Information processing device

Abstract

To provide electronic equipment including a large display region and with improved portability, and to provide electronic equipment with improved reliability.SOLUTION: An information processing device comprises a first film, a panel substrate, and at least a first housing. The panel substrate has flexibility and includes a display region. The first film has permeability to visible light and flexibility. The first housing includes a first slit. The panel substrate includes a region sandwiched between the first film and a second film. The first slit has a function to store this region. Either or both of the panel substrate and the first film are slidable along the first slit.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] One embodiment of the present invention relates to an information processing device, a display device, and an electronic device.

[0002] Note that one embodiment of the present invention is not limited to the above technical field. The technical field of one aspect relates to an article, a method, or a manufacturing method. One aspect of the present invention is a process, machine, manufacture, or composition. Therefore, the present invention more specifically disclosed herein The technical field of one embodiment of the present invention is a semiconductor device, a display device, a light-emitting device, a power storage device, a memory device, The driving method thereof or the manufacturing method thereof can be given as an example. [Background technology]

[0003] In recent years, electronic devices equipped with display devices have become increasingly diverse. There are information processing devices such as smartphones, tablet terminals, and wearable terminals.

[0004] The most representative display device is the organic EL (Electro Luminescence) Light emitted by elements and light emitting diodes (LEDs) Light-emitting devices equipped with elements, liquid crystal display devices, and electronic paper that displays images using electrophoresis, etc. Patent Document 1 and Patent Document 2 disclose flexible displays using organic EL elements. A light emitting device is disclosed. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2014-197522 A [Patent Document 2] JP 2015-064570 A Summary of the Invention [Problem to be solved by the invention]

[0006] In recent years, there has been a particular demand for information processing devices, display devices, and electronic devices having large display areas. By enlarging the display area, the viewability is improved and the amount of information that can be displayed is increased. On the other hand, in the case of portable electronic devices, if the display area is enlarged, Portability is reduced. Therefore, we are working to improve the display viewability and portability. It was difficult to achieve both improvement and

[0007] An object of one embodiment of the present invention is to provide an electronic device having a large display area. Another object of the present invention is to improve the portability of electronic devices. One of the objectives is to achieve both improvement in performance and portability. Another object of the present invention is to improve the reliability of electronic devices. do.

[0008] The description of these problems does not preclude the existence of other problems. It is not necessary for the embodiment to solve all of these problems. The above will become apparent from the description in the specification, drawings, claims, etc. It is possible to extract other issues from the descriptions in the patent, claims, etc. [Means for solving the problem]

[0009] An information processing apparatus according to an aspect of the present invention includes a hinge, a first housing, a second housing, and a panel substrate. It also includes a first film. The hinge has a rotation axis, and the first housing is connected to the second housing via the hinge so as to be rotatable about the rotation axis. The first housing has a first slit, and the second housing has a second slit. The panel substrate has a region that overlaps with the first film, and this region is housed in either one or both of the first slit and the second slit. Either one or both of the panel substrate and the first film are slidable along the second slit.

[0010] Also, an information processing apparatus according to an aspect of the present invention is the above information processing apparatus having a second film. The panel substrate has a region sandwiched between the first film and the second film.

[0011] Also, an information processing apparatus according to an aspect of the present invention is the above information processing apparatus in which the first film has flexibility and transparency to visible light. The panel substrate has flexibility and a display region. The first housing has a first part and a second part. The first part overlaps with the display region, and the second part overlaps with the peripheral part of the first part. Also, the second film is sandwiched between the display region and the first part, and the second film has flexibility.

[0012] Also, an information processing apparatus according to an aspect of the present invention is one in which the first film is fixed to a part of the first housing. The first film, the second film, and the panel substrate are slidable along the second slit by rotating the second housing relative to the first housing about the rotation axis.

[0013] ​​​​​​​​​​In addition, in the information processing apparatus according to one aspect of the present invention, the first film is fixed to the first housing, and the first film is slidable along the second slit by rotating the second housing with respect to the first housing about the rotation axis, and the second film is fixed to the first housing and the second housing.

[0014] In addition, in the information processing apparatus according to one aspect of the present invention, the second housing has an end portion parallel to the rotation axis, and the first film and the panel substrate slide within the second slit, and the first film is separated from the end portion, and the panel substrate is separated from the end portion.

[0015] In addition, in the information processing apparatus according to one aspect of the present invention, by rotating the second housing with respect to the first housing about the rotation axis, the first film becomes planar or convex with respect to the panel substrate.

[0016] In addition, in the information processing apparatus according to one aspect of the present invention, it has a circuit board. The circuit board is electrically connected to the panel substrate and is housed in the first housing.

[0017] In addition, in the information processing apparatus according to one aspect of the present invention, it has at least one drive circuit. The drive circuit is provided on the panel substrate, and the panel substrate has a curved portion between the drive circuit and the display area.

[0018] In addition, in the information processing apparatus according to one aspect of the present invention, the panel substrate has a curved portion between the image signal line drive circuit and the display area.

[0019] In addition, in the information processing apparatus according to one aspect of the present invention, it has an input unit. The input unit includes a touch sensor, and the touch sensor has an area overlapping the display area.

[0020] Further, an information processing apparatus according to an aspect of the present invention includes a first flexible printed circuit board and a second flexible printed circuit board. The first housing houses the first flexible printed circuit board and the second flexible printed circuit board. The first flexible printed circuit board supplies a control signal to a display area, and the second flexible printed circuit board supplies a control signal to a touch sensor. An information processing apparatus that supplies a control signal to a touch sensor.

[0021] Further, an information processing apparatus according to an aspect of the present invention includes one or more of a keyboard, a hardware button, a pointing device, an illuminance sensor, an imaging device, an audio input device, a gaze input device, and a posture detection device.

Advantages of the Invention

[0022] According to one aspect of the present invention, a novel information processing apparatus excellent in portability and reliability can be provided. Or, a novel information processing apparatus excellent in operability can be provided. Or, a novel information processing apparatus or a novel display device can be provided. Note that the description of these effects does not prevent the existence of other effects. Note that one aspect of the present invention does not necessarily have all of these effects. Note that other effects will be apparent from the description in the specification, drawings, claims, etc., and it is possible to extract these other effects from the description in the specification, drawings, claims, etc.

Brief Description of the Drawings

Brief Description of the Drawings

[0023]

Figure 1

Figure 2

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Figure 4

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Figure 12

Figure 13

Embodiments for Carrying Out the Invention

[0024] The embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description, and it will be easily understood by those skilled in the art that the forms and details can be variously changed without departing from the spirit and scope of the present invention. Therefore, the present invention is not to be construed as being limited to the description of the embodiments shown below. In the configuration of the invention described below, the same reference numerals are commonly used among different drawings for the same part or parts having the same or similar functions. without departing from the spirit and scope of the present invention. It will be easily understood by those skilled in the art. Therefore, the present invention is not to be construed as being limited to the description of the embodiments shown below. In the configuration of the invention described below, for the same part or parts having the same or similar functions, the same reference numerals are commonly used among different drawings. and the same reference numerals are commonly used among different drawings for the same part or parts having the same or similar functions. The description of the repetition is omitted.

[0025] (Embodiment 1) In this embodiment, a foldable touch panel, which is an information processing apparatus according to an aspect of the present invention, will be described with reference to FIGS. 1 to 4. The touch panel has a display unit and a touch sensor. It has.

[0026] (Description of cross-sectional view) FIG. 1(A) shows a cross-sectional view of a state of a foldable touch panel according to an aspect of the present invention. Also, FIG. 1(B) is a diagram showing another state of the foldable touch panel according to an aspect of the present invention. It is.

[0027] In one aspect of the present invention, the foldable touch panel includes a panel substrate 101, a first film 102, a second film 103, a first housing 104-1, a second housing 104-2, a hinge 105-1, a circuit board 106, and a flexible printed circuit board FPC 107. The panel substrate 101, the first film 102, and the second film 103 all have flexibility. The first housing 104-1 can rotate with respect to the second housing 104-2 about the rotation axis of the hinge 105-1. The state shown in FIG. 1(A) can be said to be a state in which the information processing apparatus is folded about the rotation axis of the hinge 105-1. It has. The hinge 105-1, the circuit board 106, and the flexible printed circuit board FPC 107. The panel substrate 101, the first film 102, and the second film 103 all have flexibility. The first housing 104-1 can rotate with respect to the second housing 104-2 about the rotation axis of the hinge 105-1. The state shown in FIG. 1(A) can be said to be a state in which the information processing apparatus is folded about the rotation axis of the hinge 105-1. 01, the first film 102, and the second film 103 all have flexibility. The first housing 104-1 can rotate with respect to the second housing 104-2 about the rotation axis of the hinge 105-1. The state shown in FIG. 1(A) can be said to be a state in which the information processing apparatus is folded about the rotation axis of the hinge 105-1. With the rotation axis of the hinge 105-1 as the center, the first housing 104-1 can rotate with respect to the second housing 104-2. The state shown in FIG. 1(A) is a state in which the information processing apparatus is folded about the rotation axis of the hinge 105-1. It can be said that it is a state.

[0028] In FIG. 1(A), the first housing 104-1 includes a first portion 104-1A, a second portion 104- 1B, and an end portion 111. The second housing 104-2 includes a first portion 104-2A, a second portion 104- 2B, and an end portion 110. The first portion 104-1A and the first portion 104- 104-2A are connected to the hinge 105-1, and a circuit is provided in the first portion 104-1A. The substrate 106 and the FPC 107 are housed. The second part 104-1B included in the first housing 104-1 overlaps with the peripheral part of the first part 104-1A. Also, a gap is formed between the second part 104-1B and the peripheral part of the first part 104-1A. The second part 104-2B included in the second housing 104-2 overlaps with the peripheral part of the first part 104-2A. Also, another gap is formed between the second part 104-2B and the peripheral part of the first part 104-2A. The end 111 is located between the first part 104-1A and the second part 104-1B. Also, the end 110 is located between the first part 104-2A and the second part 104-2B. For example, in the first housing 104-1, a gap (slit 108-1) is formed in the region surrounded by the first part 104-1A, the second part 104-1B, and the end 111. Also, in the second housing 104-2, a gap (slit 108-2) is formed in the region surrounded by the first part 104-2A, the second part 104-2B, and the end 110. That is, the slit 108-1 is provided in the first housing 104-1, and the slit 108-2 is provided in the second housing 104-2. The second part 104-1B included in the first housing 104-1 overlaps with the peripheral part of the first part 104-1A. Also, a gap is formed between the second part 104-1B and the peripheral part of the first part 104-1A. The second part 104-1B included in the first housing 104-1 overlaps with the peripheral part of the first part 104-1A. Also, a gap is formed between the second part 104-1B and the peripheral part of the first part 104-1A. The second part 104-2B included in the second housing 104-2 overlaps with the peripheral part of the first part 104-2A. The second part 104-2B included in the second housing 104-2 overlaps with the peripheral part of the first part 104-2A. Also, another gap is formed between the second part 104-2B and the peripheral part of the first part 104-2A. The end 111 is located between the first part 104-1A and the second part 104-1B. The end 110 is located between the first part 104-2A and the second part 104-2B. For example, in the first housing 104-1, a gap (slit 108-1) is formed in the region surrounded by the first part 104-1A, the second part 104-1B, and the end 111. For example, in the first housing 104-1, a gap (slit 108-1) is formed in the region surrounded by the first part 104-1A, the second part 104-1B, and the end 111. Also, in the second housing 104-2, a gap (slit 108-2) is formed in the region surrounded by the first part 104-2A, the second part 104-2B, and the end 110. Also, in the second housing 104-2, a gap (slit 108-2) is formed in the region surrounded by the first part 104-2A, the second part 104-2B, and the end 110. That is, the slit 108-1 is provided in the first housing 104-1, and the slit 108-2 is provided in the second housing 104-2. That is, the slit 108-1 is provided in the first housing 104-1, and the slit 108-2 is provided in the second housing 104-2.

[0029] The first film 102, the panel substrate 101, and the second film 103 are stacked and housed in the slit 108-1 and the slit 108-2. The first film 102, the panel substrate 101, and the second film 103 are stacked and housed in the slit 108-1 and the slit 108-2.

[0030] When a drive circuit is provided on the panel substrate, it may be provided in an in-cell type, or may be provided using the COG (Chip On Glass) method or the COF (Chip On Film) method. FIGS. 1(A) and 1(B) show the socket 109 when provided using the COG method. 1(A) and 1(B) show the socket 109 when provided using the COG method.

[0031] An information processing apparatus according to an aspect of the present invention includes a foldable panel substrate 101 and a first film 102 that is transparent and has a thickness of 50 μm or more and 500 μm or less, preferably 80 μm or more and 150 μm or less. By having the first film 102, mechanical damage to the surface of the panel substrate 101 is prevented, and the panel substrate 101 is prevented from lifting from the first housing 104-1 and the second housing 10 4-2. Further, a second film 103 can be accommodated between the panel substrate 101 and the first housing 104-1 or the second housing 104-2. The panel substrate 101 is slidably sandwiched between the first film 102 and the second film 103. Thereby, the panel substrate 101 can be supported using the first housing 104-1 and the second housing 104-2. Also, the second film 103 can reduce the amount of deformation of the panel substrate 101 due to the pressing accompanying the operation of the touch panel. However, the information processing apparatus according to an aspect of the present invention can be configured to prevent mechanical damage to the surface even without the second film 103.

[0032] In one aspect of the present invention, the first film 102 and the second film 103 are each fixed and supported at a portion in contact with the first housing 104-1. As shown in FIG. 1(A), the first film 102 is fixed to the first housing 104-1 by a support portion 116. The second film 103 is fixed to the first housing 104-1 by a support portion 117.

[0033] In one aspect of the present invention, an FPC 107 connects the panel substrate 101 to a circuit board 106. The circuit board 106 is fixed to the first housing 104-1. The folded state of the panel substrate 101 ​​​​​The frictional force generated between the portion and near the end 111 and the first housing 104-1, and the connection with the FPC 107 are used to support the panel substrate 101 on the first housing 104-1 together with the connection with the circuit board 106.

[0034] In the slit 108-1 of the first housing 104-1, the first film 102 and the panel substrate 101 may be fixed to each other, and the panel substrate 101 and the second film 10 3 may be fixed to each other. Thereby, the panel substrate 101, the first film 10 2, and the second film 103 can slide relative to each other within the slit 108-2 of the second housing 104-2. Or, the stress applied to the panel substrate accompanying the folding operation of the information processing apparatus can be alleviated. Or, breakage of the panel substrate due to stress can be prevented.

[0035] The first film 102 has a region that is not fixed to the panel substrate 101. When the information processing apparatus is folded with the first film 102 and the panel substrate 101 fixed to each other, the panel substrate 101 is likely to be damaged by stress. In one aspect of the present invention, when the folding operation of the above-described information processing apparatus is performed, the sliding between the first film 102 and the panel substrate 101 reduces breakage of the panel substrate 101 due to stress.

[0036] In one aspect of the information processing apparatus of the present invention, the display unit can be visually recognized through the first film 102. That is, the first film 102 has transparency with respect to light having wavelengths in the visible light region. FIG. 2(A) shows a state in which the information processing apparatus is folded so that the displayed surface is concave. In this state, the first film 102 is closer to the end 110 than the second film 103.​ is approaching. Further, FIG. 2(B) shows the information processing apparatus folded so that the displayed surface is convex. In this state, the second film 103 is closer to the end 110 than the first film 1 02. By sliding the first film 102, the second film 103 and the panel substrate 101 relative to each other, the bending stress, compressive stress, and tensile stress applied to the panel substrate 101 can be reduced.

[0037] <Explanation of the top view of the panel substrate> In this embodiment, for example, a touch panel 300 can be used as the panel substrate 101 (see FIG. 3(A)). Alternatively, a touch panel 400 can be used (see FIG. 3( B)). The touch panel 300 and the touch panel 400 each have a display portion 301. .

[0038] The touch panel 300 or the touch panel 400 has a touch sensor, and the touch sensor has a region overlapping the display portion 301. For example, a sheet-like capacitive type touch sensor overlapping the display panel can be used. Alternatively, a so-called in-cell type touch panel can be used. The in-cell type touch panel has the function of a touch sensor. For example , a capacitive touch sensor may be applied, or an optical touch sensor using a photoelectric conversion element may be applied. Specifically, a photoelectric conversion element can be used for the optical touch sensor (see FIG. 3(A) or FIG. 3(B)). For example, the optical touch sensor includes the display portion 301, and the display portion 301 includes a plurality of pixels 302 and a plurality of imaging pixels 308. The imaging pixel 308 detects a finger touching the display portion 301 or a finger shading the display portion 301, etc. . ​It can be known.

[0039] The pixel 302 includes a plurality of sub-pixels (for example, sub-pixel 302R), and the sub-pixel includes a light-emitting element and a pixel circuit.

[0040] The pixel circuit is electrically connected to a wiring capable of supplying a selection signal and a wiring capable of supplying an image signal, and the pixel circuit supplies power for driving the light-emitting element.

[0041] The touch panel 300 shown in FIG. 3(A) has a scanning line driving circuit 303g(1) and an image signal line driving circuit 303s(1). The scanning line driving circuit 303g(1) can supply a selection signal to the pixel 302. The image signal line driving circuit 303s(1) can supply an image signal to the pixel 302. Also, the touch panel 400 shown in FIG. 3(B) has a scanning line driving circuit and an image signal line driving circuit. The scanning line driving circuit can supply a selection signal to the pixel 302 for supply. The image signal line driving circuit can supply an image signal to the pixel 302 for supply. When provided, the touch panel 400 has a region 401 (1) where the socket 109 is disposed and a region 401(2), and driving circuits are provided for each using the COG method.

[0042] The imaging pixel 308 includes a photoelectric conversion element and an imaging pixel circuit, and the imaging pixel circuit drives the photoelectric conversion element.

[0043] The imaging pixel circuit is electrically connected to a wiring capable of supplying a control signal and a wiring capable of supplying a power supply potential.

[0044] For example, a signal for selecting a predetermined imaging pixel circuit and reading out the recorded imaging signal, the imaging pixel circuit Signals for initializing the path and signals for determining the time when the imaging pixel circuit detects light, etc. can be used as control signals. It can be used for signals.

[0045] The touch panel 300 or the touch panel 400 includes an imaging pixel driving circuit 303g(2) and an imaging signal line driving circuit 303s(2). The imaging pixel driving circuit 303g(2) can supply a control signal to the imaging pixel 308. The imaging signal line driving circuit 303s(2) can read out the imaging signal. The touch panel 300 or the touch panel 400 includes an imaging pixel driving circuit 303g(2) and an imaging signal line driving circuit 303s(2). The imaging pixel driving circuit 303g(2) can supply a control signal to the imaging pixel 308. The imaging signal line driving circuit 303s(2) can read out the imaging signal. The touch panel 300 or the touch panel 400 includes an imaging pixel driving circuit 303g(2) and an imaging signal line driving circuit 303s(2). The imaging pixel driving circuit 303g(2) can supply a control signal to the imaging pixel 308. The imaging signal line driving circuit 303s(2) can read out the imaging signal. The touch panel 300 or the touch panel 400 includes an imaging pixel driving circuit 303g(2) and an imaging signal line driving circuit 303s(2). The imaging pixel driving circuit 303g(2) can supply a control signal to the imaging pixel 308. The imaging signal line driving circuit 303s(2) can read out the imaging signal.

[0046] The touch panel 300 or the touch panel 400 can be bent in the area indicated by the line segment 406 or the line segment 407. For example, by arranging the area indicated by the line segment 406 near the end 111 and arranging the area indicated by the line segment 407 near the hinge 105-1, the touch panel 300 or the touch panel 400 can be bent. The touch panel 300 or the touch panel 400 can be bent in the area indicated by the line segment 406 or the line segment 407. For example, by arranging the area indicated by the line segment 406 near the end 111 and arranging the area indicated by the line segment 407 near the hinge 105-1, the touch panel 300 or the touch panel 400 can be bent. The touch panel 300 or the touch panel 400 can be bent in the area indicated by the line segment 406 or the line segment 407. For example, by arranging the area indicated by the line segment 406 near the end 111 and arranging the area indicated by the line segment 407 near the hinge 105-1, the touch panel 300 or the touch panel 400 can be bent. The touch panel 300 or the touch panel 400 can be bent in the area indicated by the line segment 406 or the line segment 407. For example, by arranging the area indicated by the line segment 406 near the end 111 and arranging the area indicated by the line segment 407 near the hinge 105-1, the touch panel 300 or the touch panel 400 can be bent.

[0047] The touch panel 300 can be folded in the area indicated by the line segment 406. For example, the touch panel 300 can be folded between the area where the scanning line driving circuit 303g(1) and the image signal line driving circuit 303s(1) are arranged and the area where the display unit is arranged. The touch panel 400 can be folded between the area where the area 401(1) and the area 401(2) are arranged and the area where the display unit is arranged. Thereby, the area of the second part 104-1B can be reduced. Or, the area of the area where the scanning line driving circuit 303g(1) and the image signal line driving circuit 303s(1) of the touch panel 300 are arranged can be made larger than the area of the second part 104-1B. Or, the area of the touch panel 400 The touch panel 300 can be folded in the area indicated by the line segment 406. For example, the touch panel 300 can be folded between the area where the scanning line driving circuit 303g(1) and the image signal line driving circuit 303s(1) are arranged and the area where the display unit is arranged. The touch panel 400 can be folded between the area where the area 401(1) and the area 401(2) are arranged and the area where the display unit is arranged. Thereby, the area of the second part 104-1B can be reduced. Or, the area of the area where the scanning line driving circuit 303g(1) and the image signal line driving circuit 303s(1) of the touch panel 300 are arranged can be made larger than the area of the second part 104-1B. Or, the area of the touch panel 400 The touch panel 300 can be folded in the area indicated by the line segment 406. For example, the touch panel 300 can be folded between the area where the scanning line driving circuit 303g(1) and the image signal line driving circuit 303s(1) are arranged and the area where the display unit is arranged. The touch panel 400 can be folded between the area where the area 401(1) and the area 401(2) are arranged and the area where the display unit is arranged. Thereby, the area of the second part 104-1B can be reduced. Or, the area of the area where the scanning line driving circuit 303g(1) and the image signal line driving circuit 303s(1) of the touch panel 300 are arranged can be made larger than the area of the second part 104-1B. Or, the area of the touch panel 400 The touch panel 300 can be folded in the area indicated by the line segment 406. For example, the touch panel 300 can be folded between the area where the scanning line driving circuit 303g(1) and the image signal line driving circuit 303s(1) are arranged and the area where the display unit is arranged. The touch panel 400 can be folded between the area where the area 401(1) and the area 401(2) are arranged and the area where the display unit is arranged. Thereby, the area of the second part 104-1B can be reduced. Or, the area of the area where the scanning line driving circuit 303g(1) and the image signal line driving circuit 303s(1) of the touch panel 300 are arranged can be made larger than the area of the second part 104-1B. Or, the area of the touch panel 400 The touch panel 300 can be folded in the area indicated by the line segment 406. For example, the touch panel 300 can be folded between the area where the scanning line driving circuit 303g(1) and the image signal line driving circuit 303s(1) are arranged and the area where the display unit is arranged. The touch panel 400 can be folded between the area where the area 401(1) and the area 401(2) are arranged and the area where the display unit is arranged. Thereby, the area of the second part 104-1B can be reduced. Or, the area of the area where the scanning line driving circuit 303g(1) and the image signal line driving circuit 303s(1) of the touch panel 300 are arranged can be made larger than the area of the second part 104-1B. Or, the area of the touch panel 400 The touch panel 300 can be folded in the area indicated by the line segment 406. For example, the touch panel 300 can be folded between the area where the scanning line driving circuit 303g(1) and the image signal line driving circuit 303s(1) are arranged and the area where the display unit is arranged. The touch panel 400 can be folded between the area where the area 401(1) and the area 401(2) are arranged and the area where the display unit is arranged. Thereby, the area of the second part 104-1B can be reduced. Or, the area of the area where the scanning line driving circuit 303g(1) and the image signal line driving circuit 303s(1) of the touch panel 300 are arranged can be made larger than the area of the second part 104-1B. Or, the area of the touch panel 400 The touch panel 300 can be folded in the area indicated by the line segment 406. For example, the touch panel 300 can be folded between the area where the scanning line driving circuit 303g(1) and the image signal line driving circuit 303s(1) are arranged and the area where the display unit is arranged. The touch panel 400 can be folded between the area where the area 401(1) and the area 401(2) are arranged and the area where the display unit is arranged. Thereby, the area of the second part 104-1B can be reduced. Or, the area of the area where the scanning line driving circuit 303g(1) and the image signal line driving circuit 303s(1) of the touch panel 300 are arranged can be made larger than the area of the second part 104-1B. Or, the area of the touch panel 400 The touch panel 300 can be folded in the area indicated by the line segment 406. For example, the touch panel 300 can be folded between the area where the scanning line driving circuit 303g(1) and the image signal line driving circuit 303s(1) are arranged and the area where the display unit is arranged. The touch panel 400 can be folded between the area where the area 401(1) and the area 401(2) are arranged and the area where the display unit is arranged. Thereby, the area of the second part 104-1B can be reduced. Or, the area of the area where the scanning line driving circuit 303g(1) and the image signal line driving circuit 303s(1) of the touch panel 300 are arranged can be made larger than the area of the second part 104-1B. Or, the area of the touch panel 400 The area of the region where 401(1) and region 401(2) are arranged is made larger than the area of the second part 104-1 than the area of B.

[0048] <Description of the top view of the housing> The first housing 104-1, the second housing 104-2, the hinge 105-1, the slit 108-1 , the slit 108-2 and the end 110 are shown in FIG. 4.

[0049] One side of the second housing 104-2 is connected to the hinge 105-1, and the other three sides of the second housing 104-2 are provided with slits 108-2. The end 110 is parallel to the rotation axis of the hinge 105-1 is provided. One side of the first housing 104-1 is connected to the hinge 105-1, and the first housing 104-1 is provided with slits 108-1 on the other three sides. The end 111 is provided parallel to the rotation axis of the hinge 105- 1.

[0050] The panel substrate 101, the first film 102 and the second film 103 are fixed to the first housing 1 04-1. Thereby, even when the information processing apparatus is folded at the hinge 105-1 , the distance between the end 111 and the panel substrate 101, the distance between the end 111 and the first film 102, and the distance between the end 111 and the second film 103 do not change. On the other hand, the panel substrate 101, the first film 102 and the second film 103 are not fixed to the second housing 1 04-2. Thereby, when the information processing apparatus is folded at the hinge 105-1 , the distance between the end 110 and the panel substrate 101, the distance between the end 110 and the first film 102, and the distance between the end 110 and the second film 103 change. For example , the distance between the end 110 and the panel substrate 101 is the distance between the rotation axis of the hinge 105-1 and the panel The longer the distance between the panel substrates 101, the greater the change.

[0051] In addition, even if the information processing apparatus is bent at the hinge 105-1, if strong bending stress, compressive stress, and tensile stress are not applied to the second film 103, the second film 10 3 may be fixed to the first housing 104-1 and the second housing 104-2.

[0052] FIGS. 1(A), 1(B) and 4 show a simplified hinge 105-1. FIG. 1(B) In the state shown, the rotation axis of the hinge 105-1 overlaps the panel substrate 101. This arrangement reduces the distances that the panel substrate 101, the first film 102, and the second film 103 slide as the information processing apparatus is bent.

[0053] The panel substrate 101 is separated from the end 110, the first film 102 is separated from the end 110, and the second film 103 is separated from the end 110. As a result, as the information processing apparatus is bent, the panel substrate 101, the first film 102, and the second film 103 slide without the panel substrate 101, the first film 102, or the second film 103 contacting the end 110. Also, the end of the first film 102 always overlaps the second portion 1 04-2B. This prevents the ends of the panel substrate 101, the first film 102, and the second film 103 from falling out of the slit 108-2 or colliding with the end of the second portion 104-2 B. Alternatively, the panel substrate 101, the first film 10 2 or the second film 103 do not contact the end 110. Or, contact with the end 110 ​​​​​​It is possible to prevent the panel substrate 101, the first film 102, or the second film 103 from being deflected, deteriorated, or damaged by contact.

[0054] For example, a display unit can be provided on the panel substrate 101, and a touch panel can be provided on the first film 102. Note that the first film 102 and the panel substrate 101 slide, and the position of the touch panel with respect to the display unit may shift during the sliding. In addition, when position information is input to the touch panel in a state where the position has shifted, unintended information may be input. For example, a touch panel and a display unit can be provided on the panel substrate 101. Thereby, it is possible to prevent the position of the touch panel with respect to the display unit from shifting. This is preferable.

[0055] The information processing apparatus according to one aspect of the present invention may be configured with only the first film 102 and the panel substrate 101. At this time, the panel substrate 101 is slidably in contact with the first film 102 and is supported by the first housing 104-1 and the second housing 104-2.

[0056] The information processing apparatus according to one aspect of the present invention may also be configured with only three or more films and the panel substrate 101. At this time, the panel substrate 101 is slidably in contact with the film that contacts one surface and the film that contacts the opposite surface, and is supported by the first housing 104-1 and the second housing 104-2.

[0057] The information processing apparatus according to one aspect of the present invention may be configured to provide a plurality of hinges and have three or more housings. When one of the connected housings constituting the information processing apparatus is defined as the first housing, the first film 102 and the panel substrate 101 may be configured to be slidable within the slit other than the first housing. ​​​​​​​

[0058] (Embodiment 2) In this embodiment, regarding the configuration of the foldable touch panel included in the information processing apparatus according to one aspect of the present invention, it will be described with reference to FIG. 5.

[0059] FIG. 5(A) is a top view for explaining the structure of a touch panel applicable to the information processing apparatus according to one aspect of the present invention. Each part in FIG. 5(A) corresponds to FIG. 3(A).

[0060] FIG. 5(B) is a cross-sectional view taken along cutting lines A-B and C-D in FIG. 5(A).

[0061] FIG. 5(C) is a cross-sectional view taken along cutting line E-F in FIG. 5(A).

[0062] <Explanation of cross-sectional view> The touch panel 300 has a substrate 310 and a counter substrate 370 facing the substrate 310 (see FIG. 5(B)).

[0063] By applying a flexible material to the substrate 310 and the counter substrate 370, flexibility can be imparted to the touch panel 300.

[0064] Note that when the flexible touch panel 300 is deformed, the functional elements provided on the touch panel 300 are subjected to stress. It is preferable to arrange the functional elements approximately at the center of the substrate 310 and the counter substrate 370 so that the deformation of the functional elements can be suppressed.

[0065] Also, it is preferable to use materials having approximately the same difference in linear expansion coefficient for the substrate 310 and the counter substrate 370. The linear expansion coefficient of the material is 1×10 / K or less, preferably 5×10 -3 / K or less, more -5 preferably 1×10 / K or less, and even more preferably 1×10 -5It is preferably below / K.

[0066] For example, materials including resins having a siloxane bond such as polyester, polyolefin, polyamide (nylon, aramid, etc.), polyimide, polycarbonate, polyurethane, acrylic resin, epoxy resin, or silicone can be used for the substrate 310 and the counter substrate 370.

[0067] The substrate 310 is a laminate in which a flexible substrate 310b, a barrier film 310a that prevents the diffusion of impurities into the light-emitting element, and a resin layer 310c that bonds the substrate 310b and the barrier film 310a are laminated.

[0068] The counter substrate 370 is a laminate of a flexible base material 370b, a barrier film 370a that prevents the diffusion of impurities into the light-emitting element, and a resin layer 370c that bonds the base material 370b and the barrier film 370a (see FIG. 5(B)).

[0069] The sealing material 360 bonds the counter substrate 370 and the substrate 310. Further, the sealing material 360 has a refractive index larger than that of air and also serves as a layer having an optically bonding function. The pixel circuit and the light-emitting element (for example, the first light-emitting element 350R) are between the substrate 310 and the counter substrate 370.

[0070] <Configuration of Pixel> The pixel 302 has sub-pixels 302R, 302G, and 302B (see FIG. 5( C)). Further, the sub-pixel 302R includes a light-emitting module 380R, the sub-pixel 302G includes a light-emitting module 380G, and the sub-pixel 302B includes a light-emitting module 380B.

[0071] ​​​​For example, sub-pixel 302R includes a pixel circuit including a first light-emitting element 350R and a transistor 302t capable of supplying power to the first light-emitting element 350R (see Fig. 5(B)) . Further, the light-emitting module 380R includes a first light-emitting element 350R and an optical element (e.g., a first coloring layer 367R).

[0072] The first light-emitting element 350R has a layer 353 containing a light-emitting organic compound between a first lower electrode 351R and an upper electrode 352 (see Fig. 5(C)).

[0073] The layer 353 containing a light-emitting organic compound includes a light-emitting unit 353a, a light-emitting unit 353b, and an intermediate layer 354 between the light-emitting unit 353a and the light-emitting unit 353b.

[0074] The light-emitting module 380R has a first coloring layer 367R on the counter substrate 370. The coloring layer may be any layer that transmits light having a specific wavelength, for example, a layer that selectively transmits light exhibiting red, green, blue, or the like. Alternatively, a region that transmits the light emitted by the light-emitting element as it is may be provided.

[0075] For example, the light-emitting module 380R has a sealing material 360 in contact with the first light-emitting element 350R and the first coloring layer 367R.

[0076] The first coloring layer 367R is located at a position overlapping the first light-emitting element 350R. As a result, a part of the light emitted by the first light-emitting element 350R passes through the sealing material 360 having a function of optically bonding and the first coloring layer 367R, and is emitted from the light-emitting module as shown by the arrow in the figure. It is emitted outside the loop 380R. The information processing apparatus according to one aspect of the present invention is in the direction of this arrow, has the first film 102.

[0077] <Configuration of display panel> The touch panel 300 has a light-shielding layer 367BM on the counter substrate 370. The light-shielding layer 367BM is provided so as to surround the colored layer (for example, the first colored layer 367R).

[0078] The touch panel 300 includes an antireflection layer 367p at a position overlapping the display portion 301. As the antireflection layer 367p, for example, a circularly polarized plate can be used.

[0079] The touch panel 300 includes an insulating film 321. In FIG. 5(B), the insulating film 321 covers the transistor 302t. Note that the insulating film 321 can be used as a layer for flattening irregularities caused by the pixel circuit. Further, an insulating film in which a layer capable of suppressing the diffusion of impurities into the transistor 302t or the like is laminated can be applied to the insulating film 321.

[0080] The touch panel 300 has a light-emitting element (for example, the first light-emitting element 350R) on the insulating film 321.

[0081] The touch panel 300 has a partition wall 328 overlapping the end of the first lower electrode 351R on the insulating film 32 1 (see FIG. 5(C)). Further, a spacer 329 for controlling the distance between the substrate 310 and the counter substrate 370 is provided on the partition wall 328.

[0082] <Configuration of image signal line driving circuit> The image signal line driving circuit 303s(1) includes a transistor 303t and a capacitor 303c. Note that the driving circuit can be formed on the same substrate in the same process as the pixel circuit.​​​​

[0083] <Configuration of imaging pixel> The imaging pixel 308 includes a photoelectric conversion element 308p and an imaging pixel circuit for detecting the light irradiated on the photoelectric conversion element 308p. The imaging pixel circuit also includes a transistor 308t. Included.

[0084] For example, a pin-type photodiode can be used as the photoelectric conversion element 308p.

[0085] <Other configurations> The touch panel 300 includes a wiring 311 for supplying signals, and a terminal 319 is provided on the wiring 311. Note that an FPC 309(1) capable of supplying signals such as an image signal and a synchronization signal is electrically connected to the terminal 319. The terminal 319 may be configured to be divided and connected by the FPC 309(1) and the FPC 309(2), or may be configured to be connected by a single FPC 309. In addition, a printed wiring board (PWB) may be attached to the FPC 309(1). Yes. The transistors formed in the same process can be applied to transistors such as the transistor 302t, the transistor 303t, and the transistor 308t. Transistors having structures such as a bottom gate type and a top gate type can be applied.

[0086] Various semiconductors can be applied to the transistors. For example, an oxide semiconductor, single crystal silicon, polysilicon, or amorphous silicon can be applied. Yes.

[0087]

[0088]

[0089]

[0090] ​​​​​Note that this embodiment can be appropriately combined with other embodiments described in this specification. 。

[0091] (Embodiment 3) In this embodiment, a foldable touch panel configuration applicable to a panel substrate of an information processing apparatus according to an aspect of the present invention will be described with reference to FIGS. 6 and 7. will be described.

[0092] FIG. 6(A) is a perspective view of a touch panel 500 illustrated in this embodiment. For clarity, representative components are shown in FIG. 6. FIG. 6(B) is a perspective view of the touch panel 500. For clarity, representative components are shown in FIG. 6. FIG. 6(B) is a perspective view of the touch panel 500. is.

[0093] FIG. 7(A) is a cross-sectional view of the touch panel 500 shown in FIG. 6(A) taken along X1-X2. 。

[0094] The touch panel 500 includes a display unit 501 and a touch sensor 595 (see FIG. 6(B)). The touch panel 500 also has a substrate 510, a substrate 570, and a substrate 590. Note that substrates 510, 570, and 590 all have flexibility.

[0095] The display unit 501 includes a substrate 510, a plurality of pixels on the substrate 510, a plurality of wirings 511 capable of supplying signals to the pixels, and an image signal line driving circuit 503s(1). The plurality of wirings 511 are routed to the outer peripheral portion of the substrate 510, and a part of them forms a terminal 519. The terminal 519 is electrically connected to an FPC 509(1).

[0096]

[0096] <Touch Sensor> On the substrate 590, there are a touch sensor 595 and a plurality of ​It is provided with wiring 598. A plurality of wirings 598 are routed along the outer peripheral portion of the substrate 590, and a part of them constitutes a terminal. And the terminal is electrically connected to the FPC 509(2). Incidentally, in FIG. 6(B), for clarity, the electrodes, wirings, etc. of the touch sensor 595 provided on the back side (the surface side facing the substrate 510) of the substrate 590 are shown by solid lines.

[0097] As the touch sensor 595, for example, a capacitance type touch sensor can be applied. As the capacitance method, there are a surface capacitance method, a projection capacitance method, etc.

[0098] As the projection capacitance method, mainly due to the difference in the driving method, there are a self-capacitance method, a mutual-capacitance method, etc. Using the mutual-capacitance method is preferable because simultaneous multi-point detection becomes possible.

[0099] Hereinafter, the case of applying a projection capacitance type touch sensor will be described with reference to FIG. 6(B).

[0100] Incidentally, various sensors that can detect the proximity or contact of a detection target such as a finger can be applied.

[0101] The projection capacitance type touch sensor 595 has an electrode 591 and an electrode 592. The electrode 5 91 is electrically connected to any one of the plurality of wirings 598, and the electrode 592 is electrically connected to any other one of the plurality of wirings 598.

[0102] As shown in FIGS. 6(A) and 6(B), the electrode 592 has a shape in which a plurality of quadrilaterals repeatedly arranged in one direction are connected at corners.

[0103] The electrode 591 is a quadrilateral and is repeatedly arranged in a direction intersecting the direction in which the electrode 592 extends. ​​​​​It is the case.

[0104] The wiring 594 electrically connects two electrodes 591 sandwiching the electrode 592. At this time, a shape in which the area of the intersection portion of the electrode 592 and the wiring 594 is as small as possible is preferable. Thereby the area of the region where no electrode is provided can be reduced, and unevenness in transmittance can be reduced. As a result the unevenness in the luminance of the light transmitted through the touch sensor 595 can be reduced.

[0105] Note that the shapes of the electrodes 591 and 592 are not limited to this, and various shapes can be adopted. For example a plurality of electrodes 591 are arranged so that gaps are not generated as much as possible, and a plurality of electrodes 59 2 are provided separately so that a region where they do not overlap with the electrode 591 is formed. At this time, it is preferable to provide a dummy electrode that is electrically insulated from these between two adjacent electrodes 592, because the area of the regions with different transmittances can be reduced.

[0106] The configuration of the touch sensor 595 will be described with reference to FIG. 7.

[0107] The touch sensor 595 includes a substrate 590, electrodes 591 and electrodes 592 arranged in a staggered pattern on the substrate 590, an insulating layer 593 covering the electrodes 591 and the electrodes 592, and wiring 594 that electrically connects adjacent electrodes 591.

[0108] The resin layer 597 adheres the substrate 590 to the substrate 570 so that the touch sensor 595 overlaps the display unit 501.

[0109] The electrodes 591 and 592 are formed using a conductive material having translucency. As the conductive material having translucency there are indium oxide, indium tin oxide, indium zinc oxide, Conductive oxides such as zinc oxide and zinc oxide added with gallium can be used. Note that , a film containing graphene can also be used. The film containing graphene can be formed, for example, by reducing a film containing graphene oxide formed in a film shape. As a method of reduction, methods such as applying heat can be mentioned.

[0110] After forming a conductive material having translucency on the substrate 590 by sputtering, unnecessary portions are removed by various patterning techniques such as photolithography to form the electrode 591 and the electrode 592.

[0111] In addition, as materials used for the insulating layer 593, for example, resins such as acrylic resin and epoxy resin, resins having a siloxane bond such as silicone, and inorganic insulating materials such as silicon oxide, silicon oxynitride, and aluminum oxide can also be used.

[0112] An opening reaching the electrode 591 is provided in the insulating layer 593, and the wiring 594 electrically connects the adjacent electrode 5 91. The translucent conductive material can increase the aperture ratio of the touch panel, so it can be suitably used for the wiring 594. In addition, a material having higher conductivity than the electrode 591 and the electrode 592 can reduce the electrical resistance, so it can be suitably used for the wiring 594.

[0113] One electrode 592 extends in one direction, and a plurality of electrodes 592 are provided in a stripe shape.

[0114] The wiring 594 is provided intersecting the electrode 592.

[0115] A pair of electrodes 591 are provided with one electrode 592 interposed therebetween, and the wiring 594 connects the pair of electrodes 591 are electrically connected.

[0116] Note that the plurality of electrodes 591 do not necessarily have to be arranged in a direction perpendicular to a single electrode 592, and may be arranged at an angle of less than 90 degrees.

[0117] A single wiring 598 is electrically connected to the electrode 591 or the electrode 592. A part of the wiring 598 functions as a terminal. As the wiring 598, for example, metal materials such as aluminum, gold, platinum, silver, nickel, titanium, tungsten, chromium, molybdenum, iron, cobalt, copper, or palladium, and alloy materials containing the metal materials can be used.

[0118] Note that an insulating layer covering the insulating layer 593 and the wiring 594 can be provided to protect the touch sensor 595.

[0119] Also, although not shown in FIG. 7, the connection layer 599 electrically connects the wiring 598 and the FPC 509(2).

[0120] As the connection layer 599, various anisotropic conductive films (ACF: Anisotropic Conductive Film) and anisotropic conductive pastes (ACP: Anisotro pic Conductive Paste) can be used.

[0121] The resin layer 597 has translucency. For example, thermosetting resins or ultraviolet curable resins can be used, and specifically, acrylic resins, polyurethanes, epoxy resins, or resins having a siloxane bond such as silicone can be used.

[0122] <Display section> The display unit 501 includes a plurality of pixels arranged in a matrix. The pixels include display elements and pixel circuits for driving the display elements.

[0123] In this embodiment, a case where an organic electroluminescence element that emits white light is applied as the display element will be described, but the display element is not limited thereto.

[0124] For example, organic electroluminescence elements having different emission colors may be applied to each sub-pixel so that the color of the light emitted from each sub-pixel is different.

[0125] In addition to the organic electroluminescence element, display elements that perform display by an electrophoresis method, an electro-wetting method, etc. (also called electronic ink), shutter-type MEM S display elements, optical interference-type MEMS display elements, liquid crystal elements, etc., various display elements can be used as the display element. Also, it can be applied to transmissive liquid crystal displays, transflective liquid crystal displays, reflective liquid crystal displays, direct-view liquid crystal displays, etc. Note that when realizing a transflective liquid crystal display or a reflective liquid crystal display, part or all of the pixel electrodes may have the function as a reflective electrode. For example, part or all of the pixel electrodes may have aluminum, silver, etc. Further, in that case it is also possible to provide a memory circuit such as SRAM under the reflective electrode. Thereby, further, power consumption can be reduced. Also, a suitable configuration for the applied display element can be selected and used from various pixel circuits. Moreover, in the display unit, an active matrix method in which the pixel has an active element, or a pixel

[0126] ​​​​​​A passive matrix method without any active elements can be used.

[0127] In the active matrix method, as active elements (active elements, non-linear elements), not only transistors but also various active elements (active elements, non-linear elements) can be used. For example, MIM (Metal Insulator Metal) or TF D (Thin Film Diode) etc. can also be used. Since these elements have fewer manufacturing steps, the manufacturing cost can be reduced or the yield can be improved. Or, since the size of these elements is small, the aperture ratio can be improved, and low power consumption and high brightness can be achieved.

[0128] As something other than the active matrix method, it is also possible to use a passive matrix type that does not use active elements (active elements, non-linear elements). Since no active elements (active elements, non-linear elements) are used, there are fewer manufacturing steps, so the manufacturing cost can be reduced or the yield can be improved. Or, since no active elements (active elements, non-linear elements) are used, the aperture ratio can be improved, and low power consumption or high brightness etc. can be achieved.

[0129] Materials having flexibility can be suitably used for the substrate 510 and the substrate 570.

[0130] Materials with suppressed impurity permeation can be suitably used for the substrate 510 and the substrate 570. For example, the water vapor transmission rate is 10 g / (m -5 ·day) or less, preferably 10 2 g / (m -6 g / (m 2 ​​​​​​​​·Materials with the following properties can be preferably used.

[0131] Materials with approximately equal linear expansion coefficients can be preferably used for the substrate 510 and the substrate 570. For example, materials with a linear expansion coefficient of 1×10 -3 / K or less, preferably 5×10 -5 / K or less, more preferably 1×10 -5 / K or less can be preferably used.

[0132] The substrate 510 is a laminate in which a flexible substrate 510b, a barrier film 510a that prevents the diffusion of impurities into the light-emitting element, and a resin layer 510c that bonds the substrate 510b and the barrier film 510a are laminated. That is.

[0133] For example, polyester, polyolefin, polyamide (nylon, aramid, etc.), polyimide, polycarbonate or acrylic resin, polyurethane, epoxy resin, or a resin having a siloxane bond such as silicone can be used for the resin layer 510c.

[0134] The substrate 570 is a laminate of a flexible substrate 570b, a barrier film 570a that prevents the diffusion of impurities into the light-emitting element, and a resin layer 570c that bonds the substrate 570b and the barrier film 570a. That is.

[0135] The sealing material 560 bonds the substrate 570 and the substrate 510. The sealing material 560 has a refractive index larger than that of air. Also, when extracting light from the sealing material 560 side, the sealing material 560 also serves as a layer having an optically bonding function. The pixel circuit and the light-emitting element (for example, the first light-emitting element 550R) are located between the substrate 510 and the substrate 570.

[0136] <Configuration of pixel> The pixel includes a sub-pixel 502R, and the sub-pixel 502R includes a light-emitting module 580R.

[0137] The sub-pixel 502R includes a pixel circuit including a first light-emitting element 550R and a transistor 502t capable of supplying power to the first light-emitting element 550R. Also, the light-emitting module 580R includes the first light-emitting element 550R and an optical element (for example, a first color filter layer 567R). The first light-emitting element 550R has a lower electrode, an upper electrode, and a layer including a light-emitting organic compound between the lower electrode and the upper electrode. The light-emitting module 580R has a first color filter layer 567R in the direction of extracting light. The color filter layer

[0138] merely needs to transmit light having a specific wavelength, and for example, a color filter layer that selectively transmits light presenting red, green, blue, or the like can be used. In addition, in other sub-pixels, a region that transmits the light emitted by the light-emitting element as it is may be provided. The light-emitting module 580R has a first color filter layer 567R in the direction of extracting light. The color filter layer

[0139] merely needs to transmit light having a specific wavelength, and for example, a color filter layer that selectively transmits light presenting red, green, blue, or the like can be used. In addition, in other sub-pixels, a region that transmits the light emitted by the light-emitting element as it is may be provided. merely needs to transmit light having a specific wavelength, and for example, a color filter layer that selectively transmits light presenting red, green, blue, or the like can be used. In addition, in other sub-pixels, a region that transmits the light emitted by the light-emitting element as it is may be provided. merely needs to transmit light having a specific wavelength, and for example, a color filter layer that selectively transmits light presenting red, green, blue, or the like can be used. In addition, in other sub-pixels, a region that transmits the light emitted by the light-emitting element as it is may be provided. merely needs to transmit light having a specific wavelength, and for example, a color filter layer that selectively transmits light presenting red, green, blue, or the like can be used. In addition, in other sub-pixels, a region that transmits the light emitted by the light-emitting element as it is may be provided.

[0140] When the sealing material 560 is provided on the light extraction side, the sealing material 560 is in contact with the first light-emitting element 550R and the first color filter layer 567R. When the sealing material 560 is provided on the light extraction side, the sealing material 560 is in contact with the first light-emitting element 550R and the first color filter layer 567R.

[0141] The first color filter layer 567R is located at a position overlapping the first light-emitting element 550R. As a result, a part of the light emitted by the first light-emitting element 550R passes through the first color filter layer 567R and is emitted to the outside of the light-emitting module 580R in the direction of the arrow shown in the figure. The information processing apparatus according to an aspect of the present invention has a first film 102 in the direction of this arrow. has a first film 102 in the direction of this arrow. has a first film 102 in the direction of this arrow.

[0142] <Configuration of the display unit> The display unit 501 has a light-shielding layer 567BM in the light-emitting direction. The light-shielding layer 567BM is It is provided so as to surround a colored layer (for example, the first colored layer 567R).

[0143] The display unit 501 includes an anti-reflection layer 567p at a position overlapping the pixels. As the polarizing plate, for example, a circular polarizing plate can be used.

[0144] The display unit 501 includes an insulating film 521. The insulating film 521 covers the transistor 502t. The insulating film 521 is used as a layer for flattening unevenness caused by the pixel circuit. In addition, a laminated film including a layer capable of suppressing diffusion of impurities can be applied to the insulating film 521. This can prevent the reliability of the transistors 502t and the like from being deteriorated due to the diffusion of impurities. The decline can be suppressed.

[0145] The display unit 501 has a light-emitting element (for example, a first light-emitting element 550R) on an insulating film 521. .

[0146] The display portion 501 has a partition wall 528 on an insulating film 521, the partition wall 528 overlapping an end of a lower electrode. A spacer for controlling the distance between the substrate 510 and the substrate 570 is provided on the partition wall 528 .

[0147] <Configuration of the scanning line driving circuit> The scanning line driver circuit 503g(1) includes a transistor 503t and a capacitor 503c. In addition, the driver circuit and the pixel circuit can be formed on the same substrate in the same process.

[0148] <Other configurations> The display unit 501 includes a wiring 511 capable of supplying a signal, and a terminal 519 is connected to the wiring 51 1. In addition, F PC 509 ( 1 ) is electrically connected to terminal 519 .

[0149] In addition, a printed wiring board (PWB) may be attached to the FPC509(1). .

[0150] The display unit 501 has wiring such as scanning lines, signal lines, and power lines. There can be.

[0151] Specifically, aluminum, chromium, copper, tantalum, titanium, molybdenum, and tungsten , nickel, yttrium, zirconium, silver or manganese; Use an alloy containing the above-mentioned metal elements or an alloy combining the above-mentioned metal elements. In particular, aluminum, chromium, copper, tantalum, titanium, molybdenum, tantalum It is preferable that the alloy contains one or more elements selected from the group consisting of copper and manganese. Gold is suitable for microfabrication using wet etching techniques.

[0152] Specifically, a two-layer structure in which a titanium film is laminated on an aluminum film, a titanium nitride film on a titanium nitride film, Two-layer structure with a tungsten film laminated on a titanium nitride film, two-layer structure with a tungsten film laminated on a titanium nitride film, A two-layer structure in which a tungsten film is laminated on a titanium film or a tungsten nitride film, a titanium film, A three-layer structure in which an aluminum film is layered on the titanium film, and a titanium film is then formed on top of that. etc. can be used.

[0153] Specifically, titanium, tantalum, tungsten, molybdenum, chromium, etc. are deposited on an aluminum film. , neodymium, scandium or a combination of two or more of these. A laminated structure in which multiple chemical films are laminated can be used.

[0154] Alternatively, a light-transmissive conductive material containing indium oxide, tin oxide, or zinc oxide may also be used. This is acceptable.

[0155] <Modification Example 1 of the Display Unit> Various transistors can be applied to the display unit 501.

[0156] The configuration when applying a bottom-gate type transistor to the display unit 501 is illustrated in FIGS. 7(A) and 7(B).

[0157] For example, a semiconductor layer containing an oxide semiconductor, amorphous silicon, etc. can be applied to the transistors 502t and 503t illustrated in FIG. 7(A). This is possible.

[0158] For example, it is preferably composed of an In-M-Zn oxide containing at least indium (In), zinc (Zn), and M (a metal such as Al, Ga, Ge, Y, Zr, Sn, La, Ce, or Hf). Alternatively, it preferably contains both In and Zn. This is preferable.

[0159] Examples of stabilizers include gallium (Ga), tin (Sn), hafnium (Hf), aluminum (Al), or zirconium (Zr), etc. Also, other stabilizers include lanthanoids such as lanthanum (La), cerium (Ce), praseodymium (P r), neodymium (Nd), samarium (Sm), europium (Eu), gadolinium ( Gd), terbium (Tb), dysprosium (Dy), holmium (Ho), erbium ( Er), thulium (Tm), ytterbium (Yb), lutetium (Lu), etc. This is the case. This is acceptable.

[0160] As the oxide semiconductor constituting the oxide semiconductor film, for example, In-Ga-Zn-based oxide, I n-Al-Zn-based oxide, In-Sn-Zn-based oxide, In-Hf-Zn-based oxide, In -La-Zn-based oxide, In-Ce-Zn-based oxide, In-Pr-Zn-based oxide, In- Nd-Zn-based oxide, In-Sm-Zn-based oxide, In-Eu-Zn-based oxide, In-G d-Zn-based oxide, In-Tb-Zn-based oxide, In-Dy-Zn-based oxide, In-Ho -Zn-based oxide, In-Er-Zn-based oxide, In-Tm-Zn-based oxide, In-Yb- Zn-based oxide, In-Lu-Zn-based oxide, In-Sn-Ga-Zn-based oxide, In-H f-Ga-Zn-based oxide, In-Al-Ga-Zn-based oxide, In-Sn-Al-Zn-based oxide, In-Sn-Hf-Zn-based oxide, In-Hf-Al-Zn-based oxide, In-G a-based oxide can be used.

[0161] Here, the In-Ga-Zn-based oxide means an oxide having In, Ga, and Zn as main components, and the ratio of In, Ga, and Zn is not limited. Further, other metal elements may be contained in addition to In, Ga, and Zn.

[0162] For example, a semiconductor layer containing polycrystalline silicon crystallized by a treatment such as laser annealing can be applied to the transistors 502t and 503t shown in FIG. 7(B).

[0163] The configuration in the case of applying a top-gate type transistor to the display unit 501 is shown in FIG. 7(C).

[0164] For example, a single crystal silicon film or the like transferred from a polycrystalline silicon or single crystal silicon substrate or the like ​​​​The semiconductor layer including can be applied to the transistors 502t and 50 3t shown in FIG. 7(C).

[0165] Note that this embodiment can be appropriately combined with other embodiments shown in this specification .

[0166] (Embodiment 4) In this embodiment, a configuration of a foldable touch panel applicable to an information processing apparatus according to an aspect of the present invention will be described with reference to FIG. 8.

[0167] FIG. 8 is a cross-sectional view of the touch panel 500B.

[0168] The touch panel 500B described in this embodiment includes a display unit 501 that displays the supplied image information on the side where the transistors are provided, and the touch sensor is provided on the substrate 510 side, which is different from the touch panel 500 described in Embodiment 3 . Here, different configurations will be described in detail, and parts where the same configurations can be used will refer to the above description.

[0169] <Display unit> The display unit 501 includes a plurality of pixels arranged in a matrix. The pixel includes a display element and a pixel circuit for driving the display element.

[0170] <Configuration of pixel> The pixel includes a sub-pixel 502R, and the sub-pixel 502R includes a light-emitting module 580R.

[0171] The sub-pixel 502R includes a first light-emitting element 550R and a pixel circuit including a transistor 502t that can supply power to the first light-emitting element 550R .

[0172] ​​ The light-emitting module 580R includes a first light-emitting element 550R and an optical element (e.g., a first colorant layer 567R).

[0173] The first light-emitting element 550R has a lower electrode, an upper electrode, and a layer containing a light-emitting organic compound between the lower electrode and the upper electrode.

[0174] The light-emitting module 580R has a first colorant layer 567R in the direction of extracting light. The colorant layer may be any layer that transmits light having a specific wavelength. For example, a layer that selectively transmits light having a color such as red, green, or blue can be used. In other sub-pixels, a region that transmits the light emitted by the light-emitting element as it is may be provided.

[0175] The first colorant layer 567R is located at a position overlapping the first light-emitting element 550R. Also, the first light-emitting element 550R shown in FIG. 8(A) emits light toward the side where the transistor 502t is provided. As a result, a part of the light emitted by the first light-emitting element 550R passes through the first colorant layer 567R and is emitted outside the light-emitting module 580R in the direction of the arrow shown in the figure. An information processing apparatus according to an aspect of the present invention has a first film 102 in the direction of this arrow.

[0176] <Configuration of the display unit> The display unit 501 has a light-shielding layer 567BM in the direction of emitting light. The light-shielding layer 567BM is provided so as to surround a colorant layer (e.g., the first colorant layer 567R).

[0177] The display unit 501 includes an insulating film 521. The insulating film 521 covers the transistor 502t and is used as a layer for flattening the unevenness caused by the pixel circuit. ​​​​​This is possible. Also, a laminated film including a layer capable of suppressing the diffusion of impurities can be applied to the insulating film 521. This is possible. Thereby, for example, the decrease in reliability of the transistor 502t or the like due to impurities diffusing from the first colored layer 567R can be suppressed.

[0178] <Touch sensor> The touch sensor 595 is provided on the substrate 510 side of the display unit 501 (see Fig. 8(A)). )

[0179] The resin layer 597 is between the substrate 510 and the substrate 590, and bonds the display unit 501 and the touch sensor 595.

[0180] <Modification example 1 of the display unit> Various transistors can be applied to the display unit 501.

[0181] The configuration when applying a bottom gate type transistor to the display unit 501 is illustrated in Fig. 8(A) and Fig. 8(B).

[0182] For example, a semiconductor layer containing an oxide semiconductor, amorphous silicon, etc. can be applied to the transistors 502t and 503t illustrated in Fig. 8(A). Also, a pair of gate electrodes can be provided so as to sandwich the region where the channel of the transistor is formed vertically. Thereby, the variation in the characteristics of the transistor can be suppressed and the reliability can be enhanced.

[0183] For example, a semiconductor layer containing polycrystalline silicon, etc. can be applied to the transistors 502t and 503t illustrated in Fig. 8(B).

[0184] The configuration when applying a top gate type transistor to the display unit 501 is illustrated in Fig. 8(C). ​​​​​​​

[0185] For example, a semiconductor layer including a polycrystalline silicon or a transferred single-crystalline silicon film can be applied to the transistors 502t and 503t illustrated in Fig. 8( C). .

[0186] In addition, this embodiment can be appropriately combined with other embodiments described in this specification .

[0187] (Embodiment 5) In this embodiment, the rotation direction of the housing described in other embodiments will be described

[0188] The panel substrate according to one aspect of the present invention is preferably a touch panel. The display portion of the touch panel is provided with a touch sensor, and the touch position is detected by touching the first film 102 with a thin member at the tip of a pen, pencil, or the like, or a finger. That is, the panel substrate 101 is protected by the first film 102 .

[0189] When a thin member at the tip touches the first film 102, it is required that the first film 102 has high hardness so as not to be damaged. The hardness of the first film 1 02 can be evaluated by a pencil hardness test. In order to increase the hardness of the first film 102, it is preferable that the first film 102 has a sufficient thickness and is formed of a material having sufficient hardness .

[0190] On the panel substrate 101, there are a plurality of vulnerable parts 600A such as cracks, interfaces between wirings and insulating films, etc., caused by the touch of a thin member at the tip. Also, there are a plurality of vulnerable parts 600B caused by the touch of a thin member at the tip or the like on the first film 102 . ​​

[0191] The panel substrate 101 has a flexible substrate 601, a flexible substrate 602, and an element formation region 603 therebetween. In the element formation region 603, wirings made of metal layers, inorganic insulating films, etc. are formed, and their interfaces exist. These interfaces, steps, grain boundaries, etc. are likely to become weak portions 600A . Therefore, many weak portions 600A exist in the element formation region 603. When the weak portion 600A in the element formation region 603 breaks, elements (for example, transistors, capacitor elements, wirings, etc.) included in the element formation region 603 may be destroyed.

[0192] For example, within the range of the movable area of the housing, with the substrate 602 on the inside, the panel substrate 101 is bent so that a bending moment 604 is generated in the panel substrate 101 (see Fig. 12(A)).

[0193] When the panel substrate 101 is bent under the action of the bending moment 604, tensile stress is generated in the substrate 601 on the convexly bent side of the panel substrate 101 to counteract the bending moment 604 . Further, compressive stress is generated in the substrate 602 on the concavely bent side. Note that there is a surface near the center of the panel substrate 101 where neither tensile stress nor compressive stress is generated, and this is called the neutral plane 605 .

[0194] The magnitude of the stress is 0 at the neutral plane 605 of the panel substrate 101. The tensile stress linearly increases toward the surface on the substrate 601 side of the panel substrate 101, and the compressive stress linearly increases toward the surface on the substrate 602 side of the panel substrate 101. Note that each reaches its maximum on the surface of the panel substrate 101, and the stress on the surface of this panel substrate 101 is called the bending stress of the panel substrate 101 .

[0195] When a tensile stress acts on the weak portion 600A, a crack starts from the weak portion 600A, and the weak portion On the other hand, when a compressive stress acts on the weak part 600A, the weak part 6 Since 00A is crushed, it is unlikely to become the starting point of fracture.

[0196] Since the element formation region 603 has a thickness, the element formation region 603 is formed only on the neutral surface 605. However, if it is formed in the vicinity of the neutral plane 605, it will not occur in the element formation region 603. The bending stress can be reduced. In addition, the stress applied to the element forming region 603 is 0 or In other words, the panel substrate is preferably in a compression direction. It is preferable to have the panel substrate 101 bent inward by the inward bending mechanism 605. Even if the insulating film is heated, cracks are unlikely to occur in the film provided in the element formation region 603 .

[0197] The information processing device of the present invention includes a first film 102 (see FIG. 12(B)). The film 102 is not fixed to the panel substrate 101. The panel substrate 101 is bent so that the surface 2 of the touch panel is concave. Alternatively, for example, the display unit can be protected from the panel substrate from the first film 102 side. When an external force 606 is applied to the plate 101, the neutral plane 605 of the panel substrate 101 is The element formation region 606 is moved to the first film 102 side by reducing the external force 606. It is possible to suppress the tensile stress applied to the element formation region 603. This can prevent breakage or cracks in the structure.

[0198] Alternatively, the first film 102 may be flexible and may have a surface other than the surface in contact with the panel substrate 101. It is provided with a hard coat layer. Thereby, it is possible to protect the panel base plate 101 from a thin member at the tip such as a pen or a pencil. Or, even if the panel base plate 101 is bent so that the hard coat layer is on the inside, the stress applied to the hard coat layer can always be made zero or in the compression direction.

[0199] The information processing apparatus of the present invention includes a first housing, a second housing, a panel substrate 101, and a first film 102. The first housing is rotatably connected to the second housing, and the first film 102 has a surface in contact with the panel substrate 101, and in a state where the surface is bent so as to be convex, the panel substrate 101 provides an element formation region 603 on the side of the first film 102 from the neutral plane. In addition, the first film 102 has a hard coat layer on the side of the panel substrate 101.

[0200] Further, in the information processing apparatus according to one aspect of the present invention, the first housing is rotatably connected to the second housing within a predetermined movable range about a rotation axis, and the predetermined movable range restricts rotation so that the surface of the first film 102 on the side of the panel substrate 101 is flat or convex. Thereby, when the first housing is rotated about the rotation axis, generation of tensile stress in the element formation region 603 or the hard coat layer can be prevented. Or, destruction of the element formation region 603 can be prevented. Or, destruction of the hard coat layer can be prevented.

[0201] The first film 102 can be made of a material having flexibility and transparency to visible light. For example, polyester resins such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polyacrylonitrile resin, polyimide resin, poly Methyl methacrylate resin, polycarbonate (PC) resin, polyethersulfone (PES) resin, polyamide resin, cycloolefin resin, polystyrene resin, polyamideimide resin, polyvinyl chloride resin, polytetrafluoroethylene (PTFE) resin, etc. are mentioned. In particular, it is preferable to use a material with a low coefficient of thermal expansion. For example, polyamideimide resin, polyimide resin, PET, etc. with a coefficient of thermal expansion of 30×10⁻⁶ / K or less can be preferably used. Also, a substrate impregnated with an organic resin in glass fibers or a substrate with an inorganic filler mixed in an organic resin to reduce the coefficient of thermal expansion can be used. A substrate using such a material is light in weight, so the display panel using the substrate can also be made lightweight. As the material for the hard coat layer of the first film 102, a thermosetting resin or the like can be used. For example, epoxy resin, phenol resin, unsaturated polyester resin, urea resin, melamine resin, diallyl phthalate resin, silicone resin, vinyl ester resin, polyimide, polyurethane, etc. can be used. These materials are hard and resistant to heat and solvents, and are effective from the viewpoint of surface protection. As the material for the hard coat layer of the first film 102, for example, urethane acrylate is preferably used. In addition, the hard coat layer of the first film 102 preferably contains metal oxide particles such as silica particles and alumina particles as an example. Also, it is preferable that the first film 102 is coated with alumina. The first film 102 may have a structure in which a plurality of different materials are laminated. For example, a 75μm thick PE layer on a 27μm thick hard coat layer is mentioned. In particular, it is preferable to use a material with a low coefficient of thermal expansion. For example, polyamideimide resin, polyimide resin, PET, etc. with a coefficient of thermal expansion of 3 0×10 -6 / K or less can be preferably used. Also, a substrate impregnated with an organic resin in glass fibers or a substrate with an inorganic filler mixed in an organic resin to reduce the coefficient of thermal expansion can be used. A substrate using such a material is light in weight, so the display panel using the substrate can also be made lightweight. As the material for the hard coat layer of the first film 102, a thermosetting resin or the like can be used. For example, epoxy resin, phenol resin, unsaturated polyester resin, urea resin, melamine resin, diallyl phthalate resin, silicone resin, vinyl ester resin, polyimide, polyurethane, etc. can be used. These materials are hard and resistant to heat and solvents, and are effective from the viewpoint of surface protection. As the material for the hard coat layer of the first film 102, for example, urethane acrylate is preferably used. In addition, the hard coat layer of the first film 102 preferably contains metal oxide particles such as silica particles and alumina particles as an example. Also, it is preferable that the first film 102 is coated with alumina. The first film 102 may have a structure in which a plurality of different materials are laminated. For example, a 75μm thick PE layer on a 27μm thick hard coat layer is mentioned. In particular, it is preferable to use a material with a low coefficient of thermal expansion. For example, polyamideimide resin, polyimide resin, PET, etc. with a coefficient of thermal expansion of 3

[0202] As the material for the hard coat layer of the first film 102, a thermosetting resin or the like can be used. For example, epoxy resin, phenol resin, unsaturated polyester resin, urea resin, melamine resin, diallyl phthalate resin, silicone resin, vinyl ester resin, polyimide, polyurethane, etc. can be used. These materials are hard and resistant to heat and solvents, and are effective from the viewpoint of surface protection. As the material for the hard coat layer of the first film 102, for example, urethane acrylate is preferably used. As the material for the hard coat layer of the first film 102, a thermosetting resin or the like can be used. For example, epoxy resin, phenol resin, unsaturated polyester resin, urea resin, melamine resin, diallyl phthalate resin, silicone resin, vinyl ester resin, polyimide, polyurethane, etc. can be used. These materials are hard and resistant to heat and solvents, and are effective from the viewpoint of surface protection. As the material for the hard coat layer of the first film 102, for example, urethane acrylate is preferably used. In addition, the hard coat layer of the first film 102 preferably contains metal oxide particles such as silica particles and alumina particles as an example. Also, it is preferable that the first film 102 is coated with alumina. The first film 102 may have a structure in which a plurality of different materials are laminated. For example, a 75μm thick PE layer on a 27μm thick hard coat layer is mentioned. In particular, it is preferable to use a material with a low coefficient of thermal expansion. For example, polyamideimide resin, polyimide resin, PET, etc. with a coefficient of thermal expansion of 3 0×10 / K or less can be preferably used. Also, a substrate impregnated with an organic resin in glass fibers or a substrate with an inorganic filler mixed in an organic resin to reduce the coefficient of thermal expansion can be used. A substrate using such a material is light in weight, so the display panel using the substrate can also be made lightweight.

[0203] In addition, the hard coat layer of the first film 102 preferably contains metal oxide particles such as silica particles and alumina particles as an example. Also, it is preferable that the first film 102 is coated with alumina. The first film 102 may have a structure in which a plurality of different materials are laminated. For example, a 75μm thick PE layer on a 27μm thick hard coat layer is mentioned. In particular, it is preferable to use a material with a low coefficient of thermal expansion. For example, polyamideimide resin, polyimide resin, PET, etc. with a coefficient of thermal expansion of 3 0×10 / K or less can be preferably used. Also, a substrate impregnated with an organic resin in glass fibers or a substrate with an inorganic filler mixed in an organic resin to reduce the coefficient of thermal expansion can be used. A substrate using such a material is light in weight, so the display panel using the substrate can also be made lightweight. A film having a structure in which T films are stacked can be used.

[0204] Further, it is preferable that the surface of the first film 102 is processed to generate an appropriate amount of frictional force against a contacted finger or the like. For example, appropriate unevenness (texture) may be provided on the first film 102.

[0205] When moving a finger while pressing against the first film 102, if the friction between the finger and the first film 102 is too large, the fingertip will be deformed. As a result, it becomes difficult to perform an input using the delicate movement of the fingertip. Examples of materials that generate too much friction include glass with a sufficiently polished and flat surface. On the other hand, if the friction between the finger and the first film 102 is too small, the tactile sensation against the surface of the finger is lost.

[0206] As a means for generating appropriate friction on the surface of the first film 102, a film having silica particles or the like disposed on the surface can be used for the first film 102. Thereby, the friction between the finger and the first film 102 can be made appropriate.

[0207] Note that the present embodiment can be appropriately combined with other embodiments described in this specification.

[0208] (Embodiment 6) In this embodiment, a method for manufacturing a foldable device applicable to an information processing apparatus, an electronic device, or the like according to an aspect of the present invention will be described with reference to FIGS. 9 to 11. Note that examples of foldable devices include display devices, light-emitting devices, input devices, and the like. Examples of input devices include touch sensors and touch panels. Examples of light-emitting devices include the like. Examples include an organic EL panel and a lighting device. Examples of display devices include an organic EL panel and a liquid crystal display device. Note that, inside a display device or a light-emitting device, there may be provided a function of an input device such as a touch sensor. For example, a touch sensor may be provided on a counter substrate (for example, a substrate on which no transistor is provided) included in a display device or a light-emitting device . Alternatively, a touch sensor may be provided on an element substrate (for example, a substrate on which a transistor is provided) included in a display device or a light-emitting device. Further , a touch sensor may be provided on both a counter substrate included in a display device or a light-emitting device and an element substrate included in a display device or a light-emitting device .

[0209] First, a release layer 703 is formed on a production substrate 701, and a layer to be released 705 is formed on the release layer 703 (FIG. 9(A)). Further, a release layer 723 is formed on a production substrate 721, and a layer to be released 725 is formed on the release layer 723 (FIG. 9(B)).

[0210] For example, when a tungsten film is used as the release layer, plasma treatment is performed on the tungsten film with a gas containing oxygen such as N2O, or annealing is performed in an atmosphere of a gas containing oxygen , or a tungsten oxide film is formed by a method such as sputtering in an atmosphere of a gas containing oxygen so that a tungsten oxide film can be formed between the tungsten film and the layer to be released using an oxidation method such as the above.

[0211] At the time of performing the release displacement step, it is preferable that the tungsten oxide film contains a large amount of a composition in which the ratio of oxygen to tungsten is less than 3 in the composition of tungsten oxide. In tungsten oxide, when n is a natural number of 1 or more, W O n ​(3n-1) ,W n O (3n-2) In the case of a homologous series, there is a crystallo-optical shear cross-section, and shear occurs due to overheating. It becomes easier. By performing N2O plasma treatment to form a tungsten oxide film, the peeling layer can be peeled from the substrate with a small force.

[0212] Alternatively, without forming a tungsten film, a tungsten oxide film can be directly formed . For example, for a sufficiently thin tungsten film, plasma treatment is performed with a gas containing oxygen or annealing is performed in a gas atmosphere containing oxygen, or in a gas atmosphere containing oxygen a tungsten oxide film is formed by a method such as sputtering, so that only the tungsten oxide film is peeled and formed as a layer.

[0213] At this time, when separating at the interface between the tungsten film and the tungsten oxide film or inside the tungsten oxide film, a tungsten oxide film may remain on the peeling layer side. And, due to the remaining tungsten oxide film, it may have an adverse effect on the characteristics of the transistor. Therefore, after the separation step of the peeling layer and the layer to be peeled, it is preferable to have a step of removing the tungsten oxide film. Note that in the above-described peeling method from the substrate, it is not always necessary to perform N2O plasma treatment, so it is also possible to reduce the step of removing the tungsten oxide film. In this case, the device can be manufactured more simply.

[0214] Also, one aspect of the present invention uses a tungsten film having a thickness of 0.1 nm or more and less than 200 nm on a substrate.

[0215] ​In addition to the tungsten film, for the release layer, a film containing molybdenum, titanium, vanadium, tantalum, silicon, aluminum, or an alloy thereof may be used. Also, a laminated structure of these films and their oxide films may be used. The release layer is not limited to an inorganic film, and an organic film such as polyimide may be used. When an organic resin is used for the release layer and low-temperature polysilicon is to be used as the semiconductor layer, the process needs to be processed at 350 °C or lower. Therefore, dehydrogenation bake for silicon crystallization, hydrogenation for terminating defects in silicon, activation of doped regions, etc. cannot be performed sufficiently, and the performance is limited. On the other hand, when an inorganic film is used, the film formation temperature is not limited to 350 °C, and it is possible to exhibit excellent characteristics. When an organic resin is used for the release layer, the organic resin and functional elements may be damaged by laser irradiation during crystallization. However, when an inorganic film is used for the release layer, such problems do not occur, which is preferable. Also, when an organic resin is used for the release layer, the organic resin may shrink due to laser irradiation for resin peeling, which may cause poor contact at the contact portion of terminals such as FPC. Therefore, it may be difficult to peel and transfer functional elements with a large number of terminals, such as a high-precision display, with high yield. When an inorganic film is used for the release layer, there is no such limitation, and it is possible to peel and transfer with high yield even for functional elements with a large number of terminals, such as a high-precision display.

[0216] When an organic resin is used for the release layer and low-temperature polysilicon is to be used as the semiconductor layer, the process needs to be processed at 350 °C or lower. Therefore, dehydrogenation bake for silicon crystallization, hydrogenation for terminating defects in silicon, activation of doped regions, etc. cannot be performed sufficiently, and the performance is limited. On the other hand, when an inorganic film is used, the film formation temperature is not limited to 350 °C, and it is possible to exhibit excellent characteristics. When an organic resin is used for the release layer, the organic resin and functional elements may be damaged by laser irradiation during crystallization. However, when an inorganic film is used for the release layer, such problems do not occur, which is preferable. Also, when an organic resin is used for the release layer, the organic resin may shrink due to laser irradiation for resin peeling, which may cause poor contact at the contact portion of terminals such as FPC. Therefore, it may be difficult to peel and transfer functional elements with a large number of terminals, such as a high-precision display, with high yield. When an inorganic film is used for the release layer, there is no such limitation, and it is possible to peel and transfer with high yield even for functional elements with a large number of terminals, such as a high-precision display. In the method for peeling a functional element from a substrate according to one aspect of the present invention, an insulating layer, a transistor, etc. are formed on a production substrate. In addition to the tungsten film, for the release layer, a film containing molybdenum, titanium, vanadium, tantalum, silicon, aluminum, or an alloy thereof may be used. Also, a laminated structure of these films and their oxide films may be used. The release layer is not limited to an inorganic film, and an organic film such as polyimide may be used.

[0217] When an organic resin is used for the release layer, the organic resin and functional elements may be damaged by laser irradiation during crystallization. However, when an inorganic film is used for the release layer, such problems do not occur, which is preferable. In addition to the tungsten film, for the release layer, a film containing molybdenum, titanium, vanadium, tantalum, silicon, aluminum, or an alloy thereof may be used. Also, a laminated structure of these films and their oxide films may be used. The release layer is not limited to an inorganic film, and an organic film such as polyimide may be used. When an organic resin is used for the release layer, the organic resin and functional elements may be damaged by laser irradiation during crystallization. However, when an inorganic film is used for the release layer, such problems do not occur, which is preferable.

[0218] Also, when an organic resin is used for the release layer, the organic resin may shrink due to laser irradiation for resin peeling, which may cause poor contact at the contact portion of terminals such as FPC. Therefore, it may be difficult to peel and transfer functional elements with a large number of terminals, such as a high-precision display, with high yield. When an inorganic film is used for the release layer, there is no such limitation, and it is possible to peel and transfer with high yield even for functional elements with a large number of terminals, such as a high-precision display. In addition to the tungsten film, for the release layer, a film containing molybdenum, titanium, vanadium, tantalum, silicon, aluminum, or an alloy thereof may be used. Also, a laminated structure of these films and their oxide films may be used. The release layer is not limited to an inorganic film, and an organic film such as polyimide may be used. When an organic resin is used for the release layer, the organic resin and functional elements may be damaged by laser irradiation during crystallization. However, when an inorganic film is used for the release layer, such problems do not occur, which is preferable. Also, when an organic resin is used for the release layer, the organic resin may shrink due to laser irradiation for resin peeling, which may cause poor contact at the contact portion of terminals such as FPC. Therefore, it may be difficult to peel and transfer functional elements with a large number of terminals, such as a high-precision display, with high yield. When an inorganic film is used for the release layer, there is no such limitation, and it is possible to peel and transfer with high yield even for functional elements with a large number of terminals, such as a high-precision display. In addition to the tungsten film, for the release layer, a film containing molybdenum, titanium, vanadium, tantalum, silicon, aluminum, or an alloy thereof may be used. Also, a laminated structure of these films and their oxide films may be used. The release layer is not limited to an inorganic film, and an organic film such as polyimide may be used. When an organic resin is used for the release layer, the organic resin and functional elements may be damaged by laser irradiation during crystallization. However, when an inorganic film is used for the release layer, such problems do not occur, which is preferable.

[0219] In the method for peeling a functional element from a substrate according to one aspect of the present invention, an insulating layer, a transistor, etc. are formed on a production substrate. The film can be formed at 600°C or lower. In this case, high-temperature polysilicon can be used for the semiconductor layer. In this case, using the conventional high-temperature polysilicon lines, it is possible to mass-produce a semiconductor device with high device operation speed, high gas barrier property, and high reliability. In this case, by using an insulating layer and transistors formed in a process at 600°C or lower, it is possible to arrange a highly gas-barrier insulating layer formed under a film-forming condition at 600°C or lower above and below the organic EL element. This suppresses the mixing of impurities such as moisture into the organic EL element and the semiconductor layer, and enables the realization of a light-emitting device with significantly higher reliability compared to the case where an organic resin or the like is used for the peeling layer. Alternatively, an insulating layer and transistors can be formed on the production substrate at 500°C or lower. In this case, low-temperature polysilicon or an oxide semiconductor can be used for the semiconductor layer, and mass production is possible using the conventional low-temperature polysilicon production line. Also in this case, by using an insulating layer and transistors formed in a process at 500°C or lower, it is possible to arrange a highly gas-barrier insulating layer formed under a film-forming condition at 500°C or lower above and below the organic EL element. This suppresses the mixing of impurities such as moisture into the organic EL element and the semiconductor layer, and enables the realization of a very highly reliable light-emitting device compared to the case where an organic resin or the like is used for the peeling layer.

[0220] Alternatively, an insulating layer and transistors can be formed on the production substrate at 400°C or lower. In this case, amorphous silicon or an oxide semiconductor can be used for the semiconductor layer, and mass production is possible using the conventional amorphous silicon production line. Also in this case, at 400°C

[0221] By using the insulating layer and transistors formed by the following process, An insulating layer with high gas barrier properties formed under film formation conditions of 400°C or less can be placed underneath the This prevents impurities such as moisture from entering the organic EL element and the semiconductor layer, and facilitates peeling. Compared to using organic resins for the separation layer, this allows for the realization of a highly reliable light-emitting device. Cut.

[0222] Next, the preparation substrate 701 and the preparation substrate 721 are placed so that the surfaces on which the peeled layers are formed face each other. The bonding layer 707 and the frame-shaped bonding layer 711 are used to bond the substrate 100 and the substrate 100 to each other. The frame-shaped bonding layer 711 is then cured (FIG. 9C). After providing the bonding layer 711 and the bonding layer 707 on the inside of the frame-shaped bonding layer 711, the fabrication substrate 7 The 01 and the fabrication substrate 721 are placed opposite each other and bonded together.

[0223] The bonding of the preparation substrate 701 and the preparation substrate 721 is preferably performed under a reduced pressure atmosphere. stomach.

[0224] In FIG. 9C, the peeling layer 703 and the peeling layer 723 are different in size. Alternatively, a release layer of the same size may be used, as shown in FIG. 9(D).

[0225] The bonding layer 707 overlaps the peeling layer 703, the layer to be peeled 705, the layer to be peeled 725, and the peeling layer 723. The end of the bonding layer 707 is disposed so as to be in contact with the peeling layer 703 or the peeling layer 723. It is preferable that the edge of the substrate is located inside at least one edge (the edge to be peeled off first from the substrate). This can prevent the formation substrate 701 and the formation substrate 721 from being strongly attached to each other. This can prevent a decrease in the yield of the peeling process.

[0226] Next, by irradiating a laser beam, a starting point 741 for the first peeling from the substrate is formed (Fig. 10( A), (B)).

[0227] Either the production substrate 701 or the production substrate 721 may be peeled off. When the sizes of the peeling layers are different it may be peeled off from the substrate on which the larger peeling layer is formed, or it may be peeled off from the substrate on which the smaller peeling layer is formed. When elements such as semiconductor elements, light-emitting elements, and display elements are fabricated only on one of the substrates it may be peeled off from the substrate on which the elements are formed, or it may be peeled off from the other substrate. Here, an example in which the production substrate 701 is peeled off first is shown.

[0228] The laser beam is irradiated onto the region where the cured bonding layer 707 or the cured frame-shaped bonding layer 711, the layer to be peeled 7 05, and the peeling layer 703 overlap. Here, an example in which the bonding layer 707 is cured and the frame-shaped bonding layer 711 is not cured is shown, and the cured bonding layer 7 07 is irradiated with a laser beam (see arrow P3 in Fig. 10(A)).

[0229] By removing a part of the layer to be peeled 705, a starting point 741 for the first peeling from the substrate can be formed (see the region surrounded by the dotted line in Fig. 10(B)). At this time, not only the layer to be peeled 705 but also other layers of the layer to be peeled 705 and a part of the peeling layer 703 and the bonding layer 707 may be removed.

[0230] The laser beam is preferably irradiated from the substrate side where the peeling layer to be peeled is provided. When irradiating the laser beam onto the region where the peeling layer 703 and the peeling layer 723 overlap cracks are selectively introduced only into the layer to be peeled 705 among the layer to be peeled 705 and the layer to be peeled 725, thereby selectively producing the substrate ​The layer 701 and the release layer 703 can be peeled off (refer to the region surrounded by the dotted line in Fig. 10(B)). )

[0231] When the laser beam is irradiated on the region where the release layer 703 and the release layer 723 overlap, starting points for peeling from the substrate are formed on both the layer 705 to be peeled off on the release layer 703 side and the layer 725 to be peeled off on the release layer 723 side. However, this may make it difficult to selectively peel off one of the fabricated substrates. Therefore, the irradiation conditions of the laser beam may be restricted so that cracks can be introduced only in one of the layers to be peeled off. The method for forming the first starting point 741 for peeling from the substrate is not limited to laser beam irradiation and may be formed by a sharp cutting tool such as a cutter. Then, starting from the first starting point 741 for peeling from the formed substrate, the layer 705 to be peeled off and the fabricated substrate 7 01 are separated (Figs. 10(C) and (D)). Thereby, the layer 705 to be peeled off can be transferred from the fabricated substrate 7 01 to the fabricated substrate 721.

[0232] The layer 705 to be peeled off separated from the fabricated substrate 701 in the process shown in Fig. 10(D) and the substrate 731 are bonded together using the bonding layer 733, and the bonding layer 733 is cured (Fig. 11(A)). Next, a second starting point 743 for peeling from the substrate is formed by a sharp cutting tool such as a cutter (Figs. 11(B) and (C)). The method for forming the second starting point 743 for peeling from the substrate is not limited to any sharp cutting tool and may be formed by laser beam irradiation or the like.

[0233] If the substrate 731 on the side where the release layer 723 is not provided can be cut by a cutting tool or the like, cuts may be made in the substrate 731,

[0234] the bonding layer 733, and the layer 725 to be peeled off (arrow P in Fig. 11(B)). (Fig. 11(B), (C)). The method for forming the second starting point 743 for peeling from the substrate is not limited to any sharp cutting tool and may be formed by laser beam irradiation or the like.

[0235] When the substrate 731 on the side where the release layer 723 is not provided can be cut by a cutting tool or the like, cuts may be made in the substrate 731, the bonding layer 733, and the layer 725 to be peeled off (arrow P in Fig. 11(B)). (see also FIG. 5). As a result, a part of the layer to be peeled 725 is removed, and a starting point 743 for the second peeling from the substrate is formed (see the region surrounded by the dotted line in FIG. 11(C)). (see also FIG. 5). As a result, a part of the layer to be peeled 725 is removed, and a starting point 743 for the second peeling from the substrate is formed (see the region surrounded by the dotted line in FIG. 11(C)).

[0236] As shown in FIGS. 11(B) and (C), when the fabricated substrate 721 and the substrate 731 are bonded by the bonding layer 733 in a region where they do not overlap with the peeling layer 723, the yield of the subsequent peeling process from the substrate may decrease due to the high adhesion between the fabricated substrate 721 side and the substrate 731 side. As shown in FIGS. 11(B) and (C), when the fabricated substrate 721 and the substrate 731 are bonded by the bonding layer 733 in a region where they do not overlap with the peeling layer 723, the yield of the subsequent peeling process from the substrate may decrease due to the high adhesion between the fabricated substrate 721 side and the substrate 731 side. As shown in FIGS. 11(B) and (C), when the fabricated substrate 721 and the substrate 731 are bonded by the bonding layer 733 in a region where they do not overlap with the peeling layer 723, the yield of the subsequent peeling process from the substrate may decrease due to the high adhesion between the fabricated substrate 721 side and the substrate 731 side. Therefore, it is preferable to cut out a frame shape in the region where the cured bonding layer 733 and the peeling layer 723 overlap, and form a starting point 743 for the second peeling from the substrate in a solid line shape. Therefore, it is preferable to cut out a frame shape in the region where the cured bonding layer 733 and the peeling layer 723 overlap, and form a starting point 743 for the second peeling from the substrate in a solid line shape. Thereby, the yield of the peeling process from the substrate can be increased.

[0237] Then, the layer to be peeled 725 and the fabricated substrate 721 are separated from the formed starting point 743 for the second peeling from the substrate (FIG. 11(D)). As a result, the layer to be peeled 725 can be transferred from the fabricated substrate 721 to the substrate 731. Then, the layer to be peeled 725 and the fabricated substrate 721 are separated from the formed starting point 743 for the second peeling from the substrate (FIG. 11(D)). As a result, the layer to be peeled 725 can be transferred from the fabricated substrate 721 to the substrate 731. Then, the layer to be peeled 725 and the fabricated substrate 721 are separated from the formed starting point 743 for the second peeling from the substrate (FIG. 11(D)). As a result, the layer to be peeled 725 can be transferred from the fabricated substrate 721 to the substrate 731.

[0238] For example, when forming a tungsten oxide film firmly anchored with N2O plasma or the like on an inorganic film such as a tungsten film, it is possible to make the adhesion relatively high during film formation. For example, when forming a tungsten oxide film firmly anchored with N2O plasma or the like on an inorganic film such as a tungsten film, it is possible to make the adhesion relatively high during film formation. After that, when a starting point for peeling is formed, cleavage occurs therefrom, and the layer to be peeled can be easily peeled off and transferred from the fabricated substrate to the substrate. After that, when a starting point for peeling is formed, cleavage occurs therefrom, and the layer to be peeled can be easily peeled off and transferred from the fabricated substrate to the substrate.

[0239] Alternatively, a liquid such as water may be infiltrated into the interface between the peeling layer 723 and the layer to be peeled 725 to separate the fabricated substrate 721 and the layer to be peeled 725. Due to capillary action, the liquid seeps into the space between the peeling layer 723 and the layer to be peeled 725, and the static electricity generated during peeling from the substrate is transferred to the layer to be peeled 725. Alternatively, a liquid such as water may be infiltrated into the interface between the peeling layer 723 and the layer to be peeled 725 to separate the fabricated substrate 721 and the layer to be peeled 725. Due to capillary action, the liquid seeps into the space between the peeling layer 723 and the layer to be peeled 725, and the static electricity generated during peeling from the substrate is transferred to the layer to be peeled 725. Alternatively, a liquid such as water may be infiltrated into the interface between the peeling layer 723 and the layer to be peeled 725 to separate the fabricated substrate 721 and the layer to be peeled 725. Due to capillary action, the liquid seeps into the space between the peeling layer 723 and the layer to be peeled 725, and the static electricity generated during peeling from the substrate is transferred to the layer to be peeled 725. adverse effects on functional elements such as FETs contained therein (such as the semiconductor element being destroyed by static electricity etc.) can be suppressed.

[0240] Also, when applying a physical force to break the bond of M-O-W (where M is an arbitrary element), the liquid seeps into the gap, and it is more likely to form bonds of M-OH and HO-W, which have a longer bonding distance, so separation can be promoted.

[0241] Note that the liquid may be sprayed in a mist or vapor form. As the liquid, pure water, organic solvents, etc. can be used, and neutral, alkaline, or acidic aqueous solutions, aqueous solutions in which salts are dissolved, etc. can also be used.

[0242] Also, the temperature of the liquid and the substrate during mechanical peeling is preferably between room temperature and 120°C, more preferably 60°C or higher and 90°C or lower.

[0243] In the peeling method from the substrate according to one aspect of the present invention described above, a starting point 743 for the second peeling from the substrate is formed by a sharp blade or the like, and after making the peeling layer and the layer to be peeled in a state where they are easy to peel, the peeling of the fabricated substrate is performed. Thereby, the yield of the peeling process from the substrate can be improved.

[0244] Also, after preliminarily bonding a pair of fabricated substrates each having a layer to be peeled, each fabricated substrate can be peeled and the substrates constituting the device to be fabricated can be bonded together. Therefore, when bonding the layers to be peeled, fabricated substrates with low flexibility can be bonded together, and the alignment accuracy during bonding can be improved compared to when bonding flexible substrates together.

[0245] ​​​​​ A method for peeling from a substrate according to one aspect of the present invention involves heating a layer to be peeled provided on the upper layer of an oxide layer. A first layer and a second layer that release hydrogen by heating are provided. Further, the hydrogen released from the layer to be peeled by heat treatment reduces WO3 in the oxide layer, and an oxide layer containing a large amount of WO2 can be formed. As a result, the peelability from the substrate can be improved.

[0246] This embodiment can be implemented in appropriate combination with other embodiments and examples described in this specification.

[0247] (Embodiment 7) In this embodiment, the configuration of an electronic device according to one aspect of the present invention will be described with reference to FIG. 13.

[0248] <Electronic device> FIG. 13 shows an electronic device 920 that can be folded. The electronic device 920 shown in FIG. 13 includes a housing 921a, a housing 921b, a display unit 922, a hinge 923, etc. The display unit 9 22 is incorporated into the housing 921a and the housing 921b.

[0249] The housing 921a and the housing 921b are rotatably connected by a hinge 923. The electronic device 920 can be deformed between a state where the housing 921a and the housing 921b are closed and an open state as shown in FIG. 13. This provides excellent portability when carrying and excellent visibility due to a large display area when in use.

[0250] Also, the hinge 923 preferably has a locking mechanism so that when the housing 921a and the housing 921b are open, the angle between them does not exceed a predetermined angle. For example, the angle at which the lock is engaged (it cannot be opened further) is preferably 90 degrees or more and less than 180 degrees, and typically can be 90 degrees, 120 degrees, 135 degrees, 150 degrees, 175 degrees, etc. This can enhance convenience, safety, and reliability. It is preferably such, and typically can be 90 degrees, 120 degrees, 135 degrees, 150 degrees, 175 degrees, etc. This can enhance convenience, safety, and reliability.

[0251] Also, the electronic device 920 has a flexible display unit 922 extending across the housing 921a and the housing 921b connected by a hinge 923. A flexible display unit 922 is provided.

[0252] Also, when the housing 921a and the housing 921b of the electronic device 920 are opened, the display unit 922 is held in a largely curved form. For example, the display unit 922 can be held in a state where the radius of curvature is 1 mm or more and 50 mm or less, preferably 5 mm or more and 30 mm or less. A part of the display unit 922 has pixels continuously arranged from the housing 921a to the housing 921b, and can perform a curved surface display. For example, the display unit 922 is held in a state where the radius of curvature is 1 mm or more and 50 mm or less, preferably 5 mm or more and 30 mm or less. It can be such that the display unit 922 is held in a state where the radius of curvature is 1 mm or more and 50 mm or less, preferably 5 mm or more and 30 mm or less. A part of the display unit 922 has pixels continuously arranged from the housing 921a to the housing 921b, and can perform a curved surface display. A part of the display unit 922 has pixels continuously arranged from the housing 921a to the housing 921b, and can perform a curved surface display. It can perform a curved surface display.

[0253] Since the hinge 923 has the above-described lock mechanism, it can prevent the display unit 922 from being damaged without applying an excessive force to the display unit 922. Therefore, a highly reliable electronic device can be realized. It can prevent the display unit 922 from being damaged without applying an excessive force to the display unit 922. Therefore, a highly reliable electronic device can be realized. A highly reliable electronic device can be realized.

[0254] The display unit 922 functions as a touch panel and can be operated by a finger, a stylus, etc. It can be operated.

[0255] Either the housing 921a or the housing 921b is provided with a wireless communication module, and data can be transmitted via a computer network such as the Internet, a LAN (Local Area Network), or Wi-Fi (Wireless Fidelity: registered trademark). Either the housing 921a or the housing 921b is provided with a wireless communication module, and data can be transmitted via a computer network such as the Internet, a LAN (Local Area Network), or Wi-Fi (Wireless Fidelity: registered trademark). Either the housing 921a or the housing 921b is provided with a wireless communication module, and data can be transmitted via a computer network such as the Internet, a LAN (Local Area Network), or Wi-Fi (Wireless Fidelity: registered trademark). It is possible to transmit and receive data. Also, either one of the housings 921a and 921b may be provided with a keyboard, a hardware button, a pointing device, an illuminance sensor, an imaging device, a voice input device, a gaze input device, or a posture detection device.

[0256] The electronic device according to one aspect of the present invention can appropriately change the size of the display unit 922 and can be applied to various things. Examples of the electronic device include a portable information terminal that is easy to carry. For example, it is possible to display document information on the display unit 922, and it can also be used as an e-book terminal. For example, the display unit can be configured to be folded in half with an A4 size and used as a textbook. Also, still images or moving images can be displayed on the display unit 922.

[0257]

[0258] This embodiment can be implemented in appropriate combination with at least some of the other embodiments described in this specification.

[0259]

Explanation of Reference Numerals

Claims

【Claim 1】 a hinge, a first housing, a second housing, a panel substrate, and a first film, and the hinge includes a rotation axis, the first housing is connected to the second housing via the hinge so as to be rotatable about the rotation axis, the first housing includes a first slit, the second housing includes a second slit, the panel substrate includes a region overlapping with the first film, the region is housed in either one or both of the first slit and the second slit, an information processing apparatus, wherein either one or both of the panel substrate and the first film are slidable along the second slit.

Images