Manufacturing method of device

Abstract

To solve the problem that it is not assumed that a device other than an oscillator is realized using a container usable for the oscillator.SOLUTION: A manufacturing method of a plurality of kinds of devices including an oscillator and a measuring device includes: a first mounting step of mounting a vibration element and a first oscillation control circuit, which generates an oscillation signal by oscillating the vibration element, in a plurality of containers; an oscillator manufacturing step of manufacturing the oscillator by mounting a second oscillation control circuit, of which an oscillation frequency is controlled based on the oscillation signal, in some of the plurality of containers on which the first mounting step is performed; and a measuring device manufacturing step of manufacturing the measuring device by mounting a measuring circuit, which measures a measuring target based on the oscillation signal, in the plurality of containers on which the first mounting step is performed and the oscillator manufacturing step is not performed.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a method for manufacturing a device.

Background Art

[0002] Conventionally, an oscillator is known in which circuits are mounted on both the front and back of the mounting surface of one oscillator. For example, in Patent Document 1, a first package that houses a first vibration element and a first circuit element that oscillates the first vibration element is mounted on a mounting surface, and a second vibration element whose oscillation frequency is controlled based on a first oscillation signal is provided, and an oscillator including a second package mounted on the back surface of the first package on the mounting surface is disclosed.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Conventional oscillators have only been used for oscillators, and it has not been assumed to realize devices other than oscillators using containers that can be used for oscillators.

Means for Solving the Problems

[0005] A method for manufacturing a device according to an embodiment is a method for manufacturing a plurality of types of devices including an oscillator and a measurement device, the method including: a first mounting step of mounting a vibration element and a first oscillation control circuit that oscillates the vibration element to generate an oscillation signal in a plurality of containers; an oscillator manufacturing step of manufacturing the oscillator by mounting a second oscillation control circuit whose oscillation frequency is controlled based on the oscillation signal on a part of the plurality of containers in which the first mounting step has been performed; and a measurement device manufacturing step of manufacturing the measurement device by mounting a measurement circuit that measures a measurement target based on the oscillation signal on the plurality of containers in which the first mounting step has been performed and the oscillator manufacturing step has not been performed.

Brief Description of the Drawings

[0006]

Figure 1

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Best Mode for Carrying Out the Invention

[0007] Hereinafter, a preferred embodiment of a method for manufacturing the device of the present invention will be described with reference to the drawings. For convenience of explanation, X-axis, Y-axis, and Z-axis orthogonal to each other are shown in each figure. Also, hereinafter, the direction along the X-axis is also referred to as the "X-axis direction", the direction along the Y-axis is also referred to as the "Y-axis direction", and the direction along the Z-axis is also referred to as the "Z-axis direction". Also, the side pointed to by the arrow of each axis is also referred to as the "plus side", and the opposite side is also referred to as the "minus side". Also, the plus side in the Z-axis direction is also referred to as "up", and the minus side in the Z-axis direction is also referred to as "down". Also, a plan view from the Z-axis direction is simply referred to as a "plan view".

[0008] FIG. 1 is a cross-sectional view showing a container commonly used in an oscillator and a measurement device. FIG. 2 is a plan view of the container as seen from the upper surface side. FIG. 3 is a bottom view of the container as seen from the bottom surface side. FIG. 4 is a cross-sectional view showing an inner package accommodated in the container and its interior. FIG. 5 is a circuit diagram showing a PLL circuit included in a circuit element of the container. FIG. 6 is a circuit diagram showing a first route of the PLL circuit. FIG. 7 is a circuit diagram showing a second route of the PLL circuit. FIG. 8 is a circuit diagram showing a third route of the PLL circuit. FIG. 9 is a circuit diagram showing a fourth route of the PLL circuit. FIG. 10 is a cross-sectional view showing an oscillator. FIG. 11 is a cross-sectional view showing a measurement circuit. FIG. 12 is a circuit diagram showing a measurement circuit. FIG. 13 is a flowchart showing a method for manufacturing an oscillator and a measurement device.

[0009] In this embodiment, a plurality of types of devices are manufactured using a plurality of containers 1. In this embodiment, the plurality of types of devices are an oscillator and a measurement device. The oscillator includes an oven-controlled crystal oscillator (OCXO). The measurement device is a device capable of measuring frequency, voltage, and current. In this way, by using a common container 1 when manufacturing different devices, namely the transmitter and the measurement device, a plurality of types of devices can be manufactured at low cost and efficiently.

[0010] First, the container 1 will be described. The container 1 shown in FIGS. 1 to 5 has a vibration element 6, a circuit element 8, a temperature control element 7, an inner package 3 that houses the vibration element 6, the circuit element 8, and the temperature control element 7, a circuit element 4, and an outer package 2 that houses the inner package 3 and the circuit element 4.

[0011] The outer package 2 has a first base 21 and a first lid 22. The first base 21 has a box shape and has a first recess 211 that opens on a first surface (upper surface) and a second recess 212 that opens on a second surface (lower surface) that is in a front-back relationship with the first surface. Further, the first lid 22 has a plate shape, covers the opening of the first recess 211, and is joined to the upper surface of the first base 21 via a sealing member 23 such as a seal ring or a low-melting-point glass. Thereby, the first recess 211 is hermetically sealed, and a first accommodation space Sp1 is formed inside the outer package 2. On the other hand, the opening of the second recess 212 is not sealed and faces the outside of the outer package 2.

[0012] Note that the constituent materials of the first base 21 and the first lid 22 are not particularly limited. For example, the first base 21 can be made of various ceramic materials such as alumina and titania, and the first lid 22 can be made of various metal materials such as kovar.

[0013] Describing the first accommodation space Sp1 in detail, the first recess 211 includes a first-1 recess 211a that opens to the upper surface, a first-2 recess 211b that opens to the bottom surface of the first-1 recess 211a and has a smaller opening than the first-1 recess 211a, and a first-3 recess 211c that opens to the bottom surface of the first-2 recess 211b and has a smaller opening than the first-2 recess 211b. And the circuit element 4 is arranged on the bottom surface of the first-1 recess 211a, and the inner package 3 is arranged on the bottom surface of the first-3 recess 211c.

[0014] The first accommodation space Sp1 is airtight and in a depressurized state, preferably a state closer to a vacuum. Thereby, the heat insulation property of the outer package 2 is enhanced. Also, the heat of the temperature control element 7 is less likely to escape, and the heating efficiency of the vibration element 6 is increased. Therefore, the temperature of the vibration element 6 is stabilized and power saving can also be achieved. However, the atmosphere of the first accommodation space Sp1 is not particularly limited.

[0015] Also, the first base 21 has a plurality of internal terminals 241 arranged on the bottom surface of the first-1 recess 211a, a plurality of internal terminals 242 arranged on the bottom surface of the first-2 recess 211b, a plurality of internal terminals 243 arranged on the bottom surface of the second recess 212, and a plurality of external terminals 244 arranged on the lower surface.

[0016] In this embodiment, the external terminals 244 include an external input terminal EXIN, a power supply terminal VDD, a ground terminal GND, an external output terminal OUT, a serial clock terminal SCK, and a serial data terminal SDA. As shown in FIG. 3, in this embodiment, a total of 10 external terminals 244 are formed on the lower surface of the container 1. Six of these external terminals 244 are the external input terminal EXIN, the power supply terminal VDD, the ground terminal GND, the external output terminal OUT, the serial clock terminal SCK, and the serial data terminal SDA.

[0017] These external terminals are electrically connected via internal wiring (not shown) formed in the first base 21 so as to form a desired circuit. Also, each internal terminal 241 is electrically connected to the circuit element 4 via a bonding wire BW1, and each internal terminal 242 is electrically connected to the inner package 3 via a bonding wire BW2.

[0018] Also, in the present embodiment, the internal terminal 243 is a terminal electrically connected to each circuit in the container 1, and includes terminals to which a voltage-controlled crystal oscillator 5, a crystal vibration element 50, and a measurement circuit 10, which will be described later, are connected. In the present embodiment, the internal terminal 243 is labeled with symbols Pa, Pb, Pc, Pd, Pu, Pv, Pw, Px, Py, and Pz. Note that the symbols Pa to Pd, Pu to Pz are for distinction purposes and are not actually marked on the internal terminal 243.

[0019] In the present embodiment, the internal terminal 243 indicated by the symbol Pd is a power supply terminal, and the internal terminal 243 indicated by the symbol Pb is a ground terminal. The power supply terminal and the ground terminal of the voltage-controlled crystal oscillator 5, the crystal vibration element 50, and the measurement circuit 10 are connected to each of these terminals.

[0020] Furthermore, each of the internal terminals 243 indicated by the symbols Pa, Pc, Pu, Pv, Pw, Px, Py, and Pz is connected to a terminal provided in the voltage-controlled crystal oscillator 5, the crystal vibration element 50, and the measurement circuit 10. In the present embodiment, as shown in FIG. 5, the terminals of the voltage-controlled crystal oscillator 5 are connected to the internal terminals 243 indicated by the symbols Pu, Pw, and Pv. Also, the terminals of the crystal vibration element 50 are electrically connected to the internal terminals 243 indicated by the symbols Pa and Pc. The terminals of the measurement circuit 10 are electrically connected to the internal terminals 243 indicated by the symbols Pw, Px, Py, and Pz. Note that the internal terminals 243 indicated by the symbols Pu, Pa, Pc, Pv, and Pw are electrically connected to the terminals included in the circuit element 4. Also, the internal terminals 243 indicated by the symbols Px, Py, and Pz are connected to the external input terminal EXIN, the serial clock terminal SCK, and the serial data terminal SDA among the external terminals 244 included in the container 1, respectively.

[0021] As shown in FIG. 4, the inner package 3 has an inner base 31 and an inner lid 32. The inner base 31 is box-shaped and has a third recess 311 that opens to the lower surface in FIG. 4. The inner lid 32 is plate-shaped and is joined to the lower surface of the inner base 31 via a sealing member 33 such as a seal ring or a low-melting-point glass so as to close the opening of the third recess 311. As a result, the third recess 311 is hermetically sealed, and a second accommodation space Sp2 is formed inside the inner package 3. The vibration element 6, the temperature control element 7, and the circuit element 8 are accommodated in the second accommodation space Sp2.

[0022] Note that the constituent materials of the inner base 31 and the inner lid 32 are not particularly limited. For example, the inner base 31 can be made of various ceramic materials such as alumina and titania, and the inner lid 32 can be made of various metal materials such as kovar.

[0023] Explaining the second accommodation space Sp2 in detail, the third recess 311 has a third-1 recess 311a that opens to the lower surface, a third-2 recess 311b that opens to the bottom surface of the third-1 recess 311a and has a smaller opening than the third-1 recess 311a, and a third-3 recess 311c that opens to the bottom surface of the third-2 recess 311b and has a smaller opening than the third-2 recess 311b. The vibration element 6 is disposed on the bottom surface of the third-1 recess 311a, and the temperature control element 7 and the circuit element 8 are arranged side by side on the bottom surface of the third-3 recess 311c.

[0024] Such a second accommodation space Sp2 is airtight and is in a depressurized state, preferably a state closer to a vacuum. As a result, the viscous resistance of the second accommodation space Sp2 is reduced, and the vibration characteristics of the vibration element 6 are improved. However, the atmosphere of the second accommodation space Sp2 is not particularly limited.

[0025] In addition, the inner base 31 has a plurality of internal terminals 341 arranged on the bottom surface of the third-first recess 311a, a plurality of internal terminals 342 and 343 arranged on the bottom surface of the third-second recess 311b, and a plurality of external terminals 344 arranged on the upper surface of the inner base 31. These terminals are electrically connected via internal wirings (not shown) formed in the inner base 31 so as to form a desired circuit.

[0026] In addition, each internal terminal 341 is electrically connected to the vibration element 6 via a conductive bonding member B2 and a bonding wire BW3. Also, each internal terminal 342 is electrically connected to the temperature control element 7 via a bonding wire BW4. Further, each internal terminal 343 is electrically connected to the circuit element 8 via a bonding wire BW5. Moreover, each external terminal 344 is electrically connected to the outer package 2 via a bonding wire BW2. The inner package 3 as described above is fixed to the bottom surface of the first-third recess 211c via a bonding member B3 in the inner lid 32.

[0027] In this embodiment, the vibration element 6 is an SC-cut crystal vibration element. Since the SC-cut crystal vibration element has a third-order frequency-temperature characteristic, it becomes a vibration element 6 with excellent frequency stability. In particular, since the SC-cut crystal vibration element has a pole-changing point near 95°C, it is suitable for a crystal oscillator with a thermostatic chamber (OCXO) that uses the vibration element 6 by heating it. Therefore, a high-precision oscillator can be manufactured at low cost using the container 1. Note that SC-cut refers to a cut angle obtained by rotating a plane orthogonal to the Y-axis (mechanical axis), which is a crystal axis of the crystal, about 33° to 35° around the X-axis (electrical axis), and further rotating it about 22° to 24° around the Z-axis (optical axis) from the rotated position and then cutting it out.

[0028] The configuration of the vibration element 6 is not limited. For example, it may be an AT-cut crystal oscillator. Since the AT-cut crystal oscillator has a third-order frequency-temperature characteristic, like the SC-cut crystal oscillator, it becomes a vibration element 6 with excellent frequency stability. In particular, since the demand for the AT-cut crystal oscillator is higher and the circulation volume is larger than that of the SC-cut crystal oscillator, cost reduction can be achieved. However, as the vibration element 6, instead of the SC-cut crystal oscillator or the AT-cut crystal oscillator, a BT-cut crystal oscillator, a tuning fork type crystal oscillator, a surface acoustic wave resonator, other piezoelectric vibration elements, MEMS resonators, etc. may be used.

[0029] As shown in FIG. 4, the temperature control element 7 includes a temperature sensor 71 and a heating circuit 72. The temperature sensor 71 functions as a temperature detection unit that detects the ambient temperature, particularly the temperature of the vibration element 6, and the heating circuit 72 functions as a heating unit that heats the vibration element 6. The temperature control element 7 is disposed on the bottom surface of the 3-3 recess 311c and is electrically connected to a plurality of internal terminals 342 via a bonding wire BW4. In the present embodiment, since the vibration element 6 and the temperature control element 7 are accommodated in the same space, the difference between the detection result of the temperature sensor 71 and the actual temperature of the vibration element 6 is reduced. Thus, by providing the temperature control element 7, the container 1 can output a highly accurate oscillation signal with less frequency variation against environmental temperature changes.

[0030] As shown in FIG. 4, the circuit element 8 has an oscillation circuit 81 that oscillates the vibration element 6. This oscillation circuit 81 is a circuit for generating an oscillation signal by amplifying the signal output from the vibration element 6 and feeding it back to the vibration element 6 to oscillate the vibration element 6. Note that the circuit element 8 further has a temperature compensation circuit 82. The temperature compensation circuit 82 performs temperature compensation based on the temperature information output from the temperature sensor 71 and the temperature compensation data so that the frequency variation of the oscillation signal is smaller than the frequency-temperature characteristic of the vibration element 6 itself, and preferably the oscillation signal is constant within a predetermined temperature range. In the circuit element 8, whether to use the temperature compensation circuit 82 or not can be set according to the user's preference.

[0031] In this embodiment, a form of performing temperature compensation using the temperature sensor 71 of the temperature control element 7 has been described. However, a temperature sensor may be built into the circuit element 8, and temperature compensation may be performed using the temperature sensor. Specifically, based on the temperature information output from the temperature sensor built into the circuit element 8 and the temperature compensation data, the frequency fluctuation of the oscillation signal is made smaller than the frequency-temperature characteristic of the vibration element 6 itself, and preferably, the oscillation signal is made constant in a predetermined temperature range. Temperature compensation may be performed.

[0032] As shown in FIG. 1, the circuit element 4 includes a temperature control circuit 41 that controls the drive of the temperature control element 7, a part of the PLL circuit 42, and an output buffer circuit 43. The temperature control circuit 41 is a circuit for controlling the amount of current flowing through the resistance of the heating circuit 72 based on the output signal of the temperature sensor 71 and maintaining the vibration element 6 at a constant temperature. For example, when the current temperature determined from the output signal of the temperature sensor 71 is lower than the set reference temperature, the temperature control circuit 41 passes a desired current through the resistance of the heating circuit 72, and when the current temperature is higher than the reference temperature, it controls so that no current flows through the resistance of the heating circuit 72. Further, for example, the temperature control circuit 41 controls to increase or decrease the amount of current flowing through the resistance of the heating circuit 72 according to the difference between the current temperature and the reference temperature.

[0033] Also, as shown in FIG. 5, the circuit element 4 includes, as a part of the PLL circuit 42, a first phase comparator 421, a first low-pass filter 422, a voltage-controlled oscillator 423, a first frequency divider 424, a second phase comparator 425, a second low-pass filter 426, an oscillation circuit 427, and a second frequency divider 428. Further, for the purpose of enhancing versatility, the circuit element 4 includes a first switch circuit SW1 disposed between the voltage-controlled oscillator 423 and the second phase comparator 425, and a second switch circuit SW2 disposed between the second low-pass filter 426 and the oscillation circuit 427.

[0034] In such a circuit element 4, by switching the routes with the first and second switch circuits SW1 and SW2, it is possible to set to the first route R1 shown in FIG. 6, the second route R2 shown in FIG. 7, the third route R3 shown in FIG. 8, or the fourth route R4 shown in FIG. 9. Thereby, in the present embodiment, it is possible to manufacture oscillators in a plurality of modes using the container 1, and it is also possible to manufacture a measurement device. The route setting may be performed, for example, by writing a program corresponding to the route to be set into the circuit element 4, or a program corresponding to all routes may be written in advance and a predetermined program may be selected from among them.

[0035] <oscillator> Next, a plurality of oscillators that can be manufactured using the container 1 will be described in order. One of the plurality of oscillators is a crystal oscillator with a thermostatic chamber (OCXO). In this case, the setting is such that the temperature compensation circuit 82 included in the circuit element 8 is not used. Also, the circuit element 4 is set to the first route R1. Such an oscillator has a configuration in which a voltage-controlled crystal oscillator 5 is arranged in the container 1 as shown in FIG. 10. The voltage-controlled crystal oscillator 5 is mounted in the second recess 212 and is electrically connected to each internal terminal 243 (the internal terminals 243 indicated by the symbols Pb, Pd, Pu, Pv, Pw) via a conductive joining member B1.

[0036] In this way, by forming the second recess 212 on the lower surface of the outer package 2 and mounting the voltage-controlled crystal oscillator 5 in the second recess 212 not covered by the lid, the mounting of the voltage-controlled crystal oscillator 5 becomes easy. Also, according to such a configuration, a crystal oscillator with a thermostatic chamber can be manufactured by mounting the voltage-controlled crystal oscillator 5 on the container 1 in a state where the first recess 211 is sealed with the first lid 22. Since the container 1 is a component that can be diverted to other oscillators and measurement devices, a transmitter that is a crystal oscillator with a thermostatic chamber can be efficiently manufactured as compared with a configuration in which a container is manufactured for each device.

[0037] As shown in FIG. 6, the voltage-controlled crystal oscillator 5 forms part of the PLL circuit 42. The voltage-controlled crystal oscillator 5 has a vibration element (not shown) and circuit elements housed in a package 51. The package 51 is formed by joining a lid so as to cover a recess with respect to a base having the recess. In the present embodiment, the vibration element included in the voltage-controlled crystal oscillator 5 is an AT-cut crystal vibration element. Since the AT-cut crystal vibration element has third-order frequency-temperature characteristics, it is a vibration element with excellent frequency stability. Therefore, it becomes a highly accurate oscillator 1A. Note that the AT-cut refers to a cut angle obtained by cutting out a surface obtained by rotating a plane orthogonal to the Y-axis (mechanical axis), which is a crystal axis of a crystal, about 33° to 36° around the X-axis (electrical axis). Of course, as the vibration element, instead of the AT-cut crystal vibration element, an SC-cut crystal vibration element, a BT-cut crystal vibration element, a tuning fork type crystal vibration element, a surface acoustic wave resonator, other piezoelectric vibration elements, MEMS resonance elements, etc. may be used.

[0038] The circuit elements included in the voltage-controlled crystal oscillator 5 have an oscillation circuit that oscillates the vibration element. The oscillation circuit is electrically connected to the vibration element, amplifies the output signal of the vibration element, and oscillates the vibration element by feeding back the amplified signal to the vibration element.

[0039] The first phase comparator 421 shown in FIG. 6 detects the phase difference between the first oscillation signal V1, which is a reference frequency signal output from the oscillation circuit 81, and the frequency signal output from the first frequency divider 424, and outputs it to the first low-pass filter 422. The first low-pass filter 422 removes high-frequency components from the output signal from the first phase comparator 421, converts it into a voltage, and outputs it as a DC signal for controlling the voltage-controlled oscillator 423. The first frequency divider 424 outputs a frequency signal obtained by dividing the frequency signal output from the voltage-controlled oscillator 423 to the first phase comparator 421.

[0040] Note that the first frequency divider 424 can set a fractional frequency division ratio, for example, by switching the integer frequency division ratio to an average fractional frequency division ratio. As a result, the front-stage PLL circuit portion composed of the first phase comparator 421, the first low-pass filter 422, the voltage-controlled oscillator 423, and the first frequency divider 424 functions as a fractional-N PLL circuit (fractional PLL circuit). Consequently, the fractional-N PLL circuit can output a signal of any frequency.

[0041] The second phase comparator 425 detects the phase difference between the frequency signal output from the voltage-controlled oscillator 423 and the frequency signal output from the second frequency divider 428, and outputs it to the second low-pass filter 426. The second low-pass filter 426 removes high-frequency components from the output signal from the second phase comparator 425, converts it into a voltage, and outputs a DC signal for controlling the voltage-controlled crystal oscillator 5. The second frequency divider 428 outputs a frequency signal obtained by dividing the frequency signal output from the voltage-controlled crystal oscillator 5 to the second phase comparator 425.

[0042] Note that the second frequency divider 428 is, for example, an integer frequency divider that divides the input signal by an integer. As a result, the rear-stage PLL circuit portion composed of the second phase comparator 425, the second low-pass filter 426, the voltage-controlled crystal oscillator 5, and the second frequency divider 428 functions as an integer-N PLL circuit (integer PLL circuit). In the integer-N PLL circuit, the phase noise can be relatively small, and the circuit configuration can be made relatively simple.

[0043] Then, from the voltage-controlled crystal oscillator 5, a second oscillation signal V2, which is a frequency signal corresponding to the voltage of the DC signal, is output toward the output buffer circuit 43. That is, the PLL circuit 42 oscillates a vibration element (not shown) provided in the voltage-controlled crystal oscillator 5 to generate a second oscillation signal V2 whose frequency is controlled based on the first oscillation signal V1. With the above configuration, a high-precision oscillator is obtained. In the example shown in FIG. 6, the oscillation circuit 81 and the circuit element 4 are a first oscillation control circuit that oscillates the vibration element 6 to generate an oscillation signal, and the voltage-controlled crystal oscillator 5 is a second oscillation control circuit whose oscillation frequency is controlled based on the oscillation signal.

[0044] The oscillators shown in FIGS. 6 and 10 may be a plurality of oscillators with different specifications. For example, a plurality of oscillators with different oscillation frequencies of vibration elements (not shown) housed in the package 51 may be manufactured.

[0045] Furthermore, instead of the voltage-controlled crystal oscillator 5, a crystal vibration element 50 may be used, and an oscillator may be manufactured by setting the circuit element 4 to the second route R2. For example, in the second recess 212 shown in FIG. 10, an oscillator is configured by mounting a crystal vibration element 50 instead of the voltage-controlled crystal oscillator 5. Also, in this configuration, as shown in FIG. 7, the oscillation circuit 427 of the circuit element 4 is electrically connected to the crystal vibration element 50. That is, the crystal vibration element 50 is electrically connected to each internal terminal 243 (internal terminals 243 indicated by the symbols Pb, Pd, Pa, and Pc) via a conductive bonding member B1. In such an oscillator, the PLL circuit 42 operates as follows.

[0046] As shown in FIG. 7, the first phase comparator 421 detects the phase difference between the first oscillation signal V1, which is a reference frequency signal output from the oscillation circuit 81, and the frequency signal output from the first frequency divider 424, and outputs it to the first low-pass filter 422. The first low-pass filter 422 removes high-frequency components from the output signal from the first phase comparator 421, converts it into a voltage, and outputs it as a DC signal for controlling the voltage-controlled oscillator 423. The first frequency divider 424 outputs a frequency signal obtained by dividing the frequency signal output from the voltage-controlled oscillator 423 to the first phase comparator 421.

[0047] The second phase comparator 425 detects the phase difference between the frequency signal output from the voltage-controlled oscillator 423 and the frequency signal output from the second frequency divider 428, and outputs it to the second low-pass filter 426. The second low-pass filter 426 removes high-frequency components from the output signal from the second phase comparator 425, converts it into a voltage, and outputs a DC signal for controlling the oscillation circuit 427. The second frequency divider 428 outputs a frequency signal obtained by dividing the frequency signal output from the oscillation circuit 427 to the second phase comparator 425.

[0048] Then, a third oscillation signal V3, which is a frequency signal corresponding to the voltage of the DC signal, is output from the oscillation circuit 427 toward the output buffer circuit 43. That is, the PLL circuit 42 oscillates the crystal oscillator element 50 and generates a third oscillation signal V3 whose frequency is controlled based on the first oscillation signal V1. As a result, a highly accurate oscillator is obtained. In the example shown in FIG. 7, the oscillation circuit 81 and the circuit element 4 are a first oscillation control circuit that oscillates the vibration element 6 to generate an oscillation signal, and the crystal oscillator element 50 is a second oscillation control circuit whose oscillation frequency is controlled based on the oscillation signal.

[0049] Furthermore, the voltage-controlled crystal oscillator 5 and the crystal vibration element 50 may be omitted, and the oscillator may be manufactured by setting the PLL circuit 42 to the third route R3. In this configuration, since the voltage-controlled crystal oscillator 5 and the crystal vibration element 50 are omitted, no circuit is mounted in the second recess 212. That is, the oscillator is composed of only the container 1. Thereby, the oscillator can be manufactured at low cost. In such an oscillator, the PLL circuit 42 operates as follows.

[0050] As shown in FIG. 8, the first phase comparator 421 detects the phase difference between the first oscillation signal V1, which is a reference frequency signal output from the oscillation circuit 81, and the frequency signal output from the first frequency divider 424, and outputs it to the first low-pass filter 422. The first low-pass filter 422 removes the high-frequency components from the output signal from the first phase comparator 421, converts it into a voltage, and outputs it as a DC signal for controlling the voltage-controlled oscillator 423. The first frequency divider 424 outputs the frequency signal obtained by dividing the frequency signal output from the voltage-controlled oscillator 423 to the first phase comparator 421. Then, from the voltage-controlled oscillator 423, a fourth oscillation signal V4, which is a frequency signal corresponding to the voltage of the DC signal, is output toward the output buffer circuit 43.

[0051] <Measurement device> Next, the measurement devices that can be manufactured using the container 1 will be described in order. The measurement device according to the present embodiment is a device capable of selecting and measuring any one of the frequency, voltage, and current of a signal given from the outside. When the measurement device is manufactured, the circuit element 4 is set to the fourth route R4 shown in FIG. 9. Such a measurement device has a configuration in which the measurement circuit 10 is arranged in the container 1 as shown in FIG. 11. The measurement circuit 10 is mounted in the second recess 212 and is electrically connected to each internal terminal 243 (the internal terminals 243 indicated by the symbols Pb, Pd, Px, Py, Pz, Pw) via the conductive joining member B1.

[0052] In this way, by forming the second recess 212 on the lower surface of the outer package 2 and mounting the measurement circuit 10 in the second recess 212 not covered by the lid, it becomes easier to mount the measurement circuit 10. Further, according to such a configuration, a measurement device can be manufactured by mounting the measurement circuit 10 on the container 1 in a state where the first recess 211 is sealed with the first lid 22. Since the container 1 is a component that can be diverted to other oscillators, the measurement device can be manufactured efficiently as compared with a configuration in which a container is manufactured for each device.

[0053] As shown in FIG. 9, the measurement circuit 10 is a circuit that measures a measurement target based on the fourth oscillation signal V4 generated by the PLL circuit 42. The circuits constituting the measurement circuit 10 are housed in the package 11. The package 11 is formed by joining a lid so as to cover a recess with respect to a base having the recess. Note that the measurement circuit 10 does not necessarily have to be housed in the package 11 as shown in FIG. 11. For example, a molded QFN (Quad Flat Non-leaded) package including the circuits constituting the measurement circuit 10 may be mounted in the second recess 212, or an integrated circuit including the circuits constituting the measurement circuit 10 may be directly mounted in the second recess 212 by means such as flip chip bonding or wire bonding.

[0054] FIG. 12 is a diagram showing the configuration of the measurement circuit 10. The measurement circuit 10 includes a third switch circuit SW3, a fourth switch circuit SW4, a counter 101, a signal processing circuit 102, an A / D (analog / digital) conversion circuit 104, an arithmetic circuit 111, and an interface circuit 112.

[0055] The third switch circuit SW3 is electrically connected to the external input terminal EXIN, and is a circuit that inputs the signal input from the external input terminal EXIN to any one of the counter 101, the fourth switch circuit SW4, and the resistance element 103. The fourth switch circuit SW4 is a circuit that selects a signal input to the A / D conversion circuit 104, and can select the output of the signal processing circuit 102, the output of the third switch circuit SW3, and the output of the resistance element 103.

[0056] The A / D conversion circuit 104 is a circuit that samples an input analog signal based on the fourth oscillation signal V4 and converts it into a digital signal. The arithmetic circuit 111 is a processor that performs predetermined processing based on the digital signal. The interface circuit 112 is a circuit for performing predetermined serial communication with an external device via the serial data terminal SDA in synchronization with the serial clock signal input from the serial clock terminal SCK.

[0057] When the signals of the external input terminal EXIN are input to the counter 101 and the output of the signal processing circuit 102 is input to the A / D conversion circuit 104 by the third switch circuit SW3 and the fourth switch circuit SW4, the measurement circuit 10 becomes a frequency measurement circuit. That is, in the present embodiment, the counter 101, the signal processing circuit 102, the A / D conversion circuit 104, and the arithmetic circuit 111 constitute a frequency measurement circuit that measures the frequency of the externally input oscillation signal CLK based on the fourth oscillation signal V4.

[0058] An input signal to the EXIN terminal is input to the counter 101 via the fourth switch circuit SW4. In this case, an oscillation signal CLK to be measured for frequency is input to the EXIN terminal. Further, the fourth oscillation signal V4 output from the circuit element 4 is input to the counter 101. The counter 101 includes a counter that counts the number of pulses of each of the input fourth oscillation signal V4 and the oscillation signal CLK. The respective count results of the fourth oscillation signal V4 and the oscillation signal CLK are output to the arithmetic circuit 111 as the first count data CNT1 and the second count data CNT2.

[0059] Further, the counter 101 transitions at a timing corresponding to the fourth oscillation signal V4 and outputs a measurement start signal STA that transitions at a predetermined period. The counter 101 also transitions at a timing corresponding to the oscillation signal CLK and outputs a measurement end signal STP that transitions at a predetermined period. The first count data CNT1 is the number of pulses of the fourth oscillation signal V4 counted from the rising edge of the measurement start signal STA to the next rising edge. The second count data CNT2 is the number of pulses of the oscillation signal CLK counted from the rising edge of the measurement end signal STP to the next rising edge.

[0060] The signal processing circuit 102 and the A / D conversion circuit 104 together constitute a time-to-digital conversion circuit. That is, when the output signal of the signal processing circuit 102 is output to the A / D conversion circuit 104 by the fourth switch circuit SW4, when the voltage signal generated by the signal processing circuit 102 is supplied to the A / D conversion circuit 104, the A / D conversion circuit 104 outputs time difference information corresponding to the time difference between the rising edge of the measurement start signal START and the rising edge of the measurement end signal STOP.

[0061] The arithmetic circuit 111 performs an arithmetic operation based on the time difference information input from the A / D conversion circuit 104, the first count data CNT1 input from the counter 101, and the second count data CNT2, and obtains the frequency of the oscillation signal CLK. The second count data CNT2 corresponds to the time with the period of the oscillation signal CLK of the measurement target input from the external input terminal EXIN as the resolution, and the first count data CNT1 corresponds to the time with the period of the fourth oscillation signal V4 output from the circuit element 4 as the resolution. By using the time difference information input from the A / D conversion circuit 104 in addition to these, the arithmetic circuit 111 can accurately measure the period of the oscillation signal CLK with the period of the fourth oscillation signal V4 as a reference.

[0062] Note that the signal processing circuit 102 can use a configuration similar to that of a known time digital conversion circuit. For example, it can be composed of an integration period signal generation circuit, a polarity switching signal generation circuit, and an integration circuit. The integration period signal generation circuit is a circuit that receives the measurement start signal STA and the measurement end signal STP respectively, and outputs an integration period signal for each of them. The polarity switching signal generation circuit is a circuit that outputs a signal that transitions from a low level to a high level at a timing synchronized with the fourth oscillation signal V4 during the integration period determined by the integration period signal, and a signal that transitions from a low level to a high level after a predetermined number of clocks of the fourth oscillation signal V4 from the transition timing of the signal. The integration processing circuit is a circuit that performs integration processing based on the output of the polarity switching signal generation circuit.

[0063] When the arithmetic circuit 111 obtains the frequency, the user can operate an external device and issue a transmission instruction for the frequency information via the serial data terminal SDA. When the transmission instruction is issued, the arithmetic circuit 111 outputs the frequency information to the external device via the interface circuit 112. As a result, the user can measure the frequency of the oscillation signal CLK input to the external input terminal EXIN. Note that the communication method of the interface circuit 112 is not limited, and various serial communications or parallel communications may be used.

[0064] When the signals of the external input terminal EXIN are input to the A / D conversion circuit 104 by the third switch circuit SW3 and the fourth switch circuit SW4, the measurement circuit 10 functions as a voltage measurement circuit. That is, an analog voltage signal to be measured is input to the external input terminal EXIN. The analog voltage signal is converted into a digital voltage signal by the A / D conversion circuit 104, and the arithmetic circuit 111 acquires the voltage value of the digital voltage signal. That is, in this case, the A / D conversion circuit 104 operates based on the fourth oscillation signal V4 and functions as a circuit that digitally converts an externally input analog voltage. When the voltage value is obtained, the user can operate an external device to issue a transmission instruction for the voltage value via the serial data terminal SDA. When the transmission instruction is issued, the arithmetic circuit 111 outputs the voltage value to the external device via the interface circuit 112. As a result, the user can measure the voltage value of the analog voltage signal input to the external input terminal EXIN.

[0065] When the signals of the external input terminal EXIN are input to the resistance element 103 by the third switch circuit SW3 and the fourth switch circuit SW4 and the output of the resistance element 103 is input to the A / D conversion circuit 104, the measurement circuit 10 functions as a current measurement circuit. That is, an analog current signal to be measured is input to the external input terminal EXIN. The analog current signal is converted into an analog voltage signal in the resistance element 103. This configuration can be realized, for example, by a configuration in which an analog current signal flows through the resistance element 103 and the voltage drop of the resistance element 103 due to the flowing current becomes an analog voltage signal.

[0066] The analog voltage signal output from the resistance element 103 is converted into a digital voltage signal by the A / D conversion circuit 104, and the arithmetic circuit 111 acquires the voltage value of the digital voltage signal. That is, in this case, the A / D conversion circuit 104 operates based on the fourth oscillation signal V4 and functions as a circuit for digitally converting an analog voltage. When the voltage value is obtained, the arithmetic circuit 111 acquires a current value based on the voltage value. For example, with the above-described configuration, the arithmetic circuit 111 acquires a current value by dividing the voltage value by the resistance value that provides a voltage drop. When the current value is obtained, the user can operate an external device and issue a transmission instruction for the current value via the serial data terminal SDA. When the transmission instruction is issued, the arithmetic circuit 111 outputs the current value to the external device via the interface circuit 112. As a result, the user can measure the current value of the analog voltage signal input to the external input terminal EXIN.

[0067] <Manufacturing method> As described above, in the present embodiment, the oscillator and the measurement device can be manufactured using the common container 1. Next, a manufacturing method for these plurality of devices will be described. FIG. 13 is a flowchart showing the manufacturing method of the device in the present embodiment. The manufacturing method of the device in the present embodiment includes a first mounting step S1, an oscillator manufacturing step S2, and a measurement device manufacturing step S3.

[0068] The first mounting step S1 is a step of mounting the vibration element 6 and the first oscillation control circuit that oscillates the vibration element 6 to generate an oscillation signal in a plurality of containers 1. The oscillator manufacturing step S2 is a step of manufacturing an oscillator by mounting a second oscillation control circuit whose oscillation frequency is controlled based on the oscillation signal on a part of the plurality of containers 1 in which the first mounting step S1 has been performed. The measurement device manufacturing step is a step of manufacturing a measurement device by mounting the measurement circuit 10 that measures a measurement target based on the oscillation signal on the plurality of containers 1 in which the first mounting step S1 has been performed and the oscillator manufacturing step S2 has not been performed.

[0069] The first implementation step S1 includes a step S100 of preparing a first base 21, a step S105 of mounting an inner package 3 containing a vibration element 6, a temperature control element 7, and a circuit element 8 in a first recess 211 of the first base 21, a step S110 of mounting a circuit element 4 in the first recess 211 of the first base 21, and a step S115 of joining a first lid 22 to the first base 21 to obtain a container 1.

[0070] The first implementation step S1 is executed for a plurality of containers 1. As a result, when step S115 ends, a plurality of containers 1 are obtained. Next, for a part of the plurality of containers 1, a voltage-controlled crystal oscillator 5 is mounted in the second recess 212 (step S120), and the PLL circuit 42 is set to the first route R1 (step S125). As a result, an oscillator is manufactured.

[0071] Also, for the remaining part of the plurality of containers 1, a crystal vibration element 50 is mounted in the second recess 212 (step S130), and the PLL circuit 42 is set to the second route R2 (step S135). As a result, an oscillator different from the oscillator manufactured in step S125 is manufactured. Further, in the remaining part of the plurality of containers 1, the PLL circuit 42 is set to the third route R3 (step S140). As a result, an oscillator different from the oscillators manufactured in steps S125 and S135 is manufactured.

[0072] Furthermore, for the remaining part or all of the plurality of containers 1, a measurement circuit 10 is mounted in the second recess 212 (step S145), and the PLL circuit 42 is set to the fourth route R4 (step S150). As a result, a measurement device is manufactured. According to the above steps, since a common container 1 is used for manufacturing different devices, a plurality of different types of devices can be manufactured at low cost and efficiently.

[0073] <Other embodiments, etc.> The above-described embodiments are examples for implementing the present invention, and various other embodiments can also be adopted. For example, the first oscillation control circuit mounted on the container 1 does not necessarily need to include a PLL circuit. Also, the application target of the oscillator according to an embodiment of the present invention is not limited, and it can be used for various targets, for example, various electronic devices, automotive electrical components, etc. Of course, the target measured by the measurement device is also not limited. Further, the types of oscillators manufactured from a plurality of containers 1 are not limited. For example, in a part of the plurality of containers 1, an oscillator may be manufactured by being set to either the first route R1 or the second route R2, and in the rest of the plurality of containers 1, a measurement device may be manufactured by being set to the fourth route R4.

[0074] The configuration of the measurement circuit 10 is not limited to the configuration shown in FIG. 12. For example, a measurement circuit capable of measuring each of frequency, voltage, and current may be mounted on the container 1. FIGS. 14, 15, and 16 are circuit diagrams of measurement circuits 110, 120, and 130 capable of measuring frequency, voltage, and current, respectively. The measurement circuit 110 shown in FIG. 14 can be realized by omitting the third switch circuit SW3, the fourth switch circuit SW4, and the resistance element 103 from the circuit shown in FIG. 12. The measurement circuit 120 shown in FIG. 15 can be realized by omitting the third switch circuit SW3, the fourth switch circuit SW4, the counter 101, the signal processing circuit 102, and the resistance element 103 from the circuit shown in FIG. 12. The measurement circuit 130 shown in FIG. 16 can be realized by omitting the third switch circuit SW3, the fourth switch circuit SW4, the counter 101, and the signal processing circuit 102 from the circuit shown in FIG. 12. After a plurality of containers 1 are manufactured, a configuration in which any one of the measurement circuits 110, 120, and 130 is mounted in the second recess 212 may be adopted.

[0075] The first implementation step may be a step of implementing a vibration element and a first oscillation control circuit that oscillates the vibration element to generate an oscillation signal in a plurality of containers. That is, the first oscillation control circuit may be any circuit that generates an oscillation signal, as long as it can generate an oscillation signal that can be used by both the second oscillation control circuit and the measurement circuit. Therefore, the first oscillation control circuit is not limited to the above-described configuration. Therefore, the PLL circuit may be a circuit including either a fractional PLL circuit or an integer PLL. Further, the first oscillation control circuit may include an RC circuit, an LC circuit, a multivibrator, a ring oscillator, or the like.

[0076] The oscillator manufacturing step may be a step of manufacturing an oscillator by implementing a second oscillation control circuit whose oscillation frequency is controlled based on an oscillation signal on a part of the plurality of containers in which the first implementation step has been performed. That is, a part of the plurality of containers is used for manufacturing the oscillator. The second oscillation control circuit may be any circuit that outputs a signal whose oscillation frequency is controlled based on an oscillation signal, and may be any of the above-described crystal vibration elements and voltage-controlled crystal oscillators. Further, among the plurality of containers, there may be a container that is not equipped with either the second oscillation control circuit or the measurement circuit and is used for manufacturing an oscillator that outputs the oscillation signal generated by the first oscillation control circuit.

[0077] The measurement device manufacturing step may be a step of manufacturing a measurement device by implementing a measurement circuit that measures a measurement target based on an oscillation signal on a plurality of containers in which the first implementation step has been performed and the oscillator manufacturing step has not been performed. That is, at least a part of the plurality of containers that have not been made into oscillators is used for manufacturing the measurement device. The measurement circuit may be any circuit that measures a measurement target based on an oscillation signal, and is a circuit that can measure any measurement target. The oscillation signal may be used for measuring the measurement target, and may be used as a reference during measurement such as frequency measurement, or may be used for A / D conversion such as voltage measurement.

Explanation of symbols

[0078] 1... Container, 2... Outer package, 3... Inner package, 4... Circuit element, 5... Voltage-controlled crystal oscillator, 6... Vibration element, 7... Temperature control element, 8... Circuit element, 10... Measurement circuit, 11... Package, 21... First base, 22... First lid, 23... Sealing member, 31... Inner base, 32... Inner lid, 33... Sealing member, 41... Temperature control circuit, 42... PLL circuit, 43... Output buffer circuit, 50... Crystal vibration element, 51... Package, 71... Temperature sensor, 72... Heating circuit, 81... Oscillation circuit, 82... Temperature compensation circuit, 101... Counter, 102... Signal processing circuit, 103... Resistance element, 104... A / D conversion circuit, 105... Arithmetic circuit, 106... Interface circuit, 211... First recess, 211a... First-1 recess, 211b... First-2 recess, 211c... First-3 recess, 212... Second recess, 241... Internal terminal, 242... Internal terminal, 243... Internal terminal, 244... External terminal, 311... Third recess, 311a... Third-1 recess, 311b... Third-2 recess, 311c... Third-3 recess, 341... Internal terminal, 342... Internal terminal, 343... Internal terminal, 344... External terminal, 421... First phase comparator, 422... First low-pass filter, 423... Voltage-controlled oscillator, 424... First frequency divider, 425... Second phase comparator, 426... Second low-pass filter, 427... Oscillation circuit, 428... Second frequency divider, B1... Bonding member, B2... Bonding member, B3... Bonding member, BW1~BW5... Bonding wires, EXIN... External input terminal, GND... Ground terminal, OUT... External output terminal, SCK... Serial clock terminal, SDA... Serial data terminal, SW1~SW4... First switch circuit~Fourth switch circuit, Sp1... First accommodation space, Sp2... Second accommodation space, VDD... Power supply terminal

Claims

1. A method for manufacturing a plurality of types of devices including an oscillator and a measurement device, comprising: a first mounting step of mounting a vibration element and a first oscillation control circuit that oscillates the vibration element to generate an oscillation signal in a plurality of containers; an oscillator manufacturing step of manufacturing the oscillator by mounting a second oscillation control circuit whose oscillation frequency is controlled based on the oscillation signal on a part of the plurality of containers in which the first mounting step has been performed; a measurement device manufacturing step of manufacturing the measurement device by mounting a measurement circuit that measures a measurement target based on the oscillation signal on the plurality of containers in which the first mounting step has been performed and the oscillator manufacturing step has not been performed; A method for manufacturing a device including the above.

2. The measurement circuit includes a frequency measurement circuit that measures the frequency of a signal input from the outside based on the oscillation signal, The method for manufacturing a device according to Claim 1.

3. The measurement circuit includes an A / D conversion circuit that operates based on the oscillation signal and digitally converts an analog voltage input from the outside, The method for manufacturing a device according to Claim 1.

4. The measurement circuit includes a resistance element that converts a current input from the outside into an analog voltage, and an A / D conversion circuit that operates based on the oscillation signal and digitally converts the analog voltage, The method for manufacturing a device according to Claim 1.

5. The oscillator and the measurement device include a temperature control element that heats the vibration element, The method for manufacturing a device according to Claim 1.

6. The container has a first accommodation space that is hermetically sealed, In the first mounting step, at least the vibration element and the temperature control element are accommodated in the first accommodation space, The method for manufacturing a device according to Claim 5.

7. The container includes: a first base having a first recess that opens on a first surface and a second recess that opens on a second surface that is in a front-back relationship with the first surface; a first lid that is joined to the first surface and covers the opening of the first recess to form the first accommodation space, In the first mounting step, the vibration element, the temperature control element, and the first oscillation control circuit are arranged in the first recess, In the oscillator manufacturing step, the second oscillation control circuit is arranged in the second recess, In the measurement device manufacturing step, the measurement circuit is arranged in the second recess, The method for manufacturing a device according to Claim 6.

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