Antenna module

Abstract

To provide an antenna module that comprises a heat dissipation structure of an IC, of which a module size of a plan surface is small, and a wide angle of an antenna can be made.SOLUTION: An antenna module 1 comprises: a first substrate 10; a second substrate 20; and a heat dissipation structure 30. In the first substrate 10, a RFIC 11 (a first IC) that processes a high-frequency signal is provided so as to be thermally contacted to a heat dissipation structure 30 to an opposite surface 10a (a first mounting surface) that is opposite to the heat dissipation structure 30. In the second substrate 20, a BBIC 21 (a second IC) that processes a base band signal so as to be thermally contacted to the heat dissipation structure 30 to an opposite surface 20a (a second mounting surface) that is opposite to the heat dissipation structure 30. A connection part 40 that electrically connects both adjacent end parts of the first substrate 10 and the second substrate 20 is provided, and an angle θ formed by an opposite surface 10a and an opposite surface 20a is a right angle or an acute angle.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to an antenna module. [Background technology]

[0002] The following Patent Document 1 discloses an antenna module including a substrate portion bent into a trapezoidal shape, multiple patch antennas provided on the front surface of the substrate portion, and an integrated circuit provided on the back surface of the substrate portion. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2020-123946 A Summary of the Invention [Problem to be solved by the invention]

[0004] The above antenna module has a trapezoidal substrate, which allows for a wide antenna angle, but the module size in the planar direction is large. In addition, the above antenna module does not take into consideration the heat dissipation structure of the integrated circuit (IC) provided on the back surface of the substrate.

[0005] The present invention has been made in consideration of the above problems, and has an object to provide an antenna module that has a heat dissipation structure for an IC, has a small module size in the planar direction, and enables a wide antenna angle. [Means for solving the problem]

[0006] An antenna module according to a first aspect of the present invention comprises a first substrate including an antenna and a feeder line for handling high frequency signals in the millimeter wave band, a second substrate for handling baseband signals in a frequency band lower than the high frequency signals, and a heat dissipation structure to which the first substrate and the second substrate are attached, wherein the first substrate has a first mounting surface facing the heat dissipation structure on which a first IC for processing the high frequency signals is provided, the first IC being in thermal contact with the heat dissipation structure and for processing the high frequency signals, and the second substrate has a second mounting surface facing the heat dissipation structure on which a second IC for processing the baseband signals is provided, the second substrate has a second mounting surface facing the heat dissipation structure on which a second IC is in thermal contact with the heat dissipation structure and for processing the baseband signals, the antenna module further comprises a connection portion electrically connecting adjacent ends of the first substrate and the second substrate, and an angle formed between the first mounting surface and the second mounting surface is a right angle or an acute angle.

[0007] According to the first aspect of the present invention, the first IC for processing high frequency signals and the second IC for processing baseband signals are thermally contacted with the heat dissipation structure, thereby allowing the first IC and the second IC to be efficiently cooled. In addition, the first board and the second board are arranged at a right angle or an acute angle with respect to the heat dissipation structure, thereby reducing the module size in the planar direction and enabling the antenna to have a wide angle. In addition, the adjacent ends of the first board and the second board are electrically connected to each other, thereby shortening the connection portion, thereby reducing the signal transmission loss and making the device less susceptible to the effects of disturbance noise and the like.

[0008] A second aspect of the present invention is the antenna module according to the first aspect, wherein the connection portion may have a flexible printed circuit board.

[0009] A third aspect of the present invention is an antenna module of the first or second aspect, wherein the heat dissipation structure has a rectangular prism shape, the first substrate is attached to at least two of the polygonal side surfaces of the heat dissipation structure, and the second substrate is attached to a first bottom surface perpendicular to the side surfaces of the heat dissipation structure.

[0010] A fourth aspect of the present invention is the antenna module according to the third aspect, wherein a cooling device may be attached to a second bottom surface of the heat dissipation structure opposite to the first bottom surface.

[0011] A fifth aspect of the present invention is an antenna module of the third or fourth aspect, wherein the heat dissipation structure has a hollow portion with an opening at a second bottom surface opposite the first bottom surface, and is provided with a cable passing through the hollow portion and connected to the second substrate.

[0012] A sixth aspect of the present invention is an antenna module according to any one of the first to fifth aspects, wherein a ground layer is provided on an inner layer of the first substrate, and the power supply line is arranged on the first mounting surface side of the ground layer.

[0013] A seventh aspect of the present invention is an antenna module according to any one of the first to sixth aspects, wherein the first substrate is attached to the heat dissipation structure via a first metal case that surrounds at least a portion of the first mounting surface, and the second substrate is attached to the heat dissipation structure via a second metal case that surrounds at least a portion of the second mounting surface.

[0014] An eighth aspect of the present invention is the antenna module according to the seventh aspect, wherein the first metal case may surround at least the first IC.

[0015] A ninth aspect of the present invention is the antenna module according to the seventh or eighth aspect, wherein the second metal case may surround at least the second IC.

[0016] A tenth aspect of the present invention is an antenna module according to any one of the seventh to ninth aspects, wherein a ground layer is provided on an inner layer of the first substrate, and the power feed line is arranged on the first mounting surface side of the ground layer, and the power feed line is surrounded by the first metal case.

[0017] An eleventh aspect of the present invention may include an antenna module according to any one of the first to tenth aspects, comprising a first resin sealing member for resin-sealing at least a portion of a functional component exposed on a surface of the first substrate opposite to the first mounting surface, and a second resin sealing member for resin-sealing at least a portion of a functional component exposed on a surface of the second substrate opposite to the second mounting surface. Effect of the Invention

[0018] According to the above aspect of the present invention, a heat dissipation structure for an IC is provided, the module size in the planar direction is small, and the antenna angle can be made wide. [Brief description of the drawings]

[0019] [Figure 1] 1 is a schematic perspective view of an antenna module according to a first embodiment. [Diagram 2] 1 is a cross-sectional configuration diagram of an antenna module according to a first embodiment. [Diagram 3] FIG. 3 is an enlarged view of an area A shown in FIG. [Figure 4] FIG. 11 is a cross-sectional configuration diagram of an antenna module according to a second embodiment. [Diagram 5] FIG. 11 is a cross-sectional configuration diagram of an antenna module according to a third embodiment. [Figure 6] FIG. 13 is a cross-sectional configuration diagram of an antenna module according to a fourth embodiment. [Figure 7] FIG. 7 is an enlarged view of a region B shown in FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0020] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Antenna modules according to embodiments of the present invention will now be described with reference to the drawings.

[0021] (First embodiment) Fig. 1 is a schematic perspective view of an antenna module 1 according to a first embodiment. Fig. 2 is a cross-sectional configuration diagram of the antenna module 1 according to the first embodiment. Fig. 3 is an enlarged view of a region A shown in Fig. 2. 1, the antenna module 1 according to this embodiment includes a first substrate 10, a second substrate 20, and a heat dissipation structure 30. The heat dissipation structure 30 is formed of a metal material such as aluminum or stainless steel.

[0022] The first substrate 10 is formed in a rectangular plate shape. The first substrate 10 handles high-frequency signals (RF signals) in the millimeter wave band. The second substrate 20 is formed in a rectangular plate shape. The second substrate 20 handles baseband signals (BB signals) in a frequency band lower than the high-frequency signals. The heat dissipation structure 30 is formed in a prismatic shape.

[0023] The heat dissipation structure 30 of this embodiment has a quadrangular prism shape, and the first substrate 10 is attached to at least two (all four in this embodiment) of the polygonal side surfaces 30a of the heat dissipation structure 30. The second substrate 20 is attached to a first bottom surface 30b perpendicular to the side surfaces 30a of the heat dissipation structure 30. The heat dissipation structure 30 is not limited to a quadrangular prism shape, and may be a polygonal prism shape having a number of sides greater than or equal to a pentagonal prism.

[0024] Adjacent ends of the first substrate 10 and the second substrate 20 are electrically connected to each other by a connection portion 40. The connection portion 40 is, for example, a flexible printed circuit board. The connection portion 40 may be an L-shaped connector. A cooling device 50 is attached to a second bottom surface 30c of the heat dissipation structure 30 opposite to the first bottom surface 30b.

[0025] In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each member may be described with reference to this XYZ orthogonal coordinate system. As shown in FIG. 1, the Z-axis direction is set in the direction in which the first bottom surface 30b and the second bottom surface 30c of the heat dissipation structure 30 face each other. The X-axis direction is set in the direction in which two of the four side surfaces 30a of the heat dissipation structure 30 face each other. The Y-axis direction is set in the direction in which the remaining two of the four side surfaces 30a of the heat dissipation structure 30 face each other. In addition, the side toward which the arrows of the XYZ orthogonal axes point is defined as the "+ side", and the opposite side is defined as the "- side".

[0026] As shown in FIG. 2, the first substrate 10 has an RFIC 11 (first IC) on a facing surface 10a (first mounting surface) facing the heat dissipation structure 30. Other electronic components (not shown) are provided on a non-facing surface 10b (surface opposite to the facing surface 10a) of the first substrate 10 at a position not covered by the Fresnel zone of the antenna. The Fresnel zone is defined as an area where the path difference is half a wavelength or less (area where the phase difference is less than 180°) when an electromagnetic wave propagates from a transmitting point to a receiving point. The RFIC 11 generates a predetermined high-frequency signal from a baseband signal supplied from the second substrate 20, for example. The first substrate 10 performs not only a transmitting process but also a receiving process of the high-frequency signal.

[0027] The first substrate 10 is a multilayer substrate having a plurality of conductor layers, as shown in Fig. 3. Specifically, the first substrate 10 includes conductor layers arranged in the order of a first layer 110, a second layer 120, a third layer 130, and a fourth layer 140 from the outside to the inside (the heat dissipation structure 30 side). An insulator 200 such as a quartz polymer is provided between the first layer 110, the second layer 120, the third layer 130, and the fourth layer 140.

[0028] The first layer 110 is a first antenna layer, in which a plurality of first antenna elements 111 (unpowered elements) are formed. The first antenna elements 111 are arranged in an array on the non-opposing surface 10b side of the first substrate 10. The second layer 120 is a second antenna layer, in which a second antenna element 121 (powered element) is formed and arranged on the +X side of the first antenna element 111. The first antenna element 111 and the second antenna element 121 function as antennas.

[0029] The third layer 130 forms a ground layer 131 that is electrically grounded. An opening 132 is formed in the ground layer 131. The fourth layer 140 is a signal layer, and a power feed line 141 electrically connected to the RFIC 11 is formed therein. The power feed line 141 is electromagnetically coupled (for example, capacitively coupled) to the second antenna element 121 through the opening 132 of the third layer 130. This coupling enables the first substrate 10 to radiate a high-frequency signal supplied from the power feed line 141 from the first antenna element 111 and the second antenna element 121, and to output a high-frequency signal received by the first antenna element 111 and the second antenna element 121 to the power feed line 141. The antenna configuration is not limited to this, and may be one in which the power supply line 141 and the second antenna element 121 are electrically and physically connected, or one in which the first antenna element 111 (parasitic element) is not present.

[0030] The power feed line 141 is disposed closer to the opposing surface 10a (+X side) than the ground layer 131. The power feed line 141 of this embodiment is exposed to the opposing surface 10a of the first substrate 10. Meanwhile, the first layer 110 (first antenna element 111) is covered with a protective film 210. The protective film 210 is preferably a low-loss dielectric that does not adversely affect transmission and reception of high-frequency signals. The protective film 210 may also have a role of improving the gain of high-frequency signals.

[0031] Returning to FIG. 2, the second substrate 20 has a BBIC 21 (second IC) provided on a facing surface 20a (second mounting surface) facing the heat dissipation structure 30. Other electronic components (not shown) are provided on a non-facing surface 20b (surface opposite to the facing surface 20a) of the second substrate 20. Each of the four sides of the outer edge of the second substrate 20 is connected to one side of each of the four first substrates 10 that is close to the second substrate 20 via a connection portion 40. That is, the baseband signal generated by the second substrate 20 is transmitted to the four first substrates 10 via the connection portion 40.

[0032] Here, the angle θ between the opposing surface 10a of the first substrate 10 and the opposing surface 20a of the second substrate 20 is a right angle (90 degrees). With this configuration, the module size of the antenna module 1 in the planar direction (XY plane direction) can be reduced. Note that the angle θ between the opposing surface 10a of the first substrate 10 and the opposing surface 20a of the second substrate 20 may be an acute angle (an angle greater than 0 degrees and less than 90 degrees). Even in this case, the module size of the antenna module 1 in the planar direction (XY plane direction) can be reduced.

[0033] The heat dissipation structure 30 has a support column 31 for mounting the first substrate 10 on a side surface 30a. A base portion 32 is further formed on the side surface 30a. The base portion 32 protrudes from the side surface 30a toward the RFIC 11 and is in contact with the RFIC 11 via a heat dissipation sheet 33. This allows heat generated in the RFIC 11 to be transferred to the heat dissipation structure 30 (base portion 32) via the heat dissipation sheet 33. Note that the support column 31 preferably surrounds the four sides of the periphery of the RFIC 11, which prevents unnecessary radio waves from being emitted to the outside and also makes it difficult to access the RFIC 11 for modification.

[0034] The heat dissipation structure 30 also includes support columns 31 for mounting the second substrate 20 on the first bottom surface 30b. A base portion 32 is also formed on the first bottom surface 30b. The base portion 32 protrudes from the first bottom surface 30b toward the BBIC 21 and is in contact with the BBIC 21 via a heat dissipation sheet 33. This allows heat generated in the BBIC 21 to be transferred to the heat dissipation structure 30 (base portion 32) via the heat dissipation sheet 33. It is preferable that the support columns 31 surround the four sides of the BBIC 21, which prevents unnecessary radio waves from being emitted to the outside and prevents the BBIC 21 from being easily accessed for modification.

[0035] The heat dissipation structure 30 has a hollow portion 34 that is open on a second bottom surface 30c opposite to the first bottom surface 30b. A plurality of heat dissipation plates 35 are provided in the hollow portion 34. The cooling device 50 is, for example, a blower, which takes in outside air and sends the air to the hollow portion 34, and also releases warm air that has exchanged heat with the heat dissipation plates 35 to the outside.

[0036] As described above, the antenna module 1 according to this embodiment includes a first substrate 10 including an antenna and a power feeder 141 for handling high-frequency signals in the millimeter wave band, a second substrate 20 for handling baseband signals in a frequency band lower than the high-frequency signals, and a heat dissipation structure 30 to which the first substrate 10 and the second substrate 20 are attached. The first substrate 10 includes an RFIC 11 (first IC) on an opposing surface 10a (first mounting surface) facing the heat dissipation structure 30, the RFIC 11 being in thermal contact with the heat dissipation structure 30 and processing the high-frequency signals, and the second substrate 20 includes a BBIC 21 (second IC) on an opposing surface 20a (second mounting surface) facing the heat dissipation structure 30, the BBIC 21 being in thermal contact with the heat dissipation structure 30 and processing the baseband signals, and a connection portion 40 for electrically connecting adjacent ends of the first substrate 10 and the second substrate 20, and an angle θ between the opposing surface 10a and the opposing surface 20a is a right angle or an acute angle.

[0037] According to this configuration, the RFIC 11 that processes radio frequency signals and the BBIC 21 that processes baseband signals are thermally contacted with the heat dissipation structure 30, so that the RFIC 11 and the BBIC 21 can be efficiently cooled. Furthermore, by arranging the first substrate 10 and the second substrate 20 in a direction perpendicular or at an acute angle to the heat dissipation structure 30, the module size in the planar direction can be reduced, and the antenna angle can be made wider. In addition, by electrically connecting the adjacent ends of the first substrate 10 and the second substrate 20 to each other, the connection portion 40 can be shortened, so that the signal transmission loss is reduced and the device is less susceptible to the effects of disturbance noise and the like.

[0038] In the present embodiment, the connection portion 40 has a flexible printed circuit board. With this configuration, the electrical connection between the first board 10 and the second board 20 can be made easier than with an L-shaped connector.

[0039] In this embodiment, the heat dissipation structure 30 has a prismatic shape, the first substrate 10 is attached to at least two of the polygonal side surfaces 30a of the heat dissipation structure 30, and the second substrate 20 is attached to a first bottom surface 30b perpendicular to the side surface 30a of the heat dissipation structure 30. With this configuration, the multiple first substrates 10 face in multiple directions, making it possible to widen the antenna angle. For example, when the beam direction from the four first substrates 10 is ±45 degrees as in this embodiment, 360 degrees can be covered without gaps.

[0040] In the present embodiment, the cooling device 50 is attached to the second bottom surface 30c opposite to the first bottom surface 30b of the heat dissipation structure 30. According to this configuration, the cooling device 50 can be disposed without increasing the module size in the planar direction.

[0041] In the present embodiment, a ground layer 131 is provided on an inner layer of the first substrate 10, and the power supply line 141 is disposed on the opposing surface 10a side of the ground layer 131. According to this configuration, the opposing surface 10a side is close to the heat dissipation structure 30, so that the heat dissipation structure 30 functions as an electromagnetic shield for the power supply line 141.

[0042] Second embodiment Next, a second embodiment of the present invention will be described. In the following description, the same or equivalent configurations as those in the above-described embodiment are given the same reference numerals, and the description thereof will be simplified or omitted.

[0043] FIG. 4 is a cross-sectional configuration diagram of an antenna module 1A according to the second embodiment. As shown in FIG. 4, an antenna module 1A of the second embodiment differs from the above-described embodiments in that a cooling device 50A includes a heat pipe 51.

[0044] The heat pipes 51 pass through the inside of the heat dissipation structure 30 and extend to the vicinity of each pedestal portion 32. With this configuration, the heat obtained at each pedestal portion 32 can be transported to the outside of the heat dissipation structure 30 by the heat pipes 51. Specifically, the cooling device 50A is made up of heat dissipation fins arranged away from the heat dissipation structure 30, metal for cooling, and the like. This eliminates the need to provide a heat sink 35 (see FIG. 2) in the hollow portion 34 of the heat dissipation structure 30, so the heat dissipation structure 30 can be made smaller. In addition, in the cooling device 50 shown in FIG. 2, there are cases where forced air cooling cannot be performed due to a failure of the fan or the adhesion of dust, but the peat pipes 51 utilize the latent heat of the heat medium and therefore are less likely to fail like fans.

[0045] Third embodiment Next, a third embodiment of the present invention will be described. In the following description, the same or equivalent configurations as those in the above-described embodiment are given the same reference numerals, and the description thereof will be simplified or omitted.

[0046] FIG. 5 is a cross-sectional configuration diagram of an antenna module 1B according to the third embodiment. As shown in FIG. 5, an antenna module 1B of the third embodiment differs from the above-described embodiments in that it includes a metal case 60 attached to the heat dissipation structure 30. As shown in FIG.

[0047] The metal case 60 includes a bottom wall portion 61 and a peripheral wall portion 62. The bottom wall portion 61 has a flat plate shape. The peripheral wall portion 62 has a frame shape that fits along the outer periphery of the bottom wall portion 61. In other words, the metal case 60 is formed in a cylindrical shape with a bottom.

[0048] The first substrate 10 is attached to the heat dissipation structure 30 via a first metal case 60A that surrounds at least a portion of the opposing surface 10a. The first metal case 60A surrounds at least the RFIC 11. With this configuration, the first metal case 60A serves as an electromagnetic shield, and unwanted radiation due to the source from the RFIC 11 can be suppressed.

[0049] Moreover, the second substrate 20 is attached to the heat dissipation structure 30 via a second metal case 60B that surrounds at least a portion of the opposing surface 20a. The second metal case 60B surrounds at least the BBIC 21. With this configuration, the second metal case 60B serves as an electromagnetic shield, and unwanted radiation due to radiation from the BBIC 21 can be suppressed.

[0050] (Fourth embodiment) Next, a fourth embodiment of the present invention will be described. In the following description, the same or equivalent configurations as those in the above-described embodiment are given the same reference numerals, and the description thereof will be simplified or omitted.

[0051] Fig. 6 is a cross-sectional view of an antenna module 1C according to a fourth embodiment of the present invention, and Fig. 7 is an enlarged view of a region B shown in Fig. 6. As shown in Figs. As shown in FIG. 6, an antenna module 1C of the fourth embodiment differs from the above-described embodiments in that it includes a cable 70 that passes through the hollow portion 34 of the heat dissipation structure 30 and is connected to the second substrate 20.

[0052] The BBIC 21 is connected to an external device (not shown), for example, via a cable 70, and generates a predetermined baseband signal based on a command from the external device. According to this configuration, the cable 70 is disposed inside the heat dissipation structure 30, so that the cable 70 can be configured not to interfere with the transmission and reception of radio waves from the antenna.

[0053] In the fourth embodiment, at least a part of the functional components 12 exposed on the non-opposing surface 10b of the first substrate 10 is resin-sealed with a first resin sealing member 80. Similarly, at least a part of the functional components 22 exposed on the non-opposing surface 20b of the second substrate 20 is resin-sealed with a second resin sealing member 90. According to this configuration, by resin-sealing the functional components 12, 22 accessible from the outside, it is possible to prevent damage, falling off, and modification.

[0054] 7, a ground layer 131 is provided on an inner layer of the first substrate 10, and the power feed line 141 is disposed closer to the opposing surface 10a (+X side) than the ground layer 131. The power feed line 141 is surrounded by a first metal case 60A. If a signal leaking from the power feed line 141 (signal line) is radiated to the outside, the leaked radio waves may interfere with radio waves from the antenna, adversely affecting the radiation characteristics (radiation pattern). With the above configuration, the leaked radio waves from the power feed line 141 can be electromagnetically shielded from escaping to the outside of the module.

[0055] Although preferred embodiments of the present invention have been described and illustrated above, it should be understood that they are illustrative of the present invention and should not be considered as limiting. Additions, omissions, substitutions, and other modifications can be made without departing from the scope of the present invention. Thus, the present invention should not be considered as limited by the foregoing description, but rather by the scope of the claims.

[0056] In addition, within the scope of the spirit of the present invention, it is possible to replace the components in the above-described embodiments with well-known components as appropriate, and the above-described embodiments and variations may be combined as appropriate. [Explanation of symbols]

[0057] 1 Antenna Module 1A Antenna Module 1B Antenna Module 1C Antenna Module 10 First substrate 10a: opposing surface (first mounting surface) 10b Non-facing surface 11 RFIC (First IC) 12 Functional parts 20 Second substrate 20a: opposing surface (second mounting surface) 20b Non-facing surface 21 BBIC (Second IC) 22 Functional parts 30 Heat dissipation structure 30a side 30b First bottom surface 30c Second bottom surface 31 Support column 32 Pedestal 33 Heat dissipation sheet 34 Hollow part 35 Heat sink 40 Connection 50 Cooling device 50A cooling device 51 Heat Pipe 60 Metal Case 60A First Metal Case 60B Second metal case 61 Bottom wall 62 Peripheral wall section 70 Cable 80 First resin sealing member 90 Second resin sealing member 110 1st layer 111 first antenna element 120 2nd layer 121 Second antenna element 130 3rd layer 131 Ground Layer 132 Opening 140 4th layer 141 Power line 200 Insulator 210 Protective film θ angle

Claims

1. A first substrate including an antenna and a feeding line for handling high-frequency signals in the millimeter-wave band, a second substrate for handling baseband signals in a frequency band lower than the high-frequency signals, a heat dissipation structure to which the first substrate and the second substrate are attached, and on the first substrate, on a first mounting surface facing the heat dissipation structure, a first IC that is in thermal contact with the heat dissipation structure and processes the high-frequency signals is provided, on the second substrate, on a second mounting surface facing the heat dissipation structure, a second IC that is in thermal contact with the heat dissipation structure and processes the baseband signals is provided, a connection part for electrically connecting adjacent ends of the first substrate and the second substrate to each other, wherein an angle formed between the first mounting surface and the second mounting surface is a right angle or an acute angle, an antenna module.

2. The connection part has a flexible printed circuit board. The antenna module according to Claim 1.

3. The heat dissipation structure has a prismatic shape, the first substrate is attached to at least two of the polygonal side surfaces of the heat dissipation structure, and the second substrate is attached to a first bottom surface orthogonal to the side surface of the heat dissipation structure. The antenna module according to Claim 1 or 2.

4. A cooling device is attached to a second bottom surface of the heat dissipation structure opposite to the first bottom surface. The antenna module according to Claim 3.

5. The heat dissipation structure has a hollow part with an opening on a second bottom surface opposite to the first bottom surface, and includes a cable connected to the second substrate passing through the hollow part. The antenna module according to Claim 3.

6. A ground layer is provided in an inner layer of the first substrate, and the feeding line is disposed on the side of the first mounting surface with respect to the ground layer. The antenna module according to Claim 1 or 2.

7. The first substrate is attached to the heat dissipation structure via a first metal case surrounding at least a part of the first mounting surface, and the second substrate is attached to the heat dissipation structure via a second metal case surrounding at least a part of the second mounting surface. The antenna module according to Claim 1 or 2.

8. The first metal case surrounds at least the first IC. The antenna module according to Claim 7.

9. The second metal case surrounds at least the second IC. The antenna module according to claim 7.

10. A ground layer is provided in an inner layer of the first substrate, the power supply line is disposed closer to the first mounting surface side than the ground layer, the power supply line is surrounded by the first metal case, The antenna module according to claim 7.

11. a first resin sealing member that resin-seals at least a part of the functional components exposed on the surface of the first substrate opposite to the first mounting surface; a second resin sealing member that resin-seals at least a part of the functional components exposed on the surface of the second substrate opposite to the second mounting surface, The antenna module according to claim 1 or 2.

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