Film forming device, processing device, film forming method, and display panel manufacturing method

Abstract

To provide a technique advantageous for reducing the time required for formation of an organic material film.SOLUTION: A film forming device comprises: a drying unit that performs drying processing of drying an organic material in a liquid state on a substrate; a firing unit that performs firing processing of firing the organic material on the substrate to obtain an organic material film; a conveying mechanism that conveys the substrate from the drying unit to the firing unit; and an irradiation unit that irradiates the organic material with ultraviolet light after the drying processing and before the firing processing.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a film forming apparatus, a processing apparatus, a film forming method, and a method for manufacturing a display panel. [Background technology]

[0002] When manufacturing an article such as an organic display panel having an OLED (Organic Light Emitting Diode) that is an organic EL (Electro Luminescence) element, a method of applying a liquid film to a desired location on a substrate is known. An organic display panel generally has a configuration in which an organic layer is disposed between an anode and a cathode. The organic layer may include a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer in addition to a light emitting layer.

[0003] Patent Document 1 describes a technique in which, in the process of forming a hole transport layer, after the ultraviolet irradiation process and the baking process are completed, a removal process is performed to remove a part of the hole transport layer material, and the remaining insoluble layer is used as the hole transport layer. In this technique, ultraviolet irradiation is performed for the purpose of thickening the remaining insoluble layer. Patent Document 2 describes a technique in which an ultraviolet-curable ink composition is ink-jet coated on an organic element as a sealing material, and then ultraviolet irradiation and heating are performed to block oxygen and moisture from penetrating into the organic layer. Patent Document 3 describes a technique in which the ink applied by inkjet coating is irradiated with high-intensity light to heat and dry the ink. Non-Patent Document 1 describes that a material containing a polyaniline structure is changed to a quinoid structure by oxidation. However, the techniques described in Patent Documents 1, 2, and 3 do not enable a reduction in the baking time. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2007-214066 A [Patent Document 2] Patent No. 7164268 [Patent Document 3] Patent No. 6222113 [Non-patent literature]

[0005] [Non-Patent Document 1] Hidetake Sakuraba, Solid-liquid phase asymmetric oxidative polymerization using microcrystals of aniline-β-cyclodextrin inclusion complex, Proceedings of the Polymer Society vol. 63, No. 5, pp, 331-340 (May, 2006) Summary of the Invention [Problem to be solved by the invention]

[0006] An object of the present invention is to provide an advantageous technique for shortening the time required to form an organic material film. [Means for solving the problem]

[0007] One aspect of the present invention relates to a film forming apparatus, the film forming apparatus including: a drying section that performs a drying process to dry an organic material in a liquid state on a substrate; a baking section that performs a baking process to bake the organic material on the substrate to obtain an organic material film; a transport mechanism that transports the substrate from the drying section to the baking section; and an irradiation section that irradiates the organic material with ultraviolet light after the drying process and before the baking process. Effect of the Invention

[0008] According to the present invention, an advantageous technique is provided for shortening the time required to form an organic material film. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a plan view illustrating a configuration of a film forming apparatus according to an embodiment. [Diagram 2] 1A to 1C are diagrams showing the flow of a film forming method according to an embodiment; [Diagram 3] 1A and 1B are diagrams showing exemplary apparatus and methods for performing an irradiation process. [Figure 4]FIG. 2 is a diagram illustrating an example of the chemical structure of a material contained in an organic material. [Diagram 5] FIG. 13 is a diagram illustrating measurement results of the spectral transmittance of an organic material. [Figure 6] FIG. 13 is a graph illustrating the relationship between baking time and transmittance. [Figure 7] FIG. 13 is a diagram illustrating the effect of shortening the baking time by irradiation with ultraviolet light. [Figure 8] FIG. 13 is a diagram illustrating the effect of shortening the baking time by irradiation with ultraviolet light. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, the embodiments will be described in detail with reference to the attached drawings. Note that the following embodiments do not limit the invention according to the claims. Although the embodiments describe a number of features, not all of these features are essential to the invention, and the features may be combined in any manner. Furthermore, in the attached drawings, the same reference numbers are used for the same or similar configurations, and duplicated descriptions are omitted.

[0011] FIG. 1 shows a schematic configuration of a film forming apparatus 100 according to an embodiment suitable for manufacturing an organic display panel. In one aspect, the film forming apparatus 100 can be understood as an apparatus for forming an organic material film on a substrate S. In another aspect, the film forming apparatus 100 can be understood as an apparatus for processing an organic material on a substrate S, or an apparatus for processing an organic material on a substrate S. The organic material film can be, for example, any of a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer of an organic EL element (OLED). The process for manufacturing an organic EL element can include a film forming step of forming an organic material film such as a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer on a substrate S. The film forming step of forming an organic material film can include a coating step of disposing or coating an organic material in a liquid state on the substrate S by a printing method or the like, a drying step of drying the organic material in the liquid state to form a dry film, and a baking step of baking the dry film. The organic material may be a solution containing a solute and a solvent for forming an organic material film.

[0012] The film forming apparatus 100 may include a plurality of processing sections and a transport mechanism 9 that transports a substrate between the plurality of processing sections. Each processing section may include a processing chamber. The film forming apparatus 100 may include a transport chamber 10 connected to each of the processing chambers of the plurality of processing sections, and the transport mechanism 9 may be disposed in the transport chamber 10. The transport chamber 10 may be disposed so as to be surrounded by each of the processing chambers of the plurality of processing sections. The film forming apparatus 100 may be a multi-chamber type processing apparatus.

[0013] In one example, the multiple processing units may include a coating unit 1, a drying unit 4, and a baking unit 5. The coating unit 1 performs a coating process to coat the substrate S with an organic material in a liquid state. The drying unit 4 performs a drying process to dry the organic material in a liquid state coated on the substrate S by the coating unit 1. The baking unit 5 performs a baking process to bake the organic material dried by the drying unit 4 to form an organic material film. In another aspect, the multiple processing units may include, for example, the coating unit 1, a cleaning unit 2, a load lock unit 3, a drying unit 4, a baking unit 5, a cooling unit 6a, an alignment unit 6b, an unload lock unit 7, and a buffer unit 8. The processing chambers that the coating unit 1, the drying unit 4, and the baking unit 5 each have may also be called a coating chamber, a drying chamber, and a baking chamber. The coating chamber is a processing chamber for performing a coating process to coat the substrate S with an organic material in a liquid state. The drying chamber is a processing chamber for performing a drying process to dry the organic material in a liquid state coated on the substrate S by the coating unit 1. The baking chamber is a processing chamber for carrying out a drying process in which the organic material on the substrate S that has been subjected to the drying process is baked to obtain an organic material film.

[0014] The cleaning unit 2 can be configured to perform a cleaning process for removing contaminants (e.g., organic matter) attached to the substrate S. The cleaning unit 2 can be configured to generate ozone using an ultraviolet light source such as an excimer lamp, and to remove the organic matter using the ozone.

[0015] The load lock unit 3 can be used as an interface for transporting the substrate S from the outside of the film forming apparatus 100 to the inside of the film forming apparatus 100. In this example, the cooling unit 6a and the alignment unit 6b are arranged in one processing chamber, but the cooling unit 6a and the alignment unit 6b may be arranged in different processing chambers. The cooling unit 6a can be configured to cool the substrate cleaned by the cleaning unit 2 and the substrate on which the dry film is baked by the baking unit 5. The cooling unit 6a can control the temperature of the substrate so that the temperature or temperature distribution of the substrate falls within ±0.2°C of the target temperature, for example. The alignment unit 6b can be configured to align the substrate supplied to the coating unit 1, for example. The alignment can be performed, for example, with respect to the position in the X-axis direction and the Y-axis direction in the XYZ coordinate system, and the rotation around the Z axis. Furthermore, the alignment unit 6b may align the substrate unloaded from the film forming apparatus 100.

[0016] The unload lock unit 7 may be configured as an interface for transporting the substrate S from the film forming apparatus 100 to the outside after the processing therein has been completed. The load lock unit 3 and the unload lock unit 7 may be a common unit. The buffer unit 8 may be used to evacuate the substrate S from inside the film forming apparatus 100 when a malfunction occurs in the film forming apparatus 100. An additional transport chamber 11 may be provided between the transport chamber 10 and the coating unit 1.

[0017] The film forming apparatus 100 may further include an irradiation section 12 that irradiates the organic material (organic material film) on the substrate S with ultraviolet light after the drying process and before the baking process. In the first configuration example, the irradiation section 12 may be configured to irradiate the organic material on the substrate S with ultraviolet light on the transport path of the substrate S from the drying section 4 to the baking section 5 by the transport mechanism 9. In the second configuration example, the irradiation section 12 may be arranged so that when a part of the substrate S is irradiated with ultraviolet light by the irradiation section 12, at least a part of the part of the substrate S that has already been irradiated with ultraviolet light is located in the baking section 5 (baking chamber). In the second configuration example, the irradiation section 12 may be arranged, for example, near a gate valve (not shown) of the baking section 5 (baking chamber). In the third example, the irradiation section 12 may be arranged so that when a part of the substrate S is irradiated with ultraviolet light by the irradiation section 12, at least a part of the part of the substrate S that has not yet been irradiated with ultraviolet light is located in the drying section 4 (drying chamber). In the third configuration example, the irradiation unit 12 may be disposed, for example, near a gate valve (not shown) of the drying unit 4 (drying chamber). In the fourth configuration example, the irradiation unit 12 may be disposed in a space outside the drying unit 4 (drying chamber) and the baking unit 5 (baking chamber), for example, in the transfer chamber 10, so as to irradiate the substrate S with ultraviolet light. In the fourth configuration example, the irradiation unit 12 may be configured to irradiate the entire area of ​​the organic material on the substrate S with ultraviolet light all at once. In the fifth configuration example, the irradiation unit 12 may be disposed in the drying unit 4 (drying chamber).

[0018] The film forming apparatus 100 may further include a control unit 20. The control unit 20 may be configured, for example, by a PLD (abbreviation of Programmable Logic Device) such as an FPGA (abbreviation of Field Programmable Gate Array), an ASIC (abbreviation of Application Specific Integrated Circuit), a general-purpose or dedicated computer with a program installed, or a combination of all or part of these. The control unit 20 may be configured to control the coating unit 1, the cleaning unit 2, the drying unit 4, the baking unit 5, the cooling unit 6a, the alignment unit 6b, the transport mechanism 9, and the irradiation unit 12, for example, based on control information provided from an external device.

[0019] FIG. 2 is a diagram showing the flow of a film forming method according to an embodiment. The execution of the film forming method shown in FIG. 2 can be controlled by the control unit 20 according to control information. In step S201 (coating step), a coating process is performed in the coating unit 1 (coating chamber) to coat an organic material in a liquid state on a substrate. This organic material can be, for example, an organic material for forming a hole injection layer. The coating unit 1 includes, for example, an inkjet device, and the coating process can be performed by the inkjet device. Although not shown in FIG. 2, the substrate that has undergone step S201 can be transported to a drying chamber of the drying unit 4 by the transport mechanism 9. Next, in step S202 (drying step), a drying process can be performed in the drying unit 4 (drying chamber) to dry the organic material in the liquid state. Next, in step S203 (irradiation step), the organic material on the substrate that has undergone the drying step is irradiated with ultraviolet light by the irradiation unit 12.

[0020] Step S203 (irradiation step) is a step performed after step S202 (drying step) and after step S204 (baking step). Step S203 (irradiation step) can be performed, for example, on the transport path of the substrate S by the transport mechanism 9 from the drying section 4 (drying chamber) to the baking section 5 (baking chamber). Alternatively, step S203 (irradiation step) can be performed, for example, before or after the substrate S is transported by the transport mechanism 9 from the drying section 4 (drying chamber) to the baking section 5 (baking chamber). Step S203 (irradiation step) can be performed so as to reduce the time required for step S204 (baking step). Alternatively, step S203 (irradiation step) can be performed so as to reduce the energy required for performing step S204 (baking step). In step S204 (baking step), a baking process for baking the organic material on the substrate S can be performed in the baking section 5 (baking chamber).

[0021] Thereafter, step S205 may be performed as necessary. In step S205, an additional film formation process may be performed. For example, when a hole injection layer is formed in the above-described steps S201 to S204, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer may be formed in the additional film formation step. Each of the hole transport layer, the light emitting layer, the electron transport layer, and the electron injection layer may be formed using an organic material different from the organic material for forming the hole injection layer, but may be performed in the same manner as the above-described steps S201 to S204. Next, in step 206 (post-processing), for example, an electrode, a protective film, etc. may be formed on (the uppermost layer of) the multiple organic material layers on the substrate S. Step 206 (post-processing) may be performed in an apparatus external to the film forming apparatus 100.

[0022] The manufacturing method for producing a display panel may be understood to include a film formation step of forming an organic material film on a substrate S by the above-mentioned film formation method, and a processing step of processing the substrate S that has undergone the film formation step to obtain a display panel.

[0023] The drying step (step S202), the irradiation step (step S203), the baking step (step S204), and the like will be described in detail below by way of example.

[0024] First, the drying step will be described. The thickness of the organic material film after the drying step may vary depending on the function of the organic material film, for example, whether the organic material film constitutes a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, or an electron injection layer, but may be within a range of, for example, 10 nm to 100 nm. The drying step may be performed, for example, so that the solvent in the organic material containing the solute (organic material) and the solvent is reduced by the drying step to 20% or less, preferably 10% or less, and more preferably 5% or less of the amount before the drying step. The drying step may be performed, for example, in air, in an inert atmosphere, or in a reduced pressure atmosphere.

[0025] In one example, the drying step may be performed under conditions of pressure=atmospheric pressure, temperature=20°C to 80°C, and time=5 minutes to 30 minutes. In another example, the drying step may be performed under conditions of pressure=1 to 1000 Pa, temperature=20°C to 80°C, and time=5 minutes to 25 minutes. In yet another example, the drying step may be performed under conditions of pressure=0.1 to 13 kPa, and temperature=-25°C to 10 degrees.

[0026] The uniformity of the organic material film after drying can be determined according to the specifications required for the organic material film. The thickness and uniformity of the organic material film after drying can depend on the drying speed. The drying unit 4 preferably has a function for controlling the thickness and uniformity of the organic material film after drying. Such a function can include, for example, at least one of a pressure reducing function and a heating function. The pressure reducing function can control the volatilization rate of the solvent from the organic material in a liquid state. The heating function can control the volatilization rate of the solvent from the organic material in a liquid state and the convection of the solute in the organic material in a liquid state.

[0027] Next, the irradiation step will be described. In the case where the organic material to be dried in the drying step contains a polyaniline structure, in the irradiation step, the organic material may be irradiated with ultraviolet light so as to increase the quinoid structure in the organic material. The ultraviolet light irradiated to the organic material in the irradiation step may change the organic material by being absorbed by the organic material. However, the ultraviolet light may be determined so as not to cause unintended bond scission in the organic material. From the viewpoint of productivity, the light source of the irradiation unit 12 is preferably one that has a short start-up time, is easy to control ON / OFF, has a long life, and causes little temperature change in the substrate and the irradiation unit 12 irradiated with light, and is preferably an LED light source.

[0028] Here, the wavelength of the ultraviolet light generated by the light source of the irradiation unit 12 will be described as an example. It is known that the absorption wavelength peaks of benzene, naphthalene, and anthracene are 255 nm, 286 nm, and 375 nm, respectively, and organic materials containing these structures or similar structures absorb light at and near the absorption wavelength peaks. Therefore, from the viewpoint of light absorption, it is preferable that the ultraviolet light generated by the light source includes these wavelengths. On the other hand, since light with a wavelength shorter than 339 nm has energy that breaks carbon-carbon bonds, when ultraviolet light in a wavelength band of 349 nm or less with a peak wavelength of 339 nm is irradiated to an organic material, the carbon-carbon bonds are broken and the function of the organic material is reduced. Therefore, it is preferable that the spectrum of the ultraviolet light to be irradiated has a relative radiant intensity of less than 0.01 at wavelengths of 349 nm or less, that is, less than 1%. Furthermore, it is more preferable that the spectrum of the ultraviolet light to be irradiated has a relative radiant intensity of less than 0.01 at wavelengths of less than 340 nm, that is, less than 1%. As the light source, an LED lamp adjusted to a narrow band is preferable rather than a broad one such as a halogen lamp. When using an LED lamp as a light source, a UV LED having a typical emission wavelength of 365 nm, 385 nm, 395 nm, or 405 nm can be used. The LED lamp can be configured to have a dominant wavelength of 350 nm or more. A metal halide lamp is an example of a light source that generates light containing wavelengths longer than 405 nm, but it is not preferred because it generates a large amount of heat. Considering these factors, it is preferable that the ultraviolet light contains a wavelength between 350 nm and 405 nm. LED lamps have the advantage that it takes a short time for the light amount to stabilize after startup and have good light amount stability, making them suitable for ON / OFF control and providing high uniformity of irradiation intensity within the substrate surface.

[0029] The integrated amount of ultraviolet light irradiated by the irradiation unit 12 onto the organic material on the substrate S can be controlled by the control unit 20 according to the type (composition), thickness, etc. of the organic material. The integrated amount of light is the product of the illuminance of the irradiated ultraviolet light and the irradiation time (length of time) of the ultraviolet light. The illuminance can be adjusted, for example, by the voltage applied to the light source and the distance from the light source to the organic material. Alternatively, the illuminance can be adjusted using a filter. The irradiation time can be adjusted by turning the light source on and off or by a shutter. Alternatively, the irradiation time can be adjusted by controlling the transport speed of the substrate S, that is, by controlling the time it takes for the organic material on the substrate S to pass through the irradiation area of ​​the ultraviolet light. The irradiation time can be set to a time that is sufficiently shorter than the baking time in the baking process, for example, within the range of 1 second to 100 seconds. The integrated amount of light is affected by the organic material and its film thickness, but if the illuminance is weak, the effect may not be sufficient. The illuminance is 100 mW / cm 2 If the light intensity is less than 100 mW / cm2, the effect of light irradiation may not be sufficient. 2 , preferably 140 mW / cm 2 More preferably, it is equal to or greater than this.

[0030] Next, an apparatus and method for performing the irradiation step will be exemplarily described with reference to Fig. 3. In Fig. 3(a) to (d), the gray areas typically indicate areas irradiated with ultraviolet light by the irradiation unit 12. Fig. 3(a) to (d) may be understood as diagrams further illustrating the drying unit 4, the transport mechanism 9 (transport chamber 10), and the baking unit 5 in Fig. 1.

[0031] FIG. 3(a) shows a schematic diagram of a first example. In the first example, the organic material on the substrate S is irradiated with ultraviolet light by the irradiation unit 12 on the transport path of the substrate S by the transport mechanism 9. From another point of view, in the first example, the organic material on the substrate S is irradiated with ultraviolet light by the irradiation unit 12 while the substrate S is transported by the transport mechanism 9. From yet another point of view, in the first example, the irradiation unit 12 can be disposed so that when a part of the substrate S is irradiated with ultraviolet light by the irradiation unit 12, at least a part of the part of the substrate S that has already been irradiated with ultraviolet light is located in the baking unit 5 (baking chamber). From yet another point of view, in the first example, the irradiation area of ​​the ultraviolet light is smaller than the substrate S. The illuminance can be adjusted, for example, by at least one of the distance between the light source (not shown) and the substrate S and the voltage applied to the light source. The irradiation time can be adjusted by at least one of the transport speed of the substrate S by the transport mechanism 9 and the ON / OFF (pulse control) of the light source. The irradiation unit 12 can be disposed, for example, in the vicinity of a gate valve (not shown) of the baking unit 5 (baking chamber).

[0032] FIG. 3(b) shows a schematic diagram of the second example. In the second example, the organic material on the substrate S is irradiated with ultraviolet light by the irradiation unit 12 on the transport path of the substrate S by the transport mechanism 9. From another point of view, in the second example, the organic material on the substrate S is irradiated with ultraviolet light by the irradiation unit 12 while the substrate S is transported by the transport mechanism 9. From yet another point of view, in a third example, the irradiation unit 12 can be disposed so that when a part of the substrate S is irradiated with ultraviolet light by the irradiation unit 12, at least a part of the part of the substrate S that has not yet been irradiated with ultraviolet light is located in the drying unit 4 (drying chamber). From yet another point of view, in the second example, the irradiation area of ​​the ultraviolet light is smaller than the substrate S. The illuminance can be adjusted, for example, by at least one of the distance between the light source (not shown) and the substrate S and the voltage applied to the light source. The irradiation time can be adjusted by at least one of the transport speed of the substrate S by the transport mechanism 9 and the ON / OFF (pulse control) of the light source. The irradiation unit 12 can be disposed, for example, in the vicinity of a gate valve (not shown) of the drying unit 4 (drying chamber).

[0033] FIG. 3(c) shows a schematic diagram of a third example. In the third example, the organic material on the substrate S is irradiated with ultraviolet light by the irradiation unit 12 on the transport path of the substrate S by the transport mechanism 9. In another aspect, the irradiation unit 12 can be configured to irradiate the entire area of ​​the organic material on the substrate S with ultraviolet light all at once. In yet another aspect, the irradiation unit 12 can be configured to irradiate the organic material on the substrate S with ultraviolet light while the substrate S is stopped. In yet another aspect, in the third example, the irradiation area of ​​the ultraviolet light is larger than the substrate S. The illuminance can be adjusted, for example, by at least one of the distance between the light source (not shown) and the substrate S and the voltage applied to the light source. The irradiation time can be adjusted by at least one of the ON / OFF of the light source and the shutter.

[0034] FIG. 3(d) shows a schematic diagram of a fourth example. In the fourth example, the organic material on the substrate S is irradiated with ultraviolet light by the irradiation unit 12 in the drying chamber of the drying unit 4. In another aspect, the irradiation unit 12 can be configured to irradiate the entire area of ​​the organic material on the substrate S with ultraviolet light all at once. In yet another aspect, the irradiation unit 12 can be configured to irradiate the organic material on the substrate S with ultraviolet light while the substrate S is stopped. In yet another aspect, in the fourth example, the irradiation area of ​​the organic material on the substrate S is larger than that of the ultraviolet light. The illuminance can be adjusted, for example, by at least one of the distance between the light source (not shown) and the substrate S and the voltage applied to the light source. The irradiation time can be adjusted by at least one of the ON / OFF of the light source and the shutter.

[0035] Next, the baking step will be described. The baking step may include a baking step for baking the organic material on the substrate S. The baking step may also be understood as a step for causing the organic material on the substrate S to have a desired property. In the heating step, the temperature given to the organic material may be, for example, in the range of 100°C to 230°C, more preferably in the range of 200°C to 230°C. The baking step may be performed, for example, so that the material containing the polyaniline structure (see FIG. 4(a)) in the organic material film is oxidized by the baking step and changes to a quinoid-imine structure (see FIG. 4(c)) and a quinoid structure (see FIG. 4(b)), that is, so that quinoidization progresses. In one example, the baking step may be performed so that the total of the quinoid structure and the quinoid-imine structure is 20 mol% or more of the entire organic material film. Each structure has a characteristic absorption wavelength observed in the spectral transmittance measurement, with the polyaniline structure absorbing at 365 to 375 nm, the quinoid structure absorbing at 565 nm, and the quinoid-imine structure absorbing at 635 nm (Non-Patent Document 1). The progress of quinoidization can be evaluated by the spectral transmittance in the wavelength band of 565 to 635 nm. In one example, the baking step can be performed in air or in an inert gas atmosphere. In another example, the baking step can be performed in air under conditions of a temperature in the range of 100°C to 230°C and a time in the range of 5 to 30 minutes.

[0036] Hereinafter, a liquid organic material that can be applied onto the substrate S in the application process will be described. The liquid organic material is a solution containing a solute and a solvent. The organic material can be applied onto the substrate S using an inkjet device. The type of organic material is not particularly limited, but it is preferable that the organic material contains an aromatic compound that absorbs irradiated light. The organic material does not need to have a curing reactivity due to light irradiation and heating. The organic material can contain a material that contains a polyaniline structure and is oxidized by baking to change into a quinoid structure.

[0037] An example will be described below. As an organic panel material, an organic material was selected that contains a polyaniline structure as shown in FIG. 4(a) before baking and changes to a quinoid structure as shown in FIG. 4(b) upon baking to exhibit the desired function. This organic material was applied to a substrate by an inkjet device to form an organic material film, which was then dried. The spectral transmittance of the organic material film containing a polyaniline structure after drying is shown as a in FIG. 5. Furthermore, the organic material film was baked at 230° C. for 30 minutes. The spectral transmittance of the organic material film containing a quinoid-imine structure and a quinoid structure after baking is shown as b in FIG. 5. This shows that the structure of the organic material film changed from the structure shown in a to the structure shown in b upon baking. FIG. 6 shows the transmittance of the organic material film at a wavelength of 600 nm when the baking time at 230° C. was changed to 0 minutes (corresponding to a in FIG. 5), 5 minutes, 10 minutes, 20 minutes, and 30 minutes (corresponding to b in FIG. 5). It can be seen that the transmittance of the organic material film decreases with baking, that is, the change from a polyaniline structure to a quinoid structure progresses.

[0038] Using a similar method, an organic material film containing a polyaniline structure was formed, and an illuminance of 140 mW / cm was achieved using a UV LED light source that generates ultraviolet light with a wavelength of 365 nm. 2 The total light output is 1.4 J / cm 2 The organic material film was irradiated with ultraviolet light (UV light) for 10 seconds so that the wavelength was 635 nm. When the spectral transmittance of the organic material film was measured in this state, absorption was observed at a wavelength of 635 nm. This is thought to be absorption due to the quinoid-imine structure in which the polyaniline structure is partially oxidized. In other words, it is thought that quinoidization has progressed. After the irradiation of ultraviolet light, the film was baked at 230°C for 15 minutes, and the spectral transmittance of the organic material film was measured, resulting in a spectrum very similar to b in Figure 5. Figure 7 shows the transmittance of the organic material film at a wavelength of 600 nm when the baking time was changed to 0, 5, 10, 15, 20, and 30 minutes. For comparison, Figure 7 also shows the results shown in Figure 6 (results when no ultraviolet light was irradiated).

[0039] FIG. 8 shows the effect of shortening the baking time by irradiation with ultraviolet light. In FIG. 8, the baking time required when no ultraviolet light (UV light) is irradiated is shown as "without UV irradiation", and the baking time required when ultraviolet light having a wavelength of 365 nm is irradiated is shown as "365 nm". By irradiating the organic material film with ultraviolet light having a wavelength of 365 nm, the transmittance is obtained even when the baking time is 15 minutes, which is the same as when the film is not irradiated and the baking time is 30 minutes. In other words, the baking time can be shortened from 30 minutes to 15 minutes. In addition, the sample irradiated with ultraviolet light having a wavelength of 365 nm showed the same transmittance when the baking time was 10 minutes and 5 minutes, respectively, as the sample not irradiated with ultraviolet light, which had a baking time of 20 minutes and 10 minutes. From these results, it was confirmed that the baking time can be shortened by about 50% by irradiation with ultraviolet light.

[0040] Furthermore, similar experiments were conducted by changing the wavelength of the UVLED light source to 385nm and 395nm, and the effect of shortening the baking time was confirmed. The baking time shortening effect of irradiation with ultraviolet light was about 25% for both 385nm and 395nm, and it was confirmed that it could be shortened to about 75% of the time when not irradiated. Figure 8 also shows the baking time required when irradiating with ultraviolet light having a wavelength of 385nm ("385nm") and the baking time required when irradiating with ultraviolet light having a wavelength of 395nm ("395nm").

[0041] The present specification and drawings include the following disclosure. (Item 1) A film forming apparatus, a drying unit that performs a drying process to dry the liquid organic material on the substrate; a baking section for baking the organic material on the substrate to obtain an organic material film; a transport mechanism that transports the substrate from the drying section to the baking section; an irradiation unit that irradiates the organic material with ultraviolet light after the drying process and before the baking process; A film forming apparatus comprising: (Item 2) a control unit that controls the drying process, the baking process, and the irradiation of the ultraviolet light by the irradiation unit, The control unit controls the irradiation unit so that the organic material is irradiated with ultraviolet light by the irradiation unit after the drying process and before the baking process. 2. The film forming apparatus according to item 1, (Item 3) The irradiation unit is disposed so as to irradiate the organic material on the substrate with the ultraviolet light along a path of the substrate transported by the transport mechanism from the drying unit to the baking unit. 3. The film forming apparatus according to item 1 or 2, (Item 4) the irradiation unit is disposed so that when the ultraviolet light is irradiated onto a portion of the substrate by the irradiation unit, at least a portion of the portion of the substrate that has already been irradiated with the ultraviolet light is located in the baking unit. 4. The film forming apparatus according to item 3, (Item 5) the irradiation unit is disposed so that, when a portion of the substrate is irradiated with the ultraviolet light by the irradiation unit, at least a portion of the substrate that has not yet been irradiated with the ultraviolet light is located in the drying unit. 4. The film forming apparatus according to item 3, (Item 6) The irradiation unit is disposed in a space outside the drying unit and the baking unit so as to irradiate the substrate with the ultraviolet light. 4. The film forming apparatus according to item 3, (Item 7) The irradiation unit is configured to irradiate the ultraviolet light collectively onto the entire area of ​​the organic material on the substrate. 7. The film forming apparatus according to item 6, (Item 8) The irradiation unit is disposed in a space within the drying unit so as to irradiate the substrate with the ultraviolet light. 3. The film forming apparatus according to item 1 or 2, (Item 9) a drying chamber in which the drying process is performed by the drying unit and a baking chamber in which the baking process is performed by the baking unit are connected by a transfer chamber, and the transfer mechanism is disposed in the transfer chamber; 9. The film forming apparatus according to any one of items 1 to 8, (Item 10) a coating unit that coats the organic material in a liquid state on the substrate, the transport mechanism transports the substrate from the coating section to the drying section; 10. The film forming apparatus according to item 9, (Item 11) The ultraviolet light includes wavelengths from 350 nm to 405 nm. 11. The film forming apparatus according to any one of items 1 to 10, (Item 12) The ultraviolet light has a wavelength of less than 340 nm and accounts for less than 1% of the total ultraviolet light. Item 12. The film forming apparatus according to item 11, (Item 13) The organic material dried in the drying section includes a polyaniline structure, The irradiation unit irradiates the organic material with ultraviolet light so as to increase a quinoid structure in the organic material. 13. The film forming apparatus according to any one of items 1 to 12, (Item 14) 1. A processing apparatus for processing an organic material in a liquid state on a substrate, comprising: a drying section for drying the organic material on the substrate; a transport mechanism for transporting the substrate from the drying section; an irradiation unit that irradiates the organic material on the substrate transported from the drying unit by the transport mechanism with ultraviolet light; A processing device comprising: (Item 15) The organic material dried in the drying section includes a polyaniline structure, The irradiation unit irradiates the organic material with ultraviolet light so as to increase a quinoid structure in the organic material. 15. The processing device according to item 14, (Item 16) 1. A processing apparatus for processing organic material on a substrate, comprising: a baking unit that bakes the organic material on the substrate; a transport mechanism for transporting the substrate to the baking section; an irradiation unit that irradiates ultraviolet light onto the organic material on the substrate that is being transported to the baking unit by the transport mechanism; A processing device comprising: (Item 17) the organic material irradiated with ultraviolet light by the irradiating unit includes a polyaniline structure, The irradiation unit irradiates the organic material with ultraviolet light so as to increase a quinoid structure in the organic material. 17. The processing device according to item 16, (Item 18) The baking of the organic material in the baking unit is carried out so as to promote quinoidization of the organic material. 18. The processing device according to item 17, (Item 19) A method for forming a film, comprising the steps of: a drying step of drying the liquid organic material on the substrate in a drying chamber; an irradiation step of irradiating the organic material on the substrate with ultraviolet light while transporting the substrate having been subjected to the drying step from the drying chamber to a baking chamber; a baking step of baking the organic material that has been subjected to the irradiation step in the baking chamber to obtain an organic material film; A film forming method comprising the steps of: (Item 20) The organic material film is a film for forming a hole injection layer. 20. The method for forming a film according to item 19, (Item 21) A method for forming a film, comprising the steps of: a drying step of drying the liquid organic material for forming the hole injection layer on the substrate; an irradiation step of irradiating the organic material that has been subjected to the drying step with ultraviolet light; a baking step of baking the organic material that has been subjected to the irradiation step to obtain an organic material film; A film forming method comprising the steps of: (Item 22) the organic material in the liquid state on the substrate comprises a polyaniline structure; The irradiation step includes irradiating the organic material film with ultraviolet light so as to increase the quinoid structure in the organic material. 22. The film forming method according to item 20 or 21, (Item 23) The baking step is carried out so as to promote the conversion of the organic material into a quinoid. 23. The method for forming a film according to item 22, (Item 24) The ultraviolet light includes wavelengths from 350 nm to 405 nm. 24. The method for forming a film according to item 23, (Item 25) The ultraviolet light has a wavelength of less than 340 nm and accounts for less than 1% of the total ultraviolet light. 25. The method for forming a film according to item 24, (Item 26) The drying step is carried out so that the solvent in the organic material is reduced to 20% or less of the amount before the drying step is carried out. 22. The film forming method according to item 20 or 21, (Item 27) A method for manufacturing a display panel, comprising the steps of: A film formation step of forming an organic material film on a substrate by the film formation method according to any one of items 19 to 26; a processing step of processing the substrate that has been subjected to the film forming step to obtain the display panel; A method for manufacturing a display panel comprising the steps of:

[0042] The invention is not limited to the above-described embodiments, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention. [Explanation of symbols]

[0043] 100: film forming apparatus, 4: drying section, 5: baking section, 9: conveying mechanism, 12: irradiation section, S: substrate, 20: control section

Claims

1. A film forming apparatus, a drying unit that performs a drying process to dry the liquid organic material on the substrate; a baking section for baking the organic material on the substrate to obtain an organic material film; a transport mechanism that transports the substrate from the drying section to the baking section; an irradiation unit that irradiates the organic material with ultraviolet light after the drying process and before the baking process; A film forming apparatus comprising:

2. a control unit that controls the drying process, the baking process, and the irradiation of the ultraviolet light by the irradiation unit, The control unit controls the irradiation unit so that the organic material is irradiated with ultraviolet light by the irradiation unit after the drying process and before the baking process.

2. The film forming apparatus according to claim 1 .

3. the irradiation unit is disposed so as to irradiate the organic material on the substrate with the ultraviolet light along a path of the substrate transported by the transport mechanism from the drying unit to the baking unit; 2. The film forming apparatus according to claim 1 .

4. the irradiation unit is disposed so that when the ultraviolet light is irradiated onto a portion of the substrate by the irradiation unit, at least a portion of the portion of the substrate that has already been irradiated with the ultraviolet light is located in the baking unit.

4. The film forming apparatus according to claim 3.

5. the irradiation unit is disposed so that, when a portion of the substrate is irradiated with the ultraviolet light by the irradiation unit, at least a portion of the substrate that has not yet been irradiated with the ultraviolet light is located in the drying unit.

4. The film forming apparatus according to claim 3.

6. The irradiation unit is disposed in a space outside the drying unit and the baking unit so as to irradiate the substrate with the ultraviolet light.

4. The film forming apparatus according to claim 3.

7. The irradiation unit is configured to irradiate the ultraviolet light collectively onto the entire area of ​​the organic material on the substrate.

7. The film forming apparatus according to claim 6.

8. The irradiation unit is disposed in a space within the drying unit so as to irradiate the substrate with the ultraviolet light.

2. The film forming apparatus according to claim 1 .

9. a drying chamber in which the drying process is performed by the drying unit and a baking chamber in which the baking process is performed by the baking unit are connected by a transfer chamber, and the transfer mechanism is disposed in the transfer chamber; 2. The film forming apparatus according to claim 1 .

10. a coating unit that coats the organic material in a liquid state on the substrate, the transport mechanism transports the substrate from the coating section to the drying section; The film forming apparatus according to claim 9 .

11. The ultraviolet light includes wavelengths from 350 nm to 405 nm.

2. The film forming apparatus according to claim 1 .

12. The ultraviolet light has a wavelength of less than 340 nm and accounts for less than 1% of the total ultraviolet light. The film forming apparatus according to claim 11 .

13. The organic material dried in the drying section includes a polyaniline structure, The irradiation unit irradiates the organic material with ultraviolet light so as to increase a quinoid structure in the organic material. The film forming apparatus according to any one of claims 1 to 12.

14. 1. A processing apparatus for processing an organic material in a liquid state on a substrate, comprising: a drying section for drying the organic material on the substrate; a transport mechanism for transporting the substrate from the drying section; an irradiation unit that irradiates the organic material on the substrate transported from the drying unit by the transport mechanism with ultraviolet light; A processing device comprising:

15. The organic material dried in the drying section includes a polyaniline structure, The irradiation unit irradiates the organic material with ultraviolet light so as to increase a quinoid structure in the organic material.

15. The processing device according to claim 14.

16. 1. A processing apparatus for processing organic material on a substrate, comprising: a baking unit that bakes the organic material on the substrate; a transport mechanism for transporting the substrate to the baking section; an irradiation unit that irradiates ultraviolet light onto the organic material on the substrate that is being transported to the baking unit by the transport mechanism; A processing device comprising:

17. the organic material irradiated with ultraviolet light by the irradiating unit includes a polyaniline structure, The irradiation unit irradiates the organic material with ultraviolet light so as to increase a quinoid structure in the organic material.

17. The processing device of claim 16.

18. The baking of the organic material in the baking unit is carried out so as to promote quinoidization of the organic material.

20. The processing device of claim 17 .

19. A method for forming a film, comprising the steps of: a drying step of drying the liquid organic material on the substrate in a drying chamber; an irradiation step of irradiating the organic material on the substrate with ultraviolet light while transporting the substrate having been subjected to the drying step from the drying chamber to a baking chamber; a baking step of baking the organic material that has been subjected to the irradiation step in the baking chamber to obtain an organic material film; A film forming method comprising the steps of:

20. The organic material film is a film for forming a hole injection layer. The film forming method according to claim 19 .

21. A method for forming a film, comprising the steps of: a drying step of drying the liquid organic material for forming the hole injection layer on the substrate; an irradiation step of irradiating the organic material that has been subjected to the drying step with ultraviolet light; a baking step of baking the organic material that has been subjected to the irradiation step to obtain an organic material film; A film forming method comprising the steps of:

22. the organic material in the liquid state on the substrate comprises a polyaniline structure; The irradiation step includes irradiating the organic material film with ultraviolet light so as to increase the quinoid structure in the organic material.

22. The film forming method according to claim 20 or 21.

23. The baking step is carried out so as to promote the conversion of the organic material into a quinoid. The film forming method according to claim 22 .

24. The ultraviolet light includes wavelengths from 350 nm to 405 nm. The film forming method according to claim 23 .

25. The ultraviolet light has a wavelength of less than 340 nm and accounts for less than 1% of the total ultraviolet light. The film forming method according to claim 24 .

26. The drying step is carried out so that the solvent in the organic material is reduced to 20% or less of the amount before the drying step is carried out.

22. The film forming method according to claim 20 or 21.

27. A method for manufacturing a display panel, comprising the steps of: A film forming step of forming an organic material film on a substrate by the film forming method according to claim 19 or 20; a processing step of processing the substrate that has been subjected to the film forming step to obtain the display panel; A method for manufacturing a display panel comprising the steps of:

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