Substrate processing apparatus, substrate processing method, and article manufacturing method

Abstract

To provide technique advantageous for improving maintainability of a substrate processing apparatus.SOLUTION: A substrate processing apparatus comprises: an air-tight container; a pressure reduction mechanism that reduces the pressure inside the air-tight container; a holding unit that is arranged inside the air-tight container and holds a substrate; a side wall member that is arranged inside the air-tight container to surround the side faces of the substrate held by the holding unit; and a cover that is arranged inside the air-tight container and arranged on the side wall member to face the principal surface of the substrate held by the holding unit. The cover has a first member, and a second member that is a different body from the first member. The first end of the first member on a leading end side in a first direction intersecting the vertical direction, and the second end of the second member on the leading end side in a second direction on the opposite side of the first direction, overlap each other in the vertical direction.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to a substrate processing apparatus, a substrate processing method, and a method for manufacturing an article. [Background technology]

[0002] When manufacturing articles such as a panel (organic EL panel) having an OLED (organic light emitting diode), which is an organic EL (electroluminescence) element, there is a known method of applying a solution film to a desired location on a substrate using an inkjet device. The solution film is a film composed of a solution containing a solute and a solvent. A film (layer) is formed on the substrate by drying the solution film applied on the substrate. A reduced pressure drying device, which is a substrate processing device, is used to dry the solution film.

[0003] Patent Document 1 discloses a method of arranging a current plate (cover) at a position facing the solution film applied to the substrate and aligning the evaporation rate of the solvent to thereby achieve a uniform film shape.

[0004] On the other hand, large displays are becoming more popular in the market and display screens are becoming larger, so there is a demand for equipment capable of manufacturing large panels. As panel sizes increase, covers also need to become larger to match the panels. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2014-199806 A Summary of the Invention [Problem to be solved by the invention]

[0006] However, when the cover becomes large, the weight of the cover also increases, and this results in a decrease in maintainability of the substrate processing apparatus, such as requiring a lot of time for maintenance.

[0007] Therefore, the present disclosure provides a technique that is advantageous for improving the maintainability of a substrate processing apparatus. [Means for solving the problem]

[0008] One aspect of the present disclosure is a substrate processing apparatus comprising: an airtight container; a pressure reduction mechanism for reducing the pressure inside the airtight container; a holding portion disposed inside the airtight container for holding a substrate; a sidewall member disposed inside the airtight container so as to surround a side surface of the substrate held by the holding portion; and a cover disposed inside the airtight container and on the sidewall member so as to face a main surface of the substrate held by the holding portion, wherein the cover has a first member and a second member separate from the first member, and a first end portion on a tip side of the first member in a first direction intersecting with a vertical direction and a second end portion on a tip side of the second member in a second direction opposite to the first direction overlap in the vertical direction. Effect of the Invention

[0009] According to the present disclosure, a technique is provided that is advantageous for improving the maintainability of a substrate processing apparatus. [Brief description of the drawings]

[0010] [Figure 1] 1 is a schematic cross-sectional view showing a configuration of a reduced-pressure drying apparatus as an example of a substrate processing apparatus according to a first embodiment. [Diagram 2] 1(a) and 1(b) are cross-sectional views showing a configuration of a part of the reduced pressure drying apparatus according to the first embodiment. [Diagram 3] 5 is a graph showing an example of pressure control in the drying process according to the first embodiment. [Figure 4] 1A is a cross-sectional view of a portion of the configuration of the reduced pressure drying apparatus according to the first embodiment, and FIG. [Diagram 5] 10(a) is a cross-sectional view of a partial configuration of a reduced pressure drying apparatus according to a second embodiment, and (b) is an explanatory view of a cover according to the second embodiment. [Figure 6] 13A is a cross-sectional view of a portion of the configuration of a reduced pressure drying apparatus according to a third embodiment, and FIG. 13B is an explanatory view of a cover according to the third embodiment. [Figure 7] 13A is a cross-sectional view of a partial configuration of a reduced pressure drying apparatus according to a fourth embodiment, and FIG. 13B is an explanatory view of a cover according to the fourth embodiment. [Figure 8] 13A is an explanatory view of a cover according to a fifth embodiment, FIG. 13B is an explanatory view of a cover according to a sixth embodiment, and FIG. 13C is an explanatory view of a cover according to a seventh embodiment. [Figure 9] FIG. 4 is a cross-sectional view of a partial configuration of a reduced pressure drying apparatus according to a comparative example. [Figure 10] FIG. 13 is a diagram showing experimental results of an example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, exemplary embodiments of the present disclosure will be described in detail with reference to the drawings. In each drawing, the same reference numerals are used for the same components, and duplicated descriptions will be omitted. In the following embodiments, directions are indicated by an XYZ coordinate system, which is an orthogonal coordinate system. In the XYZ coordinate system, the XY plane is a horizontal plane, the Z direction is the up-down direction, and the negative direction of the Z axis is the vertical direction (gravity direction).

[0012] First Embodiment 1 is a schematic cross-sectional view showing the configuration of a reduced-pressure drying apparatus 100, which is an example of a substrate processing apparatus according to the first embodiment. The reduced-pressure drying apparatus 100 is used in a part of a process for manufacturing an organic EL panel having an OLED, which is an organic EL element. That is, the reduced-pressure drying apparatus 100 forms an organic film on the substrate S by performing a drying process for drying a solution film F applied to the substrate S.

[0013] The solution film F is composed of, for example, a solution containing a solute and a solvent for forming an organic film. The solvent contained in the solution film F preferably has a property that evaporation is promoted in a reduced pressure environment lower than atmospheric pressure (1 atm). Evaporation of the solvent is preferably promoted, for example, at a temperature higher than room temperature (25° C.).

[0014] The solvent is preferably an organic solvent. The solvent contains at least one kind of organic solvent. Examples of the organic solvent include N,N-dimethylformamide, N,N-dimethylacetamide, N-methylpyrrolidone, 1,3-dimethyl-2-imidazolidinone, diethylene glycol monomethyl ether, cyclohexanone, N,N-dimethylisobutyramide, N-methylformamide, N-methylacetamide, N-diethylformamide, cyclohexanol, ethylene glycol, ethylene glycol diglycidyl ether, 1,3-octylene glycol, diethylene glycol, dipropylene glycol, triethylene glycol, tripropylene glycol, 1,3-butanediol, 1,4-butanediol, propylene glycol ... Examples of the ethylene glycol monoethyl ether include ethylene glycol, hexylene glycol, propylene glycol monomethyl ether, ethylene glycol monobutyl ether, diethylene glycol diethyl ether, diethylene glycol dimethyl ether, ethylene glycol monoethyl ether acetate, ethylene glycol monobutyl ether acetate, dipropylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether, diacetone alcohol, γ-butyrolactone, ethyl lactate, N-hexyl acetate, ethyl cellosolve acetate, and cyclohexylbenzene.

[0015] The organic film is an organic layer, and is, for example, any one of a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer of an OLED. The manufacture of an organic EL element includes a process of forming each of the organic films, ie, the hole injection layer, the hole transport layer, the light emitting layer, the electron transport layer, and the electron injection layer, on a substrate S. The solution film F is applied to a required location on the substrate S by a coating device before the substrate S is carried into the reduced pressure drying device 100.

[0016] The reduced pressure drying apparatus 100 includes an airtight container 10, a decompression mechanism 30 that reduces the pressure inside the airtight container 10, and a substrate holding unit 20 that is a holding unit that is disposed inside the airtight container 10 and is capable of holding a substrate S. The reduced pressure drying apparatus 100 also includes a cover unit 400 that is disposed inside the airtight container 10 at a position that surrounds the substrate S held by the substrate holding unit 20. The cover unit 400 is disposed at a position that does not contact the substrate S held by the substrate holding unit 20.

[0017] The pressure of the external environment of the airtight container 10 is atmospheric pressure, for example, 1 atmosphere. The airtight container 10 is a member that defines an internal space SP0. The internal space SP0 includes a space SP2 surrounded by the cover unit 400 and a space SP1 other than the space SP2. In the first embodiment, the space SP2 is a space surrounded by the substrate holding part 20 and the cover unit 400. The space SP2 inside the cover unit 400 and the space SP1 outside the cover unit 400 are in communication with each other, but by surrounding the substrate S with the cover unit 400, the pressure distribution in the space SP2 is adjusted to be as uniform as possible.

[0018] The reduced pressure drying apparatus 100 also includes a gate valve 12 provided in the airtight container 10. The substrate S coated with the solution film F to be dried is carried from an external space (e.g., another airtight container) of the airtight container 10 into the internal space SP0 through the gate valve 12. The substrate S that has undergone the drying process is carried out from the internal space SP0 to an external space (e.g., another airtight container) through the gate valve 12. The substrate S is carried in and out by a transport device (not shown) placed outside the airtight container 10.

[0019] An exhaust port 11 is formed at the top of the airtight container 10. An exhaust duct is connected to the exhaust port 11, and by operating the decompression mechanism 30, the gas in the internal space SP0 of the airtight container 10 is exhausted through the exhaust duct, and the internal space SP0 of the airtight container 10 can be decompressed. The decompression mechanism 30 includes at least one pump, for example, a plurality of pumps. The plurality of pumps includes at least one of, for example, a dry pump and a diaphragm vacuum pump. The plurality of pumps may also include at least one of, for example, a turbo molecular pump, a cryopump, a sorption pump, an oil diffusion pump, a mechanical booster pump, an ejector pump, and an oil rotary vacuum pump.

[0020] The reduced pressure drying apparatus 100 further includes a temperature control unit 60. The temperature control unit 60 controls the temperature of the substrate S or the solution film F on the substrate S by controlling the temperature of the substrate holding unit 20. The temperature control unit 60 preferably includes a heater that heats the substrate holding unit 20.

[0021] Furthermore, the temperature control unit 60 may include a cooler that cools the substrate holding unit 20. The temperature control unit 60 controls the temperature of the substrate holding unit 20 by performing at least one of heating and cooling on the substrate holding unit 20.

[0022] The temperature control unit 60 controls the multiple regions of the substrate holding unit 20 to the same temperature or different temperatures so that the substrate S has a uniform temperature distribution. Preferably, the temperature control unit 60 controls the temperature difference between the multiple regions of the substrate S held by the substrate holding unit 20 to within 10°C. More preferably, the temperature control unit 60 controls the temperature difference between the multiple regions of the substrate S held by the substrate holding unit 20 to within 5°C. The temperature control unit 60 controls the temperature of the substrate holding unit 20 so that the temperature of the substrate S becomes a predetermined temperature within a range from 0°C to 100°C. By heating the substrate holding unit 20, the drying speed of the solution film F applied on the substrate S can be improved.

[0023] The cover unit 400 is disposed on the substrate holder 20. The main material of the cover unit 400 is metal. The metal is preferably, for example, stainless steel or aluminum. The stainless steel is preferably, for example, austenitic stainless steel containing 0.045% or less phosphorus and 0.030% or less sulfur (i.e., stainless steel designated as SUS304 in the Japanese Industrial Standards: JIS).

[0024] 2(a) and 2(b) are cross-sectional views of a portion of the configuration of the reduced pressure drying apparatus 100 according to the first embodiment. Fig. 2(a) is a cross-sectional view of the cover unit 400 and the members surrounding the cover unit 400 along the XY plane, viewed in the negative direction of the Z axis. Fig. 2(b) is a cross-sectional view of the cover unit 400 and the members surrounding the cover unit 400 along the YZ plane, viewed in the negative direction of the X axis.

[0025] The cover unit 400 includes an enclosing wall 43 and a cover 40. The cover 40 is separate from the enclosing wall 43. The enclosing wall 43 is movable in the Z direction, which is the up and down direction, relative to the substrate holding part 20 by a lifting mechanism (not shown). Note that instead of the lifting mechanism, an opening through which the substrate S can be loaded and unloaded may be provided in the enclosing wall 43, and a shutter for opening and closing the opening may be disposed.

[0026] The surrounding wall 43 is an example of a sidewall member. The surrounding wall 43 is a member that supports the cover 40, and is placed on the substrate holding part 20 and disposed at a position that can face the side surface SS of the substrate S placed on the substrate holding part 20. The surrounding wall 43 may be placed on another member.

[0027] The cover 40 is disposed at a position facing the main surface MS of the substrate S in a direction perpendicular to the upper surface of the substrate holding part 20, i.e., in the Z direction. Specifically, the cover 40 is disposed at a position facing the solution film F applied on the main surface MS of the substrate S in the Z direction. The cover 40 is disposed on the surrounding wall 43. That is, the cover 40 is placed on an upper end 431 of the surrounding wall 43. The upper end 431 of the surrounding wall 43 is formed in a flange shape capable of supporting the outer periphery of the cover 40. The cover 40 may be fastened to the surrounding wall 43 by a fastening member such as a bolt.

[0028] When the substrate S held by the substrate holding part 20 is viewed in the Z direction, i.e., when the substrate S is viewed from above, the substrate S is rectangular. The substrate S is preferably a large panel. That is, the length of each side of the substrate S (rectangle) viewed in the Z direction is preferably 2000 mm or more.

[0029] 1, the reduced pressure drying apparatus 100 includes a gas introduction part 51 that introduces an inert gas into the space SP1, and a gas introduction part 52 that introduces an inert gas into the space SP2. The gas introduction parts 51 and 52 are preferably flexible tubes, for example. A valve 53 is disposed in the gas introduction part 51. A valve 54 is disposed in the gas introduction part 52.

[0030] The gas introduction part 51 is provided penetrating the airtight container 10 and is configured to be able to supply an inert gas to the space SP1. The gas introduction part 52 is provided penetrating the airtight container 10 and the surrounding wall 43 of the cover unit 400 and is configured to be able to supply an inert gas to the space SP2.

[0031] The inert gas is, for example, nitrogen. In the first embodiment, the gas supplied from the gas introduction parts 51 and 52 to the inside of the airtight container 10 is preferably an inert gas, but may be a gas other than the inert gas as long as it has a composition different from that of the solvent of the solution film F, for example, clean dry air.

[0032] The pressure in the internal space SP0 of the airtight container 10, particularly the pressure in the space SP1, is adjusted by supplying gas to the space SP1 via the gas introduction part 51. In addition, the pressure in the internal space SP0 of the airtight container 10, particularly the pressure in the space SP2, is adjusted by supplying gas to the space SP2 via the gas introduction part 52.

[0033] The cover 40 has a plurality of openings 42. Each opening 42 is a through hole. The shape of the openings 42 may be round or linear, such as a slit. The arrangement and dimensions of the openings 42 are determined so that the solution film F applied on the substrate S is dried uniformly. For example, by making the area of ​​the openings 42 facing the portion of the solution film F on the substrate S where the drying speed is high smaller than the area of ​​the other openings 42, the drying speed of the solution film F can be adjusted to eliminate unevenness in the drying speed.

[0034] The opening area per unit area in the cover 40 is referred to as the aperture ratio. The area of ​​each opening 42 in the cover 40 is adjusted so that the aperture ratio near the periphery of the substrate S is smaller than the aperture ratio near the center of the substrate S. For example, the aperture ratio of the portion of the cover 40 facing the center of the substrate S may be set to 40 to 70%, and the aperture ratio of the portion facing the periphery of the substrate S may be set to 20 to 50%. Note that the cover 40 does not necessarily have to have the openings 42, as long as it has a configuration that allows the space SP2 and the space SP1 to communicate with each other.

[0035] The reduced pressure drying apparatus 100 further includes a control device 70 that controls each part of the entire apparatus. The control device 70 is an example of a control unit. The control device 70 is configured, for example, by a computer. The control device 70 includes a CPU, which is an example of a processor, a RAM, which is a temporary storage device, a ROM and an SSD, which are non-temporary storage devices (recording media), and an I / O, which is an interface. The non-temporary storage device stores a control program that causes the CPU of the control device 70 to control each part of the entire apparatus in a manufacturing process described later. The control device 70 controls the pressure inside the airtight container 10 by controlling the decompression mechanism 30. The control device 70 also controls the valves 53 and 54 to control the supply and stop of gas to the inside of the airtight container 10 and the flow rate of gas.

[0036] In addition to the above-mentioned configuration, the control device 70 may be configured, for example, by a PLD (Programmable Logic Device) such as an FPGA (Field Programmable Gate Array), an ASIC (Application Specific Integrated Circuit), a general-purpose or dedicated computer with a program embedded therein, or a combination of all or part of these.

[0037] Among the multiple steps in the method for manufacturing an organic EL panel, which is an example of an article, some steps including a drying step (drying process) will be described below. A solution film F is applied to a required location on the main surface of the substrate S by a coating device such as an inkjet device. Then, the substrate S on which the solution film F has been applied is carried into the space SP2 inside the cover unit 400 by a transport device (not shown). Then, under the control of the control device 70, a drying process is performed to dry the solution film F on the substrate S, that is, to evaporate the solvent of the solution film F. The drying process may include multiple drying steps. The control device 70 controls the decompression mechanism 30 in each drying step.

[0038] The reduced pressure drying apparatus 100 is capable of performing a drying process for drying a solvent applied onto the substrate S, and the drying process will be specifically described below. Fig. 3 is a graph showing an example of pressure control in the drying process according to the first embodiment. The horizontal axis in Fig. 3 represents time, and the vertical axis represents the pressure in the internal space SP0. In the example in Fig. 3, the multiple drying processes are four drying processes D1 to D4, but the number of drying processes is not limited to four.

[0039] The reduced pressure drying apparatus 100 further includes a pressure gauge (not shown) that detects the pressure in the internal space SP0 of the airtight container 10. The pressure gauge (not shown) is disposed, for example, in the airtight container 10. The control device 70 controls the decompression mechanism 30 so that the pressure in the internal space SP0, i.e., the value of the pressure detected by the pressure gauge (not shown), approaches a pressure command value.

[0040] First, the control device 70 controls the decompression mechanism 30 so that the pressure of the internal space SP0 of the airtight container 10, i.e., the pressure indicated by a pressure gauge not shown, drops from atmospheric pressure (1 atm) to the first pressure P1 (drying process D1). As a result, the inside of the airtight container 10 is decompressed to the first pressure P1. The drying process D1 is a process of decompressing from atmospheric pressure to the first pressure P1. The first pressure P1 is a pressure lower than the atmospheric pressure and higher than a predetermined pressure (for example, the vapor pressure of the solvent). The first pressure P1 depends on the vapor pressure of the solvent, but is, for example, 10 Pa. Then, after the pressure indicated by the pressure gauge not shown reaches the first pressure P1, the control device 70 controls the decompression mechanism 30 so that the pressure of the internal space SP0, i.e., the pressure indicated by the pressure gauge not shown, is maintained at the first pressure P1 for a first time (drying process D2). The drying processes D1 and D2 correspond to a first process.

[0041] In the drying step D2, the control device 70 controls the pressure reducing mechanism 30 to operate and supply the inert gas from the gas introduction part 51 to the space SP1 so that the pressure indicated by the pressure gauge exceeds the vapor pressure of the solvent, i.e., becomes the first pressure P1. Note that the inert gas may be supplied from the gas introduction part 51 to the space SP1 not only in the drying step D2 but also in any of the other drying steps D1, D3, and D4, for example, in the drying step D4. Note that in the drying steps D1 and D2, the introduction of the inert gas from the gas introduction part 52 is stopped.

[0042] In order to uniformly adjust the pressure distribution around the substrate S, that is, to uniformly adjust the evaporation rate of the solvent of the solution film F on the substrate S, in the first embodiment, the substrate S is surrounded by a cover unit 400. When the solvent evaporates from the solution film F, the solvent vapor temporarily stays in the space SP2 surrounded by the cover unit 400. Then, the solvent vapor flows from the space SP2 to the space SP1 through the opening 42. The vapor that has flowed into the space SP1 is exhausted by the pressure reducing mechanism 30 through an exhaust duct connected to the exhaust port 11 of the airtight container 10.

[0043] In the drying step D2, the pressure in the internal space SP0 is maintained at the first pressure P1, so that the solution film F is dried uniformly. That is, the solution film F can be dried so that the thickness of the solution film F is uniform. Therefore, the surface of the solution film F can be made flat. In addition, a plurality of openings 42 are formed in the cover unit 400. In the drying step D2, the size and number of the openings 42 are adjusted so that the pressure distribution in the space SP2 is uniform while the pressure in the space SP2 is maintained at a predetermined pressure. Therefore, the pressure in the space SP2 is finely adjusted, and the solution film F can be dried uniformly more effectively. The shape of the solution film F is roughly determined by the time of the drying step D2.

[0044] The gas introduction unit 51 supplies an inert gas to the space SP1 so that the pressure of the internal space SP0 of the airtight container 10 exceeds a predetermined pressure in the drying step D2. Here, in the first embodiment, the predetermined pressure is the vapor pressure of the solvent contained in the solution film F, but the predetermined pressure may be a pressure different from the vapor pressure of the solvent contained in the solution film F as long as the predetermined pressure is a value based on the vapor pressure of the solvent contained in the solution film F. For example, in order to make the film thickness of the solution film F more stable and flat, the predetermined pressure may be a pressure slightly higher than the vapor pressure of the solvent contained in the solution film F. Also, the gas introduction unit 52 may supply an inert gas to the space SP2 in the drying step D2.

[0045] After the first time has elapsed, i.e., after the first process, the control device 70 controls the pressure reducing mechanism 30 so that the pressure in the internal space SP0 of the airtight container 10, i.e., the pressure indicated by a pressure gauge not shown, decreases from the first pressure P1 to the second pressure P2 (drying process D3). As a result, the pressure inside the airtight container 10 is reduced to the second pressure P2. The drying process D3 is a process of reducing the pressure from the first pressure P1 to the second pressure P2. The second pressure P2 is a pressure lower than the first pressure P1 and a pressure lower than the vapor pressure of the solvent. The second pressure P2 depends on the vapor pressure of the solvent, but is, for example, 10 -3 After the pressure indicated by the pressure gauge (not shown) reaches the second pressure P2, the control device 70 controls the decompression mechanism 30 so that the pressure in the internal space SP0, i.e., the pressure indicated by the pressure gauge (not shown), is maintained at the second pressure P2 for a second time (drying process D4). The drying processes D3 and D4 correspond to a second process.

[0046] After the drying process D3, the solution film F on the substrate S is further dried while the pressure inside the airtight container 10 is lowered to the second pressure P2. In particular, in the drying process D4, the solution film F on the substrate S is further dried while the pressure in the internal space SP0 is maintained at the second pressure P2. As a result, a flat film is formed on the substrate S.

[0047] In the drying step D4, the gas introduction part 52 can maintain the pressure in the space SP2 at the second pressure by supplying the inert gas even when the pressure reducing mechanism 30 is operating. The inert gas output from the gas introduction part 52 can also function as a means for discharging the solvent remaining in the space SP2. The gas introduction part 51 may supply the inert gas to the space SP1 in the drying step D4.

[0048] When the drying process is completed, the control device 70 raises the cover unit 400 and controls a transport device (not shown) so that the substrate S held by the substrate holding portion 20 is transported to the outside of the airtight container 10 .

[0049] As described above, in the first embodiment, the solution film F is dried by a plurality of drying steps D1 to D4 with different pressure conditions. This allows the thickness of the film formed on the substrate S to be uniform, and also allows the drying speed of the solution film F to be uniform. For example, if the pressure of the airtight container 10 is lowered below the solvent vapor pressure in the drying step D1 to increase the drying speed of the solvent, the thickness of the film formed may not be uniform due to the intense evaporation of the solvent. On the other hand, after the drying step D3, when the film has been dried to a certain extent and the shape of the film has been roughly determined, increasing the drying speed of the solvent has little effect on the film thickness. Therefore, after the drying step D3, it is possible to lower the pressure of the airtight container 10 below the solvent vapor pressure.

[0050] Here, the cover of the comparative example will be described. FIG. 9 is a cross-sectional view of a part of the configuration of the reduced pressure drying apparatus according to the comparative example. The reduced pressure drying apparatus of the comparative example includes a cover unit 400X. The cover unit 400X has an enclosure wall 43 and a cover 40X. As described above, since the substrate S is a large panel, the cover 40X is also large. Considering convenience when performing maintenance such as wiping the inner surface of the cover unit 400X or changing the setup inside the airtight container 10, the cover 40X is configured of multiple plates rather than a single plate. That is, the cover 40X has multiple members 401X to 405X. Each of the members 401X to 405X is a flat plate member.

[0051] In the comparative example, the multiple members 401X to 405X are placed on the upper end 431 of the surrounding wall 43 so that their end faces abut against each other in the Y direction. That is, the multiple members 401X to 405X are placed on the upper end 431 of the surrounding wall 43 so that they do not overlap when viewed in the negative direction of the Z axis. When the multiple members 401X to 405X are arranged side by side on the upper end 431 of the surrounding wall 43 in this manner, a gap is generated between two adjacent members among the multiple members 401X to 405X. Such a gap may be generated due to an error in precision when the members 401X to 405X are manufactured, or due to adiabatic expansion when the cover 40X is heated. If a gap is generated between two adjacent members among the multiple members 401X to 405X, the evaporated solvent leaks from the space SP2 to the space SP1 through the gap during the above-mentioned drying process, particularly during the drying step D2. This accelerates the evaporation of the solvent on the substrate S in the vicinity of the gap, causing stripes of unevenness along the gap in the evaporation rate of the solvent on the substrate S. The unevenness in the evaporation rate of the solvent, i.e., the unevenness in the drying rate of the solution film F, affects the thickness of the film formed on the substrate S.

[0052] In the first embodiment, as described above, since the substrate S is a large panel, the cover 40 is also large. Considering convenience in performing maintenance such as wiping the inner surface of the cover unit 400 and changing the interior of the airtight container 10, the cover 40 is configured of multiple plates rather than a single plate. That is, the cover 40 has multiple members, for example, five members 401 to 405, that are independent of one another. This improves the ease of maintenance of the reduced-pressure drying apparatus 100.

[0053] Each of the members 401-405 is a flat plate member. The thickness of each of the members 401-405 in the Z direction is preferably 10 mm or less. As described above, each of the members 401-405 is a member made of metal. The metal is preferably stainless steel or aluminum. Each of the members 401-405 has one or more openings 42 formed therein.

[0054] Fig. 4(a) is a cross-sectional view of a portion of the configuration of the reduced pressure drying apparatus 100 according to the first embodiment. Fig. 4(a) is a cross-sectional view of the cover unit 400 and the members surrounding the cover unit 400 along the YZ plane, viewed in the negative direction of the X axis.

[0055] Each of the members 401-405 is a rectangular plate member in plan view, i.e., when viewed in the negative direction of the Z axis. Each of the members 401-405 is arranged on the upper end 431 of the surrounding wall 43 so that the longitudinal direction of each of the members 401-405 is parallel to the X direction and the width direction, which is the short side direction of each of the members 401-405, is parallel to the Y direction. Each of the members 401-405 is arranged on the upper end 431 of the surrounding wall 43 so that the inner wall surface of the surrounding wall 43 and the upper surface of the substrate holding part 20 can be opened or closed. That is, each of the members 401-405 arranged on the surrounding wall 43 is individually detachable.

[0056] The multiple members 401 to 405 are arranged with a shift in the Y direction so that the ends of two adjacent members overlap each other in the Z direction. The members 401, 403, and 405 are placed on an upper end 431 of the surrounding wall 43, the member 402 is placed on an end of the member 401 and an end of the member 403, and the member 404 is placed on an end of the member 403 and an end of the member 405. As a result, each of the members 401 to 405 is directly or indirectly supported by the upper end 431 of the surrounding wall 43.

[0057] Specifically, the member 401 is supported at one end in the Y direction of the member 401 and both ends in the X direction of the member 401 by the upper end 431 of the surrounding wall 43. The member 403 is supported at both ends in the X direction of the member 401 by the upper end 431 of the surrounding wall 43. The member 405 is supported at one end in the Y direction of the member 405 and both ends in the X direction of the member 405 by the upper end 431 of the surrounding wall 43. The member 402 is supported at one end in the Y direction of the member 402 by the other end in the Y direction of the member 401, and at the other end in the Y direction of the member 402 by one end in the Y direction of the member 403. The member 404 is supported at one end in the Y direction of the member 404 by the other end in the Y direction of the member 403, and at the other end in the Y direction of the member 404 by the other end in the Y direction of the member 405. The multiple members 401 to 405 may be fastened together with fastening members such as bolts.

[0058] Of the multiple members 401 to 405, one of two members that are adjacent to each other and overlap each other may be a first member and the other may be a second member. The following description focuses on the two members 404 and 405 that overlap each other. The member 404 may be the first member and the member 405 may be the second member.

[0059] Fig. 4(b) is an explanatory diagram of the cover 40 according to the first embodiment. Fig. 4(b) shows a plan view S1 and a side view S2 of the region 44 indicated by the dashed line in Fig. 4(a).

[0060] Here, a direction parallel to the Y direction is defined as the Y1 direction, and a direction parallel to the Y direction and opposite to the Y1 direction is defined as the Y2 direction. The Y1 direction is an example of a first direction, and the Y2 direction is an example of a second direction. The Y1 direction is a direction intersecting the Z direction, preferably a direction perpendicular to the Z direction. The Y2 direction is a direction intersecting the Z direction, preferably a direction perpendicular to the Z direction.

[0061] As shown in Fig. 4(b), the members 404 and 405 are arranged such that an end 4041 on the tip side in the Y1 direction of the member 404 and an end 4051 on the tip side in the Y2 direction of the member 405 overlap in the Z direction. Specifically, a portion of the member 404 that overlaps with the member 405 when viewed in the Z direction is the end 4041. Also, a portion of the member 405 that overlaps with the member 404 when viewed in the Z direction is the end 4051. The end 4041 is an example of a first end, and the end 4051 is an example of a second end.

[0062] In addition, a portion of the member 404 other than the end portion 4041 does not overlap with the member 405 when viewed in the Z direction. In addition, a portion of the member 405 other than the end portion 4051 does not overlap with the member 404 when viewed in the Z direction.

[0063] In this manner, in the first embodiment, the ends 4041, 4051 overlap each other in the Z direction, thereby reducing the conductance between the members 404 and 405, thereby reducing the leakage of the solvent evaporated from the solution film F on the substrate S from between the members 404, 405 into the space SP1.

[0064] The member 404 is disposed on the member 405. The member 404 is supported by the member 405 by an end 4041 of the member 404 contacting an end 4051 of the member 405 directly in the Z direction or indirectly via a member such as a seal member.

[0065] Specifically, a region 4042 included in the end portion 4041 of the lower surface of the member 404 and a region 4052 included in the end portion 4051 of the upper surface of the member 405 are in direct or indirect surface contact with each other over the entire area in the X direction.

[0066] The lower surface of the member 404 and the upper surface of the member 405 are planes parallel to the XY plane. The region 4042 is an example of at least a portion of the region included in the end portion 4041. The region 4052 is an example of at least a portion of the region included in the end portion 4051. That is, the region 4042 is a part of the lower surface of the member 404 and is a surface parallel to the horizontal plane. The region 4052 is a part of the upper surface of the member 405 and is a surface parallel to the horizontal plane.

[0067] In the first embodiment, region 4042 of end 4041 is pressed against region 4052 of end 4051 in the negative direction of the Z axis, which is the direction of gravity, by the weight of member 404. Member 404 may be fastened to member 405 by a fastening member such as a bolt.

[0068] Thus, in the first embodiment, region 4042 of end 4041 and region 4052 of end 4051 come into contact with each other, thereby further reducing the conductance between members 404 and 405, and effectively reducing the leakage of the solvent evaporated from the solution film F on the substrate S from between members 404, 405 into space SP1.

[0069] In plan view, the area A1 of the region of the member 404 overlapping with the member 405 is preferably 1% or more relative to the area A0 of the entire region of the member 404. That is, in view in the Z direction, the ratio (A1 / A0) of the area A1 of the end 4041 of the member 404 (the area of ​​the region overlapping with the member 405) relative to the entire area A0 of the member 404 is preferably 1% or more. If the ratio (A1 / A0) is below the lower limit of 1%, leakage of solvent vapor is likely to occur, and streaky drying unevenness may occur on the substrate S. That is, by having the ratio (A1 / A0) be 1% or more, the conductance between the member 404 and the member 405 is further reduced, so that leakage of solvent vapor can be effectively reduced, and the occurrence of streaky drying unevenness on the substrate S can be effectively reduced.

[0070] In addition, in plan view, the area A1 of the region of the member 404 overlapping with the member 405 is preferably 20% or less with respect to the area A0 of the entire region of the member 404. That is, the ratio (A1 / A0) is preferably 20% or less. If the ratio (A1 / A0) exceeds the upper limit of 20%, it is necessary to increase the number of members constituting the cover 40 or increase the area of ​​the members constituting the cover 40 in order to cover the upper part of the substrate S with the cover 40, and as a result, the weight of the entire cover 40 increases, and the amount of bending of the cover 40 may increase. If the cover 40 bends, the distance between the substrate S and the cover 40 may become non-uniform within the surface of the substrate S, and the controllability of the evaporation rate of the solvent may decrease. If the controllability of the evaporation rate of the solvent decreases, the thickness of the film formed on the substrate S may become non-uniform within the surface of the substrate S, and the quality of the film may become non-uniform within the surface of the substrate S. That is, by having the ratio (A1 / A0) be 20% or less, the amount of bending of the cover 40 is reduced, and as a result, the thickness of the film formed on the substrate S becomes uniform within the surface of the substrate S, and the quality of the film formed on the substrate S becomes uniform within the surface of the substrate S. From the viewpoint of reducing the amount of bending of the cover 40, it is more preferable that the ratio (A1 / A0) be 10% or less.

[0071] As described above, according to the first embodiment, a technique that is advantageous for improving the maintainability of the reduced-pressure drying apparatus 100 and a technique that is advantageous for drying the solution on the substrate S are provided.

[0072] In the above-described first embodiment, the multiple members 401-405 are arranged in the Y direction so as to overlap each other, but the present invention is not limited to this. For example, the multiple members 401-405 may be arranged in the X direction so as to overlap each other, or may be arranged in a diagonal direction intersecting the X and Y directions so as to overlap each other.

[0073] <Second embodiment> The second embodiment will be described. In the following, elements with the same reference symbols as those in the first embodiment will have substantially the same configurations and functions as those described in the first embodiment unless otherwise specified, and differences from the first embodiment will be mainly described.

[0074] Fig. 5(a) is a cross-sectional view of a portion of the configuration of the reduced-pressure drying apparatus according to the second embodiment. The reduced-pressure drying apparatus of the second embodiment is obtained by replacing the cover unit 400 with a cover unit 400A in the reduced-pressure drying apparatus 100 of the first embodiment. Therefore, the configuration of the reduced-pressure drying apparatus (substrate processing apparatus) of the second embodiment other than the cover unit 400A is similar to the configuration of the reduced-pressure drying apparatus 100 of the first embodiment other than the cover unit 400, and therefore a description thereof will be omitted. Note that Fig. 5(a) is a cross-sectional view of the cover unit 400A and the members around the cover unit 400A along the YZ plane, viewed in the negative direction of the X axis.

[0075] The cover unit 400A includes an enclosure wall 43, which is an example of a sidewall member, and a cover 40A disposed on the enclosure wall 43. The cover 40A is a separate body from the enclosure wall 43. The cover 40A is disposed at a position facing the main surface MS of the substrate S in a direction perpendicular to the upper surface of the substrate holder 20, i.e., in the Z direction. Specifically, the cover 40A is disposed at a position facing the solution film F applied on the main surface MS of the substrate S in the Z direction. The cover 40A is placed on an upper end 431 of the enclosure wall 43. The cover 40A may be fastened to the enclosure wall 43 by a fastening member such as a bolt. The cover 40A has a plurality of openings 42. Each opening 42 is a through hole.

[0076] In the second embodiment, the substrate S is a large panel, and therefore the cover 40A is also large. Considering convenience in maintenance such as wiping the inner surface of the cover unit 400A and changing the interior of the airtight container 10, the cover 40A is configured of multiple plates rather than a single plate. That is, the cover 40A has multiple members, for example five members 401A to 405A, that are independent of one another. This improves maintainability of the reduced pressure drying apparatus (substrate processing apparatus).

[0077] Each of the members 401A to 405A is a flat plate member. The thickness of each of the members 401A to 405A in the Z direction is preferably 10 mm or less. Each of the members 401A to 405A is a member made of metal. The metal is preferably stainless steel or aluminum. A plurality of openings 42 are formed in each of the members 401A to 405A.

[0078] Each of the members 401A to 405A is a rectangular plate member in plan view, i.e., when viewed in the negative direction of the Z axis. Each of the members 401A to 405A is arranged on the upper end 431 of the surrounding wall 43 so that the longitudinal direction of each of the members 401A to 405A is parallel to the X direction and the width direction, which is the short side direction of each of the members 401A to 405A, is parallel to the Y direction. Each of the members 401A to 405A is arranged on the upper end 431 of the surrounding wall 43 so as to be able to open or close the inner wall surface of the surrounding wall 43 and the upper surface of the substrate holding part 20. That is, each of the members 401A to 405A arranged on the surrounding wall 43 is individually movable.

[0079] The multiple members 401A to 405A are arranged with a shift in the Y direction so that the ends of two adjacent members overlap each other in the Z direction. The members 401A, 403A, and 405A are supported by an upper end 431 of the surrounding wall 43. The member 402A is supported by the members 401A and 403A, and the member 404A is supported by the members 403A and 405A. As a result, the members 401A to 405A are directly or indirectly supported by the upper end 431 of the surrounding wall 43. The multiple members 401A to 405A may be fastened together by fastening members such as bolts.

[0080] Among the multiple members 401A to 405A, one of two members that are adjacent to each other and overlap each other may be a first member, and the other may be a second member. The following description focuses on the two members 402A and 403A that overlap each other. The member 402A may be the first member, and the member 403A may be the second member.

[0081] Fig. 5(b) is an explanatory diagram of a cover 40A according to a second embodiment. Fig. 5(b) shows a plan view S1 and a side view S2 of an area 44 indicated by a dashed line in Fig. 5(a).

[0082] As shown in Fig. 5(b), the members 402A and 403A are arranged such that an end 4021A on the tip side in the Y1 direction of the member 402A and an end 4031A on the tip side in the Y2 direction of the member 403A overlap in the Z direction. Specifically, the part of the member 402A that overlaps with the member 403A when viewed in the Z direction is the end 4021A. Also, the part of the member 403A that overlaps with the member 402A when viewed in the Z direction is the end 4031A. The end 4021A is an example of a first end, and the end 4031A is an example of a second end.

[0083] Note that the portion of the member 402A other than the end portion 4021A does not overlap with the member 403A when viewed in the Z direction. Also, the portion of the member 403A other than the end portion 4031A does not overlap with the member 402A when viewed in the Z direction.

[0084] Thus, in the second embodiment, the ends 4021A, 4031A overlap each other in the Z direction, thereby reducing the conductance between the members 402A and 403A, thereby reducing the leakage of the solvent evaporated from the solution film F on the substrate S from between the members 402A, 403A into the space SP1.

[0085] The member 402A is disposed on the member 403A. The member 402A is supported by the member 403A by an end 4021A of the member 402A being in contact with an end 4031A of the member 403A in the Z direction directly or indirectly via a member such as a seal member.

[0086] Specifically, a region 4022A included in the end 4021A of the lower surface of the member 402A and a region 4032A included in the end 4031A of the upper surface of the member 403A are in direct or indirect surface contact over the entire X direction. The lower surface of the member 402A and the upper surface of the member 403A are planes parallel to the XY plane. The region 4022A is an example of at least a portion of the region included in the end 4021A. The region 4032A is an example of at least a portion of the region included in the end 4031A.

[0087] In the second embodiment, region 4022A of end 4021A is pressed against region 4032A of end 4031A in the negative direction of the Z axis, which is the direction of gravity, by the weight of member 402A. Member 402A may be fastened to member 403A by a fastening member such as a bolt.

[0088] Thus, in the second embodiment, region 4022A of end 4021A and region 4032A of end 4031A are in contact with each other, thereby further reducing the conductance between members 402A and 403A, and effectively reducing the leakage of the solvent evaporated from the solution film F on the substrate S from between members 402A and 403A into space SP1.

[0089] In the second embodiment, a through hole 421 which is a first through hole is formed in an end 4021A of a member 402A, and a through hole 422 which is a second through hole is formed in an end 4031A of a member 403A. Since the end 4021A of the member 402A and the end 4031A of the member 403A are overlapped in the Z direction, the through hole 422 communicates with the through hole 421. That is, the members 402A and 403A are positioned so that the through holes 421 and 422 communicate with each other.

[0090] The through holes 421, 422 are circular when viewed in the Z direction. The through hole 421 is arranged such that the central axis of the through hole 421 overlaps with the central axis C1 of the through hole 422 (the central axis C1 of the opening 42). Note that the central axes of the through holes 421, 422 may be misaligned as long as they are in communication with each other. The sizes of the through holes 421, 422 are approximately the same.

[0091] The through holes 421, 422 communicate with each other, and thus the openings 42 are formed by the through holes 421, 422. In the evaporation rate control by the multiple openings 42 formed in the cover 40A, the evaporated solvent is confined in the space SP2, so that the amount of the solvent in the space SP2 is increased to near the saturated vapor pressure, and the amount of the solvent evaporated from the solution film F on the substrate S is made uniform within the surface. At this time, the multiple openings 42 provided in the cover 40A are arranged at an appropriate distance from each other so that the evaporation rate of the solvent, that is, the drying rate of the solution film F, is uniform. In other words, by providing the through holes 421, 422 that communicate with each other at the ends 4021A, 4031A, which are the overlapping portions, the drying rate of the solution film F can be made uniform within the surface, and the solution film F can be dried uniformly within the surface.

[0092] Although the shape of the through holes 421, 422 is circular in plan view, the shape is not limited thereto and may be, for example, a square or a triangle. The sizes of the through holes 421, 422 may be different from each other, but it is preferable that the shapes are the same.

[0093] When viewed in the Z direction, the ratio (A1 / A0) of the area A1 of the end 4021A of the member 402A (the area of ​​the region overlapping with the member 403A) to the entire area A0 of the member 402A is preferably 1% or more. When the ratio (A1 / A0) is 1% or more, the conductance between the member 402A and the member 403A is further reduced, the leakage of the solvent vapor can be effectively reduced, and the occurrence of streaky drying unevenness on the substrate S can be effectively reduced.

[0094] Moreover, the ratio (A1 / A0) is preferably 20% or less. By making the ratio (A1 / A0) 20% or less, the amount of bending of the cover 40A is reduced, and as a result, the thickness of the film formed on the substrate S becomes uniform within the surface of the substrate S, and the quality of the film formed on the substrate S becomes uniform within the surface of the substrate S. From the viewpoint of reducing the amount of bending of the cover 40A, the ratio (A1 / A0) is more preferably 10% or less.

[0095] As described above, according to the second embodiment, a technique that is advantageous for improving the maintainability of the reduced-pressure drying apparatus and a technique that is advantageous for drying the solution on the substrate S are provided.

[0096] In the above-described second embodiment, the multiple members 401A-405A are arranged in the Y direction so as to overlap each other, but the present invention is not limited to this. For example, the multiple members 401A-405A may be arranged in the X direction so as to overlap each other, or may be arranged in a diagonal direction intersecting the X and Y directions so as to overlap each other.

[0097] <Third embodiment> The third embodiment will be described below. In the following, elements with the same reference symbols as those in the first or second embodiment will have substantially the same configurations and functions as those described in the first or second embodiment unless otherwise specified, and differences from the first and second embodiments will be mainly described.

[0098] Fig. 6(a) is a cross-sectional view of a portion of the configuration of a reduced-pressure drying apparatus according to the third embodiment. The reduced-pressure drying apparatus of the third embodiment is obtained by replacing the cover unit 400 with a cover unit 400B in the reduced-pressure drying apparatus 100 of the first embodiment. Therefore, the configuration of the reduced-pressure drying apparatus (substrate processing apparatus) of the third embodiment other than the cover unit 400B is similar to the configuration of the reduced-pressure drying apparatus 100 of the first embodiment other than the cover unit 400, and therefore a description thereof will be omitted. Note that Fig. 6(a) is a cross-sectional view of the cover unit 400B and the members around the cover unit 400B along the YZ plane, viewed in the negative direction of the X axis.

[0099] The cover unit 400B includes a surrounding wall 43, which is an example of a side wall member, and a cover 40B disposed on the surrounding wall 43. The cover 40B has a plurality of openings 42. Each opening 42 is a through hole.

[0100] Cover 40B is not a single plate but is made up of multiple plates. That is, cover 40B has multiple members independent of one another, for example, five members 401B to 405B. This improves the ease of maintenance of the reduced pressure drying apparatus (substrate processing apparatus).

[0101] Of the multiple members 401B to 405B, one of two members that are adjacent to each other and overlap each other may be a first member, and the other may be a second member. The following description focuses on the two members 402B and 403B that overlap each other. The member 402B may be the first member, and the member 403B may be the second member.

[0102] Fig. 6(b) is an explanatory diagram of a cover 40B according to a third embodiment. Fig. 6(b) shows a plan view S1 and a side view S2 of the region 44 indicated by the dashed line in Fig. 6(a).

[0103] As shown in Fig. 6(b), the members 402B and 403B are arranged such that an end 4021B on the tip side in the Y1 direction of the member 402B and an end 4031B on the tip side in the Y2 direction of the member 403B overlap in the Z direction. Specifically, the part of the member 402B that overlaps with the member 403B when viewed in the Z direction is the end 4021B. Also, the part of the member 403B that overlaps with the member 402B when viewed in the Z direction is the end 4031B. The end 4021B is an example of a first end, and the end 4031B is an example of a second end.

[0104] An area 4022B of the lower surface of the member 402B that is included in the end portion 4021B and an area 4032B of the upper surface of the member 403B that is included in the end portion 4031B are in direct or indirect surface contact over the entire X direction. The lower surface of the member 402B and the upper surface of the member 403B are planes parallel to the XY plane. The area 4022B is an example of at least a portion of the area included in the end portion 4021B. The area 4032B is an example of at least a portion of the area included in the end portion 4031B.

[0105] In the third embodiment, a through hole 421B, which is a first through hole, is formed in an end 4021B of a member 402B, and a through hole 422B, which is a second through hole, is formed in an end 4031B of a member 403B. Since the end 4021B of the member 402B and the end 4031B of the member 403B are overlapped in the Z direction, the through hole 422B communicates with the through hole 421B. That is, the members 402B and 403B are positioned so that the through holes 421B and 422B communicate with each other.

[0106] The through holes 421B and 422B are circular when viewed in the Z direction. The through hole 421B is arranged such that the central axis of the through hole 421B overlaps with the central axis C1 of the through hole 422B (the central axis C1 of the opening 42). Note that the central axes of the through holes 421B and 422B may be misaligned as long as they are in communication with each other.

[0107] In the third embodiment, the through holes 421B, 422B have different sizes from each other. Since the through holes 421B, 422B have a circular shape when viewed in the Z direction, the through holes 421B, 422B have different diameters from each other.

[0108] 6(a) and 6(b), through hole 421B is larger than through hole 422B. That is, the diameter of through hole 421B is larger than the diameter of through hole 422B. Note that the size relationship between through hole 421B and through hole 422B may be reversed.

[0109] The through holes 421B and 422B communicate with each other, and thus the through holes 421B and 422B form an opening 42. In the evaporation rate control using the multiple openings 42 formed in the cover 40B, the evaporated solvent is confined in the space SP2, and the amount of the solvent in the space SP2 is increased to near the saturated vapor pressure, so that the amount of the solvent evaporated from the solution film F on the substrate S is uniform within the surface. At this time, the multiple openings 42 provided in the cover 40B are arranged at an appropriate distance from each other so that the evaporation rate of the solvent, that is, the drying rate of the solution film F, is uniform. In other words, by providing the through holes 421B and 422B that communicate with each other at the ends 4021B and 4031B, which are the overlapping portions, the drying rate of the solution film F can be uniform within the surface, and the solution film F can be dried uniformly within the surface.

[0110] In addition, positional errors may occur in the through holes 421B and 422B for various reasons. In the third embodiment, the through holes 421B and 422B have different diameters, so that even if a positional error occurs in the through holes 421B and 422B, the solution film F can be dried uniformly in the plane.

[0111] For example, as shown in FIG. 6(a) and FIG. 6(b), when the through hole 421B has a larger diameter than the through hole 422B, the diameter of the through hole 421B is set with the positional deviation taken into consideration. The through hole 422B is set to an area required for the opening 42. The positional deviation is, for example, a case where the central axis of the through hole 421B is not aligned with the central axis C1 of the through hole 422B due to thermal expansion of the members 401B to 405B or a processing error of the members 401B to 405B. When a stainless steel plate with one side of 2000 mm is heated by temperature control so that the temperature is increased by 50° C. from room temperature, the thermal expansion of the stainless steel plate due to heating can be about 3 mm. The diameter of the through hole 421B is set with the positional error of the through hole 421B due to the processing error taken into consideration with respect to this thermal expansion. More specifically, when the number of the plurality of members of the cover 40B, which is a stainless steel plate, is 5, the difference in diameter between the larger through hole 421B and the smaller through hole 422B can be up to about 2 mm. The diameter of the opening functioning as the opening 42 is the diameter of the smaller through hole 422B. Even if a positional deviation occurs between the through holes 421B and 422B, the opening area of ​​the opening 42 formed by the through holes 421B and 422B does not change. As a result, even if a positional error occurs between the through holes 421B and 422B, the solution film F can be dried uniformly within the surface.

[0112] Although the shape of the through holes 421B and 422B is circular in plan view, the shape is not limited thereto and may be, for example, a square or a triangle. The sizes of the through holes 421B and 422B may be different from each other, but it is preferable that the shapes are the same.

[0113] When viewed in the Z direction, the ratio (A1 / A0) of the area A1 of the end 4021B of the member 402B (the area of ​​the region overlapping with the member 403B) to the total area A0 of the member 402B is preferably 1% or more. When the ratio (A1 / A0) is 1% or more, the conductance between the members 402B and 403B is further reduced, the leakage of solvent vapor can be effectively reduced, and the occurrence of streaky drying irregularities on the substrate S can be effectively reduced.

[0114] Moreover, the ratio (A1 / A0) is preferably 20% or less. By making the ratio (A1 / A0) 20% or less, the amount of bending of the cover 40B is reduced, and as a result, the thickness of the film formed on the substrate S becomes uniform within the surface of the substrate S, and the quality of the film formed on the substrate S becomes uniform within the surface of the substrate S. From the viewpoint of reducing the amount of bending of the cover 40B, the ratio (A1 / A0) is more preferably 10% or less.

[0115] As described above, according to the third embodiment, a technique that is advantageous for improving the maintainability of the reduced-pressure drying apparatus and a technique that is advantageous for drying the solution on the substrate S are provided.

[0116] In the above third embodiment, the multiple members 401B-405B are arranged in the Y direction so as to overlap each other, but the present invention is not limited to this. For example, the multiple members 401B-405B may be arranged in the X direction so as to overlap each other, or may be arranged in a diagonal direction intersecting the X and Y directions so as to overlap each other.

[0117] <Fourth embodiment> The fourth embodiment will be described below. In the following, elements having the same reference symbols as those in the first, second, or third embodiment will have substantially the same configurations and functions as those described in the first, second, or third embodiment unless otherwise specified, and the following mainly describes the parts that differ from the first, second, and third embodiments.

[0118] Fig. 7(a) is a cross-sectional view of a part of the configuration of the reduced pressure drying apparatus according to the fourth embodiment. It is an explanatory diagram of a cover unit 400C. The reduced pressure drying apparatus of the fourth embodiment is obtained by replacing the cover unit 400 in the reduced pressure drying apparatus 100 of the first embodiment with a cover unit 400C. Therefore, the configuration other than the cover unit 400C in the reduced pressure drying apparatus (substrate processing apparatus) of the fourth embodiment is similar to the configuration other than the cover unit 400 in the reduced pressure drying apparatus 100 of the first embodiment, and therefore the description will be omitted. Note that Fig. 7(a) is a cross-sectional view of the cover unit 400C and the members around the cover unit 400C along the YZ plane viewed in the negative direction of the X axis.

[0119] The cover unit 400C includes a surrounding wall 43, which is an example of a side wall member, and a cover 40C disposed on the surrounding wall 43. The cover 40C has a plurality of openings 42. Each opening 42 is a through hole.

[0120] Cover 40C is not a single plate but is made up of multiple plates. That is, cover 40C has multiple members, for example, five members 401C to 405C, that are independent of one another. This improves the ease of maintenance of the reduced pressure drying apparatus (substrate processing apparatus).

[0121] Among the multiple members 401C to 405C, one of two members that are adjacent to each other and overlap each other may be a first member, and the other may be a second member. The following description focuses on the two members 403C and 404C that overlap each other. The member 403C may be the first member, and the member 404C may be the second member.

[0122] Fig. 7(b) is an explanatory diagram of a cover 40C according to a fourth embodiment. Fig. 7(b) shows a plan view S1 and a side view S2 of the region 44 indicated by the dashed line in Fig. 7(a).

[0123] As shown in Fig. 7(b), the members 403C and 404C are arranged such that an end 4031C on the tip side in the Y1 direction of the member 403C and an end 4041C on the tip side in the Y2 direction of the member 404C overlap in the Z direction. Specifically, the part of the member 403C that overlaps with the member 404C when viewed in the Z direction is the end 4031C. Also, the part of the member 404C that overlaps with the member 403C when viewed in the Z direction is the end 4041C. The end 4031C is an example of a first end, and the end 4041C is an example of a second end.

[0124] Note that the portion of the member 403C other than the end portion 4031C does not overlap with the member 404C when viewed in the Z direction. Furthermore, the portion of the member 404C other than the end portion 4041C does not overlap with the member 403C when viewed in the Z direction.

[0125] Thus, in the fourth embodiment, the ends 4031C, 4041C overlap each other in the Z direction, thereby reducing the conductance between the members 403C and 404C, thereby reducing the leakage of the solvent evaporated from the solution film F on the substrate S from between the members 403C, 404C into the space SP1.

[0126] The member 403C is disposed such that an end 4031C engages with an end 4041C of the member 404C. The member 403C is supported by the member 404C by the end 4031C of the member 403C contacting the end 4041C of the member 404C directly in the Z direction or indirectly via a member such as a seal member.

[0127] The member 403C has a region 4032C which is a lower surface included in the end portion 4031C. The member 404C has a region 4042C which is an upper surface included in the end portion 4041C. The regions 4032C and 4042C are in direct or indirect surface contact over the entire X direction. The regions 4032C and 4042C are planes parallel to the XY plane. The region 4032C is an example of at least a portion of the region included in the end portion 4031C. The region 4042C is an example of at least a portion of the region included in the end portion 4041C.

[0128] In the fourth embodiment, the weight of the member 403C presses the region 4032C of the end 4031C against the region 4042C of the end 4041C in the negative direction of the Z axis, which is the direction of gravity. The member 403C may be fastened to the member 404C by a fastening member such as a bolt.

[0129] Thus, in the fourth embodiment, region 4032C of end 4031C and region 4042C of end 4041C are in contact with each other, thereby further reducing the conductance between members 403C and 404C, and effectively reducing the leakage of the solvent evaporated from the solution film F on the substrate S from between members 403C and 404C into space SP1.

[0130] In the fourth embodiment, a through hole 421C, which is a first through hole, is formed in an end 4031C of a member 403C, and a through hole 422C, which is a second through hole, is formed in an end 4041C of a member 404C. Since the end 4031C of the member 403C and the end 4041C of the member 404C are overlapped in the Z direction, the through hole 422C communicates with the through hole 421C. That is, the members 403C and 404C are positioned so that the through holes 421C and 422C communicate with each other. By the through holes 421C and 422C communicating with each other, an opening 42 is formed by the through holes 421C and 422C.

[0131] The through holes 421C and 422C are circular when viewed in the Z direction. The through hole 421C is arranged such that the central axis of the through hole 421C overlaps with the central axis C1 of the through hole 422C (the central axis C1 of the opening 42). Note that the central axes of the through holes 421C and 422C may be misaligned as long as they are in communication with each other.

[0132] In the fourth embodiment, the through holes 421C, 422C have different sizes. Since the through holes 421C, 422C have a circular shape when viewed in the Z direction, the through holes 421C, 422C have different diameters.

[0133] 7(a) and 7(b), through hole 421C is larger than through hole 422C. That is, the diameter of through hole 421C is larger than the diameter of through hole 422C. Note that the size relationship between through hole 421C and through hole 422C may be reversed.

[0134] The through holes 421C, 422C communicate with each other, and thus the openings 42 are formed by the through holes 421C, 422C. In the evaporation rate control by the multiple openings 42 formed in the cover 40C, the evaporated solvent is confined in the space SP2, and the amount of the solvent in the space SP2 is increased to near the saturated vapor pressure, and the amount of the solvent evaporated from the solution film F on the substrate S is made uniform within the surface. At this time, the multiple openings 42 provided in the cover 40C are arranged at an appropriate distance from each other so that the evaporation rate of the solvent, that is, the drying rate of the solution film F, is uniform. In other words, by providing the through holes 421C, 422C that communicate with each other at the ends 4031C, 4041C, which are the overlapping portions, the drying rate of the solution film F can be made uniform within the surface, and the solution film F can be dried uniformly within the surface.

[0135] Furthermore, positional errors may occur in the through holes 421C and 422C for various reasons. In the fourth embodiment, the through holes 421C and 422C have different diameters, so that even if a positional error occurs in the through holes 421C and 422C, the solution film F can be dried uniformly in the plane.

[0136] Although the shape of the through holes 421C and 422C is circular in plan view, the shape is not limited thereto and may be, for example, a square or a triangle. The sizes of the through holes 421C and 422C may be different from each other, but it is preferable that the shapes are the same.

[0137] In the fourth embodiment, the member 403C has a base 4035C and a protruding portion 4036C. The base 4035C is an example of a first base. The protruding portion 4036C is an example of a first protruding portion. The protruding portion 4036C is thinner than the base 4035C in the Z direction and protrudes from the base 4035C in the Y1 direction. At least a portion of the protruding portion 4036C is included in the end portion 4031C. In the fourth embodiment, a portion of the tip side of the protruding portion 4036C is included in the end portion 4031C.

[0138] The member 404C has a base 4045C and a protruding portion 4046C. The base 4045C is an example of a second base. The protruding portion 4046C is an example of a second protruding portion. The protruding portion 4046C is thinner than the base 4045C in the Z direction and protrudes from the base 4045C in the Y2 direction. At least a portion of the protruding portion 4046C is included in the end portion 4041C. In the fourth embodiment, a portion of the tip side of the protruding portion 4046C is included in the end portion 4041C.

[0139] Region 4032C is included in the lower surface of protrusion 4036C. The lower surface of protrusion 3046C is a plane parallel to the horizontal plane. Region 4042C is included in the upper surface of protrusion 4046C. The upper surface of protrusion 3046C is a plane parallel to the horizontal plane. The flat surface of protrusion 4036C and the flat surface of protrusion 3046C are in surface contact.

[0140] As described above, the engagement structure between members 403C and 404C makes it less likely for a gap to occur between ends 4031C and 4041C in the Z direction, reducing the conductance between ends 4031C and 4041C, and effectively reducing the leakage of solvent evaporated from the solution film F on substrate S from between members 403C and 404C into space SP1.

[0141] A surface 4037C of the base 4035C facing the substrate holding part 20 and a surface 4047C of the base 4045C facing the substrate holding part 20 are flush with each other. A surface 4048C of the protruding part 4046C facing the substrate holding part 20 and the surface 4047C are flush with each other. In other words, the bottom surface of the member 403C and the bottom surface of the member 404C are flush with each other.

[0142] In this way, since the surface of the cover 40C facing the substrate holding portion 20 is approximately flat, the distance between the cover 40C and the substrate S is approximately constant within the surface, and the quality of the film formed on the substrate S is uniform within the surface of the substrate S.

[0143] The protruding portion 4036C and the base portion 4045C face each other in the Y1 and Y2 directions, and there is a gap Δ1 between the protruding portion 4036C and the base portion 4045C in the Y1 and Y2 directions. The protruding portion 4046C and the base portion 4035C face each other in the Y1 and Y2 directions, and there is a gap Δ2 between the protruding portion 4046C and the base portion 4035C in the Y1 and Y2 directions. The gaps Δ1 and Δ2 can absorb thermal expansion and processing errors of the members 401C to 405C. The gaps Δ1 and Δ2 can be a maximum of 3 mm.

[0144] When viewed in the Z direction, the ratio (A1 / A0) of the area A1 of the end 4031C of the member 403C (the area of ​​the region overlapping with the member 404C) to the total area A0 of the member 403C is preferably 1% or more. When the ratio (A1 / A0) is 1% or more, the conductance between the members 403C and 404C is further reduced, the leakage of solvent vapor can be effectively reduced, and the occurrence of streaky drying irregularities on the substrate S can be effectively reduced.

[0145] Moreover, the ratio (A1 / A0) is preferably 20% or less. By making the ratio (A1 / A0) 20% or less, the amount of bending of the cover 40C is reduced, and as a result, the thickness of the film formed on the substrate S becomes uniform within the surface of the substrate S, and the quality of the film formed on the substrate S becomes uniform within the surface of the substrate S. From the viewpoint of reducing the amount of bending of the cover 40C, the ratio (A1 / A0) is more preferably 10% or less.

[0146] As described above, according to the fourth embodiment, a technique that is advantageous for improving the maintainability of the reduced-pressure drying apparatus and a technique that is advantageous for drying the solution on the substrate S are provided.

[0147] In the fourth embodiment described above, the multiple members 401C to 405C are arranged side by side in the Y direction so as to overlap each other, but the present invention is not limited to this. For example, the multiple members 401C to 405C may be arranged side by side in the X direction so as to overlap each other, or may be arranged side by side in a diagonal direction intersecting the X and Y directions so as to overlap each other.

[0148] <Fifth embodiment> The fifth embodiment will be described below. Elements with the same reference symbols as those in the first, second, third, or fourth embodiment will have substantially the same configurations and functions as those described in the first, second, third, or fourth embodiment unless otherwise specified, and differences from the first, second, third, and fourth embodiments will be mainly described.

[0149] Fig. 8(a) is an explanatory diagram of a cover 40D according to a fifth embodiment. Fig. 8(a) shows a schematic diagram of a portion of the cover 40D corresponding to the region 44 in Fig. 7(a). The cover 40D is disposed on the surrounding wall 43 shown in Fig. 7(a).

[0150] The cover 40D has a plurality of plate-like members that are independent of each other. Among the plurality of members, two adjacent members are, for example, members 403D and 404D. The member 403D can be the first member, and the member 404D can be the second member. As shown in FIG. 8(a), the members 403D and 404D are arranged such that an end 4031D on the tip side in the Y1 direction of the member 403D and an end 4041D on the tip side in the Y2 direction of the member 404D overlap in the Z direction. The end 4031D is an example of a first end, and the end 4041D is an example of a second end.

[0151] Note that the portion of the member 403D other than the end portion 4031D does not overlap with the member 404D when viewed in the Z direction. Furthermore, the portion of the member 404D other than the end portion 4041D does not overlap with the member 403D when viewed in the Z direction.

[0152] Thus, in the fifth embodiment, the ends 4031D, 4041D overlap each other in the Z direction, thereby reducing the conductance between the members 403D and 404D, thereby reducing the leakage of the solvent evaporated from the solution film F on the substrate S in FIG. 7(a) from between the members 403D, 404D into the space SP1.

[0153] The member 403D is disposed such that an end 4031D engages with an end 4041D of the member 404D. The member 403D is supported by the member 404D by the end 4031D of the member 403D contacting the end 4041D of the member 404D directly in the Z direction or indirectly via a member such as a seal member.

[0154] The member 403D has a region 4032D which is a lower surface included in the end portion 4031D. The member 404D has a region 4042D which is an upper surface included in the end portion 4041D. The region 4032D and the region 4042D are in direct or indirect surface contact over the entire X direction. The region 4032D and the region 4042D are inclined surfaces inclined with respect to the XY plane. The region 4032D is an example of at least a portion of the region included in the end portion 4031D. The region 4042D is an example of at least a portion of the region included in the end portion 4041D.

[0155] In the fifth embodiment, the regions 4032D and 4042D are inclined surfaces inclined with respect to a horizontal plane, and the inclined surfaces are in surface contact with each other. The region 4032D of the end portion 4031D is pressed against the region 4042D of the end portion 4041D in the negative direction of the Z axis, which is the direction of gravity, by the weight of the member 403D. The member 403D may be fastened to the member 404D by a fastening member such as a bolt.

[0156] Thus, in the fifth embodiment, region 4032D of end 4031D and region 4042D of end 4041D are in contact with each other, thereby further reducing the conductance between members 403D and 404D, and effectively reducing the leakage of the solvent evaporated from the solution film F on substrate S in FIG. 7(a) from between members 403D and 404D into space SP1.

[0157] In the fifth embodiment, a through hole 421D, which is a first through hole, is formed in an end 4031D of a member 403D, and a through hole 422D, which is a second through hole, is formed in an end 4041D of a member 404D. Since the end 4031D of the member 403D and the end 4041D of the member 404D are overlapped in the Z direction, the through hole 422D communicates with the through hole 421D. That is, the members 403D and 404D are positioned so that the through holes 421D and 422D communicate with each other. By the through holes 421D and 422D communicating with each other, an opening 42 is formed by the through holes 421D and 422D.

[0158] It is preferable that the through holes 421D and 422D have different sizes. In the example of Fig. 8(a), the through hole 421D is larger than the through hole 422D. The size relationship between the through holes 421D and 422D may be reversed. By providing the through holes 421D and 422D that communicate with each other at the ends 4031D and 4041D, the drying speed of the solution film F can be made uniform within the surface, and the solution film F can be dried uniformly within the surface.

[0159] In the fifth embodiment, the member 403D has a base 4035D and a protruding portion 4036D. The base 4035D is an example of a first base. The protruding portion 4036D is an example of a first protruding portion. The protruding portion 4036D is thinner than the base 4035D in the Z direction and protrudes from the base 4035D in the Y1 direction. At least a portion of the protruding portion 4036D is included in the end portion 4031D. In the fifth embodiment, a portion of the tip side of the protruding portion 4036D is included in the end portion 4031D. The protruding portion 4036D has a tapered shape that tapers toward the Y1 direction.

[0160] The member 404D has a base 4045D and a protruding portion 4046D. The base 4045D is an example of a second base. The protruding portion 4046D is an example of a second protruding portion. The protruding portion 4046D is thinner than the base 4045D in the Z direction and protrudes from the base 4045D in the Y2 direction. At least a portion of the protruding portion 4046D is included in the end portion 4041D. In the fifth embodiment, a portion of the tip side of the protruding portion 4046D is included in the end portion 4041D. The protruding portion 4046D has a tapered shape that tapers toward the Y2 direction.

[0161] Region 4032D is included in the lower surface of protrusion 4036D. The lower surface of protrusion 3046D is an inclined surface inclined with respect to the horizontal plane. Region 4042D is included in the upper surface of protrusion 4046D. The upper surface of protrusion 3046D is an inclined surface inclined with respect to the horizontal plane. The inclined surface of protrusion 4036D and the inclined surface of protrusion 3046D are in surface contact with each other.

[0162] As described above, the engagement structure between members 403D and 404D makes it less likely for a gap to occur between ends 4031D and 4041D in the Z direction, reducing the conductance between ends 4031D and 4041D, and effectively reducing the leakage of solvent evaporated from the solution film F on the substrate S from between members 403D and 404D into space SP1.

[0163] The protruding portion 4036D and the base portion 4045D face each other in the Y1 direction and the Y2 direction, and there is a gap Δ1 between the protruding portion 4036D and the base portion 4045D in the Y1 direction and the Y2 direction. The protruding portion 4046D and the base portion 4035D face each other in the Y1 direction and the Y2 direction, and there is a gap Δ2 between the protruding portion 4046D and the base portion 4035D in the Y1 direction and the Y2 direction. The gaps Δ1 and Δ2 can absorb thermal expansion and processing errors of the members 403D and 404D. The gaps Δ1 and Δ2 can be a maximum of 3 mm.

[0164] As described above, according to the fifth embodiment, a technique that is advantageous for improving the maintainability of the reduced-pressure drying apparatus and a technique that is advantageous for drying the solution on the substrate S are provided.

[0165] In the above-described fifth embodiment, the members 403D and 404D are arranged side by side in the Y direction so as to overlap each other, but the present invention is not limited to this. For example, the members 403D and 404D may be arranged side by side in the X direction so as to overlap each other, or may be arranged side by side in a diagonal direction intersecting the X direction and the Y direction so as to overlap each other.

[0166] Sixth Embodiment The sixth embodiment will be described below. Elements with the same reference symbols as those in the first, second, third, fourth, or fifth embodiment will have substantially the same configurations and functions as those described in the first, second, third, fourth, or fifth embodiment unless otherwise specified, and the following mainly describes the parts that differ from the first, second, third, fourth, and fifth embodiments.

[0167] Fig. 8(b) is an explanatory diagram of a cover 40E according to a sixth embodiment. Fig. 8(b) shows a schematic diagram of a portion of the cover 40E corresponding to the region 44 in Fig. 7(a). The cover 40E is disposed on the surrounding wall 43 shown in Fig. 7(a).

[0168] The cover 40E has a plurality of plate-like members that are independent of each other. Among the plurality of members, two adjacent members are, for example, members 403E and 404E. The member 403E can be a first member, and the member 404E can be a second member. As shown in FIG. 8(b), the members 403E and 404E are arranged such that an end 4031E on the tip side in the Y1 direction of the member 403E and an end 4041E on the tip side in the Y2 direction of the member 404E overlap in the Z direction. The end 4031E is an example of a first end, and the end 4041E is an example of a second end.

[0169] Note that the portion of the member 403E other than the end portion 4031E does not overlap with the member 404E when viewed in the Z direction. Furthermore, the portion of the member 404E other than the end portion 4041E does not overlap with the member 403E when viewed in the Z direction.

[0170] Thus, in the sixth embodiment, the ends 4031E, 4041E overlap each other in the Z direction, thereby reducing the conductance between the members 403E and 404E, thereby reducing the leakage of the solvent evaporated from the solution film F on the substrate S in FIG. 7(a) from between the members 403E, 404E into the space SP1.

[0171] The member 403E is disposed such that an end 4031E fits into an end 4041E of the member 404E. The member 403E is supported by the member 404E by the end 4031E of the member 403E being in contact with the end 4041E of the member 404E in the Z direction directly or indirectly via a member such as a seal member.

[0172] In the sixth embodiment, a through hole 421E, which is a first through hole, is formed in an end 4031E of a member 403E, and through holes 422E1 and 422E2, which are second through holes, are formed in an end 4041E of a member 404E. Since the end 4031E of the member 403E and the end 4041E of the member 404E are overlapped in the Z direction, the through holes 422E1 and 422E2 communicate with the through hole 421E. That is, the members 403E and 404E are positioned so that the through holes 421E, 422E1 and 422E2 communicate with each other. The through holes 421E, 422E1 and 422E2 communicate with each other, and thus an opening 42 is formed by the through holes 421E, 422E1 and 422E2.

[0173] It is preferable that the through-hole 421E and the through-holes 422E1 and 422E2 are different in size from each other. In the example of Fig. 8(b), the through-hole 421E is larger than the through-holes 422E1 and 422E2. The size relationship between the through-hole 421E and the through-holes 422E1 and 422E2 may be reversed. By providing the through-holes 421E, 422E1 and 422E2 that communicate with each other at the ends 4031E and 4041E, the drying speed of the solution film F can be made uniform within the surface, and the solution film F can be dried uniformly within the surface.

[0174] In the sixth embodiment, the member 403E has a base 4035E and a protruding portion 4036E. The base 4035E is an example of a first base. The protruding portion 4036E is an example of a first protruding portion. The protruding portion 4036E is thinner than the base 4035E in the Z direction and protrudes from the base 4035E in the Y1 direction. At least a portion of the protruding portion 4036E is included in the end portion 4031E. In the sixth embodiment, a portion of the tip side of the protruding portion 4036E is included in the end portion 4031E.

[0175] The member 404E has a base 4045E and two protrusions 4046E1 and 4046E2. The base 4045E is an example of a second base. Each of the protrusions 4046E1 and 4046E2 is an example of a second protrusion. The protrusions 4046E1 and 4046E2 are thinner than the base 4045E in the Z direction and protrude from the base 4045E in the Y2 direction. The protrusions 4046E1 and 4046E2 are spaced apart in the Z direction so that the protrusion 4036E is fitted between the protrusions 4046E1 and 4046E2. At least a portion of each of the protrusions 4046E1 and 4046E2 is included in the end 4041E. In the sixth embodiment, a part of the tip side of each of the protrusions 4046E1 and 4046E2 is included in the end portion 4041E.

[0176] As described above, the interlocking structure of members 403E and 404E makes it less likely for gaps to occur between ends 4031E and 4041E in the Z direction, reducing the conductance between ends 4031E and 4041E, and effectively reducing the leakage of solvent evaporated from the solution film F on the substrate S from between members 403E and 404E into space SP1.

[0177] A surface 4037E of the base 4035E facing the substrate holding part 20 and a surface 4047E of the base 4045E facing the substrate holding part 20 are flush with each other. A surface 4048E of the protruding part 4046E2 facing the substrate holding part 20 and the surface 4047E are flush with each other. In other words, the lower surface of the member 403E and the lower surface of the member 404E are flush with each other.

[0178] In this way, since the surface of cover 40E facing substrate holding portion 20 is approximately flat, the distance between cover 40E and substrate S is approximately constant within the surface, and the quality of the film formed on substrate S is uniform within the surface of substrate S.

[0179] The protruding portion 4036E and the base portion 4045E face each other in the Y1 direction and the Y2 direction, and there is a gap Δ1 between the protruding portion 4036E and the base portion 4045E in the Y1 direction and the Y2 direction. The protruding portion 4046E1 and the base portion 4035E face each other in the Y1 direction and the Y2 direction, and there is a gap Δ21 between the protruding portion 4046E1 and the base portion 4035E in the Y1 direction and the Y2 direction. In addition, the protruding portion 4046E2 and the base portion 4035E face each other in the Y1 direction and the Y2 direction, and there is a gap Δ22 between the protruding portion 4046E2 and the base portion 4035E in the Y1 direction and the Y2 direction. The gaps Δ1, Δ21, and Δ22 can absorb thermal expansion and processing errors of the members 403E and 404E. The gaps Δ1, Δ21, and Δ22 can be a maximum of 3 mm.

[0180] As described above, according to the sixth embodiment, a technique that is advantageous for improving the maintainability of the reduced-pressure drying apparatus and a technique that is advantageous for drying the solution on the substrate S are provided.

[0181] In the sixth embodiment described above, the members 403E and 404E are arranged side by side in the Y direction so as to overlap each other, but the present invention is not limited to this. For example, the members 403E and 404E may be arranged side by side in the X direction so as to overlap each other, or may be arranged side by side in a diagonal direction intersecting the X and Y directions so as to overlap each other.

[0182] Seventh embodiment The seventh embodiment will be described below. Elements with the same reference symbols as those in the first, second, third, fourth, fifth, or sixth embodiment will have substantially the same configurations and functions as those described in the first, second, third, fourth, fifth, or sixth embodiment unless otherwise specified, and the following mainly describes the parts that differ from the first, second, third, fourth, fifth, and sixth embodiments.

[0183] Fig. 8(c) is an explanatory diagram of a cover 40F according to a seventh embodiment. Fig. 8(c) shows a schematic diagram of a portion of the cover 40F corresponding to the region 44 in Fig. 7(a). The cover 40F is disposed on the surrounding wall 43 shown in Fig. 7(a).

[0184] The cover 40F has a plurality of plate-like members that are independent of each other. Among the plurality of members, two adjacent members are, for example, members 403F and 404F. The member 403F can be the first member, and the member 404F can be the second member. As shown in FIG. 8(c), the members 403F and 404F are arranged such that an end 4031F on the tip side in the Y1 direction of the member 403F and an end 4041F on the tip side in the Y2 direction of the member 404F overlap in the Z direction. The end 4031F is an example of a first end, and the end 4041F is an example of a second end.

[0185] Note that the portion of the member 403F other than the end portion 4031F does not overlap with the member 404F when viewed in the Z direction. Furthermore, the portion of the member 404F other than the end portion 4041F does not overlap with the member 403F when viewed in the Z direction.

[0186] Thus, in the seventh embodiment, the ends 4031F, 4041F overlap each other in the Z direction, thereby reducing the conductance between the members 403F and 404F and reducing the leakage of the solvent evaporated from the solution film F on the substrate S in FIG. 7(a) from between the members 403F, 404F into the space SP1.

[0187] The member 403F is disposed such that an end 4031F fits into an end 4041F of the member 404F. The member 403F is supported by the member 404F by the end 4031F of the member 403F contacting the end 4041F of the member 404F directly in the Z direction or indirectly via a member such as a seal member.

[0188] In the seventh embodiment, a through hole 421F1, which is a first through hole, is formed in an end 4031F of a member 403F, and a through hole 422F1, which is a second through hole, is formed in an end 4041F of a member 404F. The through hole 422F1 communicates with the through hole 421F1. The through holes 421F1 and 422F1 communicate with each other, so that an opening 42 is formed by the through holes 421F1 and 422F1. It is preferable that the sizes of the through hole 421F1 and the through hole 422F1 are different from each other.

[0189] Further, a through hole 421F2 which is a first through hole is formed in an end 4031F of the member 403F, and a through hole 422F2 which is a second through hole is formed in an end 4041F of the member 403F. The through hole 422F2 communicates with the through hole 421F2. The through holes 421F2 and 422F2 communicate with each other, so that an opening 42 is formed by the through holes 421F2 and 422F2. It is preferable that the sizes of the through hole 421F2 and the through hole 422F2 are different from each other.

[0190] In the seventh embodiment, the member 403F has a base portion 4035F, a protruding portion 4036F, and a protruding portion 4037F. The base portion 4035F is an example of a first base portion. The protruding portion 4036F is an example of a first protruding portion. The protruding portion 4037F is an example of a third protruding portion.

[0191] The protruding portion 4036F is thinner than the base portion 4035F in the Z direction, and protrudes from the base portion 4035F in the Y1 direction. At least a portion of the protruding portion 4036F is included in the end portion 4031F. In the seventh embodiment, a part of the tip side of the protruding portion 4036F is included in the end portion 4031F.

[0192] The protruding portion 4037F is thinner than the base portion 4035F and the protruding portion 4036F in the Z direction, and protrudes in the Y1 direction from the protruding portion 4036F. The entire protruding portion 4037F is included in the end portion 4031F.

[0193] The member 404F has a base portion 4045F, a protruding portion 4046F, and a protruding portion 4047F. The base portion 4045F is an example of a second base portion. The protruding portion 4046F is an example of a second protruding portion. The protruding portion 4047F is an example of a fourth protruding portion.

[0194] The protruding portion 4046F is thinner than the base portion 4045F in the Z direction, and protrudes from the base portion 4045F in the Y2 direction. At least a portion of the protruding portion 4046F is included in the end portion 4041F. In the seventh embodiment, a part of the tip side of the protruding portion 4046F is included in the end portion 4041F.

[0195] The protruding portion 4047F is thinner than the base portion 4045F and the protruding portion 4046F in the Z direction, and protrudes in the Y2 direction from the protruding portion 4046F. The entire protruding portion 4047F is included in the end portion 4041F.

[0196] As described above, the engagement structure between end 4031F of member 403F and end 4041F of member 404F makes it less likely for a gap to occur between end 4031F and end 4041F in the Z direction, reducing the conductance between end 4031F and end 4041F, and effectively reducing leakage of solvent evaporated from the solution film F on substrate S from between members 403F, 404F into space SP1.

[0197] In addition, the lower surface of the member 403F and the lower surface of the member 404F are flush with each other. As a result, the surface of the cover 40F facing the substrate holding part 20 becomes substantially flat, so that the distance between the cover 40F and the substrate S becomes substantially constant within the surface, and the quality of the film formed on the substrate S becomes uniform within the surface of the substrate S.

[0198] The protruding portion 4037F and the base portion 4045F face each other in the Y1 and Y2 directions, and there is a gap Δ1 between the protruding portion 4037F and the base portion 4045F in the Y1 and Y2 directions. The protruding portion 4047F and the base portion 4035F face each other in the Y1 and Y2 directions, and there is a gap Δ2 between the protruding portion 4047F and the base portion 4035F in the Y1 and Y2 directions. The protruding portion 4036F and the protruding portion 4046F face each other in the Y1 and Y2 directions, and there is a gap Δ3 between the protruding portion 4036F and the protruding portion 4046F in the Y1 and Y2 directions. The gaps Δ1, Δ2, and Δ3 can absorb thermal expansion and processing errors of the members 403F and 404F. The gaps Δ1, Δ2, and Δ3 can be a maximum of 3 mm.

[0199] As described above, according to the seventh embodiment, a technique that is advantageous for improving the maintainability of the reduced-pressure drying apparatus and a technique that is advantageous for drying the solution on the substrate S are provided.

[0200] In the seventh embodiment described above, the members 403F and 404F are arranged side by side in the Y direction so as to overlap each other, but the present invention is not limited to this. For example, the members 403F and 404F may be arranged side by side in the X direction so as to overlap each other, or may be arranged side by side in a diagonal direction intersecting the X and Y directions so as to overlap each other.

[0201] <Example> Below, we will explain the experimental results, namely, Example 1 corresponding to the first embodiment, Example 2 corresponding to the second embodiment, Example 3 corresponding to the third embodiment, Example 4 corresponding to the fourth embodiment, and Comparative Example 1 corresponding to the comparative example.

[0202] The thickness of the organic film at the center of the substrate S was taken as 100, and the thickness of the organic film at a position 20 mm from the corner of the substrate S along the diagonal line toward the center of the substrate was taken as x. The difference between 100 and x was divided by 100 to evaluate the film thickness unevenness. The film thickness was measured using a white light interferometer (product name: VK-X3000, Keyence Corporation).

[0203] In each of Examples 1 to 4 and Comparative Example 1, the thickness of the cover was set to 4 mm, and the distance between the cover and the substrate was set to 40 mm. In each of Examples 1 to 4, the width of the overlapping portion of the two members included in the cover was set to 25 mm. In each of Examples 2 to 4, the hole diameter of the overlapping portion was set to 4 to 20 mm. In each of Examples 1 to 4 and Comparative Example 1, the number of members included in the cover was two. In Comparative Example 1, the gap between the two members was set to 2 mm.

[0204] Fig. 10 is a diagram showing the experimental results of the examples. Fig. 10 shows the evaluation results of the thickness unevenness of Examples 1 to 4 and Comparative Example 1. The thickness unevenness was evaluated in four stages: ranks A, B, C, and D. Rank A is a thickness unevenness of less than 5%, rank B is a thickness unevenness of 5% or more and less than 10%, rank C is a thickness unevenness of 10% or more and less than 15%, and rank D is a thickness unevenness of 15% or more.

[0205] Comparative Example 1 was ranked D. In contrast, Example 1 was ranked C, Examples 2 and 3 were ranked B, and Example 4 was ranked A. Thus, it was confirmed that Examples 1 to 4 had an effect of reducing film thickness unevenness compared to Comparative Example 1 in which there were gaps between the members. That is, it was confirmed that Examples 1 to 4 had a film thickness that was uniform within the surface of the film formed on the substrate S. It was also confirmed that Examples 2 to 4 further eliminated film thickness unevenness by arranging an opening in the overlapping portion.

[0206] <Embodiments of the method for manufacturing an article> The method for manufacturing an article according to an embodiment of the present disclosure is suitable for manufacturing an article such as an organic electroluminescence (OLED) panel using an inkjet printing device. The method for manufacturing an article according to the present embodiment includes a step (coating step) of arranging or coating a solution film (a solution containing a solute and a solvent for forming an organic film) on a substrate by a printing method using an inkjet printing device or the like to obtain a coated substrate. The method also includes a step (drying step) of drying the solution film on the coated substrate by the above-mentioned reduced pressure drying device to obtain a dry substrate on which a dry film is formed. Furthermore, the manufacturing method includes other well-known steps (firing, cooling, dehumidification, dry cleaning, formation of electrodes, formation of a sealing film, etc.). The method for manufacturing an article according to the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article compared to conventional methods.

[0207] The present disclosure is not limited to the above-described embodiments, and the embodiments can be modified in many ways within the technical concept of the present disclosure. For example, at least two of the above-described embodiments and modifications may be combined. In addition, the effects described in the present embodiment are merely a list of the most favorable effects resulting from the embodiments of the present disclosure, and the effects of the embodiments of the present disclosure are not limited to those described in the present embodiment.

[0208] The disclosure of the above embodiments includes the following sections.

[0209] (Section 1) An airtight container; A pressure reducing mechanism for reducing the pressure inside the airtight container; a holder disposed inside the airtight container and holding a substrate; a sidewall member disposed inside the airtight container so as to surround a side surface of the substrate held by the holding portion; a cover disposed inside the airtight container and on the sidewall member so as to face a main surface of the substrate held by the holder; The cover is A first member; A second member that is separate from the first member, a first end portion of the first member on a tip side in a first direction intersecting with the vertical direction and a second end portion of the second member on a tip side in a second direction opposite to the first direction overlap with each other in the vertical direction; The substrate processing apparatus according to claim 1,

[0210] (Section 2) The first member is supported by the second member. 2. The substrate processing apparatus according to item 1,

[0211] (Section 3) At least a portion of the region included in the first end portion and at least a portion of the region included in the second end portion are in contact with each other directly or via a member in the vertical direction. 3. The substrate processing apparatus according to item 1 or 2,

[0212] (Section 4) A first through hole is formed in the first end portion, A second through hole communicating with the first through hole is formed in the second end portion. 4. The substrate processing apparatus according to any one of items 1 to 3,

[0213] (Section 5) The first through hole and the second through hole are different in size from each other. 5. The substrate processing apparatus according to item 4,

[0214] (Section 6) The first member and the second member are flat plate-shaped members. 6. The substrate processing apparatus according to any one of items 1 to 5,

[0215] (Section 7) the first member has a first base portion and a first protruding portion that is thinner than the first base portion in the vertical direction and protrudes from the first base portion in the first direction; the second member has a second base portion and a second protruding portion that is thinner than the second base portion in the vertical direction and protrudes from the second base portion in the second direction, At least a portion of the first protrusion is included in the first end portion, At least a portion of the second protrusion is included in the second end portion. 6. The substrate processing apparatus according to any one of items 1 to 5,

[0216] (Section 8) A surface of the first base portion facing the holding portion and a surface of the second base portion facing the holding portion are flush with each other. 8. The substrate processing apparatus according to item 7,

[0217] (Section 9) a gap is provided between the first protrusion and the second base in the first direction and the second direction; a gap is provided between the second protruding portion and the first base portion in the first direction and the second direction; 9. The substrate processing apparatus according to item 7 or 8,

[0218] (Section 10) The first protrusion and the second protrusion have a tapered shape having an inclined surface inclined with respect to a horizontal plane. 10. The substrate processing apparatus according to any one of items 7 to 9,

[0219] (Section 11) the first member has a first base portion and a first protruding portion that is thinner than the first base portion in the vertical direction and protrudes from the first base portion in the first direction; the second member has a second base portion and two second protruding portions that are thinner than the second base portion in the vertical direction and protrude from the second base portion in the second direction; the two second protrusions are spaced apart in the vertical direction such that the first protrusion is fitted between the two second protrusions; At least a portion of the first protrusion is included in the first end portion, At least a portion of each of the two second protrusions is included in the second end portion. 6. The substrate processing apparatus according to any one of items 1 to 5,

[0220] (Section 12) A surface of the first base portion facing the holding portion and a surface of the second base portion facing the holding portion are flush with each other. Item 12. The substrate processing apparatus according to item 11,

[0221] (Section 13) a gap is provided between the first protrusion and the second base in the first direction and the second direction; a gap is provided between each of the two second protrusions and the first base in the first direction and the second direction; Item 12. The substrate processing apparatus according to item 11,

[0222] (Section 14) the first member has a third protruding portion that is thinner than the first protruding portion in the vertical direction and protrudes from the first protruding portion in the first direction; the second member has a fourth protruding portion that is thinner than the second protruding portion in the vertical direction and protrudes from the second protruding portion in the second direction, the third protrusion is entirely included in the first end portion, The entire fourth protrusion is included in the second end portion. 8. The substrate processing apparatus according to item 7,

[0223] (Section 15) a gap is provided between the third protrusion and the second base in the first direction and the second direction; a gap is provided between the first base portion and the fourth protruding portion in the first direction and the second direction; a gap is present between the first protruding portion and the second protruding portion in the first direction and the second direction; Item 15. The substrate processing apparatus according to item 14,

[0224] (Section 16) In a plan view, an area of ​​a region of the first member that overlaps with the second member is 1% or more of an area of ​​the entire region of the first member. 16. The substrate processing apparatus according to any one of items 1 to 15,

[0225] (Section 17) In a plan view, an area of ​​a region of the first member that overlaps with the second member is 20% or less of an area of ​​the entire region of the first member. 17. The substrate processing apparatus according to any one of items 1 to 16,

[0226] (Section 18) In a plan view, an area of ​​a region of the first member that overlaps with the second member is 10% or less of an area of ​​the entire region of the first member. 18. The substrate processing apparatus according to any one of items 1 to 17,

[0227] (Section 19) The substrate is rectangular in plan view, The length of each side of the rectangle is 2000 mm or more. Item 19. The substrate processing apparatus according to any one of items 1 to 18,

[0228] (Section 20) The first member and the second member are made of metal. 20. The substrate processing apparatus according to any one of items 1 to 19,

[0229] (Section 21) The metal is stainless steel or aluminum; 21. The substrate processing apparatus according to item 20,

[0230] (Section 22) The cover has a plurality of members that are separate from one another, Among the plurality of members, two adjacent members are the first member and the second member. 22. The substrate processing apparatus according to any one of items 1 to 21,

[0231] (Section 23) The substrate processing apparatus is capable of performing a process of drying a solvent applied onto the substrate. 23. The substrate processing apparatus according to any one of items 1 to 22,

[0232] (Section 24) 24. A substrate processing method comprising the step of drying a solvent applied onto a substrate by using the substrate processing apparatus according to any one of items 1 to 23.

[0233] (Section 25) 24. A method for manufacturing an article, comprising the step of drying a solvent applied onto a substrate by using the substrate processing apparatus according to any one of items 1 to 23. [Explanation of symbols]

[0234] 10... airtight container, 20... substrate holder (holder), 30... pressure reduction mechanism, 40... cover, 43... enclosure wall (side wall member), 100... reduced pressure drying device (substrate processing apparatus), 404... member (first member), 405... member (second member)

Claims

1. An airtight container; A pressure reducing mechanism for reducing the pressure inside the airtight container; a holder disposed inside the airtight container and holding a substrate; a sidewall member disposed inside the airtight container so as to surround a side surface of the substrate held by the holding portion; a cover disposed inside the airtight container and on the sidewall member so as to face a main surface of the substrate held by the holder; The cover is A first member; A second member that is separate from the first member, a first end portion of the first member on a tip side in a first direction intersecting with the vertical direction and a second end portion of the second member on a tip side in a second direction opposite to the first direction overlap with each other in the vertical direction; The substrate processing apparatus according to claim 1,

2. The first member is supported by the second member. The substrate processing apparatus according to claim 1 .

3. At least a portion of the region included in the first end portion and at least a portion of the region included in the second end portion are in contact with each other directly or via a member in the vertical direction. The substrate processing apparatus according to claim 1 .

4. A first through hole is formed in the first end portion, A second through hole communicating with the first through hole is formed in the second end portion. The substrate processing apparatus according to claim 1 .

5. The first through hole and the second through hole are different in size from each other. The substrate processing apparatus according to claim 4 .

6. The first member and the second member are flat plate-like members. The substrate processing apparatus according to claim 1 .

7. the first member has a first base portion and a first protruding portion that is thinner than the first base portion in the vertical direction and protrudes from the first base portion in the first direction; the second member has a second base portion and a second protruding portion that is thinner than the second base portion in the vertical direction and protrudes from the second base portion in the second direction, At least a portion of the first protrusion is included in the first end, At least a portion of the second protrusion is included in the second end portion. The substrate processing apparatus according to claim 1 .

8. A surface of the first base portion facing the holding portion and a surface of the second base portion facing the holding portion are flush with each other. The substrate processing apparatus according to claim 7 .

9. a gap is provided between the first protrusion and the second base in the first direction and the second direction; a gap is provided between the second protruding portion and the first base portion in the first direction and the second direction; The substrate processing apparatus according to claim 7 .

10. The first protrusion and the second protrusion have a tapered shape having an inclined surface inclined with respect to a horizontal plane. The substrate processing apparatus according to claim 7 .

11. the first member has a first base portion and a first protruding portion that is thinner than the first base portion in the vertical direction and protrudes from the first base portion in the first direction; the second member has a second base portion and two second protruding portions that are thinner than the second base portion in the vertical direction and protrude from the second base portion in the second direction; the two second protrusions are spaced apart in the vertical direction such that the first protrusion is fitted between the two second protrusions; At least a portion of the first protrusion is included in the first end, At least a portion of each of the two second protrusions is included in the second end portion. The substrate processing apparatus according to claim 1 .

12. A surface of the first base portion facing the holding portion and a surface of the second base portion facing the holding portion are flush with each other. The substrate processing apparatus according to claim 11 .

13. a gap is provided between the first protrusion and the second base in the first direction and the second direction; a gap is provided between each of the two second protrusions and the first base in the first direction and the second direction; The substrate processing apparatus according to claim 11 .

14. the first member has a third protruding portion that is thinner than the first protruding portion in the vertical direction and protrudes from the first protruding portion in the first direction; the second member has a fourth protruding portion that is thinner than the second protruding portion in the vertical direction and protrudes from the second protruding portion in the second direction, the third protrusion is entirely included in the first end portion, The entire fourth protrusion is included in the second end portion. The substrate processing apparatus according to claim 7 .

15. a gap is provided between the third protrusion and the second base in the first direction and the second direction; a gap is provided between the first base portion and the fourth protrusion portion in the first direction and the second direction; a gap is provided between the first protruding portion and the second protruding portion in the first direction and the second direction; The substrate processing apparatus according to claim 14 .

16. In a plan view, an area of ​​a region of the first member that overlaps with the second member is 1% or more of an area of ​​the entire region of the first member. The substrate processing apparatus according to claim 1 .

17. In a plan view, an area of ​​a region of the first member that overlaps with the second member is 20% or less of an area of ​​an entire region of the first member. The substrate processing apparatus according to claim 1 .

18. In a plan view, an area of ​​a region of the first member that overlaps with the second member is 10% or less of an area of ​​an entire region of the first member. The substrate processing apparatus according to claim 1 .

19. The substrate is rectangular in plan view, The length of each side of the rectangle is 2000 mm or more. The substrate processing apparatus according to claim 1 .

20. The first member and the second member are made of metal. The substrate processing apparatus according to claim 1 .

21. The metal is stainless steel or aluminum; The substrate processing apparatus according to claim 20 .

22. The cover has a plurality of members that are separate from one another, Among the plurality of members, two adjacent members are the first member and the second member, The substrate processing apparatus according to claim 1 .

23. The substrate processing apparatus is capable of performing a process of drying a solvent applied onto the substrate. The substrate processing apparatus according to claim 1 .

24. 24. A substrate processing method, comprising the step of drying a solvent applied onto a substrate by using the substrate processing apparatus according to claim 1.

25. A method for manufacturing an article, comprising the step of drying a solvent applied onto a substrate by using the substrate processing apparatus according to claim 1 .

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