Substrate gripping device

Abstract

To provide a substrate gripping device capable of surely gripping a substrate regardless of thickness and a warped shape of the substrate.SOLUTION: A substrate gripping device includes: a support member 2 having a follower pin 40 and a substrate support surface 41; a movable rod 5 movable relative to the support member 2; and a chuck 7 for gripping an edge of a substrate W. The chuck 7 has a guide long hole 50 having a bent shape. The follower pin 40 is disposed in the guide long hole 50 and being movable relative to the guide long hole 50. The guide long hole 50 has a first section 51, a second section 52, and a coupling section 53. The first section 51 extends upward from the coupling section 53, and the second section 52 extends in a direction different from the first section 51.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present invention relates to a substrate gripping device, and more particularly to a substrate gripping device that can be applied to a cleaning device or a drying device for a substrate such as a wafer.

Background Art

[0002] In the semiconductor device manufacturing process, a substrate cleaning process and a drying process are performed after a polishing process or a plating process. For example, in the substrate cleaning process, the substrate is rotated while being gripped by a substrate gripping device, and a cleaning liquid is supplied to the substrate in this state. A scrub cleaning tool made of a sponge or the like scrub-cleans the surface of the rotating substrate while moving on the surface of the substrate.

[0003] FIG. 10 is a diagram showing an example of a conventional substrate gripping device. This substrate gripping device includes a chuck 501 connected to a movable rod 500. The chuck 501 is rotatable about a pivot shaft 503. The movable rod 500 has a long hole 505 extending horizontally, and the chuck 501 has a pin 507 disposed in the long hole 505. When the movable rod 500 moves up and down, the chuck 501 rotates about the pivot shaft 503. FIG. 10 shows a state where the movable rod 500 has descended and the chuck 501 is gripping the edge of the substrate W.

[0004] The chuck 501 grips the substrate W so as to cover the edge of the substrate W. The distance from the outermost end of the substrate W to the tip of the chuck 501 is referred to as an overlap amount L in this specification. This overlap amount L affects not only the gripping stability of the substrate W but also the cleaning result of the substrate W. That is, if the overlap amount L is too small, the substrate W is likely to come off the chuck 501. On the other hand, if the overlap amount L is too large, the cleaning area of the substrate W becomes small. That is, since the scrub cleaning tool cleans the surface of the substrate W within a range where it does not contact the rotating chuck 501, when the overlap amount L increases, the cleaning area of the substrate W becomes small.

[0005] FIG. 11 is a diagram showing a state in which the chuck 501 holds a substrate W thicker than the substrate W shown in FIG. 10. As can be seen from the comparison between FIG. 10 and FIG. 11, the overlap amount L changes depending on the thickness of the substrate W. In other words, depending on the thickness of the substrate W, the stability of holding the substrate W and the cleaning result of the substrate W may change. Such a problem may also occur when the substrate holding device is applied to a drying device.

[0006] FIG. 12 is a diagram when the chuck 501 is trying to hold the warped substrate W, and FIG. 13 is a diagram when the chuck 501 is trying to hold a substrate W thicker than the substrate W shown in FIG. 11. As shown in FIGS. 12 and 13, when the edge of the warped substrate W or the thick substrate W is outside the movable range of the chuck 501, the chuck 501 cannot hold these substrates W.

Prior Art Documents

Patent Documents

[0007]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0008] Therefore, the present invention provides a substrate holding device that can reliably hold a substrate regardless of the thickness or warped shape of the substrate.

Means for Solving the Problems

[0009] In one aspect, there is provided a substrate gripping device for gripping a substrate, comprising a support member having a follower pin and a substrate support surface, a movable rod movable relative to the support member, a chuck for gripping an edge of the substrate, and a connecting shaft rotatably connecting the chuck to the movable rod. The chuck has a bent-shaped guide slot, the follower pin is disposed in the guide slot and is movable relative to the guide slot. The guide slot has a first section, a second section, and a connecting section located within the first and second sections. The first section extends upward from the connecting section, and the second section extends in a direction different from that of the first section.

[0010] In one aspect, when the follower pin is located in the first section, the first section is parallel to the moving direction of the movable rod. In one aspect, the guide slot is adjacent to the connecting shaft. In one aspect, the second section is located between the first section and the connecting shaft.

[0011] In one aspect, there is provided a substrate gripping device for gripping a substrate, comprising a support member having a follower pin and a substrate support surface, a movable rod movable relative to the support member, a chuck for gripping an edge of the substrate, and a connecting shaft rotatably connecting the chuck to the movable rod. The chuck has a bent-shaped guide slot, the follower pin is disposed in the guide slot and is movable relative to the guide slot. The guide slot has a first section, a second section, and a connecting section located within the first and second sections. The second section extends in a direction different from that of the first section. When the follower pin is located in the first section, the first section is parallel to the moving direction of the movable rod.

[0012] In one aspect, there is provided a substrate gripping device for gripping a substrate, comprising a support member having a substrate support surface, a movable rod relatively movable with respect to the support member, a chuck for gripping an edge of the substrate, and a connecting shaft rotatably connecting the chuck to the movable rod. The support member has a bent guide slot, the chuck has a follower pin, the follower pin is disposed within the guide slot and is relatively movable with respect to the guide slot. The guide slot has a first section, a second section, and a connecting section located within the first section and the second section. The first section extends downward from the connecting section, and the second section extends in a direction different from that of the first section.

[0013] In one aspect, the first section is parallel to the moving direction of the movable rod. In one aspect, the guide slot is adjacent to the connecting shaft. In one aspect, the first section is located between the second section and the connecting shaft.

[0014] In one aspect, there is provided a substrate gripping device for gripping a substrate, comprising a support member having a substrate support surface, a movable rod relatively movable with respect to the support member, a chuck for gripping an edge of the substrate, and a connecting shaft rotatably connecting the chuck to the movable rod. The support member has a bent guide slot, the chuck has a follower pin, the follower pin is disposed within the guide slot and is relatively movable with respect to the guide slot. The guide slot has a first section, a second section, and a connecting section located within the first section and the second section. The second section extends in a direction different from that of the first section, and the first section is parallel to the moving direction of the movable rod.

Advantages of the Invention

[0015] When the follower pin moves relative to the guide slot within the first section, the chuck moves in a direction perpendicular to the surface of the substrate. Therefore, even when the substrate is thicker than expected or warped, the chuck can approach the edge of the substrate from above and grip the edge of the substrate.

Brief Description of the Drawings

[0016]

Figure 1

Figure 2

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Figure 11

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Figure 13

Embodiments for Carrying Out the Invention

[0017] Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a longitudinal sectional view showing an embodiment of a substrate gripping device. FIG. 2 is a plan view of the substrate gripping device shown in FIG. 1. As shown in FIGS. 1 and 2, the substrate gripping device for gripping a substrate W includes a base 1 having four arms 1a, four support members 2 respectively supported at the tips of the four arms 1a, and four movable rods 5 movably supported by the four support members 2. Each movable rod 5 is movable relative to the corresponding support member 2. More specifically, the four movable rods 5 are movable up and down relative to the four support members 2 and the base 1. Examples of the substrate W include a circular wafer.

[0018] The substrate gripping device further includes four chucks 7 for gripping the edge of the substrate W, and four connecting shafts 8 rotatably connecting these four chucks 7 to the four movable rods 5 respectively. In the present embodiment, four arms 1a, four support members 2, four chucks 7, four movable rods 5, and four connecting shafts 8 are provided, but the number of arms 1a, support members 2, chucks 7, movable rods 5, and connecting shafts 8 is not limited to the present embodiment, and five or more arms 1a, support members 2, chucks 7, movable rods 5, and connecting shafts 8 may be provided.

[0019] The substrate gripping device further includes a rotating shaft 10 to which the base 1 is fixed, and a rotation mechanism 20 for rotating the rotating shaft 10 about a rotation axis Cr. The base 1 is fixed to the upper end of the rotating shaft 10, and the rotating shaft 10 is rotatably supported by a bearing (not shown). The rotation mechanism 20 of the present embodiment has pulleys 11, 12, a belt 14, and a motor 15. The rotating shaft 10 is connected to the motor 15 via the pulleys 11, 12 and the belt 14. By driving the motor 15, the base 1 rotates about the rotation axis Cr. The substrate W is gripped by the chuck 7 and rotated about the rotation axis Cr by the motor 15. The specific configuration of the rotation mechanism 20 is not limited to the present embodiment, and may have other configurations as long as the substrate W gripped by the chuck 7 can be rotated.

[0020] The substrate holding device includes a vertical movement device 30 that simultaneously moves four movable rods 5 up and down. In one embodiment, the vertical movement device 30 includes four springs 31 that push down each of the four movable rods 5. The movable rod 5 has a spring stopper 33, and the spring 31 is disposed between the lower end of the support member 2 and the spring stopper 33. The force of the spring 31 pushes down the spring stopper 33, whereby the movable rod 5 is biased downward by the spring 31.

[0021] The vertical movement device 30 further includes a lift mechanism 35 that simultaneously raises the four movable rods 5. The lift mechanism 35 is configured to move the movable rod 5 upward against the force of the spring 31. The lift mechanism 35 includes a lifter 37 positioned below the four movable rods 5 and a lift actuator 38 that moves the lifter 37 up and down. Specific examples of the lift actuator 38 include an air cylinder and an electric linear actuator. When the substrate W is held by the chuck 7, the lifter 37 is not in contact with the movable rod 5.

[0022] FIG. 3 is a diagram showing a state in which the movable rod 5 is moved upward by the lift mechanism 35. As shown in FIG. 3, when the lift actuator 38 raises the lifter 37, the lifter 37 comes into contact with the lower ends of the four movable rods 5 and further moves the four movable rods 5 upward simultaneously. When the movable rod 5 moves upward, the chuck 7 opens and the substrate W is released from the chuck 7.

[0023] When the lift actuator 38 lowers the lifter 37, as shown in FIG. 1, the lifter 37 separates from the movable rod 5 and the movable rod 5 is moved downward by the spring 31. When the movable rod 5 moves downward, the chuck 7 closes and the substrate W is held by the chuck 7.

[0024] In this embodiment, the vertical movement device 30 that vertically moves the four movable rods 5 includes a spring 31 and a lift mechanism 35. However, as long as the four movable rods 5 can be vertically moved simultaneously, the vertical movement device 30 is not limited to the combination of the spring 31 and the lift mechanism 35. For example, the vertical movement device 30 may be an actuator (e.g., an air cylinder or an electric linear actuator) connected to the four movable rods 5.

[0025] FIG. 4 is an enlarged cross-sectional view of the chuck 7, the movable rod 5, and the support member 2. The support member 2 has a follower pin 40 and a substrate support surface 41. The substrate W is conveyed to the substrate gripping device by a conveyance robot (not shown), and the edge of the substrate W is placed on the substrate support surface 41. The edge of the substrate W is supported by the substrate support surface 41. The chuck 7 is rotatably connected to the movable rod 5 by a connecting shaft 8. The movable rod 5 is vertically movable relative to the support member 2 including the follower pin 40 and the substrate support surface 41.

[0026] The chuck 7 has a guide elongated hole 50 with a bent shape, and the follower pin 40 is disposed in the guide elongated hole 50. The width of the guide elongated hole 50 is larger than the diameter of the follower pin 40, and the follower pin 40 is movable relative to the guide elongated hole 50. The guide elongated hole 50 may be a through hole penetrating from one side surface of the chuck 7 to the opposite side surface, or may be a groove formed on one side surface of the chuck 7. In other words, examples of the guide elongated hole 50 include a through hole having a bent elongated hole shape and a bent groove.

[0027] The guide slot 50 has a first section 51, a second section 52, and a connecting section 53. The connecting section 53 is located between the first section 51 and the second section 52. The first section 51 extends upward from the connecting section 53, and the second section 52 extends in a direction different from that of the first section 51. The first section 51 extends linearly, and the second section 52 also extends linearly. The second section 52 may be curved. In the present embodiment, the second section 52 extends radially inward from the connecting section 53. In this specification, the radially inner side means the radially inner side in a circle (imaginary circle) centered on the rotation center Cr of the substrate gripping device shown in FIGS. 1 and 2. As shown in FIG. 4, in the present embodiment, the second section 52 extends from the connecting section 53 toward the connecting shaft 8.

[0028] The guide slot 50 is adjacent to the connecting shaft 8. More specifically, the second section 52 is adjacent to the connecting shaft 8. The second section 52 is located between the first section 51 and the connecting shaft 8. In other words, the distance between the second section 52 and the connecting shaft 8 is shorter than the distance between the first section 51 and the connecting shaft 8. The first section 51 is longer than the second section 52, and the length of the first section 51 is greater than the thickness of the substrate W. In one embodiment, the length of the first section 51 is 1.1 to 1.5 times the sum of the thickness of the substrate W to be gripped and the warp of the substrate W assumed. The angle between the first section 51 and the second section 52 is 90 degrees or more and less than 180 degrees.

[0029] As shown in FIG. 4, when the movable rod 5 descends, the chuck 7 rotates about the follower pin 40 in a direction approaching the substrate support surface 41, and the substrate W on the substrate support surface 41 is gripped by the chuck 7. As shown in FIG. 5, when the movable rod 5 ascends, the chuck 7 rotates about the follower pin 40 in a direction away from the substrate support surface 41, and the chuck 7 moves away from the substrate W on the substrate support surface 41. As shown in FIGS. 4 and 5, as the chuck 7 rotates, the follower pin 40 moves within the guide slot 50. In actual movement, since the position of the follower pin 40 is fixed, as the chuck 7 rotates, the guide slot 50 moves relative to the follower pin 40.

[0030] When the chuck 7 holds the substrate W, as shown in FIG. 4, the follower pin 40 is located within the first section 51. After the chuck 7 separates from the substrate W, as shown in FIG. 5, the follower pin 40 is located within the second section 52. As shown in FIG. 4, the first section 51 when the follower pin 40 is located within the first section 51 is parallel to the moving direction of the movable rod 5. Here, "parallel" means not only that the first section 51 is completely parallel to the moving direction of the movable rod 5, but also, as will be described later, as long as the intended purpose of the chuck 7 being able to hold substrates with different thicknesses can be achieved, it includes the case where the first section 51 is slightly inclined from the moving direction of the movable rod 5.

[0031] FIG. 6 is a view showing the chuck 7 when holding substrates with different thicknesses. When the chuck 7 holds the substrate W, the chuck 7 is guided by the engagement between the follower pin 40 and the first section 51 of the guide slot 50 and descends in a direction perpendicular to the surface of the substrate W. In other words, the first section 51 when the follower pin 40 is located within the first section 51 is perpendicular to the surface of the substrate W. Therefore, even when the substrate W is thicker than expected or the substrate W is warped, the chuck 7 can approach the edge of the substrate W from above and hold the edge of the substrate W.

[0032] In particular, as shown in FIG. 6, since the chuck 7 descends in a direction perpendicular to the surface of the substrate W when contacting the substrate W, the overlap amount L when the substrate W is thin is the same as the overlap amount L when the substrate W is thick. The overlap amount L is the distance from the outermost end of the substrate W to the tip of the chuck 7. Since the overlap amount L is the same regardless of the thickness of the substrate W, the chuck 7 can stably hold substrates W of various thicknesses. Further, when the substrate holding device is applied to a substrate processing device such as a substrate cleaning device or a drying device, the substrate processing range can be made constant.

[0033] FIG. 7 is a diagram showing another embodiment of the substrate gripping device. The configuration and operation of this embodiment not described in particular are the same as those of the embodiment described with reference to FIGS. 1 to 6, and thus the overlapping description thereof will be omitted. In the embodiment shown in FIG. 7, the support member 2 has a bent guide elongated hole 50, and the chuck 7 has a follower pin 40. The follower pin 40 is disposed in the guide elongated hole 50 and is movable relative to the guide elongated hole 50. The guide elongated hole 50 may be a through hole penetrating from one side surface of the support member 2 to the opposite side surface, or may be a groove formed in one side surface of the support member 2. In other words, examples of the guide elongated hole 50 include a bent elongated hole-shaped through hole and a bent groove.

[0034] The guide elongated hole 50 has a first section 51, a second section 52, and a connecting section 53. The connecting section 53 is located between the first section 51 and the second section 52. The first section 51 extends downward from the connecting section 53, and the second section 52 extends in a direction different from that of the first section 51. The first section 51 extends linearly, and the second section 52 also extends linearly. The second section 52 may be curved. In the present embodiment, the second section 52 extends radially outward from the connecting section 53. In this specification, the radially outer side means the radially outer side in a circle (imaginary circle) centered on the rotation center Cr of the substrate gripping device shown in FIGS. 1 and 2. The second section 52 of the present embodiment extends radially outward and obliquely upward from the connecting section 53.

[0035] The guide elongated hole 50 is adjacent to the connecting shaft 8. More specifically, the first section 51 is adjacent to the connecting shaft 8. The first section 51 is located between the second section 52 and the connecting shaft 8. In other words, the distance between the first section 51 and the connecting shaft 8 is shorter than the distance between the second section 52 and the connecting shaft 8. The first section 51 is longer than the second section 52, and the length of the first section 51 is greater than the thickness of the substrate W. In one embodiment, the length of the first section 51 is 1.1 to 1.5 times the sum of the thickness of the substrate W to be gripped and the warp of the substrate W assumed. The angle between the first section 51 and the second section 52 is 90 degrees or more and less than 180 degrees.

[0036] As shown in FIG. 7, when the movable rod 5 descends, the chuck 7 rotates about the follower pin 40 in a direction approaching the substrate support surface 41, and the substrate on the substrate support surface 41 is gripped by the chuck 7. As shown in FIG. 8, when the movable rod 5 ascends, the chuck 7 rotates about the follower pin 40 in a direction away from the substrate support surface 41, and the chuck 7 moves away from the substrate on the substrate support surface 41. As shown in FIGS. 7 and 8, as the chuck 7 rotates, the follower pin 40 moves relative to the guide long hole 50.

[0037] When the chuck 7 grips the substrate W, as shown in FIG. 7, the follower pin 40 is located within the first section 51. After the chuck 7 moves away from the substrate W, as shown in FIG. 8, the follower pin 40 is located within the second section 52. The first section 51 is parallel to the moving direction of the movable rod 5 as shown in FIG. 7. Here, the term "parallel" means not only that the first section 51 is completely parallel to the moving direction of the movable rod 5, but also includes the case where the first section 51 is slightly inclined from the moving direction of the movable rod 5 as long as the intended purpose of enabling the chuck 7 to grip substrates with different thicknesses can be achieved.

[0038] FIG. 9 is a view showing the chuck 7 when gripping substrates with different thicknesses. When the chuck 7 grips the substrate W, the chuck 7 descends in a direction perpendicular to the surface of the substrate W guided by the engagement between the follower pin 40 and the first section 51 of the guide long hole 50. In other words, the first section 51 is perpendicular to the surface of the substrate W. Therefore, even when the substrate W is thicker than expected or the substrate W is warped, the chuck 7 can approach the edge of the substrate W from above and grip the edge of the substrate W.

[0039] In particular, as shown in FIG. 9, when the chuck 7 descends in a direction perpendicular to the surface of the substrate W when contacting the substrate W, the overlap amount L when the substrate W is thin is the same as the overlap amount L when the substrate W is thick. Therefore, the chuck 7 can stably hold the substrate W. Further, when the substrate holding device is applied to a substrate processing device such as a substrate cleaning device or a drying device, the substrate processing range can be made constant.

[0040] The shape of the guide slot 50 is not limited to the embodiment described with reference to FIGS. 1 to 9. For example, the connecting section 53 may have a curved shape that smoothly connects to the first section 51 and the second section 52.

[0041] The substrate holding device of the embodiment described with reference to FIGS. 1 to 9 is configured to hold the substrate W horizontally, but the configuration of the substrate holding device is not limited to these embodiments. For example, the substrate holding device may be configured to hold the substrate W in a vertical posture or an inclined posture.

[0042] The above-described embodiments are described for the purpose of enabling a person having ordinary knowledge in the technical field to which the present invention pertains to implement the present invention. Various modifications of the above embodiments can be naturally made by those skilled in the art, and the technical idea of the present invention can also be applied to other embodiments. Therefore, the present invention is not limited to the described embodiments, but is to be interpreted in the broadest scope in accordance with the technical idea defined by the claims.

Explanation of Reference Numerals

[0043] W Substrate 1 Base 1a Arm 2 Support Member 5 Movable Rod 7 Chuck 8 Connecting Shaft 10 Rotation Shaft 11, 12 Pulley 14 Belt 15 Motor 20 Rotation Mechanism 30 Vertical movement device 31 Spring 33 Spring stopper 35 Lift mechanism 37 Lifter 38 Lift actuator 40 Follower pin 41 Substrate support surface 50 Guide slot 51 First section 52 Second section 53 Connecting section

Claims

1. A substrate gripping device for gripping a substrate, comprising: a support member having a follower pin and a substrate support surface; a movable rod relatively movable with respect to the support member; a chuck for gripping an edge of the substrate; a connecting shaft rotatably connecting the chuck to the movable rod; the chuck has a bent-shaped guide slot; the follower pin is disposed in the guide slot and is relatively movable with respect to the guide slot; the guide slot has a first section, a second section, and a connecting section located in the first section and the second section; the first section extends upward from the connecting section; the second section extends in a direction different from that of the first section, a substrate gripping device.

2. The substrate gripping device according to claim 1, wherein the first section when the follower pin is located in the first section is parallel to the moving direction of the movable rod.

3. The substrate gripping device according to claim 1, wherein the guide slot is adjacent to the connecting shaft.

4. The substrate gripping device according to claim 1, wherein the second section is located between the first section and the connecting shaft.

5. A substrate gripping device for gripping a substrate, comprising: a support member having a follower pin and a substrate support surface; a movable rod relatively movable with respect to the support member; a chuck for gripping an edge of the substrate; a connecting shaft rotatably connecting the chuck to the movable rod; the chuck has a bent-shaped guide slot; the follower pin is disposed in the guide slot and is relatively movable with respect to the guide slot; the guide slot has a first section, a second section, and a connecting section located in the first section and the second section; the second section extends in a direction different from that of the first section; the substrate gripping device, wherein the first section when the follower pin is located in the first section is parallel to the moving direction of the movable rod.

6. A substrate gripping device for gripping a substrate, comprising: a support member having a substrate support surface; a movable rod relatively movable with respect to the support member; a chuck for gripping an edge of the substrate; a connecting shaft rotatably connecting the chuck to the movable rod; the support member has a bent-shaped guide slot; the chuck has a follower pin The follower pin is disposed within the guide slot and is movable relative to the guide slot. The guide slot has a first section, a second section, and a connecting section located within the first and second sections. The first section extends downward from the connecting section. The second section extends in a direction different from that of the first section, a substrate gripping device.

7. The substrate gripping device according to claim 6, wherein the first section is parallel to the moving direction of the movable rod.

8. The substrate gripping device according to claim 6, wherein the guide slot is adjacent to the connecting shaft.

9. The substrate gripping device according to claim 6, wherein the first section is located between the second section and the connecting shaft.

10. A substrate gripping device for gripping a substrate, comprising: A support member having a substrate support surface; A movable rod movable relative to the support member; A chuck for gripping an edge of the substrate; A connecting shaft rotatably connecting the chuck to the movable rod; The support member has a guide slot with a bent shape; The chuck has a follower pin; The follower pin is disposed within the guide slot and is movable relative to the guide slot; The guide slot has a first section, a second section, and a connecting section located within the first and second sections; The second section extends in a direction different from that of the first section; The substrate gripping device, wherein the first section is parallel to the moving direction of the movable rod.

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