Plating apparatus and plating method

Abstract

To provide a plating apparatus capable of forming a plating film having a uniform thickness distribution and free from defects on a wide range of a metal component, including three-dimensional structures in which a surface to be plated is three-dimensionally changed, without depending on manual skills of an operator.SOLUTION: A plating apparatus (E1) according to the present invention includes a cell (C) including: a porous body (2) that surrounds a metal component (1) and retains plating solution; and a plating electrode (3) that surrounds the porous body (2). A distance between the plating electrode (3) and a surface of the metal component (1) is substantially constant.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a plating apparatus and a plating formation method.

Background Art

[0002] In recent years, in view of environmental issues and resource conservation, the extension of the service life of industrial products and product recycling by repair technology for the purpose of waste reduction and resource conservation have attracted attention. As a repair method for metal parts that are locally and shallowly damaged due to wear, corrosion, etc., pen plating, for example, can be mentioned. However, since pen plating is a manual operation, the film thickness distribution of the plating may become uneven or defects may occur partially due to the skill of the operator. Conventionally, a plating apparatus is known in which a solid electrolyte membrane is interposed between a plate-shaped anode and a base material (metal member) serving as a cathode to form a plating film on the surface of the base material (see, for example, Patent Document 1). According to this plating apparatus, a plating film with few defects can be formed on the surface of the base material. Also, conventionally, a plating apparatus is known in which a porous pad impregnated with a plating solution is pressed against the surface to be plated of a substrate (metal member) and rotated to form a plating film on the substrate (see, for example, Patent Document 2). According to this plating apparatus, a plating film with a uniform film thickness distribution can be formed.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in conventional plating apparatuses (see, for example, Patent Document 1 and Patent Document 2), the plating surface of the target metal member is limited to a flat surface. Therefore, it has been difficult for conventional plating apparatuses to form a plating film with a uniform film thickness distribution and no defects on metal parts whose plating surfaces change three-dimensionally.

[0005] An object of the present invention is to form a plating film with a uniform film thickness distribution and no defects on a wide range of metal parts including three-dimensional structures whose plating surfaces change three-dimensionally without depending on the skills of an operator.

Means for Solving the Problems

[0006] The plating apparatus of the present invention includes a cell having a porous body that surrounds a metal part and contains a plating solution, and a plating electrode that surrounds the porous body, and is characterized in that the distance between the plating electrode and the surface of the metal part is substantially uniform. Further, the plating formation method of the present invention is a plating method using the above-described plating apparatus, and includes a step of disposing the plating electrode that surrounds the metal part through the porous body having a constant thickness disposed so as to surround the metal part, and a step of supplying electric energy so as to reduce metal ions in the plating solution while supplying the plating solution to the porous body to form plating on the surface of the metal part.

Effects of the Invention

[0007] According to the present invention, it is possible to form a plating film with a uniform film thickness distribution and no defects on a wide range of metal parts including three-dimensional structures whose plating surfaces change three-dimensionally without depending on the skills of an operator.

Brief Description of the Drawings

[0008]

Figure 1

Figure 2

Figure 3A

Figure 3B

Figure 4

Figure 5

Figure 6A

Figure 6B

Embodiments for Carrying Out the Invention

[0009] Hereinafter, embodiments (embodiments) for carrying out the plating apparatus of the present invention will be described in detail with appropriate reference to the drawings. The plating apparatus of the present invention has a suitable configuration when repairing defective parts due to wear or the like of metal parts during the regeneration of industrial products. That is, the plating apparatus of the present invention can be applied even to metal parts whose plated surface changes three-dimensionally.

[0010] (First Embodiment) FIG. 1 is a configuration explanatory diagram schematically showing a plating apparatus E1 according to the first embodiment of the present invention. As shown in FIG. 1, the plating apparatus E1 includes a cell C that forms a plating film (not shown) on the surface of the metal part 1. The metal part 1 in the present embodiment assumes a polygonal columnar body. The cross-sectional shape of this metal part 1 assumes a star-shaped polygon (decagram) formed by combining two regular pentagons. However, the metal part 1 applicable to the plating apparatus E1 is not limited to this, and also includes various three-dimensional structures whose surfaces change three-dimensionally. Hereinafter, a plating apparatus E1 for forming a plating film (not shown) over the entire surface of such a metal part 1 will be described by taking it as an example.

[0011] As shown in FIG. 1, the cell C is configured by integrating a porous body 2, a plating electrode 3, and a casing 4. The porous body 2 is arranged so as to surround the outside of the metal part 1 with the metal part 1 inside. Specifically, the porous body 2 is arranged so as to cover the entire surface of the metal part 1 with a predetermined thickness. That is, the porous body 2 in the present embodiment is arranged so as to cover both end faces and the peripheral side face in the height direction (the direction perpendicular to the paper surface of FIG. 1) of the metal part 1 having a polygonal columnar shape. Further, it is assumed that the thickness of the porous body 2 is constant in the direction orthogonal to the surface of the metal part 1 (the plane perpendicular direction). Thereby, the outer shape of the porous body 2 exhibits a similar shape larger than the outer shape of the metal part 1.

[0012] The porous body 2 in the present embodiment is made of resin and has many continuous pores. Thereby, as will be described later, the porous body 2 contains a plating solution and contacts the surface of the metal part 1 and follows its shape. Further, the interface between the porous body 2 and the metal part 1 is wetted with the plating solution. Then, as will be described later, when the plating solution circulates between the cell C and the tank 6, the plating solution flows through the pores of the porous body 2.

[0013] Such a porous body 2 functions as a spacer for making the distance between the surface of the metal part 1 and the plating electrode 3 uniform in relation to the plating electrode 3 described later. As the resin constituting the porous body 2, those having flexibility, chemical resistance, and hydrophilicity are preferable. Specifically, polyolefin, polyurethane, polyvinyl chloride, polyethylene, and ethylene copolymer are particularly preferable.

[0014] The plating electrode 3 is arranged so as to entirely surround the outside of the metal part 1 through the porous body 2. Specifically, the plating electrode 3 is arranged so as to cover the entire surface of the porous body 2 with a predetermined thickness. That is, in the present embodiment, the plating electrode 3 is arranged so as to cover both end faces and the peripheral side face in the height direction (the direction perpendicular to the plane of FIG. 1) of the porous body 2 having a polygonal columnar shape.

[0015] Further, it is assumed that the thickness of the plating electrode 3 is constant in the direction orthogonal to the surface of the porous body 2 (the plane perpendicular direction). Thereby, the outer shape of the plating electrode 3 exhibits a similar shape larger than the outer shape of the porous body 2. And the inner surface of the plating electrode 3 and the outer surface of the porous body 2 are in close contact. The interface between the plating electrode 3 and the porous body 2 is wetted with the plating solution. Thereby, the plating electrode 3 and the metal part 1 are electrically connected through the porous body 2 containing the plating solution.

[0016] The plating electrode 3 in the present embodiment is provided as an anode for reducing metal ions in the plating solution. As the plating electrode 3 in the present embodiment, those having a mesh structure in which wire materials form a mesh are preferable. Among them, those having a mesh structure in which the diameter of the wire material is 0.5 mm or less or the plating electrode thickness is 0.5 mm or less are particularly preferable. The material of the plating electrode 3 is not particularly limited, but those having low electrical resistance, being chemically and electrochemically stable, and being insoluble in the plating solution are preferable. Among them, platinum, iridium oxide, and ruthenium are preferable. Platinum plated on a titanium material is more preferable.

[0017] As shown in FIG. 1, the casing 4 has a cylindrical shape with both ends sealed and has an internal space in which the plating electrode 3, the porous body 2, and the metal part 1 are arranged inside. In FIG. 1, the sealing walls at the ends of the casing 4 are omitted for the convenience of drawing. As shown in FIG. 1, the inner peripheral side of the casing 4 exhibits a star-shaped polygon (decagram) in a cross-sectional view so as to be in close contact with the shape of the outer peripheral side of the plating electrode 3.

[0018] The casing 4 is formed of resin. Such a casing 4 can be formed by a 3D printer or injection molding. Among them, the method of forming the casing 4 by a 3D printer is preferable because the design data of the metal part 1 performed with high precision can be shared.

[0019] As the resin for forming the casing 4, those having electrical insulation and chemical resistance and high mechanical strength are preferable. Examples of the resin for forming the casing 4 by a 3D printer include, but are not limited to, photosensitive epoxy resin, acrylic resin, silicone resin, etc. Examples of the resin for forming the casing 4 by injection molding include, but are not limited to, ABS resin, polytetrafluoroethylene, polypropylene, polyvinyl chloride, etc.

[0020] In the cell C of the present embodiment, as described above, the casing 4, the plating electrode 3, and the porous body 2 are joined to each other and integrated. Further, the cell C is divided into a plurality so that the plated metal part 1 can be taken out from the cell C. Although not shown in the drawings, the cell C in the present embodiment is assumed to be divided into two or more in the axial direction (the direction perpendicular to the plane of FIG. 1). According to such a cell C, the metal part 1 can be taken out from the cell C by moving the divided cells C away from each other in the axial direction.

[0021] Further, when no undercut is generated on the surface shape of the metal part 1, the cell C can also be divided so as to be separable in a direction intersecting the axis. By dividing the cell C in this way, the plating apparatus E1 can repeatedly use the cell C.

[0022] And it is desirable to provide a seal member at the joints between the divided cells C to maintain the airtightness of the internal space of the cells C. Further, in order to firmly join the divided cells C together, it is desirable to provide, for example, a belt or a fixing jig that clamps the outer peripheral portion of the cell C in the circumferential direction.

[0023] In addition to such cells C, the plating apparatus E1 of the present embodiment further includes a plating solution circulation mechanism, a plating power source 9, and a vibration generator 5. As shown in FIG. 1, the plating solution circulation mechanism mainly includes a tube 10, a tank 6 for storing the plating solution, a pump 7, and a filter 8.

[0024] The tube 10 connects a plating solution inlet 11A provided on the plating electrode 3 and a plating solution outlet 11B provided on the plating electrode 3 on the opposite side of the inlet 11A with the metal part 1 interposed therebetween. Both ends of the tube 10 face the porous body 2 at the inlet 11A and the outlet 11B, respectively. Incidentally, in the present embodiment, it is assumed that the inlet 11A is provided above in the vertical direction and the outlet 11B is provided below in the vertical direction. The material of the tube 10 is preferably chemically resistant and flexible.

[0025] The tank 6 is disposed in the middle of the extension of the tube 10. The tank 6 stores an amount of plating solution necessary for repairing the metal part 1. As the material of the tank 6, a chemically resistant material is desirable. Although the capacity of the tank 6 needs to be designed according to the surface area and plating thickness of the metal part 1, it is preferably 20 L or less in consideration of transportability.

[0026] The pump 7 is disposed in the middle of the extension of the tube 10 between the tank 6 and the inlet 11A. The pump 7 is driven to circulate the plating solution through the tube 10 between the cell C and the tank 6. The pump 7 in this embodiment supplies the plating solution in the tank 6 to the porous body 2 through the inlet 11A, and returns the plating solution in the porous body 2 to the tank 6 through the outlet 11B. As the pump 7, a general-purpose chemical-resistant plating solution circulation pump is desirable. Among them, a small-sized magnet pump with adjustable discharge is preferable.

[0027] The filter 8 is disposed in the middle of the extension of the tube 10 between the outlet 11B and the tank 6. The filter 8 removes foreign matters in the plating solution that cause defects in the plating film. As the filter 8, a general-purpose chemical-resistant plating solution filter is desirable. Specifically, the filter 8 is preferably a wound yarn filter made of polypropylene. Note that the filter 8 can also be a pump filter integrated with the pump 7.

[0028] The plating power supply 9 is provided to supply electrical energy for reducing metal ions in the plating solution. Specifically, the plating power supply 9 forms an anode-side power supply unit 12A between itself and the plating electrode 3 through the lead wire L1. Also, the plating power supply 9 forms a cathode-side power supply unit 12B between itself and the metal part 1 through the lead wire L2. As the plating power supply 9, a portable small-sized DC power supply is preferable. Also, when it is desired to suppress the generation of cracks in the plating film or increase the hardness of the plating film, a pulse power supply can also be used.

[0029] The vibration generator 5 is provided to suppress the fixation of the porous body 2 and the plating film and to smooth the surface of the plating film. As the vibration generator 5, an electrokinetic type or an unbalanced mass type vibration generator that can be miniaturized is preferable.

[0030] Next, while explaining the operation of the plating apparatus E1 of this embodiment with reference to FIG. 1, a plating formation method using the plating apparatus E1 will be described. This plating formation method includes a step of disposing a plating electrode 3 that surrounds the metal part 1 through a porous body 2 having a certain thickness disposed so as to surround the metal part 1, and a step of supplying electric energy to reduce metal ions in the plating solution while supplying the plating solution to the porous body 2 to form a plating on the surface of the metal part 1. First, in this plating formation method, the metal part 1 that requires surface repair is disposed in the cell C. The distance between the surface of the metal part 1 and the plating electrode 3 is made uniform by the intervening porous body 2.

[0031] Next, when the pump 7 of the plating apparatus E1 is driven, the circulation of the plating solution through the tube 10 between the cell C and the tank 6 is started. As a result, the plating solution is supplied to the porous body 2 of the cell C. The surface of the metal part 1 and the plating electrode 3 facing it are electrically connected by the porous body 2 containing the plating solution.

[0032] On the other hand, when the plating power supply 9 supplies electric energy to the cell C, a plating film is formed on the surface of the metal part 1 that is partially damaged due to wear or the like. At this time, vibration is applied to the cell C by the vibration generator 5. The surface of the metal part 1 in contact with the porous body 2 of the cell C forms a plating film under vibration.

[0033] In addition, the plating solution that has consumed metal ions by forming the plating film is returned to the tank 6 by the plating solution circulation mechanism. The porous body 2 is supplied with a new plating solution in which the metal ions are maintained at a predetermined concentration by the plating solution circulation mechanism. A sound plating film is formed on the surface of the metal part 1 in contact with the plating solution while sufficient metal ions are supplied. After that, by taking out the metal part 1 from the divided cell C, a series of plating formation steps in this embodiment is completed.

[0034] <Advantages and Effects> Next, the advantages and effects of the plating apparatus E1 of this embodiment and the plating formation method using this plating apparatus E1 will be described. The plating apparatus E1 of this embodiment includes a cell C having a porous body 2 that surrounds the metal part 1 and contains a plating solution, and a plating electrode 3 that surrounds the porous body 2, and the distance between the plating electrode 3 and the surface of the metal part 1 is substantially uniform. Further, the plating formation method includes a step of disposing a plating electrode 3 that surrounds the metal part 1 through a porous body 2 having a certain thickness disposed so as to surround the metal part 1, and a step of supplying electrical energy to reduce metal ions in the plating solution while supplying the plating solution to the porous body 2 to form a plating on the surface of the metal part 1.

[0035] According to such a plating apparatus E1 and plating formation method, the plating electrode 3 surrounds the metal part 1 through the porous body 2 containing the plating solution, and a sound plating film without defects can be formed even on the metal part 1 whose surface to be plated changes three-dimensionally. Further, according to this plating apparatus E1, the distance between the plating electrode 3 and the surface of the metal part 1 becomes uniform due to the porous body 2 interposed between the plating electrode 3 and the metal part 1. As a result, the film thickness of the plating becomes constant during repair, and the plating quality can be improved. Further, according to this plating apparatus E1, the plating electrode 3 surrounds the metal part 1 through the porous body 2, and the plating range for the metal part 1 can be widened. As a result, repair can be performed in a shorter time compared with the conventional pen plating technique.

[0036] Further, according to this plating apparatus E1, the surface of the metal part 1 is plated with the plating solution contained in the porous body 2. As a result, the plating apparatus E1 can reduce the amount of plating solution used, unlike, for example, a plating apparatus that immerses the metal part 1 in the plating solution stored in a plating tank. And this plating apparatus E1, combined with the structure in which the plating electrode 3 surrounds the metal part 1 through the porous body 2 and the reduction in the amount of plating solution used, can be miniaturized and has excellent transportability. Therefore, according to this plating device E1, for non-planar metal parts such as large-scale infrastructure facilities installed outdoors, rapid on-site plating repair is possible. For this reason, the present invention can solve the problem that it is difficult to transport and use conventional plating devices to the site due to their large size.

[0037] In addition, the plating device E1 further includes a vibration generator 5 that vibrates the cell C. According to this plating device E1, since the vibration generator 5 forms a plating film on the surface of the metal part 1 while vibrating the cell C, it is possible to prevent the porous body 2 and the surface of the metal part 1 from adhering through the plating film. Thereby, when the metal part 1 is taken out from the cell C, damage to the plating film is avoided. In addition, according to this plating device E1, since the vibration generator 5 forms a plating film on the surface of the metal part 1 while vibrating the cell C, the surface of the plating film can be smoothed. And according to such a plating device E1, different from the formation of a plating film by conventional brush plating, it is possible to form a plating film with a uniform film thickness distribution and no defects without depending on the skills of the operator.

[0038] In addition, in such a plating device E1, there are provided a tank 6 for storing the plating solution supplied to the porous body 2, a tube 10 for circulating the plating solution between the tank 6 and the cell C, a pump for circulating the plating solution, a filter 8 for filtering the plating solution, and a plating power source 9 for supplying electrical energy to the inside of the cell C.

[0039] In this plating device E1, the plating solution from which foreign matters have been removed by the filter 8 circulates between the tank 6 and the cell C. According to this plating device E1, it is possible to prevent foreign matters from adhering to the surface of the metal part 1, and to avoid a decrease in the metal ions in the plating solution contained in the porous body 2 to a predetermined concentration or less due to the formation of the plating film. Thereby, the plating device E1 can improve the quality of the plating film formed on the surface of the metal part 1.

[0040] Further, in such a plating apparatus E1, the plating electrode 3 has a shape imitating to surround the metal part 1, and the porous body 2 is located between the plating electrode 3 and the metal part 1. According to this plating apparatus E1, the distance between the plating electrode 3 and the surface of the metal part 1 can be made more reliably uniform. Thereby, the plating apparatus E1 can more reliably improve the plating quality.

[0041] Further, in such a plating apparatus E1, the porous body 2 is formed of at least one material selected from polyolefin, polyurethane, polyvinyl chloride, polyethylene, and ethylene copolymer. The pore structure of the porous body 2 is open pores, the porosity of the porous body 2 is 70% or more, and the thickness of the porous body 2 is 10 mm or less. According to this plating apparatus E1, the chemical resistance of the porous body 2 can be improved, and the flow performance of the plating solution in the pores of the porous body 2 and the transfer efficiency of metal ions between the plating electrode 3 and the metal part 1 can be improved.

[0042] Further, in such a plating apparatus E1, the plating electrode 3 is an insoluble plating electrode containing at least one material selected from platinum, iridium oxide, and ruthenium, and has a mesh structure with a thickness of 0.5 mm or less or a wire diameter of 0.5 mm or less. According to this plating apparatus E1, a good electrode potential can be maintained over a long period of time, and the plating electrode 3 has excellent shape followability with respect to the shape of the metal part 1.

[0043] (Second Embodiment) Next, a plating apparatus E2 according to the second embodiment of the present invention will be described. FIG. 2 is a configuration explanatory diagram schematically showing a plating apparatus E2 according to the second embodiment of the present invention. In the present embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

[0044] When the number of plating processes to be performed increases, the plating apparatus E1 (see Fig. 1) may experience wear of the porous body 2 due to contact with the metal part 1, dissolution of the porous body 2 by the plating solution, clogging of the pores of the porous body 2, etc. Therefore, it is desirable to replace the porous body 2 of the plating apparatus E1 after repeated plating processes. However, the timing of replacing the porous body 2 cannot be determined unconditionally based on factors such as the type of plating solution used and the plating process time for each metal part 1. As shown in Fig. 2, the plating apparatus E2 of the second embodiment is different from the plating apparatus E1 (see Fig. 1) of the first embodiment in that it has a resistance value measurement unit 13, a porous body replacement timing prediction unit 21, and a display unit 20 for the replacement timing of the porous body 2.

[0045] During the plating process on the metal part 1, the resistance value measurement unit 13 measures the electrical resistance value between the plating electrode 3 and the metal part 1 through the porous body 2 containing the plating solution based on the current value and voltage value of the plating power supply 9. The resistance value measurement unit 13 is not particularly limited, but a small and portable electrical resistance measuring instrument is desirable. Note that the resistance value measurement unit 13 can also be configured to be incorporated inside the plating power supply 9. Thereby, the plating apparatus E2 can be made more compact by reducing the number of components.

[0046] The porous body replacement timing prediction unit 21 predicts the replacement timing of the porous body 2 based on the electrical resistance value between the plating electrode 3 and the metal part 1 output by the resistance value measurement unit 13. The porous body replacement timing prediction unit 21 in this embodiment can be configured to include a ROM (Read Only Memory) that stores a program for predicting the replacement timing of the porous body 2, a RAM (Random Access Memory) that reads out and expands the program stored in the ROM, and a CPU (Central Processing Unit) that executes the expanded program to calculate the replacement timing of the porous body 2.

[0047] FIG. 3A is a flowchart for explaining the procedure executed by the porous body replacement timing prediction unit 21 (see FIG. 2). FIG. 3B is a graph showing the relationship between the increase rate (%) of the electrical resistance value referred to by the porous body replacement timing prediction unit 21 (see FIG. 2) and the remaining life (time) of the porous body. As shown in FIG. 3A, the porous body replacement timing prediction unit 21 (see FIG. 2) acquires the electrical resistance value between the plating electrode 3 (see FIG. 2) and the metal part 1 (see FIG. 2) output by the resistance value measurement unit 13 (see FIG. 2) (see S step 101).

[0048] Next, in the CPU of the porous body replacement timing prediction unit 21 (see FIG. 2), the increase rate (%) of the acquired electrical resistance value is calculated (see S step 102). This increase rate (%) of the electrical resistance value is defined by the relational expression of 100(R2 - R1) / R1, where R1 is the electrical resistance value between the plating electrode 3 and the metal part 1 at the initial setting of the porous body 2, and R2 is the electrical resistance value acquired from the resistance value measurement unit 13.

[0049] Next, in the CPU of the porous body replacement timing prediction unit 21 (see FIG. 2), based on a preset function, the remaining life of the porous body 2 corresponding to the increase rate (%) of the electrical resistance value is calculated (see S step 103). The function used by the porous body replacement timing prediction unit 21 (see FIG. 2) represents the relationship between the increase rate (%) of the electrical resistance value and the remaining life (time) of the porous body 2.

[0050] Such a relationship between the increase rate (%) of the electrical resistance value and the remaining life (time) of the porous body 2 can be represented by a graph showing the correspondence between the increase rate (%) of the electrical resistance value and the remaining life (time) of the porous body 2, as shown in FIG. 3B. Such a correspondence can be determined by a simulation performed in advance. And in the ROM of the porous body replacement timing prediction unit 21 (see FIG. 2), a plurality of functions are stored according to the plating solution to be used, the area of the plating surface of the metal part 1, the thickness of the plating film, and the like.

[0051] Returning to FIG. 3A, the porous body replacement timing prediction unit 21 (see FIG. 2) calculates the time when the life of the porous body 2 reaches its end using the time at which the electrical resistance value was acquired from the resistance value measurement unit 13 (see FIG. 2) (see S step 104). Next, the porous body replacement timing prediction unit 21 (see FIG. 2) outputs a signal representing the time when the life of the porous body 2 reaches its end to the display unit 20 (see FIG. 2) described below (see S step 105). This completes the series of procedures performed by the porous body replacement timing prediction unit 21 (see FIG. 2). The series of steps performed by such a porous body replacement timing prediction unit 21 corresponds to the "step of predicting the replacement timing of the porous body" in the plating formation method of the present invention.

[0052] The display unit 20 (see FIG. 2) inputs the signal from the porous body replacement timing prediction unit 21 (see FIG. 2) and displays the time when the life of the porous body 2 calculated by the porous body replacement timing prediction unit 21 (see FIG. 2) reaches its end as a guide for replacing the porous body 2. Examples of the display unit 20 (see FIG. 2) include, but are not limited to, those that digitally display the time by the emission of light from an LED (light-emitting diode). Further, the display unit 20 (see FIG. 2) can also be configured to display the time by voice in response to a request, such as turning on a predetermined switch according to the needs of the user.

[0053] FIG. 4 is a schematic diagram showing an example of an image projected onto the display unit 20. As shown in FIG. 4, the display unit 20 can also be configured as a touch panel including a liquid crystal display unit that allows input by the user. This display unit 20 is configured to display the specific time "AA month BB day XX hour YY minute" when the life of the porous body 2 reaches its end at any time during the operation of the plating apparatus E2 or in response to a timely request from the user. In addition, the display unit 20 has a touch panel unit with "Yes" and "No", which are user selection buttons for accepting the presence or absence of the intention to pre-exchange the porous body 2. In such a display unit 20, by the user's touch input to "Yes", it is also possible to further display the specifications, inventory status, etc. of the porous body 2 in use. Note that when the user touches and inputs "No", the plating apparatus E2 will continue to operate as it is.

[0054] <Function and effect> Next, the function and effect of the plating apparatus E2 of the present embodiment and the plating formation method using this plating apparatus E2 will be described. The plating apparatus E2 of the present embodiment includes a resistance value measurement unit 13 that measures the electrical resistance value between the plating electrode 3 and the metal part 1 via the porous body 2, and a porous body replacement timing prediction unit 21 that predicts the replacement timing of the porous body 2 based on the increase rate (%) of the electrical resistance value. In addition, the plating formation method further has a step of predicting the replacement timing of the porous body 2 in addition to the steps constituting the plating formation method using the plating apparatus E1 described above. According to this plating apparatus E2 and the plating formation method using this plating apparatus E2, the replacement timing of the porous body 2 can be accurately grasped. In particular, when the porous body is surrounded by cells as in the plating apparatus E2 of the present invention and the state of the porous body cannot be visually confirmed at a glance, the state of the porous body can be confirmed by the porous body replacement timing prediction unit 21. In addition, by checking the state of the porous body and eliminating clogging of the porous body in advance, it is possible to suppress the consumption of extra plating solution and power consumed during plating. As a result, it is possible to reduce the environmental load during plating repair.

[0055] (Third Embodiment) Next, the plating apparatus E3 according to the third embodiment of the present invention will be described. FIG. 5 is a configuration explanatory diagram schematically showing the plating apparatus E3 according to the third embodiment of the present invention. In the present embodiment, the same components as those in the first embodiment described above are denoted by the same reference numerals, and detailed description thereof is omitted.

[0056] In the plating apparatus E1 (see FIG. 1) described above, the plating electrode 3 may suffer local damage as the number of plating processes to be performed increases. Therefore, it is desirable to replace the plating electrode 3 in a timely manner. As shown in FIG. 5, the plating apparatus E3 of the third embodiment is different from the plating apparatus E1 (see FIG. 1) of the first embodiment, and includes a potential difference measurement unit 15, a plating electrode replacement timing prediction unit 22, and a display unit 20.

[0057] The potential difference measurement unit 15 measures the potential difference between the plating power source 9 and the reference electrode 14 during the plating process on the metal part 1. The potential difference measurement unit 15 is not particularly limited, but a small and portable potentiometer is desirable. As shown in FIG. 5, the reference electrode 14 in the present embodiment is immersed in the plating solution (not shown) in the tank 6.

[0058] The reference electrode 14 in the present embodiment preferably has the same specifications as the plating electrode 3. That is, when the plating electrode 3 has a mesh structure formed of a wire made of a predetermined material, the reference electrode 14 preferably also has a mesh structure formed of a wire made of a predetermined material. Further, when the plating electrode 3 is a titanium material plated with platinum, it is desirable to use a reference electrode 14 that is also a titanium material plated with platinum and set the film thickness of the platinum plating to be the same.

[0059] The plating electrode replacement timing prediction unit 22 predicts the replacement timing of the plating electrode 3 based on the potential difference between the plating electrode 3 and the reference electrode 14 output by the potential difference measurement unit 15. The plating electrode replacement timing prediction unit 22 in this embodiment can be configured to include a ROM (Read Only Memory) that stores a program for predicting the replacement timing of the plating electrode 3, a RAM (Random Access Memory) that reads out and expands the program stored in the ROM, and a CPU (Central Processing Unit) that executes the expanded program to calculate the replacement timing of the plating electrode 3.

[0060] FIG. 6A is a flowchart for explaining the procedure executed by the plating electrode replacement timing prediction unit 22 (see FIG. 5). FIG. 6B is a graph showing the relationship between the increase rate (%) of the potential difference referred to by the plating electrode replacement timing prediction unit 22 (see FIG. 5) and the remaining life (time) of the plating electrode. As shown in FIG. 6A, the plating electrode replacement timing prediction unit 22 (see FIG. 5) acquires the potential difference between the plating electrode 3 (see FIG. 5) and the reference electrode 14 output by the potential difference measurement unit 15 (see FIG. 5) (see S step 201).

[0061] Next, the plating electrode replacement timing prediction unit 22 (see FIG. 5) calculates the increase rate (%) of the acquired potential difference (see S step 202). This increase rate (%) of the potential difference is defined by the relational expression of 100(Pd2 - Pd1) / Pd1, where Pd1 is the potential difference between the plating electrode 3 and the reference electrode 14 at the initial setting of the plating electrode 3, and Pd2 is the potential difference acquired from the potential difference measurement unit 15.

[0062] Next, the plating electrode replacement timing prediction unit 22 (see FIG. 5) calculates the remaining life of the plating electrode 3 (see FIG. 5) corresponding to the increase rate (%) of the potential difference based on a preset function (see S step 203). The function used by the plating electrode replacement timing prediction unit 22 (see FIG. 5) in the calculation represents the relationship between the increase rate (%) of the potential difference and the remaining life (time) of the plating electrode 3.

[0063] The relationship between the increase rate (%) of such a potential difference and the remaining life (time) of the plating electrode 3 can be represented by a graph showing the correspondence between the increase rate (%) of the potential difference and the remaining life (time) of the plating electrode 3, as shown in FIG. 6B. Such a correspondence can be determined by a simulation performed in advance. And in the ROM of the plating electrode replacement timing prediction unit 22 (see FIG. 5), a plurality of functions are stored according to the plating solution to be used, the specifications of the plating electrode 3, and the like.

[0064] Returning to FIG. 6A, the plating electrode replacement timing prediction unit 22 (see FIG. 5) calculates the time when the life of the plating electrode 3 is reached using the time when the potential difference is acquired from the potential difference measurement unit 15 (see FIG. 5) (see S step 204). Next, the plating electrode replacement timing prediction unit 22 (see FIG. 5) outputs a signal representing the time when the life of the plating electrode 3 is reached to the display unit 20 (see FIG. 5) (see S step 205). Thereby, a series of procedures performed by the plating electrode replacement timing prediction unit 22 (see FIG. 5) is completed. A series of steps performed by such an electrode replacement timing prediction unit 22 corresponds to the "step of predicting the replacement timing of the plating electrode" in the plating formation method of the present invention.

[0065] The display unit 20 (see FIG. 5) inputs a signal from the plating electrode replacement timing prediction unit 22 (see FIG. 5) and displays the time when the life of the plating electrode 3 calculated by the plating electrode replacement timing prediction unit 22 is reached as a reference for replacing the plating electrode 3.

[0066] <Operational Effects> Next, the operational effects exhibited by the plating apparatus E3 of the present embodiment and the plating formation method using this plating apparatus E3 will be described. The plating apparatus E3 of the present embodiment includes a reference electrode 14 immersed in the plating solution in the tank 6, a potential difference measurement unit 15 that measures the potential difference between the plating electrode 3 and the reference electrode 14, and a plating electrode replacement timing prediction unit 22 that predicts the replacement timing of the plating electrode 3 based on the increase rate of the potential difference. In addition, the plating formation method further includes a step of predicting the timing of replacing the plating electrode 3, in addition to the steps constituting the plating formation method using the plating apparatus E1 described above. According to this plating apparatus E2 and the plating formation method using this plating apparatus E3, the timing of replacing the plating electrode 3 can be accurately grasped.

[0067] As described above, the embodiments of the present invention have been described. However, the present invention is not limited to the above embodiments and can be implemented in various forms. In the second embodiment, the plating apparatus E2 including the porous body replacement timing prediction unit 21 has been described, and in the third embodiment, the plating apparatus E3 including the plating electrode replacement timing prediction unit 22 has been described. The plating apparatus of the present invention can also be configured to include both the porous body replacement timing prediction unit 21 and the plating electrode replacement timing prediction unit 22. In addition, in the first to third embodiments described above, the plating apparatuses E1, E2, and E3 suitable for repairing the metal part 1 have been described. However, the plating apparatuses E1, E2, and E3 can also be used for plating treatment of new metal parts 1.

Explanation of Reference Numerals

[0068] 1 Metal part 2 Porous body 3 Plating electrode 5 Vibration generator 6 Tank 7 Pump 8 Filter 9 Plating power supply 10 Tube 13 Resistance value measurement unit 14 Reference electrode 15 Potential difference measurement unit 21 Porous body replacement timing prediction unit 22 Plating electrode replacement timing prediction unit C Cell E1 Plating apparatus E2 Plating apparatus E3 Plating apparatus

Claims

1. A porous body that surrounds a metal part and contains a plating solution, A plating electrode that surrounds the porous body, A cell having the above, Comprising, A plating apparatus, characterized in that the distance between the plating electrode and the surface of the metal part is substantially uniform.

2. The plating apparatus according to claim 1, further comprising a vibration generator that vibrates the cell.

3. A tank for storing the plating solution supplied to the porous body, A tube for circulating the plating solution between the tank and the cell, A pump for circulating the plating solution, A filter for filtering the plating solution, A plating power source for supplying electrical energy to the inside of the cell, The plating apparatus according to claim 1, characterized in that it comprises.

4. The plating electrode has a shape imitating to surround the metal part, The plating apparatus according to claim 1, characterized in that the porous body is located between the plating electrode and the metal part.

5. The porous body is formed of one material selected from polyolefin, polyurethane, polyvinyl chloride, polyethylene, and ethylene copolymer, The pore structure of the porous body is continuous pores, the porosity of the porous body is 70% or more, and the thickness of the porous body is 10 mm or less. The plating apparatus according to claim 1, characterized in that.

6. The plating electrode is an insoluble plating electrode containing one material selected from platinum, iridium oxide, and ruthenium, and has a mesh structure with a thickness of 0.5 mm or less or a wire diameter of 0.5 mm or less. The plating apparatus according to claim 1, characterized in that.

7. A resistance value measuring unit that measures the electrical resistance value between the plating electrode and the metal part through the porous body, A porous body replacement timing prediction unit that predicts the replacement timing of the porous body based on the increase rate of the electrical resistance value, The plating apparatus according to claim 1, characterized in that it comprises.

8. A reference electrode immersed in the plating solution in the tank, A potential difference measuring unit that measures the potential difference between the plating electrode and the reference electrode, A plating electrode replacement timing prediction unit that predicts the replacement timing of the plating electrode based on the increase rate of the potential difference, The plating apparatus according to claim 3, characterized in that it comprises.

9. A plating method using the plating apparatus according to claim 1, A step of disposing the plating electrode that surrounds the metal part through the porous body having a constant thickness disposed so as to surround the metal part; A step of forming a plating on the surface of the metal part by supplying electrical energy so as to reduce metal ions in the plating solution while supplying the plating solution to the porous body; A plating formation method, characterized by comprising the above.

10. The plating formation method according to claim 9, further comprising a step of predicting the replacement timing of the porous body.

11. The plating formation method according to claim 9, further comprising a step of predicting the replacement timing of the plating electrode.

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