Electronic component package and method of manufacturing electronic component package

Abstract

To solve a problem in which the heat generated when joining a metal foil is easily transferred to an electronic component.SOLUTION: An electronic component package 10 includes a first metal foil 11, a second metal foil overlapping with the first metal foil 11, and a joint 13 where an outer edge of the first metal foil 11 and an outer edge of the second metal foil are joined. The joint 13 includes a first portion P1, a second portion P2, and a connecting portion P3. When a first imaginary straight line including an inner periphery 14 of the first portion P1 is L1 and a second imaginary straight line including an inner periphery 14 of the second portion P2 is L2, the inner periphery 14 of the connecting portion P3 is located on the opposite side of the first imaginary straight line L1 from the center of the main surface MF, or on the opposite side of the second imaginary straight line L2 from the center of the main surface MF.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to an electronic component package and a method for manufacturing an electronic component package. [Background technology]

[0002] The electronic component package disclosed in Patent Document 1 includes a first metal foil and a second metal foil. The first metal foil has a rectangular shape in a plan view. The second metal foil has substantially the same shape and size as the first metal foil. The first metal foil and the second metal foil are overlapped so that their outer edges coincide with each other. The electronic component package also includes a joint where the outer edge of the first metal foil and the outer edge of the second metal foil are welded together. The joint is a rectangular ring extending along the edge of each metal foil. A sealed space is defined by the first metal foil and the second metal foil. An electronic component is stored in the sealed space. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 5377763 Summary of the Invention [Problem to be solved by the invention]

[0004] In an electronic component package as described in Patent Document 1, the outer edges of the first and second metal foils may be welded while an electronic component is disposed between them. At this time, heat generated when welding the two metal foils may be transferred to the electronic component, adversely affecting the electronic component. In particular, heat is likely to concentrate at the rectangular corners of each metal foil during welding. Therefore, there is a demand for a structure of an electronic component package that does not easily transfer heat during welding to the electronic component. [Means for solving the problem]

[0005] In order to solve the above-mentioned problems, the present invention provides a package for electronic components comprising a first metal foil, a second metal foil overlapping the first metal foil, and a joint portion where an outer edge portion of the first metal foil and an outer edge portion of the second metal foil are joined, wherein when an edge of the joint portion located toward the center of a main surface of the first metal foil is defined as an inner edge, the joint portion comprises a first portion where the inner edge is straight, a second portion where the inner edge is straight and extends in a different direction from the first portion, and a connecting portion connecting an end of the first portion and an end of the second portion, wherein when a first imaginary line including the inner edge of the first portion and a second imaginary line including the inner edge of the second portion are imagined, the inner edge of the connecting portion is located on the side opposite the center of the main surface with respect to the first imaginary line, or on the side opposite the center of the main surface with respect to the second imaginary line.

[0006] The present invention also provides a method for manufacturing a bonding member, the method comprising: a preparation step of preparing a first metal foil and a second metal foil overlapping the first metal foil; and a joining step of forming a bonding portion by joining an outer edge of the first metal foil and an outer edge of the second metal foil by a laser, the inner edge being an edge located on the center side of a main surface of the first metal foil among the edges of the bonding portion, the first portion being a portion of the bonding portion where the inner edge is linear, and the second portion being a portion of the bonding portion where the inner edge is linear and extends in a different direction from the first portion, When a portion connecting an end of one portion and an end of the second portion is defined as a connecting portion, and a first imaginary line including the inner peripheral edge of the first portion and a second imaginary line including the inner peripheral edge of the second portion are imagined, the joining step joins the outer edge of the first metal foil and the outer edge of the second metal foil so that the inner peripheral edge of the connecting portion is located on the opposite side of the center of the main surface with respect to the first imaginary line, or the opposite side of the center of the main surface with respect to the second imaginary line. Effect of the Invention

[0007] The heat generated when joining the metal foils is not easily transferred to the electronic components. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is a perspective view of an electronic component package. [Diagram 2] FIG. 2 is a partially enlarged view of the electronic component package. [Diagram 3] FIG. 3 is a flowchart of a method for manufacturing an electronic component package. [Figure 4] FIG. 4 is an explanatory diagram of a method for manufacturing an electronic component package. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] <One embodiment of an electronic component package and a method for manufacturing the same> An embodiment of an electronic component package and a method for manufacturing the same will be described below. Note that the drawings are schematic diagrams for ease of understanding, and components may be enlarged or omitted. Therefore, the dimensional ratios of the components may differ from the actual ones.

[0010] (Overall structure) As shown in FIG. 1, an electronic component package 10 includes a first metal foil 11 and a second metal foil 12. The first metal foil 11 and the second metal foil 12 are made of a plastic.

[0011] The first metal foil 11 is a substantially rectangular foil. The material of the first metal foil 11 is stainless steel. The first metal foil 11 has a main surface MF. The main surface MF is one of the surfaces of the first metal foil 11 that has the largest area.

[0012] The first metal foil 11 has a first bonding portion 11A and a first non-bonding portion 11B. The first bonding portion 11A is a portion of the first metal foil 11 that is bonded to the second metal foil 12. The first bonding portion 11A extends over the entire outer edge of the first metal foil 11. That is, the first bonding portion 11A is an annular shape of a substantially rectangular shape. In the following, the edge of the first bonding portion 11A that is located on the center side of the main surface MF of the first metal foil 11 is referred to as the inner peripheral edge 14. The edge of the first bonding portion 11A that is located on the opposite side of the center of the main surface MF with respect to the inner peripheral edge 14 when viewed in a direction perpendicular to the main surface MF is referred to as the outer peripheral edge 15. The shape of the inner peripheral edge 14 is generally substantially rectangular. The outer peripheral edge 15 coincides with the outer edge of the first metal foil 11. Therefore, the shape of the outer peripheral edge 15 is rectangular.

[0013] The first non-bonded portion 11B is a portion of the first metal foil 11 that is not bonded to the second metal foil 12. In other words, the first non-bonded portion 11B is a portion of the first metal foil 11 that is surrounded by the inner peripheral edge 14 of the first bonding portion 11A. Therefore, the first non-bonded portion 11B has a substantially rectangular planar shape. The first non-bonded portion 11B can be separated from the second metal foil 12. The center of the first non-bonded portion 11B coincides with the center of the main surface MF of the first metal foil 11.

[0014] As shown in FIG. 1, the second metal foil 12 is a foil having a substantially rectangular shape. The material of the second metal foil 12 is stainless steel. The second metal foil 12 has a second joint portion 12A and a second non-joining portion 12B. The second joint portion 12A is a portion of the second metal foil 12 that is joined to the first metal foil 11. The second joint portion 12A extends over substantially the entire outer edge portion of the second metal foil 12. That is, the second joint portion 12A is an annular shape having a substantially rectangular shape. The shape of the second joint portion 12A is the same as that of the first joint portion 11A. Therefore, the shape of the inner peripheral edge 14 of the second joint portion 12A is substantially rectangular. The shape of the outer peripheral edge 15 of the second joint portion 12A is also rectangular.

[0015] The second non-bonded portion 12B is a portion of the second metal foil 12 that is not bonded to the first metal foil 11. In other words, the second non-bonded portion 12B is a portion of the second metal foil 12 that is surrounded by the inner peripheral edge 14 of the second bonding portion 12A. The second non-bonded portion 12B is separable from the first metal foil 11. The shape of the second non-bonded portion 12B is similar to that of the first non-bonded portion 11B.

[0016] With the above-described configuration, the electronic component package 10 has a sealed space defined by the first metal foil 11 and the second metal foil 12. Although not shown in FIG 1, the electronic component package 10 stores a predetermined electronic component EC in the sealed space.

[0017] The first metal foil 11 and the second metal foil 12 are welded in a joining step S11 described later. Therefore, the first joint portion 11A is a portion where the first metal foil 11 is melted. The second joint portion 12A is a portion where the second metal foil 12 is melted. The first joint portion 11A and the second joint portion 12A are joined together to form an integrated body. Therefore, a clear boundary may not be observed between the first joint portion 11A and the second joint portion 12A.

[0018] In the following, the integral body of the first bonding portion 11A and the second bonding portion 12A is referred to as the bonding portion 13. The inner peripheral edge 14 of the first bonding portion 11A and the second bonding portion 12A will be described as the inner peripheral edge 14 of the bonding portion 13. Similarly, the outer peripheral edge 15 of the first bonding portion 11A and the second bonding portion 12A will be described as the outer peripheral edge 15 of the bonding portion 13. Therefore, the bonding portion 13 is the portion where the outer peripheral portion of the first metal foil 11 and the outer peripheral portion of the second metal foil 12 are bonded. The material of the bonding portion 13 is the same as the material of the first metal foil 11 and the material of the second metal foil 12.

[0019] (Regarding the shape of the joint) As described above, the first bonding portion 11A and the second bonding portion 12A are bonded to each other to form the bonding portion 13. Therefore, hereinafter, the shapes of the first bonding portion 11A and the second bonding portion 12A will be described as the shape of the bonding portion 13.

[0020] As shown in FIG. 1, the joint portion 13 includes a pair of first portions P1, a pair of second portions P2, and four connecting portions P3. The first portion P1 is a portion extending along any side of the first metal foil 11 in plan view. In the first portion P1, the inner peripheral edge 14 and the outer peripheral edge 15 extend substantially parallel to each other. Therefore, the first portion P1 has a long and narrow rectangular shape in plan view. Here, as shown in FIG. 2, the shortest distance from any point on the outer peripheral edge 15 to the inner peripheral edge 14 is defined as the width dimension W of the joint 13. As described above, since the inner peripheral edge 14 and the outer peripheral edge 15 of the first portion P1 are parallel to each other, the width dimension W of the first portion P1 is substantially the same throughout the first portion P1.

[0021] 1, the pair of first portions P1 are along two sides of the first metal foil 11 that extend substantially parallel to each other in a plan view. Therefore, the pair of first portions P1 extend substantially parallel to each other. However, each of the first portions P1 does not reach any of the four corners of the first metal foil 11.

[0022] The second portion P2 is a portion that extends along one of the sides of the first metal foil 11 in plan view where the first portion P1 is not provided. In the second portion P2, the inner peripheral edge 14 and the outer peripheral edge 15 extend substantially parallel to each other. Therefore, the second portion P2 has a long and narrow rectangular shape in plan view. As described above, since the inner peripheral edge 14 and the outer peripheral edge 15 of the second portion P2 are parallel to each other, the width dimension W of the second portion P2 is substantially constant throughout the second portion P2. Moreover, the width dimension W of the second portion P2 is substantially equal to the width dimension W of the first portion P1.

[0023] The pair of second portions P2 are two sides of the first metal foil 11 that extend substantially parallel to each other in a plan view, and are along two sides on which the first portion P1 is not provided. Therefore, the pair of second portions P2 extend substantially parallel to each other. However, each of the second portions P2 does not reach any of the four corners of the first metal foil 11.

[0024] Reflecting the above-described arrangement of the first portion P1 and the second portion P2, the inner peripheral edge 14 and the outer peripheral edge 15 of the first portion P1 extend in directions different from those of the inner peripheral edge 14 and the outer peripheral edge 15 of the second portion P2. Specifically, the first portion P1 and the second portion P2 extend in directions that are approximately perpendicular to each other.

[0025] 2, the connecting portion P3 is a portion connecting an end of the first portion P1 and an end of the second portion P2. In other words, the connecting portion P3 is a portion of the joint 13 excluding the pair of first portions P1 and the pair of second portions P2. The connecting portion P3 is substantially L-shaped including the corners of the joint 13 in a plan view.

[0026] The four connecting portions P3 are located at the four corners of each of the overlapping metal foils. The outer peripheral edge 15 of the connecting portion P3 is shaped like two straight lines connected at a right angle, reflecting the shape of the corners of each metal foil. Meanwhile, the inner peripheral edge 14 of the connecting portion P3 is shaped like two arc-shaped curves connected together. The inner peripheral edge 14 of the connecting portion P3 will be described in detail below.

[0027] (About the inner edge of the joint) 2, a portion of the inner peripheral edge 14 of the connecting portion P3 that is connected to the first portion P1 has a convex arc shape toward the second portion P2. Also, a portion of the inner peripheral edge 14 of the connecting portion P3 that is connected to the second portion P2 has a convex arc shape toward the first portion P1.

[0028] Here, a first imaginary straight line L1 and a second imaginary straight line L2 are imaginary straight lines including specific sides of the inner peripheral edge 14 of the joint portion 13. The first imaginary straight line L1 is a straight line including the inner peripheral edge 14 of the first portion P1. The second imaginary straight line L2 is a straight line including the inner peripheral edge 14 of the second portion P2. The first imaginary straight line L1 and the second imaginary straight line L2 are perpendicular to each other. Note that in FIG. 2, each imaginary straight line is shown as a dashed line segment. Also, for convenience, in FIG. 2, each imaginary straight line and the inner peripheral edge 14 are shown not to overlap with each other.

[0029] The inner peripheral edge 14 of the connecting portion P3 is located on the opposite side of the center of the main surface MF with respect to the first virtual straight line L1, or on the opposite side of the center of the main surface MF with respect to the second virtual straight line L2. That is, the inner peripheral edge 14 of the connecting portion P3 is located on the outer peripheral edge 15 side of the first portion P1 with respect to the first virtual straight line L1, or on the outer peripheral edge 15 side of the second portion P2 with respect to the second virtual straight line L2. In other words, the inner peripheral edge 14 of the connecting portion P3 does not exist in the region on the center side of each metal foil with respect to the first virtual straight line L1 and on the center side of each metal foil with respect to the second virtual straight line L2. In addition, among the points on the inner peripheral edge 14 of the connecting portion P3, the point closest to the outer peripheral edge 15 of the joint portion 13 is set as the specific point SP. At this time, the specific point SP is located on the outer peripheral edge 15 side of the first portion P1 with respect to the first virtual straight line L1, and on the outer peripheral edge 15 side of the second portion P2 with respect to the second virtual straight line L2.

[0030] Reflecting the shape of the inner peripheral edge 14 of the connecting portion P3 described above, the minimum width dimension Wmin of the connecting portion P3 is smaller than the minimum width dimension W of the first portion P1 and the minimum width dimension W of the second portion P2. That is, the width dimension W of the joint 13 is minimum within the range of the connecting portion P3. In this embodiment, the width dimension W of the connecting portion P3 is the minimum width dimension Wmin at the specific point SP described above. The minimum width dimension Wmin of the connecting portion P3 is 1 / 2 or more and 4 / 5 or less of the minimum width dimension W of the first portion P1 and the minimum width dimension W of the second portion P2.

[0031] (Production method) Next, a description will be given of a method for manufacturing the electronic component package 10. As shown in Fig. 3, the method for manufacturing the electronic component package 10 includes a preparation step S10 and a bonding step S11.

[0032] In the preparation step S10, as shown in FIG. 4, a first metal foil 11, a second metal foil 12, and an electronic component EC are prepared. The electronic component EC is, for example, a chip component such as a computing device, a battery, an inductor, a capacitor, a thermistor, or the like. In this state, the first metal foil 11 does not have a first bonding portion 11A. The second metal foil 12 does not have a second bonding portion 12A. Next, the electronic component EC is placed on the main surface of the second metal foil 12. Then, the first metal foil 11 and the second metal foil 12 are overlapped so that the first metal foil 11 and the second metal foil 12 face each other.

[0033] After the preparation step S10, the joining step S11 is performed. The outer edge of the first metal foil 11 and the outer edge of the second metal foil 12 are joined. Specifically, a laser is output to the outer edge of the first metal foil 11 to melt and weld each metal foil. At this time, the laser is controlled so that the trajectory of the laser deviates to the outside of each metal foil as it approaches the corner of each metal foil. As a result, the first metal foil 11 and the second metal foil 12 are melted into a quadrangular shape along the trajectory of the laser. At the same time, the melted surface of the first metal foil 11 and the melted surface of the second metal foil 12 are welded. The melted portion of the first metal foil 11 and the melted portion of the second metal foil 12 become a solid joint 13 due to a decrease in temperature. That is, the joint 13 that joins the outer edge of the first metal foil 11 and the outer edge of the second metal foil 12 is integrally formed.

[0034] Furthermore, by controlling the trajectory of the laser as described above, the shape of inner peripheral edge 14 of connecting portion P3 becomes a shape in which two arc-like curves are connected. Also, the shape of outer peripheral edge 15 of joint portion 13 becomes a rectangle. That is, inner peripheral edge 14 of connecting portion P3 is shaped so as to be located on the outer peripheral edge 15 side of first portion P1 with respect to the above-mentioned first virtual straight line L1, or on the outer peripheral edge 15 side of second portion P2 with respect to the second virtual straight line L2. By the above-mentioned method, electronic component package 10 is manufactured.

[0035] (Effects of this embodiment) (1) In the above embodiment, the inner peripheral edge 14 of the connecting portion P3 is located on the outer peripheral edge 15 side of the first portion P1 with respect to the first imaginary straight line L1, or on the outer peripheral edge 15 side of the second portion P2 with respect to the second imaginary straight line L2. In other words, the inner peripheral edge 14 of the connecting portion P3 is located farther from the center of each metal foil than each imaginary line. This makes it possible to suppress heat transfer from the connecting portion P3 of the joint 13 to the electronic component EC in the sealed space, even if the outer peripheral portions of the metal foils are welded with the electronic component EC disposed between the first metal foil 11 and the second metal foil 12.

[0036] (2) In the above embodiment, the specific point SP is located on the outer periphery 15 side of the first portion P1 with respect to the first imaginary straight line L1, or on the outer periphery 15 side of the second portion P2 with respect to the second imaginary straight line L2. That is, the specific point SP is located near the corners of each metal foil. When the air in the sealed space expands and a stress acts on the inner periphery 14 of the joint 13 to peel off the first metal foil 11 and the second metal foil 12, the stress tends to concentrate on the specific point SP. Therefore, if the metal foils are to peel off from each other, it is highly likely that the peeling will start from the specific point SP. Therefore, the connecting portion P3 of the joint 13 functions as a pressure release valve against the overpressure in the sealed space of the electronic component package 10. On the other hand, when the metal foils peel off from each other at the first portion P1 or the second portion P2 of the joint 13, the peeling tends to extend throughout the entire joint 13 according to the linear shape of the first portion P1 and the second portion P2. In this regard, by intentionally making the connecting portion P3 easier to peel as described above, even if peeling occurs between the metal foils, the peeling can be prevented from progressing widely.

[0037] (3) In the above embodiment, the minimum width dimension Wmin of the connecting portion P3 is smaller than the minimum width dimension W of the first portion P1 and the minimum width dimension W of the second portion P2. This makes it possible to more significantly suppress the transfer of heat from the connecting portion P3 of the joint 13 to the electronic component EC in the sealed space.

[0038] (4) In the above embodiment, the minimum width dimension Wmin of the connecting portion P3 is 1 / 2 or more and 4 / 5 or less of the minimum width dimension W of the first portion P1. When the minimum width dimension Wmin of the connecting portion P3 is 1 / 2 or more of the minimum width dimension W of the first portion P1, the strength of the joint can be ensured. When the minimum width dimension Wmin of the connecting portion P3 is 4 / 5 or less of the minimum width dimension W of the first portion P1, it is easy to suppress the transfer of heat to the electronic component EC in the sealed space. Therefore, it is preferable that the minimum width dimension Wmin of the connecting portion P3 is within the above numerical range.

[0039] <Example of change> The above embodiment can be modified as follows: The above embodiment and the following modifications can be combined with each other to the extent that no technical contradiction occurs.

[0040] The shape and material of the first metal foil 11 are not limited to the examples in the above embodiment. For example, the four corners of the first metal foil 11 may be curved. The material of the first metal foil 11 may be iron, aluminum, copper, etc. The same applies to the second metal foil 12. In addition, the material of the first metal foil 11 and the material of the second metal foil 12 do not have to be the same.

[0041] The electronic component package 10 may have a third metal foil in addition to the first metal foil 11 and the second metal foil 12. In this case, the bonding portion 13 only needs to bond the outer edges of the three metal foils together.

[0042] When viewed in a direction perpendicular to the main surface MF, the shape of the outer peripheral edge 15 of the joint portion 13 does not have to be rectangular. Also, the shape of the inner peripheral edge 14 of the joint portion 13 does not have to be substantially rectangular. For example, the inner peripheral edge 14 of the connecting portion P3 may be curved or bent into a polygonal shape. Regardless of the combination of the shape of the inner peripheral edge 14 and the shape of the outer peripheral edge 15, it is sufficient that the inner peripheral edge 14 of the connecting portion P3 is located on the outer peripheral edge 15 side of the first portion P1 with respect to the first virtual straight line L1, or on the outer peripheral edge 15 side of the second portion P2 with respect to the second virtual straight line L2.

[0043] The first portion P1 does not have to be substantially rectangular. That is, the inner periphery 14 of the first portion P1 does not have to be linear over the entire area, and may be partially curved. The same applies to the second portion P2.

[0044] The first portion P1 and the second portion P2 do not have to extend in directions perpendicular to each other. If the first portion P1 and the second portion P2 extend in different directions, the inner periphery 14 of the connecting portion P3 connecting the first portion P1 and the second portion P2 may have a configuration similar to that of the above embodiment.

[0045] The inner peripheral edge 14 of the connecting portion P3 may be located either on the outer peripheral edge 15 side of the first portion P1 with respect to the first imaginary straight line L1 or on the outer peripheral edge 15 side of the second portion P2 with respect to the second imaginary straight line L2.

[0046] The specific point SP does not have to be located on the outer peripheral edge 15 side of the first portion P1 with respect to the first virtual straight line L1 and on the outer peripheral edge 15 side of the second portion P2 with respect to the second virtual straight line L2. For example, the specific point SP may be located on the outer peripheral edge 15 side of the first portion P1 with respect to the first virtual straight line L1 and on the second virtual straight line L2.

[0047] The width dimension W of the joint 13 does not have to be minimum at the connecting portion P3. For example, the width dimension W may be substantially constant throughout the first portion P1, the second portion P2, and the connecting portion P3. The width dimension W may be minimum at a portion of the first portion P1. However, even in such a case, it is preferable that the minimum width dimension Wmin at the connecting portion P3 is smaller than the width dimension W of the boundary portion between the connecting portion P3 and the first portion P1.

[0048] The minimum width dimension Wmin of the connecting portion P3 may be smaller than 1 / 2 or larger than 4 / 5 of the minimum width dimension W of the first portion P1. Even in such a case, as long as the inner peripheral edge 14 of the connecting portion P3 is located on the outer peripheral edge 15 side of the first portion P1 with respect to the first imaginary straight line L1 or on the outer peripheral edge 15 side of the second portion P2 with respect to the second imaginary straight line L2, it is possible to prevent heat from reaching the electronic component EC in the sealed space.

[0049] In the electronic component package 10, for at least one connecting portion P3 and the first portion P1 and second portion P2 connected to the connecting portion P3, it is sufficient that the inner edge 14 of the connecting portion P3 is located on the side of the outer edge 15 of the first portion P1 with respect to the first imaginary straight line L1, or on the side of the outer edge 15 of the second portion P2 with respect to the second imaginary straight line L2.

[0050] In the preparation step S10, it is not necessary to prepare two sheets of metal foil. For example, one sheet of metal foil may be folded and overlapped and joined. In this case, it is sufficient to join the three outer edges excluding the folded side.

[0051] In the bonding step S11, the method of forming the bonded portion 13 is not limited to the above embodiment. For example, the moving speed of the laser may be increased toward the corners of the rectangular outer periphery 15 of the bonded portion 13 to be formed, thereby controlling the total amount of energy output to the corners to be reduced.

[0052] Also, for example, when the laser is aimed at a corner of the outer edge of the metal foil, the total amount of energy output from the laser may be smaller than when the laser is aimed at a straight portion of the outer edge. Specifically, when the laser is aimed at a corner of the rectangular outer edge 15 of the joint 13 to be formed by the laser, the total amount of energy output from the laser may be less than twice as large as when the laser is aimed at a straight portion of the outer edge 15.

[0053] Also, for example, the metal foils may be joined using a laser with an elliptical irradiation range. By welding the area where two ellipses intersect at the corners of the metal foils with the laser, the shape of the inner periphery 14 of the connecting portion P3 becomes a shape like two arc-shaped curves connected together.

[0054] <Additional Notes> The technical ideas that can be understood from the above-described embodiment and modified examples will be described. [1] An electronic component package comprising: a first metal foil; a second metal foil overlapping the first metal foil; and a joint portion where an outer edge of the first metal foil and an outer edge of the second metal foil are joined, wherein when an edge of the joint portion that is located toward the center of a main surface of the first metal foil is defined as an inner edge, the joint portion comprises: a first portion where the inner edge is straight; a second portion where the inner edge is straight and extends in a different direction from the first portion; and a connecting portion connecting an end of the first portion and an end of the second portion, wherein when a first imaginary line including the inner edge of the first portion and a second imaginary line including the inner edge of the second portion are imagined, the inner edge of the connecting portion is located on the opposite side of the first imaginary line from the center of the main surface or the opposite side of the second imaginary line from the center of the main surface.

[0055] [2] The electronic component package according to [1], wherein when an edge of the joint portion that is located on the opposite side of the center of the main surface from the inner peripheral edge is defined as an outer peripheral edge, and a point on the inner peripheral edge of the connecting portion that is closest to the outer peripheral edge is defined as a specific point, the specific point is located on the outer peripheral edge side of the first part with respect to the first imaginary line, and on the outer peripheral edge side of the second part with respect to the second imaginary line.

[0056] [3] The electronic component package according to [1] or [2], wherein the edge of the joint portion that is located on the opposite side of the center of the main surface from the inner peripheral edge is defined as the outer peripheral edge, and the shortest distance from any point on the outer peripheral edge to the inner peripheral edge of the joint portion is defined as the width dimension of the joint portion, the minimum width dimension of the connecting portion is smaller than the minimum width dimension of the first portion and the minimum width dimension of the second portion.

[0057] [4] The electronic component package according to [3], wherein the minimum width dimension of the connecting portion is between 1 / 2 and 4 / 5 of the minimum width dimension of the first portion. [5] A method for manufacturing an electronic component package, comprising: a preparation step of preparing a first metal foil and a second metal foil overlapping the first metal foil; and a joining step of forming a joint by laser joining an outer edge portion of the first metal foil and an outer edge portion of the second metal foil, wherein an edge of the joint portion that is located toward the center of a main surface of the first metal foil is defined as an inner peripheral edge, a portion of the joint portion where the inner peripheral edge is straight is defined as a first portion, a portion of the joint portion where the inner peripheral edge is straight and extends in a different direction from the first portion is defined as a second portion, a portion connecting an end of the first portion and an end of the second portion is defined as a connecting portion, and when a first imaginary line including the inner peripheral edge of the first portion and a second imaginary line including the inner peripheral edge of the second portion are imagined, in the joining step, the outer edge portion of the first metal foil and the outer edge portion of the second metal foil are joined so that the inner edge of the connecting portion is located on the opposite side of the center of the main surface with respect to the first imaginary line or the opposite side of the center of the main surface with respect to the second imaginary line. [Explanation of symbols]

[0058] 10...Package for electronic components 11…First metal foil MF: Main surface 13…Joint part 14…Inner edge 15...Outer edge P1…first part P2…Second part P3…Connection part W…Width dimension Wmin…Width dimension L1: First imaginary line L2: Second imaginary line SP…Specific point

Claims

1. A first metal foil; a second metal foil overlapping the first metal foil; a joint portion where an outer edge portion of the first metal foil and an outer edge portion of the second metal foil are joined; Equipped with When the edge of the joint portion located on the center side of the main surface of the first metal foil is defined as the inner peripheral edge, The joint is A first portion having a straight inner periphery; a second portion, the inner periphery of which is linear and extends in a direction different from that of the first portion; a connecting portion connecting an end of the first portion and an end of the second portion; Equipped with When a first virtual straight line including the inner circumferential edge of the first portion and a second virtual straight line including the inner circumferential edge of the second portion are imagined, The inner peripheral edge of the connecting portion is located on the opposite side of the center of the main surface with respect to the first virtual straight line, or on the opposite side of the center of the main surface with respect to the second virtual straight line. Package for electronic components.

2. When an edge of the joint portion that is located on the opposite side of the center of the main surface with respect to the inner peripheral edge is defined as an outer peripheral edge, and a point on the inner peripheral edge of the connecting portion that is closest to the outer peripheral edge is defined as a specific point, The specific point is located on the outer periphery side of the first portion with respect to the first virtual line and on the outer periphery side of the second portion with respect to the second virtual line.

2. The electronic component package of claim 1.

3. When an edge of the joint portion that is located on the opposite side of the center of the main surface with respect to the inner peripheral edge is defined as an outer peripheral edge, and the shortest distance from any point on the outer peripheral edge to the inner peripheral edge of the joint portion is defined as a width dimension of the joint portion, The minimum width dimension of the connecting portion is smaller than the minimum width dimension of the first portion and the minimum width dimension of the second portion.

2. The electronic component package of claim 1.

4. The minimum width dimension of the connecting portion is equal to or greater than 1 / 2 and equal to or less than 4 / 5 of the minimum width dimension of the first portion.

4. The electronic component package according to claim 3.

5. A preparation step of preparing a first metal foil and a second metal foil overlapping the first metal foil; a joining step of forming a joint by joining an outer edge portion of the first metal foil and an outer edge portion of the second metal foil by a laser; Equipped with An edge of the joint portion that is located on the center side of the main surface of the first metal foil is defined as an inner peripheral edge, Of the joints, A portion of the inner circumferential edge that is linear is defined as a first portion, a second portion of the inner circumferential edge that is linear and extends in a direction different from that of the first portion; a portion connecting an end of the first portion and an end of the second portion is a connecting portion; When a first virtual straight line including the inner circumferential edge of the first portion and a second virtual straight line including the inner circumferential edge of the second portion are imagined, In the joining step, the outer edge portion of the first metal foil and the outer edge portion of the second metal foil are joined together such that the inner peripheral edge of the connecting portion is located on the opposite side of the center of the main surface with respect to the first virtual straight line, or on the opposite side of the center of the main surface with respect to the second virtual straight line. A method for manufacturing packages for electronic components.

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