Integrated sealing sheet, light-emitting type electronic component, and manufacturing method for the same

Abstract

To provide an integrated sealing sheet that does not interrupt the reach of light to a viewer side in a display while suppressing the luminance unevenness, and a light-emitting type electronic component using the sheet and a manufacturing method for the same.SOLUTION: The present invention relates to an integrated sealing sheet 1 that is crimped on a surface of an element-attached substrate 2, which is a substrate 20 where a plurality of light-emitting elements 21, 22, and 23 are disposed, on which the light-emitting elements 21, 22, and 23 are disposed. In this integrated sealing sheet 1, a curable resin layer 10 for covering the light-emitting elements 21, 22, and 23, a light diffusion layer 14 containing filler and diffusing incident light from the light-emitting elements 21, 22, and 23, and a support layer 15 for supporting the light diffusion layer 14 are stacked in this order.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to an integrated sealing sheet, a light-emitting electronic component using the sheet, and a method for manufacturing the same.

Background Art

[0002] In recent years, displays using extremely small light-emitting diodes called mini LEDs or micro LEDs have attracted attention. As methods for using such extremely small light-emitting diodes in a display, there are roughly two known methods. One is a method of arranging a large number of light-emitting diodes on a substrate to form a liquid crystal backlight and locally controlling the brightness of the backlight. The other is a method of emitting light-emitting diodes of each color of R (red), G (green), and B (blue) and sending light of each color to the eyes of the viewer of the display in pixel units.

[0003] Conventionally, displays using light-emitting diodes (referred to as light-emitting elements) as described above have had a problem of uneven brightness (luminance unevenness) due to the light source of the light-emitting elements. The luminance unevenness causes a phenomenon called "color shift" in which the color tone changes when viewed from the front of the display and when viewed from an oblique viewing angle, and a sealing material for the light-emitting element that can suppress the luminance unevenness has been demanded.

[0004] Patent Document 1 discloses a laminated sheet including an adhesive layer containing light-diffusing fine particles and a black-based colorant in order to prevent the luminance unevenness. However, in the optoelectronic device after sealing with the laminated sheet, the entire light-emitting element including the upper surface (light-emitting surface) is completely covered with the adhesive layer, and there is a risk that the light emitted from the light-emitting element will hardly reach the viewer side of the display.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] Therefore, an object of the present invention is to provide an integrated sealing sheet that suppresses luminance unevenness and does not prevent light from reaching the viewer side of a display, a light-emitting electronic component using the sheet, and a method for manufacturing the same.

Means for Solving the Problems

[0007] (1) An integrated sealing sheet according to an embodiment for achieving the above object is an integrated sealing sheet for pressure-bonding to a surface of a substrate with elements on which a plurality of light-emitting elements are arranged, on the surface of the substrate with elements where the plurality of light-emitting elements are arranged, a curable resin layer for covering the light-emitting elements, a light diffusion layer containing a filler and for diffusing incident light from the light-emitting elements, a support layer for supporting the light diffusion layer, are laminated in this order. (2) In the integrated sealing sheet according to another embodiment, preferably, the curable resin layer has at least a black curable resin layer for shielding light between the light-emitting elements and a transparent curable resin layer having higher light transmittance than the black curable resin layer, the light diffusion layer may be provided between the transparent curable resin layer and the support layer. (3) In the integrated sealing sheet according to another embodiment, preferably, the thickness of the light diffusion layer may be 20 to 150 μm. (4) In the integrated sealing sheet according to another embodiment, preferably, the total light transmittance in a state where the support layer and the light diffusion layer are laminated may be 80 to 99%. (5) In the integrated sealing sheet according to another embodiment, preferably, the haze value in a state where the support layer and the light diffusion layer are laminated may be 75 to 99.9%. (6) In the integrated sealing sheet according to another embodiment, preferably, the average particle diameter of the filler may be 0.5 to 10 μm. (7) In the integrated sealing sheet according to another embodiment, preferably, the mass part ratio of the filler may be 3 to 40 parts by mass with respect to 100 parts by mass of the resin solid content of the light diffusion layer. (8) In the integrated sealing sheet according to another embodiment, preferably, the light diffusion layer may be a cured layer containing at least one of an epoxy resin, an acrylic resin, and / or a polyurethane resin. (9) In the integrated sealing sheet according to another embodiment, preferably, the support layer may be provided with a hard coat layer on the surface opposite to the surface in contact with the light diffusion layer. (10) In the integrated sealing sheet according to another embodiment, preferably, the storage elastic modulus at 100 °C in the uncured state of the transparent curable resin layer may be smaller than the storage elastic modulus at 100 °C in the cured state of the light diffusion layer. (11) In the integrated sealing sheet according to another embodiment, preferably, the transparent curable resin layer may contain a filler. (12) A light-emitting electronic component according to an embodiment for achieving the above object is a substrate with elements having a plurality of light-emitting elements arranged thereon, and an integrated sealing curable sheet in a state of being pressure-bonded to the surface of the substrate with elements on which the plurality of light-emitting elements are arranged, wherein the integrated sealing curable sheet is, at least from the side in contact with the substrate with elements, a resin layer covering the light-emitting elements, a light diffusion layer containing a filler and for diffusing incident light from the light-emitting elements, a support layer for supporting the light diffusion layer, are laminated in this order, and the resin layer fills between the plurality of light-emitting elements. (13) In the light-emitting electronic component according to another embodiment, preferably, The resin layer has a black resin layer capable of shielding light between the light-emitting elements from the side in contact with the substrate with elements, and a transparent resin layer having higher light transmittance than the black resin layer. At least the black resin layer is filled between the light-emitting elements. The light diffusion layer may be provided between the transparent resin layer and the support layer. (14) A method for manufacturing a light-emitting electronic component according to an embodiment for achieving the above object includes: A step of pressing the integrated sealing sheet according to any one of the above on the surface of the substrate with elements on which a plurality of light-emitting elements are arranged, where the plurality of light-emitting elements are arranged; A step of filling at least a part of the curable resin layer between the plurality of light-emitting elements; A step of curing the curable resin layer.

Advantages of the Invention

[0008] The present invention can provide an integrated sealing sheet that suppresses luminance unevenness and does not prevent light from reaching the viewer side of the display, a light-emitting electronic component using the sheet, and a manufacturing method thereof.

Brief Description of the Drawings

[0009]

Figure 1

Figure 2

Figure 3

Figure 4

Embodiments for Carrying Out the Invention

[0010] Next, embodiments of the present invention will be described with reference to the drawings. Note that the embodiments described below do not limit the invention according to the claims, and not all of the elements and combinations thereof described in the embodiments are essential for the solution means of the present invention. In the present application, the "main component" means a component that occupies 50% by mass or more based on the total solid content of the entire composition. In the present application, the "total resin solid content" means the total solid content mass of the resin and the elastomer, and when a curing agent is blended in addition to the elastomer, the solid content mass of the curing agent is also included. The numerical range represented by "~" means a numerical range with the numerical values before and after "~" as the lower limit value and the upper limit value.

[0011] FIG. 1 shows a cross-sectional view when the integrated encapsulation sheet according to one embodiment is cut in the thickness direction. FIG. 2 shows a cross-sectional view equivalent to FIG. 1 when the integrated encapsulation sheet of FIG. 1 is arranged such that its black curable resin layer is in contact with the top surface of the light-emitting element of the substrate with elements. FIG. 3 shows a cross-sectional view equivalent to FIG. 1 in a state where the integrated encapsulation sheet is pressure-bonded to the substrate with elements from the stage of FIG. 2 until the black curable resin layer and the transparent curable resin layer of FIG. 1 are embedded between the light-emitting elements. FIG. 4 shows a cross-sectional view equivalent to FIG. 1 in a state after further proceeding from the stage of FIG. 3, peeling off the protective sheet on the hard coat layer, and performing a curing treatment.

[0012] 1. Integrated Encapsulation Sheet The integrated encapsulation sheet 1 is an integrated encapsulation sheet for pressure-bonding to the surface of the substrate with elements 2 on which a plurality of light-emitting elements 21, 22, 23 are arranged on the substrate 20, and at least a curable resin layer 10, a light diffusion layer 14, and a support layer 15 are laminated in this order.

[0013] The curable resin layer 10 is a layer for covering the light-emitting elements 21, 22, and 23 on the substrate 2 with elements. The curable resin layer 10 is a resin layer having the property of being cured by heat or the like through the curing process described later. That is, the curable resin layer 10 is an uncured layer until it undergoes the curing process. The curable resin layer 10 preferably has at least a black curable resin layer 11 and a transparent curable resin layer 12. As shown in FIG. 1, the integrated sealing sheet 1 according to the present embodiment laminates the black curable resin layer 11, the transparent curable resin layer 12, the light diffusion layer 14, the support layer 15, and the hard coat layer 18 described later in this order. The curable resin layer 10 in the present embodiment is shown as a two-layer structure of the black curable resin layer 11 and the transparent curable resin layer 12, but is not limited thereto, and may be one layer or three or more layers. Note that the integrated sealing sheet 1 may further include a protective sheet on the outer surface of either one or both of the black curable resin layer 11 and the hard coat layer 18 for convenience of handling.

[0014] (L* value of the integrated sealing sheet) The L* value in the integrated sealing sheet 1 is measured from the support layer 15 side in accordance with JIS Z 8781-4:2013, using a light source D65, a viewing field of 2°, the reflection method, and the SCE method. The L* value is preferably less than 30, and more preferably less than 26. The measurement of the L* value is performed on a standard white calibration plate. Since the light transmittance of the black curable resin layer 11 in the integrated sealing sheet 1 is low, the influence of the standard white calibration plate is almost negligible. By the L* value being less than the above upper limit value, the blackness when the display is turned off can be enhanced. The measurement of the L* value is preferably performed in a state where it is not pressure-bonded and filled to the substrate 2 with elements.

[0015] Hereinafter, each layer of the integrated sealing sheet 1 according to the present embodiment will be described in detail.

[0016] (1) Black curable resin layer The black curable resin layer 11 is a layer for blocking light between the light-emitting elements 21, 22, and 23. It is also a layer for improving the contrast of the display. Further, the black curable resin layer 11 sufficiently fills the space between the plurality of light-emitting elements 21, 22, and 23 arranged on the substrate 2 with elements in a crimping process typified by thermocompression bonding or the like, and prevents appearance defects due to the expansion of unfilled voids in a curing process typified by thermosetting and damage to the light-emitting elements 21, 22, and 23 caused by external factors in subsequent processes. In the present embodiment, the black curable resin layer 11 has a transparent curable resin layer 12 laminated on one surface and is covered with a protective sheet 16 on the other surface. The black curable resin layer 11 is cured through a curing process and becomes the black resin layer 31 described later. That is, the black curable resin layer 11 is an uncured layer.

[0017] [L*a*b* value] In the black curable resin layer 11, the L*a*b* values in the cured state measured in accordance with JIS Z 8781-4:2013, with a light source D65, a viewing field of 2°, the reflectance method, and the SCE method are preferably L*: 3 to 40, a*: -10 to 10, b*: -20 to 20, and more preferably L*: 3 to 30, a*: -5 to 5, b*: -15 to 15. The measurement of the above L*a*b* values is performed on a standard white calibration plate. Since the light transmittance of the black curable resin layer 11 is low, the influence of the standard white calibration plate is almost negligible. By the L*a*b* values in the cured state being within a preferable range, the black curable resin layer 11 can block light between the light-emitting elements 21, 22, and 23 after curing and further improve the contrast of the display. Note that the uncured black curable resin layer 11 also has the same indexes as above.

[0018] [Total light transmittance] The total light transmittance in the cured state of the black curable resin layer 11 is lower than that in the cured state of the transparent curable resin layer 12. Specifically, the black curable resin layer 11 is prepared such that its total light transmittance in the cured state is 0 to 50%. The total light transmittance in the cured state of the black curable resin layer 11 is preferably prepared to be 0 to 40%, more preferably 0 to 30%. Since the upper limit values such as 50%, 40%, and 30% of the total light transmittance are not exceeded, the black curable resin layer 11 can achieve light shielding between the light emitting elements 21, 22, and 23 after curing. The total light transmittance in this specification can be measured with a haze meter in accordance with JIS K 7361-1. The total light transmittance in the cured state can be mainly changed by the presence or absence of carbon black blending or its blending amount. Also, the total light transmittance in the cured state can be changed by the thickness of the black curable resin layer 11 and the type of the resin composition.

[0019] [Storage Elastic Modulus] In the present application, the storage elastic modulus can be measured, for example, by a method in accordance with JIS K 7244. The storage elastic modulus of the black curable resin layer 11 in the uncured state is preferably smaller than that of the transparent curable resin layer 12 in the uncured state. The storage elastic modulus of the black curable resin layer 11 at 100 °C is preferably 1.0×10 5 Pa or less, more preferably 1.0×10 1 ~1.0×10 5 Pa, and even more preferably 1.0×10 2 ~5.0×10 4It is Pa. In the uncured state, since the storage elastic modulus of the black curable resin layer 11 at 100°C is equal to or lower than the preferable upper limit value, the black curable resin layer 11 exhibits sufficient fluidity when being pressure-bonded to the plurality of light-emitting elements 21, 22, and 23, and can sufficiently fill the space between the plurality of light-emitting elements 21, 22, and 23. In the uncured state, since the storage elastic modulus of the black curable resin layer 11 at 100°C is equal to or higher than the preferable lower limit value, it is possible to prevent pressure unevenness during thermocompression bonding between the black curable resin layer 11 and the transparent curable resin layer 12, and a uniform appearance can be maintained. Further, resin outflow beyond a predetermined range can be prevented, and the film thickness after pressure bonding can be ensured.

[0020] The storage elastic modulus of the black curable resin layer 11 at 60°C after heat treatment at 120°C for 1 hour is preferably 7×10 8 ~2×10 10 Pa. Since the storage elastic modulus is equal to or lower than the preferable upper limit value, when cutting the edge of the substrate 20, it is possible to prevent cracks from occurring in the cured black curable resin layer 11. Further, since the storage elastic modulus is equal to or higher than the preferable lower limit value, when cutting the edge of the substrate 20, it is possible to prevent the cured black curable resin layer 11 from deforming and expanding and contracting, and the integrated sealing sheet 1 on the edge side of the substrate 20 from being distorted in a wave shape.

[0021] The storage elastic modulus of the black curable resin layer 11 in the uncured state is preferably 5.0×10 5 Pa or less at 150°C, more preferably 5.0×10 2 ~5.0×10 5 Pa, and even more preferably 1.0×10 3 ~1.0×10 5 Pa. In the uncured state, since the storage elastic modulus of the black curable resin layer 11 at 150°C is equal to or lower than the preferable upper limit value, cracks due to curing shrinkage are less likely to occur during thermosetting. Since the storage elastic modulus of the black curable resin layer 11 at 150°C is equal to or higher than the preferable lower limit value, the flow during thermosetting can be suppressed, and appearance defects after curing such as repelling phenomena can be suppressed.

[0022] [Curable Resin Composition] The black curable resin layer 11 contains a curable resin composition. Examples of the curable resin composition include a curable resin composition containing at least one resin selected from an epoxy resin, an acrylic resin, a polyester resin, a polyurethane resin, and a silicone resin, and a curing agent. Among the above curable resin compositions, an epoxy resin composition that can achieve curability at low temperatures and is excellent in heat resistance and reliability is preferable. In the present specification, the epoxy resin composition is a composition containing an epoxy resin as a main component, or a composition containing an epoxy resin and a curing agent as main components.

[0023] When the black curable resin layer 11 is composed of an epoxy resin composition, it may contain a curing agent for other epoxy resins other than a modified elastomer having a functional group capable of reacting with an epoxy group. Examples of other curing agents include known curing agents such as phenolic curing agents, acid anhydride curing agents, and amine curing agents. Two or more other curing agents may be used in combination.

[0024] (Epoxy resin) In the present application, the epoxy resin is a compound having an epoxy group in the molecule. As the epoxy resin used in the present invention, those having two or more epoxy groups in one molecule are preferable. This is because a crosslinked structure can be formed by the reaction with a modified resin having a functional group capable of reacting with an epoxy group, and high heat resistance can be exhibited in the cured product. Further, when two or more epoxy resins having two or more epoxy groups are used, the degree of crosslinking with a curing agent having a functional group capable of reacting with an epoxy group is sufficient, and sufficient heat resistance can be obtained in the cured product.

[0025] Examples of the epoxy resin include a bifunctional epoxy resin having two epoxy groups in the molecule, a polyfunctional epoxy resin having three or more epoxy groups in the molecule, a high molecular weight epoxy resin having a weight average molecular weight of 10,000 or more, and the like. Further, they may be hydrogenated epoxy resins. In the present application, an epoxy resin having a weight average molecular weight of 10,000 or more is classified as a high molecular weight epoxy resin regardless of the number of epoxy groups in the molecule, and is not classified as a bifunctional epoxy resin or a polyfunctional epoxy group. The weight average molecular weight of the epoxy resin is the molecular weight in terms of polystyrene measured by gel permeation chromatography.

[0026] Examples of epoxy resins include bisphenol A type epoxy resins, bisphenol F type epoxy resins, or phenoxy resins obtained by polymerizing them, bisphenol-based epoxy resins such as hydrogenated products thereof; novolac type epoxy resins such as phenol novolac epoxy resins, o-cresol novolac epoxy resins, bisphenol A novolac epoxy resins, novolac epoxy resins containing a xylene structure, naphthol novolac type epoxy resins; glycidyl ester-based epoxy resins such as diglycidyl phthalate, diglycidyl isophthalate, diglycidyl terephthalate, glycidyl p-hydroxybenzoate, diglycidyl tetrahydrophthalate, diglycidyl succinate, diglycidyl adipate, diglycidyl sebacate, triglycidyl trimellitate; glycidyl ether-based epoxy resins such as ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, 1,4-butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, trimethylolpropane triglycidyl ether, pentaerythritol tetraglycidyl ether, tetraphenyl glycidyl ether ethane, triphenyl glycidyl ether ethane, polyglycidyl ether of sorbitol, polyglycidyl ether of polyglycerol; glycidyl amine-based epoxy resins such as triglycidyl isocyanurate, tetraglycidyl diaminodiphenylmethane; linear aliphatic epoxy resins such as epoxidized polybutadiene, epoxidized soybean oil; special skeleton epoxy resins such as brominated bisphenol A type epoxy resins, phosphorus-containing epoxy resins, fluorine-containing epoxy resins, epoxy resins containing a dicyclopentadiene skeleton, epoxy resins containing a naphthalene skeleton, anthracene type epoxy resins, tertiary butyl catechol type epoxy resins, triphenylmethane type epoxy resins, tetraphenylethane type epoxy resins, biphenyl type epoxy resins, bisphenol S type epoxy resins, etc., but are not limited thereto.

[0027] As the high molecular weight epoxy resin, phenoxy resin, epoxy-modified polybutadiene, copolymer of glycidyl methacrylate and methyl methacrylate, modified polymers obtained by epoxy-modifying other resins, etc. can be used. These epoxy resins may be used alone or in combination of two or more.

[0028] Among the above epoxy resins, as the epoxy resin used for the black curable resin layer 11, from the viewpoint of increasing the crosslink density after curing, a polyfunctional epoxy resin is preferable. Among the polyfunctional epoxy resins, in particular, novolac-type epoxy resins are more preferable for the following reasons. Novolac-type epoxy resins are epoxy resins into which a moderately flexible skeleton can be introduced, and the flexibility and softening point can be adjusted. Therefore, the cured product is less likely to cause brittle fracture, the stability of the performance of the cured product of the epoxy resin composition during long-term use is improved, and the crosslink density can be increased. In addition, the heat resistance of the cured product is also improved.

[0029] Specific examples of the novolac-type epoxy resin include, for example, "YX7700" manufactured by Mitsubishi Chemical Corporation, "NC7000L", "XD1000", "EOCN-1020" manufactured by Nippon Kayaku Co., Ltd., "ESN485" manufactured by Nippon Steel Chemical & Material Co., Ltd., "N-660", "N-690", "N-695", "HP-7200H" manufactured by DIC Corporation, etc.

[0030] The blending amount of the polyfunctional epoxy resin in the black curable resin layer 11 is preferably 10 to 99% by mass, more preferably 40 to 95% by mass, and even more preferably 60 to 90% by mass with respect to 100% by mass of the total resin solid content of the black curable resin layer 11. When it is at least the above lower limit value, the crosslink density can be increased to impart chemical resistance and heat resistance. Also, when it is at most the above upper limit value, the storage elastic modulus during thermocompression bonding can be adjusted, and the fluidity of the black curable resin layer 11 can be ensured.

[0031] The black curable resin layer 11 preferably does not contain a high molecular weight epoxy resin. This makes it easy to ensure sufficient fluidity of the black curable resin layer 11 during thermocompression bonding. When the black curable resin layer 11 contains a high molecular weight epoxy resin, the blending amount of the high molecular weight epoxy resin is preferably less than 50% by mass, more preferably less than 30% by mass, and even more preferably less than 10% by mass with respect to 100% by mass of the total resin solids of the black curable resin layer 11.

[0032] From the viewpoint of ensuring sufficient fluidity during thermocompression bonding, the black curable resin layer 11 preferably contains an epoxy resin having a softening point or melting point of 100°C or lower. From the viewpoints of handleability and heat resistance of the cured product, the black curable resin layer 11 more preferably contains an epoxy resin having a softening point or melting point of 40 to 95°C. By containing an epoxy resin having a softening point or melting point within the above range, it becomes easy to control the storage elastic modulus of the black curable resin layer 11.

[0033] The total blending amount of the epoxy resin in the black curable resin layer 11 is preferably 10 to 100% by mass, more preferably 20 to 99% by mass, and even more preferably 35 to 95% by mass with respect to 100% by mass of the total resin solids of the black curable resin layer 11. When it is within the above range, it becomes easy to control the storage elastic modulus of the black curable resin layer 11 and appropriate fluidity during thermocompression bonding can be ensured. Also, when it is at least the above lower limit value, the heat resistance of the black curable resin layer 11 after curing can be improved.

[0034] (Elastomer) The black curable resin layer 11 preferably contains an elastomer in addition to resins such as epoxy resin. By containing an elastomer, it becomes easy to control the storage elastic modulus of the black curable resin layer 11, that is, to control the fluidity.

[0035] As the elastomer, a thermosetting elastomer generally called "rubber" is preferred because excellent heat resistance can be obtained. Examples of the thermosetting elastomer include acrylonitrile-butadiene rubber (NBR), which is a random copolymer of butadiene and acrylonitrile, acrylic rubber, styrene-butadiene rubber, vinyl acetate resin, silicone resin, and the like. Among these, NBR is preferred. This is because NBR has good compatibility with the epoxy resin, making it easy to control the fluidity near 100°C of the black curable resin layer 11. As a result, the adhesion between the black curable resin layer 11 and the transparent curable resin layer 12 or the substrate 2 with elements is good.

[0036] The weight average molecular weight of the elastomer is preferably from 100,000 to 1,000,000, more preferably from 120,000 to 500,000, and even more preferably from 150,000 to 300,000. If the weight average molecular weight of the elastomer is within the above range, it is easy to control the storage elastic modulus of the black curable resin layer 11 and ensure the fluidity during thermocompression bonding. If the weight average molecular weight of the elastomer is below the above upper limit value, the compatibility between the elastomer and the epoxy resin is improved, and the flow during the thermosetting of the black curable resin layer 11 can be controlled more effectively.

[0037] Particularly when the black curable resin layer 11 is composed of an epoxy resin composition, it preferably contains a modified elastomer having a functional group capable of reacting with an epoxy group. The modified elastomer having a functional group capable of reacting with an epoxy group also acts as a curing agent for the epoxy resin. In addition, since the modified elastomer can react and bond with the epoxy resin, the heat resistance and reliability against thermal shock after curing of the black curable resin layer 11 are improved. Furthermore, the difference in polarity between the functional group capable of reacting with the epoxy resin and the resin skeleton acts favorably on the dispersibility, and good dispersibility can be obtained when the black curable resin layer 11 contains carbon black.

[0038] Examples of functional groups capable of reacting with epoxy groups include acid groups such as carboxy groups, sulfo groups, nitro groups, and phosphate groups, and their acid anhydride groups, hydroxyl groups, amino groups, and the like. Among these, acid groups or acid anhydride groups are preferred because they can be cured at low temperatures and the pot life can be ensured. For the same reason, carboxy groups or carboxylic acid anhydride groups are particularly preferred.

[0039] That is, when the black curable resin layer 11 is composed of an epoxy resin composition, it preferably contains an acid-modified elastomer having an acid group or an acid anhydride group, more preferably contains an acid-modified elastomer having a carboxy group, and even more preferably contains a modified NBR having a carboxy group.

[0040] As the modified NBR having a carboxy group, carboxylated acrylonitrile rubber into which acrylic acid, methacrylic acid, maleic anhydride, etc. are introduced is preferred. Commercially available products of carboxylated acrylonitrile rubber include "NX775" and "1072CGJ" manufactured by Zeon Corporation. Two or more modified elastomers having a functional group capable of reacting with an epoxy group may be used in combination.

[0041] The blending amount of the elastomer in the black curable resin layer 11 is preferably 0.01 to 90% by mass, more preferably 1 to 80% by mass, and even more preferably 5 to 65% by mass with respect to 100% by mass of the total resin solid content of the black curable resin layer 11. When within the above range, it becomes easy to control the storage elastic modulus of the black curable resin layer 11, and appropriate fluidity of the black curable resin layer 11 during thermocompression bonding can be ensured. Also, when it is above the above lower limit value, the dispersibility of carbon black in the epoxy resin composition becomes good. Furthermore, the film-forming property of the epoxy resin composition is improved, and the distribution of the film thickness when the epoxy resin composition is coated to form a film can be narrowed.

[0042] (Curing agent) When the black curable resin layer 11 is composed of an epoxy resin composition, it may contain a curing agent for other epoxy resins other than a modified elastomer having a functional group capable of reacting with an epoxy group. Examples of other curing agents include known curing agents such as phenolic curing agents, acid anhydride curing agents, and amine curing agents. Two or more of other curing agents may be used in combination.

[0043] (Curing catalyst) When the black curable resin layer 11 is composed of an epoxy resin composition, it may contain a curing catalyst that promotes the curing reaction of the epoxy resin. Examples of the curing catalyst include imidazole-based, tertiary amine-based, and phosphorus compound-based ones. Among them, the imidazole-based one, which has good compatibility with the epoxy resin and is less likely to cause yellowing, is preferable. Among the imidazole-based curing catalysts, those having a cyanoethyl group are particularly preferable because they are easily soluble in the epoxy resin. The blending amount of the curing catalyst is preferably 0.01 to 5 parts by mass, more preferably 0.05 to 4 parts by mass, and even more preferably 0.1 to 3 parts by mass with respect to 100 parts by mass of the total resin solid content of the black curable resin layer 11. When it is within the above range, the curing of the black curable resin layer 11 can proceed sufficiently, and the pot life of the integrated sealing sheet 1 can be ensured. Two or more curing catalysts may be used in combination.

[0044] (Black pigments such as carbon black) The black curable resin layer 11 is colored black and may preferably contain carbon black, titanium oxide, iron oxide, etc. for coloring, and more preferably may contain carbon black. By containing carbon black, the light-shielding property between the plurality of light-emitting elements 21, 22, 23 of the substrate 2 with elements can be realized.

[0045] The particle size of the carbon black is preferably 10 to 500 nm, more preferably 10 to 300 nm, and even more preferably 10 to 100 nm. Here, the particle size refers to the average particle size. In this specification, the average particle size of the carbon black means the average particle size measured by a measurement method using the dynamic light scattering method. Examples of the measuring apparatus using the dynamic light scattering method include NANOTRAC WAVE II UT151 manufactured by Microtrac Bell Co., Ltd.

[0046] As the carbon black, one or more known carbon blacks such as gas black, channel black, furnace black, thermal black, and lamp black can be used. Also, resin-coated carbon black may be used. Further, carbon nanofibers and carbon nanotubes may be used.

[0047] Among the above options, gas black is preferable in that it has a large amount of surface functional groups, high dispersibility, and can exhibit a sufficient light-shielding function with a small addition. Also, when the black curable resin layer 11 contains a modified elastomer having a functional group capable of reacting with an epoxy resin, the interaction between the surface functional group of the gas black and the functional group of the modified elastomer having a functional group capable of reacting with the epoxy resin further enhances the dispersibility, and good light-shielding properties and coating solution stability can be ensured.

[0048] The compounding amount of the carbon black is preferably 0.1 to 15 parts by mass, more preferably 1.0 to 10 parts by mass, based on 100 parts by mass of the total resin solid content of the black curable resin layer 11. When the compounding amount of the carbon black is at least the above lower limit value, sufficient light-shielding properties can be obtained. When the compounding amount of the carbon black is at most the above upper limit value, the thixotropy of the black curable resin layer 11 is suppressed, the fluidity during thermocompression bonding is improved, and the space between the plurality of light-emitting elements 21, 22, 23 of the substrate 2 with elements can be sufficiently filled.

[0049] (Other components) The black curable resin layer 11 can contain an inorganic filler for improving flame retardancy, heat resistance, and adjusting the refractive index. However, from the perspective that the thixotropy increases and the fluidity during thermocompression bonding decreases, making it impossible to sufficiently fill the spaces between the plurality of light-emitting elements 21, 22, and 23 of the substrate 2 with elements, it is preferably free of inorganic fillers other than carbon black.

[0050] The black curable resin layer 11 can further use, if necessary, resins other than epoxy resins and elastomers, thickeners, defoaming agents and / or leveling agents, adhesion-imparting agents such as coupling agents, and flame retardants.

[0051] (2) Transparent curable resin layer The transparent curable resin layer 12 is a layer for sufficiently pushing the black curable resin layer 11 between the plurality of light-emitting elements 21, 22, and 23 arranged on the substrate 2 with elements. The transparent curable resin layer 12 has higher light transmittance than the black curable resin layer 11. In the present application, "light transmittance" refers to the light transmittance measured by various known methods, and may be, for example, the total light transmittance measured using a haze meter in accordance with JIS K 7361-1. In the present embodiment, the transparent curable resin layer 12 is formed between the black curable resin layer 11 and the light diffusion layer 14 described later. The transparent curable resin layer 12 is cured through a curing process and becomes the transparent resin layer 32 described later. That is, the transparent curable resin layer 12 is an uncured layer.

[0052] [Total light transmittance] The total light transmittance in the cured state of the transparent curable resin layer 12 is higher than the total light transmittance in the cured state of the black curable resin layer 11. The total light transmittance in the cured state of the transparent curable resin layer 12 is not particularly limited, and is preferably adjusted to be 50 to 99%, more preferably adjusted to be 60 to 99%, and even more preferably adjusted to be 70 to 99%.

[0053] [Storage elastic modulus] The storage elastic modulus of the transparent curable resin layer 12 in the uncured state is preferably greater than that of the black curable resin layer 11. Similarly, at 100°C and 150°C, the storage elastic modulus of the transparent curable resin layer 12 is preferably greater than that of the black curable resin layer 11.

[0054] The storage elastic modulus of the transparent curable resin layer 12 is preferably greater than that of the black curable resin layer 11 at 100 to 150°C. When the storage elastic modulus of the transparent curable resin layer 12 is greater than that of the black curable resin layer 11 at 100°C and 150°C, usually in the entire range of 100 to 150°C, the storage elastic modulus of the transparent curable resin layer 12 is greater than that of the black curable resin layer 11.

[0055] The storage elastic modulus of the transparent curable resin layer 12 is preferably 1.0×10 3 ~1.0×10 6 Pa at 100°C, and more preferably 5.0×10 3 ~5.0×10 5 Pa.

[0056] When the storage elastic modulus of the transparent curable resin layer 12 at 100°C is below the preferable upper limit value, an appropriate flexibility can be obtained that does not prevent the flow of the black curable resin layer 11 during pressure bonding to the substrate 2 with elements. Also, the spaces between the plurality of light-emitting elements 21, 22, 23 can be sufficiently filled.

[0057] When the storage elastic modulus of the transparent curable resin layer 12 at 100°C is above the preferable lower limit value, the fluidity of the transparent curable resin layer 12 can be suppressed, and the surface of the transparent curable resin layer 12 can be made smoother according to the light-emitting elements 21, 22, 23 after thermocompression bonding. As a result, the appearance can be improved, and it is possible to less likely generate appearance defects such as rejection phenomena where recesses are formed on the layer surface during thermosetting.

[0058] Further, the storage elastic modulus of the transparent curable resin layer 12 at 100°C is preferably smaller than the storage elastic modulus at 100°C in the cured state of the light diffusion layer 14 described later. Thereby, the black curable resin layer 11 is less likely to remain on the light-emitting elements 21, 22, and 23, and the luminance transmittance described later is improved.

[0059] The storage elastic modulus of the transparent curable resin layer 12 at 150°C is preferably 1.0×10 4 Pa or more, more preferably 1.0×10 4 ~5.0×10 7 Pa, and even more preferably 1.0×10 5 ~5.0×10 6 Pa.

[0060] When the storage elastic modulus of the transparent curable resin layer 12 at 150°C is equal to or lower than the preferable upper limit value, cracks due to curing shrinkage are less likely to occur during thermosetting. When the storage elastic modulus of the transparent curable resin layer 12 at 150°C is equal to or higher than the preferable lower limit value, the flow during thermosetting of the transparent curable resin layer 12 can be suppressed, and appearance defects after curing such as repelling phenomena can be suppressed. Further, even when an etching process is performed in a subsequent process, problems are less likely to occur.

[0061] The storage elastic modulus of the transparent curable resin layer 12 at 100°C is preferably a value 10 to 1000 times that of the storage elastic modulus of the black curable resin layer 11, and more preferably a value 30 to 500 times that of the storage elastic modulus of the black curable resin layer 11. The storage elastic modulus of the transparent curable resin layer 12 at 150°C is preferably a value 5 to 10000 times that of the storage elastic modulus of the black curable resin layer 11, and more preferably a value 10 to 1000 times that of the storage elastic modulus of the black curable resin layer 11. When the storage elastic modulus of the transparent curable resin layer 12 is larger than the storage elastic modulus of the black curable resin layer 11 at 100°C and 150°C, usually in the entire range of 100 to 150°C, the storage elastic modulus of the transparent curable resin layer 12 is larger than the storage elastic modulus of the black curable resin layer 11.

[0062] The storage elastic modulus of the transparent curable resin layer 12 at 60°C after heat treatment at 120°C for 1 hour is preferably 7×108 ~2×10 10 Pa. When the storage elastic modulus is below the preferable upper limit value, cracks can be prevented in the cured transparent curable resin layer 12 when cutting the edge of the substrate 20. Also, when the storage elastic modulus is above the preferable lower limit value, deformation, expansion and contraction of the cured transparent curable resin layer 12 can be prevented when cutting the edge of the substrate 20. As a result, wavy distortion of the integrated sealing sheet 1 can be prevented at the edge side of the substrate 20.

[0063] [Curable resin composition] The transparent curable resin layer 12 is composed of a curable resin composition. Examples of the curable resin composition include curable resin compositions containing at least one resin selected from epoxy resins, acrylic resins, polyester resins, polyurethane resins and silicone resins and a curing agent, similar to the black curable resin layer 11. Among them, an epoxy resin composition is preferable because curability at low temperature can be realized and it is excellent in heat resistance and reliability.

[0064] (Epoxy resin) Examples of the epoxy resin used for the transparent curable resin layer 12 include the same types as those of the black curable resin layer 11. From the viewpoint of imparting an appropriate pressure-bonding viscosity to the transparent curable resin layer 12, the transparent curable resin layer 12 preferably contains a high molecular weight epoxy resin having a weight average molecular weight of 10,000 to 100,000. Also, from the viewpoint that it has good compatibility with other resin components and can be dissolved without mixing a solvent having a high boiling point that may remain in the integrated sealing sheet 1 after drying, the transparent curable resin layer 12 more preferably contains a high molecular weight epoxy resin having a weight average molecular weight of 10,000 to 35,000.

[0065] The transparent curable resin layer 12 contains a high molecular weight epoxy resin with a weight average molecular weight of 10,000 to 100,000, and thus has an appropriate viscosity when heated. Therefore, the storage elastic modulus of the transparent curable resin layer 12 in the range of 100 to 150 °C can be adjusted to a preferable range. Since the high molecular weight epoxy resin has good compatibility with other epoxy resins, it is preferably a phenoxy resin.

[0066] The phenoxy resin has a relatively large molecular weight among epoxy resins and has an appropriate viscosity when heated. Therefore, the storage elastic modulus of the transparent curable resin layer 12 containing the phenoxy resin in the range of 100 to 150 °C can be adjusted to a preferable range. Also, unlike other thermoplastic resins such as polyester, the phenoxy resin can be cured as an epoxy resin. Therefore, the phenoxy resin increases the crosslinking density and does not impair the heat resistance of the cured product and the reliability of the performance for long-term use. From the viewpoint of ensuring the storage elastic modulus for pressing the black curable resin layer 11 during thermocompression bonding, the glass transition temperature of the phenoxy resin used in the transparent curable resin layer 12 is preferably 100 °C or higher.

[0067] Specific examples of the phenoxy resin include, for example, "1256", "YX7200", "YX8100", "YX7180" manufactured by Mitsubishi Chemical Corporation, "YP-50", "YP-50S", "YP-70" manufactured by Nippon Steel Chemical & Material Co., Ltd., "N-690", "H-157", "EXA-192" manufactured by DIC Corporation, and the like.

[0068] The compounding amount of the high molecular weight epoxy resin in the transparent curable resin layer 12 is preferably 30 to 80% by mass, more preferably 40 to 70% by mass, and even more preferably 45 to 60% by mass, based on 100% by mass of the total resin solid content of the transparent curable resin layer 12. The preferable compounding amount of the phenoxy resin in the transparent curable resin layer 12 is the same.

[0069] When the blending amount is within the above range, it becomes easy to control the storage elastic modulus. As a result, the storage elastic modulus for pushing the transparent curable resin layer 12 during thermocompression bonding can be ensured. Also, the flow during thermosetting can be suppressed, and appearance defects after curing such as repelling phenomena can be suppressed. Furthermore, even when an etching process is performed in a subsequent process, problems are less likely to occur. Also, the toughness is improved, and it becomes difficult for crack-like defects to occur during thermocompression bonding. Also, when it is below the above upper limit value, the crosslink density of the transparent curable resin layer 12 in the cured state can be increased, and the heat resistance and chemical resistance can be improved.

[0070] Furthermore, the epoxy resin used for the transparent curable resin layer 12 preferably contains a polyfunctional epoxy resin. By being able to increase the crosslink density, the polyfunctional epoxy resin further improves the stability of the performance of the cured product of the epoxy resin composition over long-term use and improves the heat resistance. Also, the viscosity of the polyfunctional epoxy resin is lower than that of the phenoxy resin in the range of 100 to 150°C. Therefore, by combining the polyfunctional epoxy resin and the phenoxy resin, the storage elastic modulus of the transparent curable resin layer 12 can be adjusted.

[0071] Specific examples of the polyfunctional epoxy resin include, for example, "YX7700", "157S70", "1032S60" manufactured by Mitsubishi Chemical Corporation, "NC7000L", "XD1000", "EOCN-1020" manufactured by Nippon Kayaku Co., Ltd., "ESN485" manufactured by Nippon Steel Chemical & Material Co., Ltd., "N-660", "N-690", "N-695", "HP-7200H" manufactured by DIC Corporation, etc.

[0072] The blending amount of the polyfunctional epoxy resin in the transparent curable resin layer 12 is preferably 90% by mass or less, more preferably 10 to 80% by mass, and even more preferably 25 to 60% by mass with respect to 100% by mass of the total resin solids of the transparent curable resin layer 12. If it is within the above range, the storage elastic modulus during thermocompression bonding of the transparent curable resin layer 12 can be controlled, and heat resistance and chemical resistance can be imparted in the cured state.

[0073] From the perspective of ensuring sufficient fluidity during thermocompression bonding, the transparent curable resin layer 12 preferably contains an epoxy resin with a softening point or melting point of 120°C or lower, and more preferably contains an epoxy resin with a softening point or melting point of 50 to 105°C from the viewpoints of handleability and heat resistance of the cured product. By containing an epoxy resin having a softening point or melting point within the above range, it becomes possible to control the storage elastic modulus.

[0074] The blending amount of the total epoxy resin in the transparent curable resin layer 12 is preferably 10 to 100% by mass, more preferably 30 to 99% by mass, and even more preferably 50 to 95% by mass with respect to 100% by mass of the total resin solid content of the transparent curable resin layer 12. When within the above range, it is easy to control the storage elastic modulus. Thereby, the storage elastic modulus for pushing the black curable resin layer 11 during thermocompression bonding can be ensured. Also, when within the above range, the flow during thermosetting can be suppressed, and appearance defects after curing such as repelling phenomena can be suppressed. Furthermore, there is less likelihood of problems even when an etching process is performed in a subsequent process. Also, when it is at or above the above lower limit value, the heat resistance improves in the cured state.

[0075] (Elastomer) In addition to resins such as epoxy resin, the transparent curable resin layer 12 preferably contains an elastomer. By containing an elastomer, it becomes easier to control the storage elastic modulus. Examples of the elastomer include the same types as those of the black curable resin layer 11. Among them, NBR is preferred for the following reasons. NBR has good compatibility with epoxy resin. Also, the storage elastic modulus of the transparent curable resin layer 12 near 150°C can be increased, and as a result, the adhesion between the transparent curable resin layer 12 and the black curable resin layer 11 becomes good. The preferred weight average molecular weight of the elastomer is the same as that of the black curable resin layer 11.

[0076] In particular, when the transparent curable resin layer 12 is composed of an epoxy resin composition, it preferably contains a modified elastomer having a functional group capable of reacting with an epoxy group. The modified elastomer also acts as a curing agent for the epoxy resin. Further, since it can react with and bond to the epoxy resin, it improves heat resistance and reliability against thermal shock. Furthermore, the difference in polarity between the functional group and the resin skeleton acts favorably on dispersibility. As a result, good dispersibility can be obtained when carbon black is contained in the transparent curable resin layer 12.

[0077] Examples of the functional group capable of reacting with an epoxy group include the same types as those of the black curable resin layer 11. Among them, an acid group or an acid anhydride group is preferable, and a carboxy group or a carboxylic acid anhydride group is particularly preferable because curing can be performed at a low temperature and a pot life can be ensured.

[0078] When the transparent curable resin layer 12 is composed of an epoxy resin composition, it particularly preferably contains a modified NBR having a carboxy group. Examples of the modified NBR having a carboxy group include the same types as those of the black curable resin layer 11. Two or more modified elastomers having a functional group capable of reacting with an epoxy group may be used in combination.

[0079] The blending amount of the elastomer in the transparent curable resin layer 12 is preferably 0 to 50% by mass, more preferably 1 to 50% by mass, and even more preferably 5 to 50% by mass with respect to 100% by mass of the total resin solid content of the transparent curable resin layer 12. When it is within the above range, the storage elastic modulus can be controlled. Further, when it is below the above upper limit value, the storage elastic modulus for pushing the black curable resin layer 11 during thermocompression bonding can be ensured. Also, the flow during thermosetting can be suppressed, and appearance defects after curing such as repelling phenomena can be suppressed. Furthermore, there is little trouble even when an etching treatment is performed in a subsequent process. Also, when it is above the above lower limit value, the dispersibility of carbon black becomes good. Furthermore, the film-forming property is improved, and the distribution of the film thickness when the epoxy resin composition is applied to form a film can be narrowed.

[0080] (Curing agent) When the transparent hardenable resin layer 12 is composed of an epoxy resin composition, it may contain, in addition to a modified elastomer having a functional group capable of reacting with an epoxy group, a curing agent for other epoxy resins. Examples of other curing agents include the same curing agents as those used for the black hardenable resin layer 11. Two or more other curing agents may be used in combination.

[0081] (Curing catalyst) When the transparent hardenable resin layer 12 is composed of an epoxy resin composition, it may contain a curing catalyst that accelerates the curing reaction of the epoxy resin. Examples of the curing catalyst include the same curing catalysts as those used for the black hardenable resin layer 11, and the preferred embodiments are also the same.

[0082] The blending amount of the curing catalyst is preferably 0.01 to 5 parts by mass, more preferably 0.05 to 4 parts by mass, and even more preferably 0.1 to 3 parts by mass with respect to 100 parts by mass of the total resin solid content of the transparent hardenable resin layer 12. When within the above range, curing can proceed sufficiently and the pot life of the integrated sealing sheet 1 can be ensured. Two or more curing catalysts may be used in combination.

[0083] (Other components) The transparent hardenable resin layer 12 may contain a black pigment or a black dye in order to suppress light emission unevenness and color unevenness.

[0084] When the transparent hardenable resin layer 12 contains carbon black, the blending amount of carbon black is preferably less than 5 parts by mass, more preferably 1 part by mass or less, and even more preferably 0.1 part by mass or less with respect to 100 parts by mass of the total resin solid content. The transparent hardenable resin layer 12 may further contain, as necessary, resins other than epoxy resins and elastomers, thickeners, defoamers and / or leveling agents, adhesion imparting agents such as coupling agents, and flame retardants.

[0085] Further, the transparent curable resin layer 12 may contain a filler described later. The filler may be the same as or different from the filler contained in the light diffusion layer 14 described later. When the transparent curable resin layer 12 contains a filler, the blending amount of the filler is preferably 3 to 40 parts by mass, more preferably 5 to 20 parts by mass, and even more preferably 7 to 15 parts by mass with respect to 100 parts by mass of the total resin solid content. If it is above the above lower limit value, the effect of reducing luminance unevenness can be easily obtained. By being below the above upper limit value, an excessive increase in the L* value can be suppressed, and the black chromaticity when the display is turned off can be maintained. The average particle diameter of the filler is not particularly limited, but is preferably the same as the average particle diameter of the filler contained in the light diffusion layer 14 described later.

[0086] [Film thickness] The thickness of the transparent curable resin layer 12 is not particularly limited, and is preferably 10 to 250 μm, more preferably 20 to 225 μm, and even more preferably 25 to 150 μm. (3) Light diffusion layer The light diffusion layer 14 contains a filler and is a layer for diffusing the incident light from the light emitting elements 21, 22, and 23. The light diffusion layer 14 is a cured layer. In the present embodiment, the light diffusion layer 14 is formed between the transparent curable resin layer 12 and the support layer 15.

[0087] Since the light diffusion layer 14 is provided separately from the curable resin layer 10 containing a black-based colorant (in this embodiment, the black curable resin layer 11), it is possible to suppress luminance unevenness without covering the entire light emitting elements 21, 22, and 23 with the curable resin layer 10 containing a black-based colorant. Further, since it is not necessary to cover the upper surface (light emitting surface) of the light emitting elements 21, 22, and 23 with the curable resin layer 10 containing a black-based colorant, the light reaching the viewer side from the light emitting elements 21, 22, and 23 during the emission of the display is not hindered.

[0088] [Photocurable resin composition] The light diffusion layer 14 is a layer containing a curable resin composition, preferably a photocurable resin composition. In this specification, the "photocurable resin composition" can preferably exemplify a photocurable resin composition containing at least one resin selected from epoxy resins, acrylic resins, and / or polyurethane resins and a photoinitiator. Further, the light diffusion layer 14 contains a filler described later in the curable resin composition.

[0089] The light diffusion layer 14 is not particularly limited, but is preferably a cured layer containing at least one of epoxy resins, acrylic resins, and / or polyurethane resins. By using these resins, the heat resistance of the light diffusion layer 14 can be enhanced.

[0090] When an epoxy resin is used for the light diffusion layer 14, the above-mentioned epoxy resin may be appropriately used, but it is preferable to use an alicyclic epoxy resin from the viewpoints of high curability by ultraviolet irradiation and difficulty in yellowing by sunlight. Examples of the alicyclic epoxy resin include "8EC-001" manufactured by Dainippon Fine Chemical Co., Ltd.

[0091] The "acrylic resin" in the present application means a resin having an acrylic skeleton and / or a methacrylic skeleton. When an acrylic resin is used for the light diffusion layer 14, various known acrylic resins can be used, and examples include polymers of acrylic monomers such as acrylic esters or methacrylic esters, and copolymers of acrylic monomers and other monomers. Among them, specifically, "8KX-212" manufactured by Dainippon Fine Chemical Co., Ltd. can be exemplified. Among these acrylic resins, a plurality of types may be used in combination.

[0092] The "polyurethane resin" in this application means a resin having a urethane bond in the molecule. When a polyurethane resin is used for the light diffusion layer 14, in addition to the urethane bond, there are polyether-type polyurethane resins containing an ether bond in the main chain, polyester-type polyurethane resins containing an ester bond in the main chain, and polycarbonate-type polyurethane resins containing a carbonate bond in the main chain. Among them, polycarbonate-type polyurethane resins are preferred, and specifically, "UF-A7-52" manufactured by Kyoeisha Chemical Co., Ltd. can be exemplified. Among these polyurethane resins, a plurality of types may be used in combination.

[0093] (Photoinitiator) The photoinitiator contained in the photocurable resin composition is not particularly limited, but when curing an epoxy resin, it is preferably a photo cationic polymerization initiator. Also, when curing an acrylic resin and a polyurethane resin, it is preferably a photo radical polymerization initiator. The photo cationic polymerization initiator is preferably an iodonium salt-based photoinitiator. Specific examples of the iodonium salt-based photoinitiator include, for example, "WPI-113", "WPI-116", "WPI-124", "WPI-170", etc. manufactured by Fujifilm Wako Pure Chemical Corporation. The photo radical polymerization initiator is preferably an acylphosphine oxide-based photoinitiator. Specific examples of the acylphosphine oxide-based photoinitiator include, for example, "Omnirad TPO H" manufactured by IGM Resins B.V.

[0094] (Sensitizer) The photocurable resin composition may contain a sensitizer. Specific examples of the sensitizer include, for example, "Omnirad 127" manufactured by IGM Resins B.V.

[0095] The photocurable resin composition may be cured by light of various wavelengths such as visible light, electron beams, and / or ultraviolet rays, etc., but it is preferably cured by ultraviolet rays from the viewpoints of handling and cost. That is, the light diffusion layer 14 is preferably an ultraviolet curable resin.

[0096] [Film thickness] The thickness of the light diffusion layer 14 is not particularly limited, but is preferably 20 to 150 μm, more preferably 30 to 120 μm, even more preferably 50 to 100 μm, and particularly preferably 50 to 80 μm. When the thickness of the light diffusion layer 14 is within the above numerical range, the light reaching the viewer side is not hindered, and the incident light from the light emitting elements 21, 22, 23 can be efficiently diffused.

[0097] [Filler] In the present application, the "filler" is not particularly limited as long as it does not prevent the light from reaching the viewer side, and suitable ones among known inorganic fillers and / or organic fillers can be appropriately used. Preferably, it is at least one of silica and / or silicone resin, and more preferably silicone resin. When the filler is made of these materials, the transparency of the light diffusion layer 14 is not excessively impaired, and the light reaching the viewer side is not hindered.

[0098] By adding the filler, the incident light from the light emitting elements 21, 22, 23 can be diffused. Thereby, even if the light emitting elements 21, 22, 23 are highly directional like LEDs, the light emitted from the light emitting elements 21, 22, 23 can be diffused and the light can be output more uniformly. As a result, color unevenness and brightness unevenness can be improved when used in the light emitting type electronic component 5.

[0099] The shape of the filler is not particularly limited, and fillers of any shape can be used. For example, it may be in the form of irregular particles, spherical, etc., and is preferably spherical.

[0100] When silica is used for the filler, the type of silica is not particularly limited, and various known silicas can be used. Examples of the silica filler include "SO-C6" manufactured by Admatechs Co., Ltd.

[0101] When using a silicone resin as the filler, various known silicone materials having a siloxane bond in the main chain and excluding silicone oil can be used. Examples of the silicone resin filler include "KMP-706", "X52-1621", "X52-854" manufactured by Shin-Etsu Chemical Co., Ltd., and "Tospearl 2000B" manufactured by Momentive.

[0102] The average particle diameter of the filler is not particularly limited as long as it does not prevent the light from reaching the viewer side, but is preferably 0.5 to 10 μm, more preferably 1.0 to 5.5 μm, and even more preferably 1.0 to 5.0 μm. When the average particle diameter of the filler is within the above numerical range, the luminance unevenness can be suppressed while increasing the blackness at the time of display turning off. In this specification, the average particle diameter of the filler is the cumulative average diameter D 50 (median diameter) in the volume-based particle size distribution determined by the laser diffraction / scattering method. Examples of the measuring device in the laser diffraction / scattering method include MT3300EXII manufactured by Microtrac Bell Co., Ltd.

[0103] The content of the filler is not particularly limited as long as it does not prevent the light from reaching the viewer side, but the mass part ratio of the filler is preferably 3 to 40 parts by mass, more preferably 5 to 40 parts by mass, and even more preferably 10 to 30 parts by mass with respect to 100 parts by mass of the resin solid content of the light diffusion layer 14. When the content of the filler is within the above numerical range, the luminance unevenness can be suppressed while increasing the blackness at the time of display turning off.

[0104] [Storage Elastic Modulus] The storage elastic modulus at 100 °C in the cured state of the light diffusion layer 14 is preferably greater than the storage elastic modulus at 100 °C in the uncured state of the transparent curable resin layer 12. Thereby, it becomes difficult for the black curable resin layer 11 to remain on the light-emitting elements 21, 22, 23, and the luminance transmittance described later is improved. The storage elastic modulus of the light diffusion layer 14 is preferably 1.0×10 6 ~5.0×10 9 Pa, more preferably 1.0×10 6~5.0×10 8 Pa.

[0105] (4) Support layer The support layer 15 is a layer for protecting the light-emitting elements 21, 22, and 23 from physical impacts, humidity, moisture, etc. from the outside after the integral sealing sheet 1 is pressure-bonded. Further, the support layer 15 is also a layer for supporting the light diffusion layer 14. The support layer 15 may be the outermost layer of the integral sealing sheet 1, but preferably has a hard coat layer 18 described later on the surface opposite to the surface in contact with the light diffusion layer 14. In the present embodiment, the support layer 15 is formed between the light diffusion layer 14 and the hard coat layer 18.

[0106] [Film thickness] The thickness of the support layer 15 is preferably 10 to 250 μm, more preferably 20 to 225 μm, and even more preferably 25 to 150 μm. When the thickness of the support layer 15 is equal to or greater than the preferable lower limit value, generation of wrinkles during thermocompression bonding of the integral sealing sheet 1 to the plurality of light-emitting elements 21, 22, and 23 can be suppressed, and the handleability can be improved. When the thickness of the support layer 15 is equal to or less than the preferable upper limit value, the visibility can be improved and the cost can be suppressed.

[0107] [Total light transmittance] The total light transmittance of the support layer 15 is preferably adjusted to be 30 to 99%, more preferably adjusted to be 35 to 95%, and even more preferably adjusted to be 40 to 95%. When the total light transmittance of the support layer 15 is equal to or greater than the lower limit value, the arrival of light to the viewer side is not hindered.

[0108] [Storage modulus] The storage modulus of the support layer 15 at 60°C is preferably 7×10 8 ~2×10 10 Pa, more preferably 1×10 9 ~1×10 10 Pa, and even more preferably 2×10 9 ~6×10 9It is Pa. By having the storage elastic modulus of the support layer 15 at 60°C be equal to or less than the preferable upper limit value, cracking of the support layer 15 can be reduced.

[0109] [Resin] The support layer 15 may be composed of a thermoplastic resin or a thermosetting resin. Examples of the resin constituting the support layer 15 include polyethylene terephthalate resin, polybutylene terephthalate resin, polyethylene 2,6-naphthalate resin, polyamide resin, polycarbonate resin, polycarbonate copolymer resin, triacetyl cellulose resin, polymethylpentene resin, phenoxy resin, syndiotactic polystyrene resin, polyimide resin, etc. From the viewpoints of heat resistance, weather resistance, ease of availability, cost, etc., it is preferable to contain at least one resin selected from polyethylene terephthalate resin, polyethylene 2,6-naphthalate resin, polycarbonate resin, polycarbonate copolymer resin, and polyamide resin. By containing these resins, deformation during pressure bonding can be prevented. The support layer 15 may contain a black pigment or a black dye in order to suppress light emission unevenness and color unevenness.

[0110] (Total light transmittance in the laminated state of the light diffusion layer and the support layer) The total light transmittance in the state where the light diffusion layer 14 and the support layer 15 are laminated (hereinafter, also referred to as a light diffusion layer laminated sheet) is preferably 80 to 99%, more preferably 85 to 95%. If it is within this numerical range, the luminance transmittance increases and the arrival of light to the viewer side is less obstructed.

[0111] In this application, the "luminance transmittance" is the transmittance calculated from the luminance of the light-emitting elements 21, 22, and 23 on the substrate 2 with elements before and after the pressure bonding of the integrated sealing hardening sheet 3. Specifically, the luminance transmittance is the luminance when the light-emitting elements 21, 22, and 23 are lit on the substrate 2 with elements before the pressure bonding of the integrated sealing hardening sheet 3 (hereinafter, also referred to as the luminance before pressure bonding), and the luminance when lit in the light-emitting electronic component 5 (hereinafter, also referred to as the luminance after pressure bonding). Then, each measured value is substituted into the following formula (I) for calculation. That is, it is calculated by dividing the value of the luminance after pressure bonding by the value of the luminance before pressure bonding. The luminance transmittance is preferably 30% or more, more preferably 40 - 60%, and even more preferably 50 - 58%. Luminance transmittance (%) = (Luminance after pressure bonding / Luminance before pressure bonding) × 100 ··· (I)

[0112] (Haze value in the laminated state of the light diffusion layer and the support layer) In this application, the haze value can be measured by a method conforming to, for example, JIS K 7136. The haze value in the state where the light diffusion layer 14 and the support layer 15 are laminated is preferably 75 - 99.9%, more preferably 80 - 95%. Within this numerical range, the incident light from the light-emitting elements 21, 22, and 23 can be diffused more efficiently, and luminance unevenness can be suppressed.

[0113] (5) Hard coat layer The hard coat layer 18 has an anti-scratch effect on the support layer 15 and is a layer for protecting the light-emitting electronic component 5 from being damaged. The hard coat layer 18 may be provided with a protection sheet 17 described later on the opposite surface of the surface in contact with the support layer 15. The hard coat layer 18 is a cured layer.

[0114] [Surface hardness] The surface hardness of the hard coat layer 18 is not particularly limited, but for example, in terms of pencil hardness, it is preferably H or more, more preferably 2H or more, and even more preferably 3H or more. By providing the hard coat layer 18, the surface hardness of the integrated sealing sheet 1 can be increased.

[0115] [Surface roughness] The surface roughness of the hard coat layer 18 is represented by the arithmetic mean roughness (Ra). The arithmetic mean roughness (Ra) is preferably 0.1 to 1 μm, more preferably 0.2 to 1 μm, and even more preferably 0.3 to 1 μm. When the Ra of the hard coat layer 18 is equal to or greater than the preferable lower limit value, the reflectance of the surface of the hard coat layer 18 can be reduced. When the Ra of the hard coat layer 18 is equal to or less than the preferable upper limit value, the manufacturing can be facilitated.

[0116] [Total light transmittance] The hard coat layer 18 is preferably prepared so that the total light transmittance is 30 to 99%, more preferably 50 to 99%, and even more preferably 60 to 99%. When the total light transmittance of the hard coat layer 18 is equal to or greater than the lower limit value, it does not prevent the light from reaching the viewer side.

[0117] [Resin] The hard coat layer 18 may be composed of either a thermoplastic resin or a thermosetting resin, and is preferably composed of a thermosetting resin. Examples of the thermosetting resin constituting the hard coat layer 18 include acrylic resins, polyurethane resins, silicone resins, melamine resins, etc., and one or more of these can be included. The hard coat layer 18 may contain a black pigment or a black dye.

[0118] [Particles] The hard coat layer 18 may contain particles. As the particles, one or both of inorganic particles and organic particles can be used. Examples of the inorganic particles include silica particles and titanium particles. Examples of the organic particles include polymethyl methacrylate resin (PMMA resin) and polyurethane resin. Among them, silica particles are preferable. By containing particles, the surface roughness of the hard coat layer 18 can be adjusted and the surface hardness can be improved.

[0119] [Film thickness] The thickness of the hard coat layer 18 is preferably 1 to 20 μm, more preferably 2 to 10 μm, and even more preferably 3 to 8 μm. By the thickness of the hard coat layer 18 being equal to or greater than the preferable lower limit value, sufficient hardness can be ensured. By the thickness of the hard coat layer 18 being equal to or less than the preferable upper limit value, problems such as curling are not caused.

[0120] (6) Protective sheet The protective sheets 16 and 17 have the role of protecting the integrated sealing sheet 1. When forming the integrated sealing sheet 1, the protective sheet 16 can also be used as the sheet on which the coating liquid of the curable resin composition is applied.

[0121] As the protective sheets 16 and 17, for example, sheets made of thermoplastic resins such as polyester, polyimide, polyamideimide, polyethylene, polytetrafluoroethylene, polypropylene, and polystyrene like polyethylene terephthalate and polyethylene naphthalate, or surface-treated paper and the like can be used.

[0122] Among these, from the viewpoints of heat resistance, mechanical strength, handleability, etc., sheets made of polyester can be preferably used. The thickness of the protective sheets 16 and 17 is not particularly limited and is generally appropriately selected according to the application in the range of 10 to 150 μm. The surface of the protective sheet 16 on which the curable resin layer 10 (in this embodiment, the black curable resin layer 11) is provided may be subjected to a release treatment.

[0123] 2. Manufacturing method of the integrated sealing sheet In this embodiment, in order to obtain the integrated sealing sheet 1, first, a coating liquid of a photocurable resin composition for the light diffusion layer 14 is applied and dried on the surface of the support layer 15 having a hard coat layer 18 formed in advance on one surface, on the surface opposite to the hard coat layer 18, and then the coating liquid is photocured. Then, a sheet (hereinafter, also referred to as a transparent layer laminated sheet) obtained by applying and drying a coating liquid of a curable resin composition of the transparent curable resin layer 12 is prepared on the surface of the light diffusion layer 14 opposite to the surface in contact with the support layer 15. Further, a sheet (hereinafter, also referred to as a black layer laminated sheet) obtained by applying and drying a coating liquid of a curable resin composition for the black curable resin layer 11 on the protective sheet 16 is prepared.

[0124] Then, by laminating the above-mentioned transparent layer laminated sheet and the black layer laminated sheet so that the transparent curable resin layer 12 and the black curable resin layer 11 are in contact with each other, a laminate in which the black curable resin layer 11, the transparent curable resin layer 12, the light diffusion layer 14, the support layer 15, and the hard coat layer 18 are sequentially laminated on the protective sheet 16 is obtained. A protective sheet 17 may be laminated on the outer surface of the hard coat layer 18 as needed.

[0125] The coating liquids of the curable resin compositions for the black curable resin layer 11 and the transparent curable resin layer 12 preferably contain an organic solvent in an amount such that the viscosity allows for unhindered coating. There are no particular restrictions on the organic solvent, and examples thereof include ketones, aromatic hydrocarbons, glycol ethers, glycol ether acetates, esters, alcohols, aliphatic hydrocarbons, petroleum-based solvents, and the like. Specifically, ketones such as methyl ethyl ketone, cyclohexanone, methyl butyl ketone, and methyl isobutyl ketone; aromatic hydrocarbons such as toluene, xylene, and tetramethylbenzene; glycol ethers such as cellosolve, methyl cellosolve, butyl cellosolve, carbitol, methyl carbitol, butyl carbitol, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol diethyl ether, and triethylene glycol monoethyl ether; esters such as ethyl acetate, butyl acetate, isobutyl acetate, ethylene glycol monoethyl ether acetate, dipropylene glycol methyl ether acetate, propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate, and propylene glycol butyl ether acetate; alcohols such as ethanol, propanol, 2-methoxypropanol, n-butanol, isobutyl alcohol, isopentyl alcohol, ethylene glycol, and propylene glycol; aliphatic hydrocarbons such as octane and decane; petroleum-based solvents such as petroleum ether, petroleum naphtha, hydrogenated petroleum naphtha, and solvent naphtha, as well as N,N-dimethylformamide (DMF), tetrachloroethylene, and turpentine oil. When adding carbon black to the coating liquid, carbon black powder may be added to the coating liquid, or a liquid in which carbon black is previously dispersed (carbon black dispersion liquid) may be added.

[0126] As a method for applying the above curable resin composition, for example, methods using various coaters such as die coaters, gravure coaters, roll coaters, curtain flow coaters, spin coaters, bar coaters, reverse coaters, kiss coaters, fountain coaters, rod coaters, air doctor coaters, knife coaters, blade coaters, cast coaters, and screen coaters can be mentioned. The drying temperature is preferably 60 to 160°C, more preferably 80 to 130°C, and even more preferably 90 to 120°C.

[0127] The temperature during lamination is preferably 20 to 120°C, more preferably 30 to 100°C, and even more preferably 40 to 80°C. By setting the temperature to be equal to or higher than the preferable lower limit value, an adhesive force that can be handled even when uncured can be ensured between the black curable resin layer 11 and the transparent curable resin layer 12. Also, by setting the temperature to be equal to or lower than the preferable upper limit value, the entrapment of air bubbles between the black curable resin layer 11 and the transparent curable resin layer 12 and the generation of wrinkles on each of the layers 11 and 12 can be prevented. Lamination can be performed using, for example, a roll laminator, a press machine, a vacuum press machine, etc.

[0128] 3. Substrate with elements As shown in FIG. 2, the substrate with elements 2 has a plurality of light-emitting elements 21, 22, and 23 arranged on a substrate 20. In FIG. 2 and the like, a portion where three light-emitting elements (light-emitting element 21, light-emitting element 22, and light-emitting element 23) are arranged is schematically shown.

[0129] The material of the substrate 20 is not limited, but known printed circuit boards can be preferably used. Examples of known printed circuit boards include epoxy glass substrates, fluororesin substrates, ceramic substrates, and glass substrates.

[0130] The light-emitting elements 21, 22, and 23 are typically light-emitting diodes. This embodiment is particularly suitable when the light-emitting elements 21, 22, and 23 are extremely small. For example, light-emitting diodes with a height of 1000 nm to 200 μm and a side length of 0.001 to 0.5 mm can be used. On the substrate 20 with elements for obtaining mini-LEDs or micro-LEDs, as the light-emitting elements 21, 22, and 23, light-emitting diodes of three colors, R, G, and B, or a blue light-emitting diode can be used. Also, the heights of the plurality of light-emitting elements 21, 22, and 23 on the substrate 20 are not limited to being all the same, and they may be individually different, preferably at least different at one location.

[0131] 4. Light-emitting electronic component and method for manufacturing the same The light-emitting electronic component 5 includes a substrate 2 with a plurality of light-emitting elements 21, 22, and 23 arranged thereon, and an integrated sealing cured sheet 3 in a state of being pressure-bonded to the surface on which the plurality of light-emitting elements 21, 22, and 23 of the substrate 2 with elements are arranged.

[0132] The integrated sealing cured sheet 3 is laminated in the order of a resin layer 30 covering the light-emitting elements 21, 22, and 23, a light diffusion layer 14, and a support layer 15, at least from the side in contact with the substrate 2 with elements. Also, the resin layer 30 is filled between the plurality of light-emitting elements 21, 22, and 23. The resin layer 30 is a cured layer of the curable resin layer 10. The resin layer 30 preferably includes a black resin layer 31 capable of shielding light between the light-emitting elements 21, 22, and 23 and a transparent resin layer 32 having higher light transmittance than the black resin layer 31. In this embodiment, the integrated sealing cured sheet 3 is laminated in the order of the black resin layer 31, the transparent resin layer 32, the light diffusion layer 14, the support layer 15, and the hard coat layer 18 from the side in contact with the substrate 2 with elements. The black resin layer 31 and the transparent resin layer 32 are cured layers obtained by thermally curing or the like the black curable resin layer 11 and the transparent curable resin layer 12. That is, the integrated sealing cured sheet 3 according to this embodiment is a sheet after curing the black curable resin layer 11 and the transparent curable resin layer 12 among the above-described integrated sealing sheets 1. The integrated sealing cured sheet 3 in this embodiment preferably fills at least the black resin layer 31 between the light-emitting elements 21, 22, and 23.

[0133] The thickness of the transparent resin layer 32 is not particularly limited, but is preferably 0.1 to 5.0 times the height of the plurality of light-emitting elements 21, 22, 23. The thickness of the black resin layer 31 is not particularly limited, but is preferably 0.1 to 0.9 times the height of the plurality of light-emitting elements 21, 22, 23.

[0134] (Surface hardness of the integrated encapsulation cured sheet) The surface hardness of the integrated encapsulation cured sheet 3 is measured on the side of the hard coat layer 18 of the sheet 3 or, when there is no hard coat layer 18, on the side of the support layer 15. From the viewpoint of improving the durability when used for the light-emitting electronic component 5, the surface hardness of the integrated encapsulation cured sheet 3 is preferably H or higher, more preferably 3H or higher, in a pencil hardness test conforming to JIS K 5600-5-4.

[0135] A method for manufacturing a light-emitting electronic component includes a step of pressing the above-described integrated encapsulation sheet 1 from the side of the curable resin layer 10 (in this embodiment, the side of the black curable resin layer 11) onto the surface on which the plurality of light-emitting elements 21, 22, 23 are arranged in the element-mounted substrate 2 in which the plurality of light-emitting elements 21, 22, 23 are arranged on the substrate 20 (hereinafter referred to as the pressing step), a step of filling at least a part of the curable resin layer 10 (in this embodiment, at least the black curable resin layer 11, and preferably also including at least a part of the transparent curable resin layer 12) between the plurality of light-emitting elements 21, 22, 23 (hereinafter referred to as the filling step), and a step of curing the curable resin layer 10 (the black curable resin layer 11 and the transparent curable resin layer 12 in this embodiment) (hereinafter referred to as the curing step). Hereinafter, a method for manufacturing a light-emitting electronic component according to this embodiment (also simply referred to as "the manufacturing method according to this embodiment") will be described with reference to FIGS. 2 to 4.

[0136] (i) Pressing step In the manufacturing method according to this embodiment, first, the protective sheet 16 is peeled off to expose the black curable resin layer 11. Then, as shown in FIG. 2, the black curable resin layer 11 is brought into contact with the surface on which the light-emitting elements 21, 22, 23 of the element-mounted substrate 2 are arranged, and the pressing of the integrated encapsulation sheet 1 is started.

[0137] Before pressure bonding, the thickness of the black curable resin layer 11 is preferably 10 to 95% with respect to the height of the light-emitting elements 21, 22, and 23. The lower limit is more preferably 15% or more, and even more preferably 30% or more. The upper limit is more preferably 85% or less, and even more preferably 75% or less.

[0138] When the thickness of the black curable resin layer 11 is 10% or more with respect to the height of the light-emitting elements 21, 22, and 23, the function of shielding light between the light-emitting elements 21, 22, and 23 becomes sufficient. Also, when the storage elastic modulus of the black curable resin layer 11 is relatively low and the layer 11 is rich in fluidity, the resin can be sufficiently filled between the light-emitting elements 21, 22, and 23. When the thickness of the black curable resin layer 11 is 15% or more with respect to the height of the light-emitting elements 21, 22, and 23, even when the fluidity of the transparent curable resin layer 12 is relatively low, surface crack-like defects are less likely to occur. When the thickness of the black curable resin layer 11 is 30% or more with respect to the height of the light-emitting elements 21, 22, and 23, the black curable resin layer 11 having a light-shielding function can be appropriately filled between the light-emitting elements 21, 22, and 23.

[0139] If the thickness of the black curable resin layer 11 is 95% or less with respect to the height of the light-emitting elements 21, 22, and 23, leakage of the black curable resin layer 11 to the outside during thermocompression bonding can be prevented, and it is difficult for the light from the light-emitting elements 21, 22, and 23 to reach the viewer side. When the thickness of the black curable resin layer 11 is 85% or less with respect to the height of the light-emitting elements 21, 22, and 23, unevenness in the film thickness of the black curable resin layer 11 that has flowed after pressing is less likely to occur, and uneven blackness is less likely to occur. If the thickness of the black curable resin layer 11 is 75% or less with respect to the height of the light-emitting elements 21, 22, and 23, the black curable resin layer 11 having a light-shielding function can be appropriately filled between the light-emitting elements 21, 22, and 23.

[0140] The thickness of the transparent curable resin layer 12 before lamination is preferably 10 to 500% of the height of the light-emitting elements 21, 22, and 23. The lower limit is more preferably 20% or more, and even more preferably 30% or more. The upper limit is more preferably 200% or less, and even more preferably 150% or less.

[0141] When the thickness of the transparent curable resin layer 12 is 10% or more of the height of the light-emitting elements 21, 22, and 23, it easily functions as a sealing layer covering the light-emitting elements 21, 22, and 23. Also, when the storage elastic modulus of the transparent curable resin layer 12 is relatively high and the fluidity of the layer 12 is suppressed, during thermosetting, the transparent curable resin layer 12 can be suppressed from flowing together with the black curable resin layer 11, and it is less likely for appearance defects to occur on the surface. When the thickness of the transparent curable resin layer 12 is 20% or more of the height of the light-emitting elements 21, 22, and 23, the range allowing the flow of the transparent curable resin layer 12 is sufficient and it is less likely for crack-like defects to occur on the surface. When the thickness of the transparent curable resin layer 12 is 30% or more of the height of the light-emitting elements 21, 22, and 23, the transparent curable resin layer 12 easily functions as a sealing layer covering the light-emitting elements 21, 22, and 23. Also, when the storage elastic modulus of the transparent curable resin layer 12 is relatively high and the fluidity of the layer 12 is suppressed, the transparent curable resin layer 12 can sufficiently push in the black curable resin layer 11.

[0142] The total thickness of the black curable resin layer 11 and the transparent curable resin layer 12 before lamination is preferably 110 to 550% of the height of the light-emitting elements 21, 22, and 23. If the total thickness is at least the lower limit value with respect to the height of the light-emitting elements 21, 22, and 23, a part of the integrated sealing sheet 1 can be sufficiently embedded between the light-emitting elements 21, 22, and 23. If the total thickness is at most the upper limit value with respect to the height of the light-emitting elements 21, 22, and 23, it is less likely to cause thickness unevenness during lamination and less likely for appearance defects to occur on the surface.

[0143] The ratio of the thickness of the black curable resin layer 11 before crimping to the total thickness of the transparent curable resin layer 12 and the black curable resin layer 11 before crimping is preferably 10 to 90%, more preferably 15 to 70%. If the ratio of the thickness is at least the above lower limit value, the blackness can be increased and the contrast of the display can be sufficiently improved. If the ratio of the thickness is at most the above upper limit value, the black curable resin layer 11 is less likely to remain on the light-emitting elements 21, 22, 23 during crimping, and the luminance can be sufficiently improved.

[0144] (ii) Filling step Next, continue the crimping and embed at least a part of the black curable resin layer 11 and the transparent curable resin layer 12 of the integrated sealing sheet 1 between the light-emitting elements 21, 22, 23 as shown in FIG. 3. At this time, the black curable resin layer 11 and the transparent curable resin layer 12 are filled between the plurality of light-emitting elements 21, 22, 23. At this time, if the storage elastic modulus of the black curable resin layer 11 is relatively low and the fluidity of the layer 11 is ensured, the black curable resin layer 11 easily follows the unevenness caused by the light-emitting elements 21, 22, 23 and is filled between the light-emitting elements 21, 22, 23.

[0145] The temperature in the thermocompression bonding is preferably 80 to 120°C, more preferably 90 to 110°C. By setting the temperature to 80°C or higher, it is easy to ensure the fluidity of the black curable resin layer 11 of the integrated sealing sheet 1. Further, by setting the temperature to 120°C or lower, it is difficult to damage the light-emitting elements 21, 22, 23. By setting the temperature to 90 to 110°C, the fluidity of the black curable resin layer 11 can be controlled more precisely, and the occurrence of unevenness and crack-like defects can be suppressed.

[0146] The pressure in thermocompression bonding is 0.05 to 5.0 MPa, preferably 0.05 to 1.0 MPa, more preferably 0.1 to 0.5 MPa. By setting the pressure to be equal to or higher than the preferable lower limit value, the black curable resin layer 11 can be sufficiently filled between the light-emitting elements 21, 22, and 23. By setting the pressure to be equal to or lower than the preferable upper limit value, it is difficult to damage the light-emitting elements 21, 22, and 23. Thermocompression bonding is preferably performed using a vacuum press machine capable of forming in a vacuum state. Thereby, it is easy to avoid defects caused by air being mixed into the obtained light-emitting type electronic component 5.

[0147] (iii) Curing step After pressure bonding, as shown in FIG. 4, after peeling off the protective sheet 17, it is thermally cured, and the black curable resin layer 11 and the transparent curable resin layer 12 of the integrated sealing sheet 1 are made into a black resin layer 31 (cured layer of the black curable resin layer 11) and a transparent resin layer 32 (cured layer of the transparent curable resin layer 12), whereby the light-emitting type electronic component 5 is obtained.

[0148] The curing temperature is preferably 100 to 160°C, more preferably 110 to 150°C. By setting the curing temperature to 100°C or higher, the black curable resin layer 11 and the transparent curable resin layer 12 of the integrated sealing sheet 1 can be surely cured. By setting the curing temperature to 110°C or higher, the curing time of the black curable resin layer 11 and the transparent curable resin layer 12 can be shortened. Also, by setting the curing temperature to be equal to or lower than the above upper limit temperature, it is difficult to damage the light-emitting elements 21, 22, and 23.

[0149] The curing time depends on the curing temperature, but is preferably 30 to 360 minutes, more preferably 45 to 180 minutes. At the curing temperature, when the storage elastic modulus of the transparent curable resin layer 12 is relatively high and the fluidity of the same layer 12 is suppressed, it is possible to suppress appearance defects after curing of the black curable resin layer 11 and the transparent curable resin layer 12.

[0150] As described above, through the steps shown in FIGS. 2 to 4, a light-emitting electronic component 5 is obtained in which an integrally formed sealing cured sheet 3 is pressure-bonded to the surface of a substrate 2 with elements, on which a plurality of light-emitting elements 21, 22, 23 are arranged, where the light-emitting elements 21, 22, 23 are arranged on the substrate 20. In the light-emitting electronic component 5 according to the present embodiment thus obtained, the black curable resin layer 11 and the transparent curable resin layer 12 are cured and have become a black resin layer 31 and a transparent resin layer 32. Further, at least the black resin layer 31 is filled between the plurality of light-emitting elements 21, 22, 23.

Example

[0151] Hereinafter, examples of the present invention will be shown and specifically described. However, the present invention is not limited to these examples.

[0152] <Raw materials> Details of the raw materials used in each example and comparative example are as follows.

[0153] [Epoxy resin for curable resin layer] · HP-7200H: Manufactured by DIC Corporation, cyclopentadiene novolak type polyfunctional epoxy resin (solid), softening point 82°C, epoxy equivalent 227 g / eq. · jER (registered trademark) YX7200B35: Manufactured by Mitsubishi Chemical Corporation, phenoxy resin (MEK solution, solid content 35% by mass), glass transition temperature 150°C, epoxy equivalent 8781 g / eq., weight average molecular weight 30,000. · EOCN 1020-55: Manufactured by Nippon Kayaku Co., Ltd., o-cresol novolak type epoxy resin, solid, softening point 55°C, epoxy equivalent 194 g / eq.

[0154] [Elastomer] · NX775: Manufactured by Nippon Zeon Co., Ltd., carboxy-modified nitrile rubber, weight average molecular weight 208,000.

[0155] [Curing catalyst] · 2PZ-CN: Manufactured by Shikoku Kasei Co., Ltd., 1-cyanoethyl-2-phenylimidazole.

[0156] [Carbon black] ·Special Black #4: Manufactured by ORION ENGINEERED CARBONS, gas black.

[0157] [Solvent] ·MEK: Manufactured by Junsei Chemical Co., Ltd., methyl ethyl ketone.

[0158] [Resin for light diffusion layer] ·8EC-001: Manufactured by Dainippon Fine Chemical Co., Ltd., alicyclic epoxy resin, epoxy equivalent 414 g / eq. ·UF-A7-52: Manufactured by Kyoeisha Chemical Co., Ltd., urethane acrylate resin. ·8KX-212: Manufactured by Dainippon Fine Chemical Co., Ltd., acrylic resin, polymer type.

[0159] [Filler for light diffusion layer and transparent curable resin layer] ·KMP-706: Manufactured by Shin-Etsu Chemical Co., Ltd., silicone resin powder, average particle diameter 2.0 μm. ·X52-1621: Manufactured by Shin-Etsu Chemical Co., Ltd., silicone resin powder, average particle diameter 5.0 μm. ·Tospearl 2000B: Manufactured by Momentive, silicone resin powder, average particle diameter 6.0 μm. ·X52-854: Manufactured by Shin-Etsu Chemical Co., Ltd., silicone resin powder, average particle diameter 0.7 μm. ·SO-C6: Manufactured by Admatechs Co., Ltd., silica, average particle diameter 2.0 μm.

[0160] [Photoinitiator] ·WPI-170: Manufactured by Fuji Film Wako Pure Chemical Corporation, photo cationic polymerization initiator. ·Omnirad TPO H: Manufactured by IGM Resins B.V., photo radical polymerization initiator.

[0161] [Sensitizer] ·Omnirad 127: Manufactured by IGM Resins B.V., sensitizer.

[0162] [PET film for support layer] · Film 1 for the support layer: PET film with a hard coat layer, manufactured by Shin-Etsu Polymer Co., Ltd., thickness 80 μm. · Film 2 for the support layer: PET film, manufactured by Shin-Etsu Polymer Co., Ltd., thickness 75 μm (without a hard coat layer).

[0163] [Protective sheet] · 1-E: Release film manufactured by Nippa Co., Ltd., thickness 50 μm.

[0164] [Resin and fine particles for the hard coat layer] · 8KX-078: Manufactured by Daisheng Fine Chemical Co., Ltd., solid content concentration 40% by mass, UV-curable acrylic polymer, weight average molecular weight 40,000. · Chemisnow (registered trademark) MX-500L: Manufactured by Soken Chemical & Engineering Co., Ltd., crosslinked acrylic monodisperse particles, average particle diameter 5 μm.

[0165] [Preparation of the coating liquid for the curable resin layer] Coating liquids for the black curable resin layer and the transparent curable resin layer were prepared with the compositions described below. Specifically, the compositions described below were mixed in a solvent of MEK to prepare a coating liquid for the black curable resin layer with a solid content concentration of 50% by mass and a coating liquid for the transparent curable resin layer with a solid content concentration of 40% by mass. The compositions described are in parts by mass based on the solid content of each material.

[0166] [Coating liquid for the black curable resin layer] · HP7200H (70 parts by mass) · NX775 (30 parts by mass) · 2PZ-CN (1 part by mass) · Special Black #4 (1 part by mass)

[0167] [Coating liquid 1 for the transparent curable resin layer] · EOCN 1020-55 (40 parts by mass) · YX7200B35 (40 parts by mass) · NX775 (20 parts by mass) · 2PZ-CN (1 part by mass) [Coating liquid 2 for the transparent curable resin layer] · EOCN 1020-55 (40 parts by mass) · YX7200B35 (40 parts by mass) · NX775 (20 parts by mass) · 2PZ-CN (1 part by mass) · KMP-706 (10 parts by mass)

[0168] [Preparation of Coating Liquid for Light Diffusion Layer] The coating liquid for the light diffusion layer was prepared with the composition described below. Specifically, the following composition was mixed with MEK solvent to prepare a coating liquid for the light diffusion layer with a solid content concentration of 60% by mass. The composition described is the parts by mass in terms of the solid content of each material. [Coating Liquid 1 for Light Diffusion Layer] · 8EC-001 (100 parts by mass) · KMP-706 (10 parts by mass) · WPI-170 (2 parts by mass) · Omnirad 127 (1 part by mass) [Coating Liquid 2 for Light Diffusion Layer] · 8EC-001 (100 parts by mass) · KMP-706 (20 parts by mass) · WPI-170 (2 parts by mass) · Omnirad 127 (1 part by mass) [Coating Liquid 3 for Light Diffusion Layer] · 8EC-001 (100 parts by mass) · KMP-706 (40 parts by mass) · WPI-170 (2 parts by mass) · Omnirad 127 (1 part by mass) [Coating Liquid 4 for Light Diffusion Layer] · 8EC-001 (100 parts by mass) · X52-1621 (10 parts by mass) · WPI-170 (2 parts by mass) · Omnirad 127 (1 part by mass) [Coating Liquid 5 for Light Diffusion Layer] · 8EC-001 (100 parts by mass) · Tospearl 2000B (10 parts by mass) · WPI-170 (2 parts by mass) · Omnirad 127 (1 part by mass) [Coating Liquid 6 for Light Diffusion Layer] · 8EC-001 (100 parts by mass) · X52-854 (10 parts by mass) · WPI-170 (2 parts by mass) · Omnirad 127 (1 part by mass) [Coating Liquid 7 for Light Diffusion Layer] · 8EC-001 (100 parts by mass) · SO-C6 (25 parts by mass) · WPI-170 (2 parts by mass) · Omnirad 127 (1 part by mass) [Coating Liquid 8 for Light Diffusion Layer] · 8EC-001 (100 parts by mass) · KMP-706 (10 parts by mass) · WPI-170 (0.5 part by mass) · Omnirad 127 (0.5 part by mass) [Coating Liquid 9 for Light Diffusion Layer] · UF-A7-52 (100 parts by mass) · KMP-706 (10 parts by mass) · Omnirad TPO H (2 parts by mass) · Omnirad 127 (1 part by mass) [Coating Liquid 10 for Light Diffusion Layer] · 8KX-212 (100 parts by mass) · KMP-706 (10 parts by mass) · Omnirad TPO H (2 parts by mass) · Omnirad 127 (1 part by mass)

[0169] [Preparation of Coating Agent for Hard Coating Layer] The coating agent for the hard coating layer was prepared with the composition described below. Specifically, the composition described below was mixed with a MEK solvent to prepare a coating agent for the hard coating layer with a solid content concentration of 30% by mass. [Coating Agent for Hard Coating Layer] · 8KX-078 (100 parts by mass) · MX-500L (15 parts by mass) · Omnirad TPO H (2 parts by mass)

[0170] [Preparation of the Support Layer Film 1] One surface of a PET film with a thickness of 75 μm was subjected to corona treatment, and a coating agent for the hard coat layer was applied using a bar coater so that the dry film thickness was 5 μm. After drying at 120°C for 5 minutes, ultraviolet light with a wavelength of 365 nm was irradiated at 400 mJ / cm 2 to cure the coating agent and form a hard coat layer. As a result, a support layer film 1 with a thickness of 80 μm was obtained.

[0171] [Example 1] [Preparation of the Light Diffusion Layer] On the support layer film 1, a coating liquid 1 for the light diffusion layer was applied using an applicator so that the dry film thickness was 50 μm. The coating liquid 1 for the light diffusion layer after application was dried at 100°C for 4 minutes. Then, ultraviolet light with a wavelength of 365 nm was irradiated at 300 mJ / cm 2 to cure the coating liquid 1 for the light diffusion layer and obtain a light diffusion layer laminated sheet in which the support layer and the light diffusion layer were laminated in this order. The sheet was used for measuring the total light transmittance and haze value described later.

[0172] [Preparation of the Transparent Curing Resin Layer] A coating liquid for the transparent curing resin layer was applied on the release surface of a release PET 1-E (manufactured by Nippa Co., Ltd., 50 μm) using a film applicator with a film thickness adjustment function (manufactured by Allgood Co., Ltd.) so that the dry film thickness was 50 μm. After drying at 100°C for 4 minutes, it was overlaid so that the surface on the light diffusion layer side of the above light diffusion layer laminated sheet was in contact with the transparent curing resin layer, and laminated with a roll laminator at 60°C. By peeling off the release PET 1-E, a transparent layer laminated sheet in which the support layer, the light diffusion layer, and the transparent curing resin layer were laminated in this order was obtained.

[0173] [Preparation of the Black Curing Resin Layer] A coating liquid for the black curing resin layer was applied on the release surface of a release PET 1-E (manufactured by Nippa Co., Ltd., 50 μm) using a film applicator with a film thickness adjustment function (manufactured by Allgood Co., Ltd.) so that the dry film thickness was 50 μm. After drying at 100°C for 5 minutes, a black layer laminated sheet in which the black curing resin layer was supported by the release PET was obtained.

[0174] [Fabrication of an integrated sealing sheet] The obtained transparent layer laminated sheet and black layer laminated sheet were overlapped so that the transparent curable resin layer and the black curable resin layer were in contact with each other, and laminated with a roll laminator at 60 °C to obtain the integrated sealing sheet of Example 1.

[0175] [Substrate with evaluation element] A substrate with a plurality of LED light-emitting elements having a size of 0.1 × 0.2 mm and a height of 65 μm arranged on an epoxy glass substrate was used as the substrate with evaluation element. The substrate with evaluation element was used for the measurement of the luminance before crimping in the luminance transmittance described later.

[0176] [Manufacture of light-emitting electronic components] The release PET of the integrated sealing sheet of each example was peeled off, and the black curable resin layer was arranged so as to be in contact with the LED light-emitting elements of the substrate with evaluation element. Then, between the light-emitting elements, the black curable resin layer and the transparent curable resin layer were filled under the conditions of a degree of vacuum of 100 hPa, 100 °C, 0.36 MPa, and 3 minutes using a vacuum press machine. After filling, it was heated in an oven at 120 °C for 1 hour to thermoset the black curable resin layer and the transparent curable resin layer, thereby obtaining a light-emitting electronic component. The light-emitting electronic component was used for the evaluation of the luminance uniformity described later and the measurement of the luminance after crimping in the luminance transmittance.

[0177] [Example 2] The same procedure as in Example 1 was carried out except that the support layer film 1 was changed to the support layer film 2.

[0178] [Example 3] The same procedure as in Example 1 was carried out except that the dry film thickness of the light diffusion layer coating liquid 1 was changed to 20 μm.

[0179] [Example 4] The same procedure as in Example 1 was carried out except that the dry film thickness of the light diffusion layer coating liquid 1 was changed to 100 μm.

[0180] [Example 5] The same procedure as in Example 1 was carried out except that the light diffusion layer coating liquid 1 was changed to the light diffusion coating liquid 2.

[0181] <Example 6> It was carried out in the same manner as in Example 1, except that the coating liquid 1 for the light diffusion layer was changed to the coating liquid 3 for the light diffusion layer.

[0182] <Example 7> It was carried out in the same manner as in Example 1, except that the coating liquid 1 for the light diffusion layer was changed to the coating liquid 4 for the light diffusion layer.

[0183] <Example 8> It was carried out in the same manner as in Example 1, except that the coating liquid 1 for the light diffusion layer was changed to the coating liquid 5 for the light diffusion layer.

[0184] <Example 9> It was carried out in the same manner as in Example 1, except that the coating liquid 1 for the light diffusion layer was changed to the coating liquid 6 for the light diffusion layer.

[0185] <Example 10> It was carried out in the same manner as in Example 1, except that the coating liquid 1 for the light diffusion layer was changed to the coating liquid 7 for the light diffusion layer.

[0186] <Example 11> It was carried out in the same manner as in Example 1, except that the coating liquid 1 for the light diffusion layer was changed to the coating liquid 8 for the light diffusion layer.

[0187] <Example 12> It was carried out in the same manner as in Example 1, except that the coating liquid 1 for the light diffusion layer was changed to the coating liquid 9 for the light diffusion layer.

[0188] <Example 13> It was carried out in the same manner as in Example 1, except that the coating liquid 1 for the light diffusion layer was changed to the coating liquid 10 for the light diffusion layer.

[0189] <Example 14> It was carried out in the same manner as in Example 1, except that the coating liquid 1 for the transparent curable resin layer was changed to the coating liquid 2 for the transparent curable resin layer.

[0190] <Comparative Example 1> A coating liquid for a transparent curable resin layer was applied to the support layer film 1 using an applicator so that the dry film thickness was 50 μm. It was dried at 120°C for 5 minutes to obtain a comparative transparent layer sheet in which the support layer and the transparent curable resin layer were laminated in this order. The black layer laminated sheet produced in the same manner as in Example 1 and the obtained comparative transparent layer sheet were overlapped so that the black curable resin layer and the transparent curable resin layer were in contact with each other, and laminated with a roll laminator at 60°C to obtain a comparative integrated sealing sheet. Thereafter, the same procedure as in Example 1 was followed.

[0191] <Comparative Example 2> Except that the support layer film 1 was changed to the support layer film 2, the same procedure as in Comparative Example 1 was followed.

[0192] Tables 1 to 2 show the compositions of the coating liquids for the light diffusion layers used in each example. Tables 3 to 4 show the conditions of the sheets used in each example and comparative example.

[0193]

Table 1

[0194]

Table 2

[0195]

Table 3

[0196]

Table 4

[0197] <Evaluation Method> [Measurement of Storage Elastic Modulus at 100°C] Each coating liquid for the light diffusion layer was coated on a release PET 1-E (manufactured by Nippon Carbide Industries Co., Ltd., 50 μm) so that the film thickness was 50 μm. Ultraviolet rays with a wavelength of 365 nm were applied to the coated coating liquid at 300 mJ / cm 2It was irradiated and cured. After curing, the release PET 1-E was peeled off to obtain a single-layer sheet of the light diffusion layer. The storage elastic modulus of the single-layer sheet at 100 °C was measured in accordance with JIS K 7244 using a viscoelasticity measuring device (RSA-G2 manufactured by TA Instruments) under the conditions of a measurement frequency of 1 Hz and a temperature rising rate of 5 °C / min. The measurement results are shown in Tables 1 to 2 above. Also, the storage elastic modulus of the black curable resin layer, the transparent curable resin layer 1 (the one obtained by applying and drying the coating liquid 1 for the transparent curable resin layer by the above method), and the transparent curable resin layer 2 (the one obtained by applying and drying the coating liquid 2 for the transparent curable resin layer by the above method) (hereinafter, may also be collectively referred to as the curable resin layer) was measured in accordance with JIS K7244 using a viscoelasticity measuring device (RSA-G2 manufactured by TA Instruments) under the conditions of a measurement frequency of 1 Hz and a temperature rising rate of 5 °C / min. The storage elastic modulus of the curable resin layer at 100 °C was applied so that the film thickness after drying on 1-E (manufactured by Nippa, release film, thickness 50 μm) became 50 μm, the curable resin layer was peeled off from 1-E, and measured in accordance with JIS K7244 under the same conditions as above using the above viscoelasticity measuring device. The measurement results are shown below. · Storage elastic modulus of the black curable resin layer at 100 °C: 6×10 2 Pa · Storage elastic modulus of the transparent curable resin layer 1 at 100 °C: 1×10 4 Pa · Storage elastic modulus of the transparent curable resin layer 2 at 100 °C: 2×10 4 Pa

[0198] [Measurement of total light transmittance and haze value] Using a haze meter (NDH5000 manufactured by Nippon Denshoku Industries Co., Ltd.), the total light transmittance and haze value were measured for the light diffusion layer laminated sheet according to each example obtained as described above in accordance with JIS K 7361-1 and JIS K 7136. Also, the total light transmittance and haze value were similarly measured for the support layer films 1 and 2 according to each comparative example. The total light transmittance of the support layer film 1 was 91% and the haze value was 70%. The total light transmittance of the support layer film 2 was 90% and the haze value was 1%. These results are shown in Tables 5 to 6.

[0199] [Measurement of L* value] Regarding the integrated sealing sheets according to the respective examples and comparative examples obtained as described above, in accordance with JIS Z 8781-4:2013, using a color difference meter CR-5 manufactured by Konica Minolta, the L* value was measured from the support layer side by the D65 light source, 2° field of view, reflection method, and SCE method. The measurement results are shown in Tables 5 to 6 below.

[0200] [Measurement of surface hardness] Also, regarding the integrated sealing sheets according to the respective examples and comparative examples, only thermosetting was performed under the above conditions without pressure bonding and filling on the substrate with evaluation elements to obtain integrated sealing cured sheets. Regarding each integrated sealing cured sheet, the surface hardness of each integrated sealing cured sheet was measured with a pencil hardness tester in accordance with JIS K 5600-5-4. The measurement results are shown in Tables 5 to 6 below.

[0201] [Calculation of luminance transmittance] The luminance of the light-emitting element on the substrate with evaluation elements before pressure bonding and filling the integrated sealing sheet was measured as the luminance before pressure bonding using a luminance meter CA-410 manufactured by Konica Minolta. Also, the luminance of the light-emitting element of the light-emitting electronic component was measured as the luminance after pressure bonding in the same manner. The luminance transmittance was calculated by the following formula (I). The calculated luminance transmittance is shown in Tables 5 to 6 below. Luminance transmittance (%) = (luminance after pressure bonding / luminance before pressure bonding) × 100 ··· (I)

[0202] [Evaluation of luminance uniformity] The light-emitting element of the light-emitting electronic component was lit, and the luminance uniformity when observed at an angle of 20 to 30° from the light-emitting surface 2 m away from the light-emitting electronic component was visually evaluated. The evaluation results are shown in Tables 5 to 6 below. The evaluation results in Tables 5 to 6 are described according to the following criteria. A: High uniformity, no luminance unevenness can be visually recognized. B: Luminance unevenness can be visually recognized in a part of the light-emitting surface, but it is not a problem in practical use. C: Luminance unevenness can be visually recognized over the entire light-emitting surface, and there is a problem in practical use.

[0203]

Table 5

[0204]

Table 6

[0205] <Evaluation Results> Each integrated sealing sheet according to the example had improved luminance uniformity compared to the comparative example without a light diffusing layer. Therefore, it can be said that the luminance unevenness was improved compared to the conventional product.

Industrial Applicability

[0206] The integrated sealing sheet according to the present invention can be used, for example, as a sheet for sealing from above a substrate on which a plurality of light emitting elements are arranged.

Explanation of Reference Numerals

[0207] 1... Integrated sealing sheet, 2... Substrate with elements, 3... Curing sheet for integrated sealing, 5... Light emitting electronic component, 10... Curing resin layer, 11... Black curing resin layer, 12... Transparent curing resin layer, 14... Light diffusing layer, 15... Support layer, 16, 17... Protective sheet, 18... Hard coat layer, 20... Substrate, 21, 22, 23... Light emitting element, 30... Resin layer, 31... Black resin layer, 32... Transparent resin layer.

Claims

1. An integrated sealing sheet for crimping onto the surface of a substrate with a plurality of light-emitting elements disposed thereon, the integrated sealing sheet comprising: a curable resin layer for covering the light-emitting elements; a light-diffusing layer containing fillers for diffusing incident light from the light-emitting elements; a support layer for supporting the light-diffusing layer; The integrated sealing sheet is laminated in this order.

2. The curable resin layer has at least a black curable resin layer for shielding light between the light-emitting elements and a transparent curable resin layer having higher light transmittance than the black curable resin layer, The integrated sealing sheet according to claim 1, wherein the light-diffusing layer is provided between the transparent curable resin layer and the support layer.

3. The integrated sealing sheet according to claim 1, wherein the thickness of the light-diffusing layer is 20 to 150 μm.

4. The integrated sealing sheet according to claim 1, wherein the total light transmittance in a state where the support layer and the light-diffusing layer are laminated is 80 to 99%.

5. The integrated sealing sheet according to claim 1, wherein the haze value in a state where the support layer and the light-diffusing layer are laminated is 75 to 99.9%.

6. The integrated sealing sheet according to claim 1, wherein the average particle diameter of the fillers is 0.5 to 10 μm.

7. The integrated sealing sheet according to claim 1, wherein the mass part ratio of the fillers is 3 to 40 parts by mass with respect to 100 parts by mass of the resin solid content of the light-diffusing layer.

8. The integrated sealing sheet according to claim 1, wherein the light-diffusing layer is a cured layer containing at least one of an epoxy resin, an acrylic resin, and / or a polyurethane resin.

9. The integrated sealing sheet according to claim 1, wherein a hard coat layer is provided on the surface of the support layer opposite to the surface in contact with the light-diffusing layer.

10. The integrated sealing sheet according to claim 1, wherein the storage elastic modulus at 100 °C in the uncured state of the transparent curable resin layer is smaller than the storage elastic modulus at 100 °C in the cured state of the light-diffusing layer.

11. A substrate with a plurality of light-emitting elements disposed thereon, and an integrated sealing curable sheet in a state of being crimped onto the surface of the substrate with the plurality of light-emitting elements disposed thereon, wherein the integrated sealing curable sheet, from at least the side in contact with the substrate with elements, comprises: a resin layer covering the light-emitting elements; a light-diffusing layer containing fillers for diffusing incident light from the light-emitting elements; a support layer for supporting the light-diffusing layer; They are laminated in the order of A light-emitting electronic component in which the resin layer is filled between the plurality of light-emitting elements. **Claim 12** The resin layer has a black resin layer capable of blocking light between the light-emitting elements from the side in contact with the substrate with elements, and a transparent resin layer having higher light transmittance than the black resin layer, At least the black resin layer is filled between the light-emitting elements, The light-emitting electronic component according to claim 11, wherein the light diffusion layer is provided between the transparent resin layer and the support layer. **Claim 13** A step of crimping the integrated sealing sheet according to any one of claims 1 to 10 to the surface of the substrate with elements on which a plurality of light-emitting elements are arranged, A step of filling at least a part of the curable resin layer between the plurality of light-emitting elements, A method for manufacturing a light-emitting electronic component, comprising a step of curing the curable resin layer.

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