Vibration device and manufacturing method of vibration device

Abstract

To provide a vibration device capable of suppressing deterioration of vibration characteristics, and to provide a manufacturing method of the vibration device.SOLUTION: In a vibration device having a support board 500 having a frame section 501 and a vibration element that is disposed on the support board 500 and has a base section, the support board 500 includes a first beam 510 that is constituted of the same material as that of the frame section 501, extends from the frame section 501, and has a first end 511 in a region overlapping the base section, and a second beam 520 that is constituted of the same material as that of the frame section 501, extends from the frame section 501, and has a second end 521 in a region overlapping the base section, and the base section and the first end 511 are connected via a first joining member and the base section and the second end 521 are connected via a second joining member.SELECTED DRAWING: Figure 8

Description

Technical Field

[0001] The present invention relates to a vibration device and a method for manufacturing the vibration device.

Background Art

[0002] Patent Document 1 discloses a configuration of a gyro sensor including a gyro element having a drive arm for detecting an angular velocity and a support portion for supporting the gyro element. Patent Document 2 discloses a configuration of a vibration device including a vibration element, a support substrate, and a circuit element. Specifically, the vibration element is attached to a base via a bonding member on an element mounting portion disposed at the center of the support substrate.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in the conventional configuration, there is a problem that deformation and strain of the base generated when the drive arm is vibrating are difficult to be relaxed, and the vibration characteristics deteriorate.

Means for Solving the Problems

[0005] The vibration device is a vibration device including a support substrate having a frame portion and a vibration element disposed on the support substrate and having a base portion. The support substrate is made of the same material as the frame portion, and includes a first beam extending from the frame portion and having a first tip portion in a region overlapping the base portion, and a second beam made of the same material as the frame portion, extending from the frame portion, and having a second tip portion in a region overlapping the base portion. The base portion and the first tip portion are connected via a first joining member, and the base portion and the second tip portion are connected via a second joining member.

[0006] A method for manufacturing a vibration device includes a support substrate having a frame portion and a vibration element disposed on the support substrate and having a base portion. The support substrate is made of the same material as the frame portion, and includes a first beam extending from the frame portion and having a first tip portion in a region overlapping the base portion, and a second beam made of the same material as the frame portion, extending from the frame portion, and having a second tip portion in a region overlapping the base portion. The base portion and the first tip portion are connected via a first joining member, and the base portion and the second tip portion are connected via a second joining member. The method for manufacturing a vibration device includes a step of simultaneously forming the frame portion, the first beam, and the second beam.

Brief Description of the Drawings

[0007]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Embodiments for Carrying Out the Invention

[0008] In the following figures, three mutually orthogonal axes will be described as the A-axis, B-axis, and C-axis. Also, the direction along the A-axis is the "A direction", the direction along the B-axis is the "B direction", and the direction along the C-axis is the "C direction". The direction of the arrow is the + direction, and the direction opposite to the + direction is the - direction. Note that the C-axis is a virtual axis along the vertical direction, with the +C direction being upward and the -C direction being downward. The -C direction is the direction in which gravity acts. Also, the plan view from the thickness direction of the support substrate 500, that is, the C-axis direction, is also simply referred to as the "plan view".

[0009] With reference to FIGS. 1 to 5, the configuration of the vibration device 1 will be described.

[0010] As shown in FIG. 1, the vibration device 1 is a physical quantity sensor that detects the angular velocity ωc with the C-axis as the detection axis. In this way, by using the vibration device 1 as a physical quantity sensor, the vibration device 1 can be mounted on a wide range of electronic devices, and a highly convenient vibration device 1 with high demand can be obtained. As the physical quantity sensor, for example, it is a gyro sensor. Hereinafter, an example of the vibration device 1 provided with a double T-shaped gyro element will be described.

[0011] The vibration device 1 includes a package 2, a circuit element 3 housed in the package 2, a support substrate 500, and a vibration element 6.

[0012] Package 2 includes a base 21 having a recess 211 that opens on the upper surface, and a lid 22 that closes the opening of the recess 211 and is joined to the upper surface of the base 21 via a joining member 23. An internal space S is formed by the recess 211 inside the package 2, and a circuit element 3, a support substrate 500, and a vibration element 6 are respectively accommodated in the internal space S.

[0013] The base 21 can be made of, for example, ceramics such as alumina. The lid 22 can be made of a metal material such as kovar. However, the constituent materials of the base 21 and the lid 22 are not particularly limited, respectively.

[0014] The internal space S is airtight and is in a depressurized state, preferably a state closer to a vacuum. Thereby, the viscous resistance is reduced and the vibration characteristics of the vibration element 6 are improved. However, the atmosphere of the internal space S is not particularly limited and may be, for example, in an atmospheric pressure state or a pressurized state.

[0015] The recess 211 is composed of a plurality of recesses, including a recess 211a that opens on the upper surface of the base 21, a recess 211b that opens at the bottom surface of the recess 211a and has a smaller opening width than the recess 211a, and a recess 211c that opens at the bottom surface of the recess 211b and has a smaller opening width than the recess 211b. The support substrate 500 is fixed to the bottom surface of the recess 211a while supporting the vibration element 6, and the circuit element 3 is fixed to the bottom surface of the recess 211c.

[0016] As shown in FIG. 2, in the internal space S, the vibration element 6, the support substrate 500, and the circuit element 3 are arranged so as to overlap each other in plan view. In other words, the vibration element 6, the support substrate 500, and the circuit element 3 are arranged side by side along the C axis. Thereby, the planar expansion of the package 2 in the A-axis direction and the B-axis direction can be suppressed, and the vibration device 1 can be miniaturized. The support substrate 500 is located between the vibration element 6 and the circuit element 3 and supports the vibration element 6 from below, that is, from the minus side of the C axis.

[0017] Also, as shown in FIGS. 1 and 2, a plurality of internal terminals 241 are arranged on the bottom surface of the recess 211a. A plurality of internal terminals 242 are arranged on the bottom surface of the recess 211b. A plurality of external terminals 243 are arranged on the lower surface of the base 21. These internal terminals 241, 242 and external terminals 243 are electrically connected via wirings (not shown) formed in the base 21.

[0018] The internal terminal 241 is electrically connected to the vibration element 6 via conductive bonding members B1, B2 and the support substrate 500. The internal terminal 242 is electrically connected to the circuit element 3 via the bonding wire BW.

[0019] The vibration element 6 is an angular velocity sensor element capable of detecting an angular velocity ωc having a C-axis as a detection axis as a physical quantity sensor element. As shown in FIG. 3, the vibration element 6 includes a vibration substrate 7 and electrodes 8 disposed on the surface of the vibration substrate 7. The vibration substrate 7 is composed of a Z-cut quartz substrate. The Z-cut quartz substrate has an extent in the X-Y plane defined by the X-axis as the electric axis and the Y-axis as the mechanical axis, which are crystal axes of quartz, and has a thickness in the direction along the Z-axis as the optical axis.

[0020] The vibration substrate 7 has a base portion 70 located at the center, a pair of detection arms 71, 72 extending from both sides of the base portion 70 in the B-axis direction, a pair of connection arms 73, 74 extending from both sides of the base portion 70 in the A-axis direction, a pair of drive arms 75, 76 extending from the tip of the connection arm 73 to both sides in the B-axis direction, and a pair of drive arms 77, 78 extending from the tip of the connection arm 74 to both sides in the B-axis direction. By using the vibration substrate 7 having such a shape, the vibration element 6 having excellent vibration balance is obtained.

[0021] Also, as shown in FIGS. 4 and 5, the drive arms 75 to 78 have a groove opening to the upper surface and a groove opening to the lower surface, and have a substantially H-shaped cross-sectional shape. Note that the detection arms 71, 72 may also have a groove opening to the upper surface and a groove opening to the lower surface, and have a substantially H-shaped cross-sectional shape.

[0022] As shown in FIG. 3, the electrode 8 includes a drive signal electrode 81, a drive ground electrode 82, a first detection signal electrode 83, a first detection ground electrode 84, a second detection signal electrode 85, and a second detection ground electrode 86.

[0023] The drive signal electrode 81 is disposed on both side surfaces of the drive arms 75 and 76, and on the upper and lower surfaces of the drive arms 77 and 78. On the other hand, the drive ground electrode 82 is disposed on the upper and lower surfaces of the drive arms 75 and 76, and on both side surfaces of the drive arms 77 and 78.

[0024] Also, the first detection signal electrode 83 is disposed on the upper and lower surfaces of the detection arm 71. The first detection ground electrode 84 is disposed on both side surfaces of the detection arm 71. On the other hand, the second detection signal electrode 85 is disposed on the upper and lower surfaces of the detection arm 72. The second detection ground electrode 86 is disposed on both side surfaces of the detection arm 72.

[0025] These electrodes 81 to 86 are each routed to the lower surface of the base 70. On the lower surface of the base 70, as shown in FIG. 3, a terminal 701 electrically connected to the drive signal electrode 81, a terminal 702 electrically connected to the drive ground electrode 82, a terminal 703 electrically connected to the first detection signal electrode 83, a terminal 704 electrically connected to the first detection ground electrode 84, a terminal 705 electrically connected to the second detection signal electrode 85, and a terminal 706 electrically connected to the second detection ground electrode 86 are arranged.

[0026] As shown in FIG. 1, the circuit element 3 is fixed to the bottom surface of the recess 211c. The circuit element 3 includes a drive circuit and a detection circuit that drive the vibration element 6 and detect the angular velocity ωc applied to the vibration element 6. However, the circuit element 3 is not particularly limited, and for example, other circuits such as a temperature compensation circuit may be included.

[0027] As shown in FIG. 1, the support substrate 500 is interposed between the base 21 and the vibration element 6. The support substrate 500 mainly has a function of absorbing and relaxing the stress generated by the deformation of the base 21 and making it difficult for the stress to be transmitted to the vibration element 6.

[0028] Next, with reference to FIGS. 6 and 7, a method for detecting the angular velocity ωc by the vibration element 6 will be described.

[0029] As shown in FIG. 6, when a drive signal is applied between the drive signal electrode 81 and the drive ground electrode 82, the drive arms 75 to 78 bend and vibrate. Hereinafter, this drive mode will be referred to as the drive vibration mode.

[0030] When the angular velocity ωc is applied to the vibration element 6 while driving in the drive vibration mode, as shown in FIG. 7, a detection vibration mode is newly excited. In the detection vibration mode, a Coriolis force acts on the drive arms 75 to 78, and vibration in the direction indicated by the arrow b is excited. In response to this vibration, the detection arms 71 and 72 generate detection vibration due to bending vibration in the direction indicated by the arrow a.

[0031] The charge generated in the detection arm 71 by such a detection vibration mode is taken out as a first detection signal from between the first detection signal electrode 83 and the first detection ground electrode 84, and the charge generated in the detection arm 72 is taken out as a second detection signal from between the second detection signal electrode 85 and the second detection ground electrode 86. Based on these first and second detection signals, the angular velocity ωc can be detected.

[0032] Next, with reference to FIG. 8, the configuration of the support substrate 500 will be described.

[0033] The support substrate 500 has a frame portion 501 that is rectangular and fixed to the base 21 in a plan view from the C-axis direction, a first beam 510 as a first extension portion extending from the frame portion 501 in the +A direction, and a second beam 520 extending from the frame portion 501 in the -A direction.

[0034] Furthermore, the support substrate 500 has a third beam 530 extending from the frame portion 501 in the -A direction and a fourth beam 540 extending from the frame portion 501 in the +A direction. Furthermore, the support substrate 500 has a fifth beam 550 extending from the frame portion 501 in the -A direction and a sixth beam 560 extending from the frame portion 501 in the +A direction. Each of the first beam 510 to the sixth beam 560 is arranged separately without contacting each other.

[0035] The first beam 510 has a first tip portion 511 in a region overlapping with the base portion 70 of the vibration element 6 in plan view. The second beam 520 has a second tip portion 521 in a region overlapping with the base portion 70 of the vibration element 6 in plan view. The third beam 530 has a third tip portion 531 in a region overlapping with the base portion 70 of the vibration element 6 in plan view. The fourth beam 540 has a fourth tip portion 541 in a region overlapping with the base portion 70 of the vibration element 6 in plan view. The fifth beam 550 has a fifth tip portion 551 in a region overlapping with the base portion 70 of the vibration element 6 in plan view. The sixth beam 560 has a sixth tip portion 561 in a region overlapping with the base portion 70 of the vibration element 6 in plan view.

[0036] The first beam 510 to the sixth beam 560 are made of the same material as the frame portion 501. Examples of the material of the frame portion 501 include, for example, quartz. Note that it is not limited to quartz and may be silicon.

[0037] In this way, by forming the frame portion 501 of the support substrate 500 and the first beam 510 to the sixth beam 560 of the same quartz, the thermal expansion coefficients of the frame portion 501 and the first beam 510 to the sixth beam 560 can be made equal. Therefore, thermal stress caused by the difference in thermal expansion coefficients between them is not substantially generated, and it becomes difficult to receive stress.

[0038] Also, it is preferable that the first beam 510, the second beam 520, that is, the support substrate 500 and the vibration element 6 are made of the same material. According to this configuration, since they are made of the same material, even when a temperature change occurs in the vibration element 6 and the support substrate 500, it is possible to suppress being affected by the thermal expansion coefficient, and it is possible to suppress the deterioration of the vibration characteristics.

[0039] The support substrate 500 is composed of a crystal substrate having the same cut angle as the vibration substrate 7 of the vibration element 6. The orientation of the crystal axes of the support substrate 500 coincides with the orientation of the crystal axes of the vibration substrate 7. That is, the X-axis, Y-axis, and Z-axis of the support substrate 500 and the vibration substrate 7 coincide with each other.

[0040] Since quartz has different coefficients of thermal expansion in the X-axis direction, Y-axis direction, and Z-axis direction respectively, by making the support substrate 500 and the vibration substrate 7 have the same cut angle and aligning the orientations of their crystal axes with each other, it becomes more difficult for thermal stress to occur between the support substrate 500 and the vibration substrate 7. Therefore, it becomes more difficult for the vibration element 6 to receive additional stress, and the degradation and variation of its vibration characteristics can be more effectively suppressed.

[0041] Note that the support substrate 500 is not limited to this. For example, it may have the same cut angle as the vibration substrate 7, but the direction of the crystal axes may be different from that of the vibration substrate 7. Also, the support substrate 500 may be formed from a crystal substrate having a cut angle different from that of the vibration substrate 7.

[0042] As shown in FIGS. 1 to 3, the support substrate 500 is electrically connected to the base portion 70 of the vibration element 6 via a conductive joining member B2.

[0043] Specifically, the first tip portion 511 of the first beam 510 of the support substrate 500 is electrically connected to the base portion 70 via the first joining member B2. The second tip portion 521 of the second beam 520 is electrically connected to the base portion 70 via the second joining member B2. Similarly, the third tip portion 531 to the sixth tip portion 561 are electrically connected to the base portion 70 via the joining member B2. The support substrate 500 is fixed to the bottom surface of the recess 211a via a conductive joining member B1.

[0044] In this way, since the first beam 510, the second beam 520, etc. extend from the frame portion 501 of the support substrate 500, and the first beam 510 is connected to the base 70 via the first joining member B2, and the second beam 520 is connected to the base 70 via the second joining member B2, when the vibration element 6 vibrates, the strain generated in the base 70 can be absorbed, relaxed, and reduced by the first beam 510 and the second beam 520 being flexibly deformed separately. The same applies to the third beam 530 to the sixth beam 560. Thereby, the vibration device 1 in which the vibration characteristics of the vibration element 6 are suppressed from deteriorating can be provided.

[0045] Further, by interposing the support substrate 500 between the vibration element 6 and the base 21, the stress transmitted from the base 21 can be absorbed and relaxed by the support substrate 500, and it becomes difficult for the stress to be transmitted to the vibration element 6. Therefore, a decrease and variation in the vibration characteristics of the vibration element 6 can be effectively suppressed.

[0046] The joining members B1 and B2 are not particularly limited as long as they have both conductivity and joinability. For example, various metal bumps such as gold bumps, silver bumps, copper bumps, and solder bumps, and conductive adhesives in which conductive fillers such as silver fillers are dispersed in various adhesives such as polyimide-based, epoxy-based, silicon-based, and acrylic-based adhesives can be used.

[0047] When using metal bumps as the joining members B1 and B2, generation of gas from the joining members B1 and B2 can be suppressed, and environmental changes in the internal space S, particularly an increase in pressure, can be effectively suppressed. On the other hand, when using a conductive adhesive as the joining members B1 and B2, the joining members B1 and B2 become relatively soft, and stress can also be absorbed and relaxed in the joining members B1 and B2.

[0048] The first tip portion 511 and the second tip portion 521 have widened portions 511a and 521a that are wider than the first beam 510 and the second beam 520. The third tip portion 531 to the sixth tip portion 561 also have similar widened portions 531a to 561a. According to this, since they have the widened portions 511a to 561a, it is possible to suppress the first joining member B2, the second joining member B2, etc. from protruding from the first beam 510 and the second beam 520, and it is possible to surely electrically connect the first beam 510 and the second beam 520 to the base 70.

[0049] On the support substrate 500, a wiring pattern (not shown) that electrically connects the vibration element 6 and the internal terminal 241 is arranged. The wiring pattern is electrically connected to the internal terminals 241 corresponding to the respective terminals 701 to 706.

[0050] Next, while referring to FIG. 9, the manufacturing method of the vibration device 1 will be described. Note that, among the manufacturing methods of the vibration device 1, the manufacturing method of the support substrate 500 will be mainly described.

[0051] As shown in FIG. 9, in step S11, a substrate to be the support substrate 500 is prepared. Specifically, for example, a quartz substrate is prepared.

[0052] In step S12, an etching process is performed on the quartz substrate. Specifically, for example, a metal film such as gold or chromium having corrosion resistance is formed on the quartz substrate, a resist pattern is formed on the upper surface thereof, the metal film is etched, and the quartz substrate is etched using the metal film pattern after etching as a mask. Thereby, the support substrate 500 including the frame portion 501, the first beam 510 extending from the frame portion 501, and the second beam 520 extending from the frame portion 501 is completed.

[0053] Note that the third beam 530 to the sixth beam 560 are also formed in the same manner. That is, the frame portion 501 and the first beam 510 to the sixth beam 560, which are made of the same material, are formed simultaneously. Thereafter, the first beam 510 is electrically connected to the first tip portion 511 and the base 70 via the first joining member B2. The second beam 520 is electrically connected to the second tip portion 521 and the base 70 via the second joining member B2. Thus, the vibration device 1 is completed.

[0054] In this way, since the frame portion 501, the first beam 510, and the second beam 520 are formed simultaneously, the first beam 510 and the second beam 520 can be extended from the frame portion 501 of the support substrate 500. As a result, the first beam 510 is connected to the base 70 via the first joining member B2, and the second beam 520 is connected to the base 70 via the second joining member B2. When the vibration element 6 vibrates, the strain generated in the base 70 can be absorbed, relaxed, and reduced by the first beam 510 and the second beam 520 being flexibly deformed separately. Consequently, the vibration device 1 can be manufactured in which the vibration characteristics of the vibration element 6 are suppressed from deteriorating.

[0055] As described above, the vibration device 1 of the present embodiment is a vibration device 1 including a support substrate 500 having a frame portion 501 and a vibration element 6 disposed on the support substrate 500 and having a base 70. The support substrate 500 is composed of the same material as the frame portion 501, and includes a first beam 510 having a first tip portion 511 in a region extending from the frame portion 501 and overlapping the base 70, and a second beam 520 composed of the same material as the frame portion 501, having a second tip portion 521 in a region extending from the frame portion 501 and overlapping the base 70. The base 70 and the first tip portion 511 are connected via the first joining member B2, and the base 70 and the second tip portion 521 are connected via the second joining member B2.

[0056] According to this configuration, the first beam 510 and the second beam 520 extend from the frame portion 501 of the support substrate 500, and the first beam 510 is connected to the base portion 70 via the first joining member B2, and the second beam 520 is connected to the base portion 70 via the second joining member B2. Therefore, when the vibrating element 6 vibrates, the strain generated in the base portion 70 can be absorbed, alleviated, and reduced by the first beam 510 and the second beam 520 being flexibly deformed separately. Thereby, it is possible to provide the vibration device 1 in which the vibration characteristics of the vibrating element 6 are suppressed from deteriorating.

[0057] Also, since wiring is formed on the individual beams 510 to 560 via the joining member B2, the routing of the wiring on the support substrate 500 can be simplified. Further, compared with the case where the support substrate 500 and the beams 510 to 560 are arranged on separate substrates, it is possible to suppress the occurrence of relative displacement between the support substrate 500 and the beams 510 to 560. Therefore, it is possible to suppress variations in the performance of the vibration device 1.

[0058] Also, in the vibration device 1 of the present embodiment, it is preferable that the vibrating element 6, the first beam 510, and the second beam 520 are made of the same material. According to this configuration, since they are made of the same material, even when a temperature change occurs in the vibrating element 6, the first beam 510, and the second beam 520, it is possible to suppress being affected by the coefficient of thermal expansion, and it is possible to suppress the deterioration of the vibration characteristics.

[0059] Also, in the vibration device 1 of the present embodiment, at least one of the first tip portion 511 and the second tip portion 521 preferably has widened portions 511a, 521a that are wider than the first beam 510 and the second beam 520. According to this configuration, since it has the widened portions 511a, 521a, it is possible to suppress the first joining member B2 and the second joining member B2 from protruding from the first beam 510 and the second beam 520, and it is possible to surely electrically connect the first beam 510 and the second beam 520 to the base portion 70.

[0060] In addition, in the vibration device 1 of the present embodiment, it is preferable to have a circuit element 3 electrically connected to the vibration element 6. According to this configuration, since the circuit element 3 is provided, for example, it can be used as a gyro sensor, an oscillator, or the like.

[0061] In addition, in the vibration device 1 of the present embodiment, it is preferable to have a package 2, and a support substrate 500 and a vibration element 6 are arranged inside the package 2. According to this configuration, since the vibration element 6 and the like are housed in the package 2, it is possible to hermetically seal the vibration element 6, and it is possible to suppress deterioration of the vibration characteristics.

[0062] Moreover, the manufacturing method of the vibration device 1 of the present embodiment includes a support substrate 500 having a frame portion 501 and a vibration element 6 disposed on the support substrate 500 and having a base portion 70. The support substrate 500 is made of the same material as the frame portion 501, and includes a first beam 510 having a first tip portion 511 in a region extending from the frame portion 501 and overlapping the base portion 70, and a second beam 520 having a second tip portion 521 in a region extending from the frame portion 501 and overlapping the base portion 70, both of which are made of the same material as the frame portion 501. The base portion 70 and the first tip portion 511 are connected via a first joining member B2, and the base portion 70 and the second tip portion 521 are connected via a second joining member B2. The manufacturing method of the vibration device 1 includes a step of simultaneously forming the frame portion 501, the first beam 510, and the second beam 520.

[0063] According to this method, since the frame portion 501, the first beam 510, and the second beam 520 are simultaneously formed, it is possible to extend the first beam 510 and the second beam 520 from the frame portion 501 of the support substrate 500. When the vibration element 6 vibrates, the strain generated in the base portion 70 can be absorbed, relaxed, and reduced by the first beam 510 and the second beam 520 being flexibly deformed separately. Thereby, it is possible to provide a manufacturing method of the vibration device 1 in which deterioration of the vibration characteristics of the vibration element 6 is suppressed.

[0064] Hereinafter, a modification of the above-described embodiment will be described.

[0065] As described above, the support substrate 500 has the first beam 510 extending from the frame portion 501 in the +A direction and the second beam 520 extending from the frame portion 501 in the -A direction. However, the present invention is not limited to this, and the configuration of the support substrate 500A shown in FIG. 10 may also be used.

[0066] As shown in FIG. 10, in addition to the first beam 510 and the second beam 520 extending in the +A direction or the -A direction, which is the first extension direction, the support substrate 500A of the modification example may include portions extending in the +B direction or the -B direction, which is the second extension direction.

[0067] Specifically, leaf spring-like portions 570A extending in the +B direction or the -B direction are provided in the middle of the first beam 510A, the fourth beam 540A, and the sixth beam 560A extending from the frame portion 501 in the +A direction. Further, leaf spring-like portions 580A extending in the +B direction or the -B direction are provided in the middle of the second beam 520A, the third beam 530A, and the fifth beam 550A extending from the frame portion 501 in the -A direction.

[0068] Thus, in the support substrate 500A of the modification example, at least one of the first beam 510 and the second beam 520 includes a first extension portion extending in the first extension direction, that is, the beams 510 and 520, and a second extension portion extending in a second extension direction different from the first extension direction, that is, the portions 570A and 580A. According to this configuration, since the first extension portion and the second extension portion are included, the displacement of the strain generated in the first extension direction, that is, the +A direction or the -A direction, can be absorbed by the leaf spring-like portions 570A and 580A, and it is possible to suppress the deterioration of the vibration characteristics.

[0069] As described above, the support substrate 500 has the first beam 510 extending from the frame portion 501 in the +A direction and the second beam 520 extending from the frame portion 501 in the -A direction. However, the present invention is not limited to this, and the configuration of the support substrate 500B shown in FIG. 11 may also be used.

[0070] As shown in FIG. 11, in addition to the first beam 510 and the second beam 520 extending in the +A direction or the -A direction which is the first extension direction, the support substrate 500B of the modified example may include portions extending in the +B direction or the -B direction which is the second extension direction.

[0071] Specifically, in the middle of the first beam 510B extending from the frame portion 501 in the +A direction, there is provided a leaf spring-like portion 570B extending in the +B direction or the -B direction. In the middle of the fourth beam 540B, there is provided a portion extending in the +B direction. In the middle of the sixth beam 560B, there is provided a portion extending in the -B direction.

[0072] Also, in the middle of the second beam 520B extending from the frame portion 501 in the -A direction, there is provided a leaf spring-like portion 580B extending in the +B direction or the -B direction. In the middle of the third beam 530B, there is provided a portion extending in the +B direction. In the middle of the fifth beam 550B, there is provided a portion extending in the -B direction.

[0073] In this way, since the leaf spring-like portions 570B and 580B are provided only on the first beam 510B and the second beam 520B of the modified example, it is possible to suppress the slight differences in the movements of the adjacent beams 530B, 540B, 550B, and 560 from affecting each other through the leaf spring-like portions 570B and 580B.

[0074] Also, since the leaf spring-like portions 570B and 580B are provided only on the first beam 510B and the second beam 520B which are the most easily deformed among the first beam 510B to the sixth beam 560B, it is possible to absorb the displacement of the strain generated in the +A direction or the -A direction, and suppress the deterioration of the vibration characteristics. Furthermore, since no leaf spring-like portion is provided on the other third beam 530 to the sixth beam 560, the support substrate 500B can be miniaturized.

[0075] Also, as described above, the double T-shaped gyro element was given as an example of the vibration element 6, but the present invention is not limited thereto, and an H-shaped gyro sensor element or a silicon MEMS gyro sensor element may be used. Further, the present invention is not limited to the gyro element, and for example, a tuning fork type vibration element may be used.

Explanation of Reference Numerals

[0076] 1... Vibration device, 2... Package, 3... Circuit element, 6... Vibration element, 7... Vibration substrate, 8... Electrode, 21... Base, 22... Lid, 23... Joining member, 70... Base portion, 71, 72... Detection arms, 73, 74... Connecting arms, 75 to 78... Driving arms, 81... Driving signal electrode, 82... Driving ground electrode, 83... First detection signal electrode, 84... First detection ground electrode, 85... Second detection signal electrode, 86... Second detection ground electrode, 211, 211a, 211b, 211c... Recesses, 241, 242... Internal terminals, 243... External terminal, 500, 500A, 500B... Support substrates, 501... Frame portion, 510, 510A, 510B... First beams, 511... First tip portions, 511a... Wide portions, 520, 520A, 520B... Second beams, 521... Second tip portions, 530... Third beam, 531... Third tip portions, 540... Fourth beam, 541... Fourth tip portions, 550... Fifth beam, 551... Fifth tip portions, 560... Sixth beam, 561... Sixth tip portions, 570A, 570B, 580A, 580B... Portions, 701 to 706... Terminals.

Claims

1. A support substrate having a frame portion, A vibration element disposed on the support substrate and having a base portion, A vibration device comprising: The support substrate, A first beam made of the same material as the frame portion, extending from the frame portion, and having a first tip portion in a region overlapping the base portion; A second beam made of the same material as the frame portion, extending from the frame portion, and having a second tip portion in a region overlapping the base portion; Comprising: The base portion and the first tip portion are connected via a first joining member, A vibration device in which the base portion and the second tip portion are connected via a second joining member.

2. The vibration device according to claim 1, The vibration element, the first beam, and the second beam are made of the same material.

3. The vibration device according to claim 1, At least one of the first beam and the second beam includes a first extension portion extending in a first extension direction and a second extension portion extending in a second extension direction different from the first extension direction.

4. The vibration device according to claim 1, At least one of the first tip portion and the second tip portion has a widened portion that is wider than the first beam and the second beam.

5. The vibration device according to claim 1, Having a circuit element electrically connected to the vibration element.

6. The vibration device according to claim 1, Having a package, A vibration device in which the support substrate and the vibration element are disposed in the package.

7. A support substrate having a frame portion, A vibration element disposed on the support substrate and having a base portion, Comprising: The support substrate, A first beam made of the same material as the frame portion, extending from the frame portion, and having a first tip portion in a region overlapping the base portion; A second beam made of the same material as the frame portion, extending from the frame portion, and having a second tip portion in a region overlapping the base portion; Comprising: The base portion and the first tip portion are connected via a first joining member, A method for manufacturing a vibration device in which the base portion and the second tip portion are connected via a second joining member, The method for manufacturing a vibration device includes a step of simultaneously forming the frame portion, the first beam, and the second beam.

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