Sensor module and electronic device

Abstract

To provide a sensor module that offers improved effectiveness and reliability in enhancing accuracy of detection data.SOLUTION: A sensor module 100 is provided, comprising a substrate 21, a substrate 26, a connection unit 40 for electrically connecting the substrate 21 and the substrate 26, a sensor device 11a provided on the substrate 21 to detect angular speed about a Z-axis, and a sensor device 11b provided on the substrate 26 to detect angular speed about the Z-axis.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a sensor module and an electronic device. [Background technology]

[0002] Patent Document 1 describes a sensor module that aims to improve the accuracy of X-axis angular velocity data by mounting two X-axis angular velocity sensor devices on the side of the same board. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2019-163955 A Summary of the Invention [Problem to be solved by the invention]

[0004] In a sensor module equipped with multiple sensor devices for one detection axis, there is a demand for further improvements in the effectiveness and reliability of high precision. [Means for solving the problem]

[0005] A sensor module according to one embodiment of the present application comprises a first substrate, a second substrate, a connection portion electrically connecting the first substrate and the second substrate, a first sensor device provided on the first substrate and detecting a physical quantity of a first axis, and a second sensor device provided on the second substrate and detecting the physical quantity of the first axis.

[0006] An electronic device according to one aspect of the present application includes the sensor module described above. [Brief description of the drawings]

[0007] [Figure 1] FIG. 2 is a perspective view showing a state in which the sensor module according to the first embodiment is fixed to a mounting surface. [Diagram 2] 2 is a perspective view showing the sensor module of FIG. 1 as viewed from the mounting surface side. [Diagram 3] FIG. [Figure 4] Exploded view of the circuit board unit. [Diagram 5] Exploded view of the circuit board unit. [Figure 6] FIG. [Figure 7A] 5 is a cross-sectional view taken along line AA in FIG. 4. [Figure 7B] 5 is a cross-sectional view taken along line AA in FIG. 4. [Figure 8] A diagram of the sensor device. [Figure 9] FIG. 11 is a development view of a board unit according to a second embodiment. [Figure 10] FIG. 11 is a development view of a board unit according to a second embodiment. [Figure 11] FIG. 11 is a perspective view of a fixing frame according to a second embodiment. [Figure 12] FIG. 11 is a perspective view showing an example of an electronic device according to a third embodiment. [Figure 13] FIG. 11 is a perspective view showing another example of the electronic device according to the third embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] In the drawings, some components may be shown with different scales to make the components easier to see. In each drawing, the X-axis, Y-axis, and Z-axis are mutually orthogonal. In the following description, the "X-axis direction" refers to a direction parallel to the X-axis, the "Y-axis direction" refers to a direction parallel to the Y-axis, and the "Z-axis direction" refers to a direction parallel to the Z-axis. In the following description, the "plus side" refers to the tip side of the arrow direction of each of the X, Y and Z axes, and the "minus side" refers to the end side of the arrow direction. In the following description, "planar view" refers to viewing from the Z-axis direction with respect to a plane including the X-axis and Y-axis, and "cross-sectional view" refers to viewing from the X-axis direction or the Y-axis direction with respect to a cross section including the Z-axis.

[0009] In the following description, the term "top surface" refers to the surface of the component on the positive side in the Z-axis direction. For example, "top surface of a substrate" refers to the surface of a substrate on the positive side in the Z-axis direction. In the following description, the term "lower surface" of a certain component refers to the surface on the negative side in the Z-axis direction of that component. In the following description, the left side surface of a certain component refers to the surface on the negative side in the X-axis direction of the component. In the following description, the right side of a certain component refers to the surface on the positive side in the X-axis direction of that component.

[0010] 1. Embodiment 1 1 to 8 show a sensor module 100 according to a first embodiment. FIG. 1 is a perspective view showing a state in which the sensor module 100 is fixed to a mounting surface 71 of an automobile or the like. FIG. 2 is a perspective view showing the sensor module 100 of FIG. 1 as viewed from the mounting surface 71 side. FIG. 3 is an exploded perspective view of the sensor module 100. FIG. 4 is a development view of the board unit 20. FIG. 5 is a development view of the board unit 20. FIG. 6 is a perspective view of the fixing frame 60. FIG. 7A is a cross-sectional view taken along the line AA in FIG. 4, showing an example of the sensor device 11b. FIG. 7B is a cross-sectional view taken along the line AA in FIG. 4, showing another example of the sensor device 11b. FIG. 8 is an explanatory view showing the internal configuration of the sensor device.

[0011] In this embodiment, the sensor module 100 is an inertial measurement unit (IMU) that detects the attitude and behavior of a worn device such as an automobile or a robot. Here, the worn device can be rephrased as a moving body, and the behavior can be rephrased as inertial momentum.

[0012] 1, the sensor module 100 has an outer case 50 that is substantially square in plan view and rectangular in three dimensions. The size of the sensor module 100 is, for example, about 24 mm on a side of the square, and about 10 mm in thickness.

[0013] A board unit 20 on which a plurality of sensor devices are mounted is housed within the outer case 50. The board unit 20 will be described later. Screw holes 52 are formed in the lower surface 58 of the outer case 50. By passing screws 70 through the two screw holes 52, the sensor module 100 is fixed to a mounting surface 71 of a mounting device such as an automobile and used.

[0014] 2, the inner case 30 is housed inside 53 of the top surface 57 of the outer case 50. An opening 31 is formed in the top surface 34 of the inner case 30. A plug-type connector 15 is disposed inside the opening 31.

[0015] The connector 15 has multiple pins. A socket-type connector (not shown) is connected to the device to which the sensor module 100 is attached via the connector 15. The sensor module 100 receives power from a power supply circuit of the device to which the sensor module 100 is attached, and transmits electrical signals such as detection data to the device to which the sensor module 100 is attached.

[0016] 1.1.Sensor module configuration FIG. 3 is an exploded perspective view of the sensor module 100 shown in FIG. 3, the sensor module 100 includes an outer case 50 and a sensor unit 10 housed in the outer case 50. The sensor unit 10 includes an inner case 30 and a board unit 20 housed in the inner case 30.

[0017] The outer case 50 is a base machined into a box shape from aluminum. The material is not limited to aluminum, and other metals such as zinc or stainless steel, resin, or a composite material of metal and resin may also be used.

[0018] The outer case 50 is in the shape of a box without a lid, and its inside 53 is an internal space surrounded by a bottom surface 55 and side walls 54. The sensor unit 10 is housed in the internal space of the outer case 50 via a joining member.

[0019] The sensor unit 10 is composed of an inner case 30 and a substrate unit 20 . The inner case 30 is a member that holds the board unit 20, and is shaped to fit inside 53 of the outer case 50. In plan view, the inner case 30 is an octagon with the four vertices of a square chamfered, and has an opening 31 as a through hole on the top surface and a recess 33 on the inside.

[0020] The height of the side walls 32 of the inner case 30 is lower than the height of the side walls 54 of the outer case 50, and as shown in Fig. 2, the top surface 34 of the inner case 30 is lower than the top surface 57 of the outer case 50. Although not shown, guide pins and support surfaces for positioning the board unit 20 are formed on the inside of the inner case 30. The substrate unit 20 is positioned by the guide pins and support surfaces, and is fixed to the inside of the inner case 30 by a joining member.

[0021] 1.2. Circuit Board Unit Configuration Fig. 4 is a plan view of the substrate unit 20 in an unfolded state, as viewed from the negative side in the Z axis direction. Fig. 5 is a plan view of the substrate unit 20 in an unfolded state, as viewed from the positive side in the Z axis direction. 3 and 6, the board unit 20 is used in an assembled state. In this embodiment, the board unit 20 is supported by a fixed frame 60 and assembled into a substantially rectangular parallelepiped shape.

[0022] As shown in Figures 4 and 5, in this embodiment, the board unit 20 includes boards 21, 22, 23, 24, 25, and 26, flexible boards 41, 42, 43, 44, and 45, sensor devices 11a, 11b, 12a, 12b, 13a, and 13b, an arithmetic circuit 14, a connector 15, a memory 16, a power supply circuit 17, and a temperature sensor 18.

[0023] The substrates 21, 22, 23, 24, 25, and 26 are hard substrates called rigid substrates, specifically, glass epoxy substrates. The substrates 21, 22, 23, 24, 25, and 26 may be rigid substrates such as composite substrates and ceramic substrates. The substrates 21, 22, 23, 24, 25, and 26 may have either a multi-layer or single-layer structure.

[0024] The flexible substrates 41, 42, 43, 44, and 45 are substrates softer than the substrates 21, 22, 23, 24, 25, and 26, and are an example of the connection portion 40 in this embodiment. The connection portion 40 may be a flexible wiring cable, wiring cord, or wire, such as a flat cable or a flat cord. The connection portion 40 may include a connector, solder, a conductive adhesive, a crimp terminal, or the like.

[0025] Flexible substrate 41 electrically connects substrate 21 and substrate 22. Flexible substrate 42 electrically connects substrate 21 and substrate 23. Flexible substrate 43 electrically connects substrate 21 and substrate 24. Flexible substrate 44 electrically connects substrate 21 and substrate 25. Flexible substrate 45 electrically connects substrate 23 and substrate 26.

[0026] The substrates 21, 22, 23, 24, 25, 26 and the flexible substrates 41, 42, 43, 44, 45 may be rigid-flexible substrates having a plurality of rigid parts and a plurality of flexible parts. When a rigid-flexible substrate is used, each of the rigid parts corresponds to the substrates 21, 22, 23, 24, 25, 26 of this embodiment, and each of the flexible parts corresponds to the flexible substrates 41, 42, 43, 44, 45 of this embodiment.

[0027] The sensor devices 11a, 11b, 12a, 12b, 13a, and 13b are each an angular velocity sensor, specifically, a vibration gyro sensor that uses a quartz crystal as an oscillator and detects angular velocity from the Coriolis force acting on the oscillator.

[0028] In this embodiment, the driving frequencies of the oscillators of the sensor devices 11a, 11b, 12a, 12b, 13a, and 13b are all the same. The oscillator is not limited to a quartz crystal. For example, the oscillator may be a MEMS (Micro Electro Mechanical Systems) oscillator formed using a silicon substrate.

[0029] In this embodiment, the sensor devices 11a and 11b are Z-axis angular velocity sensors that detect angular velocities around the Z-axis, the sensor devices 12a and 12b are Y-axis angular velocity sensors that detect angular velocities around the Y-axis, and the sensor devices 13a and 13b are X-axis angular velocity sensors that detect angular velocities around the X-axis.

[0030] In this embodiment, the sensor module 100 includes two each of X-axis angular velocity sensors, Y-axis angular velocity sensors, and Z-axis angular velocity sensors. With a configuration in which two angular velocity sensors are provided for each of the X, Y, and Z axes, the arithmetic circuit 14 calculates the average value or the like, which is a statistical quantity of the angular velocity data, based on the angular velocity data from the two angular velocity sensors for each of the X, Y, and Z axes, thereby achieving high accuracy of the angular velocity data for each axis.

[0031] As shown in Fig. 4, sensor device 11a is mounted on the lower surface of substrate 21. Sensor device 12a is mounted on the lower surface of substrate 22. Sensor device 12b is mounted on the lower surface of substrate 23. Sensor device 13a is mounted on the lower surface of substrate 24. Sensor device 13b is mounted on the lower surface of substrate 25. Sensor device 11b is mounted on the lower surface of substrate 26.

[0032] In this manner, the sensor devices 11a, 11b, 12a, 12b, 13a, and 13b are mounted on different substrates 21, 22, 23, 24, 25, and 26, respectively. In addition, the substrates are connected to each other via flexible substrates 41, 42, 43, 44, and 45. Therefore, even if the sensor devices 11a, 11b, 12a, 12b, 13a, and 13b are operated simultaneously, the flexible substrates 41, 42, 43, 44, and 45 can suppress the occurrence of mechanical or electrical interference between the sensor devices.

[0033] 5, an arithmetic circuit 14, a connector 15, a memory 16, a power supply circuit 17, and a temperature sensor 18 are mounted on the upper surface of the substrate 21. Other electronic components may also be mounted on the upper surface of the substrate 21.

[0034] The arithmetic circuit 14 is a primary controller for the sensor devices 11a, 11b, 12a, 12b, 13a, and 13b. The arithmetic circuit 14 is an integrated circuit device, and can be realized by a processor such as an MPU (Micro Processor Unit) or a CPU (Central Processing Unit).

[0035] The arithmetic circuit 14 includes a digital interface. The digital interface is a circuit that performs digital interface processing based on a communication standard such as SPI or I2C.

[0036] The arithmetic circuit 14 receives detection data output from the sensor devices 11a, 11b, 12a, 12b, 13a, and 13b, performs various processes, and transmits the output data to the outside via the connector 15. In this embodiment, the arithmetic circuit 14 is an example of a processing unit.

[0037] The various processes performed by the arithmetic circuit 14 include a process of calculating the average value of the detection data of the angular velocity around the Z axis from the sensor devices 11a and 11b, a process of calculating the average value of the detection data of the angular velocity around the Y axis from the sensor devices 12a and 12b, a process of calculating the average value of the detection data of the angular velocity around the X axis from the sensor devices 13a and 13b, a process of performing temperature correction, zero point correction, etc. on the calculated average values, a sensitivity adjustment process, a filter process, and a process of outputting the processed data from the connector 15.

[0038] The connector 15 is a plug-type connector and has two rows of connection terminals arranged at equal pitch in the X-axis direction. In this embodiment, the connector 15 has 10 pins in one row for a total of 20 connection terminals, but the number of terminals may be changed as appropriate depending on the design specifications.

[0039] The memory 16 stores programs for executing various processes performed by the arithmetic circuit 14, programs for incorporating processed detection data into packet data, and data required for executing the programs, such as table data used for temperature correction processing.

[0040] The power supply circuit 17 is supplied with power from the attached device, and supplies the necessary power to the sensor devices 11a, 11b, 12a, 12b, 13a, and 13b, the arithmetic circuit 14, and the like. The temperature sensor 18 outputs to the arithmetic circuit 14 temperature information used in the temperature correction process.

[0041] 1.3. Fixed Frame Fig. 6 is a perspective view of the fixed frame 60, and shows the fixed frame 60 in a state in which the board unit 20 is attached. In Fig. 6, the board 21 is omitted for the sake of explanation. The fixing frame 60 has an octagonal cylindrical shape in a plan view, and has openings 68 provided in the portions where the substrates 21, 22, 23, 24, 25, and 26 are attached. The openings 68 function as escapes for the sensor devices 11a, 11b, 12a, 12b, 13a, and 13b.

[0042] The substrates 21, 22, 23, 24, 25, and 26 are attached to the fixed frame 60 so that the sensor devices 11a, 11b, 12a, 12b, 13a, and 13b face inward. Therefore, the sensor devices 11a, 11b, 12a, 12b, 13a, and 13b do not protrude outward, so that the size of the substrate unit 20 can be reduced, and the sensor module 100 can be made more compact.

[0043] The fixed frame 60 is made of, for example, resin. It is preferable that the elastic modulus of the fixed frame 60 is smaller than that of the substrates 21 , 22 , 23 , 24 , 25 , 26 and larger than that of the flexible substrates 41 , 42 , 43 , 44 , 45 . By making the elastic modulus of the fixing frame 60 smaller than that of the substrates 21, 22, 23, 24, 25, 26, it is possible to suppress mechanical or electrical interference that occurs when the sensor devices 11a, 11b, 12a, 12b, 13a, 13b are simultaneously operated. By making the elastic modulus of the fixing frame 60 larger than that of the flexible substrates 41, 42, 43, 44, 45, it is possible to fix the substrates 21, 22, 23, 24, 25, 26 at desired positions corresponding to the detection axes of the mounted sensor devices, and it is possible to suppress deviation from the desired positions.

[0044] The substrate 21 (not shown) is fixed to an upper surface 61 of the fixed frame 60, and the substrate 26 is fixed to a lower surface 62. In other words, the substrate 21 and the substrate 26, on which the sensor devices 11a and 11b for detecting angular velocity around the Z axis are mounted, are disposed opposite each other.

[0045] The substrate 22 is fixed to a side surface 63 of the fixed frame 60, and the substrate 23 is fixed to a side surface 64. In other words, the substrates 22 and 23, on which the sensor devices 12a and 12b for detecting angular velocity around the Y axis are mounted, are disposed opposite each other.

[0046] The substrate 24 is fixed to a side surface 65 of the fixed frame 60, and the substrate 25 is fixed to a side surface 66. In other words, the substrates 24 and 25, on which the sensor devices 13a and 13b for detecting angular velocity around the X-axis are mounted, are disposed opposite each other.

[0047] In this embodiment, the board unit 20 is fixed to the fixed frame 60 during assembly, but the board unit 20 is not limited to a configuration using the fixed frame 60. For example, the board unit 20 may be fixed directly to the inner case 30 without using the fixed frame 60.

[0048] 1.4. Sensor Devices Packaging 7A and 7B are cross-sectional views for explaining packaging of the sensor device 11b. In this embodiment, the sensor device 11b in Fig. 7A is a physical quantity sensor that detects an angular velocity with the Z axis as the detection axis, and the sensor device 11b in Fig. 7B is a composite physical quantity sensor that detects an angular velocity with the Z axis as the detection axis and an acceleration with the Z axis as the detection axis.

[0049] 7A and 7B, sensor device 11b has a package 7, and a sensor element 3 and a circuit element 4, or sensor elements 3a and 3b and a circuit element 4, housed in the package 7. Although not shown, sensor devices 11a, 12a, 12b, 13a, and 13b also have a similar configuration to sensor device 11b.

[0050] The package 7 has a base 5 with a recess that opens on its upper surface, and a lid 6 that is joined to the upper surface of the base 5 via a joining member so as to close the opening of the recess. An internal space S is formed inside the package 7 by the recess.

[0051] The package 7 is, for example, a ceramic package. The base 5 is made of ceramics such as alumina, and the lid 6 is made of ceramics such as alumina or a metal material such as Kovar.

[0052] 7A accommodates a sensor element 3 and a circuit element 4 in an internal space S. The sensor element 3 is an angular velocity sensor that detects an angular velocity around the Z axis, and includes an oscillator 1 and a support substrate 2. The oscillator 1 is a quartz crystal oscillator. The circuit element 4 includes a detection circuit, which will be described later.

[0053] The internal space S is airtight and in a reduced pressure state, preferably in a state closer to a vacuum, which improves the vibration characteristics of the vibrator 1. However, the atmosphere of the internal space S is not particularly limited.

[0054] In the internal space S, the resonator 1, the support substrate 2, and the circuit element 4 are arranged to overlap one another in a plan view. This makes it possible to suppress the expansion of the planar area of ​​the package 7 in the directions along the X-axis and / or Y-axis, thereby enabling miniaturization.

[0055] A plurality of internal terminals 8a, 8b are provided within the recess of the base 5, and a plurality of external terminals 8c are provided on the lower surface of the base 5. These internal terminals 8a, 8b and external terminal 8c are electrically connected to wiring (not shown) formed within base 5 and on substrate 26. The internal terminal 8 a is electrically connected to the sensor element 3 via a conductive bonding member, and the internal terminal 8 b is electrically connected to the circuit element 4 via a bonding wire 9 .

[0056] A sensor device 11b in FIG. 7B accommodates sensor elements 3a and 3b and a circuit element 4 in an internal space S. The sensor element 3a is an angular velocity sensor that detects an angular velocity around the Z axis, and like the sensor element 3, includes an oscillator that undergoes flexural vibration and detects angular velocity by utilizing Coriolis force.

[0057] The sensor element 3b is an acceleration sensor that detects acceleration in the Z-axis direction. The sensor element 3b includes a quartz crystal oscillator and detects acceleration by utilizing changes in the oscillation frequency of the quartz crystal oscillator. The sensor element 3b may include a silicon MEMS having a comb-shaped fixed electrode and a movable electrode, and may be configured to detect acceleration by utilizing changes in capacitance formed between them. The circuit element 4 includes a detection circuit, which will be described later.

[0058] In the embodiment shown in FIG. 7B, sensor device 11b includes an angular velocity sensor that detects angular velocity around the Z axis and an acceleration sensor that detects acceleration in the Z axis direction, but sensor device 11b is not limited to this configuration. For example, the sensor device 11b may include, in addition to the sensor elements 3a and 3b, an angular velocity sensor element that detects an angular velocity about the X-axis and / or an angular velocity sensor element that detects an angular velocity about the Y-axis. For example, the sensor device 11b may include an acceleration sensor element that detects acceleration in the X-axis direction and / or an acceleration sensor element that detects acceleration in the Y-axis direction, in addition to the sensor elements 3a and 3b. For example, the sensor element 3a may be a three-axis angular velocity sensor that detects angular velocities around each of the X, Y and Z axes. For example, the sensor element 3b may be a three-axis acceleration sensor that detects acceleration in each of the X, Y and Z axis directions. For example, the sensor element 3b may be an angular velocity sensor that detects angular velocity around the Y axis and / or the X axis, or a three-axis angular velocity sensor that detects angular velocities around each of the X, Y and Z axes. For example, the sensor element 3a may be a triaxial angular velocity sensor that detects angular velocities around each of the X, Y, and Z axes, and the sensor element 3b may be a triaxial acceleration sensor that detects acceleration in each of the X, Y, and Z axes. In other words, the sensor device 11b may be a triaxial angular velocity sensor, a triaxial acceleration sensor, or a 6DoF (Six degrees of freedom) sensor.

[0059] When a ceramic package is used for the package 7, the package 7 can be rephrased as a hard substrate. In this case, the sensor elements 3, 3a, and 3b can be rephrased as a sensor device 11b. When a ceramic package is used as the package 7, the package 7 may be directly mounted on the flexible substrate 45 without the substrate 26 therebetween.

[0060] 1.4.2. Configuration of Sensor Element and Circuit Element Fig. 8 shows a detailed configuration example of the sensor element 3 and the circuit element 4 of the sensor device 11b shown in Fig. 7A. The sensor devices 11a, 12a, 12b, 13a, and 13b have a similar configuration.

[0061] The sensor device 11b includes a sensor element 3 and a circuit element 4. The sensor element 3 includes an oscillator 1, and the circuit element 4 includes a drive circuit 81 and a detection circuit .

[0062] The drive circuit 81 can include an amplifier circuit that receives the feedback signal DG from the vibrator 1 and amplifies the signal, an AGC (Automatic Gain Control) circuit that performs automatic gain control, and an output circuit that outputs the drive signal DS to the vibrator 1. The AGC circuit automatically adjusts the gain so that the amplitude of the feedback signal DG from the vibrator 1 is constant. The output circuit outputs, for example, a rectangular wave drive signal DS to the vibrator 1.

[0063] The detection circuit 82 may include an amplifier circuit, a synchronous detection circuit, an A / D conversion circuit, etc. The amplifier circuit receives the detection signals S1 and S2 from the transducer 1 and performs charge-to-voltage conversion and signal amplification of the detection signals S1 and S2, which are differential signals. The synchronous detection circuit uses a synchronization signal from the drive circuit 81 to perform synchronous detection for extracting a desired wave. The A / D conversion circuit converts the analog detection signals S1 and S2 after synchronous detection into digital detection data D1 and outputs it to the arithmetic circuit 14.

[0064] The arithmetic circuit 14 performs various processes such as temperature correction, zero point correction, sensitivity adjustment, and filter processing on the detection data D1, and outputs the processed detection data D2 to the outside via a connector 15.

[0065] In this embodiment, the vibrator 1 has a double T-shaped structure. As the vibrator 1, a tuning fork-shaped or H-shaped vibrator may also be used. The vibrator 1 has drive arms 98a, 98b, 98c, and 98d, detection arms 99a and 99b, a base 91, and connecting arms 92a and 92b.

[0066] The base 91 has a rectangular shape, and is provided on each side with a detection arm 99a, a detection arm 99b, a connecting arm 92a, and a connecting arm 92b. A driving arm 98a and a driving arm 98b are provided at the tip of the connecting arm 92a. A driving arm 98c and a driving arm 98d are provided at the tip of the connecting arm 92b.

[0067] Weights for adjusting the frequency are provided at the tips of the drive arms 98a, 98b, 98c, and 98d and the detection arms 99a and 99b. If the Z-axis direction is the thickness direction of the vibrator 1, the vibrator 1 detects an angular velocity around the Z-axis.

[0068] A driving electrode 93 is formed on the upper and lower surfaces of the driving arms 98a and 98b. A driving electrode 94 is formed on the right and left side surfaces of the driving arms 98a and 98b. A driving electrode 94 is formed on the upper and lower surfaces of the driving arms 98c and 98d. A driving electrode 93 is formed on the right and left side surfaces of the driving arms 98c and 98d.

[0069] The drive electrodes 93 and 94 are electrically connected to a drive circuit 81. The drive circuit 81 supplies a drive signal DS to the drive electrode 93, and receives a feedback signal DG from the drive electrode 94.

[0070] A detection electrode 95 is formed on the upper and lower surfaces of the detection arm 99a. A ground electrode 97 is formed on the right and left sides of the detection arm 99a. A detection electrode 96 is formed on the upper and lower surfaces of the detection arm 99b. A ground electrode 97 is formed on the right and left sides of the detection arm 99b. The detection electrodes 95, 96 are electrically connected to the detection circuit 82. The detection circuit 82 receives the detection signals S1, S2 from the detection electrodes 95, 96 as input.

[0071] 1.4.3. Operation of Sensor and Circuit Elements The sensor element 3 and the circuit element 4 operate as follows. When a drive signal DS is applied from the drive circuit 81 to the drive electrode 93, the drive arms 98a, 98b, 98c, and 98d perform bending vibration as shown by arrows C1 due to the inverse piezoelectric effect. Specifically, the tips of the drive arms 98a and 98c repeatedly move toward and away from each other, and the tips of the drive arms 98b and 98d also repeatedly move toward and away from each other.

[0072] In other words, the drive arms 98a, 98b, 98c, and 98d alternate between the vibration mode indicated by the solid arrow C1 and the vibration mode indicated by the dotted arrow C1 at a predetermined frequency. The predetermined frequency is, for example, 49.6 kHz.

[0073] In this embodiment, the frequency of the bending vibration of the drive arms 98a, 98b, 98c, and 98d is an example of the drive frequency of the sensor device 11b. Since the frequency of the bending vibration of the drive arms 98a, 98b, 98c, and 98d correlates with the frequency of the drive signal DS, the drive frequency of the sensor device 11b may be defined by the frequency of the drive signal DS.

[0074] The bending vibration of the drive arms 98a and 98b and the bending vibration of the drive arms 98c and 98d are linearly symmetrical with respect to the X-axis passing through the center of gravity of the base 91. Therefore, the bending vibration of the drive arms 98a, 98b, 98c, and 98d causes almost no vibration of the base 91, the connecting arms 92a and 92b, the detection arms 99a, and the detection arms 99b.

[0075] In this state, when an angular velocity about the Z-axis is applied to the oscillator 1, the Coriolis force causes the drive arms 98a, 98b, 98c, and 98d to vibrate as shown by the arrow C2. In other words, the Coriolis force in the direction of the arrow C2, which is perpendicular to the direction of the arrow C1 and the direction of the Z-axis, acts on the drive arms 98a, 98b, 98c, and 98d, generating a vibration component in the direction of the arrow C2.

[0076] The vibration of the arrow C2 is transmitted to the base portion 91 via the connecting arms 92a and 92b, whereby the detection arms 99a and 99b undergo bending vibration in the direction of the arrow C3. Charge signals generated by the piezoelectric effect caused by the bending vibration of the detection arms 99a and 99b are input to the detection circuit 82 as detection signals S1 and S2, and the angular velocity around the Z axis is detected.

[0077] As described above, the sensor module 100 of this embodiment has the following advantages. The sensor module 100 of this embodiment includes a substrate 21 as a first substrate, a substrate 26 as a second substrate, a connection portion 40 electrically connecting the substrates 21 and 26, a sensor device 11a as a first sensor device provided on the substrate 21 and detecting an angular velocity around the Z axis as a physical quantity of the first axis, and a sensor device 11b as a second sensor device provided on the substrate 26 and detecting an angular velocity around the Z axis.

[0078] In this manner, the sensor module 100 of this embodiment has sensor device 11a and sensor device 11b that detect angular velocity around the Z axis, sensor device 11a is mounted on substrate 21, sensor device 11b is mounted on substrate 26, and substrate 21 and substrate 26 are electrically connected via connection portion 40.

[0079] Therefore, the sensor module 100 of the present embodiment can suppress mechanical or electrical interference caused by mounting the sensor device 11a and the sensor device 11b on the same substrate, and therefore the sensor module 100 of the present embodiment can improve the effectiveness and reliability of the high accuracy of the detection data.

[0080] In the sensor module 100 of this embodiment, the connection portion 40 includes a flexible substrate 45 . The flexible substrate 45 is a soft substrate. Therefore, the sensor module 100 of the present embodiment can suppress mechanical or electrical interference between the sensor device 11a and the sensor device 11b even when the sensor device 11a and the sensor device 11b are operated simultaneously.

[0081] In the sensor module 100 of this embodiment, the drive frequency of the sensor device 11a is the same as the drive frequency of the sensor device 11b. The drive frequencies of the sensor devices 11a and 11b are the frequencies of the bending vibration of the drive arms 98a, 98b, 98c, and 98d, respectively, or the frequency of the drive signal DS.

[0082] Mechanical or electrical interference caused by mounting the sensor devices 11a and 11b on the same board is particularly noticeable when the drive frequency of the sensor devices 11a and 11b is the same. Therefore, the sensor module 100 of this embodiment is particularly suitable for the case where the sensor devices 11a and 11b have the same drive frequency. Furthermore, the sensor module 100 of this embodiment can use the same drive frequency for the sensor device 11a and the sensor device 11b, so there is no need to prepare devices with different drive frequencies. Therefore, the sensor module 100 of this embodiment can reduce the cost required to prepare sensor devices with different drive frequencies for the sensor device 11a and the sensor device 11b, for example, the cost of manufacturing, ordering, inventory, assembly, etc., and can improve the industrial utility value.

[0083] The sensor module 100 of this embodiment is provided on a substrate 21 and includes an arithmetic circuit 14 as a processing unit that processes detection data D1 as a first detection signal of the sensor device 11a and detection data D1 as a second detection signal of the sensor device 11b.

[0084] The detection data D1 of the sensor device 11a and the detection data D1 of the sensor device 11b are each processed by an arithmetic circuit 14 provided on the substrate 21, and the processed detection data D2 can be obtained. In the sensor module 100 of the present embodiment, interference between the sensor device 11a and the sensor device 11b is suppressed, so that the effectiveness of high accuracy is guaranteed, and it is possible to obtain the highly accurate and reliable detection data D2.

[0085] The sensor module 100 of this embodiment includes a connector 15 that is provided on the substrate 21 and electrically connected to the arithmetic circuit 14. Therefore, the sensor module 100 of this embodiment can output highly accurate and reliable detection data D2 to the outside via the connector 15 based on a configuration that ensures the effectiveness of high accuracy.

[0086] The sensor module 100 of this embodiment includes a substrate 23 as a third substrate, and a sensor device 12b as a third sensor device provided on the substrate 23 and detecting an angular velocity around the Y-axis as a physical quantity of the second axis, and the substrates 21, 26, and 23 are each made of a glass epoxy substrate as a hard substrate, and the connection portion 40 includes a flexible substrate 42 as a first flexible substrate having one end connected to the substrate 21 and the other end connected to the substrate 23, and a flexible substrate 45 as a second flexible substrate having one end connected to the substrate 23 and the other end connected to the substrate 26.

[0087] In this manner, the sensor module 100 of this embodiment has sensor device 11a and sensor device 11b which detect angular velocity around the Z axis, and sensor device 12b which detects angular velocity around the Y axis, with sensor device 11a mounted on substrate 21, sensor device 11b mounted on substrate 26, and sensor device 12b mounted on substrate 23, with substrates 21 and 23 electrically connected via flexible substrate 42, and substrates 23 and 26 electrically connected via flexible substrate 45.

[0088] Therefore, the sensor module 100 of the present embodiment can suppress mechanical or electrical interference caused by mounting the sensor devices 11a, 11b, and 12b on the same board, and therefore the sensor module 100 of the present embodiment can improve the effectiveness and reliability of the high accuracy of the detection data.

[0089] In the sensor module 100 of this embodiment, the substrate 21 and the substrate 26 are disposed opposite each other. The substrate 21 and the substrate 26 each have a sensor device mounted thereon that detects an angular velocity about the Z axis. The sensor module 100 of this embodiment achieves high accuracy in detecting the angular velocity about the Z axis by arranging the substrate 21 and the substrate 26 opposite each other, which is a highly effective configuration. Therefore, the sensor module 100 of this embodiment can improve the effectiveness of high accuracy in detecting the angular velocity about the Z axis.

[0090] The sensor module 100 of this embodiment includes a fixing frame 60 as a fixing portion to which the substrate 21 and the substrate 26 are fixed. The substrate 21 and the substrate 26 are each fixed to the fixing frame 60. Therefore, in the sensor module 100 of this embodiment, the substrate 21 and the substrate 26 can be fixed easily and reliably. Therefore, the sensor module 100 of this embodiment can improve the effectiveness and reliability of increasing the accuracy of detection data.

[0091] The sensor module 100 of this embodiment includes an inner case 30 and / or an outer case 50 as a case in which the substrate 21, the substrate 26, and the connection portion 40 are housed. Therefore, since the sensor module 100 of this embodiment is stored in the inner case 30 and / or the outer case 50, it can be shielded from external influences, thereby improving the effectiveness and reliability of high-precision detection data.

[0092] 2. Embodiment 2 9 to 11 show a sensor module 100 according to a second embodiment. Fig. 9 is a development view of the board unit 20, and a plan view of the board unit 20 when unfolded, as viewed from the negative side in the Z axis direction. Fig. 10 is a development view of the board unit 20, and a plan view of the board unit 20 when unfolded, as viewed from the positive side in the Z axis direction. Fig. 11 is a perspective view of the fixing frame 60, and shows the fixing frame 60 with the board unit 20 attached. In Fig. 11, the board 21 is omitted for the sake of explanation. In the second embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof may be omitted.

[0093] 2.1. Circuit Board Unit Configuration In embodiment 2, the board unit 20 includes boards 21, 221, 222, 231, 232, 241, 242, 251, 252, 261, 262, 27, flexible boards 411, 412, 421, 422, 431, 432, 441, 442, 451, 452, 46, sensor devices 11a, 11b, 11c, 11d, 12a, 12b, 12c, 12d, 13a, 13b, 13c, 13d, an arithmetic circuit 14, a connector 15, a memory 16, a power supply circuit 17, and a temperature sensor 18.

[0094] The substrates 21, 221, 222, 231, 232, 241, 242, 251, 252, 261, 262, and 27 are rigid substrates such as a glass epoxy substrate, a composite substrate, or a ceramic substrate.

[0095] The flexible substrates 411, 412, 421, 422, 431, 432, 441, 442, 451, 452, and 46 are examples of connection portions 40. The flexible substrate 411 electrically connects the substrate 21 to the substrate 221. The flexible substrate 412 electrically connects the substrate 21 to the substrate 222. The flexible substrate 421 electrically connects the substrate 21 to the substrate 231. The flexible substrate 422 electrically connects the substrate 21 to the substrate 232. The flexible substrate 431 electrically connects the substrate 21 to the substrate 241. The flexible substrate 432 electrically connects the substrate 21 to the substrate 242. The flexible substrate 441 electrically connects the substrate 21 to the substrate 251. The flexible substrate 442 electrically connects the substrate 21 to the substrate 252. The flexible substrate 451 electrically connects the substrate 231 to the substrate 261. The flexible substrate 452 electrically connects the substrate 232 to the substrate 262. The flexible substrate 46 electrically connects the substrate 221 to the substrate 27.

[0096] The substrates 21, 221, 222, 231, 232, 241, 242, 251, 252, 261, 262, and 27 and the flexible substrates 411, 412, 421, 422, 431, 432, 441, 442, 451, 452, and 46 may be rigid-flexible substrates.

[0097] The sensor devices 11a, 11b, 11c, 11d, 12a, 12b, 12c, 12d, 13a, 13b, 13c, and 13d are angular velocity sensors, specifically, vibration gyro sensors that use a quartz crystal as an oscillator.

[0098] In the second embodiment, the driving frequencies of the oscillators of the sensor devices 11a, 11b, 11c, 11d, 12a, 12b, 12c, 12d, 13a, 13b, 13c, and 13d are all the same. The oscillator is not limited to a quartz crystal. For example, the oscillator may be a MEMS oscillator formed using a silicon substrate.

[0099] In the second embodiment, the sensor devices 11a, 11b, 11c, and 11d are Z-axis angular velocity sensors that detect angular velocities around the Z-axis. The sensor devices 12a, 12b, 12c, and 12d are Y-axis angular velocity sensors that detect angular velocities around the Y-axis. The sensor devices 13a, 13b, 13c, and 13d are X-axis angular velocity sensors that detect angular velocities around the X-axis.

[0100] In the second embodiment, the sensor module 100 includes four each of X-axis angular velocity sensors, Y-axis angular velocity sensors, and Z-axis angular velocity sensors. With a configuration in which four angular velocity sensors are provided for each of the X, Y, and Z axes, the arithmetic circuit 14 calculates the average value or the like, which is a statistical quantity of the angular velocity data, based on the angular velocity data from the four angular velocity sensors for each of the X, Y, and Z axes, thereby achieving high accuracy of the angular velocity data for each axis.

[0101] As shown in FIG. 9, sensor device 11a is mounted on the lower surface of substrate 21. Sensor device 12a is mounted on the lower surface of substrate 221. Sensor device 12b is mounted on the lower surface of substrate 222. Sensor device 12c is mounted on the lower surface of substrate 231. Sensor device 12d is mounted on the lower surface of substrate 232. Sensor device 13a is mounted on the lower surface of substrate 241. Sensor device 13b is mounted on the lower surface of substrate 242. Sensor device 13c is mounted on the lower surface of substrate 251. Sensor device 13d is mounted on the lower surface of substrate 252. Sensor device 11c is mounted on the lower surface of substrate 261. Sensor device 11d is mounted on the lower surface of substrate 262. Sensor device 11b is mounted on the lower surface of substrate 27.

[0102] As shown in FIG. 10, on the upper surface of the substrate 21, an arithmetic circuit 14, a connector 15, a memory 16, a power supply circuit 17, and a temperature sensor 18 are mounted. The arithmetic circuit 14 is a primary controller for the sensor devices 11a, 11b, 11c, 11d, 12a, 12b, 12c, 12d, 13a, 13b, 13c, and 13d.

[0103] The arithmetic circuit 14 receives detection data output from the sensor devices 11a, 11b, 11c, 11d, 12a, 12b, 12c, 12d, 13a, 13b, 13c, and 13d, performs various processing, and transmits the output data to the outside via the connector 15.

[0104] The various processes performed by the arithmetic circuit 14 include a process of calculating the average value of the detection data of the angular velocity around the Z axis from sensor device 11a, sensor device 11b, sensor device 11c, and sensor device 11d, a process of calculating the average value of the detection data of the angular velocity around the Y axis from sensor device 12a, sensor device 12b, sensor device 12c, and sensor device 12d, a process of calculating the average value of the detection data of the angular velocity around the X axis from sensor device 13a, sensor device 13b, sensor device 13c, and sensor device 13d, a process of performing temperature correction, zero point correction, etc. on each calculated average value, a sensitivity adjustment process, a filter process, and a process of outputting the processed data from connector 15.

[0105] 2.2. Fixed Frame Fig. 11 is a perspective view of the fixed frame 60, and shows the fixed frame 60 in a state in which the board unit 20 is attached. In Fig. 11, the board 21 is omitted for the sake of explanation. When assembled, the board unit 20 is supported by a fixed frame 60 and assembled into a substantially rectangular parallelepiped shape. The fixed frame 60 has an octagonal cylindrical shape in a plan view, and openings 68 are provided in the portions where the substrates 21, 221, 222, 231, 232, 241, 242, 251, 252, 261, 262, and 27 are attached.

[0106] The substrates 21, 221, 222, 231, 232, 241, 242, 251, 252, 261, 262, and 27 are attached to the fixed frame 60 so that the sensor devices 11a, 11b, 11c, 11d, 12a, 12b, 12c, 12d, 13a, 13b, 13c, and 13d are on the inside.

[0107] The substrate 21 (not shown) is fixed to an upper surface 61 of the fixed frame 60, and the substrates 261, 262, and 27 are fixed to a lower surface 62. In other words, a sensor device that detects an angular velocity around the Z axis is mounted on the substrates 21, 261, 262, and 27, respectively, and the substrate 21 and the substrates 261, 262, and 27 are disposed opposite to each other.

[0108] The substrates 221 and 222 are fixed to a side surface 63 of the fixed frame 60, and the substrates 231 and 232 are fixed to a side surface 64. In other words, a sensor device that detects an angular velocity around the Y axis is mounted on each of the substrates 221, 222, 231, and 232, and the substrates 221, 222, 231, and 232 are disposed on the opposing side surfaces 63 and 64. Substrates 241 and 242 are fixed to side surface 65 of fixed frame 60, and substrates 251 and 252 are fixed to side surface 66. In other words, sensor devices that detect angular velocity around the X-axis are mounted on substrates 241, 242, 251, and 252, respectively, and substrates 241, 242, 251, and 252 are disposed on side surfaces 65 and 66 that face each other.

[0109] In the above-described embodiment, examples have been described in which the number of sensor devices on each of the X, Y and Z axes is two and four, but the number of sensor devices on each of the X, Y and Z axes may be three or five or more. In the above embodiment, an example has been described in which the number of sensor devices on each of the X, Y, and Z axes is the same for each axis, but the number of sensor devices may be different for each axis. For example, the number of sensor devices on the X axis may be 2, the number of sensor devices on the Y axis may be 2, and the number of sensor devices on the Z axis may be 4. In the above embodiment, an example in which there are multiple sensor devices for each of the X, Y, and Z axes has been described, but the number of sensor devices may be multiple only for a specific axis. For example, the number of sensor devices for the X axis may be 1, the number of sensor devices for the Y axis may be 1, and the number of sensor devices for the Z axis may be 2.

[0110] As described above, the sensor module 100 of the second embodiment has the following advantages in addition to the advantages of the first embodiment.

[0111] The sensor module 100 of embodiment 2 includes a substrate 21 as a first substrate, a substrate 261 as a second substrate, a connection portion 40 electrically connecting the substrate 21 and the substrate 261, a sensor device 11a as a first sensor device provided on the substrate 21 and detecting an angular velocity around the Z axis as a physical quantity of the first axis, and a sensor device 11c as a second sensor device provided on the substrate 261 and detecting an angular velocity around the Z axis.

[0112] In this manner, the sensor module 100 of the present embodiment has the sensor device 11a and the sensor device 11c for detecting the angular velocity around the Z axis, the sensor device 11a is mounted on the substrate 21, the sensor device 11c is mounted on the substrate 261, and the substrate 21 and the substrate 261 are electrically connected via the connection portion 40. Therefore, the sensor module 100 of the second embodiment can suppress mechanical or electrical interference caused by the sensor device 11a and the sensor device 11c being mounted on the same substrate. Therefore, the sensor module 100 of the second embodiment can improve the effectiveness and reliability of the high accuracy of the detection data.

[0113] 3. Embodiment 3 In the third embodiment, an electronic device including a sensor module 100 will be described. In the following, examples of electronic devices will be described, including a mobile device such as a smartphone and a mobile object such as an automobile.

[0114] 3.1. Overview of mobile devices FIG. 12 is a perspective view of a mobile device as an electronic device according to the third embodiment, showing the configuration of a smartphone 110 as an example of the mobile device.

[0115] The smartphone 110 is equipped with the sensor module 100 . The output data of the sensor module 100 is received by the control unit 111. The control unit 111 recognizes the attitude and behavior of the smartphone 110 from the received detection signal, and can change the image displayed on the display unit, sound an alarm or sound effect, or drive a vibration motor to vibrate the main body.

[0116] The sensor module 100 may be mounted on a portable device other than the smartphone 110. For example, the sensor module 100 may be mounted on a portable device such as a smartwatch, a portable activity meter, a head mounted display (HMD), a mobile personal computer (PC), a tablet PC, a camera, or a personal digital assistant (PDA). This allows the portable device to recognize its posture and behavior based on the output data of the sensor module 100, and to change the displayed image, sound an alarm or sound effect, or drive a vibration motor to vibrate the main body.

[0117] In this manner, in this embodiment, a mobile device such as the smartphone 110 is equipped with the sensor module 100. Therefore, according to this embodiment, the reliability of the mobile device equipped with the sensor module 100 can be improved.

[0118] 3.2. Overview of the Mobile Unit FIG. 13 is a perspective view of a moving object as an electronic device according to the third embodiment, showing the configuration of an automobile 130 as an example of the moving object.

[0119] The automobile 130 is equipped with the sensor module 100 . The sensor module 100 detects the attitude of the vehicle body 131 and transmits output data to a vehicle body attitude control device 132. The output data includes an angular velocity signal and an acceleration signal. When the vehicle body attitude control device 132, which controls the attitude of the vehicle body 131, receives the output data of the sensor module 100, it detects the attitude of the vehicle body 131 based on the signal, and controls the hardness of the suspension or the brakes of each wheel 133 according to the detection result.

[0120] The output data from the sensor module 100 may also be used in ECUs (Electronic Control Units) such as keyless entry, immobilizers, car navigation systems, car air conditioners, anti-lock braking systems (ABS), airbags, TPMS (Tire Pressure Monitoring Systems), engine controls, inertial navigation control equipment for autonomous driving, and battery monitors for hybrid and electric vehicles.

[0121] The sensor module 100 may be mounted on a moving body other than the automobile 130. The other moving bodies are, for example, a bipedal robot, a train, a radio-controlled airplane, a radio-controlled helicopter, a drone, an agricultural machine, and a construction machine. The moving body equipped with the sensor module 100 can utilize the output data of the sensor module 100 for posture control and position measurement of the moving body.

[0122] Thus, in this embodiment, a moving object such as an automobile 130 is equipped with the sensor module 100. Therefore, according to this embodiment, the reliability of the moving object equipped with the sensor module 100 can be improved.

[0123] Although the preferred embodiment has been described above, the present invention is not limited to the above embodiment. The configuration of each part of the present invention can be replaced with any configuration that exhibits the same function as the above embodiment, and any configuration can be added. [Explanation of symbols]

[0124] 1...transducer, 2...support substrate, 3, 3a, 3b...sensor element, 4...circuit element, 5...base, 6...lid, 7...package, 8a, 8b...internal terminal, 8c...external terminal, 9...bonding wire, 10...sensor unit, 11a, 11b, 11c, 11d, 12a, 12b, 12c, 12d, 13a, 13b, 13c, 13d...sensor device, 14...arithmetic circuit, 15...connector, 16...memory 17...power supply circuit, 18...temperature sensor, 20...circuit board unit, 21, 22, 23, 24, 25, 26, 27, 221, 222, 231, 232, 241, 242, 251, 252, 261, 262...circuit board, 30...inner case, 31...opening, 32...side wall, 33...recess, 34...upper surface, 40...connection portion, 41, 42, 43, 44, 45, 46, 411, 412, 421, 422, 431, 43 2,441,442,451,452...flexible circuit board, 50...outer case, 52...screw hole, 53...inside, 54...side wall, 55...bottom, 57...upper surface, 58...lower surface, 60...fixing frame, 61...upper surface, 62...lower surface, 63,64,65,66...side surface, 68...opening, 70...screw, 71...mounting surface, 81...drive circuit, 82...detection circuit, 91...base, 92a,92b...connecting arm, 93,94...drive electrode, 9 5, 96...detection electrode, 97...ground electrode, 98a, 98b, 98c, 98d...drive arm, 99a, 99b...detection arm, 100...sensor module, 110...smartphone, 111...control unit, 130...automobile, 131...vehicle body, 132...vehicle attitude control device, 133...wheel, C1, C2, C3...arrow, D1, D2...detection data, S1, S2...detection signal, DS...drive signal, DG...feedback signal.

Claims

1. A first substrate; A second substrate; a connection portion that electrically connects the first substrate and the second substrate; a first sensor device provided on the first substrate and configured to detect a physical quantity of a first axis; a second sensor device provided on the second substrate and configured to detect a physical quantity of the first axis; Sensor module.

2. The connection portion includes a flexible substrate. The sensor module according to claim 1 .

3. The drive frequency of the first sensor device is the same as the drive frequency of the second sensor device. The sensor module according to claim 1 .

4. a processing unit provided on the first substrate, the processing unit processing a first detection signal of the first sensor device and a second detection signal of the second sensor device; The sensor module according to claim 1 .

5. A connector provided on the first substrate and electrically connected to the processing unit. The sensor module according to claim 4 .

6. A third substrate; a third sensor device provided on the third substrate and configured to detect a physical quantity of a second axis; the first substrate, the second substrate, and the third substrate are each made of a rigid substrate; the connection portion includes a first flexible substrate having one end connected to the first substrate and the other end connected to the third substrate, and a second flexible substrate having one end connected to the third substrate and the other end connected to the second substrate, The sensor module according to claim 1 .

7. The first substrate and the second substrate are disposed opposite to each other. The sensor module according to claim 1 .

8. A fixing portion to which the first substrate and the second substrate are fixed. The sensor module according to claim 1 .

9. a case in which the first board, the second board, and the connection portion are housed, The sensor module according to claim 1 .

10. An electronic device comprising the sensor module according to any one of claims 1 to 9.

Images