Sensor module and electronic apparatus

Abstract

To provide a sensor module that can improve the accuracy and reliability of failure determination.SOLUTION: A sensor module 100 of the present embodiment comprises: an outer case 50 and / or an inner case 30; a substrate 21 provided in the outer case 50 and / or the inner case 30; a plurality of accelerator sensor devices 1a, 1b, 1c, 1d provided on the substrate 21; and a plurality of angular velocity sensor devices 2a, 2b, 2c provided on the substrate 21. The plurality of accelerator sensor devices 1a, 1b, 1c, 1d are provided in a first region R1 including the center of the substrate 21 in plan view, and the plurality of angular velocity sensor devices 2a, 2b, 2c are provided in a second region R2 located outside the first region R1 in plan view.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present invention relates to a sensor module and an electronic device.

Background Art

[0002] A physical quantity measuring device that includes a plurality of inertial sensors, compares output values from each inertial sensor, and determines a failure of the inertial sensor based on the comparison result is described in Patent Document 1.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Such a physical quantity measuring device can continue to output appropriate physical quantity data by performing processing such as not using the physical quantity data of the inertial sensor determined to have failed. In other words, in order to improve the appropriateness of the output physical quantity data, it is necessary to further improve the accuracy and reliability of the failure determination.

Means for Solving the Problems

[0005] A sensor module according to one aspect of the present application includes a housing, a substrate provided in the housing, a plurality of acceleration sensor devices provided on the substrate, and a plurality of angular velocity sensor devices provided on the substrate. The plurality of acceleration sensor devices are provided in a first region including the center of the substrate in a plan view, and the plurality of angular velocity sensor devices are provided in a second region located outside the first region in a plan view.

[0006] A sensor module according to an aspect of the present application includes a housing, a first substrate and a second substrate provided in the housing, a plurality of acceleration sensor devices provided on the first substrate and the second substrate, and a plurality of angular velocity sensor devices provided on the first substrate and the second substrate. The plurality of acceleration sensor devices are provided in a first region including the center of the first substrate and the center of the second substrate in a plan view.

[0007] An electronic device according to an aspect of the present application includes the sensor module described above.

Brief Description of the Drawings

[0008]

Figure 1

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Figure 16

Mode for Carrying Out the Invention

[0009] In each drawing, for the purpose of making each component easy to view, the dimensional scales may be shown differently depending on the component. In each drawing, the X-axis, Y-axis, and Z-axis are orthogonal to each other. In the following description, the "X-axis direction" shall indicate the direction parallel to the X-axis, the "Y-axis direction" shall indicate the direction parallel to the Y-axis, and the "Z-axis direction" shall indicate the direction parallel to the Z-axis. In the following description, the "plus side" shall indicate the tip side in the arrow direction of each axis of XYZ, and the "minus side" shall indicate the end side in the arrow direction. In the following description, "plan view" shall mean viewing from the Z-axis direction with respect to the plane including the X-axis and Y-axis.

[0010] In the following description, the description of the upper surface of a certain structure shall indicate the surface on the plus side in the Z-axis direction of the said structure. For example, the "upper surface of the substrate" shall indicate the surface on the plus side in the Z-axis direction of the substrate. In the following description, the description of the lower surface of a certain structure shall indicate the surface on the minus side in the Z-axis direction of the said structure.

[0011] 1. Embodiment 1 FIGS. 1 to 14 show the sensor module 100 according to Embodiment 1. FIG. 1 is a perspective view showing a state in which the sensor module 100 is fixed to a mounted surface 71 such as an automobile. FIG. 2 is a perspective view showing a state in which the sensor module 100 of FIG. 1 is viewed from the side of the mounted surface 71. FIG. 3 is an exploded perspective view of the sensor module 100. FIG. 4 is a perspective view of the substrate unit 20. FIG. 5 is a rear perspective view of the substrate unit 20 of FIG. 4 viewed from the negative Z-axis direction. FIG. 6 is a graph showing the relationship between the distance between the arrangement positions of the acceleration sensor devices and the difference in output values. FIG. 7 is a perspective view of the substrate unit 20 according to Modification 1. FIG. 8 is a rear perspective view of the substrate unit 20 according to Modification 1 of FIG. 7 viewed from the negative Z-axis direction. FIG. 9 is a perspective view of the substrate unit 20 according to Modification 2. FIG. 10 is a developed view of the substrate unit 20 according to Modification 2 of FIG. 9. FIG. 11 is a perspective view of the substrate unit 20 according to Modification 3. FIG. 12 is a block diagram showing the system configuration of the sensor module 100. FIG. 13 is a flowchart showing the system operation of the sensor module 100. FIG. 14 is a flowchart showing the details of the state determination process of the flowchart of FIG. 13.

[0012] In the present embodiment, the sensor module 100 is an inertial measurement unit (IMU) that detects the posture and behavior of a mounted device such as an automobile or a robot. Here, the mounted device can be referred to as a moving body. The behavior can be referred to as inertial momentum. The inertial measurement unit can be referred to as a physical quantity measurement device.

[0013] As shown in FIG. 1, the sensor module 100 has an outer case 50 having a substantially square planar shape and a rectangular parallelepiped three-dimensional shape. The size of the sensor module 100 is, for example, about 24 mm in length of one side of the square and about 10 mm in thickness.

[0014] Inside the outer case 50, a substrate unit 20 on which a plurality of sensor devices are mounted is housed. The substrate unit 20 will be described later. On the lower surface 58 of the outer case 50, screw holes 52 are formed. By passing screws 70 through these two screw holes 52, the sensor module 100 is fixed and used on the mounting surface 71 of a mounted device such as an automobile.

[0015] As shown in FIG. 2, an inner case 30 is housed inside the upper surface 57 of the outer case 50. The inner case 30 houses the substrate unit 20. An opening 31 is formed on the upper surface 34 of the inner case 30. Inside the opening 31, a plug-type connector 15 is arranged. In this way, the outer case 50 and the inner case 30 house the substrate unit 20. In the present embodiment, the outer case 50 and / or the inner case 30 is an example of a housing.

[0016] The connector 15 has a plurality of pins. A socket-type connector (not shown) from the mounted device is connected to the connector 15. The sensor module 100 is supplied with power from the power circuit of the mounted device via the connector 15 and transmits electrical signals such as detection data to the mounted device.

[0017] 1.1. Configuration of the sensor module FIG. 3 is an exploded perspective view of the sensor module 100 shown in FIG. 2. As shown in FIG. 3, the sensor module 100 is composed of an outer case 50 and a sensor unit 10 housed in the outer case 50. The sensor unit 10 is composed of an inner case 30 and a substrate unit 20 housed in the inner case 30.

[0018] The outer case 50 is a pedestal cut out in a box shape from aluminum. The material is not limited to aluminum, and other metals such as zinc and stainless steel, resin, or a composite material of metal and resin may be used.

[0019] The outer case 50 is a box shape without a lid, and its inner side 53 serves as a storage space for the sensor unit 10 surrounded by the side wall 54, the bottom surface 55, and the joint surface 56. The sensor unit 10 is joined to the joint surface 56 of the outer case 50 via the joint member 310.

[0020] The sensor unit 10 is composed of an inner case 30 and a substrate unit 20. The inner case 30 is a member that holds the substrate unit 20 and is shaped to fit inside the inner side 53 of the outer case 50. In plan view, the inner case 30 is an octagon with the corners of the four vertices of a square chamfered, and has an opening 31 penetrating the upper surface 34 and a recess 33 on the lower surface.

[0021] The height of the side wall 32 of the inner case 30 is lower than the height of the side wall 54 of the outer case 50, and as shown in FIG. 2, the upper surface 34 of the inner case 30 is lower than the upper surface 57 of the outer case 50. Although not shown, guide pins and support surfaces for positioning the substrate unit 20 are formed inside the inner case 30. The substrate unit 20 is positioned by the guide pins and support surfaces and is fixed inside the inner case 30 by a joint member.

[0022] 1.2. Configuration of the substrate unit FIG. 4 is a perspective view of the substrate unit 20 viewed from the plus side in the Z-axis direction, and FIG. 5 is a perspective view of the substrate unit 20 viewed from the minus side in the Z-axis direction. As shown in FIGS. 4 and 5, in the present embodiment, the substrate unit 20 includes a substrate 21, a plurality of acceleration sensor devices 1a, 1b, 1c, 1d provided on the substrate 21, a plurality of angular velocity sensor devices 2a, 2b, 2c provided on the substrate 21, an arithmetic circuit 14, a connector 15, a memory 16, a notification unit 17, and a temperature sensor 18 provided on the substrate 21.

[0023] The substrate 21 is a rigid substrate called a rigid board, specifically, a glass epoxy substrate. The substrate 21 may be a rigid board such as a composite substrate or a ceramic substrate. The substrate 21 may have either a multilayer or a single-layer structure.

[0024] The acceleration sensor devices 1a, 1b, 1c, and 1d are three-axis acceleration sensor devices that detect the acceleration in the X-axis direction, the acceleration in the Y-axis direction, and the acceleration in the Z-axis direction, respectively. The acceleration sensor devices 1a, 1b, 1c, and 1d are not limited to three-axis acceleration sensor devices. For example, the acceleration sensor devices 1a, 1b, 1c, and 1d may be single-axis acceleration sensors that detect only the acceleration in the Z-axis direction or two-axis acceleration sensor devices that detect the acceleration in the X-axis direction and the Y-axis direction, respectively.

[0025] The acceleration sensor devices 1a, 1b, 1c, and 1d are capacitance-type acceleration sensor devices that use silicon MEMS (Micro Electro Mechanical Systems) technology, respectively. The acceleration sensor devices 1a, 1b, 1c, and 1d may be, for example, piezoresistive acceleration sensors, thermal detection acceleration sensors, or frequency change type crystal acceleration sensors.

[0026] The angular velocity sensor device 2a is an angular velocity sensor device that detects the angular velocity around the X-axis. The angular velocity sensor device 2b is an angular velocity sensor device that detects the angular velocity around the Y-axis. The angular velocity sensor device 2c is an angular velocity sensor device that detects the angular velocity around the Z-axis.

[0027] The angular velocity sensor devices 2a, 2b, and 2c are capacitance-type angular velocity sensor devices each having a silicon MEMS oscillator using silicon MEMS technology. As the angular velocity sensor devices 2a, 2b, and 2c, for example, angular velocity sensor devices having a piezoelectric type oscillator such as a crystal oscillator can also be used.

[0028] The arithmetic circuit 14 is the primary controller for the acceleration sensor devices 1a, 1b, 1c, 1d and the angular velocity sensor devices 2a, 2b, 2c. The arithmetic circuit 14 is an integrated circuit device and can be realized by a processor such as an MPU (Micro Processor Unit) or a CPU (central processing unit). The arithmetic circuit 14 includes a digital interface. The digital interface is a circuit that performs digital interface processing based on a communication standard such as SPI or I2C.

[0029] The arithmetic circuit 14 receives the detection data output from the acceleration sensor devices 1a, 1b, 1c, 1d and the angular velocity sensor devices 2a, 2b, 2c, performs various processes, and transmits the processed detection data to the outside via the connector 15. The various processes performed by the arithmetic circuit 14 include the process of performing state determination described later. In addition, the various processes include the process of obtaining the average value of the detection data of the acceleration in the X-axis direction from the acceleration sensor devices 1a, 1b, 1c, 1d, the process of obtaining the average value of the detection data of the acceleration in the Y-axis direction, and the process of obtaining the average value of the detection data of the acceleration in the Z-axis direction, the process of obtaining the average value of the detection data of the angular velocity around the X-axis from the angular velocity sensor devices 2a, 2b, 2c, the process of obtaining the average value of the detection data of the angular velocity around the Y-axis, and the process of obtaining the average value of the detection data of the angular velocity around the Z-axis, the process of performing temperature correction, zero point correction, etc. on the obtained average values, sensitivity adjustment processing, filter processing, and the process of outputting the processed data from the connector 15, etc.

[0030] The connector 15 is a plug-type connector and has two rows of connection terminals arranged at equal pitches in the Y-axis direction. In the present embodiment, the connector 15 has 20 connection terminals with 10 pins in one row, but the number of terminals may be appropriately changed according to the design specifications.

[0031] The memory 16 stores programs for executing various processes performed by the arithmetic circuit 14, programs for incorporating detection data after processing into packet data, and data necessary for the execution of the programs, such as table data used for temperature correction processing.

[0032] When the state determination process performed by the arithmetic circuit 14 detects that a failure has occurred in the acceleration sensor devices 1a, 1b, 1c, 1d or the angular velocity sensor devices 2a, 2b, 2c, the notification unit 17 notifies the occurrence of the failure. The notification unit 17 is, for example, a light source such as a speaker or an LED (Light Emitting Diode), and notifies the occurrence of the failure by sound or light. The temperature sensor 18 outputs temperature information used for temperature correction processing to the arithmetic circuit 14.

[0033] 1.2.1. Arrangement of Multiple Acceleration Sensor Devices As shown in FIG. 5, the acceleration sensor devices 1a, 1b, 1c, 1d, which are multiple acceleration sensor devices, are provided in a first region R1 including the center CS of the substrate 21 on the lower surface 21b of the substrate 21. The acceleration sensor device 1a and the acceleration sensor device 1b are provided at positions that are point-symmetrical with respect to the center CS, or at positions that are line-symmetrical with respect to a perpendicular line CL passing through the center CS and intersecting the substrate 21 at a right angle. Similarly, the acceleration sensor device 1c and the acceleration sensor device 1d are provided at positions that are point-symmetrical with respect to the center CS, or at positions that are line-symmetrical with respect to the perpendicular line CL.

[0034] In the present embodiment, all of the multiple acceleration sensor devices 1a, 1b, 1c, 1d are provided in the first region R1. In other words, in the present embodiment, there is no acceleration sensor device that is not provided in the first region R1. Here, that the acceleration sensor device is provided in the first region R1 means that at least a part of the acceleration sensor device is mounted in the first region R1.

[0035] The first region R1 is either the first region R1a or the first region R1b. The acceleration sensor devices 1a, 1b, 1c, 1d are provided in the first region R1a and / or the first region R1b.

[0036] The first region R1a is an area inside a circle with a predetermined radius r centered on the center CS of the substrate 21. In the present embodiment, the center CS can be defined as the point where the perpendicular line CL of the substrate 21 passing through the center CS intersects the lower surface 21b of the substrate 21. Therefore, in the present embodiment, the first region R1a including the center CS is an area on the lower surface 21b of the substrate 21 where the acceleration sensor devices 1a, 1b, 1c, 1d are mounted.

[0037] In the present embodiment, the diameter of the circle corresponding to the first region R1a is 5 mm. In other words, the predetermined radius r centered on the center CS of the substrate 21 is 2.5 mm. The outside of the first region R1a is the second region R2. The boundary line B1 indicates the boundary between the first region R1a and the second region R2.

[0038] In the present embodiment, the acceleration sensor devices 1a, 1b, 1c, 1d are mounted such that at least a part of them covers the first region R1a. In other words, the acceleration sensor devices 1a, 1b, 1c, 1d are mounted close to each other. Therefore, the sensor module 100 of the present embodiment can suppress the difference in output values generated due to the distance d between the mounting positions of the respective acceleration sensor devices 1a, 1b, 1c, 1d when a rotational motion is applied to the sensor module 100.

[0039] According to the findings of the inventors, the difference in output values generated due to the distance d between the mounting positions of such respective acceleration sensor devices 1a, 1b, 1c, 1d becomes more prominent when a rotational motion is applied to the sensor module 100 than when a translational motion is applied to the sensor module 100.

[0040] FIG. 6 is a graph showing the relationship between the distance d between the arrangement positions of the acceleration sensor devices 1a, 1b, 1c, and 1d and the difference in output values. As shown in FIG. 6, the acceleration difference as the difference in output values generated due to the distance d between the arrangement positions of the acceleration sensor devices 1a, 1b, 1c, and 1d increases in proportion to the distance d between the arrangement positions of the acceleration sensor devices 1a, 1b, 1c, and 1d.

[0041] For example, when a rotational motion of 450 dps (degree per second) is applied to the sensor module 100, the difference in output values is approximately 25 mG when the distance d between the acceleration sensor device 1a and the acceleration sensor device 1b is 4 mm, whereas it is approximately 50 mG when the distance d is 8 mm, and approximately 62 mG when the distance d is 10 mm. Here, 450 dps is the maximum value within the detection range of the angular velocity sensor devices 2a, 2b, and 2c.

[0042] Therefore, when the system is designed to determine a failure when the difference in output values of each of the acceleration sensor devices 1a, 1b, 1c, and 1d exceeds 62 mG, if the distance d between the acceleration sensor device 1a and the acceleration sensor device 1b is arranged to be 11 mm or more apart, the sensor module 100 may erroneously detect that a failure has occurred in the acceleration sensor devices 1a, 1b, 1c, and 1d.

[0043] However, in the present embodiment, since at least a part of the acceleration sensor devices 1a, 1b, 1c, and 1d is mounted so as to cover at least the first region R1a, when a rotational motion is applied to the sensor module 100, the difference in output values generated due to the distance d between the arrangement positions of each of the acceleration sensor devices 1a, 1b, 1c, and 1d can be suppressed. Therefore, when a rotational motion is applied to the sensor module 100, the possibility of erroneously detecting that a failure has occurred in the acceleration sensor devices 1a, 1b, 1c, and 1d can be suppressed, so that the accuracy and reliability of failure determination can be improved.

[0044] The first region R1b is a region within a range of one-half from the center CS of the substrate 21 to the edge of the substrate 21. The outside of the first region R1b is the second region R2, and the boundary line B2 indicates the boundary between the first region R1b and the second region R2, and is a line tracing the position of one-half of each straight line connecting the center CS of the substrate 21 to the edge of the substrate 21.

[0045] The acceleration sensor devices 1a, 1b, 1c, 1d are mounted inside the first region R1b, in other words, inside the boundary line B2. Therefore, when a rotational motion is applied to the sensor module 100, the difference in output values generated due to the distance d between the arrangement positions of the respective acceleration sensor devices 1a, 1b, 1c, 1d can be suppressed. Thus, when a rotational motion is applied to the sensor module 100, the possibility of erroneously detecting that a failure has occurred in the acceleration sensor devices 1a, 1b, 1c, 1d can be suppressed.

[0046] In terms of implementation, it is preferable that the distance d between the arrangement positions of the respective acceleration sensor devices 1a, 1b, 1c, 1d is set to 10 mm or less. Furthermore, by setting the distance d between the arrangement positions of the respective acceleration sensor devices 1a, 1b, 1c, 1d to 10 mm or less, the difference in output values of the respective acceleration sensor devices 1a, 1b, 1c, 1d when a rotational motion is applied to the sensor module 100 can be suppressed. Thus, when a rotational motion is applied to the sensor module 100, the possibility of erroneously detecting that a failure has occurred in the acceleration sensor devices 1a, 1b, 1c, 1d can be suppressed.

[0047] 1.2.2. Arrangement of a plurality of angular velocity sensor devices As shown in FIG. 5, the angular velocity sensor devices 2a, 2b, 2c, which are a plurality of angular velocity sensor devices, are provided in the second region R2 of the substrate 21. In the present embodiment, all of the plurality of angular velocity sensor devices are provided in the second region R2. In other words, in the present embodiment, there is no angular velocity sensor device that is not provided in the second region R2.

[0048] The second region R2 is an area outside the first region R1a or the first region R1b. When the acceleration sensor devices 1a, 1b, 1c, 1d are provided in the first region R1a, the second region R2 is an area outside the first region R1a. When the acceleration sensor devices 1a, 1b, 1c, 1d are provided in the first region R1b, the second region R2 is an area outside the first region R1b. When the acceleration sensor devices 1a, 1b, 1c, 1d are provided in an area corresponding to both the first region R1a and the first region R1b, the second region R2 is an area outside the first region R1a and / or the first region R1b.

[0049] The angular velocity sensor device 2a is provided on a side surface orthogonal to the X-axis direction in the second region R2 of the substrate 21. The angular velocity sensor device 2b is provided on a side surface orthogonal to the Y-axis direction in the second region R2 of the substrate 21. The angular velocity sensor device 2c is provided on a surface orthogonal to the Z-axis direction in the second region R2 of the substrate 21.

[0050] Thus, in the present embodiment, the angular velocity sensor devices 2a, 2b, 2c are provided in the second region R2. In other words, since the angular velocity sensor devices 2a, 2b, 2c are provided at positions separated from each other, it is possible to suppress interference between the angular velocity sensor devices 2a, 2b, 2c due to vibrations caused by the vibrators respectively possessed by the angular velocity sensor devices 2a, 2b, 2c. Therefore, the sensor module 100 of the present embodiment can improve the detection accuracy.

[0051] 1.3. Variation The embodiments of the arrangement of the plurality of acceleration sensor devices and / or the plurality of angular velocity sensor devices described above can be variously modified. Specific modification modes are exemplified below.

[0052] 1.3.1. Variation 1 FIG. 7 and FIG. 8 are explanatory diagrams showing the arrangement of the plurality of acceleration sensor devices and the plurality of angular velocity sensor devices in Variation 1. In Modification 1, the substrate 21 has acceleration sensor devices 1a and 1b as a plurality of acceleration sensor devices, and angular velocity sensor devices 2a, 2b, and 2c as a plurality of angular velocity sensor devices.

[0053] The acceleration sensor device 1a is provided at a position overlapping the center CS in the first region R1a on the upper surface 21a of the substrate 21. The acceleration sensor device 1b is provided at a position overlapping the center CS in the first region R1a on the lower surface 21b of the substrate 21. In other words, the acceleration sensor device 1a and the acceleration sensor device 1b are provided at overlapping positions in a plan view. Or, the acceleration sensor device 1a and the acceleration sensor device 1b are provided at positions that are plane-symmetrical with respect to the substrate 21.

[0054] Therefore, when a rotational motion is applied to the sensor module 100 of the present embodiment, the sensor module 100 can suppress the difference in output values generated due to the distance d between the arrangement positions of the acceleration sensor devices 1a and 1b. Thus, the sensor module 100 of the present embodiment can suppress the possibility of erroneously detecting that a failure has occurred in the acceleration sensor devices 1a and 1b, and therefore can improve the accuracy and reliability of failure determination.

[0055] In Modification 1, the first region R1a on the upper surface 21a of the substrate 21 is a region on the upper surface 21a of the substrate 21 where the acceleration sensor device 1a is mounted, and the first region R1a on the lower surface 21b of the substrate 21 is a region on the lower surface 21b of the substrate 21 where the acceleration sensor device 1b is mounted. In Modification 1, the plurality of angular velocity sensor devices 2a, 2b, and 2c are arranged in the same manner as in the examples shown in FIGS. 4 and 5.

[0056] 1.3.2. Modification 2 FIGS. 9 and 10 are explanatory diagrams showing the arrangement of a plurality of acceleration sensor devices and a plurality of angular velocity sensor devices in Modification 2. In Modification 2, the substrate unit 20 has a substrate 21 and a substrate 22. The substrate 21 and the substrate 22 are electrically connected via a connection part 40. The connection part 40 is a flexible substrate. The substrate 21 and the substrate 22 are stacked via a spacer 60. The spacer 60 may also serve as a fixing member for fixing the substrate 21 and the substrate 22 and / or a connection part 40 for making an electrical connection.

[0057] In Modification 2, the substrate unit 20 includes acceleration sensor devices 1a, 1b, 1c, 1d. The acceleration sensor devices 1a, 1b are provided in a first region R1a and / or a first region R1b including the center CS1 of the substrate 21 on the lower surface 21b of the substrate 21. The acceleration sensor devices 1c, 1d are provided in a first region R1a and / or a first region R1b including the center CS2 of the substrate 22 on the upper surface 22a of the substrate 22. Therefore, when a rotational motion is applied, the sensor module 100 of the present embodiment can suppress the difference in output values generated due to the distance d between the arrangement positions of the acceleration sensor device 1a and the acceleration sensor device 1b, and the distance d between the arrangement positions of the acceleration sensor device 1c and the acceleration sensor device 1d. Therefore, when a rotational motion is applied, the sensor module 100 of the present embodiment can suppress the possibility of erroneously detecting that a failure has occurred in the acceleration sensor devices 1a, 1b, 1c, 1d, and thus can improve the accuracy and reliability of failure determination.

[0058] In Modification 2, the acceleration sensor devices 1a, 1b, 1c, and 1d are arranged between the substrate 21 and the substrate 22. In other words, the acceleration sensor devices 1a and 1b are provided on the lower surface 21b, which is the surface on the substrate 22 side of the substrate 21, and the acceleration sensor devices 1c and 1d are provided on the upper surface 22a, which is the surface on the substrate 21 side of the substrate 22. Therefore, in Modification 2, the space between the first region R1a of the lower surface 21b of the substrate 21 and the first region R1a of the upper surface 22a of the substrate 22, and / or the space between the first region R1b of the lower surface 21b of the substrate 21 and the first region R1b of the upper surface 22a of the substrate 22 may be defined as the first region R1.

[0059] In Modification 2, the substrate unit 20 includes angular velocity sensor devices 2a, 2b, 2c, 2d, 2e, and 2f. The angular velocity sensor device 2a is provided on the side surface 21c on the plus side in the X-axis direction among the side surfaces orthogonal to the X-axis direction in the second region R2 of the substrate 21. The angular velocity sensor device 2b is provided on the side surface 21f on the minus side in the Y-axis direction among the side surfaces orthogonal to the Y-axis direction in the second region R2 of the substrate 21. The angular velocity sensor device 2c is provided on the lower surface 21b orthogonal to the Z-axis direction in the second region R2 of the substrate 21.

[0060] The angular velocity sensor device 2d is provided on the side surface 22d on the minus side in the X-axis direction among the side surfaces orthogonal to the X-axis direction in the second region R2 of the substrate 22. The angular velocity sensor device 2e is provided on the side surface 22e on the plus side in the Y-axis direction among the side surfaces orthogonal to the Y-axis direction in the second region R2 of the substrate 22. The angular velocity sensor device 2f is provided on the upper surface 22a orthogonal to the Z-axis direction in the second region R2 of the substrate 22.

[0061] As described above, the angular velocity sensor device 2a for detecting the angular velocity around the X-axis and the angular velocity sensor device 2d are provided so as not to overlap in plan view. In addition, the angular velocity sensor device 2b for detecting the angular velocity around the Y-axis and the angular velocity sensor device 2e are provided so as not to overlap in plan view. Therefore, when the substrate 21 and the substrate 22 are arranged in an overlapping manner, the distance between the substrate 21 and the substrate 22 can be narrowed, so that the sensor module 100 can be made thinner.

[0062] 1.3.3. Modification Example 3 FIG. 11 is an explanatory diagram showing the arrangement of a plurality of acceleration sensor devices and a plurality of angular velocity sensor devices in Modification Example 3. In Modification Example 3, the substrate unit 20 includes a substrate 21 and a substrate 22. The substrate 21 and the substrate 22 are electrically connected via a connection part 40 (not shown) and are arranged in an overlapping manner via a spacer 60 (not shown).

[0063] In Modification Example 3, the substrate unit 20 includes acceleration sensor devices 1a, 1b, 1c, 1d. The acceleration sensor devices 1a, 1b are provided in a first region R1a and / or a first region R1b including the center CS1 of the substrate 21 on the upper surface 21a of the substrate 21. The acceleration sensor devices 1c, 1d are provided in a first region R1a and / or a first region R1b including the center CS2 of the substrate 22 on the upper surface 22a of the substrate 22. Therefore, when a rotational motion is applied, the sensor module 100 of the present embodiment can suppress the difference in output values generated due to the distance d between the arrangement positions of the acceleration sensor devices 1a, 1b, 1c, 1d. Thus, when a rotational motion is applied, the sensor module 100 of the present embodiment can suppress the possibility of erroneously detecting that a failure has occurred in the acceleration sensor devices 1a, 1b, 1c, 1d, and therefore, the accuracy and reliability of failure determination can be improved.

[0064] In Modification 3, the acceleration sensor devices 1c and 1d are arranged between the substrate 21 and the substrate 22. Therefore, in Modification 3, the space between the first region R1a on the upper surface 21a of the substrate 21 and the first region R1a on the upper surface 22a of the substrate 22, and / or the space between the first region R1b on the upper surface 21a of the substrate 21 and the first region R1b on the upper surface 22a of the substrate 22 may be defined as the first region R1.

[0065] In Modification 3, the substrate unit 20 includes the angular velocity sensor devices 2a, 2b, 2c, 2d, 2e, and an angular velocity sensor device 2f (not shown). The angular velocity sensor device 2a is provided on a side surface orthogonal to the X-axis direction in the second region R2 of the substrate 21. The angular velocity sensor device 2b is provided on a side surface orthogonal to the Y-axis direction in the second region R2 of the substrate 21. The angular velocity sensor device 2c is provided on the upper surface 21a orthogonal to the Z-axis direction in the second region R2 of the substrate 21.

[0066] The angular velocity sensor device 2d is provided on a side surface orthogonal to the X-axis direction in the second region R2 of the substrate 22. The angular velocity sensor device 2e is provided on a side surface orthogonal to the Y-axis direction in the second region R2 of the substrate 22. The angular velocity sensor device 2f is provided on the upper surface 22a orthogonal to the Z-axis direction in the second region R2 of the substrate 22.

[0067] In the above-described Embodiment 1, Modification 1, Modification 2, and Modification 3, the first region R1 is defined based on the centers CS, CS1, and CS2 of the substrate 21 and / or the substrate 22. However, the first region R1 may be defined based on the center of the outer case 50 and / or the inner case 30.

[0068] 1.4. System Configuration of Sensor Module FIG. 12 is a block diagram showing the system configuration of the sensor module 100. The sensor module 100 includes a plurality of acceleration sensor devices 1a, 1b, 1c, 1d, …, 1m, a plurality of angular velocity sensor devices 2a, 2b, 2c, 2d, …, 2n, an arithmetic circuit 14, a memory 16, a notification unit 17, and a temperature sensor 18.

[0069] The arithmetic circuit 14 includes a state determination unit 141 and an arithmetic unit 142. The sensor module 100 is not limited to the configuration of FIG. 12, and various modifications such as omitting some of these components or adding other components are possible. For example, the sensor module 100 may include an A / D conversion circuit, a detection circuit, a power supply circuit, an interface circuit, etc.

[0070] The state determination unit 141 determines the state of the sensor module 100. The state determination includes abnormality determination such as a failure. The arithmetic unit 142 calculates acceleration data and angular velocity data based on a plurality of detection data from the plurality of acceleration sensor devices 1a, 1b, 1c, 1d, …, 1m and the plurality of angular velocity sensor devices 2a, 2b, 2c, 2d, …, 2n. The acceleration data and angular velocity data calculated by the arithmetic unit 142 are output to an external device such as an automobile via a connector 15 (not shown). The output acceleration data and angular velocity data are used in various applications such as inertial navigation in the external device.

[0071] 1.5. System Operation of the Sensor Module FIG. 13 is a flowchart showing the system operation of the sensor module 100, and FIG. 14 is a flowchart showing the details of the process for performing state determination in the flowchart of FIG. 13.

[0072] In step S1, the system operation of the sensor module 100 is started. Specifically, each part of the sensor module 100 in the shutdown state or the standby state starts operating. In step S1, various initialization processes may be performed as necessary.

[0073] In step S2, trigger conditions are set. The trigger conditions are conditions that trigger the start of the state determination performed by the arithmetic circuit 14. Various conditions can be set as the trigger conditions. For example, it can be set to perform state determination for each sampling of the detection data from the acceleration sensor devices 1a, 1b, 1c, 1d, …, 1m and the angular velocity sensor devices 2a, 2b, 2c, 2d, …, 2n. The sampling is executed at a rate such as 2ksps or 4ksps, for example.

[0074] Alternatively, when it is detected that the acceleration data or the angular velocity data, which is the output of the sensor module 100, is out of the specification range, the setting may be such that the state determination is performed. For example, the arithmetic circuit 14 presets the upper limit values and the lower limit values of the acceleration data and the angular velocity data that are normally assumed, and when the acceleration data and / or the angular velocity data exceeds the upper limit value, or when the acceleration data and / or the angular velocity data is below the lower limit value, the state determination by the state determination unit 141 is executed.

[0075] Alternatively, when it is determined that a large impact has been applied to the sensor module 100, the setting may be such that the state determination is performed. Alternatively, the state determination may be periodically executed every given unit time. The unit time here is, for example, 1 second or the like. In this way, compared with the state determination for each sampling described above, the execution frequency of the determination is lower, so the processing load can be reduced.

[0076] In step S3, sampling of the detection data from the acceleration sensor devices 1a, 1b, 1c, 1d, …, 1m and the angular velocity sensor devices 2a, 2b, 2c, 2d, …, 2n is started. After step S3, the sampling continues at a predetermined sampling rate until the sampling is stopped in step S8.

[0077] The loop from step S4 to step S7 may be considered to be executed once per sampling, for example. That is, from the acceleration sensor devices 1a, 1b, 1c, 1d, …, 1m and the angular velocity sensor devices 2a, 2b, 2c, 2d, …, 2n, the processes of steps S4 to S7 are executed at the timing when the latest detection data is sampled.

[0078] In step S4, the arithmetic circuit 14 determines whether or not it meets the trigger condition set in step S2. When it meets the trigger condition, the state determination unit 141 executes the state determination process of step S5.

[0079] The details of step S5 will be described with reference to FIG. 14. When the state determination process is started, first, in step S51, the state determination unit 141 performs a failure determination on the acceleration sensor devices 1a, 1b, 1c, 1d, …, 1m and the angular velocity sensor devices 2a, 2b, 2c, 2d, …, 2n.

[0080] In the present embodiment, a failure includes a case where the difference in output values of each acceleration sensor device exceeds a predetermined threshold value, or other cases where the sensor module 100 cannot output values corresponding to actual acceleration and angular velocity, such as a disconnection in the circuit or damage to a physical quantity transducer such as an electrode finger or a vibrator.

[0081] If a failure is detected in step S51, the process proceeds to step S52. In step S52, the arithmetic unit 142 performs a process of excluding the failed sensor device from the calculation of the detection data, and the notification unit 17 notifies the occurrence of the failure by sound or light.

[0082] If no failure is detected in step S51, the process proceeds to step S53. In step S53, an offset abnormality is determined. The state determination unit 141 determines whether the offset is within the range of a given standard. If it is outside the range, in step S54, offset correction processing is performed. In step S53, if the offset is within the range of the given standard, it is considered that there is no offset abnormality and the processing in step S54 is skipped. Offset correction can be described as bias correction. In an acceleration sensor device or an angular velocity sensor device, it is known that the offset accumulates over time, and offset correction is a correction for reducing the offset.

[0083] In step S4, if the trigger condition is not met, the state determination is skipped and the process proceeds to step S6. In step S6, the arithmetic circuit 14 outputs the sampling result to an external device via the connector 15.

[0084] In step S7, the arithmetic circuit 14 determines whether to end the sampling operation. In step S7, the arithmetic circuit 14 may determine, for example, whether a sampling stop command has been input from the host device.

[0085] If the sampling operation is to be ended, the process proceeds to step S8 to stop the sampling operation. If the sampling operation is not to be ended, new sampling is executed and the process returns to step S4 to continue the processing.

[0086] As described above, the sensor module 100 of the present embodiment has the following effects. The sensor module 100 of the present embodiment includes an outer case 50 and / or an inner case 30 as a housing, a substrate 21 provided in the outer case 50 and / or the inner case 30, a plurality of acceleration sensor devices 1a, 1b, 1c, 1d provided on the substrate 21, and a plurality of angular velocity sensor devices 2a, 2b, 2c provided on the substrate 21. The plurality of acceleration sensor devices 1a, 1b, 1c, 1d are provided in a first region R1 including the center CS of the substrate 21 in a plan view, and the plurality of angular velocity sensor devices 2a, 2b, 2c are provided in a second region R2 located outside the first region R1 in a plan view.

[0087] Thus, the acceleration sensor devices 1a, 1b, 1c, 1d included in the sensor module 100 of the present embodiment are provided in the first region R1 including the center CS of the substrate 21 in a plan view. Therefore, since the acceleration sensor devices 1a, 1b, 1c, 1d are provided at positions close to each other, when a rotational motion is applied to the sensor module 100, the difference in output values generated due to the distance d between the arrangement positions of the respective acceleration sensor devices 1a, 1b, 1c, 1d can be suppressed. Thus, the sensor module 100 of the present embodiment can improve the accuracy and reliability of failure determination.

[0088] Furthermore, the plurality of angular velocity sensor devices 2a, 2b, 2c included in the sensor module 100 of the present embodiment are provided in a second region R2 located outside the first region R1 in a plan view. In other words, since the angular velocity sensor devices 2a, 2b, 2c are not provided in the first region R1, the acceleration sensor devices 1a, 1b, 1c, 1d can be provided at positions close to each other. In addition, since the angular velocity sensor devices 2a, 2b, 2c are provided at positions separated from each other in the second region R2, interference between the angular velocity sensor devices 2a, 2b, 2c due to the vibration of the vibrators respectively included in the angular velocity sensor devices 2a, 2b, 2c can be suppressed, and the detection accuracy can be improved.

[0089] In the sensor module 100 according to Modification 1 of the present embodiment, the plurality of acceleration sensor devices 1a and 1b include, in plan view, an acceleration sensor device 1a as a first acceleration sensor device that overlaps with the center CS.

[0090] It is preferable that the acceleration measurement points of the plurality of acceleration sensor devices 1a and 1b coincide with the center CS. That is, since a plurality of acceleration sensor devices including the acceleration sensor device 1a that overlaps with the center CS can be provided at positions close to each other, when a rotational motion is applied to the sensor module 100, the difference in output values generated due to the arrangement positions of the respective acceleration sensor devices 1a and 1b can be suppressed.

[0091] In the sensor module 100 of the present embodiment, the plurality of acceleration sensor devices include an acceleration sensor device 1a as a first acceleration sensor device provided on the upper surface 21a which is the first surface of the substrate 21, and an acceleration sensor device 1b as a second acceleration sensor device provided on the lower surface 21b which is the second surface on the opposite side of the upper surface 21a of the substrate 21 and overlapping with the acceleration sensor device 1a in plan view. Therefore, in the sensor module 100 of the present embodiment, since the plurality of acceleration sensor devices 1a and 1b can be provided at positions close to each other, when a rotational motion is applied to the sensor module 100, the difference in output values generated due to the arrangement positions of the respective acceleration sensor devices 1a and 1b can be suppressed.

[0092] The sensor module 100 of the present embodiment further includes an acceleration sensor device 1a as a first acceleration sensor device provided on the substrate 21, and an acceleration sensor device 1b as a second acceleration sensor device provided on the substrate 21 and facing each other across the acceleration sensor device 1a and the center CS.

[0093] Therefore, since the sensor module 100 of the present embodiment can be provided with a plurality of acceleration sensor devices 1a and 1b at positions close to each other, when a rotational motion is applied to the sensor module 100, it is possible to suppress the difference in output values generated due to the arrangement positions of the respective acceleration sensor devices 1a and 1b.

[0094] The sensor module 100 of the present embodiment includes an outer case 50 and / or an inner case 30 as a housing, a substrate 21 as a first substrate and a substrate 22 as a second substrate provided in the outer case 50 and / or the inner case 30, a plurality of acceleration sensor devices 1a, 1b, 1c, 1d provided on the substrates 21 and 22, and a plurality of angular velocity sensor devices 2a, 2b, 2c, 2d, 2e, 2f provided on the substrates 21 and 22. The plurality of acceleration sensor devices 1a, 1b, 1c, 1d are provided in a first region R1 including the center CS of the substrate 21 and the center CS of the substrate 22 in a plan view, and the plurality of angular velocity sensor devices 2a, 2b, 2c, 2d, 2e, 2f are provided in a second region R2 located outside the first region R1 in a plan view.

[0095] Thus, the acceleration sensor devices 1a, 1b, 1c, 1d included in the sensor module 100 of the present embodiment are provided in a first region R1 including the center CS of the substrate 21 and the center CS of the substrate 22 in a plan view. Therefore, since the acceleration sensor devices 1a, 1b, 1c, 1d are provided at positions close to each other, when a rotational motion is applied to the sensor module 100, it is possible to suppress the difference in output values generated due to the arrangement positions of the respective acceleration sensor devices 1a, 1b, 1c, 1d. Thus, the sensor module 100 of the present embodiment can improve the accuracy and reliability of failure determination.

[0096] Furthermore, the plurality of angular velocity sensor devices 2a, 2b, 2c, 2d, 2e, 2f included in the sensor module 100 of the present embodiment are provided in a second region R2 located outside the first region R1 in a plan view. In other words, since the angular velocity sensor devices 2a, 2b, 2c, 2d, 2e, 2f are not provided in the first region R1, the acceleration sensor devices 1a, 1b, 1c, 1d can be provided close to each other. In addition, since the angular velocity sensor devices 2a, 2b, 2c, 2d, 2e, 2f are provided at positions separated from each other in the second region R2, it is possible to suppress interference between the angular velocity sensor devices 2a, 2b, 2c, 2d, 2e, 2f due to vibrations of the vibrators respectively included in the angular velocity sensor devices 2a, 2b, 2c, 2d, 2e, 2f, and the detection accuracy can be improved.

[0097] The sensor module 100 of the present embodiment further includes acceleration sensor devices 1a, 1b, 1c, 1d as a first acceleration sensor device provided on the first substrate 21 and acceleration sensor devices 1c, 1d as a second acceleration sensor device provided on the second substrate 22. The acceleration sensor devices 1a, 1b are arranged on the lower surface 21b as the surface on the second substrate 22 side of the first substrate 21, and the acceleration sensor devices 1c, 1d are arranged on the upper surface 22a as the surface on the first substrate 21 side of the second substrate 22.

[0098] Therefore, since the sensor module 100 of the present embodiment can provide the plurality of acceleration sensor devices 1a, 1b, 1c, 1d close to each other, when a rotational motion is applied to the sensor module 100, it is possible to suppress the difference in output values generated due to the arrangement positions of the respective acceleration sensor devices 1a, 1b, 1c, 1d.

[0099] The sensor module 100 of this embodiment further includes an acceleration sensor device 1a as a first acceleration sensor device provided on a substrate 21, and an acceleration sensor device 1c as a second acceleration sensor device provided on a substrate 22. The plurality of angular velocity sensor devices include an angular velocity sensor device 2a as a first angular velocity sensor device provided on the substrate 21, and an angular velocity sensor device 2d as a second angular velocity sensor device provided on the substrate 22.

[0100] In this way, since the sensor module 100 of this embodiment can arrange a plurality of acceleration sensor devices including the acceleration sensor device 1a and the acceleration sensor device 1c at positions close to each other, when a rotational motion is applied to the sensor module 100, it is possible to suppress the difference in output values generated due to the arrangement positions of the plurality of acceleration sensor devices.

[0101] Furthermore, since the sensor module 100 of this embodiment can arrange a plurality of angular velocity sensor devices including the angular velocity sensor device 2a and the angular velocity sensor device 2d at positions separated from each other in the second region R2, it is possible to suppress the interference between the angular velocity sensor devices due to the vibration of the vibrators each angular velocity sensor device has, and improve the detection accuracy.

[0102] The sensor module 100 of this embodiment further includes angular velocity sensor devices 2a, 2b, 2c, 2d, 2e, 2f. The angular velocity sensor device 2a is a first angular velocity sensor device provided on a side surface 21c of the substrate 21, and the angular velocity sensor device 2d is a second angular velocity sensor device provided on a side surface 22d of the substrate 22 and not overlapping with the angular velocity sensor device 2a in a plan view. Therefore, when the substrate 21 and the substrate 22 are arranged in an overlapping manner, the interval between the substrate 21 and the substrate 22 can be narrowed, so that the sensor module 100 can be made thinner.

[0103] 2. Embodiment 2 In Embodiment 2, an electronic device equipped with the sensor module 100 will be described. Hereinafter, as examples of electronic devices, examples of portable devices such as smartphones and examples of moving bodies such as automobiles will be described.

[0104] 2.1. Overview of Portable Devices FIG. 15 is a perspective view of a portable device as the electronic device according to Embodiment 2, and is a diagram showing the configuration of a smartphone 110 as an example of a portable device.

[0105] The smartphone 110 is equipped with the sensor module 100. The detection data of the sensor module 100 is received by the control unit 111. The control unit 111 recognizes the posture and behavior of the smartphone 110 from the received detection signal, and can change the display image displayed on the display unit, sound a warning sound or an effect sound, or drive a vibration motor to vibrate the main body.

[0106] The sensor module 100 may be mounted on other portable devices other than the smartphone 110. For example, the sensor module 100 may be mounted on portable devices such as smartwatches, portable activity meters, HMDs (Head Mounted Displays), mobile PCs (Personal Computers), tablet PCs, cameras, and PDAs (Personal Digital Assistants). Thereby, the portable device can recognize the posture and behavior of the portable device based on the detection data of the sensor module 100, change the display image, sound a warning sound or an effect sound, drive a vibration motor to vibrate the main body, and so on.

[0107] Thus, in this embodiment, portable devices such as the smartphone 110 are equipped with the sensor module 100. Therefore, according to this embodiment, the reliability of the portable device equipped with the sensor module 100 can be improved.

[0108] 2.2. Overview of the Moving Object FIG. 16 is a perspective view of a moving object as an electronic device according to Embodiment 2, and is a diagram showing the configuration of an automobile 130 as an example of a moving object.

[0109] The automobile 130 is equipped with a sensor module 100. The sensor module 100 detects the attitude of the vehicle body 131 and transmits the detection data to the vehicle body attitude control device 132. The detection data includes an angular velocity signal and an acceleration signal. When the vehicle body attitude control device 132 that controls the attitude of the vehicle body 131 receives the detection data of the sensor module 100, it detects the attitude of the vehicle body 131 based on the signal, and controls the hardness and softness of the suspension or controls the brakes of individual wheels 133 according to the detection result.

[0110] The detection data of the sensor module 100 may also be utilized in other ECUs (Electronic Control Units) such as keyless entry, immobilizer, car navigation system, car air conditioner, anti-lock brake system (ABS), airbag, TPMS (Tire Pressure Monitoring System), engine control, control equipment for inertial navigation for autonomous driving, and battery monitors for hybrid vehicles and electric vehicles.

[0111] The sensor module 100 may be mounted on other moving objects other than the automobile 130. Other moving objects are, for example, bipedal robots, trains, radio-controlled airplanes, radio-controlled helicopters, drones, agricultural machines, and construction machines. The moving object equipped with the sensor module 100 can utilize the detection data of the sensor module 100 for attitude control and position measurement of the moving object.

[0112] As described above, in this embodiment, a moving object such as the automobile 130 is equipped with the sensor module 100. Therefore, according to this embodiment, the reliability of the moving object equipped with the sensor module 100 can be improved.

[0113] The above describes the preferred embodiments, but the present invention is not limited to the above-described embodiments. The configuration of each part of the present invention can be replaced with any configuration that exhibits the same functions as those of the above-described embodiments, and any configuration can be added.

Description of Reference Numerals

[0114] 1a... acceleration sensor device, 1b... acceleration sensor device, 1c... acceleration sensor device, 1d... acceleration sensor device, 2a... angular velocity sensor device, 2b... angular velocity sensor device, 2c... angular velocity sensor device, 2d... angular velocity sensor device, 2e... angular velocity sensor device, 2f... angular velocity sensor device, 10... sensor unit, 14... arithmetic circuit, 141... state determination unit, 142... arithmetic unit, 15... connector, 16... memory, 17... notification unit, 18... temperature sensor, 20... substrate unit, 21... substrate, 21a... upper surface, 21b... lower surface, 21c... side surface, 21f... side surface, 22... substrate, 22a... upper surface, 22d... side surface, 22e... side surface, 30... inner case, 31... opening, 32... side wall, 33... recess, 34... upper surface, 310... joining member, 40... connection part, 50... outer case, 52... screw hole, 53... inner side, 54... side wall, 55... bottom surface, 56... joining surface, 57... upper surface, 58... lower surface, 60... spacer, 70... screw, 71... mounted surface, 100... sensor module, 110... smartphone, 111... control unit, 130... automobile, 131... vehicle body, 132... vehicle body attitude control device, 133... wheel, B1... boundary line, B2... boundary line, R1... first region, R1a... first region, R1b... first region, R2... second region, r... radius, d... distance, CL... perpendicular line, CS... center, CS1... center, CS2... center.

Claims

1. A housing, a substrate provided in the housing, a plurality of acceleration sensor devices provided on the substrate, and a plurality of angular velocity sensor devices provided on the substrate, wherein the plurality of acceleration sensor devices are provided in a first region including the center of the substrate in plan view, the plurality of angular velocity sensor devices are provided in a second region located outside the first region in plan view, a sensor module.

2. The plurality of acceleration sensor devices include a first acceleration sensor device overlapping the center in plan view, The sensor module according to claim 1.

3. The plurality of acceleration sensor devices include a first acceleration sensor device provided on a first surface of the substrate and a second acceleration sensor device provided on a second surface opposite to the first surface of the substrate and overlapping the first acceleration sensor device in plan view, The sensor module according to claim 1.

4. The plurality of acceleration sensor devices include a first acceleration sensor device provided on the substrate and a second acceleration sensor device provided on the substrate and facing each other with the first acceleration sensor device and the center therebetween, The sensor module according to claim 1.

5. A housing, a first substrate and a second substrate provided in the housing, a plurality of acceleration sensor devices provided on the first substrate and the second substrate, and a plurality of angular velocity sensor devices provided on the first substrate and the second substrate, wherein the plurality of acceleration sensor devices are provided in a first region including the centers of the first substrate and the second substrate in plan view, the plurality of angular velocity sensor devices are provided in a second region located outside the first region in plan view, a sensor module.

6. The plurality of acceleration sensor devices include a first acceleration sensor device provided on the first substrate and a second acceleration sensor device provided on the second substrate, the first acceleration sensor device is arranged on the surface of the first substrate on the side of the second substrate, the second acceleration sensor device is arranged on the surface of the second substrate on the side of the first substrate, The sensor module according to claim 5.

7. The plurality of acceleration sensor devices includes a first acceleration sensor device provided on the first substrate and a second acceleration sensor device provided on the second substrate. The plurality of angular velocity sensor devices includes a first angular velocity sensor device provided on the first substrate and a second angular velocity sensor device provided on the second substrate. The sensor module according to claim 5.

8. The plurality of angular velocity sensor devices includes a first angular velocity sensor device provided on a side surface of the first substrate and a second angular velocity sensor device provided on a side surface of the second substrate and not overlapping the first angular velocity sensor device in plan view. The sensor module according to claim 5.

9. An electronic device including the sensor module according to any one of claims 1 to 8.

Images