Measurement method, lithography method, article manufacturing method and lithography device

Abstract

To provide a technique advantageous for accurately measuring a positional deviation of an original plate to a stage according to a type of the original plate.SOLUTION: A lithography device transfers a pattern of an original plate mounted on a stage onto a substrate. A measurement method measures a positional deviation of the original plate to the stage, and includes: an acquisition step of acquiring information showing a designed relative position of a reference mark of the stage in a state with the original plate mounted on the stage and an original plate mark of the original plate; a selection step of selecting one mode from among a plurality of modes for detecting, by a scope, the reference mark and the original plate mark according to the information acquired at the acquisition step; and a determination step of detecting, with the scope, the reference mark and the original plate mark by the one mode selected at the selection step and determining the positional deviation according to a detection result.SELECTED DRAWING: Figure 6

Description

Technical Field

[0001] The present invention relates to a measurement method, a lithography method, an article manufacturing method, and a lithography apparatus.

Background Art

[0002] As one of lithography apparatuses used in manufacturing processes of semiconductor devices, flat panel displays (FPDs), etc., there is an exposure apparatus that transfers the pattern of a reticle mounted on a stage onto a substrate. In the exposure apparatus, in order to accurately transfer the pattern of the reticle onto the substrate, the misalignment of the reticle with respect to the stage can be measured by detecting a reference mark provided on the stage and a reticle mark provided on the reticle with a scope.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the exposure apparatus, it is required to mount various types of reticles on the stage. In this case, the relative positions of the reference mark and the reticle mark in the state where the reticle is mounted on the stage may differ depending on the type of the reticle. Therefore, it is required to accurately measure the misalignment of the reticle with respect to the stage according to the type of the reticle mounted on the stage.

[0005] Patent Document 1 describes mounting a reticle having a size smaller than the specified size of the reticle mountable on the stage on the stage by using a holder that holds the peripheral portion of the reticle. In Patent Document 1, the positional deviation of the holder with respect to the stage is measured by detecting a mark provided on the holder and a reference mark on the stage, and based on the measurement result, the positional deviation of the reticle with respect to the stage is obtained. However, since the relative position between the holder and the reticle may deviate when mounting the reticle on the stage using the holder, the method described in Patent Document 1 may be insufficient to accurately measure the positional deviation of the reticle with respect to the stage.

[0006] Therefore, an object of the present invention is to provide an advantageous technique for accurately measuring the positional deviation of a reticle with respect to a stage according to the type of the reticle.

Means for Solving the Problem

[0007] In order to achieve the above object, a measurement method as one aspect of the present invention is a measurement method for measuring the positional deviation of a reticle mounted on a stage in a lithography apparatus that transfers a pattern of the reticle onto a substrate, the method including: an acquisition step of acquiring information indicating a designed relative position between a reference mark on the stage and a reticle mark on the reticle in a state where the reticle is mounted on the stage; a selection step of selecting one mode from a plurality of modes for detecting the reference mark and the reticle mark with a scope according to the information acquired in the acquisition step; and a determination step of detecting the reference mark and the reticle mark with the scope in the one mode selected in the selection step and determining the positional deviation based on the detection result. The plurality of modes include a first mode of detecting the reference mark and the reticle mark by simultaneously accommodating them within the field of view of the scope, and a second mode of detecting the reference mark and the reticle mark by individually accommodating them within the field of view through relative movement between the stage and the scope.

[0008] A further object or other aspect of the present invention will be made clear by the preferred embodiments described below with reference to the accompanying drawings.

Advantages of the Invention

[0009] According to the present invention, for example, it is possible to provide an advantageous technique for accurately measuring the misalignment of the original plate with respect to the stage according to the type of the original plate.

Brief Description of the Drawings

[0010]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Best Mode for Carrying Out the Invention

[0011] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the invention according to the claims. Although a plurality of features are described in the embodiments, not all of these plurality of features are essential to the invention, and the plurality of features may be arbitrarily combined. Further, in the accompanying drawings, the same or similar configurations are denoted by the same reference numerals, and redundant descriptions are omitted.

[0012] In this specification and the accompanying drawings, directions are indicated in an XYZ coordinate system in which directions orthogonal to each other in a plane parallel to the holding surface of the original stage holding the original are taken as the X direction and the Y direction. Directions parallel to the X-axis, Y-axis, and Z-axis in the XYZ coordinate system are taken as the X direction, Y direction, and Z direction, respectively, and rotations around the X-axis, Y-axis, and Z-axis are taken as θX, θY, and θZ, respectively. Control and drive (movement) with respect to the X-axis, Y-axis, and Z-axis each mean control or drive (movement) in a direction parallel to the X-axis, a direction parallel to the Y-axis, and a direction parallel to the Z-axis. Further, control or drive with respect to the θX-axis, θY-axis, and θZ-axis each mean control or drive related to rotation around an axis parallel to the X-axis, rotation around an axis parallel to the Y-axis, and rotation around an axis parallel to the Z-axis.

[0013] <First Embodiment> A first embodiment according to the present invention will be described. An exposure apparatus is known as one of lithography apparatuses used in manufacturing processes such as semiconductor devices and flat panel displays (FPDs). The exposure apparatus performs an exposure process of transferring (forming) a pattern formed on a reticle onto a substrate by exposing the substrate through the reticle. There are a step-and-repeat method and a step-and-scan method as methods of performing the exposure process for each of a plurality of shot regions on the substrate. An exposure apparatus adopting the step-and-repeat method is sometimes called a stepper, and sequentially performs an exposure process of collectively transferring the pattern of the reticle onto the substrate for each shot region of the substrate. On the other hand, an exposure apparatus adopting the step-and-scan method is sometimes called a scanner, and sequentially performs an exposure process of transferring the pattern of the reticle onto the substrate while relatively scanning the reticle and the substrate for each shot region of the substrate. In the present embodiment, an exposure apparatus adopting the step-and-scan method will be exemplified and described, and the relative scanning direction between the reticle and the substrate in the exposure apparatus is set as the Y direction.

[0014] FIG. 1 is a schematic diagram showing a configuration example of an exposure apparatus EXP according to the present embodiment. The exposure apparatus EXP may include, for example, an illumination optical system 1, a detection unit 2, a reticle stage 4 (stage), a projection optical system 5, a substrate stage 7, and a control unit 11.

[0015] The illumination optical system 1 illuminates the reticle 3 using light emitted from a light source unit (not shown) such as an ultra-high pressure mercury lamp. For example, the illumination optical system 1 has a wavelength selection filter, a lens group, a shutter, etc., and shapes the light from the light source unit into exposure light having a wavelength and shape suitable for exposure of the substrate 6 to illuminate the reticle 3.

[0016] The reticle 3 is mounted on the reticle stage 4. The reticle stage 4 is configured to hold the reticle 3 and be movable in the XY directions, and is driven in the XY directions by a reticle drive mechanism 12 under the control of the control unit 11. In the case of the present embodiment, the reticle stage 4 is scanned in the Y direction by the reticle drive mechanism 12 in the exposure process.

[0017] The position of the original stage 4 can be constantly measured (monitored) by the first measurement unit 13. The first measurement unit 13 may include, for example, a laser interferometer. In this case, the first measurement unit 13 irradiates the measurement light on the reflector 13a provided on the original stage 4, and measures the position of the original stage 4 based on the measurement light reflected by the reflector 13a. Thereby, the control unit 11 can control the position of the original plate 3 mounted on the original stage 4 based on the position of the original stage 4 measured by the first measurement unit 13. Further, the control unit 11 can control the speed of the original plate 3 mounted on the original stage 4 based on the time change of the position of the original stage 4 measured by the first measurement unit 13.

[0018] The projection optical system 5 has a plurality of optical elements composed of mirrors, lenses, etc. The projection optical system 5 reflects / refracts the exposure light that has passed through the original plate 3 with a plurality of optical elements, and projects the image of the pattern formed on the original plate 3 onto the substrate 6 at a predetermined magnification.

[0019] The substrate 6 is mounted on the substrate stage 7. The substrate stage 7 is configured to hold the substrate 6 and be movable in the X direction, Y direction, Z direction, and θZ direction, and is driven in each direction by the substrate drive mechanism 14 under the control of the control unit 11. In the case of this embodiment, the substrate stage 7 is scanned in the Y direction by the substrate drive mechanism 14 in the exposure process.

[0020] The position of the substrate stage 7 can be constantly measured (monitored) by the second measurement unit 15. The second measurement unit 15 may include, for example, a laser interferometer. In this case, the second measurement unit 15 irradiates the measurement light on the reflector 15a provided on the substrate stage 7, and measures the position of the substrate stage 7 based on the measurement light reflected by the reflector 15a. Thereby, the control unit 11 can control the position of the substrate 6 mounted on the substrate stage 7 based on the position of the substrate stage 7 measured by the second measurement unit 15. Further, the control unit 11 can control the speed of the substrate 6 mounted on the substrate stage 7 based on the time change of the position of the substrate stage 7 measured by the second measurement unit 15.

[0021] The detection unit 2 (alignment detection unit) has a scope for detecting (imaging) the reference mark 8 provided on the reticle stage 4 and the reticle mark 10 provided on the reticle 3. Further, the detection unit 2 detects the reference mark 9 provided on the substrate stage 7 and / or a mark (not shown) provided on the substrate 6 via the reticle 3 and the projection optical system 5. The detection unit 2 has a focus adjustment mechanism and can detect each mark by adjusting the focus according to the position of each mark in the Z direction. Hereinafter, the reference mark 8 provided on the reticle stage 4 may be referred to as the "first reference mark 8", and the reference mark 9 provided on the substrate stage 7 may be referred to as the "second reference mark 9".

[0022] Also, the detection unit 2 is configured to be movable in the XY directions and is driven in the XY directions by a detection drive mechanism 16 under the control of the control unit 11. For example, when the detection unit 2 is to detect the first reference mark 8 and / or the reticle mark 10, the detection drive mechanism 16 drives (moves) the detection unit 2 so that the mark is disposed within the field of view of the detection unit 2 (scope). Here, the drive (movement) for disposing the mark within the field of view of the detection unit 2 may be performed by driving the reticle stage 4 (reticle 3) by the reticle drive mechanism 12. Alternatively, it may be performed by relatively driving the reticle stage 4 (reticle 3) and the detection unit 2 by both the detection drive mechanism 16 and the reticle drive mechanism 12. That is, the detection drive mechanism 16 and the reticle drive mechanism 12 constitute a drive mechanism for relatively driving the reticle stage 4 (reticle 3) and the detection unit 2.

[0023] The control unit 11 is composed of a computer (information processing device) including a processor such as a CPU (Central Processing Unit) and a storage unit such as a memory, and controls the exposure process by controlling each part of the exposure device EXP. For example, the control unit 11 functions as a processing unit that determines the driving amount of each drive mechanism in the exposure process based on the position information of each mark obtained from the detection result at the detection unit 2. In the case of this embodiment, the control unit 11 may include a data storage unit 11a, a driving amount calculation unit 11b, and a driving instruction unit 11c. The data storage unit 11a constitutes at least a part of the storage unit of the control unit 11, and stores the position information of each mark, driving offsets of various drive shafts, driving parameters such as sensitivity, and various measurement data obtained by the exposure device EXP. The driving amount calculation unit 11b constitutes at least a part of the processor of the control unit 11, and determines the driving instruction amount of various drive shafts such as the reticle stage 4 and the substrate stage 7 in the exposure process based on various data stored in the data storage unit 11a. The driving instruction unit 11c constitutes at least a part of the processor of the control unit 11, and outputs a driving instruction to each drive mechanism based on the driving instruction amount determined by the driving amount calculation unit 11b.

[0024] In order to accurately transfer the pattern of the reticle 3 onto the substrate 6 in the above exposure device EXP, it is important to accurately drive the reticle 3 mounted on the reticle stage 4. As described above, the driving of the reticle 3 is performed by driving the reticle stage 4 by the reticle drive mechanism 12 based on the position of the reticle stage 4 measured by the first measurement unit 13. Therefore, in order to accurately control the position of the reticle 3 mounted on the reticle stage 4, it is desirable to have information indicating the displacement of the reticle 3 with respect to the reticle stage 4. Therefore, in the exposure device EXP, a measurement process is performed to measure the displacement of the reticle 3 with respect to the reticle stage 4 by detecting the first reference mark 8 of the reticle stage 4 and the reticle mark 10 of the reticle 3 by the detection unit 2.

[0025] In addition, in the exposure apparatus EXP, it is required to mount various types of reticles 3 on the reticle stage 4. For example, in the exposure apparatus EXP, the specified size of the reticle 3 that can be mounted on the reticle stage 4 is usually determined. However, by using the holder 20 that holds the peripheral portion of the reticle 3, a reticle 3 having a size smaller than the specified size may also be mounted on the reticle stage 4. In this case, it is desirable for the exposure apparatus EXP to accurately measure the displacement of the reticle 3 with respect to the reticle stage 4 according to the type (e.g., size) of the reticle 3. Hereinafter, a configuration example of the reticle stage 4 in the present embodiment and the mounting of various reticles 3 on the reticle stage 4 will be described.

[0026] FIG. 2 shows an example in which a reticle 3a of a specified size is mounted on the reticle stage 4. Further, FIG. 3 shows (a) the layout of the first reference mark 8 on the reticle stage 4 and (b) the layout of the reticle mark 10 on the reticle 3a of the specified size.

[0027] The reticle stage 4 may include a main body portion 4a and a chuck 4b. The main body portion 4a is a portion that is driven in the XY directions by the reticle drive mechanism 12, and the first reference mark 8 is provided on the main body portion 4a. The chuck 4b is a mechanism that sucks and holds the reticle 3a by a vacuum suction force, an electrostatic suction force, or the like. In addition, the reticle stage 4 is provided with an opening 4c for allowing light from a pattern provided in the central portion of the reticle 3a to pass through.

[0028] The original plate 3a (first original plate) of a specified size is provided with an original plate mark 10 (first mark). The original plate mark 10 is arranged on the original plate 3a so as to be within the field of view of the detection unit 2 (scope) together with the first reference mark 8 of the original plate stage 4 in a state where the original plate 3a is mounted on the original plate stage 4. In the example of FIG. 3, the original plate mark 10 is arranged on the original plate 3a so as to at least partially overlap with the first reference mark 8 of the original plate stage 4 in a state where the original plate 3a is mounted on the original plate stage 4. Therefore, the detection unit 2 can detect the first reference mark 8 of the original plate stage 4 and the original plate mark 10 of the original plate 3a while simultaneously accommodating them within the field of view.

[0029] For example, as shown in FIG. 3, the original plate 3a of a specified size may be provided with a plurality of (two) original plate marks 10a to 10b spaced apart in the X direction. In this case, the control unit 11 simultaneously accommodates the first reference mark 8a and the original plate mark 10a within the field of view of the detection unit 2 by relatively moving the original plate stage 4 and the detection unit 2, and causes the detection unit 2 to detect the first reference mark 8a and the original plate mark 10a in that state. Similarly, the control unit 11 simultaneously accommodates the first reference mark 8b and the original plate mark 10b within the field of view of the detection unit 2 by relatively moving the original plate stage 4 and the detection unit 2, and causes the detection unit 2 to detect the first reference mark 8b and the original plate mark 10b in that state. Thereby, the control unit 11 obtains the relative position between the first reference mark 8 detected by the detection unit 2 and the corresponding original plate mark 10, and determines the positional deviation of the original plate 3a with respect to the original plate stage 4 based on the difference between the obtained relative position and the designed relative position.

[0030] FIG. 4 shows an example in which an original plate 3b having a size smaller than the specified size (hereinafter sometimes referred to as a small size) is mounted on the original plate stage 4 via a holder 20. FIG. 5 shows (a) the layout of the first reference mark 8 on the original plate stage 4 and (b) the layout of the original plate mark 18 on the small-sized original plate 3b held by the holder 20. Here, since the configuration of the original plate stage 4 has been described above with reference to FIG. 2, the description here is omitted.

[0031] The holder 20 may include a first portion 21 held by the original plate stage 4 (chuck 4b), a second portion 22 connected to the first portion and holding (supporting) the small-sized original plate 3b, and a fixing member 23 that fixes the original plate 3b held by the second portion 22. The first portion 21 and the second portion 22 of the holder 20 may be made of a member that does not transmit light, such as metal, but may also be made of a member that transmits light. When the first portion 21 and the second portion 22 are made of a member that does not transmit light, the holder 20 has a light-transmitting portion 24 at a position (first portion 21) that overlaps with the first reference mark 8 in a state of being mounted on the original plate stage 4. A light-transmitting member having the same material and the same thickness as the original plate 3 is provided in the light-transmitting portion 24 of the holder 20 so that the focus of the detection unit 2 coincides when detecting the first reference mark 8 through the original plate 3 and when detecting the first reference mark 8 through the light-transmitting portion 24. Further, the fixing member 23 is a member that fixes the original plate 3b to the holder 20 (second portion 22) by pressing the small-sized original plate 3b against the second portion 22, and may be constituted by, for example, a leaf spring.

[0032] The small-sized original plate 3b (second original plate) is provided with an original plate mark 18 (second mark). When using the small-sized original plate 3b, in a state where the original plate 3b is mounted on the original plate stage 4 via the holder 20, the first reference mark 8 of the original plate stage 4 and the original plate mark 18 of the original plate 3b cannot be simultaneously included in the field of view of the detection unit 2 (scope). Therefore, the detection unit 2 individually includes the first reference mark 8 of the original plate stage 4 and the original plate mark 18 of the original plate 3b in the field of view of the detection unit 2 through the relative movement between the original plate stage 4 and the detection unit 2 and detects them.

[0033] For example, in the case of the small-sized original plate 3b, as shown in FIG. 5, a plurality (two) of original plate marks 18a to 18b spaced apart in the X direction can be provided. In this case, the control unit 11 moves the original plate stage 4 and the detection unit 2 relatively to place the first reference mark 8a within the field of view of the detection unit 2 through the light transmission portion 24 of the holder 20, and causes the detection unit 2 to detect the first reference mark 8a in that state. Then, the control unit 11 moves the original plate stage 4 and the detection unit 2 relatively to place the original plate mark 18a within the field of view of the detection unit 2, and causes the detection unit 2 to detect the original plate mark 18a in that state. Similarly, the control unit 11 moves the original plate stage 4 and the detection unit 2 relatively to place the first reference mark 8b within the field of view of the detection unit 2 through the light transmission portion 24 of the holder 20, and causes the detection unit 2 to detect the first reference mark 8b in that state. Then, the control unit 11 moves the original plate stage 4 and the detection unit 2 relatively to place the original plate mark 18b within the field of view of the detection unit 2, and causes the detection unit 2 to detect the original plate mark 18b in that state. Thereby, the control unit 11 obtains the relative position between the first reference mark 8 detected by the detection unit 2 and the corresponding original plate mark 18, and determines the displacement of the original plate 3b with respect to the original plate stage 4 based on the difference between the obtained relative position and the designed relative position.

[0034] Next, an operation example (lithography method, exposure method) of the exposure apparatus EXP in the present embodiment will be described. FIG. 6 is a flowchart showing an operation example of the exposure apparatus EXP. The flowchart of FIG. 6 can be executed by the control unit 11. Here, steps S12 to S15 in the flowchart of FIG. 6 may be understood as measurement processing for measuring the displacement of the original plate 3 with respect to the original plate stage 4. The measurement processing may include step S11 in addition to steps S12 to S15.

[0035] In step S11, the control unit 11 identifies the type of the original plate 3 conveyed onto the original plate stage 4 by an original plate conveyance unit (not shown). For example, the control unit 11 can identify the type of the original plate 3 conveyed onto the original plate stage 4 by reading an identifier (e.g., barcode) provided on the original plate 3.

[0036] In step S12, the control unit 11 obtains information indicating the designed relative position between the first reference mark 8 of the original plate stage 4 and the original plate mark of the original plate 3 in the state where the original plate 3 is held on the original plate stage 4, based on the type of the original plate 3 specified in step S11 (acquisition step). The designed relative position between the first reference mark 8 and the original plate mark means, for example, the designed relative position between the first reference mark 8 and the original plate mark when the original plate 3 is mounted on the original plate stage 4 such that the center of gravity (center) of the original plate stage 4 coincides with the center of gravity (center) of the original plate 3. Hereinafter, the information indicating the designed relative position between the first reference mark 8 and the original plate mark may be referred to as "design information".

[0037] In step S13, the control unit 11 selects one mode from a plurality of modes for detecting the first reference mark 8 of the original plate stage 4 and the original plate mark of the original plate 3, according to the design information acquired in step S12 (selection step). The plurality of modes may include a first mode and a second mode. The first mode is a mode in which the first reference mark 8 and the original plate mark are detected by bringing the first reference mark 8 and the original plate mark within the visual field of the detection unit 2 at the same time. The second mode is a mode in which the first reference mark 8 and the original plate mark are detected by individually bringing the first reference mark 8 and the original plate mark within the visual field of the detection unit 2 through the relative movement between the original plate stage 4 and the detection unit 2.

[0038] When the control unit 11 determines that the original plate mark of the original plate 3 mounted on the original plate stage 4 can be brought within the visual field of the detection unit 2 together with (simultaneously with) the first reference mark 8 based on the design information acquired in step S12, the control unit 11 selects the first mode. That is, when the original plate 3a of a specified size is mounted on the original plate stage 4, the first mode is selected. In this case, the process proceeds to step S14, and the control unit 11 causes the detection unit 2 to detect the first reference mark 8 and the original plate mark in the first mode, and determines the displacement of the original plate 3 with respect to the original plate stage 4 based on the detection result (determination step). That is, the control unit 11 performs the measurement process in the first mode. Details of step S14 in the first mode will be described later.

[0039] On the other hand, when the control unit 11 determines that it is impossible to fit the original plate mark of the original plate 3 mounted on the original plate stage 4 within the field of view of the detection unit 2 together with (simultaneously with) the first reference mark 8 based on the design information acquired in step S12, the second mode is selected. That is, when the small-sized original plate 3b is mounted on the original plate stage 4, the second mode is selected. In this case, the process proceeds to step S15, and the control unit 11 causes the detection unit 2 to detect the first reference mark 8 and the original plate mark in the second mode, and determines the misalignment of the original plate 3 with respect to the original plate stage 4 based on the detection result (determination step). That is, the control unit 11 performs the measurement process in the second mode. Details of step S15 will be described later.

[0040] In step S16, the control unit 11 performs an exposure process of exposing the substrate 6 to transfer the pattern of the original plate 3 onto the substrate 6. In the exposure process, the alignment between the original plate 3 and the substrate 6 is controlled based on the misalignment determined in step S14 or S15. For example, the control unit 11 controls the alignment between the original plate 3 and the substrate 6 by controlling the position of the original plate 3 mounted on the original plate stage 4 based on the position of the original plate stage 4 measured by the first measurement unit 13 and the misalignment determined in step S14 or S15.

[0041] Next, the details of step S14 will be described. FIG. 7 is a flowchart showing the measurement process in the first mode performed in step S14. Here, an example will be described in which the original plate 3a of a specified size is used as the original plate 3 mounted on the original plate stage 4, and a plurality (two) of original plate marks 10a to 10b are provided on the original plate 3a.

[0042] In step S21, the control unit 11 relatively drives (moves) the original plate stage 4 and the detection unit 2 so that the first reference mark 8 of the original plate stage 4 and the original plate mark 10 of the original plate 3a are simultaneously within the field of view of the detection unit 2. Next, in step S22, the control unit 11 causes the detection unit 2 to detect (image) the first reference mark 8 and the original plate mark 10 in a state where the first reference mark 8 and the original plate mark 10 are simultaneously within the field of view of the detection unit 2. At this time, the control unit 11 may adjust the focus of the detection unit 2 by the focus adjustment mechanism so that the focus of the detection unit 2 matches the first reference mark 8.

[0043] In step S23, the control unit 11 obtains the relative positional deviation between the first reference mark 8 and the original plate mark 10 based on the detection result in step S22 (that is, the image obtained by imaging). The relative positional deviation is the deviation from the designed relative position between the first reference mark 8 and the original plate mark 10. Next, in step S24, the control unit 11 determines whether the relative positional deviation has been obtained for all pairs of the first reference mark 8 and the original plate mark 10. In the case of this embodiment, the pairs of the first reference mark 8 and the original plate mark 10 may include the pair of the first reference mark 8a and the original plate mark 10a, and the pair of the first reference mark 8b and the original plate mark 10b. If the relative positional deviation has been obtained for all pairs, the process proceeds to step S25. On the other hand, if the relative positional deviation has not been obtained for all pairs, the process proceeds to step S21, and steps S21 to S23 are performed for the pairs for which the relative positional deviation has not yet been obtained.

[0044] For example, in the first steps S21 to S22, as shown in FIG. 2, the original stage 4 and the detection unit 2 are relatively driven so that the first reference mark 8a and the original mark 10a are simultaneously within the field of view of the detection unit 2. Then, the detection unit 2 is made to detect the first reference mark 8a and the original mark 10a. Thereby, in step S23, the relative positional deviation between the first reference mark 8a and the original mark 10a is obtained. Similarly, in the second steps S21 to S22, the original stage 4 and the detection unit 2 are relatively driven so that the first reference mark 8b and the original mark 10b are simultaneously within the field of view of the detection unit 2. Then, the detection unit 2 is made to detect the first reference mark 8b and the original mark 10b. Thereby, in step S23, the relative positional deviation between the first reference mark 8b and the original mark 10b is obtained. When a plurality of detection units 2 are provided in the exposure apparatus EXP as shown in FIG. 1, the steps S21 to S23 for each set may be performed in parallel by the plurality of detection units 2.

[0045] In step S25, the control unit 11 determines the positional deviation of the original plate 3a with respect to the original stage 4 based on the relative positional deviation between the first reference mark 8 and the original mark 10 obtained in step S23. When there are a plurality of sets of the first reference mark 8 and the original mark 10, the positional deviation of the original plate 3a with respect to the original stage 4 may be determined based on the representative value (for example, average value, mode value, etc.) of the relative positional deviations obtained for each of the plurality of sets.

[0046] Next, the details of step S15 will be described. FIG. 8 is a flowchart showing the measurement process in the second mode performed in step S15. Here, an example will be described in which a small-sized original plate 3b is used as the original plate 3 mounted on the original stage 4, and a plurality (two) of original marks 18a to 18b are provided on the original plate 3b.

[0047] In the following description, the design positions of the first reference marks 8a to 8b on the original plate stage 4 are represented as positions in the XY directions with the center of gravity (center) of the original plate stage 4 as the origin, and are respectively represented as (XL1, YL1) and (XR1, YR1). Also, the design positions of the original plate marks 18a to 18b on the small-sized original plate 3b are represented as positions in the XY directions with the center of gravity (center) of the original plate 3b as the origin, and are respectively represented as (XL2, YL2) and (XR2, YR2). However, in terms of design, it is assumed that the center of gravity of the original plate stage 4 coincides with the center of gravity of the small-sized original plate 3b mounted on the original plate stage 4 via the holder 20.

[0048] In step S31, the control unit 11 relatively drives (moves) the original plate stage 4 and the detection unit 2 so that the first reference mark 8 on the original plate stage 4 is within the visual field of the detection unit 2 through the light transmission portion 24 of the holder 20. Next, in step S32, the control unit 11 causes the detection unit 2 to detect (image) the first reference mark 8 that is within the visual field of the detection unit 2. At this time, the control unit 11 may adjust the focus of the detection unit 2 by the focus adjustment mechanism so that the focus of the detection unit 2 matches the first reference mark 8.

[0049] In step S33, the control unit 11 relatively drives (moves) the original plate stage 4 and the detection unit 2 so that the original plate mark 18 on the original plate 3b is within the visual field of the detection unit 2. In this embodiment, the relative driving amount between the original plate stage 4 and the detection unit 2 may use the designed relative distance between the first reference mark 8 and the original plate mark 18. Next, in step S34, the control unit 11 causes the detection unit 2 to detect (image) the original plate mark 18 that is within the visual field of the detection unit 2. At this time, the control unit 11 may adjust the focus of the detection unit 2 by the focus adjustment mechanism so that the focus of the detection unit 2 matches the original plate mark 18.

[0050] In step S35, the control unit 11 obtains the relative positional deviation between the first reference mark 8 and the original plate mark 18 based on the detection results in steps S32 and S34 (i.e., the image obtained by imaging). The relative positional deviation is the deviation from the designed relative position between the first reference mark 8 and the original plate mark 18. Next, in step S36, the control unit 11 determines whether the relative positional deviation has been obtained for all pairs of the first reference mark 8 and the original plate mark 18. In the case of this embodiment, the pairs of the first reference mark 8 and the original plate mark 18 may include the pair of the first reference mark 8a and the original plate mark 18a, and the pair of the first reference mark 8b and the original plate mark 18b. If the relative positional deviation has been obtained for all pairs, the process proceeds to step S37. On the other hand, if the relative positional deviation has not been obtained for all pairs, the process proceeds to step S31, and steps S31 to S35 are performed for the pairs for which the relative positional deviation has not yet been obtained.

[0051] For example, in the first execution of steps S31 to S34, as shown in FIG. 4, the first reference mark 8a and the original plate mark 18a are individually detected by the detection unit 2. In this case, in step S32, the positional deviation in the XY directions of the first reference mark 8a with respect to the center of the field of view of the detection unit 2 is obtained as (dxL1, dyL1). Also, in step S33, the designed relative distance (XL2 - XL1, YL2 - YL1) between the first reference mark 8a and the original plate mark 18a is used as the relative driving amount between the original plate stage 4 and the detection unit 2. Then, in step S35, the positional deviation in the XY directions of the original plate mark 18a with respect to the center of the field of view of the detection unit 2 is obtained as (dxL2, dxL2). Thereby, in step S35, the relative positional deviation between the first reference mark 8a and the original plate mark 18a is obtained as (dxL2 - dxL1, dyL2 - dyL1).

[0052] Similarly, in the second round of steps S31 to S34, the first reference mark 8b and the original plate mark 18b are individually detected by the detection unit 2. In this case, in step S32, the positional deviation in the XY directions of the first reference mark 8b with respect to the center of the field of view of the detection unit 2 is obtained as (dxR1, dyR1). Also, in step S33, the designed relative distance (XR2 - XR1, YR2 - YR1) between the first reference mark 8b and the original plate mark 18b is used as the relative driving amount between the original plate stage 4 and the detection unit 2. Then, in step S35, the positional deviation in the XY directions of the original plate mark 18a with respect to the center of the field of view of the detection unit 2 is obtained as (dxR2, dyR2). Thereby, in step S35, the relative positional deviation between the first reference mark 8b and the original plate mark 18b is obtained as (dxR2 - dxR1, dyR2 - dyR1).

[0053] In addition, as shown in FIG. 1, when a plurality of detection units 2 are provided in the exposure apparatus EXP, steps S31 to S35 for each set may be performed in parallel by the plurality of detection units 2.

[0054] In step S37, the control unit 11 determines the positional deviation of the original plate 3b with respect to the original plate stage 4 based on the relative positional deviation between the first reference mark 8 and the original plate mark 18 obtained in step S35. When there are a plurality of sets of the first reference mark 8 and the original plate mark 18, the positional deviation of the original plate 3b with respect to the original plate stage 4 may be determined based on the representative value (for example, average value, mode value, etc.) of the relative positional deviations obtained for each of the plurality of sets.

[0055] Here, in the above measurement process, when obtaining the relative positional deviation between the first reference mark 8 and the original plate marks 10 and 18, the position of the substrate stage 7 is arbitrary. The above measurement process is preferably carried out in parallel with other processes from the viewpoint of throughput, and for example, it may be carried out during the replacement of the substrate 6 on the substrate stage 7.

[0056] Also, when adjusting the focus of the detection unit 2 by the focus adjustment mechanism, the mark image may shift not only in the Z direction but also in the XY direction. Therefore, it is advisable to measure in advance the shift amount of the mark image in the XY direction when the focus of the detection unit 2 is changed at an arbitrary pitch by the focus adjustment mechanism, and store the measurement result in the data storage unit 11a as a table or a function. Thereby, the control unit 11 can accurately detect the relative positional deviation between the first reference mark 8 and the original marks 10 and 18 based on the shift amount of the mark image in the XY direction corresponding to the change amount (adjustment amount) of the detection unit 2 by the focus adjustment mechanism. The measurement of the shift amount of the mark image can be carried out at an arbitrary timing before starting the flowchart of FIG. 6.

[0057] Furthermore, when the detection unit 2 is driven in the XY direction, the actual driving position may shift in the XY direction with respect to the drive command value. Therefore, it is advisable to measure in advance the shift amount (i.e., the drive error amount) in the XY direction when the detection unit 2 is driven in the XY direction at an arbitrary pitch, and store the measurement result in the data storage unit 11a as a table or a function. Thereby, the control unit 11 can accurately drive the detection unit 2 based on the shift amount in the XY direction corresponding to the driving position of the detection unit 2. The measurement of the shift amount of the driving position can be carried out at an arbitrary timing before starting the flowchart of FIG. 6.

[0058] As described above, in the present embodiment, one mode is selected from a plurality of modes for detecting the first reference mark 8 and the master mark based on the design information indicating the relative position in design between the first reference mark 8 and the master mark. Then, based on the result of detecting the first reference mark 8 and the master mark in the selected one mode, the position of the master plate 3 with respect to the master plate stage 4 is determined. The plurality of modes include a first mode and a second mode. The first mode is a mode in which the first reference mark 8 and the master mark are simultaneously detected within the field of view of the detection unit 2, and can be selected when the master plate 3a of a specified size is mounted on the master plate stage 4. The second mode is a mode in which the first reference mark 8 and the master mark are individually detected within the field of view of the detection unit 2 through the relative movement between the master plate stage 4 and the detection unit 2, and can be selected when the small-sized master plate 3b is mounted on the master plate stage 4 via the holder 20. Thereby, the displacement of the master plate 3 with respect to the master plate stage 4 can be accurately measured according to the type of the master plate 3.

[0059] <Second Embodiment> A second embodiment according to the present invention will be described. In the present embodiment, a modified example of the measurement process in the second mode performed in step S15 will be described. Note that the present embodiment basically follows the first embodiment, and may follow the first embodiment except for the matters mentioned below.

[0060] FIG. 9 shows (a) the layout of the first reference mark 8 on the master plate stage 4, (b) the layout of the master mark 18 on the small-sized master plate 3b held by the holder 20, and (c) the layout of the second reference mark 9 on the substrate stage 7.

[0061] In the following description, the design positions of the first reference marks 8a to 8b on the original plate stage 4 are represented as positions in the XY directions with the center of gravity (center) of the original plate stage 4 as the origin, and are denoted as (XL1, YL1) and (XR1, YR1), respectively. Also, the design positions of the original plate marks 18a to 18b on the small-sized original plate 3b are represented as positions in the XY directions with the center of gravity (center) of the original plate 3b as the origin, and are denoted as (XL2, YL2) and (XR2, YR2), respectively. Further, the design positions of the second reference marks 9a to 9b on the substrate stage 7 are represented as positions in the XY directions with the center of gravity (center) of the substrate stage 7 as the origin, and are denoted as (XL3, YL3) and (XR3, YR3), respectively. However, in terms of design, it is assumed that the center of gravity of the original plate stage 4, the center of gravity of the substrate stage 7, and the center of gravity of the small-sized original plate 3b mounted on the original plate stage 4 via the holder 20 coincide. Here, the second reference marks 9a to 9b on the substrate stage 7 are arranged at the same intervals as the original plate marks 18a to 18b on the original plate 3b. When a plurality of small-sized original plates 3b having different sizes are used, the second reference marks 9 on the substrate stage 7 may be increased for each type of interval of the original plate marks 18. Even in this case, the intervals of the second reference marks 9 on the substrate stage 7 are the same as the intervals of the original plate marks 18.

[0062] FIG. 10 is a flowchart showing the measurement process in the second mode performed in step S15. In the present embodiment, an example of obtaining the relative positional deviation between the first reference mark 8 on the original plate stage 4 and the original plate mark 18 on the original plate 3b with the second reference mark 9 on the substrate stage 7 as a reference will be described.

[0063] In step S41, the control unit 11 relatively drives (moves) the original plate stage 4 and the detection unit 2 so that the original plate mark 18 on the original plate 3b is within the visual field of the detection unit 2. At this time, the control unit 11 drives the substrate stage 7 so that the second reference mark 9 on the substrate stage 7 is within the visual field of the detection unit and within the projection area of the projection optical system 5.

[0064] In step S42, the control unit 11 causes the detection unit 2 to detect (image) the original plate mark 18 and the second reference mark 9 that are within the field of view of the detection unit 2. The second reference mark 9 is detected by the detection unit 2 via the projection optical system 5. At this time, the control unit 11 may adjust the focus of the detection unit 2 by the focus adjustment mechanism or adjust the position of the second reference mark 9 in the Z direction by the substrate stage 7 so that the focus of the detection unit 2 matches the original plate mark 18 and the second reference mark 9. Next, in step S43, the control unit 11 obtains the positional deviation of the original plate mark 18 with respect to the second reference mark 9 based on the detection result in step S42 (that is, the image obtained by imaging). At this time, the control unit 11 also obtains the positional deviation of the second reference mark 9 with respect to the center of the field of view of the detection unit 2.

[0065] In step 44, the control unit 11 relatively drives (moves) the original plate stage 4 and the detection unit 2 so that the first reference mark 8 on the original plate stage 4 is within the field of view of the detection unit 2 through the light transmission portion 24 of the holder 20. In this embodiment, as the relative driving amount between the original plate stage 4 and the detection unit 2, the designed relative distance between the first reference mark 8 and the original plate mark 18 can be used.

[0066] In step S45, the control unit 11 causes the detection unit 2 to detect (image) the first reference mark 8 that is within the field of view of the detection unit 2. At this time, the control unit 11 may adjust the focus of the detection unit 2 by the focus adjustment mechanism so that the focus of the detection unit 2 matches the first reference mark 8. Next, in step S46, the control unit 11 obtains the positional deviation of the first reference mark 8 with respect to the center of the field of view of the detection unit 2 based on the detection result in step S45 (that is, the image obtained by imaging). Here, steps S44 to S46 are performed to obtain the positional relationship between the original plate stage 4 and the substrate stage 7. Therefore, if the "positional deviation of the first reference mark 8 with respect to the center of the field of view of the detection unit 2" is obtained in the first round of steps S44 to S46, the second and subsequent rounds of steps S44 to S46 may be omitted.

[0067] In step S47, the control unit 11 obtains the relative positional deviation between the first reference mark 8 and the original plate mark 18. The relative positional deviation can be calculated from the "positional deviation of the original plate mark 18 with respect to the second reference mark 9" obtained in step S43, the "positional deviation of the second reference mark 9 with respect to the center of the visual field", and the "positional deviation of the first reference mark 8 with respect to the center of the visual field" obtained in step S46.

[0068] In step S48, the control unit 11 determines whether the relative positional deviation has been obtained for all combinations of the first reference mark 8, the second reference mark 9, and the original plate mark 18. In the case of this embodiment, the combinations of the first reference mark 8, the second reference mark 9, and the original plate mark 18 may include the combination of the first reference mark 8a, the second reference mark 9a, and the original plate mark 18a, and the combination of the first reference mark 8b, the second reference mark 9b, and the original plate mark 18b. If the relative positional deviation has been obtained for all combinations, the process proceeds to step S49. On the other hand, if the relative positional deviation has not been obtained for all combinations, the process proceeds to step S41, and steps S41 to S47 are performed for the combinations for which the relative positional deviation has not yet been obtained.

[0069] For example, in the first round of steps S41 to S47, the first reference mark 8a and the original plate mark 18a are individually detected by the detection unit 2. In this case, in step S41, as the driving amount of the substrate stage 7, "-(XL3 + XR3) / 2" is used for the X direction, and "(YL3 + YR3) / 2 - (YL1 + YR1) / 2" is used for the Y direction. Then, in step S43, the positional deviation of the original plate mark 18a with respect to the second reference mark 9a is obtained as (dxL3, dyL3), and the positional deviation of the second reference mark 9a with respect to the center of the field of view of the detection unit 2 is obtained as (dxL4, dyL4). Also, in step S44, as the relative driving amount between the original plate stage 4 and the detection unit 2, the designed relative distance (XL1 - XL2, YL1 - YL2) between the first reference mark 8a and the original plate mark 18a is used. Then, in step S46, the positional deviation of the first reference mark 8a with respect to the center of the field of view of the detection unit 2 is obtained as (dxL5, dyL5). As a result, in step S47, the relative positional deviation between the first reference mark 8a and the original plate mark 18a is obtained as (dxL3 + dxL4 - dxL5, dyL3 + dyL4 - dyL5).

[0070] Similarly, in the second round of steps S41 to S47, the first reference mark 8b and the original plate mark 18b are individually detected by the detection unit 2. In this case, in step S43, the positional deviation of the original plate mark 18b with respect to the second reference mark 9b is obtained as (dxR3, dyR3), and the positional deviation of the second reference mark 9b with respect to the center of the field of view of the detection unit 2 is obtained as (dxR4, dyR4). Also, in step S44, as the relative driving amount between the original plate stage 4 and the detection unit 2, the designed relative distance (XR1 - XR2, YR1 - YR2) between the first reference mark 8a and the original plate mark 18a is used. Then, in step S46, the positional deviation of the first reference mark 8b with respect to the center of the field of view of the detection unit 2 is obtained as (dxR5, dyR5). As a result, in step S47, the relative positional deviation between the first reference mark 8b and the original plate mark 18b is obtained as (dxR3 + dxR4 - dxR5, dyR3 + dyR4 - dyR5).

[0071] In addition, when a plurality of detection units 2 are provided in the exposure apparatus EXP as shown in FIG. 1, steps S41 to S47 for each set may be performed in parallel by the plurality of detection units 2.

[0072] In step S49, the control unit 11 determines the positional deviation of the original plate 3b with respect to the original plate stage 4 based on the relative positional deviation between the first reference mark 8 obtained in step S47 and the original plate mark 18. When there are a plurality of sets of the first reference mark 8 and the original plate mark 18, the positional deviation of the original plate 3b with respect to the original plate stage 4 may be determined based on the representative values (for example, average value, mode value, etc.) of the relative positional deviations obtained for each of the plurality of sets.

[0073] Also according to the present embodiment, similar to the first embodiment, the positional deviation of the original plate 3 with respect to the original plate stage 4 can be accurately measured according to the type of the original plate 3. Here, the step (step S47) of obtaining the relative positional deviation between the first reference mark 8 and the original plate mark 18 is preferably performed in parallel with other processes from the viewpoint of throughput. For example, it may be performed during the replacement of the substrate 6 on the substrate stage 7. Therefore, the second reference mark 9 of the substrate stage 7 may be provided on the substrate stage 7 so as to at least partially overlap the original plate mark 10 at the position of the substrate stage 7 during the replacement of the substrate 6.

[0074] <Third Embodiment> The third embodiment according to the present invention will be described. In this embodiment, a configuration example of a specific exposure apparatus EXP for specifying the type of the original plate 3 in step S11 will be described. Note that this embodiment basically inherits the first embodiment and may follow the first embodiment except for the matters mentioned below. Also, in this embodiment, the measurement process in the second mode in the second embodiment may be applied instead of the measurement process in the second mode in the first embodiment.

[0075] FIG. 11 is a schematic diagram showing a configuration example of the exposure apparatus EXP' of the present embodiment. The exposure apparatus EXP' of the present embodiment may further include a master plate storage unit 50, a master plate transfer robot 51, and a master plate transfer loader 56, as compared with the exposure apparatus EXP of the first embodiment. The master plate transfer robot 51 and the master plate transfer loader 56 constitute a master plate transfer unit that transfers the master plate 3 from the master plate storage unit 50 onto the master plate stage 4.

[0076] The master plate storage unit 50 is a unit that stores the master plate 3. The master plate storage unit 50 may include a master plate stocker 52, a cassette opening device 53, and master plate cassettes 54 to 55. The master plate is taken out from the master plate stocker 52 using the master plate transfer robot 51, and is delivered to the master plate transfer loader 56 with the cassette opened by the cassette opening device 53. Thereafter, the master plate transfer loader 56 transfers the master plate onto the master plate stage 4. A plurality of master plates are held in the master plate stocker 52. In FIG. 11, the master plate 3 unloaded from the master plate cassette 54 and mounted on the master plate stage 4, and the master plate 57 stored in the master plate cassette 55 are illustrated. The master plate transfer robot 51 is provided with a reading unit 58 that reads an identifier (for example, a barcode) provided on each master plate. The reading unit 58 reads the identifier provided on the master plate (for example, the side surface portion) during the transfer of the master plate by the master plate transfer robot 51. Thereby, the control unit 11 can specify the type (for example, size) of the master plate to be transferred onto the master plate stage 4 based on the identifier read by the reading unit 58. Information regarding the type of the master plate is stored, for example, in the data storage unit 11a, and is used to acquire design information indicating the relative position in design between the first reference mark 8 and the master plate mark.

[0077] <Embodiment of the method for manufacturing an article> The article manufacturing method according to an embodiment of the present invention is suitable for manufacturing articles such as microdevices such as semiconductor devices and elements having a fine structure. The article manufacturing method of the present embodiment includes a transfer step of transferring a pattern of a master onto a substrate using the above-described lithography method (lithography apparatus), a processing step of processing the substrate that has undergone the transfer step, and a manufacturing step of manufacturing an article from the substrate that has undergone the processing step. The transfer step may be understood as a step of exposing the substrate using the above-described exposure method (exposure apparatus). Further, the processing step may be understood as a step of developing a photosensitive material (photoresist) on the substrate onto which the pattern of the master has been transferred as a latent image pattern. Furthermore, the article manufacturing method includes other well-known steps (oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.). The article manufacturing method of the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article as compared with the conventional method.

[0078] <Other embodiments> The present invention can also be realized by supplying a program that realizes one or more functions of the above-described embodiments to a system or apparatus via a network or a storage medium, and causing one or more processors in a computer of the system or apparatus to read and execute the program. It can also be realized by a circuit (for example, ASIC) that realizes one or more functions.

[0079] <Summary of the embodiment> The disclosure of this specification includes at least the following measurement method, lithography method, article manufacturing method, and lithography apparatus. (Item 1) In a lithography apparatus that transfers a pattern of a master mounted on a stage onto a substrate, a measurement method for measuring a misalignment of the master with respect to the stage, an acquisition step of acquiring information indicating a designed relative position between a reference mark of the stage and a master mark of the master in a state where the master is mounted on the stage; A selection step of selecting one mode from a plurality of modes for detecting the reference mark and the original mark within a scope according to the information obtained in the acquisition step; A determination step of detecting the reference mark and the original mark within the scope according to the one mode selected in the selection step, and determining the misalignment based on the detection result; comprising: The plurality of modes include a first mode of detecting the reference mark and the original mark by simultaneously accommodating them within the field of view of the scope, and a second mode of detecting the reference mark and the original mark by individually accommodating them within the field of view through relative movement between the stage and the scope. A measurement method characterized by this. (Item 2) In the selection step, the first mode is selected when the first original is mounted on the stage, and the second mode is selected when the second original is mounted on the stage. The first original has, as the original mark, a first mark that fits within the field of view together with the reference mark in a state where the first original is mounted on the stage. The second original has, as the original mark, a second mark that does not fit within the field of view together with the reference mark in a state where the second original is mounted on the stage. The measurement method according to Item 1, characterized by this. (Item 3) The second original has a smaller size than the first original, and is mounted on the stage via a holder that holds a peripheral portion of the second original. The measurement method according to Item 2, characterized by this. (Item 4) In the second mode, the reference mark is detected by the scope via the holder. The measurement method according to Item 3, characterized by this. (Item 5) The holder has a light-transmitting portion at a position overlapping the reference mark in a state where the holder is mounted on the stage. The measurement method according to Item 4, characterized by this. (Item 6) The holder includes a first part held by a chuck of the stage, a second part connected to the first part for holding the original plate, and a fixing member for fixing the original plate by pressing the original plate against the second part. The measurement method according to any one of Items 3 to 5 is characterized by this. (Item 7) The method further includes a specifying step of specifying the type of the original plate conveyed to the stage by reading an identifier provided on the original plate. In the obtaining step, the information is obtained based on the type of the original plate specified in the specifying step. The measurement method according to any one of Items 1 to 6 is characterized by this. (Item 8) A lithography method for transferring a pattern of an original plate mounted on a stage onto a substrate, a measurement step of measuring the misalignment of the original plate with respect to the stage using the measurement method according to any one of Items 1 to 7, a transfer step of transferring the pattern of the original plate onto the substrate, including, In the transfer step, alignment between the original plate and the substrate is controlled based on the misalignment measured in the measurement step. The lithography method is characterized by this. (Item 9) a transfer step of transferring a pattern of an original plate onto a substrate using the lithography method according to Item 8, a processing step of processing the substrate that has undergone the transfer step, a manufacturing step of manufacturing an article from the substrate that has undergone the processing step, An article manufacturing method characterized by including this. (Item 10) A lithography apparatus for transferring a pattern of an original plate onto a substrate, a stage on which the original plate is mounted, a scope for detecting a reference mark of the stage and an original plate mark of the original plate, a control unit for determining the misalignment of the original plate with respect to the stage, comprising, The control unit selects one mode from a plurality of modes according to information indicating the designed relative position between the reference mark and the original mark in a state where the original plate is mounted on the stage, and determines the misalignment based on the result of detecting the reference mark and the original mark within the scope in accordance with the one mode. The plurality of modes include a first mode in which the reference mark and the original mark are simultaneously detected within the field of view of the scope, and a second mode in which the reference mark and the original mark are individually detected within the field of view through relative movement between the stage and the scope. The lithography apparatus is characterized by this.

[0080] The invention is not limited to the above embodiments, and various changes and modifications are possible without departing from the spirit and scope of the invention. Therefore, claims are attached to disclose the scope of the invention.

Explanation of Signs

[0081] 1: Illumination optical system, 2: Detection unit (scope), 3: Original plate, 4: Original plate stage, 5: Projection optical system, 6: Substrate, 7: Substrate stage, 8: First reference mark, 9: Second reference mark, 10, 18: Original mark, 11: Control unit, EXP: Exposure apparatus (lithography apparatus)

Claims

1. In a lithography apparatus for transferring a pattern of a reticle mounted on a stage onto a substrate, a measuring method for measuring the misalignment of the reticle with respect to the stage, comprising: an acquisition step of acquiring information indicating a designed relative position between a reference mark of the stage and a reticle mark of the reticle in a state where the reticle is mounted on the stage; a selection step of selecting one mode from a plurality of modes for detecting the reference mark and the reticle mark with a scope according to the information acquired in the acquisition step; a determination step of detecting the reference mark and the reticle mark with the scope in the one mode selected in the selection step and determining the misalignment based on the detection result; wherein the plurality of modes include a first mode of detecting the reference mark and the reticle mark by simultaneously accommodating them within the field of view of the scope, and a second mode of detecting the reference mark and the reticle mark by individually accommodating them within the field of view through relative movement between the stage and the scope. A measuring method characterized by this.

2. In the selection step, the first mode is selected when a first reticle is mounted on the stage, and the second mode is selected when a second reticle is mounted on the stage. The first reticle has, as the reticle mark, a first mark that fits within the field of view together with the reference mark in a state where the first reticle is mounted on the stage. The second reticle has, as the reticle mark, a second mark that does not fit within the field of view together with the reference mark in a state where the second reticle is mounted on the stage. The measuring method according to claim 1, characterized by this.

3. The second reticle has a smaller size than the first reticle and is mounted on the stage via a holder that holds a peripheral portion of the second reticle. The measuring method according to claim 2, characterized by this.

4. In the second mode, the reference mark is detected with the scope via the holder. The measuring method according to claim 3, characterized by this.

5. The holder has a light-transmitting portion at a position overlapping the reference mark in a state where the holder is mounted on the stage. The measuring method according to claim 4, characterized by this.

6. The holder includes a first part held by a chuck of the stage, a second part connected to the first part for holding the original plate, and a fixing member for fixing the original plate by pressing the original plate against the second part. The measuring method according to claim 3 is characterized by this.

7. The method further includes a specifying step of specifying the type of the original plate conveyed to the stage by reading an identifier provided on the original plate. In the obtaining step, the information is obtained based on the type of the original plate specified in the specifying step. The measuring method according to claim 1 is characterized by this.

8. A lithography method for transferring a pattern of an original plate mounted on a stage onto a substrate, a measuring step of measuring the displacement of the original plate with respect to the stage using the measuring method according to any one of claims 1 to 7, a transferring step of transferring the pattern of the original plate onto the substrate, including In the transferring step, alignment between the original plate and the substrate is controlled based on the displacement measured in the measuring step. The lithography method is characterized by this.

9. a transferring step of transferring a pattern of an original plate onto a substrate using the lithography method according to claim 8, a processing step of processing the substrate that has undergone the transferring step, a manufacturing step of manufacturing an article from the substrate that has undergone the processing step, An article manufacturing method characterized by including these.

10. A lithography apparatus for transferring a pattern of an original plate onto a substrate, a stage on which the original plate is mounted, a scope for detecting a reference mark of the stage and an original plate mark of the original plate, a control unit for determining the displacement of the original plate with respect to the stage, comprising The control unit selects one mode from a plurality of modes according to information indicating the designed relative position between the reference mark and the original plate mark in a state where the original plate is mounted on the stage, and determines the displacement based on the result of detecting the reference mark and the original plate mark by the scope in the one mode. The plurality of modes include a first mode of detecting the reference mark and the original plate mark by simultaneously accommodating them within the field of view of the scope, and a second mode of detecting the reference mark and the original plate mark by individually accommodating them within the field of view through relative movement between the stage and the scope. The lithography apparatus is characterized by this.

Images