Printed circuit board

Abstract

To provide a printed circuit board which can improve capacitance and inductance of an inductor and also can be slimmed down and increased in degree of integration.SOLUTION: The present disclosure relates to a printed circuit board 100A including: a magnetic structure 150 including a magnetic layer 151 having a through-hole h, an insulating film 152 disposed on a wall surface of the through-hole h and including an inorganic insulating material, and a conductor layer 153 disposed on the insulating film 152, filling at least a portion of the through-hole h, and including a metal; an insulating layer 110 covering at least a portion of the magnetic structure 150; a wiring layer 120 disposed on or in the insulating layer 110; and a via layer 130 disposed in the insulating layer 110 and including a first connection via 131 connecting the conductor layer 153 to the wiring layer 120.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present disclosure relates to a printed circuit board.

Background Art

[0002] In recent years, in order to slim down semiconductor chips and increase power efficiency, it has been required to incorporate various passive elements such as capacitors and inductors inside package substrates. On the other hand, in the case of inductors, it has been required to improve the inductance compared to existing chip components through changes in materials and structures.

Summary of the Invention

Problems to be Solved by the Invention

[0003] One of the various objects of the present disclosure is to provide a printed circuit board capable of improving the capacitance and inductance of an inductor.

[0004] Another one of the various objects of the present disclosure is to provide a printed circuit board capable of enhancing slimming and integration.

Means for Solving the Problems

[0005] Among the various solutions provided through the present disclosure, one is to form a through hole in a magnetic layer, then fill it with an insulating film and a conductor layer to form a magnetic structure, embed this in a substrate, and directly form an MCI (Magnetic Composite Inductor) or the like.

[0006] For example, a printed circuit board according to one example includes a magnetic layer having a through hole, an insulating film disposed on the wall surface of the through hole and including an inorganic insulating material, and a magnetic structure disposed on the insulating film and filling at least a part of the through hole and including a conductor containing a metal, an insulating layer covering at least a part of the magnetic structure, a wiring layer disposed on or within the insulating layer, and a via layer disposed within the insulating layer and including a connection via that connects the conductor layer to the wiring layer.

[0007] For example, a printed circuit board according to one example includes a magnetic layer having a through hole, an insulating film disposed on the wall surface of the through hole, and a magnetic structure disposed on the insulating film and filling at least a part of the through hole and including a conductor layer, an insulating layer covering at least a part of the magnetic structure, a wiring layer disposed on or within the insulating layer, and a via layer disposed within the insulating layer and including a connection via that connects the conductor layer to the wiring layer, wherein the upper surface of the magnetic layer, the upper surface of the insulating film, and the upper surface of the conductor layer are substantially coplanar with each other, and the lower surface of the magnetic layer, the lower surface of the insulating film, and the lower surface of the conductor layer can also be substantially coplanar with each other.

Advantages of the Invention

[0008] Among various advantages of the present disclosure, as one advantage, it is possible to provide a printed circuit board capable of improving the capacitance and inductance of an inductor.

[0009] Among various advantages of the present disclosure, as another advantage, it is possible to provide a printed circuit board capable of enhancing slimming and integration.

Brief Description of the Drawings

[0010]

Figure 1

Figure 2

Figure 3

Figure 4a

Figure 4b

Figure 4c

Figure 4d

Figure 4e

Figure 4f

Figure 4g

Figure 4h

Figure 4i

Figure 5

Figure 6a

Figure 6b

Figure 6c

Figure 6d

Figure 6e

Figure 6f

Figure 6g

Figure 6h

Figure 6i

Figure 6j

Figure 7

Figure 8a

Figure 8b

Figure 8c

Figure 8d

Figure 8e

Figure 8f

Figure 8g

Figure 8h

Figure 8i

Figure 8j

Figure 8k

Figure 9a

Figure 9b

Figure 9c

Figure 9d

Figure 9e

Figure 9f

Embodiments for Carrying Out the Invention

[0011] Hereinafter, the present disclosure will be described with reference to the accompanying drawings. The shapes and sizes of elements in the drawings may be enlarged or reduced (or emphasized or simplified) for clearer explanation.

[0012] Electronic device FIG. 1 is a block diagram schematically showing an example of an electronic device system.

[0013] Referring to the drawings, the electronic device 1000 houses a main board 1010. Physically and / or electrically connected to the main board 1010 are chip-related components 1020, network-related components 1030, and other components 1040, etc. These, in combination with other electronic components described later, form various signal lines 1090.

[0014] Chip-related components 1020 include memory chips such as volatile memory (e.g., DRAM), non-volatile memory (e.g., ROM), flash memory, application processor chips such as a central processor (e.g., CPU), a graphics processor (e.g., GPU), a digital signal processor, an encryption processor, a microprocessor, a microcontroller, etc., and logic chips such as an analog-to-digital converter, an ASIC (application-specific IC), etc. However, it is not limited to these, and other forms of chip-related electronic components may also be included. Furthermore, these chip-related components 1020 can be combined with each other. The chip-related components 1020 can also be in a package form including the above-described chips or electronic components.

[0015] Network-related components 1030 include Wi-Fi (such as the IEEE 802.11 family, etc.), WiMAX (such as the IEEE 802.16 family, etc.), IEEE 802.20, LTE (long term evolution), Ev-DO, HSPA+, HSDPA+, HSUPA+, EDGE, GSM, GPS, GPRS, CDMA, TDMA, DECT, Bluetooth, 3G, 4G, 5G, and any other wireless and wired protocols designated as such and later. However, it is not limited to these, and any of many other wireless or wired standards or protocols may also be included. Also, the network-related components 1030 can be combined with the chip-related components 1020 with each other.

[0016] Examples of the other components 1040 include high-frequency inductors, ferrite inductors, power inductors, ferrite beads, LTCC (Low Temperature Co-Firing Ceramics), EMI (Electro Magnetic Interference) filters, MLCC (Multi-Layer Ceramic Capacitors), etc. However, the components are not limited thereto, and passive elements in the form of chip components used for various other applications may be included. Further, the other components 1040 can be combined with the chip-related components 1020 and / or the network-related components 1030 with each other.

[0017] Depending on the type of the electronic device 1000, the electronic device 1000 can include other electronic components that are physically and / or electrically connected or not connected to the main board 1010. Examples of the other electronic components include a camera module 1050, an antenna module 1060, a display 1070, a battery 1080, etc. However, the components are not limited thereto, and also include an audio codec, a video codec, a power amplifier, a compass, an accelerometer, a gyroscope, a speaker, a mass storage device (e.g., a hard disk drive), a CD (compact disk), a DVD (digital versatile disk), etc. In addition, other electronic components used for various applications depending on the type of the electronic device 1000 may also be included.

[0018] The electronic device 1000 can be, for example, a smart phone, a personal digital assistant, a digital video camera, a digital still camera, a network system, a computer, a monitor, a tablet, a laptop, a netbook, a television, a video game, a smart watch, an Automotive, etc. However, it is not limited thereto, and it can also be any other electronic device that processes data.

[0019] FIG. 2 is a perspective view schematically showing an example of an electronic device.

[0020] Referring to the drawings, the electronic device can be, for example, a smart phone 1100. Inside the smart phone 1100, a motherboard 1110 is accommodated, and various components 1120 are physically and / or electrically connected to such a motherboard 1110. Further, other components that are physically and / or electrically connected or not connected to the motherboard 1110, such as a camera module 1130 and / or a speaker 1140, are accommodated inside. A part of the components 1120 can be the above-described chip-related components, for example, a component package 1121, but is not limited thereto. The component package 1121 can be in the form of a printed circuit board on which electronic components including active components and / or passive components are surface-mounted. Or, the component package 1121 can also be in the form of a printed circuit board with active components and / or passive components built therein. On the other hand, the electronic device is not necessarily limited to the smart phone 1100, and can also be other electronic devices as described above.

[0021] Printed circuit board FIG. 3 is a cross-sectional view schematically showing an example of a printed circuit board.

[0022] Referring to the drawings, a printed circuit board 100A according to an example includes a magnetic structure 150A including a magnetic layer 151 having a through-hole h, an insulating film 152 disposed on the wall surface of the through-hole h, and a conductor layer 153 disposed on the insulating film 152 and filling at least a part of the through-hole h, an insulating layer 110 covering at least a part of the magnetic structure 150A, a wiring layer 120 disposed on or in the insulating layer 110, and a via layer 130 disposed in the insulating layer 110. If necessary, it can further include a first electronic component 170 embedded in the insulating layer 110 and a second electronic component 190 mounted on the insulating layer 110.

[0023] On the other hand, the insulating film 152 can include an inorganic insulating material. For example, the insulating film 152 can include an inorganic oxide film. For example, the inorganic insulating material included in the insulating film 152 can include at least one of Al2O3, TiO2, ZnO, ZnO2, ZrO2, SnO, SnO2, HfO2, and SiO2, but is not limited thereto. Since the insulating film 152 can be formed by a vapor deposition process using the above-described inorganic insulating material, it can be formed with a thin thickness. Therefore, the magnetic layer 151 can be formed thick enough. For example, in the cross section, based on the direction perpendicular to the wall surface of the through-hole h, the width t1 of the insulating film 152 between the wall surface of the through-hole h and the side surface of the conductor layer 153 can be thinner than the width t2 of the magnetic layer 151 between the wall surface of the through-hole h and the outer side surface of the magnetic layer 151. For example, in the cross section, based on the direction perpendicular to the wall surface of the through-hole h, the width t1 of the insulating film 152 between the wall surface of the through-hole h and the side surface of the conductor layer 153 can be 2 μm or less, for example, about 1 μm to 2 μm. Therefore, the capacitance of an inductor formed using the magnetic structure 150 in the printed circuit board 100A, such as an MCI (Magnetic Composite Inductor), can be increased, and the inductance can be further improved.

[0024] On the one hand, the upper and lower surfaces of the magnetic structure 150 can be substantially flat respectively. For example, a planarization process such as polishing can proceed as in the processes described later. Thus, the upper surfaces of the magnetic layer 151, the insulating film 152, and the conductor layer 153 can be substantially coplanar with each other, and the lower surfaces of the magnetic layer 151, the insulating film 152, and the conductor layer 153 can be substantially coplanar with each other. Therefore, the insulating layer 110 covering this can also have better flatness. Accordingly, the wiring layer 120 and the via layer 130 can be formed more easily.

[0025] On the other hand, there can be a plurality of magnetic structures 150. The plurality of magnetic structures 150 can be arranged spaced apart from each other. The respective conductor layers 153 of the plurality of magnetic structures 150 can be connected to each other via the wiring layer 120 and the via layer 130, and one or more coils can be formed through this. Alternatively, the magnetic structure 150 can have a plurality of through-holes h in the magnetic layer 151, and an insulating film 152 and a conductor layer 153 can be formed in each of the plurality of through-holes h. The respective conductor layers 153 of the plurality of through-holes h can be connected to each other via the wiring layer 120 and the via layer 130, and one or more coils can be formed through this. Alternatively, both can be combined to form one or more coils. For example, at least one of the plurality of magnetic structures 150 can have a plurality of through-holes h, an insulating film 152 and a conductor layer 153 can be formed in each of the plurality of through-holes h, and the respective conductor layers 153 of the plurality of magnetic structures 150 and / or the respective conductor layers 153 of the plurality of through-holes h can be connected to each other via the wiring layer 120 and the via layer 130, whereby one or more coils can be formed. Thereby, an MCI (Magnetic Composite Inductor) can be formed in the printed circuit board 100A. Therefore, the slimming and integration of the printed circuit board 100A can be enhanced. For example, the mounting area on the printed circuit board 100A can be increased, and the current path between the electronic component and the inductor can be minimized.

[0026] On the one hand, the via layer 130 may include a first connection via 131 that connects the conductor layer 153 of the magnetic structure 150 to the wiring layer 120. For example, the via layer 130 may include a first-1 connection via 131-1 that penetrates a part of the upper side of the insulating layer 110 and is directly connected to the upper surface of the conductor layer 153, and a first-2 connection via 131-2 that penetrates a part of the lower side of the insulating layer 110 and is directly connected to the lower surface of the conductor layer 153. The first connection via 131 may include the first-1 connection via and the first-2 connection vias 131-1 and 131-2. Thus, in the printed circuit board 100A according to an example, the conductor layer 153 of the magnetic structure 150 can be directly connected to the first connection via 131 of the via layer 130. Therefore, the manufacturing process of the printed circuit board 100A can be further simplified, and the slimming and integration of the printed circuit board 100A can be further enhanced.

[0027] On one hand, the first electronic component 170 can be disposed within the insulating layer 110 and can include, but is not limited to, at least one of a voltage regulator and a power management integrated circuit. The first electronic component 170 can be connected to at least a part of the conductor layer 153 of the magnetic structure 150 via the wiring layer 120 and the via layer 130. Further, the second electronic component 170 can be disposed on the insulating layer 110 and can include, but is not limited to, at least one of a memory chip, an application processor chip, and a logic chip. The second electronic component 190 can also be connected to at least another part of the conductor layer 153 of the magnetic structure 150 via the wiring layer 120 and the via layer 130. In this way, the first and second electronic components 170, 190 are disposed inside and outside the printed circuit board 100A and can be connected to the conductor layer 153 of the magnetic structure 150, thus enabling further reduction in size and integration of the printed circuit board 100A. For example, the mounting area on the printed circuit board 100A can be increased, and the current path between the first and second electronic components 170, 190 and the MCI (Magnetic Composite Inductor) can be minimized.

[0028] Hereinafter, with reference to the drawings, the components of the printed circuit board 100A according to an example will be described in more detail.

[0029] The insulating layer 110 can include first to fourth insulating layers 111, 112, 113, and 114. The first insulating layer 111 can have a first through-hole H1 in which at least a part of the magnetic structure 150 is disposed and a second through-hole H2 in which at least a part of the first electronic component 170 is disposed. The first insulating layer 111 can be a core layer. The second insulating layer 112 can cover at least a part of each of the first insulating layer 111, the magnetic structure 150, and the first electronic component 170, and can fill at least a part of each of the first and second through-holes H1 and H2. The third insulating layer 113 can be disposed on the upper surface of the second insulating layer 112. The fourth insulating layer 114 can be disposed on the lower surface of the second insulating layer 112. The second to fourth insulating layers 112, 113, and 114 can be build-up layers. Build-up layers can be further formed on the third and fourth insulating layers 113 and 114, respectively. The first and second through-holes H1 and H2 can penetrate between the upper and lower surfaces of the first insulating layer 111, or can penetrate only a part of the first insulating layer 111 from the upper surface. For example, the first and second through-holes H1 and H2 can be through-cavities and / or blind cavities.

[0030] The first to fourth insulating layers 111, 112, 113, 114 can include an inorganic insulating material and / or an organic insulating material. As a non-limiting example, the first to fourth insulating layers 111, 112, 113, 114 can all include an organic insulating material. Alternatively, the first insulating layer 111 can include an inorganic insulating material, and the second to fourth insulating layers 112, 113, 114 can include an organic insulating material. However, it is not limited thereto. The organic insulating material can include a thermosetting resin such as an epoxy resin, a thermoplastic resin such as a polyimide, or an inorganic filler, an organic filler, and / or glass fiber (Glass Fiber, Glass Cloth, Glass Fabric) together with the resin. For example, the organic insulating material can be, but is not limited to, CCL (Copper Clad Laminate), PPG (Prepreg), ABF (Ajinomoto Build-up Film), PID (Photo Imageable Dielectric), etc. The inorganic insulating material can include a glass substrate, a silicon substrate, and / or a ceramic substrate. For example, the glass substrate can include glass, and the glass can include, for example, pure silicon dioxide (about 100% SiO2), soda-lime glass, borosilicate glass, aluminosilicate glass, etc. However, it is not limited thereto, and alternative glass materials such as fluoroglass, phosphate glass, chalcogen glass, etc. can also be used as the material of the glass layer. Furthermore, in order to form a glass having specific physical properties, other additives can also be further included. Such additives can include not only calcium carbonate (e.g., lime) and sodium carbonate (e.g., soda), but also magnesium, calcium, manganese, aluminum, lead, boron, iron, chromium, potassium, sulfur, and antimony, and carbonates and / or oxides of such elements and other elements. On the other hand, the glass can be distinguished from the glass fiber (glass fiber, glass cloth, glass fabric) contained in the organic insulating material. Also, the silicon substrate can include silicon (Si), and optionally can also include an oxide layer formed on the silicon (Si).Further, it can also include a nitride layer formed on the oxide layer. On the other hand, the oxide layer can include a silicon oxide film, and the nitride layer can include a silicon nitride film, but is not limited thereto. Further, the ceramic substrate can include ceramic, and the ceramic can include, for example, alumina (Al2O3), aluminum nitride (AlN), silicon carbide (SiC), silicon nitride (Si3N4), etc., but is not limited thereto.

[0031] The wiring layer 120 can include a first wiring layer 121 disposed on the upper surface of the second insulating layer 112, a second wiring layer 122 disposed on the lower surface of the second insulating layer 112, a third wiring layer 123 disposed on the upper surface of the first insulating layer 111 and at least partially embedded in the second insulating layer 112, a fourth wiring layer 124 disposed on the lower surface of the first insulating layer 111 and at least partially embedded in the second insulating layer 112, a fifth wiring layer 125 disposed on the upper surface of the third insulating layer 113, and a sixth wiring layer 126 disposed on the lower surface of the fourth insulating layer 114. When the insulating layer 110 further includes a build-up layer, the wiring layer 120 can also further include a build-up wiring layer. The first to sixth wiring layers 121, 122, 123, 124, 125, 126 can each include a metal. The metal can include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), and / or alloys thereof, etc. Preferably, it can include copper (Cu), but is not limited thereto. The first to sixth wiring layers 121, 122, 123, 124, 125, 126 can each perform various functions according to the design. For example, it can include a signal pattern, a power pattern, a ground pattern, etc. These patterns can each have various forms such as a line, a plane, a pad, etc. The first to sixth wiring layers 121, 122, 123, 124, 125, 126 can each include a seed layer and a plating layer formed on the seed layer. The seed layer can be an electroless plating layer (or electroless copper) and / or a sputtering layer, and the plating layer can be an electrolytic plating layer (or electroplated copper), but is not limited thereto.

[0032] The via layer 130 includes a first-1 connection via 131-1 that penetrates a part of the upper side of the second insulating layer 112 to connect the upper surface of the conductor layer 153 to at least a part of the first wiring layer 121, a first-2 connection via 131-2 that penetrates a part of the lower side of the second insulating layer 112 to connect the lower surface of the conductor layer 153 to at least a part of the second wiring layer 122, a second connection via 132 that penetrates another part of the lower side of the second insulating layer 112 to connect the first electronic component 170 to at least another part of the second wiring layer 122, a third connection via 133 that penetrates yet another part of the upper side of the second insulating layer 112 to connect at least a part of each of the first and third wiring layers 121 and 123 to each other, a fourth connection via 134 that penetrates another part of the lower side of the second insulating layer 112 to connect at least a part of each of the second and fourth wiring layers 122 and 124 to each other, a fifth connection via 135 that penetrates the third insulating layer 113 to connect at least a part of each of the first and fifth wiring layers 121 and 125 to each other, a sixth connection via 136 that penetrates the fourth insulating layer 114 to connect at least a part of each of the second and sixth wiring layers 122 and 126 to each other, and a through via that penetrates the first insulating layer 111 to connect at least a part of each of the third and fourth wiring layers 123 and 124 to each other. The first connection via 131 can include the first-1 connection via and the first-2 connection via 131-1 and 131-2. When the insulating layer 110 further includes a build-up insulating layer, the via layer 130 can also further include a build-up via layer.

[0033] The first to sixth connection vias 131, 132, 133, 134, 135, 136 and the through via 137 can each contain a metal. The metal can include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), and / or alloys thereof, etc. Preferably, it can contain copper (Cu), but is not limited thereto. The first to sixth connection vias 131, 132, 133, 134, 135, 136 and the through via 137 can each include a filled via that fills a via hole or a through hole, but can also include a conformal via disposed along the wall surface of the via hole or the through hole. The first to sixth connection vias 131, 132, 133, 134, 135, 136 and the through via 137 can each perform various functions according to the design. For example, it can include a ground via, a power via, a signal via, etc. The first to sixth connection vias 131, 132, 133, 134, 135, 136 and the through via 137 can each include an electroless plating layer (or electroless copper) and an electroplating layer (or electroplated copper). Instead of the electroless plating layer (or electroless copper), a sputtering layer can also be included, or both can be included. The first to sixth connection vias 131, 132, 133, 134, 135, 136 can each have a tapered shape in cross-section. The through via 137 can have a columnar shape in cross-section. A filler p can be disposed inside the through via 137, and the filler p can include an insulating material or a conductive material.

[0034] The magnetic structure 150 can include a magnetic layer 151 having a through-hole h, an insulating film 152 disposed on the wall surface of the through-hole h, and a conductor layer 153 disposed on the insulating film 152 and filling at least a part of the through-hole h. There can be a plurality of magnetic structures 150, and the plurality of magnetic structures 150 can be arranged spaced apart from each other. The conductor layers 153 of each of the plurality of magnetic structures 150 can be connected to each other via the wiring layer 120 and the via layer 130, and one or more coils can be formed through this. Alternatively, the magnetic structure 150 can have a plurality of through-holes h in the magnetic layer 151, and an insulating film 152 and a conductor layer 153 can be formed in each of the plurality of through-holes h. The conductor layers 153 of each of the plurality of through-holes h can be connected to each other via the wiring layer 120 and the via layer 130, and one or more coils can be formed through this. Alternatively, both can be combined to form one or more coils. For example, at least one of the plurality of magnetic structures 150 can have a plurality of through-holes h, an insulating film 152 and a conductor layer 153 can be formed in each of the plurality of through-holes h, and the conductor layers 153 of each of the plurality of magnetic structures 150 and / or the conductor layers 153 of each of the plurality of through-holes h can be connected to each other via the wiring layer 120 and the via layer 130, whereby one or more coils can be formed. Thereby, an MCI (Magnetic Composite Inductor) can be formed in the printed circuit board 100A.

[0035] The magnetic layer 151 can contain a magnetic material. The magnetic material can include, for example, ferrite-based materials, permalloy-based materials, etc. For example, it can include Ni-based ferrite, Ni-Zn-based ferrite, Ni-Zn-Cu-based ferrite, Fe-Si-Al (Sendust), Ni-Mo-Fe (MPP: Molypermalloy Powder Core), Ni-Fe (High Flux Core), etc., but is not limited thereto, and can also include other known ferrite-based materials, permalloy-based materials, etc. Furthermore, various types of magnetic materials containing other magnetic powders and / or magnetic particles can also be used. The magnetic layer 151 can be cured in the form of a magnetic film or a magnetic sheet and disposed in the first through-hole H1. Therefore, the magnetic layer 151 can be disposed separately from the first insulating layer 111.

[0036] The insulating film 152 can contain an insulating material, for example, an inorganic insulating material. For example, the insulating film 152 can contain an inorganic oxide film. For example, the inorganic insulating material contained in the insulating film 152 can include at least one of Al2O3, TiO2, ZnO, ZnO2, ZrO2, SnO, SnO2, HfO2, and SiO2, but is not limited thereto. The insulating film 152 can be formed by a vapor deposition process using an inorganic insulating material and can have a thin thickness. For example, in a cross-section, with the direction perpendicular to the wall surface of the through-hole h as a reference, the width t1 of the insulating film 152 between the wall surface of the through-hole h and the side surface of the conductor layer 153 can be thinner than the width t2 of the magnetic layer 151 between the wall surface of the through-hole h and the outer side surface of the magnetic layer 151. For example, in a cross-section, with the direction perpendicular to the wall surface of the through-hole h as a reference, the width t1 of the insulating film 152 between the wall surface of the through-hole h and the side surface of the conductor layer 153 can be 2 μm or less, for example, about 1 μm to 2 μm.

[0037] The conductor layer 153 can contain a conductive material, such as a metal. For example, the conductor layer 153 can include metal pillars. The metal pillars can be, for example, cylinders, elliptical cylinders, square pillars, etc., but are not limited thereto. For example, the metal contained in the conductor layer 153 can include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), and / or alloys thereof, etc. Preferably, it can contain copper (Cu), but is not limited thereto. The conductor layer 153 can include a seed layer and a plating layer formed on the seed layer. The seed layer can be an electroless plating layer (or electroless copper) and / or a sputtering layer, and the plating layer can be an electrolytic plating layer (or electroplated copper), but is not limited thereto. By a planarization process such as polishing described later, the seed layer is disposed on the lower surface and the side surface of the plating layer, but can be not disposed on the upper surface, and the upper surfaces of the seed layer and the plating layer can be substantially coplanar with each other. For example, the seed layer can be disposed in a form that entirely surrounds the remaining lower surface and the side surface excluding the upper surface of the plating layer with a predetermined thin thickness, and the plating layer can fill the space formed by the seed layer. However, it is not limited thereto, and the seed layer covering the lower surface of the plating layer can also be removed by the polishing process. In this case, the seed layer can be disposed only on the side surface of the plating layer, and the upper and lower surfaces of the seed layer and the plating layer can be substantially coplanar with each other. For example, the seed layer can also be disposed in a form that entirely surrounds the side surface of the plating layer with a predetermined thin thickness.

[0038] The first electronic component 170 can include at least one of a voltage regulator and a power management integrated circuit. There can be a plurality of the first electronic components 170. In this case, all of the plurality of first electronic components 170 can be arranged within the second through-hole H2, or a plurality of second through-holes H2 can be formed and each of the first electronic components 170 can be arranged in each of the second through-holes H2. If necessary, the first electronic component 170 can further include integrated passive devices (IPD), and the integrated passive devices (IPD) can also be, in other terms, integrated passive components (IPC) or embedded passive components (EPC), etc.

[0039] The second electronic component 190 can include a semiconductor chip. The semiconductor chip can be an integrated circuit (IC) die in which hundreds to millions or more elements are integrated within one chip. The integrated circuit die can be formed on an active wafer. In this case, as the base material forming each body, silicon (Si), germanium (Ge), gallium arsenide (GaAs), etc. can be used. Various circuits can be formed on the body. Connection pads can be formed on the front surface of the body, and the connection pads can include conductive substances such as aluminum (Al) and copper (Cu). The semiconductor chip can include, but is not limited to, memory chips such as volatile memory (e.g., DRAM), non-volatile memory (e.g., ROM), flash memory, and application processor chips such as central processors (e.g., CPU), graphics processors (e.g., GPU), digital signal processors, encryption processors, microprocessors, microcontrollers, and logic chips such as analog-to-digital converters and application-specific ICs (ASIC). The second electronic component 190 can be connected to the fifth wiring layer 125 via an electrical connection metal 195. The electrical connection metal 195 can include a low melting point metal such as tin (Sn), and can include, for example, solder, but is not limited thereto.

[0040] Figures 4a to 4i are cross-sectional process diagrams schematically showing an example of the manufacture of the magnetic structure of the printed circuit board of FIG. 3.

[0041] Referring to FIG. 4a, a plurality of magnetic films 151-1, 151-2, 151-3, 151-4 can be prepared. The plurality of magnetic films 151-1, 151-2, 151-3, 151-4 can include substantially the same material as each other, for example, the above-described magnetic substance.

[0042] Referring to FIG. 4b, a plurality of magnetic films 151-1, 151-2, 151-3, 151-4 can be laminated, pressed, and then fired. Thereby, the magnetic layer 151 can be formed.

[0043] Referring to FIG. 4c, if necessary, the first and second cover layers 161, 162 can be attached to the upper and lower surfaces of the magnetic layer 151, respectively. The first and second cover layers 161, 162 can contain an insulating substance, and the material thereof is not particularly limited.

[0044] Referring to FIG. 4d, a plurality of through holes h can be formed in the magnetic layer 151. The plurality of through holes h can be formed using a CNC drill or the like. The plurality of through holes h can also penetrate the first and second cover layers 161, 162.

[0045] Referring to FIG. 4e, a carrier film 210 can be attached to the lower side of the magnetic layer 151. For example, the carrier film 210 can be attached to the lower surface of the second cover layer 162. The material of the carrier film 210 is not particularly limited.

[0046] Referring to FIG. 4f, an insulating film 152 can be formed on the magnetic layer 151. For example, a thin insulating film 152 can be formed using a deposition process such as CVD (Chemical Vapor Deposition) or ALD (Atomic Layer Deposition). The insulating film 152 can cover the upper surface of the first cover layer 161, the respective wall surfaces of the plurality of through holes h, and the exposed upper surface of the carrier film 210.

[0047] Referring to FIG. 4g, a conductor layer 153 can be formed on the insulating film 152. The conductor layer 153 can fill the remaining space of each of the plurality of through holes h. The conductor layer 153 can be formed by a plating process. For example, the conductor layer 153 can be formed using electroless plating, electrolytic plating, or the like.

[0048] Referring to FIG. 4h, the carrier film 210 can be removed, and the upper and lower surfaces of the magnetic layer 151 can be planarized. In this process, the first and second cover layers 161, 162, the insulating film 152, and the conductor layer 153 disposed on the upper and lower surfaces of the magnetic layer 151 can be removed. If necessary, a part of the upper side and / or the lower side of the magnetic layer 151 can also be removed, and together with this, at least a part of each of the insulating film 152 and the conductor layer 153 can be further removed. Therefore, a flat upper surface and a flat lower surface can be provided. As the planarization process, for example, a polishing process such as CMP (Chemical Mechanical Polishing) can be used.

[0049] Referring to FIG. 4i, the cutting process can be advanced. By the cutting process, a plurality of magnetic structures 150A-1, 150A-2 can be formed. At least one of the plurality of magnetic structures 150A-1, 150A-2, i.e., 150A-2, can have a plurality of through holes h, and an insulating film 152-1, 152-2 and a conductor layer 153-1, 153-2 can be respectively disposed in each through hole h.

[0050] Through a series of processes, a plurality of magnetic structures 150A-1, 150A-2 applicable to the printed circuit board 100A according to the above-described example can be formed. Other descriptions can be substantially the same as those described for the printed circuit board 100A according to the example, and overlapping descriptions are omitted.

[0051] FIG. 5 is a cross-sectional view schematically showing another example of a printed circuit board.

[0052] Referring to the drawings, for another example, in the printed circuit board 100B according to an example described above, in the printed circuit board 100A according to an example, the magnetic structure 150B is disposed on the upper surface of the conductor layer 153 and on the upper surface of the insulating film 152, and is connected to the upper surface of the conductor layer 153. The first pad 154 and the lower surface of the conductor layer 153 and the lower surface of the insulating film 152 are disposed thereon, and the second pad 155 connected to the lower surface of the conductor layer 153 can be further included. At this time, the first-1 connection via and the first-2 connection vias 131-1 and 131-2 can be respectively connected to the first and second pads 154 and 155. Therefore, it can be more easily connected to the first-1 connection via and the first-2 connection vias 131-1 and 131-2, and can have more excellent reliability.

[0053] On the other hand, the first and second pads 154 and 155 can each include a metal. For example, the metals included in the first and second pads 154 and 155 can include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), and / or alloys thereof. Preferably, it can include copper (Cu), but is not limited thereto. The first and second pads 154 and 155 can each include a seed layer and a plating layer formed on the seed layer. The seed layer can be an electroless plating layer (or electroless copper) and / or a sputtering layer, and the plating layer can be an electrolytic plating layer (or electroplated copper), but is not limited thereto. The respective seed layers of the first and second pads 154 and 155 can cover the upper and lower surfaces of the conductor layer 153 and the insulating film 152 with a relatively thin thickness, and each plating layer of the first and second pads 154 and 155 can cover the upper and lower surfaces of the respective seed layers of the first and second pads 154 and 155 with a relatively thick thickness. Other descriptions can be substantially the same as those described for the printed circuit board 100A according to an example, and overlapping descriptions are omitted.

[0054] FIGS. 6a to 6j are cross-sectional process diagrams schematically showing an example of manufacturing the magnetic structure of the printed circuit board of FIG. 5.

[0055] Referring to FIGS. 6a to 6h, substantially the same steps as those described in FIGS. 4a to 4h above can be carried out.

[0056] Referring to FIG. 6i, first and second resist layers 221, 222 each having an opening pattern can be formed on the upper and lower surfaces of the magnetic layer 151, and each opening pattern can be filled with plating to form first and second pads 154, 155. The first and second resist layers 221, 222 can be formed by applying and curing a solder resist or laminating a solder resist film. Optionally, after the cutting process described below, the first and second resist layers 221, 222 may remain around the first and second pads 154, 155.

[0057] Referring to FIG. 6j, the cutting process can be carried out. By the cutting process, a plurality of magnetic structures 150B-1, 150B-2 can be formed. At least one 150B-2 of the plurality of magnetic structures 150B-1, 150B-2 can have a plurality of through holes h, and insulating films 152-1, 152-2 and conductor layers 153-1, 153-2 can be respectively arranged in each through hole h, and first pads 154-1, 154-2 and second pads 155-1, 155-2 can be respectively arranged above and below each through hole h.

[0058] Through a series of processes, a plurality of magnetic structures 150B-1, 150B-2 that can be applied to the printed circuit board 100B according to another example described above can be formed. Other descriptions can be substantially the same as those described for the printed circuit board 100A according to one example and the printed circuit board 100B according to another example, and duplicate descriptions are omitted.

[0059] FIG. 7 is a cross-sectional view schematically showing still another example of a printed circuit board.

[0060] Referring to the drawings, a printed circuit board 100C according to still another example can further include a filler g in which a magnetic structure 150C is disposed inside a conductor layer 153, in the printed circuit board 100B according to the other example described above. The first and second pads 154 and 155 can further cover the upper and lower surfaces of the filler g, respectively. The upper surface of the filler g can be substantially coplanar with each of the upper surfaces of the magnetic layer 151, the insulating film 152, and the conductor layer 153. The lower surface of the filler g can be substantially coplanar with each of the lower surfaces of the magnetic layer 151, the insulating film 152, and the conductor layer 153. Therefore, the insulating layer 110 covering this can also have better flatness, and the wiring layer 120 and the via layer 130 can be formed more easily.

[0061] On the other hand, the filler g can include an insulating ink containing an insulating resin such as epoxy, but is not limited thereto, and can also include a conductive ink. For example, the filler g can include an insulating substance and / or a conductive substance. Other descriptions are substantially the same as those described for the printed circuit board 100A according to one example and the printed circuit board 100B according to the other example, and overlapping descriptions are omitted.

[0062] Figs. 8a to 8k are cross-sectional process diagrams schematically showing an example of manufacturing the magnetic structure of the printed circuit board of Fig. 7.

[0063] Referring to Figs. 8a to 8f, the same process as that described in Figs. 4a to 4f above can be carried out.

[0064] Referring to Fig. 8g, a conductor layer 153 can be formed on the insulating film 152. The conductor layer 153 can conformally fill a part of each of the plurality of through-holes h with a predetermined thickness. The conductor layer 153 can be formed by a plating process. For example, the conductor layer 153 can be formed using electroless plating, electrolytic plating, or the like.

[0065] Referring to FIG. 8h, the space between the conductor layers 153 can be filled with a filler g. The filler g can be formed in a plugging process.

[0066] Referring to FIG. 8i, the carrier film 210 can be removed, and the upper and lower surfaces of the magnetic layer 151 can be planarized. In this process, the first and second cover layers 161, 162, the insulating film 152, the conductor layer 153, and the filler g disposed on the upper and lower surfaces of the magnetic layer 151 can be removed. If necessary, a part of the upper side and / or the lower side of the magnetic layer 151 can also be removed, whereby at least a part of each of the insulating film 152, the conductor layer 153, and the filler g can be further removed. Therefore, a flat upper surface and a flat lower surface can be provided. As the planarization process, for example, a polishing process such as CMP (Chemical Mechanical Polishing) can be used.

[0067] Referring to FIG. 8j, first and second resist layers 221, 222 each having an opening pattern can be formed on the upper and lower surfaces of the magnetic layer 151, and each opening pattern can be filled with plating to form first and second pads 154, 155. The first and second resist layers 221, 222 can be formed by applying and curing a solder resist or laminating a solder resist film. If necessary, after the cutting process described later, the first and second resist layers 221, 222 may remain around the first and second pads 154, 155.

[0068] Referring to FIG. 8k, the cutting process can be advanced. A plurality of magnetic structures 150C-1, 150C-2 can be formed by the cutting process. At least one of the plurality of magnetic structures 150C-1, 150C-2, i.e., 150C-2, can have a plurality of through holes h, and an insulating film 152-1, 152-2, a conductor layer 153-1, 153-2, and a filler g1, g2 can be respectively disposed in each through hole h, and first pads 154-1, 154-2 and second pads 155-1, 155-2 can be respectively disposed on the upper and lower sides of each through hole h.

[0069] Through a series of processes, a plurality of magnetic structures 150C-1 and 150C-2 that can be applied to the printed circuit board 100C according to still another example described above can be formed. Other descriptions can be substantially the same as those described for the printed circuit board 100A according to one example, the printed circuit board 100B according to another example, and the printed circuit board 100C according to still another example, and duplicate descriptions are omitted.

[0070] Figures 9a to 9f are plan views schematically showing various examples of coils that can be applied to the printed circuit boards of Figures 3, 5, 7, etc.

[0071] Referring to Figure 9a, the coil portion c can include a plurality of coils c1 and c2 arranged in parallel in a straight line. The plurality of coils c1 and c2 can be arranged spaced apart from each other. Other wirings can be arranged between the plurality of coils c1 and c2.

[0072] Referring to Figure 9b, the coil portion c can also include a coil c3 that is arranged in a straight line and then bent on the right side and arranged in a straight line again.

[0073] Referring to Figure 9c, the coil portion c can also include a coil c4 that is arranged to be repeatedly bent up and down.

[0074] Referring to Figure 9d, the coil portion c can also include a coil c5 that is repeatedly arranged in a form inclined in one direction.

[0075] Referring to Figure 9e, the coil portion c can also include a coil c6 that is repeatedly arranged in a form inclined in one direction, then bent on the right side, and then repeatedly arranged in a form inclined in the opposite direction.

[0076] Referring to Figure 9f, the coil portion c can also include a coil c7 that is repeatedly arranged in an X shape.

[0077] For example, in the printed circuit boards 100A, 100B, and 100C described above, a coil part c including coils c1, c2, c3, c4, c5, c6, and c7 in various forms can be applied. However, the form of the coil part c is not limited to the above-described examples. Other explanations can be substantially the same as those described for the printed circuit board 100A according to one example, the printed circuit board 100B according to another example, and the printed circuit board 100C according to still another example, and duplicate explanations will be omitted.

[0078] In the present disclosure, the expression "cover" can include not only the case of covering entirely but also the case of covering at least a part, and can include not only the case of directly covering but also the case of indirectly covering. Also, the expression "fill" can include not only the case of filling completely but also the case of filling at least a part, and can include the case of roughly filling. For example, it can include the case where there are some voids or voids. Also, the expression "surround" can include not only the case of surrounding completely but also the case of surrounding a part and the case of roughly surrounding. Also, "exposing" can include not only the case of completely exposing but also the case of exposing a part, and the exposure can mean exposing from what embeds the corresponding configuration. For example, the opening exposing the pad can be exposing the pad from the resist layer, and a surface treatment layer or the like can be further disposed on the exposed pad.

[0079] In the present disclosure, the statement that an object is disposed in a through portion or a through hole can include not only the case where the object is completely disposed in the through portion or the through hole but also the case where a part protrudes upward or downward from the cross section. For example, if it is a case of being disposed in a through portion or a through hole on a plane, it can be judged in a broader sense.

[0080] In the present disclosure, it can be determined by substantially including process errors, position deviations, errors during measurement, etc. that occur during the manufacturing process. For example, being substantially perpendicular can include not only the case of being completely perpendicular but also the case of being roughly perpendicular. Also, being substantially coplanar can include not only the case of existing in exactly the same plane but also the case of existing in a roughly the same plane.

[0081] In the present disclosure, the same insulating material can mean not only the case of being exactly the same insulating material but also including insulating materials of the same type. Therefore, although the composition of the insulating materials is substantially the same, these specific composition ratios can be slightly different.

[0082] In the present disclosure, the meaning of cross-section can mean the cross-sectional shape when the object is cut vertically, or the cross-sectional shape when the object is cut vertically, or the cross-sectional shape when the object is viewed in a side view. Also, the meaning of plane can mean the planar shape when the object is cut horizontally, or the planar shape when the object is viewed in a top view or a bottom view.

[0083] In the present disclosure, the lower side, lower part, lower surface, etc. are used to mean the downward direction based on the cross-section of the drawing for convenience, and the upper side, upper part, upper surface, etc. are used to mean the opposite direction. However, this is to define the direction for convenience of explanation, and it goes without saying that the scope of rights in the claims is not particularly limited by the description of such a direction, and the concept of up / down can change at any time.

[0084] In the present disclosure, the meaning of "connected" is a concept that includes not only the case of being directly connected but also the case of being indirectly connected via an adhesive layer or the like. Further, the meaning of "electrically connected" is a concept that includes all cases of being physically connected and not being connected. Furthermore, expressions such as first, second, etc. are used to distinguish one component from another component, and do not limit the order and / or importance of the component. In some cases, without departing from the scope of the claims, the first component can also be named the second component, and similarly the second component can also be named the first component.

[0085] In the present disclosure, thickness, width, length, depth, line width, interval, pitch, separation distance, surface roughness, etc. can be measured with a scanning microscope or an optical microscope based on a cross-section obtained by polishing or cutting a printed circuit board. The cut cross-section can be a vertical cross-section or a horizontal cross-section, and numerical values can be measured based on the required cut cross-section. For example, the width of the upper end and / or the lower end of a via can be measured on a cross-section obtained by cutting the central axis of the via. At this time, when the numerical values are not constant, the numerical values can be determined as the average value of the values measured at any five points.

[0086] The expression "an example used in the present disclosure" does not mean the same embodiment as each other, but is provided to emphasize and explain each unique feature different from each other. However, the above-provided example does not exclude being realized in combination with the features of another example. For example, even if a matter described in a specific example is not described in another example, it can be understood as an explanation related to another example as long as there is no explanation contrary to or conflicting with that matter in the other example.

[0087] The terms used in the present disclosure are merely used to explain an example and are not intended to limit the present disclosure. At this time, the singular expression includes a plural expression unless the context clearly indicates otherwise.

Explanation of Reference Numerals

[0088] 1000 Electronic device 1010 Main board 1020 Chip-related components 1030 Network-related components 1040 Other components 1050 Camera 1060 Antenna 1070 Display 1080 Battery 1090 Signal line 1100 Smartphone 1110 Motherboard 1120 Components 1121 Component package 1130 Camera module 1140 Speaker 100A, 100B, 100C Printed circuit board 110 Insulating layer 111, 112, 113, 114 Insulating layer 120 Wiring layer 121, 122, 123, 124, 125, 126 Wiring layer 130 Via layer 131, 132, 133, 134, 135, 136 Connection via 137 Through-hole via 150 Magnetic structure 151 Magnetic layer 152 Insulating film 153 Conductor layer 154, 155 Pad 161, 162 Cover layer 170, 190 Electronic components 195 Electrical connection metal 210 Carrier film 221, 222 Resist layer H1, H2 Through-hole h Through-hole p, g Filling material

Claims

1. a magnetic structure including a magnetic layer having a through hole, an insulating film including an inorganic insulating material and disposed on a wall surface of the through hole, and a conductor layer including a metal and disposed on the insulating film, filling at least a portion of the through hole; an insulating layer covering at least a portion of the magnetic structure; A wiring layer disposed on or within the insulating layer; a via layer disposed within the insulating layer and including a first connection via that connects the conductor layer to the wiring layer.

2. The inorganic insulating material is Al ２ O ３ , TiO ２ , ZnO, ZnO ２ , ZrO ２ , SnO, SnO ２ , HfO ２ and SiO ２ The printed circuit board of claim 1 , comprising at least one of:

3. 2. The printed circuit board of claim 1, wherein, on a cross section, a width of the insulating film between the wall surface of the through hole and a side surface of the conductor layer is thinner than a width of the magnetic layer between the wall surface of the through hole and an outer side surface of the magnetic layer, based on a direction perpendicular to the wall surface of the through hole.

4. 4. The printed circuit board according to claim 3, wherein a width of the insulating film between a wall surface of the through hole and a side surface of the conductor layer on a cross section is 2 μm or less with respect to a direction perpendicular to the wall surface of the through hole.

5. The magnetic structures are multiple, The magnetic structures are spaced apart from one another, The printed circuit board of claim 1 , wherein the conductor layers of each of the plurality of magnetic structures are coupled to one another through the wiring layer and the via layer to form one or more coils.

6. The magnetic structure includes a magnetic layer having a plurality of the through holes, the insulating film and the conductor layer are disposed in each of the plurality of through holes; The printed circuit board according to claim 1 , wherein the conductor layers of each of the plurality of through holes are connected to one another through the wiring layer and the via layer to form one or more coils.

7. a first electronic component disposed within the insulating layer, The first electronic component includes at least one of a voltage regulator and a power management integrated circuit; The printed circuit board according to claim 1 , wherein the first electronic component is coupled to at least a portion of the conductor layer of the magnetic structure through the wiring layer and the via layer.

8. a second electronic component disposed on the insulating layer, the second electronic component includes a semiconductor chip; The printed circuit board according to claim 7 , wherein the second electronic component is coupled to at least a portion of the other of the conductor layer of the magnetic structure through the wiring layer and the via layer.

9. the insulating layer includes a first insulating layer having a through portion in which at least a portion of the magnetic structure is disposed, and a second insulating layer covering at least a portion of each of the first insulating layer and the magnetic structure and filling at least a portion of the through portion; the wiring layer includes a first wiring layer disposed on an upper surface of the second insulating layer and a second wiring layer disposed on a lower surface of the second insulating layer; the via layer further includes a 1-1 connection via that penetrates a portion of an upper side of the second insulating layer and connects an upper surface of the conductor layer to at least a portion of the first wiring layer, and a 1-2 connection via that penetrates a portion of a lower side of the second insulating layer and connects a lower surface of the conductor layer to at least a portion of the second wiring layer, 2. The printed circuit board of claim 1, wherein the first connection vias include the 1-1 connection via and the 1-2 connection via.

10. the wiring layer further includes a third wiring layer disposed on an upper surface of the first insulating layer and at least a portion of which is embedded in the second insulating layer, and a fourth wiring layer disposed on a lower surface of the first insulating layer and at least a portion of which is embedded in the second insulating layer; 10. The printed circuit board of claim 9, wherein the via layer further includes a third connection via that penetrates another portion of the upper side of the second insulating layer and connects at least a portion of each of the first wiring layer and the third wiring layer to each other, a fourth connection via that penetrates another portion of the lower side of the second insulating layer and connects at least a portion of each of the second wiring layer and the fourth wiring layer to each other, and a through via that penetrates the first insulating layer and connects at least a portion of each of the third wiring layer and the fourth wiring layer to each other.

11. 10. The printed circuit board of claim 9, wherein the first-1 connection via and the first-2 connection via are directly connected to the upper surface and the lower surface of the conductor layer, respectively.

12. the magnetic structure further includes a first pad disposed on the upper surface of the conductor layer and the upper surface of the insulating film and coupled to the upper surface of the conductor layer, and a second pad disposed on the lower surface of the conductor layer and the lower surface of the insulating film and coupled to the lower surface of the conductor layer, 10. The printed circuit board of claim 9, wherein the first-1 connection via and the first-2 connection via are connected to the first pad and the second pad, respectively.

13. The magnetic structure further includes a filler disposed within the conductor layer; The printed circuit board of claim 12 , wherein the first and second pads further cover an upper and lower surface of the filler, respectively.

14. a magnetic structure including a magnetic layer having a through hole, an insulating film disposed on a wall surface of the through hole, and a conductor layer disposed on the insulating film and filling at least a portion of the through hole; an insulating layer covering at least a portion of the magnetic structure; A wiring layer disposed on or within the insulating layer; a via layer disposed in the insulating layer and including a connection via that connects the conductor layer to the wiring layer; an upper surface of the magnetic layer, an upper surface of the insulating film, and an upper surface of the conductor layer are substantially coplanar with each other; a lower surface of the magnetic layer, a lower surface of the insulating film, and a lower surface of the conductor layer, the lower surface being substantially coplanar with one another.

15. the magnetic structure further includes a filler disposed inside the conductive layer, a first pad disposed on an upper surface of the conductive layer, an upper surface of the filler, and an upper surface of the insulating film, and coupled to the upper surface of the conductive layer, and a second pad disposed on a lower surface of the conductive layer, a lower surface of the filler, and a lower surface of the insulating film, and coupled to the lower surface of the conductive layer, an upper surface of the filling material is substantially coplanar with an upper surface of the magnetic layer, an upper surface of the insulating film, and an upper surface of the conductor layer; The printed circuit board according to claim 14 , wherein a lower surface of the filler is substantially coplanar with a lower surface of the magnetic layer, a lower surface of the insulating film, and a lower surface of the conductor layer.

16. The printed circuit board of claim 14 , further comprising: a magnetic composite inductor (MCI) including the magnetic structure and at least a portion of the wiring layer connected to the magnetic structure.

Images