Substrate conveyance device and substrate processing device including the same

Abstract

To provide a substrate conveyance device capable of efficiently conveying various types of substrates.SOLUTION: When both a first sensor 22a and a second sensor 22b detect that a substrate W is mounted on a first guide 32a and a second guide 32b, switching of a pusher 35 from an open state to a close state is permitted. On the other hand, when at least the one sensor of the first sensor 22a and the second sensor 22b does not detect the substrate W, switching of the pusher 35 from the open state to the close state is prohibited.SELECTED DRAWING: Figure 12

Description

Technical Field

[0001] The present invention relates to a substrate transfer device for transferring various substrates such as semiconductor substrates, substrates for flat panel displays (FPDs) such as liquid crystal displays and organic EL (Electroluminescence) display devices, glass substrates for photomasks, and substrates for optical discs, and a substrate processing device including the same.

Background Art

[0002] Conventionally, as a substrate transfer device for realizing substrate transfer required for substrate processing, there is one having a hand body portion with a plurality of tactile sensors. When a substrate is placed on the plurality of tactile sensors, the tactile sensors detect a force in the Z-axis direction. In this way, it is possible to recognize that the substrate is normally placed on the hand body portion. In addition, the tactile sensors can also detect an angular deviation of the hand body portion in the Z-axis direction.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, the conventional substrate transfer device equipped with tactile sensors is not configured to fully utilize the tactile sensors. For example, according to the configuration of Patent Document 1, it only detects an abnormality in substrate transfer using the tactile sensors.

[0005] Currently, there is a demand for a substrate transfer device that can transfer various types of substrates. Such a substrate transfer device needs to realize substrate transfer based on a plurality of transfer modes. Although it is considered that the tactile sensors can detect the situation of the substrate placed on the hand body portion, the specific configuration for realizing this has not been studied.

[0006] The present invention has been made in view of such circumstances, and an object thereof is to provide a substrate transfer device capable of efficiently transferring various types of substrates and a substrate processing device including the same.

Means for Solving the Problems

[0007] That is, the present invention is a substrate transfer device having a hand capable of transferring a substrate in a horizontal posture, wherein the hand includes a base member, a first guide provided on the upper surface of the base member, which supports the lower part of the periphery of the substrate and contacts the outer peripheral surface of the substrate, a first sensor for detecting that the substrate is placed on the first guide, a second guide provided on the upper surface of the base member, which supports the lower part of the periphery of the substrate and contacts the outer peripheral surface of the substrate, a second sensor for detecting that the substrate is placed on the second guide, a pusher provided on the upper surface of the base member opposite to the first guide and the second guide, and capable of advancing and retreating toward the first guide and the second guide, a pusher driving unit for advancing and retreating the pusher, a control unit for controlling the pusher driving unit, wherein the control unit can switch between an open state in which the pusher is separated from the outer peripheral surfaces of the substrates placed on the first guide and the second guide, and a closed state in which the pusher contacts the outer peripheral surface of the substrate and presses the substrate against the first guide and the second guide to clamp the substrate, and the control unit when receiving the substrate with the hand with the pusher in the open state, allows the pusher to change from the open state to the closed state when both the first sensor and the second sensor detect that the substrate is placed on the first guide and the second guide, respectively. When at least one of the first sensor and the second sensor does not detect the substrate, the pusher is prohibited from changing from the open state to the closed state.

[0008] [Function and Effect] According to the above configuration, there are provided a first sensor for detecting that a substrate is placed on the first guide, a second sensor for detecting that a substrate is placed on the second guide, and a pusher provided opposite to the first guide and the second guide and capable of advancing and retreating toward the first guide and the second guide. When both the first sensor and the second sensor detect that the substrate is placed on the first guide and the second guide respectively, the pusher is allowed to change from the open state to the closed state. When at least one of the first sensor and the second sensor does not detect the substrate, the pusher is prohibited from changing from the open state to the closed state. With such a configuration, the situation of the substrate can be grasped by using the first sensor and the second sensor. That is, when both the first sensor and the second sensor detect that the substrate is placed on the first guide and the second guide respectively, it can be determined that the shape of the substrate is close to flat. On the other hand, when at least one of the first sensor and the second sensor does not detect the substrate, it can be determined that the shape of the substrate is far from flat. In this way, if the situation of the substrate is known, it is possible to appropriately control the opening and closing of the pusher according to the situation of the substrate. Therefore, according to the present invention, a substrate transfer device capable of efficiently transferring various types of substrates can be provided.

[0009] Also, in the above-described substrate transfer device, when both the first sensor and the second sensor detect that the substrate is placed on the first guide and the second guide respectively, the control unit compares the time when the first sensor detects that the substrate is placed on the first guide with the time when the second sensor detects that the substrate is placed on the second guide, and obtains the time difference between the two, when the time difference is within a predetermined reference time difference, the pusher is allowed to change from the open state to the closed state, When the time difference exceeds a predetermined reference time difference, it is preferable to prohibit the pusher from changing from the open state to the closed state.

[0010] [Function and Effect] According to the above configuration, even when both the first sensor and the second sensor detect that the substrate is placed on the first guide and the second guide respectively, the situation of the substrate can be accurately detected. That is, according to the above configuration, the time difference between the time when the first sensor detects that the substrate is placed on the first guide and the time when the second sensor detects that the substrate is placed on the second guide is obtained by comparing the two. If the obtained time difference is within the standard time difference, it can be determined that the shape of the substrate is close to flat. Also, when the obtained time difference exceeds the standard time difference, it can be determined that the shape of the substrate is far from flat. In this way, if the situation of the substrate is known, it is possible to appropriately control the opening and closing of the pusher according to the situation of the substrate. Therefore, according to the present invention, a substrate transfer device capable of efficiently transferring various types of substrates can be provided.

[0011] Also, in the above-described substrate transfer device, it is provided with a transfer mechanism for moving the hand, the transfer mechanism is switchable between a mode of moving the hand at a first moving speed and a mode of moving at a second moving speed slower than the first moving speed, the control unit, when both the first sensor and the second sensor detect that the substrate is placed on the first guide and the second guide respectively, the time difference between the time when the first sensor detects that the substrate is placed on the first guide and the time when the second sensor detects that the substrate is placed on the second guide is obtained by comparing the two, when the time difference is within a predetermined reference time difference, the substrate is clamped by closing the pusher from the open state, furthermore, the transfer mechanism is controlled to move the hand holding the substrate at the first moving speed, On the other hand, when at least one of the first sensor and the second sensor does not detect the substrate, and when the time difference exceeds a predetermined reference time difference, the pusher is prohibited from changing from the open state to the closed state, and the substrate is not clamped, Furthermore, it is preferable to control the transfer mechanism to move the hand at the second moving speed with the substrate not being clamped by the pusher.

[0012] [Operation and Effect] According to the above configuration, it is possible to switch between a mode in which the hand is moved at the first moving speed and a mode in which the hand is moved at a second moving speed slower than the first moving speed. And if the obtained time difference is within the reference time difference, the substrate is clamped by closing the pusher from the open state, and then the hand is moved at the first moving speed. And if the obtained time difference exceeds the reference time difference, the pusher is prohibited from changing from the open state to the closed state, and then the hand is moved at the second moving speed. In addition, even when the pusher is prohibited from changing from the open state to the closed state, the hand is moved at the second speed. With this configuration, a substrate transfer device with high throughput can be realized.

[0013] Also, in the above-described substrate transfer device, the control unit, when at least one of the first sensor and the second sensor does not detect the substrate, and when the time difference exceeds a predetermined reference time difference, instead of moving the hand at the second moving speed with the substrate not being clamped by the pusher, it is preferable to return the substrate to the original slot.

[0014] [Operation and Effect] According to the above configuration, when the pusher is prohibited from changing from the open state to the closed state, the transfer of the substrate is stopped, and the substrate is returned to the original slot. With this configuration, a substrate transfer device can be provided that does not transport a substrate far from being flat and suppresses dropping of the substrate.

[0015] Also, in the above-described substrate transfer device, the first guide includes a support portion that supports the lower part of the periphery of the substrate and a wall portion that contacts the outer peripheral surface of the substrate. It is preferable that the second guide includes a support portion that supports the lower part of the periphery of the substrate and a wall portion that contacts the outer peripheral surface of the substrate.

[0016] [Function and Effect] According to the above-described configuration, the first guide includes a support portion that supports the lower part of the periphery of the substrate and a wall portion that contacts the outer peripheral surface of the substrate, and the second guide includes a support portion that supports the lower part of the periphery of the substrate and a wall portion that contacts the outer peripheral surface of the substrate. With this configuration, a substrate transfer device that can reliably transfer the substrate without dropping it as much as possible can be provided.

[0017] Also, in the above-described substrate transfer device, the base member includes a first blade, a second blade, and a connecting portion that connects the first blade and the second blade. The pusher is disposed on the connecting portion, the first guide is disposed on the first blade, and it is preferable that the second guide is disposed on the second blade.

[0018] [Function and Effect] According to the above-described configuration, the base member includes a first blade, a second blade, and a connecting portion that connects the first blade and the second blade. The pusher is disposed on the connecting portion, the first guide is disposed on the first blade, and the second guide is disposed on the second blade. With this configuration, a substrate transfer device that can reliably hold the substrate can be provided.

[0019] Also, in the above-described substrate transfer device, the first sensor is a tactile sensor and is provided between the base member and the first guide. It is preferable that the second sensor is a tactile sensor and is provided between the base member and the second guide.

[0020] [Function and Effect] According to the above configuration, the first sensor and the second sensor are tactile sensors. By adopting such a configuration, it is possible to reliably detect whether a substrate is placed on the first guide and the second guide. Further, according to the above configuration, the first sensor is provided between the base member and the first guide. By configuring in this way, the first sensor can reliably detect the placement of the substrate on the first guide. And according to the above configuration, the second sensor is provided between the base member and the second guide. By configuring in this way, the same effect as that of the first sensor is achieved.

[0021] Further, in the above-described substrate transfer device, the first guide has the support portion and the wall portion separated from each other, the first sensor is provided between the base member and the support portion of the first guide, the second guide has the support portion and the wall portion separated from each other, it is preferable that the second sensor is provided between the base member and the support portion of the second guide.

[0022] [Function and Effect] According to the above configuration, the first guide has the support portion and the wall portion separated from each other, and the first sensor is provided between the base member and the support portion of the first guide. By configuring in this way, a substrate transfer device can be provided that can detect when the substrate rides on the wall portion and determine the situation of the substrate. Further, according to the above configuration, the second guide has the support portion and the wall portion separated from each other, and the second sensor is provided between the base member and the support portion of the second guide. By configuring in this way, the same effect as that of the first guide described above is achieved for the second sensor.

[0023] Further, in the above-described substrate device, the control unit, when the first sensor detects a predetermined load, determines that a substrate is placed on the first guide, it is preferable that when the second sensor detects a predetermined load, it determines that a substrate is placed on the second guide.

[0024] [Operation and Effect] According to the above configuration, when the first sensor detects a predetermined load, it is preferable to determine that the substrate is placed on the first guide, and when the second sensor detects a predetermined load, it is determined that the substrate is placed on the second guide. With such a configuration, a substrate transfer device that does not malfunction even if the first sensor and the second sensor detect noise can be provided.

[0025] Also, in the above substrate transfer device, the first sensor is embedded in a first recess formed in the base member, it is preferable that the second sensor is embedded in a second recess formed in the base member.

[0026] [Operation and Effect] According to the above configuration, the first sensor is embedded in the first recess formed in the base member, and the second sensor is embedded in the second recess formed in the base member. With such a configuration, a substrate transfer device can be provided that suppresses the thickness in the height direction of the hand and prevents the hand from colliding with the substrate during transfer.

[0027] Also, in a substrate processing apparatus including a substrate transfer device, it is preferable to include a single-wafer processing unit that processes the substrates transferred by the hand one by one.

[0028] [Operation and Effect] According to the above configuration, it includes a single-wafer processing unit that processes the substrates transferred by the hand one by one. According to the above configuration, a substrate processing apparatus can be provided that can perform substrate processing while reliably transferring various types of substrates.

Effect of the Invention

[0029] According to the present invention, a substrate transfer device that can efficiently transfer various types of substrates and a substrate processing apparatus including the same can be provided.

Brief Description of the Drawings

[0030]

Figure 1

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Figure 20

Best Mode for Carrying Out the Invention

[0031] Hereinafter, embodiments of the present invention will be described with reference to the drawings. The following embodiments are substrate processing apparatuses equipped with the substrate transfer device of the present invention. The substrate transfer device of the present invention corresponds to the index block in the substrate processing apparatus of the embodiment. The index block has an index robot equipped with a hand for transferring the substrate.

Embodiment

[0032] 1. Overall Configuration As shown in FIG. 1, the substrate processing apparatus 1 of this example has a load port 10, an index block 3, and a processing block 5. The substrate processing apparatus 1 of this example relates to single-wafer substrate processing, and is configured to acquire a substrate W in a horizontal posture one by one from a carrier C, perform substrate processing, and then return the substrate W to the carrier one by one.

[0033] In this specification, for convenience, the direction in which the index block 3 and the processing block 5 are arranged in the substrate processing apparatus 1 is referred to as the "front-rear direction X". The front-rear direction X extends horizontally. Among the front-rear direction X, the direction from the processing block 5 to the index block 3 in the substrate processing apparatus 1 is referred to as "front". The direction opposite to the front is referred to as "rear". The horizontal direction extending perpendicular to the front-rear direction X is referred to as the "width direction Y". One direction of the "width direction Y" is referred to as "right" for convenience, and the other direction is referred to as "left" for convenience. The direction (height direction) perpendicular to the front-rear direction X and the width direction Y is referred to as the "vertical direction Z" for convenience. In each figure, front, rear, right, left, up, and down are appropriately shown for reference.

[0034] The load port 10 corresponds to the carrier placement shelf of the present invention. The load port 10 is a carrier placement shelf for placing the carrier C. A plurality of load ports 10 are arranged in the width direction Y and can each place one carrier C. The load port 10 can place a carrier C that stores substrates in a horizontal posture stacked in the vertical direction.

[0035] That is, the carrier C stores a plurality of substrates W in the vertical direction Z at a predetermined interval in a horizontal posture. Further, the carrier C is provided with an opening for taking in and storing the substrate on one side surface. A plurality of substrates W (for example, 25 substrates) are stacked and stored in a single carrier C in a horizontal posture at a constant interval. FIG. 2 is a cross-sectional view for explaining the configuration of the carrier C. The carrier C is provided with comb-shaped members 7 having a plurality of protrusions for placing the substrate W at both ends of the carrier housing. The protrusions of the comb-shaped member 7 are configured to place the ends of the substrate W. The protrusions extend in the front-rear direction X. The protrusions are arranged at intervals of 1 cm. The recesses between the protrusions form slots in which the substrate W fits. As the carrier C, for example, there is a sealed FOUP (Front Opening Unify Pod). In the present invention, an open container may be adopted as the carrier C.

[0036] The index block 3 corresponds to the substrate transfer device of the present invention. The index block 3 has a rectangular shape extending in the width direction Y. The index block 3 is provided with an index robot IR having an acquisition hand 11a and a return hand 11b capable of transferring a substrate in a horizontal posture. The index robot IR is horizontally movable in the width direction Y. The index robot IR has a hand capable of holding and transferring the substrate W. The hand is supported by a multi-joint arm configured to be capable of swivel movement, lifting movement, and forward and backward movement. The index robot IR can access the carrier C on the load port 10 and the path 24 provided in front of the processing block 5. The index robot IR can perform two operations: an operation of acquiring a substrate W in a horizontal posture one by one from the carrier C and placing it on the path 24, and an operation of acquiring the substrate W in a horizontal posture placed on the path 24 one by one and returning it to the carrier C. The unprocessed substrate W held in the carrier C is transported to the path 24 by the index robot IR. Then, the processed substrate W is placed on the path 24 and returned to the carrier C by the index robot IR.

[0037] The processing block 5 is configured to perform a predetermined process on the substrate W. The processing block 5 has a plurality of single-wafer processing chambers 5a arranged therein. The single-wafer processing chamber 5a corresponds to the single-wafer processing unit of the present invention. The single-wafer processing chamber 5a is configured to process one substrate W conveyed by the acquisition hand 11a of the index robot IR described later one by one.

[0038] The arrangement of the single-wafer processing chambers 5a in the processing block 5 will be described. That is, in the processing block 5 of the present invention, three single-wafer processing chambers 5a are arranged in each of the middle layer region, the upper layer region, and the lower layer region to form a stacked body. Two stacked bodies are arranged one behind the other on the right side of the processing block 5. Similarly, two stacked bodies are arranged one behind the other on the left side of the processing block 5. Therefore, the processing block 5 is equipped with 12 single-wafer processing chambers 5a.

[0039] A substrate transfer region extending in the front-rear direction X is provided at the center of the processing block 5. The center robot CR can reciprocate in the substrate transfer region, and can acquire one substrate W in a horizontal posture from the path 24 one by one and transfer it to any one of the single-wafer processing chambers 5a. Then, the center robot CR can acquire one substrate W in a horizontal posture held by the single-wafer processing chamber 5a one by one and return it to the path 24. In this way, the center robot CR can access each of the single-wafer processing chambers 5a and the path 24.

[0040] Examples of the substrate process performed by the single-wafer processing chamber 5a include a substrate cleaning process. The substrate processing apparatus 1 in this example may be configured to perform various substrate processes using chemical solutions in addition to the substrate cleaning process.

[0041] 2. Configuration of the Index Robot Figure 3 schematically shows the tip part related to substrate holding in the index robot IR. The index robot IR includes an acquisition hand 11a and a return hand 11b. The return hand 11b and the acquisition hand 11a are held by the arm 12 in a state of being stacked in the vertical direction Z. The arm 12 can move the return hand 11b and the acquisition hand 11a forward and backward in the front-rear direction X individually. In the configuration of Figure 3, the return hand 11b and the acquisition hand 11a are arranged in this order from top to bottom, but the order in which each member is arranged can be changed as appropriate.

[0042] The transfer mechanism 53 transfers the substrate W by operating the arm 12 under the control of the control unit 100. When the transfer mechanism 53 operates the arm 12, the acquisition hand 11a and the return hand 11b also move accordingly. The transfer mechanism 53 can move the acquisition hand 11a forward and backward, and can also move it left and right. In addition, the transfer mechanism 53 can rotate the acquisition hand 11a around the vertical axis. Thus, the transfer mechanism 53 is configured to move the acquisition hand 11a. Note that the transfer mechanism 53 realizes the same movement and rotation for the return hand 11b as for the acquisition hand 11a.

[0043] The acquisition hand 11a corresponds to the hand of the present invention. The acquisition hand 11a enters between the substrates W adjacent to each other vertically, holds the unprocessed substrates W one by one from the carrier C, and conveys them to the path 24.

[0044] The pick-up hand 11a has a base member 31 and guide members 32a and 32b. The guide members 32a and 32b correspond to the first guide and the second guide of the present invention. The base member 31 has a flat shape so as to be able to enter between the substrates. The guide members 32a and 32b are located at the tip of the pick-up hand 11a and are configured to abut against the end of the substrate W. That is, the guide members 32a and 32b are tabs provided at the tip of the base member 31 and are members that contact the substrate W. The guide members 32a and 32b are provided on the upper surface of the base member 31. Therefore, the guide members 32a and 32b are configured to support the lower part of the peripheral edge of the upper substrate W. Accordingly, the guide members 32a and 32b are configured to contact the outer peripheral surface of the substrate.

[0045] The guide members 32a and 32b have a support portion that supports the lower part of the peripheral edge of the substrate W and a wall portion that contacts the outer peripheral surface. That is, the guide members 32a and 32b have a thick portion and a thin portion. Therefore, the guide members 32a and 32b are partially different in thickness in the height direction. The wall portion of the guide members 32a and 32b facing the base end portion of the pick-up hand 11a in the thick portion is such that the end portion (bevel portion) of the substrate W can contact it. The support portion facing upward in the thin portion of the guide members 32a and 32b is such that the peripheral edge portion of the lower surface of the substrate can contact it. The guide members 32a and 32b are provided on the upper surface of the base member 31 and are configured such that the outer peripheral surface of the substrate abuts against them. The guide members are also provided at the base end portion of the base member 31, but this configuration will be described later.

[0046] The guide members 32a and 32b provided at the tip of the base member 31 are tapered, and this will be described. As shown in FIG. 3, the upper surface of the thin-walled portion of the guide members 32a and 32b is inclined. That is, the thin-walled portion is configured such that the thickness in the height direction becomes smaller as it moves away from the thick-walled portion. In this way, the guide members 32a and 32b include a tapered portion (thin-walled portion) that contacts the lower part of the substrate W and a wall portion (side surface of the thick-walled portion) that contacts the outer peripheral surface of the substrate. The tapered portions of the guide members 32a and 32b correspond to the support portions of the present invention.

[0047] Similarly, the guide members 34a and 34b provided at the base end of the base member 31 are tapered as shown in FIG. 3. That is, the thin-walled portion is configured such that the thickness in the height direction becomes smaller as it moves away from the thick-walled portion. In this way, the guide members 34a and 34b include a tapered portion (thin-walled portion) that contacts the lower part of the substrate W and a wall portion (side surface of the thick-walled portion) that contacts the outer peripheral surface of the substrate.

[0048] The return hand 11b has the same configuration as the above-described acquisition hand 11a. That is, the return hand 11b has a base member 31 and guide members 32a and 32b. In the return hand 11b, the configuration in which the guide members 32a and 32b are provided at the tip and the base of the base member 31, and the configuration in which the guide members 32a and 32b have a thick-walled portion and a thin-walled portion are the same as the configuration of the acquisition hand 11a. The return hand 11b of this example is provided for transporting the cleaned substrate W that has been subjected to the cleaning process. By using the hands separately for the forward and return paths in the reciprocating motion of the substrate W, it is not necessary for the hand holding the substrate W before the cleaning process to hold the substrate W after the cleaning process. Therefore, by providing the return hand 11b, the cleanliness of the substrate W after the cleaning process is maintained.

[0049] Also, the first sensor 22a and the second sensor 22b described later are not necessarily required for the return hand 11b.

[0050] FIG. 4 is a plan view for explaining the acquisition hand 11a and the return hand 11b. The acquisition hand 11a and the return hand 11b include a connecting portion 36, a first blade 33a, and a second blade 33b that are branched from the connecting portion 36. The connecting portion 36 is configured to connect the first blade 33a and the second blade 33b. The first blade 33a is a member extending in the front-rear direction X that holds one end portion of the substrate W, and the second blade 33b is a member extending in the front-rear direction X that holds the other end portion of the substrate W.

[0051] A guide member 32a is disposed on the first blade 33a. The guide member 32a corresponds to the first guide of the present invention. A guide member 32b is disposed on the second blade 33b. The guide member 32b corresponds to the second guide of the present invention. Further, a guide member 34a is disposed on the first blade 33a. A guide member 34b is disposed on the second blade 33b.

[0052] The wall portions A of the guide member 32a, the guide member 32b, the guide member 34a, and the guide member 34b are arranged so as to belong to a virtual circle slightly larger than the substrate W. Thereby, the substrate W can be accommodated in the receiving region of the substrate W formed by the thin portions of the guide member 32a, the guide member 32b, the guide member 34a, and the guide member 34b.

[0053] The pusher 35 is a member provided on the upper surface of the base member 31. The pusher 35 is provided at the tip of the connecting portion 36 so as to face the guide member 32a and the guide member 32b. The pusher 35 is on the line segment passing through the intermediate position between the guide member 32a and the guide member 32b and the intermediate position between the guide member 34a and the guide member 34b. The pusher 35 can push the substrate W held by the guide members 32a, 32b, 34a, and 34b forward, that is, toward the guide members 32a and 32b. Therefore, the pusher 35 can move forward and backward toward the guide members 32a and 32b. The pusher 35 can move backward to an open state and can move forward to a closed state. To grip the substrate W by the first blade 33a and the second blade 33b, first, the substrate W is held by the guide members 32a, 32b, 34a, and 34b with the pusher 35 in the open state. Then, the substrate W is sandwiched by the guide members 32a, 32b and the pusher 35 with the pusher 35 in the closed state. In this way, the clamping of the substrate W is executed.

[0054] 3. Regarding the sensor FIG. 5 is an exploded perspective view for explaining the configuration of the acquisition hand 11a. In FIG. 5, the guide members 32a, 32b, 34a, and 34b are not shown in order to facilitate understanding of the assembly structure of the sensor. At the tip of the first blade 33a, a first recess 37a for embedding the first sensor 22a is provided. Similarly, at the tip of the second blade 33b, a second recess 37b for embedding the second sensor 22b is provided.

[0055] As the first sensor 22a and the second sensor 22b, for example, a tactile sensor is used. Hereinafter, the first sensor 22a will be described as an example. FIG. 6 is an exploded perspective view for explaining the positional relationship between the first sensor 22a and the guide member 32a. The guide member 32a and the first sensor 22a are arranged in the Z direction. The first sensor 22a includes a main body portion 221 and an elastomer 222 made of an elastic member. The main body portion 221 includes an electronic circuit and measures the weight and torque applied to the elastomer 222 in three-dimensional directions and outputs an electrical signal. When the first sensor 22a is attached to the first blade 33a, the main body portion 221 is embedded in the first recess 37a, so that the elastomer 222 protrudes from the upper surface of the first blade 33a. The guide member 32a is fixed to the elastomer 222. Therefore, the first sensor 22a is a tactile sensor and is provided between the base member 31 and the guide member 32a. When the substrate W is placed on the guide member 32a, the elastomer 222 is deformed. Based on this, the first sensor 22a detects whether the substrate W has come into contact with the guide member 32a. That is, the first sensor 22a is configured to detect that the substrate W is placed on the guide member 32a.

[0056] More specifically, the first sensor 22a can detect the load applied to the guide member 32a. Therefore, the first sensor 22a outputs a signal indicating 0 mg when the guide member 32a is not placing the substrate W, and outputs a signal indicating the weight of the substrate when the guide member 32a is placing the substrate W. However, since the substrate W is supported by the guide members 32a, 32b, 34a, and 34b, the weight of the substrate W is distributed to each guide member. Therefore, the first sensor 22a only outputs a signal indicating a weight that is at most smaller than the total weight of the substrate W.

[0057] The second sensor 22b also has the same configuration as the first sensor 22a. That is, the second sensor 22b is configured to detect that the substrate W is placed on the guide member 32a.

[0058] Further, the second sensor 22b can detect the load input to the guide member 32b. This is the same as the configuration of the first sensor 22a.

[0059] The first sensor 22a and the second sensor 22b determine that the substrate is placed on the first guide 32a and the second guide 32b when a predetermined load is detected.

[0060] 4. Configuration of the pusher Hereinafter, the state change of the pusher 35 will be specifically described. FIG. 7 illustrates the acquisition hand 11a when the pusher 35 is in the open state. At this time, the substrate W is accommodated in a substrate receiving portion formed by the wall portions A in the guide member 32a, the guide member 32b, the guide member 34a, and the guide member 34b. Since the substrate receiving portion is a region having a diameter larger than that of the substrate W, a gap is interposed between each wall portion A and the substrate W. At this time, the substrate W is placed on the guide member 32a and the guide member 32b.

[0061] FIG. 8 is a cross-sectional view of the acquisition hand 11a when the pusher 35 is in the open state. The guide member 32a and the guide member 34 are in contact with the outer peripheral surface of the substrate at the tapered portion B. Although not shown in FIG. 8, the guide member 32b also contacts the outer peripheral surface of the substrate W at the tapered portion B. The outer peripheral surface of the substrate W is located at a position away from the wall portion A of each guide member.

[0062] FIG. 9 illustrates the state of the acquisition hand 11a when the pusher 35 is in the closed state. At this time, the substrate W is pressed by the pusher 35 and gripped (clamped) by the acquisition hand 11a. As can be seen by referring to FIG. 9, the substrate W is pressed by the pusher 35 and abuts against the wall portion A of the guide member 32a. Although not shown in FIG. 9, the wall portion A of the guide member 32b also abuts against the substrate W. The substrate W abuts against the wall portion A on the outer peripheral surface. In this way, when the pusher 35 is in the closed state, the substrate W is clamped at three points: the pusher 35, the guide member 32a, and the guide member 32b. When the pusher 35 presses the substrate W, the substrate W moves away from the guide members 34a and 34b. In this way, the pusher 35 can be switched between the open state and the closed state.

[0063] FIG. 10 is a cross-sectional view of the acquisition hand 11a when the pusher 35 is in the closed state. According to this figure, when the pusher 35 presses the substrate W against the guide member 32a, the substrate is gripped by the guide member 32a and the pusher 35. At this time, the substrate W is separated from the wall portions A of the guide members 34a and 34b. By pressing the substrate W with the pusher 35 in this way, the substrate W is fixed to the acquisition hand 11a, so that the substrate W can be reliably conveyed.

[0064] 5. Control of the Pusher FIG. 11 is a view of the acquisition hand 11a as seen from the X direction. Hereinafter, the control of the pusher 35 will be described with reference to FIG. 11. The pusher drive mechanism 43 can move the pusher 35 forward and backward along the first blade 33a and the second blade 33b. That is, the pusher drive mechanism 43 is configured to displace the pusher 35. The pusher drive mechanism 43 is composed of, for example, a servo motor or an air cylinder.

[0065] The control unit 100 is configured to control the pusher drive mechanism 43. That is, the control unit 100 can switch the pusher 35 between an open state and a closed state. When the pusher 35 is in the open state, the substrate W is placed on the guide members 32a, 32b, 34a, and 34b. Also, when the pusher 35 is in the closed state, the pusher 35 can press the substrate W and cause the substrate W to be clamped by the acquisition hand.

[0066] The open state of the pusher 35 refers to a state in which the pusher 35 is separated from the outer peripheral surface of the substrate placed on the guide members 32a and 32b. Also, the closed state of the pusher 35 refers to a state in which the pusher 35 abuts against the outer peripheral surface of the substrate W, presses the substrate W against the guide members 32a and 32b, and clamps the substrate W.

[0067] When the substrate W is not placed, the first sensor 22a and the second sensor 22b do not detect the substrate W. Thus, when neither the first sensor 22a nor the second sensor 22b detects the substrate W, the control unit 100 receives the outputs of the first sensor 22a and the second sensor 22b and sets the state of the pusher 35 to the open state.

[0068] FIG. 12 shows a state when the substrate W is received by the acquisition hand 11a. When the substrate W is placed on the guide member 32a, the load of the substrate W is transmitted through the guide member 32a and reaches the first sensor 22a. The first sensor 22a measures the load derived from the substrate loaded on the guide member 32a. Signals indicating the respective measurement results are input to the control unit 100.

[0069] When the control unit 100 sets the pusher 35 to the open state and receives the substrate W with the acquisition hand 11a, the control unit 100 permits the pusher 35 to change from the open state to the closed state when both the first sensor 22a and the second sensor 22b detect that the substrate W is placed on the first guide 32a and the second guide 32b, respectively. Based on this, as shown in FIG. 13, the pusher drive mechanism 43 sets the pusher 35 to the closed state and presses the substrate W with the pusher 35.

[0070] On the other hand, the substrate Wd shown in FIG. 14 is not flat, and the peripheral edge that should contact the guide member 32a protrudes upward. When the pusher 35 is in the closed state when transporting such a substrate Wd with the acquisition hand 11a, there is a possibility of causing damage to the substrate Wd or dropping the substrate Wd from the acquisition hand 11a. The control unit 100 operates assuming the possibility that the acquisition hand 11a acquires the substrate Wd.

[0071] FIG. 15 shows a state when the substrate Wd shown in FIG. 14 is received by the acquisition hand 11a. Since the substrate Wd is not flat, it does not contact the guide member 32a even after being received by the acquisition hand 11a. Therefore, the first sensor 22a at this time does not output a signal detecting the substrate Wd to the control unit 100. On the other hand, since the substrate Wd contacts the guide member 32b, the second sensor 22b outputs a signal detecting the substrate Wd and a signal indicating the load applied to the guide member 32b to the control unit 100.

[0072] In this way, when the second sensor 22b detects that the substrate W is placed on the guide member 32b and the first sensor 22a does not detect that the substrate W is placed on the guide member 32a, the control unit 100 prohibits the pusher 35 from changing from the open state to the closed state.

[0073] In the example of FIG. 15, the second sensor 22b detected the substrate W, but the configuration of this embodiment also assumes the case where the first sensor 22a detects the substrate W instead of the second sensor 22b. That is, when the first sensor 22a detects that the substrate W is placed on the guide member 32a and the second sensor 22b does not detect that the substrate W is placed on the guide member 32b, the control unit 100 prohibits the pusher 35 from changing from the open state to the closed state.

[0074] Also, in the example of FIG. 15, it was the case where the second sensor 22b detected the substrate W. However, the configuration of this embodiment also assumes the case where neither the first sensor 22a nor the second sensor 22b detects the substrate W. The position of the substrate W stored in the carrier C has been detected in advance by a prior mapping operation of inserting the acquisition hand 11a into the carrier C. Therefore, it is already detected that the substrate W is positioned in a predetermined slot without using the acquisition hand 11a. The acquisition hand 11a is moved to below the substrate W in order to scoop up the substrate W detected by the mapping operation. However, depending on the warping of the substrate W, the substrate W may float above both the guide member 32a and the guide member 32b and be supported by the guide member 34a and the guide member 34b. In such a case, although the substrate W exists, the substrate W is not detected by the first sensor 22a and the second sensor 22b. The control unit 100 prohibits the pusher 35 from changing from the open state to the closed state even in such a case.

[0075] In short, in the configuration of this embodiment, when the shape of the substrate W is close to flat, the displacement of the pusher 35 to the closed state is allowed, and when the shape of the substrate W is away from flat, the displacement of the pusher 35 to the closed state is prohibited. In other words, when at least one of the first sensor 22a and the second sensor 22b does not detect the substrate W, the displacement of the pusher 35 to the closed state is prohibited.

[0076] In the example of FIG. 15, the first sensor 22a does not detect the substrate W. However, even when the first sensor 22a detects the substrate W, the displacement of the pusher 35 to the closed state may be prohibited, so this point will be explained.

[0077] In the example of FIG. 15, since the shape of the substrate W is far from being flat, the first sensor 22a does not detect the substrate W. However, when the shape of the substrate W is closer to being flat, not only the second sensor 22b but also the first sensor 22a may detect the substrate W. This embodiment can distinguish such a substrate W with small distortion from a flat substrate W. Even when the distortion of the substrate W placed on the acquisition hand 11a is small, the displacement of the pusher 35 to the closed state is prohibited.

[0078] That is, when both the first sensor 22a and the second sensor 22b detect that the substrate W is placed on the guide member 32a and the guide member 32b respectively, the control unit 100 performs the following operations. First, the control unit 100 compares the time when the first sensor 22a detects that the substrate W is placed on the guide member 32a with the time when the second sensor 22b detects that the substrate W is placed on the guide member 32b to obtain the time difference between the two. Then, when the time difference is within a predetermined reference time difference, the control unit 100 allows the pusher 35 to change from the open state to the closed state. On the other hand, when the time difference exceeds the predetermined reference time difference, the control unit 100 prohibits the pusher 35 from changing from the open state to the closed state.

[0079] Such an operation of the control unit 100 utilizes the fact that if there is distortion in the substrate W, a time difference will occur between the detection by the first sensor 22a and the detection by the second sensor 22b. If the substrate W is flat, the first sensor 22a and the second sensor 22b should detect the substrate W simultaneously. However, if there is distortion in the substrate W, a time difference will occur in the detection timings of the first sensor 22a and the second sensor 22b according to the distortion of the substrate W. The control unit 100 of this embodiment operates without missing the small distortion of the substrate W by utilizing this time difference.

[0080] 6. Movement control of the acquisition hand The substrate processing apparatus 1 of this embodiment can change the moving speed of the acquisition hand 11a according to the situation of the substrate W, so this point will be described. That is, the transfer mechanism 53 of this embodiment can switch between a high-speed mode in which the acquisition hand 11a is moved at a first moving speed and a low-speed mode in which the acquisition hand 11a is moved at a second moving speed slower than the first moving speed.

[0081] The configuration regarding the high-speed mode will be described. When the first sensor 22a detects that the substrate W is placed on the guide member 32a and the second sensor 22b detects that the substrate W is placed on the guide member 32b, the control unit 100 obtains the time difference of the detection as described above. When the time difference is within the reference time, the pusher 35 changes from the open state to the closed state, and the substrate W is clamped by the acquisition hand 11a. At this time, the transfer of the substrate W is executed in the high-speed mode, and the substrate W is transferred at the first moving speed. Since the substrate W is firmly supported by the acquisition hand 11a by the pusher 35, even if the substrate W is transferred at high speed, the substrate W will not slip off the acquisition hand 11a.

[0082] The configuration regarding the low-speed mode will be described. When the first sensor 22a detects that the substrate is placed on the guide member 32a and the second sensor 22b does not detect that the substrate is placed on the guide member 32b, the control unit 100 prohibits the pusher 35 from changing from the open state to the closed state, and keeps the substrate W in a state where it is not clamped. At this time, the transfer of the substrate W is executed in the low-speed mode, and the substrate W is transferred at the second moving speed.

[0083] Similarly, when the second sensor 22b detects that the substrate is placed on the guide member 32b and the first sensor 22a does not detect that the substrate is placed on the guide member 32a, the control unit 100 conveys the substrate W at the second speed with the pusher 35 kept open. Further, even when the first sensor 22a detects that the substrate W is placed on the guide member 32a and the second sensor 22b detects that the substrate W is placed on the guide member 32b, if the time difference exceeds the reference time, the control unit 100 conveys the substrate W at the second speed with the pusher 35 kept open.

[0084] Note that instead of conveying the substrate W in the low-speed mode, the configuration may be such that the conveyance of the substrate is stopped. In this case, the acquisition hand 11a once scoops up and holds the substrate W from the slot formed by the comb-shaped member 7 of the carrier C, but when the control unit 100 determines that the substrate W cannot be conveyed, the substrate W is lowered and returned to the original slot. Then, the acquisition hand 11a heads to acquire another substrate W stored in the carrier C. That is, even if there are substrates W in the carrier C that cannot be conveyed mixed therein, the conveyance operation of the substrate W continues without being stopped.

[0085] 7. Other configurations As shown in FIG. 1, the index block 3 includes a control unit 100 related to the control of the index robot IR. The control unit 100 is configured by, for example, a CPU (Central Processing Unit). The specific configuration of the control unit 100 is not limited. For example, the control related to the acquisition hand 11a and the control related to the return hand 11b may be configured by a single processor or by individual processors.

[0086] Examples of the control related to the control unit 100 include control related to the forward and backward movements of the acquisition hand 11a, the forward and backward movements of the return hand 11b, the rotational movement of the acquisition hand 11a, the rotational movement of the return hand 11b, the lifting movement of the acquisition hand 11a, and the lifting movement of the return hand 11b.

[0087] The memory unit stores programs related to control and parameters such as predetermined values. The memory unit may be composed of a single device or may be composed of individual devices corresponding to each control. The indexable block 3 of the present invention has no particular limitation on the configuration of the device that realizes the memory unit.

[0088] 8. Flow of substrate processing Hereinafter, with reference to FIG. 17, the flow of substrate processing in the substrate processing apparatus 1 according to the present embodiment will be described.

[0089] Step S11: The substrate W is acquired from the carrier C placed on the load port 10. That is, the acquisition hand 11a enters the carrier C below the substrate W to be transported, then rises, and places the substrate W to be transported on the guide members 32a, 32b, 34a, and 34b.

[0090] Step S12: The control unit 100 determines whether both the first sensor 22a and the second sensor 22b have detected the substrate W. If the determination is true, the process proceeds to step S13, and if the determination is false, the process proceeds to step S15.

[0091] Step S13: The control unit 100 determines whether the time difference between the first sensor 22a and the second sensor 22b detecting the substrate W is within the standard time difference. If the determination is true, the substrate W is close to being flat, and there is no problem in transporting it at high speed with the pusher 35 in the closed state. In such a case, the process proceeds to step S14. If the determination is false, the substrate W is far from being flat, and it cannot be transported at high speed with the pusher 35 in the closed state. In such a case, the process proceeds to step S15.

[0092] Step S14: The control unit 100 determines that the substrate W placed on the acquisition hand 11a is flat, and sets the transport mode of the substrate W to the high-speed mode. Then, the process proceeds to step S16.

[0093] Step S15: When the control unit 100 determines that the substrate W placed on the acquisition hand 11a is not flat, it sets the transport mode of the substrate W to the low-speed mode. Thereafter, the process proceeds to step S17.

[0094] Step S16: The control unit 100 controls the pusher drive mechanism 43 to close the pusher 35 and transports the substrate W at high speed. The acquisition hand 11a exits from the carrier C and transports the substrate W to the path 24 at high speed. The transported substrate W is transported to the single-wafer processing chamber 5a by the center robot CR.

[0095] Step S17:: The control unit 100 transports the substrate W at low speed while keeping the pusher 35 open. The acquisition hand 11a exits from the carrier C and transports the substrate W to the path 24 at low speed. The transported substrate W is transported to the single-wafer processing chamber 5a by the center robot CR.

[0096] Step S18: The cleaning process and the drying process of the substrate W are executed in the single-wafer processing chamber 5a.

[0097] Step S19: The processed substrate W is transported to the path 24 by the center robot CR. The return hand 11b returns the substrate W placed on the path 24 to the carrier C. In this way, the substrate processing apparatus of the present embodiment processes the substrate.

[0098] Note that steps S11 to S19 describe the operations focused on one substrate W stored in the carrier C. Therefore, these steps S11 to S19 are repeated as many times as the number of substrates W stored in the carrier C.

[0099] 9. Effects of the present invention As described above, the index block 3 according to the present invention has the acquisition hand 11a including the guide member 32a and the guide member 32b. The guide member 32a has the first sensor 22a capable of detecting the substrate W, and the guide member 32b has the second sensor 22b capable of detecting the substrate W. If it is determined whether the gripping of the substrate W can be executed using the outputs of the first sensor 22a and the second sensor 22b, the substrate W can be appropriately conveyed according to the situation of the substrate W to be conveyed. Therefore, according to the index block 3 in the present invention, various types of substrates W can be efficiently conveyed.

[0100] According to the above-described configuration, there are provided a first sensor 22a for detecting that the substrate W is placed on the first guide 32a, a second sensor 22b for detecting that the substrate W is placed on the second guide 32b, and a pusher 35 provided to face the first guide 32a and the second guide 32b and capable of advancing and retreating toward the first guide 32a and the second guide 32b. When both the first sensor 22a and the second sensor 22b detect that the substrate W is placed on the first guide 32a and the second guide 32b, respectively, the pusher 35 is allowed to change from the open state to the closed state. On the other hand, when at least one of the first sensor 22a and the second sensor 22b does not detect the substrate W, the pusher 35 is prohibited from changing from the open state to the closed state. With such a configuration, the situation of the substrate W can be grasped using the first sensor 22a and the second sensor 22b. That is, when both the first sensor 22a and the second sensor 22b detect that the substrate W is placed on the first guide 32a and the second guide 32b, respectively, it can be determined that the shape of the substrate W is close to being flat. On the other hand, when at least one of the first sensor 22a and the second sensor 22b does not detect the substrate W, it can be determined that the shape of the substrate W is far from being flat. Thus, if the situation of the substrate W is known, it is possible to appropriately control the opening and closing of the pusher 35 according to the situation of the substrate W. Therefore, according to the present invention, a substrate conveying device capable of efficiently conveying various types of substrates W can be provided.

[0101] According to the above configuration, even when both the first sensor 22a and the second sensor 22b detect that the substrate W is placed on the first guide 32a and the second guide 32b respectively, the situation of the substrate W can be accurately detected. That is, according to the above configuration, when the first sensor 22a detects that the substrate W is placed on the first guide 32a, and the second sensor 22b detects that the substrate W is placed on the second guide 32b, the time difference between the two is obtained by comparison. If the obtained time difference is within the standard time difference, it can be determined that the shape of the substrate W is close to flat. Also, when the obtained time difference exceeds the standard time difference, it can be determined that the shape of the substrate W is far from flat. In this way, if the situation of the substrate W is known, it is possible to appropriately control the opening and closing of the pusher 35 according to the situation of the substrate W. Therefore, according to the present invention, a substrate transfer device capable of efficiently transferring various types of substrates W can be provided.

[0102] According to the above configuration, it is possible to switch between a mode in which the hand is moved at the first moving speed and a mode in which the hand is moved at a second moving speed slower than the first moving speed. If the obtained time difference is within the reference time difference, the pusher 35 is closed from the open state to clamp the substrate W, and then the hand is moved at the first moving speed. If the obtained time difference exceeds the reference time difference, the hand is moved at the second moving speed after prohibiting the pusher 35 from changing from the open state to the closed state. In addition, even when the pusher 35 is prohibited from changing from the open state to the closed state, the hand is moved at the second speed. With this configuration, a substrate transfer device with high throughput can be realized.

[0103] According to the above configuration, when the pusher 35 is prohibited from changing from the open state to the closed state, the transfer of the substrate W is stopped. With this configuration, a substrate transfer device can be provided that does not transfer a substrate W far from flat and suppresses the dropping of the substrate W. In such a case, the acquisition hand 11a returns the substrate W to the original slot, preventing transfer errors and also preventing a decrease in throughput due to the transfer stop so that the next substrate transfer can proceed.

[0104] According to the above configuration, the first guide 32a includes a tapered portion B that supports the lower peripheral edge of the substrate W and a wall portion A that contacts the outer peripheral surface of the substrate W. The second guide 32b includes a tapered portion B that supports the lower peripheral edge of the substrate W and a wall portion A that contacts the outer peripheral surface of the substrate W. With this configuration, a substrate transfer device can be provided that can reliably transfer the substrate W without dropping it as much as possible.

[0105] According to the above configuration, the base member 31 includes a first blade 33a, a second blade 33b, and a connecting portion 36 that connects the first blade 33a and the second blade 33b. A pusher 35 is disposed on the connecting portion 36, a first guide 32a is disposed on the first blade 33a, and a second guide 32b is disposed on the second blade 33b. With this configuration, a substrate transfer device that can reliably hold the substrate W can be provided.

[0106] According to the above configuration, the first sensor 22a and the second sensor 22b are tactile sensors. With such a configuration, it is possible to reliably detect whether or not the substrate W is placed on the first guide 32a and the second guide 32b. Further, according to the above configuration, the first sensor 22a is provided between the base member 31 and the first guide 32a. By configuring in this way, the first sensor 22a can reliably detect the placement of the substrate W on the first guide 32a. And according to the above configuration, the second sensor 22b is provided between the base member 31 and the second guide 32b. By configuring in this way, the same effect as that of the first sensor 22a is achieved.

[0107] According to the above configuration, it is preferable to determine that the substrate W is placed on the first guide 32a when the first sensor 22a detects a predetermined load, and to determine that the substrate W is placed on the second guide 32b when the second sensor 22b detects a predetermined load. With such a configuration, a substrate transfer device that does not malfunction even if the first sensor 22a and the second sensor 22b detect noise can be provided.

[0108] According to the above configuration, the first sensor 22a is embedded in the first recess 37a formed in the base member 31, and the second sensor 22b is embedded in the second recess 37b formed in the base member 31. With this configuration, it is possible to provide a substrate transfer device that suppresses the thickness in the height direction of the hand and prevents the hand from colliding with the substrate W during transfer.

[0109] According to the above configuration, a single-wafer processing unit that processes the substrates W transferred by the hand one by one is provided. According to the above configuration, it is possible to provide a substrate processing device that can perform substrate processing while reliably transferring various types of substrates W.

[0110] 10. Modification The present invention is not limited to the above-described embodiments, and the following modified implementations are possible.

[0111] <Modification 1> In the above-described steps S13 and S14 in FIG. 17, the determination was reflected in the operation of the acquisition hand 11a, but the present invention is not limited to this configuration. The determination in step S13 can also be used for the displacement operation of the pusher 35 in the return hand 11b. That is, in steps S13 and S14, for the substrate W for which clamping is possible, in step S19, the substrate W can be clamped by the return hand 11b. Also, in steps S13 and S14, for the substrate W for which clamping is not possible, in step S17, the substrate W cannot be clamped by the return hand 11b. In this way, if the determination regarding the distortion of the substrate W executed by the acquisition hand 11a is used for the return operation of the substrate W by the return hand 11b, it is possible to provide an index block 3 that can transfer the substrate more reliably.

[0112] <Modification 2> As shown in Fig. 18, the guide member 32a may be configured such that the support portion (taper portion B) and the wall portion A are provided separately. In this case, the first sensor 22a is provided between the base member 31 and the support portion of the guide member 32a. Also, in the case of this modification, the guide member 32b may also be configured such that the support portion (taper portion B) and the wall portion A are provided separately. In this case, the second sensor 22b is provided between the base member 31 and the support portion of the guide member 32b.

[0113] According to the above configuration, the first guide 32a has the taper portion B and the wall portion A separated from each other, and the first sensor 22a is provided between the base member 31 and the taper portion B of the first guide 32a. With such a configuration, a substrate transfer device can be provided that can detect when the substrate W has climbed onto the wall portion A as shown in Fig. 19 and determine the situation of the substrate W. Also, according to the above configuration, the second guide 32b has the taper portion B and the wall portion A separated from each other, and the second sensor 22b is provided between the base member 31 and the taper portion B of the second guide 32b. With such a configuration, the second sensor 22b also exhibits the same effect as the above-described first guide 32a.

[0114] <Modification Example 3> In the above-described embodiment, the tactile sensor has detected that the substrate W has been placed on the guide members 32a and 32b, but the present invention is not limited to this configuration. As shown in Fig. 20, a distance measuring sensor 27a may be provided on the first blade 33a, and a distance measuring sensor 27b may be provided on the second blade 33b. The distance measuring sensor 27a is provided at a position displaced from the guide member 32a toward the second blade 33b side. The distance measuring sensor 27b is provided at a position displaced from the guide member 32b toward the first blade 33a side. By configuring it in this way, the distance measuring sensor 27a and the distance measuring sensor 27b will be covered by the substrate W held by the acquisition hand 11a, and the presence or absence of the substrate W can be reliably detected.

[0115] The distance measuring sensor 27a can detect whether the substrate W is placed on the guide member 32a, and can also calculate the distance from the distance measuring sensor 27a to the substrate W. Therefore, it can also detect whether the substrate W is floating with respect to the guide member 32a. Similarly, the distance measuring sensor 27b can detect whether the substrate is placed on the guide member 32b and the floating of the substrate W with respect to the guide member 32b. Further, since the distance measuring sensors 27a and 27b can also detect the timing when the substrate W is placed on the guide members 32a and 32b, this modification example can also control the pusher 35 by comparing the timings.

[0116] <Modification Example 4> The present invention is not limited to the index block 3, and can be generally applied to a substrate transfer device including a robot that transfers a substrate W in a horizontal posture.

Explanation of Reference Numerals

[0117] 1 Substrate processing apparatus 3 Index block 5 Processing block 5a Single wafer processing chamber 7 Comb-shaped member 10 Load port 11a Acquisition hand 11b Return hand 12 Arm 22a First sensor 22b Second sensor 24 Path 27a Distance measuring sensor 27b Distance measuring sensor 31 Base member 32a Guide member 32b Guide member 33a First blade 33b Second blade 34a Guide member 34b Guide member 35 Pusher 36 Connecting portion 37a First recess 37b Second recess 43 Pusher drive mechanism 100 Control unit 221 Body part 222 Elastomer A Wall part B Taper part C Carrier CR Center robot IR Indexer robot W Substrate Wd Substrate

Claims

1. A substrate transfer device having a hand capable of transferring a substrate in a horizontal posture, wherein the hand comprises a base member, a first guide provided on the upper surface of the base member for supporting the lower part of the periphery of the substrate and contacting the outer peripheral surface of the substrate, a first sensor for detecting that the substrate is placed on the first guide, a second guide provided on the upper surface of the base member for supporting the lower part of the periphery of the substrate and contacting the outer peripheral surface of the substrate, a second sensor for detecting that the substrate is placed on the second guide, a pusher provided on the upper surface of the base member opposite to the first guide and the second guide and capable of moving forward and backward toward the first guide and the second guide, a pusher driving part for moving the pusher forward and backward, and a control part for controlling the pusher driving part, wherein the control part is capable of switching between an open state in which the pusher is separated from the outer peripheral surfaces of the substrates placed on the first guide and the second guide, and a closed state in which the pusher contacts the outer peripheral surface of the substrate and presses the substrate against the first guide and the second guide to sandwich the substrate, and the control part when receiving the substrate with the hand with the pusher in the open state, allows the pusher to change from the open state to the closed state when both the first sensor and the second sensor detect that the substrate is placed on the first guide and the second guide respectively, and prohibits the pusher from changing from the open state to the closed state when at least one of the first sensor and the second sensor does not detect the substrate. A substrate transfer device characterized by the above.

2. In the substrate transfer device according to Claim 1, when both the first sensor and the second sensor detect that the substrate is placed on the first guide and the second guide respectively, the control part compares the time point when the first sensor detects that the substrate is placed on the first guide with the time point when the second sensor detects that the substrate is placed on the second guide to obtain the time difference between the two, allows the pusher to change from the open state to the closed state when the time difference is within a predetermined reference time difference, and prohibits the pusher from changing from the open state to the closed state when the time difference exceeds the predetermined reference time difference. A substrate transfer device characterized by the above.

3. In the substrate transfer device according to Claim 2, a transfer mechanism for moving the hand is provided. The transfer mechanism is switchable between a mode of moving the hand at a first moving speed and a mode of moving at a second moving speed slower than the first moving speed. The control unit When both the first sensor and the second sensor detect that a substrate is placed on the first guide and the second guide, respectively, Compare the time when the first sensor detects that a substrate is placed on the first guide with the time when the second sensor detects that a substrate is placed on the second guide, and obtain the time difference between the two. When the time difference is within a predetermined reference time difference, the pusher is changed from the open state to the closed state to clamp the substrate. Furthermore, control the transfer mechanism to move the hand holding the substrate at the first moving speed. On the other hand, When at least one of the first sensor and the second sensor does not detect a substrate, and when the time difference exceeds a predetermined reference time difference, Prohibit the pusher from changing from the open state to the closed state and keep the substrate unclamped. Furthermore, control the transfer mechanism to move the hand at the second moving speed with the substrate not being clamped by the pusher. A substrate transfer device characterized by the above.

4. In the substrate transfer device according to claim 3, The control unit When at least one of the first sensor and the second sensor does not detect a substrate, and when the time difference exceeds a predetermined reference time difference, Instead of moving the hand at the second moving speed with the substrate not being clamped by the pusher, return the substrate to the original slot. A substrate transfer device characterized by the above.

5. In the substrate transfer device according to claim 1, The first guide includes a support portion that supports the lower part of the peripheral edge of the substrate and a wall portion that contacts the outer peripheral surface of the substrate. The second guide includes a support portion that supports the lower part of the peripheral edge of the substrate and a wall portion that contacts the outer peripheral surface of the substrate. A substrate transfer device characterized by the above.

6. In the substrate transfer device according to claim 1, The base member Comprises a first blade, A second blade, And a connecting portion that connects the first blade and the second blade. The pusher is arranged at the connecting portion. The first guide is arranged on the first blade. The second guide is arranged on the second blade. A substrate transfer device characterized by the above.

7. In the substrate transfer device according to claim 1, ​ The first sensor is a tactile sensor, and is provided between the base member and the first guide. The second sensor is a tactile sensor, and is provided between the base member and the second guide. A substrate transfer device characterized by the above.

8. In the substrate transfer device according to claim 7, In the first guide, the support portion and the wall portion are separated from each other. The first sensor is provided between the base member and the support portion of the first guide. In the second guide, the support portion and the wall portion are separated from each other. The second sensor is provided between the base member and the support portion of the second guide. A substrate transfer device characterized by the above.

9. In the substrate transfer device according to claim 7, The control unit When the first sensor detects a predetermined load, it determines that a substrate is placed on the first guide. When the second sensor detects a predetermined load, it determines that a substrate is placed on the second guide. A substrate transfer device characterized by the above.

10. In the substrate transfer device according to claim 7, The first sensor is embedded in a first recess formed in the base member. The second sensor is embedded in a second recess formed in the base member. A substrate transfer device characterized by the above.

11. In a substrate processing device including the substrate transfer device according to claim 1, It includes a single-wafer processing unit that processes the substrates transported by the hand one by one. A substrate processing device characterized by the above.

Images