Chamber structure for epitaxial deposition and advanced epitaxial film application

Abstract

To provide a process chamber for semiconductor substrates which meets requests with respect to improvement of production yield and acceleration of throughput while satisfying a temperature control reference required for manufacturing next generation devices.SOLUTION: A process chamber 100 includes an upper lamp module 102, a lower lamp module 104, a substrate support, an upper window 122 disposed between the substrate support and the upper lamp module, a lower window 120 disposed between the lower lamp module and the substrate support, and an injection ring 116 and a base ring 114 including a gas injector 108 disposed while penetrating the rings per se. The upper lamp module and the lower lamp module include lamp openings 128 and 186 oriented in a vertical direction for disposing heating lamps 130 and 188. The base ring includes a substrate transfer pathway 162, a lower chamber exhaust pathway 164 and one or more upper chamber exhaust pathways.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] Embodiments of the present disclosure generally relate to apparatuses and methods for fabricating semiconductor substrates. More specifically, the apparatuses disclosed herein relate to a chamber body and associated components used in semiconductor processing.

Background Art

[0002] Semiconductor substrates are processed for various applications including the manufacture of integrated and micro-devices. During processing, the substrate is placed on a susceptor within a processing chamber. The susceptor is supported by a support shaft that is rotatable about a central axis. By precisely controlling heat sources such as a plurality of heating lamps disposed above and below the substrate, it is possible to heat the substrate within a very strict tolerance range. The temperature of the substrate can affect the uniformity of the material deposited on the substrate.

[0003] The ability to accurately control the substrate temperature within the processing chamber has a significant impact on throughput and production yield. In conventional processing chambers, it has been difficult to meet the increasingly high demands for improving production yield and accelerating throughput while meeting the temperature control criteria required for the manufacture of next-generation devices.

[0004] Therefore, improvements to the processing chamber and associated components are needed.

Summary of the Invention

[0005] Embodiments described in this specification include a processing chamber for substrate processing. The processing chamber includes an upper lamp module, a lower lamp module, a substrate support, an upper window, a lower window, and a chamber body assembly. The substrate support is disposed between the upper lamp module and the lower lamp module. The upper window is disposed between the upper lamp module and the substrate support. The lower window is disposed between the lower lamp module and the substrate support. The chamber body assembly is disposed between the upper lamp module and the lower lamp module and forms a part of the processing space. The chamber body assembly includes a substrate transfer passage disposed through the chamber body assembly. A lower chamber exhaust passage is disposed through the chamber body assembly opposite to the substrate transfer passage. One or more upper chamber exhaust passages are disposed through the chamber body assembly. Each of the one or more upper chamber exhaust passages has an upper chamber exhaust passage opening disposed above the lower chamber exhaust passage. One or more injector passages are disposed through the chamber body assembly above the substrate transfer passage.

[0006] Other embodiments of a processing chamber for substrate processing include an upper lamp module, a lower lamp module, a substrate support, an upper window, a lower window, and a chamber body assembly. The upper lamp module includes an upper module body having a top surface and a bottom surface. A plurality of lamp openings are disposed from the bottom surface to the top surface. The substrate support is disposed between the upper lamp module and the lower lamp module. The upper window is disposed between the upper lamp module and the substrate support. The lower window is disposed between the lower lamp module and the substrate support. The chamber body assembly is disposed between the upper lamp module and the lower lamp module and forms a portion of the processing space. The chamber body assembly includes a lower chamber exhaust passage disposed through the chamber body assembly and a substrate transfer passage disposed through the chamber body assembly. The lower chamber exhaust passage is disposed through the chamber body assembly opposite the substrate transfer passage. One or more upper chamber exhaust passages are disposed through the chamber body assembly. Each of the one or more upper chamber exhaust passages has an upper chamber exhaust passage opening disposed above the lower chamber exhaust passage. One or more injector passages are disposed through the chamber body assembly above the substrate transfer passage.

[0007] In yet another embodiment, a processing chamber for substrate processing includes an upper lamp module, a lower lamp module, a substrate support, an upper window, a lower window, and a chamber body assembly. The upper lamp module includes an upper module body having an upper surface and a bottom surface. A plurality of lamp openings are disposed from the bottom surface to the upper surface of the upper lamp module. The substrate support is disposed between the upper lamp module and the lower lamp module. The upper window is disposed between the upper lamp module and the substrate support. The lower window is disposed between the lower lamp module and the substrate support. The chamber body assembly is disposed between the upper lamp module and the lower lamp module and forms a part of the processing space. The chamber body assembly includes a substrate transfer passage disposed therethrough. One or more upper chamber exhaust passages are disposed through the chamber body assembly. Each of the one or more upper chamber exhaust passages has an upper chamber exhaust passage opening in fluid communication with the processing space. The lower chamber exhaust passage is disposed through the chamber body assembly below the upper chamber exhaust passage opening. One or more injector passages are disposed above the substrate transfer passage.

[0008] To enable a more detailed understanding of the features described above of the present disclosure, a more specific description of the present disclosure, briefly summarized above, can be obtained by reference to the embodiments, some of which are illustrated in the accompanying drawings. However, it should be noted that the accompanying drawings illustrate only exemplary embodiments and, accordingly, should not be regarded as limiting the scope of the present disclosure, and other equally effective embodiments may be permitted.

Brief Description of the Drawings

[0009]

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DETAILED DESCRIPTION OF THE INVENTION

[0010] For ease of understanding, where possible, the same reference numbers have been used to denote the same elements common to multiple figures. It is assumed that the components and features of one embodiment can be beneficially incorporated into other embodiments without further description.

[0011] Embodiments of the present disclosure generally relate to apparatus for semiconductor processing. More specifically, the apparatus disclosed herein relates to a processing chamber and its components. The processing chamber is configured as a thermal deposition chamber such as an epitaxial deposition chamber. The processing chamber disclosed herein enables improved process gas flow and heating of the substrate. Since the components of the processing chamber are less expensive than those of conventional chambers, the replacement cost of a part of the processing chamber after a part of the chamber body has worn out or when an improved design has been applied to a part of the chamber body is reduced. The disclosed processing chamber overcomes conventional problems including improved process gas flow through the chamber space and more uniform thermal control, thereby improving throughput and process yield.

[0012] This specification also discloses components of a processing chamber. The components disclosed in this specification include an injection ring, a base ring, an upper lamp module, a lower lamp module, a susceptor, a rotation assembly, an upper liner, a lower liner, and one or more heating elements. Each of the components of the processing chamber is used together to horizontally flow one or more process gases across the surface of a substrate. The components of the processing chamber are coupled to each other to form a processing space in which a substrate is processed, for example, by epitaxial deposition.

[0013] FIG. 1 is a schematic view of a processing chamber 100 according to an embodiment of the present disclosure. The processing chamber 100 is an epitaxial deposition chamber and can be used as part of a cluster tool (not shown). The processing chamber 100 is utilized to grow an epitaxial film on a substrate such as substrate 150. The processing chamber 100 generates a cross-flow of precursors across the upper surface of the substrate 150 during processing.

[0014] The processing chamber 100 includes an upper lamp module 102, a lower lamp module 104, a chamber body assembly 106, a susceptor assembly 124, a lower window 120, and an upper window 122. The susceptor assembly 124 is disposed between the susceptor assembly 124 and the lower lamp module 104. The lower window 120 is disposed between the susceptor assembly 124 and the lower lamp module 104. The upper window 122 is disposed between the susceptor assembly 124 and the upper lamp module 102.

[0015] The upper lamp module 102 is disposed above the susceptor assembly 124 and is configured to heat a substrate such as the substrate 150 disposed on the susceptor assembly 124. The upper lamp module 102 includes an upper module body 126 and a plurality of lamp openings 128 disposed through the upper module body 126. A lamp 130 is disposed in each of the plurality of lamp openings 128. Each lamp 130 is coupled to a lamp base 129. Each of the lamp bases 129 supports one of the lamps 130 and electrically connects each lamp 130 to a power source (not shown). Each lamp 129 is fixed in an orientation generally perpendicular within the opening 128. In this specification, the generally perpendicular orientation of the lamp 130 is substantially perpendicular to the substrate support surface of the susceptor 124. The perpendicular orientation of the lamp 130 is not necessarily perpendicular to the substrate support surface, but may be at an angle of about 30 degrees to about 150 degrees, for example, at an angle of about 45 degrees to about 135 degrees, for example, at an angle of about 70 degrees to about 110 degrees with respect to the substrate support surface 906 (FIG. 9).

[0016] Continuing to refer to FIG. 1, the upper lamp module 102 further includes a heating gas passage 136 and a pyrometer passage 138. A heating gas source 132 is fluidly coupled to the heating gas passage 136. The heating gas passage 136 extends from the upper surface to the bottom surface of the upper module body 126. The heating gas passage 136 is configured such that a heated gas, such as heated air or a heated inert gas, can flow from the heating gas source 132 to the upper surface of the upper window 122 and convectively heat the upper window 122. The heated gas is supplied to an upper plenum 180 defined between the upper lamp module 102 and the upper window 122. A heating gas exhaust passage 142 is also disposed through the upper module body 126. The heating gas exhaust passage 142 is coupled to a heating exhaust pump 140. The heating exhaust pump 140 removes gas from the upper plenum 180. The heating exhaust pump 140 also functions as an exhaust pump for the processing space. The heating gas exhaust passage 142 may, in some embodiments, be a groove formed along the edge of the upper module body 126 or may be formed through a separate component in fluid communication with the upper plenum 180.

[0017] The pyrometer passage 138 is disposed through the upper module body 126 such that a pyrometer 134, such as a scanning pyrometer, can measure the temperature of the substrate 150. The pyrometer 134 is disposed on the upper module body 126 adjacent to the pyrometer passage 138. The pyrometer passage 138 extends from the upper surface of the upper module body 126 to the bottom surface in the vicinity of the upper window 122.

[0018] The lower lamp module 104 is disposed below the susceptor assembly 124 and is configured to heat the bottom surface of the substrate 150 disposed on the susceptor assembly 124. The lower lamp module 104 includes a lower module body 182 and a plurality of lamp openings 186 disposed through the lower module body 182. A lamp 188 is disposed in each of the plurality of lamp openings 186. Each lamp 188 is disposed in a generally vertical orientation and is coupled to a lamp base 184. Each of the lamp bases 184 supports one of the lamps 188 and electrically connects each lamp 188 to a power source (not shown). As used herein, the generally vertical orientation of the lamps 188 is described with respect to the substrate support surface 906 (FIG. 9) of the susceptor 124. The generally vertical orientation is not necessarily generally perpendicular to the substrate support surface 906, but may also be at an angle of about 30 degrees to about 150 degrees with respect to the substrate support surface 906, such as an angle of about 45 degrees to about 135 degrees with respect to the substrate support surface 906, such as an angle of about 70 degrees to about 110 degrees with respect to the substrate support surface 906.

[0019] The lower lamp module 104 further includes a susceptor shaft passage 195 and a pyrometer passage 192. The support shaft 904 (FIG. 9) of the susceptor 124 is disposed through the susceptor shaft passage 195. The susceptor shaft passage 195 is disposed through the center of the lower module body 182. The susceptor shaft passage 195 is configured such that the support shaft 904 of the susceptor 124 and a portion of the lower window 120 can pass through the lower module body 182.

[0020] Continuing to refer to FIG. 1, a pyrometer passage 192 is disposed through the lower module body 182 such that a pyrometer 190, such as a scanning pyrometer, can measure the temperature of the bottom surface of the substrate 150 or the bottom surface of the substrate support. The pyrometer 190 is disposed adjacent to the pyrometer passage 192 below the lower module body 182. The pyrometer passage 192 is disposed from the bottom surface of the lower module body 182 to the upper surface of the lower module body 182 in the vicinity of the lower window 120.

[0021] The chamber body assembly 106 includes an injection ring 116 and a base ring 114. The injection ring 116 is disposed on the base ring 114. The injection ring 116 has one or more gas injectors 108 disposed therethrough. The base ring 114 includes a substrate transfer passage 162 disposed therethrough, one or more upper chamber exhaust passages 426 (FIG. 4E), and a lower chamber exhaust passage 164. The substrate transfer passage 162 is disposed opposite to the one or more upper chamber exhaust passages 426 and the lower chamber exhaust passage 164. Each of the one or more upper chamber exhaust passages 426 is coupled to an exhaust module 422.

[0022] The upper chamber 111 is the portion of the processing space 110 where the substrate 150 is processed and the process gas is injected. The lower chamber 113 is the portion of the processing space 110 where the substrate 150 is loaded onto the susceptor assembly 124. The upper chamber 111 can also be understood as the space above the susceptor 902 (FIG. 9) of the susceptor assembly 124 while the susceptor assembly 124 is in the processing position. The lower chamber 113 is understood to be the space below the susceptor 902 (FIG. 9) of the susceptor assembly 124 while the susceptor assembly 124 is in the processing position. The processing position (not shown) is the position where the substrate 150 is disposed on the same plane as the horizontal plane 125 or above the horizontal plane 125. The horizontal plane 125 is the plane where the injection ring 116 and the base ring 114 contact each other.

[0023] The one or more upper chamber exhaust passages 426 and the lower chamber exhaust passage 164 are coupled to one or more exhaust pumps (not shown). The one or more exhaust pumps are configured to remove exhaust gas from the processing space 110 via the one or more upper chamber exhaust passages 426 and the lower chamber exhaust passage 164. In some embodiments, each of the upper chamber exhaust passage 426 and the lower chamber exhaust passage 164 is coupled to a single exhaust pump using a plurality of conduits. In other embodiments, the upper chamber exhaust passage 426 is coupled to a different exhaust pump than the lower chamber exhaust passage 164.

[0024] The substrate transfer path 162 is formed through the base ring 114 and is configured to allow a substrate to pass therethrough from a transfer chamber of a cluster tool (not shown). In order to enable the processing chamber 100 to be attached to a cluster tool (not shown), a flange 168 is attached to one end of the base ring 114. The substrate transfer path 162 passes through the flange 168.

[0025] The upper cooling ring 118 and the lower cooling ring 112 are disposed on both sides of the chamber body assembly 106. The upper cooling ring 118 is disposed above the injection ring 116 and is configured to cool the injection ring 116. The lower cooling ring 112 is disposed below the base ring 114 and is configured to cool the base ring 114. The upper cooling ring 118 has a coolant passage 146 disposed therein. The coolant circulating through the coolant passage 146 may include water or oil in some embodiments. The lower cooling ring 112 has a coolant passage 148 disposed therein. The coolant circulating through the coolant passage 148 is the same as the coolant circulating through the coolant passage 146 of the upper cooling ring 118. In some embodiments, the upper cooling ring 118 and the lower cooling ring 112 assist in fixing the injection ring 116 and the base ring 114 in place. The upper cooling ring 118 can partially support the upper lamp module 102, and the lower cooling ring 112 can partially support the base ring 114 and the injection ring 116.

[0026] By using the upper cooling ring 118 and the lower cooling ring 112, the temperatures of the injection ring 116 and the base ring 114 are lowered, and at this time, additional cooling channels arranged through the injection ring 116 and the base ring 114, such as those existing in conventional rings, are not required. As a result, the manufacturing costs of the injection ring 116 and the base ring 114, which are replaced more frequently than the upper cooling ring 118 and the lower cooling ring 112, are reduced. In some embodiments, the injection ring 116 may have additional coolant passages 521 (FIG. 5A) disposed therein.

[0027] One or more gas injectors 108 of the injection ring 116 are disposed through one or more openings inside the injection ring 116. In the embodiments described herein, a plurality of gas injectors 108 are disposed through the injection ring 116. One or more gas injectors 108 are configured to supply process gas to the processing space 110 via one or more gas outlets 178. One of the one or more gas injectors 108 is shown in FIG. 1. The gas injector 108 is shown as being arranged such that one or more gas outlets 178 point downward toward the susceptor 124 and the substrate 150. The downward angle of the gas injector 108 can be an angle greater than about 5 degrees from the horizontal, for example, an angle greater than about 10 degrees from the horizontal. Each of the one or more gas outlets 178 is fluidly coupled to one or more process gas sources, such as a first process gas source 174 or a second process gas source 176. In some embodiments, only the first process gas source 174 is utilized. In embodiments where both the first process gas source 174 and the second process gas source 176 are utilized, two gas outlets 178 are present within each gas injector 108. The two gas outlets 178 are arranged in an overlapping configuration, and gas mixing is possible only after the gas enters the processing space 110. In some embodiments, the first process gas source 174 is a process gas and the second process gas source 176 is a cleaning gas. In other embodiments, both the first process gas source 174 and the second process gas source 176 are process gases.

[0028] The upper window 122 is disposed between the injection ring 116 and the upper lamp module 102. The upper window 122 is an optically transparent window, whereby the radiant energy generated by the upper lamp module 102 can pass therethrough. In some embodiments, the upper window 122 is formed of quartz or glass material. The upper window 122 has a dome shape and is depicted as an upper dome in some embodiments. The outer edge of the upper window 122 forms the peripheral support portion 172. The peripheral support portion 172 is thicker than the central portion of the upper window 122. The peripheral support portion 172 is disposed on the injection ring 116. The peripheral support portion 172 is connected to the central portion of the upper window 122 and is formed of the optically transparent material of the central portion of the upper window 122.

[0029] The lower window 120 is disposed between the base ring 114 and the lower lamp module 104. The lower window 120 is an optically transparent window, whereby the radiant energy generated by the lower lamp module 104 can pass therethrough. In some embodiments, the lower window 120 is formed of quartz or glass material. The lower window 120 has a dome shape and is depicted as a lower dome in some embodiments. The outer edge of the lower window 120 forms the peripheral support portion 170. The peripheral support portion 170 is thicker than the central portion of the lower window 120. The peripheral support portion 170 is connected to the central portion of the lower window 120 and is formed of the same optically transparent material.

[0030] Various liners and heaters are disposed inside the chamber body assembly 106 within the processing space 110. As shown in FIG. 1, an upper liner 156 and a lower liner 154 are disposed within the chamber body assembly 106. The upper liner 156 is disposed above the lower liner 154 and inside the injection ring 116. The lower liner 154 is disposed inside the base ring 114. The upper liner 156 and the lower liner 154 are configured to be coupled together while they are present within the processing space. The upper liner 156 and the lower liner 154 are configured to shield the inner surfaces of the injection ring 116 and the base ring 114 from the process gas within the processing space. The upper liner 156 and the lower liner 154 further serve to reduce heat loss from the processing space to the injection ring 116 and the base ring 114. When the heat loss is reduced, the heating uniformity of the substrate 150 is improved, enabling more uniform deposition on the substrate 150 during processing.

[0031] The upper heater 158 and the lower heater 152 are also disposed within the processing space 110 in the chamber body assembly 106. As shown in FIG. 1, the upper heater 158 is disposed between the upper liner 156 and the injection ring 116, and the lower heater 152 is disposed between the lower liner 154 and the base ring 114. Both the upper heater 158 and the lower heater 152 are disposed inside the chamber body assembly 106 to enable more uniform heating of the substrate 150 while the substrate 150 is within the processing chamber 100. The upper heater 158 and the lower heater 152 reduce heat loss to the walls of the chamber body assembly 106 and form a more uniform temperature distribution around the surfaces that form the processing space 110. Each of the upper liner 156, the lower liner 154, the upper heater 158, and the lower heater 152 is coupled to a flange 160 disposed within the processing space 110. The flange 160 is a horizontal surface configured to be fixed between a portion of the injection ring 116 and the base ring 114 to enable the fixing of each of the upper liner 156, the lower liner 154, the upper heater 158, and the lower heater 152. In the embodiments described herein, both the upper heater 158 and the lower heater 152 can be configured such that a heated fluid passes therethrough or can be resistance heaters. The upper heater 158 and the lower heater 152 are further shaped to receive openings that penetrate the injection ring 116 and the base ring 114.

[0032] The susceptor assembly 124 is disposed within the processing space 110 and is configured to support the substrate 150 during processing. The susceptor assembly 124 includes a planar upper surface for supporting the substrate 150 and a shaft that extends through a portion of the lower window 120 and the lower lamp module 104. The susceptor assembly 124 is coupled to a movement assembly 194. The movement assembly 194 includes a rotation assembly 196 and a lift assembly 198. The rotation assembly 196 is configured to rotate the susceptor assembly 124 about a central axis A, and the lift assembly 198 is configured to linearly move the susceptor assembly 124 within the processing space 110 along the central axis A.

[0033] FIG. 2A is a schematic bottom view of an upper lamp assembly 102 according to an embodiment of the present disclosure. The upper module body 126 of the upper lamp module 102 further includes a bottom surface 202, an upper surface 214 (FIG. 2B), and a support ridge 204 disposed around the outer edge of the bottom surface 202. The support ridge 204 is configured to provide separation between the remaining portion of the bottom surface 202 and the upper window 122 while supporting the upper module body 126 by contacting a part of the upper window 122 (FIG. 1). The support ridge 204 disposed outside the bottom surface 202 disperses the weight of the upper module body 126 around a peripheral support portion 172 or a part of the chamber body assembly 106 instead of being supported only by the central portion of the upper window 122. Thereby, the probability of the upper window 122 breaking is reduced, and an upper plenum 180 is formed. The upper plenum 180 enables heating or cooling of the upper window 122 using a gas source such as a heating gas supply source 132. The bottom surface 202 is a curved surface and has the same shape as the central portion of the upper window 122. The bottom surface 202 is a concave surface.

[0034] Each of the lamp openings 128 includes an inner wall 206. Each of the inner walls 206 forms a circular or elliptical opening up to the lamp opening 128 of the bottom surface 202. Each of the inner walls 206 is configured to reflect radiant energy to enable focusing of the radiant energy from the lamp 130 (FIG. 1) and to enable a controlled energy distribution across the substrate 150. In the embodiments described herein, each of the inner walls 206 is curved such that the inner wall 206 forms a portion of an ellipse. In other embodiments, the inner wall 206 is a vertical wall. The inner wall 206 has a reflectivity greater than about 90%, for example greater than about 98%, for wavelengths between about 700 nm and about 15,000 nm, such as between about 700 nm and about 1000 nm or between about 1000 nm and about 15,000 nm. A reflective coating, such as a coating of gold, polished aluminum, or other polished material having a high reflectivity for infrared wavelengths, may be disposed on the inner wall 206. In some embodiments, the upper module body 126 is formed of a reflective material such as aluminum or steel. In some embodiments, the upper module body 126 is formed from a first material such as aluminum or steel and plated with a second material. The second material can be any one of copper, nickel, brass, bronze, silver, gold, aluminum, or an alloy thereof. The second material can be polished to increase its reflectivity. In some embodiments, the bottom surface 202 is also reflective. The bottom surface 202 can have a reflectivity greater than about 90%, for example greater than about 98%, for wavelengths between about 700 nm and about 15,000 nm, such as between about 700 nm and about 1000 nm or between about 1000 nm and about 15,000 nm. The bottom surface 202 is made of the same material as or coated with the same material as the inner wall 206.

[0035] The inner wall 206 extends vertically through the upper module body 126 such that the inner wall 206 extends from the bottom surface 202 towards the upper surface 214. The inner wall 206, and thus the lamp opening 128, is generally vertically oriented, enabling a more focused distribution of the radiant energy on the substrate. The generally vertical orientation of the lamp opening 128 further reduces the radiant energy absorbed by the upper module body 126. The inner wall 206 forms a part of a sphere. Each of the lamp openings 128 includes a central axis about which the inner wall 206 is formed. The central axes passing through each lamp opening 128 have a common intersection below the bottom surface 202 of the upper lamp module 102, whereby each lamp opening 128 faces inwards towards the central axis A.

[0036] As shown herein, the pyrometer passage 138 is a slit disposed through the upper module body 126. The pyrometer passage 138 has a first length L1 at the bottom surface 202 and a second length L2 at the upper surface 214 (FIG. 2B). The first length L1 is longer than the second length L2. The first length L1 is longer than the second length L2 and reduces the opening at the upper surface 214, but a complete scan of the upper surface of the substrate 150 by a scanning pyrometer such as the pyrometer 134 is possible. The heating gas passage 136 is disposed through the center of the upper module body 126.

[0037] Figure 2B is a schematic plan view of the upper lamp module 102 of FIG. 2A. As shown in FIG. 2B, each of the plurality of lamp openings 128 further includes a lamp base support portion 212 and a bulb opening 210 disposed through each of the lamp base support portions 212. The bulb opening 210 connects the lamp base support portion 212 and the reflective inner wall 206. The lamp base support portion 212 is a stepped surface disposed around the bulb opening 210. Each lamp base support portion 212 includes a central bore 211 and an arcuate recess 213 surrounding the central bore. The lamp base support portion 212 is configured to support the lamp base 129. The bulb opening 210 is a circular opening disposed through the bottom surface 215 of the lamp base support portion 212. The bulb opening 210 is dimensioned to allow the bulb of the lamp 130 to pass through.

[0038] The upper surface 214 of the upper lamp module 102 includes a raised portion 216. The raised portion 216 slightly protrudes from the outer portion of the upper surface 214. The raised portion 216 increases the structural strength of the upper lamp module 102 and reduces the deflection of the upper lamp module 102 associated with the addition of measurement tools such as the lamp 130 and the pyrometer 134.

[0039] Figure 2C is a schematic cross-sectional view of the upper lamp module of FIGS. 2A-2B cut along cutting line 2C-2C. The upper module body 126 is arranged around a central axis A. Each of the reflective inner walls 206 is configured to reflect light from the bulb around the lamp opening 128 and direct the light towards the substrate 150 (FIG. 1) through the opening 217 formed by the inner wall 206. The opening 217 is located where the inner wall 206 and the bottom surface 202 intersect. One of the openings 217 of the wall of the inner wall 206 and the lamp opening 128 surrounds a lamp opening axis E. The lamp opening axis E is a center line passing through the lamp opening 128 and is arranged at an angle φ with respect to the central axis A. The angle φ is less than about 45 degrees, for example, less than about 30 degrees, for example less than about 20 degrees. Each of the lamp openings 128 includes a similar lamp opening axis E and is arranged at an angle φ with respect to the central axis A. Although not all of the lamp opening axes E have the same angle φ, they are angled within the range of the angle φ described above.

[0040] Each opening 217 has a first diameter D1 at the bottom surface 202. The first diameter D1 is from about 10 mm to about 50 mm, for example, from about 20 mm to about 40 mm. The first diameter D1 is configured to control the distribution of the radiant energy emitted from each of the plurality of lamp openings 128 and the focal position of the radiant energy. Each of the bulb openings 210 has a second diameter D2. The lamp opening axis E similarly passes through the center of the bulb openings 210 such that the opening 217 and the bulb openings 210 are concentric around the lamp opening axis E. The second diameter D2 is from about 5 mm to about 40 mm, for example, from about 10 mm to about 30 mm. The second diameter D2 is large enough for one of the bulbs of the lamp 130 to pass therethrough, but small enough to reduce the heat loss through the bulb openings 210. In some embodiments, the ratio of the size of the first diameter D1 to the size of the second diameter D2 is from about 2:1 to about 5:4, for example from about 2:1 to about 4:3, for example from about 2:1 to about 3:2. The ratio of the first diameter D1 to the second diameter D2 is configured to form a desired energy distribution on the substrate disposed under the upper module body 126. In some embodiments, the maximum diameter of the bulb of each lamp 130 is less than 1 mm smaller than the second diameter D2.

[0041] The plurality of lamp openings 128 are arranged within a characteristic zone. As shown here, the plurality of lamp openings 128 are arranged within three zones. Each of the three zones can be approximately pie-shaped such that each zone forms one sector (sector shape) of a circle. Each sector includes a group of the lamp openings 128. Each sector covers approximately 120 degrees of the upper lamp module 102. Each zone includes approximately 5 to 10 lamp openings 128. For example, there are approximately 6 to 8 lamp openings 128 within the sector. The zones are each arranged to heat different portions of the substrate. Each zone of the plurality of lamp openings 128 includes a subset of the inner lamp openings 128 and a subset of the outer lamp openings 128. Among the subset of the inner lamp openings 128, there are a plurality of lamp openings 128. The lamp openings 128 within the subset of the inner lamp openings 128 have a small spacing between each other. The small spacing is smaller than the distance from one of the lamp openings 128 within the inner subset to any lamp opening 128 within a second subset of the inner lamp openings 128 that is within the range of an adjacent zone. The lamp openings 128 within the subset of the outer lamp openings 128 are evenly spaced on the upper lamp module 102. Each lamp opening 128 within the subset of the outer lamp openings 128 is at an equal distance from an adjacent lamp opening 128 within the second outer subset to an adjacent lamp opening 128 within the same outer subset.

[0042] Other arrangements of the plurality of lamp openings 128 are conceivable and can include arranging the plurality of lamp openings 128 within a plurality of concentric rings or arranging them uniformly across the upper lamp module 102.

[0043] Figure 3A is a schematic top view of the lower lamp module 104. The lower module body 182 of the lower lamp module 104 further includes a top surface 302, a bottom surface 314 (FIG. 3B), and a support ridge 304 disposed around the outer edge of the top surface 302. The support ridge 304 is a ring disposed around the top surface 302 of the lower module body 182 and extending outward from the lower module body 182. The support ridge 304 is configured to separate the top surface 302 of the lower module body 182 from a portion of the lower window 120 (FIG. 1) by contacting the portion of the lower window 120, while providing a separation between the remaining portion of the bottom surface 202 and the lower window 120. By the support ridge 304, the lower module body 182 can contact only the peripheral support portion 170 or a portion of the chamber body assembly 106, rather than the central portion of the lower window 120. Thereby, the probability of the lower window 120 breaking is reduced, and the lower plenum 181 is formed. The top surface 202 is an angled surface and has a shape similar to the central portion of the lower window 120. In the embodiments described herein, the top surface 202 is a concave surface.

[0044] Each of the lamp openings 186 includes an inner wall 306. Each inner wall 306 is similar to the inner wall 206 of the upper lamp module 102. The inner walls 306 of the lamp openings 186 are configured to reflect radiant energy to enable focusing of the radiant energy from the lamp 188 (FIG. 1) and to enable a controlled energy distribution across the substrate 150. Each of the inner walls 306 forms a circular or elliptical opening up to the lamp opening 186 in the top surface 302.

[0045] The inner walls 306 extend vertically through the lower module body 182 such that the inner walls 306 extend from the top surface 302 toward the bottom surface 314. By the inner walls 306, and thus the lamp openings 186, being vertically oriented, a more focused distribution of radiant energy on the substrate is enabled. The vertical orientation of the lamp openings 186 further reduces the radiant energy absorbed by the lower module body 182.

[0046] In some embodiments, the lower module body 182 is formed from a first material such as aluminum or steel and plated with a second material. The second material can be any one of copper, brass, bronze, silver, gold, aluminum, or an alloy thereof. In some embodiments, the lower module body 182 does not include a coating of the second material and is instead a single material. The lower module body 182 can have a polished upper surface 302. In some embodiments, the upper surface 302 is also reflective. The upper surface 302 can have a reflectivity greater than about 90%, such as greater than about 98%, for wavelengths between about 700 nm and about 15,000 nm, for example, between about 700 nm and about 1000 nm or between about 1000 nm and about 15,000 nm. The upper surface 302 is made of the same material as or coated with the same material as the inner wall 306.

[0047] As shown here, the pyrometer passage 192 is a slit disposed through the lower module body 182. The pyrometer passage 192 has a third length L3 at the upper surface 302 and a fourth length L4 at the bottom surface 314 (FIG. 3B). The third length L3 is longer than the fourth length L4. The third length L3 is longer than the fourth length L4 and reduces the opening at the bottom surface 314, but a complete scan of the bottom surface of the substrate 150 or the bottom surface of the susceptor by a scanning pyrometer such as the pyrometer 190 is possible.

[0048] As shown in FIG. 3A, the susceptor shaft passage 195 is disposed through the center of the lower module body 182. The susceptor shaft passage 195 is disposed between the upper surface 302 and the bottom surface 314 of the lower module body 182 and connects the upper surface 302 and the bottom surface 314 of the lower module body 182. The portion of the susceptor shaft passage 195 adjacent to the upper surface 302 includes a curved surface 208. As the lower window 120 curves to pass through the susceptor shaft passage 195, the curved surface 208 is configured to follow the shape of the lower window 120. The curved surface 208 connects the bottom surface 314 and the inner surface of the susceptor shaft passage 195.

[0049] Figure 3B is a schematic plan view of the lower lamp module 104 of FIG. 3A according to an embodiment of the present disclosure. As shown in FIG. 3B, each of the plurality of lamp openings 186 further includes a lamp base support portion 312 and a bulb opening 310 disposed through each of the lamp base support portions 312. The bulb opening 310 connects the lamp base support portion 312 and the inner wall 306. The lamp base support portion 312 is a stepped surface disposed around the bulb opening 310. Each lamp base support portion 312 includes a central bore 311 and an arcuate recess 313 surrounding the central bore. The lamp base support portion 312 is configured to support and / or couple to the lamp base 184. The bulb opening 310 is a circular opening disposed through the upper surface of the lamp base support portion 312. The bulb opening 310 is sized to allow the bulb of the lamp 188 to pass through.

[0050] Figure 3C is a schematic cross-sectional view of the lower lamp module 104 of FIG. 3A cut along plane 3C-3C. As shown in FIG. 3C, the lower module body 182 is disposed about a central axis A. In some embodiments, the inner wall 306 and the upper surface 302 intersect to form an opening 317. The opening 317 has a first diameter D1. In some embodiments, the opening 317 is elliptical or oval. In the same embodiment, the first diameter D1 is the major axis length of the opening 317. The first diameter D1 is the same as the first diameter D1 described with reference to the upper module body 126. Each of the bulb openings 310 has a second diameter D2. The second diameter D2 is the same as the second diameter D2 described with reference to the upper module body 126. In some embodiments, the maximum diameter of the bulb of each lamp 188 is less than 1 mm smaller than the second diameter D2.

[0051] Each of the reflective inner walls 306 is configured to reflect light from the bulb around the lamp opening 186 and direct the light through the opening 317 formed by the inner wall 306 towards the substrate 150 (FIG. 1). The opening 317 is disposed where the inner wall 306 and the upper surface 302 intersect. One of the walls of the inner wall 306 and the opening 317 of the lamp opening 186 surrounds the lamp opening axis F. The lamp opening axis F is the center line passing through the lamp opening 186. The lamp opening axis F also passes through the center of the bulb opening 310 such that the opening 317 and the bulb opening 310 are concentric around the lamp opening axis F.

[0052] A plurality of lamp openings 186 are disposed within the zone. As shown herein, the plurality of lamp openings 186 are disposed within two concentric zones. Each zone includes a ring of lamp openings 186 disposed with a common diameter around the susceptor shaft passage 195. Each ring of lamp openings 186 includes at least three lamp openings 186. In the embodiments described herein, the inner zone includes a ring having 8 to 16 lamp openings 186, such as 10 to 14 lamp openings 186. The outer zone includes a ring having 12 to 20 lamp openings 186, such as 14 to 18 lamp openings. In this specification, the outer zone includes more lamp openings 186 than the inner zone.

[0053] Figure 4A is a schematic cross-sectional perspective view of a chamber body assembly 106 according to an embodiment of the present disclosure. The chamber body 106 includes an injection ring 116 disposed on and coupled to a base ring 114. The injection ring 116 includes one or more gas injectors 108. The injection ring 116 includes an inner surface 504, and the base ring 114 includes an inner surface 404. The inner surface 404 of the base ring 114 and the inner surface 504 of the injection ring 116 are aligned with each other such that the inner surfaces 404, 504 have the same diameter for at least a portion of the outer periphery of the base ring 114 and the injection ring 116. The inner surface 404 of the base ring 114 and the inner surface 504 of the injection ring 116 form a central opening 401. The central opening 401 includes both an opening 410 of the base ring 114 and an opening 510 of the injection ring 116. The upper surface 412 of the base ring is in contact with the bottom surface 524 of the injection ring 116.

[0054] One or more gas injectors 108 are disposed on one side of the chamber body assembly 106, and one or more upper chamber exhaust passage openings 424 are disposed on the opposite side of the chamber body assembly 106. Each of the one or more upper chamber exhaust passage openings 424 is aligned with a recess 530 formed in the inner surface of the injection ring 116. By aligning each of the one or more recesses 530 with the upper chamber exhaust passage openings 424, the gas injected by the one or more gas injectors 108 can flow over the substrate 150 (FIG. 1) across the processing space 110 and then be removed from the processing space 110 through the upper chamber exhaust passage openings 424. The recess 530 assists in collecting the exhaust gas and directing the exhaust gas downward from a region at the same height as the injection ring 116 toward the upper chamber exhaust passage openings 424. When the exhaust gas enters the upper chamber exhaust passage openings 424, the exhaust gas flows through one or more upper chamber exhaust passages 426 and exits through the exhaust outlet 430.

[0055] The combination of the recess 530 and the upper chamber exhaust passage opening 424 reduces the complexity of manufacturing the base ring 114 and / or the injection ring 116. The combination of the recess 530 and the upper chamber exhaust passage opening 424 further enables the process gas to flow horizontally across the processing space 110 and remain within the upper chamber 111, without bypassing downward into the lower chamber 113 which can be a source of contamination.

[0056] FIG. 4B is a schematic cross-sectional view of the chamber body assembly 106 of FIG. 4A through another plane, according to an embodiment of the present disclosure. The cross-section shown in FIG. 4B shows the relationship between the lower chamber exhaust passage 164, and the orientation of the lower chamber exhaust passage 164, and at least one of the upper chamber exhaust passage opening 424, the recess 530, and the upper chamber exhaust passage 426. The recess 530, the upper chamber exhaust passage opening 424, and the upper chamber exhaust passage 426 are arranged at an angle with respect to the lower chamber exhaust passage 164, as will be described with reference to FIGS. 4D, 4E, and 5B. The recess 530 and the upper chamber exhaust passage opening 424 are additionally arranged above the lower chamber exhaust passage 164. The lower chamber exhaust passage 164 is configured to remove exhaust gas from the lower chamber 113, and the upper chamber exhaust passage opening 424 is configured to remove exhaust gas from the upper chamber 111.

[0057] FIG. 4C is a schematic cross-sectional view of the base ring 114. The base ring 114 includes a base ring body 402, and an opening 410 is disposed through the base ring body 402. The opening 410 forms at least a part of the processing space 110 of the entire processing chamber 100. The opening 410 is dimensioned to be able to receive the substrate and the susceptor assembly 124 therein. The opening 410 is formed by the inner wall 404 of the base ring 114. The opening 410 extends from the upper surface 412 of the base ring 114 to the bottom surface 414 of the base ring 114.

[0058] The base ring body 402 is the body of the base ring 114 and is formed of a metallic material such as steel, aluminum, copper, nickel, or a metal alloy. In some embodiments, the base ring body 402 can be a silicon carbide material or a doped silicon carbide material.

[0059] As described above, the substrate transfer passage 162 is disposed opposite to one or more upper chamber exhaust passages 424 and a lower chamber exhaust passage 164. The substrate transfer passage 162 is disposed through the first side surface 406 of the base ring 114, and the one or more upper chamber exhaust passage openings 424 and the lower chamber exhaust passage 164 are formed through the second side surface 408 of the base ring 114. The first side surface 406 of the base ring 114 is disposed on one side of a plane C (FIG. 4E) disposed through the base ring 114, and the second side surface 408 of the base ring 114 is disposed on the opposite side of the plane C from the first side surface 406. The plane C passes through the central axis A and is perpendicular to the plane B. The plane C separates the substrate transfer passage 162 from the lower chamber exhaust passage 164 and the upper chamber exhaust passage openings 424. In the embodiments described herein, two upper chamber exhaust passage openings 424 are formed through the upper surface 412 of the base ring 114 (FIG. 4D). The two upper chamber exhaust passage openings 424 face the substrate transfer passage 162 but are offset from directly opposite the substrate transfer passage 162. The two upper chamber exhaust passage openings 424 are offset to prevent gas from collecting inwardly when gas flows across the processing space 110 from the gas injector 108 (FIG. 1). Instead, the gas flow remains more evenly distributed across the processing space, enabling more uniform deposition on the substrate 150. The two upper chamber exhaust passage openings 424 are disposed inside the seal groove 416.

[0060] The substrate transfer path 162 has a height H1 of about 7 mm to about 30 mm, for example about 10 mm to about 20 mm, so that the substrate 150 and a transfer arm (not shown) can be arranged therethrough. The substrate transfer path 162 further has a width W1 (FIG. 4E) of about 305 mm to about 350 mm, for example about 305 mm to about 315 mm. The width W1 enables the substrate 150 to be placed thereon through the susceptor assembly 124.

[0061] Referring further to FIG. 1, the lower chamber exhaust passage 164 is disposed on the opposite side of the substrate transfer path 162 to fluidly connect the lower chamber exhaust passage 164 to an exhaust pump (not shown). The exhaust pump is also coupled to and can be in fluid communication with two upper chamber exhaust passage openings 424. In the present specification, the lower chamber exhaust passage 164 is a cylindrical passage or an elliptical passage. The lower chamber exhaust passage 164 has a height H2 of about 0 mm to about 75 mm, for example about 25 mm to about 50 mm. The height H2 of the lower chamber exhaust passage 164 is configured such that an appropriate lower chamber gas flow can pass therethrough together with a lift arm assembly as shown in FIG. 10A.

[0062] Continuing to refer to FIG. 4C, a seal groove 416 is disposed on the upper surface 412 of the base ring body 402. The seal groove 416 surrounds the inner wall 404 and is configured to accommodate a seal ring such as an O-ring or other sealing gasket. The seal ring disposed in the seal groove 416 can be a polymer or plastic having a hardness higher than 50 durometers on the Shore A scale, for example higher than 60 durometers, for example higher than about 65 durometers. The seal groove 416 is dimensioned to accommodate a seal ring that forms a seal between the base ring 114 and the injection ring 116 as shown in FIG. 1. The seal groove 416 is disposed radially outside the upper chamber exhaust passage opening 424 to prevent the exhaust gas flowing through the upper chamber exhaust passage opening 424 from leaking out of the processing chamber 100.

[0063] The upper surface 412 optionally includes a support step portion 440. The support step portion 440 is a recess formed between the upper surface 412 and the inner wall 404. The support step portion 440 is configured to support the flange 160 (FIG. 1). The flange 160 is configured to be at least partially disposed within the support step portion 440 of the base ring 114 and the injection ring 116 to hold the flange 160 in a predetermined position.

[0064] The bottom surface 414 of the base ring body 402 includes a first seal groove 418 and a second seal groove 420. The first seal groove 418 and the second seal groove 420 are concentric and surround the inner wall 404 along the bottom surface 414. The first seal groove 418 is disposed further outward from the axis A than the second seal groove 420 such that the first seal groove 418 surrounds the second seal groove 420. Each of the first seal groove 418 and the second seal groove 420 is configured to receive a seal ring such as an O-ring or other sealing gasket. The seal rings disposed within the first seal groove 418 and the second seal groove 420 can be a polymer or plastic having a hardness higher than 50 durometers on the Shore A scale, for example higher than 60 durometers, for example higher than about 65 durometers. The first seal groove 418 and the second seal groove 420 are dimensioned to receive the seal rings and enable the formation of a seal between the base ring 114 and the peripheral support portion 170 of the lower window 120 as shown in FIG. 1.

[0065] Figure 4D is a schematic plan view of the base ring 114 of FIG. 4C. As shown in FIG. 4D, the upper surface 412 has one or more upper chamber exhaust passage openings 424 disposed therethrough. The one or more upper chamber exhaust passage openings 424 are disposed between the inner wall 404 and the seal groove 416. The one or more upper chamber exhaust passage openings 424 are in fluid communication with a portion of the upper liner 156 and the injection ring 116 to remove process gas from the upper portion of the processing space 110. Each of the one or more upper chamber exhaust passage openings 424 is in fluid communication with an exhaust module 422 via an upper chamber exhaust passage 426. The upper chamber exhaust passage 426 is a passage disposed through the base ring body 402 (FIG. 4E). The upper chamber exhaust passage 426 fluidly couples one of the exhaust modules 422 to one of the upper chamber exhaust passage openings 424. As shown in FIG. 4D, two exhaust modules 422 are attached to the second side surface 408 of the base ring body 402. Each of the two exhaust modules 422 is disposed on both sides of the lower chamber exhaust passage 164, whereby each of the exhaust modules 422 is disposed on both sides of and is mirror-imaged across the plane B. The plane B passes through the central axis A, the center of the substrate transfer passage 162, and the lower chamber exhaust passage 164 (FIG. 4E). The plane B is a vertically oriented plane that divides the base ring 114 in half such that the base ring 114 is mirror-imaged across the plane B. The same plane B is utilized with reference to the injection ring as shown in FIG. 5B.

[0066] Each of the one or more upper chamber exhaust passage openings 424 has a width W2 of about 10 mm to about 220 mm, such as about 20 mm to about 150 mm. By the respective width W2 of the one or more upper chamber exhaust passage openings 424, it is possible to remove exhaust gas from within the processing space 110 while reducing the turbulence of the gas flow within the processing space 110.

[0067] Each of the upper chamber exhaust passage openings 424 is disposed between a first exhaust angle α and a second exhaust angle β with respect to plane B. The first exhaust angle α is an angle of about 5 degrees to about 45 degrees with respect to plane B, for example an angle of about 10 degrees to about 30 degrees with respect to plane B, for example an angle of about 10 degrees to about 25 degrees with respect to plane B. The first exhaust angle α is large enough to prevent the upper chamber exhaust passage 426 from intersecting the lower chamber exhaust passage 164.

[0068] The second exhaust angle β is an angle of about 30 degrees to about 70 degrees, for example an angle of about 35 degrees to about 65 degrees, for example an angle of about 45 degrees to about 60 degrees. The second exhaust angle β is large enough to capture the gas directed across the opening 410 by one or more gas injectors 108, wherein the gas path does not substantially bend inwardly towards plane B. The difference between the first exhaust angle α and the second exhaust angle β is about 25 degrees to about 60 degrees, for example about 30 degrees to about 50 degrees. The difference between the first exhaust angle α and the second exhaust angle β enables the upper chamber exhaust passage opening 424 to be disposed around the desired circumference of the opening 410, and the difference is the amount of the base ring 114 around which the upper chamber exhaust passage opening 424 extends.

[0069] FIG. 4E is a plan view with a schematic cross section taken along cutting line 4E-4E of the base ring 114 of FIG. 4C. As shown in FIG. 4E, each of the upper chamber exhaust passages 426 is fluidly coupled to an exhaust module passage 428 disposed through each of the exhaust modules 422. The exhaust module passage 428 is in fluid communication with the upper chamber exhaust passage opening 424 via the upper chamber exhaust passage 426. The exhaust module passage 428 narrows as the exhaust module passage 428 extends further from the base ring body 402, and finally, the exhaust module passage 428 connects to the exhaust outlet 430. The exhaust outlet 430 is an opening formed through the wall of the exhaust module passage 428 and is configured to be coupled to an exhaust conduit (not shown) for removing exhaust gas from the processing chamber 100. Similar to the upper chamber exhaust passage opening 424, the upper chamber exhaust passage 426 is disposed between a first exhaust angle α and a second exhaust angle β with respect to plane B.

[0070] FIG. 5A is a schematic cross-sectional view of an injection ring 116 according to an embodiment of the present disclosure. The injection ring 116 is seated on the base ring 114 and is configured to supply a process gas to the processing space 110. The injection ring 116 is a separate component from the base ring 114. The injection ring 116 is configured to inject gas across the surface of the substrate such that the main flow of gas through the processing space 110 is horizontal. The separable injection ring 116 allows the injection ring 116 to be easily replaced and maintained without replacing or removing the entire chamber body assembly 106. This reduces the replacement cost and enables new gas injection improvements to be more easily realized in the processing chamber 100 while minimizing the impact on other chamber components.

[0071] The injection ring 116 includes an inner surface 504 and an outer surface 506. The inner surface 504 forms a ring around an opening 510 disposed within the injection ring 116. The opening 510 forms at least a portion of the processing space 110 of the processing chamber 100. The injection ring 116 has one or more gas injectors 108 disposed therethrough. The one or more gas injectors 108 extend from an injector support surface 514 through the injection ring body 502 to the inner surface 504. The one or more gas injectors 108 described herein are disposed through one or more injector passages 508. Each injector passage 508 is dimensioned to receive one of the one or more gas injectors 108, e.g., one of the gas injectors 108. The injector passage 508 extends from the injector support surface 514 to the inner surface 504. As the injector passage 508 moves from the injector support surface 514 to the inner surface 504, the injector passage 508 extends downward. Extending downward is defined as being disposed such that as the injector passage 508 moves radially inwardly toward the inner surface 504, the injector passage 508 moves away from the upper surface 518 of the injection ring 116 and closer to the bottom surface 524 of the injection ring 116.

[0072] The inner surface 504 includes a groove 536 disposed around a majority of the outer periphery of the inner surface 504, the groove 536 being disposed, for example, at a rate greater than 50% of the outer periphery of the inner surface 504, e.g., greater than 60% of the outer periphery of the inner surface 504, e.g., greater than 70% of the outer periphery of the inner surface 504. The groove 536 is configured to receive a heating element such as the upper heating element 158. The groove 536 is shown in FIG. 5A as being formed as a portion of the inner surface 504 and the bottom surface 524 of the injection ring 116. Two recesses 530 are also disposed in the inner surface 504. The two recesses 530 are disposed opposite the injector passage 508. The recesses 530 are disposed within the extent of the groove 536 and extend deeper into the injection ring body 502 than the groove 536, whereby the recesses 530 extend further from the axis A than the groove 536.

[0073] The injector support surface 514, together with the outer step surface 516, is part of the outer surface 506 of the injection ring body 502. The injector support surface 514 is configured to hold one or more gas injectors 108 in a predetermined position by providing a surface for fixing a portion of the one or more gas injectors 108. One or more gas outlets 178 are disposed through the inner surface 504 and are angled downwardly toward a substrate 150 disposed within the processing space 110 (FIG. 1).

[0074] The bottom surface 524 of the injection ring 116 is configured to contact the upper surface 412 of the base ring 114. The bottom surface 524 is a planar surface extending between the outer surface 506 and the inner surface 504. The outer step surface 516 extends from the outermost portion of the outer surface 506 to the lower distal end of the injector support surface 514. The injector support surface 506 extends from the outer step surface 516 away from the bottom surface 524. The injector support surface 514 is disposed at an angle with respect to the bottom surface 524. The angle of the injector support surface 514 depends at least in part on the desired downward angle of the injector passage 508 and the one or more gas injectors 108. In the embodiments described herein, the angle of the injector support surface 514 with respect to the bottom surface 524 is greater than about 45 degrees, for example about 45 degrees to about 85 degrees, for example about 60 degrees to about 80 degrees, for example about 70 degrees to about 80 degrees. The injector support surface 514 extends radially inwardly from the outer step surface 516, whereby the distal end of the injector support surface 514 furthest from the outer step surface 516 is closer to the inner surface 504.

[0075] The upper surface 518 of the injection ring 116 extends radially inwardly from the upper distal end of the injector support surface 514. The upper surface 518 is a horizontal surface, whereby the upper surface 518 extends parallel to the bottom surface 524. The distal end of the upper surface 518 on the side opposite the injector support surface 514 is connected to the window support groove 512. The window support groove 512 is a channel disposed along the upper surface of the injection ring 116. The window support groove 512 is configured to receive the peripheral support portion 172 of the upper window 122 therein. The window support groove 512 includes a first window seal groove 520 and a second window seal groove 522. Each of the first seal window groove 520 and the second seal window groove 522 is configured to receive a seal ring such as an O-ring or other sealing gasket. The seal rings disposed within the first window seal groove 520 and the second window seal groove 522 can be a polymer or plastic having a hardness higher than 50 durometers on the Shore A scale, for example higher than 60 durometers, for example higher than about 65 durometers. The first window seal groove 520 and the second window seal groove 522 are dimensioned to receive the seal ring and are configured to form a seal between the injection ring 116 and the upper window 122 as shown in FIG. 1.

[0076] The inner portion of the window support groove 512 is formed by the angled protrusion 511. The angled protrusion 511 is disposed inward of the first window seal groove 520 and the second window seal groove 522. The angled protrusion 511 extends upward from the window support groove 512 so as to be away from the bottom surface 508. The angled protrusion 511 forms a portion of the window support groove 512 disposed at the innermost side of the angled protrusion 511 and a portion of the inner surface 504 disposed at the outermost side of the angled protrusion 511. The angled protrusion 511 extends radially inward while extending upward from the window support groove 512. The angled protrusion 511 shields a part of the upper window 122, such as the peripheral support portion 172, from the processing space 110 (FIG. 1). By shielding the peripheral support portion 172 from the processing space 110, the heating load on the peripheral support portion 172 and the seals within the first window seal groove 520 and the second window seal groove 522 is reduced. In addition, the angled protrusion 511 protects the seal ring disposed within the support groove 512 from being directly exposed to radiant energy or process gas, and thus improves the lift (lifting force) and reliability of the seal ring.

[0077] The coolant passage 521 is optionally disposed through the injection ring body 502. The coolant passage 521 is configured to receive a cooling fluid such as water or oil. The coolant passage 521 is a partial ring disposed through the injection ring body 502 and assists in temperature control of both the injection ring 116 and the base ring 114.

[0078] FIG. 5B is a schematic plan view of the injection ring 116 of FIG. 5A having a plurality of gas injectors 108. In FIG. 5B, five gas injectors 108 are shown. Other quantities of gas injectors 108 are also contemplated, for example, three or more gas injectors 108, four or more gas injectors 108, five or more gas injectors 108, or six or more gas injectors 108 are also contemplated. The number of gas injectors 108 determines the number of zones for injecting process gas into the processing space 110 (FIG. 1). The group of gas injectors 108 is arranged about plane B. Plane B is the same plane as plane B passing through the base ring 114. Plane B is arranged through the central axis A and is orthogonal to plane D. Inside each gas injector 108, a plurality of individual process gas passages (not shown) may be arranged. In an embodiment where five gas injectors 108 are utilized, the central gas injector 532a forms an inner gas injection zone, the two outermost gas injectors 532c form an outer gas injection zone, and the two intermediate gas injectors 532b between the central gas injector 532a and the outermost gas injector 532c form an intermediate gas injection zone. Plane B is arranged through the central gas injector 532a. The two intermediate gas injectors 532b are mirror images across plane B. Similarly, the two outermost gas injectors 532c are mirror images across plane B. Each injector passage 508 has a gas injector 108 arranged therethrough. The number of injector passages 508 is equal to the number of injectors 108.

[0079] Each injector passage 508 has an injector passage width W3. The injector passage widths W3 of each injector passage 508 are shown to be the same. In an alternative embodiment, the injector passage width W3 varies as the injector passage 508 extends outward from the central gas injector 532a to the outermost gas injector 532c. In some embodiments, the injector passage width W3 of the injector passage 508 in which the outermost gas injector 532c extends is larger than the injector passage width W3 of the injector passage 508 in which the intermediate gas injector 532b extends. The injector passage 508 in which the intermediate gas injector 532b extends has an injector passage width W3 that is larger than the injector passage width W3 of the injector passage 508 in which the central gas injector 532a extends.

[0080] Alternatively, the injector passage width W3 decreases as the injector passage 508 extends outward from the injector passage 508 in which the central gas injector 532a is disposed. In this embodiment, the injector passage width W3 of the injector passage 508 in which the outermost gas injector 532c extends is smaller than the injector passage width W3 of the injector passage 508 in which the intermediate gas injector 532b extends. The injector passage width W3 of the injector passage 508 in which the intermediate gas injector 532b extends is smaller than the injector passage width W3 of the injector passage 508 in which the central gas injector 532a extends.

[0081] Each of the injector passages 508 is arranged at an injector angle γ with respect to plane B. The injector angle γ is obtained with respect to plane B, while on the opposite side of plane D, it is obtained with respect to the first exhaust angle α and the second exhaust angle β. The injector angle γ is less than about 70 degrees from plane B, for example less than about 65 degrees from plane B, for example less than about 60 degrees from plane B. The injector angle γ is configured to be within a range of 10 degrees from the second exhaust angle β, whereby the difference between the injector angle γ and the second exhaust angle β is from about -10 degrees to about 10 degrees, for example, from about -5 degrees to about 5 degrees, for example about 0 degrees. The injector angle γ and the second exhaust angle β are similar in that they reduce the deflection of the gas injected into the processing space 110 by the gas injector 108 while the gas is being exhausted. Gas deflection may cause non-uniformity during film deposition.

[0082] The injection ring 116 includes a recess 530 in the inner surface 504 facing the injector passage 508. The recess 530 corresponds to one or more upper chamber exhaust passage openings 424 (FIG. 4D). The recess 530 is disposed above one or more upper chamber exhaust passage openings 424, whereby the recess 530 functions as a first portion of one or more upper chamber exhaust passages 426 of the base ring 114 (FIG. 4A). In the embodiments described herein, there are two recesses 530 corresponding to two upper chamber exhaust passages 426. The two recesses 530 are disposed on the opposite side of the opening 510 from the injector passage 508. The two recesses 530 are disposed on one side of plane D passing through the injection ring 116, and the injector passage 508 is disposed on the opposite side of plane D. The two recesses 530 are offset from the center of the injection ring 116 on the opposite side of the injector passage 508 where the central gas injector 532a is disposed. Neither of the recesses 530 is disposed through plane B. The recesses 530 are mirror images across plane B. As described above, by offsetting the two recesses 530, when the gas flows from the gas injector 108 (FIG. 1) across the processing space 110 to the upper chamber exhaust passage 426, the gas is prevented from gathering inward.

[0083] In this specification, the recess 530 has the same size and shape as one or more upper chamber exhaust passage openings 424. Each of the recesses 530 has a width W4 of from about 0 mm to about 220 mm, for example from about 10 mm to about 150 mm. The width W4 corresponds to the width W2 (FIG. 4D) of the upper chamber exhaust passage opening 424. The width W4 is configured to reduce the turbulence of the gas flow within the processing space 110, enabling mainly a laminar gas flow and uniform deposition onto the substrate 150. Similar to the upper chamber exhaust passage opening 424, the recess 530 is disposed between a first exhaust angle α and a second exhaust angle β with respect to the plane B.

[0084] The injection ring body 502 forms the injection ring 116 and is made of a metallic material such as steel, aluminum, copper, nickel, or a metal alloy. In some embodiments, the injection ring body 502 can be made from a silicon carbide material or a doped silicon carbide material.

[0085] FIG. 6A is a schematic cross-sectional view of the upper liner 156 used within the processing chamber 100 of FIG. 1. The upper liner 156 is configured to be disposed inside the opening 510 of the injection ring 116 (FIG. 5A). The upper liner 156 is ring-shaped. The upper liner 156 is configured to separate the inner surface 504 of the injection ring 116 from the processing space 110. The upper liner 156 serves to shield the inner surface 504 of the injection ring 116 from the process gas within the processing space 110, and further protect the processing space 110 from particles or other contaminants emitted by the injection ring 116 and the upper heater 158.

[0086] The upper liner 156 has an outer surface 602 and an inner surface 604. The inner surface 604 forms an opening 610 disposed therethrough. The opening 610 is configured such that the substrate 150 can be disposed therein during the processing step. The opening 610 forms at least a part of the processing space 110. While disposed within the processing chamber 100, the inner surface 604 of the upper liner 156 is disposed about the axis A.

[0087] One or more liner injection openings 614 are disposed through the upper liner 156. The one or more liner injection openings 614 are disposed from the outer surface 602 to the inner surface 604. The one or more liner injection openings 614 are configured to be aligned with the injector passage 508 of the injection ring 116 (FIG. 5B) along one side of the upper liner 156. The liner injection opening 614 is disposed on the first side of the plane E. The plane E is orthogonal to the plane B and passes through the central axis A. The plane E is aligned with the plane C and the plane D when the injection ring 116, the base ring 114, and the upper liner 156 are each disposed within the processing chamber 100. In the embodiments described herein, there are five liner injection openings 614. Each of the liner injection openings 614 is configured to conform to the periphery of a portion of the gas injector 108 that protrudes outward from the inner surface of the injection ring 116. Other quantities of liner injection openings 614 are also contemplated, such as three or more liner injection openings 614, four or more liner injection openings 614, five or more liner injection openings 614, or six or more liner injection openings 614. The number of liner injection openings 614 determines the number of zones for injecting process gas into the processing space 110 (FIG. 1). The number of liner injection openings 614 is the same as the number of injector passages 508. Similar to the injector passage 508, the liner injection openings 614 are mirror images across the plane B. The liner injection openings 614 fit tightly around one end of each gas injector 108. By fitting tightly around the gas injector 108, leakage of process gas from the processing space 110 to the region surrounding the outer surface 602 is reduced.

[0088] One or more liner exhaust openings 616 are present opposite the liner injection opening 614. The one or more liner exhaust openings 616 are located on the side opposite to the plane E from the liner injection opening 614. The one or more liner exhaust openings 616 are arranged from the outer surface 602 to the inner surface 604. The one or more liner exhaust openings 616 are configured to be aligned with the recess 530 of the injection ring 116. The one or more liner exhaust openings 616 are elongated openings and extend around a part of the outer periphery of the upper liner 156. The one or more liner exhaust openings 616 include two liner exhaust openings 616 as shown in FIG. 6B, whereby there are two liner exhaust openings 616. Similar to the recess 530, each of the two liner exhaust openings 616 is arranged on both sides of the plane B with respect to each other.

[0089] Both the one or more liner injection openings 614 and the one or more liner exhaust openings 616 are arranged on the central liner ring 615. While the upper liner 156 is arranged in the processing chamber 100, at least the central liner ring 615 is arranged around the axis A. The central liner ring 615 is arranged between the liner support ring 606 and the upper outwardly extending surface 608.

[0090] The liner support ring 606 forms the bottom surface 620 of the upper liner 156. The liner support ring 606 is a ring attached to the lower distal end of the central liner ring 615. The liner support ring 606 is a horizontally oriented ring, and the bottom surface 620 is a horizontally oriented surface. The width of the liner support ring 606 varies across the outer periphery of the liner support ring 606. The liner support ring 606 extends radially inward from the inner surface 604 of the central liner ring 615 around the entire circumference of the liner support ring 606. The liner support ring 606 spreads along the side of the upper liner 156 in the vicinity of the liner exhaust opening 616 so as to include a downwardly outwardly extending portion 618. The downwardly outwardly extending portion 618 extends outward from the portion of the outer surface 602 corresponding to the central liner ring 615.

[0091] The downward outward extending portion 618 serves to assist in supporting the upper liner 156 and also assists in aligning the upper liner 156 and the lower liner 154. Although the downward outward extending portion 618 extends only around a part of the liner support ring 606, the downward outward extending portion 618 enables the upper liner 156 to be fitted into the groove that supports the upper liner 156. The downward outward extending portion 618 is not disposed around the portion of the liner support ring 606 disposed directly below any of the liner injection openings 614. By not extending around the liner support ring 606 corresponding to the liner injection opening 614, the upper liner 156 can be more easily disposed to each of the one or more gas injectors 108 and can be fitted around each of the one or more gas injectors 108.

[0092] In the outer peripheral portion where the downward outward extending portion 618 does not exist, the upward outward extending surface 608 extends radially outward from the upper distal end of the central liner ring 615 to a position near the inner surface 504 of the injection ring 116. In the embodiments described herein, the upward outward extending surface 608 extends radially outward from the central liner ring 615, similar to the downward outward extending portion 618. The upward outward extending portion 608 can further serve to support the upper liner 156. The upward outward extending portion 608 is disposed above the liner injection opening 614. The downward outward extending portion 618 and the upward extending portion 608 are connected by a connection surface 622 (FIG. 6B). The connection surface 622 is a surface that extends outward from the central liner ring 615, joining the upward outward extending portion 608 and the downward outward extending portion 618 to form a continuous outward extending portion. The continuous outward extending portion extends over the entire circumference of the upper liner 156. The connection surface 622 extends outward from the central liner ring 615 at a radial distance similar to both the downward outward extending portion 618 and the upward outward extending surface 608. In the embodiments herein, the connection surface 622 is a vertical surface, although it is also envisioned that the connection surface 622 can be disposed at an angle with respect to the horizontal other than 90 degrees.

[0093] The liner flange 612 is disposed on top of the central liner 615. The liner flange 615 is angled with respect to the central liner 615. The liner flange 612 is disposed at the upper distal end of the central liner 615 and extends radially inwardly from the inner surface 604 of the central liner 615. The liner flange 612 extends upwardly away from the bottom surface 620. The liner flange 612 is disposed at an angle θ with respect to a plane passing through the vertical inner surface 604 and / or the vertical outer surface 602 of the central liner 615. The angle θ is from about 15 degrees to about 75 degrees, for example from about 30 degrees to about 60 degrees. The liner flange 612 is adapted to correspond to the angled protrusion 511 of the injection ring 116. The liner flange 612 separates the angled protrusion 511 from the treatment region 110.

[0094] FIG. 6B is a schematic plan view of the upper liner 156 of FIG. 6A. As shown, the upper liner 156 includes five liner injection openings 614. Other quantities of liner injection openings 614 are contemplated, such as three or more liner injection openings 614, four or more liner injection openings 614, five or more liner injection openings 614, or six or more liner injection openings 614. The liner injection openings 614 are arranged in a manner similar to the injector passage 508 of FIGS. 5A - 5B. Two liner exhaust openings 616 are disposed opposite the liner injection openings 614 and are offset from the direct center of the liner injection openings 614. Each of the liner exhaust openings 616 is configured to be aligned with the recess 530 such that the liner exhaust openings 616 are disposed in the vicinity of a portion of the outer periphery of the injection ring 116 similar to the recess 530. Similar to the recess 530, the liner exhaust openings 616 are disposed between a first exhaust angle α and a second exhaust angle β with respect to plane B. The liner injection openings 614 are arranged at an injector angle γ with respect to plane B in a manner similar to the injector passage 508.

[0095] Each of the liner injection openings 614 has a width W5 of about 10 mm to about 100 mm, for example about 50 mm to about 80 mm. The width W5 is selected to enable placement of a portion of the gas injector 108 within the liner injection opening 614. Each of the liner exhaust openings 616 has a width W6 of about 0 mm to about 220 mm, for example about 25 mm to about 100 mm. The width W6 and offset of the liner exhaust openings 616 are configured to reduce turbulence of the gas flow within the processing space 110. By reducing the turbulence of the gas flow, a major laminar gas flow within the processing space 110 is promoted, contributing to uniform deposition on the substrate 150.

[0096] FIG. 7 is a schematic cross-sectional view of a lower liner 154 according to an embodiment of the present disclosure. The lower liner 154 is configured to be disposed inside the opening 410 of the base ring 114 (FIG. 5D). The lower liner 154 has a ring shape and has a lower liner body 702. The lower liner 154 is configured to separate the inner surface 404 of the base ring 114 from the processing space 110. The upper liner 156 protects the inner surface 404 of the base ring 114 from the process gas within the processing space 110 and further protects the processing space 110 from particles or other contaminants emitted by the base ring 114 and the lower heater 152.

[0097] The lower liner 154 has an outer surface 706 and an inner surface 704. The inner surface 704 forms an opening 716 disposed therethrough. The opening 716 is configured to enable placement of a substrate therein during a processing step. The opening 716 forms at least a portion of the processing space 110. While disposed within the processing chamber 100, the inner surface 704 of the lower liner 154 is disposed about an axis A.

[0098] The lower liner 154 includes a support flange 708 and a suspension liner portion 710. The suspension liner portion 710 is coupled to the support flange 708 at its upper distal end. The suspension liner portion 710 forms a vertical curtain for protecting the inner wall 404 of the base ring 114 and the lower heater 152 from process gases within the processing space 110. The suspension liner portion 710 is configured to extend downward parallel to the inner wall 404 of the base ring 114 and radially inward of the lower heater 152. The support flange 708 extends radially outward from the suspension liner portion 710, for example, away from the outer surface 706 and radially outward.

[0099] The lower liner 154 further includes a liner substrate opening 712. The liner substrate opening 712 corresponds to the substrate transfer passage 162 and is similar in size and shape to the substrate transfer passage 162. The liner substrate opening 712 is aligned with the substrate transfer passage 162 such that a substrate passing through the substrate transfer passage 162 also passes through the liner substrate opening 712. The liner substrate opening 712 extends from the outer surface 706 to the inner surface 704 and penetrates the suspension liner portion 710. The liner substrate opening 712 is similar in size and shape to the substrate transfer passage 162.

[0100] A lower exhaust liner opening 714 is disposed opposite the liner substrate opening 712. The lower exhaust liner opening 714 corresponds to the lower chamber exhaust passage 164 (FIG. 1). The lower exhaust liner opening 714 is a circular or elliptical opening formed by penetrating the suspension liner portion 710 from the outer surface 706 to the inner surface 704. The lower exhaust liner opening 714 is similar in size and shape to the lower chamber exhaust passage 164.

[0101] FIG. 8A is a schematic cross-sectional view of a lower heater 152 according to an embodiment of the present disclosure. The lower heater 152 is coupled to a flange 160 and includes a resistive heating element 802. Other types of heaters are also conceivable. The lower heater 152 reduces heat loss to the walls of the processing chamber 100. In particular, the lower heater 152 is configured to compensate for heat loss from the processing space 110 to the inner wall 404 (FIG. 4C) of the base ring 114. By compensating for the heat lost at the inner wall 404, the temperature of the processing space 110 can be more easily maintained at a desired temperature.

[0102] The lower heater 152 includes a substrate passage opening 804 disposed through the resistive heating element 802. The substrate passage opening 804 is configured to be aligned with the substrate transfer passage 162. The substrate passage opening 804 is sized to allow a substrate such as the substrate 150 of FIG. 1 to pass through. The width W8 of the substrate passage opening 804 is from about 305 mm to about 350 mm, for example from about 305 mm to about 315 mm (FIG. 8B).

[0103] The resistive heating element 802 is arranged in a serpentine configuration, whereby the resistive heating element 802 includes a plurality of turns and bends. The resistive heating element 802 includes vertical portions 811 arranged parallel to each other and horizontal portions 812 arranged parallel to each other. Each of the vertical portions 811 is connected to an adjacent vertical portion 811 by one of the horizontal portions 812. Current from a power source (not shown) flows through the coil of the resistive heating element 802 to resistively heat the resistive heating element 802.

[0104] The resistive heating element 802 is a carbon-based material, whereby the resistivity of the coil material is from about 500 μΩ·cm to about 1500 μΩ·cm, for example from about 750 μΩ·cm to about 1250 μΩ·cm. In some embodiments, the resistive heating element 802 is formed of a graphite material. Other materials for forming the resistive heating element 802 include paralytic graphite and silicon carbide. Paralytic graphite and silicon carbide may include alternative resistivity ranges. A gap 808 is formed between each of the adjacent vertical portions 811. The gap 808 enables thermal expansion of the resistive heating element 802 and may also enable purge gas or other gases to pass therethrough. The gap 808 may be larger along the side of the resistive heating element 802 facing the substrate passage opening 804 to enable exhaust gases such as exhaust gas to pass through. Alternatively, an opening or cut in the resistive heating element 802 is disposed in the vicinity of the lower chamber exhaust passage 164. The exhaust gas will pass through the gap 808 and into the lower chamber exhaust passage 164 (FIG. 1).

[0105] The resistive heating element 802 has a curved shape or a hollow cylindrical shape and is disposed between the lower liner 154 and the inner wall 404 of the base ring 114. The resistive heating element 802 forms at least a partial ring. In the embodiments described herein, the resistive heating element 802 completely or partially surrounds the processing space 110 and the lower liner 154. Each coil 806 of the resistive heating element 802 includes two vertical portions 811 joined by a horizontal portion 812 at a first distal end of each vertical portion 811 and half of the horizontal portion 812 joined to the distal end opposite each vertical portion 811. A plurality of coils 806 are disposed within the resistive heating element 802.

[0106] FIG. 8B is a schematic plan view of the lower heater 152 of FIG. 8A. Due to the curvature of the lower heater 152, an opening 810 disposed inside the lower heater 152 is formed. A flange 160 is connected to the upper end of the lower heater 152 and extends radially outward from the lower heater 152. The flange 160 can be configured to connect to or fit within a groove or recess of the base body 114 of the injection ring 116. In some embodiments, the flange 160 can extend between the base body 114 and the injection ring 116. The flange 160 has a flat ring shape.

[0107] The resistive heating element 802 is electrically connected to a first electrical connection 806a and a second electrical connection 806b. The first electrical connection 806a and the second electrical connection 806b are located on the flange 160. The first electrical connection 806a and the second electrical connection 806b are configured to be connected to a power source. The first electrical connection 806a and the second electrical connection 806b can supply power to the resistive heating element 802, thereby controlling the temperature of the lower heater 152.

[0108] FIG. 9 is a schematic cross-sectional view of the susceptor assembly 124. The susceptor assembly 124 includes a susceptor 902, a support shaft 904, and a movement assembly 194. The susceptor 902 is connected to the upper distal end of the support shaft 904, and the movement assembly 194 is connected to the lower distal end of the support shaft 904. The susceptor assembly 124 is configured to hold the substrate 150 during processing of the substrate within the processing chamber 100 (FIG. 1). The susceptor assembly 124 is configured to support the substrate 150 while rotating, raising, or lowering it.

[0109] The susceptor 902 includes a substrate support surface 906, a bottom surface 908, an outer ledge 910 disposed radially outside the substrate support surface 906, and a shaft coupling portion 912 placed on the bottom surface 908. The susceptor 902 is formed of an optically transparent material to enable uniform heating of the substrate 150 by the lower lamp module 104. In some embodiments, the susceptor 902 is made of quartz or glass.

[0110] The substrate support surface 906 is a planar surface configured to accommodate the substrate 150. In some embodiments, the substrate support surface 906 includes features such as grooves or recesses to assist in uniformly heating the substrate 150. The outer ledge 910 surrounds the outer edge of the substrate support surface 906. The outer ledge 910 surrounds the substrate support surface 906 and is vertically offset downward from the substrate support surface 906. The outer ledge 910 is configured to support a covering or cover plate (not shown).

[0111] The bottom surface 908 of the susceptor 902 is disposed on the opposite side of the susceptor 902 from the substrate support surface 906. A shaft coupling portion 912 is coupled to the bottom surface 908 and extends downward. The shaft coupling portion 912 receives a part of the upper distal end 916 of the support shaft 904. In one embodiment, the susceptor 902 fits snugly on the support shaft 904 using the shaft coupling portion 912 in a low-temperature or room-temperature environment. Depending on the material and size of the shaft coupling portion 912, the shaft coupling portion 912 can form a strong connection on the support shaft 904 and fix the susceptor 902 to the shaft 904 at elevated temperatures such as those used during substrate processing. The support shaft 904 is generally linear in shape and extends between the susceptor 902 and the moving assembly 194. The support shaft 904 is dimensioned to generally cast a small shadow on the bottom surface of the susceptor 902 during substrate processing, thereby keeping the temperature difference small. The lower distal end 918 of the support shaft 904 is coupled to the moving assembly 194. As shown here, the lower distal end 918 of the support shaft 904 can be partially disposed within the moving assembly 194.

[0112] The moving assembly 194 includes a bearing feed-through assembly 928. The bearing feed-through assembly 928 is a ferromagnetic fluid feed-through assembly and functions as a ferromagnetic fluid bearing. The bearing feed-through assembly 928 includes a shaft 922 coupled to the support shaft 904. The shaft 922 is rotated within the bearing feed-through assembly 928. By using a ferromagnetic fluid feed-through assembly as the bearing feed-through assembly 928, the service life of the bearing feed-through assembly 928 is extended and friction is reduced compared to other types of bearing assemblies.

[0113] The bearing feed-through assembly 928 is combined with a first linear spline 924 and a second linear spline 926. Both the first linear spline 924 and the second linear spline 926 are connected to the shaft 922. The first linear spline 924 and the second linear spline 926 are at least partially disposed within the bearing feed-through assembly 928 and assist in controlling the vertical movement of the susceptor 902 and the support shaft 904. The first linear spline 924 and the second linear spline 926 are linear ball splines, but may be other types of linear bearings.

[0114] The bottom of the bearing feed-through assembly 928 and the shaft 922 are connected to the motor 914. The motor 914 can be a direct drive or other suitable motor. The motor 914 is configured to rotate or linearly displace the shaft 922. In some embodiments, the motor 914 is two separate motors, including one rotary motor for rotating the shaft 922 about its axis and one linear motor for axially displacing the shaft. In some embodiments, the motor 914 represents the rotary assembly 196 and the lift assembly 198 described in FIG. 1.

[0115] The bellows assembly 920 is coupled to both the support shaft 904 and the bearing feed-through assembly 928. The bellows assembly 920 surrounds at least a portion of the shaft 922 and enables maintaining a seal between the support shaft 904 and the bearing feed-through assembly 928 while the support shaft 904 and the susceptor 902 are raised and lowered by the motor 914.

[0116] FIG. 10A is another schematic cross-sectional view of the deposition chamber 100 of FIG. 1 according to an embodiment of the present disclosure, showing a lift arm assembly 1000. The lift arm assembly 1000 is disposed through a lower chamber exhaust passage 164 and is configured to raise or lower a substrate 150 from a susceptor 902 of the susceptor assembly 124. The lift arm assembly 1000 includes a plurality of lift pins 1012, 1014, 1016 that are configured to pass through the susceptor 902 and contact the substrate 150. The lift pins 1012, 1014, 1016 apply a force to the substrate 150 to lift the substrate 150 from the susceptor 902. When the substrate 150 is moved to the susceptor 902, the substrate 150 is placed on the lift pins 1012, 1014, 1016 in the raised position by a robot (not shown). To move the substrate 150 from the lift pins 1012, 1014, 1016, the lift pins 1012, 1014, 1016 are lowered.

[0117] The lift arm assembly 1000 includes an actuator assembly 1004, an arm assembly 1002, and lift pins 1012, 1014, 1016. Each lift pin 1012, 1014, 1016 is disposed on the arm assembly 1002. The arm assembly 1002 is disposed in the processing space 110 from the actuator assembly 1004 through the lower chamber exhaust passage 164. The arm assembly 1002 is disposed below the susceptor 902 (FIG. 9) of the susceptor assembly 124.

[0118] When the lift arm assembly 1000 is present, the arm opening 1005 is disposed through the lower liner 154 and the lower heater 152. The arm opening 1005 is dimensioned to allow the arm assembly 1002 of the lift arm assembly 1000 to pass through. In the embodiments described herein, the arm opening 1005 is disposed in the vicinity of the lower chamber exhaust passage 164 and includes the lower exhaust liner opening 714 (FIG. 7). In embodiments where the arm assembly 1002 is disposed through different openings at different angles, the arm opening 1005 is moved to correspond to the position of the arm assembly 1002. In the embodiments described herein, the arm assembly 1002 of the lift arm assembly 1000 is disposed through the lower chamber exhaust passage 164, and the purge system of the processing chamber 100 is simplified. When the arm assembly 1002 is disposed through a separate opening other than the lower chamber exhaust passage 164, the purge system of the processing chamber 100 can be correspondingly adjusted. Therefore, disposing the arm assembly 1002 through the lower chamber exhaust passage 164 is beneficial in reducing the complexity of the purge system of the processing chamber 100.

[0119] The actuator assembly 1004 includes an actuator 1006, an alignment sensor 1018, an arm rack 1008 configured to mesh and contact a part of the actuator 1006, and a bellows assembly 1010 disposed around a part of the arm rack 1008. The actuator assembly 1004 is disposed outside the chamber body assembly 106 and the processing space 110. In some embodiments, the actuator assembly 1004 is coupled to the outer surface of the chamber body assembly 106.

[0120] Figure 10B is a schematic plan view of the lift arm assembly 1000 of Figure 10A. The arm assembly 1002 includes a first arm 1020, a second arm 1022, and a third arm 1024. The first arm 1020 is disposed between the second arm 1022 and the third arm 1024. The first arm 1020 is shorter than the second arm 1022 or the third arm 1024. The second arm 1022 and the third arm 1024 are of the same length. Each of the first arm 1020, the second arm 1022, and the third arm 1024 is coupled to a base 1036. The distal end of the first arm 1020, which is the farthest from the base 1036, includes a first lift pin 1012. The distal end of the second arm 1022, which is the farthest from the base 1036, includes a second lift pin 1016. The distal end of the third arm 1024, which is the farthest from the base 1036, includes a third lift pin 1014.

[0121] Each of the first lift pin 1012, the second lift pin 1016, and the third lift pin 1014 extends upward from the first arm 1020, the second arm 1022, and the third arm 1024, respectively. Each of the first lift pin 1012, the second lift pin 1016, and the third lift pin 1014 is of a similar height and extends by a similar distance from the first arm 1020, the second arm 1022, and the third arm 1024. Each of the first lift pin 1012, the second lift pin 1016, and the third lift pin 1014 is oriented in a vertical direction, that is, parallel to the central axis A.

[0122] The base 1036 is disposed at the bottom of the actuator assembly 1004 and connects each of the first arm 1020, the second arm 1022, and the third arm 1024 to the actuator assembly 1004. Each of the first arm 1020, the second arm 1022, and the third arm 1024 extends from the surface 1038 of the base 1036 such that the first arm 1020, the second arm 1022, and the third arm 1024 are each disposed in a similar direction. In some embodiments, the first arm 1020 is disposed centrally between both the second arm 1022 and the third arm 1024. Both the second arm 1022 and the third arm 1024 extend at an angle θ2 with respect to the direction in which the first arm 1020 extends. The angle θ2 defined between the first arm 1020 and the second arm 1022 is between about 5 degrees and about 45 degrees, for example between about 10 degrees and about 35 degrees. The angle θ2 at which the second arm 1022 and the third arm 1024 extend with respect to the first arm 1020 is at least partially controlled by the width of the lower chamber exhaust passage 164 or other opening through which the arm assembly 1002 extends. In an alternative embodiment, the base 1036 extends through the lower chamber exhaust passage 164 and the arms 1020, 1022, 1024 extend outwardly from the base 1036 inside the processing space 110.

[0123] The arm rack 1008 is coupled to the arm assembly 1002 and extends above the arm assembly 1002. The arm rack 1008 couples the arm assembly 1002 to the actuator 1006. The actuator 1006 is configured to raise and lower the arm assembly 1002 using the arm rack 1008. The bellows assembly 1010 surrounds at least a portion of the arm rack 1008 and seals the arm rack 1008 and the actuator 1006 from the exhaust gas flowing through the lower chamber exhaust passage 164 to protect the arm rack 1008 and the actuator 1006.

[0124] Figure 10C is a schematic side view of the lift arm assembly 1000 of Figure 10A. The lift arm assembly 1000 shown in Figure 10C is viewed through the section line 10C-10C of Figure 10B. The alignment sensor 1018 and the actuator assembly 1004 are shown in Figure 10C.

[0125] The alignment sensor 1018 is shown coupled to the arm assembly 1002 in the vicinity of the actuator assembly 1004. The alignment sensor 1018 is configured to detect the position of one or more lift pin holes (not shown) disposed through the susceptor 902 (Figure 9). The alignment sensor 1018 is connected to one or more light pipes 1028. The light pipe 1028 extends from the alignment sensor 1018 through one of the arms 1020, 1022, 1024 of the arm assembly 1002. In the embodiment shown herein, the light pipe 1028 extends through the first arm 1020 into the first lift pin 1012. Alternatively, the light pipe 1028 extends through one of the second lift pin 1016 or the third lift pin 1014. The light pipe 1028 is directed upward and is exposed at one end of the first lift pin 1012. The light pipe 1028 is utilized to detect the presence of a surface above the upper portion of the first lift pin 1012. When the lift pin hole of the susceptor 902 rotates above the lift pin 1012, the alignment sensor 1018 detects a change in the intensity of light. Thus, the alignment sensor 1018 is used to detect when the arm assembly 1002 is aligned with the lift pin hole and the substrate 150. Thereafter, the rotation of the susceptor 902 is stopped (if necessary), whereby the pins 1012, 1014, 1016 are raised to extend through the susceptor 902, facilitating the movement of the substrate to and from the susceptor 902.

[0126] The actuator assembly 1004 includes an actuator 1006, an arm rack 1008, and a bellows assembly 1010. The actuator 1006 includes a motor 1032 and a pinion 1026 connected to the motor 1032. The pinion 1026 includes a first plurality of teeth and is configured to mesh with a second plurality of teeth 1036 of the arm rack 1008. By the meshing of the arm rack 1008 and the pinion 1026, the motor 1032 can impart linear motion to the arm rack 1008 and the arm assembly 1002.

[0127] The bellows assembly 1010 is disposed around the lower portion of the arm rack 1008 between a first plate 1030 and a second plate 1034. The first plate 1030 is disposed on the bellows assembly 1010 and is coupled to the body 1040 of the actuator 1006. The first plate 1030 is disposed around the arm rack 1008. The second plate 1034 is disposed at the bottom of the bellows assembly 1010 and is attached to the bottom surface of the arm rack 1008. The second plate 1034 is configured to connect the arm rack 1008 and the arm assembly 1002. In the embodiments described herein, the second plate 1034 is connected to the base 1036 of the arm assembly 1002. The bellows assembly 1010 is configured to seal the arm rack 1008 and the actuator 1006 from the exhaust gas while allowing vertical movement.

[0128] Other embodiments of the arm assembly 1002 are also envisioned. In some embodiments, Y-shaped arms are utilized. In yet other embodiments, there are more than three or fewer than three arms. In alternative embodiments, each of the first arm 1020, the second arm 1022, and the third arm 1024 may be of different lengths. In the embodiments described herein, the second arm 1022 and the third arm 1024 are arranged to be mirror images about the first arm 1020 to balance the arm assembly 1002 and reduce unwanted torque on the actuator 1006 or the bearing components.

[0129] The components described herein enable a higher degree of uniformity and deposition control within a processing chamber, such as the processing chamber 100. Although shown together within one processing chamber 100 herein, the components described herein can be utilized separately in existing or alternative deposition processing chambers.

[0130] The foregoing description is directed to embodiments of the present disclosure, but other and further embodiments of the present disclosure can be devised without departing from the basic scope thereof, and the scope of the present disclosure is defined by the following claims.

Claims

1. 1. A process chamber for processing a substrate, comprising: an upper lamp module; A lower lamp module; a substrate support disposed between the upper lamp module and the lower lamp module; an upper window disposed between the upper lamp module and the substrate support; a lower window disposed between the lower lamp module and the substrate support; a chamber body assembly disposed between the upper lamp module and the lower lamp module and defining a portion of a processing space, a substrate transfer passage disposed through the chamber body assembly; a lower chamber exhaust passage disposed through the chamber body assembly opposite the substrate transfer passage; one or more upper chamber exhaust passages, each of the one or more upper chamber exhaust passages having an upper chamber exhaust passage opening disposed above the lower chamber exhaust passage; and one or more injector passages disposed through the chamber body assembly above the substrate transfer passage; a chamber body assembly including: A process chamber for processing a substrate comprising:

2. 10. The processing chamber of claim 1, further comprising one or more gas injectors disposed within the one or more injector passages, wherein one or more gas outlets of each of the one or more gas injectors are disposed at an angle greater than about 5 degrees from horizontal.

3. 2. The processing chamber of claim 1, wherein the chamber body assembly includes an injection ring, the injection ring including the one or more injector passages and one or more recesses disposed between an injection ring inner surface and an injection ring bottom surface, the one or more recesses disposed above the one or more upper chamber exhaust passage openings and fluidly coupled to the one or more upper chamber exhaust passages.

4. The processing chamber of claim 1 , wherein the one or more upper chamber exhaust passages comprises two upper chamber exhaust passages.

5. The processing chamber of claim 4 , wherein the two upper chamber exhaust passages are disposed on either side of the lower chamber exhaust passage.

6. an upper liner disposed inwardly and adjacent to the injection ring; a lower liner disposed adjacent to and inwardly of the base ring; 2. The processing chamber of claim 1 , wherein the base ring is disposed below the injection ring and comprises the substrate transfer passageway, the lower chamber exhaust passageway, and the one or more upper chamber exhaust passageways.

7. The processing chamber of claim 6 , wherein a lower heater is disposed between the lower liner and the inner surface of the base ring.

8. an upper cooling ring disposed above the injection ring; a lower cooling ring disposed below the base ring; The processing chamber of claim 1 further comprising:

9. 1. A process chamber for processing a substrate, comprising:

1. An upper lamp module, comprising: an upper module body including a top surface and a bottom surface; and a plurality of lamp openings disposed from the bottom surface to the top surface; an upper lamp module including: A lower lamp module; a substrate support disposed between the upper lamp module and the lower lamp module; an upper window disposed between the upper lamp module and the substrate support; a lower window disposed between the lower lamp module and the substrate support; a chamber body assembly disposed between the upper lamp module and the lower lamp module and defining a portion of a processing space, a substrate transfer passage disposed through the chamber body assembly; one or more upper chamber exhaust passages disposed through the chamber body assembly; and one or more injector passages disposed through the chamber body assembly a chamber body assembly including: A process chamber for processing a substrate comprising:

10. The lower lamp module includes a lift arm assembly, the lift arm assembly comprising: an arm assembly disposed through the lower chamber exhaust passage; a plurality of lift pins coupled to the lift arm assembly; An alignment sensor; The processing chamber of claim 9 .

11. The processing chamber of claim 10 , wherein the substrate support further comprises a ferromagnetic bearing configured to enable rotation of the substrate support about an axis.

12. The processing chamber of claim 9 , wherein the upper lamp module further comprises a plurality of bulb openings disposed through the top surface.

13. 10. The processing chamber of claim 9, wherein each of the one or more upper chamber exhaust passages includes an upper chamber exhaust passage opening disposed around a portion of the outer periphery of the chamber body assembly, and each upper chamber exhaust passage extends about 25 degrees to about 60 degrees around the chamber body assembly.

14. 10. The processing chamber of claim 9, wherein the plurality of lamp openings are arranged in three distinct zones, each zone including between 5 and 10 lamp openings.

15. 10. The processing chamber of claim 9, wherein the chamber body assembly further comprises a lower chamber exhaust passage disposed through an inner and outer surface opposite the substrate transfer passage.

16. 16. The processing chamber of claim 15, wherein the one or more upper chamber exhaust passages include two upper chamber exhaust passages on either side of the lower chamber exhaust passage.

17. 1. A process chamber for processing a substrate, comprising:

1. An upper lamp module, comprising: an upper module body including a top surface and a bottom surface; and a plurality of lamp openings disposed from the bottom surface toward the top surface; an upper lamp module including: A lower lamp module; a substrate support disposed between the upper lamp module and the lower lamp module; an upper window disposed between the upper lamp module and the substrate support; a lower window disposed between the lower lamp module and the substrate support; a chamber body assembly disposed between the upper lamp module and the lower lamp module and defining a portion of a processing space, a substrate transfer passage disposed through the chamber body assembly; one or more upper chamber exhaust passages disposed through the chamber body assembly, each of the one or more upper chamber exhaust passages having an upper chamber exhaust passage opening in fluid communication with the processing space; a lower chamber exhaust passage disposed through the chamber body assembly below an opening of the upper chamber exhaust passage; and one or more injector passages disposed above the substrate transfer passage a chamber body assembly including: A process chamber for processing a substrate comprising:

18. 20. The processing chamber of claim 17, wherein a lift arm assembly is disposed through the lower chamber exhaust passage and includes a plurality of arms disposed within the processing space.

19. 20. The processing chamber of claim 18, wherein the lift arm assembly further comprises: a lift pin extending upwardly from each arm of the plurality of arms; and an alignment sensor connected to one of the lift pins and configured to detect a lift pin hole in the substrate support.

20. the chamber body assembly comprising: Base ring and Injection ring and Including, 20. The processing chamber of claim 17, wherein the substrate transfer passage, the one or more upper chamber exhaust passages, and the lower chamber exhaust passage are disposed through the base ring, and the one or more injector passages are disposed through the injection ring.

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