Substrate conveyance device and substrate processing device including the same

Abstract

To provide a substrate conveyance device capable of preventing a damage from being generated on a substrate in conveyance, and a substrate processing device including the same.SOLUTION: When a substrate W is held on a first hand 19, a servo motor 79 is operated and each guide 67 is moved to the outer peripheral surface of the substrate W. When a tactile sensor 73 detects that each of the guides 67 is brought into contact with the outer peripheral surface of the substrate W, energization force to the outer peripheral surface of the substrate W by each of the guides 67 is adjusted by the servo motor 79, according to the shape of the substrate W. Accordingly, sandwiching force can be adjusted for each of the shapes of substrates such as warpage and thickness of the substrate W. As the result, a damage can be prevented from being generated on the substrate W when the substrate W is conveyed regardless of the shape of the substrate W.SELECTED DRAWING: Figure 6

Description

Technical Field

[0001] The present invention relates to a substrate transfer device for transferring substrates such as semiconductor substrates, substrates for flat panel displays (FPDs) such as liquid crystal display and organic electroluminescence (EL) display devices, glass substrates for photomasks, and substrates for optical disks, and a substrate processing device including the same.

Background Art

[0002] Conventionally, as a substrate transfer device of this type, there is one having a robot hand including a hand main body and a tactile sensor (see, for example, Patent Document 1).

[0003] The hand main body has a U-shaped configuration in plan view. The hand main body has distal ends spaced apart in a bifurcated manner. The hand main body is integrated at the proximal end. The hand main body is provided with tactile sensors at three locations: two distal ends and the proximal end. The tactile sensor has a sensing surface disposed above the hand main body. The robot hand supports the lower surface of the substrate by contacting it from below at three locations. The robot hand can obtain the support state of the substrate from the tactile sensor. Control of the robot hand, such as adjusting the transfer speed according to this support state, can be performed.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, in the case of the conventional example having such a configuration, there are the following problems. That is, in the case of a substrate that conforms to the standards of the Semiconductor Equipment and Materials International (SEMI) and has little deformation, the conventional apparatus can acquire the support state of the substrate and transport it normally. On the other hand, when transporting a substrate that is outside the SEMI standards, for example, a substrate with a diameter larger than the standard or a deformed substrate such as a warped surface, it may not be possible to normally acquire the support state. Therefore, depending on the shape of the substrate, appropriate conveyance according to the support state of the substrate cannot be performed, and there is a risk that the substrate will be damaged during conveyance.

[0006] In particular, recently, in power semiconductors and the like, substrates with extremely thin thicknesses may be used. The robot hand may not be able to normally support such substrates. Furthermore, substrates with a thin thickness are particularly likely to be damaged when being supported. Also, after undergoing various heat treatments, the substrate may be deformed into a bowl shape, an umbrella shape, or a half-pipe shape. Similar to the above, there is a risk that the substrate will be damaged during conveyance of these substrates.

[0007] Conversely, substrates with a thickness greater than the standard due to bonding are also being used. Even for such substrates, appropriate conveyance according to the support state of the substrate may not be possible, and the same problems as above occur.

[0008] The present invention has been made in view of such circumstances, and an object thereof is to provide a substrate conveyance apparatus that can prevent damage to a substrate during conveyance and a substrate processing apparatus including the same.

Means for Solving the Problems

[0009] In order to achieve such an object, the present invention has the following configuration. That is, the invention according to claim 1 is a substrate transfer device for transferring a substrate, comprising: a hand for holding the substrate in a horizontal posture; a horizontal drive mechanism for driving the hand to move forward and backward in a horizontal plane to transfer the substrate; at least two guides provided on the hand for sandwiching the outer peripheral surface of the substrate and holding the substrate separated from the hand; an advance / retreat drive mechanism for driving at least one of the at least two guides as a movable guide to move forward and backward with respect to the substrate; and a control unit for adjusting the biasing force applied to the outer peripheral surface of the substrate by the movable guide by controlling the advance / retreat drive mechanism.

[0010] [Function and Effect] According to the invention described in claim 1, when the control unit holds the substrate with the hand, it operates the advance / retreat drive mechanism to move the movable guide to the outer peripheral surface of the substrate. The control unit adjusts the biasing force applied to the outer peripheral surface of the substrate by the movable guide by controlling the advance / retreat drive mechanism. Therefore, the clamping force can be adjusted according to the shape of the substrate such as warping and thickness of the substrate, the transfer speed of the substrate, and the transfer modes such as turning and reversing. As a result, it is possible to prevent damage to the substrate when transferring the substrate.

[0011] Further, in the present invention, it is preferable that the control unit adjusts the biasing force applied to the outer peripheral surface of the substrate by the movable guide according to the shape of the substrate (claim 2).

[0012] The clamping force can be adjusted according to the shape of the substrate such as warping and thickness of the substrate. Therefore, it is possible to prevent damage to the substrate when transferring the substrate regardless of the shape of the substrate.

[0013] Further, in the present invention, it is preferable that the control unit adjusts the biasing force applied to the outer peripheral surface of the substrate by the movable guide to decrease as the thickness of the substrate decreases (claim 3).

[0014] The clamping force can be adjusted according to the thickness of the substrate. Therefore, it is possible to prevent damage to the substrate when transferring the substrate regardless of the thickness of the substrate.

[0015] In the present invention, it is preferable that the control unit adjusts the biasing force applied to the outer peripheral surface of the substrate by the movable guide so as to decrease as the warp of the substrate increases (Claim 4).

[0016] The clamping force can be adjusted according to the warp of the substrate. Therefore, it is possible to prevent damage to the substrate when transporting the substrate regardless of the warp of the substrate.

[0017] In the present invention, it is preferable that an outer peripheral surface detector for detecting that the movable guide has come into contact with the outer peripheral surface of the substrate is further provided, and the control unit adjusts the biasing force after detecting that the movable guide has come into contact with the outer peripheral surface of the substrate by the outer peripheral surface detector (Claim 5).

[0018] The control unit adjusts the biasing force after detecting that the movable guide has come into contact with the outer peripheral surface of the substrate by the outer peripheral surface detector. Therefore, the movable guide can be moved at high speed until it comes into contact with the outer peripheral surface of the substrate. As a result, the time until the hand holds the substrate can be shortened.

[0019] In the present invention, it is preferable that all of the guides are the movable guides, and when the control unit holds the substrate with the hand, each of the advance / retreat drive mechanisms is operated to move all of the movable guides to the outer peripheral surface of the substrate, and the biasing force is adjusted for all of the movable guides by each of the advance / retreat drive mechanisms (Claim 6).

[0020] All of the guides are movable guides, and the biasing force is adjusted for all of the movable guides. Therefore, when clamping the substrate, the distance by which the lower surface of the substrate slides horizontally at the location where the substrate is placed can be shortened. As a result, even when the position where the substrate is placed is displaced, the movement of the center position of the substrate when clamping the substrate is minimized. Thus, particles generated when clamping the substrate can be suppressed.

[0021] In the present invention, it is preferable that the outer peripheral surface detector is a tactile sensor having a detection surface capable of detecting forces applied to each of the three orthogonal axes (Claim 7).

[0022] Regardless of the posture when the outer peripheral surface of the substrate abuts against the movable guide, the reaction force received by the movable guide from the outer peripheral surface of the substrate can be detected. Therefore, it is possible to accurately detect that the movable guide has abutted against the outer peripheral surface of the substrate.

[0023] In the present invention, it is preferable that the advancing / retreating drive mechanism includes a motor that drives the guide to advance and retreat, a drive circuit that applies a drive current for driving the motor, and an encoder that detects the rotational position of the motor. The outer peripheral surface detector includes at least one of a drive current detection unit that detects the abutment based on the drive current information of the drive circuit and a position information detection unit that detects the abutment based on the position information output from the encoder. The control unit preferably determines the abutment based on at least one of the drive current information and the position information (Claim 8).

[0024] The control unit determines that the movable guide has abutted against the outer peripheral surface of the substrate based on at least one of the drive current information from the drive current detection unit and the position information from the encoder. Therefore, it is not necessary to provide a sensor for detecting that the guide and the outer peripheral surface of the substrate have abutted. As a result, the structure can be simplified and the cost can be suppressed.

[0025] In the present invention, it is preferable that the outer peripheral surface detector is provided at the attachment portion of the movable guide to the hand (Claim 9).

[0026] Since the outer peripheral surface detector is provided at the attachment portion of the movable guide to the hand, the reaction force received from the substrate can be detected with high sensitivity. Therefore, it is possible to accurately detect that the movable guide has abutted against the outer peripheral surface of the substrate.

[0027] In the present invention, it is preferable that the guide is attached to the lower surface of the hand (Claim 10).

[0028] Even if the clearance, which is the distance between the upper surface of the placement portion that is the delivery destination of the substrate and the lower surface of the substrate, is small, the substrate can be delivered between the placement portion and the upper side by a guide provided on the lower surface of the hand.

[0029] Further, in the present invention, it is preferable that the guide has a columnar shape (Claim 11).

[0030] When the substrate has a circular shape, the columnar guide and the outer peripheral surface of the substrate are in point contact. Therefore, the contact area can be minimized, and mutual contamination through the guide can be suppressed.

[0031] Further, in the present invention, the guide includes an inclined surface that becomes lower toward the center side of the substrate and a sandwiching portion erected along the outer peripheral surface of the substrate, and when the hand receives the substrate, after the substrate is once placed on the inclined surface, the substrate is pressed and sandwiched against the sandwiching portion by applying a biasing force to the outer peripheral surface of the substrate by the movable guide, and it is preferable that the guide includes a placement detector that detects that the substrate has been placed on the inclined surface (Claim 12).

[0032] It is possible to detect with a placement detector that the substrate has been placed on the inclined surface of the guide. Therefore, the presence or absence of the substrate can be accurately detected.

[0033] Further, in the present invention, it is preferable that the hand further includes a nozzle that supplies a processing liquid to the upper surface of the substrate sandwiched by the guide (Claim 13).

[0034] In a substrate on which a three-dimensional structure pattern is formed, due to the influence of the gas-liquid interface when the substrate dries, the pattern may collapse. Therefore, the substrate is conveyed in a state of being wetted with pure water so that the substrate does not dry. Since the hand is provided with a nozzle, the substrate can be conveyed while being maintained in a wet state. Therefore, even if the substrate is conveyed in a wet state, a decrease in throughput can be suppressed.

[0035] Further, in the present invention, the hand includes two extending portions extending from the base end portion to the tip end portion, and a beam portion suspended from the two extending portions so as to pass through the central portion of the substrate sandwiched by the hand. The nozzle is preferably provided on the beam portion and supplies a processing liquid to the substrate sandwiched by the hand (Claim 14).

[0036] Since the nozzle is provided on the beam portion suspended between the two extending portions, the processing liquid can be supplied to the central portion of the substrate. Therefore, the processing liquid can be supplied to the entire surface of the substrate.

[0037] Further, in the present invention, the hand is composed of two types: an upper hand having the guide on the lower surface and a lower hand having the guide on the upper surface. Depending on the clearance, which is the distance between the upper surface of the placement portion, which is the delivery destination, and the lower surface of the substrate, the lower hand is used for the placement portion with a large clearance, and the upper hand is used for the placement portion with a small clearance, and it is preferable to transfer the substrate between the placement portion (Claim 16).

[0038] For the placement portion with a large clearance, the lower hand is used, and for the placement portion with a small clearance, the upper hand is used, so that the substrate can be transferred between the placement portions. Therefore, an appropriate hand can be selected according to the clearance of the placement portion, and the substrate can be reliably conveyed.

[0039] Further, in the present invention, it is preferable to include the substrate transfer device according to any one of the above and a processing unit that performs a predetermined process on the substrate (Claim 16).

[0040] When transferring the substrate between the processing units, the clamping force can be adjusted according to the shape of the substrate such as warping and thickness. As a result, in the substrate processing apparatus, it is possible to prevent damage to the substrate when transferring regardless of the shape of the substrate.

[0041] In addition, this specification also discloses an invention related to the following substrate transfer device and a substrate processing apparatus including the same.

[0042] In recent years, in the field of semiconductors, the refinement of patterns in three-dimensional structures has been progressing. In a substrate on which a pattern of a three-dimensional structure is formed, due to the influence of the gas-liquid interface when the substrate dries, the pattern may collapse. Therefore, after processing by a batch-type module that performs processing on a plurality of substrates collectively, until processing in a single-wafer module that performs processing on each substrate one by one, the substrate is kept wet with pure water so that the substrate does not dry.

[0043] However, in a substrate transfer device having a robot hand equipped with a conventional hand body part and a tactile sensor, even if pure water is pooled on the upper surface of the substrate, there is a risk that the pure water may spill from the upper surface of the substrate placed on the hand body part during transfer. Therefore, in order to transfer the substrate in a wet state, it is necessary to transfer at an extremely low speed, and there is a problem that the throughput is extremely reduced.

[0044] An object of the present invention is to provide a substrate transfer device capable of suppressing a decrease in throughput even when transferring a substrate in a wet state, and a substrate processing device including the same.

[0045] (1) In a substrate transfer device for transferring a substrate, a hand that holds the substrate in a horizontal posture, a horizontal drive mechanism that drives the hand to advance and retreat in a horizontal plane to transfer the substrate, at least three guides provided on the lower surface of the hand, which sandwich the outer peripheral surface of the substrate and hold the substrate spaced apart from the lower surface of the hand, a nozzle provided in the hand for supplying a processing liquid to the upper surface of the substrate held by the hand, A substrate transfer device, characterized by comprising the above.

[0046] According to the invention described in (1) above, since the hand is provided with a nozzle, the substrate can be transferred while maintaining it in a wet state. Therefore, even when transferring the substrate in a wet state, a decrease in throughput can be suppressed.

[0047] (2) In the substrate transfer device according to (1) above, the hand includes two extending portions extending from the base end portion to the tip end portion, and a beam portion suspended from the two extending portions so as to pass through the central portion of the substrate held by the hand. The nozzle is provided on the beam portion and supplies a processing liquid to the substrate held by the hand. A substrate transfer device characterized by that.

[0048] According to the invention described in (2) above, since the nozzle is provided on the beam portion suspended between the two extending portions, the processing liquid can be supplied to the central portion of the substrate. Therefore, the processing liquid can be supplied to the entire surface of the substrate.

[0049] (3) A batch processing unit that collectively processes a plurality of substrates in a vertical posture, A single-wafer processing unit that processes a single substrate in a horizontal posture, A posture conversion unit that holds a plurality of substrates that have been processed by the batch processing unit and converts the posture from a vertical posture to a horizontal posture, A first transfer unit that transfers a plurality of substrates that have been processed by the batch processing unit to the posture conversion unit, A second transfer unit that transfers the substrate that has been set to a horizontal posture by the posture conversion unit to the single-wafer processing unit, In a substrate processing apparatus comprising: The second transfer device is the substrate transfer device according to (1) or (2) above. A substrate processing apparatus characterized by that.

[0050] According to the invention described in (3) above, the first transfer unit transfers the substrate from the batch processing unit to the posture conversion unit after the processing by the batch processing unit that collectively processes a plurality of substrates. The second transfer unit transfers the substrate that has been set to a horizontal posture by the posture conversion unit to the single-wafer processing unit that processes the substrates one by one. Since the second transfer unit supplies the processing liquid from the nozzle to the substrate, it can transfer the substrate while maintaining it in a wet state. Therefore, even if the substrate is transferred in a wet state, a decrease in throughput can be suppressed.

Effects of the Invention

[0051] According to the substrate transfer device of the present invention, when the control unit holds the substrate with the hand, it operates the forward and backward drive mechanism to move the movable guide to the outer peripheral surface of the substrate. The control unit adjusts the biasing force applied to the outer peripheral surface of the substrate by the movable guide by controlling the forward and backward drive mechanism. Therefore, the clamping force can be adjusted according to the shape of the substrate such as warping and thickness of the substrate, the transfer speed of the substrate, and the transfer modes such as turning and inversion. As a result, it is possible to prevent damage to the substrate when transporting the substrate.

Brief Description of the Drawings

[0052]

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Figure 18

Figure 19

Figure 20

Figure 21

Figure 22

Figure 23

Figure 24

Figure 25

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Figure 30

Modes for Carrying Out the Invention

[0053] The present invention will be described below with reference to various examples.

Example

[0054] Hereinafter, Example 1 of the present invention will be described with reference to the drawings.

[0055] FIG. 1 is a plan view showing the overall configuration of the substrate processing apparatus according to Example 1. FIG. 2 is a view of the substrate processing apparatus in FIG. 1 as seen from the rear X.

[0056] <1. Overall configuration>

[0057] The substrate processing apparatus 1 includes a loading / unloading block 3, an indexer block 5, and a processing block 7.

[0058] The substrate processing apparatus 1 processes the substrate W. The substrate processing apparatus 1 performs, for example, a cleaning process on the substrate W. The substrate processing apparatus 1 processes the substrate W in a single-wafer type in the processing block 7. The single-wafer type processes one substrate W one by one in a horizontal posture. The substrate W has, for example, a circular shape in plan view.

[0059] In this specification, for convenience, the direction in which the loading / unloading block 3, the indexer block 5, and the processing block 7 are arranged is referred to as the "front-rear direction X". The front-rear direction X is horizontal. Among the front-rear direction X, the direction from the processing block 7 toward the loading / unloading block 3 is referred to as "front". The direction opposite to the front is referred to as "rear". The horizontal direction orthogonal to the front-rear direction X is referred to as the "width direction Y". One direction of the "width direction Y" is appropriately referred to as "right". The direction opposite to the right is referred to as "left". The direction perpendicular to the horizontal direction is referred to as the "vertical direction Z". In each figure, for reference, front, rear, right, left, up, and down are appropriately shown.

[0060] <2. Loading / unloading block>

[0061] The loading / unloading block 3 includes a loading section 9 and an unloading section 11. The loading section 9 and the unloading section 11 are arranged in the width direction Y. A plurality of substrates W (for example, 25 sheets) are stacked and stored horizontally at regular intervals within a single carrier C. The carrier C containing the unprocessed substrates W is placed on the loading section 9. The loading section 9 includes, for example, two mounting tables 13 on which the carrier C is placed. The carrier C has a plurality of grooves (not shown) formed therein for accommodating the substrates W one by one while separating the surfaces of the substrates W from each other. The carrier C accommodates the substrates W, for example, in a posture with the surface of the substrate W facing upward. Examples of the carrier C include a FOUP (Front Opening Unify Pod). The FOUP is a sealed container. The carrier C may be an open container, regardless of the type.

[0062] The unloading section 11 is disposed on the opposite side of the loading section 9 across the central part in the width direction Y in the substrate processing apparatus 1. The unloading section 11 is arranged on the left side Y of the loading section 9. The unloading section 11 stores the processed substrates W in the carrier C and discharges the entire carrier C. The unloading section 11 that functions in this way includes, like the loading section 9, for example, two mounting tables 13 for placing the carrier C. The loading section 9 and the unloading section 11 are also called load ports.

[0063] <3. Indexer Block>

[0064] The indexer block 5 is arranged adjacent to the rear X of the loading / unloading block 3 in the substrate processing apparatus 1. The indexer block 5 includes an indexer robot IR and a transfer section 15.

[0065] The indexer robot IR is configured to be rotatable about the vertical direction Z. The indexer robot IR is configured to be movable in the width direction Y. The indexer robot IR includes a first hand 19 and a second hand 21. In FIG. 1, only one hand is shown due to the illustration relationship. The first hand 19 and the second hand 21 hold the substrate W in a horizontal posture. The first hand 19 and the second hand 21 sandwich the outer peripheral surface of the substrate W and hold the substrate W while separating it from the upper surfaces of the first hand 19 and the second hand 21.

[0066] The first hand 19 and the second hand 21 each hold one substrate W. The first hand 19 and the second hand 21 are each configured to be independently movable forward and backward in the front-rear direction X. The indexer robot IR moves in the width direction Y and rotates about the vertical direction Z, and advances and retreats the first hand 19 and the second hand 21 to transfer the substrate W to and from each carrier C. Similarly, the indexer robot IR transfers the substrate W to and from the transfer portion 15.

[0067] The transfer portion 15 is disposed at the boundary with the processing block 7 among the index blocks 5. The transfer portion 15 is disposed, for example, at the central portion in the width direction Y. As shown in FIG. 2, the transfer portion 15 is formed long in the vertical direction Z.

[0068] The transfer portion 15 includes a first inversion unit 23, a path portion 25, a path portion 27, and a second inversion unit 29 from the lower side to the upper side in the vertical direction Z.

[0069] The first inversion unit 23 inverts the top and bottom of the substrate W received from the index block 5. The first inversion unit 23 inverts the horizontal posture of the substrate W. Specifically, the first inversion unit 23 converts the substrate W with the surface facing upward into a posture with the surface facing downward. In other words, the posture of the substrate W is converted so that the back surface faces upward.

[0070] The second inversion unit 29 performs the reverse operation. That is, the second inversion unit 29 inverts the top and bottom of the substrate W received from the processing block 7. The second inversion unit 29 converts the substrate W with the surface facing downward into a posture with the surface facing upward. In other words, the posture of the substrate W is converted so that the back surface faces downward.

[0071] The inversion directions of the first inversion unit 23 and the second inversion unit 29 described above may be opposite to each other. That is, the first inversion unit 23 converts the posture of the substrate W so that the surface faces upward. The second inversion unit 29 converts the posture of the substrate W so that the back surface faces upward.

[0072] The path portions 25 and 27 are used to transfer the substrate W between the indexer block 5 and the processing block 7. The path portion 25 is used, for example, to convey the substrate W from the processing block 7 to the indexer block 5. The path portion 27 is used, for example, to convey the substrate W from the indexer block 5 to the processing block 7. Note that the conveyance directions of the substrate W in the path portions 25 and 27 may be opposite to each other.

[0073] <4. Processing block>

[0074] The processing block 7 performs various processes on the substrate W, for example. Examples of the process include a cleaning process. The cleaning process is, for example, a process liquid cleaning process that supplies only a cleaning liquid or a brush cleaning process that uses a brush in addition to the process liquid.

[0075] As shown in FIG. 1, the processing block 7 is divided into, for example, a first row R1, a second row R2, and a third row R3 in the width direction Y. Specifically, the first row R1 is arranged on the left side Y. The second row R2 is arranged in the central portion of the width direction Y. In other words, the second row R2 is arranged on the right side Y of the first row R1. The third row R3 is arranged on the right side Y of the second row R2.

[0076] <4-1. First row>

[0077] The first row R1 of the processing block 7 includes a plurality of processing units 31. The first row R1 includes, for example, four processing units 31. The first row R1 has four processing units 31 stacked and arranged in the vertical direction Z. Each processing unit 31 is, for example, a cleaning unit. The cleaning unit performs a cleaning process on the substrate W. As the cleaning unit, there are a surface cleaning unit that cleans the surface of the substrate W and a back surface cleaning unit that cleans the back surface of the substrate W. In this embodiment, the back surface cleaning unit SSR is taken as an example to describe the processing unit 31.

[0078] <4-2. Second row>

[0079] The second row R2 of the processing block 7 includes a center robot CR. The center robot CR is configured to be rotatable around the vertical direction Z. The center robot CR is configured to be movable up and down in the vertical direction Z. The center robot CR includes, for example, a first hand 33 and a second hand 35. The first hand 33 and the second hand 35 each hold one substrate W. The first hand 33 and the second hand 35 are each independently configured to be movable back and forth in the front-rear direction X and the width direction Y.

[0080] The first hand 33 and the second hand 35 hold the substrate W in a horizontal posture. The first hand 33 and the second hand 35 sandwich the outer peripheral surface of the substrate W and hold the substrate W spaced apart from the upper surfaces of the first hand 33 and the second hand 35.

[0081] <4-3. Third row>

[0082] The third column R3 of the processing block 7 has the same configuration as the first column R1. That is, the third column R3 includes a plurality of processing units 31. The third column R3 includes, for example, four processing units 31. The four processing units 31 of the third column R3 are stacked and arranged in the vertical direction Z. Each processing unit 31 of the first column R1 and each processing unit 31 of the third column R3 are arranged to face each other in the width direction Y. Thereby, the center robot CR can access each of the opposing processing units 31 of the first column R1 and the third column R3 at the same height in the vertical direction Z.

[0083] The processing block 7 is configured as described above. Here, an operation example of the center robot CR will be briefly described. The center robot CR receives the substrate W from, for example, the first inversion unit 23. The center robot CR transports the substrate W to any one of the back surface cleaning units SSR of the first column R1 and the third column R3 to cause the back surface cleaning process to be performed on the back surface of the substrate W. The center robot CR receives the substrate W on which the cleaning process has been performed by any one of the back surface cleaning units SSR of the first column R1 and the third column R. The center robot CR transports the substrate W to the second inversion unit 29. The index robot IR receives the substrate W from the second inversion unit 29 and stores it in the carrier C.

[0084] <5. Mounting Table>

[0085] Here, with reference to FIGS. 1 and 3, the above-described three loading / unloading blocks will be described in detail. FIGS. 3(a) to (e) are side views showing the configuration and operation of the loading / unloading blocks.

[0086] The loading / unloading block 3 includes a mounting table 13, an opening 39, and a lid opening / closing mechanism 41. The mounting table 13 is where the carrier C is placed. The mounting table 13 is provided with a mechanism (not shown) for moving the carrier C in the front-rear direction X. The mounting table 13 can move the carrier C forward and backward with respect to the opening 39. The carrier C has a loading / unloading port CT. The loading / unloading port CT is formed on one side surface of the carrier C. A plurality of substrates W stacked and accommodated in the carrier C are loaded / unloaded through the loading / unloading port CT. The carrier C includes a lid CL. The lid CL is detachably configured at the loading / unloading port CT of the carrier C. The lid CL seals the inside of the carrier C. When the lid CL is attached to the carrier C, the atmosphere inside the carrier C is blocked from the outside.

[0087] The lid opening / closing mechanism 41 includes a detaching / attaching unit 43 in the front X direction. The detaching / attaching unit 43 removes the lid CL from the carrier C or attaches the lid CL to the carrier C. The detaching / attaching unit 43 is movable in the vertical direction Z and the front-rear direction X while holding the lid CL. The lid opening / closing mechanism 41 is movable in the front-rear direction X at the opening 39 while holding the lid CL. The lid opening / closing mechanism 41 is movable up and down in the vertical direction Z while holding the lid CL. The lid opening / closing mechanism 41 can move downward in the vertical direction Z from the opening 39 while holding the lid CL. By descending while holding the lid CL, the lid opening / closing mechanism 41 can fully open the opening 39.

[0088] First, as shown in Fig. 3(a), the carrier C is placed on the mounting table 13. The carrier C has a plurality of substrates W stacked and accommodated therein and is closed by the lid CL. At this time, the lid opening / closing mechanism 41 positions the detaching / attaching unit 43 at the opening 39. Thereby, the inside of the index block 5 is separated from the external atmosphere.

[0089] As shown in FIG. 3(b), the mounting table 13 moves the carrier C rearward in the X direction. The carrier C is positioned such that the loading / unloading opening CT and the lid CL are located at the opening 39. At this time, the attachment / detachment unit 43 releases the lock of the lid CL and holds the lid CL. The holding is performed, for example, by the attachment / detachment unit 43 sucking the lid CL.

[0090] As shown in FIG. 3(c), the lid opening / closing mechanism 41 moves rearward in the X direction. As a result, the lid CL is moved rearward in the X direction from the opening 39. The lid CL is moved inside the index block 5.

[0091] As shown in FIG. 3(d), the lid opening / closing mechanism 41 moves downward in the vertical direction Z. The lid opening / closing mechanism 41 lowers the attachment / detachment unit 43 to the lower part of the loading / unloading opening CT. The lid opening / closing mechanism 41 lowers the attachment / detachment unit 43 until the upper part of the attachment / detachment unit 43 is positioned below the lower part of the opening 39.

[0092] As shown in FIG. 3(e), the lid opening / closing mechanism 41 moves downward in the vertical direction Z and moves to the lowermost position where the lid opening / closing mechanism 41 can move. The lid opening / closing mechanism 41 lowers the attachment / detachment unit 43 to a position where it does not overlap with the opening 39 in the front-rear direction X. As a result, the opening 39 is fully opened. A plurality of substrates W in the carrier C can face the index block 5 through the opening 39.

[0093] The above-described lid opening / closing mechanism 41 is provided with, for example, a substrate sensor 45 in the attachment / detachment unit 43. The substrate sensor 45 is used to detect the position of the substrate W stacked and stored in the carrier C or to collect shape information based on the outer edge of the substrate W. The shape information includes information regarding the thickness based on the outer edge of the substrate W.

[0094] <6. Mounting portion>

[0095] Here, with reference to FIGS. 4 and 5, a part of the above-described processing unit 31 will be described. FIG. 4 is a side view showing a first example of the mounting portion provided in the processing unit. FIG. 5 is a side view showing a second example of the mounting portion provided in the processing unit.

[0096] The above-described processing unit 31 is assumed to be the back surface cleaning unit SSR. Such a back surface cleaning unit SSR is provided with, for example, one of two types of mounting portions 47 (mounting portions 47A and 47B) as described below. The mounting portion 47 is a place where the substrate W is mounted in the back surface cleaning unit SSR. The mounting portion 47 supports the lower surface of the substrate W. In addition to such two types of mounting portions 47 (mounting portions 47A and 47B), there is also a mounting portion that holds the substrate W by suction.

[0097] As shown in FIG. 4, the mounting portion 47A includes a turntable 49 and support pins 51. The turntable 49 has a circular shape in plan view. The turntable 49 has a diameter slightly larger than that of the substrate W. There are a plurality of support pins 51. The support pins 51 are erected on the upper surface of the turntable 49. The support pins 51 are arranged on the upper surface slightly inside the outer peripheral surface of the turntable 49. Some of the support pins 51 rotate eccentrically around the axis in the vertical direction Z. The substrate W is pressed horizontally from the outer peripheral surface by the support pins 51 that rotate in this way, and the position is fixed by the plurality of support pins 51. The support pins 51 contact the outer peripheral surface and the lower surface of the substrate W, and support the lower surface of the substrate W so as to be separated from the upper surface of the turntable 49.

[0098] Here, the distance between the upper surface of the turntable 49 and the lower surface of the substrate W supported by the support pins 51 is referred to as clearance CL1. In the mounting portion 47A in this first example, the clearance CL1 is relatively large. The clearance CL1 is larger than the thickness DP of the first hand 33 and the second hand 35. The thickness DP corresponds to the maximum height in the vertical direction Z when the portion that enters the position where the substrate W is transferred among the first hand 33 and the second hand 35 is viewed from the side.

[0099] In the cleaning unit SSR provided with such a mounting portion 47A, it is preferable to access it with a lower hand described later. Note that in the mounting portion 47A, it is also possible to access it with an upper hand described later.

[0100] As shown in FIG. 5, the mounting portion 47B includes a turntable 53 and support protrusions 55. The turntable 53 has a circular shape in plan view. The turntable 53 is provided with an injection port (not shown) for supplying gas to the lower surface of the substrate W. The support protrusions 55 are formed on the upper surface of the turntable 53. There are a plurality of support protrusions 55. The support protrusions 55 are formed slightly inside the outer peripheral surface of the turntable 53. The support protrusions 55 abut against the lower surface of the substrate W and support the lower surface of the substrate W so as to be spaced apart from the upper surface of the turntable 53. The substrate W is supported so as to be attracted to the support protrusions 55 and the turntable 53 by the negative pressure generated by the supply of gas. Thereby, the position of the substrate W is fixed. The clearance CL2 of this mounting portion 47B is relatively small. The clearance CL2 is smaller than the clearance CL1. The clearance CL2 is smaller than the thickness DP of the first hand 33 and the second hand 35.

[0101] In the cleaning unit SSR provided with such a mounting portion 47B, it is preferable to access it with an upper hand described later.

[0102] <7. Details of the Hand>

[0103] Here, with reference to FIGS. 6 to 9, the first hand 19 in the indexer robot IR will be described as an example. FIG. 6 is a plan view of the lower hand according to the first embodiment. FIG. 7 is a side view of the hand according to the first embodiment. FIG. 8 is a longitudinal sectional view showing the configuration of the movable guide on the tip side. FIG. 9 is a longitudinal sectional view showing the configuration of the movable guide (pusher) on the base end side. Note that the configuration of the first hand 19 is the same as that of the second hand 21 and the first hand 33 and the second hand 35 in the center robot CR.

[0104] The indexer robot IR is equipped with a horizontal drive mechanism 57. The horizontal movement mechanism 57 drives the first hand 19 in the front-rear direction X. The horizontal movement mechanism 57 drives the first hand 19 to advance and retreat in the horizontal direction. The horizontal movement mechanism 57 drives the first hand 19 to advance and retreat relative to a transfer destination. Specifically, the transfer destination in the indexer robot IR is driven to advance and retreat relative to the carrier C and the transfer section 15. Note that the horizontal movement mechanism 57 in the center robot CR drives the first hand 33 and the second hand 35 to advance and retreat not only in the front-rear direction X but also in the width direction Y.

[0105] The first hand 19 has one palm portion 59 and two finger portions 61. The palm portion 59 is the base end side of the first hand 19. The finger portion 61 is the tip end side of the first hand 19. The first hand 19 enters the delivery destination from the tip end side of the first hand 19 and exits from the base end side of the first hand 19. The palm portion 59 has an attachment base end 63 and a finger portion attachment portion 65. The attachment base end 63 is attached to the horizontal drive mechanism 57. The finger portion 61 is attached to the finger portion attachment portion 65. The finger portion attachment portion 65 is provided at two locations spaced apart in the width direction Y. When the first hand 19 advances to the position where the substrate W is to be delivered, the portion of the finger portion attachment portion 65 to which the two finger portions 61 are attached is located outside the outer circumferential surface of the substrate W in a plan view. In other words, the length of the finger portion 61 in the front-rear direction X is longer than the diameter of the substrate W.

[0106] The first hand 19 has two finger portions 61. The two finger portions 61 extend in the front-rear direction X. The two finger portions 61 are spaced apart from each other in the width direction Y. The distance between the two finger portions 61 does not exceed the diameter of the substrate W. In other words, the width direction Y of the two finger portions 61 falls within the diameter of the substrate W. The base end side of the finger portions 61 is attached to the finger portion attachment portion 65. The tip side of the finger portions 61, which is opposite to the base end side, is in an open state. The first hand 19 has a U-shape in a plan view with the palm portion 59 and the two finger portions 61.

[0107] The first hand 19 is provided with three guides 67. The three guides 67 are attached to the upper surface of the first hand 19. The finger part 61 is provided with one guide 67 on the tip side. A structure in which the guide 67 is attached to the upper surface of the finger part 61 like this first hand 19 is called a "down-taking hand". The first hand 19 having the structure of the down-taking hand holds the substrate W by scooping it up from below upward.

[0108] As shown in FIG. 8, the guide 67 of the finger part 61 is attached to the guide hole 69. The guide hole 69 is long in the front-rear direction X. A moving piece 71 is disposed at the bottom of the guide hole 69. The moving piece 71 is movable only in the front-rear direction X at the bottom of the guide hole 69. A tactile sensor 73 is attached to the moving piece 71. The tactile sensor 73 is attached to the upper surface of the moving piece 71.

[0109] The tactile sensor 73 has a detection surface 75 capable of detecting the forces applied to each of the three mutually orthogonal axes. The tactile sensor 73 is attached to the moving piece 71 with the detection surface 75 directed upward. The guide 67 is attached to the detection surface 75. The bottom of the guide 67 is attached to the detection surface 75. The tactile sensor 73 can detect the force applied to the guide 67 in each of the three axial directions. The tactile sensor 73 detects the forces applied in the front-rear direction X, the width direction Y, and the vertical direction Z. The tactile sensor 73 outputs an electrical signal corresponding to each of the forces detected in the three axial directions.

[0110] The finger part 61 has a lateral hole 77 formed in the front-rear direction X from the guide hole 69. The lateral hole 77 penetrates up to the palm part 59. A servo motor 79 is provided at a location in the palm part 59 corresponding to the end of the lateral hole 77. The servo motor 79 is equipped with an encoder 81. The encoder 81 detects the rotational position (rotation angle) of the rotation shaft of the servo motor 79 and outputs it as position information by an electric signal. A ball screw 83 is inserted into the lateral hole 77. One end side of the ball screw 83 is connected to the rotation shaft of the servo motor 79. A moving piece 71 is screwed to the other end side of the ball screw 83. When the servo motor 79 is rotationally driven, the ball screw 83 is rotated and the moving piece 71 moves in the front-rear direction X along the guide hole 69. Thereby, the guide 67 moves in the front-rear direction X.

[0111] As shown in FIG. 9, the palm part 59 includes a pusher 87. The pusher 87 includes one guide 67. The pusher 87 has the same configuration as that for driving the guide 67 of the finger part 61 except for the pusher arm 89 and the guide hole 91.

[0112] That is, the pusher 87 includes a tactile sensor 73, a lateral hole 77, a ball screw 83, a servo motor 79, an encoder 81, and a pusher arm 89. One end side of the lateral hole 77 penetrates the side surface on the finger part 61 side. A guide hole 91 is formed on the finger part 61 side of the lateral hole 77. The guide hole 91 has a larger dimension in the vertical direction Z than the lateral hole 77. A part of the pusher arm 89 is inserted into the guide hole 91 so as to be movable in the front-rear direction X. The other end side of the lateral hole 77 is closed inside the palm part 59. The servo motor 79 is disposed at the other end side of the lateral hole 77. The servo motor 79 is equipped with an encoder 81. One end side of the ball screw 83 is connected to the rotation shaft of the servo motor 79. The pusher arm 89 is screwed to the other end side of the ball screw 83. The pusher arm 89 includes the tactile sensor 73 on the opposite side of the servo motor 79 in the front-rear direction X. The guide 67 is attached to the detection surface 75 of the tactile sensor 73.

[0113] Each of the above-described guides 67 is configured to be movable by a predetermined distance in the front-rear direction X. Each of the above-described guides 67 is movable, for example, by a distance of about 5 mm in the front-rear direction X.

[0114] The first hand 19 has three guides 67 on its upper surface. The first hand 19 holds the substrate W in a state where the lower surface of the substrate W is spaced upward from the upper surface of the finger portion 61. Specifically, the outer peripheral surface of the substrate W is sandwiched by the three guides 67, and the substrate W is held in a state where its lower surface floats from the upper surface of the finger portion 61. The first hand 19 holds the substrate W in a state of contacting only the outer peripheral surface of the substrate W. The first hand 19 moves the three guides 67 toward the outer peripheral surface of the substrate W, thereby sandwiching the outer peripheral surface of the substrate W with the three guides 67 and holding the substrate W in a state of being separated from the upper surface of the finger portion 61.

[0115] The first hand 19 has three guides 67 on its upper surface, but it may be configured as shown in FIG. 10. FIG. 10 is a side view of the pick-up hand according to the embodiment.

[0116] Unlike the first hand 19, the first hand 19D has three guides 67 attached to its lower surface. Specifically, each of the two finger portions 61 has one guide 67 on its lower surface at the tip side. The palm portion 59 has one guide 67 on its lower surface at the tip side. This first hand 19D is referred to as a "pick-up hand". The first hand 19D having the structure of the pick-up hand holds the substrate W by entering from above and further lifting it upward.

[0117] The first hand 19D drives the three guides 67 by the same configuration except that the attachment surface of the guide 67 is different from that of the first hand 19 described above. Therefore, a detailed description of the drive mechanism will be omitted.

[0118] Each of the above-described guides 67 is preferably made of, for example, PBI (polybenzimidazole). This is because PBI has high heat resistance, excellent chemical resistance, and toughness. However, each guide 67 may be made of other materials. Examples of other materials include fluororesins such as PTFE (polytetrafluoroethylene) and PFA (perfluoroalkoxyalkane).

[0119] <8. Control System>

[0120] Referring to FIG. 11, the control system of the above-described substrate processing apparatus 1 will be described. FIG. 11 is a block diagram showing the control system.

[0121] The substrate processing apparatus 1 is comprehensively controlled by a control unit CU. The control unit CU includes a CPU and a memory. The control unit CU transports the substrate W to the processing unit 31 based on a recipe that defines the processing procedure and conditions of the substrate W and performs processing.

[0122] The shape information storage unit 93 stores the shape information for each substrate W obtained by the substrate sensor 45 in association with the substrate W. The shape information includes the thickness of the substrate W. The shape information includes the warp of the substrate W. The shape information storage unit 93 is referred to by the control unit CU for the shape information.

[0123] The clamping information storage unit 95 stores the center position of the substrate W corresponding to the position of the guide 67 when the substrate W is held by the first hand 19. The center position of the substrate W is acquired by the control unit CU via a clamping control unit 97 to be described later and written into the clamping information storage unit 95 by the control unit CU.

[0124] The holding information storage unit 95 also stores holding information in advance according to the shape of the substrate W. The holding information is associated with each piece of shape information of the substrate W. The holding information is the biasing force applied to the guide 67. The holding information is information related to the biasing force applied to the guide 67 by the servo motor 79. The biasing force applied from the guide 67 to the substrate W and the torque applied from the servo motor 79 to the ball screw 83 are, for example, smaller as the substrate W is thinner. These biasing forces and torques are, for example, smaller as the substrate W is warped. These biasing forces and torques are, for example, larger as the substrate W is thick and has no warp.

[0125] The holding information is the biasing force and torque when the substrate W having various shapes is actually held by the first hand 19 in advance, and at that time, the substrate W and the guide 67 are not damaged and the substrate W can be held so as not to fall. The holding information may be stored in advance in a separate device (not shown) and downloaded from a host computer (not shown) via a network.

[0126] The processing unit 31 is composed of a back surface cleaning unit SSR and the like. The processing unit 31 includes the placement parts 47A and 47B described above. The processing of the processing unit 31 is controlled by the control unit CU. The control unit CU stores in advance which processing unit 31 includes the placement part 47A and which processing unit 31 includes the placement part 47B.

[0127] The indexer robot IR and the center robot CR are controlled by the control unit CU. The movement of the indexer robot IR and the center robot CR in the front-rear direction X, the width direction Y, and the vertical direction Z is operated by the control unit CU. The movement of the first hands 19, 33 and the second hands 21, 35 in the front-rear direction X is operated by the control unit CU via the horizontal movement mechanism 57.

[0128] The clamping control unit 97 independently operates the movement of each of the three guides 67. The clamping control unit 97 is operated by the control unit CU. The clamping control unit 97 operates each servo motor 79 based on an instruction from the control unit CU to independently move the three guides 67. At that time, the clamping control unit 97 operates the servo motor 79 according to the position information from the encoder 81. The clamping control unit 97 operates the drive current to the servo motor 79. The clamping control unit 97 can detect the drive current supplied to the servo motor 79.

[0129] When the clamping control unit 97 detects by the tactile sensor 73 that the guide 67 has come into contact with the outer peripheral surface of the substrate W, the clamping control unit 97 adjusts the biasing force of the guide 67 on the outer peripheral surface of the substrate W according to the shape information from the shape information storage unit 93 to clamp the substrate W. At this time, the guide 67 does not necessarily move from the outer peripheral surface side of the substrate W toward the center side. That is, the guide 67 may not move in the direction of the center of the substrate W only by increasing the torque of the servo motor 79 to strengthen the biasing force on the outer peripheral surface of the substrate W.

[0130] When the first hand 19 holds the substrate W by clamping the substrate W with the three guides 67, based on the movement distance of the guide 67 at that time, the control unit CU calculates the center position of the substrate W and stores it in the clamping information storage unit 95. Generally, the center position of the substrate W when it is clamped and stored in the clamping information storage unit 95 is deviated from the designed center position of the substrate W in the first hand 19. The clamping information, which is the center position of the substrate W stored in the clamping information storage unit 95, is referred to by the control unit CU, and the control unit CU operates the index robot IR to correct the center position when placing the substrate W on the delivery unit 15, and delivers the substrate W to the delivery unit 15.

[0131] The control system of the above-described indexer robot IR also includes the center robot CR. That is, the control system of the center robot CR includes a clamping control unit 97. Similar to the indexer robot IR, when the center robot CR clamps the substrate W with three guides 67, the center position of the substrate W is calculated, and the calculated center position is stored in the clamping information storage unit 95. The control unit CU operates the center robot CR to transfer the substrate W to and from each processing unit 31 with reference to the center position of the substrate W stored in the clamping information storage unit 95.

[0132] <9. Operation Flow>

[0133] Referring to FIGS. 12 to 22, the transfer operation of the substrate W by the indexer robot IR in the substrate processing apparatus 1 will be described. FIG. 12 is a flowchart for explaining the operation related to transfer. FIGS. 13, 15, 17, 19, 21, and 22 are schematic diagrams for explaining the operation, and are views seen from the side. FIGS. 14, 16, 18, and 20 are schematic diagrams for explaining the operation, and are views seen from the plane.

[0134] In the following description, the operation of receiving the substrate W from the carrier C will be described as an example.

[0135] Step S1 Obtain the shape information of the substrate W. When the control unit CU removes the lid CL from the carrier C by the detaching / attaching unit 43, the substrate sensor 45 obtains the shape information of each substrate W. The control unit CU stores the obtained shape information in the shape information storage unit 93 in association with each substrate W.

[0136] Step S2 Obtain the clamping information corresponding to the shape information. The control unit CU reads out the clamping information corresponding to the shape information of the substrate W received by the first hand 19 from the clamping information storage unit 95.

[0137] Step S3 As shown in FIGS. 13 and 14, the control unit CU operates the horizontal movement mechanism 57 of the indexer robot IR to move the first hand 19 into the transfer position within the carrier C. Since the first hand 19 is a pick-up hand that picks up the substrate W from below, the first hand 19 is moved below the position where the substrate W to be picked up is placed. At this time, it is preferable that the control unit CU expands the three guides 67 of the first hand 19 to the maximum extent. In other words, the guide 67 of the finger part 61 is moved forward X to the maximum extent, and the guide 67 of the pusher 87 is moved backward X to the maximum extent. Thereby, even if the placement position of the substrate W is greatly displaced, the substrate W can be surely received by the first hand 19.

[0138] Step S4 As shown in FIGS. 15 and 16, the control unit CU moves the substrate W to a height at which it can be clamped by the first hand 19. Specifically, the control unit CU operates the indexer robot IR to raise the first hand 19 in the vertical direction Z so that the substrate W is positioned above the upper surface of the finger part 61 and below the upper end of the guide 67.

[0139] Step S5 As shown in FIGS. 17 and 18, the control unit CU operates the clamping control unit 97 to move the three guides 67 of the first hand 19 toward the outer peripheral surface of the substrate W.

[0140] Step S6 The control unit CU branches the process depending on whether each guide 67 has come into contact with the outer peripheral surface of the substrate W. Step S5 is repeated until each guide 67 comes into contact with the outer peripheral surface of the substrate W. In other words, the movement of each guide 67 toward the outer peripheral surface of the substrate W is maintained until each guide 67 comes into contact with the outer peripheral surface of the substrate W. Whether or not it has come into contact with the outer peripheral surface of the substrate W is determined by the signal of the tactile sensor 73.

[0141] The control unit CU can detect, using the tactile sensor 73, that each guide 67 has come into contact with the outer peripheral surface of the substrate W. Therefore, the control unit CU can move each guide 67 at high speed until each guide 67 comes into contact with the outer peripheral surface of the substrate W. As a result, the time until the first hand 19 holds the substrate W can be shortened.

[0142] Step S7 When each guide 67 comes into contact with the outer peripheral surface of the substrate W, the following operations are performed. As shown in FIGS. 19 and 20, the control unit CU applies a biasing force (indicated by a white arrow in the figure) to the guide 67 according to the clamping information.

[0143] Specifically, the control unit CU refers to the clamping information storage unit 95 and reads out the clamping information corresponding to the substrate W. The control unit CU operates the clamping control unit 97 according to the read clamping information to bias the guide 67. As a result, the substrate W is pressed against by the guide 67 on its outer peripheral surface. Since each guide 67 is biased based on the clamping information, the substrate W can be supported by each guide 67 so that the substrate W does not fall onto the finger portion 61. Also, since each guide 67 is biased based on the clamping information, it is possible to suppress damage to the substrate W and the guide 67.

[0144] Step S8 As shown in FIG. 21, the control unit CU operates the indexer robot IR to move the first hand 19 vertically in the Z direction by a predetermined distance. Next, as shown in FIG. 22, the control unit CU operates the horizontal movement mechanism 57 of the indexer robot IR to retract the first hand 19 from the handover position of the carrier C. Note that until the substrate W is delivered to the destination, the above-described biasing force (indicated by a white arrow in the figure) is maintained.

[0145] According to the first embodiment, when the control unit CU holds the substrate W with the first hand 19, it operates the servo motor 79 to move each guide 67 to the outer peripheral surface of the substrate W. When the tactile sensor 73 detects that each guide 67 has come into contact with the outer peripheral surface of the substrate W, the control unit CU adjusts the biasing force of each guide 67 against the outer peripheral surface of the substrate W by the servo motor 79 according to the shape of the substrate W. Therefore, the clamping force can be adjusted for each shape of the substrate W, such as warpage and thickness of the substrate W. As a result, it is possible to prevent damage to the substrate W during conveyance regardless of the shape of the substrate W. Also, it is possible to prevent damage to each guide 67.

[0146] In addition, in the first embodiment, all of the guides 67 are movable, and the biasing force is adjusted for all of the three guides 67. Therefore, when clamping the substrate W, the distance by which the lower surface of the substrate W slides in the horizontal direction at the location where the substrate W is placed can be shortened. As a result, even if the center of the substrate W at the position where the substrate W is placed is deviated from the center of the first hand 19 at the delivery position where the first hand 19 has advanced, the movement of the center position of the substrate W when clamping the substrate W is minimized. Thus, particles generated due to the clamping of the substrate W can be suppressed.

[0147] The correspondence between the above-described first embodiment and the configuration of the present invention is as follows.

[0148] The indexer robot IR and the center robot CR correspond to the "substrate transfer device" in the present invention. Each guide 67 corresponds to the "movable guide" in the present invention. The moving piece 71, the servo motor 79, and the ball screw 83 correspond to the "advancing / retreating drive mechanism" in the present invention. The tactile sensor 73 corresponds to the "outer peripheral surface detector" in the present invention. The control unit CU and the clamping control unit 97 correspond to the "control unit" in the present invention. The processing unit 31 and the back surface cleaning unit SSR correspond to the "processing unit" in the present invention.

[0149] The present invention is not limited to the above-described embodiment, and can be implemented with the following modifications.

[0150] (1) In the above-described Example 1, the tactile sensor 73 was employed as the outer peripheral surface detector. However, the present invention is not limited to such a configuration. That is, as long as it is possible to detect that the guide 67 has come into contact with the outer peripheral surface of the substrate W, other detectors may be employed. For example, a proximity sensor, a reflection-type sensor, or the like may be employed as the outer peripheral surface detector.

[0151] (2) In the above-described Example 1, the tactile sensor 73 is provided at the attachment portion of the hand 67 to the finger portion 61. However, the present invention is not limited to such a form. That is, the tactile sensor 73 may be provided on the side surface of the guide 67. In this case, it is preferable that the detection surface 75 is directed toward the outer peripheral surface side of the substrate W. This is because the detection sensitivity by the tactile sensor 73 can be increased.

[0152] (3) In the above-described Example 1, the guide 67 has a cylindrical shape, but the present invention is not limited to such a form. That is, the shape of the guide 67 is not limited.

[0153] (4) In the above-described Example 1, the first hand 19 of the index robot IR was taken as an example for explanation. However, the present invention can also be applied to the second hand 21 of the index robot IR, and the first hand 33 and the second hand 35 of the center robot CR.

[0154] (5) In the above-described Example 1, a configuration in which all three guides 67 are movable is employed. However, the present invention is not limited to such a configuration. That is, the present invention may be a configuration in which at least one guide 67 is movable.

[0155] (6) In the above-described Example 1, a configuration including three guides 67 is adopted. However, the present invention is not limited to such a configuration. That is, the present invention may be a configuration including at least two or four or more guides 67. For example, the first hand 19 including two guides 67 may include one finger portion having an I-shaped configuration in a plan view, and may be configured by one arc-shaped guide 67 corresponding to the outer edge shape of the substrate W on the tip side and a pusher 87 on the base end side.

[0156] (7) In the above-described Example 1, an advancing / retreating drive mechanism is configured to move the guide 67 by the moving piece 71, the servo motor 79, and the ball screw 83. However, the present invention is not limited to such a configuration. For example, a configuration including a wire having one end connected to a spring, a guide fixedly attached to a part of the wire, and a drive unit that winds up the other end of the wire to move the wire in the front-rear direction X may be adopted.

[0157] (8) In the above-described Example 1, the guide 67 is driven to advance and retreat in the front-rear direction X with respect to the finger portion 61, but the present invention is not limited to such a configuration. For example, the guide 67 may be fixedly attached to the finger portion 61, and the finger portion 61 may be attached to the finger portion attachment portion 65 so as to be able to advance and retreat in the front-rear direction X at the finger portion attachment portion 65. Thereby, since the movable part can be arranged outside the outer peripheral surface of the substrate W, it is advantageous in terms of cleanliness.

[0158] (9) In the above-described Example 1, a tactile sensor 73 for detecting that the guide 67 abuts on the outer peripheral surface of the substrate W is provided. However, the present invention does not necessarily require the tactile sensor 73. That is, when the control unit CU moves the guide 67 toward the outer peripheral surface of the substrate W by the servomotor 79, the guide 67 may be moved with a weak driving force, and it may be determined that the guide 67 has abutted on the outer peripheral surface of the substrate W when the movement stops. Thereafter, the control unit CU may adjust the biasing force applied to the substrate W by the guide 67 based on the position information from the encoder 81. Note that, as in the above-described Example 1, detecting the outer peripheral surface of the substrate W using the tactile sensor 73 and then adjusting the biasing force can shorten the time until the substrate W is held.

[0159] (10) In the above-described Example 1, the biasing force applied to the substrate W was adjusted according to the shape of the substrate W. However, the present invention is not limited to such a form. For example, when the conveyance speed of the substrate W is high, when the substrate W is rapidly accelerated or decelerated during conveyance, or when the substrate W is rapidly turned or inverted during conveyance, the biasing force may be increased.

Embodiment

[0160] Next, Example 2 of the present invention will be described with reference to the drawings.

[0161] FIG. 23 is a side view of the hand in the substrate processing apparatus according to Example 2. The configuration of the substrate processing apparatus 1 and the like are the same as those in the above-described Example 1. Therefore, a detailed description of the substrate processing apparatus 1 will be omitted.

[0162] Hereinafter, as in the above-described Example 1, the configuration of the first hand 19 included in the indexer robot IR will be described as an example. The hand according to Example 2 is indicated by a first hand 19A.

[0163] <1. Details of the Hand>

[0164] The first hand 19A includes two finger portions 61 and one palm portion 59. The two finger portions 61 each include a guide 67. One palm portion 59 includes one guide 67. The first hand 19A includes three guides 67.

[0165] The three guides 67 are configured in the same manner as in the above-described first embodiment and move in the front-rear direction X. That is, the guide 67 is moved by the moving piece 71, the lateral hole 77, the servo motor 79, and the ball screw 83. However, the first hand 19A in the second embodiment does not include the tactile sensor 73.

[0166] <2. Control system>

[0167] Referring to FIG. 24, the control system will be described. FIG. 24 is a block diagram showing the control system in the substrate processing apparatus according to the second embodiment.

[0168] Regarding the configuration common to the above-described first embodiment, detailed description will be omitted by assigning the same reference numerals as those in the above-described first embodiment.

[0169] The control unit CU operates the indexer robot IR. In particular, regarding the holding operation of the substrate W by the first hand 19A, it is operated via the holding control unit 97A.

[0170] The holding control unit 97A is connected to the servo motor 79 and the encoder 81. The holding control unit 97A operates the servo motor 79 based on an instruction from the control unit CU to move the three guides 67. At that time, the holding control unit 97A operates the servo motor 79 according to the position information from the encoder 81. The holding control unit 97A can detect the drive current supplied to the servo motor 79 as drive current information. The holding control unit 97A determines that the guide 67 has contacted the outer peripheral surface of the substrate W based on either or both of the position information and the drive current information.

[0171] That is, when the guide 67 abuts against the outer peripheral surface of the substrate W, the movement of the guide 67 is temporarily hindered. Therefore, the displacement of the position information from the encoder 81 temporarily stops. Also, even when the guide 67 abuts against the outer peripheral edge of the substrate, in order to further move the guide 67 toward the outer peripheral surface of the substrate W, it is necessary to increase the torque of the servo motor 79. Therefore, the drive current to the servo motor 79 increases and the drive current information is displaced. Accordingly, by monitoring either one or both of the position information and the drive current information, it is possible to accurately determine that the guide 67 has abutted against the outer peripheral surface of the substrate W. After the guide 67 abuts against the outer peripheral surface of the substrate W, the clamping control unit 97A adjusts the biasing force of the guide 67 against the outer peripheral surface of the substrate W according to the shape information from the shape information storage unit 93 and clamps the substrate W.

[0172] The correspondence between the above-described Example 2 and the configuration of the present invention is as follows.

[0173] The clamping control unit 97A corresponds to the "outer peripheral surface detector" in the present invention. The control unit CU and the clamping control unit 97A correspond to the "control unit" in the present invention. The servo motor 79 corresponds to the "motor" in the present invention. The clamping control unit 97A corresponds to the "drive circuit" and the "drive current detector" in the present invention. The encoder 81 corresponds to the "position information detector" in the present invention.

[0174] According to Example 2, the control unit CU determines that the guide 67 has abutted against the outer peripheral surface of the substrate W based on at least one of the drive current information from the clamping control unit 97A and the position information from the encoder 81. Therefore, it is not necessary to provide a tactile sensor 73 or the like for detecting that the guide 67 and the outer peripheral surface of the substrate W are in contact. As a result, the structure can be simplified and the cost can be reduced.

[0175] The present invention is not limited to the above-described embodiment and can be modified as follows.

[0176] In the above-described Example 2, (3) to (8) and (10) may be adopted, excluding (1) and (2) in the modified implementation of Example 1. Further, similar to (9) in the modified implementation of Example 1, the biasing force applied to the substrate W may be adjusted without detecting that the guide 67 abuts on the outer peripheral surface of the substrate W.

Example

[0177] Next, Example 3 of the present invention will be described with reference to the drawings.

[0178] FIG. 25 is a plan view of a hand in the substrate processing apparatus according to Example 3. FIG. 26 is a view taken along the line 100-100 in FIG. 25. Note that the configuration of the substrate processing apparatus 1 is the same as that of Example 1 described above, and thus detailed description thereof will be omitted.

[0179] Hereinafter, similar to Examples 1 and 2 described above, the configuration of the first hand 19 provided in the index robot IR will be described by taking it as an example. The hand according to Example 3 is indicated by the first hand 19B.

[0180] <1. Details of the hand>

[0181] The configuration of the finger portion 61 of the first hand 19B is different from that of Examples 1 and 2. That is, the finger portion 61 is provided with guides 67A at both end portions on the front X and rear X sides, respectively. Each guide 67A is a fixed type that does not move. Each guide 67A does not move in the front-rear direction X in the finger portion 61.

[0182] The guide 67A includes an inclined surface 101 and a regulating portion 103. The inclined surface 101 is formed to be lower toward the center side of the substrate W. In other words, the inclined surface 101 is formed to be higher toward the outside than the outer peripheral surface of the substrate W. The regulating portion 103 is erected along the outer peripheral surface of the substrate W. It is preferable that the portion of the regulating portion 103 facing the outer peripheral surface of the substrate W in plan view has the same shape as the shape of the corresponding outer peripheral surface of the substrate W. This is because although the contact area increases, the substrate W can be stably held. The four guides 67A are arranged slightly outside the outer shape of the substrate W in plan view.

[0183] The guide 67A is attached to the upper surface of the finger portion 61 via a tactile sensor 73. The tactile sensor 73 is attached to the guide 67A so that the force applied to the guide 67A is transmitted to the detection surface 75.

[0184] In the first hand 19B described above, after the substrate W is placed on the inclined surface 101 of the guide 67A, the outer peripheral surface of the substrate W is urged forward in the X direction by the guide 67 of the pusher 87. As a result, the outer peripheral surface of the substrate W located in the forward X direction slides up the inclined surface 101 and is pressed against the regulating portion 103 and clamped between the guide 67 of the pusher 87 and the two guides 67A. Thereby, the substrate W is held by the first hand 19B.

[0185] The tactile sensor 73 of the guide 67A detects that the substrate W has been placed. That is, the tactile sensor 73 only needs to detect the force in the vertical direction Z. The signal from the tactile sensor 73 of the guide 67A is used in the clamping control unit 97 to determine the presence or absence of the substrate W. When it is determined in the clamping control unit 97 that the substrate W is not present, this is transmitted to the control unit CU. Also, from the state of the force applied to the four guides 67A, the clamping control unit 97 can determine the placement posture of the substrate W. If the inclination is large, since it has an adverse effect during the conveyance of the substrate W, it may be determined that the substrate W is not present.

[0186] <2. Operation Flow>

[0187] The operation will be described with reference to FIG. 27. FIG. 27 is a flowchart for explaining the operation related to conveyance. For the same steps as the operation flowchart of FIG. 12 in the first embodiment, the same reference numerals are given and detailed descriptions thereof are omitted.

[0188] Step S4a The process branches depending on whether or not it is detected that the substrate W has been placed. The clamping control unit 97 can determine the presence or absence of the substrate W including a posture defect in which the substrate W is placed obliquely based on the output of the tactile sensor 73 of each guide 67A. When the clamping control unit 97 detects the substrate W, the control unit CU proceeds to step S5. On the other hand, when the clamping control unit 97 does not detect the substrate W, it proceeds to step S4b.

[0189] Step S4b The control unit CU gives a warning. Specifically, the control unit CU emits an alarm sound from a speaker (not shown), displays a warning on a display (not shown), or blinks a warning lamp (not shown). Thereby, the operator of the apparatus can know that an abnormality has occurred.

[0190] According to the third embodiment, the tactile sensor 73 can detect that the substrate W is correctly placed on the inclined surface 101 of the guide 67A. Therefore, the presence or absence of the substrate W can be accurately detected.

[0191] The correspondence between the above-described third embodiment and the configuration of the present invention is as follows.

[0192] The tactile sensor 73 corresponds to the "placement detector" in the present invention. The guide 67 of the pusher 87 corresponds to the "movable guide" in the present invention.

[0193] The present invention is not limited to the above-described embodiments, and can be implemented with the following modifications.

[0194] In the above-described third embodiment, (3), (4) to (7) to (10) may be adopted except for (1) and (2) in the modified implementation of the first embodiment.

[0195] Also, the configuration in the third embodiment may also be adopted for the path portions 25 and 27 of the delivery unit 15. Thereby, it is possible to accurately determine whether the substrate W can be normally placed on the path portions 25 and 27, or whether the substrate W exists on the path portions 25 and 27.

Example

[0196] Next, Example 4 of the present invention will be described with reference to the drawings.

[0197] FIG. 28 is a plan view showing a schematic configuration of a substrate processing apparatus according to Example 4. FIG. 29 is a side view of the underwater attitude conversion unit.

[0198] <1. Overall configuration>

[0199] The substrate processing apparatus 1A includes a loading / unloading block 105, a stocker block 107, a transfer block 109, and a processing block 110.

[0200] The substrate processing apparatus 1A processes the substrate W. The substrate processing apparatus 1A performs, for example, chemical solution treatment, cleaning treatment, drying treatment, etc. on the substrate W. The substrate processing apparatus 1 adopts a processing method (so-called hybrid method) that combines a batch type and a single-wafer type. The batch type processes a plurality of substrates W in a vertically oriented state all at once. The single-wafer type processes a single substrate W in a horizontally oriented state.

[0201] <2. Loading / unloading block>

[0202] The loading / unloading block 3 includes a loading section 111 and a discharging section 113. The loading section 111 and the discharging section 113 are arranged in the width direction Y. A plurality of substrates W (for example, 25 sheets) are stacked and stored horizontally at a constant interval within one carrier C. The carrier C storing the untreated substrates W is placed on the loading section 111. The loading section 111 includes, for example, two mounting tables 115 on which the carrier C is placed. The carrier C has a plurality of grooves (not shown) formed therein for accommodating the substrates W one by one while separating the surfaces of the substrates W from each other. As the carrier C, for example, there is a FOUP (Front Opening Unify Pod). The FOUP is a sealed container. The carrier C may be an open container, regardless of the type.

[0203] The discharging section 113 is disposed on the opposite side of the loading section 111 across the central portion in the width direction Y in the substrate processing apparatus 1A. The discharging section 113 is arranged to the left of the loading section 111 in the Y direction. The discharging section 113 stores the processed substrates W in the carrier C and discharges the entire carrier C. The discharging section 113 functioning in this way includes, like the loading section 111, for example, two mounting tables 117 for placing the carrier C. The loading section 111 and the discharging section 113 are also called load ports.

[0204] <3. Stocking Block>

[0205] The stocking block 107 is arranged adjacent to the rear of the loading / unloading block 105 in the X direction. The stocking block 107 includes a transfer and storage section ACB. The transfer and storage section ACB includes a transfer mechanism 119 and a shelf 121.

[0206] The transfer mechanism 119 transfers the carrier C. The transfer and storage unit ACB includes a plurality of shelves 121. On the shelves 121, there are those where the carrier C is simply temporarily placed and those where the carrier C is placed for transfer between the first transfer mechanism HTR. The transfer and storage unit ACB takes in the carrier C containing the unprocessed substrate W from the input unit 111 and places it on the shelf 121. The transfer and storage unit ACB transfers and places the carrier C on the transfer-purpose shelf 121 according to the schedule that defines the processing order. The transfer and storage unit ACB transfers and places the carrier C that has been placed on the transfer-purpose shelf 121 and has become empty back on the shelf 121. The transfer and storage unit ACB transfers and places the carrier C that has been placed on the transfer-purpose shelf 121 and in which the processed substrate W has been stored by the first transfer mechanism HTR back on the shelf 121. The transfer and storage unit ACB carries out the carrier C in which the processed substrate W has been stored and that has been placed on the shelf 121 to the delivery unit 113.

[0207] <4. Transfer Block>

[0208] The transfer block 109 is arranged adjacent to the rear X of the stocker block 107. The transfer block 109 includes a first transfer mechanism HTR, a transfer mechanism CTC, and a second transfer mechanism WTR.

[0209] The first transfer mechanism HTR transfers a plurality of substrates W collectively. The first transfer mechanism HTR collectively takes out a plurality of substrates W (for example, 25 sheets) from the carrier C placed on the transfer-purpose shelf 121 in the transfer and storage unit ACB and transfers them to the transfer mechanism CTC. The transfer mechanism CTC transfers a plurality of substrates W between the first transfer mechanism HTR and the second transfer mechanism WTR.

[0210] The second transfer mechanism WTR is configured to be movable across the transfer block 109 and the processing block 110. The second transfer mechanism WTR transfers a plurality of unprocessed substrates W to the processing block 110. The second transfer mechanism WTR includes a pair of hands 123 for transferring a lot.

[0211] <5. Processing Block>

[0212] The processing block 110 performs processing on the substrate W. The processing block 110, excluding the second transfer mechanism WTR, is divided, for example, into a first row R1, a second row R2, and a third row R3 in the width direction Y.

[0213] <5-1. First row>

[0214] The first row R1 mainly includes a batch processing unit. Specifically, the first row R1 includes a first batch processing unit BPU1, a second batch processing unit BPU2, a third batch processing unit BPU3, and an underwater attitude conversion unit 125.

[0215] The first batch processing unit BPU1 performs, for example, chemical solution processing. The chemical solution processing is, for example, phosphoric acid processing. The phosphoric acid processing uses phosphoric acid as the processing solution. The phosphoric acid processing performs etching processing on a plurality of substrates W. The etching processing chemically removes, for example, the film thickness of the film deposited on the substrate W. The film is, for example, a nitride film.

[0216] The first batch processing unit BPU1 includes a processing tank 127 and a lifter LF1. The processing tank 127 stores the processing solution. The lifter LF1 moves up and down in the vertical direction Z. Specifically, the lifter LF1 moves up and down between a processing position corresponding to the inside of the processing tank 127 and a transfer position corresponding to above the processing tank 127. The lifter LF1 holds a plurality of substrates W in a vertical posture. The lifter LF1 transfers a plurality of substrates W to and from the second transfer mechanism WTR at the transfer position.

[0217] The second batch processing unit BPU2 performs, for example, chemical solution processing. The second batch processing unit BPU2 has the same configuration as the first batch processing unit BPU1. That is, the second batch processing unit BPU2 of the chemical solution processing unit CHB2 includes a processing tank 127 and a lifter LF2.

[0218] The third batch processing unit BPU3 performs, for example, pure water washing processing. The third batch processing unit BPU3 has a configuration similar to that of the first batch processing unit BPU1 and the second batch processing unit BPU2. Specifically, it includes a processing tank 127 and a lifter LF3. However, the processing tank 127 is mainly supplied with pure water for pure water washing processing.

[0219] <5-2. Second column>

[0220] The second column R2 is provided with a center robot CR. The center robot CR is provided with a first hand 33A and a second hand 35A having a configuration similar to that of the above-described first hand 33 and second hand 35. The first hand 33A and the second hand 35A hold one substrate W. The center robot CR is configured to be movable in the front-rear direction X. The center robot CR is configured to be movable up and down in the vertical direction Z. The center robot CR is configured to be rotatable within a horizontal plane including the front-rear direction X and the width direction Y. The first hand 33A and the second hand 35A are configured to be retractable within a horizontal plane including the front-rear direction X and the width direction Y. The first hand 33A and the second hand 35A receive the substrates W one by one from the underwater posture conversion unit 125. The center robot CR delivers the substrates W one by one to the third column R3.

[0221] <5-3. Third column>

[0222] The third column R3 mainly includes a single-wafer processing unit. Specifically, the third column R3 includes a first single-wafer processing unit SWP1, a second single-wafer processing unit SWP2, a third single-wafer processing unit SWP3, and a buffer unit 131.

[0223] The first wafer processing unit SWP1 and the second wafer processing unit SWP2 include, for example, a rotation processing unit 133 and a nozzle 135. The rotation processing unit 133 rotationally drives the substrate W in a horizontal plane. The nozzle 135 supplies a processing liquid to the substrate W. The processing liquid is, for example, IPA (isopropyl alcohol) or pure water. The first wafer processing unit SWP1 and the second wafer processing unit SWP2 perform a preliminary drying process with IPA after performing a cleaning process on the substrate W with pure water, for example.

[0224] The third wafer processing unit SWP3 includes, for example, a supercritical fluid chamber 137. The supercritical fluid chamber 137 performs a drying process with a supercritical fluid, for example. The fluid used at this time is, for example, carbon dioxide. The supercritical chamber 137 processes the substrate W by bringing the processing liquid into a supercritical state. The supercritical state is obtained by setting the fluid to the critical temperature and critical pressure specific to the fluid. Specifically, when the fluid is carbon dioxide, the critical temperature is 31°C and the critical pressure is 7.38 MPa. In the supercritical state, the surface tension of the fluid becomes zero. Therefore, the gas-liquid interface does not affect the pattern on the substrate W. Therefore, pattern collapse on the substrate W is less likely to occur.

[0225] The buffer unit 131 includes, for example, a plurality of stacked shelves 139. The plurality of shelves 139 can accommodate at least one lot of substrates W. Since the first transfer mechanism HTR can take out a plurality of substrates W at once, the burden on the first transfer mechanism HTR can be reduced compared to the case of taking out the substrates W one by one. The buffer unit 131 can be accessed from a plurality of different horizontal directions. The center robot CR accesses the buffer unit 139 to place the substrate W from the second row R2 side toward the right Y. The first transfer mechanism HTR accesses the buffer unit 139 to receive one lot of substrates W from the front X to the rear X.

[0226] It is preferable that the above-described first wafer processing unit SPW1, second wafer processing unit SWP2, and third wafer processing unit SWP3 each have similar processing units stacked in multiple stages in the vertical direction Z. Thereby, the throughput can be improved.

[0227] <6. In-Water Posture Conversion Unit>

[0228] Here, the in-water posture conversion unit 125 will be described. FIG. 29 is a side view of the in-water posture conversion unit.

[0229] The in-water posture conversion unit 125 includes a posture conversion unit 141, a dipping tank 143, a lifter LF4, and a pusher 145. The posture conversion unit 141 includes an in-tank carrier 147 and a rotation mechanism 149.

[0230] The in-tank carrier 147 stores a plurality of substrates W in a vertical posture. The in-tank carrier 147 stores a plurality of substrates W at a predetermined interval in a predetermined alignment direction. The in-tank carrier 147 has an opening formed at the bottom. The in-tank carrier 147 has an opening formed on the upper surface.

[0231] The dipping tank 143 houses the in-tank carrier 147. The dipping tank 143 is provided with ejection pipes 143a at both ends in the front-rear direction X on the bottom surface. Each ejection pipe 143a forms an upward flow of pure water from the bottom of the dipping tank 143. The pure water supplied to the dipping tank 143 from each ejection pipe 143a is discharged over the upper edge of the dipping tank 143.

[0232] The rotation mechanism 149 rotates the in-tank carrier 147 around a horizontal axis. The rotation mechanism 149 rotates the in-tank carrier 147 inside the dipping tank 143.

[0233] The lifter LF4 includes a back plate portion 163 and a support portion 165. The back plate portion 163 extends along the inner surface of the dipping tank 143. For example, two support portions 165 are attached to the lower end portion of the back plate portion 163. The lifter LF4 supports the in-tank carrier 47 such that the longitudinal direction thereof is in a horizontal posture.

[0234] Near the lifter LF4, a lifting mechanism 167 is arranged. The lifting mechanism 167 includes a motor 169, a ball screw 171, a linear guide 173, and a lifting piece 175. The ball screw 171 is attached to the rotating shaft of the motor 169. The linear guide 173 is provided in parallel with the ball screw 171. The lifting piece 175 is screwed onto the ball screw 171. One side of the lifting piece 175 is slidably attached to the linear guide 173. The other side of the lifting piece 175 is attached to a connecting member 177. The connecting member 177 has an inverted L shape. The connecting member 177 is coupled to the upper end of the back plate portion 163.

[0235] When the motor 169 rotates, the lifter LF4 moves up and down at a plurality of height positions.

[0236] For example, the lifter LF4 is moved up and down by the lifting mechanism 167 over a first height position P1, a second height position P2, a third height position P3, and a fourth height position P4.

[0237] At the first height position P1, the support portion 165 of the lifter LF4 is located near the bottom surface of the immersion tank 43. The first height position P1 is a position where the in-tank carrier 147 is clamped by the rotating mechanism 149 and the support portion 165 is separated from the lower surface of the in-tank carrier 147. At the first height position P1, the in-tank carrier 147 is longitudinally rotated in the immersion tank 43 by the rotating mechanism 149.

[0238] The second height position P2 is a position that supports the entire in-tank carrier 147 below the liquid level of the immersion tank 143. At the second height position P2, the opening on the upper surface of the in-tank carrier 47 is located below the liquid level. The second height position P2 is a position where the clamping operation on the in-tank carrier 47 is performed by the rotating mechanism 49.

[0239] The third height position P3 is a position where a plurality of substrates W are transferred between the second transfer mechanism WTR and the in-tank carrier 147. The third height position P3 is, for example, a position where the support portion 165 of the lifter LF4 is located above the liquid level of the immersion tank 143.

[0240] The fourth height position P4 maintains the in-tank carrier 147 with a plurality of substrates W in a horizontal posture below the water surface in the immersion tank 143. The stepped position from the fourth height position P4 to the third height position P3 is the height position where only the substrate W to be transported by the center robot CR is positioned above the liquid surface of the immersion tank 143.

[0241] The immersion tank 143 has a through hole 179 formed in the bottom. A pusher 145 is attached to the through hole 179 so as to be movable up and down. The pusher 45 can support a plurality of substrates W collectively. The pusher 45 can move up and down through the in-tank carrier 147 in the vertical direction Z.

[0242] <7. Details of the Hand>

[0243] Referring to FIG. 30, among the first hand 33A and the second hand 35A of the center robot CR, the first hand 33A will be described as an example. FIG. 30 is a plan view of the hand in the substrate processing apparatus according to the fourth embodiment as viewed from below. The second hand 35A has the same configuration as the following first hand 33A.

[0244] The first hand 33A has the same configuration as the first hand 19 in the first embodiment. Here, for the same configuration as the first hand 19, detailed description will be omitted by attaching the same reference numerals. However, the first hand 33A is, for example, a pick-up hand. Therefore, unlike the first hand 19, the first hand 33A is provided with a guide 67 on the lower surface.

[0245] The first hand 33A includes a beam portion 181 between two finger portions 61. The beam portion 181 is preferably provided at the central portion in the front-rear direction X of the substrate W to be held. The beam portion 181 includes a nozzle 183. The nozzle 183 is preferably provided at the central portion in the width direction Y. The beam portion 181 has the nozzle 183 formed thereon. The nozzle 183 is an opening. One end side of a flow path 185 is communicatively connected to the nozzle 183. The flow path 185 is formed to penetrate through the beam portion 181, one finger portion 61, and the palm portion 59. The other end side of the flow path 185 is communicatively connected to a processing liquid supply source (not shown).

[0246] The nozzle 183 discharges the processing liquid. The nozzle 183 supplies the processing liquid to the upper surface of the substrate W. The processing liquid is, for example, pure water. The nozzle 183 moves together with the first hand 33A.

[0247] <8. Operation description>

[0248] <8-1. Batch processing>

[0249] It is assumed that a plurality of substrates W are subjected to an etching process with phosphoric acid in the first batch processing unit BPU1, and then subjected to a pure water washing process in the third batch processing unit BPU3. The plurality of substrates W that have undergone the pure water washing process are transported to the underwater posture conversion unit 125 by the second transport mechanism WTR.

[0250] <8-2. Posture conversion>

[0251] The second transfer mechanism WTR clamps a plurality of substrates W that have been processed in the third batch processing unit BPU3 with the hand 123 and transfers them above the underwater attitude conversion unit 125. At this time, in the underwater attitude conversion unit 125, the support portion 165 of the lifter LT4 is positioned at the second height position P2. The in-tank carrier 147 is held by the support portion 165. In the immersion tank 143, pure water overflows around from the upper edge. As a result, the immersion tank 143 is always filled with normal pure water. The rotation mechanism 149 is separated from the in-tank carrier 147. The pusher 145 is raised from the standby position to the transfer position in the immersion tank 143. As a result, the lower edges of the plurality of substrates W held by the second transfer mechanism WTR are abutted and supported by the pusher 145.

[0252] The second transfer mechanism WTR releases the clamping of the hand 123 and releases a plurality of substrates W. As a result, the plurality of substrates W are transferred from the second transfer mechanism WTR to the pusher 145. Next, the second transfer mechanism WTR retracts from above the underwater attitude conversion unit 125.

[0253] The lifting mechanism 167 drives the motor 169 to raise the lifter LF4 to the transfer position. Specifically, the lifter LF4 is raised to the third height position P3. As a result, the plurality of substrates W whose lower edges are supported by the pusher 145 are stored in the in-tank carrier 147.

[0254] The pusher 145 is lowered to the standby position. As a result, the plurality of substrates W are completely stored in the in-tank carrier 147.

[0255] The lifting mechanism 167 rotationally drives the motor 169 to lower the lifter LF4 to the second height position P2.

[0256] The rotation mechanism 149 clamps the in-tank carrier 147. The in-tank carrier 147 is clamped in a state where the lower part is supported by the lifter LF4. Next, the motor 169 of the lifting mechanism 167 is rotationally driven to lower the lifter LF4 to the first height position P1. As a result, the in-tank carrier 147 is in a state of being clamped only by the rotation mechanism 149.

[0257] Actuate the rotation mechanism 149 of the posture conversion unit 141. Specifically, rotationally drive the rotation mechanism 149 to rotate the in-tank carrier 147 around the axis in the front-rear direction X. The rotation angle is 90°. As a result, the in-tank carrier 147 changes from a horizontal posture (horizontally long state) to a vertical posture (vertically long state). Accordingly, the postures of the plurality of substrates W are converted from a vertical posture to a horizontal posture. At this time, the plurality of substrates W remain immersed in the pure water in the immersion tank 143. When the posture conversion is performed, even a part of the plurality of substrates W does not expose from the pure water.

[0258] Lift the lifter LF4 to the fourth position P4 by the lifting mechanism 167. As a result, the holding portion 165 of the lifter LF4 holds the in-tank carrier 147 that has been set in the vertical posture in the liquid. Further, deactivate the rotation mechanism 149. The in-tank carrier 147 is held only by the lifter LF4.

[0259] Lift the lifter LF4 from the fourth position P4 by the lifting mechanism 167, and lift it to a position where only the uppermost substrate W in the in-tank carrier 147 is exposed from the liquid surface. This substrate W is an object to be conveyed by the center robot CR. As a result, the uppermost substrate W is exposed upward from the liquid surface of the immersion tank 143 in a state where the pure water stored in the immersion tank 143 is filled on the upper surface. In this state, the center robot CR advances the first hand 33A into the in-tank carrier 147 and unloads the uppermost substrate W.

[0260] When the center robot CR moves to the underwater posture conversion unit 125 to convey the next substrate W, the lifting mechanism 167 further lifts the lifter LF4. As a result, only the next one substrate W is exposed upward from the liquid surface of the immersion tank 143. In this state, the center robot CR unloads the substrate W. Thus, each time the center robot CR moves, the lifting mechanism 167 gradually lifts the lifter LF4. As a result, all the substrates W are conveyed by the center robot CR while remaining wet with pure water.

[0261] In this way, the substrate W that is not to be conveyed by the center robot CR is located below the liquid level of the immersion tank 143. Therefore, it is possible to prevent the substrate W from drying until it becomes an object to be conveyed by the center robot CR. As a result, the collapse of the pattern on the substrate W can be suppressed.

[0262] <8-3. Single-wafer processing>

[0263] The substrate W conveyed by the center robot CR as described above is processed, for example, as follows.

[0264] The center robot CR conveys the substrate W to the first single-wafer processing unit SWP1. At this time, it is preferable to supply pure water from the nozzle 183 to the upper surface of the substrate W. Thereby, it is possible to suppress the pure water from spilling from the upper surface when the substrate W is conveyed and the pattern of the substrate W from collapsing.

[0265] The first single-wafer processing unit SWP1, for example, supplies pure water from the nozzle 135 while rotating the substrate W in the rotation processing unit 133. Then, IPA is supplied from the nozzle 35 to the substrate W to replace the pure water on the substrate W with IPA. Then, the substrate W is carried out by the center robot CR and conveyed to the third single-wafer processing unit SWP3. In the third single-wafer processing unit SWP3, the substrate W is carried into the supercritical fluid chamber 137. The substrate W is dried by carbon dioxide in the supercritical fluid chamber 137. The finish drying process is performed on the substrate W by the drying process in the supercritical fluid chamber 137. Thereby, the substrate W is completely dried, but the collapse of the pattern formed on the substrate W is suppressed.

[0266] The substrate W that has been processed in the supercritical fluid chamber 137 is transported to the buffer section 131 by the center robot CR. The center robot CR places the substrate W on the placement shelf 139 of the buffer section 131. When one lot of the substrate W is placed on the buffer section 131, the first transfer mechanism HTR transfers a plurality of the substrate W to the transfer and storage section ACB at once. The transfer and storage section ACB transfers each carrier C to the dispensing section 113. The single-wafer processing and subsequent transfer as described above are performed for all the substrate W in the in-tank carrier 147. Thereby, batch processing and single-wafer processing can be performed for all of the plurality of substrate W.

[0267] According to the fourth embodiment, a plurality of substrate W that have been processed in the third batch processing section BPU3 are transported to the posture conversion section 141 by the second transfer mechanism WTR. At this time, until the posture conversion is performed, the plurality of substrate W are immersed in pure water in the immersion tank 143. Therefore, when the posture of the plurality of substrate W in the vertical posture is converted to the horizontal posture, the entire substrate W can always be in a wet state. As a result, even when the substrate W is transported by the center robot CR for single-wafer processing, the collapse of the pattern on the substrate W can be suppressed.

[0268] Furthermore, the first hand 33A of the center robot CR is provided with a nozzle 183. Therefore, even if pure water spills from the substrate W during transportation, pure water can be supplied from the nozzle 183. Therefore, it is not necessary to transport at a low speed so that pure water does not spill from the substrate W. As a result, in addition to the effects of the first embodiment described above, there is an effect that the decrease in throughput can be suppressed even when the substrate W is transported in a wet state.

[0269] In addition, since the nozzle 183 is provided on the beam portion 181 suspended between the two finger portions 61, the processing liquid can be supplied to the center portion of the substrate W. Therefore, the processing liquid can be evenly supplied to the entire surface of the substrate W.

[0270] The correspondence between the above-described fourth embodiment and the configuration of the present invention is as follows.

[0271] The center robot CR corresponds to the "substrate transfer device" in the present invention. The two finger portions 61 correspond to the "two extending portions" in the present invention. The first batch processing unit BPU1, the second batch processing unit BPU2, the third batch processing unit BPU3, the underwater attitude conversion unit 125, the first wafer processing unit SWP1, the second wafer processing unit SWP2, and the third wafer processing unit SWP3 correspond to the "processing unit" in the present invention.

[0272] The present invention is not limited to the above-described embodiments, and can be implemented with the following modifications.

[0273] (1) In each of the above-described Examples 1 to 4, the configurations of the substrate processing apparatuses 1 and 1A were described as examples, but the present invention is not limited to substrate processing apparatuses having such configurations.

[0274] (2) In each of the above-described Examples 1 to 4, the case of processing the circular substrate W was described as an example, but the substrate W is not limited to a circular shape.

[0275] (3) In each of the above-described Examples 1 to 4, a configuration in which only one of the upper hand or the lower hand is adopted was illustrated. However, for example, the center robot CR of the substrate processing apparatus 1 includes the first hand 33 and the second hand 35, and hands with different picking methods may be adopted.

[0276] For example, in the center robot CR, the first hand 33 is an upper hand, and the second hand 35 is configured as a lower hand. Further, the first hand 33 and the second hand 35 may be selectively used according to the clearance CL1 of the mounting portion 47A and the clearance CL2 of the mounting portion 47B provided in the processing unit 31.

[0277] Therefore, an appropriate hand (the first hand 33 or the second hand 35) can be selected according to the clearances CL1 and CL2 related to the transfer of the substrate W in the processing unit 31, and the substrate W can be reliably transferred.

Explanation of Reference Numerals

[0278] 1,1A … Substrate processing apparatus W … Substrate 3 … Loading / unloading block 5 … Indexer block 7 … Processing block C … Carrier IR … Indexer robot 19 … First hand 21 … Second hand 31 … Processing unit SSR … Back surface cleaning unit CR … Center robot 33 … First hand 35 … Second hand 45 … Substrate sensor 47A, 47B … Mounting part CL1, CL2 … Clearance 57 … Horizontal movement mechanism 59 … Palm part 61 … Finger part 63 … Mounting base end part 65 … Finger part mounting part 67 … Guide 69 … Guide hole 71 … Moving piece 73 … Tactile sensor 75 … Detection surface 79 … Servo motor 81 … Encoder 83 … Ball screw 87 … Pusher CU … Control unit 93 … Shape information storage part 95 … Clamping information storage part 97 … Clamping control part

Claims

1. In a substrate transfer device for transferring a substrate, a hand for holding the substrate in a horizontal posture; a horizontal drive mechanism for driving the hand to move forward and backward in a horizontal plane to transfer the substrate; at least two guides provided on the hand, for sandwiching the outer peripheral surface of the substrate and holding the substrate while separating it from the hand; among the at least two guides, a forward and backward drive mechanism for driving at least one guide as a movable guide to move forward and backward with respect to the substrate; a control unit for adjusting the biasing force applied to the outer peripheral surface of the substrate by the movable guide by controlling the forward and backward drive mechanism; A substrate transfer device, characterized by comprising the above.

2. In the substrate transfer device according to Claim 1, the control unit adjusts the biasing force applied to the outer peripheral surface of the substrate by the movable guide according to the shape of the substrate. A substrate transfer device characterized by this.

3. In the substrate transfer device according to Claim 2, the control unit adjusts the biasing force applied to the outer peripheral surface of the substrate by the movable guide to decrease as the thickness of the substrate decreases. A substrate transfer device characterized by this.

4. In the substrate transfer device according to Claim 2, the control unit adjusts the biasing force applied to the outer peripheral surface of the substrate by the movable guide to decrease as the warp of the substrate increases. A substrate transfer device characterized by this.

5. In the substrate transfer device according to Claim 1, further comprising an outer peripheral surface detector for detecting that the movable guide has contacted the outer peripheral surface of the substrate, the control unit adjusts the biasing force after detecting that the movable guide has contacted the outer peripheral surface of the substrate by the outer peripheral surface detector. A substrate transfer device characterized by this.

6. In the substrate transfer device according to Claim 1, all of the guides are the movable guides, when holding the substrate with the hand, the control unit operates each of the forward and backward drive mechanisms to move all of the movable guides to the outer peripheral surface of the substrate, and adjusts the biasing force for all of the movable guides by each of the forward and backward drive mechanisms. A substrate transfer device characterized by this.

7. In the substrate transfer device according to Claim 5, the outer peripheral surface detector is a tactile sensor having a detection surface capable of detecting the forces applied to each of the three orthogonal axes. A substrate transfer device characterized by this.

8. In the substrate transfer device according to Claim 5, The forward and backward drive mechanism includes a motor for driving the guide forward and backward, a drive circuit for applying a drive current for driving the motor, and an encoder for detecting the rotational position of the motor. The outer peripheral surface detector includes at least one of a drive current detector for detecting the contact based on the drive current information of the drive circuit and a position information detector for detecting the contact based on the position information output from the encoder. The control unit is characterized in that it determines the contact based on at least one of the drive current information and the position information. A substrate transfer device.

9. In the substrate transfer device according to claim 5, The outer peripheral surface detector is provided at a portion of the movable guide that is attached to the hand. A substrate transfer device.

10. In the substrate transfer device according to claim 1, The guide is attached to the lower surface of the hand. A substrate transfer device.

11. In the substrate transfer device according to claim 1, The guide has a cylindrical shape. A substrate transfer device.

12. In the substrate transfer device according to claim 1, The guide includes an inclined surface that becomes lower toward the center side of the substrate and a clamping portion erected along the outer peripheral surface of the substrate. When receiving the substrate, the hand presses and clamps the substrate against the clamping portion by applying a biasing force to the outer peripheral surface of the substrate by the movable guide after the substrate is once placed on the inclined surface. The guide is provided with a placement detector for detecting that the substrate is placed on the inclined surface. A substrate transfer device.

13. In the substrate transfer device according to claim 1, The hand further includes a nozzle for supplying a processing liquid to the upper surface of the substrate clamped by the guide. A substrate transfer device.

14. In the substrate transfer device according to claim 13, The hand includes two extending portions extending from the base end portion to the tip end portion, and a beam portion suspended from the two extending portions so as to pass through the central portion of the substrate clamped by the hand. The nozzle is provided on the beam portion and supplies a processing liquid to the substrate clamped by the hand. A substrate transfer device.

15. In the substrate transfer device according to claim 1, The hand is composed of two types: an upper hand having the guide on the lower surface and a lower hand having the guide on the upper surface. According to the clearance, which is the distance between the upper surface of the placement part that is the transfer destination and the lower surface of the substrate, the lower take - hand is used for the placement part with a large clearance, and the upper take - hand is used for the placement part with a small clearance, and the substrate is transferred between the placement part. A substrate transfer device characterized by this.

16. The substrate transfer device according to any one of Claims 1 to 15, A processing unit that performs a predetermined process on the substrate, A substrate processing device characterized by comprising this.

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