High frequency module and communication device

Abstract

To achieve both reduction of the height of a high frequency module and strength for a mounting substrate.SOLUTION: A high frequency module 1 includes a mounting substrate 2, a first electronic component 3, and a second electronic component 4. The mounting substrate 2 has a first main surface 21 and a second main surface 22. The mounting substrate 2 has a first recess 61 and a second recess 62. A first bump 33 of the first electronic component 3 is disposed in the first recess 61 of the mounting substrate 2. A second bump 43 of the second electronic component 4 is disposed in the second recess 62 of the mounting substrate 2. The mounting substrate 2 has a first region and a second region. The first region is a region in which a plurality of recesses including the first recess 61 and the second recess 62 are formed. The second region is a region in which a plurality of recesses are not formed. The second region of the mounting substrate 2 is located between the first bump 33 of the first electronic component 3 and the second bump 43 of the second electronic component 4 in a plan view from a thickness direction D1 of the mounting substrate 2.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention generally relates to a high frequency module and a communication device, and more particularly to a high frequency module including a plurality of electronic components, and a communication device including the high frequency module. [Background technology]

[0002] Patent Document 1 describes a passive on-package including a substrate having a recessed portion. In the passive on-package described in Patent Document 1, bumps are arranged in the recessed portion of the substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Special Publication No. 2017-515295 Summary of the Invention [Problem to be solved by the invention]

[0004] However, with the conventional passive on package described in Patent Document 1, in a high-frequency module in which electronic components such as passive on package are arranged on a mounting board, it is difficult to achieve both a low profile of the high-frequency module and strength of the mounting board.

[0005] The present invention has been made in view of the above-mentioned points, and has an object to provide a high-frequency module and a communication device that can achieve both a low profile and strength of a mounting board. [Means for solving the problem]

[0006] A high-frequency module according to an aspect of the present invention includes a mounting substrate, a first electronic component, and a second electronic component. The mounting substrate has a first main surface and a second main surface. The first main surface and the second main surface face each other. The first electronic component is disposed on the first main surface of the mounting substrate and has a first bump. The second electronic component is disposed on the first main surface of the mounting substrate and has a second bump. The mounting substrate has a first recess and a second recess. The first recess is formed on the first main surface. The second recess is formed on the first main surface and is different from the first recess. The first bump is disposed in the first recess of the mounting substrate. The second bump is disposed in the second recess of the mounting substrate. The mounting substrate has a first region and a second region. The first region is a region in which a plurality of recesses including the first recess and the second recess are formed. The second region is a region in which the plurality of recesses are not formed. The second region of the mounting substrate is located between the first bump of the first electronic component and the second bump of the second electronic component in a plan view in a thickness direction of the mounting substrate.

[0007] A communication device according to an aspect of the present invention includes the radio frequency module and a signal processing circuit, the signal processing circuit being connected to the radio frequency module. Effect of the Invention

[0008] According to the radio frequency module and communication device according to the above aspects of the present invention, it is possible to achieve both a low profile of the radio frequency module and strength of the mounting board. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a cross-sectional view of the high-frequency module according to the first embodiment. [Diagram 2] FIG. 2 is a plan view of the high-frequency module. [Diagram 3] FIG. 3 is a block diagram of the communication device according to the first embodiment. [Figure 4]FIG. 4 is a plan view of a main part of a mounting board of a high-frequency module according to the second embodiment. [Diagram 5] Fig. 5A is a cross-sectional view of a main part of a mounting board of a high-frequency module according to embodiment 3. Fig. 5B is a cross-sectional view of a main part of a mounting board of a high-frequency module according to variation 1 of embodiment 3. Fig. 5C is a cross-sectional view of a main part of a mounting board of a high-frequency module according to variation 2 of embodiment 3. [Figure 6] FIG. 6 is a plan view of a main part of a mounting board of a high-frequency module according to the fourth embodiment. [Figure 7] FIG. 7 is a plan view of a main part of a mounting board of a high-frequency module according to the fifth embodiment. [Figure 8] FIG. 8 is a cross-sectional view of the high-frequency module according to the sixth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, a high-frequency module 1 and a communication device 9 according to embodiments 1 to 6 will be described with reference to the drawings. Fig. 1, Fig. 2, Fig. 4 to Fig. 8 referred to in the following embodiments are schematic diagrams, and the ratios of sizes and thicknesses of components in the drawings do not necessarily reflect the actual dimensional ratios. Fig. 1 is a cross-sectional view taken along line X1-X1 in Fig. 2.

[0011] (Embodiment 1) (1) High-frequency module The configuration of a high-frequency module 1 according to the first embodiment will be described with reference to the drawings.

[0012] As shown in FIG. 1, the high-frequency module 1 according to the first embodiment includes a mounting substrate 2, a first electronic component 3, a second electronic component 4, and a resin layer 51. The mounting substrate 2 has a first main surface 21 and a second main surface 22. The first main surface 21 and the second main surface 22 face each other. The first electronic component 3 is disposed on the first main surface 21 of the mounting substrate 2 and has a plurality of first bumps 33. The second electronic component 4 is disposed on the first main surface 21 of the mounting substrate 2 and has a plurality of second bumps 43. The mounting substrate 2 has a plurality of first recesses 61 and a plurality of second recesses 62. The plurality of first recesses 61 are formed on the first main surface 21. The plurality of second recesses 62 are formed on the first main surface 21 and are different from the plurality of first recesses 61. The first bumps 33 are disposed in the first recesses 61 of the mounting substrate 2. The second bumps 43 are disposed in the second recesses 62 of the mounting substrate 2. The mounting substrate 2 has a first region and a second region. The first region is a region in which a plurality of recesses including a first recess 61 and a second recess 62 are formed. The second region is a region in which a plurality of recesses are not formed. The second region of the mounting substrate 2 is located between the first bump 33 of the first electronic component 3 and the second bump 43 of the second electronic component 4 in a plan view from a thickness direction D1 of the mounting substrate 2.

[0013] In this specification, "the second region of the mounting substrate 2 is located between the first bump 33 of the first electronic component 3 and the second bump 43 of the second electronic component 4 in a plan view from the thickness direction D1 of the mounting substrate 2" means that the second region of the mounting substrate 2 is located in a region surrounded by straight lines connecting any point of the first electronic component 3 and any point of the second electronic component 4. In this case, it is sufficient that at least a part of the second region of the mounting substrate 2 is included in the region surrounded by straight lines connecting any point of the first electronic component 3 and any point of the second electronic component 4.

[0014] According to the high-frequency module 1 of the first embodiment, it is possible to achieve both a low profile of the high-frequency module 1 and strength of the mounting substrate 2.

[0015] (2) Components of the RF module Hereinafter, each component of the high-frequency module 1 according to the first embodiment will be described with reference to the drawings.

[0016] As shown in FIG. 1, the high-frequency module 1 according to the first embodiment includes a mounting substrate 2, a first electronic component 3, a second electronic component 4, a resin layer 51, and a plurality of external connection terminals (not shown).

[0017] (2.1) Mounting board 1, the mounting board 2 has a first main surface 21 and a second main surface 22. The first main surface 21 and the second main surface 22 face each other. More specifically, the first main surface 21 and the second main surface 22 face each other in a thickness direction D1 of the mounting board 2. The mounting board 2 is a board for arranging a plurality of electronic components, and is, for example, a rectangular plate. The first main surface 21 and the second main surface 22 are, for example, rectangular. The second main surface 22 faces an external board (not shown) when the high-frequency module 1 is provided on the external board.

[0018] The mounting substrate 2 has a plurality of dielectric layers 23 and a plurality of conductive layers. The mounting substrate 2 is, for example, a multi-layer substrate having a plurality of dielectric layers 23 and a plurality of conductive layers. The plurality of dielectric layers 23 and the plurality of conductive layers are stacked in a thickness direction D1 of the mounting substrate 2.

[0019] Each of the plurality of conductive layers includes one or more conductor portions in a plane perpendicular to the thickness direction D1 of the mounting substrate 2. The plurality of conductive layers are formed in a predetermined pattern determined for each layer. The material of each conductive layer is, for example, copper.

[0020] The multiple conductive layers include a ground layer (not shown). The ground layer is a layer set to a ground potential (reference potential) and is provided inside the mounting board 2. When the high-frequency module 1 is placed on an external board (e.g., a motherboard), the ground layer is connected to the ground of the external board through a via conductor or the like of the mounting board 2 and is maintained at the ground potential (reference potential).

[0021] The mounting substrate 2 is, for example, a low temperature co-fired ceramics (LTCC) substrate. Note that the mounting substrate 2 is not limited to an LTCC substrate, and may be, for example, a printed wiring board, a high temperature co-fired ceramics (HTCC) substrate, or a resin multilayer substrate.

[0022] (2.2) First electronic component 1 and 2, the first electronic component 3 is disposed on the first main surface 21 of the mounting board 2. More specifically, the first electronic component 3 is mounted on the first main surface 21 of the mounting board 2. The first electronic component 3 is, for example, an amplifier or a filter. The first electronic component 3 is, for example, a power amplifier, a transmission filter, a reception filter, or a low-noise amplifier.

[0023] The first electronic component 3 has a main body 31, a plurality of electrodes 32, and a plurality of first bumps 33. The first electronic component 3 is disposed on the first main surface 21 of the mounting substrate 2 by connecting the plurality of electrodes 32 to a plurality of first electrodes 71 provided on the first main surface 21 of the mounting substrate 2 via the plurality of first bumps 33.

[0024] The main body 31 has a functional part. The main body 31 is disposed on the mounting board 2 such that one main surface 311 of the main body 31 faces the mounting board 2 in the thickness direction D1 of the mounting board 2. More specifically, the one main surface 311 of the main body 31 faces the first main surface 21 of the mounting board 2 in a state in which the first electronic component 3 is disposed on the mounting board 2.

[0025] The multiple electrodes 32 are formed on one main surface 311 of the main body portion 31. The multiple electrodes 32 are provided, for example, on the one main surface 311 of the main body portion 31 and spaced apart from each other.

[0026] The multiple first bumps 33 are bumps for connecting the multiple electrodes 32 to a conductive layer of the mounting substrate 2. The multiple first bumps 33 are arranged on the multiple electrodes 32. Each of the first bumps 33 is formed, for example, in a circular shape. Each of the first bumps 33 is formed, for example, of solder.

[0027] (2.3) Secondary Electronic Component The second electronic component 4 is disposed on the first main surface 21 of the mounting board 2, as shown in Figs. 1 and 2. More specifically, the second electronic component 4 is mounted on the first main surface 21 of the mounting board 2. The second electronic component 4 is, for example, an amplifier or a filter. The second electronic component 4 is, for example, a power amplifier, a transmission filter, a reception filter, or a low-noise amplifier. The second electronic component 4 is disposed adjacent to the first electronic component 3 in the first direction D21. The first direction D21 is a direction perpendicular to both the thickness direction D1 and the second direction D22 of the mounting board 2.

[0028] The second electronic component 4 has a main body 41, a plurality of electrodes 42, and a plurality of second bumps 43. The second electronic component 4 is disposed on the first main surface 21 of the mounting substrate 2 by connecting the plurality of electrodes 42 to a plurality of second electrodes 72 provided on the first main surface 21 of the mounting substrate 2 via the plurality of second bumps 43.

[0029] The main body portion 41 has a functional portion. The main body portion 41 is disposed on the mounting board 2 such that one main surface 411 of the main body portion 41 faces the mounting board 2 in the thickness direction D1 of the mounting board 2. More specifically, the one main surface 411 of the main body portion 41 faces the first main surface 21 of the mounting board 2 in a state in which the second electronic component 4 is disposed on the mounting board 2.

[0030] The multiple electrodes 42 are formed on one main surface 411 of the main body portion 41. The multiple electrodes 42 are provided, for example, on the one main surface 411 of the main body portion 41 and spaced apart from each other.

[0031] The second bumps 43 are bumps for connecting the electrodes 42 to a conductive layer of the mounting substrate 2. The second bumps 43 are arranged on the electrodes 42. Each of the second bumps 43 is formed, for example, in a circular shape. Each of the second bumps 43 is formed, for example, of solder.

[0032] (2.4) Layout relationship between the mounting board and the first and second electronic components 1, the mounting substrate 2 has a plurality of first recesses 61 and a plurality of second recesses 62. The plurality of first recesses 61 are formed on the first main surface 21 of the mounting substrate 2. Each of the plurality of first recesses 61 has a bottom surface 611 and a side surface 612. The plurality of second recesses 62 are formed on the first main surface 21 of the mounting substrate 2. The plurality of second recesses 62 are recesses different from the plurality of first recesses 61. Each of the plurality of second recesses 62 has a bottom surface 621 and a side surface 622.

[0033] The mounting substrate 2 has a plurality of first electrodes 71 and a plurality of second electrodes 72. The plurality of first electrodes 71 are arranged in a plurality of first recesses 61. More specifically, the plurality of first electrodes 71 are arranged on bottom surfaces 611 of the plurality of first recesses 61. The plurality of second electrodes 72 are arranged in a plurality of second recesses 62. More specifically, the plurality of second electrodes 72 are arranged on bottom surfaces 621 of the plurality of second recesses 62.

[0034] The multiple first bumps 33 of the first electronic component 3 are arranged in multiple first recesses 61 of the mounting substrate 2. More specifically, each of the multiple first bumps 33 is arranged in the first recess 61 such that at least a portion of the first bump 33 is accommodated in the first recess 61. In the example of FIG. 1, the two central first recesses 61 are integrated to form a first recess 61a.

[0035] By arranging the first bump 33 of the first electronic component 3 in the first recess 61 of the mounting substrate 2, the height of the first electronic component 3 from the first main surface 21 of the mounting substrate 2 on which no recesses (including the first recess 61 and the second recess 62) are formed can be reduced, thereby making it possible to reduce the height of the high-frequency module 1.

[0036] The second bumps 43 of the second electronic component 4 are disposed in the second recesses 62 of the mounting substrate 2. More specifically, each of the second bumps 43 is disposed in the second recess 62 such that at least a portion of the second bump 43 is accommodated in the second recess 62.

[0037] By arranging the second bump 43 of the second electronic component 4 in the second recess 62 of the mounting substrate 2, the height of the second electronic component 4 from the first main surface 21 of the mounting substrate 2 on which no recesses (including the first recess 61 and the second recess 62) are formed can be reduced, thereby making it possible to reduce the height of the high-frequency module 1.

[0038] The mounting substrate 2 has a first region and a second region. The first region is a region in which a plurality of recesses including a plurality of first recesses 61 and a plurality of second recesses 62 are formed. The second region is a region in which a plurality of recesses are not formed. The second region of the mounting substrate 2 is located between the first bump 33 of the first electronic component 3 and the second bump 43 of the second electronic component 4 in a plan view from the thickness direction D1 of the mounting substrate 2. This allows the thickness of the mounting substrate 2 between the first recess 61 and the second recess 62 to be increased, and therefore the strength of the mounting substrate 2 can be increased compared to a case in which a recess is formed between the first recess 61 and the second recess 62.

[0039] The first bump 33 of the first electronic component 3 is, for example, an RF bump, and the second bump 43 of the second electronic component 4 is, for example, a ground bump. This separates the RF bump of the first electronic component 3 from the ground bump of the second electronic component 4 by the second region. As a result, it is possible to reduce short circuits between adjacent RF bumps and ground bumps, thereby suppressing mounting defects in the high-frequency module 1.

[0040] The first electronic component 3 and the second electronic component 4 have main body parts 31, 41 including a functional part. The main body parts 31, 41 of the first electronic component 3 and the second electronic component 4 are located outside the mounting board 2. This makes it possible to increase the strength of the mounting board 2 compared to a case in which recesses for accommodating the main body parts 31, 41 of the first electronic component 3 and the second electronic component 4 are formed in the mounting board 2.

[0041] (2.5) Resin layer 1, the resin layer 51 is disposed on the first main surface 21 of the mounting board 2. The resin layer 51 contacts the first main surface 21 of the mounting board 2 and covers at least a portion of the first electronic component 3 and the second electronic component 4. This makes it possible to protect the mounting board 2, the first electronic component 3, and the second electronic component 4.

[0042] The resin layer 51 includes a resin and a filler (not shown). The resin is, for example, an epoxy resin. In the high-frequency module 1, the distance L1 between the main body 31 of the first electronic component 3 and the mounting board 2 is larger than the diameter of the filler contained in the resin layer 51. As a result, the resin layer 51 penetrates to the periphery of the first bump 33 of the first electronic component 3, so that it is possible to prevent solder splash when the high-frequency module 1 is mounted on a motherboard. As a result, it is possible to improve the connection reliability of the first electronic component 3. In addition, the distance L2 between the main body 41 of the second electronic component 4 and the mounting board 2 is larger than the diameter of the filler contained in the resin layer 51. As a result, the resin layer 51 penetrates to the periphery of the second bump 43 of the second electronic component 4, so that it is possible to prevent solder splash when the high-frequency module 1 is mounted on a motherboard. As a result, it is possible to improve the connection reliability of the second electronic component 4.

[0043] (2.6) External connection terminal The multiple external connection terminals (not shown) are arranged, for example, on the second main surface 22 of the mounting board 2. The multiple external connection terminals are terminals for electrically connecting the mounting board 2 to an external board (not shown). The multiple external connection terminals are arranged on the second main surface 22 of the mounting board 2 at intervals from each other.

[0044] Each of the external connection terminals is a flat conductive member, and is made of, for example, a metal (for example, copper, a copper alloy, etc.).

[0045] Each external connection terminal is connected to an external connection electrode of an external substrate. In this specification, "A (e.g., an external connection terminal) is connected to B (e.g., an external connection electrode of an external substrate)" does not only mean that A and B are in contact with each other, but also means that A and B are electrically connected via a conductor electrode, a conductor terminal, wiring, or other circuit components. The multiple external connection terminals are connected to the external connection electrodes of the external substrate via, for example, a connection member (e.g., a solder bump) formed of a conductor.

[0046] The multiple external connection terminals include an antenna terminal, a signal input terminal, a signal output terminal, a control terminal, and a ground terminal. The antenna terminal is a terminal to which an antenna 91 (see FIG. 3) is connected. The signal input terminal is a terminal for inputting a transmission signal (high frequency signal) from a signal processing circuit 92 (see FIG. 3) to the high frequency module 1. The signal output terminal is a terminal for outputting a reception signal (high frequency signal) from the high frequency module 1 to the signal processing circuit 92. The control terminal is a terminal for inputting a control signal from the signal processing circuit 92 to a controller (not shown).

[0047] (3) Communications equipment 3, the communication device 9 includes a high-frequency module 1, an antenna 91, and a signal processing circuit 92. The communication device 9 is, for example, a mobile terminal (for example, a smartphone). Note that the communication device 9 is not limited to a mobile terminal, and may be, for example, a wearable terminal (for example, a smart watch).

[0048] The high frequency module 1 is configured to amplify a transmission signal (high frequency signal) from the signal processing circuit 92 and output the amplified signal to the antenna 91. The high frequency module 1 is also configured to amplify a reception signal (high frequency signal) received by the antenna 91 and output the amplified signal to the signal processing circuit 92. The high frequency module 1 is controlled by the signal processing circuit 92, for example.

[0049] The high frequency module 1 is a module that can support, for example, the 4G (fourth generation mobile communication) standard and the 5G (fifth generation mobile communication) standard. The 4G standard is, for example, the 3GPP (registered trademark, Third Generation Partnership Project) LTE (registered trademark, Long Term Evolution) standard. The 5G standard is, for example, the 5G NR (New Radio). The high frequency module 1 is a module that can support carrier aggregation and dual connectivity.

[0050] In the communication device 9, the high-frequency module 1 can be electrically connected to an external board (not shown). The external board corresponds to, for example, a motherboard of a mobile terminal, a communication device, or the like. Note that the high-frequency module 1 being electrically connectable to an external board includes not only the case where the high-frequency module 1 is directly mounted on the external board, but also the case where the high-frequency module 1 is indirectly mounted on the external board. Moreover, the case where the high-frequency module 1 is indirectly mounted on the external board includes the case where the high-frequency module 1 is mounted on another high-frequency module mounted on the external board, etc.

[0051] (3.1) Antenna The antenna 91 is connected to an antenna terminal (not shown) of the high-frequency module 1. The antenna 91 has a transmitting function of emitting a transmission signal output from the high-frequency module 1 as radio waves and a receiving function of receiving a reception signal from the outside as radio waves and outputting the reception signal to the high-frequency module 1.

[0052] (3.2) Signal processing circuit The signal processing circuit 92 is connected to the high-frequency module 1. The signal processing circuit 92 processes high-frequency signals passing through the high-frequency module 1. More specifically, the signal processing circuit 92 is configured to process a transmission signal to be output to the high-frequency module 1. In addition, the signal processing circuit 92 is configured to process a reception signal received from the high-frequency module 1.

[0053] The signal processing circuit 92 includes a baseband signal processing circuit 93 and an RF signal processing circuit 94 .

[0054] The baseband signal processing circuit 93 is, for example, a BBIC (Baseband Integrated Circuit).

[0055] The baseband signal processing circuit 93 performs predetermined signal processing on a signal from outside the signal processing circuit 92. More specifically, the baseband signal processing circuit 93 generates a transmission signal from a baseband signal (e.g., an audio signal and an image signal) from outside the signal processing circuit 92, and outputs the generated transmission signal to the RF signal processing circuit 94.

[0056] The baseband signal processing circuit 93 performs a predetermined signal processing on the signal from the RF signal processing circuit 94. More specifically, the baseband signal processing circuit 93 outputs to the outside the received signal received from the RF signal processing circuit 94. The received signal processed by the baseband signal processing circuit 93 is used, for example, as an image signal for image display, or as an audio signal for telephone calls.

[0057] The RF signal processing circuit 94 is, for example, an RFIC (Radio Frequency Integrated Circuit), and performs signal processing on high frequency signals (transmission signals and reception signals).

[0058] The RF signal processing circuit 94 performs signal processing on the transmission signal output from the baseband signal processing circuit 93, and outputs the processed transmission signal to the high-frequency module 1. Specifically, the RF signal processing circuit 94 performs signal processing such as up-conversion on the transmission signal output from the baseband signal processing circuit 93, and outputs the processed transmission signal to a transmission path of the high-frequency module 1.

[0059] The RF signal processing circuit 94 performs signal processing on the received signal output from the high-frequency module 1, and outputs the processed received signal to the baseband signal processing circuit 93. Specifically, the RF signal processing circuit 94 performs signal processing such as down-conversion on the received signal output from the reception path of the high-frequency module 1, and outputs the processed received signal to the baseband signal processing circuit 93.

[0060] (4) Effects In the high-frequency module 1 according to the first embodiment, the first bump 33 of the first electronic component 3 is disposed in the first recess 61 of the mounting substrate 2, the second bump 43 of the second electronic component 4 is disposed in the second recess 62 of the mounting substrate 2, and the second region in which the first recess 61 and the second recess 62 are not formed is located between the first bump 33 of the first electronic component 3 and the second bump 43 of the second electronic component 4. By disposing the first bump 33 of the first electronic component 3 in the first recess 61 of the mounting substrate 2, the height of the first electronic component 3 from the surface of the first main surface 21 of the mounting substrate 2 in which the recesses (including the first recess 61 and the second recess 62) are not formed can be reduced. In addition, by disposing the second bump 43 of the second electronic component 4 in the second recess 62 of the mounting substrate 2, the height of the second electronic component 4 from the surface of the first main surface 21 of the mounting substrate 2 in which the recesses (including the first recess 61 and the second recess 62) are not formed can be reduced. This allows the high-frequency module 1 to be made low-profile. Furthermore, the second region of the mounting substrate 2 is located between the first bump 33 of the first electronic component 3 and the second bump 43 of the second electronic component 4 in a plan view from the thickness direction D1 of the mounting substrate 2. This allows the thickness of the mounting substrate 2 between the first recess 61 and the second recess 62 to be increased, thereby increasing the strength of the mounting substrate 2 compared to a case in which a recess is formed between the first recess 61 and the second recess 62. As a result, it is possible to achieve both a low profile of the high-frequency module 1 and strength of the mounting substrate 2.

[0061] In the high-frequency module 1 according to the first embodiment, a first recess 61 is formed in the mounting substrate 2. This makes it possible to shorten the distance between the first electronic component 3 and the wiring conductor or wiring element built into the mounting substrate 2, compared to a case in which the first recess 61 is not formed.

[0062] In the high-frequency module 1 according to the first embodiment, the second recess 62 is formed in the mounting substrate 2. This makes it possible to shorten the distance between the second electronic component 4 and the wiring conductor or wiring element built into the mounting substrate 2, compared to a case in which the second recess 62 is not formed.

[0063] In the high-frequency module 1 according to the first embodiment, the first bump 33 of the first electronic component 3 is an RF bump, and the second bump 43 of the second electronic component 4 is a ground bump. This separates the RF bump of the first electronic component 3 from the ground bump of the second electronic component 4 by the second region. As a result, it is possible to reduce short circuits between adjacent RF bumps and ground bumps, thereby suppressing mounting defects in the high-frequency module 1.

[0064] In the high-frequency module 1 according to the first embodiment, a resin layer 51 is provided in contact with the first main surface 21 of the mounting board 2 and covering at least a portion of the first electronic component 3 and the second electronic component 4. This makes it possible to protect the mounting board 2, the first electronic component 3, and the second electronic component 4.

[0065] In the high-frequency module 1 according to the first embodiment, the distance L1 between the main body 31 of the first electronic component 3 and the mounting board 2 is larger than the diameter of the filler contained in the resin layer 51. This allows the resin layer 51 to penetrate to the periphery of the first bump 33 of the first electronic component 3, so that solder splash can be prevented when the high-frequency module 1 is mounted on the motherboard. As a result, the connection reliability of the first electronic component 3 can be improved. In addition, the distance L2 between the main body 41 of the second electronic component 4 and the mounting board 2 is larger than the diameter of the filler contained in the resin layer 51. This allows the resin layer 51 to penetrate to the periphery of the second bump 43 of the second electronic component 4, so that solder splash can be prevented when the high-frequency module 1 is mounted on the motherboard. As a result, the connection reliability of the second electronic component 4 can be improved.

[0066] In the high-frequency module 1 according to the first embodiment, the main bodies 31, 41 of the first electronic component 3 and the second electronic component 4 are located outside the mounting board 2. This makes it possible to increase the strength of the mounting board 2 compared to a case in which recesses for accommodating the main bodies 31, 41 of the first electronic component 3 and the second electronic component 4 are formed in the mounting board 2.

[0067] According to the high-frequency module 1 of the first embodiment, even when the first electronic component 3 and the second electronic component 4 of different sizes are arranged on the mounting board 2, the high-frequency module 1 can be made low-profile simply by processing the mounting board 2. In other words, the high-frequency module 1 can be made low-profile simply by performing processing to form the first recess 61 and the second recess 62 of the mounting board 2.

[0068] In the high-frequency module 1 according to the first embodiment, the first bump 33 is disposed in the first recess 61, and at least a portion of the solder of the first bump 33 fills the first recess 61. This makes it possible to increase the sum of the thickness of the mounting substrate 2 and the thickness of the first bump 33 compared to a case in which the first bump 33 is not disposed in the first recess 61, thereby increasing the strength of the mounting substrate 2.

[0069] In the high-frequency module 1 according to the first embodiment, the second bump 43 is disposed in the second recess 62, and at least a portion of the solder of the second bump 43 fills the second recess 62. This makes it possible to increase the sum of the thickness of the mounting substrate 2 and the thickness of the second bump 43 compared to a case in which the second bump 43 is not disposed in the second recess 62, thereby increasing the strength of the mounting substrate 2.

[0070] In the high-frequency module 1 according to the first embodiment, a plurality of first recesses 61 are formed in the mounting substrate 2, and a plurality of first bumps 33 protruding from one main surface 311 of the main body 31 are provided in the first electronic component 3. This makes it possible to reduce non-leveling of the first main surface 21 of the mounting substrate 2 on which the first electronic component 3 is arranged.

[0071] In the high-frequency module 1 according to the first embodiment, a plurality of second recesses 62 are formed in the mounting substrate 2, and a plurality of second bumps 43 protruding from one main surface 411 of the main body 41 are provided in the second electronic component 4. This makes it possible to reduce non-leveling of the first main surface 21 of the mounting substrate 2 on which the second electronic component 4 is arranged.

[0072] In the high-frequency module 1 of embodiment 1, the presence of the first recess 61 in the mounting substrate 2 makes it possible to limit the amount of self-alignment movement that occurs when the solder of the first bump 33 melts to within the first recess 61, thereby improving the mountability of the first electronic component 3 on the mounting substrate 2.

[0073] In the high-frequency module 1 of embodiment 1, the presence of the second recess 62 in the mounting substrate 2 makes it possible to limit the amount of self-alignment movement that occurs when the solder of the second bump 43 melts to within the second recess 62, thereby improving the mountability of the second electronic component 4 on the mounting substrate 2.

[0074] In the high-frequency module 1 according to the first embodiment, the first recess 61 and the second recess 62 are formed in the mounting board 2. As a result, the thickness of the mounting board 2 can be increased while maintaining the height of the high-frequency module 1, compared to a case in which the first recess 61 and the second recess 62 are not formed, and therefore the strength of the mounting board 2 can be increased.

[0075] In the communication device 9 according to the first embodiment, in the high-frequency module 1, the first bump 33 of the first electronic component 3 is disposed in the first recess 61 of the mounting substrate 2, the second bump 43 of the second electronic component 4 is disposed in the second recess 62 of the mounting substrate 2, and a second region in which the first recess 61 and the second recess 62 are not formed is provided between the first bump 33 of the first electronic component 3 and the second bump 43 of the second electronic component 4. This makes it possible to achieve both a low profile for the high-frequency module 1 and strength for the mounting substrate.

[0076] (5) Variations A modification of the first embodiment will now be described.

[0077] (5.1) Variation 1 The high-frequency module 1 according to the first modification of the first embodiment includes a mounting substrate 2, a first electronic component 3, a second electronic component 4, a resin layer 51, a plurality of external connection terminals (not shown), and a shielding layer (not shown).

[0078] The shielding layer covers at least a part of the resin layer 51 and the mounting substrate 2. More specifically, the shielding layer covers one main surface and an outer peripheral surface of the resin layer 51, and the outer peripheral surface of the mounting substrate 2. The one main surface of the resin layer 51 is a main surface of the resin layer 51 on the side opposite to the mounting substrate 2 side.

[0079] The shield layer is electrically conductive. More specifically, the shield layer has a multi-layer structure in which a plurality of metal layers are stacked. The metal layers include one or more types of metal. Note that the shield layer is not limited to the multi-layer structure, and may be a single metal layer.

[0080] The shield layer is provided, for example, for the purpose of electromagnetic shielding between the inside and outside of the high-frequency module 1. The shield layer is in contact with at least a part of the ground layer of the mounting board 2. This allows the potential of the shield layer to be the same as the potential of the ground layer.

[0081] The shielding layer covers at least a part of the main surface of the first electronic component 3 and the main surface of the second electronic component 4. The shielding layer may be connected to the main surface of the first electronic component 3 and the main surface of the second electronic component 4 by being in contact with them, for example.

[0082] (5.2) Variation 2 In the high-frequency module 1 according to the second modification of the first embodiment, the distance L1 (see FIG. 1) between the main body 31 of the first electronic component 3 and the mounting board 2 is smaller than the diameter of the filler contained in the resin layer 51. In addition, the distance L2 (see FIG. 1) between the main body 41 of the second electronic component 4 and the mounting board 2 is smaller than the diameter of the filler contained in the resin layer 51.

[0083] According to the high-frequency module 1 according to the second modification of the first embodiment, the height of the high-frequency module 1 can be further reduced.

[0084] (5.3) Variation 3 In the high-frequency module 1 according to the third modification of the first embodiment, the resin layer 51 does not include a filler. The resin layer 51 does not include a filler and includes only a resin, for example.

[0085] The high-frequency modules 1 according to the above-described modifications also provide the same effects as those of the high-frequency module 1 according to the first preferred embodiment.

[0086] (Embodiment 2) 4, the high-frequency module 1 according to the second embodiment differs from the high-frequency module 1 according to the first embodiment (see FIG. 1) in that a side surface 612 of the first recess 61 and a side surface 622 of the second recess 62 of the mounting substrate 2 are curved surfaces. Note that, in the high-frequency module 1 according to the second embodiment, components similar to those in the high-frequency module 1 according to the first embodiment are denoted by the same reference numerals and descriptions thereof will be omitted.

[0087] (1) Composition In the mounting board 2 of the second embodiment, as shown in FIG. 4, the side surface 612 of the first recess 61 is a curved surface when viewed in a thickness direction D1 of the mounting board 2 in a plan view.

[0088] In the mounting board 2 of the second embodiment, the side surface 622 of the second recess 62 is a curved surface when viewed in a plan view from the thickness direction D1 of the mounting board 2.

[0089] Regarding the mounting board 2 of the second embodiment, the description of the configuration and functions similar to those of the mounting board 2 of the first embodiment (see FIG. 1) will be omitted.

[0090] (2) Effects In the high-frequency module 1 according to the second embodiment, the side surface 612 of the first recess 61 is a curved surface when viewed in a plan view from the thickness direction D1 of the mounting substrate 2. This allows the shape of the first recess 61 to be closer to the shape of the first bump 33, so that when the first electronic component 3 is placed on the mounting substrate 2, the amount of self-alignment of the solder can be kept within the range of the first recess 61. As a result, the mountability of the first electronic component 3 on the mounting substrate 2 can be improved. In other words, the mounting variation of the first electronic component 3 can be reduced.

[0091] In the high-frequency module 1 according to the second embodiment, the side surface 622 of the second recess 62 is a curved surface when viewed in a plan view from the thickness direction D1 of the mounting substrate 2. This allows the shape of the second recess 62 to be close to the shape of the second bump 43, so that when the second electronic component 4 is placed on the mounting substrate 2, the amount of self-alignment of the solder can be kept within the range of the second recess 62. As a result, the mountability of the second electronic component 4 on the mounting substrate 2 can be improved. In other words, the mounting variation of the second electronic component 4 can be reduced.

[0092] (3) Modifications A modification of the second embodiment will now be described.

[0093] (3.1) Variation 1 In the high-frequency module 1 according to the first modification of the second embodiment, among the side surfaces 612 of the first recesses 61 and the side surfaces 622 of the second recesses 62 of the mounting substrate 2, only the side surfaces 612 of the first recesses 61 are curved. Note that the side surfaces 612 of some, not all, of the first recesses 61 may be curved.

[0094] In the high-frequency module 1 according to the first modification of the second embodiment, the mountability of the first electronic component 3 on the mounting board 2 can also be improved.

[0095] (3.2) Variation 2 In the high-frequency module 1 according to the second modification of the second embodiment, among the side surfaces 612 of the first recesses 61 and the side surfaces 622 of the second recesses 62 of the mounting substrate 2, only the side surfaces 622 of the second recesses 62 are curved. Note that the side surfaces 622 of some, not all, of the second recesses 62 may be curved.

[0096] In the high-frequency module 1 according to the second modification of the second embodiment, the mountability of the second electronic component 4 on the mounting board 2 can also be improved.

[0097] In short, it is only necessary that at least one of the side surfaces 612, 622 of the multiple first recesses 61 and the multiple second recesses 62 of the mounting substrate 2 is a curved surface when viewed in a plan view from the thickness direction D1 of the mounting substrate 2.

[0098] The high-frequency modules 1 according to the above-described modifications also provide the same effects as those of the high-frequency module 1 according to the second preferred embodiment.

[0099] (Embodiment 3) As shown in Fig. 5A, the radio frequency module 1 according to the third embodiment differs from the radio frequency module 1 according to the first embodiment (see Fig. 1) in that side electrodes 73 are formed on side surfaces 612 of the multiple first recesses 61 and side surfaces 622 of the multiple second recesses 62. Note that, in the radio frequency module 1 according to the third embodiment, components similar to those in the radio frequency module 1 according to the first embodiment are denoted by the same reference numerals and will not be described.

[0100] (1) Composition 5A, the mounting board 2 of embodiment 3 further includes a side electrode 73. The side electrode 73 is formed on a side surface 612 of the first recess 61. The side electrode 73 is also formed on a side surface 622 of the second recess 62. Note that, with regard to the mounting board 2 of embodiment 3, a description of the same configuration and functions as those of the mounting board 2 of embodiment 1 (see FIG. 1) will be omitted.

[0101] (2) Effects In the high-frequency module 1 according to the third embodiment, a first electrode 71 is formed on a bottom surface 611 of the first recess 61, and a side electrode 73 is formed on a side surface 612 of the first recess 61. This makes it possible to increase the contact area between the first bump 33 of the first electronic component 3 and the electrodes (first electrode 71, side electrode 73) in the first recess 61, thereby increasing the bonding strength between the first bump 33 of the first electronic component 3 and the electrodes in the first recess 61. As a result, the mountability of the first electronic component 3 on the mounting board 2 can be improved.

[0102] In the high-frequency module 1 according to the third embodiment, the second electrode 72 is formed on the bottom surface 621 of the second recess 62, and the side electrode 73 is formed on the side surface 622 of the second recess 62. This makes it possible to increase the contact area between the second bump 43 of the second electronic component 4 and the electrodes (second electrode 72, side electrode 73) in the second recess 62, thereby increasing the bonding strength between the second bump 43 of the second electronic component 4 and the electrodes in the second recess 62. As a result, the mountability of the second electronic component 4 on the mounting board 2 can be improved.

[0103] (3) Modifications A modification of the third embodiment will now be described.

[0104] (3.1) Variation 1 5B, in the high-frequency module 1 according to the first modification of the third embodiment, the mounting board 2 has a wiring pattern conductor 75. The wiring pattern conductor 75 is provided on the first main surface 21 of the mounting board 2 so as to be continuous with the side electrode 73.

[0105] In the high-frequency module 1 according to the first modification of the third embodiment, the side electrode 73 is formed on at least one of the side surfaces 612, 622 of the first recess 61 and the second recess 62. This allows wiring to be extended from the side surfaces 612, 622 of the recesses (the first recess 61 and the second recess 62), thereby increasing the degree of freedom in wiring.

[0106] (3.2) Variation 2 In the high-frequency module 1 according to the second modification of the third embodiment, the mounting board 2 has a via conductor 76 and a plurality of wiring pattern conductors 771 and 772, as shown in FIG. 5C.

[0107] The via conductor 76 connects the first electrode 71 and the wiring pattern conductor 771. The wiring pattern conductor 772 is connected to the side electrode 73. The wiring pattern conductor 772 extends from the side electrode 73 in a direction perpendicular to the thickness direction D1 of the mounting substrate 2. The via conductor 76 may be a conductor that connects the second electrode 72 and the wiring pattern conductor 771.

[0108] In the high-frequency module 1 according to the second modification of the third embodiment, the side electrode 73 is formed on at least one of the side surfaces 612, 622 of the first recesses 61 and the second recesses 62. This allows wiring to be extended from the side surfaces 612, 622 of the recesses (the first recesses 61, the second recesses 62), thereby increasing the degree of freedom in wiring.

[0109] (3.3) Variation 3 In the high-frequency module 1 according to the third modification of the third embodiment, the side electrode 73 is formed only on the side surfaces 612 of the first recesses 61 among the side surfaces 612 of the first recesses 61 and the side surfaces 622 of the second recesses 62 of the mounting substrate 2. Note that the side electrode 73 may be formed on the side surfaces 612 of some of the first recesses 61 rather than on all of the first recesses 61.

[0110] The high-frequency module 1 according to the third modification of the third embodiment also allows for greater freedom in wiring.

[0111] (3.4) Variation 4 In the high-frequency module 1 according to the fourth modification of the third embodiment, the side electrode 73 is formed only on the side surfaces 622 of the second recesses 62 out of the side surfaces 612 of the first recesses 61 and the side surfaces 622 of the second recesses 62 of the mounting substrate 2. Note that the side electrode 73 may be formed on the side surfaces 622 of some of the second recesses 62 rather than on all of the second recesses 62.

[0112] The high-frequency module 1 according to the fourth modification of the third embodiment also allows for greater freedom in wiring.

[0113] In short, it is sufficient that the mounting substrate 2 has the side electrode 73 formed on at least one of the side surfaces 612, 622 of the first recess 61 and the second recess 62.

[0114] The high-frequency modules 1 according to the above-described modifications also provide the same effects as those of the high-frequency module 1 according to the third preferred embodiment.

[0115] (Embodiment 4) 6, the high-frequency module 1 according to the fourth embodiment differs from the high-frequency module 1 according to the first embodiment (see FIG. 1) in that wiring pattern conductors 78 are formed in a plurality of first recesses 61 and a plurality of second recesses 62 of the mounting substrate 2. Note that, in the high-frequency module 1 according to the fourth embodiment, components similar to those in the high-frequency module 1 according to the first embodiment are denoted by the same reference numerals and description thereof will be omitted.

[0116] (1) Composition As shown in Fig. 6, the mounting board 2 of the fourth embodiment has a plurality of wiring pattern conductors 78. The wiring pattern conductors 78 are formed in each of the first recesses 61. More specifically, the wiring pattern conductors 78 are formed on the bottom surfaces 611 of each of the first recesses 61. The wiring pattern conductors 78 are also formed in each of the second recesses 62. More specifically, the wiring pattern conductors 78 are formed on the bottom surfaces 621 of each of the second recesses 62. Note that, regarding the mounting board 2 of the fourth embodiment, a description of the same configurations and functions as those of the mounting board 2 of the first embodiment (see Fig. 1) will be omitted.

[0117] (2) Effects In the high-frequency module 1 according to the fourth embodiment, the wiring pattern conductor 78 is formed in at least one of the multiple first recesses 61. This allows for greater freedom in wiring.

[0118] In the high-frequency module 1 according to the fourth embodiment, the wiring pattern conductor 78 is formed in at least one of the second recesses 62. This increases the degree of freedom in wiring.

[0119] (3) Modifications A modification of the fourth embodiment will now be described.

[0120] (3.1) Variation 1 In the high-frequency module 1 according to the first modification of the fourth embodiment, among the plurality of first recesses 61 and the plurality of second recesses 62 of the mounting substrate 2, the wiring pattern conductors 78 are formed only in the plurality of first recesses 61. Note that the wiring pattern conductors 78 may be formed in some of the plurality of first recesses 61 rather than in all of the plurality of first recesses 61.

[0121] The high-frequency module 1 according to the first modification of the fourth embodiment also allows for greater freedom in wiring.

[0122] (3.2) Variation 2 In the high-frequency module 1 according to the second modification of the fourth embodiment, among the plurality of first recesses 61 and the plurality of second recesses 62 of the mounting substrate 2, the wiring pattern conductors 78 are formed only in the plurality of second recesses 62. Note that the wiring pattern conductors 78 may be formed in some of the plurality of second recesses 62 rather than in all of the plurality of second recesses 62.

[0123] The high-frequency module 1 according to the second modification of the fourth embodiment also allows for greater freedom in wiring.

[0124] In short, it is sufficient that the mounting board 2 has the wiring pattern conductors 78 in at least one of the first recess 61 and the second recess 62.

[0125] (3.3) Variation 3 In the high-frequency module 1 according to the third modification of the fourth embodiment, the number of wiring pattern conductors 78 provided in the first recesses 61 is not limited to two and may be one, or three or more. The number of wiring pattern conductors 78 provided in the second recesses 62 is not limited to two and may be one, or three or more.

[0126] The high-frequency module 1 according to the above-described modified example also provides the same effects as those of the high-frequency module 1 according to the fourth preferred embodiment.

[0127] (Embodiment 5) 7, the high-frequency module 1 according to the fifth embodiment differs from the high-frequency module 1 according to the first embodiment (see FIG. 1) in that the high-frequency module 1 according to the fifth embodiment includes a wire-wound inductor 11. Note that, in the high-frequency module 1 according to the fifth embodiment, components similar to those in the high-frequency module 1 according to the first embodiment are denoted by the same reference numerals and descriptions thereof will be omitted.

[0128] (1) Composition 7, the high-frequency module 1 according to the fifth embodiment further includes a wire-wound inductor 11. The wire-wound inductor 11 is disposed in at least one of the plurality of first recesses 61. The wire-wound inductor 11 is also disposed in at least one of the plurality of second recesses 62.

[0129] (2) Effects In the high-frequency module 1 according to the fifth embodiment, the wire-wound inductor 11 is provided in at least one of the plurality of first recesses 61 and the plurality of second recesses 62. This allows the height of the relatively tall wire-wound inductor 11 to be reduced, thereby further reducing the height of the high-frequency module 1.

[0130] (Embodiment 6) The high-frequency module 1 according to the sixth embodiment differs from the high-frequency module 1 according to the first embodiment (see FIG. 1) in that it has a double-sided mounting structure, as shown in FIG. 8. Note that, in the high-frequency module 1 according to the sixth embodiment, components similar to those in the high-frequency module 1 according to the first embodiment are denoted by the same reference numerals and descriptions thereof will be omitted.

[0131] (1) Composition As shown in FIG. 8, the high-frequency module 1 of embodiment 6 includes a mounting substrate 2, a first electronic component 3, a second electronic component 4, a plurality of third electronic components 8, a plurality of resin layers 51, 52, and a plurality of external connection terminals (not shown).

[0132] (1.1) Mounting board 8, the mounting board 2 of the sixth embodiment has a first main surface 21 and a second main surface 22. The mounting board 2 is a double-sided mounting board in which electronic components are mounted on each of the first main surface 21 and the second main surface 22.

[0133] (1.2) Third Electronic Component 8, the multiple third electronic components 8 are disposed on the second main surface 22 of the mounting board 2. The multiple third electronic components 8 are, for example, IC (Integrated Circuit) components. Note that a portion of each of the multiple third electronic components 8 may be disposed on the second main surface 22 of the mounting board 2, and the remainder of each of the multiple third electronic components 8 may be incorporated within the mounting board 2. In short, the multiple third electronic components 8 are located on the mounting board 2 closer to the second main surface 22 than the first main surface 21, and at least have a portion mounted on the second main surface 22.

[0134] Each of the multiple third electronic components 8 has a main body 81, multiple electrodes 82, and multiple third bumps 83. The multiple electrodes 82 are connected to multiple third electrodes 79 provided on the second main surface 22 of the mounting substrate 2 via the multiple third bumps 83, so that the third electronic component 8 is disposed on the second main surface 22 of the mounting substrate 2.

[0135] The main body 81 has a functional part. The main body 81 is disposed on the mounting board 2 such that one main surface 811 of the main body 81 faces the mounting board 2 in the thickness direction D1 of the mounting board 2. More specifically, the one main surface 811 of the main body 81 faces the second main surface 22 of the mounting board 2 in a state in which the third electronic component 8 is disposed on the mounting board 2.

[0136] The multiple electrodes 82 are formed on one main surface 811 of the main body portion 81. The multiple electrodes 82 are provided, for example, on the one main surface 811 of the main body portion 81 and spaced apart from each other.

[0137] The multiple third bumps 83 are bumps for connecting the multiple electrodes 82 to a conductive layer of the mounting substrate 2. The multiple third bumps 83 are arranged on the multiple electrodes 82. Each of the third bumps 83 is formed, for example, in a circular shape. Each of the third bumps 83 is formed, for example, of solder.

[0138] When the third electronic component 8 is an IC component, the third electronic component 8 includes, for example, a low-noise amplifier and a switch.

[0139] The low-noise amplifier has an input terminal and an output terminal. The low-noise amplifier amplifies a received signal input to the input terminal and outputs the amplified signal from the output terminal. The input terminal of the low-noise amplifier is connected to the common terminal of the switch via an input matching circuit. The output terminal of the low-noise amplifier is connected to a signal output terminal. Therefore, the output terminal of the low-noise amplifier is connected to the signal processing circuit 92 via the signal output terminal.

[0140] The switch has a common terminal and a plurality of selection terminals. The switch is controlled by a controller (not shown). The switch switches the connection state between the common terminal and the plurality of selection terminals in accordance with a control signal from the controller.

[0141] Examples of the switches included in the IC component include a first switch, a second switch, and a third switch.

[0142] The first switch is an antenna switch connected to an antenna terminal (not shown). The common terminal is connected to the antenna terminal. An antenna (not shown) is connected to the antenna terminal. The selection terminal is connected to, for example, a transmission filter (not shown) or a reception filter (not shown). The first switch is a switch capable of connecting at least one of a plurality of selection terminals to the common terminal. The first switch is, for example, a switch capable of one-to-one and one-to-many connection.

[0143] The second switch is, for example, a band select switch for switching signal paths for a plurality of transmission signals having different communication bands. The second switch has a common terminal and a plurality of selection terminals. The common terminal is connected to a power amplifier. The selection terminal is connected to a transmission filter. The second switch is a switch capable of connecting at least one of the plurality of selection terminals to the common terminal. The second switch is, for example, a switch capable of one-to-one and one-to-many connection.

[0144] The third switch has a common terminal and a plurality of selection terminals. The common terminal is connected to the low noise amplifier via an input matching circuit. The selection terminal is connected to the receiving filter. The third switch is a switch capable of connecting at least one of the plurality of selection terminals to the common terminal. The third switch is, for example, a switch capable of one-to-one and one-to-many connection.

[0145] (1.3) Layout relationship between the mounting board, the first electronic component, the second electronic component, and the third electronic component 8, the mounting substrate 2 has a plurality of first recesses 61, a plurality of second recesses 62, and a plurality of third recesses 63. The plurality of third recesses 63 are formed on the second main surface 22 of the mounting substrate 2. Each of the plurality of third recesses 63 has a bottom surface 631 and a side surface 632. Similar to the first recess 61 and the plurality of second recesses 62 of the first embodiment (see FIG. 1), the first recess 61 and the plurality of second recesses 62 are formed on the first main surface 21 of the mounting substrate 2.

[0146] The mounting substrate 2 has a plurality of first electrodes 71, a plurality of second electrodes 72, and a plurality of third electrodes 79. The plurality of third electrodes 79 are arranged on bottom surfaces 631 of the plurality of third recesses 63. Similar to the plurality of first electrodes 71 and the plurality of second electrodes 72 of the first embodiment (see FIG. 1), the plurality of first electrodes 71 are arranged on the bottom surface 611 of the first recess 61, and the plurality of second electrodes 72 are arranged on the bottom surfaces 621 of the plurality of second recesses 62.

[0147] The multiple third bumps 83 of the multiple third electronic components 8 are arranged in the multiple third recesses 63 of the mounting substrate 2. More specifically, for each of the multiple third bumps 83, the third bump 83 is arranged in the third recess 63 such that at least a portion of the third bump 83 is accommodated in the third recess 63.

[0148] By arranging the multiple third bumps 83 of the third electronic component 8 in the multiple third recesses 63 of the mounting substrate 2, the height of the third electronic component 8 from the surface of the second main surface 22 of the mounting substrate 2 on which the multiple third recesses 63 are not formed can be reduced, thereby making it possible to reduce the height of the high-frequency module 1.

[0149] In the mounting board 2 of the sixth embodiment, at least one of the multiple third recesses 63 overlaps with the first recess 61 in a plan view from the thickness direction D1 of the mounting board 2. In the example of FIG. 8, the rightmost third recess 63 of the three third recesses 63 in which the third bump 83 of the third electronic component 8A is arranged overlaps with the leftmost first recess 61 of the four first recesses 61 in which the first bump 33 of the first electronic component 3 is arranged in a plan view from the thickness direction D1 of the mounting board 2. In addition, the leftmost third recess 63 of the two third recesses 63 in which the third bump 83 of the third electronic component 8B is arranged overlaps with the rightmost first recess 61 of the four first recesses 61 in which the first bump 33 of the first electronic component 3 is arranged in a plan view from the thickness direction D1 of the mounting board 2.

[0150] In the mounting board 2 of the sixth embodiment, at least one of the third recesses 63 overlaps with the second recess 62 in a plan view from the thickness direction D1 of the mounting board 2. In the example of Fig. 8, the leftmost third recess 63 of the three third recesses 63 in which the third bump 83 of the third electronic component 8A is arranged overlaps with the rightmost second recess 62 of the two second recesses 62 in which the second bump 43 of the second electronic component 4 is arranged in a plan view from the thickness direction D1 of the mounting board 2. The second recess 62 and the third recess 63 are electrically connected by, for example, the via conductors 76 and the wiring pattern conductor 773.

[0151] (1.4) Resin layer 8, the resin layer 51 is disposed on the first main surface 21 of the mounting board 2. The resin layer 51 contacts the first main surface 21 of the mounting board 2 and covers at least a portion of the first electronic component 3 and the second electronic component 4. This makes it possible to protect the mounting board 2, the first electronic component 3, and the second electronic component 4.

[0152] The resin layer 51 includes a resin and a filler (not shown). The resin is, for example, an epoxy resin. In the high-frequency module 1, the distance L1 between the main body 31 of the first electronic component 3 and the mounting board 2 is larger than the diameter of the filler contained in the resin layer 51. As a result, the resin layer 51 penetrates to the periphery of the first bump 33 of the first electronic component 3, so that it is possible to prevent solder splash when the high-frequency module 1 is mounted on a motherboard. As a result, it is possible to improve the connection reliability of the first electronic component 3. In addition, the distance L2 between the main body 41 of the second electronic component 4 and the mounting board 2 is larger than the diameter of the filler contained in the resin layer 51. As a result, the resin layer 51 penetrates to the periphery of the second bump 43 of the second electronic component 4, so that it is possible to prevent solder splash when the high-frequency module 1 is mounted on a motherboard. As a result, it is possible to improve the connection reliability of the second electronic component 4.

[0153] 8, the resin layer 52 is disposed on the second main surface 22 of the mounting board 2. The resin layer 52 contacts the second main surface 22 of the mounting board 2 and covers at least a portion of the multiple third electronic components 8. This makes it possible to protect the mounting board 2 and the multiple third electronic components 8.

[0154] The resin layer 52 includes a resin and a filler (not shown). The resin is, for example, an epoxy resin. In the high-frequency module 1, the distance L3 between the main body 81 of the third electronic component 8 and the mounting substrate 2 is greater than the diameter of the filler included in the resin layer 52. This allows the resin layer 52 to penetrate up to the periphery of the third bump 83 of the third electronic component 8, making it possible to prevent solder splash when the high-frequency module 1 is mounted on a motherboard. As a result, the connection reliability of the third electronic component 8 can be improved.

[0155] (1.5) External connection terminal The multiple external connection terminals (not shown) are disposed, for example, on the second main surface 22 of the mounting substrate 2. The multiple external connection terminals are arranged on the second main surface 22 of the mounting substrate 2 at intervals from one another.

[0156] Each of the plurality of external connection terminals is a columnar (e.g., cylindrical) conductive member. The material of the plurality of external connection terminals is, for example, a metal (e.g., copper, copper alloy, etc.). The tip of each of the plurality of external connection terminals may include, for example, a gold plating layer.

[0157] (2) Effects In the high-frequency module 1 according to the sixth embodiment, the third electronic components 8A and 8B are disposed on the second main surface 22 of the mounting board 2. This makes it possible to increase the mounting efficiency of the high-frequency module 1.

[0158] In the high-frequency module 1 according to the sixth embodiment, the third bump 83 of the third electronic component 8 is disposed in the third recess 63 of the mounting substrate 2. As a result, recesses (the first recess 61, the second recess 62, the third recess 63) are formed on both the first main surface 21 side and the second main surface 22 side of the mounting substrate 2, and the bumps (the first bump 33, the second bump 43, the third bump 83) are disposed in the recesses, thereby making it possible to further reduce the height of the high-frequency module 1.

[0159] In the high-frequency module 1 according to the sixth embodiment, the first recess 61, the second recess 62, and the third recess 63 are formed in the mounting substrate 2. This makes it possible to shorten the distance between the bumps (first bump 33, second bump 43) of the electronic components (first electronic component 3, second electronic component 4) and the third bump 83 of the third electronic component 8, compared to a case in which the first recess 61, the second recess 62, and the third recess 63 are not formed, and therefore makes it possible to shorten the wiring length. As a result, it is possible to reduce wiring loss.

[0160] In the high-frequency module 1 according to the sixth embodiment, the third recess 63 overlaps with at least one of the first recess 61 and the second recess 62 in the thickness direction D1 of the mounting substrate 2. This makes it possible to further shorten the distance between the bumps (first bump 33, second bump 43) of the electronic components (first electronic component 3, second electronic component 4) and the third bump 83 of the third electronic component 8. This makes it possible to further reduce the wiring loss.

[0161] In the high-frequency module 1 according to the sixth embodiment, the first recess 61, the second recess 62, and the third recess 63 are formed in the mounting board 2. As a result, the thickness of the mounting board 2 can be increased while maintaining the height of the high-frequency module 1, compared to a case in which the first recess 61, the second recess 62, and the third recess 63 are not formed in the mounting board 2, and therefore the strength of the mounting board 2 can be increased.

[0162] (3) Modifications A modification of the sixth embodiment will now be described.

[0163] (3.1) Variation 1 The high-frequency module 1 according to the first variant of the sixth embodiment includes a mounting substrate 2, a first electronic component 3, a second electronic component 4, a plurality of third electronic components 8, a plurality of resin layers 51, 52, a plurality of external connection terminals (not shown), and a shielding layer (not shown).

[0164] The shielding layer covers at least a portion of the resin layers 51 and 52 and the mounting board 2. More specifically, the shielding layer covers one main surface and an outer peripheral surface of the resin layer 51, the outer peripheral surface of the mounting board 2, and the outer peripheral surface of the resin layer 52. One main surface of the resin layer 51 is the main surface of the resin layer 51 on the side opposite to the mounting board 2 side. Note that with regard to the shielding layer in Variation 1 of Embodiment 6, a description of the same configuration and function as the shielding layer in Variation 1 of Embodiment 1 will be omitted.

[0165] (3.2) Variation 2 In the high-frequency module 1 according to the second modification of the sixth embodiment, the third electronic component 8 is not an IC component including a low-noise amplifier and a switch, but is a component other than an IC component. The third electronic component 8 may be, for example, only a low-noise amplifier or only a switch.

[0166] The high-frequency modules 1 according to the above-described modifications also provide the same effects as those of the high-frequency module 1 according to the sixth embodiment.

[0167] The above-described embodiment and modifications are merely a part of the various embodiments and modifications of the present invention. Furthermore, the embodiment and modifications can be modified in various ways depending on the design, etc., as long as the object of the present invention can be achieved.

[0168] (Aspect) The present specification discloses the following aspects.

[0169] A high-frequency module (1) according to a first aspect includes a mounting board (2), a first electronic component (3), and a second electronic component (4). The mounting board (2) has a first main surface (21) and a second main surface (22). The first main surface (21) and the second main surface (22) face each other. The first electronic component (3) is disposed on the first main surface (21) of the mounting board (2) and has a first bump (33). The second electronic component (4) is disposed on the first main surface (21) of the mounting board (2) and has a second bump (43). The mounting board (2) has a first recess (61) and a second recess (62). The first recess (61) is formed on the first main surface (21). The second recess (62) is formed on the first main surface (21) and is different from the first recess (61). The first bump (33) is disposed in a first recess (61) of the mounting substrate (2). The second bump (43) is disposed in a second recess (62) of the mounting substrate (2). The mounting substrate (2) has a first region and a second region. The first region is a region in which a plurality of recesses including the first recess (61) and the second recess (62) are formed. The second region is a region in which a plurality of recesses are not formed. The second region of the mounting substrate (2) is located between the first bump (33) of the first electronic component (3) and the second bump (43) of the second electronic component (4) in a plan view from the thickness direction (D1) of the mounting substrate (2).

[0170] According to the high-frequency module (1) of the first aspect, it is possible to achieve both a low height of the high-frequency module (1) and strength of the mounting board (2).

[0171] According to the high-frequency module (1) of the first aspect, the distance between the first electronic component (3) and the wiring conductor or wiring element built into the mounting board (2) can be made shorter than in a case where the first recess (61) is not formed.

[0172] In the high-frequency module (1) according to the second embodiment, the first bump (33) in the first embodiment is an RF bump, and the second bump (43) is a ground bump.

[0173] In the high-frequency module (1) according to the second aspect, the RF bumps of the first electronic component (3) and the ground bumps of the second electronic component (4) are separated by the second region, which reduces short-circuiting between adjacent RF bumps and ground bumps, thereby suppressing mounting defects in the high-frequency module (1).

[0174] In the high-frequency module (1) according to the third aspect, in the first or second aspect, at least one side surface (612; 622) of the first recess (61) and the second recess (62) of the mounting board (2) is curved in a planar view from the thickness direction (D1) of the mounting board (2).

[0175] According to the high-frequency module (1) of the third aspect, the shape of at least one of the first recess (61) and the second recess (62) can be made close to the shape of the bumps (first bump 33, second bump 43), so that when electronic components (first electronic component 3, second electronic component 4) are arranged on the mounting board (2), the amount of self-alignment of the solder can be suppressed within the range of the recess (first recess 61, second recess 62). As a result, the mountability of the electronic components on the mounting board (2) can be improved. In other words, the mounting variation of the electronic components can be reduced.

[0176] In a high-frequency module (1) according to a fourth aspect, in any one of the first to third aspects, the mounting board (2) has a side electrode (73). The side electrode (73) is formed on at least one of the side surfaces (612; 622) of the first recess (61) and the second recess (62).

[0177] According to the high-frequency module (1) of the fourth aspect, the contact area between the bumps (first bumps 33, second bumps 43) of the electronic components (first electronic component 3, second electronic component 4) and the electrodes in the recesses (first recesses 61, second recesses 62) can be increased, thereby increasing the bonding strength between the bumps of the electronic components and the electrodes in the recesses. As a result, the mountability of the electronic components on the mounting board (2) can be improved.

[0178] According to the high-frequency module (1) of the fourth aspect, the wiring can be extended from the side surfaces (612; 622) of the recesses (first recess 61, second recess 62), thereby increasing the degree of freedom in wiring.

[0179] In the high-frequency module (1) according to the fifth aspect, in any one of the first to fourth aspects, the mounting board (2) has a wiring pattern conductor (78). The wiring pattern conductor (78) is formed in at least one of the first recess (61) and the second recess (62).

[0180] According to the high-frequency module (1) of the fifth aspect, the degree of freedom in wiring can be increased.

[0181] The high-frequency module (1) according to a sixth aspect is any one of the first to fifth aspects, further including a wire-wound inductor (11). The wire-wound inductor (11) is disposed in at least one of the first recess (61) and the second recess (62).

[0182] According to the high-frequency module (1) of the sixth aspect, the height of the relatively tall wire-wound inductor (11) can be reduced, so that the high-frequency module (1) can be made even lower in height.

[0183] The high-frequency module (1) according to a seventh aspect is the same as any one of the first to sixth aspects, and further includes a third electronic component (8). The third electronic component (8) is disposed on the second main surface (22) of the mounting board (2) and has a third bump (83).

[0184] According to the high-frequency module (1) of the seventh aspect, the mounting efficiency of the high-frequency module (1) can be improved.

[0185] In the high-frequency module (1) according to the eighth aspect, in the seventh aspect, the mounting board (2) further has a third recess (63). The third recess (63) is formed in the second main surface (22). The third bump (83) of the third electronic component (8) is disposed in the third recess (63) of the mounting board (2).

[0186] According to the high-frequency module (1) of the eighth aspect, recesses (first recess 61, second recess 62, third recess 63) are formed on both the first main surface (21) and the second main surface (22) of the mounting substrate (2), and bumps (first bump 33, second bump 43, third bump 83) are arranged in the recesses, thereby further reducing the height of the high-frequency module (1).

[0187] According to the high-frequency module (1) of the eighth aspect, the distance between the bumps (first bump 33, second bump 43) of the electronic components (first electronic component 3, second electronic component 4) and the third bump (83) of the third electronic component (8) can be made shorter than when the first recess (61), the second recess (62), and the third recess (63) are not formed, and therefore the wiring length can be made shorter. As a result, the wiring loss can be reduced.

[0188] In the high-frequency module (1) of the ninth aspect, in the eighth aspect, the third recess (63) of the mounting board (2) overlaps with at least one of the first recess (61) and the second recess (62) of the mounting board (2) when viewed in a planar view from the thickness direction (D1) of the mounting board (2).

[0189] According to the high-frequency module (1) of the ninth aspect, the distance between the bumps (first bump 33, second bump 43) of the electronic components (first electronic component 3, second electronic component 4) and the third bump (83) of the third electronic component (8) can be further shortened, thereby further reducing the wiring loss.

[0190] The high-frequency module (1) according to a tenth aspect is the same as any one of the first to ninth aspects, and further includes a resin layer (51). The resin layer (51) is in contact with the first main surface (21) of the mounting board (2) and covers at least a part of the first electronic component (3) and the second electronic component (4).

[0191] According to the high-frequency module (1) of the tenth aspect, the mounting board (2), the first electronic component (3), and the second electronic component (4) can be protected.

[0192] In the high-frequency module (1) according to the eleventh aspect, in the tenth aspect, the resin layer (51) contains a filler. A distance (L1) between the first electronic component (3) and the mounting board (2) is greater than a diameter of the filler contained in the resin layer (51).

[0193] According to the high-frequency module (1) of the eleventh aspect, the resin layer (51) penetrates to the periphery of the first bump (33) of the first electronic component (3), so that it is possible to prevent solder splash when mounting the high-frequency module (1) on a motherboard, thereby improving the connection reliability of the first electronic component (3).

[0194] In the high-frequency module (1) according to the twelfth aspect, in the tenth aspect, the resin layer (51) contains a filler. A distance (L1) between the first electronic component (3) and the mounting board (2) is smaller than a diameter of the filler contained in the resin layer (51).

[0195] According to the high-frequency module (1) of the twelfth aspect, the height of the high-frequency module (1) can be further reduced.

[0196] In the high-frequency module (1) according to the thirteenth aspect, in any one of the first to twelfth aspects, the first electronic component (3) and the second electronic component (4) further have a main body portion (31, 41) including a functional portion. The main body portions (31, 41) of the first electronic component (3) and the second electronic component (4) are located outside the mounting board (2).

[0197] According to the high-frequency module (1) of the thirteenth aspect, the strength of the mounting board (2) can be increased compared to a case in which a recess for accommodating the main body portions (31, 41) of the first electronic component (3) and the second electronic component (4) is formed in the mounting board (2).

[0198] A communication device (9) according to a fourteenth aspect includes the high-frequency module (1) according to any one of the first to thirteenth aspects, and a signal processing circuit (92). The signal processing circuit (92) is connected to the high-frequency module (1).

[0199] According to the communication device (9) of the fourteenth aspect, in the high-frequency module (1), it is possible to achieve both a low height of the high-frequency module (1) and strength of the mounting board (2). [Explanation of symbols]

[0200] 1 High frequency module 11 Wire-wound inductors 2. Mounting Board 21 First main surface 22 Second main surface 23 Dielectric layer 3. First Electronic Component 31 Main body 311 First Main Surface 32 electrodes 33 First Bump 4. Secondary Electronic Components 41 Main body 411 First Main Surface 42 electrodes 43 2nd Bump 51,52 Resin layer 61 First recess 611 Bottom 612 Side 62 Second recess 621 Bottom 622 Side 63 Third recess 631 Bottom 632 Side 71 1st electrode 72 2nd electrode 73 Side electrode 75,771,772,78 Wiring pattern conductor 76 Via conductor 79 Third electrode 8,8A,8B Third electronic component 81 Main body 811 First Main Surface 82 electrode 83 3rd Bump 9. Communications Equipment 91 Antenna 92 Signal Processing Circuit 93 Baseband signal processing circuit 94 RF signal processing circuit L1,L2,L3 distance D1 Thickness direction D21 1st direction D22 2nd direction

Claims

1. a mounting substrate having a first main surface and a second main surface opposed to each other; a first electronic component disposed on the first main surface of the mounting substrate and having a first bump; a second electronic component disposed on the first main surface of the mounting substrate and having a second bump; The mounting board is A first recess formed in the first main surface; a second recess formed on the first main surface and different from the first recess; the first bump is disposed in the first recess of the mounting substrate, the second bump is disposed in the second recess of the mounting substrate, The mounting board is a first region in which a plurality of recesses including the first recess and the second recess are formed; a second region in which the plurality of recesses are not formed, the second region of the mounting substrate is located between the first bump of the first electronic component and the second bump of the second electronic component in a plan view in a thickness direction of the mounting substrate; High frequency module.

2. the first bump is an RF bump, The second bump is a ground bump. The high frequency module according to claim 1 .

3. At least one side surface of the first recess and the second recess of the mounting substrate is a curved surface when viewed in a plan view from the thickness direction of the mounting substrate. The high frequency module according to claim 1 .

4. the mounting substrate has a side electrode formed on at least one side surface of the first recess and the second recess; The high frequency module according to claim 1 .

5. the mounting board has a wiring pattern conductor formed in at least one of the first recess and the second recess; The high frequency module according to any one of claims 1 to 4.

6. a wire-wound inductor disposed in at least one of the first recess and the second recess, The high frequency module according to any one of claims 1 to 4.

7. a third electronic component disposed on the second main surface of the mounting substrate and having a third bump; The high frequency module according to any one of claims 1 to 4.

8. the mounting substrate further has a third recess formed in the second main surface, the third bump of the third electronic component is disposed in the third recess of the mounting substrate; The high frequency module according to claim 7.

9. the third recess of the mounting substrate overlaps with at least one of the first recess and the second recess of the mounting substrate in a plan view in the thickness direction of the mounting substrate; The high frequency module according to claim 8.

10. a resin layer in contact with the first main surface of the mounting substrate and covering at least a portion of the first electronic component and the second electronic component, The high frequency module according to any one of claims 1 to 4.

11. The resin layer contains a filler, a distance between the first electronic component and the mounting substrate is greater than a diameter of the filler contained in the resin layer; The high frequency module according to claim 10.

12. The resin layer contains a filler, a distance between the first electronic component and the mounting substrate is smaller than a diameter of the filler contained in the resin layer; The high frequency module according to claim 10.

13. The first electronic component and the second electronic component further include a main body portion including a functional portion, the main body portions of the first electronic component and the second electronic component are located outside the mounting substrate; The high frequency module according to any one of claims 1 to 4.

14. A high-frequency module according to any one of claims 1 to 4, A signal processing circuit connected to the high-frequency module. Communications equipment.

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