Sensor device and information processing apparatus

Abstract

To provide a sensor device capable of improving measurement accuracy while reducing the size of the device.SOLUTION: A sensor device comprises a substrate, one or more first IMU sensors, and one or more second IMU sensors. The substrate has a first surface and a second surface, which is on the side opposite to the first surface. The one or more first IMU sensors are arranged on the first surface. The one or more second IMU sensors are arranged on the second surface. Arranging the IMU sensors on both the first surface and the second surface enables the reduction of the device size and suppression of the substrate deformation caused by heat. Thus, highly accurate measurements based on detection results (sensing results) of the plurality of IMU sensors can be realized.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present technology relates to a sensor device applicable to inertial measurement and the like.

Background Art

[0002] Patent Document 1 discloses an inertial measurement unit including a plurality of MEMS gyro sensors (paragraph

[0087] of the specification, FIG. 6, etc.).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In an inertial measurement device or the like as described in Patent Document 1, there is a demand for a technology capable of improving measurement accuracy while reducing the size of the device.

[0005] In view of the above circumstances, an object of the present technology is to provide a sensor device capable of improving measurement accuracy while reducing the size of the device.

Means for Solving the Problems

[0006] To achieve the above object, a sensor device according to an aspect of the present technology includes a substrate, one or more first IMU sensors, and one or more second IMU sensors. The substrate has a first surface and a second surface opposite to the first surface. The one or more first IMU sensors are disposed on the first surface. The one or more second IMU sensors are disposed on the second surface.

[0007] In this sensor device, one or more first IMU sensors are arranged on the first surface of the substrate. Also, one or more second IMU sensors are arranged on the second surface opposite to the first surface. By arranging IMU sensors on both the first surface and the second surface, it becomes possible to reduce the size of the device and also to suppress deformation of the substrate caused by heat. Thereby, it becomes possible to realize highly accurate measurement based on the detection results (sensing results) of a plurality of IMU sensors.

[0008] Each of the one or more first IMU sensors and each of the one or more second IMU sensors may be MEMS sensors.

[0009] The first arrangement configuration of the plurality of first IMU sensors arranged on the first surface and the second arrangement configuration of the plurality of second IMU sensors arranged on the second surface may correspond to each other.

[0010] The first arrangement configuration and the second arrangement configuration may be equal to each other.

[0011] The one or more first IMU sensors may be a plurality of first IMU sensors. In this case, the one or more second IMU sensors may be a plurality of second IMU sensors corresponding to the number of the plurality of first IMU sensors.

[0012] The number of the plurality of second IMU sensors may be the same as the number of the plurality of first IMU sensors.

[0013] The plurality of first IMU sensors may be respectively arranged at predetermined positions on the first surface. In this case, the plurality of second IMU sensors may be respectively arranged at positions on the second surface corresponding to the positions of the plurality of first IMU sensors on the first surface.

[0014] The position of each of the plurality of first IMU sensors on the first surface and the position of each of the plurality of second IMU sensors on the second surface may be equal to each other.

[0015] The plurality of second IMU sensors may be respectively arranged at positions on the second surface that are opposite to the positions of the plurality of first IMU sensors on the first surface.

[0016] The plurality of first IMU sensors may be symmetrically arranged with reference to a predetermined first reference position on the first surface.

[0017] The plurality of second IMU sensors may be symmetrically arranged with reference to a second reference position on the second surface corresponding to the first reference position.

[0018] The sensor device may further include a control circuit unit for controlling the operations of each of the one or more first IMU sensors and the one or more second IMU sensors.

[0019] When the substrate having the first surface and the second surface is used as a sensor substrate, The sensor device may further include one or more sensor substrates, a main substrate, and one or more flexible substrates. The main substrate is configured separately from the one or more sensor substrates, and the control circuit unit is arranged thereon. The one or more flexible substrates electrically connect the one or more sensor substrates and the main substrate.

[0020] The one or more sensor substrates may include a first sensor substrate and a second sensor substrate. In this case, the one or more flexible substrates may include a first flexible substrate for electrically connecting the first sensor substrate and the main substrate, and a second flexible substrate for electrically connecting the second sensor substrate and the main substrate.

[0021] The main substrate may have a third surface on which the control circuit section is disposed and a fourth surface opposite to the third surface. In this case, the first sensor substrate may be disposed at a position facing the third surface or the fourth surface of the main substrate when the first flexible substrate is bent. Also, the second sensor substrate may be disposed at a position facing the third surface or the fourth surface of the main substrate when the second flexible substrate is bent.

[0022] The second sensor substrate may be disposed at a position facing the surface of the main substrate that faces the surface facing the first sensor substrate among the third surface and the fourth surface of the main substrate.

[0023] The second sensor substrate may be disposed at a position facing the surface of the main substrate that is opposite to the surface facing the first sensor substrate among the third surface and the fourth surface of the main substrate.

[0024] The sensor device may further include a holding portion that holds the main substrate and the one or more sensor substrates disposed at predetermined positions with respect to the main substrate when the one or more flexible substrates are bent.

[0025] When the substrate having the first surface and the second surface is used as the sensor substrate, The sensor device may further include a main substrate and a frame. The main substrate is configured separately from the sensor substrate, and the control circuit section is disposed thereon. The frame has connection wirings, and holds the sensor substrate and the main substrate such that the sensor substrate and the main substrate are electrically connected by the connection wirings.

[0026] The main substrate may have a third surface on which the control circuit portion is disposed and a fourth surface opposite to the third surface. In this case, the frame may hold the sensor substrate and the main substrate such that the sensor substrate faces the third surface or the fourth surface of the main substrate.

[0027] When the surface of the sensor substrate that faces the main substrate among the first surface and the second surface is defined as the first opposing surface, and the surface of the main substrate that faces the sensor substrate among the third surface and the fourth surface is defined as the second opposing surface, the frame may have a partition portion disposed between the first opposing surface and the second opposing surface, one or more first abutting portions extending from the partition portion toward the sensor substrate side and abutting against the sensor substrate, and one or more second abutting portions extending from the partition portion toward the main substrate side and abutting against the main substrate.

[0028] The partition portion may have a flat plate shape and may have a fifth surface facing the sensor substrate and a sixth surface facing the sensor substrate. In this case, the one or more first abutting portions may be formed in a partial region of the peripheral edge of the fifth surface, and the one or more second abutting portions may be formed in a partial region of the peripheral edge of the sixth surface.

[0029] When viewed in the direction in which the sensor substrate and the main substrate face each other, the position of the region where the one or more first abutting portions are formed on the peripheral edge of the fifth surface and the position of the region where the one or more second abutting portions are formed on the peripheral edge of the sixth surface may be different from each other.

[0030] When viewed in the direction in which the sensor substrate and the main substrate face each other, the position of the one or more first gap regions where the one or more first abutting portions are not formed on the peripheral edge of the fifth surface and the position of the one or more second gap regions where the one or more second abutting portions are not formed on the peripheral edge of the sixth surface may be different from each other.

[0031] When viewed from the direction in which the sensor substrate and the main substrate face each other, the one or more first abutting portions may be formed in a region on the opposite side of the one or more second gap regions on the sixth surface. In this case, the one or more second abutting portions may be formed in a region on the opposite side of the one or more first gap regions on the fifth surface.

[0032] When the sensor substrate is held by the frame, a first space may be formed in which the position of the one or more first gap regions on the fifth surface is opened by the partition portion, the first abutting portion, and the sensor substrate. In this case, when the main substrate is held by the frame, a second space may be formed in which the position of the one or more second gap regions on the sixth surface is opened by the partition portion, the second abutting portion, and the main substrate.

[0033] When viewed from the direction in which the sensor substrate and the main substrate face each other, the opening position of the first space and the opening position of the second space may be different from each other.

[0034] When viewed from the direction in which the sensor substrate and the main substrate face each other, the sensor substrate, the main substrate, and the partition portion may have the same shape as each other.

[0035] When viewed from the direction in which the sensor substrate and the main substrate face each other, the sensor substrate, the main substrate, and the partition portion may have a rectangular shape. In this case, the first abutting portions may be formed on two first side portions that extend in a first direction on the fifth surface and face each other. Also, the second abutting portions may be formed on two second side portions that extend in a second direction orthogonal to the first direction on the sixth surface and face each other.

[0036] The connection wiring may include a first connection terminal portion formed on at least one of the one or more first contact surfaces that contact the sensor substrate of the one or more first contact portions, a second connection terminal portion formed on at least one of the one or more second contact surfaces that contact the main substrate of the one or more second contact portions, and a wiring portion that electrically connects the first connection terminal portion and the second connection terminal portion.

[0037] A connection terminal portion electrically connected to the first connection terminal portion may be formed on the surface that contacts the first contact surface of the sensor substrate. In this case, a connection terminal portion electrically connected to the second connection terminal portion may be formed on the surface that contacts the second contact surface of the main substrate.

[0038] If the sensor substrate is a first sensor substrate and the frame is a first frame, the sensor device may include a second sensor substrate and a second frame. In this case, the first frame has a first connection wiring, and may hold the first sensor substrate and the main substrate such that the first sensor substrate and the main substrate are electrically connected by the first connection wiring. Also, the second frame has a second connection wiring, and may hold the first sensor substrate and the second sensor substrate such that the second sensor substrate and the main substrate are electrically connected by the first connection wiring and the second connection wiring.

[0039] The sensor device may further include one or more dummy components disposed on at least one of the first surface or the second surface.

[0040] A sensor device according to another aspect of the present technology includes a substrate, one or more first gyro sensors, and one or more second gyro sensors. The substrate has a first surface and a second surface opposite to the first surface. The one or more first gyro sensors are disposed on the first surface. The one or more second gyro sensors are disposed on the second surface.

Brief Description of the Drawings

[0041]

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Embodiments for Carrying Out the Invention

[0042] Hereinafter, embodiments according to the present technology will be described with reference to the drawings.

[0043] [Functional Overview of Sensor Device] FIG. 1 is a block diagram for explaining the functional overview of the sensor device according to an embodiment of the present technology. As shown in FIG. 1, the sensor device 100 includes a plurality of IMU (Inertial Measurement Unit) sensors 5 and a control circuit unit 6. The IMU sensor 5 is also called an inertial measurement device.

[0044] Each of the plurality of IMU sensors 5 can detect angular velocity and acceleration. Typically, it is possible to detect angular velocity and acceleration with respect to three mutually orthogonal axes. The specific configuration of the plurality of IMU sensors 5 is not limited. For example, a gyro sensor (angular velocity sensor) and an acceleration sensor are arranged corresponding to each of the three axes. In the present embodiment, a case where each of the plurality of IMU sensors 5 is a MEMS (Micro Electro Mechanical System) sensor will be taken as an example. That is, a case where a MEMS-IMU sensor is used will be taken as an example. By using a MEMS-IMU sensor, it is very advantageous for miniaturization of the device. Of course, the application of the present technology is not limited to the case where each of the plurality of IMU sensors 5 is configured as a MEMS sensor. Moreover, the present technology is applicable regardless of whether each of the plurality of IMU sensors 5 has the same configuration as each other or different configurations from each other.

[0045] The control circuit unit 6 is configured to control the operation of each of the plurality of IMU sensors 5. For example, the control circuit unit 6 can be realized by a processor such as a CPU or DSP, an FPGA, an ASIC, etc. In addition, any programmable logic device or the like may be used.

[0046] In the present embodiment, the detection results (sensing results) output from each of the plurality of IMU sensors 5 are output to the control circuit unit 6. Then, based on the plurality of detection results, the angular velocity and acceleration are calculated by the control circuit unit 6. Since the angular velocity and acceleration are calculated based on the plurality of detection results, for example, even when a small IMU sensor 5 configured as a MEMS sensor is used, it is possible to achieve high measurement accuracy. Note that the method of calculating the angular velocity and acceleration based on the plurality of detection results output from the plurality of IMU sensors 5 is not limited, and any algorithm or the like may be adopted. A configuration may be adopted in which the plurality of detection results output from the plurality of IMU sensors 5 by the control circuit unit 6 are transmitted to an external computer or the like, and the angular velocity and acceleration are calculated by the external computer or the like. The sensor device 100 shown in FIG. 1 can also be said to be a sensor device having a multi-IMU sensor configuration. It is also possible to call the sensor device 100 itself shown in FIG. 1 an IMU sensor (inertial measurement unit).

[0047] [Arrangement examples of a plurality of IMU sensors] FIG. 2 is a schematic diagram showing an arrangement example of the plurality of IMU sensors 5. In the example shown in FIG. 2, the sensor device 100 includes a sensor substrate 7 and a plurality of IMU sensors 5. The sensor substrate 7 is a rigid substrate on which a plurality of IMU sensors 5 are arranged (mounted). As shown in FIGS. 2A and 2B, the sensor substrate 7 has a first surface 8 and a second surface 9 on the side opposite to the first surface 8. The first surface 8 and the second surface 9 are opposite to each other. The method of defining the first surface 8 and the second surface 9 with respect to the sensor substrate 7 is not limited and may be arbitrarily defined. For example, with respect to a substrate having a front surface and a back surface, the present technology can be applied by designating either one of the surfaces as the first surface 8 and the surface on the opposite side as the second surface 9. The size, material, outer shape (shape when viewed along the Z direction), etc. of the sensor substrate 7 are not limited. For example, a substrate of any material such as a glass epoxy substrate may be used. Also, for example, a ceramic material having a low coefficient of linear expansion may be used. Of course, a substrate of a metal material such as aluminum or copper may also be used. Also, the present technology is applicable to substrates of any outer shape, such as a rectangular substrate, a circular substrate, or a polygonal substrate as shown in FIG. 2. In the present embodiment, the sensor substrate 7 corresponds to a substrate having a first surface and a second surface on the side opposite to the first surface.

[0048] The plurality of IMU sensors 5 are arranged on both the first surface 8 and the second surface 9. Of the plurality of IMU sensors 5, the IMU sensor 5 arranged on the first surface 8 is defined as the first IMU sensor 11. Of the plurality of IMU sensors 5, the IMU sensor 5 arranged on the second surface 9 is defined as the second IMU sensor 12. The number of the first IMU sensors 11 arranged on the first surface 8 and the number of the second IMU sensors 12 arranged on the second surface 9 are not limited. There may be a case where one first IMU sensor 11 is arranged on the first surface 8 or / and a case where one second IMU sensor 12 is arranged on the second surface 9. Therefore, it can be said that the sensor device 100 according to the present embodiment includes one or more first IMU sensors 11 arranged on the first surface 8 and one or more second IMU sensors 12 arranged on the second surface 9.

[0049] As shown in FIG. 2A, in the present embodiment, a plurality of first IMU sensors 11 are arranged on the first surface 8. Specifically, 16 first IMU sensors 11 are arranged. As shown in FIG. 2B, 16 second IMU sensors 12 are arranged on the second surface 8. Therefore, in the example shown in FIG. 2, the same number of IMU sensors 5 are arranged on the first surface 8 and the second surface 9, respectively. Since a plurality of IMU sensors 5 are arranged on both the first surface 8 and the second surface 9 of the sensor substrate 7, it is possible to increase the number of IMU sensors 5 without increasing the size of the device. As a result, it is possible to improve the measurement accuracy while reducing the size of the device.

[0050] FIG. 3 is a diagram for explaining the influence of heat on the sensor substrate 7. For example, it is assumed that a plurality of IMU sensors 5 are arranged only on the first surface 8 of the sensor substrate 7 (in the figure, the illustration of the IMU sensors 5 is simplified). In this case, due to the difference between the linear expansion coefficient of the sensor substrate 7 and the linear expansion coefficient of each of the plurality of IMU sensors 5, the sensor substrate 7 may be deformed. For example, it is assumed that the linear expansion coefficient of the sensor substrate 7 is larger than the linear expansion coefficient of the IMU sensor 5. In this case, the sensor substrate 7 has a larger thermal expansion rate than the IMU sensor 5, and the sensor substrate 7 may be bent toward the side where the IMU sensors 5 are arranged. Then, as shown in FIG. 3, the posture of each of the plurality of IMU sensors 5 arranged on the first surface 8 of the sensor substrate 7 is inclined. Further, the inclination occurs variably depending on the deformed state of the sensor substrate 7 and the positions of the respective IMU sensors 5. Then, an error is included in the detection result detected by each IMU sensor 5. As a result, the angular velocity and acceleration calculated based on the plurality of detection results also have low accuracy values including errors. In FIG. 3, the deformation of the sensor substrate 7 is emphasized for easy visual understanding of the influence of heat. In reality, the deformation due to heat may be so small that it cannot be visually recognized by the human eye. Even such microscopic deformation affects the accuracy of the detection results of the IMU sensor 5, reducing the accuracy of the angular velocity and acceleration calculated based on multiple detection results.

[0051] In the present embodiment, as shown in FIGS. 2A and 2B, a plurality of IMU sensors (first IMU sensor 11, second IMU sensor 12) are arranged on both the first surface 8 and the second surface 9 of the sensor substrate 7. Therefore, the stress generated in the sensor substrate 7 by heat, that is, the stress that attempts to bend the sensor substrate 7 toward the first surface 8 side (hereinafter referred to as the first stress), and the stress that attempts to bend the sensor substrate 7 toward the second surface 9 side (hereinafter referred to as the second stress) cancel each other out. That is, it becomes possible to cancel (cancel) the first stress and the second stress. As a result, it becomes possible to sufficiently suppress the influence of heat caused by the difference between the linear expansion coefficient of the sensor substrate 7 and the linear expansion coefficients of the plurality of IMU sensors (first IMU sensor 11, second IMU sensor 12). For example, when IMU sensors 5 having the same configuration are used as the first IMU sensor 11 and the second IMU sensor 12, the magnitude relationship of the linear expansion coefficient of the first IMU sensor 11 with respect to the sensor substrate 7 is equal to the magnitude relationship of the linear expansion coefficient of the second IMU sensor 12 with respect to the sensor substrate 7. Therefore, it becomes possible to cancel the first stress and the second stress generated according to the difference in the linear expansion coefficient. Of course, it is not limited to this. Suppose IMU sensors 5 having different configurations are used as the first IMU sensor 11 and the second IMU sensor 12. Even in this case, by making the magnitude relationship of the linear expansion coefficients with respect to the sensor substrate 7 equal, it becomes possible to sufficiently suppress the influence of heat caused by the difference in the linear expansion coefficient. Regarding the sensor substrate 7 on which a plurality of first IMU sensors 11 and a plurality of second IMU sensors 12 are arranged, what kind of heat distribution will occur depends on the usage state of the sensor device 100, the external temperature, the internal configuration for realizing the control circuit section 6, etc. For example, when an FPGA (control circuit section 6) or the like is arranged on the sensor substrate 7, the influence of the heat generated from the FPGA or the like is considered, and the heat distribution generated due to the position of the FPGA or the like changes. In the sensor device 100 according to the present embodiment, regardless of what kind of distribution the heat distribution on the sensor substrate 7 has, it is possible to cancel the stress from both the first surface 8 and the second surface 9, so it is possible to sufficiently suppress the deformation of the sensor substrate 7. Thereby, it is possible to sufficiently suppress the inclination of the posture of each of the plurality of IMU sensors 5. As a result, it is possible to realize highly accurate inertial measurement based on a plurality of detection results output from the plurality of IMU sensors 5.

[0052] [Arrangement configuration of the first IMU sensor and the second IMU sensor] Specific examples of the arrangement configuration of the plurality of first IMU sensors 11 arranged on the first surface 8 (hereinafter referred to as the first arrangement configuration) and the arrangement configuration of the plurality of second IMU sensors 12 arranged on the second surface 9 (hereinafter referred to as the second arrangement configuration) will be described. The "arrangement configuration" includes various parameters and states related to the arrangement, such as the number of IMU sensors 5 arranged on the arrangement surface (the first surface 8, the second surface 9) and the position of the IMU sensors 5 on the arrangement surface. For example, the position of each of the plurality of IMU sensors 5 on the arrangement surface, the positional relationship with each other, the arrangement state, etc. are also included in the "arrangement configuration". For example, by making the first arrangement configuration and the second arrangement configuration correspond to each other, it is possible to improve the effect of canceling the first stress and the second stress to suppress the deformation of the sensor substrate 7 (hereinafter referred to as the deformation suppression effect). Furthermore, by making the first arrangement configuration and the second arrangement configuration equal to each other, it is possible to improve the deformation suppression effect. Note that the configuration in which the first arrangement configuration and the second arrangement configuration are equal to each other is included in the configuration in which the first arrangement configuration and the second arrangement configuration correspond to each other.

[0053] [Number of IMU sensors] By making the number of the first IMU sensors 11 arranged on the first surface 8 correspond to the number of the second IMU sensors 12 arranged on the second surface 9, it is possible to make the first arrangement configuration and the second arrangement configuration correspond to each other. For example, when a plurality of first IMU sensors 11 are arranged on the first surface 8, a plurality of second IMU sensors 12 having a number corresponding to the number of the plurality of first IMU sensors 11 are arranged on the second surface 9. For example, as illustrated in FIGS. 2A and B, when the number of the plurality of second IMU sensors 12 is the same as the number of the plurality of first IMU sensors 11, it can be said that the numbers of the first IMU sensors 11 and the second IMU sensors 12 correspond to each other. By making the numbers of the first IMU sensors 11 and the second IMU sensors 12 the same, it is possible to exhibit a high deformation suppression effect. The configuration in which the numbers of the first IMU sensors 11 and the second IMU sensors 12 correspond to each other is not limited to the case where the numbers of the first IMU sensors 11 and the second IMU sensors 12 are the same. For example, 16 first IMU sensors 11 are arranged on the first surface 8, and correspondingly, 15 (or 17) second IMU sensors 12 are arranged on the second surface 9. Even in such a configuration, it is possible to cancel the first stress and the second stress, and it is possible to exhibit the deformation suppression effect. The configuration in which the numbers of the first IMU sensors 11 and the second IMU sensors 12 correspond to each other includes any configuration in which the number of the second IMU sensors 12 is defined based on the number of the first IMU sensors 11 within the range where the deformation suppression effect is exhibited. Of course, any configuration in which the number of the first IMU sensors 11 is defined based on the number of the second IMU sensors 12 is also included.

[0054] [Position of the IMU sensor] By making the position of the first IMU sensor 11 arranged on the first surface 8 correspond to the position of the second IMU sensor 12 arranged on the second surface 9, it is possible to make the first arrangement configuration and the second arrangement configuration correspond to each other. For example, a plurality of first IMU sensors 11 are respectively arranged at predetermined positions on the first surface 8. A plurality of second IMU sensors 12 are respectively arranged at positions on the second surface 9 corresponding to the positions of the plurality of first IMU sensors 11 on the first surface 8. Hereinafter, a configuration example in which the positions of the plurality of first IMU sensors 11 and the positions of the plurality of second IMU sensors 12 correspond to each other will be given.

[0055] (Configuration example A) The position of each of the plurality of first IMU sensors 11 on the first surface 8 is equal to the position of each of the plurality of second IMU sensors 12 on the second surface 9. For example, when the sensor substrate 7 is turned over as shown in FIGS. 2A and B, a configuration in which the position of the first IMU sensor 11 and the position of the second IMU sensor 12 are equal to each other can be given. Note that the case where the position of the first IMU sensor 11 and the position of the second IMU sensor 12 become equal by changing the orientation after turning over the sensor substrate 7 is also included. (Configuration example B) As shown in FIGS. 4A and B, a plurality of second IMU sensors 12 are respectively arranged at positions on the second surface 9 that are opposite to the positions of the plurality of first IMU sensors 11 on the first surface 8. That is, the second IMU sensor 12 is arranged on the opposite side (back side) of the first IMU sensor 11. (Configuration example C) When the sensor substrate 7 is turned over and the first surface 8 side and the second surface 9 side are respectively viewed, a configuration in which the position of the first IMU sensor 11 and the position of the second IMU sensor 12 are equal to each other in a mutually inverted state can also be given. Note that two or more of the configuration examples A to C may hold simultaneously. For example, when the number of the first IMU sensors 11 is equal to the number of the second IMU sensors 12 and any of the configuration examples A to C is satisfied, it can be said that the first arrangement configuration and the second arrangement configuration are equal to each other. Even when the number of the first IMU sensors 11 is different from the number of the second IMU sensors 12, for example, when the configuration example B is satisfied, it is included in a configuration in which the positions of the plurality of first IMU sensors 11 and the positions of the plurality of second IMU sensors 12 correspond to each other. Of course, the configuration in which the positions of the plurality of first IMU sensors 11 and the positions of the plurality of second IMU sensors 12 correspond to each other is not limited to the configuration examples A to C. For example, any configuration called front-back symmetry may be adopted. Note that the configuration examples A to C may also be called front-back symmetry. By making the arrangement of the first IMU sensors 11 with respect to the first surface 8 and the arrangement of the second IMU sensors 12 with respect to the second surface 9 correspond to each other or equal to each other, it becomes possible to sufficiently cancel the first stress and the second stress, and it becomes possible to sufficiently exhibit the deformation suppressing effect on the sensor substrate 7. As a result, it becomes possible to improve the measurement accuracy while reducing the size of the device.

[0056] [Arrangement Configuration for Each Surface] Balancedly arranging the first IMU sensors 11 and the second IMU sensors 12 with respect to each of the first surface 8 and the second surface 9 is also effective in enhancing the deformation suppressing effect. For example, a plurality of IMU sensors 5 are arranged symmetrically with respect to a predetermined reference position on the arrangement surface (the first surface 8, the second surface 9). Examples of the predetermined reference position include the center position of the arrangement surface and positions near the center position. In addition, the reference position may be arbitrarily set based on the shape (outer shape) of the arrangement surface or the like. Examples of the configuration in which the IMU sensors 5 are arranged symmetrically (hereinafter referred to as symmetric arrangement) include the following examples. Line symmetry... Arrangement that is line-symmetric with respect to a predetermined line passing through the reference position Point symmetry... Arrangement that results in a similar arrangement configuration when rotated 180° about the reference position Rotational symmetry... An arrangement where, when rotated by (360 / n)° around a reference position, the same arrangement configuration is obtained (n is an integer greater than or equal to 2). When n = 1, it is equivalent to line symmetry. When n = 2, it is equivalent to point symmetry. In addition, as a configuration example of arranging a plurality of IMU sensors 5 evenly on the arrangement surface, various configurations such as a radial arrangement and a configuration with a small dispersion of density distribution may be adopted.

[0057] Fig. 5 is a schematic diagram showing an example of a symmetric arrangement. For example, a predetermined reference position (hereinafter referred to as the first reference position P1) is set on the first surface 8. Then, a plurality of first IMU sensors 11 are symmetrically arranged with respect to the first reference position P1. In the example shown in Fig. 5A, the first reference position P1 is set at the center of the first surface 8, and the first IMU sensors 11 are arranged so as to be line-symmetric with respect to a line parallel to the X-axis passing through the first reference position P1. Also, in the example shown in Fig. 5A, it is also arranged to be line-symmetric with respect to a line parallel to the Y-axis passing through the first reference position P1. Also, when rotated by 90° around the first reference position P1, it has the same arrangement configuration. Therefore, the first arrangement configuration shown in Fig. 5A can be said to be an arrangement configuration that is line-symmetric, point-symmetric, and rotationally symmetric with respect to the first reference position P1. Also, the arrangement configuration shown in Fig. 5A can be said to be a configuration in which the same number of first IMU sensors 11 are arranged along two axes (X-axis and Y-axis) perpendicular to each other passing through the first reference position P1. In the example shown in Fig. 5B, the first reference position P1 is set at the center of the first surface 8, and the first IMU sensors 11 are arranged so as to be line-symmetric with respect to a line parallel to the X-axis passing through the first reference position P1. Also, in the example shown in Fig. 5B, it is also arranged to be line-symmetric with respect to a line parallel to the Y-axis passing through the first reference position P1. Also, when rotated by 180° around the first reference position P1, it has the same arrangement configuration. Therefore, the first arrangement configuration shown in Fig. 5B can be said to be an arrangement configuration that is line-symmetric, point-symmetric, and rotationally symmetric with respect to the first reference position P1. In the example shown in FIG. 5C, a first reference position P1 is set at the center of the first surface 8, and the first IMU sensor 11 is arranged such that the same arrangement configuration is obtained when it is rotated by 30° around the first reference position P1. Therefore, it can be said that the first arrangement configuration shown in FIG. 5C is an arrangement configuration that is point-symmetric and rotationally symmetric with respect to the first reference position P1. Also, the arrangement configuration shown in FIG. 5C can also be said to be a configuration in which the first IMU sensors 11 are arranged at equal intervals on the circumference centered on the first reference position P1. In addition, any symmetric arrangement may be adopted.

[0058] Similarly, the second IMU sensor 12 can be arranged on the second surface 9 so as to be symmetrically arranged. For example, a predetermined reference position (hereinafter referred to as the second reference position P2) is set on the second surface 12. Then, a plurality of second IMU sensors 12 are arranged symmetrically with respect to the second reference position P2. For example, a symmetric arrangement of the second IMU sensors 12 is set so as to correspond to the symmetric arrangement of the first IMU sensors 11. As a result, the above-described first arrangement configuration and second arrangement configuration are configured to correspond to each other. For example, a second reference position P2 is set on the second surface 9 so as to correspond to the first reference position P1 set on the first surface 8. Then, the second IMU sensors 12 are arranged symmetrically with respect to the second reference position P2. For example, it is assumed that the first IMU sensors 11 are arranged in a symmetric arrangement as shown in FIG. 5A. In this case, a second reference position P2 is set at the center of the second surface 9 as a reference position corresponding to the first reference position P1. Then, the second IMU sensors 12 are arranged so as to have the same configuration as the first arrangement configuration shown in FIG. 5A. As a result, a configuration in which the first arrangement configuration and the second arrangement configuration are equal to each other is realized. Similarly, in the examples shown in FIGS. 5B and 5C, a second reference position P2 is set at the center of the second surface 9. Then, the second IMU sensors 12 are arranged on the second surface 9 so as to have the symmetric arrangement shown in FIGS. 5B and 5C. In this way, by arranging the IMU sensor 5 in a well-balanced manner with respect to the first surface 8 and the second surface 9, it becomes possible to suppress the variation in stress generated due to the difference in the linear expansion coefficients of the sensor substrate 7 and the IMU sensor 5. For example, it becomes possible to suppress the occurrence of stress that causes complex deformation such that the sensor substrate 7 is twisted. As a result, it becomes possible to enhance the cancellation effect of the first stress and the second stress, and it becomes possible to improve the deformation suppression effect.

[0059] [Electronic components other than the IMU sensor] On the first surface 8 and the second surface 9 of the sensor substrate 7, there are often cases where electronic components other than the IMU sensor 5 (the first IMU sensor 11 and the second IMU sensor 12) are arranged. For example, there are cases where active components (active elements) such as diodes and transistors, passive components (passive elements) such as resistors and coils, or auxiliary components such as relays and switches are arranged. Appropriately set the arrangement configuration of these other electronic components. For example, for other electronic components as well, arrange them in a well-balanced manner with respect to the arrangement surface. Thereby, it becomes possible to suppress the variation in stress generated due to the difference in the linear expansion coefficients of the sensor substrate 7 and the other electronic components, and it becomes possible to improve the deformation suppression effect on the sensor substrate 7.

[0060] FIG. 6 is a schematic diagram showing an arrangement example of other electronic components. In the example shown in FIG. 6A, on the first surface 8, 16 first IMU sensors 11 are symmetrically arranged with respect to the first reference position P1. As the other electronic components 15, four electronic components 15a and 16 electronic components 15b are arranged. For example, arrange the four electronic components 15a and the 16 electronic components 15b symmetrically with respect to the first reference position P1. The four electronic components 15a are arranged to be line-symmetric with respect to a line passing through the first reference position P1 and parallel to the Y-axis. The 16 electronic components 15b are arranged to be point-symmetric (rotationally symmetric) with respect to the first reference position P1 (line symmetry also holds). In this way, by arranging the electronic component 15a and the electronic component 15b, it becomes possible to improve the deformation suppression effect on the sensor substrate 7. Similarly, the electronic component 15a and the electronic component 15b are also arranged with respect to the second surface 9. Thereby, it becomes possible to enhance the cancellation effect of the first stress and the second stress, and it becomes possible to improve the deformation suppression effect.

[0061] In the example shown in FIG. 6B, eight first IMU sensors 11 are symmetrically arranged with respect to the first reference position P1. As other electronic components, nine electronic components 15 are arranged. Out of the nine electronic components 15, eight are arranged in pairs of four on the left and right ends of the first surface 8 so as to be point-symmetric (rotationally symmetric) with respect to the first reference position P1. The remaining one electronic component 15 is arranged on the first reference position P1. Such an arrangement is also included in the symmetric arrangement. That is, in the example shown in FIG. 6B, it can be said that the position of the remaining one electronic component 15 is appropriately set in order to realize the symmetric arrangement. Such an arrangement makes it possible to improve the deformation suppression effect on the sensor substrate 7. Also, by arranging other electronic components 15 in the same manner with respect to the second surface 9, a high deformation suppression effect is exhibited. In the example shown in FIG. 6C, eight first IMU sensors 11 are symmetrically arranged with respect to the first reference position P1. As other electronic components, nine electronic components 15 are arranged. Out of the nine electronic components 15, eight are arranged in pairs of four at positions inside the first IMU sensor 11 so as to be point-symmetric (rotationally symmetric) with respect to the first reference position P1. The remaining one electronic component 15 is arranged on the first reference position P1. Such an arrangement is also included in the symmetric arrangement. That is, in the example shown in FIG. 6C, it can be said that the position of the remaining one electronic component 15 is appropriately set in order to realize the symmetric arrangement. Such an arrangement makes it possible to improve the deformation suppression effect on the sensor substrate 7. Also, by arranging other electronic components 15 in the same manner with respect to the second surface 9, a high deformation suppression effect is exhibited. In addition, any symmetric arrangement may be adopted for other electronic components.

[0062] [Dummy part] FIG. 7 is a schematic diagram showing an arrangement example of the dummy part 17. The dummy part 17 is a part that can be regarded as equivalent to the IMU sensor 5 in terms of the generation of stress caused by heat. For example, a part having the same linear expansion coefficient as the IMU sensor 5, etc. can be mentioned. Alternatively, an electronic component, etc. that can be regarded as equivalent to the IMU sensor 5 structurally can be mentioned. A part that has no particular function with respect to the operation of the sensor device 100, etc. may be used as a dummy member. Alternatively, an electronic component having a predetermined function with respect to the operation of the sensor device 100, etc. may be used as the dummy part 17. For example, among the other electronic components 15 described above, an electronic component 15 that can be regarded as equivalent to the IMU sensor 5 can be arranged as the dummy part 17. In addition, the specific configuration of the dummy part 17 is not limited and may be designed arbitrarily. For example, the dummy part 17 is arranged so that arrangement symmetry can be realized by matching with the IMU sensor 5 arranged on the arrangement surface (the first surface 8, the second surface 9). Thereby, it becomes possible to suppress the variation in stress caused by heat, and it becomes possible to improve the deformation suppression effect. Of course, the arrangement configuration of the dummy part 17 is not limited.

[0063] In the example shown in FIG. 7A, a plurality of first IMU sensors 11 are arranged on the first surface 8. Specifically, 16 first IMU sensors 11 are arranged. Corresponding to this first arrangement configuration, as shown in FIG. 7B, on the second surface 9, one or more second IMU sensors 12 and one or more dummy parts 17 are arranged. Specifically, 12 second IMU sensors 12 and 4 dummy parts 17 are arranged. Twelve second IMU sensors 12 and four dummy components 17 are arranged on the second surface 9 so as to be at the same positions as those of the respective first IMU sensors 11 on the first surface 8. That is, by combining the twelve second IMU sensors 12 and the four dummy components 17, the IMU sensors 12 and the dummy components 17 are arranged so as to have the same configuration as the first arrangement configuration with respect to the first surface 8.

[0064] Note that the second arrangement configuration of the second IMU sensors 12 and the arrangement configuration of the dummy components 17 (hereinafter referred to as the dummy arrangement configuration) are appropriately designed so as to correspond to the first arrangement configuration of the first IMU sensors 11. In this case, each of the second arrangement configuration and the dummy arrangement configuration is also included in the arrangement configuration corresponding to the first arrangement configuration. For example, as in the example shown in FIG. 7, twelve second IMU sensors 12 and four dummy components 17 are arranged for the sixteen first IMU sensors 11 so that the total number is the same. That is, the total number of each of one or more second IMU sensors 12 and one or more dummy components 17 is the same as the number of the plurality of first IMU sensors 11. In this case, the number of the second IMU sensors 12 (twelve) is included in the number corresponding to the number of the first IMU sensors 11 (sixteen). Also, the number of the dummy components 17 (four) is included in the number corresponding to the number of the first IMU sensors 11 (sixteen).

[0065] Of course, the dummy components 17 may be arranged on the first surface 8. Also, the dummy components 17 may be arranged on both the first surface 8 and the second surface 9. That is, any configuration in which one or more dummy components 17 are arranged on at least one of the first surface 8 or the second surface 9 may be adopted.

[0066] [Separation between Sensor Substrate and Main Substrate] FIG. 8 is a schematic diagram showing another configuration example of the sensor device 100. The sensor device 100 shown in FIG. 8 includes a sensor substrate 7, a main substrate 20, a flexible printed circuit (FPC) 21, an external connector 22, and a connector-side flexible substrate 23. In this embodiment, each of the sensor substrate 7 and the main substrate 20 is a rigid substrate. Therefore, it can be said that the sensor device 100 shown in FIG. 8 is entirely composed of a rigid-flexible substrate. Note that the main substrate 20 can also be referred to as the main control substrate.

[0067] As the sensor substrate 7, the sensor substrate 7 shown in FIG. 6A is used. On the first surface 8 of the sensor substrate 7, 16 first IMU sensors 11 and 20 other electronic components 15 (15a and 15b shown in FIG. 6A) are arranged. Similarly to the first surface 8, 16 second IMU sensors 12 and 20 other electronic components 15 are arranged on the second surface 9. The first arrangement configuration of the first IMU sensors 11 with respect to the first surface 8 is equal to the second arrangement configuration of the second IMU sensors 12 with respect to the second surface 9.

[0068] An FPGA 24 is arranged on the main substrate 20. That is, on the main substrate 20, a control circuit unit 6 for controlling the operations of each of the plurality of first IMU sensors 11 and the plurality of second IMU sensors 12 is arranged. Let the surface on which the FPGA (control circuit unit) 24 of the main substrate 20 is arranged be the third surface 25. The surface opposite to the third surface 25 is the fourth surface 26. In the example shown in FIG. 8, the sensor substrate 7 and the main substrate 20 are arranged side by side in one direction (Y direction). The third surface 25 of the main substrate 20 is the same side surface as the second surface 9 side of the sensor substrate 7. The fourth surface 26 of the main substrate 20 is the same side surface as the first surface 8 side of the sensor substrate 7. Of course, it is not limited to such a configuration.

[0069] The flexible substrate 21 electrically connects the sensor substrate 7 and the main substrate 20. In the present embodiment, the flexible substrate 21 is arranged so as to extend in the Y direction. The specific configuration of the flexible substrate 21 is not limited, and any configuration may be adopted. The external connector 22 is a connector for connecting the sensor device 7 to an external device or the like. The specific configuration of the external connector 22 is not limited. The connector-side flexible substrate 23 electrically connects the main substrate 20 and the external connector 22. In the present embodiment, the connector-side flexible substrate 23 is arranged so as to extend in the Y direction.

[0070] As illustrated in FIG. 8, the main substrate 20 and the sensor substrate 7 are configured separately. That is, the main substrate 20 is configured separately from the sensor substrate 7. Thereby, it is possible to sufficiently suppress heat generated from the FPGA 24 or the like of the main substrate 20 from being transmitted to the sensor substrate 7 and the temperature of the sensor substrate 7 from rising. As a result, it is possible to sufficiently suppress the generation of stress on the sensor substrate 7 due to heat, and it is possible to improve the deformation suppression effect. As a result, it is possible to improve the measurement accuracy of the sensor device 100. Note that an FFC (Flexible Flat Cable) may be used instead of the FPC.

[0071] FIG. 9 is a schematic diagram showing an example of the arrangement of the sensor substrate 7 with respect to the main substrate 20. In FIG. 9, illustration of other electronic components 15, the connector-side flexible substrate 23, the external connector 22, etc. is omitted. For example, as shown in FIGS. 9A to 9C, by bending the flexible substrate 21, it is possible to arrange the sensor substrate 7 at a predetermined position with respect to the main substrate 20. In the example shown in FIG. 9C, the sensor substrate 7 is arranged at a position where the first surface 8 of the sensor substrate 7 faces the fourth surface 26 of the main substrate 20. In this way, the main board 20 and the sensor board 7, which are separately configured, are connected by the flexible board 21. By bending the flexible board 21, the positional relationship between the main board 20 and the sensor board 7 can be flexibly designed. As a result, it is very advantageous for miniaturizing the sensor device 100.

[0072] FIG. 10 is a schematic diagram showing the sensor device 100 in the state shown in FIG. 9C. As shown in FIG. 10, when the fourth surface 26 of the main board 20 is viewed from the front, the sensor board 7 is arranged with respect to the main board 20 such that the entire sensor board 7 is included in the region within the fourth surface 26 (such that the entire sensor board 7 overlaps). Thereby, it is possible to sufficiently reduce the size of the sensor device 100 in the plane direction of the main board 20 (the plane direction (XY plane direction) of the third surface 25 and the fourth surface 26). Also, by sufficiently reducing the distance (see FIG. 9C) between the fourth surface 26 of the main board 20 and the first surface 8 of the sensor board 7, it is possible to sufficiently reduce the size in the vertical direction (the vertical direction (Z direction) of the third surface 25 and the fourth surface 26) of the main board 20. As a result, it is possible to realize miniaturization of the entire sensor device 100.

[0073] Note that the arrangement configuration of the main board 20 and the sensor board 7 realized by bending the flexible board 21 is not limited. For example, the sensor board 7 may be arranged such that the first surface 8 of the sensor board 7 faces the third surface 25 of the main board 20. Also, the sensor board 7 may be arranged such that the second surface 9 of the sensor board 7 faces the third surface 25 or the fourth surface 26 of the main board 20. Also, when viewed from the vertical direction (Z direction) of the main board 20, the main board 20 and the sensor board 7 may be arranged to face each other such that their positions are shifted from each other. For example, when viewed from the Z direction, the main board 20 and the sensor board 7 are arranged to face each other such that a part of each overlaps with the other. Alternatively, when viewed from the Z direction, the main board 20 and the sensor board 7 may be arranged to face each other without overlapping with each other. Further, the surface direction of the main board 20 (the surface direction of the third surface 25 and the fourth surface 26) and the surface direction of the sensor board 7 (the surface direction of the first surface 8 and the second surface 9) may be arranged along directions that are not parallel but intersect with each other. For example, the sensor device 100 may be realized in an arrangement relationship as shown in FIG. 9B. Since the flexible board 21 is used, it is possible to arrange the sensor device 100 in a narrow space with a configuration as shown in FIG. 9B, for example. Also, a configuration in which the flexible board 21 is not bent as shown in FIG. 9A may be adopted.

[0074] With reference to FIGS. 11 to 17, another configuration example of the sensor device will be described. Hereinafter, regarding the XYZ directions shown in each figure, the X direction will be described as the left - right direction, the Y direction as the depth direction, and the Z direction as the up - down direction. Also, in each figure, the side where the arrow in the X direction points is the right side (the opposite side is the left side), the side where the arrow in the Y direction points is the back side (the opposite side is the front side), and the side where the arrow in the Z direction points is the upper side (the opposite side is the lower side). Of course, the orientation in which the sensor device 100 is used is not limited.

[0075] As shown in FIGS. 11 and 12, the sensor device 100 according to this embodiment includes a main board 20, a plurality of sensor boards 7, a plurality of flexible boards 21, an external connector 22, and a connector - side flexible board 23. Also, as shown in FIGS. 14 and 17, the sensor device 100 has a holder portion 30.

[0076] The main boards 20 and the two sensor boards 7 are rigid boards. The main board 20 has a third surface 25 on which the FPGA 24 is arranged and a fourth surface 26 on the opposite side (see FIG. 13). The two sensor boards 7 are composed of a first sensor board 7a and a second sensor board 7b. In this embodiment, the first sensor substrate 7a and the second sensor substrate 7b have the same configuration as each other. Further, as the first sensor substrate 7a and the second sensor substrate 7b, the sensor substrate 7 shown in FIG. 6B is used. On the first surface 8a of the first sensor substrate 7a, eight first IMU sensors 11a and nine other electronic components 15a are arranged. Similarly to the first surface 8a, eight second IMU sensors 12a and nine other electronic components 15a are also arranged on the second surface 9a of the first sensor substrate 7a (see FIG. 13). The first arrangement configuration of the first IMU sensors 11a with respect to the first surface 8a is equal to the second arrangement configuration of the second IMU sensors 12a with respect to the second surface 9a. For the second sensor substrate 7b as well, the same configuration as that of the first sensor substrate 7a is adopted. As shown in FIG. 11 and the like, the second sensor substrate 7b has a first surface 8b, a second surface 9b, first IMU sensors 11b, second IMU sensors, and other electronic components 15b.

[0077] As shown in FIGS. 11 and 12, the first sensor substrate 7a, the main substrate 20, and the second sensor substrate 7b are arranged in this order along one direction (X direction). The first sensor substrate 7a and the second sensor substrate 7b are respectively arranged at positions where the distances from the main substrate 20 are equal to each other so as to sandwich the main substrate 20 therebetween. The first flexible substrate 21a electrically connects the first sensor substrate 7a and the main substrate 20. The second flexible substrate 21b electrically connects the second sensor substrate 7b and the main substrate 20. The first flexible substrate 21a and the second flexible substrate 21b are arranged so as to extend in the X direction. As shown in FIG. 11, when the fourth surface 26 of the main substrate 20 is viewed from the front, the first sensor substrate 7a and the second sensor substrate 7b are arranged to be symmetric with respect to the main substrate 20. Thereby, it becomes possible to simplify the configuration of the wiring and the like, and it becomes possible to simplify the configuration of the sensor device 100.

[0078] The external connector 22 is arranged at a position aligned in the Y direction with respect to the main board 20. Accordingly, the connector-side flexible printed circuit board 23 is arranged so as to extend in the Y direction.

[0079] FIG. 13 is a schematic diagram showing an arrangement example of the first sensor board 7a and the second sensor board 7b with respect to the main board 20. FIG. 13 is a view when the sensor device 100 is viewed from the front side, and illustrations of the connector-side flexible printed circuit board 23, the external connector 22, etc. are omitted. In the present embodiment, the first flexible printed circuit board 21a and the second flexible printed circuit board 21b are respectively bent to the fourth surface 26 side (upper side) of the main board 20. Then, the first sensor board 7a is arranged such that the first surface 8a of the first sensor board 7a faces the fourth surface 26 of the main board 20. Further, the second sensor board 7b is arranged such that the first surface 8a of the second sensor board 7b faces the fourth surface 26 of the main board 20. When the fourth surface 26 of the main board 20 is viewed from the front, the first sensor board 7a and the second sensor board 7b are arranged with respect to the main board 20 so as to be entirely included in the area within the fourth surface 26. Further, the first sensor board 7a and the second sensor board 7b are arranged symmetrically with respect to the left and right within the fourth surface 26 of the main board 20 (see FIG. 16).

[0080] In the configuration illustrated in FIG. 8, 32 (16 on each side) IMU sensors 5 are arranged on both sides of one sensor board 7. On the other hand, in the configuration illustrated in FIG. 11, 16 (8 on each side) IMU sensors 5 are arranged on each of the small-sized first sensor board 7a and the second sensor board 7b. By arranging the IMU sensors 5 on a plurality of sensor boards 7 in this way, it becomes possible to reduce the size of each sensor board 7. The smaller the size of the sensor board 7, the less likely it is to deform with respect to the stress acting on the sensor board 7. As a result, a high deformation suppression effect is exhibited, which is advantageous for improving the measurement accuracy.

[0081] As shown in FIGS. 14 to 17, the holder portion 30 includes a lower holder 31 and an upper holder 32. As the lower holder 31 and the upper holder 32, materials that are less likely to deform due to heat are used. For example, materials with a small coefficient of linear expansion are used. For example, by using a metal material such as aluminum or stainless steel, the durability of the sensor device 100 can be improved. Of course, it is not limited to this, and a ceramic material, a resin material, or the like may be used. As shown in FIGS. 14 and 15, the lower holder 31 includes a frame portion 33 with a hollow interior, a partition portion 34, and a central column portion 35. As shown in FIG. 14, the frame portion 33 is configured in a substantially rectangular shape when viewed from the Z direction. The frame portion 33 is configured to be able to accommodate the main board 20 in the internal space. The frame portion 33 is integrally connected with a first bending portion 36a and a second bending portion 36b that face each other along the left-right direction (X direction), and a first connecting portion 37a and a second connecting portion 37b that face each other along the depth direction (Y direction). As shown in FIGS. 14 and 15, the partition portion 34 is configured to extend inward from the inner peripheral surface of the frame portion 33. In the internal space of the frame portion 33 (the space surrounded by the frame portion 33), the lower space partitioned by the partition portion 34 becomes the space where the main board 20 is arranged. The upper space partitioned by the partition portion 34 becomes the space where the first sensor board 7a and the second sensor board 7b are arranged. The central column portion 35 is arranged in the upper space of the internal space of the frame portion 33, which is partitioned by the partition portion 34. The central column portion 35 is provided at the central position in the left-right direction (X direction) of the first connecting portion 37a and the second connecting portion 37b of the frame portion 33 so as to extend along the depth direction (Y direction). As shown in FIG. 14, the space between the left first bending portion 36a and the central column portion 35 becomes the space where the first sensor board 7a is arranged. The space between the right second bending portion 36b and the central column portion 35 becomes the space where the second sensor board 7b is arranged. Six screw holes 39 are formed in the frame portion 33. The screw holes 39 are formed at both ends in the depth direction of the first bent portion 36a, both ends in the depth direction of the second bent portion 36b, and both ends in the depth direction of the central column portion 35, respectively.

[0082] As shown in FIGS. 14 and 15, the lower holder 31 is attached from the upper side of the fourth surface 26 of the main board 20. Conversely, the main board 20 is attached from the lower side of the lower holder 31 with the fourth surface 26 facing. The main board 20 is disposed in the space below the frame portion 33 (the space below the partition portion 34). Then, the edge portion of the main board 20 is held by the frame portion 33. The method of holding the main board 20 by the frame portion 33 is not limited, and any method such as fitting, adhesion, connection by screws, etc. may be adopted.

[0083] As shown in FIG. 16, the first flexible board 21a and the second flexible board 21b are bent upward. The first flexible board 21a is bent so as to contact the first bent portion 36a on the left side of the frame portion 33. Then, the first sensor board 7a is disposed in the space above the frame portion 33 (the space above the partition portion 34) and between the first bent portion 36a and the central column portion 35. The second flexible board 21b is bent so as to contact the second bent portion 36b on the right side of the frame portion 33. Then, the second sensor board 7b is disposed in the space above the frame portion 33 (the space above the partition portion 34) and between the second bent portion 36b and the central column portion 35.

[0084] As shown in FIG. 17, the upper holder 32 has the same outer shape as the lower holder 31 when viewed in the Z direction. The upper holder 32 has a container shape with one side closed and the other side open in the Z direction. The internal space of the container shape is configured to accommodate the first sensor substrate 7a and the second sensor substrate 7b held by the frame portion 33. Further, six screw holes 40 are formed at the edge of the upper holder 32 so as to correspond to the six screw holes 39 formed in the frame portion 33. As shown in FIG. 17, the upper holder 32 is arranged from above the lower holder 31 so that the internal space faces upward. Then, the six screw holes 39 of the frame portion 33 and the six screw holes 40 of the upper holder 32 are aligned and fixed by screws 42. Thereby, the holder portion 30 sufficiently holds the main substrate 20, the first sensor base portion 7a, and the second sensor substrate 7b. The first flexible substrate 21a is sufficiently held by being sandwiched between the first bent portion 36a of the frame portion 33 and the first substrate holding portion 38a corresponding to the left side of the upper holder 32. The second flexible substrate 21b is sufficiently held by being sandwiched between the second bent portion 36b of the frame portion 33 and the second substrate holding portion 38b corresponding to the right side of the upper holder 32.

[0085] For example, when it is desired to fix the portions corresponding to the four corners of the first sensor substrate 7a and the portions corresponding to the four corners of the second sensor substrate 7b, eight screws (screw holes) are required. In the sensor device 100 according to the present embodiment, the first sensor substrate 7a and the second sensor substrate 7b are arranged side by side on the left and right of the central column portion 35 of the lower holder 31. Therefore, by screwing at both ends in the depth direction of the central column portion 35, it is possible to realize both functions of fixing the two corners on the right side of the first sensor substrate 7a and fixing the two corners on the left side of the second sensor substrate 7b. By screwing at both ends of the central column portion 35, it is possible to commonly fix both the first sensor substrate 7a and the second sensor substrate 7b. As a result, sufficient fixing can be achieved with only six screws, and it is possible to reduce the number of parts and the cost of parts. It is also very advantageous for miniaturization of the device.

[0086] In the sensor device 100 shown in FIGS. 11 to 17, the first sensor substrate 7a and the second sensor substrate 7b correspond to one or more sensor substrates. The first flexible substrate 21a and the second flexible substrate 21b correspond to one or more flexible substrates that electrically connect one or more sensor substrates and the main substrate 20. The holder portion 30 functions as a holding portion that holds the main substrate 20 and one or more sensor substrates arranged at a predetermined position with respect to the main substrate 20 by bending one or more flexible substrates.

[0087] In the sensor device 100 shown in FIGS. 11 to 17, the first flexible substrate 21a and the second flexible substrate 21b are bent in the same direction (upper side). Then, the first sensor substrate 7a and the second sensor substrate 7b are arranged to face each other on the same surface (the fourth surface 26) of the main substrate 20. The arrangement configuration of the first sensor substrate 7a and the second sensor substrate 7b with respect to the main substrate 20 is not limited and may be arbitrarily set. For example, a configuration may be adopted in which the first sensor substrate 7a and the second sensor substrate 7b face each other on different surfaces (the third surface 25 and the fourth surface 26) of the main substrate 20, respectively. For example, instead of the configuration illustrated in FIG. 13, the second flexible substrate 21b may be bent toward the third surface 25 (lower side). Then, the second sensor substrate 7b may be arranged such that the second surface 9b faces the third surface 25 of the main substrate 20. That is, an arbitrary configuration may be adopted in which the first sensor substrate 7 is arranged at a position facing the third surface 25 and the fourth surface 26 of the main substrate 20 when the first flexible substrate 21a is bent, and the second sensor substrate 7b is arranged at a position facing the third surface 25 and the fourth surface 26 of the main substrate 20 when the second flexible substrate 21b is bent.

[0088] For example, the second sensor substrate 7b is disposed at a position facing the surface of the main substrate 20 out of the third surface 25 and the fourth surface 26 that faces the surface facing the first sensor substrate 7a. For example, the configuration shown in FIG. 13 corresponds to such an arrangement. Alternatively, the second sensor substrate 7b may be disposed at a position facing the surface of the main substrate 20 out of the third surface 25 and the fourth surface 26 that is opposite to the surface facing the first sensor substrate 7a. For example, instead of the configuration illustrated in FIG. 13, a configuration in which the second sensor substrate 7b faces the third surface 25 of the main substrate 20 corresponds. Of course, a configuration in which neither, both, or either one of the first sensor substrate 7a and the second sensor substrate 7b faces the main substrate 20 may be adopted. For example, a configuration in which neither, both, or either one of the first flexible substrate 21a and the second flexible substrate 21b is not bent is also conceivable.

[0089] FIGS. 18 and 19 are schematic views showing other configuration examples of the sensor device. In the sensor device 100 shown in FIGS. 18 and 19, one main substrate 20 and three sensor substrates 7a to 7c are provided. The first sensor substrate 7a and the second sensor substrate 7b are disposed on the left and right sides of the main substrate 20. Further, the third sensor substrate 7c is disposed on the back side of the main substrate 20. Each of the first to third sensor substrates 7a to 7c is electrically connected to the main substrate 20 by the first to third flexible substrates 21a to 21c. As shown in FIG. 18, when viewed from the Z direction, the first to third sensor substrates 7a to 7c are arranged symmetrically with respect to the main substrate 20. Thereby, it becomes possible to simplify the wiring configuration and the like, and it becomes possible to simplify the configuration of the sensor device 100. As shown in FIG. 19, by bending the first to third flexible substrates 21a to 21c, the first to third sensor substrates 7a to 7c are arranged so as to face the fourth surface 26 of the main substrate 20. As a result, it is possible to increase the number of IMU sensors 5 without increasing the size of the sensor device 100. Consequently, it becomes possible to improve the measurement accuracy while reducing the size of the sensor device 100.

[0090] Figs. 20 to 22 are schematic diagrams showing other configuration examples of the sensor device. The sensor device 100 shown in Figs. 20 to 22 includes one main board 20 and seven sensor boards 7a to 7g. The main board 20 is configured in a polygonal shape when viewed from the Z direction. Specifically, it has an octagonal shape. The first to seventh flexible boards 21a to 21g are connected to seven sides of the main board 20. Then, the first to seventh sensor boards 7a to 7g are connected to the first to seventh flexible boards 21a to 21g. As shown in Fig. 21, each of the first flexible board 21a, the third flexible board 21c, the fifth flexible board 21e, and the seventh flexible board 21g is bent toward the fourth surface 26 side of the main board 20. Then, the first sensor board 7a, the third sensor board 7c, the fifth sensor board 7e, and the seventh sensor board 7g are arranged so as to face the fourth surface 26 of the main board 20. As shown in Fig. 22, the second flexible board 21b, the fourth flexible board 21d, and the sixth flexible board 21f are bent toward the third surface 25 side of the main board 20. Then, the second sensor board 7b, the fourth sensor board 7d, and the sixth sensor board 7f are arranged so as to face the third surface 25 of the main board 20. As a result, it is possible to increase the number of IMU sensors 5 without increasing the size of the sensor device 100. Consequently, it becomes possible to improve the measurement accuracy while reducing the size of the sensor device 100. Three or more sensor boards 7 may be arranged in this way. Note that if at least two of the three or more sensor boards 7 are configured as the "first sensor board" and the "second sensor board" according to the present technology, it is possible to implement the sensor device according to the present technology and to exhibit the above-described effects.

[0091] FIG. 23 is a schematic diagram showing another configuration example of the sensor device. The sensor device 100 shown in FIG. 23 has one main board 20 and two sensor boards 7a and 7b. The main board 20, the first sensor board 7a, and the second sensor board 7b have a circular outer shape when viewed from the Z direction. Also, the main board 20, the first sensor board 7a, and the second sensor board 7b are configured to have the same outer shape and the same size as each other. As shown in FIG. 23A, the first sensor board 7a, the main board 20, and the second sensor board 7b are arranged in this order along one direction (X direction). The first sensor board 7a and the second sensor board 7b are respectively arranged at positions where the distances from the main board 20 are equal to each other so as to sandwich the main board 20 therebetween. Each of the first sensor board 7a and the second sensor board 7b is electrically connected to the main board 20 by a first flexible board 21a and a second flexible board 21b that are arranged to extend in the X direction. As shown in FIG. 23B, the first flexible board 21a is bent to the fourth surface 26 side of the main board 20. Then, the first sensor board 7a is arranged so as to face the fourth surface 26 of the main board 20. On the other hand, the second flexible board 21b is bent to the third surface 25 (reference numeral omitted) side of the main board 20. Then, the second sensor board 7b is arranged so as to face the third surface 25 of the main board 20. Thereby, as shown in FIG. 23B, it becomes possible to easily realize a small-sized sensor device 100 having a cylindrical shape extending in the Z direction. Also, it becomes possible to realize a sensor device 100 that exhibits high measurement accuracy.

[0092] [Regarding the holding of the flexible board] When the flexible substrate 21 that electrically connects the sensor substrate 7 and the main substrate 20 is bent and held, it is possible to improve the measurement accuracy by suppressing the influence of the reaction force (the force trying to return to the non-bent state) of the bent flexible substrate 21. For example, in the sensor device 100 illustrated in FIG. 17, the first flexible substrate 21a and the second flexible substrate 21b are sufficiently held by the first bending portion 36a and the second bending portion 36b of the frame portion 33 and the first substrate holding portion 38a and the second substrate holding portion 38b of the upper holder 32. As a result, it is possible to prevent fluctuations and deformations in the positions of the first sensor substrate 7a and the second sensor substrate 7b due to the reaction forces of the first flexible substrate 21a and the second flexible substrate 21b. As a result, it is possible to improve the measurement accuracy. As a method for suppressing the influence of the reaction force of the flexible substrate 21, there is a method of improving the strength of the holding portion on the side receiving the reaction force (the side pressing the flexible substrate 21). Thereby, it becomes possible to sufficiently hold the flexible substrate 21 without being deformed or the like, and it becomes possible to sufficiently suppress the influence of the reaction force. For example, by appropriately designing the material, shape, size, cross-sectional area, etc. of the holding portion, it becomes possible to improve the strength of the holding portion. For example, a metal material with high strength such as stainless steel or a ceramic material is used. It is also conceivable to increase the cross-sectional area of the portion receiving the reaction force and make it thicker. Note that a method for improving the strength of the holding portion may be appropriately selected in consideration of the balance with the mass productivity, cost, etc. of the sensor device 100. In addition, as a method for suppressing the influence of the reaction force of the flexible substrate 21, any method may be adopted.

[0093] With reference to FIGS. 24 to 32, other configuration examples of the sensor device will be described. Once again, regarding the XYZ directions shown in FIGS. 24 to 32, the X direction will be described as the left-right direction, the Y direction as the depth direction, and the Z direction as the up-down direction. In each figure, the side towards which the arrow in the X direction points is the right side (the opposite side is the left side), the side towards which the arrow in the Y direction points is the back side (the opposite side is the front side), and the side towards which the arrow in the Z direction points is the upper side (the opposite side is the lower side), and the description will be made based on this. Of course, the orientation in which the sensor device 100 is used is not limited.

[0094] In the embodiment illustrated in FIG. 11 and the like, the sensor substrate 7 and the main substrate 20 are electrically connected by the flexible substrate 21. In the present embodiment, the sensor substrate 7 and the main substrate 20 are held by a frame having connection wirings. The frame holds the sensor substrate 7 and the main substrate 20 such that the sensor substrate 7 and the main substrate 20 are electrically connected by the connection wirings. This will be described in detail below.

[0095] FIG. 24 is a perspective view of the sensor device 100. FIG. 25 is an exploded perspective view of the sensor device 100. FIG. 26 is a side view of the sensor device 100.

[0096] As shown in FIGS. 24 and 25, the sensor device 100 according to the present embodiment includes a sensor substrate 7, a main substrate 20, and a frame 50. The sensor substrate 7 and the main substrate 20 are arranged to face each other along the vertical direction. The frame 50 is disposed between the sensor substrate 7 and the main substrate 20. The sensor substrate 7 is abutted against the upper side of the frame 50, and the main substrate 20 is abutted against the lower side of the frame 50. Therefore, the frame 50 holds the sensor substrate 7 on the upper side of the frame 50. Also, the frame 50 holds the main substrate 20 on the lower side of the frame 50.

[0097] FIG. 27 is a diagram showing a configuration example of the sensor substrate 7. FIG. 27A is a view of the surface facing the upper side of the sensor substrate 7 (hereinafter referred to as the upper surface) 52 as seen from the front. FIG. 27B is a view of the surface 53 of the sensor substrate 7 facing the main substrate 20 (hereinafter referred to as the first facing surface) as seen from the front. The upper surface 52 and the first facing surface 53 of the sensor substrate 7 correspond to the first surface 8 and the second surface 9 of the sensor substrate 7 shown in FIG. 4 and the like. That is, among the first surface 8 and the second surface 9 of the sensor substrate 7, the surface facing the main substrate 20 is the first facing surface 53. And among the first surface 8 and the second surface 9, the surface on the side opposite to the first facing surface 53 is the upper surface 52. Hereinafter, the upper surface 52 will be described as the first surface 8, and the first facing surface 53 will be described as the second surface 9. Of course, it is also possible to apply the present technology with the upper surface 52 as the second surface 9 and the first facing surface 53 as the first surface 8.

[0098] On the upper surface 52 (first surface 8) of the sensor substrate 7, four first IMU sensors 11 and two other electronic components 15 are arranged. On the first facing surface 53 (second surface 9) of the sensor substrate 7, four second IMU sensors 12 and two other electronic components 15 are arranged. The first arrangement configuration of the first IMU sensors 11 with respect to the upper surface 52 is equal to the second arrangement configuration of the second IMU sensors 12 with respect to the first facing surface 53 (corresponding to the above configuration example A). Also, the arrangement configuration of the other electronic components 15 with respect to the upper surface 52 is equal to the arrangement configuration of the other electronic components 15 with respect to the first facing surface 53. Note that a label (nameplate) may be provided on the upper surface 52 of the sensor substrate 7.

[0099] As shown in FIG. 27, when viewed from the Z direction in which the sensor substrate 7 and the main substrate 20 face each other, the sensor substrate 7 has a rectangular shape. Therefore, the sensor substrate 7 has four side portions, namely, two side portions 54a and 54b extending in a predetermined direction and facing each other, and two side portions 55a and 55b extending in a direction orthogonal to the predetermined direction and facing each other. Note that the four side portions of the sensor substrate 7 can also be said to be the four side portions of the upper surface 52. Also, the four side portions of the sensor substrate 7 can also be said to be the four side portions of the first facing surface 53. In the present embodiment, the sensor substrate 7 is arranged such that the extending directions of the two side portions 54a and 54b are in the X direction, and the extending directions of the two side portions 55a and 55b are in the Y direction.

[0100] As shown in FIG. 27B, connection terminal portions 56 are formed along the two side portions 55a and 55b inside the two side portions 55a and 55b of the first opposing surface 53. The connection terminal portions 56 are formed on the left and right sides of the second IMU sensor 12 and other electronic components 15 arranged on the first opposing surface 53. Further, the connection terminal portions 56 are formed on the contact surface 57 of the first opposing surface 53 that contacts the frame 50. For example, the connection terminal portion 56 is composed of a plurality of lands. Of course, it is not limited to this.

[0101] FIG. 28 is a diagram showing a configuration example of the main substrate 20. FIG. 28 is a view of the surface (hereinafter referred to as the second opposing surface) 59 of the main substrate 20 facing the sensor substrate 7 as seen from the front. An FPGA 24 (control circuit portion) is arranged on the second opposing surface 59 of the main substrate 20. Therefore, the second opposing surface 59 corresponds to the third surface 25 of the main substrate 20. The surface on the opposite side of the second opposing surface 59 corresponds to the fourth surface 26 of the main substrate 20. A configuration may be adopted in which the fourth surface 26 of the main substrate 20 becomes the second opposing surface 59 facing the sensor substrate 7. That is, the sensor substrate 7 and the main substrate 20 may be held such that the sensor substrate 7 faces the third surface 25 or the fourth surface 26 of the main substrate 20 by the frame 50. Of course, instead of the FPGA 24, a custom processor such as a DSP may be arranged to realize the control circuit portion.

[0102] As shown in FIG. 28, when viewed from the Z direction in which the sensor substrate 7 and the main substrate 20 face each other, the main substrate 20 has a rectangular shape. Therefore, the main substrate 20 has four side portions, namely, two side portions 60a and 60b that extend in a predetermined direction and face each other, and two side portions 61a and 61b that extend in a direction orthogonal to the predetermined direction and face each other. Note that the four side portions of the main substrate 20 can also be said to be the four side portions of the second opposing surface 59. Also, the four side portions of the main substrate 20 can also be said to be the four side portions of the fourth surface 26. In the present embodiment, the main substrate 20 is arranged such that the extending directions of the two side portions 60a and 60b are the X direction, and the extending directions of the two side portions 61a and 61b are the Y direction. That is, in the present embodiment, the sensor substrate 7 and the main substrate 20 are arranged such that the extending directions of the four side portions are aligned.

[0103] As shown in FIG. 28, inside the two side portions 60a and 60b that extend in the X direction and face each other on the second opposing surface 59, connection terminal portions 62 are formed along the two side portions 60a and 60b. The connection terminal portions 62 are formed on the back side and the front side of the FPGA 24 disposed on the second opposing surface 59. Also, the connection terminal portions 62 are formed on the contact surface 63 of the second opposing surface 59 that contacts the frame 50. For example, the connection terminal portions 62 are configured by a plurality of lands. Of course, it is not limited to this. Note that connection terminal portions for mounting the sensor device 100 may be formed on the fourth surface 26 on the opposite side of the second opposing surface 59. For example, mounting connection terminal portions are formed at positions on the opposite side (back side) of the connection terminal portions 62 shown in FIG. 28. Of course, the configuration is not limited to such a configuration. Note that in FIGS. 24 and 25, the illustration of the FPGA 24 and the connection terminal portions 62 is omitted.

[0104] FIGS. 29 and 30 are schematic diagrams showing a configuration example of the frame 50. FIG. 29 is a perspective view of the frame 50. FIG. 30A is a side view of the frame 50. FIG. 30B is a front view of the side (upper side) of the sensor substrate 7 of the frame 50 facing the sensor substrate 7. FIG. 30C is a front view of the side (lower side) of the main substrate 20 of the frame 50 facing the main substrate 20.

[0105] The frame 50 has a partition portion 65, one or more first abutting portions 66, and one or more second abutting portions 67. The partition portion 65 is disposed between the first opposing surface 53 of the sensor substrate 7 and the second opposing surface 59 of the main substrate 20. As shown in FIGS. 29 and 30, in the present embodiment, the partition portion 65 has a flat plate shape. For example, the partition portion 65 is formed in a thin flat plate shape having a thickness of about 0.2 mm in the vertical direction. Of course, the thickness of the partition portion 65 is not limited. Hereinafter, the surface of the partition portion 65 facing the sensor substrate 7 is defined as the fifth surface 68. Also, the surface of the partition portion 65 facing the main substrate 20 is defined as the sixth surface 69. Along the Z direction, the first opposing surface 53 of the sensor substrate 7 faces the fifth surface 68 of the partition portion 65. Also, along the Z direction, the second opposing surface 59 of the main substrate 20 faces the sixth surface 69 of the partition portion 65.

[0106] As shown in FIGS. 30B and 30C, when viewed from the Z direction in which the sensor substrate 7 and the main substrate 20 face each other, the partition portion 65 has a rectangular shape. Therefore, the partition portion 65 has four side portions, namely, two side portions 70a and 70b that extend in a predetermined direction and face each other, and two side portions 71a and 71b that extend in a direction orthogonal to the predetermined direction and face each other. Note that the four side portions of the partition portion 65 can also be said to be the four side portions of the fifth surface 68. Also, the four side portions of the partition portion 65 can also be said to be the four side portions of the sixth surface 69. In the present embodiment, the frame 50 is arranged such that the extending directions of the two side portions 70a and 70b of the partition portion 65 are in the X direction, and the extending directions of the two side portions 71a and 71b are in the Y direction. That is, in the present embodiment, the sensor substrate 7, the main substrate 20, and the partition portion 65 of the frame 50 are arranged such that the extending directions of the four side portions are aligned. Thus, in this embodiment, when viewed from the Z direction, the sensor substrate 7, the main substrate 20, and the partition wall portion 65 have the same shape as each other. The sizes of the sensor substrate 7, the main substrate 20, and the partition wall portion 65 may be configured to be equal to each other. Of course, it is not limited to this.

[0107] One or more first abutting portions 66 extend from the partition wall portion 65 toward the sensor substrate 7 side and abut against the sensor substrate 7. In this embodiment, two first abutting portions 66a and 66b are configured as the one or more first abutting portions 66. The first abutting portions 66a and 66b are formed in a partial region of the peripheral edge portion of the fifth surface 68 of the partition wall portion 65. In this embodiment, the first abutting portions 66a and 66b are formed on two side portions 71a and 71b that extend in the Y direction of the fifth surface 68 and face each other. Regions of the peripheral edge portion of the fifth surface 68 where one or more first abutting portions 66 are not formed become one or more first gap regions 73. In this embodiment, two regions along two side portions 70a and 70b that extend in the X direction of the fifth surface 68 and face each other become the first gap regions 73a and 73b. Therefore, in this embodiment, two first gap regions 73a and 73b are configured as the one or more first gap regions 73.

[0108] As shown in FIGS. 29 and 30B, upper surface portions on the sensor substrate 7 side of the two first abutting portions 66a and 66b become first abutting surfaces 74a and 74b that abut against the sensor substrate 7. A first connection terminal portion 75 is formed on at least one of the two first abutting surfaces 74a and 74b. For example, a plurality of lands are configured as the first connection terminal portion 75. Of course, it is not limited to this. In this embodiment, the first connection terminal portion 75 is configured on both of the two first abutting surfaces 74a and 74b. Without being limited to this, a configuration in which the first connection terminal portion 75 is formed only on one of the first abutting surfaces 74 may also be adopted.

[0109] When the sensor substrate 7 is held by the frame 50, the first contact surfaces 74a and 74b are brought into contact with the contact surface 57 of the first opposing surface 53 shown in FIG. 27B. Then, the connection terminal portion 56 formed on the first opposing surface 53 and the first connection terminal portions 75 formed on the first contact surfaces 74a and 74b are electrically connected.

[0110] Also, as shown in FIG. 24, when the sensor substrate 7 is held by the frame 50, a first space S1 is formed in which the positions of one or more first gap regions 73 of the fifth surface 68 are opened by the partition wall portion 65, the first contact portion 66, and the sensor substrate 7 of the frame 50. The first space S1 is a space that opens toward the back side and the front side along the Y direction, respectively. The second IMU sensor 12 and other electronic components 15 disposed on the first opposing surface 53 of the sensor substrate 7 are housed in the first space S1.

[0111] One or more second contact portions 67 extend from the partition wall portion 65 toward the main substrate 20 side and contact the main substrate 20. In the present embodiment, two second contact portions 67a and 67b are configured as one or more second contact portions 67. The second contact portions 67a and 67b are configured in a partial region of the peripheral edge of the sixth surface 69 of the partition wall portion 65. In the present embodiment, the second contact portions 67a and 67b are configured on two side portions 70a and 70b that extend in the X direction of the sixth surface 69 and face each other. Regions of the peripheral edge of the sixth surface 69 where one or more second contact portions 67 are not configured become one or more second gap regions 77. In the present embodiment, two regions along two side portions 71a and 71b that extend in the Y direction of the sixth surface 69 and face each other become the second gap regions 77a and 77b. That is, in the present embodiment, two second gap regions 77a and 77b are configured as one or more second gap regions 77.

[0112] In the present embodiment, when viewed from the Z direction, the position of the first contact portion 66 on the fifth surface 68 and the position of the second contact portion 67 on the sixth surface 69 are different from each other. As shown in FIG. 30 and the like, when viewed from the Z direction, the first contact portion 66 and the second contact portion 67 are respectively configured at positions rotated 90 degrees from each other. In other words, the direction (Y direction) in which the first contact portions 66a and 66b extend and the direction (X direction) in which the second contact portions 67a and 67b extend intersect at an angle of 90 degrees. Also, when viewed from the Z direction, the position of the first void region 73 on the fifth surface 68 and the position of the second void region 77 on the sixth surface 69 are different from each other. As shown in FIG. 30 and the like, when viewed from the Z direction, the first void region 73 and the second void region 77 are respectively configured at positions rotated 90 degrees from each other. In other words, the direction (X direction) in which the first void regions 73a and 73b extend and the direction (Y direction) in which the second void regions 77a and 77b extend intersect at an angle of 90 degrees. Further, the first contact portions 66a and 66b are configured in a region on the opposite side (back side) of the second void regions 77a and 77b on the sixth surface 69. The second contact portions 67a and 67b are configured in a region on the opposite side (back side) of the first void regions 73a and 73b on the fifth surface 68.

[0113] Also, as shown in FIG. 29 and the like, at the four corners of the partition portion 65, the first contact portion 66 is configured on the upper side, and the second contact portion 67 is configured on the lower side. In this way, at the four corners of the partition portion 65, the column portion 78 is configured by the first contact portion 66 and the second contact portion 67. The four column portions 78 configured at the four corners of the partition portion 65 hold the sensor substrate 7 on the upper side and hold the main substrate 20 on the lower side.

[0114] As shown in FIGS. 29 and 30C, the lower surface portions on the main substrate 20 side of the two second contact portions 67a and 67b become the second contact surfaces 79a and 79b that contact the main substrate 20. The second connection terminal portion 80 is formed on at least one of the two second contact surfaces 79a and 79b. For example, the second connection terminal portion 80 is configured by a plurality of lands. Of course, it is not limited to this. In the present embodiment, the second connection terminal portions 80 are formed on both of the two second abutting surfaces 79a and 79b. A configuration in which the second connection terminal portion 80 is formed only on one of the first abutting surfaces 79 is also adoptable.

[0115] When the main substrate 20 is held by the frame 50, the second abutting surfaces 79a and 79b are respectively abutted against the abutting surface 63 of the second opposing surface 59 shown in FIG. 28. Then, the connection terminal portion 62 formed on the second opposing surface 59 and the second connection terminal portions 80 formed on the second abutting surfaces 79a and 79b are electrically connected.

[0116] Also, as shown in FIG. 24, when the main substrate 20 is held by the frame 50, a second space S2 in which the positions of one or more second gap regions 77 of the sixth surface 69 are opened is formed by the partition portion 65 of the frame 50, the second abutting portion 67, and the main substrate 20. The second space S2 is a space that opens to the left and right along the X direction, respectively. The FPGA 24 disposed on the second opposing surface 59 of the main substrate 20 is housed in the second space S2.

[0117] As shown in FIG. 24, the opening position of the first space S1 (the position of the first gap region 73) and the opening position of the second space S2 (the position of the second gap region 77) are different from each other. Specifically, the opening position of the first space S1 and the opening position of the second space S2 are positions rotated 90 degrees from each other. Therefore, the opening direction (X direction) of the first space S1 and the opening direction (Y direction) of the second space S2 intersect at an angle of 90 degrees.

[0118] In the present embodiment, the Y direction corresponds to the first direction. The X direction corresponds to the second direction. Also, the side portions 71a and 71b that extend in the Y direction of the fifth surface 68 and face each other correspond to the two first side portions. The side portions 70a and 70b that extend in the X direction of the sixth surface 69 and face each other correspond to the two second side portions.

[0119] FIG. 31 is a schematic diagram showing a configuration example of the wiring portion 82. The wiring portion 82 electrically connects a first connection terminal portion 75 formed on the first contact portions 66a and 66b and a second connection terminal portion 80 formed on the second contact portions 67a and 67b. In the present embodiment, the wiring portion 82 is configured inside the frame 50. That is, the frame 50 is configured with the wiring portion 82 inserted therein. In the present embodiment, a connection wiring for electrically connecting the sensor substrate 7 and the main substrate 20 is realized by the first connection terminal portion 75, the second connection terminal portion 80, and the wiring portion 82.

[0120] As shown in FIGS. 31A and B, in the present embodiment, a plurality of first wirings 83 are provided inside the first contact portion 66. The plurality of first wirings 83 are arranged at equal intervals along the extending direction (Y direction) of the first contact portion 66. Also in the Y direction, the positions where the plurality of first wirings 83 are provided with respect to the two first contact portions 66a and 66b are equal to each other. In the present embodiment, a plurality of first wirings 83 are provided at the positions of the connection terminals of each of the connection terminal portions 75 formed on the first contact portion 66. Of course, the configuration is not limited to such a configuration.

[0121] Also in the present embodiment, a plurality of first wirings 84 are provided inside the second contact portion 67. The plurality of second wirings 84 are arranged at equal intervals along the extending direction (X direction) of the second contact portion 67. Also in the X direction, the positions where the plurality of second wirings 84 are provided with respect to the two second contact portions 67a and 67b are equal to each other. In the present embodiment, a plurality of second wirings 84 are provided at the positions of the connection terminals of each of the connection terminal portions 80 formed on the second contact portion 67. Of course, the configuration is not limited to such a configuration.

[0122] Inside the partition portion 65 of the frame 50, a plurality of intermediate wirings 85 for connecting the plurality of first wirings 83 and the plurality of second wirings 84 are formed. As shown in FIG. 31B, virtual axes are set along the X direction and the Y direction from the center of the partition wall portion 65, and the partition wall portion 65 is divided into four blocks. Then, a plurality of intermediate wirings 85 are provided for each block so as to have the same configuration as each other. Focusing on one block, the first wiring 83 and the second wiring 84 closest to the four corners of the partition wall portion 65 are connected by an intermediate wiring 85a. The first wiring 83 and the second wiring 84 second closest to the four corners of the partition wall portion 65 are connected by an intermediate wiring 85b. The first wiring 83 and the second wiring 84 third closest to the four corners of the partition wall portion 65 are connected by an intermediate wiring 85c. The first wiring 83 and the second wiring 84 farthest from the four corners of the partition wall portion 65 are connected by an intermediate wiring 85d. Each of the intermediate wirings 85a to 85d extends in the Y direction from the first wiring 83 to be connected, is bent in the X direction at the position of the second wiring 84 to be connected, and is connected to the second wiring 84 along the X direction as it is. Therefore, each of the intermediate wirings 85a to 85d has a shape in which the central portion is bent by 90 degrees. In each of the four blocks, the intermediate wirings 85a to 85d are formed. The intermediate wiring 85 is formed in the number of sets of the first wiring 83 and the second wiring 84 to be connected. A wiring portion 82 is formed by a plurality of first wirings 83, a plurality of intermediate wirings 85, and a plurality of first wirings 84.

[0123] The plurality of first wirings 83 formed on the first contact portion 66 are electrically connected to the first connection terminal portion 75 formed on the first contact surface 74. The plurality of second wirings 84 formed on the second contact portion 67 are electrically connected to the second connection terminal portion 80 formed on the second contact surface 79. Thereby, it becomes possible to electrically connect the sensor substrate 7 and the main substrate 20.

[0124] Note that a part of the plurality of first wirings 83 formed on the first abutting portion 66 may be used as the first connection terminal portion 75. Similarly, a part of the plurality of second wirings 84 formed on the second abutting portion 67 may be used as the second connection terminal portion 80. In this case, a part of the wiring portion 82 will be used as a part of the first connection terminal portion 75 or the second connection terminal portion 80. The configuration of the wiring portion 82 is not limited, and any configuration that can electrically connect the first connection terminal portion 75 formed on the first abutting surface 74 and the second connection terminal portion 80 formed on the second abutting surface 79 may be adopted.

[0125] Also, as shown in FIG. 31, in the present embodiment, wirings 86 penetrating the column portions 78 vertically are formed inside the column portions 78 formed at the four corners of the partition portion 65. Relatively thick wirings can be formed in the column portions 78. Therefore, it is possible to design the wiring 86 to be thick to reduce the wiring resistance. Thereby, for example, the wiring 86 can be used as a power supply wiring or a ground wiring. Of course, it is not limited to this, and the wiring 86 may be used to electrically connect the sensor substrate 7 and the main substrate 20.

[0126] The specific materials and the like of the various connection terminal portions and the various wirings described above are not limited. For example, any conductive material such as copper or silver may be used.

[0127] The frame 50 can be realized by, for example, MID (Molded Interconnect Device). That is, the frame 50 can be created by forming an electric circuit (such as plating) on a resin molded product. Alternatively, the method of creating a ceramic substrate can also be applied to the frame 50. For example, by combining and laminating conductive and non-conductive layers and sintering them, a ceramic sintered product with an electric circuit formed thereon is created. The ceramic sintered product can be used as the frame 50. Alternatively, methods such as attaching a flexible substrate to a resin molded product or the like, or creating a wiring portion with sheet metal and performing insert molding may be used.

[0128] In addition, as a method for creating the frame 50, any method may be adopted. For example, based on structural requirements, electrical requirements, etc. required for the frame 50, the method for creating the frame 50 may be appropriately selected. Examples of structural requirements include whether the sensor substrate 7 and the main substrate 20 can hold components in consideration of the height of the mounted components, or whether the substrate can be permanently held with the strength required for the structure. Examples of electrical requirements include whether the sensor substrate 7 and the main substrate 20 can be electrically connected in multiple systems, or whether they can be permanently connected with a resistance value below that required for the circuit. Of course, it is not limited to the case of determining the method for creating the frame 50 by paying attention to such requirements. Any creation method that can realize a three-dimensional shape and electrical wiring may be appropriately adopted.

[0129] FIG. 32 is a schematic diagram for explaining the effect of the sensor device on heat. In the sensor device 100 according to the present embodiment, the partition portion 65 of the frame 50 is disposed between the sensor substrate 7 and the main substrate 20. Thereby, it becomes possible to prevent radiant heat (aori) from the FPGA 24 or the like of the main substrate 20. Also, it becomes possible to prevent heat transfer to the sensor substrate 7 due to air convection. Further, in the present embodiment, by disposing the frame 50, the space between the sensor substrate 7 and the main substrate 20 can be divided into two spaces, a first space S1 and a second space S2. Thereby, it becomes possible to sufficiently prevent heat transfer by radiation and convection. The first space S1 is a space that opens to the back side and the front side along the Y direction. Therefore, an air passage is formed in the first space S1 along the Y direction. Moreover, the second space S2 is a space that opens to the left and right along the X direction. Therefore, in the second space S2, an air passage is formed along the X direction. In this way, each of the first space S1 and the second space S2 is partially open, and an air passage is configured. Therefore, it is possible to prevent heat from accumulating in the first space S1 and the second space S2, and it is possible to sufficiently suppress the temperature rise of the sensor substrate 7 and the main substrate 20.

[0130] Furthermore, in the present embodiment, as shown in FIG. 32, the opening position of the first space S1 and the opening position of the second space S2 are positions rotated 90 degrees from each other. That is, the opening direction (X direction) of the first space S1 and the opening direction (Y direction) of the second space S2 intersect at an angle of 90 degrees. Thereby, it is possible to sufficiently prevent the heat (warm air) released to the outside from the opening of the second space S2 from entering the inside of the first space S1. That is, it is possible to further prevent heat transfer by convection.

[0131] Furthermore, in the present embodiment, it is possible to sufficiently suppress heat transfer by conduction. As schematically shown using arrows in FIG. 32, the heat generated from the FPGA 24 etc. of the main substrate 20 first conducts to the main substrate 20. The heat transferred to the main substrate 20 conducts to the contact surface 63 (see FIG. 28) where the frame 50 abuts. From the contact surface 63 of the main substrate 20, heat conducts to the second contact portion 67 of the frame 50. The heat conducted to the second contact portion 67 conducts to the column portion 78 of the frame 50. The heat conducted to the column portion 78 of the frame 50 conducts to the first contact portion 66 of the frame 50 and then conducts to the sensor substrate 7. In this way, the frame 50 makes it possible to lengthen the heat conduction path from the FPGA 24 etc. of the main substrate 20 to the sensor substrate 7. Thereby, it is possible to sufficiently suppress the heat conducted to the sensor substrate 7. Thus, in this embodiment, by using the frame 50, it is possible to sufficiently suppress the heat transfer to the sensor substrate 7 by radiation, convection, and conduction. As a result, it is possible to sufficiently suppress the temperature of the sensor substrate 7 from rising. As a result, it is possible to sufficiently suppress the generation of stress on the sensor substrate 7 due to heat, and it is possible to improve the deformation suppression effect. As a result, it is possible to improve the measurement accuracy of the sensor device 100.

[0132] As described above, in the sensor device 100 illustrated in FIGS. 24 to 32, the sensor substrate 7 and the main substrate 20 are held by the frame 50 having connection wirings (the first connection terminal portion 75, the wiring portion 82, and the second connection terminal portion 80). The sensor substrate 7 and the main substrate 20 are electrically connected by the connection wirings of the frame 50 when held by the frame 50. This is advantageous for miniaturization of the device as compared with the case where the sensor device 100 is constituted by a rigid flexible substrate. In addition, since the device configuration can be simplified, it is possible to simplify the manufacturing process, shorten the manufacturing time, and reduce the manufacturing cost. Also, as described with reference to FIG. 32, it is possible to sufficiently suppress the influence of heat on the sensor substrate 7, and it is possible to improve the measurement accuracy of the sensor device 100. Note that by forming the partition portion 65 in the frame 50, it becomes easy to route the wiring in the horizontal direction (XY plane direction), which is advantageous for the conduction between the sensor substrate 7 and the main substrate 20 arranged vertically.

[0133] For example, by adopting the configuration shown in FIG. 24, it is possible to mass-produce inexpensively a small and highly accurate sensor device 100 whose size in each of the X and Y directions is about 10 mm and whose size in the Z direction is about 5 mm. Of course, the size of the sensor device 100 is not limited. Also, as the material of the sensor substrate 7, a ceramic material with a low coefficient of linear expansion is used. That is, a ceramic substrate is used as the sensor substrate 7. Thereby, it becomes possible to improve the measurement accuracy. Also, by using a ceramic material for the material of the main substrate 20 and the frame 50 as well, it becomes possible to sufficiently prevent the influence of the difference in the coefficient of linear expansion between members. As a result, it becomes possible to improve the measurement accuracy. Also, aluminum, copper, etc. may be used as the substrate material that has a low coefficient of thermal expansion and a large Young's modulus and is difficult to deform. The same material may also be used for the material of the main substrate 20 and the frame 50.

[0134] Note that the configuration using the frame 50 illustrated in FIG. 24 can also be applied to a sensor substrate on which an IMU sensor is mounted only on one side. Also in this case, it becomes possible to sufficiently prevent the transfer of heat to the sensor substrate.

[0135] Other configuration examples of the sensor device 100 using the frame 50 shown in FIGS. 24 to 32 will be described. Hereinafter, the description will be centered on the differences from the sensor device 100 shown in FIG. 24 and the like. The description of parts similar to the configuration and operation in the sensor device 100 shown in FIG. 24 and the like will be omitted or simplified.

[0136] FIG. 33 is a perspective view showing another configuration example of the sensor device 100. FIG. 34A is a front view of the side (upper side) of the frame 50 facing the sensor substrate 7. FIG. 34B is a side view of the frame 50. FIG. 34C is a perspective view of the side (lower side) of the frame 50 facing the main substrate 20.

[0137] Compared with the configuration illustrated in FIG. 24 and the like, in this example, the positions of the first contact portion 66 and the second contact portion 67 provided on the frame 50 are different. First, as shown in FIG. 34A and the like, the four corner vertices of the fifth surface 68 of the partition portion 65 are defined as follows. The four corner vertices of the fifth surface 68 also serve as the four corner vertices of the sixth surface 69 of the partition portion 65. Vertex 88a... The vertex between the back side portion 70a extending in the X direction and the left side portion 71a extending in the Y direction Vertex 88b... The vertex between the left side portion 71a extending in the Y direction and the front side portion 70b extending in the X direction Vertex 88c... The vertex between the front side portion 70b extending in the X direction and the right side portion 71b extending in the Y direction Vertex 88d... The vertex between the right side portion 71b extending in the Y direction and the back side portion 70a extending in the X direction

[0138] As shown in FIG. 34A and the like, first contact portions 66a and 66b are formed on the fifth surface 68 of the partition portion 65. The first contact portion 66a has a shape bent at 90 degrees around the vertex 88a when viewed from the Z direction. Specifically, the first contact portion 66a is formed in a region from the vertex 88a on the back side portion 70a to a predetermined length t1, and in a region from the vertex 88a on the left side portion 71a to the same length t1. In the present embodiment, the length t1 is designed to be larger than half of the side portions 70a and 71a. Therefore, in the side portion 70a, the first contact portion 66a is formed in a region from the left end to a position on the right side of the center. Also, in the side portion 71a, the first contact portion 66a is formed in a region from the upper end to a position below the center. The first contact portion 66b has a shape bent at 90 degrees around the vertex 88c when viewed from the Z direction. Specifically, the first contact portion 66b is formed in a region from the vertex 88c on the front side portion 70b to a length t1, and in a region from the vertex 88c on the right side portion 71b to a length t1. When viewed from the Z direction, the first contact portions 66a and 66b are configured to be symmetric with respect to the center of the partition portion 65.

[0139] In the peripheral region of the fifth surface 68 of the partition portion 65, regions where the first contact portions 66a and 66b are not formed become the first gap regions 73a and 73b. The first gap region 73a has a shape bent 90 degrees around the vertex 88b. The first gap region 73b has a shape bent 90 degrees around the vertex 88d.

[0140] FIG. 34C is a view when the frame 50 is turned over so that the vertex 88a shown in FIG. 34A comes to the position of the vertex 88c. As shown in FIG. 34C, second contact portions 67a and 67b are formed on the sixth surface 69 of the partition portion 65. The second contact portion 67a has a shape bent 90 degrees around the vertex 88d when viewed from the Z direction. Specifically, the second contact portion 67a is formed in a region from the vertex 88d on the side portion 70a to a length t1 and in a region from the vertex 88d on the side portion 71b to a length t1. The second contact portion 67b has a shape bent 90 degrees around the vertex 88b when viewed from the Z direction. Specifically, the second contact portion 67b is formed in a region from the vertex 88b on the side portion 70b to a length t1 and in a region from the vertex 88b on the side portion 71a to a length t1. The first contact portions 66a and 66b and the second contact portions 67a and 67b have different positions when viewed from the Z direction, but their shapes themselves are equal.

[0141] In the peripheral region of the sixth surface 69 of the partition portion 65, regions where the second contact portions 67a and 67b are not formed become the second gap regions 77a and 77b. The second gap region 77a has a shape bent 90 degrees around the vertex 88a. The second gap region 77b has a shape bent 90 degrees around the vertex 88c. When viewed from the Z direction, the positions of the first gap region 73 on the fifth surface 68 and the positions of the second gap region 77 on the sixth surface 69 are different from each other.

[0142] At least one of the first abutting portions 66a and 66b is configured with a first connection terminal portion (not shown). At least one of the second abutting portions 67a and 67b is configured with a second connection terminal portion (not shown). The frame 50 is configured with a connection wiring (not shown). The sensor substrate 7 held by the frame 50 and the main substrate 20 are electrically connected by the connection wiring.

[0143] As shown in FIG. 33, when the sensor substrate 7 is held by the frame 50, a first space S1 is formed. Also, when the main substrate 20 is held by the frame 50, a second space S2 is formed. The opening position of the first space S1 (the position of the first gap region 73) and the opening position of the second space S2 (the position of the second gap region 77) are configured to be different from each other. Also in the sensor device 100 shown in FIGS. 33 and 34, the effects described above are exhibited.

[0144] FIG. 35 is a perspective view showing another configuration example of the sensor device 100. FIG. 36A is a front view of the side (upper side) of the frame 50 facing the sensor substrate 7. FIG. 36B is a side view of the frame 50. FIG. 36C is a perspective view of the side (lower side) of the frame 50 facing the main substrate 20.

[0145] As shown in FIG. 36A and the like, first abutting portions 66a to 66d are formed on the fifth surface 68 of the partition portion 65. The first abutting portion 66a has a shape bent 90 degrees around the vertex 88a when viewed from the Z direction. Specifically, the first abutting portion 66a is formed in a region from the vertex 88a on the back side edge portion 70a to a predetermined length t2, and in a region from the vertex 88a on the left side edge portion 71a to the same length t2. In the present embodiment, the length t2 is designed to be smaller than half of the side portions 70a and 71a. Accordingly, in the side portion 70a, the first contact portion 66a is formed from the left end to the region to the left of the center. Also, in the side portion 71a, the first contact portion 66a is formed from the upper end to the region above the center. Each of the first contact portions 66b to 66d is formed in the same shape as the first contact portion 66a. The first contact portion 66b is formed around the vertex 88b. The first contact portion 66c is formed around the vertex 88c. The first contact portion 66d is formed around the vertex 88d. When viewed from the Z direction, the first contact portions 66a to 66d are configured to be symmetric with respect to the center of the partition portion 65.

[0146] In the peripheral edge portion of the fifth surface 68 of the partition portion 65, regions where the first contact portions 66a to 66d are not formed become the first gap regions 73a to 73d. The region between the first contact portions 66a and 66b at the center of the side portion 71a becomes the first gap region 73a. The region between the first contact portions 66b and 66c at the center of the side portion 70b becomes the first gap region 73b. The region between the first contact portions 66c and 66d at the center of the side portion 71b becomes the first gap region 73c. The region between the first contact portions 66d and 66a at the center of the side portion 70a becomes the first gap region 73d.

[0147] FIG. 36C is a view when the frame 50 is turned over so that the vertex 88a shown in FIG. 36A comes to the position of the vertex 88c. As shown in FIG. 36C, second contact portions 67a to 67d are formed on the sixth surface 69 of the partition portion 65. The second contact portion 67a is formed in a region at the center of the side portion 70a having a length of t3. The length t3 is designed to be larger than half of the side portion 70a. Also, the length t3 is designed to be larger than the length from the first gap region 73 of the fifth surface 68. The second contact portion 67b is formed in a region at the center of the side portion 71a having a length of t3. The second abutting portion 67c is formed in a region at the center of the side portion 70b with a length of t3. The second abutting portion 67d is formed in a region at the center of the side portion 71b with a length of t3. When viewed from the Z direction, the position of the first abutting portion 66 on the fifth surface 68 and the position of the second abutting portion 67 on the sixth surface 69 are different from each other.

[0148] In the peripheral portion of the sixth surface 69 of the partition portion 65, regions where the second abutting portions 67a to 67d are not formed become the second gap regions 77a to 77d. The second gap region 77a has a shape bent by 90 degrees around the vertex 88a. The second gap region 77b has a shape bent by 90 degrees around the vertex 88b. The second gap region 77b has a shape bent by 90 degrees around the vertex 88c. The second gap region 77b has a shape bent by 90 degrees around the vertex 88d. When viewed from the Z direction, the position of the first gap region 73 on the fifth surface 68 and the position of the second gap region 77 on the sixth surface 69 are different from each other.

[0149] At least one of the first abutting portions 66a to 66d forms a first connection terminal portion (not shown). At least one of the second abutting portions 67a to 67d forms a second connection terminal portion (not shown). The frame 50 forms a connection wiring (not shown). The sensor substrate 7 held by the frame 50 and the main substrate 20 are electrically connected by the connection wiring.

[0150] As shown in FIG. 35, when the sensor substrate 7 is held by the frame 50, a first space S1 is formed. Also, when the main substrate 20 is held by the frame 50, a second space S2 is formed. The opening position of the first space S1 (the position of the first gap region 73) and the opening position of the second space S2 (the position of the second gap region 77) are configured to be different from each other. Even in the sensor device 100 shown in FIGS. 35 and 36, the effects described above are exhibited.

[0151] FIG. 37 is a perspective view showing another configuration example of the sensor device 100. FIG. 38 is an exploded perspective view of the sensor device 100. FIG. 39A is a front view of the side (upper side) of the frame 50 facing the sensor substrate 7. FIG. 39B is a side view of the frame 50. FIG. 39C is a perspective view of the side (lower side) of the frame 50 facing the main substrate 20.

[0152] As shown in FIG. 39A and the like, when viewed from the Z direction, the sensor substrate 7, the main substrate 20, and the partition wall portion 65 of the frame 50 have a circular shape. On the fifth surface 68 of the partition wall portion 65 of the frame 50, first contact portions 66a and 66b are formed. The first contact portion 66a is formed in a range of a predetermined angle θ1 at the peripheral edge of the circular partition wall portion 65. Therefore, the first contact portion 66a has an arc shape when viewed from the Z direction. Note that the predetermined angle θ1 is designed to be smaller than 180 degrees. The first contact portion 66b is formed at a position facing the first contact portion 66a. In the present embodiment, the first contact portions 66a and 66b face each other along the X direction. The first contact portion 66b is formed in a range of the same angle θ1 at the peripheral edge of the circular partition wall portion 65. Therefore, when viewed from the Z direction, the first contact portions 66a and 66b are configured to be symmetric with respect to the center of the partition wall portion 65.

[0153] Regions where the first contact portions 66a and 66b are not formed at the peripheral edge of the fifth surface 68 of the partition wall portion 65 become first gap regions 73a and 73b. The first gap regions 73a and 73b are located at positions facing each other along the Y direction and have an arc shape when viewed from the Z direction.

[0154] FIG. 39C is a view when the frame 50 is turned over so that the first abutting portion 66a shown in FIG. 39A comes to the front side. As shown in FIG. 39C, second abutting portions 67a and 67b are formed on the sixth surface 69 of the partition portion 65. Each of the second abutting portions 67a and 67b is formed in a range of an angle θ1 at the peripheral edge of the circular partition portion 65. Also, the second abutting portions 67a and 67b are arranged to face each other along the Y direction. Therefore, the second abutting portions 67a and 67b are formed at positions where the first abutting portions 66a and 66b formed on the fifth surface 68 are rotated by an angle of 90 degrees. The first abutting portions 66a and 66b and the second abutting portions 67a and 67b have different positions when viewed from the Z direction, but their shapes themselves are equal.

[0155] Regions where the second abutting portions 67a and 67b are not formed at the peripheral edge of the sixth surface 69 of the partition portion 65 become second gap regions 77a and 77b. The second gap regions 77a and 77b are located to face each other along the X direction and have an arc shape when viewed from the Z direction. When viewed from the Z direction, the position of the first gap region 73 on the fifth surface 68 and the position of the second gap region 77 on the sixth surface 69 are different from each other.

[0156] At least one of the first abutting portions 66a and 66b is formed with a first connection terminal portion (not shown). At least one of the second abutting portions 67a and 67b is formed with a second connection terminal portion (not shown). A connection wiring (not shown) is formed on the frame 50. The sensor substrate 7 held by the frame 50 and the main substrate 20 are electrically connected by the connection wiring.

[0157] As shown in FIG. 37, when the sensor substrate 7 is held by the frame 50, a first space S1 is formed. Also, when the main substrate 20 is held by the frame 50, a second space S2 is formed. The opening position of the first space S1 (the position of the first gap region 73) and the opening position of the second space S2 (the position of the second gap region 77) are configured to be different from each other. Also in the sensor device 100 shown in FIGS. 37 to 39, the effects described above are exhibited.

[0158] FIG. 40 is a perspective view showing another configuration example of the sensor device 100. FIG. 41 is an exploded perspective view of the sensor device 100.

[0159] The sensor device 100 according to the present embodiment holds the main board 20 and a plurality of sensor boards 7 by a plurality of frames 50. Specifically, a plurality of sensor boards 7 can be stacked along the vertical direction by the plurality of frames 50. In the example shown in FIGS. 40 and 41, the sensor device 100 includes a main board 20, a first frame 50a, a first sensor board 7a, a second frame 50b, and a second sensor board 7b. The first frame 50a has a partition portion 65, one or more first contact portions 66, and one or more second contact portions 67. Further, connection wirings (hereinafter referred to as first connection wirings) as illustrated in FIGS. 30 and 31 are inserted into the first frame 50a. The first frame 50a holds the first sensor board 7 and the main board 20 so that the first sensor board 7a and the main board 20 are electrically connected by the first connection wiring.

[0160] The second frame 50b has the same configuration as the first frame 50a and is connected on the first sensor board 7a. A second sensor board 7b is connected above the second frame 50b. The second frame 50b has a partition portion 90 disposed between the first sensor board 7a and the second sensor board 7b, one or more contact portions 91 that contact the second sensor board 7b, and one or more contact portions 92 that contact the first sensor board 7a. The partition portion 90 is a portion corresponding to the partition portion 65 of the first frame 50a. The one or more abutting portions 91 are portions corresponding to one or more first abutting portions 66 of the first frame 50a. Also, the one or more abutting portions 92 are portions corresponding to one or more second abutting portions 67 of the first frame 50a. Also, connection wirings (hereinafter referred to as second connection wirings) as illustrated in FIGS. 30 and 31 are inserted into the second frame 50b.

[0161] The second frame 50b holds the first sensor substrate 7a and the second sensor substrate 7b such that the second sensor substrate 7b and the main substrate 20 are electrically connected by the first connection wiring and the second connection wiring. In other words, the second frame 50a is connected to the first sensor substrate 7a and holds the second sensor substrate 7b such that the second sensor substrate 7b and the main substrate 20 are electrically connected by the first connection wiring and the second connection wiring.

[0162] In the examples shown in FIGS. 40 and 41, two abutting portions 92a and 92b of the second frame 50b are abutted inside two side portions 54a and 54b along the X direction on the upper side surface of the first sensor substrate 7a. Connection terminal portions (not shown) are formed on the upper surface of the first sensor substrate 7a along the two side portions 54a and 54b. The connection terminal portions are electrically connected to connection terminal portions 93 formed on the two abutting portions 92a and 92b of the second frame 50b. Connection terminal portions (not shown) are formed on the lower side surface of the second sensor substrate 7a along two side portions 94a and 94b along the Y direction. The connection terminal portions are electrically connected to connection terminal portions 95 formed on the two abutting portions 91a and 91b of the second frame 50b. Thereby, the second sensor substrate 7b and the main substrate 20 are electrically connected via the second frame 50b (second connection wiring), the first sensor substrate 7a, and the first frame 50a (first connection wiring). Note that the wiring configuration formed in the first sensor substrate 7a for realizing the electrical connection is not limited and may be arbitrarily designed.

[0163] As shown in FIG. 40, a third space S3 is formed above the partition wall portion 90 of the second frame 50b. Also, a space S4 is formed below the partition wall portion 90. In the example shown in FIG. 40, the first frame 50a and the second frame 50b are stacked so as to face the same direction as each other. Therefore, the opening position of the third space S3 is the same as the opening position of the first space S1, and is different from the spatial position of the second space S2. Also, the opening position of the fourth space S4 is different from the opening position of the first space S1, and is the same as the spatial position of the second space S2. Of course, the present invention is not limited to such a configuration, and the first frame 50a and the second frame 50b may be arranged so as to be rotated 90 degrees with respect to each other. In this case, the opening position of the third space S3 is different from the opening position of the first space S1, and is the same as the spatial position of the second space S2. Also, the opening position of the fourth space S4 is the same as the opening position of the first space S1, and is different from the spatial position of the second space S2. For example, in the multi-stage configuration of the sensor substrate 7, the orientation of each frame 50 may be appropriately set based on the influence of heat from the main substrate 20 on each sensor substrate 7, the wiring configuration for electrically connecting each sensor substrate 7 and the main substrate 20, and the like.

[0164] In this way, by using a plurality of frames 50, it becomes possible to compactly realize a sensor device 100 on which a plurality of sensor substrates 7 are mounted with a simple configuration. Of course, the number of stages of the stack is not limited, and a multi-stage configuration having an arbitrary number of stages can be easily realized. That is, by using a plurality of frames 50, it becomes possible to give the sensor device 100 high expandability. Of course, also in the configurations illustrated in FIGS. 33, 35, 37, etc., it is possible to realize a multi-stage configuration of the sensor substrates 7 by using a plurality of frames 50. Also, the present invention is not limited to the case where all of the plurality of frames 50 have the same configuration, and a plurality of frames 50 having different configurations from each other may be used.

[0165] [Device type] The types of devices on which the sensor device 100 according to the present technology can be mounted are not limited. The sensor device 100 according to the present technology can be mounted on various devices in various fields. For example, the present technology can be applied to any electronic device such as mobile phones, smartphones, personal computers, game consoles, game controllers, digital cameras, audio equipment, TVs, projectors, car navigation systems, GPS terminals, wearable information devices (such as glasses-type and wristband-type) like HMDs, and IoT devices connected to the Internet, etc. In addition, it is also possible to mount the sensor device 100 according to the present technology on flying objects such as drones, movable devices such as robots and automobiles, and construction machinery. For example, it is also possible to mount the sensor device 100 according to the present technology on any device for which calculations such as attitude detection and self-position estimation are to be performed. In addition, it is also possible to mount the sensor device 100 according to the present technology on a pen-type operating device for a user to hold and write characters, draw pictures, etc. Based on the output result of the sensor device 100, it is also possible to realize an application such as discriminating and reproducing the characters and pictures drawn by the user. For example, by using a small sensor device 100 having a cylindrical shape as illustrated in FIG. 23, it can be easily realized to attach it to the top of the pen-type operating device or to attach it inside the pen-type operating device. Of course, it is not limited to such a mounting method.

[0166] As described above, in the sensor device 100 according to the present embodiment, one or more first IMU sensors 11 are arranged on the first surface 8 of the sensor substrate 7. Also, one or more second IMU sensors 12 are arranged on the second surface 9 opposite to the first surface 8. By arranging the IMU sensors 5 on both the first surface 8 and the second surface 9, it becomes possible to reduce the size of the device and to suppress the deformation of the sensor substrate 7 caused by heat. Thereby, it becomes possible to realize highly accurate measurement based on the detection results (sensing results) of the plurality of IMU sensors 5.

[0167] For example, by using an expensive and large IMU sensor, it becomes possible to perform highly accurate inertial measurement. On the other hand, when using a MEMS-IMU sensor, it is possible to suppress the cost, but the measurement accuracy may be slightly reduced in some cases. By using this technology, it becomes possible to realize highly accurate inertial measurement based on the detection results of a plurality of MEMS-IMU sensors arranged on both sides of the sensor substrate 7. As a result, it becomes possible to improve the measurement accuracy while reducing the size of the device. It is also possible to suppress the cost. That is, by using this technology, it is possible to realize a small-sized sensor device with high measurement accuracy without adopting a special substrate, mounting technology, large-scale reinforcement structure, etc.

[0168] <Other Embodiments> This technology is not limited to the embodiments described above, and various other embodiments can be realized.

[0169] FIG. 42 is a block diagram for explaining a functional overview of a sensor device according to another embodiment. In the sensor device 200 shown in FIG. 42, it has a plurality of gyro sensors 205 and a control circuit unit 206. Even when a gyro sensor 205 is used instead of the IMU sensor 5, it is possible to apply this technology. For example, in the above description, it is possible to implement this technology by reading "IMU sensor" as "gyro sensor". Of course, a configuration in which one gyro sensor is arranged on the first surface of the sensor substrate and / or one gyro sensor is arranged on the second surface is also included in this technology. Also, the gyro sensor may be configured as a MEMS sensor. When sensors other than the IMU sensor or the gyro sensor are used, this technology may be applied. For example, when an acceleration sensor, various biological sensors, a temperature sensor, an illuminance sensor, etc. are used, this technology may be applied.

[0170] In the above description, as an embodiment of the sensor device according to the present technology, the case where the sensor device is constituted by a rigid-flexible substrate has been cited as an example. Of course, it is not limited to such a configuration. For example, connectors are provided on each of one or more sensor substrates and a main substrate made of a rigid substrate. Then, a flexible substrate is connected to the connectors of each substrate, and each substrate is electrically connected via the flexible substrate. With such a configuration, it is also possible to realize an embodiment of the sensor device according to the present technology.

[0171] Each configuration such as the sensor device, the sensor substrate, the main substrate, the flexible substrate, the holding part, the frame, and each member included therein, and the measurement method described with reference to each drawing are merely one embodiment, and can be arbitrarily modified without departing from the gist of the present technology. That is, any other arbitrary configuration, algorithm, etc. for implementing the present technology may be adopted.

[0172] In the above description, the term "substantially" has been appropriately used to describe the shape and the like. This is merely for facilitating the understanding of the description, and there is no special meaning in the use / non-use of the term "substantially". That is, in the present disclosure, concepts that define the shape, size, positional relationship, state, etc., such as "center", "central", "uniform", "equal", "same", "orthogonal", "parallel", "symmetric", "extending", "axial direction", "cylindrical shape", "cylindrical shape", "ring shape", "annular shape", etc., are concepts including "substantially center", "substantially central", "substantially uniform", "substantially equal", "substantially same", "substantially orthogonal", "substantially parallel", "substantially symmetric", "substantially extending", "substantially axial direction", "substantially cylindrical shape", "substantially cylindrical shape", "substantially ring shape", "substantially annular shape", etc. For example, states included in a predetermined range (for example, a range of ±10%) based on "completely center", "completely central", "completely uniform", "completely equal", "completely same", "completely orthogonal", "completely parallel", "completely symmetric", "completely extending", "completely axial direction", "completely cylindrical shape", "completely cylindrical shape", "completely ring shape", "completely annular shape", etc. are also included. Therefore, even if the word "abbreviation" is not added, the concept expressed with the so-called "abbreviation" may be included. Conversely, for the state expressed with the addition of "abbreviation", the complete state is not excluded.

[0173] Among the characteristic parts related to the present technology described above, it is also possible to combine at least two characteristic parts. That is, the various characteristic parts described in each embodiment may be arbitrarily combined regardless of the differences between the embodiments. In addition, the various effects described above are merely illustrative and not limiting, and other effects may also be exhibited.

[0174] In addition, the present technology can also adopt the following configurations. (1) A substrate having a first surface and a second surface opposite to the first surface, One or more first IMU sensors disposed on the first surface, One or more second IMU sensors disposed on the second surface A sensor device comprising. (2) The sensor device according to (1), Each of the one or more first IMU sensors and each of the one or more second IMU sensors are MEMS sensors Sensor device. (3) The sensor device according to (1) or (2), The first arrangement configuration of the plurality of first IMU sensors disposed on the first surface and the second arrangement configuration of the plurality of second IMU sensors disposed on the second surface correspond to each other Sensor device. (4) The sensor device according to (3), The first arrangement configuration and the second arrangement configuration are equal to each other Sensor device. (5) The sensor device according to any one of (1) to (4), The one or more first IMU sensors are a plurality of first IMU sensors, The one or more second IMU sensors are a plurality of second IMU sensors corresponding to the number of the plurality of first IMU sensors. Sensor device. (6) The sensor device according to (5), wherein the number of the plurality of second IMU sensors is the same as the number of the plurality of first IMU sensors. Sensor device. (7) The sensor device according to (5) or (6), wherein the plurality of first IMU sensors are respectively arranged at predetermined positions on the first surface, and the plurality of second IMU sensors are respectively arranged at positions on the second surface corresponding to the positions of the plurality of first IMU sensors on the first surface. Sensor device. (8) The sensor device according to (7), wherein the positions of the plurality of first IMU sensors on the first surface are equal to the positions of the plurality of second IMU sensors on the second surface. Sensor device. (9) The sensor device according to (7), wherein the plurality of second IMU sensors are respectively arranged at positions on the second surface opposite to the positions of the plurality of first IMU sensors on the first surface. Sensor device. (10) The sensor device according to any one of (5) to (9), wherein the plurality of first IMU sensors are symmetrically arranged with reference to a predetermined first reference position on the first surface. Sensor device. (11) The sensor device according to (10), wherein the plurality of second IMU sensors are symmetrically arranged with reference to a second reference position on the second surface corresponding to the first reference position. Sensor device. (12) The sensor device according to any one of (1) to (11), and further, Comprising a control circuit unit for controlling the operations of each of the one or more first IMU sensors and the one or more second IMU sensors Sensor device. (13)(12) The sensor device according to, When the substrate having the first surface and the second surface is a sensor substrate, The sensor device further includes One or more sensor substrates, A main substrate that is separately configured from the one or more sensor substrates and on which the control circuit unit is disposed, One or more flexible substrates that electrically connect the one or more sensor substrates and the main substrate Sensor device comprising. (14)(13) The sensor device according to, The one or more sensor substrates include a first sensor substrate and a second sensor substrate, The one or more flexible substrates include a first flexible substrate that electrically connects the first sensor substrate and the main substrate, and a second flexible substrate that electrically connects the second sensor substrate and the main substrate Sensor device. (15)(14) The sensor device according to, The main substrate has a third surface on which the control circuit unit is disposed and a fourth surface opposite to the third surface, The first sensor substrate is disposed at a position facing the third surface or the fourth surface of the main substrate when the first flexible substrate is bent, The second sensor substrate is disposed at a position facing the third surface or the fourth surface of the main substrate when the second flexible substrate is bent Sensor device. (16)(15) The sensor device according to, The second sensor substrate is disposed at a position facing the surface of the main substrate that faces the surface facing the first sensor substrate among the third surface and the fourth surface of the main substrate Sensor device. The sensor device according to (17)(15), wherein the second sensor substrate is disposed at a position facing a surface of the main substrate opposite to the surface facing the first sensor substrate, among the third surface and the fourth surface of the main substrate. Sensor device. The sensor device according to any one of (18)(13) to (17), further comprising a holding portion that holds the main substrate and the one or more sensor substrates disposed at predetermined positions with respect to the main substrate by bending the one or more flexible substrates. Sensor device. The sensor device according to (19)(12), wherein when the substrate having the first surface and the second surface is used as a sensor substrate, the sensor device further comprises a main substrate configured separately from the sensor substrate and on which the control circuit portion is disposed, a frame having connection wirings and holding the sensor substrate and the main substrate such that the sensor substrate and the main substrate are electrically connected by the connection wirings. Sensor device comprising. The sensor device according to (20)(19), wherein the main substrate has a third surface on which the control circuit portion is disposed and a fourth surface opposite to the third surface, the frame holds the sensor substrate and the main substrate such that the sensor substrate faces the third surface or the fourth surface of the main substrate. Sensor device. The sensor device according to (21)(20), wherein a surface of the sensor substrate facing the main substrate among the first surface and the second surface of the sensor substrate is defined as a first facing surface, a surface of the main substrate facing the sensor substrate among the third surface and the fourth surface of the main substrate is defined as a second facing surface, then the frame has a partition portion disposed between the first facing surface and the second facing surface, One or more first contact portions that extend from the partition portion toward the sensor substrate side and contact the sensor substrate, One or more second contact portions that extend from the partition portion toward the main substrate side and contact the main substrate, and having A sensor device. (22)(21) The sensor device according to, The partition portion has a flat plate shape and has a fifth surface facing the sensor substrate and a sixth surface facing the sensor substrate, The one or more first contact portions are formed in a partial region of the peripheral edge of the fifth surface, The one or more second contact portions are formed in a partial region of the peripheral edge of the sixth surface, A sensor device. (23)(22) The sensor device according to, When viewed from the direction in which the sensor substrate and the main substrate face each other, The position of the region where the one or more first contact portions of the peripheral edge of the fifth surface are formed and the position of the region where the one or more second contact portions of the peripheral edge of the sixth surface are formed are different from each other A sensor device. (24)(23) The sensor device according to, When viewed from the direction in which the sensor substrate and the main substrate face each other, The position of the one or more first void regions where the one or more first contact portions of the peripheral edge of the fifth surface are not formed and the position of the one or more second void regions where the one or more second contact portions of the peripheral edge of the sixth surface are not formed are different from each other A sensor device. (25)(24) The sensor device according to, When viewed from the direction in which the sensor substrate and the main substrate face each other, The one or more first contact portions are formed in a region on the opposite side of the one or more second void regions of the sixth surface, The one or more second contact portions are formed in a region on the opposite side of the one or more first void regions of the fifth surface A sensor device. The sensor device according to (26), (24) or (25), wherein when the sensor substrate is held by the frame, a first space is formed by the partition portion, the first contact portion, and the sensor substrate, in which the position of the one or more first gap regions on the fifth surface is open; when the main substrate is held by the frame, a second space is formed by the partition portion, the second contact portion, and the main substrate, in which the position of the one or more second gap regions on the sixth surface is open. Sensor device. The sensor device according to (27), (26), wherein when viewed from the direction in which the sensor substrate and the main substrate face each other, the opening position of the first space and the opening position of the second space are different from each other. Sensor device. The sensor device according to any one of (21) to (27), wherein when viewed from the direction in which the sensor substrate and the main substrate face each other, the sensor substrate, the main substrate, and the partition portion have the same shape as each other. Sensor device. The sensor device according to (29), (28), wherein when viewed from the direction in which the sensor substrate and the main substrate face each other, the sensor substrate, the main substrate, and the partition portion have a rectangular shape, the first contact portion is formed on two first side portions that extend in a first direction on the fifth surface and face each other, the second contact portion is formed on two second side portions that extend in a second direction orthogonal to the first direction on the sixth surface and face each other. Sensor device. The sensor device according to any one of (21) to (29), wherein the connection wiring includes a first connection terminal portion formed on at least one of one or more first contact surfaces that contact the sensor substrate of the one or more first contact portions, At least one second connection terminal portion formed on at least one of the one or more second contact surfaces that contact the main substrate of the one or more second contact portions; A wiring portion that electrically connects the first connection terminal portion and the second connection terminal portion And having Sensor device. (31)(30) The sensor device according to any one of the above, On the surface that contacts the first contact surface of the sensor substrate, a connection terminal portion that is electrically connected to the first connection terminal portion is formed, On the surface that contacts the second contact surface of the main substrate, a connection terminal portion that is electrically connected to the second connection terminal portion is formed Sensor device. (32)(19) to (31) The sensor device according to any one of the above, When the sensor substrate is used as a first sensor substrate and the frame is used as a first frame, The sensor device includes a second sensor substrate and a second frame, The first frame has a first connection wiring, and holds the first sensor substrate and the main substrate so that the first sensor substrate and the main substrate are electrically connected by the first connection wiring. The second frame has a second connection wiring, and holds the first sensor substrate and the second sensor substrate so that the second sensor substrate and the main substrate are electrically connected by the first connection wiring and the second connection wiring. Sensor device. (33)(1) to (32) The sensor device according to any one of the above, further comprising One or more dummy components disposed on at least one of the first surface or the second surface Sensor device. (34) A substrate having a first surface and a second surface opposite to the first surface, One or more first gyro sensors disposed on the first surface, One or more second gyro sensors disposed on the second surface A sensor device comprising... (35)(33) The sensor device described above, wherein the one or more dummy components are arranged on the second surface, and the total number of each of the one or more second IMU sensors and the one or more dummy components is the same as the number of the plurality of first IMU sensors. Sensor device. (36)(13) The sensor device described above, wherein the one or more sensor substrates are three or more sensor substrates. Sensor device. (37)(13) The sensor device described above, wherein the main substrate and the sensor substrate are rigid substrates. Sensor device. (38)(19) to (32) Any one of the sensor devices described above, wherein the sensor substrate is a ceramic substrate. Sensor device. (39)(20) The sensor device described above, and further, wherein the one or more first gyro sensors are MEMS sensors. wherein the one or more second gyro sensors are MEMS sensors. Sensor device.

Explanation of symbols

[0175] P1…First reference position P2…Second reference position 5…IMU sensor 6, 206…Control circuit section 7…Sensor substrate 11…First IMU sensor 12…Second IMU sensor 15…Other electronic components 17…Dummy component 20…Main substrate 21…Flexible substrate 24…FPGA 30…Holder section 50…Frame 100, 200…Sensor device 205… Gyro sensor

Claims

1. A substrate having a first surface and a second surface facing the first surface; A plurality of IMU sensors disposed on the first surface; One or more electronic components different from the IMU sensors disposed on the first surface; A plurality of IMU sensors disposed on the second surface; One or more electronic components different from the IMU sensors disposed on the second surface; Comprising; The number of the plurality of IMU sensors disposed on the first surface is the same as the number of the plurality of IMU sensors disposed on the second surface; The arrangement configuration of the plurality of IMU sensors disposed on the first surface corresponds to the arrangement configuration of the plurality of IMU sensors disposed on the second surface; The arrangement configuration of the one or more electronic components disposed on the first surface corresponds to the arrangement configuration of the one or more electronic components disposed on the second surface Sensor device.

2. The sensor device according to claim 1, The one or more electronic components are a plurality of electronic components Sensor device.

3. The sensor device according to claim 2, The plurality of electronic components include a plurality of types of electronic components Sensor device.

4. The sensor device according to claim 1, Outputting a final detection result based on the detection results of each of the plurality of IMU sensors; Sensor device.

5. The sensor device according to claim 1, The final detection result includes at least one of angular velocity and acceleration Sensor device.

6. The sensor device according to claim 1, The arrangement configuration of the plurality of IMU sensors disposed on the first surface is equal to the arrangement configuration of the plurality of IMU sensors disposed on the second surface Sensor device.

7. The sensor device according to claim 1, The arrangement configuration of the plurality of IMU sensors includes at least one of the positions of the plurality of IMU sensors, the positional relationship of the plurality of IMU sensors, and the arrangement state of the plurality of IMU sensors Sensor device.

8. The sensor device according to claim 1, The arrangement configuration of the plurality of IMU sensors includes a configuration arranged symmetrically with respect to a predetermined reference position Sensor device.

9. The sensor device according to claim 8, The configuration arranged symmetrically with respect to the predetermined reference position includes at least one of an arrangement that is line-symmetric with respect to a predetermined line passing through the reference position, an arrangement that is point-symmetric with respect to the reference position, and an arrangement that is rotationally symmetric with respect to the reference position. Sensor device.

10. The sensor device according to claim 2, The arrangement configuration of the plurality of electronic components arranged on the first surface and the arrangement configuration of the plurality of electronic components arranged on the second surface are equal to each other. Sensor device.

11. The sensor device according to claim 2, The arrangement configuration of the plurality of electronic components includes at least one of the positions of the plurality of electronic components, the positional relationship of the plurality of electronic components, and the arrangement state of the plurality of electronic components. Sensor device.

12. The sensor device according to claim 2, The arrangement configuration of the plurality of electronic components includes a configuration arranged symmetrically with respect to a predetermined reference position. Sensor device.

13. The sensor device according to claim 1, The one or more electronic components include at least one of a diode, a transistor, a resistor, a coil, a relay, a switch, and an auxiliary component. Sensor device.

14. The sensor device according to claim 1, The IMU sensor is a gyro sensor or an acceleration sensor. Sensor device.

15. The sensor device according to claim 1, Each of the plurality of IMU sensors is a MEMS sensor. Sensor device.

16. The sensor device according to claim 1, further comprising A control circuit unit for controlling the operation of each of the plurality of IMU sensors. Sensor device.

17. A substrate having a first surface and a second surface facing the first surface, A plurality of IMU sensors arranged on the first surface, One or more electronic components different from the IMU sensors arranged on the first surface, A plurality of IMU sensors arranged on the second surface, and One or more electronic components different from the IMU sensors arranged on the second surface Comprising, The number of the plurality of IMU sensors arranged on the first surface is the same as the number of the plurality of IMU sensors arranged on the second surface, The arrangement configuration of the plurality of IMU sensors arranged on the first surface and the arrangement configuration of the plurality of IMU sensors arranged on the second surface are configured to have a first correspondence relationship. The arrangement configuration of the one or more electronic components disposed on the first surface and the arrangement configuration of the one or more electronic components disposed on the second surface are configured to have a second correspondence relationship Sensor device

18. The sensor device according to claim 17, The one or more electronic components are a plurality of electronic components Sensor device

19. The sensor device according to claim 17, The plurality of electronic components include a plurality of types of electronic components Sensor device

20. An information processing apparatus comprising a sensor device, The sensor device includes A substrate having a first surface and a second surface facing the first surface, A plurality of IMU sensors disposed on the first surface, One or more electronic components different from the IMU sensors disposed on the first surface, A plurality of IMU sensors disposed on the second surface, and One or more electronic components different from the IMU sensors disposed on the second surface wherein The number of the plurality of IMU sensors disposed on the first surface is the same as the number of the plurality of IMU sensors disposed on the second surface, The arrangement configuration of the plurality of IMU sensors disposed on the first surface and the arrangement configuration of the plurality of IMU sensors disposed on the second surface correspond to each other, The arrangement configuration of the one or more electronic components disposed on the first surface and the arrangement configuration of the one or more electronic components disposed on the second surface correspond to each other Information processing apparatus

21. The information processing apparatus according to claim 20, Performing at least one of attitude detection and self-position estimation based on the detection result of the sensor device Information processing apparatus

22. The information processing apparatus according to claim 20, configured as at least one of a mobile phone, a smartphone, a personal computer, a game console, a game controller, a digital camera, a GPS terminal, a drone, a robot, a vehicle, and a construction machine Information processing apparatus

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