Composition for heat transfer fluid, device provided with heat transfer mechanism, and heat transfer method

Abstract

To provide a heat transfer fluid which is substituted for an existing heat transfer fluid.SOLUTION: A composition for substituting a heat transfer fluid includes at least one selected from the group consisting of perfluorotripropylamine, perfluoropolyether, and a methoxytridecafluoroheptene-isomer mixture including a hexafluoropropene trimer expressed by C9F18.SELECTED DRAWING: None

Description

Technical Field

[0001] The present disclosure relates to a composition for a heat transfer fluid, a device including a heat transfer mechanism, and a heat transfer method.

Background Art

[0002] In electrical and electronic devices, heat management is required. For example, in semiconductor wafer manufacturing, it is necessary to control the process temperature. In addition, it is necessary to remove excess heat generated in microprocessors, data centers, power electronics, or aircraft. To solve such problems, heat transfer fluids are used. Generally, such heat transfer fluids are desired to have a low kinematic viscosity and excellent dielectric properties.

[0003] In addition, heat transfer fluids are also used in applications such as two-phase immersion cooling fluids, chiller fluids, or Rankine cycle working fluids.

[0004] Currently, the following are used for the above applications: · Perfluorotripropylamine (or tris(heptafluoropropyl)amine, or N,N-bis(heptafluoropropyl)(heptafluoropropyl)amine) [N(CF2CF2CF3) n (CF(CF3)CF3) 3-n (n is an integer from 0 to 3) (Patent Document 1); · Perfluoropolyether (PFPE) typified by product names "Galden®" "HT135" and "Galden®" "HT110" (manufactured by Solvay), or more specifically, tetrafluoroethylene oxide polymer (Patent Document 2); and · A methoxytridecafluoroheptene isomer mixture typified by the product name "Opteon SF10" (manufactured by Chemours), or more specifically, methyl-perfluoroheptene ether (MPHE) (C7F 13 OCH3) (Non-Patent Document 1).

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Patent Document 2

Non-Patent Documents

[0006]

Non-Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0007] This disclosure aims to provide a heat transfer fluid that replaces the above-described existing heat transfer fluids.

Means for Solving the Problems

[0008] As a result of intensive research to solve the above problems, the inventors have found that the compound represented by C9F 18 can replace the above-described existing heat transfer fluids. Based on such findings, the inventors have further conducted research and completed this disclosure.

[0009] That is, this disclosure includes the following aspects. Item 1. C9F for use as an alternative to a heat transfer fluid containing at least one selected from the group consisting of perfluorotripropylamine, perfluoropolyether, and a methoxytridecafluoroheptene isomer mixture 18 A composition containing a hexafluoropropene trimer represented by 18 . Item 2. The composition according to Item 1, wherein the hexafluoropropene trimer represented by C9F 18 contains at least one compound selected from the group consisting of compounds represented by the following formulas (I) to (III). 18

Chemical formula

Chemical formula

Advantages of the Invention

[0010] According to the present disclosure, a heat transfer fluid that replaces a heat transfer fluid containing at least one selected from the group consisting of perfluorotripropylamine, perfluoropolyether, and a methoxytridecafluoroheptene isomer mixture can be provided.

Mode for Carrying Out the Invention

[0011] In this specification, "containing" is a concept encompassing any of "comprise", "consist essentially of", and "consist of". Also, in this specification, when a numerical range is indicated as "A to B", it means A or more and B or less.

[0012] 1.C 9 F 18 A composition containing the compound represented by (1) Heat transfer fluid The composition of the present disclosure contains a heat transfer fluid compound, and the heat transfer fluid compound contains a compound represented by C9F 18 and includes a compound represented by

[0013] C9F 18 The compound represented by is preferably a hexafluoropropene (HFP) trimer.

[0014] As the hexafluoropropene trimer, known ones represented by C9F 18 can be widely adopted, and there is no particular limitation.

[0015] Specific examples of such hexafluoropropene trimers include compounds represented by the following formulas (I) to (III).

[0016]

Chemical formula

[0017] In the present disclosure, the compound represented by the above formula (I) includes both the E-form and Z-form of the diastereomer unless otherwise specified.

[0018] C9F of the present disclosure 18The hexafluoropropene trimer contained in the compound represented by may be only one of the compounds represented by the above formulas (I) to (III), or may be a mixture containing two or three of these.

[0019] When the HFP trimer is a mixture, the blending ratio of the compound represented by the above formula (I) in the whole thereof (that is, the total of those contained in the mixture among the compounds represented by formulas (I), (II) and (III)) is preferably 1% by mass or more, more preferably 10% by mass or more, still more preferably 30% by mass or more, particularly preferably 40% by mass or more, particularly preferably 45% by mass or more, and even more particularly preferably 50% by mass or more with respect to the whole HFP trimer. Further, the compound represented by formula (I) is preferably 99% by mass or less, more preferably 90% by mass or less, still more preferably 85% by mass or less (or less) with respect to the whole HFP trimer, even more preferably 80% by mass or less, particularly preferably 70% by mass or less, and most preferably 60% by mass or less. Regarding the blending ratio of the compound represented by the above formula (I), with respect to the total amount of the compound represented by C9F 18 it may be, for example, 10% by mass or more and 90% by mass or less, 30% by mass or more and 90% by mass or less, 10% by mass or more and 85% by mass or less, 35% by mass or more and 85% by mass or less, 10% by mass or more and less than 85% by mass, 20% by mass or more and less than 85% by mass, 30% by mass or more and less than 85% by mass, 40% by mass or more and less than 85% by mass, 50% by mass or more and less than 85% by mass, 40% by mass or more and 80% by mass or less, 55% by mass or more and 80% by mass or less, 60% by mass or more and 75% by mass or less, or 65% by mass or more and 70% by mass or less, 35% by mass or more and 60% by mass or less, 50% by mass or more and 60% by mass or less, and is preferably 30% by mass or more and 90% by mass or less, preferably 40% by mass or more and less than 85% by mass, more preferably 40% by mass or more and 80% by mass or less, still more preferably 45% by mass or more and 70% by mass or less, and even more preferably 50% by mass or more and 60% by mass or less.

[0020] Similarly, with respect to the compounding ratio of the compound represented by formula (II), it is preferably 1% by mass or more, more preferably 5% by mass or more, and particularly preferably 10% by mass or more based on the whole HFP trimer. Further, the compound represented by formula (II) is preferably 70% by mass or less, more preferably 50% by mass or less, even more preferably 30% by mass or less, and particularly preferably 20% by mass or less based on the whole HFP trimer.

[0021] Similarly, with respect to the compounding ratio of the compound represented by formula (III), it is preferably 1% by mass or more, more preferably 5% by mass or more, and particularly preferably 10% by mass or more based on the whole HFP trimer. Further, the compound represented by formula (III) is preferably 70% by mass or less, more preferably 50% by mass or less, even more preferably 30% by mass or less, and particularly preferably 20% by mass or less based on the whole HFP trimer.

[0022] The mass ratio of the compound represented by formula (II) and the compound represented by formula (III) in the HFP trimer is not particularly limited, and can be, for example, 1:9 to 9:1, 2:8 to 8:2, 3:7 to 7:3, 4:6 to 6:4, or 4.5:5.5 to 5.5:4.5.

[0023] The content of the compound represented by C9F in the HFP trimer is preferably 20% by mass or more, more preferably 40% by mass or more, even more preferably 60% by mass or more, and particularly preferably 80% by mass or more based on the whole heat transfer fluid composition. Further, the content of the compound represented by C9F contained in the heat transfer fluid composition is preferably 99.9999% by mass or less based on the whole heat transfer fluid composition. 18 18

[0024] ​​In the entire HFP trimer, the mass ratio of the compound represented by formula (II) and the compound represented by formula (III) is not particularly limited, and can be, for example, 1:9 to 9:1, 2:8 to 8:2, 3:7 to 7:3, 4:6 to 6:4, or 4.5:5.5 to 5.5:4.5.

[0025] The HFP trimer may contain a hexafluoropropene trimer represented by C9F other than the compounds represented by formulas (I) to (III). 18

[0026] The HFP trimer may contain a hexafluoropropene dimer.

[0027] The hexafluoropropene dimer may include (E)-1,1,1,2,3,4,5,5,5-nonafluoro-4-(trifluoromethyl)-2-pentene, (Z)-1,1,1,2,3,4,5,5,5-nonafluoro-4-(trifluoromethyl)-2-pentene, or 1,1,3,4,4,5,5-nonafluoro-2-(trifluoromethyl)-2-pentene.

[0028] The HFP trimer may contain a hexafluoropropene tetramer.

[0029] The hexafluoropropene tetramer may include 1,1,1,2,5,6,6,6-octafluoro-2,3,5-tris(trifluoromethyl)-4-(perfluoropropyl-2-yl)-3-hexene.

[0030] The compounds represented by the above formulas (I) to (III) can be produced by conventional methods. For example, they can be obtained by the method described in International Publication No. 2018 / 172919, but are not limited thereto, and can be obtained by widely adopting known methods. They may also be obtained by trimerizing HFP as a raw material.

[0031] The composition of the present disclosure is C9F 18 ​It may contain additional heat transfer fluid compounds different from the compounds represented by . The additional heat transfer fluid compounds may be one or more. Examples of the additional heat transfer fluid include perfluorotripropylamine, perfluoropolyether, and a methoxytridecafluoroheptene isomer mixture, perfluorotributylamine, and the like.

[0032] Perfluorotripropylamine is also called tris(heptafluoropropyl)amine or N,N-bis(heptafluoropropyl)(heptafluoropropyl)amine, and its general formula is: N(CF2CF2CF3) n (CF(CF3)CF3) 3-n (where n is an integer from 0 to 3). Perfluorotripropylamine may contain only one kind of the compounds represented by the above general formula or may contain a plurality of kinds. N(CF2CF2CF3)3 is preferred, but it may contain N(CF2CF2CF3) n (CF(CF3)CF3) 3-n (where n is an integer from 0 to 2) as impurities. Specifically, products such as "Fluorinate (registered trademark)" (manufactured by 3M) (FC-3283) can be mentioned.

[0033] Perfluoropolyether preferably has the general formula: RO-Rf 1 -R’ represented by In the formula, R and R’ are the same or different and are monovalent groups represented by -C m F 2m+1 where m is an integer from 1 to 8, and Rf 1 is a divalent fluoropolyoxyalkylene group containing 2 to 20 repeating units, and the repeating units are: (i) -CFXO- (where X is F or CF3); (ii) -CF2CFXO- (where X is F or CF3); (iii) -CFXCF2O- (where X is F or CF3); (iv) -CF2CF2CF2O-; or represented by (v)-CF2CF2CF2CF2O-, or Rf 1 is (vi)-(CF2) n -CFY-O- (wherein n is an integer of 0 to 3, and Y is a monovalent group represented by the general formula -ORf 2 Z, where Rf 2 is a divalent fluoropolyoxyalkylene group containing 2 to 20 repeating units, represented by -CFXO-, -CF2CFXO-, -CF2CF2CF2O-, or -CF2CF2CF2CF2O-, where each X is the same or different and is F or CF3, and Z is a monovalent C 1-5 perfluoroalkyl group).

[0034] Specific examples of the perfluoropolyether include products such as GALDEN (registered trademark) "HT135" and GALDEN (registered trademark) "HT110" (manufactured by Solvay).

[0035] The methoxytridecafluoroheptene isomer mixture specifically includes methyl-perfluoroheptene ether (MPHE) (C7F 13 OCH3). Specifically, products such as "Opteon SF10" (manufactured by Chemours) can be mentioned.

[0036] The composition of the present disclosure preferably contains 20% by mass or more, more preferably 40% by mass or more, still more preferably 60% by mass or more, and most preferably 80% by mass or more of the compound represented by C9F 18 However, in the case of containing perfluorotripropylamine, perfluoropolyether, and methoxytridecafluoroheptene isomer mixture, since their properties as heat transfer fluids are similar to those of the compound represented by C9F 18 the properties of the entire composition as a heat transfer fluid are basically unchanged regardless of their content ratios. Therefore, in this case, the composition of the present disclosure contains C9F 18It is preferable to contain the compound represented by 40% to 99.9% by mass, more preferably 60% to 99.9% by mass, and even more preferably 80% to 99.9% by mass.

[0037] (2) Other components In addition to the heat transfer fluid compound, the composition of the present disclosure may further contain other components.

[0038] The composition of the present disclosure may contain a stabilizer. The stabilizer exhibits a stabilizing effect and functions as a so-called acid acceptor or antioxidant. As the stabilizing effect, the main effects include preventing the decomposition of the heat transfer fluid compound by capturing radicals generated in the system, and preventing further decomposition of the heat transfer fluid compound by acid by capturing the acid generated in the system.

[0039] As such a stabilizer, known stabilizers can be widely adopted. Among them, since it can effectively suppress the occurrence of metal corrosion due to the composition, it is preferable to use one or more stabilizers selected from the group consisting of unsaturated alcohol-based stabilizers, nitro-based stabilizers, amine-based stabilizers, phenol-based stabilizers, and epoxy-based stabilizers.

[0040] As the unsaturated alcohol-based stabilizer, known ones can be widely adopted. For example, one or more selected from the group consisting of 3-buten-2-ol, 2-buten-1-ol, 4-propen-1-ol, 1-propen-3-ol, 2-methyl-3-buten-2-ol, 3-methyl-3-buten-2-ol, 3-methyl-2-buten-1-ol, 2-hexen-1-ol, 2,4-hexadien-1-ol, and oleyl alcohol can be used.

[0041] As nitro stabilizers, known ones can be widely adopted. As aliphatic nitro compounds, for example, nitromethane, nitroethane, 1-nitropropane, 2-nitropropane, etc. can be mentioned. As aromatic nitro compounds, for example, one or more selected from the group consisting of nitrobenzene, o-, m- or p-dinitrobenzene, o-, m- or p-nitrotoluene, dimethylnitrobenzene, m-nitroacetophenone, o-, m- or p-nitrophenol, o-nitroanisole, m-nitroanisole and p-nitroanisole can be used.

[0042] As amine stabilizers, known ones can be widely adopted. For example, one or more selected from the group consisting of pentylamine, hexylamine, diisopropylamine, diisobutylamine, di-n-propylamine, diallylamine, triethylamine, N-methylaniline, pyridine, morpholine, N-methylmorpholine, triallylamine, allylamine, α-methylbenzylamine, dimethylamine, trimethylamine, ethylamine, diethylamine, triethylamine, propylamine, isopropylamine, dipropylamine, tripropylamine, butylamine, isobutylamine, dibutylamine, tributylamine, dibenzylamine, tribenzylamine, 2-ethylhexylamine, aniline, N,N-dimethylaniline, N,N-diethylaniline, ethylenediamine, propylenediamine, diethylenetriamine, tetraethylenepentamine, benzylamine, dibenzylamine, diphenylamine and diethylhydroxylamine can be used.

[0043] As phenol stabilizers, known ones can be widely adopted. For example, one or more selected from the group consisting of 2,6-di-tert-butyl-4-methylphenol, 3-cresol, phenol, 1,2-benzenediol, 2-isopropyl-5-methylphenol, and 2-methoxyphenol can be used.

[0044] As epoxy stabilizers, known ones can be widely adopted. For example, one or more selected from the group consisting of butylene oxide, 1,2-propylene oxide, 1,2-butylene oxide, butyl glycidyl ether, diethylene glycol diglycidyl ether, and 1,2-epoxy-3-phenoxypropane can be used.

[0045] For the reason of more effectively preventing the decomposition of the heat transfer fluid compound that may occur due to various causes by using a combination of stabilizers having different stabilizing effects, it is preferable to consist of the above-mentioned epoxy stabilizer and one or more selected from the group consisting of unsaturated alcohol stabilizers, nitro stabilizers, and phenol stabilizers.

[0046] From the viewpoint of effectively suppressing the acid dissociation from the heat transfer fluid compound and suppressing the corrosion of metals by the liquid composition, the content ratio of the stabilizer in the whole composition is preferably 0.0001% by mass or more, and more preferably 0.01% by mass or more. On the other hand, considering the point of avoiding unfavorable physical property changes of the liquid composition due to excessive addition of the stabilizer, the content ratio of the stabilizer in the whole composition is preferably 10% by mass or less, and more preferably 5% by mass or less.

[0047] The composition of the present disclosure is C m F 2m and / or C n F (2n-2) 〔In the formula, m is an integer of 4 or more and 12 or less and other than 9. n is an integer of 4 or more and 12 or less.〕and may contain a compound represented by.

[0048] In the above general formula, m is an integer of 4 or more, preferably an integer of 5 or more, and more preferably an integer of 6 or more. Also, n is an integer of 12 or less, preferably an integer of 11 or less, and more preferably an integer of 10 or less. However, m does not include 9.

[0049] In the above general formula, n is an integer of 4 or more, preferably an integer of 5 or more, and more preferably an integer of 6 or more. Further, n is an integer of 12 or less, preferably an integer of 11 or less, and more preferably an integer of 10 or less. Furthermore, n is particularly preferably 9.

[0050] In the composition of the present disclosure, C m F 2m and / or C n F (2n-2) is included, whereby the stability of the compound represented by C9F 18 is improved.

[0051] Also, the content of C m F 2m and / or C n F (2n-2) is preferably 0.0001% by mass or more based on the entire composition of the present disclosure.

[0052] On the other hand, the content of C m F 2m and / or C n F (2n-2) is preferably 10% by mass or less, preferably 5% by mass or less, and more preferably 1% by mass or less based on the entire composition of the present disclosure.

[0053] In one aspect, in the composition of the present disclosure, the content of C m F 2m and / or C n F (2n-2) is preferably 0.0001 part by mass or more, more preferably 0.01 part by mass or more, and further preferably 0.1 part by mass or more based on 100 parts by mass in total of the HFP trimer.

[0054] On the other hand, in the composition of the present disclosure, the content of C m F 2m and / or C n F (2n-2)The content is preferably 10 parts by mass or less, more preferably 5 parts by mass or less, and even more preferably 1 part by mass or less with respect to 100 parts by mass in total of the HFP trimers.

[0055] In addition, C m F 2m and / or C n F (2n-2) When a plurality of types are included, the above content means the total amount thereof.

[0056] C m F 2m and / or C n F (2n-2) By setting the content of C9F 18 represented by within the above range, the decomposition of the HFP trimer represented by C9F can be suppressed, and thus an increase in fluoride ions and an increase in acidity can be suppressed.

[0057] The composition of the present disclosure may contain fluoride ions. When containing fluoride ions, the content ratio is preferably 0.0000001 to 5% by mass, and more preferably 0.000001 to 1% by mass with respect to the whole composition in terms of the thermal stability of the heat transfer fluid during long-term use.

[0058] The composition of the present disclosure may contain water. When containing water, the content ratio is preferably 1 to 1000 mass ppm with respect to the whole composition in terms of the thermal stability of the heat transfer fluid during long-term use.

[0059] In one aspect, the water content is preferably 0.0001 part by mass or more, more preferably 0.01 part by mass or more, and even more preferably 0.1 part by mass or more with respect to 100 parts by mass in total of the compound represented by C9F 18 .

[0060] On the other hand, the water content is the water content, C9F 18It is preferably 10 parts by mass or less, more preferably 5 parts by mass or less, and even more preferably 1 part by mass or less with respect to 100 parts by mass in total of the compounds represented by

[0061] The composition of the present disclosure may contain a conductive substance. Examples of the conductive substance include at least one selected from the group consisting of metals, metal ions, metal oxides, metal nitrides, carbon, conductive polymers, and superconducting ceramics, and mixtures thereof. When the conductive substance is included, its content ratio is preferably 10,000 mass ppm or less, more preferably 1,000 mass ppm or less, and even more preferably 1 mass ppm or less with respect to the entire composition in terms of suppressing problems such as causing a short circuit in the circuit by entering from the gap of the device.

[0062] The composition of the present disclosure may contain insoluble matter. When the insoluble matter is included, its content ratio is preferably 5,000 mass ppm or less, more preferably 1,000 mass ppm or less with respect to the entire composition in terms of suppressing the occurrence of blockage of piping and resistance on the circuit during repeated use.

[0063] 2. Alternative uses for heat transfer fluids The composition of the present disclosure can be used as a composition for replacing a heat transfer fluid containing at least one selected from the group consisting of perfluorotripropylamine, perfluoropolyether, and a mixture of methoxytridecafluoroheptene isomers. The composition of the present disclosure can replace the following heat transfer fluids currently in actual use. · Perfluorotripropylamine (or tris(heptafluoropropyl)amine, or N,N-bis(heptafluoropropyl)(heptafluoropropyl)amine) [N(CF2CF2CF3) n (CF(CF3)CF3) 3-n (n is an integer from 0 to 3)]; · Perfluoropolyether (PFPE) represented by product names GALDEN® "HT135" and GALDEN® "HT110" (manufactured by Solvay), or specifically, a compound represented by the general formula: RO-Rf-R’, and more specifically, tetrafluoroethylene oxide polymer and hexafluoropropylene oxide; and · Methoxytridecafluoroheptene isomer mixture represented by the product name "Opteon SF10" (manufactured by Chemours), or more specifically, methyl-perfluoroheptene ether (MPHE) (C7F 13 OCH3).

[0064] Specifically, in a device designed to transfer heat using the above heat transfer fluid, the composition of the present disclosure can be used in place of the heat transfer fluid.

[0065] The composition of the present disclosure can be a drop-in replacement, near-drop-in replacement, or retrofit replacement for the above heat transfer fluid. Note that "drop-in replacement" means that it can be replaced without any changes on the device side. "Near-drop-in replacement" means that it can be replaced with almost no changes on the device side. "Retrofit replacement" means that it can be replaced with a minimum of changes (without significant changes) on the device side. The composition of the present disclosure is preferably a drop-in replacement or near-drop-in replacement for the above heat transfer fluid.

[0066] Whether the composition of the present disclosure can be a drop-in replacement, near-drop-in replacement, or retrofit replacement can be determined by whether all of the following conditions are met. (i) The boiling point of the composition of the present disclosure is at least about 80% or more, preferably at least about 85% or more, of the boiling point of the heat transfer fluid before replacement. (ii) The pour point of the composition of the present disclosure is equal to or lower than the pour point of the heat transfer fluid before replacement. (iii) The kinematic viscosity of the composition of the present disclosure is at least about 200% or less, preferably at least about 150% or less, of the kinematic viscosity of the heat transfer fluid before replacement. (iv) The composition of the present disclosure is miscible with the heat transfer fluid before replacement in any ratio.

[0067] By setting the boiling point of the composition of the present disclosure to be at least about 80% or more, preferably at least about 85% or more, of the boiling point of the heat transfer fluid before replacement, the occurrence of cavitation and leakage from the device can be suppressed. The upper limit of the boiling point of the heat transfer fluid is not particularly limited, but for example, it may be at least about 130% or less of the boiling point of the heat transfer fluid before replacement.

[0068] By setting the pour point of the composition of the present disclosure to be equal to or lower than the pour point of the heat transfer fluid before replacement, it becomes possible to use it even below the conventional operating temperature, and the operating temperature range can be expanded. The upper limit of the pour point of the heat transfer fluid is not particularly limited, but for example, it may be at a temperature 30°C higher than the pour point of the heat transfer fluid before replacement or lower.

[0069] By setting the kinematic viscosity of the composition of the present disclosure to be at least about 200% or less, preferably at least about 150% or less, of the kinematic viscosity of the heat transfer fluid before replacement, an increase in power consumption can be suppressed or the power consumption can be reduced. It is preferable to compare the kinematic viscosities at the operating temperature, but it is not limited thereto. For example, the kinematic viscosities can be compared at any temperature between -20°C and -40°C, specifically, the kinematic viscosity at -20°C.

[0070] Since the composition of the present disclosure is miscible with the heat transfer fluid before replacement in any ratio, the replacement operation becomes easy.

[0071] Furthermore, by the composition of the present disclosure satisfying the following conditions, it is suitable for drop-in replacement, near-drop-in replacement, or retrofit replacement. (v) The composition of the present disclosure has a dielectric constant of 120% or less of the dielectric constant of the heat transfer fluid before replacement. (vi) The composition of the present disclosure is 90% or more of the dielectric strength of the heat transfer fluid before replacement. (vii) The composition of the present disclosure is 90% or more of the specific heat of the heat transfer fluid before replacement. (viii) The composition of the present disclosure is 85% or more of the thermal conductivity of the heat transfer fluid before replacement.

[0072] By setting the dielectric constant of the composition of the present disclosure to 120% or less of the dielectric constant of the heat transfer fluid before replacement, it can be suitably used as an alternative composition. The upper limit of the dielectric constant of the heat transfer fluid is not particularly limited, and for example, it may be 80% or more of the dielectric constant of the heat transfer fluid before replacement.

[0073] By setting the dielectric strength of the composition of the present disclosure to 90% or more of the dielectric strength of the heat transfer fluid before replacement, it can be suitably used as an alternative composition. The upper limit of the dielectric strength of the heat transfer fluid is not particularly limited, and for example, it may be 120% or less of the dielectric strength of the heat transfer fluid before replacement.

[0074] By setting the specific heat of the composition of the present disclosure to 90% or more of the specific heat of the heat transfer fluid before replacement, it can be suitably used as an alternative composition. The upper limit of the specific heat of the heat transfer fluid is not particularly limited, and for example, it may be 120% or less of the specific heat of the heat transfer fluid before replacement.

[0075] By setting the thermal conductivity of the composition of the present disclosure to 85% or more of the thermal conductivity of the heat transfer fluid before replacement, it can be suitably used as an alternative composition. The upper limit of the thermal conductivity of the heat transfer fluid is not particularly limited, and for example, it may be 120% or less of the thermal conductivity of the heat transfer fluid before replacement.

[0076] The boiling point of the composition of the present disclosure can preferably be 105 °C or higher, more preferably 108 °C or higher. Also, the upper limit of the boiling point of the composition of the present disclosure is not particularly limited, and for example, it can be 150 °C or lower, 130 °C or lower, or 120 °C or lower.

[0077] The pour point of the composition of the present disclosure can preferably be -80°C or lower, more preferably -100°C or lower, and even more preferably -110°C or lower. Also, the lower limit of the pour point of the composition of the present disclosure is not particularly limited, and can be, for example, -180°C or higher, or -160°C or higher.

[0078] The kinematic viscosity of the composition of the present disclosure at -20°C can preferably be 6.0 cSt or lower, more preferably 5.0 cSt or lower, even more preferably 4.0 cSt or lower, and even more preferably 3.0 cSt or lower. Also, the lower limit of the kinematic viscosity of the composition of the present disclosure is not particularly limited, and can be, for example, 1.0 cSt or higher.

[0079] The dielectric constant of the composition of the present disclosure can preferably be 3.0 or lower, more preferably 2.5 or lower, and even more preferably 2.0 or lower. Also, the lower limit of the dielectric constant of the composition of the present disclosure is not particularly limited, and can be, for example, 1.1 or higher.

[0080] The dielectric strength of the composition of the present disclosure can preferably be 40 kV or higher, more preferably 50 kV or higher, and even more preferably 50 kV or higher. Also, the upper limit of the dielectric strength of the composition of the present disclosure is not particularly limited, and can be, for example, 150 kV or lower, or 100 kV or lower.

[0081] The specific heat of the composition of the present disclosure at 30°C can preferably be 800 J / kg·K or higher, more preferably 900 J / kg·K or higher, and even more preferably 1000 J / kg·K or higher. Also, the upper limit of the specific heat of the composition of the present disclosure is not particularly limited, and can be, for example, 2000 J / kg·K or lower, or 1500 J / kg·K or lower.

[0082] The thermal conductivity of the composition of the present disclosure at 30°C can preferably be 0.055 W / mK or higher, more preferably 0.060 W / mK or higher, and even more preferably 0.065 W / mK or higher. Also, the upper limit of the thermal conductivity of the composition of the present disclosure is not particularly limited, and can be, for example, 0.090 W / mK or lower, or 0.080 W / mK or lower.

[0083] The boiling point of the composition of the present disclosure is the temperature at which a peak derived from endotherm is observed when the temperature is raised from 25°C at a rate of 5°C / min using DSC (Differential Scanning Calorimetry).

[0084] The pour point of the composition of the present disclosure is the temperature at which a peak derived from endotherm is observed when the temperature is raised at a rate of 5°C / min after cooling to below the freezing point with liquid nitrogen using DSC.

[0085] The dielectric constant of the composition of the present disclosure is the value observed at a frequency of 1 kHz in an environment of a temperature of 25°C and a humidity of 60% using the capacitance method.

[0086] The kinematic viscosity and density of the composition of the present disclosure are the values measured using the kinematic viscometer SVM3001 manufactured by Anton Paar.

[0087] The dielectric breakdown voltage of the composition of the present disclosure is the dielectric breakdown voltage when a liquid sample is immersed between spherical electrodes adjusted to a predetermined interval and the voltage is increased at a constant rate. The measurement conditions are as follows. Electrode shape: spherical (φ12.5 mm) Electrode interval: 2.5 mm Voltage increase rate: 2 kV / sec Measurement atmosphere: in air (22°C, 57% RH)

[0088] The specific heat of the composition of the present disclosure is the value obtained under the following conditions using DSC. Measurement device: Differential Scanning Calorimeter DSC8500 manufactured by Perkin-Elmer Temperature increase rate: 10°C / min Standard sample: sapphire (-Al2O3) Atmosphere: in a dry nitrogen stream Sample container: aluminum sealed container

[0089] The thermal conductivity of the composition of the present disclosure is the value obtained by the transient hot-wire method.

[0090] The compatibility of the composition of the present disclosure is determined by whether it is compatible when mixed with the target solvent. Here, "compatible" means that when the two are mixed, they become a uniform state, that is, the phases do not separate.

[0091] 3. Equipment containing heat transfer fluids The equipment of the present disclosure includes the composition of the present disclosure.

[0092] The equipment of the present disclosure includes a device and a device having a heat transfer mechanism that transfers heat to or from the device.

[0093] Specifically, the device of the present disclosure having a heat transfer mechanism includes a device and a heat transfer mechanism that transfers heat to or from the device using the composition of the present disclosure as a heat transfer fluid, and the heat transfer mechanism is designed to transfer heat using a heat transfer fluid containing at least one selected from the group consisting of perfluorotripropylamine, perfluoropolyether, and a methoxytridecafluoroheptene isomer mixture, a device including a heat transfer mechanism.

[0094] Examples of the device include a computer, a server computer, a server including a blade server; a disk array / storage system; a storage area network; network-connected storage; a storage communication system; a workstation; a router; a telecommunications infrastructure / switch; wired, optical, and wireless communication devices; a cell processor; a printer; a power supply device; a display; an optical device; a measurement system including a handheld system; military electronic equipment, etc.

[0095] The semiconductor element is a heat-generating element mounted on the device, and examples include a CPU, a GPU, an SSD, etc. The semiconductor element is composed of, for example, single-element silicon, germanium, compound semiconductors such as gallium arsenide (GaAs), gallium phosphide (GaP), indium phosphide (InP), gallium nitride (GaN), silicon carbide (SiC), etc.

[0096] When the device is a server computer, one logic board or a plurality of logic boards are arranged within the internal space. The logic board includes a number of heat-generating electronic components including at least one processor such as a CPU and a GPU. In addition, other heat-generating components of a computer such as, for example, a chipset; memory, a graphics chip, a network chip, a RAM, a power supply device, a daughter card; a storage drive such as a solid-state drive and a mechanical hard disk; can also be used.

[0097] The heat transfer mechanism is a heat transfer mechanism for transferring heat between the object to be heat-transferred and the object to be heat-transferred using the composition of the present disclosure, and heat transfer (transfer) is performed by making heat contact with the object to be heat-transferred. For example, when taking heat from the object to be heat-transferred, it is cooling, and when supplying heat, it is heating. Although it may be different mechanisms depending on each case, one heat transfer mechanism may cover both cooling and heating.

[0098] The heat transfer mechanism is not particularly limited, and examples thereof include a pump, a valve, a fluid confinement system, a pressure control system, a cooler, a heat exchanger, a heat source, a heat sink, a refrigeration system, an active temperature control system, a passive temperature control system, and the like.

[0099] More specifically, a temperature-controlled wafer chuck in a plasma-enhanced chemical vapor deposition (PECVD) tool, a temperature-controlled test head for die performance testing, a temperature-controlled working area in semiconductor processing equipment, a heat shock test bath solution reservoir, a constant temperature bath, and the like can be mentioned.

[0100] The object to be heat-transferred that is thermally contacted with the heat transfer mechanism is an article, device, or atmosphere that is cooled, heated, or maintained at a temperature to be controlled. Such objects to be heat-transferred include electrical components, mechanical components, and optical components, as well as processed products and assembled products thereof. Specific examples of the object to be heat-transferred in the present disclosure include, for example, a microprocessor, a wafer used for manufacturing a semiconductor device, a power control semiconductor, an electrical branch switch, a power transformer, a circuit board, a multi-chip module, mounted and non-mounted semiconductor devices, a chemical reactor, a nuclear reactor, a fuel cell, a heat exchanger, an electrochemical cell, a laser, a missile component, etc., and of course, it is not limited thereto.

[0101] When using the device of the present disclosure, the temperature condition of the composition of the present disclosure is preferably -100 to 100 °C, more preferably -90 to 90 °C, and even more preferably -70 to 90 °C. The composition of the present disclosure exhibits a low kinematic viscosity even at a low temperature of -20 °C or lower, and in particular, has the advantage of exhibiting a low kinematic viscosity at -70 to -60 °C. Therefore, the device can be suitably used even within the above temperature range.

[0102] The device of the present disclosure further includes a two-phase liquid immersion cooling fluid, a chiller fluid, a Rankine cycle working fluid, and the like.

[0103] 4. Heat transfer method The heat transfer method of the present disclosure is a heat transfer method including a step of transferring heat by using the composition of the present disclosure in place of the heat transfer fluid in a device designed to transfer heat by using a heat transfer fluid containing at least one selected from the group consisting of perfluorotripropylamine, perfluoropolyether, and a methoxytridecafluoroheptene isomer mixture.

[0104] The device includes a device and a heat transfer mechanism that transfers heat to or from the device, and includes a two-phase liquid immersion cooling fluid, a chiller fluid, a Rankine cycle working fluid, and the like.

[0105] In the above, the device includes the devices described in "3. Equipment Containing Heat Transfer Fluid". When using the above device, the heat transfer method of the present disclosure is designed to transfer heat using a heat transfer fluid containing at least one selected from the group consisting of perfluorotripropylamine, perfluoropolyether, and a methoxytridecafluoroheptene isomer mixture. In a device including a heat transfer mechanism, the composition of the present disclosure is used to replace the heat transfer fluid to operate the heat transfer mechanism, thereby including the step of transferring heat to or from the device, which is a heat transfer method.

[0106] In the above heat transfer method of the present disclosure, heat can be transferred by arranging the heat transfer mechanism in thermal contact with the device. When the heat transfer mechanism is arranged in thermal contact with the device, it removes heat from the device, supplies heat to the device, or maintains the device at a selected temperature or temperature range. The direction of the heat flow (from or to the device) is determined by the relative temperature difference between the device and the heat transfer mechanism.

[0107] The embodiments of the present invention have been described above. However, the present invention is not limited to such examples, and it goes without saying that the present invention can be implemented in various forms without departing from the gist of the present invention.

Examples

[0108] Hereinafter, based on the examples, the embodiments of the present invention will be described more specifically, but the present invention is not limited thereto.

[0109] <Example 1> Based on the method described in Chem Ber 1973, 106, 2950 - 2959, the composition for the heat transfer fluid of Example 1 was obtained. The obtained HFP trimer was purified by distillation to remove impurities such as the dimer and tetramer of hexafluoropropene. Further, the purified HFP trimer was separated into the compounds represented by formulas (I), (II), and (III) by distillation. Each of the separated HFP trimers was dehydrated using silica gel.

[0110] The compounds represented by the formulas (I), (II), and (III) obtained above were mixed so that the proportions of the compounds represented by the formulas (I), (II), and (III) were as shown in the following table, to obtain the trimer mixtures of Examples 1 to 4.

[0111] [Table 1] It was confirmed that the content was % by mass.

[0112] <Comparative Example 1> As Comparative Example 1, FC-3283 manufactured by 3M was prepared. It did not contain the compounds represented by (I), (II), and (III).

[0113] <Comparative Example 2> As Comparative Example 2, HFE7100 manufactured by 3M was prepared. It did not contain the compounds represented by (I), (II), and (III).

[0114] For the compositions of Examples 1 to 4 and Comparative Examples 1 and 2, the boiling point, pour point, dielectric constant, kinematic viscosity, dielectric breakdown voltage, specific heat, thermal conductivity, and compatibility were evaluated.

[0115] <Measurement of Boiling Point, Pour Point, and Dielectric Constant> The boiling point of the trimer mixture was taken as the temperature at which a peak derived from endotherm was observed when the temperature was raised from 25°C at 5°C / min using DSC (Differential Scanning Calorimetry). The pour point was taken as the temperature at which a peak derived from endotherm was observed when the temperature was raised at 5°C / min after cooling to below the freezing point with liquid nitrogen using DSC. The dielectric constant was measured at a frequency of 1 kHz by the capacitance method in an environment of 25°C and 60% humidity.

[0116] <Measurement of Kinematic Viscosity and Density> The kinematic viscosity and density of the trimer mixture were measured using a kinematic viscometer SVM3001 manufactured by Anton Paar.

[0117] <Measurement of Dielectric Breakdown Voltage> The insulating strength of the trimer mixture was measured as the breakdown voltage when a liquid sample was immersed between spherical electrodes adjusted to a specified interval and the voltage was increased at a constant rate. The detailed measurement conditions were as follows. Electrode shape: spherical (φ12.5 mm) Electrode interval: 2.5 mm Voltage increase rate: 2 kV / second Measurement atmosphere: in air (22 °C, 57% RH)

[0118] <Specific heat measurement> The specific heat of the trimer mixture was measured using DSC. The measurement conditions were as follows. Measurement device: Differential Scanning Calorimeter DSC8500 manufactured by Perkin-Elmer Temperature increase rate: 10 °C / minute Standard sample: sapphire (-Al2O3) Atmosphere: in a dry nitrogen stream Sample container: aluminum sealed container

[0119] <Thermal conductivity measurement> The thermal conductivity of the trimer mixture was measured by the unsteady thin wire method.

[0120] <Compatibility> The compatibility of the trimer mixture was evaluated by mixing equal amounts of the following three types of solvents and each trimer mixture. Galden HT135 (manufactured by Solvay) SF-10 (manufactured by Kemars) FC3283 (manufactured by 3M)

[0121]

Table 2

Claims

1. For use as an alternative to a heat transfer fluid comprising at least one selected from the group consisting of perfluorotripropylamine, perfluoropolyether, and a methoxytridecafluoroheptene isomer mixture, a composition comprising a hexafluoropropene trimer represented by C ９ F １８ .

2. Said C ９ F １８ The hexafluoropropene trimer represented by the following formula (I) to (III) contains at least one compound selected from the group consisting of the compounds represented by the following formulas (I) to (III), and the composition according to claim 1. 【Chemical 1】

3. The above-mentioned C ９ F １８ The hexafluoropropene trimer represented by the formula (I) contains less than 85% by mass of the compound represented by the formula (I) with respect to the whole hexafluoropropene trimer, and the composition according to claim 2.

4. The composition according to claim 1, satisfying the following conditions (i) to (vi). (i) The boiling point is 80% or more of the boiling point of the heat transfer fluid. (ii) The pour point is equal to or lower than the pour point of the heat transfer fluid. (iii) The kinematic viscosity is 200% or less of the kinematic viscosity of the heat transfer fluid. (iv) It is miscible with the heat transfer fluid in any ratio.

5. C ９ F １８ A composition for a heat transfer fluid, comprising a hexafluoropropene trimer represented by and at least one selected from the group consisting of perfluorotripropylamine, perfluoropolyether, and a methoxytridecafluoroheptene isomer mixture.

6. Said C ９ F １８ The hexafluoropropene trimer represented by the formula is the composition for a heat transfer fluid according to claim 5, which contains at least one compound selected from the group consisting of the compounds represented by the following formulas (I) to (III). 【Chemical 2】

7. The compound contains a compound represented by the formula (I) in an amount of less than 85% by mass based on the whole of the hexafluoropropene trimer represented by ９ CF １８ , and the composition for a heat transfer fluid according to claim 6.

8. The compound contains a compound represented by the formula (I) in an amount of 85% by mass or more based on the whole of the hexafluoropropene trimer represented by ９ CF １８ The composition for a heat transfer fluid according to claim 6.

9. A device and a heat transfer mechanism that transfers heat to or from the device using the composition according to claim 1, or the composition for a heat transfer fluid according to claim 5 or 6, as the heat transfer fluid. The heat transfer mechanism is designed to transfer heat using a heat transfer fluid containing at least one selected from the group consisting of perfluorotripropylamine, perfluoropolyether, and a methoxytridecafluoroheptene isomer mixture. A device including a heat transfer mechanism.

10. C ９ F １８ Use for the replacement of a heat transfer fluid comprising at least one selected from the group consisting of perfluorotripropylamine, perfluoropolyether, and a mixture of methoxytridecafluoroheptene isomers with a hexafluoropropene trimer represented by

11. In a device including a heat transfer mechanism designed to transfer heat using a heat transfer fluid containing at least one selected from the group consisting of perfluorotripropylamine, perfluoropolyether, and a methoxytridecafluoroheptene isomer mixture, by operating the heat transfer mechanism using the composition according to claim 1, or the composition for a heat transfer fluid according to claim 5 or 6, in place of the heat transfer fluid, a heat transfer method including a step of transferring heat to or from the device.

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