Stage device, lithography device, substrate delivery method, and method for manufacturing article

Abstract

To provide a stage device advantageous for delivery of a substrate from a substrate chuck to pins.SOLUTION: A stage device has: a substrate chuck that has a holding surface and absorbs and holds a substrate on the holding surface; pins that can project from the holding surface through holes provided in the substrate chuck and can absorb and hold the substrate; a driving unit that relatively moves the substrate chuck and the pins; and a control unit that controls the driving unit. When separating the substrate and the substrate chuck, the control unit controls the driving unit based on a first condition related to the ease of separation of the substrate and the substrate chuck from each other.SELECTED DRAWING: Figure 8

Description

Technical Field

[0001] The present invention relates to a stage device, a lithography device, a substrate transfer method, and a method for manufacturing an article.

Background Art

[0002] In a manufacturing process of a semiconductor device, a liquid crystal display device, etc., a stage device may be used to transfer a substrate by changing the relative position between a pin having a vacuum chuck mechanism for holding the substrate and a substrate chuck. Further, Patent Document 1 discloses a stage device that stores the position of a driven member when the pin contacts the substrate and rapidly changes the relative position between the pin and the substrate until they contact based on the stored position.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Here, Patent Document 1 discloses that when the pin adsorbs and holds the substrate chuck and separates the substrate from the substrate chuck, the driven member is moved a small distance at a low speed. For example, if the driven member is moved at a high speed when separating the substrate from the substrate chuck, lateral displacement of the substrate may occur due to the remaining adsorption force (difficulty in separation) between the substrate and the substrate chuck. As a result, the substrate chuck may wear. Further, since the remaining adsorption force is caused by the characteristics of the substrate and the substrate chuck, in order to separate the substrate from the substrate chuck while reducing the influence of the remaining adsorption force, it is preferable that the driving of the driven member is appropriately set each time.

[0005] Therefore, an object of the present invention is to provide a stage device advantageous for transferring a substrate from a substrate chuck to a pin.

Means for Solving the Problem

[0006] In order to achieve the above object, a stage device according to one aspect of the present invention includes a substrate chuck having a holding surface and adsorbing and holding a substrate on the holding surface, a pin that can protrude from the holding surface through a hole provided in the substrate chuck and can adsorb and hold the substrate, a driving unit that relatively moves the substrate chuck and the pin, and a control unit that controls the driving unit. The control unit controls the driving unit based on a first condition related to the ease of separation between the substrate and the substrate chuck when separating the substrate from the substrate chuck.

[0007] A further object or other aspect of the present invention will be clarified by the embodiments described below with reference to the drawings.

Advantageous Effects of the Invention

[0008] According to the present invention, it is possible to provide a stage device that is advantageous for transferring a substrate from a substrate chuck to a pin.

Brief Description of the Drawings

[0009]

Figure 1

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Embodiments for Carrying Out the Invention

[0010] Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that the following embodiments do not limit the invention according to the claims. Although a plurality of features are described in the embodiments, not all of these plurality of features are essential for the invention, and the plurality of features may be arbitrarily combined. Further, in the drawings, the same or similar configurations are denoted by the same reference numerals, and duplicate explanations are omitted.

[0011] In the present specification and drawings, basically, directions are indicated by an XYZ coordinate system in which the vertical direction is the Z-axis and the horizontal plane perpendicular to the vertical direction is the XY plane, with each axis being orthogonal to each other. However, when an XYZ coordinate system is described in each drawing, that coordinate system takes precedence.

[0012] Hereinafter, in each embodiment, a specific configuration will be described.

[0013] <First Embodiment> FIG. 1 is a schematic diagram showing the configuration of a substrate processing apparatus 1 in the present embodiment. In the present embodiment, the substrate processing apparatus 1 is a projection exposure apparatus that exposes a pattern of a reticle (mask, reticle) onto a substrate through a projection optical system by a step-and-repeat method or a step-and-scan method. However, the substrate processing apparatus 1 is not limited to a projection exposure apparatus. For example, the substrate processing apparatus 1 may be a drawing apparatus that draws on a substrate with an electron beam, an ion beam, etc. to form a pattern on the substrate. Further, the substrate processing apparatus 1 may be another lithography apparatus (substrate exposure apparatus), for example, an imprint apparatus that forms a pattern on a substrate by molding an imprint material on the substrate with a mold. Alternatively, the substrate processing apparatus 1 may be another apparatus that processes a substrate such as a semiconductor wafer or a glass plate, such as an ion implantation apparatus, a developing apparatus, an etching apparatus, a film forming apparatus, an annealing apparatus, a sputtering apparatus, or a vapor deposition apparatus. Further, the substrate processing apparatus 1 may be a planarization apparatus that planarizes a composition on a substrate using a flat plate.

[0014] The substrate processing apparatus 1 includes an illumination optical system 12 that irradiates light, a projection optical system 15, a reticle stage 14 that holds a reticle 13, and a stage device 100 that can hold a substrate 2. The stage device 100 further includes a substrate chuck (chuck plate) 3, a drive unit (fine movement stage) 4, a surface plate 5, a control unit 11, an exhaust line 7, a pressure adjustment unit 8, and a measurement unit 20. The control unit 11 controls the driving of the stage device 100. However, the control unit 11 may not only control the stage device 100 but also control each part of the substrate processing apparatus 1. The exhaust line 7 connects a pin, which will be described later, and the pressure adjustment unit 8. The pressure adjustment unit 8 adjusts the pressure by exhausting gas through the exhaust line 7, and by adjusting this pressure, the pin adsorbs and holds the substrate 2. In this embodiment, an example where the stage device 100 has a pressure adjustment unit 8 is shown, but as long as the pressure for adsorbing the substrate 2 to the pin can be adjusted, a configuration where the stage device 100 does not have a pressure adjustment unit 8 may also be used.

[0015] The reticle 13 is an original plate in which a pattern (e.g., a circuit pattern) to be transferred onto the surface of, for example, quartz glass is formed of chromium. The substrate 2 is, for example, single crystal silicon, and when the substrate processing apparatus 1 is an exposure apparatus, the substrate 2 transported to the substrate processing apparatus 1 has a photosensitive material (resist) applied on its surface. Here, the illumination optical system 12 is a pattern forming unit that forms a pattern on the substrate 2. In this embodiment, an example of a lithography apparatus that forms a pattern using light is shown, and the pattern forming unit is the illumination optical system 12, but it may also be a lithography apparatus that cures a thermosetting material by heat. In that case, the pattern forming unit is, for example, a heating unit that heats the thermosetting material.

[0016] In the substrate processing apparatus 1, exposure light from a light source (not shown) illuminates a reticle 13 held on a reticle stage 14 via an illumination optical system 12. The light transmitted through the reticle 13 is irradiated onto a substrate 2 via a projection optical system 15. At this time, light from the pattern formed on the reticle 13 is imaged on the surface of the substrate 2. The substrate processing apparatus 1 thus exposes the shot regions on the substrate 2, and performs exposure in the same manner for each of the plurality of shot regions.

[0017] When the substrate processing apparatus 1 is a substrate exposure apparatus of the step-and-scan method, by driving the drive unit (fine movement stage) 4, the operation of stepping to each shot area on the substrate 2 and the operation of scanning are repeated. Further, the drive unit (fine movement stage) 4 can also move in the Z-axis direction and tilt direction, and is driven under the control of the control unit 11. Further, the stage device 100 has a measurement unit 20 that measures the position of the drive unit 4. In the present embodiment, the measurement unit 20 measures the position of the drive unit (fine movement stage) 4 by the laser reflected by the bar mirror 22 from the laser interferometer 21. The bar mirror 22 for reflecting the laser beam from the laser interferometer 21 is provided at the end of the drive unit (fine movement stage) 4, and one bar mirror 22 is arranged at a position along the X-axis direction and the Y-axis direction, respectively. At least one or more laser interferometers 21 are arranged at positions corresponding to the bar mirrors 22 arranged in the X-axis direction and the Y-axis direction, respectively. The position in the X direction and the position in the Z direction of the drive unit (fine movement stage) 4 are measured by the bar mirror 22 arranged at the position along the X-axis direction and the laser interferometer 21 arranged corresponding thereto. Then, the position in the Y direction and the position in the Z direction of the drive unit (fine movement stage) 4 are measured by the bar mirror arranged at the position along the Y-axis direction and the laser interferometer arranged corresponding thereto. Here, in the present embodiment, an example in which the position in the Z direction is measured by the bar mirror 22 arranged along each of the X-axis direction and the Y-axis direction and the laser interferometer 21 arranged at a position corresponding to each bar mirror 22 is shown. However, a form in which the position in the Z direction is measured in either one of the bar mirrors 22 arranged along each of the X-axis direction and the Y-axis direction may be adopted, or a new measurement unit for measuring the position in the Z direction may be provided. In FIG. 1, the bar mirror and the laser interferometer for measuring the position in the Y direction are not shown. Here, in the present embodiment, an example in which the bar mirror 22 is provided at the end of the drive unit (fine movement stage) 4 is shown, but the bar mirror 22 may be provided on the substrate chuck 3. Further, in the present embodiment, a method of measuring the position of the drive unit (fine movement stage) 4 by the laser interferometer 21 is shown, but the position of the drive unit 4 may be measured by an encoder, and the measurement method of the drive unit 4 is not particularly limited.In addition, in the case where the pin 6 moves due to the driving of the driving unit (including the movement of the tip of the pin 6 due to elongation), the measuring unit may measure the position of the pin 6.

[0018] FIG. 2 shows the configuration of the control unit 11 in the present embodiment. The control unit 11 includes an instruction unit 110, a storage unit 120, and an information processing unit 130. The instruction unit 110 controls each part. The functions of the storage unit 120 and the information processing unit 130 will be described later. In the present embodiment, an example in which the control unit 11 includes the storage unit 120 and the information processing unit 130 is shown, but the storage unit 120 and the information processing unit 130 may be provided separately from the control unit 11.

[0019] FIG. 3 is a view of the stage device 100 in the present embodiment as seen from the projection optical system 15 side (+Z direction side). In the substrate chuck 3 of the present embodiment, an annular seal portion is provided at a position along the outer periphery of the substrate chuck 3. Note that the substrate chuck 3 may not be provided with a seal portion, and there may be a plurality of seal portions. The presence, number, and arrangement of the seal portions are not limited to the example of FIG. 3.

[0020] A plurality of protrusions (not shown) are provided on the holding surface of the substrate chuck 3, and these plurality of protrusions can serve as a holding surface for holding the substrate 2. The substrate chuck 3 has a plurality of suction holes (not shown), and by exhausting the gas between the substrate 2 and the substrate chuck 3 from the suction holes, the substrate chuck 3 adsorbs and holds the substrate 2. Note that the exhaust from the plurality of suction holes may be performed by the pressure adjustment unit 8. In addition, the pressure in the space between the substrate 2 and the substrate chuck 3 when the substrate chuck 3 adsorbs the substrate 2 is measured by a pressure sensor (not shown), and the exhaust of the gas in the suction holes of the substrate chuck 3 is adjusted based on the measured pressure value.

[0021] The surface plate 5 is provided with pins 6 having a hollow structure. The surface plate 5 is also provided with an exhaust line 7, and the exhaust line 7 connects the pin 6 and the pressure adjustment unit 8. In the example of FIG. 3, the pressure adjustment unit 8 is arranged outside the surface plate 5, but the pressure adjustment unit 8 may be arranged inside the surface plate 5. The substrate chuck 3 and the drive unit (fine movement stage) 4 are provided with through holes (holes) 30 through which the pins 6 can protrude from the holding surface of the substrate chuck 3. In this embodiment, an example in which there are three pins 6 is shown, but the number of pins 6 is not particularly limited as long as the substrate 2 can be adsorbed and held. The bar mirrors 22 are arranged one by one along the X-axis direction and the Y-axis direction, and two laser interferometers 21 are arranged at positions corresponding to the respective bar mirrors 22.

[0022] FIG. 4 is a diagram showing a cross-sectional view of the stage device 100 in this embodiment. Note that FIG. 4 shows the cross-section A-A' of FIG. 3. In the example of FIG. 4, the drive unit (fine movement stage) 4 moves in the Z-axis direction along the pin 6. The drive unit 4 can move in the Z-axis direction while tilting corresponding to the Z position relationship of the three pins 6.

[0023] In FIG. 4(a), the drive unit 4 is located on the +Z direction side, and the substrate chuck 3 holds the substrate 2. In FIG. 4(b), when the drive unit 4 moves in the -Z direction, the pin 6 and the substrate 2 come into contact, and the drive unit 4 stops moving. At this time, the adsorption of the substrate chuck 3 to the substrate 2 is released, the pressure adjustment unit 8 starts pressure adjustment, and the pin 6 adsorbs and holds the substrate 2. Then, in the state where the pin 6 adsorbs and holds the substrate 2 as shown in FIG. 4(c), the drive unit 4 further moves in the -Z direction. In this way, the substrate chuck 3 transfers the substrate 2 to the pin 6. By the operation of FIG. 4(c), a gap is generated between the substrate chuck 3 and the substrate 2, and a transfer hand (not shown) is inserted into this gap, whereby the substrate 2 is carried out from the stage device 100.

[0024] Here, in FIG. 4, an example is shown in which the driving unit (fine movement stage) 4 moves, and the pin 6 adsorbs and holds the substrate 2. However, it is sufficient that the relative positions of the substrate chuck 3 and the pin 6 can be changed. A form in which the entire or the tip of the pin 6 moves in the Z direction by the driving unit may also be used. Changing the relative positions of the substrate chuck 3 and the pin 6 is synonymous with relatively moving the substrate chuck 3 and the pin 6, and it is sufficient that the driving unit can relatively move the substrate chuck 3 and the pin 6. FIG. 5 is a cross-sectional view of the stage device 100 in the present embodiment, showing an example in which the pin 6 is driven by the driving unit to extend, the tip of the pin 6 moves, and the pin 6 adsorbs and holds the substrate 2. In the present embodiment, the movement of the tip position of the pin 6 by the driving unit may be expressed as the movement of the pin 6.

[0025] In FIG. 5(a), the tip portion of the pin 6 on the +Z direction side is located on the -Z direction side and is not in contact with the substrate 2. In this state, the substrate chuck 3 holds the substrate 2. In FIG. 5(b), as the pin 6 extends in the +Z direction, the pin 6 and the substrate 2 come into contact. The pin 6 stops extending at the position where it contacts the substrate 2, the adsorption of the substrate chuck 3 to the substrate 2 is released, the pressure adjustment unit 8 starts pressure adjustment, and the pin 6 adsorbs and holds the substrate 2. Then, in the state where the pin 6 adsorbs and holds the substrate 2 as shown in FIG. 5(c), the pin 6 further extends in the +Z direction. In this way, the substrate chuck 3 transfers the substrate 2 to the pin 6. By the operation of FIG. 5(c), a gap is generated between the substrate chuck 3 and the substrate 2, and a transfer hand (not shown) is inserted into this gap, so that the substrate 2 is carried out from the stage device 100. Note that in FIG. 5, an example is shown in which the pin 6 receives the substrate 2 from the substrate chuck 3 by extending, but a form in which the entire pin 6 moves in the Z direction by the driving unit may also be used. Further, the driving unit may be included in the pin 6, or the driving unit and the pin 6 may be connected.

[0026] As shown in FIGS. 4 and 5, the control unit 11 controls the driving of a driving unit capable of moving the substrate chuck 3 or the pins 6 so as to separate the substrate 2 from the substrate chuck 3 by the relative movement between the substrate chuck 3 and the pins 6. Note that the control of the driving unit that drives the substrate chuck 3 or the pins 6 is performed based on a first condition related to the adsorption force (remaining adsorption force) between the substrate 2 and the substrate chuck 3, which will be described later. The first condition is also a condition related to the ease of separation when separating the substrate 2 from the substrate chuck 3. More specifically, the control unit 11 controls based on a second condition related to the relative movement (change in relative position) between the substrate chuck 3 and the pins 6 when delivering the substrate 2 to the pins 6, based on the first condition. Delivering the substrate 2 to the pins 6 is synonymous with separating the substrate 2 from the substrate chuck 3. The second condition is related to at least one of the acceleration, speed, or amount of movement of the substrate chuck 3 or the pins 6 moved by the driving unit when relatively moving the substrate chuck 3 and the pins 6, and the standby time before separating the substrate 2 from the substrate chuck 3.

[0027] FIG. 6 is a diagram showing the relationship between time and the position of the driving unit (fine movement stage) 4 in the Z direction when delivering the substrate 2 from the substrate chuck 3 to the pins 6. Note that the amount of change in the position of the driving unit (fine movement stage) 4 in the Z direction is the same as the amount of change in the position of the substrate chuck 3 in the Z direction. In the first section, using the first position stored in the storage unit 120 as the target position, the instruction unit 110 controls the driving unit (fine movement stage) 4 to move at high speed in the -Z direction. When the driving unit (fine movement stage) 4 is driven in the -Z direction, the first position is set to be a position on the +Z direction side or the same position as the position of the driving unit (fine movement stage) 4 in the Z direction when the substrate 2 and the pins 6 come into contact.

[0028] Here, in the description of FIG. 6, an example where the driving unit (fine movement stage) 4 moves in the -Z direction was shown. However, even when the driving unit that drives the pin 6 moves the entire pin 6 or the tip portion thereof in the +Z direction, since only the moving direction is different, the -Z direction in the description of FIG. 6 can be replaced with the +Z direction and applied. For the figures and descriptions to be described later, even when the driving unit that drives the pin 6 moves the entire pin 6 or the tip portion thereof in the +Z direction, the -Z direction can be replaced with the +Z direction and applied. Here, in the description regarding FIG. 6 and the figures to be described later, the description of moving the driving unit in the Z direction may be replaced with the description of moving the substrate chuck 3 or the pin 6 by the driving unit, and further may be replaced with the description of relative movement between the substrate chuck 3 and the pin 6.

[0029] In the second section, the driving unit 4 is moved slowly in the -Z direction, and the drive current value during the driving of the driving unit 4 is monitored. By monitoring the drive current value when the driving unit 4 is moved in the -Z direction, the drive current value that changes when the substrate 2 and the pin 6 come into contact is detected, and it is detected that the substrate 2 and the pin 6 have come into contact.

[0030] Here, the reason for moving the driving unit 4 slowly in the second section is that if the substrate 2 is brought into contact with the pin 6 at high speed, there is a possibility of damaging the substrate 2 and the pin 6. When it is detected by monitoring the drive current value that the pin 6 and the substrate 2 have come into contact, the movement of the driving unit 4 in the -Z direction is stopped, and the second section is ended. Incidentally, when it is detected that the pin 6 and the substrate 2 have come into contact in the second section, the information on the first position stored in the storage unit 120 may be updated with the position of the driving unit 4 in the Z direction at that time as the first position. By updating the first position in this way, the time required for the second section can be reduced.

[0031] Also, when the coordinates of the drive unit 4 when the first position, the substrate 2, and the pin 6 are in contact are the same, the substrate 2 and the pin 6 are in contact at the time when the first position is reached. In this case, in order to detect that the substrate 2 and the pin 6 are in contact due to the drive current value simultaneously with the start of the second section, the drive unit 4 is shifted to the third section without moving at a low speed in the second section. If it is known in advance that the coordinates of the drive unit 4 when the first position, the substrate 2, and the pin 6 are in contact are the same, the second section may be omitted and the operation of the third section may be performed after the first section.

[0032] In the third section, the suction of the gas between the substrate 2 and the substrate chuck 3 is stopped. In parallel with this, the suction of the gas between the substrate 2 and the pin 6 by the pin 6 is started. That is, the third section is a suction switching section.

[0033] The fourth section is a standby section that waits until the pressure changed by adsorption in the space between the substrate chuck 3 and the substrate 2 reaches atmospheric pressure. This standby section is the time from after the stop of gas suction between the substrate 2 and the substrate chuck 3 until the relative movement between the substrate chuck 3 and the pin 6 starts when the driving unit drives the substrate chuck 3 or the pin 6 to separate the substrate chuck 3 from the substrate 2. Here, even if waiting for a certain period of time to make the pressure changed by adsorption in the space between the substrate chuck 3 and the substrate 2 equal to atmospheric pressure in the fourth section, the pressure in the space between the substrate chuck 3 and the substrate 2 may not change to atmospheric pressure. This can occur, for example, due to poor pressure release or the characteristics of the substrate chuck 3 or the substrate 2. In this embodiment, when the pressure in the space between the substrate chuck 3 and the substrate 2 does not change to atmospheric pressure and the adsorption force (adsorption pressure) remains when the substrate chuck 3 holds the substrate 2 by adsorption, the pressure difference from atmospheric pressure is defined as the residual adsorption force. The residual adsorption force is related to the ease of separation when separating the substrate 2 from the substrate chuck 3. Due to this residual adsorption force, even if the pressure reduction for the substrate chuck 3 to hold the substrate 2 by adsorption is stopped, the substrate 2 and the substrate chuck 3 are in a state where they are difficult to separate. This phenomenon is also called ringing. The characteristics of the substrate chuck 3 or the substrate 2 are, for example, the warpage amount of the substrate 2, the surface roughness of the substrate 2 or the substrate chuck 3, and the flatness of the substrate chuck 3. For example, when neither the roughness of the back surface of the substrate 2 nor the roughness of the surface of the substrate chuck 3 that holds the substrate 2 is rough, the substrate 2 and the substrate chuck 3 adhere firmly. As a result, the substrate 2 and the substrate chuck 3 are in a state where they are difficult to separate. Here, a state with a high residual adsorption force is synonymous with a state with low ease of separation when separating the substrate 2 from the substrate chuck 3.

[0034] Therefore, in the fifth section, the drive unit 4 is moved in the -Z direction at a low speed to separate the substrate 2 and the substrate chuck 3 by a minute distance. If the drive unit 4 is moved in the -Z direction at a high speed to forcibly separate the substrate 2 and the substrate chuck 3 while there is residual adsorption force, the substrate 2 will shift horizontally or the like on the substrate chuck 3, which will cause the substrate chuck 3 to wear. The wear of the substrate chuck 3 will affect the subsequent adsorption and holding of the substrate 2. Therefore, in order to reduce the wear of the substrate chuck 3, in the fifth section, the drive unit 4 is moved in the -Z direction at a low speed to reduce the occurrence of horizontal displacement or the like of the substrate 2 due to the residual adsorption force. In the sixth section, the drive unit 4 is moved in the -Z direction at a high speed to the final position in the Z direction.

[0035] As described above, the control unit 11 controls the speed of the substrate chuck 3 or the pin 6 that is moved by the drive unit to be low speed in the fifth section and higher speed than the fifth section in the sixth section. In other words, the control unit 11 controls the speed of the substrate chuck 3 or the pin 6 that is moved by the drive unit to increase from low speed to high speed. This may also be achieved by increasing the acceleration. That is, the control unit 11 controls the acceleration or speed of the substrate chuck 3 or the pin 6 when separating the substrate 2 and the substrate chuck 3 according to the distance between the substrate 2 and the substrate chuck 3.

[0036] Here, if the standby time in the fourth section, the acceleration, speed, and amount of movement of the substrate chuck 3 and the pin 6 that relatively move by the drive unit in the fifth section are made constant and processing is executed under the same conditions for all substrates, wear may occur on the substrate chuck 3. This is because the residual adsorption force is affected by the characteristics of the substrate 2 and the substrate chuck 3. For example, for a substrate with characteristics that make it easy for the residual adsorption force to occur, the possibility of causing wear on the substrate chuck 3 can be reduced by increasing the standby time in the fourth section. This can also reduce the possibility of causing wear on the substrate chuck 3 by decreasing the acceleration in the fifth section (relative movement), decreasing the speed in the fifth section (relative movement), or increasing the amount of movement in the fifth section (relative movement). On the other hand, for a substrate with characteristics that make it difficult for the residual adsorption force to occur, the standby time in the fourth section is shortened, the acceleration in the fifth section (relative movement) is increased, the speed in the fifth section (relative movement) is increased, and the amount of movement in the fifth section (relative movement) is decreased. As a result, the substrate can be transferred from the substrate chuck 3 to the pin 6 in a short time without causing wear on the substrate chuck 3. That is, the substrate can be transferred from the substrate chuck 3 to the pin 6 in a highly productive state. Therefore, an object of the present embodiment is to provide a stage device 100 capable of transferring the substrate from the substrate chuck 3 to the pin 6 under conditions according to the adsorption force (residual adsorption force, ease of separation) between the substrate 2 and the substrate chuck 3 after the adsorption to the substrate 2 is stopped.

[0037] FIG. 7 is a diagram showing the relationship between time and the Z deviation in the present embodiment. In the present embodiment, time D1 is the start time of the fifth section (the end time of the fourth section), and time D2 is the end time of the fifth section (the start time of the sixth section). The Z deviation is the difference between the target position in the Z direction (driving direction) of the driving unit 4 when the instruction unit 110 instructs the driving unit 4 to move in the Z direction and the actual position in the Z direction of the driving unit 4 measured by the measuring unit 20. When the measuring unit measures the position of the substrate chuck 3, the Z deviation is the difference between the target position in the Z direction (driving direction) of the substrate chuck 3 and the actual position measured by the measuring unit. When the measuring unit measures the position of the pin 6, the Z deviation is the difference between the target position in the Z direction (driving direction) of the pin 6 and the actual position measured by the measuring unit. In the present embodiment, the driving unit is controlled based on the Z deviation (first condition) acquired in advance.

[0038] As described above, when the driving unit 4 is moved in the -Z direction at a low speed in the fifth section after waiting in the fourth section, the substrate 2 and the substrate chuck 3 are in a state where they are difficult to separate due to the residual adsorption force. As a result, the driving unit cannot move to the target position instructed by the instruction unit 110 (the substrate chuck 3 or the pin 6 cannot be moved to the target position), and the target position and the actual position in the Z direction are different, resulting in a Z deviation. The information processing unit 130 calculates the Z deviation, which is the difference between the target position in the Z direction of the driving unit 4 or the substrate chuck 3 or the pin 6 and the actual position in the Z direction measured by the measuring unit 20. The Z deviation has a waveform as shown in FIG. 7, for example.

[0039] In the present embodiment, the absolute value of the Z deviation value when the acquired Z deviation becomes the maximum value or the minimum value is defined as the representative Z deviation value (first condition). This maximum value or minimum value is the maximum value or minimum value among the representative Z deviation values (Z deviations) from when the substrate 2 and the pin 6 come into contact until the entire surface of the substrate 2 separates from the substrate chuck 3. The information processing unit 130 obtains the absolute value of the Z deviation value when the Z deviation becomes the maximum or minimum in the waveform of the acquired Z deviation, and stores that value in the storage unit 120 as the representative Z deviation value.

[0040] The instruction unit 110 instructs the driving operation of the driving unit when moving the substrate chuck 3 or the pins 6 for the next substrate based on the Z deviation representative value stored in the memory unit 120. FIG. 8 is a diagram showing the relationship between time and the position of the driving unit (fine movement stage) 4 in the Z direction when the substrate 2 is transferred from the substrate chuck 3 to the pins 6 in this embodiment. When instructing (controlling) the driving unit to drive, the instruction unit 110 controls based on a second condition based on a first condition (Z deviation representative value) related to the ease of separation stored in the memory unit 120. Specifically, the control of the second condition means controlling at least one of the waiting time in the fourth section, the acceleration or speed in the fifth section, and the movement amount in the fifth section of the member (substrate chuck 3 or pins 6) whose position is changed by the driving unit. The movement amount in the fifth section is the amount of movement of the substrate chuck 3 or the pins 6 from when the pins 6 come into contact with the substrate 2 until the substrate chuck 3 or the pins 6 are moved at a predetermined speed when separating the substrate 2 from the substrate chuck 3. The predetermined speed is the speed at which the substrate chuck 3 or the pins 6 move at high speed in the sixth section.

[0041] For example, a case where the suction force (residual suction force) is large, that is, a case where the Z deviation representative value is large, will be described. In other words, a case where the suction force (residual suction force) is large is a case where the ease of separation is low. In this case, the difference between the target position and the actual position in the Z direction of the driving unit (fine movement stage) 4, the substrate chuck 3, or the pins 6 becomes large. Therefore, the waiting time in the fourth section may be lengthened, or the acceleration in the fifth section (relative movement) may be reduced, or the speed in the fifth section (relative movement) may be slowed, or the amount of movement in the fifth section (relative movement) may be increased. The influence of the residual suction force may be reduced by adjusting one of the waiting time in the fourth section, the acceleration or speed in the fifth section, and the amount of movement in the fifth section, or the influence of the residual suction force may be reduced by adjusting multiple conditions.

[0042] On the other hand, when the adsorption force (residual adsorption force) is small, the opposite adjustment may be made to the case where the above-mentioned adsorption force (residual adsorption force) is large. In other words, when the adsorption force (residual adsorption force) is small, it means that the ease of separation is high. When the adsorption force is small, that is, when the representative value of the Z deviation is small, the waiting time in the fourth section is shortened, or the acceleration in the fifth section (relative movement) is increased, or the speed in the fifth section (relative movement) is increased, or the movement amount in the fifth section (relative movement) is decreased. By controlling in this way, the time taken for the fourth section or the fifth section can be shortened, and the productivity can be improved. The determination of the second condition based on the first condition in the present embodiment may be made by the information processing unit 130 performing calculations based on the first condition for the second condition to be adjusted. Further, the type and amount of the condition to be adjusted may be learned and adjusted by the instruction unit 110. That is, the control unit 11 may also learn based on the information when the substrate 2 was separated from the substrate chuck 3 in the past, and determine the second condition when separating the next substrate from the substrate chuck 3 based on the learning result.

[0043] Here, control based on the representative Z deviation value will be described. For example, if it is between the same lots, the characteristics of the substrates often tend to be similar. Therefore, the representative Z deviation value may be obtained for the first substrate of the lot, and the driving of the driving unit within the same lot may be controlled based on the representative Z deviation value. Alternatively, the representative Z deviation value may be obtained for all substrates, and the operation of the driving unit may be controlled based on the representative Z deviation value of the substrate processed immediately before. Alternatively, when the representative Z deviation value obtained for all substrates is larger than the representative Z deviation value stored in the storage unit 120, the representative Z deviation value stored in the storage unit 120 may be updated. Alternatively, the operation of the driving unit may be controlled based on the maximum value of the representative Z deviation values of the substrates processed in the past. The substrates processed in the past are, for example, the substrates processed in the past of the same lot, or the substrates processed in the past with the same processing conditions in the previous process. Alternatively, a plurality of substrates from one before the predetermined number of substrates to be processed next to the substrate processed immediately before, or substrates every predetermined number from one before the predetermined number of substrates to be processed next. Substrates every predetermined number from one before the predetermined number of substrates to be processed next are, for example, when calculating the representative Z deviation value for every 5 substrates, the substrate processed 15 substrates before the substrate to be processed next, the substrate processed 10 substrates before, and the substrate processed 5 substrates before. The operation of the driving unit may be controlled based on the representative Z deviation values of these substrates. That is, the representative Z deviation value may be obtained continuously or discontinuously, and the representative Z deviation value based on which the instruction unit 110 controls the operation of the driving unit may be one or a plurality. When based on the representative Z deviation values of a plurality of substrates, the driving unit is controlled based on the maximum representative Z deviation value among the representative Z deviation values of the plurality of substrates or the average value of the representative Z deviation values of the plurality of substrates. In the present embodiment, it is to control based on the first condition (Z deviation, representative Z deviation value). More specifically, it is to control based on the second condition related to the relative movement between the substrate chuck 3 and the pin 6 based on the first condition.

[0044] Also, when the instruction unit 110 controls the driving unit based on a plurality of representative Z deviation values, the representative Z deviation values may be weighted by the information processing unit 130. The weighting may be in a form such that, for example, the past substrates processed closer to the time of the substrate to be processed in the future have a larger weighting amount. This is because substrates processed closer to the time of the substrate to be processed in the future are more likely to have characteristics similar to those of the substrate to be processed. Alternatively, the weighting may be performed by reflecting the learning results of learning using AI, machine learning, or the like.

[0045] The weighting is performed, for example, by multiplying the weighting coefficient used for weighting by the representative Z deviation value. The driving unit may be controlled based on the result of adding up the weighted representative Z deviation values. Alternatively, depending on the weighting method, the driving unit may be controlled based on the maximum value among the weighted representative Z deviation values (Z deviations) of the plurality of substrates or the average value of the representative Z deviation values of the plurality of substrates. Note that the weighting method is not limited to the above, and may be implemented, for example, by the root mean square (RMS).

[0046] Here, in this embodiment, an example of controlling the operation of the driving unit based on the Z deviation between time D1 and time D2 is shown. However, the driving unit may be controlled based on the Z deviation (first condition) in at least a part of the interval from the first interval to the fourth interval or the sixth interval. For example, when controlling the driving unit based on at least a part of the interval from the first interval to the fourth interval, the driving unit can be controlled based on the data of the substrate to be processed itself, rather than based on the substrates processed in the past.

[0047] In addition, in this embodiment, as the first condition, an example is shown in which the Z deviation when the driving unit is moved in the Z direction is used to control the driving unit based on this Z deviation. However, the first condition is not limited to the Z deviation (Z deviation representative value). For example, the first condition may be the X deviation (X deviation representative value) which is the deviation in the X direction, or the Y deviation (Y deviation representative value) which is the deviation in the Y direction. Alternatively, when separating the substrate 2 and the substrate chuck 3, the driving unit may be controlled based on the driving current value flowing through the driving unit when the driving unit for moving the substrate chuck 3 or the pin 6 drives. This utilizes the fact that when the residual adsorption force is large, that is, when the ease of separation is low, the required driving current value becomes large. The value when this driving current value reaches its maximum can be used instead of the Z deviation representative value. Alternatively, a load sensor may be arranged on a part of the driving unit, the pin 6, or the substrate chuck 3, and the driving unit may be controlled based on the measured value of the load applied to the member on which the load sensor is arranged when separating the substrate 2 and the substrate chuck 3. When the ease of separation when separating the substrate 2 and the substrate chuck 3 is low, the value of the load sensor is affected by the residual adsorption force and becomes large. The value when the value output by this load sensor reaches its maximum can be used instead of the Z deviation representative value. Alternatively, the pressure in the space between the substrate chuck 3 and the substrate 2 may be measured, and the driving unit may be controlled based on the measurement result. The value when the difference between the measurement result of this pressure and the atmospheric pressure reaches its maximum can be used instead of the Z deviation representative value. Alternatively, the driving unit may be controlled based on a value related to the controllability in at least a part of the sections from the first section to the fourth section, for example, a deviation or a driving current value in at least a part of the sections from the first section to the fourth section. Alternatively, the operation of the driving unit may be determined in advance based on the characteristics of the substrate chuck 3 and the substrate 2. That is, the operation of the driving unit may be determined in advance from conditions such as the warpage amount of the substrate 2, the surface roughness of the substrate 2 or the substrate chuck 3, and the flatness value of the substrate chuck 3, which are the characteristics of the substrate chuck 3 and the substrate 2. The determination of the operation of the driving unit from the characteristics of the substrate chuck 3 and the substrate 2 is performed by an information processing device provided inside or outside the substrate processing device 1 different from the information processing unit 130 or the control unit 11. The above-mentioned conditions may be used as the first condition.

[0048] FIG. 9 is a flowchart of the substrate transfer method in this embodiment. First, an adsorption step (S210) of adsorbing and holding the substrate 2 on the holding surface of the substrate chuck 3 is performed, and a forming step (S220) of forming a pattern on the substrate 2 adsorbed and held in the adsorption step is performed.

[0049] Next, after the forming step, a transfer step (S230) of transferring the substrate 2 adsorbed and held by the substrate chuck 3 from the substrate chuck 3 to the pin 6 is performed by the relative movement between the pin 6 and the substrate chuck 3. Here, in the transfer step, the control unit 11 controls based on a first condition related to the ease of separation when separating the substrate 2 and the substrate chuck 3. More specifically, it controls based on a second condition related to the relative movement between the substrate chuck 3 and the pin 6 based on the first condition. Note that the pin 6 is configured to be able to protrude from the holding surface through the hole 30 provided in the substrate chuck 3 and adsorb and hold the substrate 2.

[0050] According to this embodiment, by controlling the drive of the drive unit for relative movement between the substrate chuck 3 and the pin 6 in consideration of the ease of separation when separating the substrate 2 and the substrate chuck 3, it is possible to reduce the wear of the substrate chuck 3 while maintaining high productivity. Therefore, the stage device 100 of this embodiment is advantageous for transferring the substrate 2 from the substrate chuck 3 to the pin 6.

[0051] <Second Embodiment> In this embodiment, the method for determining the second condition is different from that of the first embodiment. In this embodiment, the control unit 11 controls the drive unit based on a second condition associated with a range of preset representative Z deviation values by comparing the representative Z deviation value calculated by the information processing unit 130 with the range of the preset representative Z deviation values.

[0052] FIG. 10 is an example of a table of the second condition associated with the first condition in the present embodiment. In the present embodiment, the first condition is the representative value of the Z deviation, and the representative value of the Z deviation is divided into four ranges. Then, r1, r2, and r3 are set as the threshold values of the representative value of the Z deviation. For example, the case where the representative value of the Z deviation is less than r1 will be described. In this case, the instruction unit 110 controls the drive unit based on the speed V1 in the fifth section, the movement amount H1 in the fifth section, the acceleration A1 in the fifth section, and the times t11, t12, t13, and t14 related to the acceleration in the fifth section. Note that the speed, movement amount, acceleration, and time related to the acceleration in the fifth section are the second conditions. In addition, in the example of FIG. 10, only the second condition in the fifth section is shown as a preset example, but the standby time in the fourth section may be preset as the second condition.

[0053] FIG. 11 is an example of the movement of the drive unit in the Z direction in the present embodiment. When controlling based on the second condition associated with the range including the representative value of the Z deviation, a waveform as shown in FIG. 11 can be obtained. Note that the maximum acceleration described in FIG. 11 is the acceleration (A1 or A2 or A3 or A4) described in the table of FIG. 10. And the time J1 is the time to start accelerating in the -Z direction, and accelerates to the maximum acceleration in the -Z direction. When the maximum acceleration is reached, a constant acceleration is obtained, and the acceleration changes in a direction approaching 0 from the time J2 when the acceleration changes so that the acceleration becomes 0. And the acceleration is 0 until the time J3. Then, the acceleration in the +Z direction is started from the time J3, and when the maximum acceleration in the +Z direction is reached, a constant acceleration is obtained, and the acceleration changes in a direction approaching 0 from the time J4 when the acceleration changes so that the acceleration becomes 0. The above-described times t11, t12, t13, and t14 correspond to, for example, the times J1, J2, J3, and J4. Note that the time related to the acceleration is not limited to this example.

[0054] Based on the first condition in this way, by the control unit 11 performing control based on the set of second conditions selected from among a plurality of preset sets of second conditions, it is possible to omit the calculation (computation) for each of the plurality of conditions. In this embodiment, the speed, the moving amount, the acceleration, and the time related to the acceleration are each preset. However, the preset conditions may include any one or more of these, and the examples of the conditions are not limited to this example. Also, in the example of FIG. 10, the time related to the acceleration is set in four stages, but the time related to the acceleration does not have to be four stages.

[0055] Here, in this embodiment, as the first condition, the Z deviation (Z deviation representative value) is used, and an example of selecting the second condition in the Z direction from among a plurality of preset sets of conditions based on this Z deviation (Z deviation representative value) is shown. However, similar to the first embodiment, other values may be used for the first condition. For example, the first condition may be the X deviation (X deviation representative value) which is the deviation in the X direction, or the Y deviation (Y deviation representative value) which is the deviation in the Y direction. Alternatively, it may be based on the drive current value when the drive unit drives. Alternatively, a load sensor may be arranged on the substrate chuck 3 or the pin 6 or a part of the substrate chuck 3, and it may be based on the value from the load sensor. Alternatively, it may measure the pressure in the space between the substrate chuck 3 and the substrate 2 and be based on the measurement result. Alternatively, it may be based on a value related to the controllability in at least a part of the sections from the first section to the fourth section. Alternatively, it may be based on the characteristics of the substrate chuck 3 or the substrate 2. Conditions as described above may be used as the first condition.

[0056] <Third Embodiment> In this embodiment, the driving of the drive unit in the fifth section is different compared to the first embodiment. FIG. 12 is a diagram showing the relationship between the time and the position of the drive unit (fine movement stage) 4 in the Z direction when the substrate 2 in this embodiment is transferred from the substrate chuck 3 to the pin 6.

[0057] In this embodiment, the fifth section is divided into two sections, namely the fifth - 1 section and the fifth - 2 section, to control the second condition. Specifically, the control unit 11 controls the speed at which the substrate chuck 3 or the pin 6 moves due to the driving of the driving unit to be low speed in the fifth - 1 section and higher speed than that in the fifth - 1 section in the fifth - 2 section. In other words, the speed at which the substrate chuck 3 or the pin 6 moves due to the driving of the driving unit is controlled to be from low speed to high speed during the fifth section. In this embodiment, an example is shown where the driving unit 4 moves in the -Z direction to separate the substrate 2 and the substrate chuck 3, but a configuration where the whole or the tip of the pin 6 moves in the +Z direction due to the driving of the driving unit to separate the substrate 2 and the substrate chuck 3 may also be used.

[0058] When the substrate chuck 3 and the pin 6 are relatively moved by the driving unit in the fifth section after the fourth section which is the standby section, there may be a risk of residual adsorption force occurring as described above. That is, there may be a state where it is difficult to separate the substrate 2 and the substrate chuck 3 (the ease of separation is low). When reducing the influence of the residual adsorption force, it is preferable that the speed of the driving unit 4 in the -Z direction in the fifth section is slower. However, if the speed is reduced throughout the fifth section, the productivity will decrease. Therefore, in this embodiment, in the fifth - 1 section, which is the fifth section immediately after the fourth section where the influence of the residual adsorption force is the greatest, the driving unit 4 is moved in the -Z direction at a low speed (the first speed), and then in the subsequent fifth - 2 section, it is moved in the -Z direction at a second speed faster than the first speed. By dividing the fifth section into two sections in this way, moving at a low speed in the first section where the influence of the residual adsorption force is large, and then increasing the speed in the subsequent section, it is possible to reduce the influence of the residual adsorption force while suppressing the decrease in productivity. In this embodiment, an example of dividing the fifth section into two sections for control is shown, but the fifth section may be divided into three or more sections for control, and as long as it is two or more sections, it is possible to reduce the influence of the residual adsorption force while suppressing the decrease in productivity.

[0059] Note that, by combining the present embodiment and the second embodiment, the second condition in the Z direction of the drive unit may be selected from among a plurality of sets of conditions based on the first condition. For example, one set of the second conditions may be selected from among a plurality of sets of the second conditions based on the first condition, and the movement of the drive unit is controlled by the speed in the 5-1 section and the speed in the 5-2 section set in the selected set of the second conditions. Note that the first condition may be a Z deviation (Z deviation representative value), an X deviation (X deviation representative value), a Y deviation (Y deviation representative value), or a drive current value when the drive unit is driven. Alternatively, it may be a measured value of a load sensor disposed on the substrate chuck 3, the pin 6, or a part of the substrate chuck 3, or a pressure value in the space between the substrate chuck 3 and the substrate 2. Alternatively, it may be a value related to controllability in at least a part of the sections from the first section to the fourth section, characteristics of the substrate chuck 3 or the substrate 2, or the like. Thus, by combining the present embodiment and the second embodiment, it is not necessary to calculate each of the plurality of conditions.

[0060] <Fourth Embodiment> In the present embodiment, the control method of the drive unit in the fifth section is different from that in the first embodiment. FIG. 13 is a diagram showing the relationship between time and the position of the drive unit (fine movement stage) 4 in the Z direction when the substrate 2 is transferred from the substrate chuck 3 to the pin 6 in the present embodiment. In the present embodiment, the drive unit in the fifth section is controlled based on a target value (Z position) based on a cosine wave (cosine waveform). The movement amount and movement time in the fifth section can be determined by the second condition based on the first condition. The cosine wave is obtained based on the movement amount in the fifth section and the movement time in the fifth section.

[0061] Assuming that the initial position (first position) of the fifth section is 0, the start time of the fifth section is 0, the elapsed time from the start time of the fifth section is t, the movement amount in the fifth section is z, and the movement time in the fifth section is T, the cosine wave can be obtained from Equation (1).

[0062]

Equation

[0063] By controlling the driving unit based on a cosine waveform, the initial velocity in the fifth section becomes 0, so the influence of the residual adsorption force can be reduced. For example, the wear of the substrate chuck 3 can be reduced. Further, when the driving unit is controlled based on a cosine waveform, the driving of the driving unit becomes a single-frequency driving, so the generation of local vibrations such as vibrations of the substrate 2 can also be reduced.

[0064] <Fifth Embodiment> This embodiment is characterized in that the features of the first embodiment are applied in a form of two or more stages, for example, a twin-stage form. FIG. 14 is an example of the configuration of the twin stage in this embodiment. The twin stage includes a first stage 1000 and a second stage 2000. The first stage 1000 and the second stage 2000 move between a measurement space 500 for measuring alignment marks and an exposure space 600 for performing alignment based on the results measured in the measurement space 500 and performing exposure processing on each shot area. The first stage 1000 and the second stage 2000 have the same configuration as the stage described in the first embodiment. That is, the substrate is held by the substrate chuck 3, and the substrate is placed on the substrate chuck 3 or separated from the substrate chuck 3 by driving in the Z direction of the driving unit.

[0065] The detailed operation of the twin-stage form will be described. When the exposure process of the substrate held by the first stage 1000 in the exposure space 600 is completed, the first stage 1000 moves outside the exposure space 600. Then, the substrate for which the exposure process has been completed is transferred, and the substrate for which the exposure process is to be performed next is held. Then, it moves inside the measurement space 500. On the other hand, the second stage 2000 moves inside the exposure space 600 while holding the substrate on which the alignment marks have been measured in the measurement space 500. The alignment marks of the substrate held by the first stage 1000 that has moved to the measurement space 500 are measured. Then, the substrate held by the second stage 2000 that has moved to the exposure space 600 is aligned based on the measurement results of the alignment marks, and exposure processing is performed on each shot area.

[0066] In this embodiment, the operation of the drive unit that relatively moves the substrate chuck 3 and the pins 6 is controlled based on the first condition (second condition based on the first condition) in the first stage 1000 and the second stage 2000. Examples of the first condition include, for example, Z deviation (Z deviation representative value), X deviation (X deviation representative value), and Y deviation (Y deviation representative value). Alternatively, it may be the drive current value when the drive unit drives, or the measured value of the substrate chuck 3, the pins 6, or the load sensor disposed on the substrate chuck 3, or the measured value of the pressure in the space between the substrate chuck 3 and the substrate 2. Alternatively, it may be a value related to controllability in at least a part of the sections from the first section to the fourth section, or the characteristics of the substrate chuck 3 or the substrate 2.

[0067] In the first embodiment, the operation of the drive unit was controlled based on the first condition in one stage. As an example of this embodiment, the control unit 11 controls the operation in the Z direction of the drive unit that moves the substrate chuck 3 or the pins 6 for the first stage 1000 and the second stage 2000 according to the first condition (second condition based on the first condition) in the first stage 1000. With such a configuration, it is also possible to make the operations of both stages appropriate based on the information obtained from one stage and reduce the influence of the adsorption force (remaining adsorption force, ease of separation). Note that the present invention is not limited to the example of controlling the first stage 1000 and the second stage 2000 according to the first condition (second condition based on the first condition) in the first stage 1000. For example, only the first stage 1000 may be controlled according to the first condition (second condition based on the first condition) in the first stage 1000, or only the second stage 2000 may be controlled. Further, the stage may be controlled according to the first condition (second condition based on the first condition) in the second stage 2000.

[0068] As another example of this embodiment, each of the first stage 1000 and the second stage 2000 may be controlled according to the first condition (second condition based on the first condition) in each of the first stage 1000 and the second stage 2000. In this form, even when the characteristics are different for each stage, control can be performed according to the stage.

[0069] As another example of this embodiment, the first stage 1000 and the second stage 2000 may be controlled by the first condition (the second condition based on the first condition) of both the first stage 1000 and the second stage 2000. The residual adsorption force is often affected by the characteristics of the substrate, and the characteristics may vary from lot to lot. In such a case, the first conditions tend to be similar for the same lot. Therefore, the first stage 1000 and the second stage 2000 are controlled by the first condition (the second condition based on the first condition) obtained in both the first stage 1000 and the second stage 2000. That is, for example, when the first condition is the Z deviation (Z deviation representative value), the Z deviation Z1 is obtained at the first stage 1000, and when this value is the maximum at the current stage, it becomes the Z deviation representative value. Next, the Z deviation Z2 is obtained at the second stage 2000, and when this value is larger than the Z deviation Z1, the Z deviation representative value becomes Z2. The first stage 1000 and the second stage 2000 are controlled by the second condition based on this Z2.

[0070] By controlling as described above, even in the form of a twin stage, the relative movement between the substrate chuck 3 and the pin 6 can be controlled in consideration of the ease of separation when separating the substrate 2 and the substrate chuck 3. Thereby, it is possible to maintain high productivity while reducing the wear of the stage (substrate chuck).

[0071] <Sixth Embodiment> This embodiment is characterized by manufacturing an article using the above-described stage device.

[0072] FIG. 15 is a flowchart of a method for manufacturing an article in this embodiment. First, an adsorption step (S310) of adsorbing and holding the substrate 2 on the holding surface of the substrate chuck 3 is performed, and a forming step (S320) of forming a pattern on the substrate 2 adsorbed and held in the adsorption step is performed.

[0073] Next, after the forming step, a delivery step (S330) is performed to transfer the substrate 2 adsorbed and held by the substrate chuck 3 to the pin 6 by the relative movement between the pin 6 and the substrate chuck 3. Here, in the delivery step, the relative movement is performed based on a first condition related to the ease of separation when separating the substrate 2 and the substrate chuck 3. Note that the pin 6 is configured to be able to protrude from the holding surface through a hole 30 provided in the substrate chuck 3 and to be able to adsorb and hold the substrate 2. Then, a manufacturing step (S340) is performed to manufacture an article from the substrate 2 on which the pattern has been formed in the forming step.

[0074] Articles manufactured by this manufacturing method are, for example, semiconductor IC elements, liquid crystal display elements, color filters, MEMS, etc.

[0075] In the forming step, for example, a pattern is formed on a substrate (such as a silicon wafer or a glass plate) coated with a photosensitive material by exposing the substrate with an exposure apparatus (lithography apparatus).

[0076] The manufacturing step includes, for example, development of a substrate (photosensitive material) on which a pattern has been formed, etching and resist stripping on the developed substrate, dicing, bonding, and packaging. According to this manufacturing method, an article can be manufactured in a method that is more advantageous for achieving both productivity and quality than in the past.

[0077] The disclosure of this specification includes the following stage apparatus, lithography apparatus, substrate delivery method, and article manufacturing method.

[0078] 〔Item 1〕 A substrate chuck having a holding surface and adsorbing and holding a substrate on the holding surface, A pin that can protrude from the holding surface through a hole provided in the substrate chuck and can adsorb and hold the substrate, A drive unit that relatively moves the substrate chuck and the pin, A control unit that controls the drive unit, and When separating the substrate and the substrate chuck, the control unit controls the drive unit based on a first condition related to the ease of separation between the substrate and the substrate chuck. A stage device characterized by this.

[0079] 〔Item 2〕 The control unit controls the drive unit based on a second condition related to the relative movement when separating the substrate and the substrate chuck, which is set based on the first condition. The stage device according to Item 1, characterized by this.

[0080] 〔Item 3〕 The second condition includes at least one of the acceleration of the relative movement, the speed, the amount of movement of the substrate chuck or the pin when moving the substrate chuck or the pin at a predetermined speed from when the pin contacts the substrate until the substrate chuck or the pin moves, and the waiting time which is the time from when the suction of the gas between the substrate and the substrate chuck stops until the relative movement starts when separating the substrate and the substrate chuck. The stage device according to Item 2, characterized by this.

[0081] 〔Item 4〕 It has a measurement unit that measures the position of the drive unit, the pin, or the substrate chuck. The first condition is related to the difference between the target position of the member having the measurement unit and the measurement result of the position of the member measured by the measurement unit when the drive unit is driven, which is acquired in advance. The stage device according to any one of Items 1 to 3, characterized by this.

[0082] 〔Item 5〕 The first condition is related to the maximum value of the difference from when the substrate and the pin contact until the entire surface of the substrate and the substrate chuck separate. The stage device according to Item 4, characterized by this.

[0083] 〔Item 6〕 The first condition is the drive current value flowing through the drive unit when separating the substrate and the substrate chuck. The stage device according to any one of Items 1 to 3, characterized by this.

[0084] [Item 7] It has a load sensor that measures the load applied to the drive unit, the pin, or the substrate chuck, The first condition is the measured value of the load sensor when separating the substrate and the substrate chuck, and the stage device according to any one of Items 1 to 3, characterized in that.

[0085] [Item 8] It has a pressure sensor that measures the pressure in the space between the substrate and the substrate chuck, The first condition is the measured value of the pressure sensor, and the stage device according to any one of Items 1 to 3, characterized in that.

[0086] [Item 9] The first condition is related to at least one of the warpage amount of the substrate, the surface roughness of the substrate or the substrate chuck, and the flatness of the substrate chuck, and the stage device according to any one of Items 1 to 3, characterized in that.

[0087] [Item 10] When the ease of separation is high, the control unit makes the acceleration of the relative movement, or the speed of the relative movement, or the moving amount of the substrate chuck or the pin when moving from the time the pin contacts the substrate smaller, or the standby time shorter, when separating the substrate and the substrate chuck, compared to when the ease of separation is low. The stage device according to Item 3, characterized in that.

[0088] [Item 11] The control unit controls the acceleration or speed of the substrate chuck or the pin when separating the substrate and the substrate chuck according to the distance between the substrate and the substrate chuck, and the stage device according to any one of Items 1 to 10, characterized in that.

[0089] [Item 12] The stage device according to item 2 or 3, wherein the control unit controls based on a set of the second conditions selected based on the first condition among a plurality of preset sets of the second conditions.

[0090] [Item 13] The stage device according to any one of items 1 to 12, wherein the control unit controls such that when separating the substrate from the substrate chuck, the substrate chuck or the pin changes from the first speed to a second speed faster than the first speed.

[0091] [Item 14] The stage device according to any one of items 1 to 13, wherein the control unit controls the driving of the driving unit based on a target value based on a cosine waveform when separating the substrate from the substrate chuck.

[0092] [Item 15] The stage device according to item 2 or 3, wherein the control unit learns based on information when separating a substrate from the substrate chuck in the past and determines the second condition when separating the next substrate from the substrate chuck based on the learning result.

[0093] [Item 16] A first stage, A second stage different from the first stage, and The stage device according to item 2 or 3, wherein the control unit controls at least one of the first stage and the second stage based on the first condition.

[0094] [Item 17] The stage device according to item 2 or 3, wherein the control unit controls based on a result of weighting the first condition.

[0095] [Item 18] The stage device according to any one of items 1 to 17, and A pattern forming unit that forms a pattern on a substrate held by the stage device; A lithographic apparatus, characterized by comprising the same.

[0096] [Item 19] An adsorption step of adsorbing and holding the substrate on the holding surface of the substrate chuck; A transfer step of transferring the substrate adsorbed and held by the substrate chuck to the pin by relative movement between the pin that can protrude from the holding surface through a hole provided in the substrate chuck and can adsorb and hold the substrate and the substrate chuck, In the transfer step, the relative movement is performed based on a first condition related to the ease of separation when separating the substrate from the substrate chuck. A substrate transfer method, characterized by the above.

[0097] [Item 20] An adsorption step of adsorbing and holding the substrate on the holding surface of the substrate chuck; A forming step of forming a pattern on the substrate adsorbed and held in the adsorption step; After the forming step, a transfer step of transferring the substrate adsorbed and held by the substrate chuck to the pin by relative movement between the pin that can protrude from the holding surface through a hole provided in the substrate chuck and can adsorb and hold the substrate and the substrate chuck, A manufacturing step of manufacturing an article from the substrate on which the pattern is formed in the forming step, In the transfer step, the relative movement is performed based on a first condition related to the ease of separation when separating the substrate from the substrate chuck. A method for manufacturing an article, characterized by the above.

[0098] The invention is not limited to the above embodiments, and various changes and modifications are possible without departing from the spirit and scope of the invention. Therefore, claims are attached to disclose the scope of the invention.

Claims

1. A substrate chuck that suction-holds a substrate; a pin that can protrude from a hole provided in the substrate chuck and that can suction-hold the substrate; a drive unit that moves the substrate chuck and the pins relative to each other; a control unit that controls the drive unit, The stage device is characterized in that the control unit controls the drive unit to separate the substrate and the substrate chuck while causing the relative movement in accordance with the ease with which the substrate and the substrate chuck separate.

2. The stage device described in Claim 1, characterized in that the control unit controls the drive unit to move the substrate chuck and the pin relative to each other at a speed or acceleration based on the ease of separation between the substrate and the substrate chuck, thereby separating the substrate and the substrate chuck.

3. 2. The stage device according to claim 1, wherein the control unit controls the drive unit based on at least one of the amount of movement of the substrate chuck or the pin from when the pin comes into contact with the substrate to when the substrate chuck or the pin is moved at a predetermined speed, based on the ease of separation, and a waiting time which is the time from when suction of gas between the substrate and the substrate chuck stops to when the relative movement starts.

4. a measuring unit for measuring the position of the driving unit, the pin, or the substrate chuck; 2. The stage device according to claim 1, wherein the ease of separation is related to a difference between a target position of the member when driven by the drive unit, which is previously acquired, and a measurement result of the position of the member measured by the measurement unit.

5. 5. The stage device according to claim 4, wherein the ease of separation is related to the maximum value of the difference between when the substrate and the pin come into contact and when the entire surface of the substrate and the substrate chuck separate.

6. 2. The stage device according to claim 1, wherein the ease of separation is related to a value of a drive current that flows through the drive unit when the substrate and the substrate chuck are separated from each other.

7. a load sensor for measuring a load applied to the driving unit, the pin, or the substrate chuck; 2. The stage apparatus according to claim 1, wherein the ease of separation is related to a measurement value of the load sensor when the substrate and the substrate chuck are separated from each other.

8. a pressure sensor for measuring the pressure in a space between the substrate and the substrate chuck; 2. The stage apparatus according to claim 1, wherein the ease of separation is related to a measurement value of the pressure sensor.

9. 2. The stage device according to claim 1, wherein the ease of separation is related to at least one of the amount of warping of the substrate, the surface roughness of the substrate or the substrate chuck, and the flatness of the substrate chuck.

10. 4. The stage device according to claim 3, wherein the control unit controls the acceleration of the relative movement when separating the substrate from the substrate chuck to be larger, or the speed of the relative movement to be faster, or the amount of movement of the substrate chuck or the pins from the time the pins come into contact with the substrate to be smaller, or the waiting time to be shorter, when the substrate and the substrate chuck are easily separated compared to when the substrate and the substrate chuck are not easily separated.

11. 2. The stage device according to claim 1, wherein the control unit controls the acceleration or speed of the substrate chuck or the pin when separating the substrate from the substrate chuck, depending on the distance between the substrate and the substrate chuck.

12. 2. The stage device according to claim 1, wherein the control unit performs control based on a set of conditions selected from a plurality of preset sets of conditions for separating the substrate from the substrate chuck based on the ease of separation.

13. 2. The stage device according to claim 1, wherein the control unit controls the substrate chuck or the pins to move from a first speed to a second speed that is faster than the first speed when separating the substrate and the substrate chuck.

14. 2. The stage device according to claim 1, wherein the control unit controls the driving of the drive unit based on a target value based on a cosine waveform when separating the substrate from the substrate chuck.

15. 2. The stage device according to claim 1, wherein the control unit learns based on information from past substrate separations from the substrate chuck, and determines conditions for separating the next substrate from the substrate chuck based on the learning results.

16. The first stage and a second stage different from the first stage; 2. The stage apparatus according to claim 1, wherein the control unit controls the relative movement of at least one of the first stage and the second stage based on the ease of separation.

17. 2. The stage device according to claim 1, wherein the control unit performs control based on a result of weighting the ease of separation.

18. A stage device according to any one of claims 1 to 17; a pattern forming unit that forms a pattern on a substrate held by the stage device; 1. A lithography apparatus comprising:

19. a suction step of suction-holding the substrate on a holding surface of the substrate chuck; a transfer step of transferring the substrate, which is held by suction on the substrate chuck, from the substrate chuck to the pin by relative movement between the substrate chuck and the pin, the pin being capable of protruding from a hole provided in the substrate chuck and capable of suction-holding the substrate; In the transferring step, the substrate is transferred to the pins so as to separate the substrate from the substrate chuck while performing the relative movement according to ease of separation between the substrate and the substrate chuck. A substrate transfer method comprising:

20. A program for causing a computer to execute the substrate transfer method described in claim 19.

21. a suction step of suction-holding the substrate on a holding surface of the substrate chuck; a forming step of forming a pattern on the substrate held by suction in the suction step; a transfer step of transferring the substrate, which is held by suction on the substrate chuck, from the substrate chuck to the pin by relative movement between the pin and the substrate chuck, the pin being capable of protruding from a hole formed in the substrate chuck and capable of suction-holding the substrate, after the forming step; a manufacturing process for manufacturing an article from the substrate on which the pattern has been formed in the forming process, In the transferring step, the substrate is transferred to the pins so as to separate the substrate from the substrate chuck while performing the relative movement according to ease of separation between the substrate and the substrate chuck. A method for manufacturing an article.

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