Component mounting system

The component mounting system optimizes line selection using production stop impact indicators to minimize stoppages, improving efficiency by allocating appropriate lines based on historical data and actual values, thus enhancing productivity.

JP2025084486APending Publication Date: 2025-06-03YAMAHA MOTOR CO LTD
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Patent Information

Application Number
JP2023198429
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-11-22
Publication Date
2025-06-03

AI Technical Summary

Technical Problem

Existing component mounting systems do not consider the possibility of production stoppages when selecting production lines, leading to decreased overall production efficiency.

Method used

A component mounting system that includes automatic and non-automatic lines, where production planning is optimized by a device that considers past production data and actual values of production stop impact indicators to allocate appropriate lines for each substrate, minimizing the likelihood of production stoppages.

Benefits of technology

Improves production efficiency by strategically assigning automatic or non-automatic lines based on production stop impact indicators, reducing the frequency and likelihood of errors and maintenance, thereby enhancing overall productivity.

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Abstract

To provide a component mounting system capable of improving substrate production efficiency when the system is regarded as an integrated whole of multiple lines.SOLUTION: In a component mounting system 100, a production plan device 6 creates each production plan data PSD of an automatic line 1A and a non-automatic line 1B. The production plan device 6 performs substrate data acquisition processing S1 of acquiring a substrate data DA in regard to a plurality of production object substrates, actual data acquisition processing S2 of acquiring an actual data DB containing an actual value of a production stop influence index DB4 indicating an index affecting a production stop, and allocation processing S3 of allocating an automatic line 1A or a non-automatic line 1B to each of the plurality of production object substrates on the basis of the actual values of the production stop influence index DB4.SELECTED DRAWING: Figure 3
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Description

Technical Field

[0001] The present invention relates to a component mounting system including a production line for producing a component mounting substrate.

Background Art

[0002] When there are a plurality of production lines for producing component mounting substrates on which components are mounted, a line to be used for production targeting the production target substrate is selected from among the plurality of lines. A technique for selecting this type of line is disclosed in Patent Document 1. In the technique disclosed in Patent Document 1, when new lines and old lines with different performances such as production tact time, power consumption, and component mounting accuracy are mixed, a line that matches the characteristics of the number of component mountings and the number of production sheets on the production target substrate is selected as the production line.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] During production on a production line, an error that affects production stoppage may occur. In this case, maintenance work on the production stoppage line will be performed by an operator. Patent Document 1 only discloses selecting a line in consideration of the characteristics of the number of component mountings and the number of production sheets on the production target substrate, and does not consider the possibility of production stoppage in line selection. If an appropriate line is not assigned to a production target substrate with a high possibility of production stoppage, there is a problem that the production efficiency of the substrate decreases when considering the entire plurality of lines.

[0005] An object of the present invention is to provide a component mounting system capable of improving the production efficiency of a substrate when viewed as a whole of a plurality of lines.

Means for Solving the Problems

[0006] A component mounting system according to one aspect of the present invention includes a mounting machine having a mounting head for mounting a held component on a substrate, and a production line for producing a component-mounted substrate, wherein a supply operation for supplying components to the mounting machine is automatically performed by a supply device. An automatic line and a non-automatic line in which the supply operation is performed by an operator, and a production planning device for creating production plans for each of the automatic line and the non-automatic line. The production planning device includes a substrate data acquisition process for acquiring substrate data regarding a plurality of production target substrates indicating the substrates to be produced in each of the automatic line and the non-automatic line, and data regarding past production results corresponding to the substrate data, including actual values of production stop impact indicators indicating indicators that affect production stops. An actual data acquisition process for acquiring actual data, and an allocation process for allocating the automatic line or the non-automatic line as the production line to be used for production for each of the plurality of production target substrates based on the actual values of the production stop impact indicators.

[0007] According to this component mounting system, as production lines for producing component mounting substrates, there are a plurality of lines including an automatic line in which the component replenishment work for the mounter is automatically performed by a replenishment device and a non-automatic line in which the replenishment work is performed by an operator. In this case, when creating the production plan for each of the automatic line and the non-automatic line, the production planning device assigns an automatic line or a non-automatic line as the production line to be used for the production of each of the plurality of production target substrates indicated by the substrate data based on the actual value of the production stop impact index included in the actual data. The production stop impact index is the past actual value indicating the index that affects the stop of production for the production target substrates in the automatic line and the non-automatic line. Therefore, the production planning device can assign an appropriate line of either the automatic line or the non-automatic line to each of the plurality of production target substrates while considering the possibility of production stop due to the occurrence of errors or the like. As a result, when viewed as a whole of the production lines including the plurality of lines of the automatic line and the non-automatic line, the production efficiency of the substrates can be improved.

[0008] In the above component mounting system, the substrate data includes data regarding a plurality of used components indicating the components used in the production for each of the plurality of production target substrates, and the actual data may include the actual value of the normal holding rate indicating the probability when the holding state of the components by the mounting head is normal as the production stop impact index for each of the components of the same type as the plurality of used components. In this case, in the assignment process, the production planning device determines whether or not each of the plurality of used components satisfies a first component determination condition indicating that the actual value of the normal holding rate is equal to or higher than a predetermined holding rate reference value, and based on the determination result, assigns the automatic line or the non-automatic line to the production target substrate.

[0009] In this mode, the normal retention rate as a production stop impact indicator is a past performance value indicating the probability when the holding state of components by the mounting head is normal. When the performance value of the normal retention rate for components of the same type as the components used in production satisfies the first component determination condition indicating that it is equal to or higher than a predetermined retention rate reference value, in the production for the production target substrate, the probability of an error in the holding state of components by the mounting head that affects production stop will be low. On the other hand, when the first component determination condition is not satisfied, in the production for the production target substrate, the probability of an error in the holding state of components by the mounting head will be high. The production planning device can allocate an appropriate line, either an automatic line or a non-automatic line, to each of the plurality of production target substrates while considering the possibility of production stop caused by an error in the holding state of components by the mounting head by determining whether or not the first component determination condition is satisfied for each of the plurality of components used in the production of the production target substrate.

[0010] In the above component mounting system, in the allocation process, when all of the plurality of used components satisfy the first component determination condition, the production planning device may allocate the automatic line to the production target substrate, and when there are under-standard components among the plurality of used components that do not satisfy the first component determination condition, allocate the non-automatic line to the production target substrate.

[0011] When all of the plurality of components used in the production of the production target substrate satisfy the first component determination condition, the probability of an error in the holding state of components by the mounting head that affects production stop is low. In this case, the production planning device allocates the automatic line as the line to be used in the production of the production target substrate where it is assumed that the possibility of production stop caused by an error in the holding state of components by the mounting head is low. Thereby, the production planning device can make a production plan for the production target substrate where the possibility of production stop is low, taking advantage of the high productivity of the automatic line where the component replenishment work is automatically performed by the replenishment device.

[0012] On one hand, among a plurality of used parts used in the production of a substrate to be produced, if there are substandard parts that do not meet the first part determination condition, there is a high probability that an error will occur in the holding state of the parts by the mounting head that affects production stoppage. In this case, the production planning device assigns a non-automatic line as the line to be used in the production of the substrate to be produced, assuming that there is a high possibility of production stoppage due to an error in the holding state of the parts by the mounting head. Thereby, the production planning device can make a plan to produce on a non-automatic line where an operator who performs parts replenishment work is arranged for the substrate to be produced, assuming that there is a high possibility of production stoppage. In this case, even if a production stoppage occurs in the non-automatic line, the operator can quickly perform maintenance work on the production stoppage.

[0013] In the above component mounting system, in the allocation process, when all of the plurality of used parts meet the first part determination condition, the production planning device allocates the automatic line to the substrate to be produced. When there are substandard parts that do not meet the first part determination condition among the plurality of used parts, it is determined whether or not a second part determination condition indicating that the ratio of the number of mounted substandard parts to the total number of mounted parts of the plurality of used parts on the substrate to be produced is less than or equal to a predetermined mounting ratio reference value is satisfied. When the second part determination condition is satisfied, the automatic line is allocated to the substrate to be produced, and when the second part determination condition is not satisfied, the non-automatic line may be allocated to the substrate to be produced.

[0014] Among a plurality of component parts used in the production of a substrate to be produced, assume a case where the second component determination condition is satisfied, indicating that the mounting ratio of non-compliant components on the substrate to be produced is equal to or less than a predetermined mounting ratio reference value, when there are non-compliant components that do not meet the first component determination condition. In this case, in the production of the substrate to be produced, although the probability of an error in the holding state of components by the mounting head that affects production stop is high, the frequency of production stop occurrence will be relatively low. In this case, the production planning device can allocate an automatic line as the line to be used for the production of the substrate to be produced, where it is assumed that there is a possibility of production stop but the frequency of production stop occurrence is low. On the other hand, when the mounting ratio of non-compliant components on the substrate to be produced does not satisfy the second component determination condition, in the production of the substrate to be produced, the probability of an error in the holding state of components by the mounting head that affects production stop is high, and the frequency of production stop occurrence will be relatively high. In this case, the production planning device can allocate a non-automatic line as the line to be used for the production of the substrate to be produced, where it is assumed that the frequency of production stop occurrence is high.

[0015] In the above component mounting system, in the allocation process, when all of the plurality of component parts satisfy the first component determination condition, the production planning device allocates the automatic line to the substrate to be produced. When there are non-compliant components among the plurality of component parts that do not satisfy the first component determination condition, it is determined whether the second component determination condition is satisfied, which indicates that the mounting ratio of the non-compliant components to the total number of mounted components among the plurality of component parts on the substrate to be produced is equal to or less than a predetermined mounting ratio reference value, and the number of non-compliant components is equal to or less than a predetermined component number threshold. If the second component determination condition is satisfied, the automatic line is allocated to the substrate to be produced. If the second component determination condition is not satisfied, the non-automatic line may be allocated to the substrate to be produced.

[0016] Among a plurality of component parts used in the production of a substrate to be produced, when there are non-compliant parts that do not meet the first component determination condition, assume a case where the mounting ratio of non-compliant parts on the substrate to be produced is equal to or less than a predetermined mounting ratio reference value, and the number of non-compliant parts is equal to or less than a predetermined component number threshold, which indicates that the second component determination condition is satisfied. In this case, in the production of the substrate to be produced, although the probability of an error in the holding state of the parts by the mounting head that affects production stoppage is high, the frequency of production stoppage will be extremely low. In this case, the production planning device can allocate an automatic line as the line to be used in the production of the substrate to be produced, assuming that although there is a possibility of production stoppage, the frequency of production stoppage is extremely low. On the other hand, when the mounting ratio of non-compliant parts on the substrate to be produced does not satisfy the second component determination condition, in the production of the substrate to be produced, the probability of an error in the holding state of the parts by the mounting head that affects production stoppage is high, and the frequency of production stoppage will be extremely high. In this case, the production planning device can allocate a non-automatic line as the line to be used in the production of the substrate to be produced, assuming that the frequency of production stoppage is extremely high.

[0017] In the above component mounting system, the performance data may include data on the actual production quantity for each type of substrate. In this case, in the allocation process, the production planning device determines whether each of the plurality of substrates to be produced satisfies a substrate determination condition indicating that the actual production quantity of substrates of the same type as the substrate to be produced is equal to or greater than a predetermined production quantity reference value, and then determines whether each of the plurality of component parts satisfies the first component determination condition, thereby allocating the automatic line or the non-automatic line to the substrate to be produced.

[0018] When the substrate determination condition indicating that the actual production quantity of substrates of the same type as the substrate to be produced is equal to or greater than a predetermined production quantity reference value is satisfied, there will be many past production records of substrates of the same type as the substrate to be produced that are equal to or greater than the production quantity reference value. On the other hand, when the substrate determination condition is not satisfied, there will be few past production records of substrates of the same type as the substrate to be produced, or the substrate to be produced will be a new substrate without past production records. The production planning device determines whether or not such a substrate determination condition is satisfied, and then determines whether or not each of a plurality of used parts used in the production of the substrate to be produced satisfies a first part determination condition. Thereby, the production planning device can efficiently determine whether or not the first part determination condition is satisfied based on the determination result of whether or not the substrate determination condition is satisfied.

[0019] In the above component mounting system, in the allocation process, when the substrate determination condition is not satisfied, if all of the plurality of used parts satisfy the first part determination condition, the automatic line is allocated to the substrate to be produced. If there are parts that do not meet the standard and do not satisfy the first part determination condition among the plurality of used parts, the non-automatic line may be allocated to the substrate to be produced.

[0020] When the substrate determination conditions are not met and all of the multiple used parts meet the first part determination conditions, although there is little past production record regarding substrates of the same type as the substrate to be produced, there are past performance values of the normal holding rate regarding parts of the same type as the used parts for production, and in the production targeting the substrate to be produced, the probability of an error in the holding state of parts by the mounting head that affects production stop is low. In this case, the production planning device can allocate an automatic line as the line to be used for the production of the substrate to be produced, assuming that although the production record of the substrate is small, the possibility of production stop due to an error in the holding state of parts by the mounting head is low. On the other hand, when there are parts that do not meet the first part determination conditions (substandard parts) among the multiple used parts, there is little past production record regarding substrates of the same type as the substrate to be produced, and in the production targeting the substrate to be produced, the probability of an error in the holding state of parts by the mounting head that affects production stop is high. In this case, the production planning device can allocate a non-automatic line as the line to be used for the production of the substrate to be produced, assuming that the production record of the substrate is small and the possibility of production stop due to an error in the holding state of parts by the mounting head is high.

[0021] In the above component mounting system, the performance data may include an actual value of the inspection normal rate indicating the probability of obtaining a normal inspection result in one inspection in the inspection of the component mounting substrate as the production stop influence index regarding the component mounting substrate produced for substrates of the same type as the substrate to be produced. In this case, in the allocation process, the production planning device determines whether or not the inspection determination condition indicating that the actual value of the inspection normal rate of substrates of the same type as the substrate to be produced is equal to or higher than a predetermined inspection reference value is satisfied. If the inspection determination condition is satisfied, the automatic line is allocated to the substrate to be produced, and if the inspection determination condition is not satisfied, the non-automatic line is allocated to the substrate to be produced.

[0022] In this aspect, the inspection normal rate as a production stop impact indicator is a past performance value indicating the probability of obtaining a normal inspection result in one inspection in the inspection of component mounting substrates. When the inspection determination condition indicating that the performance value of the inspection normal rate of substrates of the same type as the substrate to be produced is equal to or higher than a predetermined inspection reference value is satisfied, in the production targeting the substrate to be produced, the probability of occurrence of an inspection error related to the mounting state of components that affects production stop is low. In this case, the production planning device can allocate an automatic line as the line to be used for the production of the substrate to be produced, assuming that the probability of production stop due to the occurrence of an inspection error is low. On the other hand, when the inspection determination condition is not satisfied, in the production targeting the substrate to be produced, the probability of occurrence of an inspection error related to the mounting state of components that affects production stop is high. In this case, the production planning device can allocate a non-automatic line as the line to be used for the production of the substrate to be produced, assuming that the probability of production stop due to the occurrence of an inspection error is high.

[0023] In the above component mounting system, the performance data may include a performance value of an operator call rate indicating the number of times an operator is called in response to the occurrence of an error in the production of one substrate as the production stop impact indicator for the production targeting substrates of the same type as the substrate to be produced. In this case, in the allocation process, the production planning device determines whether or not the call rate determination condition indicating that the performance value of the operator call rate of substrates of the same type as the substrate to be produced is equal to or lower than a predetermined call rate reference value is satisfied. When the call rate determination condition is satisfied, the automatic line is allocated to the substrate to be produced, and when the call rate determination condition is not satisfied, the non-automatic line is allocated to the substrate to be produced.

[0024] In this aspect, the operator call rate as a production stop impact indicator is an actual value indicating the number of times an operator is called in response to an error occurrence in the production of a single substrate. When the call rate determination condition indicating that the actual value of the operator call rate of substrates of the same type as the substrate to be produced is equal to or lower than a predetermined call rate reference value is satisfied, in the production of the substrate to be produced, the number of times an operator is called in response to an error occurrence that affects production stop will be small. In this case, the production planning device can allocate an automatic line as the line to be used for the production of the substrate to be produced for which it is assumed that the number of times an operator is called in response to an error occurrence is small. On the other hand, when the call rate determination condition is not satisfied, in the production of the substrate to be produced, the number of times an operator is called in response to an error occurrence that affects production stop will be large. In this case, the production planning device can allocate a non-automatic line as the line to be used for the production of the substrate to be produced for which it is assumed that the number of times an operator is called in response to an error occurrence is large.

[0025] In the above component mounting system, the production planning device may be configured to perform a line number data acquisition process for acquiring line number data indicating the number of each of the automatic line and the non-automatic line in the production line. In this case, in the allocation process, the production planning device allocates the automatic line or the non-automatic line to each of the plurality of substrates to be produced based on the actual value of the production stop impact indicator while referring to the line number data.

[0026] In this aspect, the production planning device can allocate an appropriate line, either the automatic line or the non-automatic line, to each of the plurality of substrates to be produced while referring to the line number data indicating the number of each of the automatic line and the non-automatic line and considering the possibility of production stop due to the occurrence of an error or the like.

Advantages of the Invention

[0027] As described above, according to the present invention, it is possible to provide a component mounting system capable of improving the production efficiency of a substrate when viewed as a whole of a plurality of lines.

Brief Description of the Drawings

[0028]

Figure 1

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Embodiments for Carrying Out the Invention

[0029] Hereinafter, a component mounting system according to an embodiment of the present invention will be described with reference to the drawings.

[0030] The component mounting system 100 shown in FIG. 1 is a system for producing a component mounting substrate on which components such as electronic components are mounted on a substrate such as a printed circuit board. The component mounting system 100 includes a production line 1, a production planning device 6, and an actual performance data storage device 7.

[0031] The production line 1 includes at least one mounter 2 and is a line for producing a component mounting substrate. The production line 1 can produce a component mounting substrate by mounting components on the substrate in the mounter 2. Note that a printing device 3 may be disposed upstream of the mounter 2 in the conveyance direction of the substrate, and an inspection device 4 may be disposed downstream of the mounter 2. The printing device 3 is a device for printing solder paste on the substrate. The inspection device 4 is a device for inspecting the mounting state of components on the component mounting substrate produced by the mounter 2.

[0032] The production line 1 includes a plurality of lines, an automatic line 1A and a non-automatic line 1B. The automatic line 1A is a line in which a replenishment operation for replenishing components to the mounter 2 is automatically performed by a replenishment device 5A. The replenishment device 5A includes a traveling body 51, a holding unit 52 mounted on the traveling body 51, and a work unit 53. The traveling body 51 is an unmanned vehicle capable of automatically traveling along the automatic line 1A. The holding unit 52 is a unit capable of holding a plurality of feeders for supplying components. The work unit 53 is a unit that performs an operation of moving a feeder between the holding unit 52 and the mounter 2. The replenishment device 5A automatically performs a replenishment operation of replenishing components to the mounter 2 by the work unit 53 moving the feeder from the holding unit 52 to the mounter 2 in a state where the holding unit 52 is disposed at a position facing the mounter 2 due to the automatic traveling of the traveling body 51. The non-automatic line 1B is a line in which a replenishment operation for replenishing components to the mounter 2 is performed by an operator 5B.

[0033] Regarding the mounting machine 2 provided in each of the automatic line 1A and the non-automatic line 1B, it will be described in detail with reference to FIG. 2. In FIG. 2, the directional relationship is shown using XY orthogonal coordinates that are orthogonal to each other on the horizontal plane. The mounting machine 2 includes a main body frame 21, a conveyor 23, a component supply unit 24, a head unit 25, and a substrate support unit 28.

[0034] The main body frame 21 is a structure in which each part constituting the mounting machine 2 is arranged, and is formed in a substantially rectangular shape in a plan view seen from the Z-axis direction orthogonal to both the X-axis direction and the Y-axis direction. The conveyor 23 extends in the X-axis direction and is arranged on the main body frame 21. The conveyor 23 conveys the substrate PP in the X-axis direction. The substrate PP conveyed on the conveyor 23 is positioned by the substrate support unit 28 at a predetermined working position (a component mounting position where components are mounted on the substrate PP). The substrate support unit 28 positions the substrate PP by supporting the substrate PP with push-up pins.

[0035] The component supply unit 24 is arranged on the +Y side and -Y side regions in the Y-axis direction of the main body frame 21, sandwiching the conveyor 23. The component supply unit 24 is a region of the main body frame 21 where a plurality of feeders 24F are mounted side by side. For each component to be held by the mounting head 251 provided in the head unit 25 described later, the set position of each feeder 24F is partitioned. The feeder 24F is detachably mounted on the component supply unit 24. The feeder 24F holds a plurality of components and supplies the held components to a predetermined component supply position set in the feeder. The component supply method of the feeder 24F is not particularly limited as long as it can supply components. As the feeder 24F, for example, a tape feeder that supplies components using a tape as a carrier, a tray feeder that supplies components by moving a tray on which components are placed, a stick feeder that supplies components while extruding the components stored in a cylindrical stick, etc. can be adopted.

[0036] The head unit 25 is held by the moving frame 27. On the main body frame 21, a fixed rail 261 extending in the Y-axis direction and a ball screw shaft 262 that is rotationally driven by a Y-axis servo motor 263 are arranged. The moving frame 27 is disposed on the fixed rail 261, and a nut portion 271 provided on the moving frame 27 is screwed onto the ball screw shaft 262. Further, on the moving frame 27, a guide member 272 extending in the X-axis direction and a ball screw shaft 273 that is driven by an X-axis servo motor 274 are arranged. The head unit 25 is movably held by the guide member 272, and a nut portion provided on the head unit 25 is screwed onto the ball screw shaft 273. Then, when the moving frame 27 moves in the Y-axis direction by the operation of the Y-axis servo motor 263, the head unit 25 moves in the X-axis direction with respect to the moving frame 27 by the operation of the X-axis servo motor 274. That is, the head unit 25 is movable in the Y-axis direction as the moving frame 27 moves, and is movable in the X-axis direction along the moving frame 27. The head unit 25 is movable over a predetermined working position of the substrate PP conveyed by the component supply unit 24 and the conveyor 23.

[0037] The head unit 25 includes a plurality of mounting heads 251. The mounting head 251 performs a component mounting operation of taking out and holding a component from the component supply unit 24 and mounting (mounting) the held component on the substrate PP.

[0038] As shown in FIG. 2, an imaging unit C1 is installed between the component supply unit 24 and the conveyor 23 on the main body frame 21. The imaging unit C1 is an imaging camera equipped with an imaging element such as a CMOS (Complementary metal-oxide-semiconductor) or a CCD (Charged-coupled device). While the head unit 25 is moving from the component supply position of the feeder 24F toward the working position of the substrate PP conveyed by the conveyor 23, the imaging unit C1 captures an image of the component held by the mounting head 251 from below to obtain a component holding image. In the mounter 2, based on the component holding image captured by the imaging unit C1, a process for recognizing the holding state of the component by the mounting head 251 is performed. The holding state of the component by the mounting head 251 includes a normal state in which the component is normally held by the mounting head 251, and an abnormal state indicating that the component is not held by the mounting head 251 or the deviation amount of the holding position of the component with respect to the mounting head 251 exceeds the allowable range. In the mounter 2, based on the recognition result of the holding state of the component by the mounting head 251, the component mounting operation on the substrate PP by the mounting head 251 is controlled. Thereby, the mounting accuracy of the component on the substrate PP is improved.

[0039] The performance data storage device 7 is a device that accumulates and stores performance data DB regarding past production performance in each of the automatic line 1A and the non-automatic line 1B. As shown in FIG. 1, the performance data DB includes a substrate type information DB1, a production quantity information DB2, a component type information DB3, and a production stop influence index DB4. The substrate type information DB1 is data indicating the types of substrates that were the targets of past production in each of the automatic line 1A and the non-automatic line 1B. The production quantity information DB2 is data indicating the actual production quantity values for each type of substrate indicated by the substrate type information DB1. The component type information DB3 is data indicating the types of components used in production for each type of substrate indicated by the substrate type information DB1.

[0040] The actual value of the production stop impact indicator DB4 is data indicating the actual value of the indicator that affects production stop in the production of each substrate on the automatic line 1A and the non-automatic line 1B. Examples of the production stop impact indicator DB4 include the normal retention rate DB5, the inspection normal rate DB6, the operator call rate DB7, and the like.

[0041] The normal retention rate DB5 is data regarding the parts indicated by the part type information DB3 used in the production targeting the substrates indicated by the substrate type information DB1, and is data indicating the probability when the holding state of the parts by the mounting head 251 is normal. The normal retention rate DB5 indicates, for each part indicated by the part type information DB3, as a percentage, the ratio of the number of times the holding state of the mounting head 251 was normal to the total number of times used in production.

[0042] The inspection normal rate DB6 is data indicating the probability of obtaining a normal inspection result in one inspection in the inspection by the inspection device 4 of the component-mounted substrate produced targeting the substrate indicated by the substrate type information DB1. In the inspection device 4, when a normal inspection result cannot be obtained in one inspection in the inspection of the mounting state of the components on the component-mounted substrate, the inspection parameters are changed and reinspection is performed. The inspection normal rate DB6 indicates, for each substrate indicated by the substrate type information DB1, as a percentage, the ratio of the number of times a normal inspection result was obtained to the total number of inspections performed in the inspection device 4.

[0043] The operator call rate DB7 is data indicating, for each substrate indicated by the substrate type information DB1, the number of times an operator was called in response to the occurrence of an error in the production of one substrate. In the mounter 2, when an error occurs during the production of a substrate due to, for example, an abnormal holding state of the parts by the mounting head 251, an operator is called to perform work to address the error.

[0044] The production planning device 6 is a device that creates production plans for each of the automatic line 1A and the manual line 1B. The production planning device 6 is realized, for example, by a personal computer. As shown in FIG. 1, the production planning device 6 includes a communication unit 61, an arithmetic processing unit 62, and a storage unit 63.

[0045] The communication unit 61 is configured to be communicable with the performance data storage device 7 via a network and communicable with an external device that creates the substrate data DA. The production planning device 6 acquires the performance data DB from the performance data storage device 7 and the substrate data DA from the external device by the communication of the communication unit 61. The substrate data DA is data regarding a plurality of production target substrates indicating the substrates to be produced in each of the automatic line 1A and the manual line 1B. The substrate data DA includes substrate type information DA1 and used part information DA2. The substrate type information DA1 is data indicating the type of each of the plurality of production target substrates. The used part information DA2 is data regarding a plurality of used parts indicating the parts used in production for each production target substrate indicated by the substrate type information DA1, and includes information regarding the part type of the used parts and information regarding the mounting number of the used parts on the substrate.

[0046] The arithmetic processing unit 62 executes various arithmetic processes for creating production plan data PSD indicating the production plans for each of the automatic line 1A and the manual line 1B based on a preset program. The arithmetic processing unit 62 executes various arithmetic processes for creating the production plan data PSD while referring to various setting values stored in the storage unit 63. The production plan data PSD is data in which, for each production target substrate indicated by the substrate type information DA1 included in the substrate data DA, the used part information DA2, the production quantity of the substrate, the production time zone in which the substrate is produced, and information indicating whether the production line 1 for producing the substrate is the automatic line 1A or the manual line 1B are associated.

[0047] The memory unit 63 stores various setting values such as the production quantity reference value SV1, the component mounting times threshold value SV2, the retention rate reference value SV3, the mounting ratio reference value SV4, the component number threshold value SV5, the inspection reference value SV6, and the call rate reference value SV7. The production quantity reference value SV1 is set in advance corresponding to the production quantity information DB2 included in the performance data DB, and indicates the reference value of the production quantity of the substrate. The component mounting times threshold value SV2 indicates the threshold value of the mounting times of the components mounted on the substrate. The retention rate reference value SV3 is set in advance corresponding to the actual value of the normal retention rate DB5 included in the performance data DB, and indicates the reference value of the normal retention rate DB5. The mounting ratio reference value SV4 indicates the reference value of the ratio of the number of components that do not meet the first component determination condition described below to the total number of components mounted on the substrate. The component number threshold value SV5 is set in advance corresponding to the mounting ratio reference value SV4, and indicates the threshold value of the number of components that do not meet the standard. The inspection reference value SV6 is set in advance corresponding to the actual value of the inspection normal rate DB6 included in the performance data DB, and indicates the reference value of the inspection normal rate DB6. The call rate reference value SV7 is set in advance corresponding to the actual value of the operator call rate DB7 included in the performance data DB, and indicates the reference value of the operator call rate DB7.

[0048] Regarding various arithmetic processes for creating the production plan data PSD executed by the arithmetic processing unit 62 of the production planning device 6, it will be described with reference to the flowchart of FIG. 3. The arithmetic processing unit 62 performs a substrate data acquisition process S1, a performance data acquisition process S2, an allocation process S3, and a production plan creation process S4.

[0049] In the substrate data acquisition process S1, the arithmetic processing unit 62 acquires substrate data DA regarding a plurality of production target substrates indicating the production target substrates in each of the automatic line 1A and the non-automatic line 1B via the communication unit 61.

[0050] In the performance data acquisition process S2, the arithmetic processing unit 62 acquires, via the communication unit 61, the performance data DB which is data regarding past production performance corresponding to the substrate data DA and includes the actual value of the production stop influence index DB4, from the performance data storage device 7.

[0051] In the allocation process S3, based on the actual values of the production stop impact index DB4 included in the performance data DB, the arithmetic processing unit 62 allocates the automatic line 1A or the non-automatic line 1B as the production line 1 to be used for the production of each of the plurality of production target substrates.

[0052] In the production plan creation process S4, based on the allocation results of the automatic line 1A or the non-automatic line 1B for each of the plurality of production target substrates, the arithmetic processing unit 62 creates production plan data PSD indicating the production plan for each production target substrate in each of the automatic line 1A and the non-automatic line 1B.

[0053] When creating the production plan data PSD indicating the production plans for each of the automatic line 1A and the non-automatic line 1B, the arithmetic processing unit 62 allocates the automatic line 1A or the non-automatic line 1B as the production line 1 to be used for the production of each of the plurality of production target substrates indicated by the substrate data DA, based on the actual values of the production stop impact index DB4 included in the performance data DB. The production stop impact index DB4 is the past actual value indicating the index that affects the stop of production for the production target substrates in the automatic line 1A and the non-automatic line 1B. For this reason, the arithmetic processing unit 62 can allocate an appropriate line of either the automatic line 1A or the non-automatic line 1B to each of the plurality of production target substrates while considering the possibility of production stop due to the occurrence of errors or the like. As a result, when considering the entire production line 1 including the plurality of lines of the automatic line 1A and the non-automatic line 1B, the production efficiency of the substrates can be improved.

[0054] A specific example of the allocation process S3 executed by the arithmetic processing unit 62 will be described below. First, the first example of the allocation process S3 will be described with reference to the flowchart of FIG. 4.

[0055] The arithmetic processing unit 62 extracts one production target substrate from a plurality of production target substrates indicated by the substrate type information DA1 included in the substrate data DA (step S31). The arithmetic processing unit 62 determines whether or not a substrate determination condition JA is satisfied, which indicates that the actual production value of the number of substrates of the same type as the extracted production target substrate is equal to or greater than the production number reference value SV1 stored in the storage unit 63, based on the production number information DB2 included in the performance data DB (step S32).

[0056] When the substrate determination condition JA is not satisfied (NO in step S32), it means that the past production record of substrates of the same type as the production target substrate is small, or the production target substrate is a new substrate with no past production record. In this case, the arithmetic processing unit 62 assigns the non-automatic line 1B as the line to be used for the production of the production target substrate (step S37). Thereby, the arithmetic processing unit 62 can assign the non-automatic line 1B to the production target substrate with a small past production record.

[0057] On the other hand, when the substrate determination condition JA is satisfied (YES in step S32), there will be many past production records regarding substrates of the same type as the substrate to be produced, with the production quantity being equal to or greater than the production quantity reference value SV1. In this case, the arithmetic processing unit 62 extracts one of the plurality of used parts indicated by the used part information DA2 included in the substrate data DA (step S33). Based on the performance data DB, the arithmetic processing unit 62 determines whether the performance value regarding parts of the same type as the used part satisfies the first part determination condition JB1 (step S34), and determines whether the determination regarding the first part determination condition JB1 for all the used parts is completed (step S35). That is, the arithmetic processing unit 62 determines whether each of the plurality of used parts indicated by the used part information DA2 satisfies the first part determination condition JB1. The first part determination condition JB1 is a determination condition regarding parts of the same type as the used part, where the actual value of the mounting times is equal to or greater than the part mounting times threshold value SV2 stored in the storage unit 63, and the actual value of the normal holding rate DB5 as the production stop influence index DB4 is equal to or greater than the holding rate reference value SV3 stored in the storage unit 63. Note that the first part determination condition JB1 may be a determination condition indicating that the actual value of the normal holding rate DB5 regarding parts of the same type as the used part is equal to or greater than the holding rate reference value SV3.

[0058] The arithmetic processing unit 62 determines whether or not each of a plurality of used parts satisfies the first part determination condition JB1, and assigns either the automatic line 1A or the non-automatic line 1B to the production target substrate based on the determination result. The normal holding rate DB5 as the production stop influence index DB4 is a past performance value indicating the probability when the holding state of the parts by the mounting head 251 is normal. When the first part determination condition JB1 is satisfied, which indicates that the performance value of the normal holding rate DB5 for parts of the same type as the used parts used in production is equal to or higher than a predetermined holding rate reference value SV3, in the production targeting the production target substrate, the probability of an error in the holding state of the parts by the mounting head 251 that affects production stop is low. On the other hand, when the first part determination condition JB1 is not satisfied, in the production targeting the production target substrate, the probability of an error in the holding state of the parts by the mounting head 251 is high. By determining whether or not each of a plurality of used parts used in the production of the production target substrate satisfies the first part determination condition JB1, the arithmetic processing unit 62 can assign an appropriate line, either the automatic line 1A or the non-automatic line 1B, to each of the plurality of production target substrates while considering the possibility of production stop caused by an error in the holding state of the parts by the mounting head 251.

[0059] As described above, when all of the plurality of used parts used in the production of the production target substrate satisfy the first part determination condition JB1 (YES in step S34 and YES in step S35), the probability of an error in the holding state of the parts by the mounting head 251 that affects production stop is low. In this case, the arithmetic processing unit 62 assigns the automatic line 1A as the line to be used in the production of the production target substrate for which it is assumed that the possibility of production stop caused by an error in the holding state of the parts by the mounting head 251 is low (step S36). Thereby, the arithmetic processing unit 62 can make a production plan to produce while taking advantage of the high productivity of the automatic line 1A, in which the part replenishment work is automatically performed by the replenishment device 5A, for the production target substrate for which it is assumed that the possibility of production stop is low.

[0060] On the other hand, if there is a substandard component that does not meet the first component determination condition JB1 among a plurality of used components used in the production of the substrate to be produced (NO in step S34), there is a high probability that an error will occur in the holding state of the component by the mounting head 251 that affects production stoppage. In this case, the arithmetic processing unit 62 assigns the non-automatic line 1B as the line to be used for the production of the substrate to be produced, assuming that there is a high possibility of production stoppage due to an error in the holding state of the component by the mounting head 251 (step S37). As a result, the arithmetic processing unit 62 can make a plan to produce the substrate to be produced, for which there is a high possibility of production stoppage, on the non-automatic line 1B where the operator 5B who performs the component replenishment work is arranged. In this case, even if a production stoppage occurs on the non-automatic line 1B, the operator 5B can quickly perform maintenance work for the production stoppage.

[0061] The arithmetic processing unit 62 determines whether the assignment of lines for all of the plurality of substrates to be produced indicated by the substrate type information DA1 included in the substrate data DA has been completed (step S38). If the assignment of lines for all of the substrates to be produced has not been completed (NO in step S38), the arithmetic processing unit 62 repeats each process from step S31 to step S37 until the assignment of lines is completed.

[0062] Next, a second example of the assignment process S3 executed by the arithmetic processing unit 62 will be described with reference to the flowchart of FIG. 5.

[0063] The arithmetic processing unit 62 extracts one substrate to be produced from among the plurality of substrates to be produced indicated by the substrate type information DA1 included in the substrate data DA (step S31). The arithmetic processing unit 62 determines whether the substrate determination condition JA indicating that the actual production value of the number of substrates of the same type as the extracted substrate to be produced is equal to or greater than the production number reference value SV1 stored in the storage unit 63 is satisfied based on the production number information DB2 included in the actual result data DB (step S32).

[0064] When the substrate determination condition JA is not satisfied (NO in step S32), the arithmetic processing unit 62 assigns the non-automatic line 1B as the line to be used for the production of the substrate to be produced (step S37).

[0065] On the other hand, when the substrate determination condition JA is satisfied (YES in step S32), the arithmetic processing unit 62 extracts one of the plurality of used parts indicated by the used part information DA2 included in the substrate data DA (step S33). The arithmetic processing unit 62 determines whether or not the first part determination condition JB1 indicating that the actual value of the normal holding rate DB5 for parts of the same type as the used part is equal to or higher than the holding rate reference value SV3 is satisfied (step S34), and determines whether or not the determination regarding the first part determination condition JB1 for all the used parts has been completed (step S35). That is, the arithmetic processing unit 62 determines whether or not the first part determination condition JB1 is satisfied for each of the plurality of used parts indicated by the used part information DA2. When the determination regarding the first part determination condition JB1 has not been completed (NO in step S35), the arithmetic processing unit 62 repeats the processes of step S33 and step S34 until the determination for all the used parts is completed.

[0066] The determination result as to whether or not the first part determination condition JB1 is satisfied is stored, for example, in the storage unit 63 for each of the plurality of used parts indicated by the used part information DA2. The arithmetic processing unit 62 refers to the determination result based on the first part determination condition JB1 stored in the storage unit 63, and recognizes the existence of the parts not reaching the standard that do not satisfy the first part determination condition JB1 among the plurality of used parts.

[0067] The arithmetic processing unit 62 determines whether or not the second component determination condition JB2 is satisfied (step S351). The second component determination condition JB2 is a determination condition indicating that the non-compliance component mounting ratio DB51, which indicates the ratio of the number of non-compliance components to the total number of all mounted components on the production target substrate as a percentage, is equal to or less than the mounting ratio reference value SV4 stored in the storage unit 63. Note that the second component determination condition JB2 may be a determination condition indicating that the non-compliance component mounting ratio DB51 is equal to or less than the mounting ratio reference value SV4 stored in the storage unit 63, and that the number of non-compliance components DB52 indicating the number of non-compliance components is equal to or less than the component number threshold value SV5 stored in the storage unit 63.

[0068] When there are non-compliance components that do not satisfy the first component determination condition JB1 and the second component determination condition JB2 is satisfied (YES in step S351), in the production of the production target substrate, although the probability of an error in the component holding state by the mounting head 251 that affects production stop is high, the frequency of production stop occurrence is relatively low. In this case, the arithmetic processing unit 62 assigns the automatic line 1A as the line to be used for the production of the production target substrate for which it is assumed that there is a possibility of production stop but the frequency of production stop occurrence is low (step S36).

[0069] On the other hand, when the second component determination condition JB2 is not satisfied (NO in step S351), in the production of the production target substrate, the probability of an error in the component holding state by the mounting head 251 that affects production stop is high, and the frequency of production stop occurrence is relatively high. In this case, the arithmetic processing unit 62 assigns the non-automatic line 1B as the line to be used for the production of the production target substrate for which it is assumed that the frequency of production stop occurrence is high (step S37).

[0070] The arithmetic processing unit 62 determines whether the assignment of lines to all of the plurality of production target substrates indicated by the substrate type information DA1 included in the substrate data DA has been completed (step S38). When the assignment of lines to all of the production target substrates has not been completed (NO in step S38), the arithmetic processing unit 62 repeats each process from step S31 to step S37 until the assignment of lines is completed.

[0071] Next, a third example of the assignment process S3 executed by the arithmetic processing unit 62 will be described with reference to the flowchart of FIG. 6. In the assignment process S3 according to the third example, the processing content when the substrate determination condition JA is not satisfied is different from that in the assignment process S3 according to the second example, and the rest is the same as that in the assignment process S3 according to the second example. For this reason, descriptions will be omitted for those other than the processing content when the substrate determination condition JA is not satisfied.

[0072] When the substrate determination condition JA is not satisfied (NO in step S32), it means that there is little past production record for substrates of the same type as the production target substrate, or the production target substrate is a new substrate with no past production record. In this case, the arithmetic processing unit 62 determines whether all of the plurality of used parts used in the production of the production target substrate satisfy the first part determination condition JB1 (step S321).

[0073] When all of the plurality of used parts satisfy the first part determination condition JB1 when the substrate determination condition JA is not satisfied (YES in step S321), although there is little past production record for substrates of the same type as the production target substrate, there is a past actual value of the normal holding rate DB5 for parts of the same type as the used parts used in the production, and in the production targeting the production target substrate, the probability of an error in the holding state of the parts by the mounting head 251 that affects the production stop is low. In this case, the arithmetic processing unit 62 assigns the automatic line 1A as the line used in the production of the production target substrate, assuming that although the production record of the substrate is small, the possibility of production stop due to the occurrence of an error in the holding state of the parts by the mounting head 251 is low (step S36).

[0074] On the other hand, when there is a substandard component that does not meet the first component determination condition JB1 among a plurality of used components (NO in step S321), the production history of substrates of the same type as the substrate to be produced is small, and in the production of the substrate to be produced, the probability of an error in the component holding state by the mounting head 251 that affects production stoppage is high. In this case, the arithmetic processing unit 62 assigns the non-automatic line 1B as the line to be used for the production of the substrate to be produced, assuming that the production history of the substrate is small and the probability of production stoppage due to an error in the component holding state by the mounting head 251 is high (step S37).

[0075] Next, a fourth example of the allocation process S3 executed by the arithmetic processing unit 62 will be described with reference to the flowchart of FIG. 7.

[0076] The arithmetic processing unit 62 extracts one production target substrate from among a plurality of production target substrates indicated by the substrate type information DA1 included in the substrate data DA (step S31). The arithmetic processing unit 62 determines whether or not the production target substrate satisfies a substrate determination condition JA indicating that the actual production quantity value for substrates of the same type as the extracted production target substrate is equal to or greater than the production quantity reference value SV1 stored in the storage unit 63, based on the production quantity information DB2 included in the performance data DB (step S32).

[0077] When the substrate determination condition JA is not satisfied (NO in step S32), the arithmetic processing unit 62 assigns the non-automatic line 1B as the line to be used for the production of the production target substrate (step S35).

[0078] On the other hand, when the substrate determination condition JA is satisfied (YES in step S32), the arithmetic processing unit 62 determines whether or not the inspection determination condition JC is satisfied based on the inspection normal rate DB6 as the production stoppage influence index DB4 included in the performance data DB (step S33). The inspection determination condition JC is a determination condition indicating that the actual value of the inspection normal rate DB6 of substrates of the same type as the production target substrate is equal to or greater than the inspection reference value SV6 stored in the storage unit 63.

[0079] The inspection normal rate DB6 as the production stop influence index DB4 is a past performance value indicating the probability of obtaining a normal inspection result in one inspection in the inspection of the component mounting substrate by the inspection apparatus 4. When the inspection determination condition JC indicating that the performance value of the inspection normal rate DB6 of a substrate of the same type as the production target substrate is equal to or higher than a predetermined inspection reference value SV6 is satisfied (YES in step S33), in the production targeting the production target substrate, the probability of an inspection error regarding the mounting state of components that affects production stop is low. In this case, the arithmetic processing unit 62 assigns the automatic line 1A as the line to be used for the production of the production target substrate for which it is assumed that the possibility of production stop due to the occurrence of an inspection error is low (step S34).

[0080] On the other hand, when the inspection determination condition JC is not satisfied (NO in step S33), in the production targeting the production target substrate, the probability of an inspection error regarding the mounting state of components that affects production stop is high. In this case, the arithmetic processing unit 62 assigns the non-automatic line 1B as the line to be used for the production of the production target substrate for which it is assumed that the possibility of production stop due to the occurrence of an inspection error is high (step S35).

[0081] The arithmetic processing unit 62 determines whether the assignment of lines for all of the plurality of production target substrates indicated by the substrate type information DA1 included in the substrate data DA has been completed (step S36). When the assignment of lines for all of the production target substrates has not been completed (NO in step S36), the arithmetic processing unit 62 repeats each process from step S31 to step S35 until the assignment of lines is completed.

[0082] Next, a fifth example of the assignment process S3 executed by the arithmetic processing unit 62 will be described with reference to the flowchart of FIG. 8.

[0083] The arithmetic processing unit 62 extracts one production target substrate from a plurality of production target substrates indicated by the substrate type information DA1 included in the substrate data DA (step S31). The arithmetic processing unit 62 determines whether or not a substrate determination condition JA is satisfied, which indicates that the actual production quantity value for substrates of the same type as the extracted production target substrate is equal to or greater than the production quantity reference value SV1 stored in the storage unit 63, based on the production quantity information DB2 included in the performance data DB (step S32).

[0084] When the substrate determination condition JA is not satisfied (NO in step S32), the arithmetic processing unit 62 assigns the non-automatic line 1B as the line to be used for the production of the production target substrate (step S35).

[0085] On the other hand, when the substrate determination condition JA is satisfied (YES in step S32), the arithmetic processing unit 62 determines whether or not a call rate determination condition JD is satisfied, based on the operator call rate DB7 as the production stop influence index DB4 included in the performance data DB (step S33). The call rate determination condition JD is a determination condition indicating that the actual value of the operator call rate DB7 for substrates of the same type as the production target substrate is equal to or less than the call rate reference value SV7 stored in the storage unit 63.

[0086] The operator call rate DB7 as the production stop influence index DB4 is an actual value indicating the number of times an operator is called in response to the occurrence of an error in the production of one substrate. When the call rate determination condition JD is satisfied, which indicates that the actual value of the operator call rate DB7 for substrates of the same type as the production target substrate is equal to or less than a predetermined call rate reference value SV7 (YES in step S33), it means that the number of times an operator is called in response to the occurrence of an error that affects production stop is small in the production of the production target substrate. In this case, the arithmetic processing unit 62 assigns the automatic line 1A as the line to be used for the production of the production target substrate, where it is assumed that the number of times an operator is called in response to the occurrence of an error is small (step S34).

[0087] On the other hand, when the call rate determination condition JD is not satisfied (NO in step S33), in the production of the production target substrate, the number of times the operator is called will increase in response to the occurrence of an error that affects production stoppage. In this case, the arithmetic processing unit 62 allocates the non-automatic line 1B as the line to be used for the production of the production target substrate for which it is assumed that the number of times the operator is called will increase in response to the occurrence of an error (step S35).

[0088] The arithmetic processing unit 62 determines whether or not the allocation of lines for all of the plurality of production target substrates indicated by the substrate type information DA1 included in the substrate data DA has been completed (step S36). When the allocation of lines for all of the production target substrates has not been completed (NO in step S36), the arithmetic processing unit 62 repeats each process from step S31 to step S35 until the allocation of lines is completed.

[0089] Although the embodiments of the present invention have been described above, the present invention is not limited thereto, and for example, the following modified embodiments can be adopted.

[0090] In the above embodiment, the mode in which the arithmetic processing unit 62 in the production planning device 6 executes each of the substrate data acquisition process S1, the performance data acquisition process S2, the allocation process S3, and the production plan creation process S4 has been described, but it is not limited to such a mode. The processes executed by the arithmetic processing unit 62 of the production planning device 6 according to the modified embodiment will be described with reference to FIGS. 9 and 10.

[0091] The arithmetic processing unit 62 may be configured to execute a line number data acquisition process S2A before the allocation process S3. That is, the arithmetic processing unit 62 performs the substrate data acquisition process S1, the performance data acquisition process S2, the line number data acquisition process S2A, the allocation process S3, and the production plan creation process S4. Since the substrate data acquisition process S1, the performance data acquisition process S2, and the production plan creation process S4 are the same as the above-described processing contents, the description thereof is omitted.

[0092] In the line number data acquisition process S2A, the arithmetic processing unit 62 acquires line number data DL indicating the number of each of the automatic line 1A and the non-automatic line 1B on the production line 1. Then, in the assignment process S3, the arithmetic processing unit 62 refers to the line number data DL and assigns the automatic line 1A or the non-automatic line 1B to each of the plurality of production target substrates indicated by the substrate type information DA1 included in the substrate data DA based on the actual value of the production stop influence index DB4 included in the actual data DB. In this case, the arithmetic processing unit 62 can assign an appropriate line of either the automatic line 1A or the non-automatic line 1B to each of the plurality of production target substrates while referring to the line number data DL and considering the possibility of production stop due to the occurrence of errors or the like. Such a mode of assigning a line while referring to the line number data DL is particularly effective when the number of the automatic line 1A is larger than that of the non-automatic line 1B.

[0093] In the example shown in FIG. 10, the line number data DL is data indicating that the number of the automatic line 1A is "3" and the number of the non-automatic line 1B is "1". Then, the priority orders of the normal holding rate DB5, the ratio of mounted parts below the standard DB51, the inspection normal rate DB6, and the operator call rate DB7 as the production stop influence index DB4 used in the determination of the line assignment for the production target substrates are set in advance. In the example shown in FIG. 10, the inspection normal rate DB6 is set to the first priority order, the normal holding rate DB5 is set to the second priority order, the ratio of mounted parts below the standard DB51 is set to the third priority order, and the operator call rate DB7 is set to the fourth priority order.

[0094] In the assignment process S3, based on the performance data DB, for each of the plurality of substrates to be produced, the arithmetic processing unit 62 recognizes the respective performance values of the inspection normal rate DB6, the minimum value of the normal retention rate DB5, the ratio of non-compliant component mounting DB51, and the operator call rate DB7 for substrates of the same type as the substrate to be produced. Then, the arithmetic processing unit 62 arranges each of the plurality of substrates to be produced in descending order of the degree of influence on production stop of each performance value according to the above preset priority order. In the example shown in FIG. 10, the arithmetic processing unit 62 arranges the substrates to be produced in descending order of the degree of influence on production stop of the performance value of the inspection normal rate DB6 with the highest priority, that is, in ascending order of the inspection normal rate DB6. When there are a plurality of substrates to be produced with the same performance value of the inspection normal rate DB6, the substrates to be produced are arranged while referring to the respective performance values of the minimum value of the normal retention rate DB5 with the second highest priority, the ratio of non-compliant component mounting DB51 with the third highest priority, and the operator call rate DB7 with the fourth highest priority.

[0095] Then, the arithmetic processing unit 62 refers to the ratio of the number of non - automatic lines 1B to the total number of production lines 1 indicated by the line number data DL, and among the plurality of production target substrates arranged in descending order of the impact degree of production stop of each performance value, the non - automatic line 1B is assigned to the production target substrates up to the rank corresponding to the ratio of the number of non - automatic lines 1B from the top, and the automatic line 1A is assigned to the other production target substrates. For example, when the number of non - automatic lines 1B is "2" and the number of automatic lines 1A is "3", the arithmetic processing unit 62 divides the whole of the plurality of production target substrates in a ratio of 2:3 from the one with the greater impact degree of production stop of each performance value, and assigns the part corresponding to the upper 2 / 5 with a greater impact degree to the non - automatic line 1B. Thereby, the arithmetic processing unit 62 can assign the non - automatic line 1B to the production target substrates for which a high possibility of production stop is assumed, and can assign the automatic line 1A to the production target substrates for which a low possibility of production stop is assumed. In this case, even when the number of automatic lines 1A is larger than that of non - automatic lines 1B, it is possible to prevent a situation where no substrate is assigned to the automatic line 1A. Note that the arithmetic processing unit 62 may assign the non - automatic line 1B to the production target substrates up to the rank corresponding to the number of non - automatic lines 1B indicated by the line number data DL from the top among the plurality of production target substrates arranged in descending order of the impact degree of production stop of each performance value, and assign the automatic line 1A to the other production target substrates.

Explanation of Signs

[0096] 1 Production line 1A Automatic line 1B Non - automatic line 2 Mounter 5A Supply device 5B Operator 6 Production planning device DA Substrate data DB Performance data DB4 Production stop impact index DB5 Normal holding rate DB51 Ratio of mounted parts not reaching the standard DB6 Inspection normal rate DB7 Operator Call Rate SV1 Production Quantity Standard Value SV2 Component Mounting Times Threshold SV3 Retention Rate Standard Value SV4 Mounting Ratio Standard Value SV5 Component Quantity Threshold SV6 Inspection Standard Value SV7 Call Rate Standard Value

Claims

1. A production line for producing a component mounting substrate, including a mounting machine having a mounting head for mounting components held on a substrate, wherein a replenishment operation for replenishing components to the mounting machine is automatically performed by a replenishment device, and an automatic line and a non-automatic line in which the replenishment operation is performed by an operator. And a production planning device for creating a production plan for each of the automatic line and the non-automatic line. The production planning device Performs a substrate data acquisition process for acquiring substrate data regarding a plurality of production target substrates indicating the substrates to be produced in each of the automatic line and the non-automatic line. A performance data acquisition process for acquiring performance data that is data regarding past production performance corresponding to the substrate data and includes actual values of production stop impact indicators indicating indicators that affect production stops. A component mounting system that performs an allocation process of allocating the automatic line or the non-automatic line as the production line to be used for production for each of the plurality of production target substrates based on the actual values of the production stop impact indicators.

2. The substrate data includes data regarding a plurality of used components indicating the components used in production for each of the plurality of production target substrates. The performance data includes actual values of normal holding rates indicating the probability that the holding state of components by the mounting head is normal as the production stop impact indicators for each of the components of the same type as the plurality of used components. In the allocation process, the production planning device determines whether or not each of the plurality of used components satisfies a first component determination condition indicating that the actual value of the normal holding rate is equal to or higher than a predetermined holding rate reference value, and allocates the automatic line or the non-automatic line to the production target substrate based on the determination result. The component mounting system according to Claim 1.

3. In the allocation process, the production planning device When all of the plurality of used components satisfy the first component determination condition, allocates the automatic line to the production target substrate. When there are under-standard components that do not satisfy the first component determination condition among the plurality of used components, allocates the non-automatic line to the production target substrate. The component mounting system according to Claim 2.

4. In the allocation process, the production planning device When all of the plurality of component parts satisfy the first component determination condition, the automatic line is assigned to the substrate to be produced. When there is a non-compliant component part that does not satisfy the first component determination condition among the plurality of component parts, it is determined whether the second component determination condition indicating that the mounting ratio of the non-compliant component parts to the total number of mounted parts of the plurality of component parts on the substrate to be produced is equal to or less than a predetermined mounting ratio reference value is satisfied. When the second component determination condition is satisfied, the automatic line is assigned to the substrate to be produced. When the second component determination condition is not satisfied, the non-automatic line is assigned to the substrate to be produced. The component mounting system according to claim 2.

5. In the allocation process, the production planning device When all of the plurality of component parts satisfy the first component determination condition, the automatic line is assigned to the substrate to be produced. When there is a non-compliant component part that does not satisfy the first component determination condition among the plurality of component parts, it is determined whether the second component determination condition indicating that the mounting ratio of the non-compliant component parts to the total number of mounted parts of the plurality of component parts on the substrate to be produced is equal to or less than a predetermined mounting ratio reference value and that the number of non-compliant component parts is equal to or less than a predetermined component number threshold is satisfied. When the second component determination condition is satisfied, the automatic line is assigned to the substrate to be produced. When the second component determination condition is not satisfied, the non-automatic line is assigned to the substrate to be produced. The component mounting system according to claim 2.

6. The performance data includes data on the actual production quantity for each type of substrate. In the allocation process, the production planning device determines whether the substrate determination condition indicating that the actual production quantity of substrates of the same type as the substrate to be produced is equal to or greater than a predetermined production quantity reference value is satisfied for each of the plurality of substrates to be produced, and then determines whether the first component determination condition is satisfied for each of the plurality of component parts, thereby assigning the automatic line or the non-automatic line to the substrate to be produced. The component mounting system according to claim 2.

7. When the production planning device does not satisfy the substrate determination condition in the allocation process When all of the plurality of used components satisfy the first component determination condition, assign the automatic line to the substrate to be produced. The component mounting system according to claim 6, wherein when there is a substandard component that does not satisfy the first component determination condition among the plurality of used components, the non-automatic line is assigned to the substrate to be produced.

8. The performance data includes an actual value of an inspection normal rate indicating a probability of obtaining a normal inspection result in one inspection in the inspection of the component mounting substrate as the production stop influence index regarding the component mounting substrate produced for a substrate of the same type as the substrate to be produced. In the assignment process, the production planning device determines whether or not the inspection determination condition indicating that the actual value of the inspection normal rate of a substrate of the same type as the substrate to be produced is equal to or higher than a predetermined inspection reference value is satisfied. When the inspection determination condition is satisfied, the automatic line is assigned to the substrate to be produced, and when the inspection determination condition is not satisfied, the non-automatic line is assigned to the substrate to be produced. The component mounting system according to claim 1.

9. The performance data includes an actual value of an operator call rate indicating the number of times an operator is called in response to an error in the production of one substrate as the production stop influence index regarding the production for a substrate of the same type as the substrate to be produced. In the assignment process, the production planning device determines whether or not the call rate determination condition indicating that the actual value of the operator call rate of a substrate of the same type as the substrate to be produced is equal to or lower than a predetermined call rate reference value is satisfied. When the call rate determination condition is satisfied, the automatic line is assigned to the substrate to be produced, and when the call rate determination condition is not satisfied, the non-automatic line is assigned to the substrate to be produced. The component mounting system according to claim 1.

10. The production planning device performs a line number data acquisition process for acquiring line number data indicating the number of each of the automatic line and the non-automatic line in the production line. In the assignment process, while referring to the line number data, based on the actual value of the production stop influence index, the automatic line or the non-automatic line is assigned to each of the plurality of substrates to be produced. The component mounting system according to claim 1.

Citation Information

Patent Citations

  • Line selecting method

    JP2008047835A