Substrate processing device and substrate processing method

Abstract

To make countermeasures for preventing a processing liquid from being applied to a substrate by a slit nozzle with foreign objects adhering to a nozzle guard in a substrate processing device in which the nozzle guard is disposed forward of the slit nozzle which is moved relative to the substrate.SOLUTION: The invention relates to a substrate processing device and a substrate processing method which move a slit nozzle and a plate-like nozzle guard relative to a substrate with a processing liquid discharged from a discharge port of the slit nozzle in a state where the discharge port is placed close to a surface of the substrate to apply the processing liquid to the surface of the substrate while preventing foreign objects from adhering to the slit nozzle with the nozzle guard provided forward of the slit nozzle in a relative movement direction in which the slit nozzle is relatively moved. Before application of the processing liquid is performed in this way, foreign objects adhering to the nozzle guard are detected.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a substrate processing technology for supplying and applying a processing liquid from a slit nozzle to a substrate for precision electronic devices such as a glass substrate for FPDs such as a liquid crystal display device and an organic EL display device, a semiconductor wafer, a glass substrate for a photomask, a substrate for a color filter, a substrate for a recording disk, a substrate for a solar cell, a substrate for electronic paper, etc., and a substrate for a semiconductor package (hereinafter simply referred to as "substrate").

Background Art

[0002] There is known a substrate processing apparatus for applying a processing liquid to a substrate by discharging the processing liquid from a slit nozzle while relatively moving the slit nozzle having a slit-shaped discharge port with respect to the substrate. For example, in the apparatus described in Patent Document 1, the processing liquid is applied by moving the slit nozzle above the stage surface while holding the substrate on the stage surface of the stage. On the other hand, in the apparatus described in Patent Document 2, the substrate is moved in a so-called floating method while positioning the slit nozzle at a predetermined coating position above the stage surface of the stage. More specifically, the substrate is moved so as to pass through a coating region sandwiched between the slit nozzle and the stage surface while floating the substrate by a pressure gas layer formed on the stage surface by a gas flow passing through gas holes provided in the stage surface. Although the substrate conveyance methods are different in this way, nozzle guards are provided in any of the apparatuses. This is in consideration of the fact that foreign matters or protrusions (hereinafter referred to as "foreign matters") may protrude upward on the surface side of the substrate. That is, if the application of the processing liquid is executed with these foreign matters present, the slit nozzle collides with the foreign matters, thereby inhibiting the application of the processing liquid. That is, the above collision may have an adverse effect on the applied processing liquid or the slit nozzle. Therefore, in the above conventional apparatus, the nozzle guard is disposed on the front side of the slit nozzle in the relative movement direction in which the slit nozzle moves relative to the substrate.

Prior Art Documents

Patent Documents

[0003] Patent Document 1 Japanese Patent Application Laid-Open No. 2006-102609 Patent Document 2 Japanese Patent Application Laid-Open No. 2011-212544 Summary of the Invention Problems to be Solved by the Invention

[0004] By the way, when removing foreign matter by a nozzle guard, the foreign matter may adhere to the nozzle guard. Depending on the size of the foreign matter, when performing a coating process using a slit nozzle equipped with the nozzle guard, the substrate and the foreign matter may come into contact, which may cause defects. In addition, if the coating process is repeated using the slit nozzle with foreign matter attached, defects will occur continuously at the same position for several sheets.

[0005] This invention has been made in view of the above problems, and in a substrate processing apparatus in which a nozzle guard is disposed on the front side of a slit nozzle that moves relative to a substrate, it is possible to take measures such as preventing the processing liquid from being applied to the substrate by the slit nozzle while foreign matter adheres to the nozzle guard. The purpose is to provide a substrate processing technology. Means for Solving the Problems

[0006] One aspect of the present invention is a substrate processing apparatus for applying a processing liquid to the surface of a substrate, comprising: a slit nozzle having a slit-shaped discharge port for discharging the processing liquid; a nozzle moving unit that moves the slit nozzle in a state where the discharge port faces downward relative to the substrate along the surface of the substrate in a direction relative to the substrate above the substrate; a plate-shaped nozzle guard provided on the front side of the slit nozzle in the relative movement direction in which the slit nozzle moves relative to the substrate by the nozzle moving unit when applying the processing liquid, and moving integrally with the slit nozzle; and a foreign matter detection unit that detects foreign matter adhering to the nozzle guard.

[0007] Another aspect of the present invention is a substrate processing method, which includes a coating step of applying a processing liquid to the surface of a substrate while discharging the processing liquid from a discharge port of a slit nozzle while keeping the discharge port of the slit nozzle close to the surface of the substrate and relatively moving the slit nozzle and a plate-shaped nozzle guard with respect to the substrate, so as to prevent foreign matter from adhering to the slit nozzle by the nozzle guard provided on the front side of the slit nozzle in the relative movement direction in which the slit nozzle relatively moves, and a detection step of detecting the adhesion of foreign matter to the nozzle guard before the coating step.

[0008] In the invention configured as described above, a coating process is executed while removing foreign matter by a nozzle guard disposed on the front side of a slit nozzle moving in the relative movement direction. For this reason, foreign matter may adhere to the nozzle guard. Therefore, in the present invention, a foreign matter detection unit is provided, and the adhesion of foreign matter to the nozzle guard is detected.

Advantages of the Invention

[0009] As described above, according to the present invention, it is possible to detect the adhesion of foreign matter to the nozzle guard disposed on the front side of the slit nozzle that relatively moves with respect to the substrate, and various measures can be taken, such as preventing the coating process from being performed with foreign matter adhering to the nozzle guard before the coating process.

Brief Description of the Drawings

[0010]

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Embodiments for Carrying Out the Invention

[0011] FIG. 1 is a diagram schematically showing the overall configuration of a coating apparatus which is the 1st embodiment of a substrate processing apparatus according to the present invention. Further, FIG. 2 is a side view schematically showing the coating apparatus shown in FIG. 1. In FIGS. 1, 2 and each subsequent figure, an XYZ orthogonal coordinate system is appropriately attached with the Z direction as the vertical direction and the XY plane as the horizontal plane in order to clarify their directional relationships, and the dimensions and numbers of each part are exaggerated or simplified as necessary. Also, in FIG. 2, some configurations such as the nozzle support are omitted.

[0012] The coating device 1A is a coating device called a slit coater that applies a processing liquid to the surface 31 of a substrate 3, which is an example of an object to be coated, using a slit nozzle 2. The processing liquid is, for example, a photoresist liquid. Also, the processing liquid may be various processing liquids in paste or slurry form containing, for example, pigments for color filters, polyimide precursors, silicone agents, nano metal inks, or conductive materials. The substrate 3 is a glass substrate having a rectangular shape in plan view. Also, the substrate 3 to be coated can be applied to various substrates such as rectangular glass substrates, semiconductor substrates, flexible substrates for film liquid crystals, substrates for photomasks, substrates for color filters, substrates for solar cells, substrates for organic EL (ElectroLuminescence), and substrates for semiconductor packages. Note that in this specification, the "surface 31 of the substrate 3" means the main surface on the side where the processing liquid is applied among the two main surfaces of the substrate 3.

[0013] The coating device 1A includes a stage 4 that can adsorb and hold the substrate 3 in a horizontal posture, a coating processing unit 5 that performs a coating process on the substrate 3 held by the stage 4 using the slit nozzle 2, a nozzle maintenance unit 6 that performs maintenance processing on the slit nozzle 2 and the nozzle guard NG, and a control unit 10 that controls each of these units.

[0014] The stage 4 is made of a stone material such as granite having a substantially rectangular parallelepiped shape, and on the (-Y) direction side of its upper surface (+Z side), it has a holding surface 41 that is processed into a substantially horizontal flat surface to hold the substrate 3. A large number of vacuum suction ports (not shown) are dispersedly formed on the holding surface 41. By adsorbing the substrate 3 through these vacuum suction ports, the substrate 3 is horizontally held at a predetermined position during the coating process. Note that the holding mode of the substrate 3 is not limited to this, and for example, it may be configured to mechanically hold the substrate 3. Also, a nozzle adjustment region RA is provided on the (+Y) direction side of the region occupied by the holding surface 41 in the stage 4, and the nozzle maintenance unit 6 is arranged in this nozzle adjustment region RA.

[0015] In the slit nozzle 2, as shown in FIGS. 1 and 2, its lower end 2a (nozzle lip portion) has a downwardly tapered shape. And a slit-shaped discharge port 21 is extended in the X direction on the lower surface of the lower end 2a, and the processing liquid pumped from a processing liquid supply unit (not shown) is discharged from the discharge port 21 onto the surface 31 of the substrate 3. Thereby, the processing liquid is applied to the surface 31 of the substrate 3.

[0016] The coating processing unit 5 has a nozzle support 51 that supports the slit nozzle 2. This nozzle support 51 has a support member 51a that extends parallel to the X direction above the stage 4, and two elevating mechanisms 51b that support the support member 51a from both sides in the X direction and raise and lower the support member 51a. The support member 51a is made of carbon fiber reinforced resin or the like and is a rod member having a rectangular cross section. The lower surface of this support member 51a serves as the mounting location 510 of the slit nozzle 2, and the support member 51a detachably supports the slit nozzle 2 at the mounting location 510. As a mechanism for attaching and detaching the slit nozzle 2 to and from the mounting location 510 of the support member 51a, various fastening mechanisms such as latches or screws can be appropriately used.

[0017] The two elevating mechanisms 51b are connected to both longitudinal ends of the support member 51a and each have an AC servo motor and a ball screw or the like. By these elevating mechanisms 51b, the support member 51a and the slit nozzle 2 fixed thereto are raised and lowered in the vertical direction (Z direction), and the distance between the discharge port 21 that opens at the lower end of the slit nozzle 2 and the substrate 3, that is, the relative height of the discharge port 21 with respect to the substrate 3 is adjusted. The vertical position of the support member 51a can be detected, for example, by a linear encoder composed of a scale portion provided on the side surface of the elevating mechanism 51b (not shown) and a detection sensor provided on the side surface of the slit nozzle 2 or the like facing the scale portion.

[0018] The nozzle support 51 configured as described above has a cross-linked structure that spans the holding surface 41 and extends across the left and right ends of the stage 4 along the X direction, as shown in FIG. 1. The coating processing unit 5 has a nozzle moving unit 53 that moves the nozzle support 51 in the Y direction. The nozzle moving unit 53 functions as relative moving means for relatively moving the nozzle support 51 as a cross-linked structure and the slit nozzle 2 supported thereby along the Y direction with respect to the substrate 3 held on the stage 4. Specifically, the nozzle moving unit 53 includes, on each of the ±X sides, a guide rail 52 that guides the movement of the slit nozzle 2 in the Y direction, a linear motor 54 as a drive source, and a linear encoder 55 for detecting the position of the discharge port 21 of the slit nozzle 2.

[0019] The two guide rails 52 are respectively provided at both ends of the stage 4 in the X direction and extend in the Y direction so as to include the nozzle adjustment region RA and the section where the holding surface 41 is provided. Then, each of the two guide rails 52 guides the movement of the two elevating mechanisms 51b in the Y direction. Also, the two linear motors 54 are respectively provided on both sides of the stage 4 and are AC coreless linear motors having a stator 54a and a mover 54b. The stator 54a is provided along the Y direction on the side surface of the stage 4 in the X direction. On the other hand, the mover 54b is fixedly provided outside the elevating mechanism 51b. The two linear motors 54 respectively drive the two elevating mechanisms 51b in the Y direction by the magnetic force generated between these stator 54a and mover 54b.

[0020] Further, each linear encoder 55 has a scale portion 55a and a detection portion 55b. The scale portion 55a is provided along the Y direction below the stator 54a of the linear motor 54 fixedly provided on the stage 4. On the other hand, the detection portion 55b is fixedly provided further outside the mover 54b of the linear motor 54 fixedly provided on the elevating mechanism 51b and is disposed opposite to the scale portion 55a. The linear encoder 55 detects the position of the discharge port 21 of the slit nozzle 2 in the Y direction based on the relative positional relationship between the scale portion 55a and the detection portion 55b.

[0021] The nozzle moving part 53 configured in this way can move the slit nozzle 2 between above the nozzle adjustment area RA and above the substrate 3 held on the stage 4 by driving the nozzle support 51 in the Y direction. Then, the coating device 1A forms a treatment liquid layer on the surface 31 of the substrate 3 by moving the slit nozzle 2 from the coating start position Pst to the coating end position Pen in the (+Y) direction while discharging the treatment liquid from the discharge port 21 of the slit nozzle 2. Thus, in this embodiment, the (+Y) direction corresponds to an example of the "relative movement direction" of the present invention.

[0022] While the slit nozzle 2 is relatively moved in the (+Y) direction with respect to the substrate 3 in this way, the treatment liquid is applied. However, if foreign matter exists on the surface 31 of the substrate 3, the discharge port 21 of the slit nozzle 2 may come into contact with the foreign matter and be damaged. Therefore, as shown in FIGS. 1 and 2, a plate-shaped nozzle guard NG is disposed on the front side of the slit nozzle 2 (the diagonally lower right side in FIG. 1 and the right hand side in FIG. 2) in the relative movement direction (+Y) direction. This nozzle guard NG has the same X-direction width as the slit nozzle 2. As shown in FIG. 2, the nozzle guard NG is attached to the side surface on the (+Y) direction side of the slit nozzle 2 in such a manner that its lower end portion protrudes below the discharge port 21 of the slit nozzle 2 at a position separated from the discharge port 21 of the slit nozzle 2 by a distance D1 in the (+Y) direction. For this reason, during the application process of the treatment liquid, the lower end portion of the nozzle guard NG approaches the surface 31 of the substrate 3 from above, protecting the discharge port 21 of the slit nozzle 2 from foreign matter on the surface 31 of the substrate 3.

[0023] After the application of the processing liquid is completed, the slit nozzle 2 further moves in the (+Y) direction and waits in the nozzle adjustment area RA. This nozzle adjustment area RA is provided at a position deviated from the holding surface 41 of the substrate 3 in the (+Y) direction. The nozzle adjustment area RA functions as a waiting place for the slit nozzle 2 during a period when coating processing is not performed on the stage 4 such as the delivery period of the substrate 3 (the loading / unloading period of the substrate 3) between the coating apparatus 1A and the external transfer mechanism. Also, for the slit nozzle 2 located in the nozzle adjustment area RA, the nozzle maintenance unit 6 performs various types of maintenance.

[0024] The nozzle maintenance unit 6 includes a nozzle cleaning standby unit 7 for performing so-called pre-dispense processing, a foreign object detection unit 8 for detecting the attachment of foreign objects to the nozzle guard NG, and a nozzle cleaning unit 9 for cleaning the slit nozzle 2. These are arranged in the (+Y) direction. For the purpose of explaining these positional relationships later, the positions of the nozzle cleaning standby unit 7, the foreign object detection unit 8, and the nozzle cleaning unit 9 in the Y direction are defined as position Ppd, position Pdt, and position Pnc, respectively.

[0025] Among these, the nozzle cleaning unit 9 corresponds to an example of the "nozzle cleaning unit" of the present invention, and for example, those described in Japanese Patent Application Laid-Open No. 2018-149468 can be used. The nozzle cleaning unit 9 includes a scraper (contact member) 91. The scraper 91 moves along the outer surface (specifically, the inclined surface of the lip portion) of the lower end portion of the slit nozzle 2 in the X direction along the outer surface while being in contact with it (scraping operation) by a drive mechanism (not shown). Thereby, the scraper 91 scrapes and removes the deposits attached to the lower end portion 2a of the slit nozzle 2.

[0026] The nozzle cleaning standby unit 7 is disposed on the (-Y) direction side of the nozzle cleaning unit 9 with the foreign matter detection unit 8 interposed therebetween. The nozzle cleaning standby unit 7 has a pre-dispense roller 72 partially immersed in the cleaning liquid stored in the storage tank 71. This pre-dispense roller 72 has a length equal to or greater than that of the slit nozzle 2 in the X direction. This pre-dispense roller 72 rotates by driving of a motor (not shown). In the present embodiment, before performing the coating process, a small amount of resist liquid (processing liquid) is discharged from the slit nozzle 2 moved above the pre-dispense roller 72, whereby the resist liquid containing the cleaning liquid used in the nozzle cleaning unit 9 and the like is removed from the slit nozzle 2 (pre-discharge process). By this pre-discharge process, it becomes possible to discharge a resist liquid suitable for the coating process not containing impurities. Then, in the nozzle cleaning standby unit 7, the slit nozzle 2 waits for the next coating process.

[0027] FIG. 3 is a perspective view showing the overall configuration and operation of the foreign matter detection unit. The foreign matter detection unit 8 is disposed between the nozzle cleaning standby unit 7 and the nozzle cleaning unit 9 as shown in FIG. 2. More specifically, the foreign matter detection unit 8 is disposed at a foreign matter detection position Pdt separated from the pre-dispense roller 72 by a distance D2 in the (+Y) direction. In the present embodiment, this distance D2 coincides with the distance D1 from the discharge port 21 of the slit nozzle 2 to the nozzle guard NG in the Y direction as shown in FIG. 2. Therefore, in order to perform the pre-discharge process, when the slit nozzle 2 is positioned at the pre-dispense position Ppd corresponding to the pre-dispense roller 72, the tip of the nozzle guard NG is positioned at the foreign matter detection unit 8 configured as follows, and the foreign matter detection process can be executed in parallel with the pre-discharge process.

[0028] The foreign object detection unit 8 includes a light projector 81, a light receiver 82, and an amplifier unit 83. The amplifier unit 83 incorporates a light emitting section and a light quantity detection section. The light projector 81 and the light receiver 82 each have a light projection window and a light reception window with the same shape. The light projector 81 and the light receiver 82 are erected upward from the amplifier unit 83 while the light projection window and the light reception window face each other and are separated from each other by a predetermined distance in the Y direction. Here, the predetermined distance is set to be slightly wider than the thickness of the tip of the nozzle guard NG, and as shown in FIG. 3, the tip of the nozzle guard NG can be sandwiched between the light projector 81 and the light receiver 82. Further, the light projector 81 makes the light emitted from the light emitting section into a parallel light beam by means of a built-in lens and then reflects it in the (+Y) direction by a built-in mirror, thereby projecting the parallel light beam toward the light receiver 82. On the other hand, the light receiver 82 receives the parallel light beam from the light projector 81, reflects the direction of the light by a built-in mirror, and then guides the light to the light quantity detection section through the built-in lens. Then, the light quantity detection section outputs a value proportional to the received light quantity (hereinafter referred to as "received light quantity information") to the control unit 10. In this embodiment, the foreign object detection unit 8 in which the light projector 81, the light receiver 82, and the amplifier unit 83 are integrated is used. However, the amplifier unit 83 may be separated from the light projector 81 and the light receiver 82, and the first optical fiber may be used to connect between the light emitting section and the light projector 81, and the second optical fiber may be used to connect between the light receiver 82 and the light quantity detection section.

[0029] The foreign object detection unit 8 configured as described above is provided so as to be reciprocally movable in the X direction as shown in FIG. 3. Further, the foreign object detection unit 8 is connected to a moving mechanism 84. Therefore, when the moving mechanism 84 operates in response to a movement command from the control unit 10, the foreign object detection unit 8 moves between the front position P(X1) and the back position P(Xmax) while sandwiching the tip of the nozzle guard NG. While moving in this way, the light emitting section continuously emits light or emits light at regular intervals in response to a lighting command from the control unit 10. On the other hand, the light quantity detection section outputs received light quantity information.

[0030] FIG. 4 is a diagram schematically showing the operation of the foreign matter detection unit. In the figure, "sensor position" indicates the position of the foreign matter detection unit 8 in the X direction, "light shielding situation" indicates the situation where the parallel light beam traveling from the light projector 81 to the light receiver 82 is shielded by the tip of the nozzle guard NG, and "received light amount" indicates the received light amount received by the light amount detection unit. Here, the received light amount when the nozzle guard NG does not exist between the light projector 81 and the light receiver 82 is set to 100. Here, when the foreign matter detection unit 8 moves to a position where no foreign matter adheres to the tip of the nozzle guard NG (a position other than the position P(Xn) in the figure), the received light amount decreases to 60, but when the foreign matter detection unit 8 moves to a position where the foreign matter F adheres (the position P(Xn) in the figure), the received light amount further decreases by an amount corresponding to the foreign matter F and becomes 50. Therefore, the control unit 10 can specify the presence or absence of the foreign matter F and the adhesion position of the foreign matter F based on the change in the received light amount.

[0031] In order to control each part of the coating apparatus 1A configured as described above, the control unit 10 is provided as described above. This control unit 10 has a configuration of a general computer system in which an arithmetic unit (for example, a CPU, etc.) that performs various arithmetic processes, and a storage unit (for example, a ROM, a RAM, etc.) that stores a basic program and various information are connected to a bus line. The bus line is further connected to a fixed disk (for example, a hard disk drive, etc.) that stores a coating program, etc., a display unit (for example, a display, etc.) that displays various information, and an input unit (for example, a keyboard and a mouse, etc.) that receives an input from an operator. Note that, for example, a touch panel display in which the functions of the display unit and the input unit are integrated may be used. Further, the control unit 10 receives signals sent from sensors provided in each part of the apparatus via an interface (not shown), and the arithmetic unit of the control unit 10 controls each part of the apparatus according to the basic program and executes the coating process described below.

[0032] FIG. 5 is a flowchart showing the coating operation executed by the coating apparatus shown in FIG. 1. In this coating apparatus 1A, after the slit nozzle 2 used for the coating process moves to the pre-dispense position Ppd, a pre-discharge process is executed (step S11). Also, in parallel with the pre-discharge process, a foreign object detection process is executed. That is, the tip of the nozzle guard NG enters between the projector 81 and the light receiver 82 and blocks a part of the parallel light beam traveling from the projector 81 to the light receiver 82. The light reception amount information corresponding to the light blocking situation at this time is given to the control unit 10. Such an operation is executed corresponding to the movement of the foreign object detection unit 8 in the X direction, and as shown in FIG. 4, the light reception amount information at the sensor positions P(X1),..., P(Xn),..., P(Xmax) is sequentially acquired and temporarily stored in the storage unit of the control unit 10.

[0033] Based on the light reception amount information thus obtained, the arithmetic unit of the control unit 10 determines whether a foreign object F (FIG. 4) is attached to the nozzle guard NG (step S12). Then, when foreign object attachment to the nozzle guard NG is detected (in step S12, "NO"), a foreign object removal operation (steps S13 to S15) is executed. That is, the coating process is interrupted in step S13. Subsequently to regulating the coating operation in this way, the arithmetic unit of the control unit 10 displays, on the display unit, a message requesting the user to clean the nozzle guard NG while keeping the coating operation regulated, and prompts the cleaning of the nozzle guard NG (step S14). Then, when the user cleans the nozzle guard NG and further operates a button, icon, etc. corresponding to the completion of the cleaning (in step S15, "YES"), the foreign object removal operation ends, and the control unit 10 returns to step S11 and the pre-discharge operation and the foreign object detection operation are repeated. In the present embodiment, the display unit is used to notify the temporary regulation of the coating operation and the cleaning request for the nozzle guard NG, but other notification means, such as a lamp or voice, may also be used.

[0034] When it is detected that no foreign matter F is attached to the nozzle guard NG (i.e., "YES" in step S12), the coating process is executed as follows (steps S16 to S24). The substrate 3 is loaded into the coating apparatus 1A (step S16). More specifically, after the substrate 3 is placed on the holding surface 41 of the stage 4, it is sucked and held.

[0035] In parallel with this, with a clean resist liquid adhering to the vicinity of the discharge port 21 by the preliminary discharge process, the slit nozzle 2 is moved from the pre-dispense position Ppd to a position above the coating start position Pst (step S17). Subsequently, the descent of the slit nozzle 2 is started. Then, the resist liquid adhering to the vicinity of the discharge port 21 of the slit nozzle 2 comes into contact with the surface 31 of the substrate 3 at the coating start position Ps. As a result, a meniscus of the resist liquid is formed on the surface 31 of the substrate 3 at the coating start position Pst. In response to the meniscus formation, the descent of the slit nozzle 2 is continued. Subsequently, the slit nozzle 2 rises by a distance corresponding to the thickness of the resist liquid to adjust the distance between the discharge port 21 and the surface 31 of the substrate 3, that is, the so-called coating gap (step S18).

[0036] Following the adjustment of the coating gap, the coating operation is started (step S19). That is, while the slit nozzle 2 moves in the (+Y) direction, the resist liquid is discharged from its discharge port 21. As a result, a coating operation in which the slit nozzle 2 applies the resist liquid to the surface 31 of the substrate 3 is executed, and a coating film of a certain thickness by the resist liquid is formed on the surface 31 of the substrate 3. Thus, in the present embodiment, the (+Y) direction corresponds to the "relative movement direction" of the present invention.

[0037] The coating operation continues until the substrate 3 is conveyed to the coating end position Pen where the coating should be completed (step S20). When the substrate 3 reaches the coating end position Pen ( "YES" in step S20), the ejection of the resist solution from the slit nozzle 2 is stopped. Thereby, the coating operation is terminated (step S21). Further, the slit nozzle 2 is detached from the coating end position Pen and returned to the pre-dispense position Ppd (step S22). In parallel with the movement of the slit nozzle 2 to the pre-dispense position Ppd, the adsorption and holding release of the substrate 3 and the substrate unloading are executed (step S23). And when there is a next substrate 3 to be processed ( "YES" in step S24), the process returns to step S11 and the same process as above is repeated. On the other hand, if there is no next substrate 3 ( "NO" in step S24), the process is terminated.

[0038] As described above, according to the first embodiment, since the adhesion of foreign matter to the nozzle guard NG is detected before the coating process is executed, it is possible to prevent the coating process from being executed while the foreign matter F adheres to the nozzle guard NG. Therefore, it is possible to surely prevent defects due to contact between the substrate 3 and the foreign matter F, and the coating process can be performed with high quality.

[0039] Also, when the adhesion of foreign matter to the nozzle guard NG is detected, a message prompting the cleaning of the nozzle guard NG is immediately displayed on the display unit. Therefore, an accurate instruction is displayed to the user in the shortest time. And when the user who notices it cleans the nozzle guard NG, the coating process that is not affected by the foreign matter F can be resumed in a short time. As a result, the operating rate of the coating apparatus 1A can be increased.

[0040] Also, the execution timing of the foreign object detection process is basically arbitrary as long as it is before the next coating process on the substrate. However, in the present embodiment, in the Y direction, by making the distance D1 between the discharge port 21 of the slit nozzle 2 and the nozzle guard NG equal to the distance D2 between the pre-dispense roller 72 and the foreign object detection unit 8, the foreign object detection process and the pre-discharge process are carried out in parallel. Thus, in the present embodiment, a novel configuration of combining a foreign object detection process with a coating apparatus that performs a conventionally well-known pre-discharge process is adopted. However, with the addition of the foreign object detection process, the cycle time does not increase by the tact time required for the foreign object detection process. As in the above embodiment, by completing the foreign object detection process while the pre-discharge process is being performed, it is possible to obtain the above-described operational effects without changing the cycle time. Also, even if the foreign object detection process extends before and after the pre-discharge process, it is possible to obtain the above-described operational effects while suppressing an increase in the cycle time by performing the foreign object detection process partially in parallel with the pre-discharge process.

[0041] Also, in the present embodiment, as shown in FIG. 2, the foreign object detection unit 8 is arranged using the space existing between the nozzle cleaning standby unit 7 and the nozzle cleaning unit 9. Therefore, by effectively using the above space, it is possible to add a new foreign object detection unit 8 while suppressing an increase in the apparatus size.

[0042] Furthermore, in the present embodiment, foreign objects are detected based on the light shielding state of parallel light beams. That is, since foreign object detection is performed by an example of a non-contact method, foreign object detection can be performed without damaging the nozzle guard NG either. As the non-contact method of foreign object detection, the foreign object detection method described below may be adopted (Second Embodiment, Third Embodiment).

[0043] As described above, in the first embodiment, the nozzle cleaning standby unit 7 corresponds to an example of the "pre-discharge unit" of the present invention. Further, the foreign object detection unit 8 is located on the front side of the nozzle cleaning standby unit 7 in the relative movement direction (+Y), and corresponds to an example of the "detection unit" of the present invention. Further, steps S11 and S19 respectively correspond to an example of the "detection step" and the "coating step" of the present invention.

[0044] FIG. 6 is a diagram schematically showing a foreign object detection operation in a coating apparatus which is a second embodiment of a substrate processing apparatus according to the present invention. The major difference between this second embodiment and the first embodiment is that, instead of using the light shielding of parallel light beams, the projected image of the tip of the nozzle guard NG is used. Since other configurations are the same as those of the first embodiment, the same reference numerals are given to the same configurations and the configuration description is omitted.

[0045] As shown in FIG. 6, in the second embodiment, the foreign object detection unit 8 includes a projector 85 incorporating an LED and a projection-side telecentric lens, and a light receiver 86 incorporating a light-receiving-side telecentric lens and a CMOS, and is capable of acquiring the projected image of the tip of the nozzle guard NG existing between the projector 85 and the light receiver 86. The image signal corresponding to the projected image acquired by the foreign object detection unit 8 is supplied to the control unit 10. Such an imaging operation is executed corresponding to the movement of the foreign object detection unit 8 in the X direction, and the projected images at the sensor positions P(X1),..., P(Xn),..., P(Xmax) as shown in FIG. 6 are sequentially acquired and temporarily stored in the storage unit of the control unit 10. As this foreign object detection unit 8, for example, the inline projection image measuring instrument TM-X5000 series manufactured by Keyence Corporation can be used.

[0046] Based on the projected image thus obtained, the arithmetic unit of the control unit 10 determines whether or not a foreign object F (Fig. 4) is attached to the nozzle guard NG. For example, when a projected image as shown in Fig. 6 is acquired, when the foreign object detection unit 8 moves to a position where no foreign object is attached at the tip of the nozzle guard NG (a position other than the position P(Xn) in the figure), the projected image includes only the ridge line image IMa corresponding to the tip of the nozzle guard NG and the tip side image IMb extending upward from the ridge line image IMa. On the other hand, when the foreign object detection unit 8 moves to a position where the foreign object F is attached (the position P(Xn) in the figure), the projected image includes, in addition to the ridge line image IMa and the tip side image IMb, a foreign object image IMc corresponding to the foreign object F. Therefore, the control unit 10 can identify the presence or absence of the foreign object F and the attachment position of the foreign object F by determining whether or not the foreign object image IMc is included in the projected image.

[0047] As described above, in the second embodiment, since the attachment of a foreign object to the nozzle guard NG is detected based on the projected image of the tip of the nozzle guard NG before the coating process is executed, the same operational effects as those of the first embodiment can be obtained.

[0048] Also, in the second embodiment, since the shape and size of the foreign object F can be detected from the projected image, foreign object detection with higher accuracy than in the first embodiment can be performed. For example, when the protrusion amount of the foreign object image IMc from the ridge line image IMa is small enough not to affect the coating operation, it may be configured to substantially determine that no foreign object is detected in step S12 and proceed to the coating operation. Thereby, the operating rate of the coating apparatus 1A can be increased.

[0049] FIG. 7 is a diagram schematically showing a foreign object detection operation in a coating apparatus which is a third embodiment of a substrate processing apparatus according to the present invention. The great difference between this third embodiment and the first embodiment is that the foreign object detection unit 8 is configured by a line scan camera. Also, in comparison with the second embodiment, in the second embodiment, a projection image is captured to detect the foreign object F, but the tip of the nozzle guard NG positioned at the foreign object detection position Pdt is imaged from below. An image signal corresponding to the image acquired by the line scan camera is supplied to the control unit 10. Such an imaging operation is executed corresponding to the movement of the foreign object detection unit 8 in the X direction. As shown in FIG. 7, images at sensor positions P(X1), …, P(Xn), …, P(Xmax) are sequentially acquired and temporarily stored in the storage unit of the control unit 10.

[0050] Based on the image thus obtained, the arithmetic unit of the control unit 10 determines whether or not a foreign object F (FIG. 4) is attached to the nozzle guard NG. For example, when a tip surface image as shown in FIG. 7 is acquired, when the foreign object detection unit 8 moves to a position where no foreign object is attached (a position other than the position P(Xn) in the figure) at the tip of the nozzle guard NG, the tip surface image only includes the tip surface image IMd of the tip of the nozzle guard NG viewed from below. On the other hand, when the foreign object detection unit 8 moves to a position where the foreign object F is attached (the position P(Xn) in the figure), the image includes, in addition to the tip surface image IMd, a foreign object image IMe corresponding to the foreign object F. Therefore, the control unit 10 can specify the presence or absence of the foreign object F and the attachment position of the foreign object F by determining whether or not the foreign object image IMe is included in the tip surface image.

[0051] As described above, in the third embodiment, since the attachment of a foreign object to the nozzle guard NG is detected based on the tip surface image of the nozzle guard NG before the coating process is executed, not only the same operational effects as those of the first embodiment can be obtained, but also the same operational effects as those of the second embodiment can be obtained.

[0052] FIG. 8 is a side view schematically showing a coating apparatus which is a fourth embodiment of a substrate processing apparatus according to the present invention. The fourth embodiment is significantly different from the first embodiment in that it further includes a guard cleaning unit 11 as an example of a foreign matter removing unit for removing foreign matter adhering to the nozzle guard NG. Since other configurations are the same as those of the first embodiment, the same reference numerals are given to the same configurations and the description of the configurations is omitted.

[0053] As the guard cleaning unit 11, for example, the one described in Japanese Patent Application Laid-Open No. 2022-134204 can be used. This guard cleaning unit 11 is arranged at a guard cleaning position Pgc which is separated from the nozzle cleaning unit 9 by a distance D3 in the (+Y) direction. In the present embodiment, this distance D3 coincides with the distance D1 from the discharge port 21 of the slit nozzle 2 to the nozzle guard NG in the Y direction. Therefore, in order to clean the tip of the slit nozzle 2 with the nozzle cleaning unit 9, when the slit nozzle 2 is positioned at a nozzle cleaning position Pnc corresponding to the scraper (contact member) 91, the tip of the nozzle guard NG is positioned at the guard cleaning unit 11, and the guard cleaning process can be executed in parallel with the nozzle cleaning process.

[0054] The cleaning of the tip of the slit nozzle 2 is performed at the timing such as when the coating device 1A is started, after each coating process is completed, after the coating process is executed a preset number of times, and when a nozzle cleaning request is received from the user. That is, the control unit 10 controls each part of the device to move the slit nozzle 2 to the nozzle cleaning unit 9 to perform the nozzle cleaning process. By this movement, the nozzle guard NG is positioned at the guard cleaning unit 11. Therefore, in the fourth embodiment, the guard cleaning process is configured to be performed in parallel with the nozzle cleaning process. Thus, in the fourth embodiment, in addition to the nozzle cleaning process, a configuration of performing the guard cleaning process is adopted. However, the cycle time does not increase by the tact time required for the guard cleaning process due to the addition of the guard cleaning process. Further, by completing the guard cleaning process while the nozzle cleaning process is being performed, it is possible to obtain the above-described operational effects without changing the cycle time. Further, even if the guard cleaning process protrudes before and after the nozzle cleaning process and is executed, it is possible to obtain the above-described operational effects while suppressing an increase in the cycle time by performing the guard cleaning process in parallel with a part of the nozzle cleaning process.

[0055] Further, since the fourth embodiment includes the guard cleaning unit 11, when the foreign matter F is detected in step S12, instead of notifying the user of the cleaning request for the nozzle guard NG, it may be configured to automatically execute the guard cleaning process. That is, when the control unit 10 detects the adhesion of foreign matter to the nozzle guard NG (”NO” in step S12), the coating process is interrupted in step S13. Subsequently, after the control unit 10 positions the nozzle guard NG at the guard cleaning unit 11, the guard cleaning unit 11 may be configured to clean the nozzle guard NG. The control unit 10 may control each part of the device so as to perform the nozzle cleaning process in parallel with the cleaning of the nozzle guard NG.

[0056] Incidentally, in the above-described fourth embodiment, as an example of a foreign matter removing unit that removes foreign matter (reference numeral F in FIG. 4) adhering to the tip of the nozzle guard NG, the guard cleaning unit 11 described in Japanese Patent Application Laid-Open No. 2022-134204 is used, but there are the following problems. This guard cleaning unit 11 is movable in the X direction along the tip (lower end) of the nozzle guard NG while supplying nitrogen gas and a rinse liquid to the nozzle guard NG. Further, the guard cleaning unit 11 is reciprocally moved in the extending direction X of the nozzle guard NG by a moving mechanism (not shown). Then, the tip of the nozzle guard NG enters a substantially V-shaped space provided in the upper central part of the guard cleaning unit 11, and the guard cleaning unit 11 moves in the X direction with nitrogen gas and the rinse liquid being supplied to the tip, thereby cleaning the nozzle guard NG.

[0057] In this way, the guard cleaning unit 11 removes foreign matter adhering to the nozzle guard NG by a wet method. Therefore, after the cleaning process of the nozzle guard NG, the rinse liquid may remain on the nozzle guard NG. If the nozzle guard NG moves above the substrate 3 integrally with the slit nozzle 2 in this state, it may fall on the surface 31 of the substrate 3 immediately before coating. If the surface 31 of the substrate 3 is wetted by the rinse liquid in this way, not only can the coating process not be performed well, but also there is a possibility of causing a process defect thereafter.

[0058] Therefore, as a foreign matter removing unit for removing the foreign matter F, instead of the guard cleaning unit 11 employed in the fourth embodiment, a dry foreign matter removing unit that removes the foreign matter F from the nozzle guard NG by a so-called dry method may be provided (fifth to eleventh embodiments). Hereinafter, the configuration and operation of the dry foreign matter removing unit in the fifth to eleventh embodiments will be described in order.

[0059] FIG. 9 is a diagram schematically showing the operation of a dry guard cleaner which is an example of a foreign matter removing unit equipped in a coating apparatus according to a fifth embodiment of a substrate processing apparatus of the present invention. Further, FIG. 10 is a diagram schematically showing the operation of the dry guard cleaner shown in FIG. 9. The dry guard cleaner 12 is disposed at a guard cleaning position Pgc which is separated by a distance D3 in the (+Y) direction from the nozzle cleaning unit 9. In the present embodiment, this distance D3 coincides with the distance D1 from the discharge port 21 of the slit nozzle 2 to the nozzle guard NG in the Y direction. Therefore, in order to clean the tip of the slit nozzle 2 with the nozzle cleaning unit 9, when the slit nozzle 2 is positioned at the nozzle cleaning position Pnc corresponding to the scraper (contact member) 91, the tip of the nozzle guard NG is positioned at the dry guard cleaner 12 configured as described below, and a dry guard cleaning process can be executed in parallel with the nozzle cleaning process.

[0060] As shown in FIGS. 9 and 10, the dry guard cleaner 12 has two adhesive rollers 121 and 122. The adhesive rollers 121 and 122 are provided with adhesive layers 121a and 122a fixedly on the surfaces of roller bodies rotatable about rotation shafts 121b and 122b extending in the X direction at the guard cleaning position Pgc.

[0061] The adhesive roller 121 is rotatably disposed while contacting the tip (lower end) of the nozzle guard NG positioned at the guard cleaning position Pgc. On the other hand, the adhesive roller 122 is disposed on the opposite side (-Z direction side in the present embodiment) of the nozzle guard NG with the adhesive roller 121 interposed therebetween. The adhesive roller 122 is provided so as to be driven rotatable in a direction opposite to the rotation direction of the adhesive roller 121 in a state of being externally tangent to the adhesive roller 121. Further, in the present embodiment, the materials constituting the adhesive layers 121a and 122a are selected such that the adhesive force to the foreign matter F is higher in the adhesive layer 122a than in the adhesive layer 121a.

[0062] The dry guard cleaner 12 configured as described above is connected to the roller drive unit 123. Therefore, when the roller drive unit 123 operates in response to a roller rotation command from the control unit 10, in the dry guard cleaner 12, as shown in FIGS. 9 and 10, in the longitudinal direction X of the nozzle guard NG, the adhesive layer 121a of the adhesive roller 121 contacts the entire tip of the nozzle guard NG while the adhesive roller 121 rotates around the first rotation axis 121b. Further, the other adhesive roller 122 is in close contact with the entire adhesive roller 121 in the longitudinal direction X of the nozzle guard NG below the contact position between the adhesive roller 121 and the nozzle guard NG (vertically downward in this embodiment). Moreover, the adhesive roller 122 rotates counterclockwise in the plane of FIG. 10 by the roller drive unit 123.

[0063] Here, for example, when foreign matter F adheres to the position P(n) at the tip of the nozzle guard NG, at the position P(n), the foreign matter F is removed from the nozzle guard NG by the operation shown in FIG. 10. That is, when removing foreign matter, the rotation of the adhesive rollers 121 and 122 is started, and the nozzle guard NG is moved to the guard cleaning position Pgc. Then, when the tip thereof contacts the rotating adhesive roller 121, the foreign matter F is transferred to the first adhesive layer 121a. By this transfer, the foreign matter F is captured by the adhesive layer 121a and removed from the nozzle guard NG. After such foreign matter removal is completed, the nozzle guard NG separates from the adhesive roller 121. On the other hand, even after the nozzle guard NG separates, the adhesive rollers 121 and 122 continue to rotate for a certain period of time. As a result, the foreign matter F moves to the nip position where the adhesive rollers 121 and 122 are in close contact with each other. And at the nip position, the foreign matter F is transferred from the adhesive roller 121 to the adhesive roller 122. Here, in this embodiment, since the adhesive force of the adhesive layer 122a is stronger than the adhesive force of the adhesive layer 121a with respect to the foreign matter F, the transfer of the foreign matter F from the adhesive roller 121 to the adhesive roller 122 is surely performed. As a result, the adhesive roller 121 does not carry the foreign matter F and returns to a state where it can favorably capture another foreign matter F, and rotates clockwise.

[0064] FIG. 11 is a diagram schematically showing the operation of a dry guard cleaner, which is an example of a foreign matter removing unit equipped in a coating apparatus according to the sixth embodiment of the substrate processing apparatus of the present invention. FIG. 12 is a diagram schematically showing the operation of the dry guard cleaner shown in FIG. 11. The significant difference between this sixth embodiment and the fifth embodiment lies in the structure of the dry guard cleaner 12. In the fifth embodiment, the adhesive rollers 121 and 122 fixedly arranged at the guard cleaning position Pgc are used. In contrast, in the sixth embodiment, the movable adhesive rollers 121 and 122 are used. In the following, the configuration and operation of the dry guard cleaner 12 will be mainly described, and the same components and operations will be denoted by the same reference numerals and the description thereof will be omitted.

[0065] In the sixth embodiment, as shown in FIGS. 10 and 11, the dry guard cleaner 12 has two adhesive rollers 121 and 122, and is common to the first embodiment in that the adhesive layers 121a and 122a are provided on the surfaces of the roller bodies. On the other hand, both the adhesive rollers 121 and 122 are significantly shorter than those in the fifth embodiment, and the rotation axes 121b and 122b are arranged parallel to the Y direction. Further, the adhesive rollers 121 and 122 are integrally reciprocally movable in the X direction.

[0066] The adhesive roller 121 is configured to be driven to rotate in the X direction while contacting the tip (lower end) of the nozzle guard NG positioned at the guard cleaning position Pgc. On the other hand, the adhesive roller 122 is arranged on the opposite side of the nozzle guard NG (the (-Z) direction side in this embodiment) with the adhesive roller 121 interposed therebetween. The adhesive roller 122 is provided to be driven to rotate in the direction opposite to the rotation direction of the adhesive roller 121 in a state of being externally tangent to the adhesive roller 121. Also, in this embodiment, the materials constituting the adhesive layers 121a and 122a are selected such that the adhesive force to the foreign matter F is higher in the adhesive layer 122a than in the adhesive layer 121a.

[0067] The dry guard cleaner 12 is connected to the roller drive unit 123. Therefore, when the roller drive unit 123 operates in response to a movement command from the control unit 10, the dry guard cleaner 12 moves in the X direction in a state where the adhesive layer 121a of the adhesive roller 121 abuts against the tip of the nozzle guard NG to form a nip portion NP (Fig. 11), as shown in Figs. 10 and 11. The adhesive roller 121 rolls between the front position P(X1) and the back position P(Xmax) while rotating clockwise in the plane of Fig. 11. The other adhesive roller 122 moves integrally with the adhesive roller 121 between the front position P(X1) and the back position P(Xmax) while rotating counterclockwise in the plane of Fig. 11 while being in close contact with the adhesive roller 121 below the nip portion NP (vertically below in this embodiment). Note that the reference sign P(X0) in Fig. 11 (and Fig. 11 described later) is the first retracted position on the (+X) direction side from the front position P(X1), and the reference sign P(Xmax + 1) is the second retracted position on the (-X) direction side from the back position P(Xmax).

[0068] Here, for example, when a foreign object F adheres to the position P(n) of the tip of the nozzle guard NG, while the adhesive roller 121 rolls and passes through the position P(n), the foreign object F is transferred from the nozzle guard NG to the adhesive layer 121a. By this transfer, the foreign object F is captured by the adhesive layer 121a and removed from the nozzle guard NG. Further, the removed foreign object F remains captured by the adhesive layer 121a and moves clockwise integrally with the adhesive roller 121 and is separated from the nozzle guard NG. Then, when the foreign object F moves to the nip position where the adhesive rollers 121 and 122 are in close contact with each other, the foreign object F is transferred from the adhesive roller 121 to the adhesive roller 122. Here, in this embodiment, since the adhesive force of the adhesive layer 122a is stronger than the adhesive force of the adhesive layer 121a with respect to the foreign object F, a part F is surely transferred from the adhesive roller 121 to the adhesive roller 122. As a result, the adhesive roller 121 does not carry the foreign object F and is returned to a state where it can favorably capture another foreign object F and rotates clockwise.

[0069] In the above-described fifth and sixth embodiments, the dry guard cleaner 12 has the adhesive rollers 121 and 122. However, it may be configured only with the adhesive roller 121 that is responsible for the function of directly removing the foreign matter F from the nozzle guard NG. In this case, it is desirable to perform maintenance operations such as replacement or cleaning of the new adhesive roller 121 every time the foreign matter removal has progressed to a certain extent. Considering this maintenance frequency, it can be said that the above-described fifth and sixth embodiments are superior to the modification configured only with the adhesive roller 121.

[0070] FIG. 13 is a perspective view schematically showing the configuration and operation of a dry guard cleaner which is an example of a foreign matter removal unit equipped in a coating apparatus according to a seventh embodiment of the substrate processing apparatus according to the present invention. FIG. 14 is a view schematically showing the operation of the dry guard cleaner shown in FIG. 13. The significant difference between this seventh embodiment and the fifth embodiment lies in the structure of the dry guard cleaner 12. In the fifth embodiment, the dry guard cleaner 12 is constituted by the upper and lower two-stage adhesive rollers 121 and 122, whereas in the seventh embodiment, the dry guard cleaner 12 is configured to capture and remove the foreign matter F by transferring the foreign matter F with an adhesive tape. Since the other configurations are the same as those in the fifth embodiment, the same reference numerals are given to the same configurations and the configuration description is omitted.

[0071] In the seventh embodiment, the dry guard cleaner 12 has a tape supply unit 125, a tape recovery unit 126, and a backup roller 127 that are fixedly arranged at the guard cleaning position Pgc. These tape supply unit 125, tape recovery unit 126, and backup roller 127 are rotatably provided around a rotation axis extending in the X direction parallel to the longitudinal direction of the nozzle guard NG. In the tape supply unit 125, as shown in FIG. 14, an adhesive tape 128 having an adhesive layer on its surface is wound around a supply roller body 125a. As shown in FIG. 13, this adhesive tape 128 has an adhesive layer provided on its surface and has a width that can contact the entire nozzle guard NG in the longitudinal direction X of the nozzle guard NG. The adhesive tape 128 pulled out from the tape supply unit 125 is sent to the tape recovery unit 126 in a state where its back surface is passed over a backup roller 127 arranged above the tape supply unit 125 and the tape recovery unit 126, and is wound around and recovered by a recovery roller body 126a of the tape recovery unit 126. The backup roller 127 is longer than the nozzle guard NG in the X direction and is arranged opposite to cover the entire nozzle guard NG from below with the adhesive tape 128 interposed therebetween. The backup roller 127 presses the nozzle guard NG against the surface of the adhesive tape 128, that is, the surface of the adhesive layer (adhesive layer), in the width direction of the nozzle guard NG before being supplied from the tape supply unit 125 and recovered by the tape recovery unit 126. Thereby, a nip portion NP is formed between the backup roller 127 and the nozzle guard NG. Foreign matter F adhering to the nozzle guard NG in this nip portion NP is transferred to the adhesive layer.

[0072] The supply roller body 125a and the recovery roller body 126a are connected to a tape drive motor (not shown) of the tape running section 129. When this tape drive motor rotates in response to a command from the control section 10, the adhesive tape 128 is drawn obliquely upward from the tape supply section 125 and sent to the backup roller 127 with the adhesive layer facing upward. Then, the adhesive tape 128 stretched across the backup roller 127 comes into close contact with the nozzle guard NG to form a nip section NP. And foreign matter F is transferred from the nozzle guard NG to the adhesive tape 128 at the nip section NP. After that, the adhesive tape 128 is recovered while carrying the transferred foreign matter F.

[0073] FIG. 15 is a perspective view schematically showing the configuration and operation of a dry guard cleaner, which is an example of a foreign matter removing section equipped in a coating apparatus according to the eighth embodiment of the substrate processing apparatus according to the present invention. FIG. 16 is a view schematically showing the operation of the dry guard cleaner shown in FIG. 15. A major difference between this eighth embodiment and the seventh embodiment lies in the structure of the dry guard cleaner 12. In the seventh embodiment, by bringing the tip of the nozzle guard NG into overall contact with the adhesive tape 128 that travels in the order of the tape supply section 125, the backup roller 127, and the tape recovery section 126, the foreign matter F adhering to the nozzle guard NG is removed all at once.

[0074] In contrast, in the eighth embodiment, the tape supply section 125, the tape recovery section 126, and the backup roller 127 are rotatable about a rotation axis parallel to the relative movement direction Y, and their lengths in the Y direction are significantly shorter compared to those in the seventh embodiment. A nip transfer section 130 is connected to these tape supply section 125, tape recovery section 126, and backup roller 127. This nip transfer section 130 has a tape running section (not shown) for running the adhesive tape 128, similar to the seventh embodiment, and a moving section (not shown) for integrally moving the tape supply section 125, the tape recovery section 126, and the backup roller 127 in the X direction, and as will be described next, it is possible to move the nip section NP along the nozzle guard NG.

[0075] As described above, since the Y-direction lengths of the tape supply unit 125, the tape recovery unit 126, and the backup roller 127 are short, the adhesive tape 128 has a significantly narrower width than that in the seventh embodiment. Then, the adhesive tape 128 travels in the order of the tape supply unit 125, the backup roller 127, and the tape recovery unit 126. Further, the backup roller 127 presses the adhesive tape 128 against a part of the tip of the nozzle guard NG to form a nip portion NP. Furthermore, the tape supply unit 125, the backup roller 127, and the tape recovery unit 126 move integrally in the X direction. As a result, the nip portion NP moves along the tip of the nozzle guard NG, and accordingly, the foreign matter F adhering to the nozzle guard NG is sequentially transferred to the adhesive tape 128, and the adhesive tape 128 carrying the transferred foreign matter F is recovered. In this way, when the nip portion NP moves from one end to the other end of the tip of the nozzle guard NG, the dry guard cleaning process is completed.

[0076] FIG. 17 is a perspective view showing the overall configuration and operation of a dry guard cleaner, which is an example of a foreign matter removal unit equipped in a coating apparatus according to a ninth embodiment of a substrate processing apparatus according to the present invention. Further, FIG. 18 is a diagram schematically showing the operation of the dry guard cleaner shown in FIG. 17. The dry guard cleaner 12 is disposed at a guard cleaning position Pgc that is separated from the nozzle cleaning unit 9 by a distance D3 in the (+Y) direction. In the present embodiment, this distance D3 coincides with the distance D1 from the discharge port 21 of the slit nozzle 2 to the nozzle guard NG in the Y direction. Therefore, in order to clean the tip of the slit nozzle 2 with the nozzle cleaning unit 9, when the slit nozzle 2 is positioned at the nozzle cleaning position Pnc corresponding to the scraper (contact member) 91, the tip of the nozzle guard NG is positioned at the dry guard cleaner 12 configured as described below, and the dry guard cleaning process can be executed in parallel with the nozzle cleaning process.

[0077] The dry guard cleaner 12 has a suction head 120. As shown in FIG. 18, the upper part of the suction head 120 is finished with a substantially V-shaped YZ cross section so as to cover the peripheral atmosphere SA of the tip (lower end) of the nozzle guard NG positioned at the guard cleaning position Pgc from below. In FIG. 18, dots are added to visually clarify the peripheral atmosphere SA.

[0078] This suction head 120 is provided so as to be movable along the nozzle guard NG in the longitudinal direction X of the nozzle guard NG while facing the peripheral atmosphere SA of the nozzle guard NG from below. Further, a groove extending in the X direction is formed in the central part of the upper part of the suction head 120. A plurality of suction ports are provided in this groove. Further, the suction head 120 is connected to a head moving part 120h. Further, a suction part 120a is connected to the suction head 120. Therefore, by operating the head moving part 120h and the suction part 120a according to a command from the control part 10, the suction head 120 moves in the longitudinal direction X of the nozzle guard NG while sucking the peripheral atmosphere SA of the nozzle guard NG. That is, the suction head 120 moves in the X direction along the tip of the nozzle guard NG while applying a negative pressure to the tip of the nozzle guard NG. For example, as shown in FIG. 18, the foreign matter F is sucked and removed from the nozzle guard NG by the suction head 120 passing through the position where the foreign matter F is attached (foreign matter removal process).

[0079] FIG. 19 is a diagram schematically showing the configuration and operation of a foreign matter removing unit provided in a coating apparatus according to the tenth embodiment of the substrate processing apparatus of the present invention. The tenth embodiment is significantly different from the ninth embodiment in the structure of the dry guard cleaner 12. In the ninth embodiment, in the X direction, the suction head 120 is finished shorter than the nozzle guard NG, and by moving the suction head 120 in the X direction, foreign matter F is suction-removed from the entire nozzle guard NG. On the other hand, in the tenth embodiment, the length of the suction head 120 in the X direction is the same as or longer than that of the nozzle guard NG, and a substantially V-shaped portion 120b extends in the X direction over the entire suction head 120. The substantially V-shaped portion 120b makes it possible to entirely cover the peripheral atmosphere SA (FIG. 6) of the tip (lower end) of the nozzle guard NG from below. The suction head 120 is fixedly arranged at the guard cleaning position Pgc. Since other configurations are the same as those in the ninth embodiment, the same reference numerals are given to the same configurations and the configuration description is omitted.

[0080] In the tenth embodiment, as shown by the dashed line in the figure, the slit nozzle 2 and the nozzle guard NG are integrally moved in the (+Y) direction. When the nozzle guard NG is positioned at the guard cleaning position Pgc, the entire peripheral atmosphere of the tip of the nozzle guard NG is covered from below by the substantially V-shaped portion 120b. In that state, when the suction unit 120a operates in response to a command from the control unit 10, the entire peripheral atmosphere becomes a negative pressure, and the foreign matter F adhering to the tip of the nozzle guard NG is suction-removed all at once by the suction unit 120a.

[0081] FIGS. 20A and 20B are diagrams schematically showing the configuration and operation of a foreign matter removing unit provided in a coating apparatus according to the eleventh embodiment of the substrate processing apparatus of the present invention. The eleventh embodiment is significantly different from the tenth embodiment in that a brush member 120c is added to the upper surface of the suction head 120 and that brush cleaning using the brush member 120c is used in combination. Since other configurations are the same as those in the tenth embodiment, the same reference numerals are given to the same configurations and the configuration description is omitted.

[0082] In this embodiment, brush members 120c and 120c are erected toward the nozzle guard NG at the (+Y)-direction side end and the (-Y)-direction side end of the substantially V-shaped portion 120b on the upper surface of the suction head 120. Then, as shown by the broken line in FIG. 20A, when the slit nozzle 2 and the nozzle guard NG are integrally moved in the (+Y) direction and the nozzle guard NG is positioned at the guard cleaning position Pgc, the entire peripheral atmosphere of the tip of the nozzle guard NG is covered from below by the substantially V-shaped portion 120b. At the same time, in the Z direction, the tops of the brush members 120c and 120c are positioned so as to overlap the tip of the nozzle guard NG. In this state, in response to a swing command from the control unit 10, the slit nozzle 2 and the nozzle guard NG swing integrally in the Y direction (see reference symbol AR in FIG. 20B). At this time, the tips of the brush members 120c and 120c rub against the tip of the nozzle guard NG, and brush cleaning is performed. As a result, the foreign matter F is peeled off from the nozzle guard NG. Also, in parallel with this brush cleaning, the suction unit 120a operates in response to a command from the control unit 10, and the foreign matter F is collectively sucked and removed by the suction unit 120a. Therefore, the foreign matter F peeled off from the nozzle guard NG by the brush cleaning can be surely sucked and removed, and it is possible to surely prevent the foreign matter F from scattering around the guard cleaning position Pgc.

[0083] Incidentally, in the first to eleventh embodiments described above, the present invention is applied to a coating apparatus 1A in which the slit nozzle 2 moves relative to the substrate 3 to apply a resist solution (processing solution). However, as described in Patent Document 2, the present invention can also be applied to a coating apparatus in which the substrate moves relative to a slit nozzle fixedly arranged to apply a resist solution (processing solution). Hereinafter, a tenth embodiment of the present invention will be described with reference to FIG. 21.

[0084] FIG. 21 is a diagram schematically showing the overall configuration of a coating apparatus according to the tenth embodiment of the substrate processing apparatus of the present invention. This coating apparatus 1B is a slit coater that applies a resist solution (processing solution) to the surface 31 of a substrate 3 that is conveyed in a horizontal posture from the left hand side to the right hand side in FIG. 21. In FIG. 21, in order to clarify the arrangement relationship of each part of the apparatus, right-handed XYZ orthogonal coordinates are set as shown in the figure. The conveyance direction of the substrate 3 is defined as the "X direction", the horizontal direction from the left hand side to the right hand side in FIG. 21 is referred to as the "+X direction", and the opposite direction is referred to as the "-X direction". Also, among the horizontal directions Y orthogonal to the X direction, the front side of the apparatus (the front side in the figure) is referred to as the "-Y direction", and the back side of the apparatus is referred to as the "+Y direction". Further, the upward and downward directions in the vertical direction Z are referred to as the "+Z direction" and the "-Z direction", respectively.

[0085] In the coating apparatus 1B, along the conveyance direction Dt of the substrate 3, that is, in the (+X direction), an input conveyor 100, an input transfer unit 200, a floating unit 300, an output transfer unit 400, and an output conveyor 110 are arranged in this order in proximity to each other. As will be described in detail below, a conveyance path of the substrate 3 extending in a substantially horizontal direction is formed by these components.

[0086] The substrate 3 to be processed is carried into the input conveyor 100 from the left hand side in FIG. 21. The input conveyor 100 includes a roller conveyor 101 and a rotation drive mechanism 102 that rotationally drives the roller conveyor 101. By the rotation of the roller conveyor 101, the substrate 3 is conveyed in a horizontal posture to the downstream side, that is, in the (+X) direction. The input transfer unit 200 includes a roller conveyor 221 and a rotation / elevation drive mechanism 222 that has a function of rotationally driving the roller conveyor and a function of elevating and lowering it. By the rotation of the roller conveyor 221, the substrate 3 is further conveyed in the (+X) direction. Also, by the elevation of the roller conveyor 221, the vertical position of the substrate 3 is changed. By the input transfer unit 200 configured in this way, the substrate 3 is transferred from the input conveyor 100 to the floating unit 300.

[0087] The upper floating part 300 has an upstream floating stage 301, a central floating stage 302, and a downstream floating stage 303. Both the upstream floating stage 301 and the downstream floating stage 303 have a large number of air ejection holes dispersed in a matrix pattern over the entire surface of a single plate-shaped stage surface. By supplying compressed air to each ejection hole, the substrate 3 is lifted by the gas flow caused by the ejection of compressed air from each ejection hole. As a result, on the upstream floating stage 301 and the downstream floating stage 303, the substrate 3 floats by a predetermined floating height, for example, 10 to 500 micrometers, from the stage surface. In order to supply compressed air to each ejection hole, as shown in Fig. 21, a floating control mechanism 335 is provided.

[0088] In addition, the downstream floating stage 303 has a plurality of lift pins in addition to the above-mentioned ejection holes. Also, a lift pin drive mechanism 334 is provided to raise and lower the lift pins. The plurality of lift pins are provided at a predetermined interval, straddling the spaces between the ejection holes, so as to face the entire back surface of the substrate 3. Then, the lift pins are driven to move up and down in the vertical direction (Z-axis direction) by a lift pin drive mechanism 334 installed below the stage surface. That is, when descending, the tip of the lift pin descends to the (-Z) direction side from the stage surface of the downstream floating stage 303, and when ascending, the tip of the lift pin ascends to a position where the substrate 3 is delivered to a transfer robot (not shown). Since the lower surface of the substrate 3 is supported and lifted by the lift pins thus raised, the substrate 3 rises from the stage surface of the downstream floating stage 303. As a result, the unloading of the substrate 3 from the coating apparatus 1B by the transfer robot becomes possible.

[0089] On the one hand, the central levitation stage 302 is configured as follows and has a higher levitation accuracy than the upstream levitation stage 301 and the downstream levitation stage 303. That is, the central levitation stage 302 has a rectangular plate-shaped stage surface. On this stage surface, a plurality of holes are dispersed in a matrix at a pitch narrower than the ejection holes provided in the upstream levitation stage 301 and the downstream levitation stage 303. Also, different from the upstream levitation stage 301 and the downstream levitation stage 303, in the central levitation stage 302, half of the holes function as ejection holes for compressed air, and the remaining half function as suction holes. That is, compressed air is ejected from the ejection holes toward the back surface of the substrate 3 to send the compressed air into the space between the stage surface and the back surface of the substrate 3. On the other hand, it is configured to suck air from the space through the suction holes. By performing the ejection and suction of air with respect to the above space in this way, in the above space, the gas flow of the compressed air ejected from each ejection hole spreads in the horizontal direction and is then sucked from the suction hole adjacent to the ejection hole. As a result, the pressure balance in the air layer (pressure gas layer) spreading in the above space becomes more stable, and the levitation height of the substrate 3 can be controlled with high precision and stably. Note that the supply of compressed air to each ejection hole and the suction of air from the suction holes are controlled by the levitation control mechanism 335.

[0090] The substrate 3 carried into the levitation unit 300 through the input transfer unit 200 is given a propulsive force in the (+X) direction by the rotation of the roller conveyor 221 and is conveyed onto the upstream levitation stage 301. The upstream levitation stage 301, the central levitation stage 302, and the downstream levitation stage 303 support the substrate 3 in a levitated state but do not have the function of moving the substrate 3 in the horizontal direction. The conveyance of the substrate 3 in the levitation unit 300 is performed by the substrate conveyance unit 500 disposed below the upstream levitation stage 301, the central levitation stage 302, and the downstream levitation stage 303.

[0091] The substrate transfer unit 500 includes a chuck mechanism 551 that supports the substrate 3 from below by partially contacting the peripheral portion of the lower surface of the substrate 3, and a suction / drive control mechanism 552 that applies negative pressure to a suction pad (not shown) provided on the suction member at the upper end of the chuck mechanism 551 to suck and hold the substrate 3 and has a function of reciprocating the chuck mechanism 551 in the X direction. When the chuck mechanism 551 holds the substrate 3, the back surface of the substrate 3 is positioned higher than the surface of each stage of the floating portion 300. Therefore, the substrate 3 maintains a horizontal posture as a whole due to the buoyancy applied from the floating portion 300 while the peripheral portion is sucked and held by the chuck mechanism 551. In addition, a sensor SN for measuring the plate thickness is arranged near the roller conveyor 221 in order to detect the vertical position of the surface of the substrate 3 at the stage when the back surface of the substrate 3 is partially held by the chuck mechanism 551. By positioning a chuck (not shown) that does not hold the substrate 3 directly below this sensor SN, the sensor SN can detect the vertical position of the surface of the suction member, that is, the suction surface.

[0092] The chuck mechanism 551 holds the substrate 3 carried into the floating portion 300 from the input transfer unit 200. In this state, when the chuck mechanism 551 moves in the (+X) direction, the substrate 3 is conveyed from above the upstream floating stage 301 via above the central floating stage 302 to above the downstream floating stage 303. The conveyed substrate 3 is delivered to the output transfer unit 400 arranged on the (+X) side of the downstream floating stage 303.

[0093] The output transfer unit 400 includes a roller conveyor 441 and a rotation / lift drive mechanism 442 that has a function of rotationally driving and lifting the roller conveyor 441. When the roller conveyor 441 rotates, a propulsive force in the (+X) direction is applied to the substrate 3, and the substrate 3 is further conveyed along the conveyance direction Dt. Also, when the roller conveyor 441 moves up and down, the vertical position of the substrate 3 is changed. By the output transfer unit 400, the substrate 3 is transferred from above the downstream floating stage 303 to the output conveyor 110.

[0094] The output conveyor 110 includes a roller conveyor 111 and a rotary drive mechanism 112 that rotationally drives the roller conveyor 111. Due to the rotation of the roller conveyor 111, the substrate 3 is further conveyed in the (+X) direction and finally discharged out of the coating device 1B. Note that the input conveyor 100 and the output conveyor 110 may be provided as part of the configuration of the coating device 1B, or they may be separate from the coating device 1B. For example, a substrate discharge mechanism of another unit provided upstream of the coating device 1B may be used as the input conveyor 100. Also, a substrate receiving mechanism of another unit provided downstream of the coating device 1B may be used as the output conveyor 110.

[0095] On the conveyance path of the substrate 3 conveyed as described above, a coating mechanism 700 for applying a resist solution to the surface 31 of the substrate 3 is arranged. The coating mechanism 700 has a slit nozzle 2 having the same configuration as that of the first embodiment. Further, as shown in FIG. 21, a nozzle drive mechanism 800 is connected to the slit nozzle 2, and the slit nozzle 2 is positioned at a coating position above the central floating stage 302 (the position indicated by the solid line in FIG. 21), an upper position away from the coating position upward, or a maintenance position by the nozzle drive mechanism 800. Furthermore, a coating liquid supply mechanism (not shown) is connected to the slit nozzle 2, a resist solution is supplied from the coating liquid supply mechanism, and the resist solution is discharged as a processing liquid from a discharge port 21 that opens downward at the lower part of the nozzle.

[0096] This slit nozzle 2 has its discharge port 21 extending in the Y direction and is supported by a nozzle support portion (not shown) such that the resist liquid can be discharged vertically downward (-Z side). The nozzle support portion is connected to a nozzle drive mechanism 800. In particular, when supplying the resist liquid to the surface 31 of the substrate 3 by the slit nozzle 2, as shown by the dashed-dotted line in FIG. 4, after the discharge port 21 is moved to a position above the coating position, the slit nozzle 2 descends until the distance (gap) between the discharge port 21 and the substrate 3 reaches a predetermined value. Thereby, the slit nozzle 2 is positioned at the coating position. Thereafter, while discharging the resist liquid from the discharge port 21 toward the surface 31 of the substrate 3 in this positioned state, the substrate 3 is conveyed in the (+X) direction. That is, the slit nozzle 2 moves relative to the substrate 3 in the (-X) direction to perform the coating process. That is, in the present embodiment, the (-X) direction corresponds to the "relative movement direction" of the present invention. Further, a nozzle guard NG is attached to the front side in the relative movement direction (-X) of this slit nozzle 2.

[0097] In order to perform predetermined maintenance on the slit nozzle 2 configured as described above, as shown in FIG. 21, the coating mechanism 700 is provided with a nozzle maintenance unit 6 having the same configuration as that of the first embodiment. That is, it has a nozzle cleaning standby unit 7 for performing a so-called pre-dip process, a foreign matter detection unit 8 for detecting the attachment of foreign matter to the nozzle guard NG, and a nozzle cleaning unit 9 for cleaning the slit nozzle 2. These are arranged in this order along the relative movement direction (-X). And, similar to the first embodiment, before the coating process, the control unit 10 determines whether or not foreign matter (reference numeral F in FIG. 4) is attached to the nozzle guard NG. As a result of this determination, if it is determined that foreign matter is attached to the nozzle guard NG, the control unit 10 restricts the coating process and then immediately displays a message prompting the cleaning of the nozzle guard NG on the display unit.

[0098] As described above, also in the tenth embodiment, similar to the first embodiment, foreign matter adhesion to the nozzle guard NG is detected before the coating process is executed. Therefore, the same operational effects as those of the first embodiment, such as preventing the coating process from being executed while foreign matter F remains attached to the nozzle guard NG, can be obtained.

[0099] As described above, in the tenth embodiment, the adsorption / travel control mechanism 552 corresponds to an example of the "nozzle moving part" of the present invention.

[0100] Note that the present invention is not limited to the above-described embodiments, and various modifications other than those described above can be made without departing from the spirit thereof. For example, in the tenth embodiment, the present invention is applied to a so-called floating type substrate processing apparatus, but the foreign matter detection unit 8 provided in the second to third embodiments may also be applied.

Industrial Applicability

[0101] The present invention is applicable to the entire substrate processing technology of supplying and coating a processing liquid from a slit nozzle to a substrate in a state where a nozzle guard is disposed on the front side of the slit nozzle that relatively moves with respect to the substrate.

Explanation of Reference Numerals

[0102] 1A, 1B... Coating apparatus (substrate processing apparatus) 2... Slit nozzle 3... Substrate 7... Nozzle cleaning standby unit (preliminary discharge unit) 8... Foreign matter detection unit 9... Nozzle cleaning unit (nozzle cleaning part) 10... Control unit 11... Guard cleaning unit (foreign matter removal unit) 12... Dry guard cleaner (foreign matter removal unit) 21... Discharge port (of the slit nozzle) 31... Surface (of the substrate) 53... Nozzle moving part 552... Adsorption / travel control mechanism (nozzle moving part) D1… Distance (from the slit nozzle to the nozzle guard) D2… Distance (from the preliminary discharge section to the foreign object detection section) D3… Distance (from the nozzle cleaning section to the foreign object removal section) F… Foreign object NG… Nozzle guard

Claims

1. A substrate processing apparatus for applying a processing liquid to the surface of a substrate, comprising: a slit nozzle having a slit-shaped discharge port for discharging the processing liquid; a nozzle moving unit that moves the slit nozzle with the discharge port facing downward relative to the substrate in a direction along the surface of the substrate above the substrate; a plate-shaped nozzle guard provided on the front side of the slit nozzle in the relative movement direction in which the slit nozzle moves relative to the substrate by the nozzle moving unit when applying the processing liquid, and moving integrally with the slit nozzle; a foreign matter detection unit that detects foreign matter adhering to the nozzle guard; A substrate processing apparatus, characterized by comprising the above.

2. The substrate processing apparatus according to claim 1, further comprising: a control unit that restricts the application operation of the processing liquid to the substrate when the foreign matter detection unit detects the foreign matter.

3. The substrate processing apparatus according to claim 2, wherein: the control unit prompts the user to remove the foreign matter from the nozzle guard while restricting the application operation.

4. The substrate processing apparatus according to claim 2, further comprising: a foreign matter removal unit that removes the foreign matter from the nozzle guard; the control unit controls the foreign matter removal unit so that the foreign matter is removed from the nozzle guard while restricting the application operation.

5. The substrate processing apparatus according to claim 4, further comprising: a nozzle cleaning unit that cleans the slit nozzle; the foreign matter removal unit is provided at a position in the relative movement direction, in front of the nozzle cleaning unit, and separated from the nozzle cleaning unit by the same distance as the distance from the slit nozzle to the nozzle guard; the control unit controls the nozzle cleaning unit and the foreign matter removal unit so that cleaning of the slit nozzle by the nozzle cleaning unit and removal of the foreign matter by the foreign matter removal unit are performed at least partially in parallel.

6. The substrate processing apparatus according to claim 1, further comprising: a preliminary discharge unit that discharges a preset amount of the processing liquid from the discharge port of the slit nozzle at a preliminary discharge position away from the substrate and waits before discharging the processing liquid from the discharge port of the slit nozzle toward the surface of the substrate; a control unit that controls the preliminary discharge unit and the foreign matter detection unit; Comprising the above. The foreign object detection unit is provided at a position separated from the preliminary discharge unit by the same distance as the distance from the slit nozzle to the nozzle guard on the front side of the preliminary discharge unit in the relative movement direction. The control unit controls the preliminary discharge unit and the foreign object detection unit so that the discharge or standby of the processing liquid in the preliminary discharge unit and the detection of the foreign object in the foreign object detection unit are performed at least partially in parallel. A substrate processing apparatus.

7. The substrate processing apparatus according to any one of claims 1 to 6, The foreign object detection unit includes a light projector that projects a parallel light beam parallel to the relative movement direction toward the tip of the slit nozzle, and a light receiver that receives the parallel light beam that has advanced without being blocked by the slit nozzle, and the light receiver is integrated with the light receiver. The foreign object is detected based on the amount of light received by the light receiver while moving along the tip of the slit nozzle. A substrate processing apparatus.

8. The substrate processing apparatus according to any one of claims 1 to 6, The foreign object detection unit detects the foreign object based on a projected image of the slit nozzle captured along the tip of the slit nozzle while projecting light from a direction parallel to the relative movement direction. A substrate processing apparatus.

9. The substrate processing apparatus according to any one of claims 1 to 6, The foreign object detection unit detects the foreign object based on an image of the slit nozzle captured along the tip of the slit nozzle from below the slit nozzle. A substrate processing apparatus.

10. While discharging the processing liquid from the discharge port with the discharge port of the slit nozzle close to the surface of the substrate, the slit nozzle and the plate-shaped nozzle guard are relatively moved with respect to the substrate, so that the slit nozzle is relatively moved. A coating step of applying the processing liquid to the surface of the substrate while preventing foreign matter from adhering to the slit nozzle by the nozzle guard provided on the front side of the slit nozzle in the movement direction; A detection step of detecting the adhesion of foreign matter to the nozzle guard before the coating step; A substrate processing method characterized by comprising:

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