Resin molding

Abstract

To provide a resin molding which is excellent in heat shielding properties, strength, and surface smoothness and suppresses warpage.SOLUTION: A resin molding 1 according to the present invention is formed by sequentially laminating: an infrared reflection layer 11 containing a first thermosetting resin 12, first glass fibers 13, and an infrared reflective pigment 14; a first reinforcing layer 21 containing a second thermosetting resin 22 and carbon fibers 23; and a second reinforcing layer 31 containing a third thermosetting resin 32 and second glass fibers 33. The resin molding 1 is suitable as a vehicle exterior material.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a resin molded body, particularly a resin molded body obtained by curing a reinforced fiber resin composite material.

Background Art

[0002] Conventionally, regarding exterior materials for vehicles, various technologies for suppressing the temperature rise inside the vehicle due to sunlight or the like have been proposed. For example, Patent Document 1 discloses a paint composition containing a scaly infrared reflective pigment and a resin. Patent Document 2 discloses a heat insulating film provided with a white reflective layer containing a white pigment.

[0003] However, in the case of the paint composition and the heat insulating film, it is difficult to further improve the heat insulating performance. In the paint composition, when the concentration of the pigment is increased, the viscosity increases, the coatability deteriorates, and it is difficult to obtain a good film formation. Further, according to Patent Document 1, when the thickness of the paint film exceeds 100 μm, coating film defects such as sagging and running are likely to occur, so it is difficult to increase the absolute amount of the pigment by thickening the paint film. Furthermore, when trying to increase the paint film thickness by applying multiple layers of the paint film, the workability deteriorates. Also, in the heat insulating film, according to Patent Document 2, from the viewpoint of maintaining strength, the thickness of the white reflective layer is preferably 200 μm or less, and it is difficult to increase the absolute amount of the pigment by thickening the reflective layer.

[0004] By the way, fiber-reinforced resin composite materials in which thermosetting resins such as vinyl ester resins are reinforced with carbon fibers as reinforcing fibers have attracted attention for their features of being lightweight while having excellent heat resistance and mechanical strength, and their use in various structural applications, including the casings or various members of automobiles and aircraft, is expanding (see, for example, Patent Document 3). For example, as a manufacturing method using the fiber-reinforced resin composite material, a method of hot compression molding an intermediate material called sheet molding compound (hereinafter sometimes abbreviated as "SMC") is known. By hot compression molding a laminate of a plurality of the SMCs, a resin molded body having an arbitrary thickness can be obtained. For example, a resin molded body having a thickness of 500 μm to 5 mm has excellent strength despite such a thickness and can be used as an exterior material for vehicles.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Patent Document 2

Patent Document 3

Summary of the Invention

Problems to be Solved by the Invention

[0006] An object of the present invention is to provide a resin molded body that is excellent in heat insulation properties, strength, and surface smoothness and has warpage suppressed.

Means for Solving the Problems

[0007] The inventors of the present case have found that a resin molded body comprising a thermosetting resin, containing carbon fibers as reinforcing fibers, and an infrared reflection layer containing an infrared reflective pigment is inferior in heat insulation properties. As a result of intensive studies, the inventors of the present case have found that carbon fibers absorb infrared rays, thereby impairing the heat insulation performance of the infrared reflective pigment, and have arrived at the present invention.

[0008] That is, the resin molded body according to the present invention includes an infrared reflection layer containing a first thermosetting resin, a first glass fiber, and an infrared reflective pigment, a first reinforcing layer containing a second thermosetting resin and carbon fiber, and a second reinforcing layer containing a third thermosetting resin and a second glass fiber, and the infrared reflection layer, the first reinforcing layer, and the second reinforcing layer are laminated in this order.

Effect of the Invention

[0009] According to the present invention, it is possible to provide a resin molded body that is excellent in heat insulation, strength, and surface smoothness and has warpage suppressed.

Brief Description of the Drawings

[0010]

Figure 1

Embodiments for Carrying Out the Invention

[0011] Hereinafter, embodiments of the present invention will be described. The resin molded body 1 of the present embodiment shown in FIG. 1 includes an infrared reflection layer 11, a first reinforcing layer 21, and a second reinforcing layer 31, and the layers 11, 21, 31 are laminated in this order and integrated. The infrared reflection layer 11 contains a first thermosetting resin 12, a first glass fiber 13, and an infrared reflective pigment 14. The first reinforcing layer 21 contains a second thermosetting resin 22 and carbon fiber 23. The second reinforcing layer 31 contains a third thermosetting resin 32 and a second glass fiber 33.

[0012] The resin molded body 1 preferably comprises a cured product of a laminate in which a first reinforced fiber resin composite material containing a first thermosetting resin 12, a first glass fiber 13, and an infrared reflective pigment 14, a second reinforced fiber resin composite material containing a second thermosetting resin 22 and a carbon fiber 23, and a third reinforced fiber resin composite material containing a third thermosetting resin 32 and a second glass fiber 33 are laminated in this order. From the viewpoints of workability, ease of handling, etc., the first to third reinforced fiber resin composite materials are preferably sheet molding compounds and prepregs.

[0013] The infrared reflective layer 11 is a layer provided on the side where infrared rays enter the resin molded body 1. The infrared reflective layer 11 can achieve both excellent heat insulation properties and surface smoothness by reinforcing the first thermosetting resin 12 in which the infrared reflective pigment 14 is dispersed with the first glass fiber 13. Here, when the infrared reflective layer 11 contains carbon fiber instead of the first glass fiber 13, the heat insulation property generated by the infrared reflective pigment 14 is impaired. Further, when the infrared reflective layer 11 does not contain any fiber, the polymerization shrinkage of the first thermosetting resin 12 during heat curing cannot be suppressed, the strength cannot be ensured, and excellent surface smoothness cannot be obtained.

[0014] The first reinforcing layer 21 is a layer provided adjacent to the infrared reflective layer 11. The first reinforcing layer 21 reinforces the second thermosetting resin 22 with the carbon fiber 23. By providing the resin molded body 1 with the first reinforcing layer 21, the strength can be improved as compared with the case where the resin molded body 1 is composed of only one layer of the infrared reflective layer 11.

[0015] The second reinforcing layer 31 is a layer provided on the side opposite to the infrared reflective layer 11 of the first reinforcing layer 21. The second reinforcing layer 31 reinforces the third thermosetting resin 32 with the second glass fiber 33. By providing the resin molded body 1 with the second reinforcing layer 31, the strength can be improved as compared with the case where the resin molded body 1 is composed of only two layers of the infrared reflective layer 11 and the first reinforcing layer 21.

[0016] Furthermore, by providing the resin molded body 1 with the second reinforcing layer 31 in addition to the infrared reflection layer 11 and the first reinforcing layer 21, it is possible to suppress warping during molding. Here, when the resin molded body is composed of only two layers, namely the infrared reflection layer 11 and the first reinforcing layer 21, when the laminate in which the first reinforced fiber resin composite material and the second reinforced fiber resin composite material are laminated is cured by heating and then cooled, the infrared reflection layer 11 shrinks more than the first reinforcing layer 21, resulting in warping of the resin molded body. This is due to the difference in the thermal shrinkage rate between the first glass fiber 13 contained in the infrared reflection layer 11 and the carbon fiber 23 contained in the first reinforcing layer 21.

[0017] In order to suppress the occurrence of warping in the resin molded body 1, the second reinforcing layer 31 is designed to have a thermal shrinkage rate substantially equivalent to that of the infrared reflection layer 11. For example, it is preferable that the second reinforcing layer 31 has substantially the same configuration as the infrared reflection layer 11 except that it does not contain the infrared reflective pigment 14.

[0018] Specifically, the third thermosetting resin 32 constituting the second reinforcing layer 31 is substantially the same as the first thermosetting resin 12 constituting the infrared reflection layer 11, the content mass of the third thermosetting resin 32 in the second reinforcing layer 31 is substantially the same as the total content mass of the first thermosetting resin 12 and the infrared reflective pigment 14 in the infrared reflection layer 11, the second glass fiber 33 constituting the second reinforcing layer 31 is substantially the same as the first glass fiber 13 constituting the infrared reflection layer 11, and it is preferable that the content mass of the second glass fiber 33 in the second reinforcing layer 31 is substantially the same as the content mass of the first glass fiber 13 in the infrared reflection layer 11. Here, "substantially the same" means that it is sufficient as long as the thermal shrinkage rate of the second reinforcing layer 31 can have a thermal shrinkage rate substantially equivalent to that of the infrared reflection layer 11, and it does not have to be exactly the same.

[0019] For example, in a range where the heat shrinkage rate of the second reinforcing layer 31 is substantially equivalent to that of the infrared reflecting layer 11, it is preferable to adjust the resin composition containing the third thermosetting resin 32 and other additive components so that it is substantially the same as the resin composition of the first thermosetting resin 12. Also, in a range where the heat shrinkage rate of the second reinforcing layer 31 is substantially equivalent to that of the infrared reflecting layer 11, it is preferable to adjust the content mass of the third thermosetting resin 32 in the second reinforcing layer 31 to be in a range substantially the same as the total content mass of the first thermosetting resin 12 and the infrared reflective pigment 14 in the infrared reflecting layer 11. For example, it is preferable to adjust the content mass of the third thermosetting resin 32 in the second reinforcing layer 31 to be in the range of ±10% of the total content mass of the first thermosetting resin 12 and the infrared reflective pigment 14 in the infrared reflecting layer 11. Also, in a range where the heat shrinkage rate of the second reinforcing layer 31 is substantially equivalent to that of the infrared reflecting layer 11, it is preferable to adjust the material and form of the second glass fiber 33 to be substantially the same as the material and form of the first glass fiber 13. Also, in a range where the heat shrinkage rate of the second reinforcing layer 31 is substantially equivalent to that of the infrared reflecting layer 11, it is preferable to adjust the content mass of the second glass fiber 33 in the second reinforcing layer 31 to be in a range substantially the same as the content mass of the first glass fiber 13 in the infrared reflecting layer 11. For example, it is preferable to adjust the content mass of the second glass fiber 33 in the second reinforcing layer 31 to be in the range of ±10% of the content mass of the first glass fiber 13 in the infrared reflecting layer 11.

[0020] Since the heat shrinkage rate of the second reinforcing layer 31 is substantially equivalent to that of the infrared reflecting layer 11, for simplicity, the second reinforcing layer 31 preferably contains a third thermosetting resin 32 having the same resin composition as the first thermosetting resin 12 and a second glass fiber 33 having the same material and form as the first glass fiber 13, and has the same dimensions (length × width × thickness) as the infrared reflecting layer.

[0021] As described above, the resin molded body 1 has excellent heat insulation properties, strength, and surface smoothness, and can suppress the occurrence of warping.

[0022] The shape of the resin molded body 1 is arbitrary and may be sheet-like or may be three-dimensional such as a box. The resin molded body 1 preferably has an overall thickness in the range of 0.5 mm or more and 10 mm or less, and the thickness of the infrared reflection layer 11 is preferably in the range of 0.1 mm or more and 2 mm or less. Since the infrared reflection layer 11 having the above thickness can contain a sufficient amount of infrared reflective pigment 14, the resin molded body 1 having the above thickness can have both heat insulation properties and strength required for an exterior material for vehicles. At this time, from the viewpoint of suppressing warping of the resin molded body 1, the thickness of the second reinforcing layer 31 is preferably substantially the same as the thickness of the infrared reflection layer 11. Further, from the viewpoint of strength, the thickness of the first reinforcing layer 21 is preferably in the range of 0.3 mm or more and 6 mm or less.

[0023] Next, the first to third reinforced fiber resin composite materials suitable for molding the infrared reflection layer 11, the first reinforcing layer 21, and the second reinforcing layer 31 will be described. From the viewpoints of workability and handleability, each reinforced fiber resin composite material is preferably a sheet molding compound or a prepreg.

[0024] <First Reinforced Fiber Resin Composite Material> The first reinforced fiber resin composite material essentially contains a first thermosetting resin, a first glass fiber, and an infrared reflective pigment.

[0025] The first thermosetting resin may be any commonly used one, and epoxy resin, vinyl ester resin, phenolic resin, urea resin, unsaturated polyester resin, melamine resin, polyurethane, silicone resin, acrylic resin, etc. can be used. Since a resin molded body with higher strength can be obtained, it is preferably an epoxy resin or a vinyl ester resin. The first reinforced fiber resin composite material may include a resin composition containing the first thermosetting resin.

[0026] The resin composition can be arbitrarily selected without particular limitation according to the desired physical properties of the resin molded product, the application, etc. Hereinafter, the details of the epoxy resin composition and the vinyl ester resin composition will be described.

[0027] The epoxy resin composition is a thermosetting resin composition containing an epoxy group-containing compound and a curing agent or a curing accelerator. The specific structure of the epoxy group-containing compound is not particularly limited as long as it has an epoxy group in its molecular structure, and various types can be used. It may be used alone or in combination of two or more. Among them, since it becomes an epoxy resin composition excellent in the curing reaction, the epoxy group-containing compound is preferably a compound having two or more epoxy groups in its molecular structure. The proportion of the compound having two or more epoxy groups in the molecular structure in the whole epoxy group-containing compound is preferably 80% by mass or more, and particularly preferably 90% by mass or more.

[0028] Examples of the epoxy group-containing compound include diglycidyloxybenzene, diglycidyloxynaphthalene, biphenol type epoxy resin, bisphenol type epoxy resin, polyglycidyl ether of aliphatic polyol, novolak type epoxy resin, alicyclic epoxy resin, glycidylamine type epoxy resin, heterocyclic type epoxy resin, glycidyl ester type epoxy resin, triphenolmethane type epoxy resin, phenol or naphthol aralkyl type epoxy resin, phenylene or naphthylene ether type epoxy resin, oxazolidone-modified epoxy resin, brominated epoxy resins thereof, and epoxy resins obtained by extending these epoxy group-containing compounds with an extender.

[0029] Examples of the bisphenol type epoxy resin include bisphenol compounds such as bisphenol and tetramethylbisphenol, and those obtained by polyglycidyl etherifying one or more kinds of alkylene oxide adducts of these bisphenol compounds with epihalohydrin.

[0030] Examples of the bisphenol type epoxy resin include those obtained by polyglycidyl etherifying one or more alkylene oxide adducts of bisphenol compounds such as bisphenol A, bisphenol F, bisphenol S, bisphenol fluorene, and biscresol fluorene with epihalohydrin, and bisphenol compounds themselves.

[0031] Examples of the polyglycidyl ether of the aliphatic polyol include those obtained by polyglycidyl etherifying one or more alkylene oxide adducts of various aliphatic polyol compounds with epihalohydrin. Examples of the aliphatic polyol compounds include aliphatic diol compounds such as ethylene glycol, propylene glycol, 1,3 - propanediol, 2 - methylpropanediol, 1,2,2 - trimethyl - 1,3 - propanediol, 2,2 - dimethyl - 3 - isopropyl - 1,3 - propanediol, 1,4 - butanediol, 1,3 - butanediol, 3 - methyl - 1,3 - butanediol, 1,5 - pentanediol, 3 - methyl 1,5 - pentanediol, neopentyl glycol, 1,6 - hexanediol, 1,4 - bis(hydroxymethyl)cyclohexane, 2,2,4 - trimethyl - 1,3 - pentanediol; alicyclic diol compounds such as 2,2 - bis(4 - hydroxyphenyl)propane; and trifunctional or higher - functional aliphatic polyol compounds such as trimethylolethane, trimethylolpropane, glycerin, hexanetriol, pentaerythritol, ditrimethylolpropane, and dipentaerythritol.

[0032] Examples of the novolak type epoxy resin include those obtained by polyglycidyl etherifying a novolak resin composed of one or more of various phenol compounds such as phenol, dihydroxybenzene, cresol, xylenol, naphthol, dihydroxynaphthalene, bisphenol, and biphenol with epihalohydrin.

[0033] Examples of alicyclic epoxy resins include, for example, those obtained by hydrogenating the above-mentioned biphenol compounds or bisphenol compounds, or those obtained by polyglycidyl etherifying one or more kinds of alkylene oxide adducts thereof with epihalohydrin, as well as 3,4-epoxy-6-methylcyclohexylmethyl-3,4-epoxy-6-methylcyclohexanecarboxylate, 1-epoxyethyl-3,4-epoxycyclohexane, and the like.

[0034] Examples of the glycidylamine type epoxy resins include, for example, N,N-diglycidylaniline, triglycidylaminophenol, tetraglycidylxylylenediamine, 4,4'-methylenebis[N,N-diglycidylaniline], and the like.

[0035] Examples of the heterocyclic type epoxy resins include, for example, 1,3-diglycidyl-5,5-dimethylhydantoin, triglycidyl isocyanurate, and the like.

[0036] Examples of the glycidyl ester type epoxy resins include, for example, diglycidyl phthalate, diglycidyl tetrahydrophthalate, diglycidyl-p-oxybenzoic acid, glycidyl dimer acid ester, and the like.

[0037] Examples of the extender for epoxy resins include, for example, the above-mentioned various biphenol compounds and their hydrogenated products, the above-mentioned various bisphenol compounds and their hydrogenated products, dibasic acid compounds, acid group-containing polyester resins, and the like.

[0038] Among these, since the epoxy resin is excellent in the strength of the resin molded product and the impregnation property to glass fiber and carbon fiber, it is preferably the bisphenol type epoxy resin, and more preferably the bisphenol type epoxy resin having an epoxy equivalent in the range of 160 to 260 g / equivalent. The proportion of the bisphenol type epoxy resin in the whole epoxy group-containing compound is preferably 40% by mass or more, more preferably 60% by mass or more, and particularly preferably 70% by mass or more. The proportion is preferably 95% by mass or less, and more preferably 90% or less.

[0039] Also, from the viewpoint of reducing the viscosity of the epoxy resin, the epoxy resin composition preferably contains a polyglycidyl ether of the aliphatic polyol, and more preferably a polyglycidyl ether of an aliphatic polyol having 2 to 6 carbon atoms. The proportion of the polyglycidyl ether of the aliphatic polyol in the whole epoxy group-containing compound is preferably 5% by mass or more, and more preferably 10% by mass or more. The proportion is preferably 50% by mass or less, and more preferably 35% by mass or less.

[0040] When the bisphenol type epoxy resin and the polyglycidyl ether of the aliphatic polyol are used in combination, the mass ratio of the two (bisphenol type epoxy resin) / (polyglycidyl ether of aliphatic polyol) is preferably in the range of 60 / 40 to 95 / 5, and more preferably in the range of 70 / 30 to 85 / 15.

[0041] As the curing agent or curing accelerator, various compounds generally used as the curing agent or curing accelerator for the epoxy group-containing compound can be used without particular limitation. Further, the curing agent or curing accelerator may be used alone or in combination of two or more.

[0042] Examples of the curing agent or curing accelerator include amine compounds, amide compounds, acid anhydrides, phenolic hydroxyl group-containing compounds, phosphorus compounds, imidazole compounds, imidazoline compounds, urea-based compounds, organic acid metal salts, Lewis acids, amine complex salts, and the like.

[0043] Examples of the amine compounds include aliphatic amine compounds such as ethylenediamine, tetramethylethylenediamine, diethylenetriamine, hexamethylenediamine, triethylenetetramine, and guanidine derivatives; alicyclic and heterocyclic amine compounds such as piperidine, piperazine, isophoronediamine, and 1,8-diazabicyclo-[5.4.0]-undecene (DBU); aromatic amine compounds such as phenylenediamine, diaminodiphenylmethane, diaminodiphenylsulfone, benzylmethylamine, dimethylbenzylamine, xylenediamine, and pyridine; and boron trifluoride amine complex.

[0044] Examples of the amide compounds include dicyandiamide and polyamideamine. The polyamideamine is obtained, for example, by reacting aliphatic dicarboxylic acids such as succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, and azelaic acid, carboxylic acid compounds such as fatty acids and dimer acids, with aliphatic polyamines or polyamines having a polyoxyalkylene chain.

[0045] Examples of the acid anhydrides include phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, maleic anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylnadic anhydride, hexahydrophthalic anhydride, and methylhexahydrophthalic anhydride.

[0046] Examples of the phenolic hydroxyl group-containing resins include various novolak resins, dicyclopentadiene phenol addition type resins, phenol or naphthol aralkyl resins, triphenol methane resins, phenol or naphthol aralkyl resins, phenylene or naphthylene ether resins, and aminotriazine-modified phenol resins.

[0047] Examples of the phosphorus compound include alkylphosphines such as ethylphosphine and butylphosphine, primary phosphines such as phenylphosphine; dialkylphosphines such as dimethylphosphine and dipropylphosphine; secondary phosphines such as diphenylphosphine and methylethylphosphine; and tertiary phosphines such as trimethylphosphine, triethylphosphine, and triphenylphosphine.

[0048] Examples of the imidazole compound include imidazole, 1-methylimidazole, 2-methylimidazole, 3-methylimidazole, 4-methylimidazole, 5-methylimidazole, 1-ethylimidazole, 2-ethylimidazole, 3-ethylimidazole, 4-ethylimidazole, 5-ethylimidazole, 1-n-propylimidazole, 2-n-propylimidazole, 1-isopropylimidazole, 2-isopropylimidazole, 1-n-butylimidazole, 2-n-butylimidazole, 1-isobutylimidazole, 2-isobutylimidazole, 2-undecyl-1H-imidazole, 2-heptadecyl-1H-imidazole, 1,2-dimethylimidazole, 1,3-dimethylimidazole, 2,4-dimethylimidazole, 2-ethyl-4-methylimidazole, 1-phenylimidazole, 2-phenyl-1H-imidazole, 4-methyl-2-phenyl-1H-imidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, 2-phenylimidazole isocyanurate adduct, 2-methylimidazole isocyanurate adduct, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 1-cyanoethyl-2-phenyl-4,5-di(2-cyanoethoxy)methylimidazole, 1-dodecyl-2-methyl-3-benzylimidazolium chloride, 1-benzyl-2-phenylimidazole hydrochloride, and the like.

[0049] Examples of the imidazoline compound include 2-methylimidazoline, 2-phenylimidazoline, and the like.

[0050] Examples of the urea compound include p-chlorophenyl-N,N-dimethylurea, 3-phenyl-1,1-dimethylurea, 3-(3,4-dichlorophenyl)-N,N-dimethylurea, N-(3-chloro-4-methylphenyl)-N',N'-dimethylurea, 4,4'-methylenebis(phenyldimethylurea), and the like.

[0051] Among these, as the curing agent or curing accelerator, an amine compound, an amide compound, an imidazole compound, or a urea compound is preferable because they have fast curing speed and excellent strength of the cured product.

[0052] When using a compound having a functional group capable of reacting with an epoxy group, such as an amine compound, an amide compound, an acid anhydride, or a phenolic hydroxyl group-containing compound, the blending amount of the curing agent or curing accelerator in the epoxy resin composition is preferably in the range of 0.5 to 1.2 moles of the functional group or active hydrogen in the curing agent per mole of the epoxy group in the epoxy group-containing compound. When using a phosphorus compound, an imidazole compound, an imidazoline compound, a urea-based compound, etc., it is preferable to blend the curing agent or curing accelerator in a proportion of 0.5 to 20 parts by mass with respect to 100 parts by mass of the epoxy group-containing compound.

[0053] The epoxy resin composition may contain other components in addition to the epoxy group-containing compound and the curing agent or curing accelerator. Examples of the other components include curable compounds, curing catalysts, water absorbents, thermoplastic resins, inorganic fillers, low shrinkage agents, mold release agents, thickeners, viscosity reducers, pigments, antioxidants, plasticizers, flame retardants, antibacterial agents, ultraviolet stabilizers, reinforcing materials, etc., other than the epoxy group-containing compound and the curing agent or curing accelerator. These other components are appropriately added according to the desired performance and use of the sheet molding compound, and the addition amount is also arbitrary.

[0054] Among them, since a sheet molding compound excellent in handleability such as peelability from a carrier film can be obtained, the epoxy resin composition preferably further contains a polyhydroxy compound and a polyisocyanate compound. At this time, the total mass of the epoxy group-containing compound, the curing agent or curing accelerator, the polyhydroxy compound, and the polyisocyanate compound in the epoxy resin composition is preferably 80% by mass or more, and particularly preferably 90% by mass or more.

[0055] As long as the polyhydroxy compound has a plurality of hydroxyl groups in its molecular structure, its specific structure is not particularly limited, and a wide variety of them can be used. The polyhydroxy compound may be used alone or in combination of two or more. In the present specification, those having an epoxy group among the polyhydroxy compounds are treated as the epoxy group-containing compounds.

[0056] Examples of the polyhydroxy compound include aliphatic polyol compounds, dihydroxybenzenes, dihydroxynaphthalenes, trihydroxybenzenes, trihydroxynaphthalenes, triphenolalkanes, biphenol compounds, bisphenol compounds, alicyclic polyol compounds, novolak resins, phenol or naphthol aralkyl type resins, phenylene or naphthylene ether type resins, and alkylene oxide adducts thereof.

[0057] Examples of the aliphatic polyol compound include aliphatic diol compounds such as ethylene glycol, propylene glycol, 1,3-propanediol, 2-methylpropanediol, 1,2,2-trimethyl-1,3-propanediol, 2,2-dimethyl-3-isopropyl-1,3-propanediol, 1,4-butanediol, 1,3-butanediol, 3-methyl-1,3-butanediol, 1,5-pentanediol, 3-methyl-1,5-pentanediol, neopentyl glycol, 1,6-hexanediol, 1,4-bis(hydroxymethyl)cyclohexane, 2,2,4-trimethyl-1,3-pentanediol; alicyclic diol compounds such as 2,2-bis(4-hydroxyphenyl)propane; and trifunctional or higher-functional aliphatic polyol compounds such as trimethylolethane, trimethylolpropane, glycerin, hexanetriol, pentaerythritol, ditrimethylolpropane, dipentaerythritol, etc.

[0058] Examples of the biphenol compound include biphenol, tetramethylbiphenol, etc.

[0059] Examples of the bisphenol compound include bisphenol compounds such as bisphenol A, bisphenol F, bisphenol S, bisphenol fluorene, biscresol fluorene, etc.

[0060] Examples of the alicyclic polyol compound include cyclohexanediol and those obtained by hydrogenating the above-mentioned biphenol compound and bisphenol compound.

[0061] Examples of the novolak resin include novolak resins composed of one or more of various phenol compounds such as phenol, dihydroxybenzene, cresol, xylenol, naphthol, dihydroxynaphthalene, bisphenol, biphenol, etc.

[0062] Among them, since a sheet molding compound excellent in handleability such as peelability from a carrier film can be obtained, it is preferable to use a polyhydroxy compound having a hydroxyl equivalent in the range of 125 to 600 g / equivalent, and the ratio of the polyhydroxy compound having a hydroxyl equivalent in the range of 125 to 600 g / equivalent to the whole polyhydroxy compound is more preferably 70% by mass or more, and particularly preferably 80% by mass or more. Further, the polyhydroxy compound preferably has a (poly)alkylene oxide structure in its molecular structure, more preferably an alkylene oxide adduct of the aliphatic polyol compound or the bisphenol compound, and the aliphatic polyol compound more preferably has 2 to 6 carbon atoms. Further, its hydroxyl equivalent is more preferably in the range of 150 to 400 g / equivalent.

[0063] In addition, since a sheet molding compound excellent in handleability such as the strength of the resin molded product and peelability from the carrier film can be obtained, the blending amount of the polyhydroxy compound is preferably 5 parts by mass or more, more preferably 10 parts by mass or more, based on 100 parts by mass of the epoxy group-containing compound, and preferably 50 parts by mass or less, more preferably 30 parts by mass or less.

[0064] As long as the polyisocyanate compound has a plurality of isocyanate groups in its molecular structure, its specific structure is not particularly limited, and a wide variety of compounds can be used. The polyisocyanate compound may be used alone or in combination of two or more. Specific examples include, for example, aliphatic diisocyanate compounds such as butane diisocyanate, pentamethylene diisocyanate, hexamethylene diisocyanate, 2,2,4-trimethylhexamethylene diisocyanate, 2,4,4-trimethylhexamethylene diisocyanate, dimer acid diisocyanate; alicyclic diisocyanate compounds such as norbornane diisocyanate, isophorone diisocyanate, hydrogenated xylylene diisocyanate, hydrogenated diphenylmethane diisocyanate; aromatic diisocyanate compounds such as toluene diisocyanate, xylylene diisocyanate, tetramethylxylylene diisocyanate, tolidine diisocyanate, diphenylmethane diisocyanate, 1,5-naphthalene diisocyanate, polymethylene polyphenyl polyisocyanate; isocyanurate-modified products, biuret-modified products, allophanate-modified products, carbodiimide-modified products, urethane imine-modified products, and polyol-modified products modified with polyols having a number average molecular weight of 1,000 or less such as diethylene glycol and dipropylene glycol, which are modified products of these isocyanate compounds.

[0065] Among these, aromatic polyisocyanate compounds or their various modified products are preferred because a sheet molding compound excellent in handleability such as peelability from a carrier film can be obtained. The isocyanate group content is preferably 15% by mass or more, more preferably 20% by mass or more, and preferably 40% by mass or less.

[0066] The addition amount of the polyisocyanate compound is preferably such that the molar ratio of the isocyanate groups in the polyisocyanate compound to 1 mol of the hydroxyl groups in the polyhydroxy compound is 0.5 or more, more preferably 0.8 or more, since a sheet molding compound excellent in handleability such as releasability from the carrier film can be obtained. Further, it is preferably 3.0 or less, more preferably 1.5 or less, and particularly preferably 1.2 or less.

[0067] When the epoxy resin composition contains the polyisocyanate compound and the polyol compound, a urethanization catalyst and a water absorbent may be added as necessary. One type of urethanization catalyst may be used alone, or two or more types may be used in combination. Examples of the urethanization catalyst include amine compounds such as triethylamine, dibutylamine, triethylenediamine, and pyridine; phosphorus compounds such as triphenylphosphine and triethylphosphine; organotin compounds such as dibutyltin dilaurate, octyltin trilaurate, octyltin diacetate, dibutyltin diacetate, and tin octylate; organic zinc compounds such as zinc amine, zinc carboxylate, zinc stearate, and zinc octylate; organic bismuth compounds such as bismuth carboxylate; organic zirconium compounds such as zirconium acetylacetonate and zirconium tetraethanolate; organic aluminum compounds such as aluminum triethoxide; and organic titanium compounds such as titanium tetrabutyrate and titanium ethyl acetoacetate. Among them, organic zinc compounds and organic bismuth compounds are preferred because of their excellent safety to living bodies and storage stability.

[0068] When the urethanization catalyst is used, its addition amount is preferably in the range of 0.002 to 1% by mass, more preferably in the range of 0.01 to 0.8% by mass, based on the total mass of the epoxy group-containing compound, the curing agent or curing accelerator, the polyhydroxy compound, and the polyisocyanate compound.

[0069] The absorbent may be used alone or in combination of two or more kinds. Examples of the absorbent include silica gel, activated alumina, molecular sieve, etc. Among these, molecular sieve is preferable from the viewpoint of excellent water absorption efficiency. The pore diameter thereof is preferably in the range of 0.1 to 0.5 nm, more preferably in the range of 0.2 to 0.4 nm. Further, the particle size is preferably 50 μm or less, more preferably 10 μm or less. When using the absorbent, the addition amount thereof is preferably in the range of 0.1 to 5% by mass based on the total mass of the epoxy group-containing compound, the curing agent or curing accelerator, the polyhydroxy compound, and the polyisocyanate compound.

[0070] Since it has excellent impregnation properties with respect to glass fiber and carbon fiber, the viscosity of the epoxy resin composition at 25°C is preferably 100 mPa·s or more, more preferably 300 mPa·s or more, and preferably 10,000 mPa·s or less, more preferably 6,000 mPa·s or less. In the present specification, the viscosity measurement of the epoxy resin composition is the value measured within 10 minutes after all the components of the epoxy resin composition are mixed.

[0071] The vinyl ester resin composition is a thermosetting resin composition containing a vinyl ester resin. Examples of the vinyl ester resin include those using an epoxy group-containing compound and (meth)acrylic acid as reaction raw materials. The vinyl ester resin may be used alone or in combination of two or more kinds. In the present specification, “(meth)acrylic acid” means either one or both of acrylic acid and methacrylic acid, and “(meth)acrylate” means either one or both of acrylate and methacrylate.

[0072] Examples of the epoxy group-containing compound serving as a reaction raw material for the vinyl ester resin include the various compounds exemplified above as those contained in the epoxy resin composition. Among them, the bisphenol type epoxy resin or an epoxy resin obtained by extending the bisphenol type epoxy resin with an extender is preferable because it is excellent in the strength of the resin molded product and the impregnation properties with glass fibers and carbon fibers. The epoxy equivalent of the bisphenol type epoxy resin or an epoxy resin obtained by extending the bisphenol type epoxy resin with an extender is preferably 160 g / eq or more, more preferably 170 g / eq or more, and preferably 400 g / eq or less, more preferably 380 g / eq or less.

[0073] The reaction between the epoxy group-containing compound and (meth)acrylic acid can be carried out by heating under temperature conditions of about 60 to 140°C in the presence of an arbitrary esterification catalyst. A reaction solvent may be used or a polymerization inhibitor may be added as necessary. Further, the reaction ratio between the epoxy group-containing compound and (meth)acrylic acid is preferably in the range of 0.6 to 1.1 in terms of the molar ratio of both functional groups [carboxy group / epoxy group] in order to obtain a vinyl ester resin excellent in performance balance such as impregnation properties with glass fibers and carbon fibers and curability. When a plurality of types of the vinyl ester resin are used in combination, a plurality of epoxy group-containing compounds may be acrylated (meth)acrylate at once, or those acrylated (meth)acrylate separately may be blended.

[0074] The proportion of the vinyl ester resin using the bisphenol type epoxy resin or an epoxy resin obtained by extending the bisphenol type epoxy resin with an extender as a reaction raw material in the total vinyl ester resin is preferably 70% by mass or more, more preferably 80% by mass or more, and particularly preferably 90% by mass or more.

[0075] The vinyl ester resin composition may contain other components other than the vinyl ester resin composition. Examples of the other components include, for example, polymerizable unsaturated group-containing compounds other than the vinyl ester resin, polyisocyanate compounds, curing catalysts, water absorbents, thermoplastic resins, inorganic fillers, low shrinkage agents, mold release agents, thickeners, viscosity reducers, pigments, antioxidants, plasticizers, flame retardants, antibacterial agents, ultraviolet stabilizers, reinforcing materials, and the like. These other components are appropriately added according to the desired performance and use of the sheet molding compound, and the addition amount thereof is also arbitrary.

[0076] Among them, since it is excellent in the strength of the resin molded product and the impregnation property to glass fiber and carbon fiber, it is preferable to use a polymerizable unsaturated group-containing compound other than the vinyl ester resin. The polymerizable unsaturated group-containing compound may be used alone or in combination of two or more. When using a polymerizable unsaturated group-containing compound, the ratio of the polymerizable unsaturated group-containing compound to a total of 100 parts by mass of the thermosetting resin and the polymerizable unsaturated group-containing compound is preferably 15% by mass or more, more preferably 30% by mass or more, and preferably 70% by mass or less, more preferably 60% by mass or less, and particularly preferably 50% by mass or less.

[0077] Examples of the polymerizable unsaturated group-containing compound include aliphatic mono(meth)acrylate compounds such as methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, pentyl (meth)acrylate, hexyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, octyl (meth)acrylate, isodecyl (meth)acrylate, lauryl (meth)acrylate, isotridecyl (meth)acrylate, n-stearyl (meth)acrylate, ethylene glycol (meth)acrylate alkyl ether, and propylene glycol (meth)acrylate alkyl ether; alicyclic mono(meth)acrylate compounds such as cyclohexyl (meth)acrylate, isobornyl (meth)acrylate, adamantyl mono(meth)acrylate, dicyclopentenyl oxyethyl (meth)acrylate, and dicyclopentanyl methacrylate; heterocyclic ring-containing mono(meth)acrylate compounds such as glycidyl (meth)acrylate and tetrahydrofurfuryl acrylate; aromatic ring-containing mono(meth)acrylate compounds such as benzyl (meth)acrylate, phenyl (meth)acrylate, phenylbenzyl (meth)acrylate, phenoxy (meth)acrylate, phenoxyethyl (meth)acrylate, phenoxyethoxyethyl (meth)acrylate, 2-hydroxy-3-phenoxypropyl (meth)acrylate, phenoxybenzyl (meth)acrylate, benzylbenzyl (meth)acrylate, and phenylphenoxyethyl (meth)acrylate; (poly)oxyalkylene-modified mono(meth)acrylate compounds in which a polyoxyalkylene chain such as a (poly)oxyethylene chain, a (poly)oxypropylene chain, or a (poly)oxytetramethylene chain is introduced into the molecular structure of the various mono(meth)acrylate monomers; lactone-modified mono(meth)acrylate compounds in which a (poly)lactone structure is introduced into the molecular structure of the various mono(meth)acrylate compounds; aliphatic di(meth)acrylate compounds such as ethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, butanediol di(meth)acrylate, hexanediol di(meth)acrylate, and neopentyl glycol di(meth)acrylate;Alicyclic di(meth)acrylate compounds such as 1,4-cyclohexanedimethanol di(meth)acrylate, norbornane di(meth)acrylate, norbornanedimethanol di(meth)acrylate, dicyclopentanyl di(meth)acrylate, tricyclodecane dimethanol di(meth)acrylate; aromatic ring-containing di(meth)acrylate compounds such as biphenol di(meth)acrylate, bisphenol di(meth)acrylate; polyoxyalkylene-modified di(meth)acrylate compounds in which a (poly)oxyalkylene chain such as a (poly)oxyethylene chain, a (poly)oxypropylene chain, or a (poly)oxytetramethylene chain is introduced into the molecular structure of the various di(meth)acrylate compounds; lactone-modified di(meth)acrylate compounds in which a (poly)lactone structure is introduced into the molecular structure of the various di(meth)acrylate compounds; aliphatic tri(meth)acrylate compounds such as trimethylolpropane tri(meth)acrylate, glycerin tri(meth)acrylate; (poly)oxyalkylene-modified tri(meth)acrylate compounds in which a (poly)oxyalkylene chain such as a (poly)oxyethylene chain, a (poly)oxypropylene chain, or a (poly)oxytetramethylene chain is introduced into the molecular structure of the aliphatic tri(meth)acrylate compounds; lactone-modified tri(meth)acrylate compounds in which a (poly)lactone structure is introduced into the molecular structure of the aliphatic tri(meth)acrylate compounds; tetrafunctional or higher aliphatic poly(meth)acrylate compounds such as pentaerythritol tetra(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate, dipentaerythritol hexa(meth)acrylate; tetrafunctional or higher (poly)oxyalkylene-modified poly(meth)acrylate compounds in which a (poly)oxyalkylene chain such as a (poly)oxyethylene chain, a (poly)oxypropylene chain, or a (poly)oxytetramethylene chain is introduced into the molecular structure of the aliphatic poly(meth)acrylate compounds; tetrafunctional or higher lactone-modified poly(meth)acrylate compounds in which a (poly)lactone structure is introduced into the molecular structure of the aliphatic poly(meth)acrylate compounds, etc. can be mentioned.;

[0078] Among them, since it is excellent in the strength of the resin molded product and the impregnation property to glass fiber and carbon fiber, the aromatic ring-containing (meth)acrylate compound is preferable, and the aromatic ring-containing mono(meth)acrylate is more preferable.

[0079] In addition, since a sheet molding compound excellent in handleability such as peelability from the carrier film can be produced, the vinyl ester resin composition preferably contains a polyisocyanate compound. The polyisocyanate compound may be used alone or in combination of two or more. The addition amount of the polyisocyanate compound is preferably 5% by mass or more, more preferably 10% by mass or more, and preferably 40% by mass or less, more preferably 30% by mass or less based on the total mass of the vinyl ester resin and the polymerizable unsaturated group-containing compound.

[0080] Examples of the polyisocyanate compound include various compounds exemplified as those that the epoxy resin composition may contain. Among them, since a sheet molding compound excellent in handleability such as peelability from the carrier film can be produced, an aromatic polyisocyanate compound or various modified products thereof is preferable. The isocyanate group content is preferably 15% by mass or more, more preferably 20% by mass or more, and preferably 40% by mass or less.

[0081] The vinyl ester resin composition may contain a polymerization initiator. General polymerization initiators can be used without particular limitation, but organic peroxides are particularly preferred. Examples of the organic peroxide include diacyl peroxide compounds, peroxyester compounds, hydroperoxide compounds, ketone peroxide compounds, alkyl perester compounds, percarbonate compounds, peroxyketals, and the like. These polymerization initiators may be used alone or in combination of two or more. From the viewpoint of the balance between storage stability and curability, the addition amount of the polymerization initiator is preferably 0.1% by mass or more, more preferably 0.2% by mass or more, still more preferably 0.3% by mass or more, and preferably 3% by mass or less, more preferably in the range of 2% by mass or less, based on the total mass of the vinyl ester resin and the polymerizable unsaturated group-containing compound.

[0082] The vinyl ester resin composition may contain a polymerization inhibitor. Examples of the polymerization inhibitor include hydroquinone, trimethylhydroquinone, p-t-butylcatechol, t-butylhydroquinone, toluohydroquinone, p-benzoquinone, naphthoquinone, hydroquinone monomethyl ether, phenothiazine, copper naphthenate, copper chloride, and the like. These may be used alone or in combination of two or more. The addition amount of the polymerization inhibitor is preferably in the range of 0.01 to 3% by mass based on the total mass of the vinyl ester resin and the polymerizable unsaturated group-containing compound.

[0083] Since it has excellent impregnation properties with respect to glass fibers and carbon fibers, the viscosity of the vinyl ester resin composition at 25°C is preferably 100 mPa·s or more, more preferably 300 mPa·s or more, and preferably 10,000 mPa·s or less, more preferably 6,000 mPa·s or less. In the present specification, the viscosity measurement of the vinyl ester resin composition is the value measured within 10 minutes after all the components of the vinyl ester resin composition are mixed.

[0084] As the resin contained in the reinforced fiber resin composite material, in addition to the thermosetting resin, a thermoplastic resin may be used. Examples of the thermoplastic resin include polyamide resin; polyacetal resin; aromatic polyester resins such as polyethylene terephthalate resin, polybutylene terephthalate resin, and polycarbonate resin; polyurethane resin; polyolefin resins such as polypropylene resin and polyethylene resin;, polystyrene resin; acrylic resin; polyarylene sulfide resin or those modified by copolymerization or the like. These may be used alone or in combination of two or more.

[0085] The reinforced fiber resin composite material essentially contains, in addition to the first thermosetting resin, first glass fiber and an infrared reflection pigment.

[0086] Examples of the first glass fiber include aggregates of glass fibers such as deposits of chopped glass fibers, chopped glass fiber mats, glass fiber woven fabrics, and glass fiber non-woven fabrics. The thickness of the glass fiber aggregate may be appropriately set and selected according to the desired thickness as the infrared reflection layer. In ensuring the thickness of the infrared reflection layer by the glass fiber aggregate, if the number of laminated sheets is large, it takes time and labor in the lamination process. Therefore, in order to reduce the number of laminated sheets, the thickness of the glass fiber aggregate is preferably, for example, 0.1 mm or more, 1 mm or more, or 2 mm or more. And the basis weight of the glass fiber aggregate is 300 g / m 2 or more, 350 g / m 2 or more, or 400 g / m 2 or more is preferable, and 1500 g / m 2 or less, 1200 g / m 2 or less, or 1000 g / m 2 or less is preferable.

[0087] When using an SMC sheet as the first reinforced fiber resin composite material, the average length of the first glass fiber contained in the first reinforced fiber resin composite material is preferably 1 mm or more, 3 mm or more, or 5 mm or more in order to ensure strength, and preferably 50 mm or less, 25 mm or less, or 15 mm or less in order to ensure fluidity in the mold during resin molding.

[0088] The average length of the first glass fiber is measured by the following method. Weigh approximately 20 mg of glass fiber into a polyethylene cup and defibrate it by rubbing it against the cup wall using a metal spatula. Press one adhesive side of a weakly adhesive double-sided tape against the glass fiber adhering to the cup wall and stick it onto the tape. Stick the other adhesive side of the double-sided tape with the glass fiber attached flatly onto a white plastic sheet to obtain a sheet for microscopic observation. Observe this sheet for microscopic observation with the following optical microscope device to acquire an optical image. Consider the distance obtained using the two-point distance measurement tool of the following image analysis software as the length of the fiber. Select 100 arbitrary glass fibers, measure and record their lengths, and calculate the number average length. As the optical microscope device, for example, the digital microscope VR-3200 manufactured by KEYENCE can be used, and the magnification of the microscope can be, for example, 12 to 40 times depending on the length of the glass fiber. Also, as the analysis software, for example, the software VR-3000 G2 observation application Ver2.4.0.115 (planar measurement - two-point distance measurement tool) manufactured by KEYENCE can be used.

[0089] The content of the first glass fiber is preferably 20% by mass or more based on the total mass of the first reinforced fiber resin composite material or the infrared reflection layer from the viewpoints of suppressing the polymerization shrinkage of the first thermosetting resin and ensuring strength. Further, in order to prevent the first thermosetting resin from sufficiently impregnating the first glass fiber and causing an impregnation-free region, it is preferably 60% by mass or less based on the total mass of the first reinforced fiber resin composite material. Furthermore, from the viewpoint of taking a balance among polymerization shrinkage, the strength of the infrared reflection layer, and impregnability, it is more preferably 30% by mass or more and 50% by mass or less.

[0090] The infrared reflective pigment is a pigment capable of reflecting light with a wavelength of 780 to 2500 nm. The type, shape, size, addition amount, etc. of the infrared reflective pigment can be appropriately selected according to the purpose.

[0091] Examples of the infrared reflective pigment include inorganic pigments such as composite oxides of metals containing at least one metal element selected from the group consisting of zinc, chromium, titanium, manganese, antimony, iron, bismuth, tantalum, niobium, zirconium, hafnium, tungsten, aluminum, cobalt, and nickel. One type of the infrared reflective pigment may be used alone, or two or more types may be used in combination. In order to surely ensure the heat shielding effect, the spectral reflectance of light with a wavelength of 1500 nm of the infrared reflective pigment is preferably 50% or more. Further, in order to prevent the surroundings from being dazzling due to the reflection of visible light, the maximum value of the spectral reflectance of visible light is preferably 10% or less. This means that the maximum value of the spectral reflectance of light in the entire wavelength range of visible light (380 nm to 780 nm) is 10% or less. Examples of such infrared reflective pigments include chromium iron oxide, manganese bismuth oxide, and oxides of calcium / titanium / manganese ((Ca,Ti,Mn)O3). Furthermore, since it has excellent blackness, surface smoothness, and dispersibility in the thermosetting resin, it is particularly preferable to use chromium iron oxide. The spectral reflectance can be measured, for example, by the method described below.

[0092] The shape of the infrared reflective pigment can be any shape such as spherical, flaky, porous, etc. Since the filling amounts in the first reinforced fiber resin composite material and the infrared reflective layer can be increased, a shape close to spherical is preferable. Further, since the infrared reflective pigment can ensure infrared reflective performance with a small filling amount, it is preferably flaky such as scaly, plate-like, flat, etc.

[0093] From the viewpoints of improving dispersibility, hiding power, etc., the average particle diameter of the infrared reflective pigment is preferably in the range of 10 nm to 1 μm. The average particle diameter can be obtained, for example, by photographing the infrared reflective pigment with an electron microscope, randomly selecting 50 of the pigments present within the viewing angle, measuring the particle diameters, and calculating the arithmetic mean. In addition, when the pigment is not spherical, the maximum diameter of the particle is measured.

[0094] From the viewpoint of ensuring heat insulation performance, the content of the infrared reflective pigment is preferably 1% by mass or more, 3% by mass or more based on the total mass of the first reinforced fiber resin composite material or the infrared reflective layer. Further, from the viewpoint of ensuring the surface smoothness of the resin molded body, the content of the infrared reflective pigment is preferably 50% by mass or less, 30% by mass or less. And, from the viewpoint of achieving both heat insulation performance and surface smoothness, the content of the infrared reflective pigment is preferably 5% by mass or more and 20% by mass or less, and more preferably 8% by mass or more and 15% by mass or less.

[0095] In one embodiment of the present invention, the first reinforced fiber resin composite material and the infrared reflective layer may further contain other components. Examples of other components include fillers, low shrinkage agents, mold release agents, thickeners, viscosity reducers, pigments, antioxidants, plasticizers, flame retardants, antibacterial agents, ultraviolet stabilizers, reinforcing materials, photocuring agents, etc.

[0096] In one embodiment of the present invention, from the viewpoint of easily ensuring the thickness and strength as a molded body, the first reinforced fiber resin composite material and the infrared reflection layer may further contain other fibers made of a material different from the above-described glass fiber. The other fibers preferably have low infrared absorption performance, similar to the glass fiber. The other fibers may be a fiber aggregate such as a woven fabric, a non-woven fabric, a cut fiber bundle mat, and a paper sheet. As the fiber, ceramic fiber, natural stone-derived fiber, organic fiber, etc. can be used. Examples of the ceramic fiber include alumina fiber, zirconia fiber, boron fiber, etc. Examples of the natural stone-derived fiber include basalt fiber, etc. Examples of the organic fiber include polyester fiber, polypropylene fiber, polyamide fiber, polyarylene sulfide fiber, natural organic fiber, etc.

[0097] <Second Reinforced Fiber Resin Composite Material> The second reinforced fiber resin composite material essentially contains a second thermosetting resin and carbon fiber. The second reinforced fiber resin composite material may include a resin composition containing the second thermosetting resin.

[0098] As the second thermosetting resin, the resins mentioned as the first thermosetting resin, that is, epoxy resin, vinyl ester resin, phenol resin, urea resin, unsaturated polyester resin, melamine resin, polyurethane, silicon resin, acrylic resin, etc. can be used. As the second thermosetting resin, the same resin as that used as the first thermosetting resin may be used, or a different resin may be used.

[0099] The second reinforced fiber resin composite material can use the components that the above-described first reinforced fiber resin composite material can contain, and further contains carbon fiber. The description of the components other than the carbon fiber that can be used in the second reinforced fiber resin composite material is omitted.

[0100] When using an SMC sheet as the second reinforced fiber resin composite material, the average length of the carbon fibers contained in the second reinforced fiber resin composite material is preferably 1 mm or more, 3 mm or more, or 5 mm or more in order to ensure strength, and preferably 50 mm or less, 25 mm or less, or 15 mm or less in order to ensure fluidity in the mold during resin molding.

[0101] As the carbon fibers, various types such as polyacrylonitrile-based, pitch-based, and rayon-based can be used. Among these, polyacrylonitrile-based carbon fibers are preferred because high-strength carbon fibers can be easily obtained. Also, the number of filaments in the fiber bundle used as the carbon fibers is preferably 1,000 to 60,000 because the resin impregnation property and the mechanical properties of the molded product are further improved.

[0102] When using an SMC sheet as the second reinforced fiber resin composite material, the average length of the carbon fibers contained in the second reinforced fiber resin composite material is preferably 1 mm or more, 3 mm or more, or 5 mm or more in order to ensure strength, and preferably 50 mm or less, 25 mm or less, or 15 mm or less in order to ensure fluidity in the mold during resin molding.

[0103] The average length of the carbon fibers can be measured in the same manner as the average length of the glass fibers described above. When it is necessary to separate and recover the carbon fibers from the resin molded body 1 or the second reinforced fiber resin composite material 1 when measuring the average length of the carbon fibers, the resin molded body 1 or the second reinforced fiber resin composite material containing the carbon fibers is placed in a magnetic crucible and heated in a muffle furnace set at 150°C in air for 1 hour, then the temperature is raised to 550°C and heated for a further 2.5 hours. After cooling, the carbon fibers are separated and recovered from the residue in the crucible.

[0104] From the viewpoints of suppressing the polymerization shrinkage of the second thermosetting resin and ensuring strength, the carbon fiber content is preferably 20% by mass or more based on the total mass of the second reinforced fiber resin composite material or the first reinforcing layer. Further, in order to sufficiently impregnate the carbon fiber with the second thermosetting resin and prevent the occurrence of an impregnation-free region, it is preferably 60% by mass or less based on the total mass of the second reinforced fiber resin composite material. Furthermore, from the viewpoint of achieving a balance among polymerization shrinkage, the strength of the infrared reflection layer, and impregnability, it is more preferably 30% by mass or more and 50% by mass or less.

[0105] <The third reinforced fiber resin composite material> The third reinforced fiber resin composite material essentially contains a third thermosetting resin and a second glass fiber. The third reinforced fiber resin composite material may include a resin composition containing the third thermosetting resin.

[0106] As the third thermosetting resin, resins such as those listed as the first thermosetting resin, that is, epoxy resin, vinyl ester resin, phenol resin, urea resin, unsaturated polyester resin, melamine resin, polyurethane, silicone resin, acrylic resin, etc. can be used. As the third thermosetting resin, those different from the resin used as the first thermosetting resin may be used, but it is more preferable to use the same one.

[0107] As the second glass fiber, the fibers listed as the first glass fiber can be used. It is more preferable to use the same one as the first glass fiber as the second glass fiber.

[0108] The third reinforced fiber resin composite material can use the components that the above-described first reinforced fiber resin composite material can contain. The description of these components is omitted.

[0109] It is more preferable to use the same material as the first reinforced fiber resin composite material for the third reinforced fiber resin composite material, except that an infrared reflective pigment is not added. Thereby, the second reinforcing layer can be easily adjusted so as to have a thermal shrinkage rate substantially equal to that of the infrared reflective layer 11.

[0110] The resin molded body 1 of the present embodiment can be obtained, for example, by a manufacturing method including a manufacturing process (A) of the first to third reinforced fiber resin composite materials and a manufacturing process (B) of the resin molded body.

[0111] <Manufacturing Process (A) of the First to Third Reinforced Fiber Resin Composite Materials> In process (A), each reinforced fiber resin composite material is manufactured. The first reinforced fiber resin composite material can be manufactured by preparing a resin composition containing a first thermosetting resin, impregnating a mixture obtained by mixing an infrared reflective pigment into the resin composition into the first glass fiber by means such as pressurization. The second reinforced fiber resin composite material can be manufactured by impregnating a resin composition containing a second thermosetting resin into carbon fiber by means such as pressurization. The third reinforced fiber resin composite material can be manufactured by impregnating a resin composition containing a third thermosetting resin into the second glass fiber by means such as pressurization. The reinforced fiber resin composite material thus obtained is called an SMC (sheet molding compound) sheet or a prepreg.

[0112] <Manufacturing Process (B) of the Resin Molded Body> In step (B), the resin molded body 1 is molded by curing a laminate in which the first to third reinforced fiber resin composite materials obtained in step (A) are laminated in sequence. More specifically, first, a laminate is obtained by laminating the first reinforced fiber resin composite material, the second reinforced fiber resin composite material, and the third reinforced fiber resin composite material in sequence in the cavity of a mold. The lamination order may be reversed. At this time, each reinforced fiber resin composite material is cut in advance so as to be substantially the same as or smaller than the projected area of the cavity of the mold. Further, a plurality of each reinforced fiber resin composite material may be stacked according to the desired thicknesses of the infrared reflection layer 11, the first reinforcing layer 21, and the second reinforcing layer 31 to be molded. Next, the mold is clamped to pressurize the laminate, and the first to third reinforced fiber resin composite materials are filled into the cavity for molding. There is no particular limitation on the molding means. For example, by heating and pressurizing using a heated mold press, the thermosetting resin contained in each reinforced fiber resin composite material is crosslinked to obtain the resin molded body 1.

[0113] Hereinafter, a method for manufacturing the resin molded body 1 using a sheet-like reinforced fiber resin composite material will be described.

[0114] First, a resin composition for use in the first reinforced fiber resin composite material is prepared by stirring and mixing a first thermosetting resin, an infrared reflection pigment, a curing agent, and the like. Next, the resin composition is applied onto a carrier film, and a glass fiber layer containing first glass fibers is provided thereon. Another set of the resin composition applied onto the carrier film is prepared, and they are laminated in the order of carrier film / resin composition / glass fiber layer / resin composition / carrier film, and the resin composition is impregnated into the glass fiber layer using a pressure roll or the like to produce the first reinforced fiber resin composite material. After pressurizing using a pressure roll or the like, it may be aged by standing in a temperature range of room temperature (for example, 25°C) to about 50°C for 10 hours or more.

[0115] Similarly, a second reinforced fiber resin composite material is produced. First, a resin composition for use in the second reinforced fiber resin composite material is prepared by stirring and mixing a second thermosetting resin, a curing agent, and the like. Next, the resin composition is applied onto a carrier film, and a carbon fiber layer containing carbon fibers is placed thereon. Another set of the resin composition applied onto the carrier film is made, and they are laminated in the order of carrier film / resin composition / carbon fiber layer / resin composition / carrier film, and the resin composition is impregnated into the carbon fiber layer with a pressure roll or the like to produce a second reinforced fiber resin composite material.

[0116] Similarly, a third reinforced fiber resin composite material is produced. First, a resin composition for use in the third reinforced fiber resin composite material is prepared by stirring and mixing a third thermosetting resin, a curing agent, and the like. Next, the resin composition is applied onto a carrier film, and a glass fiber layer containing second glass fibers is placed thereon. Another set of the resin composition applied onto the carrier film is made, and they are laminated in the order of carrier film / resin composition / glass fiber layer / resin composition / carrier film, and the resin composition is impregnated into the glass fiber layer with a pressure roll or the like to produce a third reinforced fiber resin composite material.

[0117] Next, the first to third reinforced fiber resin composite materials are sequentially laminated in the cavity of a mold, and the obtained laminate is heated and pressed to be cured, whereby a resin molded body 1 can be produced. At this time, by adjusting the number of laminated sheets of each of the first to third reinforced fiber resin composite materials and the height of the cavity of the mold, a resin molded body 1 having a desired thickness can be obtained.

[0118] The resin molded body 1 of the present embodiment is excellent in strength, surface smoothness, and heat insulation properties, and the occurrence of warpage is suppressed. Therefore, it can be suitably used for automobile members, railway vehicle members, aircraft members, ship members, housing equipment members, light vehicle members, building civil engineering members, etc. In particular, it is suitable as an exterior material for vehicles such as automobile bonnet hoods, doors, and roofs.

Example

[0119] Hereinafter, the present invention will be described more specifically based on examples, but the present invention is not limited to the examples.

[0120] <Preparation of Resin Compositions A and B> First, 90 parts by mass of bisphenol A type vinyl ester resin (EXDOME (registered trademark), manufactured by DIC MATERIALS CO., LTD.) and 10 parts by mass of phenoxyethyl methacrylate (flash point 120 ° C) as the polymerizable unsaturated group-containing compound were stirred and mixed to prepare a vinyl ester resin paste. Subsequently, 22 parts by mass of polyisocyanate (Lupranate (registered trademark) MI, manufactured by BASF INOAC Polyurethane Co., Ltd., NCO group content 33.3 or more) was added and mixed well at room temperature. Then, 1 part by mass of a polymerization initiator (Kayacarbon (registered trademark) AIC-75, an organic peroxide, manufactured by Kayaku Akzo Co., Ltd.) and 0.05 part by mass of p-benzoquinone as a polymerization inhibitor were added and stirred well at room temperature to prepare a thermosetting resin composition A (hereinafter, may be abbreviated as "resin composition A").

[0121] Furthermore, when preparing the resin composition A, after adding and mixing polyisocyanate and before adding the polymerization initiator, any one of infrared reflective pigments P-1 to P-3 (hereinafter, may be abbreviated as "infrared reflective pigment P") was added and mixed in the formulations shown in Table 1 and Table 2 to prepare thermosetting resin compositions B-1 to B-8 (hereinafter, may be abbreviated as "resin compositions B-1 to B-8" or "resin composition B"). In other words, the resin composition B is a mixture of the resin composition A and infrared reflective pigments a to c. The following were used as the infrared reflective pigments P-1 to P-3. · Infrared reflective pigment P-1: Sicopal (registered trademark) Black L 0095, iron chromium oxide, manufactured by SunChemical, reflectance of light with a wavelength of 1500 nm (hereinafter, referred to as "infrared reflectance"): 75%, maximum value of reflectance of light in the entire wavelength range of 380 to 780 nm (hereinafter, referred to as "maximum value of visible light reflectance"): 5.1% · Infrared Reflective Pigment P-2: Manufactured by Ishihara Sangyo Co., Ltd., Type Peacock Black SG-101, (Ca, Ti, Mn)O3, Infrared Reflectance: 67%, Maximum Value of Visible Light Reflectance: 8.5% · Infrared Reflective Pigment P-3: Manufactured by Ishihara Sangyo Co., Ltd., Type Peacock R-820, Titanium Dioxide, Infrared Reflectance: 82%, Maximum Value of Visible Light Reflectance: 90%

[0122] <Preparation of the First Reinforced Fiber Resin Composite Material X> The first reinforced fiber resin composite materials X (X-1 to X-10) were prepared as follows. The first reinforced fiber resin composite materials X-1 to X-7 were prepared as follows. First, 600 g of resin compositions B-1 to B-7 were prepared according to the formulations shown in Table 2. Subsequently, the 600 g of resin composition B was divided approximately in half, and one half was applied to a 100 cm square area of a polypropylene process film. 400 g of glass fiber G (PB-549 manufactured by Nitto Boseki Co., Ltd., basis weight 4.8 g / m) cut into 2 cm lengths was uniformly scattered on the application surface of the above resin composition B to form a glass fiber layer. The remaining half of the divided resin composition B was similarly applied to a 100 cm square area of a polypropylene process film, and a laminate was obtained by stacking it so that the application surface was in contact with the above glass fiber layer. Next, the laminate was pressed with a hand roller to sufficiently impregnate the glass fiber layer, and aged at room temperature for 24 hours or more, whereby the first reinforced fiber resin composite materials X-1 to X-7 (1000 g / m 2 ) were prepared. Also, after preparing 665 g of resin composition X-8 according to the formulation shown in Table 2, the first reinforced fiber resin composite material X-8 (1065 g / m 2 ) was prepared in the same manner as the first reinforced fiber resin composite material X-1 except that it was used. Also, the first reinforced fiber resin composite material X-9 (1000 g / m 2 ) was prepared in the same manner as the first reinforced fiber resin composite material X-3 except that 400 g of carbon fiber C (manufactured by Toray Industries, Inc., basis weight 3800 g / m) cut into 2 cm lengths was used instead of glass fiber G. Also, except for using 1000 g of the resin composition B-3 and not using any glass fiber G at all, by performing in the same manner as the first reinforced fiber resin composite material X-3, the first reinforced fiber resin composite material X-10 (1000 g / m 2 ) was produced.

[0123] <Production of the second reinforced fiber resin composite material Y> The first reinforced fiber resin composite material Y was produced as follows. First, 600 g of the resin composition A was divided into approximately two halves, and one half was applied to a 100 cm square region of a polypropylene process film. By uniformly scattering 400 g of the carbon fiber C on the application surface of the resin composition A, a carbon fiber layer was formed. The remaining half of the divided resin composition A was similarly applied to a 100 cm square region of the polypropylene process film, and a laminate was obtained by stacking them so that the application surface was in contact with the carbon fiber layer. Next, the laminate was pressed with a hand roller to sufficiently impregnate the glass fiber layer and aged at room temperature for 24 hours or more, thereby obtaining the second reinforced fiber resin composite material Y (1000 g / m 2 ) provided with process films on both sides.

[0124] <Production of the third reinforced fiber resin composite material Z> Except for using the glass fiber G instead of 400 g of the carbon fiber C, by performing in the same manner as the second reinforced fiber resin composite material Y, the third reinforced fiber resin composite material Z (1000 g / m 2 ) was produced.

[0125] <Production of the resin molded body> A resin molded body was produced using a mold composed of a convex upper mold and a concave lower mold, having a cavity of 30 cm in length and 30 cm in width, and the height of the cavity being adjustable by a spacer. The height of the cavity was set to 2.0 mm. The above-described first to third first reinforced fiber resin composite materials were cut into 30 cm squares in advance, and the process films were peeled off before use. In Examples 1 to 8, a laminate in which any one of the first reinforced fiber resin composite materials X-1 to X-8, two sheets of the second reinforced fiber resin composite material Y, and one sheet of the third reinforced fiber resin composite material Z were sequentially stacked was placed at the center of the cavity of the mold. After that, the mold was closed, the temperature of the upper mold was set to 140°C, the temperature of the lower mold was set to 150°C, and pressure was applied for 10 minutes under the condition of 92 t to produce a resin molded body having a thickness of 2.0 mm.

[0126] Any of the obtained resin molded bodies of Examples 1 to 8 includes an infrared reflection layer containing a resin, glass fiber G, and an infrared reflective pigment P, a first reinforcing layer containing a resin and carbon fiber C, and a second reinforcing layer containing a resin and glass fiber G.

[0127] In Comparative Example 1, a resin molded body was produced in the same manner as in Example 3, except that a laminate in which four sheets of the first reinforced fiber resin composite material X-9 were stacked was used. The obtained resin molded body consists of only one layer of the infrared reflection layer. The infrared reflection layer is different in that it does not contain glass fiber G but contains carbon fiber C and has a thickness four times that of the infrared reflection layer provided in the resin molded body of Example 3.

[0128] In Comparative Example 2, a resin molded body was produced in the same manner as in Example 3, except that a laminate in which one sheet of the first reinforced fiber resin composite material X-10 and three sheets of the second reinforced fiber resin composite material Y were stacked was used. The obtained resin molded body consists of only two layers of the infrared reflection layer and the reinforcing layer. The infrared reflection layer is different from the infrared reflection layer provided in the resin molded body of Example 3 in that it does not contain glass fiber G. The reinforcing layer has the same configuration as the first reinforcing layer provided in the resin molded body of Example 3, but is different in that it has a thickness 1.5 times that of the first reinforcing layer.

[0129] In Comparative Example 3, a resin molded body was produced in the same manner as in Example 3, except that a laminate in which four sheets of the first reinforced fiber resin composite material X-3 were stacked was used. The obtained resin molded body consists of only one layer of the infrared reflection layer. The infrared reflection layer has the same configuration as the infrared reflection layer provided in the resin molded body of Example 3, but is different in that it has a thickness four times that of the infrared reflection layer provided in the resin molded body of Example 3.

[0130] In Comparative Example 4, a resin molded body was produced in the same manner as in Example 3, except that a laminate in which one sheet of the first reinforced fiber resin composite material X-3 and three sheets of the second reinforced fiber resin composite material Y were laminated was used. The obtained resin molded body is composed of only two layers, an infrared reflection layer and a reinforcing layer. The infrared reflection layer has the same configuration as the first reinforcing layer provided in the resin molded body of Example 3 and the same thickness. The reinforcing layer has the same configuration as the first reinforcing layer provided in the resin molded body of Example 3, but is different in that it has a thickness 1.5 times that of the first reinforcing layer.

[0131] In Comparative Example 5, a resin molded body was produced in the same manner as in Example 3, except that a laminate in which one sheet of the first reinforced fiber resin composite material X-3 and three sheets of the third reinforced fiber resin composite material Z were laminated was used. The obtained resin molded body is composed of only two layers, an infrared reflection layer and a reinforcing layer. The infrared reflection layer has the same configuration as the infrared reflection layer provided in the resin molded body of Example 3 and the same thickness. The reinforcing layer has the same configuration as the second reinforcing layer provided in the resin molded body of Example 3, but is different in that it has a thickness 1.5 times that of the second reinforcing layer.

[0132] The following evaluations were performed on the resin molded bodies of Examples 1 to 8 and Comparative Examples 1 to 5. The results are shown in Table 2.

[0133] <Evaluation of the amount of bulge generation> The surface of the obtained resin molded body was visually observed, and the amount of bulge generation on the surface of the resin molded body was evaluated based on the following evaluation criteria. The surface (the infrared incident surface) of the infrared reflection layer of the resin molded body and the surface on the opposite side were observed. The results are shown in Tables 1 and 2. <<Evaluation>> 〇: The number of bubbles generated per 1 m 2 on the surface of the resin molded body is 5 or less. △: The number of bubbles generated per 1 m 2 on the surface of the resin molded body is 6 to 9. ×: The number of bubbles generated per 1 m 2 on the surface of the resin molded body is 10 or more.

[0134] <Warpage evaluation> The obtained resin molded body was placed on a flat plate, and the displacement in the thickness direction from the center to the center was measured at a total of 8 locations near the sides in the vertical, horizontal, and diagonal directions from the center of the resin molded body. The warpage amount of each point was obtained, and the average value of the 8-point displacement amount was defined as the average warpage amount of the molded product. The warpage of the resin molded body was evaluated based on the following evaluation criteria. The results are shown in Tables 1 and 2. <<Evaluation>> 〇: The average warpage amount of the resin molded body is 1 cm or less. ×: The average warpage amount of the resin molded body is greater than 1 cm.

[0135] <Measurement of flexural strength and flexural modulus of the molded body> Test pieces were cut out from the obtained resin molded body, and a three-point bending test was performed in accordance with JIS K7074 to measure the flexural strength and flexural modulus. The results are shown in Tables 1 and 2. <<Evaluation (flexural strength)>> 〇: 250 MPa or more. ×: Less than 250 MPa. <<Evaluation (flexural strength)>> 〇: 17 GPa or more. ×: Less than 17 GPa.

[0136] <Measurement of infrared reflectance> Test pieces with a length of 50 mm, a width of 50 mm, and a thickness of 2 mm were cut out from the obtained resin molded body, and the spectral reflectance of infrared light with a wavelength of 1500 nm was measured using SolidSpec-3700DUV (manufactured by Shimadzu Corporation, double-beam method). The measurement was carried out using an integrating sphere, and the measurement included not only the specular reflection component but also the reflection component due to diffuse light. The infrared reflectance of the resin molded body was evaluated based on the following evaluation criteria. The higher the reflectance, the better the heat insulation performance. The results are shown in Tables 1 and 2. <<Evaluation>> 〇: The infrared reflectance is 70% or more. △: The infrared reflectance is 50% or more and less than 70%. ×: The infrared reflectance is less than 50%.

[0137] <Measurement of visible light reflectance> From the obtained resin molded body, a test piece with a length of 50 mm, a width of 50 mm, and a thickness of 2 mm was cut out, and using a SolidSpec-3700DUV (manufactured by Shimadzu Corporation, double-beam method), the spectral reflectance of visible light was measured over the entire wavelength range of 380 to 780 nm. The measurement was carried out using an integrating sphere, and the measurement included not only the specular reflection component but also the reflection component due to diffuse light. The maximum value of the reflectance of visible light over the entire wavelength range of 380 to 780 nm was evaluated based on the following evaluation criteria. The results are shown in Table 1 and Table 2. <<Evaluation>> 〇: The maximum value of the visible light reflectance is 10% or less. △: The maximum value of the visible light reflectance exceeds 10%.

[0138]

Table 1

[0139]

Table 2

[0140] As shown in Table 2, the resin molded body of Example 3 provided with the infrared reflection layer, the first reinforcing layer, and the second reinforcing layer has excellent heat insulation properties, strength, and surface smoothness compared to the resin molded bodies of Comparative Examples 1 to 5, and the occurrence of warping is suppressed.

[0141] When comparing the resin molded bodies of Examples 1 to 5, the higher the content of the infrared reflective pigment, the higher the infrared reflection performance and the improved heat insulation properties. On the other hand, the amount of swelling generated in the infrared reflection layer increases, and the surface smoothness decreases. Considering the balance between the infrared reflection performance and the amount of swelling generated, it can be understood that among Examples 1 to 5, Examples 2 to 4 are preferable, and Example 3 is the most excellent.

[0142] Comparing the resin moldings of Examples 3, 6, and 7, it can be understood that as infrared reflective pigments, chromium iron oxide (infrared reflective pigment a) and calcium / titanium / manganese oxides (infrared reflective pigment b) are preferable from the viewpoints of obtaining an excellent heat insulation effect and reducing glare in the surroundings. Further, from the viewpoint of reducing the amount of swelling generated in the infrared reflective layer and obtaining surface smoothness, it can be understood that chromium iron oxide is more preferable.

[0143] The resin moldings of Examples 3 and 8 showed equivalent results in all evaluation items. From this, it can be understood that the content mass of the thermosetting resin can be adjusted in the range where the thermal shrinkage rate of the second reinforcing layer is approximately the same as that of the infrared reflective layer.

Explanation of Reference Numerals

[0144] 1…Resin molding, 11…Infrared reflective layer, 12…First thermosetting resin, 13…First glass fiber, 14…Infrared reflective pigment, 21…First reinforcing layer, 22…Second thermosetting resin, 23…Carbon fiber, 31…Second reinforcing layer, 32…Third thermosetting resin, 33…Second glass fiber.

Claims

1. An infrared reflective layer containing a first thermosetting resin, first glass fibers, and an infrared reflective pigment, a first reinforcing layer containing a second thermosetting resin and carbon fibers, and a second reinforcing layer containing a third thermosetting resin and second glass fibers, wherein the infrared reflective layer, the first reinforcing layer, and the second reinforcing layer are laminated in this order. A resin molded body characterized by this.

2. The third thermosetting resin is substantially the same as the first thermosetting resin, the content mass of the third thermosetting resin in the second reinforcing layer is substantially the same as the total content mass of the first thermosetting resin and the infrared reflective pigment in the infrared reflective layer, the second glass fibers are substantially the same as the first glass fibers, and The resin molded body according to claim 1, wherein the content mass of the second glass fibers in the second reinforcing layer is substantially the same as the content mass of the first glass fibers in the infrared reflective layer.

3. The resin molded body according to claim 1 or claim 2, wherein the content of the infrared reflective pigment is 5% by mass or more and 20% by mass or less based on the total mass of the infrared reflective layer.

4. The resin molded body according to claim 1 or claim 2, containing at least one selected from the group consisting of an epoxy resin and a vinyl ester resin as the first thermosetting resin.

5. A first reinforced fiber resin composite material containing the first thermosetting resin, the first glass fibers, and the infrared reflective pigment, a second reinforced fiber resin composite material containing the second thermosetting resin and carbon fibers, and a third reinforced fiber resin composite material containing the third thermosetting resin and second glass fibers are laminated in this order. The resin molded body according to claim 1 or 2, which is composed of a cured product of the laminate.

6. The resin molded body according to claim 1 or claim 2, used as an exterior material for a vehicle.

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