Conveyance device, irradiation system, and irradiation method

Abstract

To provide a conveyance device that can reduce costs and save space.SOLUTION: A conveyance portion 20 and an installation portion 21 are separated from each other as different mechanisms. The conveyance portion 20 can adopt a simple configuration required for conveying a target substrate 50, and the installation portion 21 can adopt a simple configuration required for installing the target substrate 50 in an installation unit 3. Each of the conveyance portion 20 and the installation portion 21 is configured to have a simple structure corresponding to required specifications, which enables cost reduction. In addition, since the conveyance portion 20 and the installation portion 21 have a simple configuration and are separated from each other, it is possible to dispose the portions with high flexibility. Thus, space can be saved.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a conveying device.

Background Art

[0002] As a conventional radioactive isotope production system, the one described in Patent Document 1 is known. In this radioactive isotope production system, a solid target is held by a target device at the position of an irradiation port for a particle beam.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Here, in a radioactive isotope production system, there may be provided a transport mechanism for transporting and installing a target substrate with respect to an irradiation port. Here, when the transport mechanism installs the target substrate at the irradiation port, a large pressing structure is required because a predetermined pressing force is necessary. In addition, when the transport mechanism takes out the target substrate transported by the transport unit and transports it to the irradiation port by an operation such as turning, the transport mechanism is required to have strength against a large radial load. When the transport mechanism attempts to satisfy these requirements for the pressing structure and the strength, there is a problem that the structure becomes complicated and large-scale, resulting in an increase in cost and an increase in the installation space.

[0005] One aspect of the present invention has been made to solve such problems, and an object thereof is to provide a conveying device capable of reducing costs and saving space.

Means for Solving the Problems

[0006] A transport device according to one embodiment of the present invention is a transport device that transports a target substrate during processes related to the production of radioisotopes. The transport device includes a transport unit that transports the target substrate from the position of a transport unit that transports the target substrate to the position of an installation unit that installs the target substrate, and an installation unit that installs the target substrate on the installation unit. The transport unit and the installation unit are separated as different mechanisms from each other.

[0007] The transport device includes a transport unit that transports the target substrate from the position of a transport unit that transports the target substrate to the position of an installation unit that installs the target substrate, and an installation unit that installs the target substrate on the installation unit. Here, the transport unit and the installation unit are separated as different mechanisms from each other. Therefore, the transport unit can adopt a simple configuration necessary for transporting the target substrate, and the installation unit can adopt a simple configuration necessary for installing the target substrate on the installation unit. In this way, by adopting a simple structure according to the specifications required for each of the transport unit and the installation unit, the cost can be reduced. In addition, by separating the transport unit and the installation unit into simple configurations, a highly flexible arrangement becomes possible. As a result, space can be saved. From the above, it is possible to reduce the cost and save space.

[0008] The installation unit presses the target substrate in a first direction against the installation unit, and the position where the transport unit takes out the target substrate from the transport unit may be separated from the installation unit in a second direction that intersects the first direction. In this way, by arranging the position where the transport unit takes out the target substrate at a position shifted from the installation unit, it is possible to suppress water from entering the transport unit when liquid leakage of cooling water occurs in the installation unit.

[0009] The setting unit has a pressing mechanism for setting the target substrate on the setting unit by pressing the target substrate against the setting unit, and the pressing mechanism may be provided in the setting unit as a mechanism separated from the conveying unit. In this case, the pressing mechanism can be configured appropriately according to the required specifications without considering the conveying function.

[0010] The conveying unit may have a turning mechanism for turning the target substrate during conveyance. When attempting to give the setting unit a turning function, as the turning radius increases, an excessive radial load is applied to the setting unit, necessitating an unnecessary increase in strength. Therefore, separating the conveying unit and the setting unit can suppress an unnecessary increase in the strength of the setting unit.

[0011] The irradiation system according to one aspect of the present invention includes the above-described conveying device and an irradiation unit that irradiates a particle beam onto a target substrate installed in the installation unit.

[0012] The irradiation method according to one aspect of the present invention uses the above-described conveying device to irradiate a particle beam onto a target substrate installed in the installation unit.

[0013] According to such an irradiation system and irradiation method, the same functions and effects as those of the above-described conveying device can be obtained.

Effects of the Invention

[0014] According to one embodiment of the present invention, it is possible to provide a conveying device that can reduce costs and save space.

Brief Description of the Drawings

[0015]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Mode for Carrying Out the Invention

[0016] Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. In each figure, the same or corresponding parts are denoted by the same reference numerals, and redundant descriptions are omitted.

[0017] FIG. 1 is a block diagram showing an RI manufacturing system 200 including a transfer device 1 according to this embodiment. FIG. 2 is a view showing a target substrate 50 held by a holder 51. The RI manufacturing system 200 is a system for manufacturing and purifying RI (Radio Isotope) using the target substrate 50. The RI manufacturing system 200 performs predetermined processing using the transfer device 1 that transfers the target substrate 50 between processes related to the manufacture of RI.

[0018] First, with reference to FIG. 2, the target substrate 50 will be described. The target substrate 50 is a member having a layer of a target material 52 formed on its surface. In the present embodiment, the target substrate 50 is an oval plate material, but the shape is not particularly limited. As the material of the target substrate 50, a material that is not dissolved in a dissolving solution is adopted, and for example, Au, Pt, etc. may be adopted. As the target material 52, for example, bismuth, etc. may be mentioned. As the RI generated corresponding to the target material 52, 211At, etc. may be mentioned. Note that the target material 52 and the RI to be purified are not particularly limited, and other RIs may be generated. The target material 52 is formed in a layer by plating or the like at the central position of one main surface of the target substrate 50. When the target material 52 is irradiated with a particle beam, RI is generated. Note that the particles of the particle beam to be irradiated are, for example, protons, deuterons, alpha particles or 3 He, etc. The holder 51 is a member for holding the target substrate 50. The holder 51 has an oval shape similar to that of the target substrate 50 and is configured as a plate material having a larger thickness than the target substrate 50. Depending on each process, the target substrate 50 is processed while being held by the holder 51 and is processed while being removed from the holder 51.

[0019] As shown in FIG. 1, the RI production system 200 includes a plating apparatus 201, an RI production apparatus 202, and an RI purification apparatus 203.

[0020] The plating apparatus 201 is an apparatus for forming the target material 52 on the target substrate 50 by plating. The target substrate 50 that has been plated by the plating apparatus 201 is transported to the RI production apparatus 202 while being held by the holder 51. Note that after the target material 52 is dissolved by the RI purification apparatus 203, by forming the target material 52 on the target substrate 50, RI can be produced again by the RI production apparatus 202.

[0021] The RI manufacturing apparatus 202 is an apparatus for manufacturing RI using the target substrate 50. The RI manufacturing apparatus 202 is constituted by an accelerator (cyclotron) having an irradiation port for a particle beam or the like. In the RI manufacturing apparatus 202, the target substrate 50 held by the holder 51 is installed at the irradiation port. The RI manufacturing apparatus 202 irradiates the target material 52 of the target substrate 50 installed at the irradiation port with a particle beam. As a result, RI is generated at the location of the target material 52 irradiated with the particle beam. Note that the RI manufacturing apparatus 202 has a transfer device 1 that transfers the transported target substrate 50 to the irradiation port. A detailed description of the transfer device 1 will be given later.

[0022] The RI purification apparatus 203 is an apparatus for purifying and extracting RI from the target substrate 50 after particle beam irradiation. The RI purification apparatus 203 dissolves the target material 52 containing RI of the target material 52. The RI purification apparatus 203 dissolves the target material 52 by putting the target substrate 50 removed from the holder 51 into a tank. The RI purification apparatus 203 purifies high-purity RI by extracting RI from the solution.

[0023] Next, the irradiation system 250 and the transfer device 1 according to the present embodiment will be described in detail with reference to FIGS. 3 and 4. For convenience of explanation, an XYZ coordinate system is set for the explanation. The Y-axis direction is a direction orthogonal to the X-axis direction. The Z-axis direction is a direction orthogonal to the X-axis direction and the Y-axis direction. FIG. 3 is a view of the irradiation system 250 as seen from the positive side to the negative side in the Y-axis direction. FIG. 4 is a view of the irradiation system 250 as seen from the negative side to the positive side in the Z-axis direction. As shown in FIGS. 3 and 4, the irradiation system 250 includes a transfer device 1, a transport unit 2, and an installation unit 3.

[0024] The transport unit 2 is a unit that transports the target substrate 50 from another location to the vicinity of the installation unit 3. As shown in FIG. 4, the transport unit 2 includes an air conveyance pipe 4, an end position 6, and an orientation correction unit 7. The transport unit 2 transports the target substrate 50 with the holder 51 holding the target substrate 50 fixed to the air carrier 8. The air conveyance pipe 4 is a tubular member that transports the air carrier 8 accommodated therein using the force of gas. The air conveyance pipe 4 extends from the position where the previous process (for example, plating treatment in the plating apparatus 201) is performed to the position of the transfer device 1. In the range shown in FIG. 4, it extends from the negative side to the positive side in the Y-axis direction. The end position 6 is provided at the tip of the air conveyance pipe 4. At the end position 6, the target substrate 50 fixed to the air carrier 8 can be taken out together with the holder 51. The orientation correction unit 7 corrects the orientation of the target substrate 50 at the end position 6. The posture of the target substrate 50 rotates during transportation by the air conveyance pipe 4. Therefore, the orientation correction unit 7 corrects the orientation of the target substrate 50 at the end position 6 so that the transfer device 1 can easily hold it. As a result, the opening 8a of the air carrier 8 is corrected to open toward the negative side in the X-axis direction. Therefore, the transfer device 1 can take out the target substrate 50 from the end position 6 from the positive side to the negative side in the X-axis direction.

[0025] The setting unit 3 is a unit for setting the target substrate 50. As shown in FIG. 4, in the present embodiment, the setting unit 3 is constituted by an irradiation port 10 (irradiation unit) for irradiating the set target substrate 50 with the particle beam B. The irradiation port 10 is arranged at a position separated to the negative side in the X-axis direction and separated to the positive side in the Z-axis direction (see FIG. 3) with respect to the end position 6 of the transport unit 2. Further, the opening 10a of the irradiation port 10 is formed to open to the positive side in the X-axis direction. The internal space SP of the irradiation port 10 expands toward the positive side in the Y-axis direction. The particle beam B is irradiated from the positive side to the negative side in the Y-axis direction in the internal space SP. The target substrate 50 is in a state of being exposed to the internal space SP when installed at the position of the opening 10a of the irradiation port 10. Therefore, the particle beam B is irradiated onto the target substrate 50. Note that the target substrate 50 is slightly inclined so as to incline toward the positive side in the X-axis direction as it advances toward the positive side in the Y-axis direction with respect to the Y-axis direction so that the irradiation is performed. Therefore, the end position 6 of the transport unit 2 and the transfer device 1 are also slightly inclined with respect to the Y-axis direction in accordance with the inclination. Among the end faces on the positive side in the X-axis direction of the irradiation port 10, the vicinity of the opening 10a is configured as the installation surface 10b of the holder 51 of the target substrate 50 (see also FIG. 3).

[0026] Next, the transfer device 1 will be described. The transfer device 1 is a transfer device that transfers the target substrate 50 between processes related to the production of radioisotopes. In the present embodiment, the transfer device 1 transfers the target substrate 50 between the RI production process in the RI production device 202 and the pre-process of the RI production (for example, plating treatment in the plating device 201). The transfer device 1 includes a transfer unit 20 and an installation unit 21. The transfer unit 20 and the installation unit 21 are separated as different mechanisms. That is, the transfer unit 20 and the installation unit 21 are constituted by separate component parts and are provided at different positions. Note that the transfer unit 20 and the installation unit 21 are provided on a plate-shaped base member 15 that extends in the XZ direction (see FIG. 4).

[0027] As shown in FIG. 3, the transport unit 20 transports the target substrate 50 together with the holder 51 from the end position 6 of the transport unit 2 to the position of the installation surface 10b of the irradiation port 10 of the installation unit 3. The transport unit 20 includes a Z-axis guide unit 22, a slider unit 23, a support unit 24, an arm unit 26, and a chuck unit 27. The Z-axis guide unit 22 is a member that guides the slider unit 23 in the Z-axis direction. The Z-axis guide unit 22 is disposed at a position between the end position 6 of the transport unit 2 and the irradiation port 10 of the installation unit 3 in the X-axis direction. The Z-axis guide unit 22 extends in the Z-axis direction, extends to the negative side in the Z-axis direction from the end position 6 of the transport unit 2, and extends to the positive side in the Z-axis direction from the installation surface 10b of the irradiation port 10.

[0028] The slider unit 23 is a member that reciprocates in the Z-axis direction along the Z-axis guide unit 22. A support unit 24, an arm unit 26, and a chuck unit 27 are provided on the slider unit 23. These members move as the slider unit 23 moves. The support unit 24 is connected to the upper surface of the slider unit 23 and supports the chuck unit 27 via the arm unit 26. The arm unit 26 is a member that extends from the support unit 24 to one side (the negative side in the X-axis direction in FIG. 3) in the X-axis direction. The arm unit 26 can move the chuck unit 27 in the X-axis direction with respect to the support unit 24 by expanding and contracting. The chuck unit 27 is a member provided at the tip of the arm unit 25 and can hold the target substrate 50 via the holder 51. The chuck unit 27 holds the holder 51 by sandwiching it from both sides.

[0029] The transport unit 20 has a turning mechanism 29 for turning the target substrate 50 during transport (see FIG. 4). The turning mechanism 29 is provided between the slider unit 23 and the support unit 24. The turning mechanism 29 turns the support unit 24, the arm unit 26, and the chuck unit 27 in the turning direction RD as viewed from the Y-axis direction (the direction shown in FIG. 3). Thereby, the transport unit 20 can move the target substrate 50 held by the chuck unit 27 on the positive side in the X-axis direction from the Z-axis guide unit 22 to the negative side in the X-axis direction from the Z-axis guide unit 22 by turning (see FIG. 6).

[0030] The setting unit 21 sets the target substrate 50 on the setting unit 3. The setting unit 21 is arranged at a position separated to the positive side in the X-axis direction from the Z-axis guide unit 22 of the transfer unit 20, and is arranged at a position separated to the positive side in the Z-axis direction from the end position 6 of the transport unit 2. Further, the setting unit 21 is arranged to face at a position separated to the positive side in the X-axis direction with respect to the installation surface 10b of the irradiation port 10. The setting unit 21 includes a pressing mechanism 30 and a cooling mechanism 31.

[0031] The pressing mechanism 30 is a mechanism that installs the target substrate 50 on the irradiation port 10 by pressing the target substrate 50 against the irradiation port 10 of the setting unit 3. The pressing mechanism 30 is a mechanism provided in the setting unit 21 as a mechanism separated from the transfer unit 20. That is, the pressing mechanism 30 is formed by a component separated from each component of the transfer unit 20. The pressing mechanism 30 includes a cylinder unit 32, a rod unit 33, and a pressing unit 34.

[0032] The cylinder part 32 is a member that supports the rod part 33 so that it can move forward and backward. The cylinder part 32 is a member extending in the X-axis direction. The rod part 33 is a rod-shaped member protruding from the end part 32a on the negative side in the X-axis direction of the cylinder part 32. The rod part 33 reciprocates inside the cylinder part 32, so that the protruding amount from the end part 32a of the cylinder part 32 expands and contracts. The pressing part 34 presses the holder 51 of the target substrate 50 against the installation surface 10b of the irradiation port 10. The pressing part 34 is provided at the negative-side end in the X-axis direction of the rod part 33. Therefore, when the protruding amount from the end part 32a of the rod part 33 increases, the pressing part 34 moves to the negative side in the X-axis direction and extends to the vicinity of the installation surface 10b of the irradiation port 10. Thereby, the pressing part 34 can press the target substrate 50 against the irradiation port 10 (see Fig. 7). When the protruding amount from the end part 32a of the rod part 33 decreases, the pressing part 34 moves to the positive side in the X-axis direction (see Figs. 5 and 6). A pressing surface 34a for pressing the holder 51 is formed on the negative side in the X-axis direction of the pressing part 34. Note that the pressing part 34 is arranged on the positive side in the Y-axis direction rather than the Z-axis guide part 22. Therefore, even when the pressing part 34 extends to the irradiation port 10, the pressing part 34 can avoid interference with the Z-axis guide part 22.

[0033] The cooling mechanism 31 is a mechanism for cooling the target substrate 50 installed in the irradiation port 10. The cooling mechanism 31 is constituted by a flow path for a cooling medium formed in the pressing surface 34a. A cooling medium flows through the flow path of the cooling mechanism 31 between an inlet part and an outlet part (not shown). Therefore, the holder 51 pressed by the pressing surface 34a is cooled. As a result, the target substrate 50 can be cooled via the holder 51.

[0034] According to the structure as described above, the installation part 21 presses the target substrate 50 in the X-axis direction (the first direction) against the installation unit 3. The position (end position 6) where the transfer part 20 takes out the target substrate 50 from the transport unit 2 is separated from the installation part 21 in the Z-axis direction orthogonal to the X-axis direction. The position (end position 6) where the transfer part 20 takes out the target substrate 50 from the transport unit 2 is arranged at a position shifted to the negative side in the Z-axis direction from the installation part 21 and the irradiation port 10.

[0035] Next, the operation of the transfer device 1 will be described with reference to FIGS. 5 to 7. FIG. 5 shows a state when the target substrate 50 reaches the end position 6 of the transport unit 2. At this time, the transfer part 20 of the transfer device 1 moves the chuck part 27 to a position corresponding to the end position 6 in the Z-axis direction. Further, the transfer part 20 turns the chuck part 27 to the positive side in the X-axis direction from the Z-axis guide part 22. Then, the transfer part 20 moves the chuck part 27 to the positive side in the X-axis direction to hold the holder 51 at the end position 6. After the transfer part 20 holds the holder 51 with the chuck part 27 at the end position 6, the chuck part 27 is moved to the negative side in the X-axis direction to take out the target substrate 50 together with the holder 51 from the end position 6. Next, the transfer part 20 turns the chuck part 27 and the target substrate 50. Thereby, the transfer part 20 moves the chuck part 27 and the target substrate 50 to the negative side in the X-axis direction from the Z-axis guide part 22. The chuck part 27 at this time is arranged at the position shown in FIG. 3.

[0036] Next, the transfer unit 20 moves the chuck unit 27 holding the target substrate 50 in the positive direction in the Z-axis direction, and moves the target substrate 50 to the far side of the installation surface 10b of the irradiation port 10. The transfer unit 20 moves the target substrate 50 held by the chuck unit 27 together with the holder 51 in the negative direction in the X-axis direction. As a result, as shown in FIG. 6, the transfer unit 20 can temporarily place the target substrate 50 on the irradiation port 10. At this time, the flange portion of the holder 51 is arranged to contact the installation surface 10b. After temporarily placing the target substrate 50 on the irradiation port 10, the transfer unit 20 returns to its original state (the state of the transfer unit 20 shown in FIGS. 3 and 7).

[0037] Next, the installation unit 21 presses the holder 51 against the installation surface 10b by moving the pressing unit 34 in the negative direction in the X-axis direction. As a result, as shown in FIG. 7, the installation unit 21 completes the state in which the target substrate 50 is installed on the irradiation port 10. Further, the installation unit 21 cools the target substrate 50 via the holder 51 by the cooling mechanism 31. In this state, in the irradiation port 10, the target substrate 50 is irradiated with the particle beam B (see FIG. 4). The transfer unit 20 collects the target substrate 50 irradiated with the particle beam B and returns it to the transport unit 2. The target substrate 50 is transported by the transport unit 2 to the next process location such as the RI purification device 203.

[0038] Next, the operations and effects of the transfer device 1, the irradiation system 250, and the irradiation method according to the present embodiment will be described.

[0039] FIG. 8 is a diagram showing an irradiation system 300 according to a comparative example. In the irradiation system 300 according to the comparative example, the transfer device 301 has both a transfer function and an installation function. The transfer device 301 presses the target substrate 50 toward the negative side in the X-axis direction with respect to the irradiation port 302. The air supply pipe 310 of the transport unit 303 is arranged to extend in the X-axis direction at a position spaced from the irradiation port 302 toward the negative side in the Y-axis direction. The transfer device 301 extends toward the negative side in the Y-axis direction and takes out the target substrate 50 from the end position 311 of the transport unit 303. Then, the transfer device 301 turns the target substrate 50 in the turning direction RD and installs the target substrate 50 at the irradiation port 302. When the transfer device 301 installs the target substrate 50 at the irradiation port 302, a large pressing structure is required because a pressing force considering the crushing force of the O-ring, the cooling water circulation pressure, the weight of the target substrate 50, the weight of the piping, etc. is necessary. In addition, since the transfer device 301 takes out the target substrate 50 transported by the transport unit 303 and performs a turning operation, the transfer device 301 is required to have a high strength against a large radial load. In an attempt to meet these requirements for the pressing structure and strength, the transfer device 301 has a problem that the structure becomes complex and large-scale, resulting in an increase in cost and an increase in the installation space.

[0040] Here, in order to perform the operation of the transfer device 301 as described above, the irradiation port 302 and the end position 311 need to be at the same position in the Z-axis direction. Here, a cooling structure for cooling the target substrate 50 exists in the pressing portion of the transfer device 301. Therefore, when the positive side in the Y-axis direction is the upward direction, if water leakage occurs in the cooling structure, the cooling water W may mix into the transport unit 303. When such mixing occurs, water accumulation may form in the air supply pipe 310 that is out of reach. Such water accumulation in the air supply pipe 310 hinders the transport of the target substrate 50 and causes clogging. As a result, a high-dose target substrate 50 remains in the air supply pipe 310. Further, even if water mixing is detected before transport, since the transport unit 303 cannot be used, the high-dose target substrate 50 is attached to the irradiation port 302. In this case, it is necessary to wait for the attenuation of the dose (half-life is 7.2 h), and it takes time to recover. For example, by setting the X-axis direction as the vertical direction, a positional relationship in which water is less likely to mix into the transport unit 303 can be achieved, but the versatility is reduced.

[0041] On the one hand, the transfer device 1 according to the present embodiment includes a transfer unit 20 that transfers the target substrate 50 from the position of the transport unit 2 that transports the target substrate 50 to the position of the installation unit 3 that installs the target substrate 50, and an installation unit 21 that installs the target substrate 50 on the installation unit 3. Here, the transfer unit 20 and the installation unit 21 are separated as different mechanisms from each other. For this reason, the transfer unit 20 can adopt a simple configuration necessary for transferring the target substrate 50, and the installation unit 21 can adopt a simple configuration necessary for installing the target substrate 50 on the installation unit 3. In the irradiation system 250 according to the comparative example, since the transfer device 301 attempts to have both a transfer function and an installation function, it is necessary to have excessive specifications from the perspective of each function, resulting in an increase in cost. In contrast, in the present embodiment, the cost can be reduced by adopting a simple structure according to the specifications required for each of the transfer unit 20 and the installation unit 21. Further, by separating the transfer unit 20 and the installation unit 21 into simple configurations, a highly flexible arrangement becomes possible. Thereby, space saving can be achieved. From the above, it is possible to reduce the cost and achieve space saving.

[0042] The installation unit 21 presses the target substrate 50 in the X-axis direction (first direction) against the installation unit 3, and the position where the transfer unit 20 takes out the target substrate 50 from the transport unit 2 may be separated from the installation unit 21 in the Z-axis direction (second direction) intersecting the X-axis direction. In this way, by arranging the position where the transfer unit 20 takes out the target substrate 50 at a position shifted from the installation unit 21, it is possible to suppress water from entering the transport unit 2 when liquid leakage of cooling water occurs in the installation unit 21. Further, according to such a configuration, since water ingress can be suppressed regardless of the orientation of the irradiation port 10, the versatility of the system can be improved.

[0043] The setting unit 21 has a pressing mechanism 30 for pressing the target substrate 50 against the installation unit 3 to install the target substrate 50 on the installation unit 3. The pressing mechanism 30 may be provided in the setting unit 21 as a mechanism separated from the conveying unit 20. In this case, the pressing mechanism 30 can be configured appropriately according to the required specifications without considering the conveying function.

[0044] The conveying unit 20 may have a turning mechanism 29 for turning the target substrate 50 during conveyance. If the setting unit 21 is to be given a turning function, the turning radius becomes large, resulting in an excessive radial load being applied to the setting unit 21 and necessitating an unnecessary increase in strength. Therefore, by separating the conveying unit 20 and the setting unit 21, it is possible to suppress an unnecessary increase in the strength of the setting unit 21.

[0045] The irradiation system 250 according to this embodiment includes the above-described conveying device 1 and an irradiation port 10 (irradiation unit) for irradiating a particle beam onto the target substrate 50 installed on the installation unit 3.

[0046] The irradiation method according to this embodiment uses the above-described conveying device 1 to irradiate a particle beam onto the target substrate 50 installed on the installation unit 3.

[0047] According to such an irradiation system 250 and irradiation method, the same operations and effects as those of the above-described conveying device 1 can be obtained.

[0048] The present invention is not limited to the above-described embodiments.

[0049] For example, the arrangements and configurations of the transport unit 2, installation unit 3, conveying unit 20, and setting unit 21 in the above-described embodiments are merely examples and can be appropriately changed without departing from the gist of the present invention.

Explanation of Reference Numerals

[0050] 1... Transfer device, 2... Conveying unit, 3... Installation unit, 20... Conveying section, 21... Installation section, 29... Swivel mechanism, 30... Pressing mechanism, 50... Target substrate, 250... Irradiation system.

Claims

1. A transfer device for transferring a target substrate during processes related to the production of radioisotopes, comprising: a transfer section for transferring the target substrate from the position of a transport unit that transports the target substrate to the position of an installation unit that installs the target substrate; an installation section for installing the target substrate on the installation unit; and the transfer device, wherein the transfer section and the installation section are separated as different mechanisms from each other.

2. The installation section presses the target substrate in a first direction against the installation unit, and the position where the transfer section takes out the target substrate from the transport unit is separated from the installation section in a second direction intersecting the first direction. The transfer device according to Claim 1.

3. The installation section has a pressing mechanism for installing the target substrate on the installation unit by pressing the target substrate against the installation unit, and the pressing mechanism is provided in the installation section as a mechanism separated from the transfer section. The transfer device according to Claim 1.

4. The transfer device according to Claim 1, wherein the transfer section has a turning mechanism for turning the target substrate during transfer.

5. An irradiation system comprising the transfer device according to any one of Claims 1 to 4, and an irradiation section for irradiating a particle beam onto the target substrate installed on the installation unit.

6. An irradiation method using the transfer device according to any one of Claims 1 to 4 to irradiate a particle beam onto the target substrate installed on the installation unit.

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