Multilayer electronic component

Abstract

To provide a multilayer electronic component which is improved in moisture resistance reliability and connectivity between external and internal electrodes, in a multi-terminal structure to reduce an equivalent series inductance of the multilayer electronic component.SOLUTION: A multilayer electronic component includes: first connection electrodes 131 and 132 respectively connected to a first internal electrode on both surfaces that oppose each other in a second direction; second connection electrodes 133 and 134 respectively connected to a second internal electrode on both surfaces that oppose each other in a third direction; and margin portions 141-144 respectively disposed on the first connection electrodes and the second connection electrodes. Each of the connection electrodes is connected to a first external electrode and a second external electrode. The first connection electrode 131 or 132 includes a first main portion 131a or 132a in contact with a portion of the first internal electrode and a first lead-out portion 131b or 132b, and the second connection electrode 133 or 134 similarly includes a second main portion 133a or 134a and a second lead-out portion 133b or 134b.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a multilayer electronic component.

Background Art

[0002] A multilayer ceramic capacitor (MLCC), which is one type of multilayer electronic component, is a chip-shaped capacitor that is mounted on electronic products such as video devices such as liquid crystal display (LCD) devices and plasma display panel (PDP) panels, mobile devices such as smartphones and mobile phones, computers, on-board chargers (OBCs) for electric vehicles, circuits such as DC-DC converters, and infotainment systems for electric vehicles and internal combustion engine vehicles, or printed circuit boards, and serves to charge or discharge electricity.

[0003] As the integration levels of various electronic devices and electronic products increase, the thinning and miniaturization of passive components such as multilayer ceramic capacitors are being promoted. In addition, electronic devices and electronic products are often exposed to harsh environments such as high temperature, high pressure, and high vibration, which has led to an increasing demand for multilayer ceramic capacitors having a low equivalent series inductance (ESL).

[0004] As one of various methods for reducing the equivalent series inductance (ESL) of a multilayer ceramic capacitor, there is a method of reducing the inductance of the entire capacitor by arranging three or more terminal electrodes to cancel out the magnetic field generated by the current flowing through the multilayer ceramic capacitor.

[0005] In order to form such a multi-terminal capacitor, as described in Patent Document 1, a lead-out portion must be formed so that it can be connected to a plurality of terminals of the external electrode in the internal electrode. However, such a lead-out portion of the internal electrode may act as a main path for the penetration of moisture or plating solution from the outside, which may cause a reduction in the moisture resistance reliability of the multilayer electronic component.

[0006] Therefore, there is a need for a structural improvement that can ensure sufficient effective capacitance while reducing the equivalent series inductance (ESL) of the multilayer electronic component and improving the moisture resistance reliability.

Prior Art Documents

Patent Documents

[0007]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0008] One of the various objects of the present invention is to alleviate the problem of reduced moisture resistance reliability that may occur when applying a multi-terminal structure of three or more terminals in order to reduce the equivalent series inductance (ESL) of the multilayer electronic component.

[0009] One of the various objects of the present invention is to alleviate the problem of reduced connectivity between the external electrode and the internal electrode that may occur when applying a multi-terminal structure of three or more terminals in order to reduce the equivalent series inductance (ESL) of the multilayer electronic component.

[0010] However, the object of the present invention is not limited to the above-described content, and can be more easily understood in the process of explaining the specific embodiments of the present invention.

Means for Solving the Problems

[0011] A multilayer electronic component according to an embodiment of the present invention includes a dielectric layer, a multilayer portion including a first internal electrode and a second internal electrode alternately arranged with the dielectric layer in a first direction, a first connection electrode connected to the first internal electrode on both sides facing each other in a second direction perpendicular to the first direction of the multilayer portion, a second connection electrode connected to the second internal electrode on both sides facing each other in a third direction perpendicular to the first direction and the second direction of the multilayer portion, and a margin portion disposed on the first connection electrode and the second connection electrode, a first external electrode disposed on the main body and connected to the first connection electrode, and a second external electrode disposed on the main body and connected to the second connection electrode. The first connection electrode includes a first main portion in contact with at least a part of the first internal electrode, and a first lead portion extending from the first main portion in the first direction. The second connection electrode may include a second main portion in contact with at least a part of the second internal electrode, and a second lead portion extending from the second main portion in the first direction.

Effects of the Invention

[0012] One of the various effects of the present invention is to reduce the equivalent series inductance (ESL) of the multilayer electronic component.

[0013] One of the various effects of the present invention is to improve the moisture resistance reliability of the multilayer electronic component.

[0014] One of the various effects of the present invention is to provide a multilayer electronic component capable of ensuring a sufficient effective capacitance.

[0015] One of the various effects of the present invention is to ensure moisture resistance reliability and a sufficient effective capacitance even when applying a multi-terminal structure of three or more terminals in order to reduce the equivalent series inductance (ESL) of the multilayer electronic component.

[0016] However, the diverse and meaningful advantages and effects of the present invention are not limited to the above-described content, and can be more easily understood in the process of explaining the specific embodiments of the present invention.

Brief Description of the Drawings

[0017]

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Mode for Carrying Out the Invention

[0018] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into several other forms, and the scope of the present invention is not limited to the embodiments described below. Also, the embodiments of the present invention are provided to more fully explain the present invention to an ordinary technician. Therefore, elements such as the shape and size in the drawings may be enlarged, reduced (or emphasized or simplified) for a clearer explanation, and elements denoted by the same reference numerals in the drawings are the same elements.

[0019] In addition, parts not related to the explanation are omitted in the drawings for clearly explaining the present invention, and the sizes and thicknesses of the illustrated components are arbitrarily shown for the convenience of explanation, so the present invention is not necessarily limited by the illustration. Also, components with the same functions within the scope of the same concept are described using the same reference numerals. Furthermore, throughout the specification, when a certain part "includes" a certain component, it means that other components can be further included, rather than excluding other components, unless otherwise stated to the contrary.

[0020] In the drawings, the first direction can be defined as the lamination direction of the internal electrodes and the dielectric layer.

[0021] FIG. 1 schematically shows a perspective view of a multilayer electronic component according to an embodiment. FIG. 2 schematically shows a perspective view of a main body according to an embodiment. FIG. 3 is a perspective view of a configuration excluding a connection electrode to show the form of the connection electrode in a main body according to an embodiment, with the configuration made transparent. FIG. 4 schematically shows a perspective view of a stacked portion according to an embodiment. FIG. 5 schematically shows an exploded perspective view of a stacked portion according to an embodiment. FIG. 6 is a perspective view showing the form of a connection electrode according to an embodiment. FIG. 7 is an exploded perspective view schematically showing the coupling relationship between a first connection electrode and a stacked portion according to an embodiment. FIG. 8 is an exploded perspective view schematically showing the coupling relationship between a second connection electrode and a stacked portion according to an embodiment. FIGS. 9(a) and (b) are plan views of the multilayer electronic component as viewed from a second direction, and FIGS. 9(c) and (d) are plan views of the multilayer electronic component as viewed from a third direction. FIG. 10 is a cross-sectional view taken along line I-I' of FIG. 1 where a first internal electrode is exposed. FIG. 11 is a cross-sectional view taken along line I-I' of FIG. 1 where a second internal electrode is exposed. FIG. 12 is a cross-sectional view taken along line II-II' of FIG. 1. FIG. 13 is a cross-sectional view taken along line III-III' of FIG. 1. FIG. 14 is a cross-sectional view taken along line IV-IV' of FIG. 1.

[0022] Hereinafter, with reference to FIGS. 1 to 14, a multilayer electronic component 100 according to an embodiment of the present invention will be described in detail. The features of the multilayer electronic component 100 according to the embodiment to be described later can be similarly applied to the first to third modified examples to be described later as long as there is no opposite or conflicting description.

[0023] The stacked electronic component 100 according to an embodiment of the present invention includes a stacked portion 10 including a dielectric layer 111, and first internal electrodes 121 and second internal electrodes 122 alternately arranged with the dielectric layer 111 in a first direction, first connection electrodes 131 and 132 connected to the first internal electrode 121 on both surfaces S3 and S4 facing each other in a second direction perpendicular to the first direction of the stacked portion 10, second connection electrodes 133 and 134 connected to the second internal electrode 122 on both surfaces S5 and S6 facing each other in a third direction perpendicular to the first and second directions of the stacked portion 10, and margin portions 141, 142, 143, 144 arranged on the first connection electrodes 131, 132 and the second connection electrodes 133, 134, a main body 110, first external electrodes 151 and 152 arranged on the main body 110 and connected to the first connection electrodes 131 and 132, and second external electrodes 153 and 154 arranged on the main body 110 and connected to the second connection electrodes 133 and 134. The first connection electrodes 131 and 132 include first main portions 131a and 132a in contact with at least a part of the first internal electrodes 121 and 122, and first lead portions 131b and 132b extending from the first main portions 131a and 132a in the first direction. The second connection electrodes 133 and 134 can include second main portions 133a and 134a in contact with at least a part of the second internal electrode 122, and second lead portions 133b and 134b extending from the second main portions 133a and 134a in the first direction.

[0024] The main body 110 can include a stacked portion 10 including a dielectric layer 111, and first internal electrodes 121 and second internal electrodes 122 alternately arranged with the dielectric layer 111 in a first direction, first connection electrodes 131 and 132 connected to the first internal electrode 121 on both surfaces S3 and S4 facing each other in a second direction perpendicular to the first direction of the stacked portion 10, second connection electrodes 133 and 134 connected to the second internal electrode 122 on both surfaces S5 and S6 facing each other in a third direction perpendicular to the first and second directions of the stacked portion 10, and margin portions 141, 142, 143, 144 arranged on the first connection electrodes 131, 132 and the second connection electrodes 133, 134.

[0025] Referring to FIG. 2, the main body 110 can include a stacked portion 10 and connection electrodes 131, 132, 133, 134 and margin portions 141, 142, 143, 144 disposed on the stacked portion 10.

[0026] Referring to FIGS. 4 and 5, the stacked portion 10 can include a dielectric layer 111 and internal electrodes 121, 122. Specifically, the dielectric layer 111, the first internal electrode 121, and the second internal electrode 122 can be alternately arranged in the first direction.

[0027] Referring to FIG. 4, the stacked portion 10 can include both surfaces S1, S2 facing each other in the first direction, both surfaces S3, S4 facing each other in the second direction perpendicular to the first direction, and both surfaces S5, S6 facing each other in the third direction perpendicular to the first and second directions. Among the surfaces S1, S2, S3, S4, S5, S6 of the stacked portion 10, the both surfaces S1, S2 facing each other in the first direction of the stacked portion 10 can each form a part of the both surfaces 1, 2 facing each other in the first direction of the main body 110, and connection electrodes 131, 132, 133, 134 can be arranged on the both surfaces S3, S4 facing each other in the second direction and the both surfaces S5, S6 facing each other in the third direction of the stacked portion 10.

[0028] The stacked portion 10 can include a plurality of dielectric layers 111, first internal electrodes 121, and second internal electrodes 122 respectively. The plurality of dielectric layers 111 included in the stacked portion 10 are in a fired state, and the boundary between adjacent dielectric layers 111 can be integrated so that it is difficult to confirm without using a scanning electron microscope (SEM).

[0029] The raw material for forming the dielectric layer 111 is not particularly limited as long as sufficient capacitance can be obtained. For example, a barium titanate-based (BaTiO 3 ) dielectric material, a dielectric material with normal dielectric properties of a CaZrO 3 substrate, etc. can be used. For example, a barium titanate-based (BaTiO 3 ) dielectric material is BaTiO 3 , (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O 3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O 3 (0 < x < 1, 0 < y < 1) and Ba(Ti 1-y Zr y )O 3 It can be one or more of (0 < y < 1), and the dielectric material with the relative permittivity of the CaZrO 3 substrate is (Ca 1-x Sr x )(Zr 1-y Ti y )O 3 (0 < x < 1, 0 < y < 1).

[0030] In addition, various ceramic additives, organic solvents, binders, dispersants, etc. can be added to the dielectric layer 111 according to the object of the present invention.

[0031] The average thickness td of the dielectric layer 111 is not particularly limited.

[0032] When aiming at miniaturization and high capacitance of the multilayer electronic component 100, the average thickness td of the dielectric layer 111 can be 0.35 μm or less, and in order to improve the reliability of the multilayer electronic component 100 under high temperature and high pressure, the average thickness td of the dielectric layer 111 can be 3 μm or more.

[0033] The average thickness td of the dielectric layer 111 can be measured by scanning an image of the cross section of the multilayer electronic component 100 in the first direction and the second direction with a scanning electron microscope (SEM).

[0034] For example, the average thickness td of the dielectric layer 111 is extracted from an image obtained by scanning cross-sections in the first and second directions polished up to the central portion of the multilayer electronic component 100 in the third direction with a scanning electron microscope (SEM). Among the dielectric layers, for a total of five dielectric layers, two layers above and two layers below, with one layer of the dielectric layer at the point where the center line in the length direction of the main body and the center line in the thickness direction are in contact, taking the point where the center line in the second direction of the main body and the center line in the first direction are in contact as a reference, after determining five points at equal intervals, two points on the left and two points on the right centered around one reference point, the thickness at each point can be measured and the average value can be measured.

[0035] The internal electrodes 121 and 122 can include a first internal electrode 121 and a second internal electrode 122.

[0036] The first internal electrode 121 and the second internal electrode 122 can be alternately arranged so as to face each other with the dielectric layer 111 interposed therebetween. The first internal electrode 121 can be exposed on both surfaces S3 and S4 facing each other in the second direction of the stacked portion 10, and the second internal electrode 122 can be exposed on both surfaces S5 and S6 facing each other in the third direction of the stacked portion 10. As a result, the first internal electrode 121 can be connected to the first connection electrodes 131 and 132 on both surfaces S3 and S4 facing each other in the second direction of the stacked portion 10, and the second internal electrode 122 can be connected to the second connection electrodes 133 and 134 on both surfaces S5 and S6 facing each other in the third direction of the stacked portion 10.

[0037] Referring to FIGS. 4 and 5, the first internal electrode 121 can be separated from both surfaces S5 and S6 facing each other in the third direction of the stacked portion 10, and the second internal electrode 122 can be separated from both surfaces S3 and S4 facing each other in the second direction of the stacked portion 10. As a result, the first internal electrode 121 and the second internal electrode 122 can be electrically separated from each other by the dielectric layer 111 disposed in the middle.

[0038] The stacked portion 10 can be formed by alternately stacking ceramic green sheets printed with the first internal electrode 121 and ceramic green sheets printed with the second internal electrode 122 and then firing them.

[0039] The materials for forming the internal electrodes 121 and 122 are not particularly limited, and materials with excellent electrical conductivity can be used. For example, the internal electrodes 121 and 122 may include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0040] Also, the internal electrodes 121 and 122 can be formed by printing a conductive paste for internal electrodes containing one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof on the ceramic green sheet. As the printing method of the above conductive paste for internal electrodes, a screen printing method, a gravure printing method, or the like can be used, and the present invention is not limited thereto.

[0041] The average thickness te of the internal electrodes 121 and 122 is not particularly limited and can vary depending on the purpose. For the miniaturization of the multilayer electronic component 100, the average thickness te of the internal electrodes 121 and 122 can be 0.35 μm or less, and for improving the reliability of the multilayer electronic component 100 under high temperature and high pressure, the average thickness te of the internal electrodes 121 and 122 can be 3 μm or more.

[0042] The average thickness te of the internal electrodes 121 and 122 can be measured by scanning, with a scanning electron microscope (SEM), the cross-sections in the first and second directions polished up to the central portion in the third direction of the multilayer electronic component 100, extracting the internal electrode layers from the obtained images, and measuring the thicknesses of five internal electrode layers, namely, two layers above and two layers below, with reference to one layer of the internal electrode layer at the point where the central line in the length direction of the main body and the central line in the thickness direction are in contact, setting five points, two points on the left and two points on the right, at equal intervals around one reference point with reference to the point where the central line in the length direction of the main body and the central line in the thickness direction are in contact, and then measuring the average value of the thicknesses at each point.

[0043] The first connection electrodes 131 and 132 can be connected to the first internal electrodes 121 and 122 on both sides S3 and S4 facing each other in the second direction of the stacked portion 10, and the second connection electrodes 133 and 134 can be connected to the second internal electrode 122 on both sides S5 and S6 facing each other in the third direction of the stacked portion 10. The connection electrodes 131, 132, 133, and 134 can prevent the internal electrodes 121 and 122 from directly contacting the external electrodes 151 and 152. Thereby, by blocking or extending the moisture penetration path, the moisture resistance reliability of the multilayer electronic component 100 can be improved.

[0044] Margin portions 141, 142, 143, and 144 can be arranged on the connection electrodes 131, 132, 133, and 134. The margin portions 141, 142, 143, and 144 can be arranged to cover a part of the connection electrodes 131, 132, 133, and 134. At this time, a partial region of the connection electrodes 131, 132, 133, and 134 not covered by the margin portions 141, 142, 143, and 144 can be in contact with the external electrodes 151 and 152 on the surface of the main body 110.

[0045] The materials for forming the connecting electrodes 131, 132, 133, and 134 are not particularly limited, and materials with excellent electrical conductivity can be used. For example, the internal electrodes 121 and 122 can include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof. That is, the connecting electrodes 131, 132, 133, and 134 can include the same conductive metal as the conductive metal included in the internal electrodes 121 and 122, but are not limited thereto, and can include a conductive metal different from the conductive metal included in the internal electrodes 121 and 122.

[0046] The method for forming the connecting electrodes 131, 132, 133, 134 and the margin portions 141, 142, 143, 144 is not particularly limited. A unit sheet in which a connecting electrode forming sheet is formed on a margin portion forming sheet can be pressure-bonded to both surfaces S3 and S4 facing each other in the second direction and both surfaces S5 and S6 facing each other in the third direction of the stacking portion 10, and then fired to be formed. The margin portions 141, 142, 143, 144 can be formed of the same material as the dielectric layer 111, but are not limited thereto, and can also be formed of a material different from the dielectric layer 111.

[0047] On the other hand, referring to FIG. 6(a), the unit sheet can be provided such that the connecting electrodes 131, 132, 133, 134 protrude on the margin portions 141, 142, 143, 144. However, due to the fluidity of the sheet in the process of pressing, adhering, and firing the sheet, the grooves formed by the protruding shapes of the connecting electrodes 131, 132, 133, 134 can be filled by the margin portions 141, 142, 143, 144.

[0048] On the other hand, referring to FIG. 6(b), the unit sheet can be provided such that the connecting electrodes 131, 132, 133, 134 do not protrude due to the margin portions 141', 142', 143', 141. In this case, since it is not necessary to fill the groove between the stacking portion 10 and the sheet, it can be advantageous for ensuring the adhesion between the stacking portion 10 and the sheet.

[0049] The shape of such a unit sheet can be similarly applied when forming the connection electrodes 131-1, 132-1, 133-1, 134-1 and the margin portions 141-1, 142-1, 143-1, 144-1, 141'-1, 142'-1, 143'-1, 144'-1 according to the first modification example shown in FIG. 17, the connection electrodes 131-2, 132-2, 133-2, 134-2 and the margin portions 141-2, 142-2, 143-2, 144-2, 141'-2, 142'-2, 143'-2, 144'-2 according to the second modification example shown in FIG. 20, and the connection electrodes 131-3, 132-3, 133-3, 134-3 and the margin portions 141-3, 142-3, 143-3, 144-3, 141'-3, 142'-3, 143'-3, 144'-3 according to the third modification example shown in FIG. 24.

[0050] On the other hand, when the margin portions disposed on the first connection electrodes 131 and 132 are defined as the first margin portions 141 and 142, and the margin portions disposed on the second connection electrodes 133 and 134 are defined as the second margin portions 143 and 144, the second margin portions 143 and 144 can be disposed so as to cover the ends of the first margin portions 141 and 142 in the third direction, whereby the moisture resistance reliability of the stacked electronic component 100 can be further improved. The method of disposing the second margin portions 143 and 144 so as to cover the ends of the first margin portions 141 and 142 in the third direction is not particularly limited, but a method can be used in which a unit sheet having a connection electrode forming sheet formed on a margin portion forming sheet is first pressed and adhered to both surfaces S3 and S4 facing each other in the second direction of the stacked portion 10, and then the unit sheet is adhered to both surfaces S5 and S6 facing each other in the third direction.

[0051] When the first internal electrode 121 is exposed on both surfaces S3 and S4 facing each other in the second direction of the stacked portion 10, and the second internal electrode 122 has a structure of being exposed on both surfaces S5 and S6 facing each other in the third direction of the stacked portion 10, it is advantageous for reducing the equivalent series inductance (ESL) of the multilayer electronic component. However, in the conventional case where external electrodes are directly formed on each of the two surfaces S3 and S4 facing each other in the second direction of the stacked portion 10 and the two surfaces S5 and S6 facing each other in the third direction of the stacked portion 10, there may occur a problem that the internal electrode becomes brittle due to the penetration of moisture or plating solution from the outside.

[0052] Therefore, as in Patent Document 1, there has been an attempt to improve the moisture resistance reliability by forming a lead-out portion having a width narrower than the entire internal electrode on the internal electrode so that the lead-out portion is in direct contact with the external electrode. However, even when such a lead-out portion is formed, the length of the penetration path of moisture or plating solution cannot be extended, so there is a limit to improving the moisture resistance reliability of the multilayer electronic component.

[0053] Therefore, in one embodiment of the present invention, the main portions 131a, 132a, 133a, 134a of the internal electrodes 121, 122 and the connection electrodes 131, 132, 133, 134 are directly connected, and lead portions 131b, 132b, 133b, 134b extending in the first direction from the main portions 131a, 132a, 133a, 134a are included to extend the penetration path of moisture and plating solution from the outside and improve the moisture resistance reliability of the multilayer electronic component 100. By improving the electrical connectivity between the external electrodes 151, 152, 153, 154 and the internal electrodes 121, 122, the effective capacitance of the multilayer electronic component 100 can also be improved.

[0054] Specifically, referring to FIG. 3, the first connection electrodes 131 and 132 according to an embodiment of the present invention can include first main portions 131a and 132a that are in contact with at least a part of the first internal electrode 121, and first lead portions 131b and 132b that extend in the first direction from the first main portions 131a and 132a. The second connection electrodes 133 and 134 according to an embodiment can include second main portions 133a and 134a that are in contact with at least a part of the second internal electrode 122, and second lead portions 133b and 134b that extend in the first direction from the second main portions 133a and 134a.

[0055] Referring to FIG. 9, the first connection electrodes 131 and 132 can be arranged to cover both ends of the first internal electrode 121 in the second direction, and the second connection electrodes 133 and 134 can be arranged to cover both ends of the second internal electrode 122 in the third direction.

[0056] In one embodiment, the first internal electrode 121 can be exposed on both surfaces S3 and S4 facing each other in the second direction of the stacked portion, the second internal electrode 122 can be exposed on both surfaces S5 and S6 facing each other in the third direction of the stacked portion, the first connection electrodes 131 and 132 can be arranged to cover all of the exposed ends of the first internal electrode 121, and the second connection electrodes 133 and 134 can be arranged to cover all of the exposed ends of the second internal electrode 122. Thereby, the connectivity between the internal electrodes 121 and 122 and the connection electrodes 131, 132, 133, and 134 can be improved, and the effect of improving the effective capacitance of the multilayer electronic component 100 can be made more remarkable.

[0057] In one embodiment, the first main portions 131a and 132a can mean regions arranged to cover the ends exposed on both surfaces S3 and S4 facing each other in the second direction of the stacked portion 10 of the first internal electrode 121, and the second main portions 133a and 134a can mean regions arranged to cover the ends exposed on both surfaces S5 and S6 facing each other in the third direction of the stacked portion 10 of the second internal electrode 122.

[0058] The first lead portions 131b and 132b can mean regions extending in the first direction from the first main portions 131a and 132a, and the second lead portions 133b and 134b can mean regions extending in the first direction from the second main portions 133a and 134a. Referring to FIG. 3, although the first lead portions 131b and 132b and the second lead portions 133b and 134b are shown as extending on both sides in the first direction, the present invention is not limited thereto, and as in the modification described later, it can extend in one direction in the first direction or in the opposite direction thereto.

[0059] The first connection electrodes 131 and 132 can be arranged on both opposite surfaces of the stacked portion 10 facing the second direction, and the second connection electrodes 133 and 134 can be arranged on both opposite surfaces of the stacked portion 10 facing the third direction. At this time, the first connection electrodes 131 and 132 and the second connection electrodes 133 and 134 can be arranged apart from each other. Thereby, different voltages can be applied to the first internal electrode 121 and the second internal electrode 122.

[0060] Referring to FIGS. 2 and 8, the first lead portion 131b of the first connection electrode 131 disposed on one surface S3 facing the second direction of the stacked portion 10 can be disposed offset to one side in the third direction with respect to the central portion in the third direction of the first connection electrodes 131 and 132, and the first lead portion 132b of the first connection electrode 132 disposed on the other surface S4 facing the second direction of the stacked portion 10 can be disposed offset to the other side in the third direction with respect to the central portion in the third direction of the first connection electrodes 131 and 132. Similarly, the second lead portion 133b of the second connection electrode 133 disposed on one surface S5 facing the third direction of the stacked portion 10 is disposed offset to one side in the second direction with respect to the central portion in the second direction of the second connection electrode 133, and the second lead portion 134b of the second connection electrode 134 disposed on the other surface S6 facing the third direction of the stacked portion 10 can be disposed offset to the other side in the second direction with respect to the central portion in the second direction of the second connection electrode 134. At this time, the external electrodes 151, 152, 153, 154 can be disposed so as to cover the corners connecting four or more surfaces of the main body 110, whereby the moisture resistance reliability of the multilayer electronic component 100 can be further improved, and the mechanical strength can also be improved.

[0061] Referring to FIG. 9, in one embodiment, the average lengths of the first lead portions 131b and 132b can be relatively shorter than those of the first main portions 131a and 132a, and the average lengths of the second lead portions 133b and 134b can be relatively shorter than those of the second main portions 133a and 134a. Thereby, while ensuring the contact areas between the connection electrodes 131, 132, 133, 134 and the internal electrodes 121, 122, it is possible to mitigate the decrease in the moisture resistance reliability of the multilayer electronic component 100.

[0062] When the ratio of the average length LL1 of the first lead portions 131b and 132b to the average length LC1 of the first main portions 131a and 132a is less than 0.05, or when the ratio of the average length LL2 of the second lead portions 133b and 134b to the average length LC2 of the second main portions 133a and 134a is less than 0.05, it may be difficult to ensure a sufficient bonding area between the external electrodes 151, 152, 153, 154 and the connection electrodes 131, 132, 133, 134. When the ratio of the average length LL1 of the first lead portions 131b and 132b to the average length LC1 of the first main portions 131a and 132a exceeds 0.45, or when the ratio of the average length LL2 of the second lead portions 133b and 134b to the average length LC2 of the second main portions 133a and 134a exceeds 0.45, the effect of improving the moisture resistance reliability may be insufficient.

[0063] Therefore, in one embodiment, the ratio of the average length LL1 of the first lead portions 131b and 132b to the average length LC1 of the first main portions 131a and 132a is 0.05 or more and 0.45 or less, and the ratio of the average length LL2 of the second lead portions 133b and 134b to the average length LC2 of the second main portions 133a and 134a satisfies 0.05 or more and 0.45 or less, so that a sufficient effective capacitance can be ensured while improving the moisture resistance reliability of the multilayer electronic component 100.

[0064] On the other hand, the "average length" of the main portions 131a, 132a, 133a, 134a and the lead portions 131b, 132b, 133b, 134b in one embodiment can be measured differently depending on which connection electrode is used for measurement. Specifically, the "average length" of the first connection electrodes 131 and 132 can mean the average size in the third direction, and the "average length" of the second connection electrodes 133 and 134 can mean the average size in the second direction.

[0065] On the one hand, the method for measuring the "average length" of each of the main parts 131a, 132a, 133a, 134a and the lead parts 131b, 132b, 133b, 134b is not particularly limited. For example, the average lengths LC1 and LL1 of the first main part 131a and the first lead part 131b, which are arranged on one of the two opposite surfaces of the laminated part 10 facing the second direction, after polishing the laminated electronic component 100 in the second direction to expose the first connecting electrode 131, can be measured by calculating the average value of the sizes in the third direction measured by measuring equipment such as an optical microscope (OM, Optical Microscope) or a scanning electron microscope (SEM, Scanning Electron Microscope) at three or more equally spaced points in the first direction.

[0066] Referring to FIG. 10, in one embodiment, the ratio of the average widths WC1 and WC2 of the connecting electrodes 131, 132, 133, 134 to the average widths WM1 and WM2 of the margin parts can be 0.03 or more and 0.50 or less.

[0067] When the ratio of the average widths WC1 and WC2 of the connecting electrodes 131, 132, 133, 134 to the average widths WM1 and WM2 of the margin parts is less than 0.03, the effect of ensuring the electrical connectivity between the internal electrode and the external electrode through the connecting electrode may be somewhat insufficient. When the ratio of the average widths WC1 and WC2 of the connecting electrodes 131, 132, 133, 134 to the average widths WM1 and WM2 of the margin parts exceeds 0.50, the effect of ensuring the connectivity between the internal electrode and the external electrode through the connecting electrode is improved, but as a result, the connecting electrodes 131, 132, 133, 134 are located close to the surface of the main body 110, and the moisture resistance reliability may decrease.

[0068] Therefore, as in one embodiment, when the ratio of the average widths WC1 and WC2 of the connecting electrodes 131, 132, 133, 134 to the average widths WM1 and WM2 of the margin parts satisfies 0.03 or more and 0.50 or less, it is possible to prevent the deterioration of the moisture resistance reliability while ensuring the effect of electrically connecting the internal electrodes 121, 122 and the external electrodes 151, 152, 153, 154 through the connecting electrodes 131, 132, 133, 134 of the laminated electronic component 100.

[0069] In one embodiment, the “average width” of each of the margin portions 141, 142, 143, 144 and the connection electrodes 131, 132, 133, 134 can be measured differently depending on which connection electrode is used for measurement. Specifically, the “average width” of the first connection electrodes 131, 132 can mean the average size in the second direction, and the “average width” of the second connection electrodes 133, 134 can mean the average size in the third direction.

[0070] On the other hand, the method for measuring the “average width” of each of the margin portions 141, 142, 143, 144 and the connection electrodes 131, 132, 133, 134 is not particularly limited. For example, among the margin portions, the average width WM1 of the margin portion 141 disposed on the connection electrode 131 disposed on one surface facing the second direction of the stacked portion 10 is obtained by polishing the multilayer electronic component 100 to the central portion to expose the first internal electrode 121 and the first connection electrodes 131, 132, and then measuring the average value of the sizes in the second direction measured by measuring equipment such as an optical microscope (OM, Optical Microscope) or a scanning electron microscope (SEM, Scanning Electron Microscope) at three or more points at equal intervals in the third direction.

[0071] External electrodes 151, 152, 153, 154 can be disposed on the main body 110. The external electrodes 151, 152, 153, 154 of the present invention can be electrically connected via the internal electrodes 121, 122 and the connection electrodes 131, 132, 133, 134.

[0072] The material for forming the external electrodes 151, 152, 153, 154 is not particularly limited, and any substance having electrical conductivity can be used to form them. Specific substances can be determined in consideration of electrical characteristics, structural stability, etc., and they can further have a multilayer structure.

[0073] The external electrodes 151, 152, 153, and 154 can include an electrode layer disposed to contact the main body 110 and a plating layer formed on the electrode layer.

[0074] More specific examples of the electrode layer include that the electrode layer can be a fired electrode containing a conductive metal and glass, or a resin-based electrode containing a conductive metal and a resin.

[0075] Also, the electrode layer can be in a form where a fired electrode and a resin-based electrode are sequentially formed on the main body. Further, the electrode layer can be formed by a method of transferring a sheet containing a conductive metal onto the main body, or can be formed by a method of transferring a sheet containing a conductive metal onto a fired electrode.

[0076] As the conductive metal contained in the electrode layer, a material with excellent electrical conductivity can be used, but it is not particularly limited. For example, the conductive metal can be one or more of nickel (Ni), copper (Cu), and their alloys.

[0077] The plating layer plays a role in improving mounting characteristics. The type of the plating layer is not particularly limited, and it can be a plating layer containing one or more of Ni, Sn, Pd, and their alloys, and can be formed from a plurality of layers.

[0078] More specific examples of the plating layer include that the plating layer can be a Ni plating layer or a Sn plating layer, and can be in a form where a Ni plating layer and a Sn plating layer are sequentially formed on the electrode layer, or can be in a form where a Sn plating layer, a Ni plating layer, and a Sn plating layer are sequentially formed. Also, the plating layer can include a plurality of Ni plating layers and / or a plurality of Sn plating layers.

[0079] The external electrodes 151, 152, 153, and 154 can be disposed on one or more of the surfaces 1, 2, 3, 4, 5, and 6 of the main body 110 according to the shapes of the connecting electrodes 131, 132, 133, and 134.

[0080] Specifically, when the first lead portions 131b and 132b and the second lead portions 133b and 134b are exposed on both sides facing each other in the first direction of the main body 110, the external electrodes 151, 152, 153, and 154 can be arranged to cover the corners of the main body 110.

[0081] On the other hand, when the first lead portions 131b and 132b and the second lead portions 133b and 134b are arranged to extend in the second direction or the third direction and penetrate the margin portion, the first lead portions 131b and 132b and the second lead portions 133b and 134b themselves can serve as the external electrodes, but it is not necessarily limited to this. Also in this case, the external electrodes 151, 152, 153, and 154 can be arranged to cover the first lead portions 131b and 132b and the second lead portions 133b and 134b.

[0082] On the other hand, when the first lead portions 131b and 132b and the second lead portions 133b and 134b are exposed only on one of the two sides facing each other in the first direction of the main body 110, the external electrodes 151, 152, 153, and 154 can be arranged to cover the vertex where three surfaces of the main body 110 are in contact, but it is not necessarily limited to this. They can also be arranged to cover only the portions where the first lead portions 131b and 132b and the second lead portions 133b and 134b are exposed.

[0083] On the other hand, when the first lead portions 131b and 132b and the second lead portions 133b and 134b are located at the central portions of the first main portions 131a and 132a and the second main portions 133a and 134a, the external electrodes 151, 152, 153, and 154 can be arranged to cover the corners where two surfaces of the main body 110 are in contact.

[0084] Hereinafter, various embodiments of the present invention due to the deformation of the position or shape of the first lead portions 131b and 132b and the second lead portions 133b and 134b will be described in detail.

[0085] Referring to FIGS. 10 and 11, the first internal electrode 121 can be in contact with the first connection electrodes 131 and 132 simultaneously, and the second internal electrode 122 can be in contact with the second connection electrodes 133 and 134 simultaneously. At this time, referring to FIGS. 12, 13, and 14, the first external electrodes 151 and 152 are disposed on one of the two opposite surfaces of the main body 110 facing in the second direction, and include a first-1 external electrode 151 connected to the first connection electrode 131 and a first-2 external electrode 152 disposed on the other of the two opposite surfaces of the main body 110 facing in the second direction and connected to the first connection electrode 132. The second external electrodes 153 and 154 are disposed on one of the two opposite surfaces of the main body 110 facing in the third direction, and include a second-1 external electrode 153 connected to the second connection electrode 133 and a second-2 external electrode 154 disposed on the other of the two opposite surfaces of the main body 110 facing in the third direction and connected to the second connection electrode 134. At this time, the first-1 external electrode 151, the first-2 external electrode 152, the second-1 external electrode 153, and the second-2 external electrode 154 can be disposed spaced apart from each other, and the distance by which the first-1 external electrode 151, the first-2 external electrode 152, the second-1 external electrode 153, and the second-2 external electrode 154 are spaced apart from each other can be 10 μm or more. Thereby, it is possible to prevent a short circuit from occurring between the external electrodes 151, 152, 153, and 154.

[0086] The distance by which the first-1 external electrode 151, the first-2 external electrode 152, the second-1 external electrode 153, and the second-2 external electrode 154 are spaced apart from each other can mean the minimum linear distance between the external electrodes, and can mean the minimum linear distance between the external electrodes measured by a measuring device such as an optical microscope (OM) or a scanning electron microscope (SEM) on one of the two opposite surfaces of the multilayer electronic component 100 facing in the first direction.

[0087] On the one hand, the size of the multilayer electronic component 100 is not particularly limited. For example, the multilayer electronic component 100 can have a size of 0201 (length × width, 0.2 mm × 0.1 mm) or less in order to achieve miniaturization and high capacity simultaneously. In the case of products where reliability in a high-temperature and high-pressure environment is important, it can have a size of 3216 (length × width, 3.2 mm × 1.6 mm) or more, but it is not limited thereto.

[0088] Referring to FIG. 1, the maximum size of the multilayer electronic component 100 in the first direction can be represented by T, the maximum size in the second direction by L, and the maximum size in the third direction by W. In one embodiment, the maximum size T of the multilayer electronic component in the first direction can be 110 μm or less. Thereby, a Low-Profile multilayer electronic component can be realized, and the effect of reducing the equivalent series inductance (ESL) can be further improved.

[0089] (First Modified Example) FIG. 15 is a perspective view schematically showing the multilayer electronic component according to the first modified example, FIG. 16 is a perspective view schematically showing the main body according to the first modified example, FIG. 17 is a perspective view schematically showing the form of the connection electrode according to the first modified example, and FIG. 18 is an exploded perspective view schematically showing the coupling relationship between the connection electrode and the stacked portion according to the first modified example.

[0090] Referring to FIGS. 16 to 18, the main body 110-1 according to the first modification example can include a stacked portion 10, connection electrodes 131-1, 132-1, 133-1, 134-1 disposed on the stacked portion 10, and margin portions 141-1, 142-1, 143-1, 144-1 disposed on the connection electrodes 131-1, 132-1, 133-1, 134-1. In this case, the margin portions 141-1, 142-1, 143-1, 144-1 can cover only a part of the connection electrodes 131-1, 132-1, 133-1, 134-1. Specifically, the margin portions 141-1, 142-1, 143-1, 144-1 can not cover the first lead portions 131b-1, 132b-1 and the second lead portions 133b-1, 134b-1. Thereby, a part of the connection electrodes 131-1, 132-1, 133-1, 134-1 can form a part of the surface of the main body 110-1.

[0091] Referring to FIG. 15, the multilayer electronic component 100-1 according to the first modification example can include external electrodes 151-1, 152-1, 153-1, 154 disposed on the main body 110-1.

[0092] The first lead portions 131b-1, 132b-1 of the connection electrodes according to the first modification example can be disposed so as to penetrate the margin portions 141-1, 142-1 in the second direction, and the second lead portions 133b-1, 134b-1 can be disposed so as to penetrate the margin portions 143-1, 144-1 in the third direction. In this case, the external electrodes 151, 152, 153, 154 can be disposed so as to cover the vertex where three surfaces of the main body 110-1 are in contact, similar to the multilayer electronic component 100 according to an embodiment of the present invention, but is not necessarily limited thereto, and the first lead portions 131b-1, 132b-1 and the second lead portions 131b-1, 132b-1 can serve as external electrodes without separately forming external electrodes.

[0093] In the first modification example, the first lead portions 131b-1 and 132b-1 can mean regions where the average size in the second direction is larger than that of the first main portions 131a-1 and 132a-1, and the second lead portions 133b-1 and 134b-1 can mean regions where the average size in the third direction is larger than that of the second main portions 133a-1 and 134a-1. On the other hand, referring to FIGS. 16 to 18, the regions of the first main portions 131a-1 and 132a-1 that are in contact with the first lead portions 131b-1 and 132b-1 can have a larger average size in the second direction than the regions of the other main portions, and the regions of the second main portions 133a-1 and 134a-1 that are in contact with the second lead portions 133b-1 and 134b-1 can also have a larger average size in the third direction than the regions of the other main portions.

[0094] (Second modification example) FIG. 19 schematically shows a perspective view of the main body in the second modification example, FIG. 20 is a perspective view showing the form of the connection electrodes according to the second modification example, FIG. 21 is an exploded perspective view schematically showing the coupling relationship between the connection electrodes and the stacked portion according to the second modification example, and FIG. 22 schematically shows a perspective view of the stacked electronic component according to the second modification example.

[0095] Referring to FIGS. 19 to 22, the main body 110-2 according to the second modification example can include a stacked portion 10, connection electrodes 131-2, 132-2, 133-2, 134-2 disposed on the stacked portion 10, and margin portions 141-2, 142-2, 143-2, 144-2 disposed on the connection electrodes 131-2, 132-2, 133-2, 134-2. External electrodes 151-2, 152-2, 153-2, 151-4 can be disposed on the main body 110-2.

[0096] The connection electrodes 131-2, 132-2, 133-2, 134-2 according to the second modification example can include main portions 131a-2, 132a-2, 133a-2, 134a-2 that are in contact with at least a part of the internal electrodes 121 and 122, and lead portions 131b-2, 132b-2, 133b-2, 134b-2 that extend in the first direction from the main portions 131a-2, 132a-2, 133a-2, 134a-2.

[0097] The lead portions 131b-2, 132b-2, 133b-2, and 134b-2 according to the second modification example can be in contact with the external electrodes 151-2, 152-2, 153-2, and 154-2 only on either one of the two opposite surfaces of the main body 110-2 facing the first direction. Specifically, the first lead portions 131b-2 and 132b-2 can be in contact with the first external electrodes 151-2 and 152-2 only on either one of the two opposite surfaces of the main body 110-2 facing the first direction, and the second lead portions 133b-2 and 134b-2 can be in contact with the second external electrodes 153-2 and 154-2 only on either one of the two opposite surfaces of the main body 110-2 facing the first direction. Thereby, the maximum size of the entire multilayer electronic component 100-2 in the first direction can be minimized.

[0098] On the other hand, the external electrodes 151-2, 152-2, 153-2, and 154-2 according to the second modification example can be similarly applied to the main body 110 according to one embodiment. For example, in the main body 110 according to one embodiment, when the first lead portions 131b, 132b and the second lead portions 133b, 134b are exposed on both surfaces 1 and 2 of the main body 110 facing the first direction, the external electrodes 151, 152, 153, and 154 can be arranged only on both surfaces 1 and 2 of the main body 110 facing the first direction.

[0099] On the other hand, when the external electrodes are arranged only on both surfaces 1 and 2 of the main body 110 facing the first direction, like the external electrodes 151-2, 152-2, 153-2, and 154-2 according to the second modification example, the external electrodes 151-2, 152-2, 153-2, and 154-2 can be a plating layer covering the ends of the first lead portions 131b-2, 132b-2, 133b-2, and 134b-2 in the first direction. Thereby, the maximum size of the multilayer electronic component 100 in the first direction can be further reduced, and the effect of reducing the equivalent series inductance (ESL) due to the Low-Profile can be further improved.

[0100] (Third Modification Example) FIG. 23 schematically shows a perspective view of the main body according to the third modification example, FIG. 24 is a perspective view showing the form of the connection electrodes according to the third modification example, FIG. 25 is an exploded perspective view schematically showing the connection relationship between the connection electrodes and the stacked portion according to the third modification example, and FIG. 26 is a perspective view schematically showing a perspective view of the stacked electronic component according to the third modification example.

[0101] Referring to FIGS. 23 to 26, the main body 110-3 according to the third modification example can include a stacked portion 10, connection electrodes 131-3, 132-3, 133-3, 134-3 disposed on the stacked portion 10, and margin portions 141-3, 142-3, 143-3, 144-3 disposed on the connection electrodes 131-3, 132-3, 133-3, 134-3.

[0102] The connection electrodes 131-3, 132-3, 133-3, 134-3 according to the third modification example can include main portions 131a-3, 132a-3, 133a-3, 134a-3 in contact with at least a part of the internal electrodes 121, 122, and lead portions 131b-3, 132b-3, 133b-3, 134b-3 extending in the first direction from the main portions 131a-3, 132a-3, 133a-3, 134a-3.

[0103] The first lead portions 131b-3, 132b-3 according to the third modification example are disposed between the 1 / 3 point and the 2 / 3 point in the third direction of the first main portions 131a-3, 132a-3, and the second lead portions 133b-3, 134b-3 can be disposed between the 1 / 3 point and the 2 / 3 point in the second direction of the second main portions 133a-3, 134a-3.

[0104] Referring to FIG. 26, the stacked electronic component 100-3 according to the third modification example can include external electrodes 151-3, 152-3, 153-3, and 154-3 disposed on the main body 110-3. Accordingly, the external electrodes 151-3, 152-3, 153-3, and 154-3 according to the third modification example can be formed so as to cover a corner where two of the six surfaces of the main body 110-3 are in contact. Thereby, the distance between the external electrodes forming each terminal is reduced, and the effect of reducing the equivalent series inductance (ESL) of the present invention can be further improved.

[0105] (Application Example) FIG. 27 is a perspective view schematically showing a stacked portion according to an application example, FIG. 28 is a plan view showing the form of internal electrodes according to the application example, and FIG. 29 is an exploded perspective view schematically showing the form of a dielectric layer and internal electrodes included in the stacked portion according to the application example.

[0106] Hereinafter, with reference to FIGS. 27 to 29, the stacked portion 10' according to the application example will be described in detail. The stacked portion 10' according to the application example can be applied to all of the stacked electronic components according to the above-described one embodiment and the stacked electronic components 100-1, 100-2, and 100-3 according to the first to third modification examples.

[0107] On the other hand, since the shape of the stacked portion 10' according to the application example is partially different from the shape of the stacked portion 10 and the internal electrodes 121 and 122 according to one embodiment, the description of matters other than the difference in shape will be omitted in order to avoid duplicate description.

[0108] The stacked portion 10' according to the application example can include a dielectric layer 111, and a first internal electrode 121 and a second internal electrode 122 alternately arranged with the dielectric layer 111 in the first direction.

[0109] At this time, the first internal electrode 121 can have substantially the same width along the second direction, and the second internal electrode 122 can include a capacitance portion 122a that overlaps the first internal electrode 121 in the first direction and a lead-out portion 122b that extends from the capacitance portion 122a in the third direction and has an average width smaller than that of the capacitance portion 122a.

[0110] When the laminated portion 10' according to the application example is applied to each of the first to third modified examples, by forming the narrow lead-out portion 122b in the second internal electrode 122, not only can the effect of improving the moisture resistance reliability be further improved, but also the first internal electrode 121 can ensure the connectivity between the internal electrode and the external electrode by maintaining the form of the internal electrode according to the existing example.

[0111] As described above, the embodiments of the present invention have been described in detail. However, the present invention is not limited by the above-described embodiments and the accompanying drawings, but is limited by the appended claims. Therefore, within the scope not departing from the technical idea of the present invention described in the claims, various forms of substitution, modification, and change are possible by those having ordinary knowledge in the technical field, and it can be said that these also belong to the scope of the present invention.

[0112] In addition, the expressions "one example", "modified example", and "application example" used in the present disclosure do not mean the same example as each other, but are provided to emphasize and explain their respective unique features. However, the above-presented "one example", "modified example", and "application example" do not exclude being realized in combination with the features applicable to the "one example", "modified example", and "application example". For example, even if the matter described in a specific one example is not described in another one example, it can be understood as an explanation related to the other one example as long as there is no explanation contrary to or conflicting with that matter in the other one example.

[0113] The terms used in this disclosure are merely used to explain an embodiment and are not intended to limit this disclosure. At this time, singular expressions include plural expressions unless the context clearly indicates otherwise.

Explanation of Signs

[0114] 100, 100-1, 100-2, 100-3 Multilayer electronic component 110, 110-1, 110-2, 110-3 Main body 10, 10' Laminated portion 111 Dielectric layer 121, 122 Internal electrode 131, 132, 133, 134, 131-1, 132-1, 133-1, 134-1, 131-2, 132-2, 133-2, 134-2, 131-3, 132-3, 133-3, 134-3 Connecting electrode 131a, 132a, 133a, 134a, 131a-1, 132a-1, 133a-1, 134a-1, 131a-2, 132a-2, 133a-2, 134a-2, 131a-3, 132a-3, 133a-3, 134a-3 Main portion 131b, 132b, 133b, 134b, 131b-1, 132b-1, 133b-1, 134b-1, 131b-2, 132b-2, 133b-2, 134b-2, 131b-3, 132b-3, 133b-3, 134b-3 Lead portion 141, 142, 143, 144, 141-1, 142-1, 143-1, 144-1, 141-2, 142-2, 143-2, 144-2, 141-3, 142-3, 143-3, 144-3 Margin portion 151, 152, 153, 154, 151-1, 152-1, 153-1, 154-1, 151-2, 152-2, 153-2, 154-2, 151-3, 152-3, 153-3, 154-3 External electrode

Claims

1. a laminated body including a dielectric layer, and first and second internal electrodes alternately disposed with the dielectric layer in a first direction, a first connecting electrode connected to the first internal electrode on both sides of the laminated body facing a second direction perpendicular to the first direction, a second connecting electrode connected to the second internal electrode on both sides of the laminated body facing a third direction perpendicular to the first and second directions, and a margin portion disposed on the first connecting electrode and the second connecting electrode; a first external electrode disposed on the body and connected to the first connecting electrode; a second external electrode disposed on the body and connected to the second connecting electrode, the first connecting electrode includes a first main portion in contact with at least a portion of the first internal electrode, and a first lead portion arranged to extend from the first main portion in the first direction, and the second connecting electrode includes a second main portion in contact with at least a portion of the second internal electrode, and a second lead portion arranged to extend from the second main portion in the first direction.

2. 2. The multilayer electronic component according to claim 1, wherein the first connecting electrodes are arranged so as to cover both ends of the first internal electrodes in the second direction, and the second connecting electrodes are arranged so as to cover both ends of the second internal electrodes in the third direction.

3. the first internal electrode is exposed to both surfaces of the laminated portion facing each other in the second direction, and the second internal electrode is exposed to both surfaces of the laminated portion facing each other in the third direction, 2. The multilayer electronic component according to claim 1, wherein the first connecting electrode is disposed so as to cover an entire exposed end portion of the first internal electrode, and the second connecting electrode is disposed so as to cover an entire exposed end portion of the second internal electrode.

4. The multilayer electronic component according to claim 1 , wherein the first connecting electrode and the second connecting electrode are disposed spaced apart from each other.

5. a first lead portion of the first connecting electrode disposed on one surface of the laminated portion facing the second direction is biased to one side in the third direction with respect to a center of the first connecting electrode in the third direction, and a first lead portion of the first connecting electrode disposed on the other surface of the laminated portion facing the second direction is biased to the other side in the third direction with respect to a center of the first connecting electrode in the third direction, 2. The multilayer electronic component according to claim 1, wherein the second lead portion of the second connecting electrode arranged on one surface of the laminate facing the third direction is biased to one side in the second direction with respect to a center of the second connecting electrode in the second direction, and the second lead portion of the second connecting electrode arranged on the other surface of the laminate facing the third direction is biased to the other side in the second direction with respect to a center of the second connecting electrode in the second direction.

6. 2. The multilayer electronic component according to claim 1, wherein the first lead portion has an average length shorter than that of the first main portion, and the second lead portion has an average length shorter than that of the second main portion.

7. 2. The multilayer electronic component according to claim 1, wherein a ratio of an average length of the first lead portion to an average length of the first main portion is 0.05 or more and 0.45 or less, and a ratio of an average length of the second lead portion to an average length of the second main portion is 0.05 or more and 0.45 or less.

8. 2. The multilayer electronic component according to claim 1, wherein a ratio of an average width of the first connecting electrodes to an average width of the margin portion is 0.03 or more and 0.50 or less, and a ratio of an average width of the second connecting electrodes to an average width of the margin portion is 0.03 or more and 0.50 or less.

9. 2. The multilayer electronic component according to claim 1, wherein the first lead portion contacts the first external electrode on one or more of both surfaces of the body facing in the first direction, and the second lead portion contacts the second external electrode on one or more of both surfaces of the body facing in the first direction.

10. the first external electrode includes a 1-1 external electrode disposed on one of both surfaces of the body facing in the second direction and connected to the first connecting electrode, and a 1-2 external electrode disposed on the other of both surfaces of the body facing in the second direction and connected to the first connecting electrode; the second external electrode includes a 2-1 external electrode disposed on one of both surfaces of the body facing in the third direction and connected to the second connecting electrode, and a 2-2 external electrode disposed on the other of both surfaces of the body facing in the third direction and connected to the second connecting electrode, 2. The multilayer electronic component according to claim 1, wherein the first-1 external electrode, the first-2 external electrode, the second-1 external electrode, and the second-2 external electrode are spaced apart from one another.

11. 11. The multilayer electronic component according to claim 10, wherein the 1-1 external electrode, the 1-2 external electrode, the 2-1 external electrode, and the 2-2 external electrode are spaced apart from one another by a distance of 10 μm or more.

12. 2. The multilayer electronic component according to claim 1, wherein when a margin portion arranged on the first connecting electrode is defined as a first margin portion and a margin portion arranged on the second connecting electrode is defined as a second margin portion, the second margin portion covers an end portion of the first margin portion in the third direction.

13. 2. The multilayer electronic component according to claim 1, wherein the maximum size of the multilayer electronic component in the first direction is 110 μm or less.

14. 2. The multilayer electronic component according to claim 1, wherein the first lead portion is arranged to extend in the second direction and penetrate the margin portion, and the second lead portion is arranged to extend in the third direction and penetrate the margin portion.

15. 15. The multilayer electronic component according to claim 14, wherein the first lead portion has a larger average size in the second direction than the first main portion, and the second lead portion has a larger average size in the third direction than the second main portion.

16. The multilayer electronic component according to claim 14 , wherein the margin portion does not cover the first lead portion and the second lead portion.

17. 2. The multilayer electronic component according to claim 1, wherein the first lead portion contacts the first external electrode on only one of both surfaces of the body facing in the first direction, and the second lead portion contacts the second external electrode on only one of both surfaces of the body facing in the first direction.

18. 18. The multilayer electronic component according to claim 17, wherein the first external electrode is a plating layer covering an end portion of the first lead portion in the first direction, and the second external electrode is a plating layer covering an end portion of the second lead portion in the first direction.

19. the first lead portion is disposed between a 1 / 3 point and a 2 / 3 point of the first main portion in the third direction, The multilayer electronic component according to claim 1 , wherein the second lead portion is disposed between a ⅓ point and a ⅔ point of the second main portion in the second direction.

20. 19. The multilayer electronic component according to claim 1 , wherein a width of the first internal electrode is substantially the same along the second direction, and the second internal electrode includes a capacitive portion overlapping the first internal electrode in the first direction, and an extension portion extending from the capacitive portion in the third direction and having an average width smaller than that of the capacitive portion.

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