Substrate conveyance device and substrate processing device including the same

Abstract

To provide a substrate conveyance device capable of efficiently conveying a substrate, and a substrate processing device including the same.SOLUTION: An indexer robot IR includes: first hands 19 and 21; at least two guides 67 which sandwich the outer peripheral surface of a dummy substrate DW, and hold the substrate so as to be separated from the hands; a moving piece 71 for driving at least the one guide out of at least the two guides 67 as a moving guide to advance or retract with respect to the dummy substrate DW; a servo motor 79; and a ball screw 83. The indexer robot IR acquires initial position information P0 and periodic position information P1 and P2 indicating a position in a horizontal surface where the guides 67 sandwich the outer peripheral surface of the dummy substrate DW, by a tactile sensor 73 and an encoder 81. The indexer robot IR determines whether the degree of consumption of the guides 67 exceeds first consumption F1 and second consumption F2 on the basis of the acquired initial position information P0 and periodic position information P1 and P2.SELECTED DRAWING: Figure 25

Description

Technical Field

[0001] The present invention relates to a substrate transfer device for transferring substrates such as semiconductor substrates, substrates for flat panel displays (FPD) such as liquid crystal display and organic EL (Electroluminescence) display devices, glass substrates for photomasks, and substrates for optical discs, and a substrate processing device including the same.

Background Art

[0002] Conventionally, as this type of device, there is one including a substrate transfer device for transferring a substrate and a processing unit for processing the substrate. The substrate transfer device includes a hand for gripping the substrate. The hand includes a fixed guide fixed to the tip side and a movable guide provided on the base end side and movable back and forth by a drive mechanism. The hand grips the substrate by pressing the movable guide against the fixed guide with the substrate supported by the fixed guide (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in the case of the conventional example having such a configuration, there are the following problems. That is, in the conventional device, the fixed guide and the movable guide are worn as the hand repeatedly grips the substrate. The wear state of the fixed guide and the movable guide is visually judged by an operator. Therefore, if the wear state is not properly judged, a transfer failure may occur where the substrate cannot be properly transferred. As a result, there is a problem that the substrate cannot be efficiently transferred.

[0005] The present invention has been made in view of such circumstances, and an object thereof is to provide a substrate transfer device capable of efficiently transferring a substrate and a substrate processing device including the same.

Means for Solving the Problems

[0006] In order to achieve such an object, the present invention has the following configuration. That is, the present invention provides a substrate transfer device for transferring a substrate, including a hand that holds the substrate in a horizontal posture, a horizontal drive mechanism that drives the hand to advance and retreat in a horizontal plane to transfer the substrate, at least two guides provided on the hand that sandwich the outer peripheral surface of the substrate and hold the substrate separated from the hand, an advance and retreat drive mechanism that drives at least one of the at least two guides to advance and retreat with respect to the substrate as a movable guide, an acquisition unit that acquires clamping position information indicating a position in the horizontal plane where the guide sandwiches the outer peripheral surface of the substrate, and a control unit that determines the degree of wear of the guide based on the acquired clamping position information.

[0007] According to the substrate transfer device of the present invention, clamping position information indicating a position in the horizontal plane where the guide sandwiches the outer peripheral surface of the substrate is acquired, and the degree of wear of the guide is determined based on the acquired clamping position information. The clamping position information changes depending on the degree of wear of the guide. By determining the degree of wear of the guide, it is possible to make it difficult to cause a transfer failure of the substrate. As a result, it is possible to provide a substrate transfer device capable of efficiently transferring a substrate.

[0008] Further, in the substrate transfer device according to the present invention, it is preferable that the control unit calculates difference information between the clamping position information of the guide in the initial state and the acquired clamping position information of the guide, and determines the degree of wear based on the difference information (Claim 2). Thereby, by comparing the clamping position information of the guide in the initial state with the acquired clamping position information of the guide, the degree of wear of the guide can be accurately detected.

[0009] Also, in the substrate transfer device according to the present invention, it is preferable that the control unit performs first control when the difference information exceeds a first threshold value (Claim 3). Thereby, when the degree of wear of the guide reaches such a level that the difference information exceeds the first threshold value, appropriate control can be performed.

[0010] Also, in the substrate transfer device according to the present invention, it is preferable that the control unit performs second control when the difference information exceeds a second threshold value which is larger than the first threshold value in terms of the degree of wear (Claim 4). Thereby, when the degree of wear of the guide reaches such a large level that the difference information exceeds the second threshold value, more appropriate control can be performed.

[0011] Also, in the substrate transfer device according to the present invention, the forward and backward drive mechanism includes a motor that provides a driving force for the forward and backward drive, and a sensor that detects the rotation of the motor and outputs it as a detection signal. It is preferable that the acquisition unit acquires the clamping position information based on the detection signal provided by the sensor (Claim 5). Thereby, the degree of wear can be suitably determined using the output from the sensor that detects the rotation of the motor.

[0012] Also, in the substrate transfer device according to the present invention, the forward and backward drive mechanism includes a measurement unit that measures the moving distance of the guide and outputs it as a measurement signal. It is preferable that the acquisition unit acquires the clamping position information based on the measurement signal provided by the measurement unit (Claim 6). Thereby, the degree of wear can be suitably determined using the output from the measurement unit that measures the moving distance of the guide.

[0013] Also, in the substrate transfer device according to the present invention, it is preferable that the control unit causes an output unit that outputs information to output information corresponding to the degree of wear according to the degree of wear (Claim 7). Thereby, the operator can recognize the degree of wear of the guide.

[0014] In addition, in the substrate transfer device according to the present invention, it is preferable that the control unit stops the transfer of the substrate according to the degree of wear (Claim 8). Thereby, it is possible to prevent transfer failures of the substrate in advance.

[0015] In addition, in the substrate transfer device according to the present invention, it is preferable that the control unit operates the guide so that the contact position between the guide and the outer peripheral surface of the substrate changes according to the degree of wear (Claim 9). Thereby, the service life of the guide can be extended as compared with the case where the contact position is not changed.

[0016] The substrate processing apparatus according to the present invention is characterized by including the substrate transfer device according to any one of the above, and a processing unit that performs a predetermined process on the substrate transferred by the substrate transfer device (Claim 10). As a result, it is possible to provide a substrate processing apparatus that can efficiently process a substrate as a result of being able to efficiently transfer the substrate.

[0017] In addition, in the substrate processing apparatus according to the present invention, it is preferable that the substrate held by the guide when the holding position information is acquired is the substrate to be processed by the processing unit (Claim 11). Thereby, it is possible to determine the degree of wear of the guide while operating the substrate processing apparatus normally.

[0018] In addition, in the substrate processing apparatus according to the present invention, it is preferable that the substrate held by the guide when the holding position information is acquired is a dummy substrate that is not processed by the processing unit (Claim 12). Thereby, it is possible to determine the degree of wear of the guide without being affected by differences in the shape of the substrate.

[0019] In addition, in the substrate processing apparatus according to the present invention, it is preferable that the dummy substrate is placed in the substrate processing apparatus in advance, and the degree of wear is determined at a preset cycle (Claim 13). Thereby, it is possible to regularly determine the degree of wear of the guide in the substrate processing apparatus.

[0020] In addition, in the substrate processing apparatus according to the present invention, it preferably includes a carrier placement unit on which a carrier capable of accommodating a plurality of substrates is placed, and the substrate transfer device is a transfer robot that transfers the substrates placed on the carrier (Claim 14). Thereby, it is possible to determine the degree of wear of the guide of the transfer robot that transfers the substrates placed on the carrier.

[0021] In addition, in the substrate processing apparatus according to the present invention, it includes a carrier placement unit on which a carrier capable of accommodating a plurality of substrates is placed, and a temporary placement unit on which the substrates transferred from the carrier are temporarily placed, and the substrate transfer device is preferably a transfer robot that transfers the substrates placed on the temporary placement unit to the processing unit (Claim 15). Thereby, it is possible to determine the degree of wear of the guide of the transfer robot that transfers the substrates placed on the temporary placement unit to the processing unit.

Advantages of the Invention

[0022] According to the substrate transfer device and the substrate processing apparatus including the same according to the present invention, by acquiring the clamping position information of the guide, it is possible to determine the degree of wear of the guide and perform various controls on the wear of the guide. As a result, it is possible to provide a substrate transfer device capable of efficiently transferring substrates and a substrate processing apparatus including the same.

Brief Description of the Drawings

[0023]

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BEST MODE FOR CARRYING OUT THE INVENTION

[0024] The present invention will be described below with reference to various examples.

EXAMPLE

[0025] Hereinafter, Example 1 of the present invention will be described with reference to the drawings.

[0026] FIG. 1 is a plan view showing the overall configuration of a substrate processing apparatus according to Example 1. FIG. 2 is a view of the substrate processing apparatus in FIG. 1 as seen from the rear X.

[0027] <1. Overall Configuration>

[0028] The substrate processing apparatus 1 includes a loading / unloading block 3, an indexer block 5, and a processing block 7.

[0029] The substrate processing apparatus 1 processes a substrate W. For example, the substrate processing apparatus 1 performs a cleaning process on the substrate W. The substrate processing apparatus 1 processes the substrate W in a single-wafer type in the processing block 7. The single-wafer type processes one substrate W at a time in a horizontal posture. The substrate W, for example, has a circular shape in plan view.

[0030] In this specification, for convenience, the direction in which the loading / unloading block 3, the indexer block 5, and the processing block 7 are arranged is referred to as the "front-rear direction X". The front-rear direction X is horizontal. Among the front-rear direction X, the direction from the processing block 7 toward the loading / unloading block 3 is referred to as "front". The direction opposite to the front is referred to as "rear". The horizontal direction orthogonal to the front-rear direction X is referred to as the "width direction Y". One direction of the "width direction Y" is appropriately referred to as "right". The direction opposite to the right is referred to as "left". The direction perpendicular to the horizontal direction is referred to as the "vertical direction Z". In each figure, for reference, front, rear, right, left, up, and down are appropriately shown.

[0031] <2. Loading / Unloading Block>

[0032] The loading / unloading block 3 includes a loading section 9 and an unloading section 11. The loading section 9 and the unloading section 11 are arranged in the width direction Y. A plurality of (for example, 25) substrates W are stacked and stored in a single carrier C in a horizontal posture at regular intervals. The carrier C storing the unprocessed substrate W is placed on the loading section 9. The loading section 9, for example, includes two mounting tables 13 on which the carrier C is placed. The carrier C has a plurality of grooves (not shown) that separate the surfaces of the substrates W and accommodate the substrates W one by one. The carrier C, for example, accommodates the substrates W with their surfaces facing upward. Examples of the carrier C include a FOUP (Front Opening Unify Pod). The FOUP is a sealed container. The carrier C may be an open container, regardless of the type.

[0033] The ejection unit 11 is disposed on the opposite side of the loading unit 9 across the central part in the width direction Y in the substrate processing apparatus 1. The ejection unit 11 is arranged to the left Y of the loading unit 9. The ejection unit 11 stores the processed substrate W in the carrier C and ejects the entire carrier C. The ejection unit 11 that functions in this way, like the loading unit 9, includes, for example, two mounting tables 13 for mounting the carrier C. The loading unit 9 and the ejection unit 11 are also called load ports.

[0034] <3. Indexer Block>

[0035] The indexer block 5 is disposed adjacent to the rear X of the loading / unloading block 3 in the substrate processing apparatus 1. The indexer block 5 includes an indexer robot IR and a delivery unit 15.

[0036] The indexer robot IR is configured to be rotatable around the vertical direction Z. The indexer robot IR is configured to be movable in the width direction Y. The indexer robot IR includes a first hand 19 and a second hand 21. In FIG. 1, only one hand is shown due to the illustration relationship. The first hand 19 and the second hand 21 hold the substrate W in a horizontal posture. The first hand 19 and the second hand 21 sandwich the outer peripheral surface of the substrate W and hold the substrate W while separating it from the upper surfaces of the first hand 19 and the second hand 21.

[0037] The first hand 19 and the second hand 21 each hold one substrate W. The first hand 19 and the second hand 21 are configured to be independently movable forward and backward in the front-rear direction X. The indexer robot IR moves in the width direction Y and rotates around the vertical direction Z, and advances and retreats the first hand 19 and the second hand 21 to transfer the substrate W to and from each carrier C. Similarly, the indexer robot IR transfers the substrate W to and from the delivery unit 15.

[0038] The delivery unit 15 is disposed at the boundary with the processing block 7 among the index blocks 5. The delivery unit 15 is disposed, for example, at the central portion in the width direction Y. As shown in FIG. 2, the delivery unit 15 is formed long in the vertical direction Z.

[0039] The delivery unit 15 includes, from the lower side to the upper side in the vertical direction Z, a first inversion unit 23, a path unit 25, a path unit 27, a second inversion unit 29, and a dummy substrate placement unit 30.

[0040] The first inversion unit 23 inverts the top and bottom of the substrate W received from the index block 5. The first inversion unit 23 inverts the horizontal posture of the substrate W. Specifically, the first inversion unit 23 converts the substrate W with its surface facing upward into a posture with its surface facing downward. In other words, the posture of the substrate W is converted so that its back surface faces upward.

[0041] The second inversion unit 29 performs the reverse operation. That is, the second inversion unit 29 inverts the top and bottom of the substrate W received from the processing block 7. The second inversion unit 29 converts the substrate W with its surface facing downward into a posture with its surface facing upward. In other words, the posture of the substrate W is converted so that its back surface faces downward.

[0042] The inversion directions of the first inversion unit 23 and the second inversion unit 29 described above may be opposite to each other. That is, the first inversion unit 23 converts the posture of the substrate W so that its surface faces upward. The second inversion unit 29 converts the posture of the substrate W so that its back surface faces upward.

[0043] The path units 25 and 27 are used to transfer the substrate W between the index block 5 and the processing block 7. The path unit 25 is used, for example, to convey the substrate W from the processing block 7 to the index block 5. The path unit 27 is used, for example, to convey the substrate W from the index block 5 to the processing block 7. Note that the conveyance directions of the substrate W in the path units 25 and 27 may be opposite to each other.

[0044] The dummy substrate placement section 30 has a dummy substrate DW placed thereon that is sandwiched by a guide 67 in order to detect the degree of wear of the guide 67 described later. The dummy substrate DW may be sandwiched by the guide 67 of the indexer robot IR or may be sandwiched by the guide 67 of the center robot CR.

[0045] <4. Processing block>

[0046] Processing block 7 performs various processes on the substrate W, for example. Examples of the process include a cleaning process. The cleaning process is, for example, a process liquid cleaning process in which only a cleaning liquid is supplied, or a brush cleaning process using a brush in addition to the process liquid.

[0047] As shown in FIG. 1, processing block 7 is divided into, for example, a first row R1, a second row R2, and a third row R3 in the width direction Y. Specifically, the first row R1 is arranged on the left side Y. The second row R2 is arranged at the center of the width direction Y. In other words, the second row R2 is arranged on the right side Y of the first row R1. The third row R3 is arranged on the right side Y of the second row R2.

[0048] <4-1. First row>

[0049] The first row R1 of processing block 7 includes a plurality of processing units 31. The first row R1 includes, for example, four processing units 31. The first row R1 has four processing units 31 stacked and arranged in the vertical direction Z. Each processing unit 31 is, for example, a cleaning unit. The cleaning unit cleans the substrate W. As the cleaning unit, there are a surface cleaning unit that cleans the surface of the substrate W and a back surface cleaning unit that cleans the back surface of the substrate W. In this embodiment, the back surface cleaning unit SSR is taken as an example to explain the processing unit 31.

[0050] <4-2. Second row>

[0051] The second column R2 of processing block 7 is equipped with the center robot CR. The center robot CR is configured to be rotatable around the vertical direction Z. The center robot CR is configured to be movable up and down in the vertical direction Z. The center robot CR includes, for example, a first hand 33 and a second hand 35. The first hand 33 and the second hand 35 each hold one substrate W. The first hand 33 and the second hand 35 are each independently configured to be movable back and forth in the front-rear direction X and the width direction Y.

[0052] The first hand 33 and the second hand 35 hold the substrate W in a horizontal posture. The first hand 33 and the second hand 35 sandwich the outer peripheral surface of the substrate W and hold the substrate W spaced apart from the upper surfaces of the first hand 33 and the second hand 35.

[0053] <4-3. Third column>

[0054] The third column R3 of processing block 7 has the same configuration as the first column R1. That is, the third column R3 includes a plurality of processing units 31. The third column R3 includes, for example, four processing units 31. The four processing units 31 of the third column R3 are arranged stacked in the vertical direction Z. Each processing unit 31 of the first column R1 and each processing unit 31 of the third column R3 are arranged to face each other in the width direction Y. Thereby, the center robot CR can access each of the opposing processing units 31 of the first column R1 and the third column R3 at the same height in the vertical direction Z.

[0055] Processing block 7 is configured as described above. Here, an operation example of the center robot CR will be briefly described. The center robot CR receives the substrate W from the first inversion unit 23, for example. The center robot CR transports the substrate W to the back surface cleaning unit SSR in either the first row R1 or the third row R3 to perform a cleaning process on the back surface of the substrate W. The center robot CR receives the substrate W on which the cleaning process has been performed by the back surface cleaning unit SSR in either the first row R1 or the third row R. The center robot CR transports the substrate W to the second inversion unit 29. The index robot IR receives the substrate W from the second inversion unit 29 and stores it in the carrier C.

[0056] Note that the dummy substrate DW described above is a substrate that is not processed by the processing unit 31 described above. The dummy substrate DW is used for measuring the degree of wear of the guide 67 and adjusting the position of the hand of the index robot IR or the center robot IR.

[0057] <5. Mounting table>

[0058] Here, with reference to FIGS. 1 and 3, the three above-described loading / unloading blocks will be described in detail. FIGS. 3(a) to (e) are side views showing the configuration and operation of the loading / unloading blocks.

[0059] The loading / unloading block 3 includes a mounting table 13, an opening 39, and a lid opening / closing mechanism 41. The mounting table 13 has the carrier C mounted thereon. The mounting table 13 includes a mechanism (not shown) for moving the carrier C in the front-rear direction X. The mounting table 13 can move the carrier C forward and backward with respect to the opening 39. The carrier C has a loading / unloading port CT. The loading / unloading port CT is formed on one side surface of the carrier C. A plurality of substrates W stacked and stored in the carrier C are loaded / unloaded through the loading / unloading port CT. The carrier C includes a lid CL. The lid CL is detachably configured at the loading / unloading port CT of the carrier C. The lid CL seals the inside of the carrier C. When the lid CL is attached to the carrier C, the atmosphere inside the carrier C is blocked from the outside.

[0060] The lid opening / closing mechanism 41 has a detachable unit 43 in the forward X direction. The detachable unit 43 removes the lid CL from the carrier C or attaches the lid CL to the carrier C. The detachable unit 43 is movable in the vertical direction Z and the front-rear direction X while holding the lid CL. The lid opening / closing mechanism 41 is movable in the front-rear direction X at the opening 39 while holding the lid CL. The lid opening / closing mechanism 41 is movable up and down in the vertical direction Z while holding the lid CL. The lid opening / closing mechanism 41 can move downward in the vertical direction Z from the opening 39 while holding the lid CL. By descending while holding the lid CL, the lid opening / closing mechanism 41 can fully open the opening 39.

[0061] First, as shown in FIG. 3(a), the carrier C is placed on the mounting table 13. A plurality of substrates W are stacked and stored in the carrier C and are closed by the lid CL. At this time, the lid opening / closing mechanism 41 positions the detachable unit 43 at the opening 39. Thereby, the inside of the index block 5 is separated from the external atmosphere.

[0062] As shown in FIG. 3(b), the mounting table 13 moves the carrier C rearward in the X direction. The carrier C has the loading outlet CT and the lid CL positioned at the opening 39. At this time, the detachable unit 43 releases the lock of the lid CL and holds the lid CL. The holding is performed, for example, by the detachable unit 43 sucking the lid CL.

[0063] As shown in FIG. 3(c), the lid opening / closing mechanism 41 moves rearward in the X direction. Thereby, the lid CL is moved rearward in the X direction from the opening 39. The lid CL is moved inside the index block 5.

[0064] As shown in FIG. 3(d), the lid opening / closing mechanism 41 moves downward in the vertical direction Z. The lid opening / closing mechanism 41 lowers the detachable unit 43 to the lower part of the loading outlet CT. The lid opening / closing mechanism 41 lowers until the upper part of the detachable unit 43 is positioned at the lower part of the opening 39.

[0065] As shown in Fig. 3(e), the lid opening / closing mechanism 41 moves downward in the vertical direction Z and moves to the lowermost position where the lid opening / closing mechanism 41 can move. The lid opening / closing mechanism 41 descends to a position where the detachable unit 43 does not overlap with the opening 39 in the front-rear direction X. As a result, the opening 39 is fully opened. A plurality of substrates W in the carrier C can face the index block 5 through the opening 39.

[0066] The above-described lid opening / closing mechanism 41 includes, for example, a substrate sensor 45 in the detachable unit 43. The substrate sensor 45 is used to detect the position of the substrate W stacked and stored in the carrier C or to collect shape information based on the outer edge of the substrate W. The shape information includes information regarding the thickness based on the outer edge of the substrate W.

[0067] <6. Mounting portion>

[0068] Here, referring to Figs. 4 and 5, a part of the above-described processing unit 31 will be described. Fig. 4 is a side view showing a first example of the mounting portion provided in the processing unit. Fig. 5 is a side view showing a second example of the mounting portion provided in the processing unit.

[0069] The above-described processing unit 31 is assumed to be a back surface cleaning unit SSR. Such a back surface cleaning unit SSR includes, for example, either one of two types of mounting portions 47 (mounting portions 47A and 47B) as described below. The mounting portion 47 is a place where the substrate W is mounted in the back surface cleaning unit SSR. The mounting portion 47 supports the lower surface of the substrate W. In addition to such two types of mounting portions 47 (mounting portions 47A and 47B), there is also a mounting portion that holds the substrate W by suction.

[0070] As shown in FIG. 4, the mounting portion 47A includes a turntable 49 and support pins 51. The turntable 49 has a circular shape in plan view. The turntable 49 has a diameter slightly larger than that of the substrate W. There are a plurality of support pins 51. The support pins 51 are erected on the upper surface of the turntable 49. The support pins 51 are arranged on the upper surface slightly inside from the outer peripheral surface of the turntable 49. Some of the support pins 51 rotate eccentrically around the axis in the vertical direction Z. The substrate W is pressed horizontally from the outer peripheral surface by the support pins 51 that rotate in this way, and the position is fixed by the plurality of support pins 51. The support pins 51 abut against the outer peripheral surface and the lower surface of the substrate W, and support the lower surface of the substrate W while being separated from the upper surface of the turntable 49.

[0071] Here, the distance between the upper surface of the turntable 49 and the lower surface of the substrate W supported by the support pins 51 is referred to as a clearance CL1. In the mounting portion 47A in this first example, the clearance CL1 is relatively large. The clearance CL1 is larger than the thickness DP of the first hand 33 and the second hand 35. The thickness DP corresponds to the maximum height in the vertical direction Z when the portion that enters the position where the substrate W is transferred among the first hand 33 and the second hand 35 is viewed from the side.

[0072] In the cleaning unit SSR provided with such a mounting portion 47A, it is preferable to access with a lower take-off hand described later. In addition, in the mounting portion 47A, it is also possible to access with an upper take-off hand described later.

[0073] As shown in FIG. 5, the placement portion 47B includes a turntable 53 and support protrusions 55. The turntable 53 has a circular shape in plan view. The turntable 53 is provided with an injection port (not shown) for supplying gas to the lower surface of the substrate W. The support protrusions 55 are formed on the upper surface of the turntable 53. There are a plurality of support protrusions 55. The support protrusions 55 are formed slightly inside the outer peripheral surface of the turntable 53. The support protrusions 55 abut against the lower surface of the substrate W and support the lower surface of the substrate W while being spaced apart from the upper surface of the turntable 55. The substrate W is supported so as to be attracted to the support protrusions 55 and the turntable 55 by the negative pressure generated by the supply of gas. Thereby, the position of the substrate W is fixed. The clearance CL2 of this placement portion 47B is relatively small. The clearance CL2 is smaller than the clearance CL1. The clearance CL2 is smaller than the thickness DP of the first hand 33 and the second hand 35.

[0074] In the cleaning unit SSR provided with such a placement portion 47A, it is preferable to access with the pickup hand described later.

[0075] <7. Details of the Hand>

[0076] Here, with reference to FIGS. 6 to 10, the first hand 19 in the index robot IR will be described as an example. Note that the configuration of the first hand 19 is the same as that of the second hand 21 and the first hand 33 and the second hand 35 in the center robot CR.

[0077] The index robot IR includes a horizontal drive mechanism 57. The horizontal movement mechanism 57 drives the first hand 19 in the front-rear direction X. The horizontal movement mechanism 57 drives the first hand 19 to advance and retreat in the horizontal direction. The horizontal movement mechanism 57 drives the first hand 19 to advance and retreat with respect to the delivery destination. Specifically, the delivery destination in the index robot IR drives the first hand 19 to advance and retreat with respect to the carrier C and the delivery unit 15. Note that the horizontal movement mechanism 57 in the center robot CR also drives the first hand 33 and the second hand 35 to advance and retreat in the width direction Y together with the front-rear direction X.

[0078] The first hand 19 has one palm portion 59 and two finger portions 61. The palm portion 59 is the base end side of the first hand 19. The finger portion 61 is the tip end side of the first hand 19. The first hand 19 enters the delivery destination from the tip end side of the first hand 19 and exits from the base end side of the first hand 19. The palm portion 59 has an attachment base end 63 and a finger portion attachment portion 65. The attachment base end 63 is attached to the horizontal drive mechanism 57. The finger portion 61 is attached to the finger portion attachment portion 65. The finger portion attachment portion 65 is provided at two locations spaced apart in the width direction Y. When the first hand 19 advances to the position where the substrate W is to be delivered, the portion of the finger portion attachment portion 65 to which the two finger portions 61 are attached is located outside the outer circumferential surface of the substrate W in a plan view. In other words, the length of the finger portion 61 in the front-rear direction X is longer than the diameter of the substrate W.

[0079] The first hand 19 has two finger portions 61. The two finger portions 61 extend in the front-rear direction X. The two finger portions 61 are spaced apart from each other in the width direction Y. The distance between the two finger portions 61 does not exceed the diameter of the substrate W. In other words, the width direction Y of the two finger portions 61 falls within the diameter of the substrate W. The base end side of the finger portions 61 is attached to the finger portion attachment portion 65. The tip side of the finger portions 61, which is opposite to the base end side, is in an open state. The first hand 19 has a U-shape in a plan view with the palm portion 59 and the two finger portions 61.

[0080] The first hand 19 has three guides 67. The first hand 19 has three guides 67 attached to its upper surface. The finger portion 61 has one guide 67 on the tip side. A structure in which the guides 67 are attached to the upper surface of the finger portion 61, like this first hand 19, is called a "trade-in hand." The first hand 19, which has a trade-in hand structure, holds the substrate W by scooping it up from below.

[0081] As shown in FIG. 8, the guide 67 of the finger portion 61 is attached to the guide hole 69. The guide hole 69 is long in the front - rear direction X. At the bottom of the guide hole 69, a moving piece 71 is arranged. The moving piece 71 is movable only in the front - rear direction X at the bottom of the guide hole 69. A tactile sensor 73 is attached to the moving piece 71. The tactile sensor 73 is attached to the upper surface of the moving piece 71.

[0082] The tactile sensor 73 has a detection surface 75 that can detect the forces applied to each of the three mutually orthogonal axes. The tactile sensor 73 is attached to the moving piece 71 in a posture where the detection surface 75 is directed upward. The guide 67 is attached to the detection surface 75. The bottom of the guide 67 is attached to the detection surface 75. The tactile sensor 73 can detect the force applied to the guide 67 in each of the three - axis directions. The tactile sensor 73 detects the forces applied in the front - rear direction X, the width direction Y, and the vertical direction Z. The tactile sensor 73 outputs an electrical signal corresponding to each of the forces detected in the three - axis directions.

[0083] In the finger portion 61, a lateral hole 77 is formed in the front - rear direction X from the guide hole 69. The lateral hole 77 penetrates through to the palm portion 59. A servo motor 79 is provided at a location in the palm portion 59 corresponding to the end of the lateral hole 77. The servo motor 79 is equipped with an encoder 81. The encoder 81 detects the rotational position (rotation angle) of the rotation shaft of the servo motor 79 and outputs it as position information in an electrical signal. A ball screw 83 is inserted into the lateral hole 77. One end side of the ball screw 83 is connected to the rotation shaft of the servo motor 79. The other end side of the ball screw 83 is screwed to the moving piece 71. When the servo motor 79 is rotationally driven, the ball screw 83 rotates, and the moving piece 71 moves in the front - rear direction X along the guide hole 69. Thereby, the guide 67 moves in the front - rear direction X.

[0084] As shown in FIG. 9, the palm portion 59 is provided with a pusher 87. The pusher 87 is provided with one guide 67. The pusher 87 has the same configuration as that for driving the guide 67 of the finger portion 61, except for the pusher arm 89 and the guide hole 91.

[0085] That is, the pusher 87 includes a tactile sensor 73, a lateral hole 77, a ball screw 83, a servo motor 79, an encoder 81, and a pusher arm 89. One end side of the lateral hole 77 penetrates the side surface on the finger portion 61 side. A guide hole 91 is formed on the finger portion 61 side of the lateral hole 77. The guide hole 91 has a larger dimension in the vertical direction Z than the lateral hole 77. A part of the pusher arm 89 is inserted into the guide hole 91 so as to be movable in the front-rear direction X. The other end side of the lateral hole 77 is closed inside the palm portion 59. A servo motor 79 is disposed on the other end side of the lateral hole 77. The servo motor 79 includes an encoder 81. One end side of the ball screw 83 is connected to the rotation shaft of the servo motor 79. The pusher arm 89 is screwed to the other end side of the ball screw 83. The pusher arm 89 is provided with the tactile sensor 73 on the side opposite to the servo motor 79 in the front-rear direction X. The guide 67 is attached to the detection surface 75 of the tactile sensor 73.

[0086] Each of the above-described guides 67 is configured to be movable by a predetermined distance in the front-rear direction X. Each of the above-described guides 67 is movable, for example, by a distance of about 5 mm in the front-rear direction X.

[0087] The first hand 19 has three guides 67 on its upper surface. The first hand 19 holds the substrate W in a state where the lower surface of the substrate W is spaced upward from the upper surface of the finger portion 61. Specifically, the outer peripheral surface of the substrate W is clamped by the three guides 67, and the substrate W is held in a state where the lower surface of the substrate W floats from the upper surface of the finger portion 61. The first hand 19 holds the substrate W in a state of contacting only the outer peripheral surface of the substrate W. The first hand 19 moves the three guides 67 toward the outer peripheral surface of the substrate W, thereby clamping the outer peripheral surface of the substrate W with the three guides 67 and holding the substrate W in a state of being spaced apart from the upper surface of the finger portion 61.

[0088] The first hand 19 has three guides 67 on its upper surface, but it may be configured as shown in FIG. 10. FIG. 10 is a side view of the pick-up hand according to the embodiment.

[0089] Unlike the first hand 19, the first hand 19D has three guides 67 attached to its lower surface. Specifically, the two finger portions 61 each have one guide 67 on the lower surface at the tip side. The palm portion 59 has one guide 67 on the lower surface at the tip side. This first hand 19D is referred to as an "upper pick-up hand". The first hand 19D having the structure of the upper pick-up hand holds the substrate W so as to lift it upward from above.

[0090] The first hand 19D drives the three guides 67 by the same configuration except that the attachment surface of the guide 67 is different from that of the first hand 19 described above. Therefore, a detailed description of the drive mechanism will be omitted.

[0091] Each of the above-described guides 67 is preferably made of, for example, PBI (polybenzimidazole). This is because PBI has high heat resistance, excellent chemical resistance, and toughness. However, each guide 67 may be made of other materials. Examples of other materials include fluororesins such as PTFE (polytetrafluoroethylene) and PFA (perfluoroalkoxyalkane).

[0092] <8. Control System>

[0093] Referring to FIG. 11, the control system of the substrate processing apparatus 1 described above will be described. FIG. 11 is a block diagram showing the control system.

[0094] The substrate processing apparatus 1 is comprehensively controlled by a control unit CU. The control unit CU includes a CPU and a memory. The control unit CU conveys the substrate W to the processing unit 31 based on a recipe that defines the processing procedure and conditions of the substrate W, etc., and performs processing.

[0095] The shape information storage unit 93 stores the shape information for each substrate W obtained by the substrate sensor 45 in association with the substrate W. The shape information includes the thickness of the substrate W. The shape information includes the warp of the substrate W. The shape information storage unit 93 is referred to for the shape information by the control unit CU.

[0096] The shape information storage unit 93 also stores the shape information of the dummy substrate DW described above. The shape information of the dummy substrate DW is used when the dummy substrate DW is held by the guide 67.

[0097] The clamping information storage unit 95 stores the center position of the substrate W corresponding to the position of the guide 67 when the substrate W is held by the first hand 19. The center position of the substrate W is acquired by the control unit CU via the clamping control unit 97 described later, and is written into the clamping information storage unit 95 by the control unit CU.

[0098] The clamping information storage unit 95 also stores in advance the clamping information according to the shape of the substrate W. The clamping information is associated with the shape information of the substrate W. The clamping information is the biasing force applied to the guide 67. The clamping information is information related to the biasing force applied to the guide 67 by the servo motor 79. The biasing force applied from the guide 67 to the substrate W and the torque applied from the servo motor 79 to the ball screw 83 are, for example, smaller as the substrate W is thinner. These biasing forces and torques are, for example, smaller as the substrate W is more warped. These biasing forces and torques are, for example, larger as the substrate W is thick and has no warp.

[0099] The clamping information is the biasing force or torque when the substrate W having various shapes is actually held by the first hand 19 in advance, and at that time, the substrate W and the guide 67 are not damaged and the substrate W can be held so as not to fall. The clamping information may be stored in advance in a separate device (not shown) and downloaded from a host computer (not shown) via a network.

[0100] The clamping information storage unit 95 also stores the clamping information in advance according to the shape of the dummy substrate DW described above. The clamping information of the dummy substrate DW is used when the dummy substrate DW is clamped by the guide 67.

[0101] The processing unit 31 is composed of a back surface cleaning unit SSR and the like. The processing unit 31 includes the placement units 47A and 47B described above. The processing of the processing unit 31 is controlled by the control unit CU. The control unit CU stores in advance which processing unit 31 includes the placement unit 47A and which processing unit 31 includes the placement unit 47B.

[0102] The indexer robot IR is controlled by the control unit CU. The movement of the indexer robot IR in the front-rear direction X, the width direction Y, and the vertical direction Z is operated by the control unit CU. The movement of the first hand 19 and the second hand 21 in the front-rear direction X is operated by the control unit CU via the horizontal movement mechanism 57.

[0103] The clamping control unit 97 independently operates the movement of each of the three guides 67. The clamping control unit 97 is operated by the control unit CU. The clamping control unit 97 operates each servo motor 79 based on an instruction from the control unit CU to independently move the three guides 67. At that time, the clamping control unit 97 operates the servo motor 79 according to the position information from the encoder 81. The clamping control unit 97 operates the drive current to the servo motor 79. The clamping control unit 97 can detect the drive current supplied to the servo motor 79.

[0104] When the holding control unit 97 detects, via the tactile sensor 73, that the guide 67 has come into contact with the outer peripheral surface of the substrate W, the holding control unit 97 adjusts the biasing force exerted on the outer peripheral surface of the substrate W by the guide 67 according to the shape information from the shape information storage unit 93, and holds the substrate W. At this time, the guide 67 does not necessarily move from the outer peripheral surface side to the center side of the substrate W. That is, the guide 67 may not move in the direction of the center of the substrate W only by increasing the torque of the servo motor 79 to strengthen the biasing force on the outer peripheral surface of the substrate W.

[0105] When the first hand 19 holds the substrate W by holding the substrate W with the three guides 67, the control unit CU calculates the center position of the substrate W based on the moving distance of the guide 67 at that time and stores it in the holding information storage unit 95. Generally, the center position of the substrate W when the substrate W is held and stored in the holding information storage unit 95 is deviated from the designed center position of the substrate W in the first hand 19. The holding information, which is the center position of the substrate W stored in the holding information storage unit 95, is referred to by the control unit CU, and the control unit CU operates the index robot IR to correct the center position when placing the substrate W on the delivery unit 15, and delivers the substrate W to the delivery unit 15.

[0106] When the dummy substrate position information storage unit 96 stores the position information obtained from the encoder 81 when the above-described dummy substrate DW is held by, for example, the first hand 19. Specifically, the dummy substrate position information storage unit 96 stores the position information obtained from the encoder 81 at the timing when the tactile sensor 73 detects that the guide 67 has come into contact with the outer peripheral surface of the substrate W. The dummy substrate position information storage unit 96 stores the position information separately for the guide 67 of the right finger portion 61, the guide 67 of the left finger portion 61, and the guide 67 of the pusher 87 in the width direction Y. The position information includes the initial position information P0, the periodic position information P1, and P2, which will be described later. The position information is stored in association with the date when the dummy substrate DW is held.

[0107] When the guide 67 is replaced with a new guide 67, the dummy substrate DW is clamped by the new guide 67. When the guide 67 is replaced, the control unit CU may access the dummy substrate placement unit 30 and perform control to clamp the dummy substrate DW. Such control may be performed by the control unit CU when an operator operates an operation unit provided outside the substrate processing apparatus 1.

[0108] When the guide 67 is replaced with a new guide 67, the date when the guide 67 is replaced is stored. When the dummy substrate DW is clamped by the replaced guide 67, the position information acquired from the encoder 81 is stored in the dummy substrate position information storage unit 96 as the position information in the initial state of the guide 67 (hereinafter referred to as the initial position information).

[0109] The control unit CU periodically performs control to clamp the dummy substrate DW by the guide 67 based on the date when the guide 67 is replaced. The dummy substrate position information storage unit 96 also stores the position information (hereinafter referred to as the periodic position information) acquired from the encoder 81 by periodically clamping the dummy substrate DW. Also, the process of acquiring the periodic position information is called periodic measurement.

[0110] Thereby, the process of the guide 67 being consumed from the initial state can be recorded.

[0111] The differential position information storage unit 97 acquires the difference between the initial position information and the periodic position information each time the periodic position information is acquired. For example, the control unit CU obtains the moving distance of the guide 67 in the initial state based on the initial position information. The control unit CU obtains the moving distance of the guide 67 at the time of periodic measurement based on the periodic position information. The control unit CU obtains the difference between the moving distances of the guide 67 in the initial state and at the time of periodic measurement. The differential position information storage unit 97 stores this difference in the moving distance as differential position information. The differential position information is a value indicating the consumption of the guide 67.

[0112] The threshold information storage unit 98 stores the degree of wear of the guide 67, which is an index for replacing the guide 67. The degree of wear of the guide 67 is threshold information for determining whether to issue a notification indicating that the guide 67 needs to be replaced, based on the differential position information. That is, the first threshold information is the numerical value of the differential position information indicating that the guide 67 needs to be replaced. The second threshold information is the numerical value of the differential position information indicating that the guide 67 needs to be replaced immediately.

[0113] The notification control unit 111 performs, for example, two-stage notification according to an instruction from the control unit CU. That is, when the differential position information at the time of periodic measurement is equal to or greater than the first threshold and less than the second threshold, the control unit CU performs the first control. The first control is, for example, control that causes the notification control unit 111 to issue a first warning. The first warning is a warning indicating that the guide 67 needs to be replaced. Specifically, for example, a message such as "Please replace the guide (first warning)" is displayed on the image display unit 113 provided in the substrate control device 1. Instead of displaying the message, a first lamp indicating that the guide 67 needs to be replaced may be lit.

[0114] The notification control unit 111 stores the position information acquired from the encoder 81. If the differential position information of any one of the guides 67 of the right finger part 61, the guide 67 of the left finger part 61, and the guide 67 of the pusher 87 in the width direction Y exceeds the first threshold, the dummy substrate position information storage unit 96 issues the first warning.

[0115] When the differential position information during the regular observation performed after exceeding the first threshold is equal to or greater than the second threshold, the control unit CU performs the second control. The second control is, for example, control that causes the notification control unit 111 to issue a second warning. The second warning is to display a message such as "Please replace the guide immediately (second warning)" on the image display unit 113. Instead of displaying the message, a second lamp indicating that the guide 67 needs to be replaced immediately may be lit. The control unit CU may control the index robot IR not to convey the substrate W until the guide 67 is replaced, either in place of the second warning or together with the second warning.

[0116] The control system of the above-described index robot IR also includes the center robot CR. That is, the control system of the center robot CR includes the clamping control unit 97. Similar to the index robot IR, when the center robot CR clamps the substrate W with three guides 67, the center position of the substrate W is calculated and the calculated center position is stored in the clamping information storage unit 95. The control unit CU operates the center robot CR to transfer the substrate W to and from each processing unit 31 with reference to the center position of the substrate W stored in the clamping information storage unit 95.

[0117] The control using the above-described dummy substrate DW is also performed on the center robot CR.

[0118] <9. Operation Flow>

[0119] With reference to FIGS. 12 to 22, the transfer operation of the substrate W by the index robot IR in the substrate processing apparatus 1 will be described. FIG. 12 is a flowchart for explaining the operations related to transfer. FIGS. 13, 15, 17, 19, 21, and 22 are schematic diagrams for explaining the operations and are views seen from the side. FIGS. 14, 16, 18, and 20 are schematic diagrams for explaining the operations and are views seen from the plane.

[0120] In the following description, the operation of receiving the substrate W from the carrier C will be described as an example.

[0121] Step S1 Obtain the shape information of the substrate W. When the control unit CU removes the lid CL from the carrier C by the detachable unit 43, the substrate sensor 45 obtains the shape information of each substrate W. The control unit CU associates the obtained shape information with each substrate W and stores it in the shape information storage unit 93.

[0122] Step S2 Obtain the clamping information corresponding to the shape information. The control unit CU reads out the clamping information corresponding to the shape information of the substrate W received by the first hand 19 from the clamping information storage unit 95.

[0123] Step S3 As shown in FIGS. 13 and 14, the control unit CU operates the horizontal movement mechanism 57 of the indexer robot IR to move the first hand 19 into the transfer position within the carrier C. Since the first hand 19 is a pickup hand that picks up the substrate W from below, the first hand 19 is moved below the position where the substrate W to be received is placed. At this time, it is preferable that the control unit CU expands the three guides 67 of the first hand 19 to the maximum extent. In other words, the guide 67 of the finger part 61 is moved forward X to the maximum extent, and the guide 67 of the pusher 87 is moved backward X to the maximum extent. Thereby, even if the placement position of the substrate W is greatly deviated, the first hand 19 can surely receive the substrate W.

[0124] Step S4 As shown in FIGS. 15 and 16, the control unit CU moves the first hand 19 to a height at which the substrate W can be clamped. Specifically, the control unit CU operates the indexer robot IR to raise the first hand 19 in the vertical direction Z so that the substrate W is positioned at a height above the upper surface of the finger part 61 and below the upper end of the guide 67.

[0125] Step S5 As shown in FIGS. 17 and 18, the control unit CU operates the clamping control unit 97 to move the three guides 67 of the first hand 19 toward the outer peripheral surface of the substrate W.

[0126] Step S6 The control unit CU branches the process depending on whether or not each guide 67 has come into contact with the outer peripheral surface of the substrate W. Step S5 is repeated until each guide 67 comes into contact with the outer peripheral surface of the substrate W. In other words, until each guide 67 comes into contact with the outer peripheral surface of the substrate W, the movement of each guide 67 toward the outer peripheral surface of the substrate W is maintained. Whether or not it has come into contact with the outer peripheral surface of the substrate W is determined by the signal of the tactile sensor 73.

[0127] Step S7 When each guide 67 comes into contact with the outer peripheral surface of the substrate W, the following operation is performed. As shown in FIGS. 19 and 20, the control unit CU applies a biasing force (indicated by a white arrow in the figure) to the guide 67 according to the clamping information.

[0128] Specifically, the control unit CU refers to the clamping information storage unit 95 and reads out the clamping information corresponding to the substrate W. The control unit CU operates the clamping control unit 97 according to the read clamping information to bias the guide 67. As a result, the substrate W is pressed against by the guide 67 on the outer peripheral surface. Since each guide 67 is biased based on the clamping information, the substrate W can be supported by each guide 67 so that the substrate W does not fall onto the finger portion 61. Further, since each guide 67 is biased based on the clamping information, it is possible to suppress damage to the substrate W and the guide 67.

[0129] Step S8 As shown in FIG. 21, the control unit CU operates the indexer robot IR to move the first hand 19 by a predetermined distance in the vertical direction Z. Next, as shown in FIG. 22, the control unit CU operates the horizontal movement mechanism 57 of the indexer robot IR to retract the first hand 19 from the transfer position of the carrier C. Note that until the substrate W is delivered to the destination, the above-described biasing force (indicated by a white arrow in the figure) is maintained.

[0130] <10. Degree of wear of the guide> Refer to FIGS. 23 to 25. FIG. 23 is a plan view of a hand for explaining the first wear degree of the guide. FIG. 24 is a plan view of a hand for explaining the second wear degree of the guide. FIG. 25 is a side view of a hand for explaining the first and second wear degrees of the guide. Note that the wear of the illustrated guide 67 is enlarged more than the actual for the convenience of illustration.

[0131] Refer to FIGS. 23 and 25. The guide 67 indicated by the broken line shown in FIG. 23 shows a state where it does not sandwich the outer peripheral surface of the dummy substrate DW. The guide 67 indicated by the broken line is not horizontally driven. FIG. 23 shows a guide 67 indicated by a two-dot chain line on the central side of the dummy substrate DW rather than the guide 67 indicated by the broken line. The guide 67 indicated by the two-dot chain line shows a state where it sandwiches the outer peripheral surface of the dummy substrate DW as also shown in FIG. 25(a). The guide 67 indicated by the two-dot chain line is horizontally driven from the position of the guide 67 indicated by the broken line. The guide 67 indicated by the two-dot chain line indicates a new guide 67, that is, a guide 67 with no wear.

[0132] FIG. 23 shows a guide 67 indicated by a solid line on the center side of the dummy substrate DW with respect to the guide 67 indicated by a two-dot chain line. The guide 67 indicated by the solid line shows a state of sandwiching the outer peripheral surface of the dummy substrate DW. Different from the guide 67 indicated by the two-dot chain line, the guide 67 indicated by the solid line has a first wear F1 shown with hatching as a result of being used for a predetermined period. The first wear F1 has occurred in any of the three guides 67. The first wear F1 is, for example, abrasion. The abrasion occurs on the outer peripheral surface of the guide 67 by repeatedly sandwiching the substrate W by the guide 67 for a predetermined period as shown in FIG. 25(b). The guide 67 indicated by the solid line shows a state of sandwiching the outer peripheral surface of the dummy substrate DW at the deepest surface of the portion where the first wear F1 has occurred. The first wear F1 corresponds to a first wear degree indicating the degree of wear of the guide 67. Note that the first wear F1 may be a breakage of the guide 67. The breakage occurs, for example, when the guide 67 sandwiches the substrate W to be processed by the processing unit 31, and the outer peripheral surface of the guide 67 is scraped by the edge (sharp edge) of the substrate W.

[0133] Refer to FIGS. 24 and 25. FIG. 24 shows a guide 67 indicated by a broken line and a guide 67 indicated by a two-dot chain line, similar to FIG. 23. The guide 67 indicated by the solid line shows a state of sandwiching the outer peripheral surface of the dummy substrate DW by a guide 67 in which a second wear F2 having a greater degree of wear than the first wear F1 has occurred. The second wear F2 is abrasion that occurs by further repeatedly sandwiching the substrate W by the guide 67 for a predetermined period from the time when the first wear F1 shown in (b) has occurred as shown in FIG. 25(c). The guide 67 indicated by the solid line shows a state of sandwiching the outer peripheral surface of the dummy substrate DW at the deepest surface of the portion where the second wear F2 has occurred. The second wear F2 corresponds to a second wear degree indicating the degree of wear of the guide 67. The second wear F2 has occurred in any of the three guides 67.

[0134] The point P shown in FIGS. 23 and 24 is the center of the guide 67 indicated by the dashed line in a state where the guide 67 does not sandwich the outer peripheral surface of the dummy substrate DW. The point P0 shown in FIGS. 23, 24, and 25 is the center of the guide 67 indicated by the two-dot chain line in a state where the non-consumed guide 67 sandwiches the outer peripheral surface of the dummy substrate DW. The point P0 is the above-described initial position information. The point P0 is also referred to as the initial position P0 or the initial position information P0. The initial position information P0 is the position information when the center of the guide 67 is moved from the point P to the point P0. The initial position information P0 is the distance from the point P to the point P0.

[0135] The point P1 shown in FIGS. 23 and 25 is the center of the guide 67 indicated by the solid line in a state where the guide 67 with the first wear F1 sandwiches the outer peripheral surface of the dummy substrate DW. The point P2 shown in FIGS. 24 and 25 is the center of the guide 67 indicated by the solid line in a state where the guide 67 with the second wear F2 sandwiches the outer peripheral surface of the dummy substrate DW. The points P1 and P2 are the above-described periodic position information obtained when periodically sandwiching the dummy substrate DW with the guide 67. The point P1 is also referred to as the periodic positions P1, P2 or the periodic position information P1, P2. The periodic position information P1, P2 is the position information when the center of the guide 67 is moved from the point P to the points P1, P2. The periodic position information P1, P2 is the distance from the point P0 to the point P1. Note that the points P0, P1, and P2 are set at the center of the guide 67, but may be set at the front end or the rear end of the guide 67.

[0136] The distance L1 between the initial position P0 and the periodic position P1 shown in FIGS. 23 and 25 is the differential position information described above. The distance L1 is also referred to as differential position information L1. The differential position information L1 is the difference between the periodic position information P1 and the initial position information P0 described above. That is, the control unit CU calculates the difference between the initial position information P0 of the guide 67 in the initial state and the acquired periodic position information P1 of the guide 67 as the differential position information L1. Also, the distance L2 between the initial position P0 and the periodic position P2 shown in FIGS. 24 and 25 is the differential position information described above. The distance L2 is also referred to as differential position information L2. The differential position information L2 is the difference between the periodic position information P2 and the initial position information P0 described above. That is, the control unit CU calculates the difference between the initial position information P0 of the guide 67 in the initial state and the acquired periodic position information P2 of the guide 67 as the differential position information L2.

[0137] <11. Determination of Wear Degree and Control According to Wear Degree> Refer to FIG. 26. FIG. 26 is a graph showing the relationship between the wear degree of the guide provided in the indexer robot IR and the elapsed time in (a), and a graph showing the relationship between the wear degree of the guide provided in the center robot CR and the elapsed time in (b).

[0138] The differential position information L shown in (a) is the difference between the initial position information and the periodic position information acquired by the guide 67 of the indexer robot IR periodically gripping the dummy substrate DW. The differential position information L may be any one of the guides 67 of the two finger portions 61 and the guide 67 of one pusher 87, or two or more.

[0139] The differential position information L is represented by length. The elapsed period indicates the interval at which the dummy substrate DW is periodically clamped. That interval is, for example, one month. The start of the elapsed period is the point in time when the guide 67 is replaced with a new guide 67. The differential position information L1 is the value set by the control unit CU as the first threshold value. The first threshold value corresponds to the above-described first wear F1 and the first degree of wear. The first threshold value is a value for the control unit CU to issue a first warning indicating that the guide 67 needs to be replaced. The differential position information L2 is the value set by the control unit CU as a second threshold value higher than the first threshold value. The second threshold value corresponds to the above-described second wear F2 and the second degree of wear. The second threshold value is a value for the control unit CU to issue a second warning indicating that the guide 67 needs to be replaced immediately, or a value for not permitting the transfer of the substrate W by the indexer robot IR until the guide 67 is replaced.

[0140] Specifically, for example, until the sixth month from the start of the elapsed period, the differential position information L of the guide 67 of the indexer robot IR does not exceed the differential position information L1 (the first threshold value). That is, the control unit CU determines that the degree of wear of the guide 67 does not exceed the first threshold value and the first degree of wear based on the acquired differential position information L. In the seventh month from the start of the elapsed period, the differential position information L of the guide 67 of the indexer robot IR exceeds the differential position information L1 (the first threshold value). That is, the control unit CU determines that the degree of wear of the guide 67 exceeds the first threshold value and the first degree of wear based on the acquired differential position information L. At this time, the control unit CU performs first control to replace the guide 67. The first control is, for example, to issue a first warning indicating that the guide 67 needs to be replaced. The operator who sees the first warning replaces the three guides 67. That is, when the differential position information L of one of the three guides 67 exceeds the first threshold value, the first control is performed.

[0141] When the first threshold is exceeded, it is not necessarily the case that the conveyance of the substrate W will be hindered immediately if the guide 67 is not replaced. Therefore, it is also possible to continue using the guide 67 for a while without replacing it when the first threshold is exceeded. After that, until the 10th month from the start of the elapsed period, the differential position information L does not exceed the second differential position information L2 (second threshold). That is, the control unit CU determines that the degree of wear of the guide 67 does not exceed the second threshold, the second degree of wear, based on the acquired differential position information L. In the 11th month from the start of the elapsed period, the differential position information L exceeds the second differential position information L2 (second threshold). That is, the control unit CU determines that the degree of wear of the guide 67 exceeds the second threshold, the second degree of wear, based on the acquired differential position information L. At this time, the control unit CU performs a second control to replace the guide 67. For example, a second warning is issued that more strongly appeals to the operator than the first warning that the replacement of the guide 67 is necessary. Also, control is performed to not permit the conveyance of the substrate W by the indexer robot IR until the guide 67 is replaced. Thereby, it is possible to prevent the guide 67, whose wear has progressed to the extent that it hinders the conveyance of the substrate W, from being continuously used.

[0142] (b) is a graph showing the differential position information L acquired by the center robot CR. In the substrate processing apparatus 1 of the first embodiment, the center robot CR clamps the substrate W more frequently than the indexer robot IR. Therefore, the guide 67 of the center robot CR wears out at a faster rate than the guide 67 of the indexer robot IR. In consideration of the wear rate of the guide 67 in the center robot CR, the acquisition interval of the differential position information L in the center robot CR may be made shorter than the acquisition interval of the differential position information L in the indexer robot IR.

[0143] (b) The differential position information L shown is the difference between the initial position information and the periodic position information obtained by the guide 67 of the center robot CY periodically clamping the dummy substrate DW. The differential position information L1 corresponding to the first threshold and the differential position information L2 corresponding to the second threshold may be the same value or different values for the indexer robot IR and the center robot CR.

[0144] Specifically, the differential position information L of the guide 67 of the center robot CR exceeds the first differential position information L1 (the first threshold value) at the fourth month from the start of the elapsed period. That is, that is, the control unit CU determines that the degree of wear of the guide 67 of the center robot CR exceeds the first threshold value, the first degree of wear, based on the acquired differential position information L. At this time, as a first control for replacing the guide 67, the control unit CU issues, for example, the first warning described above. The differential position information L of the guide 67 of the center robot CR exceeds the second differential position information L2 (the second threshold value) at the eleventh month from the start of the elapsed period. That is, the control unit CU determines that the degree of wear of the guide 67 of the center robot CR exceeds the second threshold value, the second degree of wear, based on the acquired differential position information L. At this time, as a second control for immediately replacing the guide 67, the control unit CU performs, for example, the second warning described above and the control of not permitting the conveyance of the substrate W described above. Thereby, it is possible to prevent the guide 67 whose wear has progressed to the extent that it hinders the conveyance of the substrate W from being continuously used not only in the index robot IR but also in the center robot CR.

[0145] As described above, the index robot IR, the center robot CR, and the substrate processing apparatus 1 including these in the first embodiment include a tactile sensor 73 and an encoder 81 that acquire initial position information P0, periodic position information P1, and P2 indicating the position of the guide 67 in the horizontal plane that sandwiches the outer peripheral surface of the substrate W, and a control unit CU that determines the degree of wear of the guide 67 based on the acquired initial position information P0, periodic position information P1, and P2. The periodic position information P1 and P2 change according to the degree of wear of the guide 67. By determining the degree of wear of the guide 67, it is possible to make it difficult to cause a conveyance failure of the substrate W due to the wear of the guide 67.

[0146] In addition, the control unit CU of Example 1 calculates the differential position information L, which is the difference between the initial position information P0 of the 67 guides in the initial state and the periodic position information P1, P2 of the acquired guide 67, and determines the degree of wear of the guide 67 based on the differential position information L. Thereby, by comparing the initial position information P0 of the guide 67 in the initial state with the periodic position information P1, P2 of the acquired guide 67, the degree of wear of the guide 67 can be accurately detected.

[0147] In addition, when the differential position information L exceeds the first threshold value (first degree of wear), the control unit CU of Example 1 issues, for example, a first warning indicating that the guide 67 needs to be replaced. Thereby, when the degree of wear of the guide 67 is such that the differential position information L exceeds the first threshold value (first degree of wear), it is possible to appropriately notify that the guide 67 needs to be replaced.

[0148] In addition, when the differential position information L exceeds a second threshold value (second degree of wear) with a greater degree of wear than the first threshold value (first degree of wear), the control unit CU of Example 1 issues a second warning that more strongly appeals to the operator that the guide 67 needs to be replaced than the first warning. Instead of or together with the second warning, control is performed to not permit the transfer of the substrate W by the index robot IR (or the center robot CR) until the guide 67 is replaced. Thereby, when the degree of wear of the guide is large such that the differential position information L exceeds the second threshold value (second degree of wear), it is possible to prevent the guide 67, whose wear has progressed to the extent that it hinders the transfer of the substrate W, from being continuously used.

[0149] In Example 1, a servo motor 79 that provides a driving force for the forward and backward driving of the guide 67, and an encoder 81 that detects the rotation of the servo motor 79 and outputs the rotation of the servo motor 79 as a detection signal at the timing when the tactile sensor 73 detects that the guide 67 has come into contact with the outer peripheral surface of the substrate W are included. The control unit CU acquires initial position information P0, periodic position information P1, and P2 based on the detection signal provided by the servo motor 79. Thereby, it is possible to suitably determine the degree of wear using the output from the encoder 81 that detects the rotation of the servo motor 79 at the timing when the tactile sensor 73 detects that the guide 67 has come into contact with the outer peripheral surface of the substrate W.

[0150] In addition, the control unit CU of Example 1 causes the image display unit 113 that outputs information to output information such as a first warning and a second warning according to the degree of wear of the guide 67. Thereby, the operator can recognize the degree of wear of the guide 67.

[0151] In addition, the control unit of Example 1 stops the conveyance of the substrate W according to the degree of wear of the guide 67. Thereby, it is possible to prevent conveyance failures of the substrate W in advance.

[0152] In Example 1, the substrate W held by the guide 67 when the initial position information P0, periodic position information P1, and P2 are acquired is a dummy substrate DW that is not processed by the processing unit 31. Thereby, it is possible to determine the degree of wear of the guide 67 without being affected by differences in the shape of the substrate W.

[0153] In Example 1, the dummy substrate DW is placed in the substrate processing apparatus 1 in advance, and the degree of wear of the guide 67 is determined at a preset cycle. Thereby, it is possible to periodically determine the degree of wear of the guide 67 in the substrate processing apparatus 1.

[0154] The correspondence between Example 1 described above and the configuration of the present invention is as follows.

[0155] At least one of the indexer robot IR and the center robot CR corresponds to the "substrate transfer device" and the "transfer robot" in the present invention. The dummy substrate DW corresponds to the "substrate" in the present invention. Each guide 67 corresponds to the "movable guide" in the present invention. The moving piece 71, the servo motor 79, and the ball screw 83 correspond to the "advancing and retreating drive mechanism" in the present invention. The tactile sensor 73, the encoder 81, and the control unit CU that receives the position detection signal at the timing when the guide 67 contacts the dummy substrate DW from the tactile sensor 73 and the encoder 81 correspond to the "acquisition unit" in the present invention. The initial position information P0, the periodic position information P1, and P2 correspond to the "clamping position information" of the present invention. The control unit CU corresponds to the "control unit" in the present invention. The first threshold value (the first degree of wear) and the second threshold value (the second degree of wear) correspond to the "degree of wear" in the present invention. The differential position information L, the differential position information L1, and the differential position information L1 correspond to the "differential information" in the present invention. The image display unit 113 corresponds to the "output unit" in the present invention. The clamping control unit 97 and the control unit CU correspond to the "control unit" in the present invention. The processing unit 31 and the back surface cleaning unit SSR correspond to the "processing unit" in the present invention. The mounting table 13 corresponds to the "carrier mounting unit" in the present invention. The delivery unit 15 corresponds to the "temporary mounting unit" in the present invention.

[0156] The present invention is not limited to the above-described embodiments and can be implemented with modifications as follows.

[0157] (1) In the above-described Example 1, the dummy substrate DW was pre-mounted on the dummy substrate mounting portion 30 of the substrate processing apparatus 1. However, the dummy substrate DW may be mounted on the carrier C. Specifically, immediately after the guide 67 is replaced and at the timing of predetermined regular measurement thereafter, the carrier C containing the dummy substrate DW is mounted on the mounting table 13. When the index robot IR unloads the dummy substrate DW from the carrier C, the dummy substrate DW is clamped by the guide 67. The index robot IR transports the dummy substrate DW from the carrier C to the delivery unit 15. When the center robot CR unloads the dummy substrate DW from the delivery unit 15, the dummy substrate DW is clamped by the guide 67. Note that the index robot IR may be configured to clamp the dummy substrate DW mounted on the carrier C, and the center robot CR may be configured to grip the dummy substrate DW mounted on the dummy substrate mounting portion 30.

[0158] (2) In the above-described Example 1, the differential position information L of each of the guide 67 of the right finger portion 61, the guide 67 of the left finger portion 61, and the guide 67 of the pusher 87 in the width direction Y was acquired. However, a configuration in which the differential position information L of any one of the guides 67 is acquired may also be acceptable.

[0159] (3) In the above-described Example 1, the dummy substrate position information storage unit 96 stores the position information acquired from the encoder 81. The notification control unit 111 gives a first warning if the differential position information of any one of the guide 67 of the right finger portion 61, the guide 67 of the left finger portion 61, and the guide 67 of the pusher 87 in the width direction Y exceeds the first threshold value. However, the present invention is not limited to such a configuration. A first warning may be given when the differential position information of two of the three guides 67 exceeds the first threshold value. A first warning may also be given when the differential position information of the three guides 67 exceeds the first threshold value. The same applies to the second threshold value.

[0160] (4) In the above-described Example 1, the position where it was detected by the tactile sensor 73 that the guide 67 had come into contact with the outer peripheral surface of the dummy substrate DW was treated as the position where the dummy substrate DW was sandwiched by the guide 67. However, it may be detected by a sensor other than the tactile sensor 73 that the guide 67 has come into contact with the outer peripheral surface of the dummy substrate DW.

[0161] (5) In the above-described Example 1, the position information of the guide 67 was acquired based on the position information obtained from the encoder 81 connected to the servo motor 79. However, the present invention is not limited to such a configuration. For example, by connecting a linear scale (linear encoder) to the moving piece 71 connected to the ball screw 79, the position information may be acquired from the amount of movement of the moving piece 71. The control unit CU that measures the position of the guide 67 based on the linear scale (linear encoder) and the measurement signal from the linear scale (linear encoder) corresponds to the "sensor" and "measurement unit" in the present invention.

[0162] (6) In the above-described Example 1, the tactile sensor 73 was adopted. However, the present invention is not limited to such a configuration. That is, as long as it can be detected that the guide 67 has come into contact with the outer peripheral surface of the substrate W, other detectors may be adopted. As the outer peripheral surface detector, for example, a proximity sensor, a reflection type sensor, or the like may be adopted.

[0163] (7) In the above-described Example 1, the tactile sensor 73 is provided at the attachment portion of the hand 67 to the finger portion 61. However, the present invention is not limited to such a form. That is, the tactile sensor 73 may be provided on the side surface of the guide 67. In this case, it is preferable that the detection surface 75 is directed toward the outer peripheral surface side of the substrate W. This is because the detection sensitivity by the tactile sensor 73 can be increased.

[0164] (8) In the above-described Example 1, the guide 67 has a cylindrical shape, but the present invention is not limited to such a form. That is, the shape of the guide 67 does not matter.

[0165] (9) In the above-described Example 1, the first hand 19 of the index robot IR was taken as an example for explanation. However, the present invention can also be applied to the second hand 21 of the index robot IR, and the first hand 33 and the second hand 35 of the center robot CR.

[0166] (10) In the above-described Example 1, a configuration in which all three guides 67 are movable is adopted. However, the present invention is not limited to such a configuration. That is, the present invention may be a configuration in which at least one guide 67 is movable.

[0167] (11) In the above-described Example 1, a configuration including three guides 67 is adopted. However, the present invention is not limited to such a configuration. That is, the present invention may be a configuration including at least two or four or more guides 67. For example, the first hand 19 including two guides 67 may be configured with one finger portion having an I-shaped shape in plan view, one arc-shaped guide 67 corresponding to the outer edge shape of the substrate W at the tip side, and a pusher 87 at the base end side.

[0168] (12) In the above-described Example 1, the advancing / retreating drive mechanism is configured to move the guide 67 with the moving piece 71, the servo motor 79, and the ball screw 83. However, the present invention is not limited to such a configuration. For example, a configuration including a wire having one end connected to a spring, a guide fixedly attached to a part of the wire, and a drive unit that winds up the other end of the wire to move the wire in the front-rear direction X may be adopted.

[0169] (13) In the above-described Example 1, the guide 67 was driven to advance and retreat in the front-rear direction X with respect to the finger portion 61. However, the present invention is not limited to such a configuration. For example, the guide 67 may be fixedly attached to the finger portion 61, and the finger portion 61 may be attached to the finger portion attachment portion 65 so as to be able to advance and retreat in the front-rear direction X at the finger portion attachment portion 65. Thereby, since the movable part can be arranged outside the outer peripheral surface of the substrate W, it is advantageous in terms of cleanliness.

[0170] (14) In the above-described Example 1, the tactile sensor 73 for detecting that the guide 67 abuts on the outer peripheral surface of the substrate W is provided. However, the present invention does not necessarily require the tactile sensor 73. That is, when the control unit CU moves the guide 67 of the pusher 87 toward the outer peripheral surface of the substrate W by the servomotor 79, the urging force of the guide 67 on the substrate W may be adjusted according to the shape of the substrate W regardless of the position of the outer peripheral surface. When the diameter of the substrate W to be processed is known, since the position of the outer peripheral surface of the substrate W is substantially known, the control unit CU can adjust the urging force of the guide 67 on the substrate W based on the position information from the encoder 81. Note that, as in the above-described Example 1, detecting the outer peripheral surface of the substrate W using the tactile sensor 73 and then adjusting the urging force can shorten the time until the substrate W is held.

Example

[0171] Next, Example 2 of the present invention will be described with reference to the drawings.

[0172] In the above-described Example 1, at the timing when the tactile sensor 73 detects that the guide 67 abuts on the outer peripheral surface of the dummy substrate DW, the position information acquired from the encoder 81 is treated as the position information at which the dummy substrate DW is sandwiched by the guide 67. Example 2 is different from Example 1 in that the position information at which the guide 67 abuts on the outer peripheral surface of the dummy substrate DW is directly acquired from the position information acquired from the encoder 81.

[0173] FIG. 27 is a side view of the hand in the substrate processing apparatus according to Example 2. The configuration of the substrate processing apparatus 1 and the like are the same as those in the above-described Example 1. Therefore, a detailed description of the substrate processing apparatus 1 will be omitted.

[0174] Hereinafter, as in the above-described Example 1, the configuration of the first hand 19 provided in the indexer robot IR will be described as an example. The hand according to Example 2 is indicated by the first hand 19A.

[0175] <1. Details of the hand>

[0176] The first hand 19A includes two finger portions 61 and one palm portion 59. The two finger portions 61 each include a guide 67. One palm portion 59 includes one guide 67. The first hand 19A includes three guides 67.

[0177] The three guides 67 are configured in the same manner as in the above-described Example 1 and move in the front-rear direction X. That is, the guide 67 is moved by a moving piece 71, a lateral hole 77, a servo motor 79, and a ball screw 83. However, the first hand 19 in Example 2 does not include a tactile sensor 73.

[0178] <2. Control System>

[0179] With reference to FIG. 28, the control system will be described. FIG. 28 is a block diagram showing the control system in the substrate processing apparatus according to Example 2.

[0180] For the configuration common to the above-described Example 1, detailed description will be omitted by assigning the same reference numerals as those in the above-described Example 1.

[0181] The control unit CU operates the indexer robot IR. In particular, for the clamping operation of the substrate W by the first hand 19, it is operated via the clamping control unit 97A.

[0182] The clamping control unit 97A is connected to the servo motor 79 and the encoder 81. The clamping control unit 97A operates the servo motor 79 based on an instruction from the control unit CU to move the three guides 67. At that time, the clamping control unit 97A operates the servo motor 79 according to the position information from the encoder 81. The clamping control unit 97A can detect the drive current supplied to the servo motor 79 as drive current information. The clamping control unit 97A determines that the guide 67 has come into contact with the outer peripheral surface of the substrate W based on either one or both of the position information and the drive current information.

[0183] That is, when the guide 67 contacts the outer peripheral surface of the substrate W, the movement of the guide 67 is temporarily obstructed. Therefore, the displacement of the position information from the encoder 81 temporarily stops. Also, even when the guide 67 contacts the outer peripheral edge of the substrate, to move the guide 67 further toward the outer peripheral surface of the substrate W, it is necessary to increase the torque of the servo motor 79. Therefore, the drive current to the servo motor 79 increases, and the drive current information is displaced. Accordingly, by monitoring either one or both of the position information and the drive current information, it is possible to accurately determine that the guide 67 has contacted the outer peripheral surface of the substrate W. After the guide 67 contacts the outer peripheral surface of the substrate W, the clamping control unit 97A adjusts the biasing force of the guide 67 against the outer peripheral surface of the substrate W according to the shape information from the shape information storage unit 93 and clamps the substrate W.

[0184] The dummy substrate position information storage unit 96 stores the position information acquired from the encoder 81 when the above-described dummy substrate DW is clamped by, for example, the first hand 19. Specifically, the dummy substrate position information storage unit 96 stores the position information acquired from the encoder 81 at the timing when the displacement of the position information from the encoder 81 described above temporarily stops. That is, at the timing when the displacement of the position information from the encoder 81 described above temporarily stops, the position information acquired from the encoder 81 is stored as the position information when the guide 67 contacts the outer peripheral surface of the substrate W, that is, the position information when the guide 67 clamps the outer peripheral surface of the substrate W.

[0185] The correspondence between the above-described Example 2 and the configuration of the present invention is as follows.

[0186] The encoder 81 and the dummy substrate position information storage unit 96 correspond to the "acquisition unit" in the present invention.

[0187] According to the second embodiment, the control unit CU determines that the guide 67 has come into contact with the outer peripheral surface of the substrate W based on at least one of the drive current information from the clamping control unit 97A and the position information from the encoder 81. Therefore, it is not necessary to provide a tactile sensor 73 or the like for detecting that the guide 67 and the outer peripheral surface of the substrate W are in contact. As a result, the structure can be simplified and the cost can be reduced.

[0188] The present invention is not limited to the above-described embodiments, and can be modified as follows.

[0189] In the above-described second embodiment, (1) to (5) and (8) to (14) may be adopted except for (6) and (7) in the modified implementation of the first embodiment. Also, similar to (14) in the modified implementation of the first embodiment, the biasing force applied to the substrate W may be adjusted without detecting that the guide 67 has come into contact with the outer peripheral surface of the substrate W.

Embodiment

[0190] Next, a third embodiment of the present invention will be described with reference to the drawings.

[0191] In the type in which the guides 67 of the right finger portion 61, the guides 67 of the left finger portion 61, and the guide 67 of the pusher 87 in the width direction Y are all movable, the control unit CU determines whether the differential position information of any one of the guides 67 exceeds a threshold value. In the third embodiment, there is one movable guide 67, and the difference from the first embodiment is that the control unit CU determines whether the differential position information of one guide 67 exceeds a threshold value.

[0192] FIG. 29 is a plan view of the hand in the substrate processing apparatus according to the third embodiment. FIG. 30 is a view taken along the line 100-100 in FIG. 29. Note that the configuration of the substrate processing apparatus 1 is the same as that of the first embodiment described above, and thus detailed description thereof will be omitted.

[0193] In the following, similar to the above-described Examples 1 and 2, the configuration of the first hand 19 provided in the indexer robot IR will be described by taking it as an example. The hand according to Example 3 is indicated by the first hand 19B.

[0194] <1. Details of the Hand>

[0195] The configuration of the finger part 61 of the first hand 19B is different from that of Examples 1 and 2. That is, the finger part 61 is provided with guides 67A on both end sides in the front X and the rear X directions, respectively. Each guide 67A is a fixed type that does not move. Each guide 67A does not move in the front-rear direction X in the finger part 61.

[0196] The guide 67A includes an inclined surface 101 and a clamping part 103. The inclined surface 101 is formed so as to become lower toward the center side of the substrate W. In other words, the inclined surface 101 is formed so as to become higher toward the outside than the outer peripheral surface of the substrate W. The clamping part 103 is erected along the outer peripheral surface of the substrate W. It is preferable that the portion of the clamping part 103 facing the outer peripheral surface of the substrate W in plan view has the same shape as the shape of the corresponding outer peripheral surface of the substrate W. This is because although the contact area increases, the substrate W can be stably held. The four guides 67A are arranged slightly outside the outer shape of the substrate W in plan view.

[0197] The guide 67A is attached to the upper surface of the finger part 61 via a tactile sensor 73. The tactile sensor 73 is attached to the guide 67A so that the force applied to the guide 67A is transmitted to the detection surface 75.

[0198] In the above-described first hand 19B, after the substrate W is placed on the inclined surface 101 of the guide 67A, the outer peripheral surface of the substrate W is biased forward in the X direction by the guide 67 of the pusher 87. As a result, the outer peripheral surface located in the front X of the substrate W slides up the inclined surface 101 and is pressed by the clamping part 103 and clamped by the guide 67 of the pusher 87 and the two guides 67A. Thereby, the substrate W is held by the first hand 19.

[0199] The tactile sensor 73 of the guide 67A detects that the substrate W is placed. That is, the tactile sensor 73 only needs to detect the force in the vertical direction Z. The signal from the tactile sensor 73 of the guide 67A is used by the clamping control unit 97 to determine the presence or absence of the substrate W. When it is determined in the clamping control unit 97 that the substrate W is absent, this is transmitted to the control unit CU. Also, from the state of the force applied to the four guides 67A, the clamping control unit 97 can determine the placement posture of the substrate W. If the inclination is large, since it has an adverse effect during the conveyance of the substrate W, it may be determined that the substrate W is absent.

[0200] <2. Degree of wear of the guide> Refer to FIGS. 31 and 32. FIG. 31 is a plan view of the hand for explaining the first degree of wear of the guide. FIG. 32 is a plan view of the hand for explaining the second degree of wear of the guide. FIG. 33 is a side view of the hand for explaining the first and second degrees of wear of the guide.

[0201] Refer to FIGS. 31 and 33. In FIG. 31, as in Example 1, the guide 67 of the pusher 87 indicated by a broken line and the guide 67 of the pusher 87 indicated by a two-dot chain line are shown. The guide 67 of the pusher 87 indicated by the two-dot chain line shows a state in which the guide 67 of the pusher 87 where no wear has occurred and the two guides 67A on the tip side sandwich the outer peripheral surface of the dummy substrate DW, as shown in FIG. 33(a). The guide 67 of the pusher 87 indicated by a solid line shows a state in which the guide 67 of the pusher 87 where the first wear F1 has occurred and the two guides 67A on the tip side sandwich the outer peripheral surface of the dummy substrate DW. The first wear F1 is wear that occurs by repeatedly clamping the substrate W by the guide 67 of the pusher 87 and the two guides 67A on the tip side for a predetermined period, as shown in FIG. 33(b). The guide 67 of the pusher 87 indicated by a solid line and the two guides 67A on the tip side show a state in which they sandwich the outer peripheral surface of the dummy substrate DW at the deepest surface of the portion where the first wear F1 has occurred. The first wear F1 corresponds to the first degree of wear indicating the degree of wear of the guide 67 of the pusher 87 and the two guides 67A on the tip side.

[0202] Refer to FIGS. 32 and 33. As in the above description, FIG. 31 shows the guide 67 of the pusher 87 indicated by a dashed line and the guide 67 of the pusher 87 indicated by a two-dot chain line. The guide 67 of the pusher 87 indicated by a solid line shows a state where the guide 67 of the pusher 87 where the second wear F2 has occurred and the two guides 67A on the tip side sandwich the outer peripheral surface of the dummy substrate DW. As shown in FIG. 33(c), the second wear F2 is wear that occurs by repeatedly sandwiching the substrate W by the guide 67 of the pusher 87 and the two guides 67A on the tip side from the time when the first wear F1 shown in (b) occurs. The guide 67 of the pusher 87 indicated by a solid line and the two guides 67A on the tip side show a state where they sandwich the outer peripheral surface of the dummy substrate DW at the deepest surface of the portion where the second wear F2 has occurred. The second wear F2 corresponds to the second wear degree indicating the wear degree of the guide 67 of the pusher 87 and the two guides 67A on the tip side.

[0203] The points P0, P1, and P2 are the position information of the guide 67 of the pusher 87. Similar to Example 1, the point P0 is also called the initial position P0 or the initial position information P0. The point P1 is also called the regular position P1, P2 or the regular position information P1, P2.

[0204] The distance L1 between the initial position P0 and the regular position P1 indicates the distance by which the guide 67 of the pusher 87 is pushed out more than the initial position P0 due to the occurrence of the first wear F1 in the guide 67 of the pusher 87 and the two guides 67A on the tip side. The distance L1 is the differential position information described above. The distance L1 is also called the differential position information L1. The differential position information L1 is the difference between the regular position information P1 and the initial position information P0 described above.

[0205] The distance L2 between the initial position P0 and the regular position P2 indicates the distance by which the guide 67 of the pusher 87 is pushed out more than the initial position P0 due to the occurrence of the second wear F2 at two locations on the guide 67A on the tip side and the guide 67. The distance L2 is the differential position information described above. The distance L2 is also referred to as the differential position information L2. The differential position information L2 is the difference between the regular position information P2 and the initial position information P0 described above.

[0206] <3. Control according to the degree of wear>

[0207] Similar to Example 1, when the differential position information L of the guide 67 of the pusher 87 exceeds the first threshold value (differential position information L1), a first warning is given as the first control. An operator who sees the first warning replaces the guide 67 of the pusher 87 and the two guides 67A on the tip side. The two guides 67A on the base end side may also be replaced. Also, when the differential position information L of the guide 67 of the pusher 87 exceeds the second threshold value (differential position information L2), as the second control, a second warning and a control that does not permit the conveyance of the substrate W until the guide 67 of the pusher 87 and the two guides 67A on the tip side are replaced are performed.

[0208] In this way, when only one guide 67 among the plurality of guides 67, 67A is movable, even if the differential position information of all the guides 67, 67A is not acquired, it is possible to prevent the guide 67 whose wear has progressed to the extent that it hinders the conveyance of the substrate W from continuing to be used by a configuration that acquires only the differential position information of the movable guide 67.

[0209] The correspondence relationship between the above-described Example 3 and the configuration of the present invention is as follows. The guide 67 of the pusher 87 corresponds to the "movable guide" in the present invention.

[0210] The present invention is not limited to the above-described embodiments and can be implemented in modified forms as follows.

[0211] In the above-described Example 3, (1), (5), (8), (9), (11), (12), and (14) may be adopted, excluding (2), (3), (4), (6), (7), (10), and (13) in the modified implementation of Example 1.

Example

[0212] In the above-described Examples 1 to 3, the degree of wear of the guide 67 was determined using the dummy substrate DW. In Example 4, the point of determining the degree of wear of the guide 67 using the substrate W processed by the processing unit 31 is different from Examples 1 to 3 described above.

[0213] Refer to FIG. 34. FIG. 34 is a side view of the hand of Example 4.

[0214] The initial position information P0 is obtained by sandwiching the substrate W with the newly replaced guide 67. The periodic position information P1 and P2 are preferably obtained when transporting the substrate W having the same diameter as the substrate W for which the initial position information P0 was obtained at a predetermined period. It is preferable to set the period for obtaining the periodic position information P1 and P2 to be relatively long so that the periodic position information P1 and P2 can be obtained with substrates of the same diameter.

[0215] Refer to FIG. 35. FIG. 35 is a graph showing the relationship between the degree of wear of the guide provided in the indexer robot IR and the elapsed time in (a), and a graph showing the relationship between the degree of wear of the guide provided in the center robot CR and the elapsed time in (b).

[0216] The relationship between the degree of wear of the guide 67 and the guide 67A and the elapsed time is the same as that shown in Example 1. In Example 4, considering that the configuration is to determine the degree of wear of the guide 67 in the process of transporting the substrate W processed by the processing unit 31, when the differential position information L exceeds the first threshold value and the second threshold value, the processing performed by the control unit CU is different from that in Example 1.

[0217] That is, when the differential position information L exceeds the first threshold value (differential position information L1), the control unit CU issues a warning indicating that the guides 67 of the pusher 87 and the two guides 67A on the tip side should be exchanged. This warning is the same as the first warning when the first threshold value in the first embodiment is exceeded. After the differential position information L exceeds the first threshold value, when the differential position information L exceeds the second threshold value (differential position information L2), the control unit CU stops, for example, the process of the index robot IR transporting the substrate W. Specifically, for example, the first hand 19 of the index robot IR releases the guide 67 from the substrate W, places the substrate W on the carrier C, and retracts from the carrier C.

[0218] Thereby, when the guides 67 and 67A continue to be used beyond the differential position information L2 (second degree of wear), it is possible to prevent damage to the substrate W due to poor conveyance of the substrate W.

[0219] The correspondence between the above-described Example 4 and the configuration of the present invention is as follows. The guide 67 of the pusher 87 corresponds to the "movable guide" in the present invention.

[0220] The present invention is not limited to the above-described embodiments, and can be modified as follows.

[0221] (1) In each of the above-described Examples 1 to 4, the configuration of the substrate processing apparatus 1 was described as an example, but the present invention is not limited to a substrate processing apparatus having such a configuration.

[0222] (2) In each of the above-described Examples 1 to 4, the case of processing the circular substrate W and the dummy substrate DW was described as an example, but the substrate W and the dummy substrate DW are not limited to a circular shape.

Explanation of Reference Numerals

[0223] 1, 1A... Substrate processing apparatus DW... Dummy substrate W... Substrate 3... Loading / Unloading Block 5... Index Block 7 … Processing block C … Carrier IR … Indexer robot 19 … First hand 21 … Second hand 31 … Processing unit SSR … Back surface cleaning unit CR … Center robot 33 … First hand 35 … Second hand 45 … Substrate sensor 47A, 47B … Mounting part CL1, CL2 … Clearance 57 … Horizontal movement mechanism 59 … Palm part 61 … Finger part 63 … Mounting base end part 65 … Finger part mounting part 67 … Guide 69 … Guide hole 71 … Moving piece 73 … Tactile sensor 75 … Detection surface 79 … Servo motor 81 … Encoder 83 … Ball screw 87 … Pusher CU … Control unit 93 … Shape information storage part 95 … Clamping information storage part 96 … Dummy substrate position information storage part 97 … Clamping control part 98 … Threshold value information storage part 111 … Notification control part 113 … Image display part

Claims

1. In a substrate transfer device for transferring a substrate, a hand for holding the substrate in a horizontal posture, a horizontal drive mechanism for driving the hand to advance and retreat in a horizontal plane to transfer the substrate, at least two guides provided on the hand for sandwiching the outer peripheral surface of the substrate and holding the substrate while separating it from the hand, an advance / retreat drive mechanism for driving at least one of the at least two guides to advance and retreat with respect to the substrate as a movable guide, an acquisition unit for acquiring clamping position information indicating a position in the horizontal plane where the guide clamps the outer peripheral surface of the substrate, a control unit for determining the degree of wear of the guide based on the acquired clamping position information, characterized in that it comprises a substrate transfer device.

2. In the substrate transfer device according to claim 1, the control unit calculates difference information between the clamping position information of the guide in the initial state and the acquired clamping position information of the guide, and determines the degree of wear based on the difference information characterized in that it is a substrate transfer device.

3. In the substrate transfer device according to claim 2, the control unit performs first control when the difference information exceeds a first threshold value characterized in that it is a substrate transfer device.

4. In the substrate transfer device according to claim 2, the control unit performs second control when the difference information exceeds a second threshold value at which the degree of wear is greater than the first threshold value characterized in that it is a substrate transfer device.

5. In the substrate transfer device according to claim 1, the advance / retreat drive mechanism includes a motor for applying a driving force for the advance / retreat drive, a sensor for detecting the rotation of the motor and outputting it as a detection signal, and the acquisition unit acquires the clamping position information based on the detection signal given by the sensor characterized in that it is a substrate transfer device.

6. In the substrate transfer device according to claim 1, the advance / retreat drive mechanism includes a measurement unit for measuring the moving distance of the guide and outputting it as a measurement signal, and the acquisition unit acquires the clamping position information based on the measurement signal given by the measurement unit characterized in that it is a substrate transfer device.

7. In the substrate transfer device according to claim 1, the control unit causes an output unit that outputs information to output information corresponding to the degree of wear according to the degree of wear characterized in that it is a substrate transfer device.

8. In the substrate transfer device according to claim 1, The control unit stops the conveyance of the substrate according to the degree of wear. A substrate conveyance device characterized by the above.

9. In the substrate conveyance device according to Claim 1, the control unit operates the guide so that the contact position between the guide and the outer peripheral surface of the substrate changes according to the degree of wear. A substrate conveyance device characterized by the above.

10. A substrate processing device comprising: the substrate conveyance device according to any one of Claims 1 to 9; and a processing unit that performs a predetermined process on the substrate conveyed by the substrate conveyance device. A substrate processing device characterized by the above.

11. In the substrate processing device according to Claim 10, the substrate held by the guide when the holding position information is acquired is the substrate to be processed by the processing unit. A substrate processing device characterized by the above.

12. In the substrate processing device according to Claim 10, the substrate held by the guide when the holding position information is acquired is a dummy substrate that is not processed by the processing unit. A substrate processing device characterized by the above.

13. In the substrate processing device according to Claim 12, the dummy substrate is placed in the substrate processing device in advance, and the degree of wear is determined at a preset cycle. A substrate processing device characterized by the above.

14. In the substrate processing device according to Claim 10, a carrier mounting portion on which a carrier capable of accommodating a plurality of substrates is mounted is provided, and the substrate conveyance device is a conveyance robot that conveys the substrate mounted on the carrier. A substrate processing device characterized by the above.

15. In the substrate processing device according to Claim 10, a carrier mounting portion on which a carrier capable of accommodating a plurality of substrates is mounted, and a temporary mounting portion on which the substrate conveyed from the carrier is temporarily mounted are provided, and the substrate conveyance device is a conveyance robot that conveys the substrate mounted on the temporary mounting portion to the processing unit. A substrate processing device characterized by the above.

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