Electronic component and manufacturing method of electronic component

Abstract

To provide an electronic component capable of suppressing a crack of a sheath body caused by an inner pressure rise during reflow, and a manufacturing method of an electronic component capable of realizing the electronic component which is capable of suppressing the crack of the sheath body caused by the inner pressure rise during reflow.SOLUTION: An electronic component comprises an element 10 and a sheath body 20 encapsulating the element 10. The sheath body 20 includes a first portion 21 containing a first resin material and a second portion 22 containing a second resin material. The first portion 21 is a tube structure including a through hole 23, and the element 10 is stored in the through hole 23. The second portion 22 is present in the through hole 23 in which the element 10 is stored, and a moisture-proof film 140 is provided between the first portion 21 and the second portion 22.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to an electronic component and a method for manufacturing an electronic component. [Background technology]

[0002] Patent Document 1 discloses an electronic component comprising an element and an exterior body that seals the element, the exterior body having a first portion containing a first resin material and a second portion containing a second resin material, the first portion being a tubular structure having a through hole, the element being housed in the through hole, and the second portion being present in the through hole in which the element is housed. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2023 / 085204 Summary of the Invention [Problem to be solved by the invention]

[0004] Patent Document 1 describes a method for preventing cracks in the exterior body caused by an increase in internal pressure due to reflow after moisture absorption, in which a tubular exterior body is formed using two types of resin, and cracks are generated in the resin on the inside of the tubular structure, thereby preventing cracks from reaching the outermost surface of the exterior body.

[0005] However, if the amount of moisture absorption is large, the internal resin alone may not be able to fully relieve the stress, and cracks may occur all the way to the outermost surface of the exterior body.

[0006] The present invention has been made to solve the above problems, and aims to provide an electronic component capable of suppressing cracks in an exterior body caused by an increase in internal pressure during reflow. Another aim of the present invention is to provide a manufacturing method for an electronic component capable of realizing an electronic component capable of suppressing cracks in an exterior body caused by an increase in internal pressure during reflow. [Means for solving the problem]

[0007] The electronic component of the present invention comprises an element and an exterior body that seals the element, the exterior body having a first portion containing a first resin material and a second portion containing a second resin material, the first portion being a tubular structure having a through hole and housing the element in the through hole, the second portion being present in the through hole in which the element is housed, and a moisture-proof film being provided between the first portion and the second portion.

[0008] A method for manufacturing an electronic component of the present invention includes the steps of preparing an element, preparing a first part of an outer casing containing a first resin material and having a through hole, forming a moisture-proof film on a surface of the first part, and hardening a liquid material containing a liquid second resin material filled in the gap between the first part and the element inserted into the through hole to form the second part of the outer casing. Effect of the Invention

[0009] According to the present invention, it is possible to provide an electronic component capable of suppressing cracks in an exterior body due to an increase in internal pressure during reflow. Furthermore, according to the present invention, it is possible to provide a manufacturing method for an electronic component capable of realizing an electronic component capable of suppressing cracks in an exterior body due to an increase in internal pressure during reflow. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 is a perspective view that illustrates an example of an electronic component according to an embodiment of the present invention. [Diagram 2] FIG. 2 is a cross-sectional view of the electronic component shown in FIG. 1 taken along line XX. [Diagram 3] 3 is a cross-sectional view of the electronic component shown in FIG. 1 taken along line YY. [Figure 4] FIG. 4 is a cross-sectional view that illustrates a schematic example of a solid electrolytic capacitor element included in the electronic component illustrated in FIG. [Diagram 5]FIG. 5 is a cross-sectional view that illustrates an example of an electronic component according to another embodiment of the present invention, and corresponds to the cross-sectional view illustrated in FIG. [Figure 6] FIG. 6 is a cross-sectional view that diagrammatically illustrates the electronic component illustrated in FIG. 5, and corresponds to the cross-sectional view illustrated in FIG. [Figure 7] FIG. 7 is a perspective view showing a schematic example of a first part of an exterior body used in a manufacturing method for an electronic component according to an embodiment of the present invention, with some through holes seen through. [Figure 8] FIG. 8 is a plan view of a first portion of the exterior body shown in FIG. [Figure 9] FIG. 9 is a cross-sectional view taken along line ZZ of the first portion of the exterior package shown in FIG. [Figure 10] FIG. 10 is a diagram illustrating an example of a process for forming a moisture-proof film on the surface of the first portion of the exterior body. [Figure 11] FIG. 11 is a plan view showing a schematic example of a workpiece used in the method for manufacturing an electronic component according to an embodiment of the present invention. [Figure 12] Fig. 12A is a diagram showing an example of a process for preparing a stack of multiple solid electrolytic capacitor elements stacked together. Fig. 12B is a diagram showing an example of a process for inserting the stack into a through-hole. Fig. 12C is a diagram showing an example of a process for embedding the tip of each element in a conductive paste. Fig. 12D is a diagram showing an example of a process for filling a liquid material around each element inserted into a through-hole. [Figure 13] FIG. 13 is a diagram illustrating an example of a step of cutting the first portion of the exterior body around the through hole. [Figure 14] Fig. 14A is a schematic diagram showing another example of a process for inserting a stack into a through-hole, Fig. 14B is a schematic diagram showing another example of a process for embedding a tip of each element in a conductive paste, and Fig. 14C is a schematic diagram showing another example of a process for filling a liquid material around each element inserted into a through-hole. [Figure 15] FIG. 15 is a diagram illustrating a schematic diagram of another example of the step of cutting the first portion of the exterior body around the through hole. [Figure 16] FIG. 16 is a graph showing the results of the moisture absorption test of the samples of Example 1 and Comparative Example 1. [Figure 17] FIG. 17 is a graph showing the results of the moisture absorption test of the samples of Examples 1 and 6 and Comparative Example 1. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] The electronic component and the method for manufacturing the electronic component of the present invention will be described below. However, the present invention is not limited to the following configurations, and can be modified as appropriate within the scope of the present invention. Note that the present invention also includes a combination of two or more of the individual desirable configurations described below.

[0012] [Electronic components] Fig. 1 is a perspective view showing a schematic diagram of an example of an electronic component according to an embodiment of the present invention. Fig. 2 is a cross-sectional view taken along line XX of the electronic component shown in Fig. 1. Fig. 3 is a cross-sectional view taken along line YY of the electronic component shown in Fig. 1. It should be noted that the dielectric layer 41 of the solid electrolytic capacitor element 10 is omitted in Fig. 2. Moreover, the internal structure of the solid electrolytic capacitor element 10 is omitted in Fig. 3 and Fig. 6 described later.

[0013] 1 to 3, the length direction of electronic component 100 and electronic component body 110 is indicated by L, the width direction by W, and the height direction by T. Here, the length direction L, the width direction W, and the height direction T are perpendicular to each other.

[0014] The electronic component 100 is a solid electrolytic capacitor, and has a substantially rectangular parallelepiped outer shape as shown in Figures 1 to 3. The electronic component 100 includes an electronic component body 110, a first external electrode 120, and a second external electrode .

[0015] The electronic component body 110 includes a solid electrolytic capacitor element 10 (hereinafter sometimes simply referred to as “element 10”) as an element (electronic component element), and includes a stack 11 in which a plurality of elements 10 are stacked. The electronic component body 110 further includes an exterior body 20 and a collecting electrode 30. The number of elements 10 included in stack 11 is not particularly limited as long as it is two or more, and can be set appropriately.

[0016] The electronic component body 110 has a substantially rectangular parallelepiped outer shape. The electronic component body 110 has a first main surface 110a and a second main surface 110b that face each other in a height direction T, a first side surface 110c and a second side surface 110d that face each other in a width direction W, and a first end surface 110e and a second end surface 110f that face each other in a length direction L.

[0017] As described above, electronic component body 110 has a substantially rectangular parallelepiped outer shape, but the corners and ridges may be rounded. A corner is a portion where three faces of electronic component body 110 intersect, and a ridge is a portion where two faces of electronic component body 110 intersect.

[0018] The exterior body 20 encapsulates the multiple elements 10. That is, a stack 11 of the multiple elements 10 is embedded in the exterior body 20. The exterior body 20 also encapsulates the collecting electrodes 30. The exterior body 20 has a first portion 21 including a first resin material and a second portion 22 including a second resin material.

[0019] The first portion 21 has a tubular structure (e.g., a rectangular tubular structure) having a through hole 23, and houses a plurality of elements 10 (stacked body 11) in the through hole 23. The second portion 22 exists in the through hole 23 in which the plurality of elements 10 (stacked body 11) are housed. In this regard, a "square tube structure" refers to a structure in which the outer peripheral surface of the tube structure includes four planes, and any two adjacent planes among the four planes intersect with each other (preferably perpendicularly), and the shape of the through hole 23 is not particularly limited.

[0020] 2 and 3, a moisture-proof film 140 is provided between the first portion 21 and the second portion 22. This prevents moisture from entering the inside of the electronic component body 110 before reflow (reducing moisture absorption), thereby preventing cracks from occurring in the exterior body 20 due to an increase in internal pressure during reflow.

[0021] 2, in the first portion 21 of the tubular structure having the through hole 23, both ends in the extending direction of the through hole 23 (i.e., the longitudinal direction or the tube axis direction) are open, and the first portion 21 houses a plurality of elements 10 (superimposed body 11) and the second portion 22. The first portion 21 constitutes the outermost periphery of the exterior body 20, and the surface of the first portion 21 is composed of an outer peripheral surface 21a, an inner peripheral surface 21b, an end face 21c on the first external electrode 120 side, and an end face 21d on the second external electrode 130 side. The first portion 21 is integrally molded into the tubular structure from a predetermined material including a first resin material, and the first portion 21 has no seams or internal joint interfaces.

[0022] The second portion 22 is filled in the through hole 23 in which the multiple elements 10 (superimposed body 11) are housed. That is, the second portion 22 is filled inside the first portion 21 and around the multiple elements 10 (superimposed body 11). However, a moisture-proof film 140 is interposed between the first portion 21 and the second portion 22, and the second portion 22 is not in direct contact with the first portion 21. Here, the state where the second portion 22 is filled in the through-hole 23 housing the multiple elements 10 (superimposed body 11) may mean that the second portion 22 completely fills the space around the multiple elements 10 (superimposed body 11) inside the first portion 21 (moisture-proof film 140) or may not completely fill it. In the latter case, for example, a small amount of air bubbles may remain in the second portion 22, a small amount of gap may remain between the second portion 22 and the moisture-proof film 140, or a small amount of gap may remain between the second portion 22 and at least one element 10.

[0023] The first resin material may be the same material as the second resin material, but is preferably a material different from the second resin material.

[0024] The first resin material of the first portion 21 is preferably an injection moldable resin, specifically, a thermoplastic resin such as PPS (polyphenylene sulfide), LCP (liquid crystal polymer), PBT (polybutylene terephthalate), polyimide, polyamide, etc.

[0025] The second resin material of the second portion 22 is preferably a thermosetting resin such as an epoxy resin, a silicone resin, or a urethane resin.

[0026] The first resin material and the second resin material may each contain, as a reinforcing material, a filler such as silica particles, alumina particles, or metal particles, or a fiber such as ceramic fiber. In particular, it is preferable that the first resin material contains, as a reinforcing material, ceramic fiber having a fiber length of 50 μm or more.

[0027] The moisture-proof film 140 is formed on the inner circumferential surface 21b of the first portion 21, and preferably covers the entire inner circumferential surface 21b of the first portion 21. On the other hand, the moisture-proof film 140 does not have to be formed on the outer circumferential surface 21a, the end face 21c, and the end face 21d of the first portion 21.

[0028] The moisture-proof film 140 is preferably an insulating film containing at least one metal selected from the group consisting of Si, Ti, Al, Hf, Zr, Ta, Sc, and Nb, and more preferably an insulating film containing at least one metal selected from the group consisting of Si, Ti, and Al. More specifically, a metal oxide film, a metal nitride film, or the like formed from any of these metals is preferable. Thus, the moisture-proof film 140 is preferably an insulating film containing an oxide or nitride of the above metal (at least one metal selected from the group consisting of Si, Ti, Al, Hf, Zr, Ta, Sc, and Nb, preferably at least one metal selected from the group consisting of Si, Ti, and Al).

[0029] The moisture-proof film 140 may be a single-layer insulating film, or may be a multi-layer insulating film (an insulating film in which a plurality of layers are stacked).

[0030] The single-layer insulating film preferably contains only one of the metals Si, Ti, Al, Hf, Zr, Ta, Sc, or Nb as the metal component, and more preferably contains only one of the metals Si, Ti, or Al as the metal component, which allows the formation of a denser insulating film with fewer defects, thereby improving the moisture-proofing effect.

[0031] From a similar viewpoint, each layer of the multilayer insulating film preferably contains only one of the metals Si, Ti, Al, Hf, Zr, Ta, Sc, or Nb as the metal component, and more preferably contains only one of the metals Si, Ti, or Al as the metal component.

[0032] The multi-layer insulating film preferably includes a plurality of layers containing different metals, whereby the layers containing different metals can mutually compensate for defects, thereby improving the moisture-proofing effect.

[0033] The thickness of the moisture-proof film 140 is not particularly limited and can be set appropriately, but is preferably 5 nm to 10 μm, more preferably 10 nm to 500 nm, and even more preferably 10 nm to 100 nm.

[0034] The multiple elements 10 are arranged overlapping in the height direction T. The extending direction of each of the multiple elements 10 is substantially parallel to the first main surface 110a and the second main surface 110b of the electronic component body 110. The elements 10 adjacent to each other in the height direction T may be joined to each other via a conductive adhesive (not shown).

[0035] FIG. 4 is a cross-sectional view that illustrates a schematic example of a solid electrolytic capacitor element included in the electronic component illustrated in FIG.

[0036] 2 and 4, each solid electrolytic capacitor element 10 is a substantially flat-plate-shaped electronic component element, and includes an anode 40 which is a thin film (foil) having a rectangular shape in plan view and whose surface is made of a porous valve metal substrate, a dielectric layer 41 (see FIG. 4, not shown in FIG. 2) provided on the surface of the anode 40 except for the base end surface 40b of the anode 40, a mask layer 42 which is a linear (extending in a strip-like shape) insulating member provided on the dielectric layer 41 along the base end surface 40b of the anode 40, and a cathode 43 provided on the dielectric layer 41 on the side of the mask layer 42 closer to the tip end surface 40a of the anode 40. In each solid electrolytic capacitor element 10, the cathode 43 faces the anode 40 via the dielectric layer 41.

[0037] In this specification, the term "planar view" means a view from the normal direction of the main surface of the anode.

[0038] The cathode 43 has a solid electrolyte layer 44 provided on the dielectric layer 41, a carbon layer 45 provided on the solid electrolyte layer 44, and a cathode conductor layer 46 provided on the carbon layer 45.

[0039] 2, the collecting electrode 30 is electrically connected to a plurality of cathodes 43 of a plurality of elements 10. The collecting electrode 30 is exposed at the first end face 110e of the electronic component body 110, and is provided at least on the first end face 110e side of the electronic component body 110. The collecting electrode 30 is formed in a shape having a thickness at a position recessed from the first end face 110e (end face 21c of the first portion 21).

[0040] As shown in FIG. 2, at least a portion of each cathode 43 on the first external electrode 120 side is embedded in the collecting electrode 30, thereby ensuring electrical connection between each cathode 43 and the collecting electrode 30.

[0041] The collecting electrode 30 is a composite material of a conductive component (conductive material) and a resin component (resin material). The conductive component preferably contains, as a main component, a metal such as silver, copper, nickel, or tin, or an alloy containing at least one of these metals. The resin component preferably contains, as a main component, an epoxy resin, a phenolic resin, or the like. The collecting electrode 30 can be formed, for example, using a conductive paste such as silver paste.

[0042] As shown in Fig. 2, the first external electrode 120 is provided on the first end surface 110e of the electronic component body 110. In Fig. 1, the first external electrode 120 is provided from the first end surface 110e of the electronic component body 110 to each of the first main surface 110a, the second main surface 110b, the first side surface 110c, and the second side surface 110d. The first external electrode 120 is electrically connected to the collecting electrode 30 exposed from the electronic component body 110 at the first end surface 110e. That is, the first external electrode 120 is electrically connected to each cathode 43 via the collecting electrode 30.

[0043] Furthermore, the collecting electrode 30 is present in the through hole 23 that houses the multiple elements 10 (superimposed body 11), and the collecting electrode 30 and the first portion 21 of the exterior body 20 form the first end face 110e of the electronic component body 110, so that the first external electrode 120 can be formed on this first end face 110e. This makes it easy to electrically connect the first external electrode 120 and the collecting electrode 30, and also makes it possible to form the first external electrode 120 with a thin thickness.

[0044] Specifically, the first external electrode 120 may have a so-called sputtered film formed by a sputtering method. Examples of materials for the sputtered film include Ni, Sn, Ag, Cu, and Au.

[0045] The first external electrode 120 may have a so-called evaporated film formed by evaporation. Examples of materials for the evaporated film include Ni, Sn, Ag, and Cu.

[0046] In this way, since the first external electrode 120 can be formed from a sputtered film and / or a vapor deposition film, the film thickness of the first external electrode 120 may be thinner than the film thickness of the second external electrode 130. Specifically, the film thickness of the first external electrode 120 is preferably 1 μm or more and 100 μm or less, more preferably 5 μm or more and 50 μm or less, and even more preferably 10 μm or more and 30 μm or less.

[0047] As shown in Fig. 2, the second external electrode 130 is provided on the second end face 110f of the electronic component body 110. In Fig. 1, the second external electrode 130 is provided from the second end face 110f of the electronic component body 110 to each of the first main face 110a, the second main face 110b, the first side face 110c, and the second side face 110d. The second external electrode 130 is electrically connected to the anode 40 (valve metal base) of the element 10 exposed from the electronic component body 110 at the second end face 110f. The second external electrode 130 may be directly or indirectly connected to the anode 40 at the second end face 110f of the electronic component body 110.

[0048] At least one of the first external electrode 120 and the second external electrode 130 may have a resin electrode layer containing a conductive component and a resin component. The conductive component preferably contains, as a main component, a metal such as silver, copper, nickel, or tin, or an alloy containing at least one of these metals. The resin component preferably contains, as a main component, an epoxy resin, a phenolic resin, or the like. The resin electrode layer can be formed, for example, using a conductive paste such as a silver paste.

[0049] At least one of the first external electrode 120 and the second external electrode 130 may have a so-called plating layer formed by a plating method. Examples of the plating layer include a zinc-silver-nickel layer, a silver-nickel layer, a nickel layer, a zinc-nickel-gold layer, a nickel-gold layer, a zinc-nickel-copper layer, and a nickel-copper layer. On these plating layers, for example, a copper plating layer, a nickel plating layer, and a tin plating layer are preferably provided in this order (or with the exception of some plating layers).

[0050] At least one of the first external electrode 120 and the second external electrode 130 may have both a resin electrode layer and a plating layer. For example, the first external electrode 120 may have a resin electrode layer connected to the current collecting electrode 30 and an outer plating layer provided on the surface of the resin electrode layer. The first external electrode 120 may have an inner plating layer connected to the current collecting electrode 30, a resin electrode layer provided so as to cover the inner plating layer, and an outer plating layer provided on the surface of the resin electrode layer. The second external electrode 130 may have a resin electrode layer connected to the anode 40 (valve metal substrate) and an outer plating layer provided on the surface of the resin electrode layer. The second external electrode 130 may have an inner plating layer connected to the anode 40 (valve metal substrate), a resin electrode layer provided so as to cover the inner plating layer, and an outer plating layer provided on the surface of the resin electrode layer.

[0051] Fig. 5 is a cross-sectional view showing a schematic example of an electronic component according to another embodiment of the present invention, and corresponds to the cross-sectional view shown in Fig. 2. Fig. 6 is a cross-sectional view showing a schematic example of the electronic component shown in Fig. 5, and corresponds to the cross-sectional view shown in Fig. 3.

[0052] The electronic component 100A shown in Figures 5 and 6 differs from the electronic component 100 shown in Figures 2 and 3 in the following respects. That is, in the electronic component 100A, a moisture-proof film 140 is provided on the surface of each element 10, in addition to being provided between the first portion 21 and the second portion 22 of the exterior body 20. This further prevents moisture from penetrating into the electronic component body 110 before reflow (further reduces moisture absorption), thereby further preventing cracks in the exterior body due to an increase in internal pressure during reflow.

[0053] More specifically, the moisture-proof film 140 is provided between the first portion 21 and the second portion 22, between each element 10 and the second portion 22, and between the collecting electrode 30 and the second portion 22.

[0054] The moisture-proof film 140 is formed on the inner circumferential surface 21b of the first portion 21, and preferably covers the entire inner circumferential surface 21b of the first portion 21.

[0055] In addition, the moisture-proof film 140 is formed on the surface of each element 10, and preferably covers the entire surface of each element 10 except for one end face electrically connected to the second external electrode 130 and the other end face electrically connected to the collecting electrode 30. In addition, when adjacent elements 10 in the height direction T are joined to each other via a conductive adhesive, the moisture-proof film 140 does not need to be provided at the joint (more specifically, the area between the element 10 and the conductive adhesive).

[0056] Moreover, the moisture-proof film 140 is formed on the surface of the collecting electrode 30 , and preferably covers the entire surface of the collecting electrode 30 adjacent to the second portion 22 .

[0057] [Electronic component manufacturing method] A method for manufacturing an electronic component according to an embodiment of the present invention will now be described.

[0058] A manufacturing method for an electronic component according to an embodiment of the present invention includes the steps of preparing an element, preparing a first part of an outer casing including a first resin material and having a through hole, forming a moisture-proof film on a surface of the first part, and hardening a liquid material including a liquid second resin material filled in a gap between the first part and the element inserted into the through hole to form the second part of the outer casing.

[0059] In this way, by forming a moisture-proof film on the surface of the first portion of the exterior body, it is possible to prevent moisture from penetrating into the electronic component body before reflow (reducing moisture absorption), and as a result, it is possible to prevent cracks in the exterior body due to an increase in internal pressure during reflow.

[0060] Hereinafter, the method for manufacturing a solid electrolytic capacitor according to the embodiment of the present invention will be described in more detail with reference to the drawings. The electronic component 100 can be manufactured by the following method. In the following example, a method for simultaneously manufacturing a plurality of solid electrolytic capacitor elements using a large valve metal substrate will be described.

[0061] Fig. 7 is a perspective view showing a schematic example of a first part of an exterior body used in a manufacturing method for an electronic component according to an embodiment of the present invention, with some through holes seen through. Fig. 8 is a plan view of the first part of the exterior body shown in Fig. 7. Fig. 9 is a cross-sectional view taken along line ZZ of the first part of the exterior body shown in Fig. 8.

[0062] First, as shown in Fig. 7 to Fig. 9, a first portion 221 of an exterior body 220 (a member that will become the first portion 21 of the exterior body 20) is prepared, which contains the above-mentioned first resin material and has a plurality of through holes 223. The first portion 221 is a member in which a flat plate material having a rectangular shape in a plan view and a predetermined thickness is provided with a plurality of through holes 223 vertically and horizontally. Each of the through holes 223 is provided in a direction perpendicular to the main surface of the first portion 221, and both ends thereof are open.

[0063] The first resin material used for the first portion 221 is preferably an injection moldable resin, specifically, a thermoplastic resin such as PPS (polyphenylene sulfide), LCP (liquid crystal polymer), PBT (polybutylene terephthalate), polyimide, polyamide, etc. The first resin material may contain, as a reinforcing material, a filler such as silica particles, alumina particles, metal particles, etc., or a fiber such as ceramic fiber, etc. Each inner corner of each through hole 223 of the first portion 221 may be rounded (see FIG. 3) or corner processed (formed into an inclined surface).

[0064] FIG. 10 is a diagram illustrating an example of a process for forming a moisture-proof film on the surface of the first portion of the exterior body.

[0065] 10, a moisture-proof film 240 is formed on the surface of the first portion 221 of the exterior body 220. The moisture-proof film 240 is preferably formed on the entire surface of the first portion 221. This makes it possible to easily form the moisture-proof film 240 by the method described below.

[0066] That is, it is preferable that the moisture-proof film 240 is formed by any one of chemical vapor deposition (CVD), atomic layer deposition (ALD), sputtering, or spin-on-glass (SOG), with atomic layer deposition being more preferable.

[0067] Furthermore, a plurality of solid electrolytic capacitor elements 10 are prepared, and then stack 11 is prepared.

[0068] FIG. 11 is a plan view showing a schematic example of a workpiece used in the method for manufacturing an electronic component according to an embodiment of the present invention.

[0069] First, as shown in FIG. 11, a work 210 is prepared in which element portions 212 (plurality of solid electrolytic capacitor elements 10) are connected in the form of strips at regular intervals to a band-shaped holding portion 211.

[0070] In detail, first, a valve metal substrate having a porous portion on its surface is cut by laser processing, punching processing, or the like, to be processed into a shape including a plurality of element portions 212 and holding portion 211 .

[0071] The valve metal substrate is made of a valve metal such as an elemental metal such as aluminum, tantalum, niobium, titanium, or zirconium, or an alloy containing these metals. The valve metal base need only be composed of a core and a porous portion provided on at least one of the main surfaces of the core, and may be, for example, a metal foil having an etched surface or a metal foil having a porous sintered powder formed on the surface.

[0072] Next, a mask layer is formed on both main surfaces and both side surfaces of each element portion 212 so as to extend along the short sides of the element portion 212 .

[0073] The mask layer is formed by applying a mask material such as a composition containing an insulating resin by screen printing, roller transfer, dispenser, inkjet printing, etc. Examples of insulating resins include polyphenylsulfone (PPS), polyethersulfone (PES), cyanate ester resins, fluororesins (tetrafluoroethylene, tetrafluoroethylene-perfluoroalkylvinylether copolymers, etc.), compositions consisting of soluble polyimidesiloxane and epoxy resins, polyimide resins, polyamideimide resins, and derivatives or precursors thereof.

[0074] After this, the mask layer may or may not be coated with a hydrophilic material.

[0075] Next, an oxide film that will become a dielectric layer is formed on the surface of the valve metal base by anodizing the valve metal base. For example, the dielectric layer is made of an aluminum oxide. At this time, an oxide film is also formed on the side of the element portion 212 that has been cut by laser processing, punching, or the like. A chemical foil on which an aluminum oxide has already been formed may be used as the valve metal base. In this case, an oxide film is also formed on the side of the cut element portion 212 by anodizing the valve metal base after cutting.

[0076] Next, a solid electrolyte layer is formed on the dielectric layer of the element section 212. Specifically, the element section 212 is immersed in a treatment liquid containing a solid electrolyte, so that the treatment liquid is impregnated into the porous portion of the valve metal base. After a predetermined period of immersion, the element section 212 is pulled out of the treatment liquid and dried at a predetermined temperature for a predetermined period of time. The immersion in the treatment liquid, pulling out, and drying are repeated a predetermined number of times to form a solid electrolyte layer.

[0077] As the treatment liquid containing a solid electrolyte, for example, a dispersion liquid of a conductive polymer such as polypyrroles, polythiophenes, polyanilines, etc. is used. Among these, polythiophenes are preferred, and poly(3,4-ethylenedioxythiophene), also known as PEDOT, is particularly preferred. The conductive polymer may also contain a dopant such as polystyrene sulfonic acid (PSS). A conductive polymer film can be formed by attaching a dispersion liquid of a conductive polymer to the outer surface of a dielectric layer and drying it. Alternatively, as the treatment liquid containing a solid electrolyte, a liquid containing a polymerizable monomer, such as 3,4-ethylenedioxythiophene, and an oxidizing agent may be used. This liquid containing the conductive polymer can be attached to the outer surface of the dielectric layer to form a conductive polymer film by chemical polymerization. This conductive polymer film becomes a solid electrolyte layer.

[0078] Thereafter, the element portion 212 is immersed in the carbon paste, pulled out, and dried to form a carbon layer in a predetermined area. The carbon paste is a conductive paste containing carbon particles as a conductive component and a resin component such as an epoxy resin or a phenol resin.

[0079] Then, the element portion 212 is immersed in the conductive paste, pulled up, and dried to form a cathode conductor layer in a predetermined region. The conductive paste for forming the cathode conductor layer may contain, for example, metal particles as a conductive component and a resin component such as an epoxy resin or a phenolic resin. The metal particles may be, for example, gold, silver, copper, platinum, or the like. Among them, a silver paste containing silver particles as a conductive component is preferable as the conductive paste for forming the cathode conductor layer.

[0080] As a result of the above, a workpiece 210 (plurality of elements 10) in which a solid electrolytic capacitor element 10 is formed on each element portion 212 is produced.

[0081] Here, the above-mentioned first portion 221 has substantially rectangular parallelepiped through holes 223 formed at the same number and pitch as the elements 10 of the rectangular workpiece 210, and has a plurality of rows of such through holes 223.

[0082] Next, a plurality of solid electrolytic capacitor elements 10 (stack 11) are prepared, and a resin curing step is carried out.

[0083] Fig. 12A is a diagram showing an example of a process for preparing a stack of multiple solid electrolytic capacitor elements stacked together. Fig. 12B is a diagram showing an example of a process for inserting the stack into a through-hole. Fig. 12C is a diagram showing an example of a process for embedding the tip of each element in a conductive paste. Fig. 12D is a diagram showing an example of a process for filling a liquid material around each element inserted into a through-hole.

[0084] First, as shown in Fig. 12A, a plurality of workpieces 210 on which a plurality of elements 10 are formed in a rectangular shape are prepared, and a predetermined number of workpieces 210 are bundled together and fixed with a jig such as a clamp (not shown) so that the plurality of elements 10 overlap each other. As a result, stacks 11 in which the plurality of elements 10 overlap each other are arranged in a row (a row aligned perpendicular to the paper surface of Fig. 12A).

[0085] 12B, an adhesive sheet 250 (hereinafter may be simply abbreviated as "sheet 250") is attached to first portion 221 of exterior body 220 so as to close first openings 223a of each through-hole 223. That is, adhesive sheet 250 is attached to the entire surface of one side of first portion 221 to close one side of each through-hole 223. This makes it possible to easily expose the end face of collecting electrode 30 at first end face 110e of electronic component body 110 by peeling sheet 250 after sealing.

[0086] It should be noted that it is sufficient for each through hole 223 to have the first opening 223a (lower opening) covered, and instead of attaching the adhesive sheet 250, the first opening 223a may be covered, for example, by placing the first portion 221 on a flat table.

[0087] Next, as shown in FIG. 12B, in a state where the first opening 223a of each through hole 223 is covered with the adhesive sheet 250, the conductive paste 230 is supplied onto the sheet 250 from the second opening 223b (upper opening) of each through hole 223. As a result, the conductive paste 230 is applied onto the sheet 250 in each through hole 223. For example, the conductive paste 230 may contain metal particles as a conductive component and a resin component such as epoxy resin or phenolic resin. For example, the metal particles may be silver, copper, nickel, tin, or the like. Among them, the conductive paste 230 is preferably a silver paste containing silver particles as a conductive component. In addition, for example, a dispenser or the like may be used to supply the conductive paste 230.

[0088] Then, as shown in Fig. 12B, a plurality of elements 10 (superimposed body 11) are inserted into each through-hole 223. That is, as shown in Fig. 12B, the fixed plurality of workpieces 210 are moved relative to the first portion 221, and the superimposed body 11 is inserted into the through-holes 223 in the same row from the second openings 223b.

[0089] In this way, by using the workpiece 210 in which multiple elements 10 are connected in the form of strips at regular intervals in the holding portion 211, the elements 10 can be inserted into the first portion 221 in strip units, thereby significantly improving productivity compared to inserting the elements 10 one by one or the stacks 11 one by one into the first portion 221.

[0090] 12C, the conductive paste 230 is spread by the tip of each element 10, i.e., the tip of the cathode 43, and the tip of the cathode 43 of each element 10 is embedded in the conductive paste 230. That is, the conductive paste 230 is connected to all elements 10.

[0091] Then, with each cathode 43 embedded, the conductive paste 230 is cured on the sheet 250 by, for example, heating. As a result, the current collecting electrode 30 (see FIG. 2) is formed with at least the tip of the cathode 43 of each element 10 embedded in the current collecting electrode 30.

[0092] 12D, the liquid material 222 is filled into the gap between each element 10 inserted into each through hole 223, that is, between the stack 11 and the first portion 221 (moisture-proof film 240). For example, the liquid material 222 is injected into each through hole 223 by a dispenser or the like, and vacuum degassing is performed to fill the gap between the first portion 221 (moisture-proof film 240) and each element 10, that is, between the stack 11. The liquid material 222 may also be filled into the gap between adjacent elements 10. When adjacent elements 10 are in contact with each other or when adjacent elements 10 are bonded with a conductive adhesive, the liquid material 222 does not need to be filled between them. In addition, the viscosity of the liquid material 222 may be reduced by heating during injection or vacuum degassing. The liquid material 222 contains the above-mentioned second resin material (however, in a liquid state before hardening). The resin contained in the liquid second resin material is preferably a thermosetting resin such as an epoxy resin, a silicone resin, a urethane resin, etc. The liquid second resin material may contain, as a reinforcing material, a filler such as silica particles, alumina particles, or metal particles, or a fiber such as a ceramic fiber.

[0093] The liquid material 222 before curing preferably has a viscosity of 100 Pa·s or less at 25°C. A viscosity of 100 Pa·s or less allows for easy filling by simply degassing and heating in a vacuum oven, thereby increasing productivity. The viscosity of the liquid material 222 before curing is more preferably 30 Pa·s or less at 25°C, and even more preferably 5 Pa·s or less. The viscosity of the liquid material 222 before curing referred to here is the viscosity measured by the double cylinder method at 25°C.

[0094] Although there is no lower limit to the viscosity of the liquid material 222 before hardening, it is preferable that the viscosity is not too low so that the liquid material 222 does not leak from the gap between the first portion 221 and the sheet 250 after the liquid material 222 is filled and before it is hardened by heating. More specifically, the viscosity of the liquid material 222 before hardening is usually 0.01 Pa·s or more at 25° C., preferably 0.1 Pa·s or more, and more preferably 0.3 Pa·s or more.

[0095] Then, the liquid material 222 filled in the gaps between each element 10 (superimposed body 11) and the first portion 221 (moisture-proof film 240) is cured. For example, the liquid material 222 is heated and cured in a vacuum oven to form the second portion 222a of the exterior body 220 (the portion that becomes the second portion 22 of the exterior body 20). A small number of air bubbles may remain in the second portion 222a which is the hardened product of the liquid material 222. A small gap may remain between the second portion 222a and the moisture-proof film 240 and / or between the second portion 222a and at least one element 10.

[0096] Thereafter, for the other rows of through holes 223, the conductive paste 230 is supplied, multiple elements 10 (superimposed body 11) are inserted, the conductive paste 230 is hardened, the liquid material 222 is filled, and the liquid material 222 is hardened, so that the multiple elements 10 (superimposed body 11) and second portions 222a are stored in all of the through holes 223.

[0097] After the resin curing step, sheet 250 is peeled off from first portion 221. Collecting electrodes 30 to which elements 10 are connected are exposed on the peeled surface, and this peeled surface becomes first end surface 110e of electronic component body 110. An end surface of at least one cathode may be exposed on this peeled surface.

[0098] On the other hand, unnecessary parts of each element 10, unnecessary parts of liquid material 222, and holding portion 211 of workpiece 210 are present above first portion 221. In addition, the height of first portion 221 is the length in the longitudinal direction of the chip, and therefore needs to be adjusted to a predetermined length. For this reason, the unnecessary parts above first portion 221 are scraped off with a grinder or the like. The surface exposed after the unnecessary parts have been scraped off becomes second end face 110f of electronic component body 110. Anode 40 (foil made of a valve metal base) of each element 10 is exposed at second end face 110f.

[0099] Next, cutting is performed to separate the substrate into individual pieces.

[0100] FIG. 13 is a diagram illustrating an example of a step of cutting the first portion of the exterior body around the through hole.

[0101] 13, the first portion 221 is cut around each through hole 223. This makes it possible to easily form the first portion 21 of the tubular structure from the first portion 221. For example, a predetermined cut line (dotted line in FIG. 13) on the outside of each through hole 223 is cut using a dicer or the like.

[0102] In this manner, electronic component body 110 comprising stack 11 of elements 10 is obtained.

[0103] Thereafter, electronic component body 110 may be subjected to barrel polishing. Specifically, electronic component body 110 may be polished by sealing electronic component body 110 together with an abrasive in a barrel tank and rotating the barrel tank. This causes corners and ridges of electronic component body 110 to be rounded.

[0104] If necessary, metal fine particles may be ejected by an aerosol deposition method and collided with the barrel-polished second end surface 110f (anode end surface) of electronic component body 110. This may form a metal film on each of base end surfaces 40b of anodes 40 exposed at second end surface 110f (anode end surface) of electronic component body 110.

[0105] Next, the first external electrode 120 and the second external electrode 130 are formed on the first end face 110e (cathode end face) and the second end face 110f (anode end face) of the electronic component body 110, respectively. For example, a conductive paste is applied by a screen printing method or the like and cured to form resin electrode layers as the first external electrode 120 and the second external electrode 130, respectively. As the conductive paste for forming the resin electrode layer, a silver paste containing silver particles as a conductive component is suitable. After that, a plating layer may be formed on the resin electrode layer by plating.

[0106] At this time, the first external electrode 120 may be a thin sputtered film and / or a vapor deposition film having a thickness of, for example, several μm, formed by sputtering or vapor deposition.

[0107] By the above method, the electronic component 100 (solid electrolytic capacitor) shown in FIGS. 1 to 3 can be obtained.

[0108] Electronic component 100A shown in FIGS. 5 and 6 can be fabricated in the same manner as electronic component 100, except for the following points, for example.

[0109] Fig. 14A is a schematic diagram showing another example of a process for inserting a stack into a through-hole, Fig. 14B is a schematic diagram showing another example of a process for embedding a tip of each element in a conductive paste, and Fig. 14C is a schematic diagram showing another example of a process for filling a liquid material around each element inserted into a through-hole.

[0110] First, as shown in FIG. 12A, a predetermined number of workpieces 210 are bundled together to create a stack 11.

[0111] Next, as shown in FIG. 14A, adhesive sheet 250 is attached to first portion 221, and conductive paste 230 is applied onto sheet 250 in the same manner as described above.

[0112] However, at this stage, no moisture-proof film is formed on the surface of first portion 221 of exterior body 220.

[0113] Then, as shown in FIG. 14B, similarly to the above-described case, multiple elements 10 (superimposed body 11) are inserted into each through hole 223, the tip portion of the cathode 43 of each element 10 is embedded in the conductive paste 230, and the conductive paste 230 is hardened with each cathode 43 embedded.

[0114] 14B, a moisture-proof film 240 is formed on the surface of the first portion 221 of the exterior body 220 by a method similar to that described above. As a result, the moisture-proof film 240 can be formed on the surface of the first portion 221 (the surface that becomes the inner circumferential surface 21b of the first portion 21 of the exterior body 20) and the surfaces of each element 10.

[0115] The moisture-proof film 240 is preferably formed on the entire exposed surfaces of the first portion 221, each element 10, and the conductive paste 230. This allows the moisture-proof film 240 to be easily formed by a chemical vapor deposition method, an atomic layer deposition method, a sputtering method, or a spin-on glass method.

[0116] 14C, the liquid material 222 is filled and cured in the same manner as described above, to form the second portion 222a of the exterior body 220. As shown in FIG.

[0117] FIG. 15 is a diagram illustrating a schematic diagram of another example of the step of cutting the first portion of the exterior body around the through hole.

[0118] Then, similarly to the above, sheet 250 is peeled off, diced into pieces (see FIG. 15), external electrodes are formed, and so on, to obtain electronic component 100A (solid electrolytic capacitor) shown in FIGS.

[0119] In the above embodiment, the case where the current collecting electrode 30 is provided has been described, but the current collecting electrode 30 may not be provided and the cathode 43 of each solid electrolytic capacitor element 10 may be directly connected to the first external electrode 120. In this case, for example, after peeling off the adhesive sheet 250, the lower part of the first portion 221 to which the sheet 250 was attached may be scraped off with a grinder or the like to expose each cathode 43 at the first end surface 110e (cathode end surface) of the electronic component body 110, and the first external electrode 120 may be formed on each cathode 43 exposed at the first end surface 110e.

[0120] Furthermore, in the case where the collecting electrode 30 is not provided, the resin curing step may be performed according to the following steps. That is, first, the liquid material 222 is injected into each through-hole 223 of the first portion 221 on which the moisture-proof film 240 is formed, by using a dispenser or the like, to fill the through-holes 223. Next, a plurality of solid electrolytic capacitor elements 10 (superimposed body 11) are inserted into each through-hole 223 filled with the liquid material 222, and the liquid material 222 is filled into the gaps between the inserted plurality of elements 10 (superimposed body 11) and the moisture-proof film 240. For example, after the insertion of the plurality of elements 10, vacuum degassing is performed to fill the liquid material 222 into the gaps between the plurality of elements 10 and the moisture-proof film 240. Then, the liquid material 222 filled into the gaps between each element 10 (superimposed body 11) and the moisture-proof film 240 is cured by heating, for example, in a vacuum oven.

[0121] In the above embodiment, the exterior body 20 is composed of only two types of resin materials, i.e., the first portion 21 and the second portion 22. However, the exterior body of the electronic component of the present invention may be composed of three types of resin materials. For example, one or more intermediate resin layers made of resin materials may be provided between the first portion and the second portion. Such an intermediate resin layer can be formed, for example, by forming the second portion that seals the stack of multiple solid electrolytic capacitor elements with dimensions smaller than the through hole of the first portion by transfer molding or the like, and then inserting the stack of solid electrolytic capacitor elements together with the second portion into the through hole of the first portion on which the moisture-proof film is formed, and then filling the gap between the second portion and the moisture-proof film with a liquid resin material and curing it.

[0122] In the above embodiment, a case has been described in which a substantially rectangular parallelepiped electronic component body 110 is used, but the shape of the electronic component of the present invention is not particularly limited. The electronic component body is preferably in a shape having opposing first and second end faces, and such a shape may be, for example, a cylindrical shape in addition to a substantially rectangular parallelepiped shape.

[0123] In addition, in the above embodiment, a case has been described in which the electronic component 100 includes a plurality of solid electrolytic capacitor elements 10 as elements, but the electronic component of the present invention need only include at least one element (electronic component element), and may include only one element.

[0124] In addition, in the above embodiment, a case has been described in which a plurality of electronic component bodies 110 are simultaneously produced using a first portion 221 having a plurality of through holes 223, but in the electronic component manufacturing method of the present invention, electronic component bodies may also be produced one by one using a first portion having only one through hole.

[0125] In the above embodiment, the electronic component 100 is described as a solid electrolytic capacitor. However, the electronic component of the present invention is not particularly limited as long as it is an electronic component including an element (electronic component element) and an exterior body, and may be, in addition to a solid electrolytic capacitor, for example, a film capacitor, an electric double layer capacitor, a solid-state battery, etc. EXAMPLES

[0126] EXAMPLES Hereinafter, examples will be given that more specifically disclose the electronic component and the method for manufacturing the electronic component of the present invention, but the present invention is not limited to these examples.

[0127] Example 1 As the electronic component serving as the sample of Example 1, the electronic component (solid electrolytic capacitor) shown in FIGS. 1 to 3 was produced by the above-mentioned method. The moisture-proof film was formed by repeating the process of forming an aluminum oxide film, specifically an Al2O3 film, 150 times by atomic layer deposition. The film formation temperature was 100°C, and no pre-treatment was performed.

[0128] Comparative Example 1 An electronic component as a sample of Comparative Example 1 was produced in the same manner as in Example 1, except that no moisture-proof film was formed.

[0129] <Moisture absorption test 1> The samples of Example 1 and Comparative Example 1 were subjected to a moisture absorption test. In detail, the sample was first baked at 125°C for 24 hours, and then subjected to moisture absorption treatment at 30°C and 60% humidity for a specified period of time. The weight change of the sample before and after the moisture absorption treatment was measured and used as the amount of water absorption. The results are shown in Figure 16.

[0130] FIG. 16 is a graph showing the results of the moisture absorption test of the samples of Example 1 and Comparative Example 1.

[0131] As shown in FIG. 16, it was found that the sample of Example 1 on which the moisture-proof film was formed had a reduced amount of water absorption.

[0132] Example 2 An electronic component as a sample of Example 2 was fabricated in the same manner as in Example 1, except that the deposition temperature of the Al2O3 film was set to 200° C. and the film thickness was set to 10 nm.

[0133] Example 3 An electronic component as a sample of Example 3 was fabricated in the same manner as in Example 1, except that the deposition temperature of the Al2O3 film was set to 150° C. and the film thickness was set to 10 nm.

[0134] Example 4 An electronic component as a sample of Example 4 was fabricated in the same manner as in Example 1, except that the deposition temperature of the Al2O3 film was set to 150° C. and the film thickness was set to 30 nm.

[0135] Example 5 An electronic component as a sample of Example 5 was fabricated in the same manner as in Example 1, except that the deposition temperature of the Al2O3 film was set to 150° C. and the film thickness was set to 60 nm.

[0136] <Moisture absorption test 2> For the samples of Examples 2 to 5, a moisture absorption test was carried out under the same conditions as in the moisture absorption test 1. The results are shown in Table 1 below.

[0137] [Table 1]

[0138] As shown in Table 1 above, it was found that the water absorption amount tends to decrease as the thickness of the moisture-proof film increases. From the viewpoint of moisture-proof effect, the thickness of the moisture-proof film is preferably 10 nm or more. From the viewpoint of suppressing film formation cost and suppressing film peeling due to an increase in the film stress of the moisture-proof film, the thickness of the moisture-proof film is preferably 500 nm or less.

[0139] Example 6 An electronic component as a sample of Example 6 was fabricated in the same manner as in Example 1, except that the deposition temperature of the Al2O3 film was 150°C.

[0140] <Moisture absorption test 3> For the samples of Examples 1 and 6 and Comparative Example 1, moisture absorption tests were carried out under the same conditions as in the moisture absorption test 1. The results are shown in FIG.

[0141] Fig. 17 is a graph showing the results of the moisture absorption test of the samples of Examples 1 and 6 and Comparative Example 1. In Fig. 17, the vertical axis shows the weight change rate (%) of each sample when the amount of absorption (weight change of the sample before and after moisture absorption treatment) when the sample of Comparative Example 1 was subjected to moisture absorption treatment for 24 hours is taken as 100%.

[0142] 17, it was found that the amount of water absorption tends to increase when the film formation temperature is low in the atomic layer deposition method. Therefore, when forming a moisture-proof film by using the atomic layer deposition method, the film formation temperature is preferably 150°C or less, and more preferably 100°C or less.

[0143] The present specification discloses the following:

[0144] <1> An element and an exterior body that seals the element, the exterior body has a first portion including a first resin material and a second portion including a second resin material, the first portion is a tube structure having a through hole, and the element is housed in the through hole; the second portion is present within the through hole in which the element is housed, An electronic component, comprising: a moisture-proof film provided between the first portion and the second portion.

[0145] <2> The moisture-proof film is further provided on a surface of the element. <1> 2. An electronic component as described in claim 1.

[0146] <3> The moisture-proof film is an insulating film containing at least one metal selected from the group consisting of Si, Ti, Al, Hf, Zr, Ta, Sc, and Nb. <1> or <2> 2. An electronic component as described in claim 1.

[0147] <4> The moisture-proof film is an insulating film containing an oxide or nitride of the metal. <3> 2. An electronic component as described in claim 1.

[0148] <5> providing a device; preparing a first portion of an exterior body including a first resin material and having a through hole; forming a moisture-proof film on a surface of the first portion; a step of hardening a liquid material, including a liquid second resin material, filled in a gap between the first portion and the element inserted into the through hole to form a second portion of the exterior body; A method for manufacturing an electronic component, comprising:

[0149] <6> The step of forming the moisture-proof film is performed before inserting the element into the through hole, and the moisture-proof film is formed only on the surface of the first portion. <5> A method for manufacturing an electronic component according to claim 1.

[0150] <7> the step of forming the moisture-proof film is performed after inserting the element into the through hole, and the moisture-proof film is formed on a surface of the first portion and a surface of the element. <5> A method for manufacturing an electronic component according to claim 1.

[0151] <8> The moisture-proof film is formed by any one of a chemical vapor deposition method, an atomic layer deposition method, a sputtering method, and a spin-on glass method. <5> from <7> 13. A method for producing an electronic component according to any one of claims 1 to 12. [Explanation of symbols]

[0152] 10 Solid electrolytic capacitor element 11 Superposition 20 Exterior body 21 Part 1 21a Outer surface 21b Inner surface 21c end face 21d End face 22 Part 2 23 Through hole 30 Current collecting electrode 40 Anode 40a Tip surface 40b Proximal surface 41 Dielectric layer 42 Mask Layer 43 Cathode 44 Solid electrolyte layer 45 Carbon Layer 46 Cathode conductor layer 100, 100A Electronic Components 110 Electronic component body 110a 1st main surface 110b 2nd principal surface 110c 1st side 110d 2nd side 110e 1st end face 110f 2nd end face 120 1st external electrode 130 2nd external electrode 140, 240 Moisture-proof membrane 210 Work 211 Holding part 212 Element section 220 Exterior body 221 Part 1 222 Liquid Materials 222a Part 2 223 Through hole 223a First opening 223b Second opening 230 Conductive Paste 250 Adhesive Sheet

Claims

1. An element and an exterior body that seals the element, the exterior body has a first portion including a first resin material and a second portion including a second resin material, The first portion is a tube structure having a through hole, and the element is housed in the through hole. the second portion is present within the through hole in which the element is housed, The electronic component further comprises a moisture-proof film provided between the first portion and the second portion.

2. The electronic component according to claim 1 , wherein the moisture-proof film is further provided on a surface of the element.

3. 3. The electronic component according to claim 1, wherein the moisture-proof film is an insulating film containing at least one metal selected from the group consisting of Si, Ti, Al, Hf, Zr, Ta, Sc, and Nb.

4. 4. The electronic component according to claim 3, wherein the moisture-proof film is an insulating film containing an oxide or nitride of the metal.

5. providing a device; preparing a first portion of an exterior body including a first resin material and having a through hole; forming a moisture-proof film on a surface of the first portion; a step of hardening a liquid material, including a liquid second resin material, filled in a gap between the first portion and the element inserted in the through hole to form a second portion of the exterior body; A method for manufacturing an electronic component, comprising:

6. The method for manufacturing an electronic component according to claim 5 , wherein the step of forming the moisture-proof film is performed before inserting the element into the through hole, and the moisture-proof film is formed only on the surface of the first portion.

7. The method for manufacturing an electronic component according to claim 5 , wherein the step of forming the moisture-proof film is performed after inserting the element into the through hole, and the moisture-proof film is formed on the surface of the first portion and the surface of the element.

8. 7. The method for producing an electronic component according to claim 5, wherein the moisture-proof film is formed by any one of a chemical vapor deposition method, an atomic layer deposition method, a sputtering method, and a spin-on-glass method.

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