Electronic device, state estimation system of electronic component, and state estimation method of electronic component

Abstract

To provide an electronic device, a state estimation system of an electronic component, and a state estimation method of an electronic component capable of estimating the state of each electronic component without providing any dedicated sensors for determining (detecting) the state of an electronic component.SOLUTION: An electronic device includes an electronic circuit having multiple electronic components, and a microcomputer having a CPU and a storage. The storage stores design information of an electronic circuit, and performance deterioration characteristic information showing characteristics of deterioration of performance of the respective electronic components. The CPU calculates time-series data of an electric stress normalization value of the respective electronic components when the electronic circuit is operating on the basis of the design information of the electronic circuit and output data to the electronic circuit, and calculates stress accumulation time information on the basis of the calculated time-series data of an electric stress normalization value and stores it in the storage. The CPU calculates an estimated performance value of the respective electronic components showing a performance deterioration state of the respective electronic components on the basis of the stress accumulation time information and the performance deterioration characteristic information.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to an electronic device, a state estimation system for electronic components, and a method for estimating the state of electronic components.

Background Art

[0002] The long-term stable operation of electronic devices that require high performance and high reliability is an important product value for customers and also an important social value for reducing environmental load. For the long-term stable operation of electronic devices, it is necessary to perform maintenance, inspection, and replacement. In order to perform these operations at appropriate timings, it is required to estimate the state (deterioration state) of each electronic component constituting the electronic device.

[0003] Patent Document 1 discloses a state estimation device (hereinafter referred to as the "conventional device") for estimating the state of equipment. The conventional device acquires time-series data of the AC voltage and AC current of the equipment from a sensor, and acquires time-series data of the power supply voltage applied to the equipment and the consumption current of the equipment from the acquired time-series data of the AC voltage and AC current of the equipment. The conventional device extracts the consumption current in a time interval to be analyzed corresponding to a predetermined reference or state of the power supply voltage from the time-series data of the consumption current of the equipment. The conventional device estimates the state of the equipment in the time interval to be analyzed from the consumption current in the time interval to be analyzed based on the relationship between the consumption current information of the equipment and the deterioration state of the equipment. The conventional device performs a filtering process corresponding to the time change rate of the state change of the object to be estimated on the estimated state of the equipment in the time interval, and estimates the state change of the equipment.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] The conventional device needs to be provided with a current sensor and a voltmeter (voltage sensor) for monitoring the voltage applied to the equipment and the current flowing through the equipment. That is, the conventional device requires a dedicated sensor for determining (detecting) the state of electronic components. Also, the conventional device cannot estimate the state of each electronic component constituting the electronic device.

[0006] The present invention has been made to solve the above problems. That is, one of the objects of the present invention is to provide an electronic device, an electronic component state estimation system, and an electronic component state estimation method capable of estimating the state of each electronic component without providing a dedicated sensor for determining (detecting) the state of the electronic component.

Means for Solving the Problems

[0007] In order to solve the above problems, the electronic device of the present invention is an electronic device including an electronic circuit having a plurality of electronic components and a computer having an arithmetic device and a storage device, wherein the storage device stores design information of the electronic circuit and performance degradation characteristic information indicating characteristics of performance degradation of each electronic component, and the arithmetic device calculates time-series data of stress evaluation parameters of each electronic component when the electronic circuit is operating based on the design information of the electronic circuit and output data to the electronic circuit or input data from the electronic circuit, calculates time-series data of electrical stress normalization values of each electronic component by normalizing the calculated time-series data of the stress evaluation parameters of each electronic component, calculates stress cumulative time information indicating the cumulative time that each electronic component has actually operated in each of a plurality of stress level ranges based on the time-series data of the electrical stress normalization values of each electronic component, and stores the stress cumulative time information in the storage device, and calculates an estimated performance value of each electronic component indicating the performance degradation state of each electronic component based on the stress cumulative time information and the performance degradation characteristic information.

[0008] The deterioration state estimation system for electronic components of the present invention is an electronic component deterioration state estimation system having an electronic device including an electronic circuit having a plurality of electronic components and a computer, and a management server having an arithmetic device and a storage device, wherein the storage device stores design information of the electronic circuit and performance deterioration characteristic information indicating characteristics of performance deterioration of each electronic component of the electronic device, the arithmetic device acquires output data from the electronic device to the electronic circuit or input data from the electronic circuit, and based on the design information of the electronic circuit and the acquired output data to the electronic circuit or the input data from the electronic circuit, calculates time-series data of stress evaluation parameters for each electronic component when the electronic circuit is operating, calculates time-series data of electrical stress normalization values for each electronic component by normalizing the calculated time-series data of the stress evaluation parameters for each electronic component, calculates stress cumulative time information indicating the cumulative time that each electronic component of the electronic device has actually operated in each of a plurality of stress level ranges based on the time-series data of the electrical stress normalization values for each electronic component, and stores the stress cumulative time information in the storage device, and calculates an estimated performance value of each electronic component indicating the performance deterioration state of each electronic component of the electronic device based on the stress cumulative time information and the performance deterioration characteristic information.

[0009] The deterioration state estimation method for electronic components of the present invention is a deterioration state estimation method for estimating the deterioration state of each electronic component of an electronic device using at least one of an arithmetic device inside and outside the electronic device including an electronic circuit having a plurality of electronic components and at least one of a storage device inside and outside the electronic device, The memory device stores the design information of the electronic circuit and performance degradation characteristic information indicating the characteristics of performance degradation of each electronic component of the electronic device. Based on the design information of the electronic circuit and the output data to the electronic circuit or the input data from the electronic circuit by the arithmetic unit, time-series data of stress evaluation parameters of each electronic component when the electronic circuit is operating is calculated. By normalizing the calculated time-series data of the stress evaluation parameters of each electronic component, time-series data of electrical stress normalization values of each electronic component is calculated. Based on the time-series data of the electrical stress normalization values of each electronic component, stress cumulative time information indicating the cumulative time that each electronic component of the electronic device has actually operated in each of a plurality of stress level ranges is calculated and stored in the memory device. Based on the stress cumulative time information and the performance degradation characteristic information, an estimated performance value of each electronic component indicating the performance degradation state of each electronic component of the electronic device is calculated.

Advantages of the Invention

[0010] According to the present invention, the state of each electronic component can be estimated without providing a dedicated sensor for determining (detecting) the state of the electronic component. Note that the effects described here are not necessarily limited, and any of the effects described in the present disclosure may be applicable.

Brief Description of the Drawings

[0011]

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[0012] Hereinafter, each embodiment of the present invention will be described with reference to the drawings. In all the drawings of the embodiments, the same or corresponding parts may be denoted by the same reference numerals. In the following description, various information may be described using expressions such as "table", "record", "column", "row", "graph", etc., but the various information may be represented by other data structures. Further, when explaining identification information, expressions such as "identification number" and "name" are used, but these can be mutually replaced.

[0013] <<First Embodiment>> An electronic device 100 according to a first embodiment of the present invention will be described. FIG. 1 is a diagram for explaining an example of the electronic device 100 according to the first embodiment of the present invention. As shown in FIG. 1, the electronic device 100 includes a microcomputer 110, a DAC 120, an IV conversion circuit 130, a switching filter 140, an amplifier circuit 150, a first drive circuit 160, a second drive circuit 170, and a power load 180. The microcomputer 110 may be referred to as a "computer".

[0014] FIG. 2 is a diagram showing an example of the hardware configuration of the microcomputer 110. The microcomputer 110 includes a CPU 111, a ROM 112, a RAM 113, a non-volatile storage device 114 capable of reading and writing data, a network interface 115, an input / output interface 116, and the like. These are communicably connected to each other via a bus 117. The CPU 111 may be referred to as an "arithmetic unit".

[0015] The CPU 111 loads various programs stored in the ROM 112 and / or the storage device 114 into the RAM 113, and realizes various functions by executing the programs loaded into the RAM 113. As described above, various programs executed by the CPU 111 are loaded into the RAM 113, and data used when the CPU 111 executes various programs is temporarily stored. The ROM 112 and / or the storage device 114 are non-volatile storage media, and various programs are stored in the ROM 112 and / or the storage device 114.

[0016] The storage device 114 stores (stores, saves) design information of the electronic circuit, performance degradation characteristic information 300 shown in FIG. 3 described later, stress accumulation time information 400 shown in FIG. 4A, degradation evaluation point information 410 shown in FIG. 4B, and performance degradation information 500 of the electronic component shown in FIG. 5. The details of these information will be described later.

[0017] The network interface 115 is an interface for connecting the electronic device 100 to a network (not shown). The input / output interface 116 is an interface for connecting to a keyboard, a display device, etc. The display device is a display capable of displaying an image.

[0018] Note that instead of the microcomputer 110, a hardware device configured by an FPGA (Field Programmable Gate Array) or the like may be used for a part or all of it.

[0019] The DAC 120 is a digital-to-analog converter, which is a device that converts a digital signal into an analog signal. The analog signal is information represented by a continuous current. The IV conversion circuit 130 is a circuit that converts a current signal into a voltage signal. The switching filter 140 passes an input voltage signal within a specific frequency range and suppresses other frequency components. The switching filter 140 is used to selectively pass or block the frequency of the voltage signal. The amplification circuit 150 amplifies the input voltage signal and generates an output voltage signal.

[0020] The first drive circuit 160 and the second drive circuit 170 are electronic circuits for controlling the electronic device 100 to operate properly. Each of the first drive circuit 160 and the second drive circuit 170 generates a control signal, supplies the signal to the power load 180, and causes the power load 180 to perform a predetermined operation. The power load 180 is a component that consumes power, such as a motor.

[0021] Each of the IV conversion circuit 130, the switching filter 140, the amplification circuit 150, the first drive circuit 160, and the second drive circuit 170 is composed of a plurality of electronic components. The electronic components are, for example, resistors, capacitors, transistors, etc. Each of the plurality of electronic components is referred to as electronic component 1, electronic component 2,..., electronic component N for the sake of convenience of explanation. In the following description, electronic components 1 to N are referred to as "electronic components" when there is no need to particularly distinguish them.

[0022] FIG. 3 is a diagram for explaining the performance degradation characteristic information 300 of electronic components. The performance degradation characteristic information 300 of electronic components is information indicating the performance degradation characteristics with respect to time for each electrical stress of each electronic component constituting the electronic device 100 (electronic circuit). Specifically speaking, the performance degradation characteristic information 300 of electronic components has graphs Gr1 to GrN. Each of the graphs Gr1 to GrN is a graph representing the time change of the performance value (for example, a parameter indicating that the deterioration progresses as the value increases) for each electrical stress of each of the electronic components 1 to N by a line (referred to as a "performance degradation curve").

[0023] Graph Gr1 includes a performance degradation curve a1, a performance degradation curve a2, and a performance degradation curve a3. The performance degradation curve a1 shows the time change of the performance value when the electrical stress of the electronic component 1 is 30%. The performance degradation curve a2 shows the time change of the performance value when the electrical stress of the electronic component 1 is 60%. The performance degradation curve a3 shows the time change of the performance value when the electrical stress of the electronic component 1 is 60%. Note that each of the graphs Gr2 to GrN also represents the time change of the performance degradation for each electrical stress of the corresponding electronic component by performance degradation curves similar to those of graph Gr1. The performance degradation characteristic information 300 of electronic components is created, for example, by performing an acceleration experiment and / or simulation in advance and stored in the storage device 114.

[0024] FIG. 4A is a diagram for explaining stress accumulation time information 400. As shown in FIG. 4A, the stress accumulation time information 400 includes, as columns (columns) for storing information (values), a part number 401 and stress L1 402a1 to stress L10 402a10. In the stress accumulation time information 400 represented by one table, information corresponding to each column regarding the stress accumulation time of an electronic component at a certain time tn is associated with each other and stored as row unit information (records). Specifically, the part number 401 stores an identification number for identifying the electronic component. Each of stress L1 402a1 to stress L10 402a10 stores the accumulated time obtained by accumulating the time during which the corresponding electronic component actually operated within each stress level range. In this example, the stress level range is ten ranges. For example, stress level 1 (stress L1 402a1) is a level range of 0 or more and 10% or less, stress level 2 (stress L2 402a2) is a range of more than 10% and 20% or less, stress level 3 (stress L3 402a3) is a range of more than 20% and 30% or less, stress level 4 (stress L4 402a4) is a range of more than 30% and 40% or less, stress level 5 (stress L5 402a5) is a range of more than 40% and 50% or less, stress level 6 (stress L6 402a6) is a range of more than 50% and 60% or less, stress level 7 (stress L7 402a7) is a range of more than 60% and 70% or less, stress level 8 (stress L8 402a8) is a range of more than 70% and 80% or less, stress level 9 (stress L9 402a9) is a range of more than 80% and 90% or less, and stress level 10 (stress L1 402a10) is a range of more than 90% and 100% or less. The lower the stress level, the lower the electrical stress. Note that the stress accumulation time information 400 is calculated at each time when a predetermined time has elapsed, and the storage device 114 stores the stress accumulation time information 400 corresponding to each time (that is, a plurality of stress accumulation time information 400).

[0025] FIG. 4B is a diagram for explaining the deterioration evaluation point information 410. As shown in FIG. 4B, the deterioration evaluation point information 410 includes a part number 411 and a deterioration evaluation point 412 as columns (columns) for storing information (values). In the deterioration evaluation point information 410, information corresponding to each column regarding the deterioration evaluation points of the electronic components is associated with each other and stored as row unit information (records). Specifically, the part number 401 stores an identification number for identifying the electronic component. The deterioration evaluation point 412 stores a deterioration evaluation point that is the evaluation result of evaluating the deterioration state of the corresponding electronic component.

[0026] FIG. 5 is a diagram for explaining the performance deterioration information 500 of the electronic component. The performance deterioration information 500 of the electronic component is information indicating the time change of the estimated performance value (for example, a parameter indicating that the deterioration progresses as the value increases) when each electronic component constituting the electronic device 100 actually operates. Specifically, the performance deterioration information 500 of the electronic component has graphs GR1 to GRN. Each of the graphs GR1 to GRN is a graph representing the time change of the estimated performance value of each of the electronic components 1 to N of the electronic component by a line (referred to as an "estimated performance deterioration curve").

[0027] Graph GR1 is a graph representing the time change of the estimated performance value of the electronic component 1 by the estimated performance deterioration curve b1. Each of the graphs Gr2 to GrN also represents the time change of the estimated performance value of the corresponding electronic component by an estimated performance deterioration curve similar to that of graph GR1. For convenience of explanation, the performance deterioration curves a1 to a3 of Gr1 in FIG. 3 are shown in graph GR1 of FIG. 5, but these performance deterioration curves a1 to a3 may be omitted.

[0028] <Summary> The microcomputer 110 periodically calculates stress evaluation parameters (e.g., voltage, current, power, bias conditions, heat generation temperature, etc. of each electronic component) at every elapse of a predetermined time as information for evaluating the electrical stress during the actual operation of each electronic component constituting the circuit, based on the design information of the electronic circuit included in the electronic device 100 and the output data D1 output from the microcomputer 110 to the DAC 120.

[0029] The design information of the electronic circuit includes, for example, a circuit diagram including power supply, signal path, and arrangement information of each electronic component, a list of electronic components, information regarding the specifications of each electronic component, information regarding the performance, operating conditions, signal requirements, safety requirements, etc. of the design. The information regarding the specifications of each electronic component indicates how each electronic component operates and under what conditions it can be used. For example, in the case of a resistor, the information regarding the specifications of the electronic component is information indicating rated resistance, tolerance, power evaluation, temperature coefficient, etc.; in the case of a capacitor, it is information indicating capacitance, tolerance, rated voltage, temperature characteristics, etc.; and in the case of a transistor, it is information indicating the characteristic polarity of the transistor, rated voltage, etc.

[0030] The output data D1 is, for example, a digital signal output from a processing unit (e.g., CPU 111) that generates a signal. The microcomputer 110 can calculate and acquire the stress evaluation parameters without providing (adding) a dedicated sensor for detecting the stress evaluation parameters by calculating the stress evaluation parameters using the design information of the electronic circuit and the output data D1.

[0031] For example, at a certain time tn, the microcomputer 110 calculates the time-series data of the stress evaluation parameters of each electronic component in a predetermined time interval using the design information of the electronic circuit and the output data D1 in the predetermined time interval.

[0032] The microcomputer 110 normalizes the time-series data of the stress evaluation parameters of each calculated electronic component by converting it into a ratio to the rated design value of each electronic component based on the design information, thereby calculating the time-series data of the electrical stress normalization value for a predetermined time interval at time tn. That is, the electrical stress normalization value (%) = {stress evaluation parameter of the electronic component ÷ rated design value of the stress evaluation parameter} × 100 (%), normalizes the stress evaluation parameter of each electronic component, and calculates the time-series data of the electrical stress normalization value. Note that the value obtained by normalizing the stress evaluation parameter is referred to as the "electrical stress normalization value".

[0033] Specifically, for example, if the stress evaluation parameter of a certain electronic component N is voltage, the voltage Vn applied to the electronic component N calculated based on the design information, and the rated design value of the electronic component N known based on the design information is "rated Vn", the electrical stress normalization value can be calculated by applying these to the above formula, and the electrical stress normalization value (%) = {voltage Vn ÷ rated Vn} × 100%.

[0034] Based on the time-series data of the electrical stress normalization value for a predetermined time interval, the microcomputer 110 calculates the time during which the electronic component operates within each stress level range from stress L1 402a1 to stress L10 402a10 in the predetermined time interval.

[0035] Based on the calculated time of operation within each stress level range for the predetermined time interval and the stress cumulative time information 400 up to before time tn, the microcomputer 110 calculates the cumulative time of operation within each stress level range at time tn.

[0036] Based on the cumulative time of operation within each stress level range at time \(t_n\), the microcomputer 110 creates stress cumulative time information 400 at time \(t_n\) and stores (saves, memorizes) it in the storage device 114. Instead of saving the time-series data of the stress evaluation parameters themselves in the storage device 114, by saving the stress cumulative time information 400 in the storage device 114, the amount of stored data of the data necessary for estimating (evaluating) the deterioration state of each electronic component can be reduced.

[0037] The microcomputer 110 obtains, for each electronic component, the stress cumulative time and the performance deterioration curve of each stress level range corresponding to that electronic component from the performance deterioration characteristic information 300 of the electronic component and the stress cumulative time information 400, and based on the obtained stress cumulative time and the performance deterioration curve of each stress level range of the electronic component, estimates the performance value of the electronic component, thereby calculating the time-series data of the estimated performance values of each electronic component up to a certain time \(t_n\). The microcomputer 110 calculates the performance deterioration information 500 of the electronic component indicating the performance deterioration state of each electronic component by performing all these calculations for each of all the electronic components.

[0038] For example, in FIG. 5, when a certain time \(t_n\) is \(t_{10}\), the estimated performance value of the electronic component at time \(t_{10}\) can be obtained by Σ (calculated performance value \(P_n\)). Here, \(n = 1\) to 10, and the calculated performance value \(P_n\) is a value calculated based on the cumulative time of the stress level \(L_n\) and the performance deterioration curve of the electronic component at the stress level \(L_n\). The relationship of “time from time 0 to time \(t_{10}\)” = (cumulative time of stress level \(L_1\) + cumulative time of stress level \(L_2\) + ··············· + cumulative time of stress level \(L_{10}\)) holds. The performance deterioration curves \(d_1\) to \(d_{10}\) of each electronic component for stress levels \(L_1\) to \(L_{10}\) shown in block BR1 of FIG. 5 can be estimated based on the performance deterioration curves \(a_1\) to \(a_3\).

[0039] For example, at a certain time t10, if the cumulative time at stress level L1 is x1 hours, the cumulative time at stress level L2 is x2 hours, the cumulative time at stress level L3 is x3, and the cumulative time at other stress levels is 0 hours, the estimated performance value of the electronic component at time t10 can be obtained by "the calculated performance value P1 based on the performance degradation curve of the electronic component at x1 hours and stress level L1 (the performance value corresponding to time x1 on performance degradation curve d1)" + "the calculated performance value P2 based on the performance degradation curve of the electronic component at x2 hours and stress level L2 (the performance value corresponding to time x2 on performance degradation curve d2)" + "the calculated performance value P3 based on the performance degradation curve of the electronic component at x3 hours and stress level L3 (the performance value corresponding to time x3 on performance degradation curve d3)".

[0040] Also, the microcomputer 110 calculates the degradation evaluation point (%) of each electronic component at the current time based on the current estimated performance value. For example, when the current time is time t10, the performance value at time t10 is y1%, and the threshold value of the estimated performance value is the threshold value yth%, the degradation evaluation point corresponding to y1% (= (y1 ÷ yth) × 100)% is calculated. The microcomputer 110 stores the calculated degradation evaluation point in the degradation evaluation point information 410 and updates the degradation evaluation point information 410.

[0041] The microcomputer 110 outputs the performance degradation information 500 of the electronic component, the degradation evaluation point information 410 of each electronic component, etc. to an external device according to an output command. For example, when the external device is a display device, the display device displays the performance degradation information 500 of the electronic component and the degradation evaluation point information 410 output from the microcomputer 110. Note that the microcomputer 110 may output information obtained by processing the performance degradation information 500 of the electronic component, the degradation evaluation point information 410 of each electronic component, etc. to the external device and have it displayed on the display device.

[0042] Based on the performance degradation information 500 and degradation evaluation point information 410 (or information processed therefrom) of the electronic components displayed on the display device, the user can determine the timing of maintenance, inspection, and replacement of each electronic component, as well as the priority order of maintenance, inspection, and replacement of each electronic component. Based on the determination result, the user can take appropriate actions against the degradation of each electronic component or plan appropriate countermeasures against the degradation of each electronic component.

[0043] Note that the microcomputer 110 may calculate the respective timings of maintenance, inspection, and replacement of each electronic component, or the respective priority orders of maintenance, inspection, and replacement of each electronic component based on the performance degradation information 500 and / or degradation evaluation point information 410 of the electronic components, and output the calculated results to an external device.

[0044] <Specific operation> FIG. 6 is a flowchart showing a processing flow executed by the CPU 111 of the microcomputer 110. The CPU 111 executes the processing flow shown in FIG. 6 every time a predetermined time elapses. When starting the processing from step 600, the CPU 111 sequentially executes the processing of steps 605 to 630 described below, and then proceeds to step 635.

[0045] Step 605: Based on the output data D1 in a predetermined time interval (for example, the output data D1 (digital signal) in a predetermined time output from the microcomputer 110 to the DAC 120) and the design information, the CPU 111 calculates the time-series data of the stress evaluation parameters of each electronic component during circuit operation. Note that for each electronic component, the types of stress evaluation parameters (such as voltage, current, or power) to be calculated are set.

[0046] Step 610: The CPU 111 normalizes the time-series data of the stress evaluation parameters using the normalization parameters, and calculates the time-series data of the electrical stress normalization values. For example, when the stress evaluation parameter of a certain electronic component is the voltage of the electronic component, the normalization parameter is the rated voltage value of the electronic component. In this case, the normalization is performed by (voltage of the electronic component ÷ rated voltage value of the electronic component) × 100%.

[0047] Step 615: As described above, the CPU 111 calculates the cumulative time for each stress level using the time-series data of the electrical stress normalization values in a predetermined time interval, and stores the stress cumulative time information 400 in the storage device 114.

[0048] Step 620: Based on the stress cumulative time information 400 and the performance degradation characteristic information 300 of the electronic component, the CPU 111 calculates the estimated performance degradation curve up to the current time by the method described above, thereby calculating the performance degradation information 500 of the electronic component, and stores the performance degradation information 500 of the electronic component in the storage device 114.

[0049] Step 625: The CPU 111 calculates the degradation evaluation points of each electronic component by the method described above. The CPU 111 stores the calculated degradation evaluation points of each electronic component in the degradation evaluation point information 410.

[0050] When the CPU 111 proceeds to step 630, it determines whether there is a data output command. If there is no data output command, the CPU 111 determines "NO" in step 630 and proceeds to step 695 to temporarily end this processing flow.

[0051] If there is a data output command, the CPU 111 determines "YES" in step 630 and proceeds to step 635, and outputs the performance degradation information 500 and the degradation evaluation point information 410 to the external device that requested the output. Then, the CPU 111 proceeds to step 695 to temporarily end this processing flow.

[0052] In addition, in the flowchart of FIG. 6, step 630 may be omitted, and the CPU 111 may periodically perform the process of step 635.

[0053] <Effect> As described above, the electronic device 100 according to the first embodiment of the present invention can estimate the state of each electronic component without providing a dedicated sensor for determining (detecting) the state of the electronic component.

[0054] <<Second Embodiment>> The electronic device 100 according to the second embodiment of the present invention will be described. The electronic device 100 according to the second embodiment has differences from the electronic device 100 according to the first embodiment only in the following points. · The electronic device 100 according to the second embodiment periodically monitors the performance of the electronic device 100 and reflects the monitoring result in the performance degradation characteristic information 300 (performance degradation curve) of the electronic component.

[0055] Hereinafter, the description will focus on this difference. <Overview> Similar to the first embodiment, the microcomputer 110 periodically calculates stress evaluation parameters every time a predetermined time elapses based on the design information of the electronic circuit included in the electronic device 100 and the output data D1. Similar to the first embodiment, the microcomputer 110 calculates time-series data of the electrical stress normalization values in a predetermined time interval at time tn. Similar to the first embodiment, based on the time-series data of the electrical stress normalization values in a predetermined time interval, the microcomputer 110 calculates the time during which the electronic component operates in each stress level range from stress L1 402a1 to stress L10 402a10 in the predetermined time interval. Based on the calculated time of operation in each stress level range in the predetermined time interval and the stress cumulative time information 400 up to before time tn, the microcomputer 110 calculates the cumulative time of operation in each stress level range at time tn.

[0056] The microcomputer 110 creates stress cumulative time information 400 at time tn based on the cumulative time of operation within each stress level range at time tn, and stores (saves, memorizes) it in the storage device 114.

[0057] The microcomputer 110 measures, every time a predetermined time has elapsed, a performance evaluation parameter indicating the performance of the electronic circuit of the electronic device 100, and calculates time-series data of the performance values of the electronic circuit of the electronic device 100 based on the measured time-series data of the performance evaluation parameter. Examples of the performance evaluation parameter indicating the performance of the electronic circuit of the electronic device 100 include, for example, the operating frequency, power consumption, noise, gain, and the like. The microcomputer 110 calculates (estimates) the measured performance degradation curve of each electronic component based on the time-series data of the performance values of the electronic circuit of the electronic device 100 and the stress cumulative time information 400. This estimation can be performed, for example, using simulation results or AI.

[0058] The microcomputer 110 corrects the performance degradation characteristic information 300 of the electronic component using the measured performance degradation curve of each electronic component. By correcting the performance degradation characteristic information 300 of the electronic component based on the measured values, the microcomputer 110 can more accurately estimate the degradation state of the electronic component. For example, the microcomputer 110 compares the performance degradation curve of the performance degradation characteristic information 300 with the measured performance degradation curve, and uses a mathematical method to derive a correction function or correction coefficient for matching the performance degradation curve to the measured performance degradation polarity. The microcomputer 110 corrects the performance degradation curve of the performance degradation characteristic information 300 using the derived correction function or correction coefficient. As a result, the performance degradation characteristic information 300 (the performance degradation curve of the performance degradation characteristic information 300) can be made to conform to the measured performance degradation curve as much as possible.

[0059] The microcomputer 110 obtains, for each electronic component, the stress accumulation time and the performance degradation curve within each stress level range corresponding to the electronic component from the corrected performance degradation characteristic information 300 and stress accumulation time information 400 of the electronic component, and estimates the performance value of the electronic component at a certain time tn based on the obtained stress accumulation time and performance degradation curve within each stress level range of the electronic component, thereby calculating the time-series data of the estimated performance values of each electronic component up to a certain time tn. The microcomputer 110 calculates the performance degradation information 500 of the electronic component indicating the performance degradation state of each electronic component by performing all these calculations for each of all the electronic components.

[0060] Also, similar to the first embodiment, the microcomputer 110 calculates the degradation evaluation point (%) of each electronic component at the current time based on the estimated performance value at the current time, stores the calculated degradation evaluation point (%) in the degradation evaluation point information 410, and updates the performance evaluation point information 410.

[0061] Similar to the first embodiment, the microcomputer 110 outputs the performance degradation information 500 of the electronic component, the degradation evaluation point information 410 of each electronic component, etc. to an external device in response to an output command. Note that, similar to the first embodiment, the microcomputer 110 may calculate the respective timings of maintenance, inspection, and replacement of each electronic component, or the respective priorities of maintenance, inspection, and replacement of each electronic component based on the performance degradation information 500 and / or degradation evaluation point information 410 of the electronic component, and output the calculated results to the external device.

[0062] The microcomputer 110 may also output, in response to an output command, the time-series data of the performance values of the electronic circuit of the electronic device 100, etc. to an external device. The user can reflect the results of viewing the time-series data of the performance values of the electronic circuit of the electronic device 100 and the performance degradation information 500 in the design of the electronic device 100.

[0063] Note that the microcomputer 110 may analyze time-series data of performance values of the electronic circuits of the electronic device 100 using AI or the like, calculate design information of the electronic circuits of the optimized electronic device 100 based on the analysis results, and output the calculated design information to an external device.

[0064] <Specific operation> FIG. 7 is a flowchart showing a processing flow executed by the CPU 111 of the microcomputer 110. The CPU 111 executes the processing flow shown in FIG. 7 every time a predetermined time elapses. The processing flow in FIG. 7 is the same as the processing flow shown by the flowchart in FIG. 6, except that steps 627 and 629 are added between steps 625 and 630 in the flowchart of FIG. 6. Therefore, hereinafter, these different steps 627 and 629 will be described, and the description of the processing of the other steps will be omitted.

[0065] Step 627: The CPU 111 measures the performance of the electronic circuits of the electronic device 100. That is, as described above, the CPU 111 measures time-series data of performance evaluation parameters indicating the performance of the electronic circuits of the electronic device 100, and calculates time-series data of the performance values of each electronic component based on the measured performance evaluation parameters. The CPU 111 calculates the measured performance degradation curve of each electronic component based on the time-series data of the performance values of each electronic component and the stress accumulation time information 400.

[0066] Step 629: The CPU 111 feeds back (reflects) the measurement result of the performance of the electronic device 100 to the performance degradation curve of each electronic component in the performance degradation characteristic information 300. That is, the CPU 111 corrects the performance degradation characteristic information 300 of the electronic component using the measured performance degradation curve of each electronic component calculated in step 627. Note that in the subsequent processing, the corrected performance degradation characteristic information 300 of the electronic component is used.

[0067] <Effect> As described above, the electronic device 100 according to the second embodiment of the present invention can estimate the state of each electronic component without providing a dedicated sensor for determining (detecting) the state of the electronic component. Further, the electronic device 100 according to the second embodiment corrects the performance degradation characteristic information 300 of the electronic component based on the measured value, and uses the corrected performance degradation characteristic information 300 of the electronic component, so that the degradation state of each electronic component can be estimated more accurately.

[0068] <<Third Embodiment>> The electronic device 100 according to the third embodiment of the present invention will be described. The electronic device 100 according to the third embodiment has differences from the electronic device 100 according to the first embodiment only in the following points. · The electronic device 100 according to the third embodiment estimates the performance change of each electronic component by calculation, and calculates the stress evaluation parameter in consideration of the estimated performance change of each electronic component.

[0069] Hereinafter, the description will be centered on this difference. <Overview> The microcomputer 110 periodically calculates the stress evaluation parameter every time a predetermined time elapses based on the design information of the electronic circuit included in the electronic device 100 and the output data D1. In this calculation, the microcomputer 110 estimates the performance change of each electronic component based on the stress accumulation time information 400, and calculates the stress evaluation parameter in consideration of the estimated performance change. Specifically, for example, the microcomputer 110 acquires the parameters necessary for calculating the stress evaluation parameter from the design information, corrects the acquired parameters necessary for calculating the stress evaluation parameter to values corresponding to the performance change estimated based on the stress accumulation time information 400, and uses the corrected values to calculate the stress evaluation parameter.

[0070] For example, when the parameter necessary for calculating the stress evaluation parameter is voltage, the voltage is corrected to a value estimated based on the stress accumulation time information 400, and the corrected value is used to calculate the stress evaluation parameter.

[0071] This correction is performed using, for example, the relationship between the stress accumulation time information 400 that is known in advance by conducting experiments / simulations, etc., and the parameters required for calculating the stress evaluation parameters of each electronic component. Note that, except for the above points, it is the same as the electronic device 100 according to the first embodiment, so detailed descriptions of other aspects are omitted.

[0072] <Specific operation> FIG. 8 is a flowchart showing the processing flow executed by the CPU 111 of the microcomputer 110. The CPU 111 executes the processing flow shown in FIG. 8 every time a predetermined time elapses. The processing flow in FIG. 8 is the same as the processing flow shown by the flowchart in FIG. 6, except that steps 827 and 829 are added between steps 625 and 630 in the flowchart of FIG. 6. Therefore, hereinafter, these different steps 827 and 829 will be described, and descriptions of the processing of other steps are omitted.

[0073] Step 827: The CPU 111 estimates the performance change of the electronic component by the method described above. That is, the CPU 111 uses the relationship between the stress accumulation time information 400 and the parameters required for calculating the stress evaluation parameters of each electronic component to obtain the parameters required for calculating the stress evaluation parameters from the design information of each electronic component, and corrects the obtained parameters required for calculating the stress evaluation parameters to values corresponding to the estimated performance change based on the stress accumulation time information 400.

[0074] Step 829: The CPU 111 reflects the performance change of the electronic component in the calculation of the next stress evaluation parameter as described above. That is, in step 605 hereinafter, the stress evaluation parameters of each electronic component are calculated by the method described above.

[0075] <Effect> As described above, the electronic device 100 according to the third embodiment of the present invention can estimate the state of each electronic component without providing a dedicated sensor for determining (detecting) the state of the electronic component. Further, the electronic device 100 according to the third embodiment estimates the performance change of the electronic component, and uses the stress evaluation parameter reflecting the estimated performance change of the electronic component to more accurately estimate the deterioration state of each electronic component.

[0076] <<Fourth Embodiment>> The deterioration state estimation system for electronic components according to the fourth embodiment of the present invention will be described. FIG. 9 is a diagram showing a system configuration example of the deterioration state estimation system for electronic components according to the fourth embodiment. As shown in FIG. 9, the deterioration state estimation system for electronic components according to the fourth embodiment includes a plurality of electronic devices 900 and a management server 910. The plurality of electronic devices 900 and the management server 910 are connected to be able to transmit and receive information to and from each other via a network NW1.

[0077] In the first embodiment, the deterioration state estimation system for electronic components executes the estimation of the deterioration state of the electronic components constituting the electronic device 900 executed by the electronic device 900 on the management server 910. The electronic device 900 is the same as the electronic device 100 of the first embodiment except that it does not have the function of estimating the deterioration state of the electronic component. Therefore, in the storage device 114 of the electronic device 900, the performance deterioration characteristic information 300 shown in FIG. 3, the stress accumulation time information 400 shown in FIG. 4A, the deterioration evaluation point information 410 shown in FIG. 4B, and the performance deterioration information 500 of the electronic component shown in FIG. 5, which are necessary for estimating the deterioration state of the electronic component, are not stored.

[0078] The management server 910 includes a CPU 911, a ROM 912, a RAM 913, a non-volatile storage device 914 capable of reading and writing data, a network interface 915, an input / output interface 916, and the like. These are connected to be able to communicate with each other via a bus (not shown). The CPU 911 may be referred to as an "arithmetic unit". The management server 910 may be composed of a plurality of servers or may be a virtual computer constructed on the cloud.

[0079] The CPU 911 realizes various functions by loading various programs stored in the ROM 912 and / or the storage device 914 into the RAM 913 and executing the programs loaded into the RAM 913. As described above, various programs executed by the CPU 911 are loaded into the RAM 913, and data used when the CPU 911 executes various programs is temporarily stored. The ROM 912 and / or the storage device 914 are non-volatile storage media, and various programs are stored in the ROM 912 and / or the storage device 914.

[0080] The storage device 914 stores (stores, saves) design information (not shown) of the electronic circuit of the electronic device 900, performance degradation characteristic information 300 shown in FIG. 3, stress accumulation time information 400 shown in FIG. 4A, degradation evaluation point information 410 shown in FIG. 4B, and performance degradation information 500 of the electronic component shown in FIG. 5.

[0081] The network interface 915 is an interface for connecting the management server 910 to the network NW1. The input / output interface 916 is an interface for connecting to a keyboard, a display device, and the like. The display device is a display capable of displaying an image. A hardware device configured by an FPGA (Field Programmable Gate Array) or the like may be used for part or all of the management server 910.

[0082] <Summary> The microcomputer 110 of the electronic device 900 sequentially transmits the output data D1 to the management server 910. The management server 910 performs the same operations as those performed by the microcomputer 110 of the electronic device 100 in the first embodiment using the received output data D1.

[0083] That is, the management server 910 periodically calculates stress evaluation parameters every time a predetermined time elapses based on the design information of the electronic circuit and the output data D1.

[0084] The management server 910 calculates time-series data of stress evaluation parameters for each calculated electronic component by normalizing them by converting them into a ratio to the rated design value of each electronic component based on the design information, thereby calculating time-series data of the electrical stress normalization value.

[0085] Based on the time-series data of the electrical stress normalization value, the management server 910 calculates which stress level range among the stresses L1 402a1 to L10 402a10 of the stress cumulative time information 400 the electrical stress normalization value corresponds to, and calculates the time of operation within that stress level range. The management server 910 further calculates the cumulative time of the time of operation within that stress level range.

[0086] Based on the calculated stress level range and the cumulative time of operation within that stress level range, the management server 910 updates the stress cumulative time information 400.

[0087] The management server 910 calculates time-series data of the electrical stress normalization value. Based on the time-series data of the electrical stress normalization value, the management server 910 creates stress cumulative time information 400 and stores (saves, remembers) it in the storage device 814.

[0088] From the performance degradation characteristic information 300 of the electronic component and the stress cumulative time information 400, the management server 910 obtains the stress cumulative time and the performance degradation curve of each stress level range corresponding to the electronic component for the electronic component, and based on the stress cumulative time and the performance degradation curve of each stress level range of the obtained electronic component, estimates the performance value of the electronic component, thereby calculating time-series data of the estimated performance value of each electronic component up to a certain time tn. The management server 910 calculates the performance degradation information 500 of the electronic component indicating the performance degradation state of each electronic component by performing all these calculations for each of all the electronic components.

[0089] Further, based on the current estimated performance value, the management server 910 calculates the deterioration evaluation points (%) of each current electronic component, and stores the calculated deterioration evaluation points in the deterioration evaluation point information 410.

[0090] In response to an output command, the management server 910 outputs the performance deterioration information 500 of the electronic components and the deterioration evaluation point information 410 of each electronic component to an external device. Note that the management server 910 may calculate the respective timings of maintenance, inspection, and replacement of each electronic component, or the respective priorities of maintenance, inspection, and replacement of each electronic component, based on the performance deterioration information 500 and / or the deterioration evaluation point information 410 of the electronic components, and output the calculated results to the external device.

[0091] Based on the performance deterioration information 500 and the deterioration evaluation point information 410 (or information processed therefrom) of the electronic components of the entire electronic device 900 displayed on the display device, the user can determine the timings of maintenance, inspection, and replacement of each electronic component of the entire electronic device 900, as well as the priorities of maintenance, inspection, and replacement of each electronic component. Based on the determination result, the user can take appropriate actions against the deterioration of each electronic component or plan appropriate measures against the deterioration of each electronic component. Based on the prediction result, when determining the order of maintenance, inspection, and replacement and taking measures based on the performance deterioration information 500 and the deterioration evaluation point information 410 (or information processed therefrom) of the electronic components of the entire electronic device 900 displayed on the display device, the user can manage all the electronic components in the entire electronic device 900 collectively.

[0092] Note that when calculating the estimated performance value of each electronic component, the management server 910 may correct the calculation results of the same electronic components existing in the entire electronic device 900 or the calculation results of mutually similar electronic components by using a statistical processing method, so as to improve the accuracy of the calculation results of the estimated performance value.

[0093] <Specific Operations> FIG. 10 is a flowchart showing a processing flow executed by the CPU 911 of the management server 910. The CPU 911 executes the processing flow shown in FIG. 10 every time a predetermined time elapses. When the CPU 911 starts processing from step 1000, it sequentially executes the processing of steps 1005 to 1030 described below, and then proceeds to step 1035.

[0094] Step 1005: The CPU 911 receives the output data D1 from each electronic device 900. Step 1010: The CPU 911 calculates time-series data of stress evaluation parameters for each electronic component during circuit operation based on the output data D1 and design information in a predetermined time interval. Step 1015: The CPU 911 normalizes the time-series data of the stress evaluation parameters using the normalization parameter to calculate the time-series data of the electrical stress normalization value. Step 1020: As described above, the CPU 911 calculates the cumulative time for each stress level using the time-series data of the electrical stress normalization value in a predetermined time interval, and stores the stress cumulative time information 400 in the storage device 914. Step 1025: Based on the stress cumulative time information 400 and the performance degradation characteristic information 300, the CPU 911 calculates the performance degradation information 500 of the electronic component by calculating the estimated performance degradation curve up to the current time by the method described above, and stores the performance degradation information 500 in the storage device 914. Step 1030: The CPU 911 calculates the degradation evaluation points of each electronic component by the method described above. The CPU 911 stores the calculated degradation evaluation points of each electronic component in the degradation evaluation point information 410.

[0095] When the CPU 911 proceeds to step 1035, it determines whether there is a data output command. If there is no data output command, the CPU 911 determines "NO" at step 1035 and proceeds to step 1095 to temporarily end this processing flow.

[0096] When there is a data output command, the CPU 911 determines "YES" in step 1035 and proceeds to step 1040, and outputs the performance degradation information 500 and the degradation evaluation point information 410 to the external device that has requested the output. Thereafter, the CPU 911 proceeds to step 1095 and temporarily ends this processing flow.

[0097] In the flowchart of FIG. 10, step 1035 may be omitted, and the CPU 911 may periodically perform the process of step 1040.

[0098] <Effect> As described above, the deterioration state estimation system for electronic components according to the fourth embodiment of the present invention can estimate the state of each electronic component without providing a dedicated sensor for determining (detecting) the state of the electronic component.

[0099] <<Fifth Embodiment>> The deterioration state estimation system for electronic components according to the fifth embodiment of the present invention will be described. The deterioration state estimation system for electronic components according to the fifth embodiment has differences from the deterioration state estimation system for electronic components according to the fourth embodiment only in the following points. · The deterioration state estimation system for electronic components according to the fifth embodiment periodically monitors the performance of the electronic device 900 and reflects the monitoring results in the performance degradation characteristic information 300 (performance degradation curve) of the electronic component.

[0100] Hereinafter, the description will be centered on this difference. <Overview> The microcomputer 110 of the electronic device 900 periodically transmits the output data D1 to the management server 910 every time a predetermined time elapses. The management server 910 performs the same operations as those performed by the microcomputer 110 in the second embodiment using the received output data D1. Since this operation has already been described in the second embodiment, the description thereof is omitted. Note that, similar to the first embodiment, when calculating the estimated performance values of the respective electronic components, the management server 910 may correct the calculation results of the same electronic components existing in all the electronic devices 900 or the calculation results of electronic components similar to each other by using a statistical processing method, so as to improve the accuracy of the calculation results of the estimated performance values. Further, the management server 910 stores (stores, preserves) the time-series data of the performance evaluation parameters indicating the performance of the electronic circuits of all the electronic devices 900 in the storage device 914, and analyzes these stored data (big data), thereby calculating the determination criteria for the respective timings of maintenance, inspection, and replacement of each electronic component of the electronic device 900, or the determination criteria for the respective priorities of maintenance, inspection, and replacement of each electronic component, and outputting the calculated results to an external device.

[0101] <Specific operation> FIG. 11 is a flowchart showing the processing flow executed by the CPU 911 of the management server 910. The CPU 911 executes the processing flow shown in FIG. 11 every time a predetermined time elapses. The processing flow in FIG. 11 is the same as the processing flow shown by the flowchart in FIG. 10, except that steps 1032 and 1034 are added between steps 1030 and 1035 in the flowchart of FIG. 10. Therefore, hereinafter, these different steps 1032 and 1034 will be described, and the description of the processing of the other steps will be omitted.

[0102] Step 1032: The CPU 911 measures the performance of the electronic device 900. That is, as described above, the CPU 911 measures the time-series data of the performance evaluation parameters indicating the performance of the electronic circuit of the electronic device 900, and calculates the time-series data of the performance values of each electronic component based on the measured performance evaluation parameters. The CPU 911 calculates the measured performance degradation curve of each electronic component based on the time-series data of the performance values of each electronic component and the stress accumulation time information 400.

[0103] Step 1034: The CPU 911 feeds back (reflects) the measurement result of the performance of the electronic circuit of the electronic device 900 to the performance degradation curve of each electronic component in the performance degradation characteristic information 300. That is, the CPU 911 corrects the performance degradation characteristic information 300 of the electronic component using the measured performance degradation curve of each electronic component calculated in Step 1032. In the subsequent processing, the corrected performance degradation characteristic information 300 of the electronic component is used.

[0104] <Effect> As described above, the degradation state estimation system according to the fifth embodiment of the present invention can estimate the state of each electronic component without providing a dedicated sensor for determining (detecting) the state of the electronic component. Further, the degradation state estimation system according to the fifth embodiment corrects the performance degradation characteristic information 300 of the electronic component based on the measured value, and uses the corrected performance degradation characteristic information 300 of the electronic component, so that the degradation state of each electronic component can be estimated more accurately.

[0105] <<Sixth Embodiment>> The degradation state estimation system of the electronic component according to the sixth embodiment of the present invention will be described. The degradation state estimation system of the electronic component according to the sixth embodiment has differences from the degradation state estimation system of the electronic component according to the fourth embodiment only in the following points. · The degradation state estimation system of the electronic component according to the sixth embodiment estimates the performance change of each electronic component, and calculates the stress evaluation parameter in consideration of the estimated performance change of each electronic component.

[0106] Hereinafter, the description will be centered on this difference. <Summary> The microcomputer 110 of the electronic device 900 periodically transmits the output data D1 to the management server 910 every time a predetermined time elapses. The management server 910 performs the same operations as those performed by the microcomputer 110 in the third embodiment using the received output data D1. Since this operation has already been described in the third embodiment, the description thereof is omitted. Note that, as in the first embodiment, when calculating the estimated performance value of each electronic component, the management server 910 may correct the calculation results of the same electronic components or the calculation results of electronic components that are similar to each other existing in all the electronic devices 900 by using a statistical processing method, so as to improve the accuracy of the calculation results of the estimated performance value.

[0107] <Specific Operation> FIG. 12 is a flowchart showing a processing flow executed by the CPU 911 of the management server 910. The CPU 911 executes the processing flow shown in FIG. 12 every time a predetermined time elapses. The processing flow in FIG. 12 is the same as the processing flow shown by the flowchart in FIG. 10, except that steps 1232 and 1234 are added between steps 1030 and 1035 of the flowchart in FIG. 10. Therefore, hereinafter, these different steps 1232 and 1234 will be described, and the description of the processing of the other steps will be omitted.

[0108] Step 1232: The CPU 911 estimates the performance change of the electronic component by the method described above. That is, the CPU 911 obtains the parameters required for calculating the stress evaluation parameter of each electronic component from the design information of each electronic component by using the relationship between the stress accumulation time information 400 and the parameters required for calculating the stress evaluation parameter of each electronic component, and corrects the parameters required for calculating the obtained stress evaluation parameter to values corresponding to the estimated performance change based on the stress accumulation time information 400.

[0109] Step 1234: As described above, the CPU 911 reflects the performance change of the electronic component in the calculation of the parameters for the next stress evaluation. That is, in the subsequent step 1010, the stress evaluation parameters for each electronic component are calculated by the method described above.

[0110] <Effect> As described above, the deterioration state estimation system according to the sixth embodiment of the present invention can estimate the state of each electronic component without providing a dedicated sensor for determining (detecting) the state of the electronic component. Further, the deterioration state estimation system according to the sixth embodiment can estimate the performance change of the electronic component, and can more accurately estimate the deterioration state of each electronic component using the stress evaluation parameter reflecting the estimated performance change of the electronic component.

[0111] <<Seventh Embodiment>> The electronic device 1300 according to the seventh embodiment of the present invention will be described. The electronic device 1300 according to the seventh embodiment has differences from the electronic device 100 according to the first embodiment only in the following points. · The electronic device 1300 according to the seventh embodiment calculates stress evaluation parameters (for example, the voltage, current, power, bias condition, heat generation temperature, etc. of each electronic component) for each electronic component constituting the circuit based on the input data D2.

[0112] Hereinafter, the description will be centered on this difference. FIG. 13 is a diagram for explaining an example of the electronic device 1300 according to the seventh embodiment of the present invention. As shown in FIG. 13, the electronic device 1300 includes a microcomputer 1310, a sensor 1320, an IV conversion circuit 1330, a first amplifier circuit 1340, a second amplifier circuit 1350, and an ADC 1360.

[0113] The microcomputer 1310 has the same configuration as the microcomputer 110 according to the first embodiment. Similar to the first embodiment, design information, performance degradation characteristic information 300, stress accumulation time information 400, degradation evaluation point information 410, and performance degradation information 500 of electronic components are stored (stored, saved) in the storage device 114.

[0114] The sensor 1320 is a device that collects information from the surrounding environment and converts it into an electrical signal or data. The sensor 1320 is, for example, a temperature sensor or the like. The IV conversion circuit 1330 is a circuit that converts a current signal into a voltage signal. The first amplifier circuit 1340 amplifies the input voltage signal and generates an output voltage signal. The second amplifier circuit 1350 amplifies the input voltage signal and generates an output voltage signal. The ADC 1360 is an analog-to-digital converter, which is a device that converts an analog signal into a digital signal.

[0115] Based on the design information of the electronic circuit included in the electronic device 1300 and the input data D2 input to the microcomputer 1310, the microcomputer 1310 calculates stress evaluation parameters (for example, the voltage, current, power, bias conditions, heat generation temperature, etc. of each electronic component) every time a predetermined time elapses as information for evaluating the electrical stress during the actual operation of each electronic component constituting the circuit. Except for the above points, it is the same as the first embodiment, so the description is omitted.

[0116] <Effect> As described above, the electronic device 1300 according to the seventh embodiment of the present invention can estimate the state of each electronic component without providing a dedicated sensor for determining (detecting) the state of the electronic component. Note that the features of the electronic device 100 according to the second embodiment may be applied to the electronic device 1300 according to the seventh embodiment. The features of the electronic device 100 according to the third embodiment may be applied to the electronic device 1300 according to the seventh embodiment.

[0117] <<Modification Example>> The present invention is not limited to the above-described embodiments, and various modifications can be adopted within the scope of the present invention. Furthermore, the above-described embodiments can be combined with each other as long as they do not depart from the scope of the present invention.

[0118] In the fourth to sixth embodiments, instead of the electronic device 900, another electronic device (this other electronic device is different from the electronic device 1300 only in that the performance degradation characteristic information 300 shown in FIG. 3, the stress accumulation time information 400 shown in FIG. 4A, the degradation evaluation point information 410 shown in FIG. 4B, and the performance degradation information 500 of the electronic component shown in FIG. 5 are not stored.) may be used. In this case, the management server 910 operates in the same manner as in the fourth to sixth embodiments, except that it receives the input data D2 instead of the output data D1 from the electronic device.

[0119] In each embodiment, a threshold may be set for the estimated performance value, and when the estimated performance value becomes equal to or greater than the threshold, the user may be notified, for example, by sound, image, etc. via an external device (e.g., a user terminal) that the electronic component is deteriorated.

[0120] In each embodiment, a threshold may be set for the degradation evaluation point, and when the degradation evaluation point becomes equal to or greater than the threshold, the user may be notified, for example, by sound, image, etc. via an external device (e.g., a user terminal) that the electronic component is deteriorated.

[0121] The present invention can also adopt the following configuration. [1] A method for estimating the degradation state of each electronic component of an electronic device using at least one of an arithmetic device inside and outside the electronic device and at least one of a storage device inside and outside the electronic device, the electronic device including an electronic circuit having a plurality of electronic components, comprising: the storage device stores design information of the electronic circuit and performance degradation characteristic information indicating characteristics of performance degradation of each electronic component of the electronic device; by the arithmetic device, Based on the design information of the electronic circuit and the output data to the electronic circuit or the input data from the electronic circuit, calculate the time-series data of the stress evaluation parameters of each electronic component when the electronic circuit is operating, and calculate the time-series data of the electrical stress normalization values of each electronic component by normalizing the calculated time-series data of the stress evaluation parameters of each electronic component. Based on the time-series data of the electrical stress normalization values of each electronic component, calculate stress cumulative time information indicating the cumulative time that each electronic component of the electronic device has actually operated within each of a plurality of stress level ranges, and store the stress cumulative time information in the storage device. Calculate the estimated performance value of each electronic component indicating the performance degradation state of each electronic component of the electronic device based on the stress cumulative time information and the performance degradation characteristic information. Method for estimating the degradation state of an electronic component. [2] In the method for estimating the degradation state of an electronic component according to [1], by the arithmetic unit, measure the degradation state of the electronic circuit when the electronic device is actually operating, correct the performance degradation characteristic information of each electronic component based on the measured degradation state of the electronic circuit, calculate the estimated performance value of each electronic component using the corrected performance degradation characteristic information. Method for estimating the degradation state of an electronic component. [3] In the method for estimating the degradation state of an electronic component according to [1], by the arithmetic unit, calculate the performance change of the electronic component, when calculating the time-series data of the stress evaluation parameters based on the design information of the electronic circuit and the output data or the input data, calculate the time-series data of the stress evaluation parameters so as to reflect the calculated performance change. Method for estimating the degradation state of an electronic component.

Explanation of symbols

[0122] 100... Electronic device, 110... Microcomputer, 111... CPU, 114... Storage device, 300... Performance degradation characteristic information, 400... Stress accumulation time information, 410... Degradation evaluation point information, 500... Performance degradation information, 900... Electronic device, 910... Management server, 911... CPU, 914... Storage device, D1... Output data, D2... Input data

Claims

1. An electronic device comprising: an electronic circuit having a plurality of electronic components; and a computer having an arithmetic unit and a storage unit, wherein the storage unit stores design information of the electronic circuit and performance degradation characteristic information indicating characteristics of performance degradation of each electronic component, and the arithmetic unit calculates time-series data of stress evaluation parameters of each electronic component when the electronic circuit is operating based on the design information of the electronic circuit and output data to or input data from the electronic circuit, and normalizes the calculated time-series data of the stress evaluation parameters of each electronic component to calculate time-series data of normalized electrical stress values of each electronic component, calculates stress cumulative time information indicating the cumulative time that each electronic component has actually operated in each of a plurality of stress level ranges based on the time-series data of the normalized electrical stress values of each electronic component, and stores the stress cumulative time information in the storage unit, and calculates an estimated performance value of each electronic component indicating the performance degradation state of each electronic component based on the stress cumulative time information and the performance degradation characteristic information. An electronic device configured as described above.

2. The electronic device according to Claim 1, wherein the arithmetic unit measures a degradation state of the electronic circuit when the electronic device is actually operating, corrects the performance degradation characteristic information of each electronic component based on the measured degradation state of the electronic circuit, and calculates the estimated performance value of each electronic component using the corrected performance degradation characteristic information. An electronic device configured as described above.

3. The electronic device according to Claim 1, wherein the arithmetic unit calculates a performance change of the electronic component, and calculates the time-series data of the stress evaluation parameters while reflecting the calculated performance change when calculating the time-series data of the stress evaluation parameters based on the design information of the electronic circuit and the output data or the input data. An electronic device configured as described above.

4. The electronic device according to Claim 1, wherein the arithmetic unit stores the calculated estimated performance value of each electronic component in the storage unit as performance degradation information. An electronic device configured as described above.

5. The electronic device according to Claim 4, wherein the arithmetic unit calculates a degradation evaluation point of each electronic component for evaluating the degradation state of each electronic component based on the estimated performance value, and stores degradation evaluation point information indicating the calculated degradation evaluation point of each electronic component in the storage unit. An electronic device configured as described above. ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ Electronic device.

6. In the electronic device according to claim 5, the arithmetic unit is configured to output at least any one of the performance degradation information and the degradation evaluation point information or information based on at least any one of the information to an external device. The electronic device configured as described above.

7. In the electronic device according to claim 1, the arithmetic unit determines whether the estimated performance value of each electronic component is equal to or greater than a threshold value, and when it is equal to or greater than the threshold value, notifies the user that the electronic component is deteriorated using an external device. The electronic device configured as described above Electronic device.

8. In the electronic device according to claim 2, the arithmetic unit analyzes the degradation state of the electronic circuit of the measured electronic device, calculates design information of the electronic circuit of the optimized electronic device based on the analysis result, and outputs it to an external device. The electronic device configured as described above Electronic device.

9. An electronic device including an electronic circuit having a plurality of electronic components and a computer, a management server having an arithmetic unit and a storage device, A deterioration state estimation system of an electronic component having In the storage device, design information of the electronic circuit and performance degradation characteristic information indicating characteristics of performance degradation of each electronic component of the electronic device are stored. The arithmetic unit acquires output data from the electronic device to the electronic circuit or input data from the electronic circuit, Based on the design information of the electronic circuit and the output data to the electronic circuit or the input data from the electronic circuit that has been acquired, time-series data of stress evaluation parameters for each electronic component when the electronic circuit is operating is calculated, and by normalizing the calculated time-series data of the stress evaluation parameters for each electronic component, time-series data of electrical stress normalization values for each electronic component is calculated. Based on the time-series data of the electrical stress normalization values of each electronic component, stress cumulative time information indicating the cumulative time that each electronic component of the electronic device has actually operated within each of a plurality of stress level ranges is calculated and stored in the storage device. Based on the stress cumulative time information and the performance degradation characteristic information, an estimated performance value of each electronic component indicating the performance degradation state of each electronic component of the electronic device is calculated. The deterioration state estimation system of an electronic component configured as described above Deterioration state estimation system of electronic components.

10. In the deterioration state estimation system of an electronic component according to claim 9, the arithmetic unit Measure the degradation state of the electronic circuit when the electronic device is actually operating, and correct the performance degradation characteristic information of each electronic component based on the measured degradation state of the electronic circuit. Calculate the estimated performance value of each electronic component using the corrected performance degradation characteristic information. Configured as follows An electronic component degradation state estimation system.

11. In the electronic component degradation state estimation system according to claim 9, The arithmetic unit Calculates the performance change of the electronic component. When calculating the time-series data of the stress evaluation parameter based on the design information of the electronic circuit and the output data or the input data, the time-series data of the stress evaluation parameter is calculated so as to reflect the calculated performance change. Configured as follows An electronic component degradation state estimation system.

12. A degradation state estimation method for estimating the degradation state of each electronic component of an electronic device using at least one of an arithmetic unit inside and outside the electronic device and at least one of a storage device inside and outside the electronic device, the electronic device having an electronic circuit including a plurality of electronic components, The storage device stores design information of the electronic circuit and performance degradation characteristic information indicating the characteristics of performance degradation of each electronic component of the electronic device. By the arithmetic unit Based on the design information of the electronic circuit and the output data to the electronic circuit or the input data from the electronic circuit, calculate the time-series data of the stress evaluation parameter of each electronic component when the electronic circuit is operating, and calculate the time-series data of the electrical stress normalization value of each electronic component by normalizing the calculated time-series data of the stress evaluation parameter of each electronic component. Based on the time-series data of the electrical stress normalization value of each electronic component, calculate stress cumulative time information indicating the cumulative time that each electronic component of the electronic device has actually operated in each of a plurality of stress level ranges, and store it in the storage device. Calculate the estimated performance value of each electronic component indicating the performance degradation state of each electronic component of the electronic device based on the stress cumulative time information and the performance degradation characteristic information. A method for estimating the degradation state of an electronic component.

13. In the method for estimating the degradation state of an electronic component according to claim 12, By the arithmetic unit Measure the degradation state of the electronic circuit when the electronic device is actually operating, and correct the performance degradation characteristic information of each electronic component based on the measured degradation state of the electronic circuit. Calculating the estimated performance value of each electronic component using the corrected performance degradation characteristic information. Method for estimating the degradation state of an electronic component.

14. In the method for estimating the degradation state of an electronic component according to claim 12, by the arithmetic unit, calculating the performance change of the electronic component, when calculating the time-series data of the stress evaluation parameter based on the design information of the electronic circuit and the output data or the input data, calculating the time-series data of the stress evaluation parameter so as to reflect the calculated performance change. Method for estimating the degradation state of an electronic component.

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