Controller, soldering device, program, and method for setting control pattern

Abstract

To improve the finish of solder after soldering.SOLUTION: A controller 20 being the controller that controls the position of a heater tool that heats a workpiece including a first joining target, a second joining target, and solder joining them from above to melt the solder, includes: a position control unit 22B that controls the position in the vertical direction of the heater tool by controlling a movement mechanism which moves the heater tool in a predetermined control pattern during a heating period in which the heater tool heats the workpiece; and a pattern change unit 22C that receives a change instruction for the predetermined control pattern and changes the content of the predetermined control pattern on the basis of the received change instruction.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a controller, a soldering device, a program, and a method for setting a control pattern, which are used for soldering.

Background Art

[0002] Patent Document 1 discloses a controller that controls the position of a heater tool that heats a workpiece including a first joining target, a second joining target, and solder that joins these from above to melt the solder.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the soldering device described in Patent Document 1, the position of the heater tool is controlled so that the finish of the solder after soldering is good. However, the heater tool thermally expands due to heat generation. In the technique described in Patent Document 1, this thermal expansion is not taken into account, and due to the thermal expansion of the heater tool, for example, the amount of spread of the solder becomes larger than the desired amount, and as a result, the finish of the solder may not be good.

[0005] An object of the present invention is to improve the finish of the solder after soldering.

Means for Solving the Problems

[0006] To solve the above problems, a controller according to the present invention is a controller that controls the position of a heater tool that heats a workpiece including a first joining target, a second joining target, and solder that joins these from above to melt the solder, and controls the vertical position of the heater tool by controlling a moving mechanism that moves the heater tool during a heating period in which the heater tool heats the workpiece according to a predetermined control pattern, and a pattern changing unit that receives an instruction to change the predetermined control pattern and changes the content of the predetermined control pattern based on the received change instruction.

[0007] To solve the above problems, a soldering apparatus according to the present invention includes the controller and the heater tool, and a welding machine that performs soldering of the workpiece by the heater tool under the control of the controller.

[0008] To solve the above problems, a program according to the present invention causes a computer to function as the above controller.

[0009] To solve the above problems, a method for setting a control pattern according to the present invention includes a first step of performing soldering on the workpiece as a sample by operating the controller, a second step of checking the finish of the solder in the sample after soldering obtained in the first step, and a third step of causing the pattern changing unit to receive the change instruction according to the check result in the second step and change the predetermined control pattern of the controller, and repeating the first step to the third step until the finish confirmed in the second step becomes a desired finish.

Advantages of the Invention

[0010] According to the present invention, the finish of the solder after soldering becomes good.

Brief Description of the Drawings

[0011]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

[0012] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0013] The controller 20 according to the present embodiment shown in FIG. 1 is configured as a part of the soldering apparatus 10. The soldering apparatus 10 further includes a user interface 30, a welding machine 50, and a power supply circuit 60.

[0014] The controller 20 is composed of a computer that controls the operations of the user interface 30, the welding machine 50, and the power supply circuit 60. The controller 20 includes a storage unit 21 that stores control patterns, programs, etc. to be described later, and a processor 22 that executes the program and performs the processes to be described later according to the control pattern. The processor 22 consists of a CPU (Central Processing Unit) or the like. The controller 20 further includes a main memory 23 that provides a working area for the processor 22, and an I / O (Input / Output) 24 that relays data transmitted and received between the processor 22 and the outside of the controller 20.

[0015] The user interface 30 includes a display device 31 that displays various operation screens, and an operation device 32 that receives operations from the user. The operation device 32 may be a transparent touch panel provided on the screen of the display device 31 in addition to an operation device having various operation keys, and receives touch operations from the user. As will be described later, the above control pattern is changed by the user's operation on the operation device 32.

[0016] As shown in FIG. 2, the welding machine 50 is configured to solder the joining target W2 to the joining target W1 with solder S. Here, the joining target W1 is an electrode of the circuit board K, and the joining target W2 is a lead wire soldered to the electrode, but specific examples of the joining targets W1 and W2 are arbitrary. The solder S is supplied in advance onto the joining target W1. The solder S is pre-fused cream solder, solder plating, or the like. The joining target W1 may be an electrode of a circuit board, the joining target W2 may be a semiconductor chip, and the solder S may be a bump provided on the semiconductor chip.

[0017] The welding machine 50 includes a stage 51 that supports the work W to be soldered, and a heater tool 52 that heats the work W from above to melt the solder S during soldering. The heater tool 52 is a resistive metal having a substantially U-shaped cross-section with a slit opening upward.

[0018] The welding machine 50 further includes a moving mechanism 53 that moves the heater tool 52 in the vertical direction, and a displacement gauge 54 that detects the position of the heater tool 52.

[0019] The moving mechanism 53 includes a support column 53A that stands up from the stage 51, a lifting head 53B that is attached to the support column 53A and moves (lifts and lowers) in the vertical direction, and a motor 53C that moves the lifting head 53B in the vertical direction. The moving mechanism 53 appropriately includes a mechanism that changes the power of the motor 53C into a force for lifting and lowering the lifting head 53B.

[0020] The moving mechanism 53 further includes a rod 53D that penetrates the bottom of the space inside the lifting head 53B, has an upper end reaching inside the space, and has a heater tool 52 fixed to the lower end, and a plate-shaped retaining member 53E that is connected to the rod 53D and prevents the rod 53D from falling out downward from the lifting head 53B. The rod 53D is provided so as to be relatively movable in the vertical direction with respect to the lifting head 53B. The retaining member 53E is disposed in the space inside the lifting head 53B, and when the rod 53D is at the lower limit position with respect to the lifting head 53B, it abuts against the bottom of the lifting head 53B to restrict the rod 53D from moving further downward. The lifting head 53B supports the rod 53D and the heater tool 52 so as to be movable in the vertical direction.

[0021] The moving mechanism 53 further includes a biasing mechanism 53F that biases the heater tool 52 downward by biasing the rod 53D downward. The biasing mechanism 53F includes a cylinder 53FA attached to the lifting head 53B, a cap 53FB screwed onto the upper end of the cylinder 53FA, and an elastic body 53FC such as a spring loaded inside the cylinder 53FA. The elastic body 53FC is sandwiched between the cap 53FB and the rod 53D to bias the rod 53D downward. The cap 53FB adjusts the biasing force on the rod 53D by the elastic body 53FC according to the degree of screwing onto the cylinder 53FA.

[0022] The displacement meter 54 is disposed within the lifting head 53B, and detects the relative position of the heater tool 52 with respect to the lifting head 53B by measuring the relative position of the retainer 53E with respect to the lifting head 53B. The displacement meter 54 can be formed of, for example, a known differential transformer. In this case, the core 54A fixed to the retainer 53E in parallel with the rod 53D is moved within the coil 54B which combines the primary coil and two sets of secondary coils, and the displacement of the core 54A, that is, the relative position of the retainer 53E, is detected based on the output difference between the two sets of secondary coils.

[0023] The welding machine 50 further includes a thermocouple 59 that detects the temperature (welding temperature) near the tip of the heater tool 52. As shown in FIG. 1, the output of this thermocouple 59 is output to the power supply circuit 60.

[0024] During soldering, the power supply circuit 60 in FIG. 1 passes a current through the heater tool 52 that is in contact with the workpiece W, causing the heater tool 52 to instantaneously generate heat. Thereby, heating of the workpiece W and soldering are performed by pulse heat. The power supply circuit 60 performs feedback control to match the temperature of the heater tool 52 to a preset temperature profile, using the output of the thermocouple 59 as a feedback value. The temperature profile is preset and stored in the power supply circuit 60. In this feedback control, the voltage and / or current input to the heater tool 52 detected within the power supply circuit 60 may be further used.

[0025] The power supply circuit 60 may be configured to supply power to the controller 20, the user interface 30, the motor 53C, and the displacement meter 54.

[0026] The processor 22 of the controller 20 operates as the heating control unit 22A, the position control unit 22B, and the pattern change unit 22C shown in FIG. 3 by executing the program in the storage unit 21.

[0027] The heating control unit 22A controls the heating by the heater tool 52 by controlling the power supply circuit 60. Here, the heating control unit 22A instructs the power supply circuit 60 to start the heating by the heater tool 52.

[0028] The position control unit 22B controls the lifting head 53B to move up and down by controlling the moving mechanism 53. By this up and down movement, the position of the heater tool 52 is controlled. The position control unit 22B controls the moving mechanism 53 according to the control pattern stored in the storage unit 21, and moves the lifting head 53B up and down in the movement pattern indicated by this control pattern.

[0029] The pattern change unit 22C receives an instruction to change the control pattern stored in the storage unit 21, and changes the control pattern based on the received change instruction.

[0030] Next, the processes performed by the above-described units 22A to 22C of the controller 20 will be described.

[0031] The units 22A and 22B execute the soldering process shown in FIG. 4. The soldering process starts when the work W is placed on the stage 51 and an operation to start soldering is input to the operation device 32. At the start of the soldering process, it is assumed that the lifting head 53B is disposed at an upper position where the heater tool 52 is separated from the work W by a predetermined distance as shown in FIG. 2. For this reason, it is assumed that the rod 53D is positioned at the lower limit position with respect to the lifting head 53B due to its own weight.

[0032] In the soldering process, first, the position control unit 22B controls the moving mechanism 53 (more specifically, the motor 53C) to lower the lifting head 53B (step S11). As a result of the lowering of the lifting head 53B, when the heater tool 52 comes into contact with the workpiece W (here, the joining target W2) from above, the workpiece W pushes the heater tool 52 (the rod 53D to the retaining member 53E) upward relative to the lifting head 53B (see Fig. 5). Thereby, the output value of the displacement gauge 54 increases. In the example of Fig. 5, the heater tool 52 moves upward by the amount of displacement x relative to the lifting head 53B together with the retaining member 53E, etc., and the output value corresponding to the amount of displacement x is output from the displacement gauge 54.

[0033] The position control unit 22B monitors the output value of the displacement gauge 54 and waits until it determines that the heater tool 52 has contacted the workpiece W (step S12; No). The determination as to whether the heater tool 52 has contacted the workpiece W is made by determining whether the increase amount of the output value based on the output value before the start of the soldering process has reached a preset predetermined value. When the position control unit 22B determines that the heater tool 52 has contacted the workpiece W when the increase amount has reached the predetermined value (step S12; Yes), it controls the moving mechanism 53 (the position of the lifting head 53B) so that the increase amount becomes a value corresponding to the target sinking amount A included in the control pattern stored in the storage unit 21 (step S13). The target sinking amount A is the target amount that the heater tool 52 wants to enter (sink into) the workpiece W when the solder S melts during soldering. By step S13, when the solder S melts during soldering, the heater tool 52 sinks into the workpiece W by an amount corresponding to the target sinking amount A due to its own weight and the biasing force of the elastic body 53FC, and further sinking is prevented.

[0034] Thereafter, the position control unit 22B controls the moving mechanism 53 according to the control pattern stored in the storage unit 21 (step S14). The details of this control will be described later.

[0035] In synchronization with the start of the control of the moving mechanism 53 in step S14, the heating control unit 22A controls the power supply circuit 60 to start controlling the heating temperature of the work W by the heater tool 52 in the power supply circuit 60 (step S15). As described above, the power supply circuit 60 starts controlling the current to the heater tool 52 in order to generate heat from the heater tool 52 according to a preset temperature profile. The temperature profile is defined, for example, as the time change of the target temperature of the heater tool 52. Note that the control of the current to the heater tool 52 according to the temperature profile (that is, the control of the heating temperature by the heater tool 52) may be executed by the heating control unit 22A. In such a case, the output value of the thermocouple 59, the current value detected by the power supply circuit 60, etc. may be fed back to the heating control unit 22A.

[0036] The control of the moving mechanism 53 and the control of the heating temperature are performed in parallel, and the soldering process ends when these controls end.

[0037] Next, with reference to FIG. 6, the time change of the target temperature of the heater tool 52 in the temperature profile, the time change of the position of the lifting head 53B controlled by the control pattern, and the position of the heater tool 52 at that time will be described. Note that the vertical axis in FIG. 6 is exaggerated and may not be the actual scale (the same applies to other graphs).

[0038] As shown in the upper graph of FIG. 6, the target temperature of the heater tool 52 gradually increases from the start timing T0 of the control of the heating temperature, and reaches a predetermined temperature (for example, 340° C.) equal to or higher than the melting point of the solder S at timing T1. Thereafter, the target temperature is maintained at the predetermined temperature for a certain period until timing T2, and then becomes normal temperature (current value to the heater tool 52 = 0) at timing T2. The actual temperature of the heater tool 52 gradually decreases after the target temperature becomes normal temperature (see the broken line). After timing T2, in order to accelerate the temperature drop of the heater tool 52, cooling by air cooling or liquid cooling may be performed by a cooling mechanism (not shown). After timing T2, the temperature of the heater tool 52 that decreases reaches a predetermined solid point SP. This solid point SP is the point at which the solder S solidifies.

[0039] During the period from T0 to T1, when the solder S melts, the heater tool 52 sinks into the work W (see the time change of the position of the heater tool in the lower part of FIG. 6 and FIG. 7). The maximum amount of sinking of the heater tool 52 (more specifically, the lower surface of the heater tool 52) due to this sinking ideally becomes the target sinking amount A by the retainer 53E. However, in reality, the heater tool 52 thermally expands due to its own heat generation. Further, the rod 53D may also be heated and thermally expanded by the heat generation of the heater tool 52. These thermal expansions move the lowermost surface of the heater tool 52 further downward, thus increasing the maximum sinking amount (in other words, the amount of crushing of the solder S). As a result, the maximum sinking amount exceeds the target sinking amount A. This causes excessive crushing of the solder S, resulting in a short circuit where the solder S contacts other conductive parts and / or a bonding defect where the bonding target W2 is exposed from the solder S. Therefore, in the present embodiment, during the heating of the heater tool 52, the movement mechanism 53 is controlled by the position control unit 22B according to the above control pattern.

[0040] The control pattern of the moving mechanism 53 is a predetermined pattern that is not changed during control. The control pattern moves the lifting head 53B so as to cancel the thermal expansion of the heater tool 52 or the like, and prevents the maximum penetration amount of the heater tool 52 from exceeding the target penetration amount A (that is, the solder S from being crushed too much).

[0041] The control pattern includes a pattern in which the position of the lifting head 53B is held at the position controlled by step S13 during a period from the start timing T0, that is, the first period P1 in the heating period of the work W by the heater tool 52 (see the lower graph in FIG. 6). In the period P1, when the temperature of the work W rises and the solder S melts, the heater tool 52 sinks downward, but due to the retaining member 53E, the sinking of the heater tool 52 stops when the amount reaches the target sinking amount A (see the period P11). Strictly speaking, since the thermal expansion of the heater tool 52 or the like has started, the penetration amount of the heater tool 52 (especially the lower surface) exceeds the target penetration amount A, but the thermal expansion occurs with a delay in the temperature change of the heater tool 52, and / or since the temperature of the heater tool 52 is still low and the thermal expansion amount itself is small, the expansion amount at this time can be ignored. Also, the temperature of the solder S changes with a delay with respect to the temperature change of the heater tool 52. This is due to the time required for heat conduction. For this reason, the solder S starts to melt with a delay from the timing when the heater tool 52 reaches a temperature equal to or higher than the melting point of the solder S.

[0042] The control pattern further includes a pattern in which the lifting head 53B is gradually raised in a period P2 following the period P1. When the lifting head 53B is raised, the heater tool 52 is also raised. The degree of the raising (the slope of the time change of the position of the lifting head) is such that the lower surface of the heater tool 52 does not separate from the solder S and does not sink into the solder S more than the target sinking amount A, so as to cancel to some extent the downward movement (thermal expansion amount) of the lower surface of the heater tool 52 due to thermal expansion.

[0043] The control pattern further includes a pattern in which the lifting head 53B is gradually lifted in a period P2 following the period P1. In the period P2, the lifting head 53B rises until the lower surface of the heater tool 52 reaches a position where the finishing collapse amount, which is the collapse amount of the solder S after curing, becomes a desired amount.

[0044] The control pattern further includes a pattern in which the position of the lifting head 53B is held in a period P3 following the period P2. During the period P3, the control by the heating profile ends, and the heater tool 52 is gradually cooled. Thereafter, the period P3 continues until the temperature of the heater tool 52 reaches the solid point at which the solder S solidifies. The end timing of the period P3 is defined in the control pattern here as the timing after a fixed time has elapsed from the period P2, but the control pattern may define the end timing of the period P3 as the timing when the temperature of the heater tool 52 reaches the solid point. In this case, the power supply circuit 60 notifies the position control unit 22B that the temperature of the heater tool 52 detected by the thermocouple 59 has reached the solid point, and the control pattern may define the timing of this notification as the end timing of the period P3.

[0045] The control pattern includes a pattern in which, in a period P4 following the period P3, the lifting head 53B is lifted and the heater tool 52 is detached from the work W (especially the solder S) to finish soldering.

[0046] In the period P3, since the lifting head 53B is held at a position where the finishing collapse amount of the solder S by the heater tool 52 becomes a desired amount, the shape of the solder S is stabilized in the shape of the finishing collapse amount in the last period of soldering.

[0047] The optimal control pattern for soldering varies depending on the material of the elements of the workpiece W and the like. Therefore, in this embodiment, the control pattern is changed. The change is made by the pattern change unit 22C. In this change, the basic shape of the control pattern is not changed. That is, the control pattern always includes a period P1 during which the lifting head 53B is held at the first position, a period P2 during which the lifting head 53B is gradually lifted and moved from the first position to the second position, and a period P3 during which the lifting head 53B is held at the second position.

[0048] The pattern change unit 22C performs, for example, the pattern change process shown in FIG. 8. The pattern change process is started when an operation to instruct the start of the change of the control pattern is performed on the operation device 32.

[0049] In the pattern change process, the pattern change unit 22C first causes the display device 31 to display a change screen for accepting changes to the lengths of the periods P1 to P3, the position of the lifting head 53B held in the period P1 (hereinafter also referred to as the first position), the position of the lifting head 53B to which it moves in the period P2 (hereinafter also referred to as the second position), and the position held in the period P3 (step S21).

[0050] While viewing the change screen of the display device 31, the user inputs the changed information among the above-mentioned pieces of information as a change instruction to the operation device 32. The pattern change unit 22C accepts the change instruction (step S22), and changes the control pattern stored in the storage unit 21 based on the accepted change instruction (step S23). The change of the control pattern in step S23 may be to change at least a part of the content of the currently stored and used control pattern in the storage unit 21 (hereinafter also referred to as the existing control pattern) based on the change instruction. The change of the control pattern in step S23 may be to generate a new control pattern that is at least partially different from the existing control pattern based on the change instruction, and newly register the generated new control pattern in the storage unit 21 or overwrite the existing control pattern as the control pattern to be newly used.

[0051] Note that the change instruction may be an instruction to change at least one of the first position, the second position, the length of period P1, and the length of period P2. The instruction to change the length of period P2 includes an instruction to change the length of period P2 by changing the change speed of the position of the lifting head (the slope of the time change of the position of the lifting head in FIG. 6).

[0052] The user may set a desired control pattern in the controller 20 by, for example, the control pattern setting method shown in FIG. 9. First, the user solders the work W prepared as a sample with the soldering apparatus 10 (step S31), and checks the finish of the solder S of the sample (work W) after soldering (step S32). In step S31, the user operates the controller 20 via the user interface 30 (display device 31 and operation device 32), thereby causing the soldering apparatus 10 (more specifically, the welding machine 50) to perform soldering on the work W. As a result of the check in step S32, if the finish of the solder S is not good (step S33; No), the user inputs a change instruction to the controller 20 via the operation device 32 to cause the pattern changing unit 22C to receive it, and causes the pattern changing unit 22C to change the control pattern stored in the storage unit 21 (step S34). The user repeats steps S31 to S34 until a sample with good finish of the solder S is obtained.

[0053] For example, as a result of the check in step S32, if the amount of collapse of the solder S is large, the first position and / or the second position may be too low with respect to the work W, and the heater tool 52 may have sunk into the solder S more than necessary. Also, if period P2 is too long, that is, if the change speed of the position of the lifting head is too slow, there is a possibility that the amount of thermal expansion of the heater tool 52 etc. cannot be completely canceled by the upward movement of the lifting head 53B. In this case, the user may change at least one of the first position, the second position, and the length of period P2, and perform step S31 again. Of course, a new sample is prepared in the second step S31.

[0054] For example, as a result of the confirmation in step S32, if the solder S has a poor joint, it is possible that the first position and / or the second position is too high with respect to the workpiece W, resulting in insufficient heating due to the heater tool 52 being separated from the solder S. Also, if the period P1 is too short and the lifting head 53B starts to rise due to the period P2 before the thermal expansion amount becomes large, as a result, the heater tool 52 may be separated from the solder S. This may also cause insufficient heating of the solder S. In this case, the user may change at least one of the first position, the second position, and the length of the period P1, and perform step S31 again.

[0055] When the user obtains a sample with good solder finish (step S33; Yes), the user ends the control pattern setting method. As a result, the finally changed control pattern is set as the control pattern to be used thereafter. Such a control pattern setting method can also be said to be a production method of the controller 20 in which an optimal control pattern is set. Note that the setting (change) of the control pattern may be performed by a machine instead of a person such as the user. For example, an imaging image of a sample (workpiece W) after soldering may be input to the controller 20, and a machine learning unit or the like that discriminates the finish of the solder S based on the imaging image, generates a change instruction according to the discrimination result, and inputs it to the pattern change unit 22C may be provided. In this case, the machine learning unit is realized by, for example, the processor 22.

[0056] As described above, in the present embodiment, the controller 20 is configured to control the position of the heater tool 52 that heats the work W including the joining target W1, the joining target W2, and the solder S for joining them from above to melt the solder S. Then, the controller 20 includes a position control unit 22B that controls the vertical position of the heater tool 52 by controlling a moving mechanism 53 that moves the heater tool 52 during a heating period in which the heater tool 52 heats the work W in a predetermined control pattern. Further, the controller 20 also includes a pattern change unit 22C that receives an instruction to change the predetermined control pattern and changes the content of the predetermined control pattern based on the received change instruction. With such a configuration, a control pattern considering thermal expansion can be obtained, so that the finish of the solder after soldering using the controller 20 is good. In addition, a control pattern that provides a good finish of the solder can be incorporated, and by controlling with the once-created control pattern, a good finish can be obtained with simple control. Note that the change instruction may be input from another device that can communicate with the controller 20 and received by the pattern change unit 22C.

[0057] The configurations of the moving mechanism 53 and the control pattern are arbitrary, but the moving mechanism 53 may be configured to move a lifting head 53B that supports the heater tool 52 so as to be movable in the vertical direction in the vertical direction. Further, as shown in FIG. 6, each of the predetermined control patterns before and after the change of the content based on the change instruction includes a first pattern for holding the lifting head 53B at the first position during a period P1 of the heating period, a second pattern for moving the lifting head 53B from the first position to a second position above the first position during a period P2 following the period P1, and a third pattern for holding the lifting head 53B at the second position during a period P3 from the end timing of the period P2 to the solid timing (such as the timing when the solder S starts to harden or the timing when it completely hardens) which is the timing of the solid point SP at which the solder S hardens. With such a control pattern, simple control is realized in which the movement of the lifting head 53B for thermal expansion countermeasures is minimized. Further, the change instruction includes an instruction to change at least one of the first position, the second position, the length of the period P1, and the length of the period P2, so that the user can change the control pattern effectively and easily.

[0058] Note that the heater tool 52 may thermally contract due to cooling after heating. Usually, since the amount of thermal contraction of the heater tool 52 increases slowly with respect to the temperature drop of the heater tool 52, the influence of the thermal contraction is ignored. However, for example, when the work W is miniaturized or the heater tool 52 is formed of a material with high responsiveness to the generation of the amount of thermal contraction, the influence of the thermal contraction may not be ignored. In response to such a case, as shown in FIG. 10, the control pattern may include, instead of the third pattern described above, a pattern in which the lifting head 53B is moved downward after being held at the second position during the period P3. Thereby, the thermal contraction component is canceled and the finish of the solder S becomes good. The change instruction in this case may include an instruction to change the downward movement timing and / or the movement speed of the lifting head 53B in the third pattern. Thereby, a more suitable control pattern can be obtained.

[0059] Furthermore, when the lifting head 53B moves to the first position, the heater tool 52 abuts against the work W and moves upward by a predetermined amount of movement (target sinking amount A) relative to the lifting head 53B, and when the solder S of the work W melts, it moves downward by a predetermined amount of movement. Thus, the amount of sinking of the heater tool 52 downward is restricted, and the finish of the solder S becomes good.

[0060] Furthermore, by including the controller 20 and the welding machine 50 that includes the heater tool 52 and performs soldering of the work W with the heater tool 52 under the control of the controller 20, the soldering apparatus 10 with good solder finish after soldering is obtained.

[0061] Furthermore, like the method for setting the control pattern in the present embodiment, a first step of performing soldering on the work W as a sample by operating the controller 20, a second step of checking the finish of the solder in the sample after soldering obtained in the first step, and a third step of causing the pattern change unit 22C to receive a change instruction according to the check result in the second step and change the predetermined control pattern stored in the storage unit 21 of the controller 20 may be executed. Furthermore, it is preferable to repeatedly execute the first step to the third step until the finish checked in the second step becomes a desired finish. Thereby, a control pattern for obtaining a solder S with a good finish is set in the controller 20.

[0062] (Supplementary Note) A configuration taking the above embodiment and modification example as an example is appended. The appended configurations can be combined with each other. The symbols in parentheses in the following supplementary notes show an example of the correspondence relationship between the elements described in the supplementary notes and the elements of the above embodiment and modification example, and are not intended to limit the elements described in the supplementary notes to the elements of the above embodiment and modification example with the symbols in parentheses. (Supplementary Note 1) A controller (20) for controlling the position of a heater tool (52) that heats a workpiece (W) including a first joining target (W1), a second joining target (W2), and solder (S) for joining them from above to melt the solder, a position control unit (22B) that controls the vertical position of the heater tool by controlling a moving mechanism (50) that moves the heater tool during a heating period in which the heater tool heats the workpiece according to a predetermined control pattern, a pattern change unit (22C) that receives an instruction to change the predetermined control pattern and changes the content of the predetermined control pattern based on the received change instruction, A controller comprising: (Appendix 2) The moving mechanism moves a head (53B) that supports the heater tool so as to be movable in the vertical direction in the vertical direction, Each of the predetermined control patterns before and after the change of the content based on the change instruction is a first pattern that holds the head at a first position during a first period (P1) of the heating period, a second pattern that moves the head from the first position to a second position above the first position during a second period (P2) following the first period, a third pattern that holds the head at the second position during a third period (P3) from the end timing of the second period to the solid timing (SP) at which the solder hardens, and the change instruction includes an instruction to change at least one of the first position, the second position, the first period, and the second period. The controller according to Appendix 1. (Appendix 3) The moving mechanism moves a head (53B) that supports the heater tool so as to be movable in the vertical direction in the vertical direction, Each of the predetermined control patterns before and after the change of the content based on the change instruction is a first pattern that holds the head at a first position during a first period (P1) of the heating period, During a second period (P2) following the first period, a second pattern for moving the head from the first position to a second position above the first position; During a third period (P3) from the end timing of the second period to the solid timing (SP) at which the solder hardens, a third pattern for moving the head downward after holding the head at the second position; and The change instruction includes an instruction to change at least one of the first position, the second position, the first period, and the second period. The controller according to Appendix 1. (Appendix 4) The change instruction can include an instruction to change the downward movement timing and / or the movement speed of the head in the third pattern. The controller according to Appendix 3. (Appendix 5) The heater tool When the head moves to the first position, it abuts against the work and moves upward by a predetermined amount relative to the head, and is configured to move downward by the predetermined amount when the solder of the work melts. The controller according to any one of Appendices 2 to 4. (Appendix 6) A controller according to any one of Appendices 1 to 5, and a welding machine (50) including the heater tool and performing soldering of the work by the heater tool under the control of the controller. Soldering apparatus. (Appendix 7) A program that causes a computer to function as the controller according to any one of Appendices 1 to 6. (Appendix 8) A first step (S31) of performing soldering on the work as a sample by operating the controller according to any one of Appendices 1 to 6, a second step (S32) of checking the finish of the solder in the sample after soldering obtained in the first step, A third step (S33, S34) of causing the pattern change unit to receive the change instruction according to the confirmation result of the second step and changing the predetermined control pattern of the controller, Repeatedly execute the first step to the third step (S33, S34) until the finish confirmed in the second step becomes a desired finish (S33, S34), Method for setting a control pattern.

[0063] (Scope of the present invention) Although the present invention has been described with reference to the embodiments and modifications, the present invention is not limited to the above embodiments and modifications. For example, the present invention includes various changes to the above embodiments and modifications that can be understood by those skilled in the art within the scope of the technical idea of the present invention. For example, at least a part of each of the parts 22A to 22C of the controller 20 may be configured by various circuits such as an ASIC or an FPGA. Each configuration described in the above embodiments and modifications can be appropriately combined within a non - conflicting range. Also, omission of each configuration is optional.

Explanation of reference numerals

[0064] 10... Soldering device, 20... Controller, 21... Storage unit, 22... Processor, 22A... Heating control unit, 22B... Position control unit, 22C... Pattern change unit, 23... Main memory, 30... User interface, 31... Display device, 32... Operating device, 50... Welder, 51... Stage, 52... Heater tool, 53... Moving mechanism, 53A... Support column, 53B... Lifting head, 53C... Motor, 53D... Rod, 53E... Anti - detachment, 53F... Biasing mechanism, 53FA... Cylinder, 53FB... Cap, 53FC... Elastic body, 54... Displacement meter, 54A... Core, 54B... Coil, 59... Thermocouple, 60... Power supply circuit, K... Circuit board, S... Solder, W... Workpiece, W1... Joining target, W2... Joining target.

Claims

1. A controller for controlling the position of a heater tool that heats a workpiece including a first joining target, a second joining target, and solder for joining these from above to melt the solder, a position control unit that controls the vertical position of the heater tool by controlling a moving mechanism that moves the heater tool during a heating period in which the heater tool heats the workpiece according to a predetermined control pattern; a pattern change unit that receives an instruction to change the predetermined control pattern and changes the content of the predetermined control pattern based on the received instruction to change; A controller comprising:

2. The moving mechanism moves a head that supports the heater tool so as to be movable in the vertical direction in the vertical direction, Each of the predetermined control patterns before and after the change of the content based on the change instruction is a first pattern in which the head is held at a first position during a first period of the heating period; a second pattern in which the head is moved from the first position to a second position above the first position during a second period following the first period; a third pattern in which the head is held at the second position during a third period from the end timing of the second period to the solid timing at which the solder hardens, and includes, The change instruction includes an instruction to change at least one of the first position, the second position, the first period, and the second period. The controller according to claim 1.

3. The moving mechanism moves a head that supports the heater tool so as to be movable in the vertical direction in the vertical direction, Each of the predetermined control patterns before and after the change of the content based on the change instruction is a first pattern in which the head is held at a first position during a first period of the heating period; a second pattern in which the head is moved from the first position to a second position above the first position during a second period following the first period; a third pattern in which the head is moved downward after being held at the second position during a third period from the end timing of the second period to the solid timing at which the solder hardens, and includes, The change instruction includes an instruction to change at least one of the first position, the second position, the first period, and the second period. The controller according to claim 1.

4. The change instruction can include an instruction to change the downward movement timing and / or the movement speed of the head in the third pattern. The controller according to claim 3.

5. The heater tool when the head moves to the first position, abuts against the workpiece and moves upward by a predetermined amount relative to the head, and is configured to move downward by the predetermined amount when the solder of the workpiece melts. The controller according to any one of claims 2 to 4.

6. The controller according to claim 1, a soldering machine including the heater tool and performing soldering of the workpiece by the heater tool under the control of the controller. Soldering apparatus.

7. A program for causing a computer to function as the controller according to claim 1.

8. A first step of performing soldering on the workpiece as a sample by operating the controller according to claim 1, a second step of checking the finish of the solder in the sample after soldering obtained in the first step, and a third step of causing the pattern change unit to receive the change instruction according to the confirmation result of the second step and change the predetermined control pattern of the controller. The first step to the third step are repeatedly executed until the finish confirmed in the second step becomes a desired finish. Method for setting a control pattern.

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