Method for imaging workpiece

Abstract

To provide a method for imaging a workpiece that can reduce the time it takes to capture images of the workpiece two or more times under different imaging conditions.SOLUTION: A method for imaging a workpiece includes an outward imaging step 1001 of relatively moving a holding table having a holding surface for holding the workpiece and an imaging unit for imaging the workpiece held on the holding surface in a first direction parallel to the holding surface to image a predetermined area of the workpiece under first imaging conditions, and a return imaging step 1002 of relatively moving the holding table and the imaging unit in a second direction that is opposite to the first direction to image the predetermined area of the workpiece under second imaging conditions different from the first imaging conditions after the outward imaging step 1001.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a method for imaging a workpiece. [Background technology]

[0002] A method is known in which an imaging unit, which captures an image of a workpiece more clearly, has a narrower imaging area (an area within the imaging field of view) than the workpiece, is moved to any position on the workpiece to capture an image of a portion of the workpiece, and the captured image of the portion of the workpiece is used to inspect inspection items of the portion of the workpiece (see, for example, Patent Documents 1 and 2). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2023-018740 A [Patent Document 2] JP 2023-018741 A Summary of the Invention [Problem to be solved by the invention]

[0004] There is a demand for inspecting two or more types of inspection items using the captured image of the part of the workpiece. However, the imaging conditions under which the image can be captured more clearly differ depending on the inspection item. For this reason, when inspecting two or more types of inspection items under different imaging conditions under which the image can be captured more clearly, it is necessary to obtain images of the part of the workpiece captured under the two or more different imaging conditions. However, in order to capture the image of the workpiece twice or more under different imaging conditions, it is necessary to move the imaging unit to the position of the part of the workpiece twice or more, which is time-consuming.

[0005] The present invention has been made in consideration of such problems, and its object is to provide a method for imaging a workpiece that can reduce the time required to capture an image of the workpiece two or more times under different imaging conditions. [Means for solving the problem]

[0006] In order to solve the above-mentioned problems and achieve the object, the imaging method of the present invention is an imaging method for imaging a workpiece, which includes an outward imaging step in which a holding table having a holding surface for holding the workpiece and an imaging unit for imaging the workpiece held on the holding surface are moved relatively in a first direction parallel to the holding surface to image a predetermined area of ​​the workpiece under first imaging conditions, and a return imaging step in which, after the outward imaging step, the holding table and the imaging unit are moved relatively in a second direction that is opposite to the first direction to image the predetermined area of ​​the workpiece under second imaging conditions different from the first imaging conditions.

[0007] At least one of the outward imaging step and the return imaging step may capture a plurality of small images by sequentially capturing images of each small section while changing the imaging area of ​​the imaging unit.

[0008] The imaging method may further include a first image generation step of generating a first image by combining the small images acquired in the outbound imaging step, and a second image generation step of generating a second image by combining the small images acquired in the return imaging step.

[0009] The method may further comprise a detection step of detecting at least any one of chipping, cracks, corrosion, adhesion of foreign matter, and processing marks from the small image or an image obtained by combining the small images.

[0010] The first imaging condition and the second imaging condition may differ in at least one of the focal position, the amount of light irradiated to the workpiece, and the direction of light.

[0011] The holding surface may be formed to include a transparent body, and the imaging unit may include a first imaging unit that images a surface of the workpiece that is not held on the holding surface, and a second imaging unit that images a surface of the workpiece that is held on the holding surface via the holding surface.

[0012] The workpiece may have a plurality of grooves formed therein.

[0013] The return imaging step may image an area imaged in the immediately preceding outward imaging step. Effect of the Invention

[0014] In the present invention, an imaging unit is moved back and forth relative to a workpiece held on a holding table, and a forward imaging step is performed on the forward leg of the reciprocating movement to image and acquire a predetermined area of ​​the workpiece under first imaging conditions, and a return imaging step is performed on the return leg of the reciprocating movement to image and acquire the same predetermined area of ​​the workpiece under second imaging conditions different from the first imaging conditions.Therefore, images of the workpiece imaged under two different imaging conditions can be obtained efficiently in a short amount of time by utilizing the reciprocating movement, thereby reducing the time required to image the workpiece two or more times under different imaging conditions. [Brief description of the drawings]

[0015] [Figure 1] FIG. 1 is a flowchart showing a processing procedure of a workpiece imaging method according to the first embodiment. [Diagram 2] FIG. 2 is a perspective view showing an example of a workpiece that is an imaging target of the workpiece imaging method according to the first embodiment. [Diagram 3] FIG. 3 is a perspective view showing an example of a workpiece that is an imaging target of the workpiece imaging method according to the first embodiment. [Figure 4] FIG. 4 is an enlarged cross-sectional view illustrating a main portion of the workpiece shown in FIG. [Diagram 5] FIG. 5 is an enlarged cross-sectional view showing a main part of the workpiece shown in FIG. [Figure 6] FIG. 6 is a perspective view showing a configuration example of an imaging device for implementing the workpiece imaging method according to the first embodiment. [Figure 7] FIG. 7 is a perspective view showing a part of the imaging device shown in FIG. [Figure 8] FIG. 8 is a perspective view showing a part of the imaging device shown in FIG. [Figure 9] FIG. 9 is a side cross-sectional view illustrating an example of the operation process of the imaging device shown in FIG. [Figure 10] FIG. 10 is a diagram showing an example of an image captured by the imaging device shown in FIG. [Figure 11] FIG. 11 is a diagram showing an example of an image captured by the imaging device shown in FIG. [Figure 12] FIG. 12 is a conceptual top view illustrating an example of the forward imaging step and the return imaging step shown in FIG. [Figure 13] FIG. 13 is a conceptual top view illustrating an example of the forward imaging step and the return imaging step shown in FIG. [Figure 14] FIG. 14 is a conceptual top view illustrating an example of an outward imaging step and a return imaging step of the workpiece imaging method according to the second embodiment. [Figure 15] FIG. 15 is a conceptual top view illustrating an example of an outward imaging step and a return imaging step of the workpiece imaging method according to the second embodiment. [Figure 16] FIG. 16 is a conceptual top view illustrating an example of an outward imaging step and a return imaging step of the workpiece imaging method according to the second embodiment. [Figure 17] FIG. 17 is a conceptual top view illustrating an example of an outward imaging step and a return imaging step of the workpiece imaging method according to the third embodiment. [Figure 18] FIG. 18 is a perspective view showing a configuration example of an imaging device for implementing a workpiece imaging method according to a modified example. [Figure 19] FIG. 19 is a diagram showing an example of a display screen displayed in the workpiece imaging method according to the modified example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] The form (embodiment) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiment. Furthermore, the components described below include those that a person skilled in the art can easily imagine and those that are substantially the same. Furthermore, the configurations described below can be appropriately combined. Furthermore, various omissions, substitutions, or modifications of the configurations can be made without departing from the gist of the present invention.

[0017] [Embodiment 1] The imaging method of a workpiece according to the first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a flow chart showing the processing procedure of the imaging method of a workpiece according to the first embodiment. The imaging method of a workpiece according to the first embodiment is a method of imaging a workpiece 100 as shown in FIG. 3 described later, and includes an outward imaging step 1001 and a return imaging step 1002 as shown in FIG. 1. The imaging method of a workpiece according to the first embodiment may further include a detection step 1003 as shown in FIG. 1. The imaging method of a workpiece according to the first embodiment may further include a first image generating step 1004 and a second image generating step 1005 as shown in FIG. 1.

[0018] 2 and 3 are perspective views showing an example of a workpiece 100 that is an imaging target of the imaging method of the workpiece according to the first embodiment. FIG. 4 is an enlarged cross-sectional view for explaining a main part of the workpiece 100 shown in FIG. 3. FIG. 5 is an enlarged cross-sectional view showing a main part of the workpiece 100 shown in FIG. 3. The workpiece 100 that is an imaging target of the imaging method of the workpiece according to the first embodiment is, as shown in FIGS. 2 and 3, a wafer such as a disk-shaped semiconductor wafer or an optical device wafer, whose base material is silicon, sapphire, silicon carbide (SiC), gallium arsenide, glass, or the like. The workpiece 100 shown in FIG. 2 has a flat surface 101, and chip-shaped devices 103 are formed in each area partitioned by a plurality of planned division lines 102 that intersect with each other.

[0019] In the first embodiment, the workpiece 100 has a functional layer 107 laminated on the surface 101. The functional layer 107 includes a low-dielectric constant insulator coating (hereinafter referred to as a low-k film) made of an inorganic film such as a nitride film, an oxide film, SiOF, or BSG (SiOB), or an organic film such as a polymer film of a polyimide system or a parylene system, and a conductor film made of a conductive metal. The device 103 includes a low-k film and a conductor film laminated between the low-k films. The conductor film forms the wiring pattern of the device 103. The functional layer 107 of the planned division line 102 may also include a TEG (Test Element Group), which is an evaluation element for finding design or manufacturing problems occurring in the device 103. In the present invention, the workpiece 100 is not limited to this form, and the functional layer 107 may not be laminated on the surface 101, and the device 103 may have another configuration.

[0020] Furthermore, the workpiece 100 has a bonding pad (not shown) provided on the surface of the device 103. This bonding pad is formed of a material (e.g., copper, aluminum, platinum, gallium nitride) different from the base material of the workpiece 100, and functions as, for example, an electrode of the device 103. A lead wire that exchanges signals between the device 103 and the outside is connected to the bonding pad.

[0021] 2, the workpiece 100 has a support tape 105 attached to a back surface 104 behind the front surface 101, and an annular frame 106 attached to the outer edge of the support tape 105. That is, the workpiece 100 is supported and fixed to the opening of the annular frame 106 via the support tape 105.

[0022] 2 is supported and fixed to the opening of an annular frame 106 via a support tape 105, and then processed grooves 109 are formed along the intended division lines 102 and divided, resulting in the state of the workpiece 100 shown in Fig. 3, and multiple device 103 chips are manufactured. Note that in the present invention, the workpiece 100 may be a rectangular package substrate having multiple devices sealed with resin, a ceramic plate, a glass plate, or the like.

[0023] In the first embodiment, the workpiece 100 is divided into chips of a plurality of devices 103 by a plurality of processing grooves 109 formed along the planned division lines 102. Specifically, in the first embodiment, the processing grooves 109 are formed to include two pairs of grooving grooves 109-1 formed along both ends of the processing groove 109 on the inside of the both ends, penetrating the functional layer 107 in the thickness direction and to a depth not penetrating the workpiece 100 in the thickness direction, and a full-cut groove 109-2 formed between the two pairs of grooving grooves 109-1, straddling the inner end of the grooving groove 109-1, penetrating the workpiece 100 in the thickness direction. The processed groove 109 thus includes the full-cut groove 109-2 and the grooving groove 109-1 formed at both ends of the full-cut groove 109-2 and shallower than the full-cut groove 109-2, and thus has a step structure in which the depth changes in two steps along a direction perpendicular to the processed groove 109. In the present invention, the grooving groove 109-1 does not necessarily have to be a groove with a depth penetrating the functional layer 107 formed in the workpiece 100 having the functional layer 107 in the thickness direction, and includes a half-cut groove that does not fully cut the workpiece 100. In the first embodiment, both the pair of groove grooves 109-1 and the full-cut groove 109-2 may be formed by cutting with a cutting blade, or the pair of groove grooves 109-1 may be formed by laser processing by laser irradiation, and the full-cut groove 109-2 may be formed by cutting with a cutting blade. Also, instead of forming a pair of grooving grooves 109-1, a single grooving groove wider than the full-cut groove 109-2 may be formed, in which case the wider grooving groove is formed, for example, by cutting with a wide cutting blade.

[0024] Fig. 6 is a perspective view showing a configuration example of an imaging device 1 for implementing an imaging method for a workpiece according to the first embodiment. Figs. 7 and 8 are both perspective views showing a part of the imaging device 1 shown in Fig. 6. Fig. 9 is a side cross-sectional view explaining an example of an operation process of the imaging device 1 shown in Fig. 6. Fig. 7 shows a part including a holding table 10 of the imaging device 1, and Fig. 8 shows a part including an imaging unit 20 of the imaging device 1. As shown in Fig. 6, the imaging device 1 includes the holding table 10, the imaging unit 20, a moving unit 30, a display unit 40, and a control unit 50.

[0025] As shown in Fig. 6 and Fig. 7, the holding table 10 has a disk-shaped transparent member 11 and an annular frame 12 that holds the outer edge of the transparent member 11. The transparent member 11 is made of a transparent material such as quartz glass, borosilicate glass, sapphire, calcium fluoride, lithium fluoride, magnesium fluoride, or the like, and is formed into a disk shape with a constant thickness. The outer diameter of the transparent member 11 is larger than the outer diameter of the workpiece 100 and smaller than the inner diameter (opening diameter) of the annular frame 106. The outer edge of the transparent member 11 is supported by the frame 12 and is exposed above and below the holding table 10.

[0026] The upper surface of the transparent member 11 serves as a holding surface 13 on which the workpiece 100 is placed and which holds one of the surfaces of the placed workpiece 100. In this manner, the holding table 10 is formed such that at least a portion of the holding surface 13 includes the transparent member 11 which is a transparent body. The transparent member 11 is formed so that the holding surface 13 is parallel to and flat on the XY plane which is a horizontal plane. In the first embodiment, the holding surface 13 of the transparent member 11 holds the back surface 104 side of the workpiece 100 via a support tape 105 as shown in FIG.

[0027] The imaging device 1 images and inspects the surface of the workpiece 100 held by the holding surface 13 of the holding table 10 on the holding surface 13 side by using a second imaging unit 22 of the imaging unit 20 described later through the holding surface 13. For this reason, it is preferable that the holding table 10 has a larger area of ​​the holding surface 13 formed of the transparent member 11, because this increases the area in which the surface of the workpiece 100 held by the holding surface 13 on the holding surface 13 can be imaged and inspected. Note that, when the area to be imaged and inspected (or desired to be imaged and inspected) of the surface of the workpiece 100 on the holding surface 13 side of the workpiece 100 held by the holding surface 13 is determined, it is sufficient that at least a part of the area of ​​the holding surface 13 including the area of ​​the holding surface 13 corresponding to the area to be imaged and inspected of the surface of the workpiece 100 on the holding surface 13 side is formed of the transparent member 11, rather than the entire surface of the holding surface 13.

[0028] The frame 12 is made of a metal such as stainless steel. The frame 12 is formed with an inner diameter equal to the outer diameter of the transparent member 11, and is attached to the outer edge of the transparent member 11. The upper surface 14 of the frame 12 is formed flat along the horizontal direction and is disposed on the same plane as the holding surface 13. The annular frame 106 attached to the workpiece 100 is placed on the upper surface 14 of the frame 12, and holds the placed annular frame 106. In the first embodiment, the upper surface 14 of the frame 12 holds the annular frame 106 attached to the workpiece 100 via a support tape 105. Both ends of the frame 12 are supported by the X-axis moving unit 31 of the moving unit 30 so as to be movable in the X-axis direction parallel to the horizontal direction, and the holding table 10 is provided so as to be movable in the X-axis direction by the X-axis moving unit 31 of the moving unit 30.

[0029] 9, the frame 12 is provided with a suction groove 15, which is recessed from the upper surface 14 and has a circular planar shape, on the inner edge of the upper surface 14, and is connected to a suction source (not shown) through a suction path (not shown) formed penetrating the inside of the suction groove 15. In the first embodiment, the holding table 10 holds the workpiece 100 and the annular frame 106 by suction on the holding surface 13 and the upper surface 14 via the support tape 105, by a suction source (not shown) sucking the suction groove 15 through the suction path.

[0030] In the first embodiment, the imaging unit 20 includes a first imaging unit 21, a second imaging unit 22, and a unit body 23, as shown in Fig. 8. The first imaging unit 21 is provided at the upper end of the unit body 23, which is formed in a column shape with a longitudinal direction parallel to the vertical direction and parallel to the Z-axis direction perpendicular to the XY plane, and is installed above the holding surface 13 of the holding table 10, and images the surface of the workpiece 100 held on the holding table 10 that is not held on the holding surface 13, i.e., the surface side facing upward, as shown in Fig. 9. The second imaging unit 22 is provided at the lower end of the unit body 23, which is installed below the holding surface 13 of the holding table 10, and images the surface of the workpiece 100 held on the holding table 10 that is held on the holding surface 13, i.e., the surface side facing downward, through the holding surface 13 (transparent member 11), as shown in Fig. 9. In addition, the imaging unit 20 is not limited to this in the present invention, and may be in a form including only one imaging unit or in a form including three or more imaging units as long as it is capable of imaging either side of the workpiece 100 held on the holding table 10.

[0031] As shown in Fig. 8, the first imaging unit 21 and the second imaging unit 22 are provided so as to be movable in the Z-axis direction by separate Z-axis direction moving units 33 of the moving unit 30. As shown in Fig. 7, the unit body 23 is provided so as to be movable in the Y-axis direction, which is parallel to the horizontal direction and perpendicular to the X-axis direction, by a Y-axis direction moving unit 32 of the moving unit 30, and the first imaging unit 21 and the second imaging unit 22 are integrally movable in the Y-axis direction via the unit body 23.

[0032] 9, the workpiece 100 is held from below by the holding table 10 with the front surface 101 side facing upward and the back surface 104 side to which the support tape 105 is attached facing downward, and is imaged from the front surface 101 side by the first imaging unit 21 and imaged from the back surface 104 side by the second imaging unit 22 via the support tape 105. That is, in the first embodiment, the first imaging unit 21 and the second imaging unit 22 respectively image the front surface 101 side and the back surface 104 side of the workpiece 100 held on the holding table 10.

[0033] In the first embodiment, the first imaging unit 21 and the second imaging unit 22 each have an imaging area within an imaging field of view that is narrower than the area (the area of ​​the front surface 101 or the area of ​​the back surface 104) of the workpiece 100 to be imaged in a plan view, and the length of the imaging area in any one direction is shorter than the length of the workpiece 100 to be imaged in the plan view in that direction. That is, the first imaging unit 21 and the second imaging unit 22 each cannot capture an image of the entire surface of the workpiece 100 in a plan view in one imaging by fitting the entire surface of the workpiece 100 in a plan view in one imaging, but capture a clearer and more accurate image of a part of the entire surface of the workpiece 100 in a plan view in one imaging by fitting a part of the entire surface of the workpiece 100 in a plan view in one imaging area.

[0034] The first imaging unit 21 and the second imaging unit 22 each include an imaging element that images the upward facing surface side and the downward facing surface side of the workpiece 100 held on the holding table 10. The imaging element is, for example, a CCD (Charge-Coupled Device) imaging element or a CMOS (Complementary MOS) imaging element. The first imaging unit 21 and the second imaging unit 22 each image the upward facing surface side and the downward facing surface side of the workpiece 100 held on the holding table 10, and output the obtained images to the control unit 50.

[0035] In the first embodiment, for example, an infrared camera or a visible light camera is used as the first imaging unit 21. In the first embodiment, the first imaging unit 21 images the surface 101 side of the workpiece 100 to which the support tape 105 is not attached, so that an image of the workpiece 100 can be suitably obtained by using either infrared light or visible light. In the first embodiment, for example, an infrared camera is preferably used as the second imaging unit 22. In embodiment 1, the second imaging unit 22 images the back surface 104 of the workpiece 100 to which the support tape 105 is attached, and therefore does not use visible light, which makes it difficult to clearly image the boundaries of cracks and chipping that have occurred on the back surface 104 of the workpiece 100 when the support tape 105 is tightly attached, but uses infrared light, which can clearly image the boundaries of cracks and chipping that have occurred on the back surface 104 of the workpiece 100 even when the support tape 105 is tightly attached.As a result, an image of the workpiece 100 that is suitable for inspecting cracks and chipping that have occurred on the back surface 104 of the workpiece 100 can be obtained.

[0036] Both the first imaging unit 21 and the second imaging unit 22 include an incident illumination (not shown) that irradiates the imaging area of ​​the workpiece 100 with light along the Z-axis direction parallel to the vertical direction perpendicular to the surface of the workpiece 100, and an oblique illumination (not shown) that irradiates the imaging area of ​​the workpiece 100 with light from a direction inclined with respect to the Z-axis direction. The first imaging unit 21 and the second imaging unit 22 can appropriately change and adjust the irradiation rate of incident light by incident illumination and the irradiation rate of oblique light by oblique illumination, and can irradiate incident light and oblique light with arbitrary irradiation rates by incident illumination and oblique illumination toward the imaging area of ​​the workpiece 100 held on the holding table 10 to capture and acquire an image of the workpiece 100. Here, the irradiation rate is, for example, the ratio of the amount of light supplied when the maximum amount of light possessed by incident illumination or oblique illumination is set to 100%.

[0037] The first imaging unit 21 and the second imaging unit 22 are both set and changed under the control of the control unit 50 under the imaging conditions for imaging the workpiece 100. Here, the imaging conditions of the first imaging unit 21 and the second imaging unit 22 include the irradiation rate of incident light by incident illumination, the irradiation rate of oblique light by oblique illumination, and the focal position in imaging in the first embodiment. That is, the imaging conditions of the first imaging unit 21 and the second imaging unit 22 include the amount of light irradiated to the workpiece 100, the direction of light, and the focal position in the first embodiment. In addition, the imaging conditions of the first imaging unit 21 and the second imaging unit 22 are suitably set to the conditions for imaging the image of the workpiece 100 that can suitably inspect the inspection item, according to the inspection item to be inspected by performing image processing based on the image of the workpiece 100 imaged by the control unit 50 in the first embodiment. Note that the imaging conditions are not limited to this in the present invention, and various conditions may be added and set according to the inspection item, or some conditions may be omitted.

[0038] The moving unit 30 moves the holding table 10 and the imaging unit 20 (the first imaging unit 21 and the second imaging unit 22) relatively along the X-axis direction, the Y-axis direction, and the Z-axis direction. As shown in FIG. 6, the moving unit 30 has an X-axis direction moving unit 31, a Y-axis direction moving unit 32, and a Z-axis direction moving unit 33. The X-axis direction moving unit 31, the Y-axis direction moving unit 32, and the Z-axis direction moving unit 33 move the holding table 10 and the imaging unit 20 (the first imaging unit 21 and the second imaging unit 22) relatively along the X-axis direction, the Y-axis direction, and the Z-axis direction, respectively. In the first embodiment, the X-axis direction moving unit 31 moves the holding table 10 relative to the imaging unit 20 along the X-axis direction. In the first embodiment, the Y-axis direction moving unit 32 and the Z-axis direction moving unit 33 move the imaging unit 20 relative to the holding table 10 along the Y-axis direction and the Z-axis direction, respectively.

[0039] The X-axis direction moving unit 31, the Y-axis direction moving unit 32, and the Z-axis direction moving unit 33 are all known ball screw mechanisms having a motor, a ball screw, and a guide. The X-axis direction moving unit 31, the Y-axis direction moving unit 32, and the Z-axis direction moving unit 33 each include an encoder that reads the rotational position of the motor, and detects the relative positions of the holding table 10 and the imaging unit 20 in the X-axis direction, the Y-axis direction, and the Z-axis direction based on the rotational position of the motor read by the encoder, and outputs the detected relative positions to the control unit 50. Here, the relative positions in the X-axis direction, the Y-axis direction, and the Z-axis direction are determined using an apparatus coordinate system (such as XYZ coordinates, which are an orthogonal coordinate system, or RθZ coordinates, which is a cylindrical coordinate system) provided in the imaging device 1. In addition, the X-axis direction moving unit 31, the Y-axis direction moving unit 32 and the Z-axis direction moving unit 33 are not limited to a configuration in which the relative positions of the holding table 10 and the imaging unit 20 are detected by an encoder, and may be configured with linear scales parallel to the X-axis direction, the Y-axis direction and the Z-axis direction, respectively, and a reading head that is freely movable in the X-axis direction, the Y-axis direction and the Z-axis direction by the X-axis direction moving unit 31, the Y-axis direction moving unit 32 and the Z-axis direction moving unit 33, respectively, and reads the graduations of the linear scale.

[0040] 9, under the control of the control unit 50, the first imaging unit 21 is set to an imaging condition that allows the image of the surface 101 side of the workpiece 100 to be suitably inspected by the epi-illumination and oblique illumination of the first imaging unit 21 and the Z-axis direction moving unit 33 to be imaged, and then the X-axis direction moving unit 31 and the Y-axis direction moving unit 32 move the imaging area of ​​the first imaging unit 21 to a position including an area to be imaged or inspected on the surface 101 side of the workpiece 100, and image the imaging area, thereby imaging an image including the area to be imaged or inspected on the surface 101 side of the workpiece 100. When there are multiple areas to be imaged or inspected on the surface 101 side of the workpiece 100, the imaging area of ​​the first imaging unit 21 scans multiple positions including the multiple areas, and images the multiple imaging areas, thereby imaging multiple images including the multiple areas to be imaged or inspected on the surface 101 side of the workpiece 100.

[0041] 9, under the control of the control unit 50, the second imaging unit 22 is set to an imaging condition that allows the image of the back surface 104 side of the workpiece 100 to be suitably inspected for a desired inspection item by the epi-illumination and oblique illumination of the second imaging unit 22 and the Z-axis direction moving unit 33, and then the imaging area of ​​the second imaging unit 22 is moved by the X-axis direction moving unit 31 and the Y-axis direction moving unit 32 to a position including an area to be imaged or inspected on the back surface 104 side of the workpiece 100, and the imaging area is imaged, thereby imaging an image including an area to be imaged or inspected on the back surface 104 side of the workpiece 100. When there are multiple areas to be imaged or inspected on the back surface 104 side of the workpiece 100, the imaging area of ​​the second imaging unit 22 scans multiple positions including the multiple areas, and images the multiple imaging areas, thereby imaging multiple images including the multiple areas to be imaged or inspected on the back surface 104 side of the workpiece 100.

[0042] In the first embodiment, as shown in FIG. 6, the display unit 40 is provided on a cover (not shown) of the imaging device 1 with the display surface facing outward. The display unit 40 displays a screen for setting various conditions related to various processes of the imaging device 1, such as imaging and inspection by the imaging unit 20, acquired images and data, various processing results by the control unit 50, and the like, so that the operator can visually confirm them. The display unit 40 is configured with a liquid crystal display device or the like. The display unit 40 is provided with an input unit 41 that the operator uses when inputting information related to the above-mentioned various conditions of the imaging device 1 and information related to the display of images, etc. The input unit 41 provided on the display unit 40 is configured with at least one of a touch panel provided on the display unit 40, a mouse, a touch pad, a keyboard, and the like. Note that the display unit 40 is not fixed to the imaging device 1, but is provided on any communication device, and the any communication device may be connected to the imaging device 1 wirelessly or by wire.

[0043] The control unit 50 controls the operation of each component of the imaging device 1, and causes the imaging device 1 to perform various processes including the imaging method of the workpiece according to the first embodiment. The control unit 50 controls the imaging unit 20 (the first imaging unit 21 and the second imaging unit 22) and the moving unit 30 to control, set, and change the imaging conditions of the imaging unit 20 (the first imaging unit 21 and the second imaging unit 22), and the imaging unit 20 captures the workpiece 100 under the imaging conditions set, thereby acquiring an image of the workpiece 100. The control unit 50 also displays the acquired image of the workpiece 100 on the display unit 40, thereby visually indicating it to the worker. The control unit 50 also performs image processing based on the acquired image of the workpiece 100 to inspect a predetermined inspection item. The control unit 50 also generates a screen showing the results of the inspected inspection items, and displays the generated screen on the display unit 40, thereby visually indicating it to the worker.

[0044] In the first embodiment, the inspection items of the workpiece 100 include at least one of chipping, cracking, corrosion, adhesion of foreign matter, and processing marks of the workpiece 100. The chipping of the workpiece 100 refers to a chipping state on the front surface 101 side or the back surface 104 side of the workpiece 100 due to an impact or the like applied to the workpiece 100. The cracking of the workpiece 100 refers to a cracking state on the front surface 101 side, the back surface 104 side, or inside the workpiece 100 due to an impact or the like applied to the workpiece 100. Among the chipping and cracking of the workpiece 100, those occurring on the outer periphery of the chip of the device 103 separated from the workpiece 100 are specially referred to as chipping. Thus, the inspection items for chips and cracks in the workpiece 100 are, for example, the presence or absence of chips, cracks, or chipping, or, if present, the extent of the occurrence, as quantified by the area, length, etc. of the occurring portion. Note that, in the following, the presence or absence inspection items are judged based on whether or not the phenomenon of the item occurs, or are judged to be absent when the calculated value for the phenomenon of the item is equal to or less than a predetermined allowable value, and are judged to be present when the calculated value is greater than a predetermined allowable value.

[0045] In the first embodiment, the corrosion of the workpiece 100 refers to the corrosion of the bonding pads arranged on the surface of the device 103. The corrosion of the bonding pads occurs, for example, when an acidic liquid comes into contact with the bonding pads, or when TEG debris generated by processing along the planned division lines 102 adheres to the bonding pads, causing a potential difference between the bonding pads and the TEG debris, causing the bonding pads to dissolve. Thus, the inspection items for the corrosion of the workpiece 100 are, for example, the presence or absence of corrosion of the bonding pads, or, if corrosion has occurred, the extent of the corrosion, quantified by the area of ​​the portion where the corrosion has occurred, etc.

[0046] In embodiment 1, the adhesion of foreign matter to the workpiece 100 occurs when foreign matter such as delamination (hereinafter abbreviated as delamination as appropriate) caused by peeling of a functional layer 107 such as a low-k film or a conductive film laminated on the surface 101 of the workpiece 100, fine dust (hereinafter referred to as debris) generated when performing so-called ablation in which a laser beam of an absorbent wavelength is irradiated onto the workpiece 100 to sublimate or evaporate the workpiece 100, and contamination (hereinafter referred to as contamination) generated from the processing device that processes the workpiece 100 by transporting, processing, etc. of the workpiece 100, the workpiece 100, etc., adheres to the surface 101 or rear surface 104 of the workpiece 100. The inspection items for the adhesion of foreign matter to the workpiece 100 are, for example, the presence or absence of foreign matter adhering to the workpiece 100, or, if there is foreign matter, the extent of the foreign matter, quantified by the area of ​​the part where the foreign matter is adhering, etc.

[0047] In the first embodiment, the processing marks of the workpiece 100 refer to structures formed on the workpiece 100 by processing the workpiece 100, such as the processed groove 109 formed including the grooving groove 109-1 and the full-cut groove 109-2. Items for inspection of the processing marks of the workpiece 100 include the position and deviation of the processed groove 109 in the width direction, including the position of the grooving groove 109-1 in the width direction and the position of the full-cut groove 109-2 in the width direction, the width and deviation of the processed groove 109, including the width of the grooving groove 109-1 and the width of the full-cut groove 109-2, the meandering of the processed groove 109 in the width direction, including the meandering of the grooving groove 109-1 in the width direction and the meandering of the full-cut groove 109-2 in the width direction, and the like, and also include the chip size, chip shape, and deviation of the device 103 surrounded by the processed groove 109, which are calculated based on these inspection results.

[0048] Specifically, the widthwise position and deviation of the machined groove 109, including the widthwise position of the grooving groove 109-1 and the widthwise position of the full-cut groove 109-2, are represented by numerical values ​​representing the positions of both ends (edges) and the widthwise center of the grooving groove 109-1, numerical values ​​representing the direction and magnitude of the widthwise deviation of both ends and the widthwise center of the grooving groove 109-1 from the positions where they are intended to be formed, numerical values ​​representing the positions of both ends and the widthwise center of the full-cut groove 109-2, numerical values ​​representing the direction and magnitude of the widthwise deviation of both ends and the widthwise center of the full-cut groove 109-2 from the positions where they are intended to be formed, etc.

[0049] In addition, the width and deviation of the machined groove 109, including the width of the grooving groove 109-1 and the width of the full-cut groove 109-2, are represented by a numerical value representing the width of the grooving groove 109-1, a numerical value representing the direction (large or small) and magnitude of the deviation of the width of the grooving groove 109-1 from the width that is intended (to be) formed, a numerical value representing the width of the full-cut groove 109-2, a numerical value representing the direction (large or small) and magnitude of the deviation of the width of the full-cut groove 109-2 from the width that is intended (to be) formed, etc.

[0050] Also, the meandering in the width direction of the machined groove 109, including the meandering in the width direction of the grooving groove 109-1 and the meandering in the width direction of the full-cut groove 109-2, is the presence or absence of meandering in the grooving groove 109-1, a numerical value representing the meandering of the grooving groove 109-1, the presence or absence of meandering in the full-cut groove 109-2, a numerical value representing the meandering of the full-cut groove 109-2, etc. Here, the numerical value representing the meandering of any groove is calculated by calculating a pair of end lines forming the groove, calculating a maximum separation distance which is the distance between the points on one end line that are farthest from the other end line, and calculating the difference between the maximum separation distance and the width of the groove.

[0051] In addition, the chip size, chip shape and deviation of the device 103 surrounded by the processed groove 109 are represented by a numerical value representing the average spacing between lines representing a pair of opposing ends (edges) of the device 103 (the horizontal or vertical length when the device 103 is rectangular), a numerical value representing the direction (large or small) of deviation and size of the numerical value representing this average spacing relative to the spacing that is planned (to be) formed, a numerical value representing the area of ​​the region surrounded by the edges of the device 103, a numerical value representing the direction (large or small) of deviation and size of the numerical value representing this area relative to the area that is planned (to be) formed, a mathematical formula or a group of coordinates representing the edges (ends) of the device 103, whether the edges (ends) of the device 103 meander or not, a numerical value representing the meandering of the edges (ends) of the device 103, etc.

[0052] The control unit 50 associates the inspection items of the workpiece 100 with the imaging conditions of the first imaging unit 21 and the second imaging unit 22 that capture images of the workpiece 100 that can suitably inspect the inspection items, and stores them as imaging condition data. The imaging condition data is input in advance by an operator through the input unit 41 and stored in the control unit 50. The imaging condition data is updated by the operator inputting update information through the input unit 41. The control unit 50 refers to the imaging condition data, determines the imaging conditions of the first imaging unit 21 and the second imaging unit 22 that capture images of the workpiece 100 according to the desired inspection items of the workpiece 100, and sets the first imaging unit 21 and the second imaging unit 22 to the determined imaging conditions.

[0053] When the inspection item of the workpiece 100 is chips and cracks in the workpiece 100, the imaging conditions of the first imaging unit 21 and the second imaging unit 22 are set to the irradiation rate of incident light by incident illumination and the irradiation rate of oblique light by oblique illumination at which chips and cracks stand out and are clearly displayed in the captured image, and the focal position in the imaging is set to a height at which chips and cracks are inspected. When the inspection item is chips and cracks in the workpiece 100, the control unit 50 executes image processing to extract chips and cracks based on the image of the workpiece 100 captured under such imaging conditions. The control unit 50 executes inspection processing to inspect chips and cracks in the workpiece 100 by calculating the above-mentioned inspection items of chips and cracks in the workpiece 100 from the chips and cracks extracted by this image processing, and comparing the calculated inspection items with a predetermined reference value input in advance.

[0054] When the inspection item of the workpiece 100 is corrosion of the workpiece 100, the imaging conditions of the first imaging unit 21 and the second imaging unit 22 are set to an irradiation rate of incident light by incident illumination and an irradiation rate of oblique light by oblique illumination at which the corrosion stands out and is clearly displayed in the captured image, and are set to a focal position in imaging that matches the surface height of the bonding pad, which is the height at which corrosion is inspected. When the inspection item is corrosion of the workpiece 100, the control unit 50 executes image processing to extract corrosion based on the image of the workpiece 100 captured under such imaging conditions. The control unit 50 executes an inspection process to inspect corrosion of the workpiece 100 by calculating the above-mentioned inspection items of the corrosion of the workpiece 100 from the corrosion extracted by this image processing, and comparing the calculated inspection items with predetermined reference values ​​input in advance.

[0055] When the inspection item of the workpiece 100 is the adhesion of foreign matter to the workpiece 100, the imaging conditions of the first imaging unit 21 and the second imaging unit 22 are set to the irradiation rate of incident light by incident illumination and the irradiation rate of oblique light by oblique illumination at which the adhesion of foreign matter stands out and is clearly displayed in the captured image, and the focal position in the imaging is set to the height of the front surface 101 or the back surface 104 of the workpiece 100, which is the height at which the adhesion of foreign matter is inspected. When the inspection item is the adhesion of foreign matter to the workpiece 100, the control unit 50 executes image processing to extract the adhesion of foreign matter based on the image of the workpiece 100 captured under such imaging conditions. The control unit 50 executes an inspection process to inspect the adhesion of foreign matter to the workpiece 100 by calculating the above-mentioned inspection item of the adhesion of foreign matter to the workpiece 100 from the adhesion of foreign matter extracted by this image processing, or by comparing the calculated inspection item with a predetermined reference value input in advance.

[0056] When the inspection item of the workpiece 100 is a processing mark of the workpiece 100, and is related to the groove groove 109-1, the imaging conditions of the first imaging unit 21 and the second imaging unit 22 are set to an irradiation rate of incident light by incident illumination and an irradiation rate of oblique light by oblique illumination such that the end of the groove groove 109-1 stands out more clearly than the end of the full-cut groove 109-2 in the captured image, and are set to a focal position in imaging that is set to a height less than the depth of the groove groove 109-1 from the height of the surface 101 of the workpiece 100, which is the height at which the end of the groove groove 109-1 is inspected. In the first embodiment, since the end of the groove groove 109-1 stands out in the captured image due to the oblique light by the oblique illumination, specifically, in this imaging condition, the irradiation rate of oblique light by oblique illumination is set to be relatively large (e.g., 80% or more) and the irradiation rate of incident light by incident illumination is set to be relatively small (e.g., less than 20%). Hereinafter, this imaging condition is referred to as the grooving groove imaging condition. When the inspection item is related to the grooving groove 109-1 of the processing mark of the workpiece 100, the control unit 50 executes image processing to extract the end of the grooving groove 109-1 based on the image of the workpiece 100 imaged under the grooving groove imaging condition. The control unit 50 executes an inspection process to inspect the grooving groove 109-1 of the processing mark of the workpiece 100 by calculating the inspection item related to the grooving groove 109-1 of the processing mark of the workpiece 100 from the end of the grooving groove 109-1 extracted by this image processing, and comparing the calculated inspection item with a predetermined reference value input in advance.

[0057] When the inspection item of the workpiece 100 is the processing mark of the workpiece 100, and the inspection item is related to the full-cut groove 109-2, the imaging conditions of the first imaging unit 21 and the second imaging unit 22 are set to the irradiation rate of the incident light by the incident illumination and the irradiation rate of the oblique light by the oblique illumination such that the end of the full-cut groove 109-2 stands out more clearly than the end of the groove groove 109-1 in the image to be captured, and the focal position is set to a height equal to or higher than the depth of the groove groove 109-1, which is the height at which the end of the full-cut groove 109-2 is inspected. In the image to be captured, the end of the full-cut groove 109-2 stands out by suppressing the oblique light by the oblique illumination and irradiating it with the incident light by the incident illumination. Therefore, in this imaging condition, specifically, the irradiation rate of the oblique light by the oblique illumination is set to be relatively small (for example, less than 20%) and the irradiation rate of the incident light by the incident illumination is set to be relatively large (for example, 80% or more). Hereinafter, this imaging condition is referred to as the full-cut groove imaging condition. When the inspection item is related to the full-cut groove 109-2 of the processing mark of the workpiece 100, the control unit 50 executes image processing to extract the end of the full-cut groove 109-2 based on the image of the workpiece 100 captured under the full-cut groove imaging conditions. The control unit 50 executes an inspection process to inspect the full-cut groove 109-2 of the processing mark of the workpiece 100 by calculating the inspection item related to the full-cut groove 109-2 of the processing mark of the workpiece 100 described above from the end of the full-cut groove 109-2 extracted by this image processing, and comparing the calculated inspection item with a predetermined reference value input in advance.

[0058] When the inspection item for the workpiece 100 is the processing mark of the workpiece 100, if the inspection item requires information on both the end of the groove groove 109-1 and the end of the full-cut groove 109-2, an inspection process is performed to perform an inspection that requires information on both the end of the groove groove 109-1 and the end of the full-cut groove 109-2 of the processing mark of the workpiece 100 by calculating the inspection item that requires information on both the end of the groove groove 109-1 and the end of the full-cut groove 109-2 of the processing mark of the workpiece 100 described above from the end of the groove groove 109-1 extracted based on the image of the workpiece 100 captured under the groove imaging conditions and the end of the full-cut groove 109-2 extracted based on the image of the workpiece 100 captured under the full-cut groove imaging conditions that are different from the groove imaging conditions, or by comparing the calculated inspection item with a predetermined reference value input in advance.

[0059] Fig. 10 and Fig. 11 are diagrams showing images 201 and 202, which are examples of images captured by the imaging device 1 shown in Fig. 6. The image 201 shown in Fig. 10 is an image of an area including a part of the machined groove 109 of the workpiece 100 captured from the front surface 101 side by the first imaging unit 21 under grooving groove imaging conditions. The image 202 shown in Fig. 11 is an image of an area of ​​the workpiece 100 similar to the image 201 captured from the front surface 101 side by the same first imaging unit 21 that captured the image 201 under full-cut groove imaging conditions. As shown in Figures 10 and 11, both images 201 and 202 show a state in which a workpiece 100 has a planned division line 102 formed along the X-axis direction and a planned division line 102 formed along the Y-axis direction intersecting at right angles at the center of the images 201 and 202, devices 103 are formed in the upper left, lower left, upper right, and lower right areas of the planned division line 102, and a processing groove 109 is formed along the planned division line 102 formed along the X-axis direction.

[0060] As shown in FIG. 10, an image 201 captured under the grooving groove imaging condition shows the end of the groove 109-1 more clearly than the end of the full-cut groove 109-2. As shown in FIG. 11, an image 202 captured under the full-cut groove imaging condition shows the end of the full-cut groove 109-2 more clearly than the end of the groove 109-1. In this way, the first imaging unit 21 and the second imaging unit 22 capture images under different imaging conditions, thereby highlighting different parts in the imaging area and capturing images of the workpiece 100 that can suitably inspect different inspection items. Also, the control unit 50 captures images under such different imaging conditions, thereby suitably inspecting different inspection items.

[0061] The control unit 50 uses the X-axis direction moving unit 31 and the Y-axis direction moving unit 32 to move the shooting area of ​​the first imaging unit 21 or the second imaging unit 22 relative to the holding table 10 that holds the workpiece 100, while sequentially shooting (imaging) each small section 110 (see Figure 12, etc.), which is a partition unit of an area equivalent to the area of ​​one shooting area, to obtain multiple small images, which are images of an area equivalent to one shooting area, and combines these multiple small images into one image so that small images shot in adjacent or overlapping areas are smoothly connected to generate a single large image with an area equivalent to the multiple shooting areas.

[0062] The control unit 50 may execute the above-mentioned inspection process on the small images, or may execute the above-mentioned inspection process on the large image generated by executing a synthesis process for synthesizing the small images. That is, the control unit 50 may execute either the inspection process or the synthesis process first.

[0063] The above-mentioned inspection items, image processing, inspection processing, synthesis processing, pre-input predetermined reference values, etc., performed by the control unit 50 are specific examples in embodiment 1, and the present invention is not limited to these and can be changed as appropriate.

[0064] In the first embodiment, the control unit 50 includes a computer system. The computer system included in the control unit 50 includes an arithmetic processing device having a microprocessor such as a CPU (Central Processing Unit), a storage device having a memory such as a ROM (Read Only Memory) or a RAM (Random Access Memory), and an input / output interface device. The arithmetic processing device of the control unit 50 performs arithmetic processing according to a computer program stored in the storage device of the control unit 50, and outputs control signals for controlling the imaging device 1 to each component of the imaging device 1 via the input / output interface device of the control unit 50.

[0065] Next, this specification describes an imaging method of a workpiece according to embodiment 1. In embodiment 1, the X-axis direction and the Y-axis direction of the XYZ coordinate system of the device coordinate system are aligned with the first direction and the second direction in which the division lines 102 and the cutting grooves 109 formed in the workpiece 100 extend, and the imaging unit 20 images the workpiece 100, but the present invention is not limited to this, and the X-axis direction and the Y-axis direction do not have to be aligned with the first direction and the second direction.

[0066] When the imaging method for the workpiece is carried out by the imaging device 1 having a plurality of imaging units 20 (the first imaging unit 21 and the second imaging unit 22) as in the first embodiment, first, before carrying out the outward imaging step 1001, at least one imaging unit 20 that images the workpiece 100 in the outward imaging step 1001 and the return imaging step 1002 is selected and determined. In the first embodiment, the control unit 50 may select and determine the imaging unit 20 in response to receiving an input of the selection of the imaging unit 20 from the operator to the input unit 41, or may select and determine the imaging unit 20 based on selection information of the imaging unit 20 that has been input in advance.

[0067] In embodiment 1, a configuration is described in which the first imaging unit 21 is selected for this imaging unit 20, and the first imaging unit 21 images the workpiece 100 under two types of imaging conditions (first imaging condition, second imaging condition) in the outbound imaging step 1001 and the return imaging step 1002, respectively. However, the present invention is not limited to this, and a configuration may also be used in which the second imaging unit 22 is selected for this imaging unit 20, and the workpiece 100 is images under two types of imaging conditions in the outbound imaging step 1001 and the return imaging step 1002, respectively, by the second imaging unit 22, or a configuration in which both the first imaging unit 21 and the second imaging unit 22 are selected for this imaging unit 20, and the workpiece 100 is images under two types of imaging conditions by both the first imaging unit 21 and the second imaging unit 22, respectively, in the outbound imaging step 1001 and the return imaging step 1002. In addition, in embodiment 1, the second imaging unit 22 that was not selected as the imaging unit 20 to be imaged in the outbound imaging step 1001 and the return imaging step 1002 may be used to capture images of another workpiece 100 while the outbound imaging step 1001 and the return imaging step 1002 are being performed.

[0068] In the imaging method of the workpiece according to the first embodiment, before the outward imaging step 1001 is performed, two different types of inspection items to be inspected by performing image processing based on the image captured by the previously determined imaging unit 20 (first imaging unit 21) are selected and determined, and two types of imaging conditions that can capture images of the workpiece 100 that can suitably inspect the two selected and determined types of inspection items are selected and determined. In the first embodiment, the control unit 50 may select and determine two different types of inspection items in response to receiving an input of the selection of two different types of inspection items from the operator to the input unit 41, or may select and determine two different types of inspection items based on selection information of two different types of inspection items input in advance. Then, the control unit 50 refers to the imaging condition data stored, and selects and determines two different types of imaging conditions that are respectively associated with the two different types of inspection items in the imaging condition data in response to the two different types of inspection items selected and determined.

[0069] Here, of the two different imaging conditions selected and determined, one becomes a first imaging condition in the outward imaging step 1001, and the other becomes a second imaging condition in the return imaging step 1002. Therefore, in the first embodiment, the first imaging condition and the second imaging condition differ from each other in at least one of the irradiation rate of incident light by incident illumination, the irradiation rate of oblique light by oblique illumination, and the focal position in imaging. That is, the first imaging condition and the second imaging condition differ from each other in at least one of the amount of light irradiated to the workpiece 100, the direction of light, and the focal position.

[0070] The outward imaging step 1001 is performed after the above-mentioned selection and determination of the imaging unit 20 and the selection and determination of the two types of imaging conditions. The outward imaging step 1001 is a step in which the holding table 10 having the holding surface 13 for holding the workpiece 100 and the imaging unit 20 for imaging the workpiece 100 held on the holding surface 13 are moved relatively in a first direction parallel to the holding surface 13, and a predetermined area of ​​the workpiece 100 is imaged under the first imaging conditions. In embodiment 1, the outward imaging step 1001 is a step in which, under the control of the control unit 50, the X-axis direction moving unit 31 and the Y-axis direction moving unit 32 relatively move the holding table 10 holding the workpiece 100 and the first imaging unit 21 photographing the surface 101 side of the workpiece 100 in a first direction parallel to the XY plane, and in accordance with this movement, on the outward path along which the first imaging unit 21 moves relative to the workpiece 100 held on the holding table 10, a predetermined area on the surface 101 side of the workpiece 100 is imaged under first imaging conditions by the first imaging unit 21 selected as the imaging unit 20.

[0071] In the forward imaging step 1001, the predetermined area of ​​the workpiece 100 refers to an area of ​​the workpiece 100 whose image is to be captured or inspected, as described above, and can be arbitrarily determined, and may be, for example, one small section 110 (see FIG. 12, etc.), or may include a plurality of small sections 110. In addition, in the forward imaging step 1001, the first direction may be set so that the imaging area of ​​the imaging unit 20 passes over all of the small sections 110 included in the predetermined area of ​​the workpiece 100, and specifically, may be a direction parallel to the X-axis direction, a direction parallel to the Y-axis direction, or a direction intersecting (not parallel to) both the X-axis direction and the Y-axis direction. In addition, the first direction may be constant or may not be constant and may change, and may change depending on the moving distance or moving time, for example, moving a certain distance in the X-axis direction and then moving another distance in the Y-axis direction. Furthermore, in the outward imaging step 1001, the first imaging condition is set to one of two types of imaging conditions selected and determined before the outward imaging step 1001 is performed.

[0072] The return imaging step 1002 is a step in which, after the forward imaging step 1001 is performed, the holding table 10 that holds the workpiece 100 and the imaging unit 20 that is the same as the one that imaged the workpiece 100 in the forward imaging step 1001 are moved relatively in a second direction that is opposite to the first direction, to image a specified area of ​​the workpiece 100 under second imaging conditions different from the first imaging conditions. In embodiment 1, the return path imaging step 1002 is a step in which, under the control of the control unit 50, the X-axis direction moving unit 31 and the Y-axis direction moving unit 32 relatively move the holding table 10 holding the workpiece 100 and the first imaging unit 21 photographing the surface 101 side of the workpiece 100 in a second direction opposite to the first direction, and on the return path, which is the path along which the first imaging unit 21 moves relative to the workpiece 100 held on the holding table 10 as a result of this movement, the first imaging unit 21 selected as the imaging unit 20 images a specified area that is the same as the area imaged in the outward path imaging step 1001 on the surface 101 side of the workpiece 100 under second imaging conditions different from the first imaging conditions.

[0073] The predetermined area of ​​the workpiece 100 in the return path imaging step 1002 indicates the same area as the predetermined area of ​​the workpiece 100 in the forward path imaging step 1001. In addition, in the return path imaging step 1002, the second direction is the opposite direction to the first direction, is a direction parallel to the XY plane, and is determined based on the first direction. For example, when the first direction is expressed as (X, Y) in vector notation in the XY plane using the XY coordinate system, the second direction is a direction expressed in vector notation (-X, -Y). The second direction is constant when the first direction is constant, and changes when the first direction is not constant and changes. In addition, for example, when the first direction is expressed as (X(t), Y(t)) in vector notation, which is a function in which the moving time changes between -t and +t using the XY coordinate system, the second direction is a direction expressed in vector notation (-X(-t), -Y(-t)). Furthermore, in the return journey imaging step 1002, the second imaging condition is set to the other of the two types of imaging conditions selected and determined before the implementation of the outward journey imaging step 1001, which is not the first imaging condition.

[0074] It is acceptable for there to be an area that is imaged in the outbound imaging step 1001 and not imaged in the return imaging step 1002, and for there to be an area that is not imaged in the outbound imaging step 1001 and is imaged in the return imaging step 1002. It is acceptable as long as the area imaged in the outbound imaging step 1001 and the area imaged in the return imaging step 1002 share at least one imaging area, i.e., one small section 110 (see FIG. 12, etc.).

[0075] In the method for imaging a workpiece according to embodiment 1, the imaging unit 20 is moved back and forth relative to the workpiece 100 held on the holding table 10 when the forward imaging step 1001 and the return imaging step 1002 are performed once each, and the forward imaging step 1001 is performed on the forward leg of the reciprocating movement to image and acquire a predetermined area of ​​the workpiece 100 under first imaging conditions, and the return imaging step 1002 is performed on the return leg of the reciprocating movement to image and acquire the same predetermined area of ​​the workpiece 100 under second imaging conditions different from the first imaging conditions. Therefore, by utilizing the reciprocating movement, images of the workpiece 100 imaged under two different imaging conditions can be obtained efficiently in a short time.

[0076] In embodiment 1, for example, the first imaging unit 21 is selected as the imaging unit 20 that performs the outbound imaging step 1001 and the return imaging step 1002, and two types of inspection items are selected: one related to the grooving groove 109-1 of the processing mark on the workpiece 100 and one related to the full-cut groove 109-2. Based on these two types of inspection items, groove groove imaging conditions and full-cut groove imaging conditions are selected as two types of imaging conditions, so that in the outbound imaging step 1001, image 201 shown in FIG. 10 is acquired under the grooving groove imaging conditions, and in the return imaging step 1002, image 202 shown in FIG. 11 is acquired under the full-cut groove imaging conditions of the same shooting area as image 201.

[0077] In the first embodiment, at least one of the outward imaging step 1001 and the return imaging step 1002 acquires a plurality of small images by sequentially photographing each small section 110 while changing the photographing area of ​​the imaging unit 20. That is, at least one of the outward imaging step 1001 and the return imaging step 1002, the X-axis direction moving unit 31 and the Y-axis direction moving unit 32 move the holding table 10 that holds the workpiece 100 and the imaging unit 20 that photographs the workpiece 100 relatively, while moving and changing the photographing area of ​​the imaging unit 20 on the workpiece 100, sequentially photographing each small section 110 corresponding to the photographing area, thereby acquiring a plurality of small images each capturing an image of the plurality of small sections 110. Note that in the first embodiment, in both the outward imaging step 1001 and the return imaging step 1002, the photographing area of ​​the imaging unit 20 may be changed while sequentially photographing each small section 110 to acquire a plurality of small images.

[0078] 12 and 13 are conceptual top views for explaining an example of the forward imaging step 1001 and the return imaging step 1002 shown in FIG. In the first embodiment, the workpiece 100 held on the holding table 10 and the area around the workpiece 100 are expressed by dividing them into small sections 110 as shown in FIG. 12 and FIG. 13. Here, the small sections 110 dividing the workpiece 100 held on the holding table 10 and the area around the workpiece 100 are division units of an area corresponding to the area of ​​one photographing area of ​​the imaging unit 20 (first imaging unit 21) that images the workpiece 100 in the forward imaging step 1001 and the return imaging step 1002, and in the first embodiment, as shown in FIG. 12 and FIG. 13, they are formed in a rectangular shape (or a square shape), and two pairs of opposing sides are oriented in the X-axis direction and the Y-axis direction, respectively, and are arranged without gaps in the divided area.

[0079] When the outward imaging step 1001 and the return imaging step 1002 are performed once each, a round trip path 121 (outward path and return path) for moving the imaging unit 20 back and forth relative to the workpiece 100 held on the holding table 10 can be set to any of a plurality of mutually connected small sections 110. In the first embodiment, as shown in Figs. 12 and 13, the round trip path 121 has a width equivalent to one small section 110 in the X-axis direction (horizontal direction of the paper in Figs. 12 and 13) and is set to one row of small sections 110 extending along the Y-axis direction, in which the small sections 110 are arranged in the Y-axis direction (vertical direction of the paper in Figs. 12 and 13), and a plurality of paths (ten paths 121-1 to 121-10 in the example shown in Fig. 13) are set according to the number of small sections 110 arranged in the X-axis direction. In embodiment 1, the outbound imaging step 1001 and the return imaging step 1002 are performed a number of times corresponding to the number of round trip paths 121 set, and each of the round trip paths 121 of the outbound imaging step 1001 and the return imaging step 1002 that are performed sequentially is set to one row of small sections 110 extending in the Y-axis direction, starting from the -X direction side (the left side of the paper in Figures 12 and 13).

[0080] Specifically, in the first outward imaging step 1001, as shown in Fig. 12(A), one row (round trip path 121-1) of small sections 110 extending in the Y-axis direction on the most -X direction side (the leftmost side of the paper in Fig. 12) is imaged while the imaging unit 20 is moved in the -Y direction (the direction from the top to the bottom of the paper in Fig. 12) relative to the workpiece 100, thereby acquiring small images imaged under first imaging conditions with each small section 110 in the row as an imaging area. In the first return imaging step 1002, as shown in Fig. 12(B), one row (round trip path 121-1) of small sections 110 extending in the Y-axis direction on the most -X direction side is imaged while the imaging unit 20 is moved in the +Y direction (the direction from the bottom to the top of the paper) relative to the workpiece 100, thereby acquiring small images imaged under second imaging conditions with each small section 110 in the row as an imaging area.

[0081] Then, in the second outward imaging step 1001, as shown in FIG. 12(C), the round trip path 121 shifts to one row (round trip path 121-2) of small sections 110 extending in the Y-axis direction on the +X-direction side (one to the right of the paper in FIG. 12) compared to the first time, and images are captured of one row (round trip path 121-2) of small sections 110 extending in the second Y-axis direction from the -X-direction side while moving the imaging unit 20 in the -Y direction relative to the workpiece 100, thereby obtaining small images captured under the first imaging conditions with each small section 110 in the row as the imaging area. In the second return path imaging step 1002, as shown in FIG. 12(D), a row of small sections 110 (round trip path 121-2) extending from the -X direction side to the second Y-axis direction is imaged while the imaging unit 20 is moved relative to the workpiece 100 in the +Y direction, thereby obtaining small images captured under second imaging conditions with each small section 110 in the row as the imaging area.

[0082] In embodiment 1, as shown in FIG. 13, each time the outbound imaging step 1001 and the return imaging step 1002 are performed, the round trip path 121 is shifted to one row of small sections 110 extending in the Y-axis direction to the right from the previous time, and the outbound imaging step 1001 and the return imaging step 1002 are performed, and the outbound imaging step 1001 and the return imaging step 1002 are repeatedly performed until the round trip path 121 shifts to one row of small sections 110 extending in the Y-axis direction to the far right (round trip path 121-10) and the outbound imaging step 1001 and the return imaging step 1002 are performed.

[0083] In this manner, in the first embodiment, the return imaging step 1002 images the area (predetermined area, small section 110) that was imaged in the immediately preceding outward imaging step 1001, and when the condition of the area to be imaged (predetermined area, small section 110) is prone to change, it is possible to image the area under the first imaging conditions and the second imaging conditions in the same or a similar condition.

[0084] In addition, in embodiment 1, multiple round trip paths 121 are set to cover the entire area of ​​the workpiece 100, and the outbound imaging step 1001 and the return imaging step 1002 are performed once for each of the round trip paths 121.By doing this, for each small section 110 in the entire area of ​​the workpiece 100, the outbound imaging step 1001 is performed on the outbound path to capture an image under a first imaging condition and obtain a small image, and the return imaging step 1002 is performed on the return path to capture an image under a second imaging condition different from the first imaging condition and obtain a small image. Therefore, by utilizing the round trip movement, small images captured under two different imaging conditions can be obtained efficiently in a short time for the entire area of ​​the workpiece 100.

[0085] In the first embodiment, the detection step 1003 is performed after the outward imaging step 1001 and the return imaging step 1002. The detection step 1003 is a step of detecting at least one of the following conditions: chipping, cracks, corrosion, adhesion of foreign matter, and processing marks, from the small images acquired in the outward imaging step 1001 and the return imaging step 1002 or an image obtained by combining the small images. In the example of the first embodiment shown in FIG. 1, the detection step 1003 is described as being performed based on the small images acquired in the outward imaging step 1001 and the return imaging step 1002 after the outward imaging step 1001 and the return imaging step 1002 and before the first image generating step 1004 and the second image generating step 1005 described later, but the present invention is not limited to this. The detection step 1003 may be performed based on the first image generated in the first image generating step 1004 after the first image generating step 1004, or may be performed based on the second image generated in the second image generating step 1005 after the second image generating step 1005. Furthermore, in the present invention, the detection step 1003 may be performed at any timing as long as it is performed at least after the outbound imaging step 1001, or may be performed simultaneously with the return imaging step 1002 after the outbound imaging step 1001 is performed, or may be performed simultaneously with the first image generation step 1004 or the second image generation step 1005 after the outbound imaging step 1001 and the return imaging step 1002 are performed, or may be performed simultaneously with the first image generation step 1004 and the second image generation step 1005.

[0086] In the detection step 1003, specifically, the control unit 50 executes an inspection process for inspecting the inspection item associated with the first imaging condition set in the forward imaging step 1001 in the imaging condition data based on the small image acquired in the forward imaging step 1001, and executes an inspection process for inspecting the inspection item associated with the second imaging condition set in the return imaging step 1002 in the imaging condition data based on the small image acquired in the return imaging step 1002. In the detection step 1003, the control unit 50 refers to the imaging condition data stored in the control unit 50 and extracts two types of inspection items associated with the first imaging condition and the second imaging condition, respectively, in the imaging condition data. Here, in the first embodiment, the inspection items include at least one of the conditions of chipping, cracking, corrosion, adhesion of foreign matter, and processing marks of the workpiece 100 as described above, so that at least one of the conditions of chipping, cracking, corrosion, adhesion of foreign matter, and processing marks can be detected by executing an inspection process for any of these inspection items in the detection step 1003.

[0087] In the first embodiment, a first image generating step 1004 is performed after the outward imaging step 1001. The first image generating step 1004 is a step for generating a first image by combining the small images acquired in the outward imaging step 1001. In the first image generating step 1004, the multiple small images acquired in the outward imaging step 1001 are combined into one image such that the small images captured in adjacent shooting areas (small sections 110) are smoothly connected to generate a first image, which is a single large image with an area equivalent to the multiple shooting areas (small sections 110).

[0088] In the first embodiment, a second image generating step 1005 is performed after the return imaging step 1002. The second image generating step 1005 is a step of generating a second image by combining the small images acquired in the return imaging step 1002. In the second image generating step 1005, the multiple small images acquired in the return imaging step 1002 are combined into one image such that the small images captured in adjacent shooting areas (small sections 110) are smoothly connected to generate a second image, which is a single large image with an area equivalent to the multiple shooting areas (small sections 110).

[0089] In the first embodiment, by thus performing the first image generating step 1004 and the second image generating step 1005, it is possible to display the imaging results (images) of a plurality of imaging regions (small sections 110) under the first imaging condition and the second imaging condition, for example, the entire workpiece 100, so that the operator can visually confirm them at a glance. In addition, by spanning a plurality of imaging regions, it is possible to accurately and efficiently obtain large images (first and second images) that can accurately inspect inspection items that can be inspected with higher accuracy, for example, meandering in the width direction of the processed groove 109 (grooving groove 109-1 and full-cut groove 109-2) and meandering of the edge (end) of the device 103.

[0090] The method for imaging the workpiece of embodiment 1 having the above-mentioned configuration moves the imaging unit 20 back and forth relative to the workpiece 100 held on the holding table 10 when performing the forward imaging step 1001 and the return imaging step 1002 once each, and performs the forward imaging step 1001 on the forward path of the reciprocating movement to image and acquire a predetermined area of ​​the workpiece 100 under first imaging conditions, and performs the return imaging step 1002 on the return path of the reciprocating movement to image and acquire the same predetermined area of ​​the workpiece 100 under second imaging conditions different from the first imaging conditions. Therefore, it is possible to efficiently obtain images of the workpiece 100 imaged under two different imaging conditions by utilizing the reciprocating movement in a short time, thereby achieving the effect of reducing the time required to image the workpiece 100 two or more times under different imaging conditions.

[0091] Moreover, in the imaging method of the workpiece according to the first embodiment, at least one of the outward imaging step 1001 and the return imaging step 1002 captures a plurality of small images by sequentially capturing images for each small section 110 while changing the imaging area of ​​the imaging unit 20. Therefore, the imaging method of the workpiece according to the first embodiment can efficiently capture more small images in one outward imaging step 1001 or return imaging step 1002, and therefore the time required to capture an image of the workpiece 100 can be further reduced.

[0092] Moreover, the method for imaging a workpiece according to the first embodiment further includes a detection step 1003 for detecting at least one of chipping, cracks, corrosion, adhesion of foreign matter, and processing marks from the small image. Therefore, the method for imaging a workpiece according to the first embodiment can efficiently obtain images for inspecting many types of desired inspection items of the workpiece 100, and therefore can further reduce the time required to capture an image of the workpiece 100.

[0093] The workpiece imaging method according to the first embodiment further includes a first image generating step 1004 for generating a first image by combining the small images acquired in the outward imaging step 1001, and a second image generating step 1005 for generating a second image by combining the small images acquired in the return imaging step 1002. Therefore, the workpiece imaging method according to the first embodiment can display the imaging results (images) of a plurality of imaging regions (small sections 110) under the first imaging condition and the second imaging condition, for example, the entire workpiece 100, so that the operator can visually recognize them at a glance. Furthermore, the workpiece imaging method according to the first embodiment can accurately and efficiently obtain large images (first and second images) that can accurately inspect inspection items that can be inspected with higher accuracy by spanning a plurality of imaging regions, for example, meandering in the width direction of the processed groove 109 (grooving groove 109-1 and full-cut groove 109-2) and meandering of the edge (end) of the device 103.

[0094] In addition, in the imaging method of the workpiece according to the first embodiment, the first imaging condition and the second imaging condition are different in at least one of the focal position, the amount of light irradiated to the workpiece 100, and the direction of the light. Therefore, the imaging method of the workpiece according to the first embodiment can efficiently capture an image of the workpiece 100 suitable for detecting the state of chipping, cracks, corrosion, adhesion of foreign matter, and processing marks, and can further reduce the time required to capture an image of the workpiece 100.

[0095] In addition, in the imaging method for the workpiece according to the first embodiment, in the imaging device 1 to be implemented, the holding surface 13 of the holding table 10 is formed including a transparent body, and the imaging unit 20 includes a first imaging unit 21 that images the surface of the workpiece 100 that is not held by the holding surface 13, and a second imaging unit 22 that images the surface of the workpiece 100 that is held by the holding surface 13 via the holding surface 13. Therefore, the imaging method for the workpiece according to the first embodiment can obtain images of the workpiece 100 imaged under two types of imaging conditions efficiently in a short time by using reciprocating movement on both the front surface 101 side and the back surface 104 side of the workpiece 100, or on both the front surface 101 side and the back surface 104 side simultaneously in parallel, and therefore the time required to image the workpiece 100 twice or more under different imaging conditions can be reduced.

[0096] In the method for imaging a workpiece according to the first embodiment, the workpiece 100 to be imaged is divided into chips of a plurality of devices 103 by a plurality of processed grooves 109 (grooving grooves 109-1 and full-cut grooves 109-2). Even for the workpiece 100 having a large number of types of inspection items and therefore a large number of types of imaging conditions suitable for each inspection item, the method for imaging a workpiece according to the first embodiment can efficiently obtain images of the workpiece 100 imaged under two types of imaging conditions in a short time by utilizing reciprocating movement, thereby reducing the time required to image the workpiece 100 two or more times under different imaging conditions.

[0097] Moreover, in the imaging method of the workpiece according to the first embodiment, the return imaging step 1002 images the area imaged in the immediately preceding forward imaging step 1001. Therefore, in the imaging method of the workpiece according to the first embodiment, when the state of the imaged area (predetermined area, small section 110) of the workpiece 100 is prone to change, it is possible to image the same or a similar state under the first imaging condition and the second imaging condition.

[0098] [Embodiment 2] A method for imaging a workpiece according to embodiment 2 of the present invention will be described. Figures 14, 15, and 16 are all conceptual top views for explaining an example of an outward imaging step 1001 and a return imaging step 1002 of the method for imaging a workpiece according to embodiment 2. In Figures 14, 15, and 16, the same parts as those in embodiment 1 are denoted by the same reference numerals, and descriptions thereof will be omitted.

[0099] The imaging method of a workpiece of embodiment 2 is the same as that of embodiment 1, except that the round trip paths 121 (ten paths from round trip paths 121-1 to 121-10) shown in Figures 12 and 13 are replaced with round trip paths 122 (outgoing path 122-1 and returning path 122-2) shown in Figures 14, 15, and 16, and the other configurations are the same as those of embodiment 1.

[0100] In the second embodiment, the round trip path 122 is set to include an outgoing path 122-1 shown in FIGS. 14 and 16, and a return path 122-2 shown in FIGS. 14(A), (B), (C), (D) and 16, the outgoing path 122-1 is set as a path in which the imaging unit 20 moves in the -Y direction (a direction from the top to the bottom of the paper in Figs. 14 and 16) relative to the workpiece 100 for one row of small sections 110 extending from the -X direction side (the leftmost side of the paper in Figs. 14 and 16) along the odd-numbered Y-axis direction (the vertical direction of the paper in Figs. 14 and 16), moves in the +Y direction (a direction from the bottom to the top of the paper in Figs. 14 and 16) relative to the workpiece 100 for one row of small sections 110 extending from the -X direction side along the even-numbered Y-axis direction, and then moves from the -X direction side toward the +X direction side (the rightmost side of the paper in Figs. 14 and 16) along one row of small sections 110 extending along the Y-axis direction.

[0101] 15(A), (B), (C), (D) and 16, the return path 122-2 is set as a path in which the imaging unit 20 moves in the +Y direction (from the bottom to the top of the paper in FIGS. 15 and 16) relative to the workpiece 100 for one row of small sections 110 extending from the -X direction side (the leftmost side of the paper in FIGS. 15 and 16) along the odd-numbered Y-axis direction (the vertical direction of the paper in FIGS. 15 and 16), moves in the -Y direction (from the top to the bottom of the paper in FIGS. 15 and 16) relative to the workpiece 100 for one row of small sections 110 extending from the -X direction side along the even-numbered Y-axis direction, and moves from the +X direction side (the rightmost side of the paper in FIGS. 15 and 16) toward the -X direction side for one row of small sections 110 extending along the Y-axis direction.

[0102] In this way, both the outgoing path 122-1 and the returning path 122-2 are set so that the imaging unit 20 moves without overlap or waste over all the small sections 110 arranged on the workpiece 100. Moreover, the outgoing path 122-1 and the returning path 122-2 are set so that the imaging unit 20 moves over all the same small sections 110 in opposite directions from completely opposite sides to each other.

[0103] In the second embodiment, in one outward imaging step 1001, imaging is performed while the imaging unit 20 is moved relative to the workpiece 100 along the outward path 122-1 shown in Fig. 14 and Fig. 16, thereby acquiring small images captured under a first imaging condition with all the small sections 110 included in the outward path 122-1, i.e., all the small sections 110 arranged on the workpiece 100 (the entire surface in a planar view of the workpiece 100) as the imaging region. In the second embodiment, in one return imaging step 1002, imaging is performed while the imaging unit 20 is moved relative to the workpiece 100 along the return path 122-2 shown in Fig. 15 and Fig. 16, thereby acquiring small images captured under a second imaging condition with all the small sections 110 included in the return path 122-2, i.e., all the small sections 110 arranged on the workpiece 100 (the entire surface in a planar view of the workpiece 100) as the imaging region.

[0104] In the second embodiment, a round trip path 122 including one outbound path 122-1 and one return path 122-2 is set so as to cover the entire area of ​​the workpiece 100, and the outbound path imaging step 1001 and the return path imaging step 1002 are performed once each on the one outbound path 122-1 and the one return path 122-2. By performing the outbound path imaging step 1001 on the outbound path 122-1 to capture images under first imaging conditions and obtain small images for each small section 110 in the entire area of ​​the workpiece 100, and the return path imaging step 1002 on the return path 122-2 to capture images under second imaging conditions different from the first imaging conditions and obtain small images, it is possible to efficiently obtain small images captured under two types of imaging conditions for the entire area of ​​the workpiece 100 by utilizing the round trip movement in a short time.

[0105] The imaging method of a workpiece of embodiment 2 having the above-mentioned configuration is the imaging method of a workpiece of embodiment 1 in which the round trip path 121 of embodiment 1 is changed to the round trip path 122 of embodiment 2 (outward path 122-1 and return path 122-2), and therefore has the same effect as embodiment 1, except that the return path imaging step 1002 images the area imaged in the immediately preceding outward path imaging step 1001.

[0106] [Embodiment 3] A method for imaging a workpiece according to embodiment 3 of the present invention will be described. Fig. 17 is a conceptual top view diagram for explaining an example of an outward imaging step 1001 and a return imaging step 1002 of the method for imaging a workpiece according to embodiment 3. In Fig. 17, the same parts as those in embodiment 1 and embodiment 2 are denoted by the same reference numerals, and the description thereof will be omitted.

[0107] The imaging method of the workpiece of embodiment 3 is the same as that of embodiment 1, except that the imaging unit 20 that images the workpiece 100 in the outbound imaging step 1001 and the return imaging step 1002 is changed to an imaging unit 20-2, and the round trip path 121 (10 paths from 121-1 to 121-10) shown in Figures 12 and 13 is changed to a round trip path 123 (outbound path 123-1 and return path 123-2) shown in Figure 17, and the other configurations are the same as those of embodiment 1.

[0108] In the third embodiment, an imaging device 1 in which the imaging unit 20 is changed to an imaging unit 20-2 is used. The imaging unit 20-2 is modified by arranging a plurality of the imaging units 20 of the first embodiment along the X-axis direction for both the first imaging unit 21 and the second imaging unit 22, so that the length of the imaging area, which is an area within the imaging field of view, in the X-axis direction is formed longer than the length of the workpiece 100, which is the imaging target, in the X-axis direction in plan view, as shown in Fig. 17.

[0109] In the third embodiment, the round trip path 123 is set to have an outgoing path 123-1 shown in Fig. 17(A) and (B) and a returning path 123-2 shown in Fig. 17(C) and (D). As shown in Fig. 17(A) and (B), the outgoing path 123-1 is set to a path in which the imaging area of ​​the imaging unit 20-2 is positioned so as to cover one row of small sections 110 extending in the X-axis direction (vertical direction of the paper of Fig. 17) on the most +Y direction side (topmost side of the paper of Fig. 17) of the workpiece 100, and the imaging unit 20-2 is moved relatively in the -Y direction (direction from the top to the bottom of the paper of Fig. 17) with respect to the workpiece 100, so that the imaging area of ​​the imaging unit 20-2 scans all the small sections 110 arranged on the workpiece 100.

[0110] As shown in Figures 17(C) and (D), the return path 123-2 is set as a path that positions the imaging area of ​​the imaging unit 20-2 so as to cover one row of small sections 110 extending in the X-axis direction (the vertical direction of the paper in Figure 17) on the -Y side of the workpiece 100 (the bottom side of the paper in Figure 17), and moves the imaging unit 20-2 in the +Y direction (the direction from the bottom to the top of the paper in Figure 17) relative to the workpiece 100 to scan the imaging area of ​​the imaging unit 20-2 over all of the small sections 110 arranged on the workpiece 100.

[0111] In this way, both the outgoing path 123-1 and the returning path 123-2 are set so that the imaging unit 20-2 moves without overlap or waste over all the small sections 110 arranged on the workpiece 100. Also, the outgoing path 123-1 and the returning path 123-2 are set so that the imaging unit 20-2 moves over all the same small sections 110 in opposite directions from completely opposite sides to each other.

[0112] In the third embodiment, in one outward imaging step 1001, imaging is performed while the imaging unit 20-2 is moved relative to the workpiece 100 along the outward path 123-1 shown in Fig. 17(A) and (B), thereby acquiring small images captured under a first imaging condition with all the small sections 110 included in the outward path 123-1, i.e., all the small sections 110 arranged on the workpiece 100 (the entire surface in a planar view of the workpiece 100) as the imaging area. In the third embodiment, in one return imaging step 1002, imaging is performed while the imaging unit 20-2 is moved relative to the workpiece 100 along the return path 123-2 shown in Fig. 17(C) and (D), thereby acquiring small images captured under a second imaging condition with all the small sections 110 included in the return path 123-2, i.e., all the small sections 110 arranged on the workpiece 100 (the entire surface in a planar view of the workpiece 100) as the imaging area.

[0113] In embodiment 3, a round trip path 123 including one outbound path 123-1 and one return path 123-2 is set so as to cover the entire area of ​​the workpiece 100, and the outbound path imaging step 1001 and the return path imaging step 1002 are performed once each on the one outbound path 123-1 and the one return path 123-2. By performing the outbound path imaging step 1001 on the outbound path 123-1 to capture small images under first imaging conditions for each small section 110 in the entire area of ​​the workpiece 100, and the return path imaging step 1002 on the return path 123-2 to capture small images under second imaging conditions different from the first imaging conditions, it is possible to efficiently obtain small images captured under two types of imaging conditions for the entire area of ​​the workpiece 100 by utilizing the round trip movement in a short time.

[0114] The imaging method of a workpiece of embodiment 3 having the above-mentioned configuration is the same as the imaging method of embodiment 1 except that the imaging unit 20 is changed to an imaging unit 20-2 in which the length of the imaging area in the X-axis direction is longer than the length of the workpiece 100 to be imaged in a planar view in the X-axis direction, and the round trip path 121 of embodiment 1 is changed to the round trip path 123 of embodiment 3 (outgoing path 123-1 and returning path 123-2), and therefore the same effect as embodiment 1 is achieved.

[0115] [Modifications] A method for imaging a workpiece according to a modified example of the present invention will be described. Fig. 18 is a perspective view showing a configuration example of an imaging device 1 for implementing the method for imaging a workpiece according to the modified example. Fig. 19 is a diagram showing an example of a display screen 210 displayed in the method for imaging a workpiece according to the modified example. In Figs. 18 and 19, the same reference numerals are assigned to the same parts as those in the first, second and third embodiments, and the description thereof will be omitted.

[0116] The imaging method of a workpiece according to the modified example is the same as that according to the first, second and third embodiments, except that it is performed by an imaging device 1 provided in conjunction with a processing device 300 that processes a workpiece 100 as shown in FIG. 18, and that a display screen 210 as shown in FIG. 19 is additionally displayed; the other configurations are the same as those of the first, second and third embodiments.

[0117] As shown in FIG. 18, the processing apparatus 300 includes a chuck table 310, a processing unit 320, a moving unit 330, a control unit 340, a cassette placement table 351, transport units 352 and 353, and a cleaning unit 354.

[0118] The chuck table 310 includes a disk-shaped frame body with a recess formed therein and a disk-shaped suction part fitted into the recess. The suction part of the chuck table 310 is made of porous ceramics or the like with a large number of porous holes, and is connected to a vacuum suction source (not shown) via a vacuum suction path (not shown). The upper surface of the suction part of the chuck table 310 is a holding surface 311 on which the workpiece 100 is placed and which suction-holds the placed workpiece 100 by negative pressure introduced from the vacuum suction source. The holding surface 311 and the upper surface of the frame body of the chuck table 310 are arranged on the same plane and are formed parallel to the XY plane, which is a horizontal plane. The chuck table 310 is provided so as to be movable in the X-axis direction by an X-axis movement unit 331 of the movement unit 330. The chuck table 310 is provided so as to be rotatable around the Z-axis by a rotation movement unit 334 of the movement unit 330.

[0119] In a modified example, the processing unit 320 is a cutting unit including a cutting blade and a spindle, as shown in FIG. 18. The cutting blade is attached to the tip of the spindle, and is rotated by the spindle, which serves as a rotation axis, to cut the workpiece 100 held on the chuck table 310. The spindle is provided rotatably around an axis parallel to the Y-axis direction, and is rotated around the axis by a motor (not shown) connected to the spindle. The spindle supports the cutting blade attached to the tip of the spindle rotatably around an axis parallel to the Y-axis direction. The processing unit 320 is provided so as to be movable in the Y-axis direction and the Z-axis direction by a Y-axis direction moving unit 332 and a Z-axis direction moving unit 333 of the moving unit 330, respectively.

[0120] The processing unit 320 rotates the cutting blade attached to the tip of the spindle around an axis parallel to the Y-axis direction by rotating the spindle, while moving (processing feed) the cutting blade along the X-axis direction, which is the processing feed direction, relative to the workpiece 100 on the chuck table 310 using the X-axis direction moving unit 331, thereby cutting the workpiece 100, for example, from the front surface 101 side along the intended division line 102, reaching the back surface 104 side, forming a processing groove 109 that penetrates in the thickness direction, and dividing the workpiece 100 along the intended division line 102.

[0121] In addition, in the present invention, the processing unit 320 is not limited to a cutting unit, but may be one that performs other processing on the workpiece 100, such as a laser processing unit that has a laser beam irradiator that irradiates the workpiece 100 with a laser beam and laser processes the workpiece 100 with the laser beam, or a grinding unit that has a spindle on which a grinding wheel with a grinding wheel disposed thereon is rotatably mounted and grinds the workpiece 100 with the grinding wheel.

[0122] The moving unit 330 moves the chuck table 310 and the processing unit 320 relatively along the X-axis direction, the Y-axis direction, and the Z-axis direction. As shown in Fig. 18, the moving unit 330 has an X-axis direction moving unit 331, a Y-axis direction moving unit 332, a Z-axis direction moving unit 333, and a rotational moving unit 334. The X-axis direction moving unit 331, the Y-axis direction moving unit 332, the Z-axis direction moving unit 333, and the rotational moving unit 334 move the chuck table 310 and the processing unit 320 relatively in the X-axis direction, the Y-axis direction, the Z-axis direction, and a rotational direction around the Z-axis, respectively. The X-axis direction moving unit 331 and the rotational moving unit 334 move the chuck table 310 relatively to the processing unit 320 in the X-axis direction and a rotational direction around the Z-axis, respectively. The Y-axis direction moving unit 332 and the Z-axis direction moving unit 333 move the processing unit 320 relative to the chuck table 310 along the Y-axis direction and the Z-axis direction, respectively.

[0123] The cassette placement table 351 is a placement table on which a cassette 355, which is a container for accommodating a plurality of workpieces 100, is placed, and raises and lowers the placed cassette 355 in the Z-axis direction. The transport unit 352 transports the workpiece 100 between the inside of the cassette 355 placed on the cassette placement table 351 and the chuck table 310 or the spinner table of the cleaning unit 354. The transport unit 353 transports the workpiece 100 between the processing device 300 and the imaging device 1. The cleaning unit 354 includes a spinner table, and cleans the workpiece 100 held on the spinner table, thereby removing contamination such as processing debris that is generated when processing is performed by the processing unit 320 and adheres to the workpiece 100.

[0124] The control unit 340 controls the operation of each component of the processing device 300, and causes the processing device 300 to perform various processes including the processing of the workpiece 100. The control unit 340 includes a computer system similar to the control unit 50. The arithmetic processing device of the control unit 340 performs arithmetic processing according to a computer program stored in a storage device of the control unit 340, and outputs a control signal for controlling the processing device 300 to each component of the processing device 300 via an input / output interface device of the control unit 340.

[0125] The control unit 50 of the imaging device 1 and the control unit 340 of the processing device 300 are connected to each other so as to be able to transmit and receive information to each other by wireless communication or wired communication. The control unit 340 of the processing device 300 acquires information on processing data of the workpiece 100 detected by any detector or the like provided in each component of the processing device 300 while the workpiece 100 is being processed by the processing device 300, and transmits the acquired processing data of the workpiece 100 to the control unit 50.

[0126] Here, in a modified example, the processing data for the workpiece 100 includes, for example, the vibration of the mount that fixes the cutting blade to the tip of the spindle in the processing unit 320, the current value (spindle current value) and voltage value (spindle voltage value) of the motor that drives the spindle of the processing unit 320, the torque generated in the spindle of the processing unit 320, the vibration of the chuck table 310 that holds the workpiece 100, the current value and voltage value of the motor of the rotational movement unit 334 that rotates and moves the chuck table 310, the torque generated when the chuck table 310 rotates and moves, the load in the Z-axis direction applied to the chuck table 310, the processing feed rate, which is the relative movement speed of the processing unit 320 with respect to the chuck table 310, the supply pressure, temperature and flow rate of cutting water, the thickness of the workpiece 100, etc.

[0127] The control unit 50 of the imaging device 1 receives and acquires information on the processing data of the workpiece 100 from the control unit 340 of the processing device 300. Based on the information on the image of the workpiece 100 acquired by the imaging method of the workpiece, the information on the inspection items of the workpiece 100 acquired in the detection step 1003 of the imaging method of the workpiece, and the information on the processing data of the workpiece 100 acquired from the control unit 340 of the processing device 300, the control unit 50 generates a display screen 210 as shown in FIG. 19, for example, which displays the information on the workpiece 100 and the position on the workpiece 100, and displays the generated display screen 210 on the display unit 40. The information on the image of the workpiece 100 acquired by the imaging method of the workpiece may be a small image acquired in the forward imaging step 1001 and the return imaging step 1002, a first image acquired in the first image generation step 1004, or a second image acquired in the second image generation step 1005.

[0128] 19, the display screen 210 shows the entire surface of the surface 101 of the workpiece 100, and also shows a first image or a second image showing the groove 109 formed in the workpiece 100 by the machining unit 320, a colored display 131 showing an area where the spindle current value was equal to or greater than a predetermined threshold during machining to form the groove 109 as machining data information, and a mark display 132 showing an area where chipping exceeding a predetermined allowable value was detected as inspection item information. The display screen 210 shown in FIG. 19 shows that there is no correlation between the colored display 131 and the mark display 132, and therefore, since there is no correlation between the spindle current value and chipping, it is possible to efficiently and effectively analyze that the cause of chipping is likely not the spindle current value, but is likely to be another element of the machining device 300.

[0129] The imaging method of a workpiece of the modified example having the above-mentioned configuration is the imaging method of a workpiece of the first embodiment modified so that it is performed by an imaging device 1 provided in conjunction with a processing device 300 that processes the workpiece 100, and modified so that a display screen 210 is additionally displayed. Therefore, the display screen 210 makes it possible to efficiently and effectively analyze processing defects caused by the processing device 300.

[0130] It should be noted that the present invention is not limited to the above-described embodiment, and can be practiced in various modified forms without departing from the gist of the present invention. [Explanation of symbols]

[0131] 10 Holding table 13 Holding surface 20,20-2 Imaging unit 21 First Imaging Unit 22 Second imaging unit 100 Workpiece 109 Machining groove 110 Plot 1001 Outward imaging step 1002 Return imaging step 1003 Detection Step 1004 First image generation step 1005 Second image generating step

Claims

1. An imaging method for imaging a workpiece, comprising: a forward imaging step of relatively moving a holding table having a holding surface for holding a workpiece and an imaging unit for imaging the workpiece held on the holding surface in a first direction parallel to the holding surface, and imaging a predetermined area of ​​the workpiece under a first imaging condition; a return imaging step in which, after the outward imaging step, the holding table and the imaging unit are relatively moved in a second direction opposite to the first direction, and a predetermined area of ​​the workpiece is imaged under a second imaging condition different from the first imaging condition; A method for imaging a workpiece comprising:

2. The method for imaging a workpiece as described in claim 1, characterized in that at least one of the outward imaging step and the return imaging step involves changing the imaging area of ​​the imaging unit and sequentially photographing each small section to obtain a plurality of small images.

3. a first image generating step of generating a first image by combining the small images acquired in the forward imaging step; a second image generating step of generating a second image by combining the small images acquired in the return imaging step; The method of claim 2 further comprising:

4. 4. The method for imaging a workpiece according to claim 2 or 3, further comprising a detection step of detecting at least one of chipping, cracks, corrosion, adhesion of foreign matter, and processing marks from the small image or an image obtained by combining the small images.

5. The method for imaging a workpiece according to claim 1, characterized in that the first imaging condition and the second imaging condition differ in at least one of the focal position, the amount of light irradiated to the workpiece, and the direction of light.

6. The holding surface is formed to include a transparent body, The imaging unit includes a first imaging unit that images a surface of the workpiece that is not held on the holding surface, and a second imaging unit that images a surface of the workpiece that is held on the holding surface via the holding surface. The method for imaging a workpiece according to claim 1 .

7. 2. The method for imaging a workpiece according to claim 1, wherein the workpiece has a plurality of machining grooves formed therein.

8. 2. The method for imaging a workpiece according to claim 1, wherein the return imaging step images an area imaged in the immediately preceding outward imaging step.

Images