Multilayer ceramic capacitor

Abstract

To provide a multilayer ceramic capacitor that can improve reliability.SOLUTION: A multilayer ceramic capacitor 100 includes an element body 110 including a plurality of dielectric layers 140 and a plurality of internal electrode layers 150 stacked in a thickness direction T, a first external electrode provided on a first end face of the element body 110, and a second external electrode provided on a second end face of the element body 110, the plurality of internal electrode layers 150 include a plurality of first internal electrode layers 151 connected to the first external electrode and a plurality of second internal electrode layers 152 connected to the second external electrode, each of the plurality of internal electrode layers 150 has an opposing portion where adjacent internal electrode layers in the thickness direction oppose each other, and a third internal electrode layer 153 is provided between the opposing portion and at least one of the first side surface 113 and the second side surface 114 in the width direction W.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present disclosure relates to a multilayer ceramic capacitor. [Background technology]

[0002] Japanese Patent Laid-Open Publication No. 2009-32934 (Patent Document 1) discloses a conventional multilayer ceramic capacitor in which a laminate is formed by alternately laminating a plurality of dielectric layers and internal electrode layers, and external electrodes are arranged on both end faces of the laminate. Side margins are formed between both side faces of the laminate and the internal electrode layers, and end margins are formed between opposing portions where adjacent internal electrode layers face each other and both end faces of the laminate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2009-32934 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, no internal electrode layers are formed in the side margins, and no internal electrode layers are formed in the end margins in any areas other than the lead-out portions that are led to the external electrode layers. Therefore, if moisture penetrates into the laminate from the side margins and / or end margins, there is a concern that the reliability of the multilayer ceramic capacitor will be significantly reduced.

[0005] The present disclosure has been made in view of the above-mentioned problems, and an object of the present disclosure is to provide a multilayer ceramic capacitor capable of improving reliability. [Means for solving the problem]

[0006] A multilayer ceramic capacitor according to the present disclosure includes an element part having a first main surface and a second main surface opposed to each other in a thickness direction, a first side surface and a second side surface opposed to each other in a width direction, and a first end surface and a second end surface opposed to each other in a length direction, the element part including a plurality of dielectric layers and a plurality of internal electrode layers laminated in the thickness direction, a first external electrode provided on the first end surface, and a second external electrode provided on the second end surface. The plurality of internal electrode layers include a plurality of first internal electrode layers connected to the first external electrode, and a plurality of second internal electrode layers connected to the second external electrode. Each of the plurality of internal electrode layers has an opposing portion where the internal electrode layers adjacent to each other in the thickness direction are opposed to each other. A third internal electrode layer is provided in the width direction between the opposing portion and at least one of the first side surface and the second side surface.

[0007] In the multilayer ceramic capacitor based on the present disclosure, a fourth internal electrode layer may be provided in the longitudinal direction at least either between the first internal electrode layer and the second end surface or between the second internal electrode layer and the first end surface.

[0008] In the multilayer ceramic capacitor according to the present disclosure, the fourth internal electrode layer provided between the first internal electrode layer and the second end face in the length direction may be located at the same position in the thickness direction as the first internal electrode layer, and the third internal electrode layer provided between the second internal electrode layer and the first end face in the length direction may be located at the same position in the thickness direction as the second internal electrode layer.

[0009] In the multilayer ceramic capacitor according to the present disclosure, Ni may be diffused into a peripheral region of the fourth internal electrode layer other than ⅓ of the thickness of the fourth internal electrode layer.

[0010] In the multilayer ceramic capacitor according to the present disclosure, the grain diameter in the peripheral region of the fourth internal electrode layer may be smaller than the grain diameter in the vicinity of the outermost surface of the element body portion.

[0011] In the multilayer ceramic capacitor according to the present disclosure, Ni may be diffused into a peripheral region of the third internal electrode layer other than ⅓ of the thickness of the third internal electrode layer.

[0012] In the multilayer ceramic capacitor according to the present disclosure, the third internal electrode layer may be located at the same position in the thickness direction as the opposing portion.

[0013] In the multilayer ceramic capacitor according to the present disclosure, the grain diameter in the peripheral region of the third internal electrode layer may be smaller than the grain diameter in the vicinity of the outermost surface of the element body portion.

[0014] A multilayer ceramic capacitor according to the present disclosure includes an element part having a first main surface and a second main surface opposed to each other in a thickness direction, a first side surface and a second side surface opposed to each other in a width direction, and a first end surface and a second end surface opposed to each other in a length direction, the element part including a plurality of dielectric layers and a plurality of internal electrode layers laminated in the thickness direction, a first external electrode provided on the first end surface, and a second external electrode provided on the second end surface. The plurality of internal electrode layers include a plurality of first internal electrode layers connected to the first external electrode, and a plurality of second internal electrode layers connected to the second external electrode. In the length direction, a fourth internal electrode layer is provided at least one of between the first internal electrode layer and the second end surface and between the second internal electrode layer and the first end surface. Effect of the Invention

[0015] According to the present disclosure, it is possible to provide a multilayer ceramic capacitor capable of improving reliability. [Brief description of the drawings]

[0016] [Figure 1] 1 is a perspective view of a multilayer ceramic capacitor according to an embodiment; [Diagram 2] FIG. 2 is a cross-sectional view taken along line II-II shown in FIG. [Diagram 3]FIG. 2 is a cross-sectional view taken along line III-III shown in FIG. [Figure 4] FIG. 2 is a flow chart showing a manufacturing flow for manufacturing the multilayer ceramic capacitor according to the embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0017] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. In the embodiments described below, the same or common parts are denoted by the same reference characters in the drawings, and the description thereof will not be repeated.

[0018] Fig. 1 is a perspective view of a multilayer ceramic capacitor according to an embodiment. Fig. 2 is a cross-sectional view taken along line II-II shown in Fig. 1. Fig. 3 is a cross-sectional view taken along line III-III shown in Fig. 1. A multilayer ceramic capacitor 100 according to an embodiment will be described with reference to Figs. 1 to 3.

[0019] 1 to 3, a multilayer ceramic capacitor 100 according to an embodiment includes an element body 110, a first external electrode 120, and a second external electrode 130. The element body 110 is a laminate, and includes a plurality of dielectric layers 140 and a plurality of internal electrode layers 150 that are alternately stacked one by one along a thickness direction T. A third internal electrode layer 153 and a fourth internal electrode layer 154, which will be described later, are provided inside the element body 110.

[0020] The body 110 has a substantially rectangular parallelepiped shape. The body 110 includes a first main surface 111 and a second main surface 112 facing in a thickness direction T, a first side surface 113 and a second side surface 114 facing in a width direction W intersecting the thickness direction T, and a first end surface 115 and a second end surface 116 facing in a length direction L intersecting the thickness direction T and the width direction W.

[0021] It is preferable that the corners and ridges of the element part 110 are rounded. Here, a corner is a portion where three faces of the element part 110 intersect, and a ridge is a portion where two faces of the element part 110 intersect.

[0022] The first external electrode 120 is provided on the first end face 115. Specifically, the first external electrode 120 is formed over the entire first end face 115, and is formed so as to extend from the first end face 115 to the first main face 111, the second main face 112, the first side face 113, and the second side face 114.

[0023] The second external electrode 130 is provided on the second end face 116. Specifically, the second external electrode 130 is formed over the entire second end face 116, and is formed so as to extend from the second end face 116 to the first main face 111, the second main face 112, the first side face 113, and the second side face 114.

[0024] The first external electrode 120 and the second external electrode 130 each include an underlying electrode layer and a plating layer provided on the underlying electrode layer. The underlying electrode layer includes at least one selected from a baked layer, a resin layer, a thin film layer, and the like.

[0025] The baking layer includes glass and a metal. The glass includes Si. The metal included in the baking layer is composed of one metal selected from the group consisting of Ni, Cu, Ag, Pd, and Au, or an alloy including this metal, and for example, an alloy of Ag and Pd can be used.

[0026] The baked layer is formed by applying a conductive paste containing glass and metal to the element portion 110 and baking it, and may be baked simultaneously with the internal electrode layer 150 or may be baked after the internal electrode layer 150 is baked.

[0027] The resin layer may contain conductive particles and a thermosetting resin. When forming a resin layer, it may be formed directly on the laminate without forming a baked electrode layer. The resin layer may be a multi-layered layer.

[0028] The thin film layer is formed by a thin film forming method such as sputtering or vapor deposition, and is a layer of 1 μm or less in thickness in which metal particles are deposited.

[0029] The plating layer is made of one metal selected from the group consisting of Ni, Cu, Ag, Pd, and Au, or an alloy containing this metal, and for example, an alloy of Ag and Pd can be used.

[0030] The plating layer may be formed of multiple layers. For example, the plating layer has a two-layer structure of Ni plating and Sn plating. The Ni plating layer can prevent the base electrode layer from being eroded by solder when mounting the multilayer ceramic capacitor. The Sn plating layer improves the wettability of the solder when mounting the multilayer ceramic capacitor, making it easier to mount.

[0031] The first external electrode 120 and the second external electrode 130 may be formed of a plating layer. The plating layer is provided directly on the element body 110 and is directly connected to the internal electrode layer 150.

[0032] In this case, the plating layer preferably includes a first plating layer and a second plating layer provided on the first plating layer. The first plating layer and the second plating layer preferably include plating of one metal selected from the group consisting of Cu, Ni, Sn, Pb, Au, Ag, Pd, Bi, and Zn, or an alloy containing the metal.

[0033] For example, when Ni is used for the internal electrodes, it is preferable to use Cu, which has good bonding properties with Ni, for the first plating layer, and it is preferable to use Sn or Au, which have good solder wettability, for the second plating layer, and it is preferable to use Ni, which has solder barrier properties, for the first plating layer.

[0034] The second plating layer is formed as necessary, and the external electrode may be composed of the first plating layer. The second plating layer may be provided as the outermost layer of the plating layers, or another plating layer may be provided on the second plating layer. It is preferable that the plating layer does not contain glass.

[0035] The metal ratio per unit volume of the plating layer is preferably 99% by volume or more. The plating layer is formed by grain growth along the thickness direction T, and may be columnar.

[0036] The number of laminated dielectric layers 140 is preferably, for example, not less than 100 and not more than 1000. Note that the above-mentioned number of laminated layers also includes the number of outer layer portions (first outer layer portion X1 and second outer layer portion X2) described below.

[0037] The material constituting the dielectric layer 140 is, for example, BaTiO 3 Dielectric ceramics containing, as a main component, a Mn compound, an Fe compound, a Cr compound, a Co compound, a Ni compound, or the like, which are added to these components in a smaller amount than the main component, may be used. The thickness of the dielectric layer 140 is preferably 0.4 μm or more and 0.6 μm or less.

[0038] The number of layers of the multiple internal electrode layers 150 is preferably, for example, 10 or more and 1000 or less. The thickness of each internal electrode layer 150 is preferably 0.3 μm or more and 0.7 μm or less. The internal electrode layer 150 is made of one metal selected from the group consisting of Ni, Cu, Ag, Pd, and Au, or an alloy containing this metal, and for example, an alloy of Ag and Pd can be used. The internal electrode layer 150 may contain dielectric particles of the same composition as the ceramics contained in the dielectric layer 140.

[0039] The multiple internal electrode layers 150 include multiple first internal electrode layers 151 connected to the first external electrode 120 and multiple second internal electrode layers 152 connected to the second external electrode 130 .

[0040] 2, the first internal electrode layer 151 includes a facing portion 151A facing the second internal electrode layer 152, and a lead portion 151B drawn to the first end surface 115. The second internal electrode layer 152 includes a facing portion 152A facing the first internal electrode layer 151, and a lead portion 152B drawn to the second end surface 116. The facing portions 151A and 152A correspond to facing portions where adjacent internal electrode layers 150 in the thickness direction T face each other.

[0041] Each of the first internal electrode layer 151 and the second internal electrode layer 152 may contain Sn at the interface with the dielectric layer 140.

[0042] As shown in Figures 2 and 3, the element body 110 is partitioned into an inner layer portion C, a first outer layer portion X1, a second outer layer portion X2, a first side margin portion S1, a second side margin portion S2, a first end margin portion E1, and a second end margin portion E2.

[0043] The inner layer portion C has a capacitance due to the opposing portion 151A of the first internal electrode layer 151 and the opposing portion 152A of the second internal electrode layer 152 being laminated in the thickness direction T.

[0044] The first outer layer portion X1 and the second outer layer portion X2 sandwich the inner layer portion C in the thickness direction T. The first outer layer portion X1 is located outside the inner layer portion C in the thickness direction T, and is located on the first main surface 111 side. The second outer layer portion X2 is located outside the inner layer portion C in the thickness direction T, and is located on the second main surface 112 side. The thicknesses of the first outer layer portion X1 and the second outer layer portion X2 are preferably 0.4 μm or more and 0.6 μm or less.

[0045] The first end margin portion E1 and the second end margin portion E2 sandwich the inner layer portion C in the longitudinal direction L. The first end margin portion E1 is located outside the inner layer portion C in the longitudinal direction L, on the side of the first end face 115. The second end margin portion E2 is located outside the inner layer portion C in the longitudinal direction L, on the side of the second end face 116.

[0046] For example, each of the dimension in the length direction L of the first end margin portion E1 and the dimension in the length direction L of the second end margin portion E2 is preferably not less than 10 μm and not more than 40 μm.

[0047] The first side margin portion S1 and the second side margin portion S2 sandwich the inner layer portion C in the width direction W. The first side margin portion S1 is located outside the inner layer portion C in the width direction W, on the first side surface 113 side. The second side margin portion S2 is located outside the inner layer portion C in the width direction W, on the second side surface 114 side.

[0048] For example, it is preferable that each of the dimension in the width direction W of the first side margin portion S1 and the dimension in the width direction W of the second side margin portion S2 is not less than 10 μm and not more than 40 μm.

[0049] The third internal electrode layer 153 is disposed in the first side margin portion S1 and the second side margin portion S2. Specifically, in the width direction W, the third internal electrode layer 153 is disposed between each of the multiple opposing portions 151A, 152B and both the first side surface 113 and the second side surface 114. The third internal electrode layer 153 is formed of substantially the same material as the internal electrode layer 150. The third internal electrode layer 153 may contain Ni.

[0050] The third internal electrode layer 153 is provided independently of the internal electrode layer 150 and is insulated from the internal electrode layer 150. The third internal electrode layer 153 is disposed away from the internal electrode layer 150. The third internal electrode layer 153 is disposed so as to be at the same position in the thickness direction as the corresponding opposing portion. In the above, the corresponding opposing portion means the opposing portion disposed next to the third internal electrode layer 153 in the width direction W.

[0051] The thickness of the third internal electrode layer 153 in the thickness direction T is thinner than that of the internal electrode layer 150. The thickness of the third internal electrode layer 153 is about 1 / 3 to 1 / 2 of the thickness of the internal electrode layer 150. If the thickness of the third internal electrode layer 153 exceeds 1 / 2 of the thickness of the internal electrode layer 150, a structural defect may occur due to a step between the internal electrode layer 150 and the dielectric layer 140.

[0052] The third internal electrode layer 153 may be formed in an island shape or a dot shape, or may have a shape extending along the length direction L. The third internal electrode layer 153 may extend continuously or intermittently along the length direction L.

[0053] The grain diameter in the peripheral region R3 of the third internal electrode layer 153 is smaller than the grain diameter in the vicinity of the outermost surface of the element body part 110. The peripheral region R3 is, for example, within 30 μm from the third internal electrode layer 153. The vicinity of the outermost surface of the element body part 110 is, for example, within 10 μm from the first main surface 111 or the second main surface 112.

[0054] As described later, when manufacturing the multilayer ceramic capacitor 100, the multilayer chip that becomes the element part 110 is fired. At this time, Ni contained in the third internal electrode layer 153 diffuses into the dielectric layer 140, so that the growth of grains contained in the dielectric layer 140 located in the peripheral region R3 of the third internal electrode layer 153 can be suppressed.

[0055] The grain diameter of the peripheral region R3 of the third internal electrode layer 153 is preferably about ¼ or less of the grain diameter of the portion not affected by Ni in the dielectric layer 140. For example, the grain diameter of the peripheral region R3 is 0.02 μm or more and 0.1 μm or less.

[0056] The grain diameter is calculated by, for example, measuring the area of ​​the grains using an SEM at a cross section including the thickness direction T and the width direction W at the center of the multilayer ceramic capacitor 100 in the length direction L, and calculating the circle-equivalent diameter. Specifically, about 20 grains excluding singular points are randomly measured, and the circle-equivalent diameter is calculated from these.

[0057] Furthermore, when the dielectric layer 140 contains Ni as a minor component, Ni is not contained in the dielectric layer 140 in a portion located in the vicinity of the third internal electrode layer 153. This is because Ni of the dielectric layer 140 is absorbed by the third internal electrode layer 153. Note that the vicinity of the third internal electrode layer 153 is within a range from the third internal electrode layer 153 to about ⅓ of the thickness of the third internal electrode layer 153.

[0058] In other words, Ni is diffused in the peripheral region of the third internal electrode layer 153 and in a region other than 1 / 3 of the thickness of the third internal electrode layer. A part of the third internal electrode layer 153, particularly the outer side in the width direction W, may be oxidized. Alternatively, the entire third internal electrode layer 153 may be oxidized.

[0059] The presence or absence of Ni can be detected by polishing the multilayer ceramic capacitor 100 so that the dielectric layer 140 located around the third internal electrode layer 153 is exposed, and observing the exposed dielectric layer 140 using EDX.

[0060] In the first end margin portion E1, the lead portion 151B of the first internal electrode layer 151 and the fourth internal electrode layer 154 are arranged. In the second end margin portion E2, the lead portion 152B of the second internal electrode layer 152 and the fourth internal electrode layer 154 are arranged. The fourth internal electrode layer 154 is formed of substantially the same material as the internal electrode layer 150. The fourth internal electrode layer 154 may contain Ni.

[0061] The fourth internal electrode layer 154 is provided in the length direction L between the multiple first internal electrode layers 151 and the second end face 116, and between the multiple second internal electrode layers 152 and the first end face 115.

[0062] The fourth internal electrode layer 154 is provided independently of the internal electrode layer 150 and is insulated from the internal electrode layer 150. The fourth internal electrode layer 154 is disposed away from the internal electrode layer 150. The fourth internal electrode layer 154 is disposed so as to be at the same position in the thickness direction T as the corresponding internal electrode layer 150. In the above, the corresponding internal electrode layer 150 means the internal electrode layer 150 disposed side by side with the fourth internal electrode layer 154 in the length direction L.

[0063] The thickness of the fourth internal electrode layer 154 in the thickness direction T is thinner than that of the internal electrode layer 150. The thickness of the fourth internal electrode layer 154 is about 1 / 3 to 1 / 2 of the thickness of the internal electrode layer 150. If the thickness of the fourth internal electrode layer 154 exceeds 1 / 2 of the thickness of the internal electrode layer 150, a structural defect may occur due to a step between the internal electrode layer 150 and the dielectric layer 140.

[0064] The fourth internal electrode layer 154 may be formed in an island shape or a dot shape, or may have a shape extending along the width direction W. The fourth internal electrode layer 154 may extend continuously or intermittently along the width direction W.

[0065] The grain diameter in the peripheral region R4 of the fourth internal electrode layer 154 is smaller than the grain diameter in the vicinity of the outermost surface of the element body part 110. The peripheral region R4 is, for example, within 30 μm from the fourth internal electrode layer 154. The vicinity of the outermost surface of the element body part 110 is, for example, within 10 μm from the first main surface 111.

[0066] As described later, when manufacturing the multilayer ceramic capacitor 100, the multilayer chip that becomes the element part 110 is fired. At this time, Ni contained in the fourth internal electrode layer 154 diffuses into the dielectric layer 140, so that the growth of grains contained in the dielectric layer 140 located in the peripheral region R3 of the fourth internal electrode layer 154 can be suppressed.

[0067] The grain diameter of the peripheral region R4 of the fourth internal electrode layer 154 is preferably about ¼ or less of the grain diameter of the portion not affected by Ni in the dielectric layer 140. For example, the grain diameter of the peripheral region R4 is 0.02 μm or more and 0.1 μm or less.

[0068] The grain diameter is calculated by, for example, measuring the area of ​​the grains using an SEM at a cross section including the thickness direction T and the length direction L at the center of the multilayer ceramic capacitor 100 in the width direction W, and calculating the circle-equivalent diameter. Specifically, about 20 grains excluding singular points are randomly measured, and the circle-equivalent diameter is calculated from these.

[0069] Furthermore, when the dielectric layer 140 contains Ni as a minor component, the portion of the dielectric layer 140 located near the fourth internal electrode layer 154 does not contain Ni. This is because Ni of the dielectric layer 140 is absorbed by the fourth internal electrode layer 154. The vicinity of the fourth internal electrode layer 154 is within a range from the fourth internal electrode layer 154 to about 1 / 3 of the thickness of the fourth internal electrode layer 154. A part of the fourth internal electrode layer 154, particularly the outer side in the width direction W, may be oxidized. Or the entire fourth internal electrode layer 154 may be oxidized.

[0070] In other words, Ni is diffused in the peripheral region of the fourth internal electrode layer 154 and in the region other than ⅓ of the thickness of the fourth internal electrode layer 154 .

[0071] The presence or absence of Ni can be detected by polishing the multilayer ceramic capacitor 100 so that the dielectric layer 140 located around the fourth internal electrode layer 154 is exposed, and observing the exposed dielectric layer 140 using EDX.

[0072] As described above, in the multilayer ceramic capacitor 100 of this embodiment, the third internal electrode layer 153 is arranged in the first side margin portion S1 and the second side margin portion S2, and the fourth internal electrode layer 154 is arranged in the first end margin portion E1 and the second end margin portion E2.

[0073] As a result, even if moisture penetrates into the inside of the element body 110 from either the first side margin portion S1 and the second side margin portion S2, or the first end margin portion E1 and the second end margin portion E2, the third internal electrode layer 153 and / or the fourth internal electrode layer 154 can suppress the penetration of the moisture.

[0074] Furthermore, when the third internal electrode layer 153 and the fourth internal electrode layer 154 contain Ni, the growth of grains contained in the dielectric layer 140 located in the peripheral region R3 of the third internal electrode layer 153 and the peripheral region R4 of the fourth internal electrode layer 154 can be suppressed, so that the grain interfaces can be increased. As a result, the moisture resistance reliability can be further improved.

[0075] In the above description, a case where a plurality of third internal electrode layers 153 are provided corresponding to the respective opposing portions of the plurality of internal electrode layers 150 has been exemplified, but this is not limited thereto. The third internal electrode layer 153 may be provided from at least one of the plurality of opposing portions to at least one of the first side surface 113 and the second side surface 114. For example, the third internal electrode layer 153 may be provided every other layer. The third internal electrode layer 153 may be provided only in the first side margin portion S1 or only in the second side margin portion S2. Even in this case, the moisture resistance of the multilayer ceramic capacitor 100 can be improved at least on one side in the width direction W.

[0076] Similarly, in the above description, a case where a plurality of fourth internal electrode layers 154 are provided corresponding to a plurality of internal electrode layers 150 is illustrated, but the present invention is not limited thereto. The fourth internal electrode layer 154 may be provided between at least any of the plurality of first internal electrode layers 151 and the second end surface 116, and between at least any of the plurality of second internal electrode layers 152 and the first end surface 115 in the length direction L. For example, the fourth internal electrode layer 154 may be provided every other layer. The fourth internal electrode layer 154 may be provided only in the first end margin portion E1, or may be provided only in the second end margin portion E2. Even in this case, the moisture resistance of the multilayer ceramic capacitor 100 can be improved at least on one side of the length direction L.

[0077] (Manufacturing method of multilayer ceramic capacitors) 4 is a flow diagram showing a manufacturing flow for manufacturing the multilayer ceramic capacitor according to the embodiment. The manufacturing method for the multilayer ceramic capacitor according to the embodiment will be described with reference to FIG.

[0078] As shown in Fig. 4, when manufacturing a multilayer ceramic capacitor as a multilayer electronic component, first, in step (S1), a green sheet to become the dielectric layer 140 and a conductive paste for the internal electrode layer 150 are prepared. The green sheet is formed from a dielectric paste obtained by kneading ceramic powder, such as barium titanate, a binder, a dispersant, a plasticizer, and the like. The conductive paste 14 is obtained by kneading conductive powder, a solvent, a binder, ceramic powder, and the like. The green sheet and the conductive paste may be publicly known ones.

[0079] Next, in step (S2), the conductive paste for the internal electrodes is transferred in a predetermined pattern onto the green sheet 30 using a gravure printing plate. This forms a dielectric sheet on which an electrode pattern that will become the internal electrode layer 150 is formed. A pattern that will become the internal electrode pattern is formed on the circumferential surface of the gravure printing plate, but in an area outside the pattern, a pattern that is shallower than the pattern is formed. The conductive paste transferred from this shallow pattern becomes the third internal electrode layer 153 and the fourth internal electrode layer 154.

[0080] Subsequently, in step (S3), a plurality of dielectric sheets are laminated to produce a laminated sheet. Specifically, a predetermined number of dielectric sheets for outer layers on which no electrode pattern is printed are laminated, dielectric sheets on which an electrode pattern is printed are sequentially laminated thereon, and a predetermined number of the dielectric sheets for outer layers are laminated thereon.

[0081] Subsequently, in step (S4), a laminated block is produced by pressing the laminated sheets in the lamination direction using a pressing device such as a hydrostatic press.

[0082] Next, in step (S5), a laminated chip is produced. Specifically, the laminated block is cut into a predetermined size using a cutting blade to cut out the laminated chip. At this time, the corners and ridges of the laminated chip may be rounded by barrel polishing or the like.

[0083] Next, in step (S6), the laminated chip is sintered at a sintering temperature of, for example, about 900° C. to 1300° C., depending on the materials of the dielectric material and the electrode pattern.

[0084] Next, in step (S7), external electrodes are formed. For example, a conductive paste for external electrodes is applied to both end faces of the laminated chip and baked to form a baked layer on the both end faces. At this time, the baking temperature is, for example, 700°C to 900°C. Next, a plating layer is provided on the surface of the baked layer as necessary. Through the above steps, the laminated electronic component can be manufactured. Note that, when forming the external electrodes, the baking layer may be omitted and a plating layer may be provided directly on the element part 110. Through the above steps, the laminated ceramic capacitor 100 according to the embodiment can be manufactured.

[0085] (Other variations) In the above embodiment, the case where both the third internal electrode layer 153 and the fourth internal electrode layer 154 are provided has been described as an example, but the present invention is not limited to this. It is sufficient that at least one of the third internal electrode layer 153 and the fourth internal electrode layer 154 is provided.

[0086] The embodiments disclosed herein are illustrative and not restrictive in all respects. The scope of the present invention is defined by the claims, and includes all modifications within the meaning and scope of the claims. [Explanation of symbols]

[0087] 14 conductive paste, 30 green sheet, 100 multilayer ceramic capacitor, 110 element portion, 111 first main surface, 112 second main surface, 113 first side surface, 114 second side surface, 115 first end surface, 116 second end surface, 120 first external electrode, 130 second external electrode, 140 dielectric layer, 150 internal electrode layer, 151 first internal electrode layer, 151A facing portion, 151B lead-out portion, 152 second internal electrode layer, 152A facing portion, 152B lead-out portion, 153 third internal electrode layer, 154 fourth internal electrode layer, C inner layer portion, E1 first end margin portion, E2 second end margin portion, L length direction, R3, R4 peripheral area, S1 first side margin portion, S2 second side margin portion, T thickness direction, W width direction, X1 1st outer layer part, X2 2nd outer layer part.

Claims

1. A body portion having a first main surface and a second main surface facing each other in the thickness direction, a first side surface and a second side surface facing each other in the width direction, and a first end surface and a second end surface facing each other in the length direction, and including a plurality of dielectric layers and a plurality of internal electrode layers laminated in the thickness direction; A first external electrode provided on the first end surface; A second external electrode provided on the second end surface, comprising: The plurality of internal electrode layers include a plurality of first internal electrode layers connected to the first external electrode and a plurality of second internal electrode layers connected to the second external electrode; Each of the plurality of internal electrode layers has an opposing portion where the adjacent internal electrode layers in the thickness direction face each other; A multilayer ceramic capacitor, wherein a third internal electrode layer is provided between at least one of the first side surface and the second side surface from the opposing portion in the width direction.

2. The multilayer ceramic capacitor according to claim 1, wherein a fourth internal electrode layer is provided in at least one of the interval from the first internal electrode layer to the second end surface and the interval from the second internal electrode layer to the first end surface in the length direction.

3. The fourth internal electrode layer provided between the first internal electrode layer and the second end surface in the length direction has the same position as the first internal electrode layer in the thickness direction; The multilayer ceramic capacitor according to claim 2, wherein the third internal electrode layer provided between the second internal electrode layer and the first end surface in the length direction has the same position as the second internal electrode layer in the thickness direction.

4. The multilayer ceramic capacitor according to claim 2, wherein Ni is diffused in a peripheral region of the fourth internal electrode layer and in a region other than 1 / 3 of the thickness of the fourth internal electrode layer.

5. The multilayer ceramic capacitor according to claim 2, wherein the grain diameter in the peripheral region of the fourth internal electrode layer is smaller than the grain diameter near the outermost surface of the body portion.

6. The multilayer ceramic capacitor according to any one of claims 1 to 5, wherein Ni is diffused in a peripheral region of the third internal electrode layer and in a region other than 1 / 3 of the thickness of the third internal electrode layer.

7. The multilayer ceramic capacitor according to any one of claims 1 to 5, wherein the third internal electrode layer has the same position as the opposing portion in the thickness direction.

8. The laminated ceramic capacitor according to any one of claims 1 to 5, wherein the grain diameter in the peripheral region of the third internal electrode layer is smaller than the grain diameter near the outermost surface of the element body portion.

9. An element body having a first main surface and a second main surface opposing each other in the thickness direction, a first side surface and a second side surface opposing each other in the width direction, and a first end surface and a second end surface opposing each other in the length direction, and including a plurality of dielectric layers and a plurality of internal electrode layers laminated in the thickness direction; A first external electrode provided on the first end surface; A second external electrode provided on the second end surface, and comprising: The plurality of internal electrode layers include a plurality of first internal electrode layers connected to the first external electrode and a plurality of second internal electrode layers connected to the second external electrode; A laminated ceramic capacitor, wherein a fourth internal electrode layer is provided at least on one of the intervals from the first internal electrode layer to the second end surface and from the second internal electrode layer to the first end surface in the length direction.

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