Functional panel

Abstract

To provide a novel functional panel with excellent convenience or reliability, a manufacturing method for a novel functional panel with excellent convenience or reliability, a novel light-emitting device with excellent convenience or reliability, or a novel information processing device with excellent convenience or reliability.SOLUTION: A mold release layer, a first base material including a region overlapping with the mold release layer, a terminal between the mold release layer and the first base material, a second base material including a region overlapping with the first base material, and a bonding layer between the first base material and the second base material are provided. The terminal includes a region not overlapping with the bonding layer.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] One aspect of the present invention relates to a method for manufacturing a functional panel, a functional module, a light-emitting module, a display module, a position information input module, a light-emitting device, a lighting device, a display device, an information processing device, or a functional panel. Note that one aspect of the present invention is not limited to the above technical field. The technical field of one aspect of the invention disclosed in this specification and the like relates to an article, a method, or a manufacturing method. Or, one aspect of the present invention relates to a process, a machine, a manufacture, or a composition of matter. Therefore, more specifically, examples of the technical field of one aspect of the present invention disclosed in this specification include semiconductor devices, display devices, light-emitting devices, power storage devices, storage devices, their driving methods, or their manufacturing methods.

[0002]

Background Art

[0003] The social infrastructure related to information transmission means has been improved. As a result, diverse and abundant information can be acquired, processed, and transmitted using an information processing device not only at the workplace, at home, but also outside.

[0004]

[0005] For example, portable information processing devices are often carried around and used, and unexpected forces may be applied to the information processing device and the display device used therein due to dropping. As an example of a display device that is difficult to break, a configuration in which the adhesion between a structure that separates a light-emitting layer and a second electrode layer is enhanced is known (Patent Document 1).

Prior Art Documents

Patent Documents

[0006]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0007] One aspect of the present invention is to provide a novel functional panel excellent in convenience or reliability as one of the problems. Or, to provide a novel functional module, light-emitting module, display module or position information input module excellent in convenience or reliability as one of the problems. Or, to provide a method for manufacturing a novel functional panel excellent in convenience or reliability as one of the problems. Or, to provide a novel light-emitting device, display device or information processing device excellent in convenience or reliability as one of the problems. Or, to provide a novel functional panel as one of the problems. Or, to provide a novel functional module, light-emitting module, display module or position information input module as one of the problems. Or, to provide a method for manufacturing a novel functional panel as one of the problems. Or, to provide a novel light-emitting device, novel information processing device or novel semiconductor device as one of the problems.

[0008] Note that the description of these problems does not prevent the existence of other problems. Note that one aspect of the present invention does not need to solve all of these problems. Note that other problems will be naturally clarified from the descriptions in the specification, drawings, claims, etc., and it is possible to extract these other problems from the descriptions in the specification, drawings, claims, etc.

Means for Solving the Problem

[0009] One aspect of the present invention includes a release layer, a first base material having a region overlapping with the release layer, a terminal between the release layer and the first base material, a second base material having a region overlapping with the first base material, a bonding layer between the first base material and the second base material, and a functional layer between the first base material and the bonding layer. And, the functional layer includes a functional element, and the functional element is electrically connected to the terminal. Also, one aspect of the present invention includes a terminal, a wiring electrically connected to the terminal, a first base material having a region overlapping with the terminal and a region overlapping with the wiring, a second base material having a region overlapping with the first base material, a bonding layer between the first base material and the second base material, a release layer between the first base material and the bonding layer, and a functional layer between the first base material and the bonding layer. And, the release layer is disposed between the wiring and the bonding layer, the functional layer includes a functional element, and the functional element is electrically connected to the wiring.

[0010] The functional panel according to one aspect of the present invention described above includes a release layer, a first base material having a region overlapping with the release layer, a terminal between the release layer and the first base material, a second base material having a region overlapping with the first base material, a bonding layer between the first base material and the second base material, and the terminal has a region that does not overlap with the bonding layer.

[0011] Thus, a signal or power can be supplied to the terminal disposed so as not to overlap with the bonding layer between the release layer and the first base material. A signal or power can be supplied between the first base material and the bonding layer.

[0012]

[0013]

[0014] ​​​​​​​​​​ It can be supplied to the functional elements included in the functional layer disposed between the layers. As a result, convenience Or a novel functional panel excellent in reliability can be provided.

[0015] Further, one aspect of the present invention is a first region in which a release layer is disposed between a first base material and a bonding layer, and A second region adjacent to the first region and having no release layer disposed between the first base material and the bonding layer. Have.

[0016] And the force required to separate the bonding layer in the first region from the first base material is 1 / 10 times or more and less than 1 time the force required to separate the bonding layer in the second region from the first base material. The above functional Panel. Functional panel.

[0017] And the force required to separate the bonding layer in the first region from the first base material is 0.5 N or more and 8 .0 N or less. The above functional panel.

[0018] Thereby, the bonding layer in the region overlapping the release layer can be selectively separated from the first base material while preventing the destruction of the terminals. As a result, a novel functional panel excellent in convenience or reliability Can be provided. Can be provided.

[0019] Further, one aspect of the present invention is that the release layer has a contact angle of 90° or more and less than 180° with respect to water. The above functional panel.

[0020] Further, one aspect of the present invention is that the release layer is the above functional panel containing a fluorine-containing group.

[0021] Thereby, the thickness of the bonding layer can be 100 μm or less, preferably 50 μm or less, more preferably 1 0 μm or less, and the thickness of the release layer can be made thinner than the thickness of the bonding layer. As a result, convenience It is possible to provide a novel functional panel with excellent properties or reliability.

[0022] Moreover, one aspect of the present invention is a method for manufacturing the above functional panel having the following first step to fourth step.

[0023] In the first step, a first member and a second member are prepared, and the first member and the second member are bonded together.

[0024] The first member has a terminal, a wiring, a first base material, a release layer, and a functional layer. The wiring is electrically connected to the terminal. The first base material includes a region overlapping the terminal and a region overlapping the wiring. The release layer includes a region overlapping the terminal. The terminal is disposed between the release layer and the first base material. The functional layer includes a region overlapping the first base material. The functional layer includes a functional element, and the functional element is electrically connected to the wiring.

[0025] The second member has a substrate, a peelable layer, and a release layer. The peelable layer includes a region overlapping the substrate. The release layer is disposed between the substrate and the peelable layer.

[0026] Also, the release layer is disposed so as to overlap a region where the peelable layer and the release layer are not formed, and using a bonding layer that contacts a region where the release layer, the functional layer, the peelable layer, and the release layer are not formed, the first member and the second member are bonded together.

[0027] In the second step, a part of the peelable layer is separated from the substrate to form a starting point of peeling.

[0028] In the third step, a part of the bonding layer and the substrate, and a part of the bonding layer and the peelable layer are separated.

[0029] In the fourth step, using a resin layer, a second substrate having a region overlapping the release layer and the release layer is bonded.

[0030] The method for manufacturing a functional panel according to one aspect of the present invention includes four steps. Thus, the bonding layer in the region overlapping the release layer can be selectively separated from the first substrate while preventing the destruction of the terminals. As a result, a novel method for manufacturing a functional panel excellent in convenience or reliability can be provided.

[0031] One aspect of the present invention is a functional module having the above functional panel, a printed circuit board having a region overlapping the terminals of the functional panel, and a conductive member between the functional panel and the printed circuit board.

[0032] The printed circuit board has wiring, the conductive member contains conductive particles, and the conductive particles electrically connect the terminals and the wiring.

[0033] One aspect of the present invention is a light-emitting module having the above functional panel, a printed circuit board having a region overlapping the terminals of the functional panel, and a conductive member between the functional panel and the printed circuit board.

[0034] The functional panel has a light-emitting element, the printed circuit board has wiring, and the conductive member electrically connects the terminals and the wiring.

[0035] One aspect of the present invention is a display module having the above functional panel, a printed circuit board having a region overlapping the terminals of the functional panel, and a conductive member between the functional panel and the printed circuit board.

[0036] ​​​​​​​​​​​The functional panel includes a display element, the printed circuit board includes wiring, and the conductive member electrically connects the terminals and the wiring.

[0037] One aspect of the present invention is a position information input module having the above-described functional panel, a printed circuit board including a region overlapping with the terminals of the functional panel, and a conductive member between the functional panel and the printed circuit board.

[0038] The functional panel includes a proximity sensor, the printed circuit board includes wiring, and the conductive member electrically connects the terminals and the wiring.

[0039] One aspect of the present invention is a light-emitting device having the above-described light-emitting module and a driving unit electrically connected to the light-emitting module. The driving unit includes a constant-current power supply.

[0040] The light-emitting device according to one aspect of the present invention includes a light-emitting module including a light-emitting element and a driving unit electrically connected to the light-emitting module.

[0041] Thereby, power can be supplied to the terminals disposed so as not to overlap with the bonding layer between the release layer and the first base material. Power can be supplied to the functional layer disposed between the first base material and the bonding layer. As a result, a novel light-emitting device excellent in convenience or reliability can be provided.

[0042] One aspect of the present invention has the above-described display module and a driving unit electrically connected to the display module. The driving unit includes a timing signal generation circuit.

[0043] The display device according to one aspect of the present invention includes a display module including a display element and a driving unit electrically connected to the display module. ​​​​​​​​​​It is configured to include a driving unit that is electrically connected.

[0044] Thereby, a signal or power can be supplied to a terminal disposed so as not to overlap with the bonding layer between the release layer and the first substrate. A signal or power can be supplied to a functional layer disposed between the first substrate and the bonding layer. As a result, a novel display device excellent in convenience or reliability can be provided.

[0045] One aspect of the present invention has the above-described position information input module, a driving unit electrically connected to the position information input module, and a detection circuit electrically connected to the driving unit.

[0046] The display device according to one aspect of the present invention is configured to include a position information input module including a proximity sensor and a driving unit electrically connected to the display module.

[0047] Thereby, a signal detected by the proximity sensor can be supplied to conductive particles having conductivity that are electrically connected to a terminal disposed so as not to overlap with the bonding layer between the release layer and the first substrate. A signal can be supplied to the detection circuit. As a result, a novel information processing device excellent in convenience or reliability can be provided.

Effects of the Invention

[0048] According to one aspect of the present invention, a novel functional panel excellent in convenience or reliability can be provided. Or, a novel functional module, light-emitting module, display module, or position information input module excellent in convenience or reliability can be provided. Or, a method for manufacturing a novel functional panel excellent in convenience or reliability can be provided. Or, a novel one excellent in convenience or reliability ​​​​​​​​​​A novel light-emitting device, display device, or information processing device can be provided. Or, a novel functional panel can be provided. Or, a novel functional module, light-emitting module, display module, or a position information input module can be provided. Or, a method for manufacturing a novel functional panel can be provided. Or, a novel light-emitting device, novel information processing device, or novel semiconductor device can be provided .

[0049] Note that the description of these effects does not prevent the existence of other effects. Note that one aspect of the present invention does not necessarily have to have all of these effects. Note that other effects will become apparent from the descriptions in the specification, drawings, claims, etc., and it is possible to extract these other effects from the descriptions in the specification, drawings, claims, etc.

Brief Description of the Drawings

[0050]

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Figure 18

Mode for Carrying Out the Invention

[0051] A functional panel according to one aspect of the present invention includes a terminal, a release layer having a region overlapping the terminal, a first base material having a region overlapping the terminal, a second base material having a region overlapping the first base material, and a bonding layer between the first base material and the second base material, and the terminal has a region not overlapping the bonding layer. Thus, a signal or power can be supplied to a terminal disposed so as not to overlap the bonding layer between the release layer and the first base material. A signal or power can be supplied to a functional layer disposed between the first base material and the bonding layer. As a result, a novel functional panel excellent in convenience or reliability can be provided. .

[0052]

[0053] The embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description, and those skilled in the art can easily understand that the form and details can be variously changed without departing from the spirit and scope of the present invention. Therefore, the present invention should not be construed as being limited to the description of the embodiments shown below. In the configuration of the invention described below, the same reference numerals are commonly used for the same parts or parts having the same function among different drawings, and the repeated description thereof will be omitted. Without departing from the spirit and scope of the present invention, those skilled in the art can easily understand that the form and details can be variously changed. Therefore, the present invention should not be construed as being limited to the description of the embodiments shown below. Without departing from the spirit and scope of the present invention, those skilled in the art can easily understand that the form and details can be variously changed. Therefore, the present invention should not be construed as being limited to the description of the embodiments shown below. Without departing from the spirit and scope of the present invention, those skilled in the art can easily understand that the form and details can be variously changed. Therefore, the present invention should not be construed as being limited to the description of the embodiments shown below. In the configuration of the invention described below, the same reference numerals are commonly used for the same parts or parts having the same function among different drawings, and the repeated description thereof will be omitted. In the configuration of the invention described below, the same reference numerals are commonly used for the same parts or parts having the same function among different drawings, and the repeated description thereof will be omitted.

[0054] (Embodiment 1) In this embodiment, the configuration of the function panel and the configuration of the function module according to one aspect of the present invention will be described with reference to FIG. 1. In this embodiment, the configuration of the function panel and the configuration of the function module according to one aspect of the present invention will be described with reference to FIG. 1.

[0055] FIG. 1 is a diagram for explaining the configuration of the function panel and the function module according to one aspect of the present invention. FIG. 1(A) is a top view of the function panel according to one aspect of the present invention, and FIG. 1(B) is a cross-sectional view taken along the cutting lines Z1-Z2 and Z3-Z4 in FIG. 1(A). FIG. 1(A) is a top view of the function panel according to one aspect of the present invention, and FIG. 1(B) is a cross-sectional view taken along the cutting lines Z1-Z2 and Z3-Z4 in FIG. 1(A). FIG. 1(A) is a top view of the function panel according to one aspect of the present invention, and FIG. 1(B) is a cross-sectional view taken along the cutting lines Z1-Z2 and Z3-Z4 in FIG. 1(A).

[0056] <Configuration Example 1 of Function Panel.> The function panel 100 described in this embodiment has a release layer 119S, a first base material 110 having a region overlapping the release layer 119S, a terminal 119 between the release layer 119S and the first base material 110, a second base material 170 having a region overlapping the first base material 110, a bonding layer 130 between the first base material 110 and the second base material 170, and a functional layer 161 between the first base material 110 and the bonding layer 130 (see FIGS. 1(A) and 1(B)). The function panel 100 described in this embodiment has a release layer 119S, a first base material 110 having a region overlapping the release layer 119S, a terminal 119 between the release layer 119S and the first base material 110, a second base material 170 having a region overlapping the first base material 110, a bonding layer 130 between the first base material 110 and the second base material 170, and a functional layer 161 between the first base material 110 and the bonding layer 130 (see FIGS. 1(A) and 1(B)). The function panel 100 described in this embodiment has a release layer 119S, a first base material 110 having a region overlapping the release layer 119S, a terminal 119 between the release layer 119S and the first base material 110, a second base material 170 having a region overlapping the first base material 110, a bonding layer 130 between the first base material 110 and the second base material 170, and a functional layer 161 between the first base material 110 and the bonding layer 130 (see FIGS. 1(A) and 1(B)). The function panel 100 described in this embodiment has a release layer 119S, a first base material 110 having a region overlapping the release layer 119S, a terminal 119 between the release layer 119S and the first base material 110, a second base material 170 having a region overlapping the first base material 110, a bonding layer 130 between the first base material 110 and the second base material 170, and a functional layer 161 between the first base material 110 and the bonding layer 130 (see FIGS. 1(A) and 1(B)). The function panel 100 described in this embodiment has a release layer 119S, a first base material 110 having a region overlapping the release layer 119S, a terminal 119 between the release layer 119S and the first base material 110, a second base material 170 having a region overlapping the first base material 110, a bonding layer 130 between the first base material 110 and the second base material 170, and a functional layer 161 between the first base material 110 and the bonding layer 130 (see FIGS. 1(A) and 1(B)).

[0057] The functional layer 161 includes functional elements, and the functional elements are electrically connected to the terminals 119. For example, the light-emitting element 150 can be used as a functional element.

[0058] Alternatively, the functional panel 100 includes a terminal 119, a wiring 11 1 that is electrically connected to the terminal 119, and a first base material 110 having a region overlapping with the terminal 119 and a region overlapping with the wiring 111. a second base material 170 having a region overlapping with the first base material 110, a bonding layer 130 between the first base material 110 and the second base material 170, and a release layer 119S between the first base material 110 and the bonding layer 130, and a functional layer 161 between the first base material 110 and the bonding layer 130. has.

[0059] The release layer 119S is disposed between the wiring 111 and the bonding layer 130, and the functional layer 16 1 includes a functional element, and the functional element is electrically connected to the terminal 119 via the wiring 111.

[0060] The functional panel described in this embodiment includes a release layer 119S, a first base material 110 having a region overlapping with the release layer 119S, and a terminal 119 between the release layer 119S and the first base material 110. a second base material 170 having a region overlapping with the first base material 110, a bonding layer 130 between the first base material 110 and the second base material 170, and The terminal 119 has a region that does not overlap with the bonding layer 130. and

[0061] Thereby, a signal or power can be supplied to the terminal 119 disposed so as not to overlap with the bonding layer 130 between the release layer 119S and the first base material 110. A signal or electricity Power can be supplied to the functional element included in the functional layer 161 disposed between the first base material 110 and the bonding layer 130. As a result, a novel functional panel excellent in convenience or reliability can be provided. ​​​​

[0062] Note that a functional layer 162 can be provided between the second base material 170 and the bonding layer 130.

[0063] Note that the terminal 119 can be electrically connected to the flexible printed circuit board FPC1 using, for example, a conductive member ACF1.

[0064] For example, a configuration in which an insulating film 110a, a base material 110b, and a resin layer 110c are laminated between the insulating film 110a and the base material 110b can be used for the first base material 110.

[0065] For example, a configuration in which an insulating film 170a, a base material 170b, and a resin layer 170c are laminated between the insulating film 170a and the base material 170b can be used for the second base material 170.

[0066] For example, a light-emitting element 150, a partition wall 128 having an opening in a region overlapping the light-emitting element 150, and an insulating layer 121 having a region overlapping the partition wall 128 can be used for the functional layer 161.

[0067] For example, an insulating layer that suppresses the diffusion of impurities can be used for the functional layer 162.

[0068] Hereinafter, each element constituting the functional panel 100 will be described. Note that these configurations cannot be clearly separated, and there are cases where one configuration also serves as another configuration or includes a part of another configuration.

[0069] For example, the insulating film 110a included in the first base material 110 can also serve as part or all of the functional layer 161 while being a part of the first base material 110.

[0070] Also, for example, the insulating film 170a included in the second base material 170 is a part of the second base material 170​​​​​​​​ It can also serve as part or all of the functional layer 162.

[0071] 《Configuration Example》 The functional panel 100 includes a terminal 119, a wiring 111, a first base material 110, a bonding layer 130, a release layer 119S, a functional layer 161, and a second base material 170.

[0072] 《Wiring 111 and Terminal 119》 A material having conductivity can be used for the wiring 111 and the terminal 119.

[0073] The terminal 119 is electrically connected to the wiring 111. Also, a part of the wiring 111 can be used as the terminal 119.

[0074] For example, an inorganic conductive material, an organic conductive material, a metal, or a conductive ceramic can be used for the wiring 111 or the terminal 119.

[0075] Specifically, a metal element selected from aluminum, gold, platinum, silver, copper, chromium, tantalum, titanium, molybdenum , tungsten, nickel, iron, cobalt, palladium, or manganese can be used for the wiring 111 or the terminal 119. Or, an alloy containing the above-mentioned metal element can be used for the wiring 111 or the terminal 119. Or, an alloy combining the above-mentioned metal elements can be used for the wiring 111 or the terminal 119. In particular, an alloy of copper and manganese is suitable for microfabrication using the wet etching method.

[0076] Specifically, a two-layer structure in which a titanium film is laminated on an aluminum film, a two-layer structure in which a titanium film is laminated on a titanium nitride film, a two-layer structure in which a tungsten film is laminated on a titanium nitride film, a titanium nitride film on which a titanium film is laminated, a two-layer structure in which a tungsten film is laminated on a titanium nitride film, a titanium nitride ​​​​​A two-layer structure in which a tungsten film is laminated on a tantalum film or a tungsten nitride film, a titanium film, and A three-layer structure in which an aluminum film is laminated on the titanium film and a titanium film is further formed thereon etc. can be used for the wiring 111 or the terminal 119.

[0077] Specifically, conductive oxides such as indium oxide, indium tin oxide, indium zinc oxide, zinc oxide, zinc oxide added with gallium, etc. can be used for the wiring 111 or the terminal 119 can be used.

[0078] Specifically, a film containing graphene or graphite can be used for the wiring 111 or the terminal 119 can be used.

[0079] For example, a film containing graphene oxide is formed, and by reducing the film containing graphene oxide thereby, a film containing graphene can be formed. Examples of the reduction method include heating methods and methods using a reducing agent.

[0080] Specifically, a conductive polymer can be used for the wiring 111 or the terminal 119.

[0081] 《First substrate 110》 For example, a material having light transmissivity can be used for the first substrate 110.

[0082] For example, those having heat resistance to withstand the manufacturing process and thickness and size applicable to the manufacturing apparatus can be used for the first substrate 110.

[0083] An organic material, an inorganic material, or a composite material such as a composite of an organic material and an inorganic material, etc. can be used for the first substrate 110 can be used. For example, inorganic materials such as glass, ceramics, and metals can be used for the first substrate 110 It can be used for...

[0084] Specifically, non-alkali glass, soda-lime glass, potash glass, or crystal glass etc. can be used for the first base material 110. Specifically, inorganic oxides, inorganic nitrides, or inorganic oxynitrides, etc. can be used for the first base material 110. For example, silicon oxide, nitrogen silicon, silicon oxynitride, alumina, etc. can be used for the first base material 110. Stainless steel or aluminum, etc. can be used for the first base material 110.

[0085] For example, organic materials such as resins, resin films, or plastics can be used for the first base material 110. Specifically, resin films or resin plates such as polyester, polyolefin, polyamide, polyimide, polycarbonate, or acrylic resin can be used for the first base material 110. 110.

[0086] For example, a composite material obtained by laminating a metal plate, a thin glass plate, or a film of an inorganic material, etc. on a resin film can be used for the first base material 110. For example, a composite material in which fibrous or particulate metal, glass, or inorganic material, etc. is dispersed in a resin film can be used for the first base material 110. For example, a composite material in which fibrous or particulate resin or organic material, etc. is dispersed in an inorganic material can be used for the first base material 110.

[0087] In addition, a single-layer material or a material in which a plurality of layers are laminated can be used for the first base material 110. For example, a material in which an insulating film for preventing diffusion of impurities contained in the base material is laminated can be used for the first base material 110. Specifically, a material in which glass and impurities contained in the glass are prevented from diffusing can be used for the first base material 110. Specifically, glass and impurities contained in the glass can be used for the first base material 110. Specifically, impurities contained in glass and glass A layer or layers selected from a silicon oxide layer, a silicon nitride layer, a silicon oxynitride layer, etc., which prevent the diffusion of substances. A material having multiple layers laminated thereon can be applied to the first substrate 110. Alternatively, a resin and a resin-permeable material can be applied to the first substrate 110. A material that is laminated with a silicon oxide film, a silicon nitride film, a silicon oxynitride film, etc., to prevent the diffusion of impurities that The material can be applied to a first substrate 110 .

[0088] A flexible material can be used for the first substrate 110. For example, A material having a degree of flexibility that allows it to be folded or shrunk can be used. Specifically, it is 5 mm or more, preferably 4 mm or more, more preferably 3 mm or more, and particularly preferably Preferably, a material that can be bent with a radius of curvature of 1 mm or more can be used. 0.5 μm or more and 3 mm or less, preferably 5 μm or more and 1.5 mm or less, more preferably 10 μm or less Materials having a thickness of 500 μm or less can be used for the first substrate 110 .

[0089] For example, a flexible base material 110b, an insulating film 110a for preventing diffusion of impurities, and a base material 110b The laminate including the resin layer 110c that bonds the insulating film 110a to the first substrate 11 is Can be used for 0.

[0090] Specifically, a silicon oxynitride film having a thickness of 600 nm and a silicon nitride film having a thickness of 200 nm are laminated. A film including the laminated material thus obtained can be used for the insulating film 110a.

[0091] Specifically, a silicon oxynitride film having a thickness of 600 nm, a silicon nitride film having a thickness of 200 nm, 0 nm thick silicon oxynitride film, 140 nm thick silicon oxynitride film, and 100 nm thick silicon oxynitride film. A film containing a laminated material in which silicon nitride films are laminated in this order can be used for the insulating film 110a. Cut.

[0092] Specifically, resin films such as polyester, polyolefin, polyamide, polyimide, polycarbonate, or acrylic resin, resin plates, or laminates can be used for the base material 110b. It is possible.

[0093] Specifically, polyester, polyolefin, polyamide (nylon, aramid, etc.), poly imide, polycarbonate, polyurethane, acrylic resin, epoxy resin, or a material containing a resin having a siloxane bond such as silicone can be used for the resin layer 110c. It is possible.

[0094] 《Second base material 170》 For example, materials that can be used for the first base material 110 can be used for the second base material 170. It is possible.

[0095] Specifically, the same material can be used for the first base material 110 and the second base material 170 that are bonded together using the bonding layer 130. Thereby, the curling of the functional panel 100 can be suppressed. It is possible.

[0096] For example, a material in which an insulating film 170a that prevents diffusion of impurities, a flexible base material 170b, and a resin layer 170c that bonds the insulating film 170a and the base material 170b are laminated can be used for the second base material 170.

[0097] 《Bonding layer 130》 A material having a function of bonding the first base material 110 and the second base material 170 can be used for the bonding layer 1 30.

[0098] Inorganic materials, organic materials, or composite materials of inorganic materials and organic materials can be used for the bonding layer 130. can be achieved.

[0099] For example, glass having a melting point of 400°C or lower, preferably 300°C or lower, can be used for the bonding layer 130. can be achieved.

[0100] For example, an organic material such as a heat-meltable resin or a curable resin can be used for the bonding layer 130. can be achieved.

[0101] For example, an organic material such as a photocurable adhesive, a reaction-curable adhesive, a thermosetting adhesive, or / and an anaerobic adhesive can be used for the bonding layer 130. can be used for the bonding layer 130.

[0102] Specifically, an adhesive containing an epoxy resin, an acrylic resin, a silicone resin, a phenolic resin, a polyimide resin, an imide resin, a PVC (polyvinyl chloride) resin, a PVB (polyvinyl butyral) resin, an EVA (ethylene vinyl acetate) resin, etc. can be used for the bonding layer 130.

[0103] can be used.

[0103] 《First region A1, second region A2》 Further, the functional panel 100 described in this embodiment has a first region A1 in which a release layer 119S is disposed between the first base material 110 and the bonding layer 130, and a second region A2 that is adjacent to the first region A1 and in which the release layer 119S is not disposed between the first base material 110 and the bonding layer 130 (see FIG. 1(B)).

[0104] (See FIG. 1(B)).

[0104] And the force required to separate the bonding layer 130 in the first region A1 from the first base material 110 is 1 / 10 times or more and less than 1 time the force required to separate the bonding layer 130 in the second region A2 from the first base material 110. 0 times or more and less than 1 time.

[0105] Alternatively, the force required to separate the bonding layer 130 of the first region A1 from the first substrate 110 is , 0.03 N or more and 8.0 N or less.

[0106] Thus, the bonding layer 130 in the region overlapping the release layer 119S can be selectively separated from the first substrate 110 while preventing the terminals 119 from being damaged. As a result, a novel functional panel with excellent convenience or reliability can be provided.

[0107] 《Release layer 119S》 Various configurations can be used for the release layer 119S. For example, a configuration in which a single layer or a plurality of layers are laminated can be used for the release layer 119S.

[0108] For example, a configuration having a first layer, a second layer laminated on the first layer, and an interface where the first layer and the second layer are in contact, and the interface can be broken by a force smaller than the force that causes cohesive failure of the bonding layer 130, can be used for the release layer 119S.

[0109] Specifically, a configuration having a first layer containing an organic material, a second layer containing an inorganic material laminated on the first layer, and an interface where the first layer and the second layer are in contact can be used for the release layer 119S. For example, a layer containing a light-emitting organic compound can be used for the first layer. Also, a layer containing a conductive inorganic material can be used for the second layer.

[0110] Specifically, the same configuration as that of an organic electroluminescence element can be used for the release layer 119S. The interface between the layer containing the light-emitting organic compound and the electrode can be broken by a force smaller than the force that causes cohesive failure of the bonding layer 130.

[0111] Alternatively, a material that can be cohesively broken with a force smaller than that of the bonding layer 130 can be used for the release layer 119S. It can be used for

[0112] Alternatively, an interface that can be broken with a force smaller than the force at which the bonding layer 130 is cohesively broken can be formed between the bonding layer 130 and a material that can be used for the release layer 119S. It can be used for

[0113] Specifically, a material having a contact angle of 90° or more and less than 180° with respect to water can be used for the release layer 119S. Thereby, the bonding layer 130 in the region overlapping the release layer 119S can be selectively separated from the first base material 110 while preventing the destruction of the terminal 119. It can be used for the first base material 110 while preventing the destruction of the terminal 119.

[0114] Alternatively, a material containing a fluorine-containing group can be used for the release layer 119S. Thereby, the thickness of the bonding layer can be reduced to 100 μm or less, preferably 50 μm or less, more preferably 10 μm or less, and the thickness of the release layer can be made thinner than the thickness of the bonding layer. the thickness of the bonding layer can be reduced to 100 μm or less, preferably 50 μm or less, more preferably 10 μm or less, and the thickness of the release layer can be made thinner than the thickness of the bonding layer. It can be used for

[0115] Specifically, a polymer compound containing a perfluoroalkyl group in the side chain, an acrylic resin or a methacrylic resin containing a perfluoroalkyl group in the side chain, etc. can be used for the release layer 119S. For example, a polymer compound containing a perfluoroalkyl group having 4 or more and 12 or less carbon atoms, preferably 6 or more and 12 or less carbon atoms, etc. can be used. It can be used for the release layer 119S. For example, a polymer compound containing a perfluoroalkyl group having 4 or more and 12 or less carbon atoms, preferably 6 or more and 12 or less carbon atoms, etc. can be used. It can be used for

[0116] Alternatively, a film having a thickness of 2 μm or less, preferably 0.3 μm or less, more preferably 0.1 μm or less, containing an organic compound having a perfluoroalkyl group can be used for the release layer 119S. It can be used for .

[0117] Thereby, the bonding layer having a thickness of 100 μm or less, preferably 50 μm or less, more preferably 7 μm or less The thickness of the release layer 119S can be made sufficiently thinner than 130. As a result, a novel functional panel excellent in convenience or reliability can be provided.

[0118] 《Functional layer 161》 One or more layers selected from various functional circuits, functional elements, optical elements, functional films, etc. can be used for the functional layer 161.

[0119] For example, an electrical element or a biochip can be used for the functional layer. Specifically, a transistor, a capacitive element, a resistive element, a memory element, a light-emitting element, or a display element can be used.

[0120] For example, a display element and a pixel circuit for driving the display element can be used for the functional layer.

[0121] For example, a proximity sensor (e.g., a touch sensor), a color filter, or a moisture-proof film can be used for the functional layer.

[0122] Note that a functional panel having a light-emitting element in the functional layer 161 is also referred to as a light-emitting panel.

[0123] Also, a functional panel having a display element in the functional layer 161 is also referred to as a display panel.

[0124] Note that a functional panel having a proximity sensor in the functional layer 161 is also referred to as a position information input panel.

[0125] For example, a light-emitting element can be used for the functional layer 161. Specifically, an organic electroluminescence element, an inorganic electroluminescence element, or a light-emitting diode can be used.

[0126] Alternatively, a drive circuit having a function of driving these light-emitting elements can be used in the functional layer .

[0127] For example, a display element can be used in the functional layer. Specifically, an EL (electroluminescence ) element (EL element including organic and inorganic substances, organic EL element, inorganic EL element), L ED (white LED, red LED, green LED, blue LED, etc.), transistor (transistor that emits light according to current), electron-emitting element, liquid crystal element, electronic ink, electrophoretic element, grating light valve (GLV), plasma display (PDP), display element using MEMS( micro-electro-mechanical system), digital micromirror device (DMD), DMS (digital micro shutter), MIRASOL (registered trademark), IMOD (interference modulation) element, shutter type MEMS display element, optical interference type MEMS display element, electro-wetting element , piezoelectric element, etc. can be used.

[0128] Alternatively, a pixel circuit having a function of driving these display elements or a drive circuit having a function of driving the pixel circuit can be used in the functional layer 161 .

[0129] Alternatively, optical elements such as color filters, antireflection films, and polarizing plates can be used in the functional layer 161 .

[0130] Alternatively, functional films such as moisture-proof films can be used in the functional layer 161

[0131] 《Functional layer 162》 For example, functional elements, functional circuits, optical elements, or functional films that can be used in the functional layer 161 A layer selected from the group consisting of, etc., including one or more, can be used for the functional layer 162.

[0132] For example, a functional element that can be used in combination with the functional elements included in the functional layer 161 can be used for the functional layer 162.

[0133] Specifically, a display panel can be configured by using a display element in the functional layer 161 and using a color filter having a region overlapping with the display element in the functional layer 162. can be used.

[0134] Also, a touch panel can be configured by using a display element in the functional layer 161 and using a proximity sensor in the functional layer 162. can be used.

[0135] 《Light-emitting element 150》 Various light-emitting elements can be used for the light-emitting element 150. For example, an organic electroluminescence element, an inorganic electroluminescence element, or a light-emitting diode, etc., can be used for the light-emitting element 150. can be used.

[0136] For example, a configuration including a lower electrode 151, an upper electrode 152 having a region overlapping with the lower electrode, and a layer 153 containing a light-emitting organic compound between the lower electrode 151 and the upper electrode 152 can be used for the light-emitting element 150. can be used.

[0137] 《Partition wall 128, Insulating layer 121》 For example, an insulating inorganic material, an insulating organic material, or an insulating composite material containing an inorganic material and an organic material can be used for the partition wall 128 or the insulating layer 121.

[0138] Specifically, an inorganic oxide film, an inorganic nitride film, or an inorganic oxynitride film, or a selection from these A laminated material formed by laminating a plurality of [materials] can be used for the partition wall 128 or the insulating layer 121. 。

[0139] Specifically, polyester, polyolefin, polyamide, polyimide, polycarbonate, polysiloxane, acrylic resin, etc., or a composite material of a plurality of resins selected from these can be used for the partition wall 128. Also, it may be formed using a photosensitive material. 。 。

[0140] The partition wall 128 can separate, for example, the light-emitting element 150 from other components adjacent to the light-emitting element 150. 。

[0141] The insulating layer 121 can planarize, for example, steps resulting from various structures overlapping the insulating layer 121. 。

[0142] <Configuration example of a light-emitting module> The light-emitting module described in this embodiment includes a functional panel 100, a flexible printed circuit board FPC1 having a region overlapping with the terminals 119 of the functional panel 100, and a conductive member ACF1 between the functional panel 100 and the flexible printed circuit board FPC1. 。 。

[0143] The flexible printed circuit board FPC1 includes wiring PW, the conductive member ACF1 includes conductive particles CP, and the conductive particles CP electrically connect the terminals 119 and the wiring PW (see Fig. 1(B)). 。 。

[0144] Also, the functional layer includes the light-emitting element 150.

[0145] <Example of a method for connecting a printed circuit board> The flexible printed circuit board FPC1 is electrically connected to the functional panel 100 according to one aspect of the present invention. The following method will be described with reference to FIG. 2.

[0146] FIG. 2 is a cross-sectional view showing a method of electrically connecting the flexible printed circuit board FPC1 to the function panel 100 according to an aspect of the present invention. to the connection.

[0147] FIG. 2(A) is a cross-sectional view of a region having the terminal 119 of the function panel 100 according to an aspect of the present invention, and FIG. 2(B) illustrates the terminal 119, the flexible printed circuit board FPC1, and the conductive member ACF1 sandwiched between the terminal 119 and the flexible printed circuit board FPC1. It is a figure which demonstrates. Further, FIG. 2(C) is a cross-sectional view illustrating a state in which the release layer 119S is pressed against the conductive particles CP. is pressed. is shown.

[0148] Prepare the function panel 100, the flexible printed circuit board FPC1, and the conductive member ACF1 between the function panel 100 and the flexible printed circuit board FPC1, and press the terminal 119 and the flexible printed circuit board FPC1 against the conductive member ACF1. F1 has a step of pressing the terminal 119 and the flexible printed circuit board FPC1 against the conductive member ACF1 (see FIGS. 2(A) and 2(B)). See). (See FIGS. 2(A) and 2(B)).

[0149] For example, the heated pressure bonding device CH is pressed against the flexible printed circuit board FPC1.

[0150] As a result, the terminal 119 and the contact included in the flexible printed circuit board FPC1 can be electrically connected using the conductive particles CP included in the conductive member ACF1. to the connection. Yes.

[0151] By the way, the release layer 119S disposed between the conductive particles CP and the terminal 119 is pressed by the conductive particles CP having conductivity, and the conductive particles CP are electrically connected to the terminal 119. is pressed, and the conductive particles CP are electrically connected to the terminal 119. It occurs (see Fig. 2(C)).

[0152] 《Printed Circuit Board》 For example, a flexible printed circuit board can be used for the printed circuit board (see Fig. 1(B)). Reference.

[0153] The flexible printed circuit board FPC1 has a wiring PW electrically connected to the terminal 119, a base material BF supporting the wiring PW, and a coating layer CVL provided in a region overlapping with the wiring PW. The wiring PW includes a region sandwiched between the base material BF and the coating layer CVL and a region not overlapping with the coating layer CVL. The wiring PW includes a region sandwiched between the base material BF and the coating layer CVL and a region not overlapping with the coating layer CVL. The wiring PW includes a region sandwiched between the base material BF and the coating layer CVL and a region not overlapping with the coating layer CVL. Region.

[0154] In addition, the wiring PW in the region not overlapping with the coating layer CVL can be used for the terminal of the flexible printed circuit board FPC1. 1 can be used.

[0155] A material having conductivity can be used for the wiring PW of the flexible printed circuit board FPC1. For example, a material that can be used for the wiring 111 or the like can be used for the wiring PW of the flexible printed circuit board FPC1. Specifically, copper or the like can be used. A material that can be used for the wiring 111 or the like can be used for the wiring PW of the flexible printed circuit board FPC1. For example, a material that can be used for the wiring 111 or the like can be used for the wiring PW of the flexible printed circuit board FPC1. Specifically, copper or the like can be used. C1 can be used for the wiring PW. Specifically, copper or the like can be used.

[0156] A material having an insulating region can be used for the base material BF of the flexible printed circuit board FPC1 in a region in contact with the wiring PW of the flexible printed circuit board FPC1. Can be used for the base material BF of the flexible printed circuit board FPC1.

[0157] For example, an organic material such as resin, resin film or plastic can be used for the base material BF. Specifically, a resin layer, resin film or resin plate such as polyester, polyolefin, polyamide, polyimide, polycarbonate or acrylic resin can be used for the base material. The glass transition temperature is preferably 150°C or higher, more preferably 200°C or higher, still more preferably Can be used. Specifically, a resin layer, resin film or resin plate such as polyester, polyolefin, polyamide, polyimide, polycarbonate or acrylic resin can be used for the base material. The glass transition temperature is preferably 150°C or higher, more preferably 200°C or higher, still more preferably A resin layer, resin film or resin plate such as polyester, polyolefin, polyamide, polyimide, polycarbonate or acrylic resin can be used for the base material. The glass transition temperature is preferably 150°C or higher, more preferably 200°C or higher, still more preferably Can be used for the base material. The glass transition temperature is preferably 150°C or higher, more preferably 200°C or higher, still more preferably A resin film with a temperature of 250°C or higher and 375°C or lower can be used as a base material.

[0158] 《Conductive Member》 For example, solder, a conductive paste, an anisotropic conductive film, etc. can be used as the conductive member. can be used.

[0159] Specifically, a conductive member ACM F1 containing conductive particles CP and a material for dispersing the particles CP can be used as the conductive member. can be used as the conductive member.

[0160] For example, spherical particles having a size of 1 μm or more and 200 μm or less, preferably 3 μm or more and 150 μm or less, particles having a shape such as a columnar or thread-like shape can be used as the particles CP.

[0161] For example, particles coated with a conductive material containing nickel or gold can be used. can be used.

[0162] Specifically, particles containing polystyrene, an acrylic resin, titanium oxide, etc. can be used. can be used.

[0163] For example, synthetic rubber, a thermosetting resin, a thermoplastic resin, etc. can be used as the material for dispersing the particles CP. can be used.

[0164] Thereby, the terminals of the flexible printed circuit board FPC1 and the terminal 119 can be electrically connected using the particles CP. electrically connected.

[0165] Note that the present embodiment can be appropriately combined with other embodiments shown in this specification. can be combined.

[0166] (Embodiment 2) In the present embodiment, a method for manufacturing a functional panel according to an aspect of the present invention will be described with reference to FIGS. 3 to 7. while referring to FIGS. 3 to 7.

[0167] Figure 3 is a flowchart for explaining a method of manufacturing a functional panel according to an aspect of the present invention. Figure 4 is a diagram for explaining a method of manufacturing a functional panel according to an aspect of the present invention. Further, Figure 5 is a diagram for explaining a method of manufacturing a functional panel according to an aspect of the present invention. Figure 4(A-2) is a top view of a first member used in manufacturing the functional panel, and Figure 4(A-1 ) is a cross-sectional view taken along the cutting line W1-W2 of Figure 4(A-2).

[0168] Figure 4(B-2) is a top view of a second member used in manufacturing the functional panel, and Figure 4(B-1 ) is a cross-sectional view taken along the cutting line W1-W2 of Figure 4(B-2).

[0169] Figure 4(C-2) is a top view of a processed member during the manufacturing process, and Figure 4(C-1) is a cross-sectional view taken along the cutting line W1-W2 of Figure 4(C )-2).

[0170] Figure 5(A-2), Figure 5(C-2), and Figure 5(D-2) are top views of members during the manufacturing process Figure 5(A-1) is a cross-sectional view taken along the cutting line W1-W2 of Figure 5(A-2), and Figure 5

[0171] (C-1) is a cross-sectional view taken along the cutting line W3-W4 of Figure 5(C-2). Further, Figure 5(D (-1) is a cross-sectional view taken along the cutting line W3-W4 of Figure 5(D-2). (C-1) is a cross-sectional view taken along the cutting line W3-W4 of Figure 5(C-2). Further, Figure 5(D (-1) is a cross-sectional view taken along the cutting line W3-W4 of Figure 5(D-2).

[0172] <Example of manufacturing method 1.> The method of manufacturing the functional panel described in this embodiment has the following four steps (see Figures 3 to 5).

[0173] <<First step>> In the first step, the terminal 13b, the wiring 13c, the base material 41, the release layer 13a, and the function Prepare a first member 91 having a release layer 13a (see FIGS. 4(A-1) and 4(A-2)). )

[0174] Note that the wiring 13c is electrically connected to the terminal 13b, and the base material 41 includes a region overlapping with the terminal 13b and a region overlapping with the wiring 13c. The release layer 13a includes a region overlapping with the terminal 13b The terminal 13b is disposed between the release layer 13a and the base material 41, and the functional layer 13d includes a region overlapping with the base material 41 The functional layer 13d includes a functional element, and the functional element is electrically connected to the wiring 13c Thereby

[0175] In addition, a resin layer 31 can be provided between the wiring 13c and the base material 41

[0176] Also, prepare a second member 82 having a substrate 21, a layer to be peeled 23, and a peeling layer 22 ( see FIGS. 4(B-1) and 4(B-2)).

[0177] Note that the layer to be peeled 23 includes a region overlapping with the substrate 21, and the peeling layer 22 is disposed between the substrate 21 and the layer to be peeled 23

[0178] Then, the release layer 13a of the first member 91 overlaps a region where the layer to be peeled 23 and the peeling layer 22 of the second member 82 are not formed. For example, the first member 91 and the second member 82 are disposed so that the release layer 13a, the functional layer 13d, the layer to be peeled 23, and the peeling layer 22 are not formed, and bonded using a bonding layer 30 in contact with the region to obtain a processed member (see FIGS. 3(S1), 4 (C-1) and 4(C-2)).

[0179] Note that various methods can be used to form the bonding layer 30. For example, a dispenser An adhesive or a screen printing method can be used. Also, depending on the material used for the bonding layer 30 a method is used to cure the bonding layer 30. For example, when a photo-curable material is used for the bonding layer 30 the bonding layer 30 is irradiated with light containing light of a predetermined wavelength, and when a thermosetting material is used for the bonding layer 30, it is heated to a predetermined temperature.

[0180] Note that the processed member after the first step includes a release layer 13a, terminals 13b, wiring 13c, functional elements, a functional layer 13d, a base material 41, a substrate 21, a bonding layer 30, a peelable layer 23, and a release layer 22.

[0181] The terminal 13b has a region overlapping the release layer 13a, the wiring 13c is electrically connected to the terminal 13b the functional layer 13d includes functional elements, the functional elements are electrically connected to the wiring 13c, and the base material 41 has a region overlapping the terminal 13b, the wiring 13c, and the functional layer 13d.

[0182] The substrate 21 has a region overlapping the base material 41, the bonding layer 30 is disposed between the base material 41 and the substrate 21 the peelable layer 23 is disposed between the substrate 21 and the bonding layer 30, and the release layer 22 is disposed between the substrate 21 and the peelable layer 23.

[0183] Also, the processed member after the first step has a region where the peelable layer 23 and the release layer 22 are not provided, overlapping the region of the terminal 13b and the release layer 13a.

[0184] Also, a resin layer 31 can be provided between the base material 41 and the functional layer 13d.

[0185] 《Second Step》 In the second step, a part of the peelable layer 23 is separated from the substrate 21 to form a starting point 91 of peeling ​Form s (see Fig. 3 (S2), Fig. 5 (A-1) and Fig. 5 (A-2)).

[0186] The starting point 91s of peeling has a structure in which a part of the layer 23 to be peeled and the substrate 21 are separated.

[0187] For example, the layer 23 to be peeled is cut or pierced using a cutting tool or the like having a sharp tip from the side of the base material 41, or a method using a laser or the like (specifically, the laser ablation method), etc. By using this, a part of the layer 23 to be peeled can be peeled from the peeling layer 22. Thereby, the starting point 91s of peeling can be formed.

[0188] 《The Third Step》 In the third step, a part of the bonding layer 30 and the substrate 21 are separated from another part of the bonding layer 30 and the layer 23 to be peeled (see Fig. 3 (S3) and Fig. 5 (B)). Specifically, starting from the starting point 91s of peeling formed near the end of the bonding layer 30, the substrate 21 together with the peeling layer 22 is separated from the layer 23 to be peeled (see Fig. 5 (B)).

[0189] Thereby, a remainder is obtained which includes the layer 23 to be peeled, the base material 41 having a region overlapping with the layer 23 to be peeled, the bonding layer 30 between the layer 23 to be peeled and the base material 41, the resin layer 31 between the bonding layer 30 and the base material 41, the functional layer 13d between the resin layer 31 and the bonding layer 30, the wiring 1 3c between the functional layer 13d and the resin layer 31, the terminal 13b electrically connected to the wiring 13c, and the release layer 13a having a region overlapping with the terminal 13b.

[0190] Note that ions may be irradiated near the interface between the peeling layer 22 and the layer 23 to be peeled to remove static electricity while separating. Specifically, ions generated using an ionizer may be irradiated. ​​​​

[0191] Also, when separating the release layer 22 from the layer to be released 23, a liquid may be infiltrated into the interface between the release layer 22 and the layer to be released 23. Or, a liquid ejected from the nozzle 99 may be sprayed. For example, water or a polar solvent or the like can be used as the liquid to be infiltrated or the liquid to be sprayed. Or, a liquid that dissolves the release layer can be used. By infiltrating a liquid, it is possible to suppress the influence of static electricity or the like generated during peeling. Particularly, when peeling the layer to be released 23 from the release layer 22 containing tungsten oxide while infiltrating or spraying a liquid containing water, it is possible to reduce the stress accompanying peeling applied to the layer to be released 23, which is highly preferable.

[0192] Particularly, when peeling the layer to be released 23 from the release layer 22 containing tungsten oxide while infiltrating or spraying a liquid containing water, it is possible to reduce the stress accompanying peeling applied to the layer to be released 23, which is highly preferable. Particularly, when peeling the layer to be released 23 from the release layer 22 containing tungsten oxide while infiltrating or spraying a liquid containing water, it is possible to reduce the stress accompanying peeling applied to the layer to be released 23, which is highly preferable.

[0193] Particularly, when peeling the layer to be released 23 from the release layer 22 containing tungsten oxide while infiltrating or spraying a liquid containing water, it is possible to reduce the stress accompanying peeling applied to the layer to be released 23, which is highly preferable. Particularly, when peeling the layer to be released 23 from the release layer 22 containing tungsten oxide while infiltrating or spraying a liquid containing water, it is possible to reduce the stress accompanying peeling applied to the layer to be released 23, which is highly preferable. Particularly, when peeling the layer to be released 23 from the release layer 22 containing tungsten oxide while infiltrating or spraying a liquid containing water, it is possible to reduce the stress accompanying peeling applied to the layer to be released 23, which is highly preferable.

[0194] Note that a part of the release layer 13a is disposed so as to overlap a region where the release layer 22 is not formed in the first step. Thereby, when separating the remaining portion from the substrate 21, it is convenient that a part of the bonding layer 30 in the region overlapping the release layer 13a can be removed together with the substrate 21. Note that a part of the release layer 13a is disposed so as to overlap a region where the release layer 22 is not formed in the first step. Thereby, when separating the remaining portion from the substrate 21, it is convenient that a part of the bonding layer 30 in the region overlapping the release layer 13a can be removed together with the substrate 21. Note that a part of the release layer 13a is disposed so as to overlap a region where the release layer 22 is not formed in the first step. Thereby, when separating the remaining portion from the substrate 21, it is convenient that a part of the bonding layer 30 in the region overlapping the release layer 13a can be removed together with the substrate 21. Note that a part of the release layer 13a is disposed so as to overlap a region where the release layer 22 is not formed in the first step. Thereby, when separating the remaining portion from the substrate 21, it is convenient that a part of the bonding layer 30 in the region overlapping the release layer 13a can be removed together with the substrate 21.

[0195] Also, since a part of the bonding layer 30 in the region overlapping the release layer 13a can be more easily removed than another part of the bonding layer 30 in the region not overlapping the release layer 13a, a part of the bonding layer 30 in the region overlapping the release layer 13a can be selectively removed. Also, since a part of the bonding layer 30 in the region overlapping the release layer 13a can be more easily removed than another part of the bonding layer 30 in the region not overlapping the release layer 13a, a part of the bonding layer 30 in the region overlapping the release layer 13a can be selectively removed. Also, since a part of the bonding layer 30 in the region overlapping the release layer 13a can be more easily removed than another part of the bonding layer 30 in the region not overlapping the release layer 13a, a part of the bonding layer 30 in the region overlapping the release layer 13a can be selectively removed.

[0196] <<Fourth Step>> In the fourth step, the layer to be released 23 and the base material 42 are bonded together using the resin layer 32 (see FIGS. 3 (S4), 5 (C-1), and 5 (C-2)). In the fourth step, the layer to be released 23 and the base material 42 are bonded together using the resin layer 32 (see FIGS. 3 (S4), 5 (C-1), and 5 (C-2)).

[0197] A liquid adhesive can be used for the resin layer 32. Alternatively, an adhesive that has its fluidity suppressed and has been pre-formed into a single-sheet shape (also referred to as a sheet-shaped adhesive) can be used. When using a sheet-shaped adhesive, the amount of adhesive that protrudes from the outer shape of the peelable layer 23 can be reduced. Also, the thickness of the resin layer 32 can be easily made uniform. Incidentally, the functional panel produced after completing the fourth step has the terminal 13b, the wiring 13c, the base material

[0198] 41, the base material 42, the bonding layer 30, the release layer 13a, and the functional layer 13d (see FIGS. 5(D-1 ) and FIG. 5(D-2)). And the wiring 13c is electrically connected to the terminal 13b. The base material 41 includes a region that overlaps with the terminal 13b

[0199] and a region that overlaps with the wiring 13c. The base material 42 includes a region that overlaps with the base material 41. The bonding layer 30 is disposed between the base material 41 and the base material 42. The release layer 13a is disposed between the base material 41 and the bonding layer 30. The functional layer 13d is disposed between the base material 41 and the bonding layer 30. The release layer 13a is disposed between the wiring 13c and the bonding layer 30. The functional layer 13d includes a functional element, and the functional element is electrically connected to the wiring 13c. Also, the functional panel includes a resin layer 31, a resin layer 32, and a peelable layer 23. The peelable layer 23

[0200] is disposed between the base material 42 and the bonding layer 30. The resin layer 32 is disposed between the peelable layer 23 and the base material 4 2. The resin layer 31 is disposed between the wiring 13c and the base material 41. The manufacturing method of the functional panel described in this embodiment is configured to include the above four steps.

[0201] This allows the bonding layer 30 in the region overlapping the release layer 13a in the third step to be selectively separated from the base material 41 while preventing the destruction of the terminal 13b. As a result, a novel method for manufacturing a functional panel with excellent convenience or reliability can be provided.

[0202] <Example of manufacturing method 2.> Another example of the method for manufacturing a functional panel according to an aspect of the present invention will be described with reference to FIGS. 6 and 7. Hereinafter, it will be described.

[0203] FIG. 6 is a flowchart for explaining a modified example of the method for manufacturing a functional panel according to an aspect of the present invention.

[0204] FIG. 7 is a diagram for explaining a modified example of the method for manufacturing a functional panel according to an aspect of the present invention. FIGS. 7(A- 2), FIG. 7(B-2), FIG. 7(D-2), and FIG. 7(E-2) are top views of the members during the manufacturing process. FIG. 7(A-1) is a cross-sectional view taken along the cutting line W1-W2 of FIG. 7(A-2), and FIG. 7(B-1) is a cross-sectional view taken along the cutting line W1-W2 of FIG. 7(B-2). FIG. 7( D-1) is a cross-sectional view taken along the cutting line W1-W2 of FIG. 7(D-2). Also, FIG. 7(E- 1) is a cross-sectional view taken along the cutting line W1-W2 of FIG. 7(E-2).

[0205] Note that the method for manufacturing a functional panel described with reference to FIGS. 3 to 5 is different in the configuration of the first member and the first step.

[0206] The first member 81 used instead of the first member 91 has, for example, a substrate 11 instead of the base material 41, a release layer 12 provided in a region overlapping the substrate 11, and a layer to be peeled 13e provided in a region overlapping the release layer 12, which is different (see FIGS. 4 and 7). Note that the release layer 12 is the layer to be peeled It has a function of separating from the release layer 13e and the substrate 11.

[0207] Also, in the first step, a part of the release layer 13e is separated from the substrate 11 to form a starting point of peeling, the substrate 11 is separated to obtain the remaining part, and the resin layer 31 is used to bond the base material 41 to the remaining part. This is different (see FIGS. 3 and 6). .

[0208] Here, different configurations or steps will be described in detail, and for parts where the same configurations or steps can be used, the above description will be incorporated by reference.

[0209] A modification of the method for manufacturing the functional panel described in this embodiment has the following four steps before the above-described second step (see FIGS. 6 and 7).

[0210] <<Step 1-1>> In the first step 1-1, a first member 81 having a release layer 13e, a substrate 11, and a release layer 12 is prepared (see FIGS. 7(A-1) and 7(A-2)).

[0211] Note that the substrate 11 has a region overlapping the release layer 13e, and the release layer 12 is disposed between the release layer 13e and the substrate 11.

[0212] The release layer 13e has a terminal 13b, a release layer 13a having a region overlapping the terminal 13b, a wiring 13c electrically connected to the terminal 13b, and a functional element electrically connected to the wiring 13c and a functional layer 13d including the functional element.

[0213] Also, a second member having a substrate 21, a release layer 23, and a release layer 22 is prepared.

[0214] The layer to be peeled 23 has an area overlapping the substrate 21, and the peeling layer 22 has an area overlapping the substrate 21 and the It is disposed between the release layers 23 .

[0215] The release layer 13a of the first member 91 is formed on the peeling layer 22 of the second member 82. For example, a first member 81 and a second member 82 are disposed so as to overlap the area where the release layer 1 is not formed. 3a, a bonding layer that is in contact with an area where the functional layer 13d, the layer to be peeled 23, and the peeling layer 22 are not formed The laminate is laminated using the bonding layer 30 to obtain a processed member (see FIG. 6(T1-1)).

[0216] <Step 1-2> In step 1-2, a part of the layer 13e to be peeled off is separated from the substrate 11 to detect the peeling. A point 13s is formed (see FIG. 6 (T1-2), FIG. 7 (B-1) and FIG. 7 (B-2)).

[0217] The peeling starting point 13s has a structure in which a part of the layer 13e to be peeled is separated from the substrate 11.

[0218] For example, a method of piercing the peeled layer 13e from the substrate 11 side with a sharp tip or using a laser or the like A part of the layer to be peeled off 13e is peeled off by using a method (specifically, a laser ablation method) that is known in the art. It is possible to partially peel off from the peeling layer 12. This forms the peeling starting point 13s. It is possible.

[0219] <Steps 1-3> In step 1-3, the remaining portion including the peeled layer 13e is separated from the substrate 11 (FIG. 6 (T1-3), see FIG. 7(C) and FIG. 7(D-1) to (D-2)).

[0220] When the remaining portion is separated from the substrate 11, the bonding layer 30 is peeled off from the peeled layer 13e. A force is added to make this happen.

[0221] When attempting to peel off the bonding layer 30 in the region overlapping with the release layer 13a from the release layer 13a, the force required is much smaller than the force required when attempting to peel off the bonding layer 30 in the region not overlapping with the release layer 13a. If it is too small, the bonding layer 30 in the region overlapping with the release layer 13a may be peeled off from the release layer 13a.

[0222] When the bonding layer 30 is peeled off from the release layer 13a, the mechanical strength of the layer to be peeled 13e in the region overlapping with the release layer 13a decreases. As a result, during the manufacturing process of the functional panel, the terminal 13b disposed in the region overlapping with the release layer 13a may be damaged.

[0223] Also, when attempting to peel off the bonding layer 30 in the region overlapping with the release layer 13a from the release layer 13a, the force required is the same as or greater than the force required when attempting to peel off the bonding layer 30 in the region not overlapping with the release layer 13a from the layer to be peeled 13e. If so, the bonding layer 30 in the region overlapping with the release layer 13a may not be peeled off from the release layer 13a.

[0224] If the bonding layer 30 cannot be peeled off from the release layer 13a, the terminal 13b and the conductive member may not be electrically connected.

[0225] Specifically, a material is selected such that the force required to separate the bonding layer 30 provided in the region where the release layer 13a is not provided from the layer to be peeled 13e is 1 / 10 times or more and less than 1 time the force required to separate the bonding layer 30 provided in the region where the release layer 13a is not provided from the layer to be peeled 13e, and this material is used for the release layer 13a.

[0226] Also, when separating the bonding layer 30 in the region where the release layer 13a and the bonding layer 30 are in contact from the substrate 21, ​​​​​​​​When the required force separates the bonding layer 30 in the region where the release layer 13a is not provided from the substrate 21 if it is greater than the required force, the bonding layer 30 may not be separable.

[0227] Also, when separating the bonding layer 30 in the region where the release layer 13a and the bonding layer 30 are in contact from the substrate 21 if the required force is 0.5 N or more, the probability of accidentally separating the bonding layer 30 during the manufacturing process can be suppressed. Also, if it is 5 N or less, the bonding layer 30 can be easily separated.

[0228] Note that a method based on the adhesive tape and adhesive sheet test method conforming to the standard number JIS Z0237 of the Japanese Industrial Standards (JIS) is used to measure the force required to separate the bonding layer 30 in the region where the release layer 13a and the bonding layer 30 are in contact from the substrate 21. from the substrate 21. can be measured.

[0229] Specifically, using a small desktop testing machine (EZ-TEST EZ-S-50N) manufactured by Shimadzu Corporation at an angle (also called the peeling angle) of 90° and a speed (also called the peeling speed) of 20 mm / min while separating the bonding layer 30 of a sample having an outer shape of length 126 mm × width 25 mm from the substrate 21 it can be measured.

[0230] 《Steps 1-4》 In Steps 1-4, the layer to be peeled 13e and the base material 41 having a region overlapping with the layer to be peeled 13e are bonded together using the resin layer 31 (see FIGS. 6 (T1-4), 7 (E-1) and 7 (E-2)).

[0231] Note that the processed member in the state after Steps 1-4 has the same configuration as the processed member in the state after the first step described in Manufacturing Method Example 1.

[0232] ​​​ <Example 1 of manufacturing method of release layer.> A method for manufacturing a release layer that can be used in a method for manufacturing a functional panel according to an aspect of the present invention will be described with reference to FIG. 8. Refer to FIG. 8.

[0233] First, prepare a member having a layer to be peeled 13e, a substrate 11, and a release layer 12 (see FIGS. 8( A-1) and 8(A-2)).

[0234] Note that the substrate 11 has a region overlapping the layer to be peeled 13e, and the release layer 12 is disposed between the layer to be peeled 13e and the substrate 11.

[0235] Further, the layer to be peeled 13e includes a release layer 13a having a terminal 13b and a region overlapping the terminal 13b a wiring 13c electrically connected to the terminal 13b, a functional element electrically connected to the wiring 13c, and a functional layer 13d including the functional element. has

[0236] Then, the release layer 13 is formed so that the terminal 13b is disposed between the release layer 13a and the substrate 11 a (FIGS. 8(B-1) and 8(B-2)).

[0237] For example, a solution or dispersion liquid containing an acrylic resin or the like having a perfluoroalkyl group or the like in the side chain is applied to the region overlapping the terminal 13b, and the solvent or dispersion medium is volatilized to form the release layer 13a can be formed. formed.

[0238] For example, it can be applied using a cloth or the like impregnated with the solution or dispersion liquid. Or It can be applied using an inkjet method or a printing method.

[0239] Thereby, a material containing a fluorine-containing group can be used for the release layer 13a.

[0240] Note that after forming the release layer 13a, the functional layer 13d may be formed. For example, after forming the release layer 1 3a, a light-emitting element or the like may be formed on the functional layer 13d. Specifically, an elect roluminescence element or the like may be formed.

[0241] <Example 2 of the method for producing the release layer.> For example, a film having a laminated structure can be used for the release layer 13a.

[0242] Specifically, a structure in which a layer containing a light-emitting organic compound and a layer containing a conductive material are laminated can be used for the release layer 13a.

[0243] For example, a layer containing a light-emitting organic compound or a metal can be vacuum-deposited using a resistance heating method. Also, a conductive oxide or the like can be formed into a film using a sputtering method.

[0244] Thereby, a laminated structure containing a light-emitting organic compound can be used for the release layer 13a.

[0245] Note that in the same process as the process of forming the release layer 13a, an organic elect roluminescence element may be formed in the functional layer 13d. Specifically, using a shadow mask having openings in a region overlapping the functional layer 13d and a region overlapping the terminal 1 3b, a layer containing a light-emitting organic compound can be formed.

[0246] <Example 3 of the production method.> Another example of the method for producing the functional panel according to one aspect of the present invention will be described with reference to FIGS. 9 and 10.

[0247] Note that the method for producing the functional panel described with reference to FIGS. 3 to 5 is the structure of the second member. ​​The composition and the first step are different. Also, the fifth step is enabled after the fourth step. The difference is that

[0248] The second member 82B used in place of the second member 82 is a member in which the layer to be peeled 23 and the peeling layer 22 are In the first step, a region of the first member 91 that is to be bonded to the release layer 13a is provided. (See FIG. 9(A-1) and FIG. 9(A-2)).

[0249] In the first step, the layer to be peeled 23 and the peeling layer 22 are formed in the region. The first member 91 and the second member 82B are bonded to each other using the bonding layer 30 so that the release layers 13a overlap each other. Then, the processed member is obtained (see FIG. 9(B-1) and FIG. 9(B-2)).

[0250] In the second step, a starting point for peeling is formed, and in the third step, the substrate 2 1 and the peeled layer 23 (see FIG. 9(C), FIG. 9(D-1) and FIG. 9(D-2) ).

[0251] In the fourth step, the base material 42 and the peeled layer 23 are bonded together using the resin layer 32. (See FIG. 10(A-1) and FIG. 10(A-2)).

[0252] The processed member produced after the fourth step is subjected to a demolding process to remove the bonding layer 30 and the peeled layer 23. The points in the area overlapping the layer 13a and the terminal 13b are shown in FIG. 5(D-1) and FIG. 2) (see Fig. 10(A-1) and Fig. 10(A-2)).

[0253] The fifth step In the fifth step, the peeled layer 23 and the bonding layer 30 are provided in an area overlapping the release layer 13a. , an opening is formed (see FIGS. 10(B-1) and 10(B-2)).

[0254] For example, an adhesive tape is attached to the peelable layer 23 in the region overlapping the release layer 13a, and the attached adhesive tape is peeled off. As a result, the peelable layer 23 and the bonding layer 30 in the region overlapping the release layer 13a can be removed together with the adhesive tape. As a result, an opening reaching the release layer 13a can be formed in the peelable layer 23 and the bonding layer 30 in the region overlapping the release layer 13a.

[0255] Note that the present embodiment can be appropriately combined with other embodiments described in this specification.

[0256] (Embodiment 3) In the present embodiment, the configuration of the display panel and the display module according to one aspect of the present invention will be described with reference to FIG. 11.

[0257] FIG. 11 is a diagram for explaining the configuration of the display panel and the display module according to one aspect of the present invention. FIG. 11(A) is a top view of the functional panel according to one aspect of the present invention, and FIG. 11(B) is a cross-sectional view taken along the cutting lines Y1-Y2 and Y3-Y4 in FIG. 11(A).

[0258] [Configuration example of display panel] The functional panel 500 including the display element 550R can also be referred to as a display panel.

[0259] The functional panel 500 includes a terminal 519, a wiring 511 electrically connected to the terminal 519, a first base material 510 including a region overlapping the terminal 519 and a region overlapping the wiring 511, a second base material 570 including a region overlapping the first base material 510, and the first base material 510 and the second ​​​​​​​A bonding layer 530 is disposed between the substrate 570, and a release layer 5 is disposed between the first substrate 510 and the bonding layer 530. 19S, and a functional layer 561 between the first substrate 510 and the bonding layer 530.

[0260] The release layer 519S is disposed between the wiring 511 and the bonding layer 530, and the functional layer 56 1 includes a display element 550R, which is electrically connected to a terminal 519.

[0261] As a result, a signal or power is transmitted between the release layer 519S and the first substrate 510 through the bonding layer 519S. The signal or power can be supplied to a terminal 519 arranged so as not to overlap with the terminal 530. The force is provided by the functional layer 561 disposed between the first substrate 510 and the bonding layer 530. As a result, a novel function that is convenient and reliable can be realized. A functional panel can be provided.

[0262] In addition, a functional layer 562 may be provided between the second base material 570 and the bonding layer 530 .

[0263] The terminal 519 is a flexible printed circuit board FPC1 and, for example, a conductive member ACF1. Electrical connection can be made using the same.

[0264] For example, between the insulating film 510a and the base material 510b, and between the insulating film 510a and the base material 510b The first base material 510 may have a structure in which the resin layer 510c is laminated thereon.

[0265] For example, between the insulating film 570a and the base material 570b, and between the insulating film 570a and the base material 570b The second base material 570 may have a laminated structure with the resin layer 570c.

[0266] For example, a display element 550R, and a partition wall 52 having an opening in a region overlapping with the display element 550R 8, and an insulating layer 521 having a region overlapping with the partition wall 528 can be used for the functional layer 561 be done.

[0267] For example, an insulating layer that suppresses the diffusion of impurities can be used for the functional layer 562. Or, an optical element can be used for the functional layer 562.

[0268] Specifically, a colored layer CF having a region overlapping with the display element 550R and a light-shielding layer BM having an opening in a region overlapping with the display element 550R can be used.

[0269] Hereinafter, each element constituting the functional panel 500 will be described. Note that these configurations cannot be clearly separated, and one configuration may also serve as part of or include another configuration there is.

[0270] For example, the insulating film 510a provided in the first base material 510 can also serve as part of or all of the functional layer 561 while being a part of the first base material 510 also.

[0271] Also, for example, the insulating film 570a provided in the second base material 570 is a part of the second base material 570 and can also serve as part of or all of the functional layer 562.

[0272] 《Configuration Example》 The functional panel 500 includes a terminal 519, a wiring 511, a first base material 510, a bonding layer 530, a release layer 519S, a functional layer 561, and a second base material 570.

[0273] 《Wiring 511, Terminal 519》 For example, materials that can be used for the wiring 111 or the terminal 119 described in Embodiment 1 It can be used for the wiring 511 or the terminal 519.

[0274] 《The first base material 510》 For example, the materials that can be used for the base material 110 described in the first embodiment can be used for the first base material 5 10.

[0275] 《The second base material 570》 For example, the materials that can be used for the base material 170 described in the first embodiment can be used for the second base material 5 70.

[0276] 《The bonding layer 530》 For example, the materials that can be used for the bonding layer 130 described in the first embodiment can be used for the bonding layer 53 0.

[0277] 《The first region A1 and the second region A2》 In addition, the functional panel 500 described in the present embodiment includes a first region A1 where a release layer 519S is disposed between the first base material 510 and the bonding layer 530, and a first region A1 adjacent to the first region A1, and a second region A2 where the release layer 519S is not disposed between the first base material 510 and the bonding layer 530 (see FIG. 11(B)). It has (see FIG. 11(B)). (See FIG. 11(B)).

[0278] And the force required to separate the bonding layer 530 in the first region A1 from the first base material 510 is 1 / 1 of the force required to separate the bonding layer 530 in the second region A2 from the first base material 510 0 times or more and less than 1 time.

[0279] Or the force required to separate the bonding layer 530 in the first region A1 from the first base material 510 is 0.03 N or more and 8.0 N or less.

[0280] Thus, the bonding layer 530 in the region overlapping with the release layer 519S prevents the destruction of the terminal 519 2. can be selectively separated from the first substrate 510. As a result, a novel functional panel with excellent convenience or reliability can be provided.

[0281] <Release layer 519S> Various configurations can be used for the release layer 519S. For example, the materials used for the release layer 119S described in Embodiment 1 can be used.

[0282] <Functional layer 561> For example, a layer including one or more selected from functional circuits, functional elements, optical elements, or functional films, etc., which can be used for the functional layer 161 described in Embodiment 1, can be used for the functional layer 561.

[0283] Specifically, the functional layer 161 includes a pixel 502 supplied with a control signal and an image signal, a driving circuit GD that supplies a control signal, a driving circuit SD that supplies an image signal, a wiring 511 electrically connected to the driving circuit SD, and a terminal 519 electrically connected to the wiring 511, and has (see FIGS. 11(A) and 11(B)). The pixel 502 includes a plurality of sub-pixels (e.g., sub-pixel 502R), etc. Note that sub-pixels having a function of displaying various

[0284] colors can be used. Specifically, a sub-pixel having a function of displaying red can be used for the sub-pixel 502R. Also, sub-pixels having a function of displaying green or blue, etc., can be used for the pixel 502.

[0285] The sub-pixel 502R includes a display element 550R, a colored layer CF provided in a region overlapping the display element 550R, a pixel circuit between the layer 553 containing a light-emitting organic compound and the first substrate 510, and It includes (see Fig. 11(B)).

[0286] The pixel circuit has a function of supplying power to the display element 550R based on a control signal and an image signal. It includes. For example, a driving transistor M0 or a capacitive element can be used for the pixel circuit. It can be used.

[0287] The display element 550R includes a first electrode 551R and a second electrode 552 to which power is supplied, and a layer 553 containing a light-emitting organic compound between the first electrode 551R and the second electrode 552. and includes them.

[0288] The first electrode 551R is electrically connected to the source electrode or drain electrode of the driving transistor M0. It is connected.

[0289] Specifically, various sequential circuits such as a shift register can be used for the driving circuit GD or the driving circuit SD. Also, the driving circuit SD includes a transistor MD or a capacitor CD. For example, a transistor that can be formed in the same process as the driving transistor M0 can be used for the transistor MD. SD can be used. Also, the driving circuit SD includes a transistor MD or a capacitor CD. For example, a transistor that can be formed in the same process as the driving transistor M0 can be used for the transistor MD. It can be used. It can be used.

[0290] For example, in this specification, etc., an active matrix method having an active element in a pixel or a passive matrix method having no active element in a pixel can be used. It can be used.

[0291] In the active matrix method, as active elements (active elements, non-linear elements), not only transistors but also various active elements (active elements, non-linear elements) can be used. For example, MIM (Metal Insulator Metal), or TF D (Thin Film Diode), etc. can also be used. These elements can be used. For example, MIM (Metal Insulator Metal), or TF D (Thin Film Diode), etc. can also be used. These elements Since the number of manufacturing processes is small, it is possible to reduce the manufacturing cost or improve the yield. Alternatively, since the size of these elements is small, the aperture ratio can be improved, and low power consumption and high brightness can be achieved.

[0292] Alternatively, one aspect of the present invention can also be applied to an illumination device without pixels.

[0293] 《Functional layer 562》 For example, a functional circuit, a functional element that can be used for the functional layer 161 described in Embodiment 1, a layer including one or more selected from optical elements or functional films, etc. can be used for the functional layer 562.

[0294] Specifically, the functional layer 562 can use a colored layer CF having a region overlapping with the display element 550R and a light-shielding layer BM having an opening in a region overlapping with the display element 550R (see Fig. 11 (B)). (Refer to (B).)

[0295] 《Other configurations》 In addition, a display module according to one aspect of the present invention has a functional film 570p in a region overlapping with the pixel 502. For example, a polarizing plate can be used for the functional film 570p.

[0296] <Configuration example of the display module.> A display module according to one aspect of the present invention includes a functional panel 500, a flexible printed circuit board FPC1 having a region overlapping with the terminal 51 9 of the functional panel 500, and a conductive member ACF1 between the functional panel 500 and the flexible printed circuit board FPC1.

[0297] The functional panel 500 includes a display element 550R, and the flexible printed circuit board FP C1 includes a wiring PW, and the conductive member ACF1 electrically connects the terminal 519 and the wiring PW. Continue.

[0298] Also, the conductive member ACF1 contains conductive particles CP, and the conductive particles CP electrically connect the terminal 519 and the wiring PW.

[0299] 《Printed Circuit Board》 For example, the materials used for the flexible printed circuit board FPC1 described in Embodiment 1 can be used for the printed circuit board. can be used.

[0300] 《Conductive Member》 For example, the materials used for the conductive member ACF1 described in Embodiment 1 can be used for the conductive member.

[0301] Note that this embodiment can be appropriately combined with other embodiments shown in this specification. .

[0302] (Embodiment 4) In this embodiment, the configurations of the position information input panel and the position information input module of one aspect of the present invention will be described with reference to FIGS. 12 and 13. will be described.

[0303] FIGS. 12 and 13 are diagrams for explaining the configurations of the position information input panel and the position information input module of one aspect of the present invention. is a diagram.

[0304] FIG. 12(A) is a top view of the position information input panel of one aspect of the present invention, and FIG. 12(B) is a cross-sectional view taken along the cut lines X1-X2 and X3-X4 of FIG. 12(A).

[0305] FIG. 13(A) is a projection view of the position information input panel of one aspect of the present invention. For convenience of explanation, For this purpose, a part of the position information input panel is enlarged and shown in the figure. FIG. 13(B) is a top view of the proximity sensor of the position information input panel, and FIG. 13(C) is a cross-sectional view taken along the cutting line X5-X6 of FIG. 13(B). FIG. 13(B) is a top view of the proximity sensor of the position information input panel, and FIG. 13(C) is a cross-sectional view taken along the cutting line X5-X6 of FIG. 13(B). FIG. 13(C) is a cross-sectional view taken along the cutting line X5-X6 of FIG. 13(B).

[0306] <Configuration example of the position information input panel> The functional panel 500TP provided with the proximity sensor 575 can also be referred to as the position information input panel. Also, the functional panel 500TP provided with the proximity sensor 575 and the display element 550R can also be referred to as a touch panel. FIG. 13(C) is a cross-sectional view taken along the cutting line X5-X6 of FIG. 13(B).

[0307] The functional panel 500TP is different from the functional panel 500 described with reference to FIG. 11 in that it has a terminal 579, has a wiring 578 electrically connected to the terminal 579, has a release layer 579S between the second base material 570 and the bonding layer 530, and has a different configuration of the functional layer 562 (see FIG. 12(B)). Here, the different configurations will be described in detail, and the parts where the same configurations can be used will be incorporated by reference to the above description. The functional panel 500TP is different from the functional panel 500 described with reference to FIG. 11 in that it has a terminal 579, has a wiring 578 electrically connected to the terminal 579, has a release layer 579S between the second base material 570 and the bonding layer 530, and has a different configuration of the functional layer 562 (see FIG. 12(B)). Here, the different configurations will be described in detail, and the parts where the same configurations can be used will be incorporated by reference to the above description. The functional panel 500TP is different from the functional panel 500 described with reference to FIG. 11 in that it has a terminal 579, has a wiring 578 electrically connected to the terminal 579, has a release layer 579S between the second base material 570 and the bonding layer 530, and has a different configuration of the functional layer 562 (see FIG. 12(B)). Here, the different configurations will be described in detail, and the parts where the same configurations can be used will be incorporated by reference to the above description. Here, the different configurations will be described in detail, and the parts where the same configurations can be used will be incorporated by reference to the above description. Here, the different configurations will be described in detail, and the parts where the same configurations can be used will be incorporated by reference to the above description.

[0308] Note that the functional layer 562 includes a proximity sensor 575 electrically connected to the wiring 578.

[0309] Thereby, a signal or power can be supplied to the terminal 579 disposed between the release layer 579S and the second base material 570 so as not to overlap the bonding layer 530. A signal or power can be supplied to the proximity sensor 575 included in the functional layer 562 disposed between the second base material 570 and the bonding layer 530. As a result, a novel functional panel excellent in convenience or reliability can be provided. Thereby, a signal or power can be supplied to the terminal 579 disposed between the release layer 579S and the second base material 570 so as not to overlap the bonding layer 530. A signal or power can be supplied to the proximity sensor 575 included in the functional layer 562 disposed between the second base material 570 and the bonding layer 530. As a result, a novel functional panel excellent in convenience or reliability can be provided. A signal or power can be supplied to the proximity sensor 575 included in the functional layer 562 disposed between the second base material 570 and the bonding layer 530. As a result, a novel functional panel excellent in convenience or reliability can be provided. As a result, a novel functional panel excellent in convenience or reliability can be provided.

[0310] 《Configuration example》 The functional panel 500TP includes a terminal 519, a wiring 511, a first base material 510, a bonding layer 530, a release layer 519S, a functional layer 561, a second base material 570, a terminal 579, a wiring 578, a release layer 5 79S or a proximity sensor 575.

[0311] 《Wiring 578, Terminal 579》 For example, the materials used for the wiring 111 or the terminal 119 described in the first embodiment can be used for the wiring 578 or the terminal 579.

[0312] 《First Region B1, Second Region B2》 Also, the functional panel 500TP described in this embodiment has a first region B1 where a release layer 579S is disposed between the second base material 570 and the bonding layer 53 0, and a second region B2 adjacent to the first region B1 where the release layer 579S is not disposed between the second base material 570 and the bonding layer 530 (see FIG. 12(B)). (See FIG. 12(B)).

[0313] And the force required to separate the bonding layer 530 of the first region B1 from the second base material 570 is 1 / more than 1 / 10 times and less than 1 time the force required to separate the bonding layer 530 of the second region B2 from the second base material 570.

[0314] Or, the force required to separate the bonding layer 530 of the first region B1 from the second base material 570 is 0.03 N or more and 8.0 N or less.

[0315] Thereby, the bonding layer 530 in the region overlapping with the release layer 579S can be selectively separated from the second base material 570 while preventing the destruction of the terminal 579. As a result, a new functional panel excellent in convenience or reliability can be provided. can be provided.

[0316] 《Release Layer 579S》 Various configurations can be used for the release layer 579S. For example, the materials used for the release layer 119S described in Embodiment 1 can be used. Note that the release layer 579S is disposed between the wiring 578 and the bonding layer 530.

[0317] 《Proximity Sensor 575》 A detection element that detects capacitance, illuminance, magnetic force, radio waves, pressure, etc. and supplies a signal based on the detected physical quantity can be used in the functional layer.

[0318] For example, a conductive film, a photoelectric conversion element, a magnetic detection element, a piezoelectric element, a resonator, or the like can be used as the detection element.

[0319] For example, a detection circuit having a function of supplying a signal that changes based on the capacitance parasitic on the conductive film can be used in the functional layer. A control signal is supplied to the first electrode, and the potential of the second electrode that changes based on the supplied control signal and capacitance is acquired and supplied as a detection signal. Thereby, a finger or the like approaching the conductive film in the air can be detected using the change in capacitance.

[0320] For example, a first electrode C1(i) and a second electrode C2(j) having a portion that does not overlap with the first electrode C1(i) can be used for the proximity sensor 575 (see FIGS. 13(A) and 13(B)). Note that i and j are natural numbers of 1 or more.

[0321] Specifically, a first electrode C1(i) electrically connected to a control line CL(i) extending in the row direction (the direction of the arrow indicated by R in the figure) and a second electrode C2(j) extending in the column direction (the direction of the arrow indicated by C in the figure) A second electrode C2(j) electrically connected to the signal line ML(j) can be used in the proximity sensor 575. It can be used.

[0322] For example, a conductive film provided in a region overlapping the pixel 502 or the sub-pixel 502R in a light-transmissive region can be used for the first electrode C1(i) or the second electrode C2(j). It can be used.

[0323] For example, a mesh-like conductive film provided in a region overlapping the pixel 502 or the sub-pixel 502R in the opening 576 can be used for the first electrode C1(i) or the second electrode C2(j). It can be used.

[0324] The control line CL(i) includes the wiring BR(i,j). The control line CL(i) intersects the signal line ML(j) at the wiring BR(i,j) (see FIG. 13(C)). An insulating film 571 is provided between the wiring BR(i,j) and the signal line ML(j). Thereby, a short circuit between the wiring BR(i,j) and the signal line ML(j) can be prevented. j) (see FIG. 13(C)). An insulating film 571 is provided between the wiring BR(i,j) and the signal line ML(j). Thereby, a short circuit between the wiring BR(i,j) and the signal line ML(j) can be prevented. An insulating film 571 is provided between the wiring BR(i,j) and the signal line ML(j). Thereby, a short circuit between the wiring BR(i,j) and the signal line ML(j) can be prevented. It can prevent a short circuit between the wiring BR(i,j) and the signal line ML(j).

[0325] Either the control line CL(i) or the signal line ML(j) is electrically connected to the terminal 579. The control line CL(i) can supply a control signal, for example, and the signal line ML(j) can supply a detection signal, for example. The control line CL(i) can supply a control signal, for example, and the signal line ML(j) can supply a detection signal, for example. It can supply a detection signal, for example.

[0326] <Configuration example of the position information input module.> The position information input module according to one aspect of the present invention includes a functional panel 500TP, a flexible printed circuit board FPC2 provided in a region overlapping the terminal 579 of the functional panel 500TP, and a conductive member ACF2 between the functional panel 500TP and the flexible printed circuit board FPC2 (see FIGS. 12(A) and 12(B)). The position information input module according to one aspect of the present invention includes a functional panel 500TP, a flexible printed circuit board FPC2 provided in a region overlapping the terminal 579 of the functional panel 500TP, and a conductive member ACF2 between the functional panel 500TP and the flexible printed circuit board FPC2 (see FIGS. 12(A) and 12(B)). The position information input module according to one aspect of the present invention includes a functional panel 500TP, a flexible printed circuit board FPC2 provided in a region overlapping the terminal 579 of the functional panel 500TP, and a conductive member ACF2 between the functional panel 500TP and the flexible printed circuit board FPC2 (see FIGS. 12(A) and 12(B)). It has (see FIGS. 12(A) and 12(B)).

[0327] The functional panel 500TP is provided with a proximity sensor 575 and a flexible printed circuit board The FPC2 is provided with a wiring PW, and the conductive member ACF2 electrically connects the terminal 579 and the wiring PW to each other.

[0328] Further, the conductive member ACF2 contains conductive particles CP, and the conductive particles CP electrically connect the terminal 519 and the wiring PW to each other.

[0329] 《Printed Circuit Board》 For example, the materials used for the flexible printed circuit board FPC1 described in Embodiment 1 can be used for the printed circuit board as well.

[0330] 《Conductive Member》 For example, the materials used for the conductive member ACF1 described in Embodiment 1 can be used for the conductive member as well.

[0331] Note that this embodiment can be appropriately combined with other embodiments shown in this specification .

[0332] (Embodiment 5) In this embodiment, an apparatus having a functional panel according to one aspect of the present invention will be described with reference to FIGS. 14 to 1 6.

[0333] 《Light-Emitting Device》 A light-emitting device according to one aspect of the present invention will be described with reference to FIG. 14

[0334] FIG. 14(A) is a block diagram for explaining the light-emitting device 5000A. Further, FIGS. 14(B) and FIG. 14(C) are projection views for explaining the light-emitting device 5000A according to one aspect of the present invention

[0335] The light-emitting device 5000A for explaining this embodiment includes a light-emitting module 5100 and a light-emitting module It has a drive unit 5110 electrically connected to the - rule 5100. And the drive unit 511 0 includes a constant - current power supply 5111 (see Fig. 14(A)).

[0336] Also, the light - emitting device 5000A has a housing 5101. The housing 5101 supports the light - emitting module 5100, the drive unit 5110, and the switch SW.

[0337] For example, a rotatable member can be used for the member of the housing 5101 that supports the light - emitting module 5100 Specifically, a hinge can be used as the rotatable member. By using a rotatable member to support the light - emitting module 5100, the light - emitting module 5100 can be placed in a standing - up state or also in a folded state. (See Fig. 14(B) and Fig. 14(C))

[0338] The light - emitting device 5000A includes a functional panel according to one aspect of the present invention. For example, the functional panel 100 described in Embodiment 1 can be used.

[0339] Thereby, power can be supplied to the terminals arranged so as not to overlap the bonding layer between the release layer and the first base material Power can be supplied to the light - emitting elements of the functional layer arranged between the base material and the bonding layer. As a result, a novel light - emitting device excellent in convenience or reliability can be provided

[0340] 《Display device》 A display device according to one aspect of the present invention will be described with reference to Fig. 15.

[0341] Fig. 15(A) is a block diagram for explaining a display device 5000B according to one aspect of the present invention. Also ​​Figs. 15(B) to 15(E) illustrate a display device 5000B according to an aspect of the present invention. These are projection views.

[0342] The display device 5000B described in this embodiment includes a display module 5500 and a driving unit 5520 electrically connected to the display module 5500. The driving unit 5520 includes a timing signal generation circuit 5521 (see Fig. 15(A)).

[0343] The display device 5000B also has a housing 5501 and a housing 5502. The housing 5501 houses the driving unit 5520. The housing 5502 supports the display module 5500.

[0344] For example, a housing having an outer shape along a cylindrical column or the like can be used as the housing 5502. Thereby, the display module can be supported in a curved state (see Fig. 15(B)). For example, it can be installed on a column of a building to display an advertisement.

[0345] For example, the display module described in Embodiment 2 can be used as the display module 5500.

[0346] For example, a circuit having a function of supplying a selection signal for a scanning line, a start pulse of a shift register, etc. can be used as the timing signal generation circuit 5521.

[0347] Thereby, a signal or power can be supplied to a terminal disposed between the release layer and the first substrate so as not to overlap the bonding layer. A signal or power can be supplied to a display element of a functional layer disposed between the substrate and the bonding layer. As a result, a novel display device excellent in convenience or reliability can be provided. ​

[0348] "Information Processing Device" An information processing device according to an aspect of the present invention will be described with reference to FIG. 16.

[0349] FIG. 16(A) is a block diagram for explaining the configuration of an information processing device 5000C according to an aspect of the present invention. FIG. 16(B) is a top view for explaining the information processing device 5000C according to an aspect of the present invention. FIG. 16(C) is a cross-sectional view for explaining the information processing device 5000C along the cutting line V1-V2 of FIG. 16(B).

[0350] The information processing device 5000C for explaining the present embodiment includes a position information input module 5500T P, a drive unit 5530 electrically connected to the position information input module 5500TP, and a detection circuit 5531 electrically connected to the drive unit 5530 (see FIG. 16(C)).

[0351] The information processing device 5000C also includes a housing 5503. The housing 5503 supports the position information input module 5500TP and the drive unit 5530. For example, a housing that can be folded in two can be used.

[0352] The information processing device 5000C includes a function panel according to an aspect of the present invention. For example, the function panel 500TP described in Embodiment 4 can be used.

[0353] The detection circuit 5531 includes a detector and detects the state of the information processing device 5000C. For example, it detects the inclination of the information processing device 5000C, the brightness of the environment in which it is placed, or whether the state of the foldable housing is in a folded state.

[0354] ​​​​​In addition, the information processing apparatus 5000C includes a computing unit CPU, a storage unit MEM that stores a program to be executed by the computing unit CPU, and a power supply BT that supplies power to drive the computing unit CPU.

[0355] For example, a battery can be used as the power supply BT.

[0356] The housing 5503 has a function of housing the computing unit CPU, the storage unit MEM, the switch SW, or the battery BT, etc.

[0357] As a result, the signal detected by the proximity sensor can be supplied to the conductive particles disposed so as not to overlap the bonding layer between the release layer and the first base material, and the signal can be supplied to the detection circuit. Consequently, a novel information processing apparatus excellent in convenience or reliability can be provided.

[0358] Note that this embodiment can be appropriately combined with other embodiments shown in this specification.

Example

[0359] In this example, the configuration of the display module of one aspect of the present invention that has been manufactured will be described with reference to FIGS. 17 and 18.

[0360] FIG. 17(A) is a schematic diagram for explaining the configuration of the manufactured display module 1100M.

[0361] FIG. 17(B) is a diagram for explaining the configuration of a release layer 1119S having a region overlapping the terminal 1119 and a first base material 1110 having a region overlapping the terminal 1119.

[0362] ​​​​​​​​FIG. 18(A) is an optical micrograph of the appearance of the circular region P shown in FIG. 17(A), and is taken from the substrate 1110 side.

[0363] FIG. 18(B-1) is an electron micrograph for explaining the structure of a cross section in the portion shown between arrow P3 and arrow P4 in FIG. 18(A). FIG. 18(B-2) is a photograph for explaining in detail the region surrounded by the dashed rectangle in FIG. 18(B-1). The cross section is formed using FIB and observed using a scanning transmission electron microscope (STEM).

[0364] FIG. 18(C-1) is an electron micrograph for explaining the structure of a cross section in the portion shown between arrow P5 and arrow P6 in FIG. 18(A). FIG. 18(C-2) is a photograph for explaining in detail the region surrounded by the dashed rectangle in FIG. 18(C-1).

[0365] <Display module 1100M> The display module 1100M includes a display panel 1100, a flexible printed circuit board FPC, and an anisotropic conductive film (see FIG. 17(A)).

[0366] The display panel 1100 includes a terminal 1119 and a release layer 1119S provided in a region overlapping the terminal 1119. The display panel 1100 also includes a light-emitting element 1150 electrically connected to the terminal 1119.

[0367] The anisotropic conductive film is disposed between the terminal 1119 and the flexible printed circuit board FPC, and is thermocompression bonded to the terminal 1119 and the flexible printed circuit board FPC. The anisotropic conductive film includes conductive particles and a resin for dispersing the conductive particles. ​​​​​​​​​​​​

[0368] "First Substrate 1110" A laminated material in which a first substrate 1110b, a resin layer 1110c, and an insulating film 1110a are laminated in this order was used for the first substrate 1110 (see Fig. 17(B)).

[0369] An aramid film was used for the first substrate 1110b, and an epoxy resin was used for the resin layer 1110c .

[0370] A film including a laminated material in which a silicon oxynitride film with a thickness of 600 nm, a silicon nitride film with a thickness of 200 nm, a silicon oxynitride film with a thickness of 200 nm, a silicon nitride oxynitride film with a thickness of 140 nm, and a silicon oxynitride film with a thickness of 100 nm are laminated in this order was used for the insulating film 1110a . .

[0371] "Terminal" A laminated material in which an aluminum film and a titanium film are laminated in this order was used for the terminal 1119

[0372] "Release Layer" A configuration having a first layer 1510 and a second layer 1520 having a region overlapping the first layer 1510 was used for the release layer 1119S. The thickness of the first layer 1510 was 74.6 nm, the thickness of the second layer 1520 was 86 nm, and the thickness of the release layer 1119S was 160.6 nm . .

[0373] A laminated structure in which layers 1511 to 1517 are laminated in this order was used for the first layer 1510 . The first layer 1510 contains a light-emitting organic compound. Note that a resistance heating evaporation apparatus was used for the production of layers 1511 to 1517 .

[0374] A laminated structure in which layers 1521 to 1523 are laminated in this order was used for the second layer 1520 . A layer containing lithium fluoride was used for layer 1521, and a layer containing a silver magnesium alloy was used for layer 1522 A layer containing indium tin oxide was used for layer 1523. Note that a resistance heating evaporation apparatus was used for the fabrication of layer 1521 and layer 15 22, and a sputtering apparatus was used for the fabrication of layer 1523 .

[0375] 《Light-emitting element》 The light-emitting element 1150 includes the structure of the release layer 1119S

[0376] 《Particles with conductivity》 A filler coated with a layer containing nickel and gold was used as the conductive particle CP(1) .

[0377] 《Evaluation results》 Terminal 1119(1), the conductive particle CP(1) in contact with terminal 1119(1), were observed (see Fig. 18(B-1) or Fig. 18(B-2)).

[0378] Terminal 1119(2), the conductive particle CP(2) in contact with terminal 1119(2), were observed (see Fig. 18(C-1) or Fig. 18(C-2)).

[0379] Note that, due to the thermocompression bonding process, the conductive particle CP(1) and the conductive particle CP (2) were crushed

[0380] Also, no release layer 1119 S was observed between terminal 1119(1) and the conductive particle CP(1). Also, no release layer 1119S was observed between terminal 1119(2) and the conductive particle CP(2) .

[0381] The resin flows with the thermocompression bonding. Thus, it is considered that the release layer 1119S flowed together with the resin .

[0382] The terminal 1119 and the flexible printed circuit board FPC are electrically connected via conductive particles and a signal can be supplied from the flexible printed circuit board FPC to the display panel 1100 .

[0383] For example, in this specification and the like, in cases explicitly described as X and Y being connected , it is assumed that the cases where X and Y are electrically connected, where X and Y are functionally connected , and where X and Y are directly connected are those disclosed in this specification and the like . Therefore, it is not limited to a predetermined connection relationship, for example, the connection relationship shown in the figure or the text , and those other than the connection relationship shown in the figure or the text are also considered to be those described in the figure or the text .

[0384] Here, it is assumed that X and Y are objects (for example, devices, elements, circuits, wirings, electrodes, terminals, conductive films, layers , etc.).

[0385] As an example of the case where X and Y are directly connected, an element that enables electrical connection between X and Y (for example, a switch, transistor, capacitor element, inductor, resistor element, diode , display element, light-emitting element, load, etc.) is not connected between X and Y , and X and Y are connected without an element (for example, a switch, transistor, capacitor element, inductor, resistor element, diode, display element, light-emitting element, load, etc.) that enables electrical connection between X and Y . As an example of the case where X and Y are electrically connected, an element that enables electrical connection between X and Y (for example, a switch, transistor, capacitor element, inductor, resistor element, diode

[0386] For example, in this specification and the like, in cases explicitly described as X and Y being connected , it is assumed that the cases where X and Y are electrically connected, where X and Y are functionally connected One or more of an audio, a display element, a light emitting element, a load, etc. can be connected between X and Y. Note that the switch has a function of controlling on and off. That is, the switch becomes a conduction state (on state) or a non-conduction state (off state), and has a function of controlling whether to allow current to flow or not. Or, the switch has a function of selecting and switching a path through which current flows. Note that when X and Y are electrically connected, it shall include the case where X and Y are directly connected.

[0387] As an example of the case where X and Y are functionally connected, a circuit that enables functional connection between X and Y (for example, a logic circuit (inverter, NAND circuit, NOR circuit, etc.), a signal conversion circuit (DA conversion circuit, AD conversion circuit, gamma correction circuit, etc.), a potential level conversion circuit (a power supply circuit (boost circuit, buck circuit, etc.), a level shifter circuit that changes the potential level of a signal, etc.), a voltage source, a current source, a switching circuit, an amplification circuit (a circuit that can increase a signal amplitude or a current amount, an operational amplifier, a differential amplification circuit, a source follower circuit, a buffer circuit, etc.), a signal generation circuit, a memory circuit, a control circuit, etc.) can be connected between X and Y. Note that as an example, even if another circuit is sandwiched between X and Y, when the signal output from X is transmitted to Y, X and Y are considered to be functionally connected. Note that when X and Y are functionally connected, it shall include the case where X and Y are directly connected and the case where X and Y are electrically connected.

[0388] Note that when it is explicitly described that X and Y are electrically connected, X and Y when they are electrically connected (i.e., connected with another element or another circuit interposed between X and Y) and when X and Y are functionally connected (i.e., functionally connected with another circuit interposed between X and Y) and when X and Y are directly connected (i.e., connected without another element or another circuit interposed between X and Y) shall be as disclosed in this specification and the like. That is, when explicitly described as being electrically connected, it shall be regarded as being disclosed in this specification and the like that it is merely described as being connected, in the same sense as when explicitly described as being connected. For example, when the source (or the first terminal, etc.) of a transistor is electrically connected to X, with or without Z1 therebetween, and the drain (or the second terminal, etc.) of the transistor is electrically connected to Y, with or without Z2 therebetween, or when the source (or the first terminal, etc.) of the transistor is directly connected to a part of Z1, another part of Z1 is directly connected to X, the drain (or the second terminal, etc.) of the transistor is directly connected to a part of Z2, and another part of Z2 is directly connected to Y, it can be expressed as follows. For example, it can be expressed as "X, the source (or the first terminal, etc.) of the transistor, the drain (or the second terminal, etc.) of the transistor, and Y are electrically connected to each other in this order." Or, "The source (or the first terminal, etc.) of the transistor... shall be as disclosed in this specification and the like.

[0389] shall be as disclosed in this specification and the like. That is, when explicitly described as being electrically connected, it shall be regarded as being disclosed in this specification and the like that it is merely described as being connected, in the same sense as when explicitly described as being connected. For example, when the source (or the first terminal, etc.) of a transistor is electrically connected to X, with or without Z1 therebetween, and the drain (or the second terminal, etc.) of the transistor is electrically connected to Y, with or without Z2 therebetween, or when the source (or the first terminal, etc.) of the transistor is directly connected to a part of Z1, another part of Z1 is directly connected to X, the drain (or the second terminal, etc.) of the transistor is directly connected to a part of Z2, and another part of Z2 is directly connected to Y, it can be expressed as follows. For example, when the source (or the first terminal, etc.) of a transistor is electrically connected to X, with or without Z1 therebetween, and the drain (or the second terminal, etc.) of the transistor is electrically connected to Y, with or without Z2 therebetween, or when the source (or the first terminal, etc.) of the transistor is directly connected to a part of Z1, another part of Z1 is directly connected to X, the drain (or the second terminal, etc.) of the transistor is directly connected to a part of Z2, and another part of Z2 is directly connected to Y, it can be expressed as follows. For example, when the source (or the first terminal, etc.) of a transistor is electrically connected to X, with or without Z1 therebetween, and the drain (or the second terminal, etc.) of the transistor is electrically connected to Y, with or without Z2 therebetween, or when the source (or the first terminal, etc.) of the transistor is directly connected to a part of Z1, another part of Z1 is directly connected to X, the drain (or the second terminal, etc.) of the transistor is directly connected to a part of Z2, and another part of Z2 is directly connected to Y, it can be expressed as follows. For example, when the source (or the first terminal, etc.) of a transistor is electrically connected to X, with or without Z1 therebetween, and the drain (or the second terminal, etc.) of the transistor is electrically connected to Y, with or without Z2 therebetween, or when the source (or the first terminal, etc.) of the transistor is directly connected to a part of Z1, another part of Z1 is directly connected to X, the drain (or the second terminal, etc.) of the transistor is directly connected to a part of Z2, and another part of Z2 is directly connected to Y, it can be expressed as follows. For example, when the source (or the first terminal, etc.) of a transistor is electrically connected to X, with or without Z1 therebetween, and the drain (or the second terminal, etc.) of the transistor is electrically connected to Y, with or without Z2 therebetween, or when the source (or the first terminal, etc.) of the transistor is directly connected to a part of Z1, another part of Z1 is directly connected to X, the drain (or the second terminal, etc.) of the transistor is directly connected to a part of Z2, and another part of Z2 is directly connected to Y, it can be expressed as follows. For example, when the source (or the first terminal, etc.) of a transistor is electrically connected to X, with or without Z1 therebetween, and the drain (or the second terminal, etc.) of the transistor is electrically connected to Y, with or without Z2 therebetween, or when the source (or the first terminal, etc.) of the transistor is directly connected to a part of Z1, another part of Z1 is directly connected to X, the drain (or the second terminal, etc.) of the transistor is directly connected to a part of Z2, and another part of Z2 is directly connected to Y, it can be expressed as follows.

[0390] For example, it can be expressed as "X, the source (or the first terminal, etc.) of the transistor, the drain (or the second terminal, etc.) of the transistor, and Y are electrically connected to each other in this order." Or, "The source (or the first terminal, etc.) of the transistor... For example, it can be expressed as "X, the source (or the first terminal, etc.) of the transistor, the drain (or the second terminal, etc.) of the transistor, and Y are electrically connected to each other in this order." Or, "The source (or the first terminal, etc.) of the transistor... For example, it can be expressed as "X, the source (or the first terminal, etc.) of the transistor, the drain (or the second terminal, etc.) of the transistor, and Y are electrically connected to each other in this order." Or, "The source (or the first terminal, etc.) of the transistor... For example, it can be expressed as "X, the source (or the first terminal, etc.) of the transistor, the drain (or the second terminal, etc.) of the transistor, and Y are electrically connected to each other in this order." Or, "The source (or the first terminal, etc.) of the transistor... The terminal of 1 (such as the drain of the transistor or the second terminal) is electrically connected to X, and the drain of the transistor (or the second terminal) is electrically connected to Y. X, the source of the transistor (or the first terminal), the drain of the transistor (or the second terminal), and Y are electrically connected in this order. It can be expressed as "". Or, "X is electrically connected to Y via the source of the transistor (or the first terminal) and the drain of the transistor (or the second terminal). X, the source of the transistor (or the first terminal), the drain of the transistor (or the second terminal), and Y are provided in this connection order." Using the same expression method as these examples, by stipulating the connection order in the circuit configuration, the source of the transistor (or the first terminal) and the drain of the transistor (or the second terminal) can be distinguished, and the technical scope can be determined. Or, as another expression method, for example, "The source of the transistor (or the first terminal) is electrically connected to X via at least the first connection path. The first connection path does not have the second connection path. The second connection path is the path between the source of the transistor (or the first terminal) and the drain of the transistor (or the second terminal) through the transistor. The first connection path is the path through Z1. The drain of the transistor (or the second terminal) is electrically connected to Y via at least the third connection path. The third connection path does not have the second connection path. The third connection path is the path through Z2." It can be expressed as "". Or, "The source of the transistor (or the first terminal) is electrically connected to Y via the source of the transistor (or the first terminal) and the drain of the transistor (or the second terminal). X, the source of the transistor (or the first terminal), the drain of the transistor (or the second terminal), and Y are provided in this connection order." Using the same expression method as these examples, by stipulating the connection order in the circuit configuration, the source of the transistor (or the first terminal) and the drain of the transistor (or the second terminal) can be distinguished, and the technical scope can be determined. Or, as another expression method, for example, "The source of the transistor (or the first terminal) is electrically connected to X via at least the first connection path. The first connection path does not have the second connection path. The second connection path is the path between the source of the transistor (or the first terminal) and the drain of the transistor (or the second terminal) through the transistor. The first connection path is the path through Z1. The drain of the transistor (or the second terminal) is electrically connected to Y via at least the third connection path. The third connection path does not have the second connection path. The third connection path is the path through Z2." Using the same expression method as these examples, by stipulating the connection order in the circuit configuration, the source of the transistor (or the first terminal) and the drain of the transistor (or the second terminal) can be distinguished, and the technical scope can be determined. Or, as another expression method, for example, "The source of the transistor (or the first terminal) is electrically connected to X via at least the first connection path. The first connection path does not have the second connection path. The second connection path is the path between the source of the transistor (or the first terminal) and the drain of the transistor (or the second terminal) through the transistor. The first connection path is the path through Z1. The drain of the transistor (or the second terminal) is electrically connected to Y via at least the third connection path. The third connection path does not have the second connection path. The third connection path is the path through Z2." Using the same expression method as these examples, by stipulating the connection order in the circuit configuration, the source of the transistor (or the first terminal) and the drain of the transistor (or the second terminal) can be distinguished, and the technical scope can be determined.

[0391] Or, as another expression method, for example, "The source of the transistor (or the first terminal) is electrically connected to X via at least the first connection path. The first connection path does not have the second connection path. The second connection path is the path between the source of the transistor (or the first terminal) and the drain of the transistor (or the second terminal) through the transistor. The first connection path is the path through Z1. The drain of the transistor (or the second terminal) is electrically connected to Y via at least the third connection path. The third connection path does not have the second connection path. The third connection path is the path through Z2." The source of the transistor (or the first terminal) is electrically connected to X via at least the first connection path. The first connection path does not have the second connection path. The second connection path is the path between the source of the transistor (or the first terminal) and the drain of the transistor (or the second terminal) through the transistor. The first connection path is the path through Z1. The drain of the transistor (or the second terminal) is electrically connected to Y via at least the third connection path. The third connection path does not have the second connection path. The third connection path is the path through Z2. It can be expressed as "". Or, "The source of the transistor (or the first terminal) is electrically connected to Y via the source of the transistor (or the first terminal) and the drain of the transistor (or the second terminal). X, the source of the transistor (or the first terminal), the drain of the transistor (or the second terminal), and Y are provided in this connection order." Using the same expression method as these examples, by stipulating the connection order in the circuit configuration, the source of the transistor (or the first terminal) and the drain of the transistor (or the second terminal) can be distinguished, and the technical scope can be determined. Or, as another expression method, for example, "The source of the transistor (or the first terminal) is electrically connected to X via at least the first connection path. The first connection path does not have the second connection path. The second connection path is the path between the source of the transistor (or the first terminal) and the drain of the transistor (or the second terminal) through the transistor. The first connection path is the path through Z1. The drain of the transistor (or the second terminal) is electrically connected to Y via at least the third connection path. The third connection path does not have the second connection path. The third connection path is the path through Z2." Using the same expression method as these examples, by stipulating the connection order in the circuit configuration, the source of the transistor (or the first terminal) and the drain of the transistor (or the second terminal) can be distinguished, and the technical scope can be determined. Or, as another expression method, for example, "The source of the transistor (or the first terminal) is electrically connected to X via at least the first connection path. The first connection path does not have the second connection path. The second connection path is the path between the source of the transistor (or the first terminal) and the drain of the transistor (or the second terminal) through the transistor. The first connection path is the path through Z1. The drain of the transistor (or the second terminal) is electrically connected to Y via at least the third connection path. The third connection path does not have the second connection path. The third connection path is the path through Z2." Using the same expression method as these examples, by stipulating the connection order in the circuit configuration, the source of the transistor (or the first terminal) and the drain of the transistor (or the second terminal) can be distinguished, and the technical scope can be determined. The source of the transistor (or the first terminal) is electrically connected to X via at least the first connection path. The first connection path does not have the second connection path. The second connection path is the path between the source of the transistor (or the first terminal) and the drain of the transistor (or the second terminal) through the transistor. The first connection path is the path through Z1. The drain of the transistor (or the second terminal) is electrically connected to Y via at least the third connection path. The third connection path does not have the second connection path. The third connection path is the path through Z2. and is electrically connected to X, and the first connection path does not have a second connection path. The second connection path has a connection path through a transistor, and the drain (or the second terminal, etc.) is electrically connected to Y via Z2 by at least a third connection path. The third connection path does not have the second connection path. It can be expressed as follows. Or, "The source of the transistor (or the first terminal, etc.) is electrically connected to X via Z1 by at least a first electrical path, and the first electrical path does not have a second electrical path. The second electrical path is an electrical path from the source of the transistor (or the first terminal, etc.) to the drain of the transistor (or the second terminal, etc.). The drain of the transistor (or the second terminal, etc.) is electrically connected to Y via Z2 by at least a third electrical path, and the third electrical path does not have a fourth electrical path. The fourth electrical path is an electrical path from the drain of the transistor (or the second terminal, etc.) to the source of the transistor (or the first terminal, etc.)." It can be expressed as follows. By using an expression method similar to these examples to define the connection path in the circuit configuration, the source of the transistor (or the first terminal etc.) and the drain (or the second terminal, etc.) can be distinguished to determine the technical scope. Note that these expression methods are just examples and are not limited to these expression methods. Here, X, Y, Z1, and Z2 are assumed to be objects (for example, devices, elements, circuits, wirings, electrodes, terminals, conductive films, layers, etc.).

[0392] etc.).

[0393] ​​​​​​​​​ In addition, the circuit diagram shows independent components as if they are electrically connected to each other. Even if the components are the same, one component may have the functions of multiple components. For example, when a part of the wiring also functions as an electrode, one conductive film has the function of the wiring and The electrode functions as both components. The term "electrochemically connected" refers to a case where one conductive film has the functions of multiple components. This also falls within the scope of the above. [Explanation of symbols]

[0394] A1 area A2 area ACF1 Conductive material ACF2 Conductive material B1 area B2 area BF base material BM light shielding layer BR wiring C1 electrode C2 electrode CF colored layer CL Control Line CP particles CVL coating layer FPC Flexible Printed Circuit Board FPC1 Flexible Printed Circuit Board FPC2 Flexible Printed Circuit Board M0 drive transistor P area PW wiring 11 Substrate 12 Release layer 13a Release layer 13b Terminal 13c Wiring 13d Functional Layer 13e Peeling layer 13s starting point 21 Substrate 22 Peeling layer 23 Layer to be peeled 30 Bonding layer 31 Resin layer 32 Resin layer 41 Substrate 42 Substrate 81 Member 82 Member 82B Member 91 Member 91s Starting point 99 Nozzle 100 Functional panel 110 Substrate 110a Insulating film 110b Substrate 110c Resin layer 111 Wiring 119 Terminal 119S Release layer 121 Insulating layer 128 Partition wall 130 Bonding layer 150 Light-emitting element 151 Lower electrode 152 Upper electrode 153 Layer 161 Functional layer 162 Functional layer 170 Substrate 170a Insulating film 170b Substrate 170c Resin layer 500 Functional panel 500TP Functional panel 502 Pixel 502R Sub-pixel 510 Substrate 510a Insulating film 510b Substrate 510c Resin layer 511 Wiring 519 Terminal 519S Release layer 521 Insulating layer 528 Partition wall 530 Bonding layer 550R Display element 551R Electrode 552 Electrode 553 Layer 561 Functional layer 562 Functional layer 570 Substrate 570a Insulating film 570b Substrate 570c Resin layer 570p Functional film 571 Insulating film 575 Proximity sensor 576 Opening 578 Wiring 579 Terminal 579S Release layer 1100 Display panel 1100M Display module 1119 Terminal 1119S Release layer 1110 Substrate 1110a Insulating film 1110b Substrate 1110c Resin layer 1150 Light-emitting element 1510 First layer 1511 Layer 1517 Layer 1520 Second layer 1521 Layer 1522 Layer 1523 Layer 5000A Light-emitting device 5000B Display device 5000C Information processing device 5100 Light-emitting module 5101 Housing 5110 Driving unit 5111 Constant current power supply 5500 Display module 5500TP Position information input module 5501 Housing 5502 Housing 5503 Housing 5520 Driving unit 5521 Timing signal generation circuit 5530 Driving unit 5531 Detection circuit

Claims

【Claim 1】 It has a release layer, a first substrate, terminals, a second substrate, a bonding layer, and a functional layer, The first substrate has a region overlapping with the release layer, The terminals are disposed between the release layer and the first substrate, The second substrate has a region overlapping with the first substrate, The bonding layer is disposed between the first substrate and the second substrate, The functional layer is disposed between the first substrate and the bonding layer, The functional layer includes functional elements, The functional elements are electrically connected to the terminals, and it is a functional panel.

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