Method for processing processing object

Abstract

To provide a method for processing a processing object capable of accurately grasping a state of a processing groove.SOLUTION: A processing method includes a holding step for holding a processing object (Pa) on a holding table (60), a processing step for forming a processing groove (Qa) in the processing object held on the holding table, and an information acquisition step for acquiring information on the processing groove from an image obtained by imaging the processing groove, and it includes a detection step for detecting a first area (Ea) for which it is determined that a defective element does not exist and a second area (Eb) for which it is determined that a defective element exists by using the image obtained by imaging the processing object before the processing step, and forms the processing groove in the first area in the processing step.SELECTED DRAWING: Figure 6

Description

Technical Field

[0001] The present invention relates to a method for processing an object to be processed.

Background Art

[0002] In various technical fields, processing for forming a processing groove in an object to be processed is performed. For example, in the manufacture of electronic devices such as semiconductors, a plurality of chips are formed on a wafer or a package substrate, and a processing groove is formed along a division line for partitioning the plurality of chips. Alternatively, a processing groove may be formed on the outer surface of an article for purposes such as design. The form of the processing groove includes a groove that penetrates the object to be processed in the thickness direction (full cut groove), a bottomed groove (half cut groove) formed up to the middle of the thickness of the object to be processed, and the like. Methods for forming the processing groove include various methods such as cutting with a cutting tool (such as a cutting blade) by cutting into the object to be processed, and laser processing for removing a part of the object to be processed by irradiating laser light.

[0003] In order to precisely form a processing groove in an object to be processed, various inspections are performed. For example, as disclosed in Patent Document 1, an overhead view image of the processing groove formed in the object to be processed is captured, and the quality of the processing groove is checked by determining the quality of the shape and arrangement of the processing groove from the captured image.

[0004] Also, as disclosed in Patent Document 2, when forming a processing groove by cutting, an overhead view image of a trace of cutting the cutting blade into the object to be processed at a predetermined depth is captured, the outer diameter size of the cutting blade is calculated, and based on the obtained outer diameter size information of the cutting blade, the cutting depth of the cutting blade into the object to be processed is managed.

[0005] Also, as disclosed in Patent Document 3, when forming a processing groove by cutting, an image along the cross-sectional direction (depth direction) of the processing groove formed in the object to be processed is captured, and the shape of the cutting blade (blade width, wear state, etc.) and the operating accuracy of the cutting blade (such as the presence or absence of shaft runout during rotation) are detected.

Prior Art Documents

Patent Document

[0006]

Patent Document 1

Patent Document 2

Patent Document 3

Summary of the Invention

Problems to be Solved by the Invention

[0007] When performing inspections on the processed groove using the above various methods, when imaging the object to be processed, an image containing unnecessary elements other than the processed groove may be obtained, which may reduce the inspection accuracy. For example, in the object to be processed, at positions where the processed groove partially overlaps or around the processed groove, if foreign matters or air bubbles are mixed in, or cracks or chipping occur, when obtaining information about the processed groove from the image of the processed groove, the processed groove cannot be accurately recognized in image processing, and high-precision inspection cannot be performed.

[0008] The present invention has been made in view of such points, and an object thereof is to provide a processing method for an object to be processed that can more accurately grasp the state of the processed groove.

Means for Solving the Problems

[0009] A processing method for an object to be processed according to an aspect of the present invention includes a holding step of holding the object to be processed on a holding table, a processing step of forming a processed groove in the object to be processed held on the holding table, and an information acquisition step of acquiring information about the processed groove from an image obtained by imaging the processed groove. Before the processing step, a detection step of detecting a first region determined to have no defective elements and a second region determined to have defective elements using an image obtained by imaging the object to be processed is provided, and in the processing step, the processed groove is formed in the first region.

[0010] The second region is a region in which at least one of foreign matter inclusion, air bubble inclusion, chipping, and chipping is formed as a defective element.

[0011] The holding table is preferably at least one of a processing table having a processing holding surface for holding a workpiece and an inspection table adjacent to the processing table and having an inspection holding surface for holding an inspection piece.

[0012] As one form of the inspection table, it has a rotation drive unit that rotates the inspection holding surface along a rotation axis parallel to the inspection holding surface. The rotation drive unit rotates and moves between a processing position where the inspection holding surface faces the processing unit and an imaging position where the cross section of the processing groove formed in the inspection piece held on the inspection holding surface faces the imaging unit. The processing step is performed at the processing position, and the detection step and the information acquisition step are performed at the imaging position.

Advantages of the Invention

[0013] According to the processing method of the object to be processed of the present invention, by forming a processing groove in a region of the object to be processed where there is no defective element, it becomes possible to more accurately grasp the state of the processing groove.

Brief Description of the Drawings

[0014]

Figure 1

Figure 2

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Figure 5

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Figure 10

Figure 11

Embodiments for Carrying Out the Invention

[0015] Hereinafter, with reference to the accompanying drawings, a machining method for a workpiece according to the present embodiment will be described. The machining apparatus 10 shown in FIG. 1 is an apparatus that performs cutting on a workpiece 11 which is an example of a workpiece to be machined, using a machining unit 30, and forms a machining groove by cutting. That is, the machining unit 30 is a unit for cutting. The X-axis direction and the Y-axis direction in the machining apparatus 10 are horizontal directions, and the X-axis direction and the Y-axis direction are perpendicular to each other. The Z-axis direction is the vertical direction, with the +Z direction being upward and the -Z direction being downward.

[0016] The processing device 10 has a control unit 100. The control unit 100 controls each part of the processing device 10 described below to cause the processing device 10 to perform processing operations, inspections, etc. The control unit 100 is a computer having an arithmetic processing device such as a CPU (Central Processing Unit), a storage device such as a ROM (Read Only Memory) and a RAM (Random Access Memory), and an input / output interface connected to each part of the processing device 10. The arithmetic processing device of the control unit 100 performs arithmetic processing according to a program stored in the storage device, and outputs a control signal for controlling the processing device 10 to each part of the processing device 10 via the input / output interface. Also, signals detected by each part of the processing device 10 are input to the control unit 100 via the input / output interface.

[0017] The processing device 10 includes a notification unit 80 that notifies an operator. The notification unit 80 is composed of a display monitor, display lamp, speaker, etc. provided in the processing device 10, and performs notification by displaying information on the display monitor, lighting or flashing the display lamp, and emitting sound from the speaker. Note that the processing device 10 includes a communication unit that enables communication with external devices (such as servers, personal computers, and tablet terminals), and it is also possible to transmit information from the communication unit of the processing device 10 to an external device and use the communication unit or the external device as the notification unit.

[0018] The workpiece 11 is a plate-shaped object to be processed that can form a processing groove by cutting in the processing device 10. For example, the workpiece 11 is a disk-shaped wafer made of a material such as silicon, sapphire, or gallium. On the surface of the workpiece 11, chips 12, which are electronic devices, are formed in regions partitioned in a grid pattern by a plurality of division planned lines formed in a grid pattern.

[0019] Note that the type, material, and shape of the workpiece are not limited to the workpiece 11 of the present embodiment. For example, the workpiece may be a rectangular package substrate. Further, the workpiece is not limited to a wafer or a package substrate on which an electronic device is formed, and may be a material wafer before forming the device, or other substrates or plate materials.

[0020] Also, unlike the workpiece 11 of the present embodiment, the processing groove formed in the workpiece may be other than the groove along the division planned line for dividing the chip. Further, the processing groove may be a full cut groove penetrating the workpiece, or a bottomed half cut groove formed up to the middle of the thickness of the workpiece.

[0021] The workpiece 11 is held inside the opening of the annular frame 13 via the support tape 14. The support tape 14 has a larger area than the workpiece 11, and the adhesive surface of the support tape 14 is adhered to the back surface of the workpiece 11 and the back surface of the annular frame 13. In the processing apparatus 10, processing and conveyance are performed in the state of the workpiece unit 15 composed of the workpiece 11, the annular frame 13, and the support tape 14.

[0022] The workpiece unit 15 before processing the workpiece 11 is housed in the cassette 16 and carried into the processing apparatus 10. A plurality of workpiece units 15 can be housed inside the cassette 16. The cassette 16 carried into the processing apparatus 10 is placed on the cassette placement portion 21 on the base 20.

[0023] The processing device 10 includes a processing table 22 that holds the workpiece unit 15 when processing the workpiece 11. The processing table 22 has a disk shape, and the processing holding surface 23 for holding the workpiece 11 is formed of a porous material such as porous ceramics. A suction source 28 (FIG. 2) is connected to the processing holding surface 23 of the processing table 22, and by applying the suction force of the suction source 28 to the processing holding surface 23, the workpiece 11 placed on the processing holding surface 23 is sucked and held. More specifically, the processing table 22 sucks the support tape 14 attached to the back side of the workpiece 11 and holds the workpiece 11 via the support tape 14.

[0024] The processing table 22 includes a plurality of clamp portions 24 around the processing holding surface 23. The processing table 22 of the present embodiment includes four clamp portions 24 at equal intervals in the circumferential direction of the processing holding surface 23, but the number and arrangement of the clamp portions 24 are not limited. The workpiece 11 is sucked and held by the processing holding surface 23, and each clamp portion 24 clamps the annular frame 13 from above and below, so that the workpiece unit 15 is fixedly held with respect to the processing table 22. Each clamp portion 24 is operable between a state of clamping the annular frame 13 from above and below and a state of releasing the clamping of the annular frame 13.

[0025] In addition, in the processing device 10, it is also possible to perform processing and conveyance in a state where only the workpiece 11 is used without using the annular frame 13. In this case, the processing table 22 may not include the clamp portion 24.

[0026] The processing table 22 is moved in the X-axis direction by an X-axis movement unit 25. The X-axis movement unit 25 is configured by a guide rail (not shown) that extends in the X-axis direction and supports the processing table 22 movably, a ball screw (not shown) that is rotationally driven by a motor and transmits a moving force in the X-axis direction to the processing table 22, and the like. The processing table 22 moved in the X-axis direction by the X-axis movement unit 25 is positioned in a processing region below the processing unit 30 and a loading / unloading region adjacent to the cassette placement unit 21 on the +Y direction side.

[0027] Further, the machining table 22 is supported by a rotation drive unit 26 so as to be rotatable about an axis in the Z-axis direction.

[0028] A table cover 27 that moves in the X-axis direction together with the machining table 22 is provided on the base 20. The upper part of the machining table 22 including the machining holding surface 23 is exposed above the table cover 27.

[0029] The machining apparatus 10 includes a pair of machining units 30 arranged to face each other in the Y-axis direction. Each machining unit 30 has a configuration in which a cutting blade 32 (FIGS. 4 and 9) is attached to the tip side of a spindle 31 (FIGS. 4 and 9) extending in the Y-axis direction, and the spindle 31 is rotationally driven by a spindle motor (not shown). The spindle 31 and the spindle motor are housed inside a spindle housing 33.

[0030] The cutting blade 32 is an annular cutting edge centered on the rotation axis of the spindle 31. The cutting blade 32 is formed by bonding abrasive grains such as diamond or CBN (Cubic Boron Nitride) with a binder (bonding material) such as metal or resin. The cutting blade 32 may be a hub blade in which the cutting edge is supported by a base, or a hubless blade composed only of the cutting edge. In either form of the hub blade or the hubless blade, the cutting blade 32 is fixed to the mount on the tip side of the spindle 31, and the cutting blade 32 is rotationally driven together with the spindle 31.

[0031] Each of the pair of processing units 30 is moved in the Y-axis direction (indexing feed) by a Y-axis moving unit 34 and in the Z-axis direction (cutting feed) by a Z-axis moving unit 35. That is, corresponding to the pair of processing units 30, a pair of Y-axis moving units 34 and a pair of Z-axis moving units 35 are provided. Each processing unit 30 can position the cutting blade 32 at an arbitrary position above the processing holding surface 23 by the Y-axis moving unit 34 and the Z-axis moving unit 35, and cut the cutting blade 32 into the workpiece 11 on the processing holding surface 23.

[0032] The Y-axis moving unit 34 is composed of a guide rail 37 that extends in the Y-axis direction and supports the Y-axis moving table 36 so as to be movable in the Y-axis direction, a ball screw 38 that is rotationally driven by a motor and transmits a moving force in the X-axis direction to the Y-axis moving table 36, and the like. The components of the Y-axis moving unit 34 are supported by a gantry column 39 erected on the base 20.

[0033] The Z-axis moving unit 35 is composed of a guide rail 41 that extends in the Z-axis direction and supports the Z-axis moving table 40 so as to be movable in the Z-axis direction, a ball screw 42 that is rotationally driven by a motor and transmits a moving force in the X-axis direction to the Z-axis moving table 40, and the like. The components of the Z-axis moving unit 35 are supported by the Y-axis moving table 36.

[0034] The spindle housing 33 of the processing unit 30 is attached to the lower end of the Z-axis moving table 40. When the Y-axis moving unit 34 moves the Y-axis moving table 36 in the Y-axis direction, the position of the processing unit 30 changes in the Y-axis direction. When the Z-axis moving unit 35 moves the Z-axis moving table 40 in the Z-axis direction, the position of the processing unit 30 changes in the Z-axis direction.

[0035] On the base 20, a cleaning unit 45 is provided at a position adjacent to the loading / unloading area of the processing table 22 in the +Y direction. The cleaning unit 45 includes a spinner table 46 that holds and can rotate the workpiece unit 15, and a cleaning nozzle (not shown) that injects cleaning liquid or drying air toward the workpiece unit 15 on the spinner table 46.

[0036] The general outline of the processing operation by the processing apparatus 10 configured as described above will be described. The following processing operations are performed under the control of the control unit 100.

[0037] A cassette 16 containing the workpiece unit 15 is placed on the cassette placement unit 21. The workpiece unit 15 is pulled out from the cassette 16 by a transfer mechanism (not shown) and placed on the processing table 22 located in the loading / unloading area. The workpiece 11 is sucked and held on the processing holding surface 23, and the annular frame 13 is clamped by the clamping unit 24, so that the workpiece unit 15 is fixedly held on the processing table 22. In this state, the processing table 22 is moved by the X-axis moving unit 25 to the processing area on the -X direction side.

[0038] The control unit 100 adjusts the relative positions of the processing table 22 and each processing unit 30 in the X-axis direction and the Y-axis direction by the X-axis moving unit 25 and the Y-axis moving unit 34, and positions the cutting blade 32 of each processing unit 30 above the end of the division planned line of the workpiece 11 to be cut.

[0039] Subsequently, the control unit 100 rotates the spindle 31 and lowers each processing unit 30 by the Z-axis moving unit 35. The cutting blade 32 of each processing unit 30 cuts into the workpiece 11 of the workpiece unit 15 held on the processing table 22 while rotating. Then, by moving the processing table 22 in the X-axis direction (processing feed) by the X-axis moving unit 25, cutting processing by the cutting blade 32 is performed along the division planned line extending in the X-axis direction.

[0040] When the cutting process along a set of planned dividing lines by each processing unit 30 is completed, the control unit 100 raises each processing unit 30 by the Z-axis moving unit 35 to separate the cutting blade 32 from the workpiece 11. Subsequently, the control unit 100 moves each processing unit 30 in the Y-axis direction (index feed) by the Y-axis moving unit 34 and positions the cutting blade 32 of each processing unit 30 above the end of the next uncut planned dividing line. Then, in the same manner as above, each processing unit 30 is lowered (feed for cutting) by the Z-axis moving unit 35, and the processing table 22 is moved in the X-axis direction (processing feed) by the X-axis moving unit 25 to perform the cutting process along the planned dividing line.

[0041] When the cutting along all the planned dividing lines arranged in the Y-axis direction is completed, the control unit 100 rotates the processing table 22 by 90 degrees by the rotation driving unit 26. As a result, the workpiece 11 on the processing table 22 is in a state where a plurality of uncut planned dividing lines are arranged in the Y-axis direction (extending in the X-axis direction). Then, in the same manner as above, each processing unit 30 is made to sequentially perform the cutting process along all the uncut planned dividing lines.

[0042] Note that only one of the two processing units 30 may be operated to perform the cutting process for each planned dividing line one by one. Also, different from the configuration shown in FIG. 1, the processing apparatus 10 may be configured to include only one processing unit 30 and always perform the cutting process for each planned dividing line one by one.

[0043] When the cutting process for the workpiece 11 is completed, the processing table 22 is moved from the processing area to the loading / unloading area (+X direction) by the X-axis moving unit 25. Using a conveying mechanism (not shown), the workpiece unit 15 is conveyed from the processing table 22 that has moved to the loading / unloading area to the cleaning unit 45.

[0044] In the cleaning unit 45, cleaning liquid is sprayed from the cleaning nozzles, and at the same time, the spinner table 46 is rotated to clean the workpiece unit 15. Also, air is sprayed from the cleaning nozzles to dry the workpiece unit 15 after cleaning. The workpiece unit 15 after cleaning is conveyed to the position of the cassette 16 using a conveying mechanism (not shown) and stored in the cassette 16.

[0045] An imaging unit 50 is provided near the processing unit 30 on one side (+Y direction side). The imaging unit 50 is supported by the Z-axis moving table 40 and moves integrally with one processing unit 30. That is, the imaging unit 50 moves in the Y-axis direction by the Y-axis moving unit 34 and moves in the Z-axis direction by the Z-axis moving unit 35.

[0046] The imaging unit 50 includes an imaging optical system and an image sensor, and can image a predetermined range below the processing unit 30. The image signal captured by the imaging unit 50 is sent to the control unit 100. The image processing unit 101 of the control unit 100 processes the image signal sent from the imaging unit 50 to generate image data. The control unit 100 controls the operation of the processing apparatus 10 by referring to the image information in the image data.

[0047] For example, when cutting the workpiece 11, the imaging unit 50 is used to image the workpiece 11 on the processing table 22, and based on a predetermined pattern on the workpiece 11, the control unit 100 adjusts the relative positional relationship between the workpiece 11 and the processing unit 30 to set the cutting position on the division planned line by the cutting blade 32.

[0048] Also, the control unit 100 can image the workpiece 11 after cutting using the imaging unit 50 to obtain information on the processing groove formed in the workpiece 11. Specifically, the workpiece 11 is imaged by the imaging unit 50 to obtain information such as the width of the processing groove, the shape of the edge of the processing groove, and the position of the processing groove relative to the division planned line.

[0049] As shown in FIGS. 1 and 2, the processing apparatus 10 includes a first inspection table 60 and a second inspection table 70, in addition to the processing table 22. The first inspection table 60 and the second inspection table 70 are examples of holding tables.

[0050] The first inspection table 60 is used to hold inspection pieces Pa and a dresser board (not shown). The second inspection table 70 is used to hold inspection piece Pb. The dresser board is used for the purpose of cutting into the cutting blade 32 to eliminate clogging and uneven wear when the cutting blade 32 becomes clogged or unevenly worn. The inspection pieces Pa and Pb are used to inspect the cutting blade 32. Specifically, the inspection pieces Pa and Pb are subjected to cutting by the cutting blade 32, the machining marks (machining grooves) are imaged by the imaging unit 50, and the control unit 100 determines the state of the cutting blade 32 based on the captured image.

[0051] The inspection piece Pa held on the first inspection table 60 and the inspection piece Pb held on the second inspection table 70 are examples of workpieces. The inspection piece Pa and the inspection piece Pb may be of the same material or different materials. Also, the material of the workpiece 11 and the materials of the inspection pieces Pa and Pb may be the same or different. As the materials of the inspection pieces Pa and Pb, for example, silicon, synthetic resin, carbon, etc. can be applied.

[0052] The first inspection table 60 and the second inspection table 70 are provided on the table cover 27 and are arranged side by side with the processing table 22 in the X-axis direction. The first inspection table 60 is located adjacent to the processing table 22 on the +X direction side, and the second inspection table 70 is located adjacent to the first inspection table 60 on the +X direction side.

[0053] Note that the first inspection table 60 and the second inspection table 70 do not necessarily have to be installed adjacent to the processing table 22. It is sufficient if the workpiece 11 held on the processing table 22 and the inspection pieces Pa and Pb held on the first inspection table 60 and the second inspection table 70 are installed within the range where they can be processed by the processing unit 30. For example, one of the first inspection table 60 and the second inspection table 70 may be arranged on the +X direction side of the processing table 22, and the other of the first inspection table 60 and the second inspection table 70 may be arranged on the -X direction side of the processing table 22. Alternatively, the first inspection table 60 or the second inspection table 70 may be arranged at a position on the +Y direction side or the -Y direction side of the processing table 22.

[0054] Also, the first inspection table 60 and the second inspection table 70 may be configured independently of the processing table 22, or may be configured by connecting to the processing table 22.

[0055] Subsequently, mainly referring to FIGS. 3 to 7, a first embodiment applied to a processing method of the inspection piece Pa, which is an object to be processed held on the first inspection table 60, will be described.

[0056] The first inspection table 60 has an inspection holding surface 62 on the upper part of a pedestal 61 provided on a table cover 27. The inspection holding surface 62 is formed in a rectangular shape, with its longitudinal direction in the Y-axis direction and its short side direction in the X-axis direction. The inspection holding surface 62 is made of, for example, a metal material.

[0057] On the inspection holding surface 62, a suction groove connected to a suction source 63 is formed. The first inspection table 60 operates the suction source 63 to apply a suction force onto the inspection holding surface 62, thereby suction-holding the inspection piece Pa placed on the inspection holding surface 62. Note that the suction source 28 that suctions the processing holding surface 23 of the processing table 22 and the suction source 63 that suctions the inspection holding surface 62 of the first inspection table 60 may be a common suction source.

[0058] The processing method of the first embodiment is applied to an inspection process in which a machining groove Qa is formed in an inspection piece Pa by a cutting blade 32 of a machining unit 30, information regarding the machining groove Qa is acquired, and the outer diameter size of the cutting blade 32 is detected. As shown in FIGS. 5 and 6, the machining groove Qa is a bottomed groove-shaped machining mark having both ends in the X-axis direction and not penetrating the inspection piece Pa in the X-axis direction and the Z-axis direction.

[0059] As shown in FIG. 7, the cutting blade 32 is cut into the inspection piece Pa to a predetermined depth to form a machining groove Qa having both ends in the X-axis direction. The length D of the machining groove Qa in the X-axis direction, the height Zh in the Z-axis direction from the upper surface of the inspection piece Pa to the central axis C (axis of the spindle 31) of the cutting blade 32, and the radius r of the cutting blade 32 satisfy the relationship r2 = (Zh)2 + (D / 2)2 according to the Pythagorean theorem. Therefore, the outer diameter of the cutting blade 32 can be detected based on the length D of the machining groove Qa and the height Zh of the central axis C of the cutting blade 32.

[0060] As shown in FIG. 1, the control unit 100 includes, as functional blocks, a machining groove measurement unit 102, a blade outer diameter calculation unit 103, a blade outer diameter determination unit 104, and a region detection unit 105. The respective functions of the machining groove measurement unit 102, the blade outer diameter calculation unit 103, the blade outer diameter determination unit 104, and the region detection unit 105 are realized by the arithmetic processing unit executing a computer program stored in the storage device.

[0061] The machining groove measurement unit 102 causes the imaging unit 50 to image the inspection piece Pa in which the machining groove Qa is formed from above, and measures the length of the machining groove Qa in the X-axis direction from the captured image. Specifically, the actual length of the machining groove Qa is calculated based on the magnification of the image captured by the imaging unit 50 and the length of the machining groove Qa in the image.

[0062] The blade outer diameter calculation unit 103 calculates the outer diameter of the cutting blade 32 according to the above formula from the length of the machining groove Qa measured by the machining groove measurement unit 102 and the height Zh of the central axis C of the cutting blade 32. The height Zh of the central axis C of the cutting blade 32 can be obtained based on information such as the descending amount (motor driving amount) of the machining unit 30 instructed by the control unit 100 to the Z-axis movement unit 35 when the cutting blade 32 is cut into the inspection piece Pa to form the machining groove Qa. Alternatively, a sensor for detecting the height position of the machining unit 30 in the Z-axis direction may be provided, and the height Zh of the central axis C of the cutting blade 32 when the machining groove Qa is formed may be detected using the sensor.

[0063] The blade outer diameter determination unit 104 compares the outer diameter of the cutting blade 32 calculated by the blade outer diameter calculation unit 103 with the specified outer diameter (outer diameter threshold) of the cutting blade 32 registered in advance, and determines whether the cutting blade 32 has an appropriate outer diameter. When the outer diameter of the cutting blade 32 calculated by the blade outer diameter calculation unit 103 is below the threshold value, the blade outer diameter determination unit 104 determines that the cutting blade 32 needs to be replaced due to wear or the like. When such a replacement determination is made, the blade outer diameter determination unit 104 causes the notification unit 80 provided in the processing apparatus 10 to execute notification of the content that the cutting blade 32 needs to be replaced.

[0064] By the way, when performing an inspection based on the information of the machining groove Qa on the inspection piece Pa as described above, the image of the inspection piece Pa captured by the imaging unit 50 needs to be appropriate. For example, in the inspection piece Pa, if foreign matter or air bubbles are mixed in, or chipping or chipping occurs, these defective elements may cause the shape and length of the machining groove Qa to not be accurately recognized from the image of the inspection piece Pa, and there is a risk that the inspection cannot be performed with high accuracy. That is, the defective elements of the inspection piece Pa are elements that adversely affect the acquisition of information regarding the machining groove Qa. In particular, if there are defective elements at positions overlapping the machining groove Qa on the upper surface of the inspection piece Pa that is the imaging target, the shape and length of the machining groove Qa are likely to be misdetected.

[0065] As a countermeasure against such problems, in the processing method of the present embodiment, defective elements on the test piece Pa are detected in advance, and the processing groove Qa is formed in a region of the test piece Pa that is not affected by the defective elements. The details of this processing method will be described below.

[0066] [Holding step] In the holding step, as shown in FIG. 3, the test piece Pa is held on the inspection holding surface 62 of the first inspection table 60. The suction source 63 is operated to suck and hold the test piece Pa placed on the inspection holding surface 62.

[0067] [Detection step] Following the holding step, the detection step is performed. In the detection step, as shown in FIG. 3, the imaging unit 50 is positioned above the first inspection table 60 by moving the processing table 22 in the X-axis direction by the X-axis moving unit 25 and moving the imaging unit 50 in the Y-axis direction by the Y-axis moving unit 34. In this state, the upper surface of the test piece Pa faces the imaging unit 50. Then, the control unit 100 controls the imaging unit 50 to image the upper surface of the test piece Pa on the inspection holding surface 62.

[0068] At this stage, the test piece Pa has not been cut by the processing unit 30. Therefore, when there are no defective elements such as foreign matter contamination, air bubble contamination, chipping, and tipping on the upper surface of the test piece Pa, the image of the test piece Pa captured by the imaging unit 50 will have a generally uniform luminance. On the other hand, when there are defective elements such as foreign matter contamination, air bubble contamination, chipping, and tipping on the upper surface of the test piece Pa, the image of the captured test piece Pa will have a partially different luminance at the location of the defective element.

[0069] In the inspection piece Pa of the present embodiment, the luminance becomes equal to or less than a predetermined value at the location of a defective element. The region detection unit 105 of the control unit 100 performs binarization processing on the image of the imaged inspection piece Pa based on luminance, determines a region where the luminance exceeds the predetermined value as the first region Ea, and determines a region where the luminance is equal to or less than the predetermined value as the second region Eb. Since the luminance becomes equal to or less than the predetermined value at the location of the defective element, the first region Ea is a region determined to have no defective element, and the second region Eb is a region determined to have a defective element.

[0070] Note that depending on conditions such as the material of the inspection piece and the way light hits the inspection piece, the luminance may increase at the location of a defective element, contrary to the present embodiment, and the present invention is applicable even in such a case. In this case, the region detection unit 105 of the control unit 100 determines a region where the luminance is below the predetermined value as the first region Ea and a region where the luminance is equal to or greater than the predetermined value as the second region Eb in the image of the imaged inspection piece Pa. Since the luminance becomes equal to or greater than the predetermined value at the location of the defective element, the first region Ea is a region determined to have no defective element, and the second region Eb is a region determined to have a defective element.

[0071] FIG. 6(A) shows an example of the detection result in the detection step (the result of imaging the inspection piece Pa before processing and performing region determination). The first region Ea with relatively high luminance occupies most of the area, and the second region Eb with luminance equal to or less than the predetermined value is included in part. The control unit 100 stores the positions and ranges (coordinates on the image) of the first region Ea and the second region Eb detected in the detection step in the storage device.

[0072] [Processing Step] Following the detection step, a processing step of forming a processing groove Qa in the test piece Pa held on the first inspection table 60 is performed. In the processing step, as shown in FIG. 4, the cutting blade 32 is positioned above the first inspection table 60 by moving the processing table 22 in the X-axis direction by the X-axis moving unit 25 and moving the processing unit 30 in the Y-axis direction by the Y-axis moving unit 34. Then, the cutting blade 32 is rotationally driven, and the processing unit 30 is lowered by the Z-axis moving unit 35 to cut the cutting blade 32 into the test piece Pa to a predetermined depth, thereby forming the processing groove Qa.

[0073] The control unit 100 refers to the positions and ranges of the first region Ea and the second region Eb detected and stored in the previous detection step, and in the processing step, controls the operation of the processing unit 30 so as to form the processing groove Qa in the first region Ea without including the second region Eb.

[0074] [Information acquisition step] When the processing step is completed, proceed to the information acquisition step. The information acquisition step, together with the determination step to be performed next, constitutes a part of the inspection process described above. In the inspection process, the outer diameter of the cutting blade 32 is calculated based on the length of the processing groove Qa, and the outer diameter of the cutting blade 32 is inspected.

[0075] In the information acquisition step, under the control of the control unit 100, as shown in FIG. 5, the imaging unit 50 is positioned above the first inspection table 60 again to image the test piece Pa. Then, the processing groove measurement unit 102 of the control unit 100 calculates the length of the processing groove Qa from the captured image. Subsequently, the blade outer diameter calculation unit 103 of the control unit 100 calculates the outer diameter of the cutting blade 32 with reference to the length information of the processing groove Qa.

[0076] [Determination step] Following the information acquisition step, a determination step is performed. In the determination step, the blade outer diameter determination unit 104 of the control unit 100 determines whether the outer diameter of the cutting blade 32 is an appropriate value. That is, it is determined whether the outer diameter of the cutting blade 32 is not less than a predetermined threshold value.

[0077] (B) of FIG. 6 shows the result of imaging the inspected piece Pa after processing in which the processing groove Qa is formed. In the previous processing step, the processing groove Qa is formed in the first region Ea without including the second region Eb. Specifically, a plurality of processing grooves Qa are formed on the inspected piece Pa at intervals in the Y-axis direction. In the portion including the second region Eb, the processing groove Qa is not formed, and the second region Eb is skipped in the Y-axis direction, and the next processing groove Qa is formed at a position that does not overlap the second region Eb.

[0078] The virtual processing groove Qa' indicated by the broken line in (B) of FIG. 6 is a portion where no processing groove is actually formed. Since the second region Eb overlaps near the end of the virtual processing groove Qa', if a processing groove is actually formed at the position of the virtual processing groove Qa', when the inspected piece Pa is imaged in the information acquisition step, the second region Eb may be erroneously determined to be included in the shape of the processing groove. As a result, the shape of the processing groove (particularly, the position near the end in the X-axis direction where the second region Eb overlaps) cannot be accurately recognized, the outer diameter of the cutting blade 32 cannot be correctly detected, and the detection accuracy deteriorates.

[0079] On the other hand, in the processing method of the present embodiment, before processing, the first region Ea where the processing groove Qa is easy to detect and the second region Eb where the processing groove Qa is difficult to detect are detected, and the processing groove Qa is formed in the first region Ea. Therefore, defective elements such as foreign matter contamination, air bubble contamination, chipping, and tipping do not affect the recognition of the processing groove Qa, and the processing groove Qa can be accurately recognized. Therefore, based on the information of the processing groove Qa acquired in the information acquisition step, the outer diameter of the cutting blade 32 can be detected with high accuracy.

[0080] In addition, when the object for which information is acquired in the information acquisition step is an outer contour line (outline) such as the end shape in the X-axis direction or the end shape in the Y-axis direction of the machining groove Qa, if defective elements such as foreign matter inclusion, air bubble inclusion, chipping, and tipping in the inspection piece Pa are completely within the inner region (within the contour range) of each machining groove Qa, it may not have an adverse effect on the recognition of the machining groove Qa during inspection. Therefore, when the luminance region corresponding to the second region Eb is within the inner region (within the contour range) of the machining groove Qa, exceptionally, a machining groove Qa may be formed at a position overlapping the region (the luminance region corresponding to the second region Eb) in the machining step. In other words, if the machining groove Qa completely encloses the second region Eb, it may be selected to be formed in the machining step.

[0081] Conversely, for a machining groove like the virtual machining groove Qa' shown in FIG. 6(B) where the second region Eb overlaps its outer contour line, it is desirable not to form it in the machining step. Therefore, forming the machining groove Qa in the first region Ea in the machining step at least means forming the machining groove Qa so that the outer contour line of the machining groove Qa does not overlap the second region Eb.

[0082] In the above description, information regarding the machining groove Qa is acquired to calculate and determine the outer diameter of the cutting blade 32. However, since the machining groove Qa is a trace of machining near the tip of the cutting blade 32, in the determination step, it is also possible to determine the quality of the shape such as the presence or absence of uneven wear at the tip of the cutting blade 32 based on the acquired shape information of the machining groove Qa. In this case, the control unit 100 includes, as functional blocks, a normal image storage unit 106 (FIG. 1) and a blade shape determination unit 107 (FIG. 1).

[0083] The normal image storage unit 106 stores a normal image obtained by imaging, with the imaging unit 50 from above the inspection piece Pa, the machining groove Qa formed on the inspection piece Pa by a normal cutting blade 32, that is, an image of the normal shape of the machining groove Qa in a top view. The function of the normal image storage unit 106 is realized by the storage device of the control unit 100.

[0084] Based on the captured image captured by the imaging unit 50, the blade shape determination unit 107 determines whether the shape of the machining groove Qa formed in the test piece Pa is normal. The blade shape determination unit 107 compares the shape of the machining groove Qa imaged by the imaging unit 50 in the information acquisition step with the normal shape of the machining groove Qa stored in the normal image storage unit 106, and determines the degree of coincidence between them. When the degree of coincidence of the shapes is equal to or less than a predetermined value, the blade shape determination unit 107 determines that the cutting blade 32 does not satisfy the required shape requirements (specifications) and that a required countermeasure is necessary.

[0085] As a result of the determination by the blade shape determination unit 107, when a predetermined amount or more of uneven wear has occurred at the tip of the cutting blade 32, it is also possible to perform a countermeasure of correcting the tip shape by dressing the cutting blade 32 instead of replacing the cutting blade 32. In this case, the control unit 100 performs a process of causing the notification unit 80 to notify the content recommending dressing of the cutting blade 32 or automatically performing dressing of the cutting blade 32.

[0086] When performing the determination of the blade shape using the normal image storage unit 106 and the blade shape determination unit 107 as described above, the above detection step is performed before the machining step, and the region detection unit 105 detects the first region Ea and the second region Eb of the test piece Pa. Then, in the machining step, the control unit 100 controls the operation of the machining apparatus 10 so as to form the machining groove Qa in the first region Ea. Thereby, defective elements such as foreign matter contamination, air bubble contamination, chipping, and tipping do not affect the recognition of the machining groove Qa, the machining groove Qa can be accurately recognized, and based on the information of the machining groove Qa acquired in the information acquisition step, the shape of the tip portion of the cutting blade 32 can be detected and determined with high accuracy.

[0087] Subsequently, mainly referring to FIGS. 8 to 11, a second embodiment applied to the processing method of the test piece Pb which is a processing object held on the second inspection table 70 will be described.

[0088] The second inspection table 70 has a movable holding part 73 that is rotatably supported by a rotating drive part 72 with respect to a pedestal 71 provided on a table cover 27. The rotating drive part 72 supports the movable holding part 73 so as to perform a rotating operation around an axis extending in the Y-axis direction, and rotates the movable holding part 73 with the driving force of a rotating drive source 74 such as a motor or an air cylinder. The movable holding part 73 has an inspection holding surface 75, and the rotating drive part 72 rotates the movable holding part 73 along a rotation axis parallel to the inspection holding surface 75.

[0089] The inspection holding surface 75 is formed in a rectangular shape and has its longitudinal direction oriented in the Y-axis direction. The short side direction of the inspection holding surface 75 varies depending on the position of the movable holding part 73. At a processing position (Fig. 9) described later, the short side direction of the inspection holding surface 75 faces the X-axis direction, and at an imaging position (Figs. 8 and 10) described later, the short side direction of the inspection holding surface 75 faces the Z-axis direction. The inspection holding surface 75 is constituted by, for example, a metal material.

[0090] On the inspection holding surface 75, a suction groove connected to a suction source 76 is formed. The second inspection table 70 operates the suction source 76 to apply a suction force onto the inspection holding surface 75, thereby suction-holding an inspection piece Pb placed on the inspection holding surface 75. Note that the suction source 28 that suctions the processing holding surface 23 of the processing table 22 and the suction source 76 that suctions the inspection holding surface 75 of the second inspection table 70 may be a common suction source. Also, the suction source 63 that suctions the inspection holding surface 62 of the first inspection table 60 and the suction source 76 that suctions the inspection holding surface 75 of the second inspection table 70 may be a common suction source.

[0091] With the inspection piece Pb held on the inspection holding surface 75, the surface of the inspection piece Pb that is in contact with and held by the inspection holding surface 75 is defined as the back surface, and the surface of the inspection piece Pb that faces the side opposite to the inspection holding surface 75 is defined as the front surface. Also, in the inspection piece Pb, the surface that connects the front surface and the back surface is defined as the side surface. The inspection piece Pb is a plate-shaped member that is substantially rectangular in plan view and has four side surfaces.

[0092] The movable holding part 73 rotates approximately 90 degrees by the rotational drive part 72, and is positioned at a machining position (Fig. 9) where the inspection holding surface 75 extends in a substantially horizontal direction and faces upward (+Z direction), and an imaging position (Figs. 8 and 10) where the inspection holding surface 75 extends in a substantially vertical direction and faces in the lateral direction (+X direction). In either case where the movable holding part 73 is positioned at the machining position or the imaging position, the inspection piece Pb can be held without being dropped from the inspection holding surface 75 by applying a suction force to the inspection holding surface 75.

[0093] The machining position of the movable holding part 73 is a position where the machining unit 30 is opposed above the inspection piece Pb held on the inspection holding surface 75, and the inspection piece Pb on the inspection holding surface 75 can be machined by the machining unit 30. At the machining position of the movable holding part 73, the inspection holding surface 75 is oriented parallel to the machining holding surface 23 of the machining table 22.

[0094] The imaging position of the movable holding part 73 is a position where the imaging unit 50 is opposed above the inspection piece Pb held on the inspection holding surface 75, and the inspection piece Pb on the inspection holding surface 75 can be imaged by the imaging unit 50. At the imaging position of the movable holding part 73, the inspection holding surface 75 is oriented substantially perpendicular to the machining holding surface 23 of the machining table 22, and is a position where the side surface (end surface) of the inspection piece Pb can be imaged by the imaging unit 50.

[0095] The machining method of the second embodiment is applied to an inspection process for forming a machining groove Qb in the inspection piece Pb by the cutting blade 32 of the machining unit 30, acquiring information regarding the machining groove Qb, and detecting the shape of the cutting blade 32. The machining groove Qb is a groove-shaped machining mark that communicates from one end to the other end in the short side direction (X-axis direction when the movable holding part 73 is at the machining position) of the rectangular inspection piece Pb, and is a bottomed groove (half-cut groove) that does not penetrate in the thickness direction of the inspection piece Pb.

[0096] In the inspection process, the movable holding part 73 is positioned at the machining position, and after forming the machining groove Qb in the inspection piece Pb with the cutting blade 32 of the machining unit 30, the movable holding part 73 is rotated to the imaging position, and one end (the end on the machining start side or the end on the machining end side) of the machining groove Qb appearing on the side surface of the inspection piece Pb is imaged by the imaging unit 50. The end on the machining start side in the machining groove Qb is the end on the side where the cutting blade 32 first cuts in, and the end on the machining end side in the machining groove Qb is the end on the cutting-out side of the cutting blade 32. The shape of the end of the machining groove Qb appearing on the side surface of the inspection piece Pb corresponds to the cross-sectional shape of the machining groove Qb perpendicular to the machining feed direction during the cutting process by the cutting blade 32.

[0097] As shown in FIG. 1, the control unit 100 includes, as functional blocks, a normal image storage unit 106, a blade shape determination unit 107, and a region detection unit 108. The function of the normal image storage unit 106 is realized by the storage device of the control unit 100. The functions of the blade shape determination unit 107 and the region detection unit 108 are realized by the arithmetic processing unit executing the computer programs stored in the storage device. For the sake of convenience in explanation, in the control unit 100 of FIG. 1, the region detection unit 105 used in the first embodiment and the region detection unit 108 used in the second embodiment are separately described, but it is also possible to make them function as a common region detection unit.

[0098] The normal image storage unit 106 stores a normal image obtained by imaging, with the imaging unit 50 from the side surface of the inspection piece Pb, the machining groove Qb formed by cutting the inspection piece Pb from one end to the other end with a normal cutting blade 32, that is, an image of the normal shape of the cross-section of the machining groove Qb.

[0099] Based on the captured image captured by the imaging unit 50, the blade shape determination unit 107 determines whether the shape of the machining groove Qb formed in the test piece Pb is normal. The blade shape determination unit 107 compares the shape of the cross section of the machining groove Qb imaged by the imaging unit 50 in the inspection process with the normal shape of the cross section of the machining groove Qb stored in the normal image storage unit 106, and determines the degree of coincidence between them. When the degree of coincidence of the shapes is below a predetermined value, the blade shape determination unit 107 determines that the cutting blade 32 does not meet the required shape requirements (specifications) and that the required countermeasures are necessary.

[0100] The state where the cutting blade 32 does not meet the required shape requirements is caused by various reasons, and the shape of the cross section of the machining groove Qb changes according to the reasons. For example, when the tip portion of the cutting blade 32 is unevenly worn, the shape of the bottom of the machining groove Qb becomes uneven, and when the tip portion of the cutting blade 32 is evenly worn, the bottom of the machining groove Qb becomes flat. Also, if there are irregularities on the side surface of the cutting blade 32 or if there is an axial runout during the rotation of the cutting blade 32, the side surface of the machining groove Qb becomes inclined or has irregularities, or the groove width of the machining groove Qb becomes excessive compared to the width of the cutting blade 32.

[0101] Therefore, by comparing the shape of the cross section of the machining groove Qb imaged by the imaging unit 50 with the normal shape of the cross section of the machining groove Qb, it is possible to determine whether there is an abnormality in the shape of the machining groove Qb due to the above various reasons. Specifically, it is possible to determine the quality (pass / fail) regarding the blade width of the cutting blade 32, the shape of the tip (outer edge) of the cutting blade 32, the outer diameter of the cutting blade 32, the rotational operation of the cutting blade 32, etc., based on the cross-sectional shape of the imaged machining groove Qb.

[0102] As a result of the determination, when there is uneven wear of a predetermined amount or more at the tip of the cutting blade 32, it is possible to take measures to correct the tip shape by dressing the cutting blade 32. In this case, the control unit 100 performs a process of causing the notification unit 80 to notify the content recommending dressing of the cutting blade 32 or automatically performing dressing of the cutting blade 32.

[0103] Alternatively, when the state of the cutting blade 32 cannot be dealt with by dressing or the like, the control unit 100 may determine that it is necessary to replace the cutting blade 32. When such a replacement determination is made, the control unit 100 causes the notification unit 80 provided in the processing apparatus 10 to execute notification of the necessity of replacing the cutting blade 32.

[0104] When performing an inspection based on the information of the processing groove Qb on the inspection piece Pb as described above, if there are defective elements such as foreign matter contamination, air bubble contamination, chipping, and tipping in the inspection piece Pb, it becomes impossible to accurately recognize the shape of the cross section of the processing groove Qb from the image obtained by imaging the inspection piece Pb, and there is a risk that an inspection with high accuracy cannot be performed. That is, the defective element of the inspection piece Pb is an element that adversely affects the acquisition of information regarding the processing groove Qb. In particular, if there is a defective element at a position overlapping the processing groove Qb on the side surface of the inspection piece Pb that is the imaging target, the shape of the processing groove Qb is likely to be misdetected.

[0105] As a countermeasure against such problems, in the processing method of the present embodiment, defective elements on the inspection piece Pb are detected in advance, and the processing groove Qb is formed in a region of the inspection piece Pb that is not affected by the defective elements. The details of this processing method will be described below.

[0106] [Holding Step] In the holding step, the inspection piece Pb is held on the inspection holding surface 75 of the second inspection table 70. The suction source 76 is operated to suck and hold the inspection piece Pb placed on the inspection holding surface 75.

[0107] In the holding step, it is preferable to place the inspection piece Pb on the inspection holding surface 75 with the movable holding portion 73 positioned at the processing position (FIG. 9) and the inspection holding surface 75 facing upward. After the inspection piece Pb is sucked and held on the inspection holding surface 75, as shown in FIG. 8, the movable holding portion 73 is rotated from the processing position to the imaging position by the rotation drive unit 72 so that one side surface of the inspection piece Pb faces upward (+Z direction).

[0108] As a different form of the holding step, the movable holding portion 73 may be positioned at the imaging position (FIG. 8) from the beginning, and with a suction force acting on the inspection holding surface 75, the inspection piece Pb may be brought close to the inspection holding surface 75 from the side in the X-axis direction, and the inspection piece Pb may be sucked and held on the inspection holding surface 75.

[0109] [Detection Step] Following the holding step, a detection step is performed. The detection step is carried out with the movable holding portion 73 (inspection holding surface 75) of the second inspection table 70 at the imaging position. In the detection step, as shown in FIG. 8, the imaging unit 50 is positioned above the second inspection table 70 by moving the processing table 22 in the X-axis direction by the X-axis moving unit 25 and moving the imaging unit 50 in the Y-axis direction by the Y-axis moving unit 34. In this state, the side surface of the inspection piece Pb faces the imaging unit 50. Then, the control unit 100 controls the imaging unit 50 to image the side surface of the inspection piece Pb on the inspection holding surface 75.

[0110] At this stage, the inspection piece Pb has not been cut by the processing unit 30. Therefore, when there are no defective elements such as foreign matter inclusion, air bubble inclusion, chipping, and tipping on the side surface of the inspection piece Pb, the image of the inspection piece Pb captured by the imaging unit 50 will have a generally uniform luminance. On the other hand, when there are defective elements such as foreign matter inclusion, air bubble inclusion, chipping, and tipping on the side surface of the inspection piece Pb, the image of the captured inspection piece Pb will have a partially different luminance at the location of the defective element.

[0111] In the inspection piece Pb of this embodiment, the luminance becomes below a predetermined value at the location of the defective element. The region detection unit 108 of the control unit 100 binarizes the image of the captured inspection piece Pb, determines the region where the luminance exceeds the predetermined value as the first region Fa, and determines the region where the luminance is below the predetermined value as the second region Fb. Since the luminance becomes below the predetermined value at the location of the defective element, the first region Fa is the region determined to have no defective element, and the second region Fb is the region determined to have a defective element.

[0112] Note that depending on conditions such as the material of the test piece and the way light hits the test piece, the brightness may increase at the location of the defective element, contrary to this embodiment. Even in such a case, the present invention is applicable. In this case, the area detection unit 108 of the control unit 100 determines, in the image of the captured test piece Pb, an area where the brightness is below a predetermined value as the first area Fa, and an area where the brightness is equal to or greater than the predetermined value as the second area Fb. Since the brightness becomes equal to or greater than the predetermined value at the location of the defective element, the first area Fa is an area determined to have no defective element, and the second area Fb is an area determined to have a defective element.

[0113] (A) of FIG. 11 shows an example of the detection result in the detection step (the result of imaging the test piece Pb before processing and performing area determination). The first area Fa with relatively high brightness occupies most of the area, and the second area Fb with brightness below the predetermined value is partially included. The control unit 100 stores the positions and ranges of the first area Fa and the second area Fb detected in the detection step in the storage device.

[0114] [Processing Step] Following the detection step, a processing step of forming a processing groove Qb in the test piece Pa held on the second inspection table 70 is performed. In the processing step, as shown in FIG. 9, the movable holding unit 73 is rotated from the imaging position to the processing position by the rotation drive unit 72, and the inspection holding surface 75 is turned upward. As a result, the surface of the test piece Pb faces upward (+Z direction).

[0115] By moving the machining table 22 in the X-axis direction by the X-axis moving unit 25 and moving the machining unit 30 in the Y-axis direction by the Y-axis moving unit 34, as shown in FIG. 9, the cutting blade 32 is positioned above the second inspection table 70. Then, the cutting blade 32 is rotationally driven, and the machining unit 30 is lowered by the Z-axis moving unit 35 to cut the cutting blade 32 into the inspection piece Pb to a predetermined depth. Further, by moving the machining table 22 in the X-axis direction (machining feed) by the X-axis moving unit 25, a machining groove Qb extending in the short side direction of the inspection piece Pb is formed. The machining groove Qb is formed to communicate from one side surface in the short side direction of the inspection piece Pb to the other side surface, and the shape of the cross section of the machining groove Qb appears on the side surface of the inspection piece Pb.

[0116] The control unit 100 refers to the positions and ranges of the first region Fa and the second region Fb detected and stored in the previous detection step, and in the machining step, controls the operation of the machining unit 30 so as to form the machining groove Qb in the first region Fa without including the second region Fb.

[0117] [Information acquisition step] When the machining step is completed, proceed to the information acquisition step. The information acquisition step, together with the determination step to be performed next, constitutes a part of the inspection process described above. In the inspection process, the state of the cutting blade 32 is inspected based on the shape of the machining groove Qb formed in the machining step.

[0118] In the information acquisition step, as shown in FIG. 10, the movable holding part 73 is rotated from the machining position to the imaging position by the rotation driving part 72 to turn the inspection holding surface 75 sideways. As a result, the side surface of the inspection piece Pb faces upward (+Z direction). Then, as shown in FIG. 10, the control unit 100 positions the imaging unit 50 above the second inspection table 70 again to image the inspection piece Pb and acquires the information of the machining groove Qb included in the captured image.

[0119] [Determination step] Following the information acquisition step, a determination step is performed. In the determination step, the blade shape determination unit 107 of the control unit 100 compares the shape of the cross section of the machining groove Qb included in the captured image with the normal shape of the cross section of the machining groove Qb stored in the normal image storage unit 106 to determine whether the cutting blade 32 meets the predetermined shape requirements. If it is determined that the cutting blade 32 does not meet the predetermined shape requirements, the control unit 100 performs notification using the notification unit 80 (recommendation for dressing or replacement of the cutting blade 32) according to the details of the determination, or a process of automatically dressing the cutting blade 32.

[0120] (B) of FIG. 11 shows the result of imaging the inspected piece Pb after machining in which the machining groove Qb is formed. In the previous machining step, the machining groove Qb is formed in the first region Fa without including the second region Fb. Specifically, a plurality of machining grooves Qb are formed on the inspected piece Pb at intervals in the Y-axis direction, and the machining groove Qb is not formed at the location including the second region Fb, and the second region Fb is skipped in the Y-axis direction, and the next machining groove Qb is formed at a position that does not overlap the second region Fb.

[0121] The virtual machining groove Qb' indicated by the dashed line in (B) of FIG. 11 is a portion where no machining groove is actually formed. Since the second region Fb overlaps the side surface portion of the virtual machining groove Qb', if a machining groove is actually formed at the position of the virtual machining groove Qb', when the inspected piece Pb is imaged in the information acquisition step, the second region Fb may be erroneously determined to be included in the shape of the machining groove. As a result, the shape of the machining groove (especially the shape of the side surface of the machining groove where the second region Fb overlaps) cannot be accurately recognized, the shape of the cutting blade 32 cannot be correctly detected, and the detection accuracy deteriorates.

[0122] In contrast, in the processing method of the present embodiment, before processing, a first region Fa where the processing groove Qb is easy to detect and a second region Fb where the processing groove Qb is difficult to detect are detected, and the processing groove Qb is formed in the first region Fa. Therefore, defective elements such as foreign matter inclusion, air bubble inclusion, chipping, and tipping do not affect the recognition of the processing groove Qb, and the processing groove Qb can be accurately recognized. Accordingly, based on the information of the processing groove Qb obtained in the information acquisition step, it becomes possible to detect the shape of the cutting blade 32 with high accuracy.

[0123] In addition, when the object for which information is acquired in the information acquisition step is an outer contour line (outline) such as the shape of the side surfaces on both sides of the processing groove Qb and the shape of the bottom of the groove, if defective elements such as foreign matter inclusion, air bubble inclusion, chipping, and tipping in the inspection piece Pb are completely within the inner region (within the contour range) of each processing groove Qb, it may not have an adverse effect on the recognition of the processing groove Qb during inspection. Therefore, when the region with the luminance corresponding to the second region Fb is within the inner region (within the contour range) of the processing groove Qb, exceptionally, the processing groove Qb may be formed at a position overlapping the region (the region with the luminance corresponding to the second region Fb) in the processing step. In other words, if the processing groove Qb completely encloses the second region Fb, it may be selected to be formed in the processing step.

[0124] Conversely, for a processing groove like the virtual processing groove Qb' shown in FIG. 11(B) where the second region Fb overlaps the outer contour line, it is desirable not to form it in the processing step. Therefore, forming the processing groove Qb in the first region Fa in the processing step at least means forming the processing groove Qb so that the outer contour line of the processing groove Qb does not overlap the second region Fb.

[0125] In the above-described second embodiment, information on the cross-sectional shape of the processing groove Qb on one side surface in the short side direction of the test piece Pb is acquired. However, information on the cross-sectional shapes of the processing grooves Qb on both side surfaces in the short side direction of the test piece Pb may be acquired. That is, the shapes of both the end portion on the processing start side and the end portion on the processing end side in the processing groove Qb may be acquired. In this case, the movable holding portion 73 of the second inspection table 70 may be configured to be rotatable to both sides from the processing position (FIG. 9), and the first imaging position where one side surface in the short side direction of the test piece Pb faces upward and the second imaging position where the other side surface in the short side direction of the test piece Pb faces upward may be selectable.

[0126] Depending on the material and processing method of the test piece Pb, there are cases where processing defects such as burrs, cracks, and chipping are likely to occur at the end portion on the processing start side and cases where they are likely to occur at the end portion on the processing end side. Therefore, by acquiring information on the cross-sectional shapes (shapes of both end portions of the processing groove Qb) of the processing grooves Qb on both side surfaces of the test piece Pb, the accuracy of the acquired information can be improved.

[0127] In the above-described processing apparatus 10, the processing method according to the present invention is applied to the processing of each of the test piece Pa and the test piece Pb held by the first inspection table 60 and the second inspection table 70. However, the processing method according to the present invention may be applied only to the test piece held by one inspection table. For example, regarding the first inspection table 60, it may be used only for holding the dresser board and not for holding the test piece. Further, the processing apparatus 10 may include only one of the first inspection table 60 and the second inspection table 70.

[0128] In each of the above embodiments, in the detection step, for the image obtained by imaging the test piece, binarization processing based on a predetermined value of luminance is performed to distinguish the first region and the second region. Detection by such binarization processing has the advantage that the burden of image processing and image determination in the control unit 100 is small, and high-speed processing and determination can be performed without using a high-performance computer. However, different from each of the above embodiments, it is also possible to process the luminance of the image obtained by imaging the test piece with multiple gradations of three gradations or more, and distinguish the first region and the second region from among the multiple gradations of luminance.

[0129] In each of the above embodiments, FIG. 6 shows an image obtained by imaging the entire surface of the test piece Pa, and FIG. 11 shows an image obtained by imaging the entire one side surface of the test piece Pb. However, when acquiring information regarding the processing groove, an image obtained by magnifying only a part of the test piece may be acquired.

[0130] Further, it is sufficient that at least one processing groove is included in the imaging image referred to in the information acquisition step, and it is not essential to image a plurality of processing grooves simultaneously. For example, the plurality of processing grooves Qa shown in FIG. 6(B) and the plurality of processing grooves Qb shown in FIG. 11(B) are traces of performing a plurality of processing steps on the respective test pieces Pa and test pieces Pb. In each inspection, in the processing step, it is sufficient to form at least one processing groove Qa (the latest processing groove Qa) or at least one processing groove Qb (the latest processing groove Qb).

[0131] When performing the processing step a plurality of times, before each processing step, the detection step may be performed each time for the vicinity of the portion to be processed in that processing step. In this case, in the detection step, only a narrow area including at least one processing groove is imaged.

[0132] Alternatively, when performing the processing step multiple times, in the detection step, the entire object to be processed is detected collectively, and the positions and ranges (coordinates on the image) of the first region and the second region in the entire object to be processed are comprehensively memorized. Then, the coordinate information of each memorized region is read out in each processing step, and a processing groove may be formed while avoiding the second region.

[0133] In each of the above embodiments, the first inspection table 60 and the second inspection table 70 have a structure for holding the inspection piece Pa or the inspection piece Pb by suction, but may have a structure for holding the inspection piece Pa or the inspection piece Pb by clamping or the like by a clamp portion.

[0134] Each of the above embodiments applies the first inspection table 60 and the second inspection table 70 as holding tables, and applies the inspection piece Pa and the inspection piece Pb as objects to be processed. As a modification different from each of the above embodiments, it is also possible to apply the processing table 22 as a holding table and apply the workpiece 11 as an object to be processed, and implement the processing method of the object to be processed according to the present invention.

[0135] In this modification, before performing a processing step of forming a processing groove along the division planned line on the workpiece 11 using the cutting blade 32 of the processing unit 30, a detection step is performed. In the detection step, the upper surface of the workpiece 11 is imaged by the imaging unit 50, and the region detection unit of the control unit 100 detects the first region and the second region based on the luminance of the image of the imaged workpiece 11. For example, when the luminance of the captured image becomes equal to or lower than a predetermined value at a location where defective elements such as foreign matter contamination, air bubble contamination, chipping, and tipping exist on the upper surface of the workpiece 11, among the images of the workpiece 11, a region where the luminance exceeds the predetermined value is determined as the first region, and a region where the luminance is equal to or lower than the predetermined value is determined as the second region. These region determinations in the detection step have the same processing content as the region determinations performed on the inspection piece Pa and the inspection piece Pb in each of the above-described embodiments, and can be executed by the region detection unit 105 and the region detection unit 108 of the control unit 100.

[0136] The control unit 100 stores the positions and ranges (coordinates on the image) of the first region and the second region detected in the detection step in a storage device, and in the processing step, controls the operation of the processing unit 30 so as to form a processing groove in the first region of the workpiece 11 and not to form a processing groove in the second region. That is, at the location where the second region exists on the planned division line, control is performed so as not to form a processing groove.

[0137] When the processing step is completed, the control unit 100 performs an information acquisition step of causing the imaging unit 50 to image the upper surface of the processed workpiece 11 and acquiring information regarding the processing grooves formed in the workpiece 11.

[0138] As shown in FIG. 1, the control unit 100 includes a processing groove determination unit 109 as a functional block. The processing groove determination unit 109 performs a determination step of determining the quality of the shape and position of the processing groove based on the information of the processing grooves on the workpiece 11 acquired in the information acquisition step. In the previous detection step, a second region in which defective elements such as foreign matter contamination, air bubble contamination, chipping, and tipping are determined to exist is detected, and in the processing step, a processing groove is formed in the first region while avoiding the second region. As a result, the information of the processing grooves acquired by the imaging by the imaging unit 50 in the information acquisition step accurately reflects the shape and position of the processing grooves without being affected by the above-mentioned defective elements. As a result, the processing groove determination unit 109 can determine the quality of the processing grooves with high accuracy.

[0139] As can be seen from the above-described embodiments and modifications, the processing method of the present invention can be widely applied to applications such as inspecting the state of a processing tool such as a cutting blade 32 by processing a test piece Pa or a test piece Pb, and inspecting the state of processing grooves formed by processing a workpiece 11.

[0140] In the processing method of the present invention, the method of forming the processing groove is not limited to cutting processing as in each of the above embodiments and modifications. For example, it is also applicable when forming a processing groove by laser processing in which laser light is irradiated toward the object to be processed. That is, the processing apparatus may be a laser processing apparatus or the like instead of a cutting apparatus. Also in a laser processing apparatus, it is performed to check the quality of the processing groove formed in the workpiece, or to form a processing groove in a test piece to check the state of the laser processing unit. In the processing of these workpieces and test pieces, the processing method having the above characteristics is useful.

[0141] Note that the embodiments of the present invention are not limited to the above embodiments and modifications, and may be variously changed, replaced, and modified without departing from the spirit of the technical idea of the present invention. Furthermore, if the technical idea of the present invention can be realized in another way by technological progress or another derived technology, it may be implemented using that method. Therefore, the scope of the claims covers all embodiments that can be included within the scope of the technical idea of the present invention.

Industrial Applicability

[0142] As described above, according to the processing method of the present invention, by forming a processing groove in a region of the object to be processed where no defective element is determined to exist, it is possible to more accurately grasp the state of the processing groove, and improve the accuracy of determining the quality of the formed processing groove and the quality of the tool for forming the processing groove.

Explanation of Signs

[0143] 10: Processing apparatus 11: Workpiece (object to be processed) 15: Workpiece unit 20: Base 22: Processing table (holding table) 23: Processing holding surface 24: Clamping part 25: X-axis movement unit 26: Rotation drive unit 27: Table cover 30: Processing unit 31: Spindle 32: Cutting blade 34: Y-axis movement unit 35: Z-axis movement unit 45: Cleaning section 50: Imaging unit 60: First inspection table (holding table) 62: Inspection holding surface 70: Second inspection table (holding table) 72: Rotation drive section 73: Movable holding section 74: Rotation drive source 75: Inspection holding surface 100: Control unit 101: Image processing section 102: Machining groove measurement section 103: Blade outer diameter calculation section 104: Blade outer diameter determination section 105: Region detection section 106: Normal image memory section 107: Blade shape determination section 108: Region detection section 109: Machining groove determination section Ea: First region Eb: Second region Fa: First region Fb: Second region Pa: Test piece (object to be processed) Pb: Test piece (object to be processed) Qa: Machining groove Qb: Machining groove

Claims

1. a holding step of holding a workpiece on a holding table; a processing step of forming a processing groove in the workpiece held on the holding table; an information acquisition step of acquiring information regarding the processing groove from an image obtained by imaging the processing groove; comprising: before the processing step, a detection step of detecting, using an image obtained by imaging the workpiece, a first region determined to have no defective element and a second region determined to have a defective element; the processing step is characterized by forming the processing groove in the first region, a processing method for a workpiece.

2. The processing method for a workpiece according to claim 1, wherein the second region is a region where at least one of foreign matter contamination, air bubble contamination, chipping, and tipping is formed.

3. The processing method for a workpiece according to claim 1, wherein the holding table is at least one of a processing table having a processing holding surface for holding a workpiece to be processed and an inspection table adjacent to the processing table and having an inspection holding surface for holding an inspection piece.

4. The inspection table has a rotation drive unit that rotates the inspection holding surface along a rotation axis parallel to the inspection holding surface, the rotation drive unit rotates and moves between a processing position where the inspection holding surface faces a processing unit and an imaging position where a cross section of a processing groove formed in the inspection piece held on the inspection holding surface faces an imaging unit, the processing step is performed at the processing position, and the detection step and the information acquisition step are performed at the imaging position, a processing method for a workpiece according to claim 3.

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