Composite filter component and high-frequency wave module

Abstract

To provide a multiband compatible composite filter component capable of suppressing degradation of amplification characteristics.SOLUTION: A composite filter component 10 includes: a filter 100d for passing a band AL reception band; a filter 100c for passing a band BL reception band; a filter 100b for passing a band AM reception band capable of simultaneously receiving the band AL; a filter 100a for passing a band BM reception band capable of simultaneously receiving the band BL; an input bump 102 connected to the filters 100d and 100b; an input bump 101 connected to the filters 100c and 100a; an output bump 114 connected to the filter 100d; an output bump 113 connected to the filter 100c; an output bump 112 connected to the filter 100b; and an output bump 111 connected to the filter 100a. The output bumps 113 and 114 are disposed adjacent to each other, and the output bumps 111 and 112 are disposed adjacent to each other.SELECTED DRAWING: Figure 1A

Description

Technical Field

[0001] The present invention relates to a composite filter component and a high-frequency module including the same.

Background Art

[0002] Patent Document 1 discloses a multi-band compatible high-frequency front-end circuit. In the circuit configuration shown in FIG. 4 of Patent Document 1, a filter and a low-noise amplifier are connected by wiring via a band selection switch. Since one low-noise amplifier can amplify a plurality of bands, it is configured to be connectable to a plurality of filters.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in the high-frequency front-end circuit (high-frequency module) disclosed in FIG. 4 of Patent Document 1, when a plurality of filters and a plurality of low-noise amplifiers are connected by wiring, wiring crossovers occur in the region between the plurality of filters and the plurality of low-noise amplifiers. When wiring crossovers occur in the above region, the parasitic capacitance increases near the input end of the low-noise amplifier, the noise figure of the low-noise amplifier increases, and the amplification characteristics deteriorate. Also, not only in the receiving path but also in the transmitting path, when wiring crossovers occur in the region between the plurality of power amplifiers and the plurality of filters, the parasitic capacitance increases near the output end of the power amplifier. As a result, parasitic capacitance is added to the low-impedance power amplifier, the impedance matching degree between the power amplifier and the filter decreases, and the amplification characteristics of the power amplifier deteriorate.

[0005] Therefore, the present invention provides a multi-band compatible composite filter component and a high-frequency module capable of suppressing deterioration of amplification characteristics.

Means for Solving the Problems

[0006] A composite filter component according to an aspect of the present invention includes a first filter having a first passband including a reception band of a first band, a second filter having a second passband including a reception band of a second band, a third filter having a third passband including a reception band of a third band that can be received simultaneously with the first band, a fourth filter having a fourth passband including a reception band of a fourth band that can be received simultaneously with the second band, a first input bump connected to an input end of the first filter and an input end of the third filter, a second input bump connected to an input end of the second filter and an input end of the fourth filter, a first output bump connected to an output end of the first filter, a second output bump connected to an output end of the second filter, a third output bump connected to an output end of the third filter, and a fourth output bump connected to an output end of the fourth filter. Among the first output bump, the second output bump, the third output bump, and the fourth output bump, the first output bump and the second output bump are arranged adjacent to each other, and the third output bump and the fourth output bump are arranged adjacent to each other.

[0007] In addition, the composite filter component according to one aspect of the present invention includes a first filter having a first passband including the transmission band of the first band, a second filter having a second passband including the transmission band of the second band, a third filter having a third passband including the transmission band of the third band that can be transmitted simultaneously with the first band, a fourth filter having a fourth passband including the transmission band of the fourth band that can be transmitted simultaneously with the second band, a first output bump connected to the output end of the first filter and the output end of the third filter, a second output bump connected to the output end of the second filter and the output end of the fourth filter, a first input bump connected to the input end of the first filter, a second input bump connected to the input end of the second filter, a third input bump connected to the input end of the third filter, and a fourth input bump connected to the input end of the fourth filter. Among the first input bump, the second input bump, the third input bump, and the fourth input bump, the first input bump and the second input bump are arranged adjacent to each other, and the third input bump and the fourth input bump are arranged adjacent to each other.

Effects of the Invention

[0008] According to the present invention, it is possible to provide a composite filter component and a high-frequency module compatible with multi-bands that can suppress deterioration of amplification characteristics.

Brief Description of the Drawings

[0009]

Figure 1A

Figure 1B

Figure 2A

Figure 2B

Figure 2C

Figure 2D

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7A

Figure 7B

Figure 8A

Figure 8B

Figure 9A

Figure 9B

Figure 10A

Figure 10B

Figure 11A

Figure 11B

Figure 12

Figure 13A

Figure 13B

Figure 14

Figure 15

Embodiments for Carrying Out the Invention

[0010] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. All of the embodiments described below show comprehensive or specific examples. Numerical values, shapes, materials, components, arrangements of components, connection forms, etc. shown in the following embodiments are merely examples and are not intended to limit the present invention.

[0011] Note that each drawing is a schematic diagram that has been appropriately emphasized, omitted, or adjusted in ratio to show the present invention, and is not necessarily drawn precisely, and may differ from the actual shape, positional relationship, and ratio. In each drawing, the same reference numerals are given to substantially the same configurations, and duplicate explanations may be omitted or simplified.

[0012] In the following figures, the x-axis and the y-axis are axes orthogonal to each other on a plane parallel to the main surface of the module substrate or the composite filter component. Specifically, when the module substrate or the composite filter component has a rectangular shape in plan view, the x-axis is parallel to the first side of the module substrate or the composite filter component, and the y-axis is parallel to the second side orthogonal to the first side of the module substrate or the composite filter component. The z-axis is an axis perpendicular to the main surface of the module substrate or the composite filter component, the positive direction thereof indicates the upward direction, and the negative direction thereof indicates the downward direction.

[0013] In the circuit configuration of the present disclosure, "connected" includes not only the case of being directly connected by connection terminals and / or wiring conductors, but also the case of being electrically connected via other circuit elements. "Connected between A and B" means being connected to both A and B between A and B.

[0014] In the component arrangement of the present invention, "a component is arranged on a substrate" includes that the component is arranged on the main surface of the substrate and that the component is arranged inside the substrate. "A component is arranged on the main surface of the substrate" includes that the component is arranged in contact with the main surface of the substrate, and also includes that the component is arranged above the main surface without contacting the main surface (for example, the component is stacked on another component arranged in contact with the main surface). Further, "a component is arranged on the main surface of the substrate" may include that the component is arranged in a recess formed in the main surface. "A component is arranged inside the substrate" includes that the component is encapsulated inside the module substrate, that all of the component is arranged between the two main surfaces of the substrate but a part of the component is not covered by the substrate, and that only a part of the component is arranged inside the substrate.

[0015] In the component arrangement of the present invention, "in a plan view of the main surface" means looking at an object by orthographically projecting it onto the xy plane from the positive side of the z axis. "A overlaps B in a plan view" means that at least a part of the region of A orthographically projected onto the xy plane overlaps at least a part of the region of B orthographically projected onto the xy plane. Further, "A is arranged between B and C" means that at least one of a plurality of line segments connecting an arbitrary point in B and an arbitrary point in C passes through A.

[0016] In the component arrangement of the present invention, "A is arranged adjacent to B" means that A and B are arranged closely, specifically meaning that there are no other circuit components in the space where A faces B. In other words, "A is arranged adjacent to B" means that none of the plurality of line segments reaching B along the normal direction of the surface from an arbitrary point on the surface of A facing B passes through circuit components other than A and B. Here, a circuit component means a component including an active element and / or a passive element. That is, circuit components include active components such as transistors or diodes, and passive components such as inductors, transformers, capacitors or resistors, and do not include electromechanical components such as terminals, connectors or wirings.

[0017] In the present invention, the term "terminal" means the point where the conductor within an element ends. When the impedance of the conductor between elements is sufficiently low, the terminal is interpreted not only as a single point but also as any point on the conductor between elements or the entire conductor. Further, the term "bump" means a protruding electrode such as a spherical, cylindrical, conical, prismatic, or pyramidal shape among the "terminals".

[0018] In the bump arrangement of the present invention, the phrase "bump A and bump B are adjacently arranged" means that there is no bump (HOT bump) to which a signal potential is applied in the space where bump A and bump B face each other. Specifically, it means that none of the plurality of (straight-line) line segments reaching from any point on the surface of bump A to bump B passes through a HOT bump. Note that there may be a bump (GND bump) to which a ground potential is applied in the space where bump A and bump B face each other.

[0019] Also, the phrase "three or more bumps are adjacently arranged" means that there is no HOT bump other than the three or more bumps in the space where any two of the three or more bumps face each other. Therefore, one of the three or more bumps may exist in the space where any two of the three or more bumps face each other.

[0020] Also, terms indicating the relationship between elements such as "parallel" and "perpendicular", terms indicating the shape of elements such as "rectangle", and numerical ranges do not represent only a strict meaning but also substantially equivalent ranges, for example, including an error of about several percent.

[0021] The "passband of a filter" is a part of the frequency spectrum transmitted by the filter and is defined as the frequency band in which the output power does not attenuate by 3 dB or more from the maximum output power. Therefore, the high-frequency end and the low-frequency end of the passband of a band-pass filter are specified as the higher frequency and the lower frequency of the two points where the output power attenuates by 3 dB from the maximum output power.

[0022] "Reception band" means the frequency band used for reception in a communication device. For example, in frequency division duplex (FDD), different frequency bands are used as the transmission band and the reception band, and in time division duplex (TDD), the same frequency band is used as the transmission band and the reception band. In particular, in FDD, when the communication device is implemented as a user equipment (UE) of a cellular network, the uplink operation band is used as the transmission band, and the downlink operation band is used as the reception band. Conversely, when the communication device is implemented as a base station (BS) of a cellular network, the downlink operation band is used as the transmission band, and the uplink operation band is used as the reception band.

[0023] (Embodiment 1) [1.1 Configuration of High-Frequency Module 1 and Communication Device 4] First, the circuit configuration and component layout configuration of the high-frequency module 1 and the communication device 4 according to this embodiment will be described with reference to FIG. 1A. FIG. 1A is a circuit configuration diagram of the high-frequency module 1 and the communication device 4 according to Embodiment 1. Note that FIG. 1A shows an exemplary circuit configuration of the high-frequency module 1 and the communication device 4, and the high-frequency module 1 and the communication device 4 can be implemented using any of a variety of circuit implementations and circuit technologies. Therefore, the description of the high-frequency module 1 and the communication device 4 provided below should not be construed in a limiting sense.

[0024] The communication device 4 is implemented in a UE of a cellular network and is typically a mobile phone, smartphone, tablet computer, wearable device, etc. Note that the communication device 4 may also be an IoT (Internet of Things) sensor device, a medical / healthcare device, a vehicle, an unmanned aerial vehicle (UAV) (so-called drone), or an automated guided vehicle (AGV). Further, the communication device 4 may be implemented in a BS of a cellular communication system.

[0025] As shown in FIG. 1A, the communication device 4 includes a high-frequency module 1, an antenna 2, and an RFIC (Radio Frequency Integrated Circuit) 3.

[0026] The high-frequency module 1 can transmit a high-frequency signal between the antenna 2 and the RFIC 3. The internal configuration of the high-frequency module 1 will be described later.

[0027] The antenna 2 is connected to the antenna connection terminal 200 of the high-frequency module 1. The antenna 2 can receive a high-frequency signal from the outside of the communication device 4 and supply it to the high-frequency module 1. Further, the antenna 2 may transmit the high-frequency signal supplied from the high-frequency module 1 to the outside of the communication device 4. Note that the antenna 2 may not be included in the communication device 4. Also, the communication device 4 may include a plurality of antennas.

[0028] RFIC3 is an example of a signal processing circuit that processes high-frequency signals. Specifically, RFIC3 can process a high-frequency reception signal input via the reception path of the high-frequency module 1 by down-conversion or the like, and output the reception signal generated by the signal processing to a BBIC (Baseband Integrated Circuit). Further, RFIC3 can process a transmission signal input from the BBIC by up-conversion or the like, and output the high-frequency transmission signal generated by the signal processing to the high-frequency module 1. Also, RFIC3 may include a control unit for controlling switches, low-noise amplifiers, etc. included in the high-frequency module 1. Note that part or all of the control unit may be provided outside RFIC3, and may be included in, for example, the BBIC or the high-frequency module 1.

[0029] Next, the circuit configuration of the high-frequency module 1 according to the present embodiment will be described. The high-frequency module 1 includes a composite filter component 10, low-noise amplifiers 31 and 32, switches 20, 21, and 22, inductors 41, 42, 43, and 44, an antenna connection terminal 200, and signal output terminals 110 and 120.

[0030] The composite filter component 10 includes filters 100a, 100b, 100c, and 100d, input bumps 101 and 102, and output bumps 111, 112, 113, and 114.

[0031] Filter 100d has a first passband that includes the reception band (ALR) of band AL (the first band). Filter 100c has a second passband that includes the reception band (BLR) of band BL (the second band). Filter 100b has a third passband that includes the reception band (AMR) of band AM (the third band). Filter 100a has a fourth passband that includes the reception band (BMR) of band BM (the fourth band). Filters 100d and 100c are each an example of one of the first filter and the second filter, and the other example of the first filter and the second filter, and filters 100b and 100a are each an example of one of the third filter and the fourth filter, and the other example of the third filter and the fourth filter.

[0032] Note that filters 100d and 100c may each be an example of one of the third filter and the fourth filter, and the other example of the third filter and the fourth filter, and in that case, filters 100b and 100a are each an example of one of the first filter and the second filter, and the other example of the first filter and the second filter.

[0033] Band AL (the first band) and band AM (the third band) are a combination of bands that can be received simultaneously, and band BL (the second band) and band BM (the fourth band) are a combination of bands that can be received simultaneously. That is, the signal of band AL (the first band) and the signal of band AM (the third band) can be received simultaneously, and the signal of band BL (the second band) and the signal of band BM (the fourth band) can be received simultaneously.

[0034] Input bump 102 is an example of a first input bump and is connected to the input ends of filter 100d and filter 100b. Input bump 101 is an example of a second input bump and is connected to the input ends of filter 100c and filter 100a.

[0035] According to this, for the input bump 101, the input terminals of two filters 100a and 100c that can be received simultaneously are commonly connected, and for the input bump 102, the input terminals of two filters 100b and 100d that can be received simultaneously are commonly connected. Therefore, the number of input bumps of the composite filter component 10 can be reduced, and the size can be reduced. Furthermore, since the number of input bumps of the composite filter component 10 is reduced, the number of terminals of the switch 20 can be reduced, and thus the off-capacitance generated at the terminals of the switch 20 can be reduced.

[0036] The output bump 114 is an example of the first output bump and is connected to the output terminal of the filter 100d. The output bump 113 is an example of the second output bump and is connected to the output terminal of the filter 100c. The output bump 112 is an example of the third output bump and is connected to the output terminal of the filter 100b. The output bump 111 is an example of the fourth output bump and is connected to the output terminal of the filter 100a.

[0037] Among the output bumps 111 to 114, the output bump 111 and the output bump 112 are arranged adjacent to each other, and the output bump 113 and the output bump 114 are arranged adjacent to each other.

[0038] The low-noise amplifier 32 is an example of the first low-noise amplifier and is capable of amplifying the signals of ALR and BLR. Since the bands AL and BL are a combination of bands that are not received simultaneously with each other, the low-noise amplifier 32 can be connected to both the filter 100d including ALR in its passband and the filter 100c including BLR in its passband. Thus, the input terminal of the low-noise amplifier 32 is connected to the output bumps 113 and 114 via the switch 22.

[0039] The low-noise amplifier 31 is an example of the second low-noise amplifier and is capable of amplifying the signals of AMR and BMR. Since the bands AM and BM are a combination of bands that are not received simultaneously with each other, the low-noise amplifier 31 can be connected to both the filter 100b including AMR in its passband and the filter 100a including BMR in its passband. Thus, the input terminal of the low-noise amplifier 31 is connected to the output bumps 111 and 112 via the switch 21.

[0040] Switch 20 is connected between the antenna connection terminal 200 and the composite filter component 10, and switches the connection between the antenna 2 and the input bump 101 and the connection between the antenna 2 and the input bump 102. Switch 21 is connected between the low noise amplifier 31 and the composite filter component 10, and switches the connection between the low noise amplifier 31 and the output bump 111 and the connection between the low noise amplifier 31 and the output bump 112. Switch 22 is connected between the low noise amplifier 32 and the composite filter component 10, and switches the connection between the low noise amplifier 32 and the output bump 113 and the connection between the low noise amplifier 32 and the output bump 114.

[0041] Inductor 41 is connected between the output bump 111 and the switch 21, and achieves impedance matching between the composite filter component 10 and the low noise amplifier 31. Inductor 42 is connected between the output bump 112 and the switch 21, and achieves impedance matching between the composite filter component 10 and the low noise amplifier 31. Inductor 43 is connected between the output bump 113 and the switch 22, and achieves impedance matching between the composite filter component 10 and the low noise amplifier 32. Inductor 44 is connected between the output bump 114 and the switch 22, and achieves impedance matching between the composite filter component 10 and the low noise amplifier 32. Each of the inductors 41 to 44 may be a matching circuit composed of at least one of an inductor and a capacitor. Further, the high-frequency module 1 of the present embodiment does not have to include at least one of the switches 20 to 22 and the inductors 41 to 44.

[0042] In a conventional composite filter component including a plurality of filters 100a to 100d, filters 100b (AMR) and 100d (ALR) that can be received simultaneously are connected to input bump 102, and filters 100a (BMR) and 100c (BLR) that can be received simultaneously are connected to input bump 101. In order to avoid crossing and shorten the wiring connecting the input bumps and each filter, in the composite filter component, filters 100b and 100d are arranged adjacent to each other, and filters 100a and 100c are arranged adjacent to each other. On the other hand, in order to avoid crossing and shorten the wiring connecting the output bumps and each filter, on the output side of the composite filter component, since filters 100b and 100d are arranged adjacent to each other, output bump 114 connected to filter 100d and output bump 112 connected to filter 100b are made adjacent to each other, and since filters 100a and 100c are arranged adjacent to each other, output bump 111 connected to filter 100a and output bump 113 connected to filter 100c are made adjacent to each other. In low-noise amplifiers 31 and 32 that receive the received signals output from the composite filter component, it is difficult to receive two signals received simultaneously with one low-noise amplifier, and it is desirable to distribute and receive the two signals to low-noise amplifiers 31 and 32 respectively. For this reason, the adjacent output bumps 112 and 114 are distributed and connected to the low-noise amplifiers 31 and 32, and the adjacent output bumps 111 and 113 are distributed and connected to the low-noise amplifiers 31 and 32. Then, in the region between the output bumps 111 to 114 and the low-noise amplifiers 31 and 32, the connection wiring crosses, and a parasitic capacitance due to the above crossing occurs near the input ends of the low-noise amplifiers 31 and 32. The closer the generated parasitic capacitance is to the input end of the low-noise amplifier, the worse the noise figure of the low-noise amplifier becomes.

[0043] On the other hand, in the above configuration of the composite filter component 10 according to the present embodiment, on the input side of the composite filter component 10, filters 100b (AMR) and 100d (ALR) that can be received simultaneously are connected to the input bump 102, and filters 100a (BMR) and 100c (BLR) that can be received simultaneously are connected to the input bump 101. On the output side of the composite filter component 10, the output bump 114 connected to the filter 100d and the output bump 113 connected to the filter 100c are adjacent to each other, and the output bump 112 connected to the filter 100b and the output bump 111 connected to the filter 100a are adjacent to each other. According to this, when connecting the filter 100d (output bump 114 connected thereto) and the filter 100c (output bump 113 connected thereto) that do not receive signals simultaneously to the low-noise amplifier 32, and connecting the filter 100b (output bump 112 connected thereto) and the filter 100a (output bump 111 connected thereto) that do not receive signals simultaneously to the low-noise amplifier 31, the filters 100a to 100d can be connected to the low-noise amplifiers 31 and 32 without crossing the wiring connecting the output bumps 111 to 114 to the low-noise amplifiers 31 and 32. As a result, it is possible to suppress the occurrence of parasitic capacitance caused by the crossing of the wiring in the vicinity of the input ends of the low-noise amplifiers 31 and 32.

[0044] Therefore, since no wiring crossing occurs in the region between the output bumps 111 to 114 and the low-noise amplifiers 31 and 32, it is possible to suppress the deterioration of the noise figure of the low-noise amplifiers 31 and 32, and suppress the deterioration of the amplification characteristics on the output side of the composite filter component 10.

[0045] In addition, since there is no wiring crossing between the output bumps 111 to 114 and the low-noise amplifiers 31 and 32, it is possible to reduce the height of the high-frequency module 1.

[0046] Note that the bands AL, AM, BL, BM, and the bands that appear in the following embodiments are frequency bands for a communication system constructed using radio access technology (RAT: Radio Access Technology), and are predefined by a standardization organization or the like (for example, 3GPP (registered trademark) and IEEE, etc.). Examples of communication systems include 5GNR (5th Generation New Radio) systems, LTE (Long Term Evolution) systems, and WLAN (Wireless Local Area Network) systems, etc.

[0047] Band AL is, for example, Band3 for LTE or n3 for 5GNR. Band AM is, for example, Band1 for LTE or n1 for 5GNR. Band BL is, for example, Band25 for LTE or n25 for 5GNR. Band BM is, for example, Band66 for LTE or n66 for 5GNR.

[0048] Also, the band combinations that can be received simultaneously are predefined by a standardization organization or the like. The band combinations that can be received simultaneously are defined, for example, as band combinations for CA, EN-DC, NR-DC (New Radio - Dual Connectivity), or NE-DC (New Radio E-UTRAN - Dual Connectivity).

[0049] FIG. 1B is a plan view of the high-frequency module 1 according to Embodiment 1. In the figure, an example of the layout configuration of each circuit component and bump constituting the high-frequency module 1 is shown. (a) of the figure is a view seen from the positive side of the z-axis looking at the main surface 90a side of the mounting substrate 90, and (b) of the figure is a perspective view of the main surface 90b side of the mounting substrate 90 seen from the positive side of the z-axis.

[0050] In addition, in FIG. 1B, illustration of the resin member covering the circuit components and the shield electrode layer formed on the surface of the resin member is omitted. Note that the resin member and the shield electrode layer may not be provided.

[0051] As shown in FIG. 1B, the high-frequency module 1 includes a mounting substrate 90, a composite filter component 10, low-noise amplifiers 31 and 32, switches 20 to 22, and inductors 41 to 44.

[0052] The composite filter component 10, the switch 20, and the inductors 41 to 44 are arranged on the main surface 90a of the mounting substrate 90. The switches 21 and 22, and the low-noise amplifiers 31 and 32 are arranged on the main surface 90b of the mounting substrate 90.

[0053] The mounting substrate 90 has main surfaces 90a (third main surface) and 90b (fourth main surface) facing each other. A ground electrode layer or the like is formed on the mounting substrate 90, the main surface 90a, and the main surface 90b. In FIG. 1B, the mounting substrate 90 has a rectangular shape in plan view, but the shape of the mounting substrate 90 is not limited thereto.

[0054] As the mounting substrate 90, for example, a low-temperature co-fired ceramics (LTCC) substrate or a high-temperature co-fired ceramics (HTCC) substrate having a stacked structure of a plurality of dielectric layers, a component-embedded substrate, a substrate having a redistribution layer (RDL), or a printed substrate or the like can be used, but is not limited thereto.

[0055] The composite filter component 10 has, for example, a form in which (1) it is formed into an IC chip on a silicon substrate, (2) filters 100a to 100d are accommodated in one package, (3) a plurality of piezoelectric substrates are joined via a support layer, or (4) filters 100a to 100d are arranged on one substrate.

[0056] Each of the inductors 41 to 44 is, for example, a surface mount chip inductor. Note that each of the inductors 41 to 44 may be composed of a coil conductor formed on the mounting substrate 90.

[0057] The low-noise amplifiers 31 and 32, and the switches 21 and 22 are formed in the IC 150.

[0058] Here, the output bumps 113 and 114 are arranged closer to the low-noise amplifier 32 than to the low-noise amplifier 31, and the output bumps 111 and 112 are arranged closer to the low-noise amplifier 31 than to the low-noise amplifier 32.

[0059] According to this, the wiring connecting the output bumps 113 and 114 to the low-noise amplifier 32, and the wiring connecting the output bumps 111 and 112 to the low-noise amplifier 31 can be shortened. Therefore, the high-frequency module 1 can be made low-loss and miniaturized.

[0060] Wiring 211a, 212a, 213a, and 214a are arranged on the main surface 90a of the mounting substrate 90, and wiring 211b, 212b, 213b, and 214b are arranged on the main surface 90b of the mounting substrate 90 and inside the mounting substrate 90.

[0061] One end of the wiring 211a is connected to the output bump 111, and the other end is connected to the inductor 41. One end of the wiring 211b is connected to the inductor 41, and the other end is connected to the switch 21. One end of the wiring 212a is connected to the output bump 112, and the other end is connected to the inductor 42. One end of the wiring 212b is connected to the inductor 42, and the other end is connected to the switch 21. One end of the wiring 213a is connected to the output bump 113, and the other end is connected to the inductor 43. One end of the wiring 213b is connected to the inductor 43, and the other end is connected to the switch 22. One end of the wiring 214a is connected to the output bump 114, and the other end is connected to the inductor 44. One end of the wiring 214b is connected to the inductor 44, and the other end is connected to the switch 22.

[0062] The output bumps 111 to 114 are arranged in the order of the output bumps 111, 112, 113, and 114 in the first direction (negative x-axis direction). On the other hand, the input bumps 101 and 102 are arranged in the order of the input bumps 101 and 102 in the first direction (negative x-axis direction).

[0063] According to the above configuration of the high-frequency module 1, the wirings 211a to 214a do not cross each other, and the wirings 211b to 214b do not cross each other. Thereby, it is possible to suppress the occurrence of parasitic capacitance caused by the crossing of the wirings in the vicinity of the input ends of the low-noise amplifiers 31 and 32. Therefore, it is possible to suppress the deterioration of the noise figure of the low-noise amplifiers 31 and 32.

[0064] In addition, since each of the wirings 211b to 214b includes a via conductor that penetrates between the main surface 90a and the main surface 90b, the wirings 211b to 214b can be shortened. Further, the circuit components constituting the high-frequency module 1 are distributed and arranged on both sides of the mounting substrate 90. Therefore, the high-frequency module 1 can be made low-loss and miniaturized.

[0065] [1.2 Structure of the composite filter component 10A according to Embodiment 1] FIG. 2A is a plan view and a cross-sectional view of the composite filter component 10A according to Embodiment 1. In the figure, an example of the arrangement configuration of each filter and each bump constituting the composite filter component 10A is shown. (a) in the figure is a view of the a-a plane seen from the positive z-axis side, (b) in the figure is a view of the b-b plane seen from the positive z-axis side, (c) in the figure is a view of the c-c plane seen from the positive z-axis side, (d) in the figure is a view of the d-d cross-section seen from the negative y-axis side, and (e) in the figure is a view of the e-e cross-section seen from the negative y-axis side. Note that the a-a plane is a plane parallel to the main surface 151 and between the opposing main surfaces of the filter chip 122. The b-b plane is a plane parallel to the main surface 153 and between the opposing main surfaces of the filter chip 121. The c-c plane is the main surface 153. The d-d cross-section is a plane perpendicular to the main surface 153 and passing through the output bumps 111 to 114. The e-e cross-section is a plane perpendicular to the main surface 153 and passing through the input bumps 101 and 102.

[0066] The composite filter component 10A includes filter chips 121 and 122 laminated on each other, and includes main surfaces 153 (first main surface) and 151 (second main surface) facing each other. The filter chip 121 is an example of a first layer portion and includes the main surface 153 (first main surface), the filter 100a (BMR), and the filter 100b (AMR). The filter chip 122 is an example of a second layer portion and includes the main surface 151 (second main surface), the filter 100c (BLR), and the filter 100d (ALR).

[0067] In this embodiment, the filter 100d is an example of a first filter and is connected to the input bump 102 (first input bump) and the output bump 114 (first output bump). The filter 100c is an example of a second filter and is connected to the input bump 101 (second input bump) and the output bump 113 (second output bump). The filter 100b is an example of a third filter and is connected to the input bump 102 (first input bump) and the output bump 112 (third output bump). The filter 100a is an example of a fourth filter and is connected to the input bump 101 (second input bump) and the output bump 111 (fourth output bump).

[0068] Each of the filter chips 121 (first layer portion) and 122 (second layer portion) has a form in which, for example, (1) it is formed into an IC chip on a silicon substrate, (2) two filters are accommodated in one package, or (3) the functional electrodes of two filters are formed on one piezoelectric substrate. Further, the composite filter component 10A has a form in which, for example, at least one of (1) bonding between electrodes, (2) bonding with an adhesive, and (3) resin molding is performed on the filter chips 121 and 122. In this embodiment, the filter chips 121 and 122 are bonded at the interface 152.

[0069] As shown in Fig. 2A (c), the composite filter component 10A has a rectangular shape when the main surface 153 is viewed in plan view, and has outer sides 301 (first outer side) and 303 (second outer side) facing each other, and outer sides 302 and 304 facing each other. Note that the composite filter component 10A may be polygonal when the main surface 153 is viewed in plan view.

[0070] The output bumps 111 to 114 are arranged in the order of the output bumps 111, 112, 113, and 114 in the first direction (negative x-axis direction) along the outer side 301 on the main surface 153. On the other hand, the input bumps 101 and 102 are arranged in the order of the input bumps 101 and 102 in the first direction (negative x-axis direction) in the region between the output bumps 111 to 114 and the outer side 303 on the main surface 153.

[0071] According to this, since no wiring crossover occurs in the region between the output bumps 111 to 114 and the low-noise amplifiers 31 and 32 arranged on the output side of the composite filter component 10A, deterioration of the noise figure of the low-noise amplifiers 31 and 32 can be suppressed, and deterioration of the amplification characteristics on the output side of the composite filter component 10A can be suppressed.

[0072] Note that the output bumps 111 to 114 do not have to be linearly arranged in the first direction as shown in Fig. 2A. The output bumps 111 to 114 only need to be arranged such that the output bump 111 and the output bump 112 are adjacent to each other, and the output bump 113 and the output bump 114 are adjacent to each other in the region between the outer side 301 and the input bumps 101 and 102.

[0073] The filters 100c and 100d are arranged in the order of the filters 100c and 100d in the first direction (negative x-axis direction). The filters 100a and 100b are arranged in the order of the filters 100a and 100b in the first direction (negative x-axis direction). When the main surfaces 151 and 153 are viewed in plan view, the filter 100c and the filter 100a at least partially overlap, and the filter 100d and the filter 100b at least partially overlap.

[0074] That is, in the composite filter component 10A according to the present embodiment, by arranging two filters that do not receive signals simultaneously on one filter chip, the isolation of two received signals received simultaneously is improved. Further, by arranging two filters that receive signals simultaneously so as to overlap in a plan view, the proximity and intersection of the wiring connected to the input bump 101 and the wiring connected to the input bump 102 are suppressed.

[0075] According to the above arrangement configuration, the wiring connecting the input bump 101 and the filters 100a and 100c does not intersect with the wiring connecting the input bump 102 and the filters 100b and 100d within the filter chip 121, and also does not intersect within the filter chip 122 (see (a), (b), and (e) of FIG. 2A). Also, the wiring connecting the output bump 111 and the filter 100a, the wiring connecting the output bump 112 and the filter 100b, the wiring connecting the output bump 113 and the filter 100c, and the wiring connecting the output bump 114 and the filter 100d do not intersect within the filter chip 121, and also do not intersect within the filter chip 122 (see (a), (b), and (d) of FIG. 2A).

[0076] That is, inside the composite filter component 10A, intersections of the wiring connecting the input bump and the filter within the filter chip do not occur, and intersections of the wiring connecting the output bump and the filter within the filter chip do not occur. As a result, the deterioration of the noise figure of the low-noise amplifiers 31 and 32 arranged on the output side of the composite filter component 10A can be further suppressed, and the isolation of the filters 100a to 100d within the composite filter component 10A can be improved. Therefore, the composite filter component 10A can transmit the received signals of ALR and AMR passing through simultaneously with low loss, and can transmit the received signals of BLR and BMR passing through simultaneously with low loss.

[0077] [1.3 Structure of the composite filter component 10B according to Embodiment 2] Figure 2B is a plan view and a cross-sectional view of the composite filter component 10B according to Example 2. In this figure, an example of the arrangement configuration of each filter and each bump constituting the composite filter component 10B is shown. (a) in this figure is a view of the a-a plane seen from the positive z-axis side, (b) in this figure is a view of the b-b plane seen from the positive z-axis side, (c) in this figure is a view of the c-c plane seen from the positive z-axis side, (d) in this figure is a view of the d-d cross-section seen from the negative y-axis side, and (e) in this figure is a view of the e-e cross-section seen from the negative y-axis side. Note that the a-a plane is a plane parallel to the main surface 151 and between the opposing main surfaces of the filter chip 122. Also, the b-b plane is a plane parallel to the main surface 153 and between the opposing main surfaces of the filter chip 121. Also, the c-c plane is the main surface 153. Also, the d-d cross-section is a plane perpendicular to the main surface 153 and passing through the output bumps 111 to 114. Also, the e-e cross-section is a plane perpendicular to the main surface 153 and passing through the input bumps 101 and 102.

[0078] Compared with the composite filter component 10A according to Example 1, the composite filter component 10B according to this example has a different arrangement configuration of the filters 100c and 100d in the filter chip 122. Therefore, hereinafter, for the composite filter component 10B according to this example, the description of the same configuration as that of the composite filter component 10A according to Example 1 will be omitted, and the description will focus on the configuration of the filter chip 122 different from that of the composite filter component 10A.

[0079] In this example, the filter 100d is an example of a first filter and is connected to the input bump 102 (first input bump) and the output bump 111 (fourth output bump). The filter 100c is an example of a second filter and is connected to the input bump 101 (second input bump) and the output bump 112 (third output bump). The filter 100b is an example of a third filter and is connected to the input bump 102 (first input bump) and the output bump 114 (first output bump). The filter 100a is an example of a fourth filter and is connected to the input bump 101 (second input bump) and the output bump 113 (second output bump).

[0080] Filters 100c and 100d are arranged in the order of filter 100d and 100c in the first direction (negative x-axis direction). Filters 100a and 100b are arranged in the order of filter 100a and 100b in the first direction (negative x-axis direction). When the main surfaces 151 and 153 are viewed in plan view, filter 100c and filter 100b overlap at least partially, and filter 100d and filter 100a overlap at least partially.

[0081] That is, in the composite filter component 10B according to the present embodiment, by arranging two filters that do not receive signals simultaneously on one filter chip, the isolation of two received signals received simultaneously is improved. In addition, by arranging two filters that receive signals simultaneously on different filter chips and arranging them so as not to overlap in plan view, the distance between the two filters that receive signals simultaneously is ensured, and the isolation of the two received signals received simultaneously is further improved.

[0082] According to the above arrangement configuration, the wiring connecting the input bump 101 and filters 100a and 100c does not cross the wiring connecting the input bump 102 and filters 100b and 100d within the filter chip 121, and also does not cross within the filter chip 122 (see (a), (b), and (e) of FIG. 2B). Also, the wiring connecting the output bump 111 and filter 100d, the wiring connecting the output bump 112 and filter 100c, the wiring connecting the output bump 113 and filter 100a, and the wiring connecting the output bump 114 and filter 100b do not cross within the filter chip 121, and also do not cross within the filter chip 122 (see (a), (b), and (d) of FIG. 2B).

[0083] That is, inside the composite filter component 10B, no intersection of the wirings connecting the input bumps and the filter occurs within the filter chip, and no intersection of the wirings connecting the output bumps and the filter occurs within the filter chip. As a result, it is possible to suppress the deterioration of the noise figures of the low-noise amplifiers 31 and 32 arranged on the output side of the composite filter component 10B, and it is possible to improve the isolation of the filters 100a to 100d within the composite filter component 10B. Therefore, the composite filter component 10B can transmit the received signals of the simultaneously passing band ALR and the received signals of the band AMR with low loss, and can transmit the received signals of the simultaneously passing band BLR and the received signals of the band BMR with low loss.

[0084] [1.4 Structure of the composite filter component 10C according to Embodiment 3] FIG. 2C is a plan view and a cross-sectional view of the composite filter component 10C according to Embodiment 3. In the figure, an example of the arrangement configuration of each filter and each bump constituting the composite filter component 10C is shown. (a) in the figure is a view of the a-a plane seen from the positive z-axis side, (b) in the figure is a view of the b-b plane seen from the positive z-axis side, (c) in the figure is a view of the c-c plane seen from the positive z-axis side, (d) in the figure is a view of the d-d cross-section seen from the negative y-axis side, and (e) in the figure is a view of the e-e cross-section seen from the negative y-axis side. Note that the a-a plane is a plane parallel to the main surface 151 and between the opposing main surfaces of the filter chip 122. The b-b plane is a plane parallel to the main surface 153 and between the opposing main surfaces of the filter chip 121. The c-c plane is the main surface 153. The d-d cross-section is a plane perpendicular to the main surface 153 and passing through the output bumps 111 to 114. The e-e cross-section is a plane perpendicular to the main surface 153 and passing through the input bumps 101 and 102.

[0085] The composite filter component 10C according to this embodiment has a different arrangement configuration of the filters 100a to 100d in the filter chips 121 and 122 as compared with the composite filter component 10A according to Embodiment 1. Therefore, hereinafter, for the composite filter component 10C according to this embodiment, the description of the same configuration as that of the composite filter component 10A according to Embodiment 1 will be omitted, and the description will focus on the configurations of the filter chips 121 and 122 different from those of the composite filter component 10A.

[0086] The filter chip 121 is an example of the first layer portion and includes a main surface 153 (first main surface), a filter 100b (AMR), and a filter 100d (ALR). The filter chip 122 is an example of the second layer portion and includes a main surface 151 (second main surface), a filter 100a (BMR), and a filter 100c (BLR).

[0087] In this embodiment, the filter 100d is an example of the first filter and is connected to the input bump 102 (first input bump) and the output bump 114 (first output bump). The filter 100c is an example of the second filter and is connected to the input bump 101 (second input bump) and the output bump 113 (second output bump). The filter 100b is an example of the third filter and is connected to the input bump 102 (first input bump) and the output bump 112 (third output bump). The filter 100a is an example of the fourth filter and is connected to the input bump 101 (second input bump) and the output bump 111 (fourth output bump).

[0088] The filters 100b and 100d are arranged in the order of the filters 100b and 100d in the first direction (negative x-axis direction). The filters 100a and 100c are arranged in the order of the filters 100a and 100c in the first direction (negative x-axis direction). When the main surfaces 151 and 153 are viewed in plan, the filter 100c and the filter 100d at least partially overlap, and the filter 100a and the filter 100b at least partially overlap.

[0089] That is, in the composite filter component 10C according to the present embodiment, by arranging two filters received simultaneously on one filter chip, it is possible to avoid the wiring connecting the two filters received simultaneously and the output bump from being close to each other.

[0090] According to the above arrangement configuration, the wiring connecting the input bump 101 and the filters 100a and 100c does not cross the wiring connecting the input bump 102 and the filters 100b and 100d within the filter chip 121, and also does not cross within the filter chip 122 (see (a), (b) and (e) of FIG. 2C). Also, the wiring connecting the output bump 111 and the filter 100a, the wiring connecting the output bump 112 and the filter 100b, the wiring connecting the output bump 113 and the filter 100c, and the wiring connecting the output bump 114 and the filter 100d do not cross within the filter chip 121, and also do not cross within the filter chip 122 (see (a), (b) and (d) of FIG. 2C).

[0091] That is, inside the composite filter component 10C, no crossing occurs in the wiring connecting the input bump and the filter within the filter chip, and no crossing occurs in the wiring connecting the output bump and the filter within the filter chip. As a result, it is possible to suppress the deterioration of the noise figure of the low-noise amplifiers 31 and 32 arranged on the output side of the composite filter component 10C, and it is possible to improve the isolation of the filters 100a to 100d within the composite filter component 10C. Therefore, the composite filter component 10C can transmit the received signals of the band ALR and the band AMR passing through simultaneously with low loss, and can transmit the received signals of the band BLR and the band BMR passing through simultaneously with low loss.

[0092] [1.5 Structure of the composite filter component 10D according to Embodiment 4] FIG. 2D is a plan view and a cross-sectional view of the composite filter component 10D according to Example 4. In the figure, an example of the arrangement configuration of each filter and each bump constituting the composite filter component 10D is shown. (a) of the figure is a view of the a-a plane seen from the positive z-axis side, (b) of the figure is a view of the b-b plane seen from the positive z-axis side, (c) of the figure is a view of the c-c plane seen from the positive z-axis side, (d) of the figure is a view of the d-d cross-section seen from the negative y-axis side, and (e) of the figure is a view of the e-e cross-section seen from the negative y-axis side. Note that the a-a plane is a plane parallel to the main surface 151 and between the opposing main surfaces of the filter chip 122. Also, the b-b plane is a plane parallel to the main surface 153 and between the opposing main surfaces of the filter chip 121. Also, the c-c plane is the main surface 153. Also, the d-d cross-section is a plane perpendicular to the main surface 153 and passing through the output bumps 111 to 114. Also, the e-e cross-section is a plane perpendicular to the main surface 153 and passing through the input bumps 101 and 102.

[0093] Compared with the composite filter component 10A according to Example 1, the composite filter component 10D according to this example has a different arrangement configuration of the filters 100a to 100d in the filter chips 121 and 122. Therefore, hereinafter, for the composite filter component 10D according to this example, the description of the same configuration as that of the composite filter component 10A according to Example 1 will be omitted, and the description will focus on the configuration of the filter chips 121 and 122 that are different from the composite filter component 10A.

[0094] The filter chip 121 is an example of the first layer portion and includes a main surface 153 (first main surface), filters 100a (BMR), 100c (BLR), and 100d (ALR). The filter chip 122 is an example of the second layer portion and includes a main surface 151 (second main surface) and a filter 100b (AMR).

[0095] In this embodiment, the filter 100d is connected to the input bump 102 (first input bump) and the output bump 114 (first output bump). The filter 100c is connected to the input bump 101 (second input bump) and the output bump 113 (second output bump). The filter 100b is connected to the input bump 102 (first input bump) and the output bump 112 (third output bump). The filter 100a is connected to the input bump 101 (second input bump) and the output bump 111 (fourth output bump).

[0096] The filters 100a, 100c, and 100d are arranged in the order of the filters 100a, 100c, and 100d in the first direction (negative x-axis direction). When the main surfaces 151 and 153 are viewed in plan, the filter 100b and the filter 100d at least partially overlap.

[0097] That is, in the composite filter component 10D according to this embodiment, the two filters 100b and 100d that are simultaneously received are arranged so as to overlap in plan view, and the two filters 100a and 100c that are simultaneously received are arranged in one filter chip 121, thereby suppressing the proximity and intersection of the wiring connected to the input bump 101 and the wiring connected to the input bump 102. Further, by arranging the three filters 100a, 100c, and 100d in the filter chip 121 close to the output bumps 111 to 114, the wiring connecting the three filters and the output bumps is shortened.

[0098] According to the above-described arrangement configuration, the wiring connecting the input bump 101 and the filters 100a and 100c does not cross the wiring connecting the input bump 102 and the filters 100b and 100d within the filter chip 121, and also does not cross within the filter chip 122 (see (a), (b), and (e) of FIG. 2D). Also, the wiring connecting the output bump 111 and the filter 100a, the wiring connecting the output bump 112 and the filter 100b, the wiring connecting the output bump 113 and the filter 100c, and the wiring connecting the output bump 114 and the filter 100d do not cross within the filter chip 121, and also do not cross within the filter chip 122 (see (a), (b), and (d) of FIG. 2D).

[0099] That is, inside the composite filter component 10D, no crossing of the wiring connecting the input bump and the filter occurs within the filter chip, and no crossing of the wiring connecting the output bump and the filter occurs within the filter chip. As a result, it is possible to suppress deterioration of the noise figure of the low-noise amplifiers 31 and 32 arranged on the output side of the composite filter component 10D, and it is possible to improve the isolation of the filters 100a to 100d within the composite filter component 10D. Therefore, the composite filter component 10D can transmit the received signals of the simultaneously passing band ALR and the received signals of the band AMR with low loss, and can transmit the received signals of the simultaneously passing band BLR and the received signals of the band BMR with low loss.

[0100] Note that the arrangements of the filter 100d and the filter 100b may be interchanged. Also, the filter 100b may be arranged on the filter chip 121, and the filter 100a or the filter 100c may be arranged on the filter chip 122. In this case, the filter 100a and the filter 100c at least partially overlap in the above-described plan view.

[0101] [1.6 Stacked Structure of the Composite Filter Component 10A According to Embodiment 1] Next, a specific example of the stacked structure of the composite filter component 10A according to Embodiment 1 is shown. FIG. 3 is a detailed cross-sectional view of the composite filter component 10A according to Embodiment 1.

[0102] The composite filter component 10A includes filter chips 121 and 122 laminated on each other, and the filter chips 121 and 122 are joined by a support layer 325 disposed on the outer peripheral portion.

[0103] The filter chip 121 is an example of a first chip and includes a filter 100a (BMR) and a filter 100b (AMR). The filter chip 121 also includes a piezoelectric substrate 326. The filters 100a and 100b are surface acoustic wave filters formed on the piezoelectric substrate 326. The filter chip 122 is an example of a second chip and includes a filter 100c (BLR) and a filter 100d (ALR). The filter chip 122 also includes a piezoelectric substrate 327. The filters 100c and 100d are surface acoustic wave filters formed on the piezoelectric substrate 327.

[0104] On the main surface of the piezoelectric substrate 326 facing the piezoelectric substrate 327, an IDT electrode 330a constituting the filter 100a and an IDT electrode 330b constituting the filter 100b are formed. On the main surface of the piezoelectric substrate 327 facing the piezoelectric substrate 326, an IDT electrode 330c constituting the filter 100c and an IDT electrode 330d constituting the filter 100d are formed. That is, the IDT electrodes 330a to 330d and the wirings connected thereto are disposed in a hollow space surrounded by the piezoelectric substrates 326 and 327 and the support layer 325.

[0105] According to the above configuration, since the above hollow space is an air layer with a relative permittivity of 1, when the wiring formed on the piezoelectric substrate 326 and the wiring formed on the piezoelectric substrate 327 intersect in the plan view of the piezoelectric substrates 326 and 327, the parasitic capacitance generated is smaller than the parasitic capacitance generated when the wirings formed on the dielectric substrate intersect. Therefore, it is possible to improve the isolation between the filters 100a and 100b and the filters 100c and 100d. Also, the wiring formed in the above hollow space can ensure a larger distance from the ground layer formed on the mounting substrate 90 than, for example, the wiring formed on the main surface of the piezoelectric substrate 326 facing the mounting substrate 90, and can reduce the parasitic capacitance generated between the composite filter component 10A and the mounting substrate 90.

[0106] Therefore, the composite filter component 10A can transmit the received signals of the simultaneously passing band ALR and the received signals of the band AMR with low loss, and can transmit the received signals of the simultaneously passing band BLR and the received signals of the band BMR with low loss.

[0107] Note that the above configuration in which each of the filter chips 121 and 122 includes a piezoelectric substrate and the IDT electrode and the wiring connected thereto are arranged in the hollow space between the filter chip 121 and the filter chip 122 may be applied to the composite filter components 10B, 10C, and 10D.

[0108] [Configuration of the high-frequency module 1A according to the first modification] FIG. 4 is a circuit configuration diagram of the high-frequency module 1A according to Modification 1 of Embodiment 1. As shown in the figure, the high-frequency module 1A according to this modification includes a composite filter component 11, low-noise amplifiers 31 and 32, switches 20A, 21A, and 22A, inductors 41, 42, 43, 44, 45, and 46, an antenna connection terminal 200, and signal output terminals 110 and 120. The high-frequency module 1A according to this modification is different from the high-frequency module 1 according to Embodiment 1 in that there are three sets of two bands received simultaneously. Hereinafter, for the high-frequency module 1A according to this modification, the description of the same configuration as that of the high-frequency module 1 according to Embodiment 1 will be omitted, and the description will focus on the different configurations.

[0109] The composite filter component 11 includes filters 100a, 100b, 100c, 100d, 100e, and 100f, input bumps 101, 102, and 103, and output bumps 111, 112, 113, 114, 115, and 116.

[0110] The filter 100d has a first passband including the reception band (ALR) of the band AL (first band). The filter 100c has a second passband including the reception band (BLR) of the band BL (second band). The filter 100b has a third passband including the reception band (AMR) of the band AM (third band). The filter 100a has a fourth passband including the reception band (BMR) of the band BM (fourth band). The filter 100f has a fifth passband including the reception band (CLR) of the band CL (fifth band). The filter 100e has a sixth passband including the reception band (CMR) of the band CM (sixth band).

[0111] Filters 100d and 100c are, respectively, an example of one of the first filter and the second filter, and an example of the other of the first filter and the second filter. Filters 100b and 100a are, respectively, an example of one of the third filter and the fourth filter, and an example of the other of the third filter and the fourth filter. Filters 100f and 100e are, respectively, an example of one of the fifth filter and the sixth filter, and an example of the other of the fifth filter and the sixth filter.

[0112] Note that filters 100d and 100c may each be an example of one of the third filter and the fourth filter, and an example of the other of the third filter and the fourth filter. In that case, filters 100b and 100a are, respectively, an example of one of the first filter and the second filter, and an example of the other of the first filter and the second filter.

[0113] The signal of band AL (the first band) and the signal of band AM (the third band) can be received simultaneously. The signal of band BL (the second band) and the signal of band BM (the fourth band) can be received simultaneously. The signal of band CL (the fifth band) and the signal of band CM (the sixth band) can be received simultaneously.

[0114] Input bump 102 is an example of the first input bump and is connected to the input ends of filter 100d and filter 100b. Input bump 101 is an example of the second input bump and is connected to the input ends of filter 100c and filter 100a. Input bump 103 is an example of the third input bump and is connected to the input ends of filter 100e and filter 100f.

[0115] The output bump 114 is an example of a first output bump and is connected to the output terminal of the filter 100d. The output bump 113 is an example of a second output bump and is connected to the output terminal of the filter 100c. The output bump 112 is an example of a third output bump and is connected to the output terminal of the filter 100b. The output bump 111 is an example of a fourth output bump and is connected to the output terminal of the filter 100a. The output bump 116 is an example of a fifth output bump and is connected to the output terminal of the filter 100f. The output bump 115 is an example of a sixth output bump and is connected to the output terminal of the filter 100e.

[0116] Among the output bumps 111 to 116, the output bump 116 is arranged adjacent to at least one of the output bumps 114 and 113, and the output bump 115 is arranged adjacent to at least one of the output bumps 112 and 111.

[0117] Note that in the composite filter component 11 according to this modification example, the output bumps 111 to 116 are illustrated as being arranged in the order of output bumps 111, 112, 115, 113, 114, and 116. However, at least one of the output bumps 113, 114, and 116 is not arranged between the output bumps 111, 112, and 115, and at least one of the output bumps 111, 112, and 115 is not arranged between the output bumps 113, 114, and 116. For example, the output bumps 111 to 116 may be arranged in the order of output bumps 111, 115, 112, 113, 116, and 114. In this case, the output bump 116 is arranged adjacent to the output bumps 114 and 113, and the output bump 115 is arranged adjacent to the output bumps 112 and 111.

[0118] The low-noise amplifier 32 is an example of a first low-noise amplifier and is capable of amplifying the signals of ALR, BLR, and CLR. Since the bands AL, BL, and CL are a combination of bands that do not receive signals simultaneously, the low-noise amplifier 32 can be connected to the filter 100d including ALR in the passband, the filter 100c including BLR in the passband, and the filter 100f including CLR in the passband. From this, the input terminal of the low-noise amplifier 32 is connected to the output bumps 113, 114, and 116 via the switch 22A.

[0119] The low-noise amplifier 31 is an example of a second low-noise amplifier and is capable of amplifying the signals of AMR, BMR, and CMR. Since the bands AM, BM, and CM are a combination of bands that do not receive signals simultaneously, the low-noise amplifier 31 can be connected to the filter 100b including AMR in the passband, the filter 100a including BMR in the passband, and the filter 100e including CMR in the passband. From this, the input terminal of the low-noise amplifier 31 is connected to the output bumps 111, 112, and 115 via the switch 21A.

[0120] The switch 20A is connected between the antenna connection terminal 200 and the composite filter component 11 and switches the connection between the antenna 2 and the input bump 101, the connection between the antenna 2 and the input bump 102, and the connection between the antenna 2 and the input bump 103. The switch 21A is connected between the low-noise amplifier 31 and the composite filter component 11 and switches the connection between the low-noise amplifier 31 and the output bump 111, the connection between the low-noise amplifier 31 and the output bump 112, and the connection between the low-noise amplifier 31 and the output bump 115. The switch 22A is connected between the low-noise amplifier 32 and the composite filter component 11 and switches the connection between the low-noise amplifier 32 and the output bump 113, the connection between the low-noise amplifier 32 and the output bump 114, and the connection between the low-noise amplifier 32 and the output bump 116.

[0121] The inductor 45 is connected between the output bump 115 and the switch 21A, and impedance matching is achieved between the composite filter component 11 and the low-noise amplifier 31. The inductor 46 is connected between the output bump 116 and the switch 22A, and impedance matching is achieved between the composite filter component 11 and the low-noise amplifier 32. Further, the high-frequency module 1A of this modification example does not have to include at least one of the switches 20A to 22A and the inductors 41 to 46.

[0122] In the above configuration, on the input side of the composite filter component 11, the filters 100b (AMR) and 100d (ALR) that can be received simultaneously are connected to the input bump 102, the filters 100a (BMR) and 100c (BLR) that can be received simultaneously are connected to the input bump 101, and the filters 100e (CMR) and 100f (CLR) that can be received simultaneously are connected to the input bump 103. On the other hand, on the output side of the composite filter component 11, the output bump 114 connected to the filter 100d, the output bump 113 connected to the filter 100c, and the output bump 116 connected to the filter 100f are adjacent to each other, and the output bump 112 connected to the filter 100b, the output bump 111 connected to the filter 100a, and the output bump 115 connected to the filter 100e are adjacent to each other.

[0123] According to this, when connecting the filters 100d (output bumps 114 connected thereto), 100c (output bumps 113 connected thereto), and 100f (output bumps 116 connected thereto) that do not receive signals simultaneously to the low-noise amplifier 32, and connecting the filters 100b (output bumps 112 connected thereto), 100a (output bumps 111 connected thereto), and 100e (output bumps 115 connected thereto) that do not receive signals simultaneously to the low-noise amplifier 31, the filters 100a to 100f can be connected to the low-noise amplifiers 31 and 32 without crossing the wirings connecting the output bumps 111 to 116 and the low-noise amplifiers 31 and 32. Thereby, it is possible to suppress the occurrence of parasitic capacitance caused by the crossing of the wirings in the vicinity of the input ends of the low-noise amplifiers 31 and 32. According to this, since no crossing of the wirings occurs in the region between the output bumps 111 to 116 and the low-noise amplifiers 31 and 32, deterioration of the noise figure of the low-noise amplifiers 31 and 32 can be suppressed, and deterioration of the amplification characteristics on the output side of the composite filter component 11 can be suppressed.

[0124] Band AL is, for example, Band 3 for LTE or n3 for 5G NR. Band AM is, for example, Band 1 for LTE or n1 for 5G NR. Band BL is, for example, Band 25 for LTE or n25 for 5G NR. Band BM is, for example, Band 66 for LTE or n66 for 5G NR. Band CL is, for example, Band 39 for LTE or n39 for 5G NR. Band CM is, for example, Band 34 for LTE or n34 for 5G NR.

[0125] [1.8 Structure of the composite filter component 11A according to Example 5] As a specific configuration example of the composite filter component 11 included in the high-frequency module 1A according to the first modification, the composite filter component 11A according to the fifth embodiment is shown. FIG. 5 is a plan view and a cross-sectional view of the composite filter component 11A according to the fifth embodiment. In the figure, an example of the arrangement configuration of each filter and each bump constituting the composite filter component 11A is shown. (a) in the figure is a view of the a-a plane seen from the positive z-axis side, (b) in the figure is a view of the b-b plane seen from the positive z-axis side, (c) in the figure is a view of the c-c plane seen from the positive z-axis side, (d) in the figure is a view of the d-d cross-section seen from the negative y-axis side, and (e) in the figure is a view of the e-e cross-section seen from the negative y-axis side. Note that the a-a plane is a plane parallel to the main surface 154 and between the opposing main surfaces of the filter chip 124. Also, the b-b plane is a plane parallel to the main surface 156 and between the opposing main surfaces of the filter chip 123. Also, the c-c plane is the main surface 156. Also, the d-d cross-section is a plane perpendicular to the main surface 156 and passing through the output bumps 111 to 116. Also, the e-e cross-section is a plane perpendicular to the main surface 156 and passing through the input bumps 101 to 103.

[0126] The composite filter component 11A includes filter chips 123 and 124 laminated on each other, and includes main surfaces 156 (first main surface) and 154 (second main surface) facing each other. The filter chip 123 is an example of the first layer portion and includes the main surface 156 (first main surface), filters 100a (BMR), 100b (AMR), and 100e (CMR). The filter chip 124 is an example of the second layer portion and includes the main surface 154 (second main surface), filters 100c (BLR), 100d (ALR), and 100f (CLR).

[0127] In this embodiment, filter 100d is an example of a first filter and is connected to input bump 102 (first input bump) and output bump 114 (first output bump). Filter 100c is an example of a second filter and is connected to input bump 101 (second input bump) and output bump 113 (second output bump). Filter 100b is an example of a third filter and is connected to input bump 102 (first input bump) and output bump 112 (third output bump). Filter 100a is an example of a fourth filter and is connected to input bump 101 (second input bump) and output bump 111 (fourth output bump). Filter 100f is an example of a fifth filter and is connected to input bump 103 (third input bump) and output bump 116 (fifth output bump). Filter 100e is an example of a sixth filter and is connected to input bump 103 (third input bump) and output bump 115 (sixth output bump).

[0128] Each of filter chips 123 and 124 has a form in which, for example, (1) an IC chip is formed on a silicon substrate, (2) two filters are accommodated in one package, or (3) functional electrodes of two filters are formed on one piezoelectric substrate. Also, the composite filter component 11A has a form in which, for example, at least one of (1) bonding between electrodes, (2) bonding with an adhesive, and (3) resin molding is performed on filter chips 123 and 124. Filter chips 123 and 124 are joined at interface 155.

[0129] As shown in FIG. 5(c), the composite filter component 11A has a rectangular shape when viewed in plan on the main surface 156, and has outer sides 311 (first outer side) and 313 (second outer side) facing each other, and outer sides 312 and 314 facing each other. Note that the composite filter component 11A may be polygonal when viewed in plan on the main surface 156.

[0130] The output bumps 111 to 116 are arranged on the main surface 156 in the order of output bumps 111, 115, 112, 113, 116, and 114 in the first direction (negative x-axis direction) along the outer side 311. On the other hand, the input bumps 101 to 103 are arranged on the main surface 156 in the order of input bumps 101, 103, and 102 in the first direction (negative x-axis direction) in the region between the output bumps 111 to 116 and the outer side 313.

[0131] According to this, since no wiring crossing occurs in the region between the output bumps 111 to 116 and the low-noise amplifiers 31 and 32 arranged on the output side of the composite filter component 11A, deterioration of the noise figure of the low-noise amplifiers 31 and 32 can be suppressed, and deterioration of the amplification characteristics on the output side of the composite filter component 11A can be suppressed.

[0132] Note that the output bumps 111 to 116 do not have to be linearly arranged in the first direction as shown in FIG. 5. The output bumps 111 to 116 may be arranged such that the output bumps 111, 112, and 115 are adjacently arranged and the output bumps 113, 114, and 116 are adjacently arranged in the region between the outer side 311 and the input bumps 101 to 103.

[0133] The filters 100c, 100d, and 100f are arranged in the order of filters 100c, 100f, and 100d in the first direction (negative x-axis direction). The filters 100a, 100b, and 100e are arranged in the order of filters 100a, 100e, and 100b in the first direction (negative x-axis direction). When the main surfaces 154 and 156 are viewed in plan, the filter 100c and the filter 100a at least partially overlap, the filter 100e and the filter 100f at least partially overlap, and the filter 100d and the filter 100b at least partially overlap.

[0134] That is, in the composite filter component 11A according to the present embodiment, by arranging three filters that do not receive signals simultaneously on one filter chip, the isolation of two received signals received simultaneously is improved. Further, by arranging the two filters received simultaneously so as to overlap in a plan view, the proximity and intersection of the wiring connected to the input bump 101, the wiring connected to the input bump 102, and the wiring connected to the input bump 103 are suppressed.

[0135] According to the above arrangement configuration, the wiring connecting the input bump 101 and the filters 100a and 100c, the wiring connecting the input bump 102 and the filters 100b and 100d, and the wiring connecting the input bump 103 and the filters 100e and 100f do not cross within the filter chip 123 and do not cross within the filter chip 124 (see (a), (b), and (e) of FIG. 5). Further, the wiring connecting the output bump 111 and the filter 100a, the wiring connecting the output bump 112 and the filter 100b, the wiring connecting the output bump 113 and the filter 100c, the wiring connecting the output bump 114 and the filter 100d, the wiring connecting the output bump 115 and the filter 100e, and the wiring connecting the output bump 116 and the filter 100f do not cross within the filter chip 123 and do not cross within the filter chip 124 (see (a), (b), and (d) of FIG. 5).

[0136] That is, inside the composite filter component 11A, no intersection occurs between the wirings connecting the input bumps and the filter within the filter chip, and no intersection occurs between the wirings connecting the output bumps and the filter within the filter chip. As a result, the degradation of the noise figures of the low-noise amplifiers 31 and 32 arranged on the output side of the composite filter component 11A can be further suppressed, and the isolation of the filters 100a to 100f within the composite filter component 11A can be improved. Therefore, the composite filter component 11A can transmit the received signals of the simultaneously passing bands AL and AM with low loss, can transmit the received signals of the simultaneously passing bands BL and BM with low loss, and can transmit the received signals of the simultaneously passing bands CL and CM with low loss.

[0137] [1.9 Configuration of the high-frequency module 1B according to Modification 2] FIG. 6 is a circuit configuration diagram of the high-frequency module 1B according to Modification 2 of Embodiment 1. As shown in the figure, the high-frequency module 1B according to this modification includes a composite filter component 12, low-noise amplifiers 31, 32, and 33, switches 20B, 21B, 22B, and 23B, inductors 41 to 46, an antenna connection terminal 200, and signal output terminals 110, 120, and 130. The high-frequency module 1B according to this modification is different from the high-frequency module 1A according to Modification 1 in that three bands are received simultaneously. Hereinafter, for the high-frequency module 1B according to this modification, the description of the same configuration as that of the high-frequency module 1A according to Modification 1 will be omitted, and the description will be centered on the different configuration.

[0138] The composite filter component 12 includes filters 100a, 100b, 100c, 100d, 100e, 100f, 100g, and 100h, input bumps 101, 102, and 103, and output bumps 111, 112, 113, 114, 115, 116, 117, and 118.

[0139] Filter 100d has a first passband including the reception band (ALR) of band AL (the first band). Filter 100c has a second passband including the reception band (BLR) of band BL (the second band). Filter 100b has a third passband including the reception band (AMR) of band AM (the third band). Filter 100a has a fourth passband including the reception band (BMR) of band BM (the fourth band). Filter 100f has a fifth passband including the reception band (CLR) of band CL (the fifth band). Filter 100e has a sixth passband including the reception band (CMR) of band CM (the sixth band). Filter 100g has a seventh passband including the reception band (AHR) of band AH (the seventh band). Filter 100h has an eighth passband including the reception band (BHR) of band BH (the eighth band). Filters 100d and 100c are each an example of one of the first filter and the second filter, and the other example of the first filter and the second filter, respectively. Filters 100b and 100a are each an example of one of the third filter and the fourth filter, and the other example of the third filter and the fourth filter, respectively. Filters 100f and 100e are each an example of one of the fifth filter and the sixth filter, and the other example of the fifth filter and the sixth filter, respectively. Filters 100g and 100h are each an example of one of the seventh filter and the eighth filter, and the other example of the seventh filter and the eighth filter, respectively.

[0140] The signals of band AL (the first band), band AM (the third band), and band AH (the seventh band) can be received simultaneously. The signals of band BL (the second band), band BM (the fourth band), and band BH (the eighth band) can be received simultaneously. The signals of band CL (the fifth band) and band CM (the sixth band) can be received simultaneously.

[0141] The input bump 102 is an example of a first input bump and is connected to the input ends of the filter 100d, the filter 100b, and the filter 100g. The input bump 101 is an example of a second input bump and is connected to the input ends of the filter 100c, the filter 100a, and the filter 100h. The input bump 103 is an example of a third input bump and is connected to the input ends of the filter 100e and the filter 100f.

[0142] The output bump 114 is an example of a first output bump and is connected to the output end of the filter 100d. The output bump 113 is an example of a second output bump and is connected to the output end of the filter 100c. The output bump 112 is an example of a third output bump and is connected to the output end of the filter 100b. The output bump 111 is an example of a fourth output bump and is connected to the output end of the filter 100a. The output bump 116 is an example of a fifth output bump and is connected to the output end of the filter 100f. The output bump 115 is an example of a sixth output bump and is connected to the output end of the filter 100e. The output bump 118 is an example of a seventh output bump and is connected to the output end of the filter 100g. The output bump 117 is an example of an eighth output bump and is connected to the output end of the filter 100h.

[0143] Among the output bumps 111 to 114, 117, and 118, the output bump 114 and the output bump 113 are arranged adjacent to each other, the output bump 112 and the output bump 111 are arranged adjacent to each other, and the output bump 117 and the output bump 118 are arranged adjacent to each other.

[0144] In the composite filter component 12 according to this modified example, the output bumps 111, 112, and 115 are illustrated as being arranged in the order of the output bumps 111, 112, and 115. However, at least one of the output bumps 113, 114, 116, 117, and 118 may not be arranged between the output bumps 111, 112, and 115. Also, the output bumps 113, 114, and 116 are illustrated as being arranged in the order of the output bumps 113, 114, and 116. However, at least one of the output bumps 111, 112, 115, 117, and 118 may not be arranged between the output bumps 113, 114, and 116. For example, the output bumps 111, 112, and 115 may be arranged in the order of the output bumps 111, 115, and 112, or in the order of the output bumps 115, 111, and 112. For example, the output bumps 113, 114, and 116 may be arranged in the order of the output bumps 113, 116, and 114, or in the order of the output bumps 116, 113, and 114.

[0145] The low-noise amplifier 33 is an example of a third low-noise amplifier and is capable of amplifying the signals of AHR and BHR. Since the bands AH and BH are a combination of bands that do not receive signals simultaneously, the low-noise amplifier 33 can be connected to the filter 100g including AHR in the passband and the filter 100h including BHR in the passband. From this, the input terminal of the low-noise amplifier 33 is connected to the output bumps 117 and 118 via the switch 23B.

[0146] The switch 20B is connected between the antenna connection terminal 200 and the composite filter component 12. The switch 21B is connected between the low-noise amplifier 31 and the composite filter component 12. The switch 22B is connected between the low-noise amplifier 32 and the composite filter component 12. The switch 23B is connected between the low-noise amplifier 33 and the composite filter component 12.

[0147] Note that the high-frequency module 1B of this modified example does not have to include at least one of the switches 20B to 23B and the inductors 41 to 46.

[0148] In the above configuration, on the input side of the composite filter component 12, filters 100b (AMR), 100d (ALR), and 100g (AHR) that can be received simultaneously are connected to the input bump 102, and filters 100a (BMR), 100c (BLR), and 100h (BHR) that can be received simultaneously are connected to the input bump 101. On the other hand, on the output side of the composite filter component 12, the output bump 114 connected to the filter 100d and the output bump 113 connected to the filter 100c are adjacent, the output bump 112 connected to the filter 100b and the output bump 111 connected to the filter 100a are adjacent, and the output bump 118 connected to the filter 100g and the output bump 117 connected to the filter 100h are adjacent.

[0149] According to this, when connecting the filters 100d (output bump 114 connected thereto), 100c (output bump 113 connected thereto), and 100f (output bump 116 connected thereto) that do not receive signals simultaneously to the low-noise amplifier 32, the filters 100b (output bump 112 connected thereto), 100a (output bump 111 connected thereto), and 100e (output bump 115 connected thereto) that do not receive signals simultaneously to the low-noise amplifier 31, and the filters 100g (output bump 118 connected thereto) and 100h (output bump 117 connected thereto) that do not receive signals simultaneously to the low-noise amplifier 33, the filters 100a to 100h and the low-noise amplifiers 31 to 33 can be connected without crossing the wiring connecting the output bumps 111 to 118 and the low-noise amplifiers 31 to 33. Thereby, it is possible to suppress the occurrence of parasitic capacitance caused by the crossing of the wiring in the vicinity of the input ends of the low-noise amplifiers 31 to 33. According to this, since no wiring crossing occurs in the region between the output bumps 111 to 118 and the low-noise amplifiers 31 to 33, deterioration of the noise figure of the low-noise amplifiers 31 to 33 can be suppressed, and deterioration of the amplification characteristics on the output side of the composite filter component 12 can be suppressed.

[0150] Band AL is, for example, Band 3 for LTE or n3 for 5G NR. Band AM is, for example, Band 1 for LTE or n1 for 5G NR. Band BL is, for example, Band 25 for LTE or n25 for 5G NR. Band BM is, for example, Band 66 for LTE or n66 for 5G NR. Band CL is, for example, Band 39 for LTE or n39 for 5G NR. Band CM is, for example, Band 34 for LTE or n34 for 5G NR. Band AH is, for example, Band 40 for LTE or n40 for 5G NR. Band BH is, for example, Band 30 for LTE or n30 for 5G NR.

[0151] Note that in the high-frequency module 1B according to this modification example, the filters 100g or 100h may not be provided. In this case, in the arrangement configuration of the output bumps, it is desirable that the output bumps 111, 112, and 115 are arranged adjacent to each other, the output bumps 113, 114, and 116 are arranged adjacent to each other, and the output bump 117 or 118 is arranged alone between the output bumps 111, 112, and 115 and the output bumps 113, 114, and 116.

[0152] [1.10 Structure of the composite filter component 12A according to Example 6] As a specific configuration example of the composite filter component 12 included in the high-frequency module 1B according to Modification 2, the composite filter component 12A according to Example 6 is shown. FIG. 7A is a plan view and a cross-sectional view of the composite filter component 12A according to Example 6. In the figure, an arrangement configuration example of each filter and each bump constituting the composite filter component 12A is shown. (a) in the figure is a view of the a-a plane seen from the positive z-axis side, (b) in the figure is a view of the b-b plane seen from the positive z-axis side, (c) in the figure is a view of the c-c plane seen from the positive z-axis side, (d) in the figure is a view of the d-d cross-section seen from the negative y-axis side, and (e) in the figure is a view of the e-e cross-section seen from the negative y-axis side. Note that the a-a plane is a plane parallel to the main surface 157 and between the opposing main surfaces of the filter chip 126. Also, the b-b plane is a plane parallel to the main surface 159 and between the opposing main surfaces of the filter chip 125. Also, the c-c plane is the main surface 159. Also, the d-d cross-section is a plane perpendicular to the main surface 159 and passing through the output bumps 111 to 118. Also, the e-e cross-section is a plane perpendicular to the main surface 159 and passing through the input bumps 101 to 103.

[0153] The composite filter component 12A includes filter chips 125 and 126 laminated on each other, and includes main surfaces 159 (first main surface) and 157 (second main surface) facing each other. The filter chip 125 is an example of a first-layer portion, and includes a main surface 159 (first main surface), filters 100a (BMR), 100b (AMR), 100e (CMR), and 100g (AHR). The filter chip 126 is an example of a second-layer portion, and includes a main surface 157 (second main surface), filters 100c (BLR), 100d (ALR), 100f (CLR), and 100h (BHR).

[0154] In this embodiment, the filter 100d is an example of a first filter and is connected to the input bump 102 (first input bump) and the output bump 114 (first output bump). The filter 100c is an example of a second filter and is connected to the input bump 101 (second input bump) and the output bump 113 (second output bump). The filter 100b is an example of a third filter and is connected to the input bump 102 (first input bump) and the output bump 112 (third output bump). The filter 100a is an example of a fourth filter and is connected to the input bump 101 (second input bump) and the output bump 111 (fourth output bump). The filter 100f is an example of a fifth filter and is connected to the input bump 103 (third input bump) and the output bump 116 (fifth output bump). The filter 100e is an example of a sixth filter and is connected to the input bump 103 (third input bump) and the output bump 115 (sixth output bump). The filter 100g is an example of a seventh filter and is connected to the input bump 102 (first input bump) and the output bump 118 (seventh output bump). The filter 100h is an example of an eighth filter and is connected to the input bump 101 (second input bump) and the output bump 117 (eighth output bump).

[0155] As shown in FIG. 7A(c), the composite filter component 12A has a rectangular shape when the main surface 159 is viewed in plan view, and has outer sides 321 (first outer side) and 323 (second outer side) facing each other, and outer sides 322 and 324 facing each other. Note that the composite filter component 12A may be a polygon when the main surface 159 is viewed in plan view.

[0156] The output bumps 111 to 118 are arranged in the order of the output bumps 111, 115, 112, 117, 118, 113, 116, and 114 in a first direction (negative x-axis direction) along the outer side 321 on the main surface 159. On the other hand, the input bumps 101 to 103 are arranged in the order of the input bumps 101, 103, and 102 in the first direction (negative x-axis direction) in a region between the output bumps 111 to 118 and the outer side 323 on the main surface 159.

[0157] According to this, since wiring intersections do not occur in the region between the output bumps 111 to 118 and the low-noise amplifiers 31 to 33 arranged on the output side of the composite filter component 12A, deterioration of the noise figure of the low-noise amplifiers 31 to 33 can be suppressed, and deterioration of the amplification characteristics on the output side of the composite filter component 12A can be suppressed.

[0158] Note that the output bumps 111 to 118 do not have to be linearly arranged in the first direction as shown in FIG. 7A. The output bumps 111 to 118 may be arranged such that the output bumps 111, 112, and 115 are adjacent to each other, the output bumps 113, 114, and 116 are adjacent to each other, and the output bumps 117 and 118 are adjacent to each other in the region between the outer side 321 and the input bumps 101 to 103.

[0159] The filters 100c, 100d, 100f, and 100h are arranged in the order of the filters 100h, 100c, 100f, and 100d in the first direction (negative x-axis direction). The filters 100a, 100b, 100e, and 100g are arranged in the order of the filters 100a, 100e, 100b, and 100g in the first direction (negative x-axis direction).

[0160] That is, in the composite filter component 12A according to the present embodiment, three filters 100a, 100c, and 100h that are simultaneously received are arranged close to the input bump 101, three filters 100b, 100d, and 100g that are simultaneously received are arranged close to the input bump 102, and two filters 100e and 100f that are simultaneously received are arranged close to the input bump 103, thereby suppressing the proximity and intersection of the wiring connected to the input bump 101, the wiring connected to the input bump 102, and the wiring connected to the input bump 103.

[0161] According to the above-described arrangement configuration, the wiring connecting the input bump 101 to the filters 100a, 100c, and 100h, the wiring connecting the input bump 102 to the filters 100b, 100d, and 100g, and the wiring connecting the input bump 103 to the filters 100e and 100f do not cross within the filter chip 125 and do not cross within the filter chip 126 (see (a), (b), and (e) of FIG. 7A). Also, the wiring connecting the output bump 111 to the filter 100a, the wiring connecting the output bump 112 to the filter 100b, the wiring connecting the output bump 113 to the filter 100c, the wiring connecting the output bump 114 to the filter 100d, the wiring connecting the output bump 115 to the filter 100e, the wiring connecting the output bump 116 to the filter 100f, the wiring connecting the output bump 117 to the filter 100h, and the wiring connecting the output bump 118 to the filter 100g do not cross within the filter chip 125 and do not cross within the filter chip 126 (see (a), (b), and (d) of FIG. 7A).

[0162] That is, inside the composite filter component 12A, no crossing of the wiring connecting the input bump and the filter within the filter chip occurs, and no crossing of the wiring connecting the output bump and the filter within the filter chip occurs. As a result, the deterioration of the noise figure of the low-noise amplifiers 31 to 33 arranged on the output side of the composite filter component 12A can be further suppressed, and the isolation of the filters 100a to 100h within the composite filter component 12A can be improved. Therefore, the composite filter component 12A can transmit the received signals of the bands AL, AM, and AH passing through simultaneously with low loss, can transmit the received signals of the bands BL, BM, and BH passing through simultaneously with low loss, and can transmit the received signals of the bands CL and CM passing through simultaneously with low loss.

[0163] [1.11 Structure of the composite filter component 12B according to Embodiment 7] As a specific configuration example of the composite filter component 12 included in the high-frequency module 1B according to the second modification, a composite filter component 12B according to the seventh embodiment is shown. FIG. 7B is a plan view and a cross-sectional view of the composite filter component 12B according to the seventh embodiment. The composite filter component 12B according to the present embodiment has a different arrangement configuration of each filter included in the filter chips 125 and 126 as compared with the composite filter component 12A according to the sixth embodiment. Hereinafter, for the composite filter component 12B according to the present embodiment, the description of the same configuration as that of the composite filter component 12A according to the sixth embodiment will be omitted, and the description will be centered on the different configuration.

[0164] The composite filter component 12B includes filter chips 125 and 126 laminated on each other, and includes main surfaces 159 (first main surface) and 157 (second main surface) facing each other. The filter chip 125 is an example of the first layer portion, and includes a main surface 159 (first main surface), filters 100b (AMR), 100d (ALR), 100e (CMR), and 100g (AHR). The filter chip 126 is an example of the second layer portion, and includes a main surface 157 (second main surface), filters 100a (BMR), 100c (BLR), 100f (CLR), and 100h (BHR).

[0165] As shown in FIG. 7B(c), the composite filter component 12B has a rectangular shape when the main surface 159 is viewed in plan, and has outer sides 321 (first outer side) and 323 (second outer side) facing each other, and outer sides 322 and 324 facing each other. Note that the composite filter component 12B may be polygonal when the main surface 159 is viewed in plan.

[0166] The output bumps 111 to 118 are arranged on the main surface 159 in the order of output bumps 115, 111, 112, 117, 118, 113, 114, and 116 in the first direction (negative x-axis direction) along the outer side 321. On the other hand, the input bumps 101 to 103 are arranged in the order of input bumps 101, 103, and 102 in the first direction (negative x-axis direction) in the region between the output bumps 111 to 118 and the outer side 323 on the main surface 159.

[0167] According to this, since no wiring crossing occurs in the region between the output bumps 111 to 118 and the low-noise amplifiers 31 to 33 arranged on the output side of the composite filter component 12B, deterioration of the noise figure of the low-noise amplifiers 31 to 33 can be suppressed, and deterioration of the amplification characteristics on the output side of the composite filter component 12B can be suppressed.

[0168] Note that the output bumps 111 to 118 do not have to be linearly arranged in the first direction as shown in FIG. 7B. The output bumps 111 to 118 may be arranged such that the output bumps 111, 112, and 115 are adjacently arranged, the output bumps 113, 114, and 116 are adjacently arranged, and the output bumps 117 and 118 are adjacently arranged in the region between the outer side 321 and the input bumps 101 to 103.

[0169] The filters 100a, 100c, 100f, and 100h are arranged in the order of the filters 100a, 100h, 100c, and 100f in the first direction (negative x-axis direction). The filters 100b, 100d, 100e, and 100g are arranged in the order of the filters 100e, 100b, 100g, and 100d in the first direction (negative x-axis direction).

[0170] That is, in the composite filter component 12B according to the present embodiment, three filters 100a, 100c, and 100h that are simultaneously received are arranged on the filter chip 126, and three filters 100b, 100d, and 100g that are simultaneously received are arranged on the filter chip 125. In addition, three filters 100a, 100b, and 100e that do not receive simultaneously are collectively arranged on the positive x-axis side, and three filters 100c, 100d, and 100f that do not receive simultaneously are collectively arranged on the negative x-axis side. As a result, each filter and the output bump connected to the filter are brought close to each other, and crossing of the wirings connected to the respective output bumps is suppressed.

[0171] Also, when band AL is Band 3 for LTE or n3 for 5G NR, band AM is Band 1 for LTE or n1 for 5G NR, band BL is Band 25 for LTE or n25 for 5G NR, band BM is Band 66 for LTE or n66 for 5G NR, band AH is Band 40 for LTE or n40 for 5G NR, and band BH is Band 30 for LTE or n30 for 5G NR, the frequency range including ALR, AMR, and AHR is wider than the frequency range including BLR, BMR, and BHR. When receiving multiple signals simultaneously, the so-called bundling loss increases as the above frequency range becomes wider. Also, when comparing filter chips 125 and 126, the filter chip 125 arranged closer to the input bump can have shorter connection wiring. From this perspective as well, filters 100b, 100d, and 100g are arranged on filter chip 125, and filters 100a, 100c, and 100h are arranged on filter chip 126. Thereby, the bundling loss of the composite filter component 12B can be reduced.

[0172] Also, when receiving signals of multiple bands simultaneously, the bundling loss in the low-frequency band increases. From this perspective, in filter chip 125, among filters 100b, 100d, and 100g connected to input bump 102, filter 100d is arranged closest to input bump 102. Thereby, the bundling loss of the composite filter component 12B can be reduced.

[0173] According to the above-described arrangement configuration, the wiring connecting the input bump 101 to the filters 100a, 100c, and 100h, the wiring connecting the input bump 102 to the filters 100b, 100d, and 100g, and the wiring connecting the input bump 103 to the filters 100e and 100f do not cross within the filter chip 125 and do not cross within the filter chip 126 (see (a), (b), and (e) of FIG. 7B). Also, the wiring connecting the output bump 111 to the filter 100a, the wiring connecting the output bump 112 to the filter 100b, the wiring connecting the output bump 113 to the filter 100c, the wiring connecting the output bump 114 to the filter 100d, the wiring connecting the output bump 115 to the filter 100e, the wiring connecting the output bump 116 to the filter 100f, the wiring connecting the output bump 117 to the filter 100h, and the wiring connecting the output bump 118 to the filter 100g do not cross within the filter chip 125 and do not cross within the filter chip 126 (see (a), (b), and (d) of FIG. 7B).

[0174] That is, inside the composite filter component 12B, no crossing of the wiring connecting the input bump and the filter within the filter chip occurs, and no crossing of the wiring connecting the output bump and the filter within the filter chip occurs. As a result, deterioration of the noise figure of the low-noise amplifiers 31 to 33 arranged on the output side of the composite filter component 12B can be further suppressed, and isolation of the filters 100a to 100h within the composite filter component 12B can be improved. Therefore, the composite filter component 12B can transmit the received signals of the simultaneously passing bands AL, AM, and AH with low loss, can transmit the received signals of the simultaneously passing bands BL, BM, and BH with low loss, and can transmit the received signals of the simultaneously passing bands CL and CM with low loss.

[0175] Note that in the composite filter component 12B according to this embodiment, the filters 100e and 100f may not be provided. In this case, the filter chip 125 includes the filters 100b, 100d, and 100g, and the filter chip 126 includes the filters 100a, 100c, and 100h. The filters 100a, 100c, and 100h are arranged in the order of the filters 100a, 100h, and 100c in the first direction, and the filters 100b, 100d, and 100g are arranged in the order of the filters 100b, 100g, and 100d in the first direction. Also, the input bumps 103, output bumps 117 and 118 are deleted, and the output bumps 111 to 116 are arranged on the main surface 159 in the order of the output bumps 115, 111, 112, 113, 114, and 116 in the first direction. On the other hand, the input bumps 101 and 102 are arranged in the order of the input bumps 101 and 102 in the first direction in the region on the main surface 159 between the output bumps 111 to 116 and the outer side 323.

[0176] [Configuration of the high-frequency module 1C according to Modification Example 3] FIG. 8A is a circuit configuration diagram of the high-frequency module 1C according to Modification Example 3 of Embodiment 1. As shown in the figure, the high-frequency module 1C according to this modification includes a composite filter component 13, low-noise amplifiers 31 and 32, a power amplifier 36, switches 20, 21, 22, and 24, inductors 41 to 44, an antenna connection terminal 200, signal output terminals 110 and 120, and a signal input terminal 140. The high-frequency module 1C according to this modification is different from the high-frequency module 1 according to Embodiment 1 in that a transmission circuit is added. Hereinafter, regarding the high-frequency module 1C according to this modification, the description of the same configuration as that of the high-frequency module 1 according to Embodiment 1 will be omitted, and the description will focus on the different configuration.

[0177] The composite filter component 13 includes filters 100a, 100b, 100c, 100d, 100j, 100k, 100l, and 100m, input bumps 101, 102, 161, 162, 163, and 164, and output bumps 111, 112, 113, and 114.

[0178] Filters 100a to 100d have the same configuration as the filters 100a to 100d included in the composite filter component 10 according to Embodiment 1, and thus the description thereof is omitted.

[0179] Filter 100j has a passband including the transmission band (ALT) of band AL. Filter 100k has a passband including the transmission band (BLT) of band BL. Filter 100l has a passband including the transmission band (AMT) of band AM. Filter 100m has a passband including the transmission band (BMT) of band BM.

[0180] The signals of band AL (first band) and band AM (third band) can be transmitted and received simultaneously, and the signals of band BL (second band) and band BM (fourth band) can be transmitted and received simultaneously.

[0181] Input bump 102 is an example of a first input bump and is connected to the input end of filter 100d, the input end of filter 100b, the output end of filter 100j, and the output end of filter 100l. Input bump 101 is an example of a second input bump and is connected to the input end of filter 100c, the input end of filter 100a, the output end of filter 100k, and the output end of filter 100m.

[0182] Among output bumps 111 to 114, output bump 111 and output bump 112 are adjacently arranged, and output bump 113 and output bump 114 are adjacently arranged.

[0183] Input bump 161 is connected to the input end of filter 100j. Input bump 162 is connected to the input end of filter 100l. Input bump 163 is connected to the input end of filter 100k. Input bump 164 is connected to the input end of filter 100m.

[0184] Power amplifier 36 can amplify the signals of ALT, AMT, BLT, and BMT.

[0185] Switch 20 is connected between the antenna connection terminal 200 and the composite filter component 13. Switch 21 is connected between the low-noise amplifier 31 and the composite filter component 13. Switch 22 is connected between the low-noise amplifier 32 and the composite filter component 13. Switch 24 is connected between the power amplifier 36 and the composite filter component 13.

[0186] Note that the high-frequency module 1C of this modified example does not necessarily include at least one of switches 20 to 22, 24 and inductors 41 to 44.

[0187] According to the above configuration, when connecting the filters 100d (output bumps 114 connected thereto) and 100c (output bumps 113 connected thereto) that do not receive signals simultaneously with each other to the low-noise amplifier 32, and connecting the filters 100b (output bumps 112 connected thereto) and 100a (output bumps 111 connected thereto) that do not receive signals simultaneously with each other to the low-noise amplifier 31, the filters 100a to 100d and the low-noise amplifiers 31 and 32 can be connected without crossing the wiring connecting the output bumps 111 to 114 and the low-noise amplifiers 31 and 32. As a result, it is possible to suppress the occurrence of parasitic capacitance caused by the crossing of the wiring in the vicinity of the input ends of the low-noise amplifiers 31 and 32. Therefore, it is possible to suppress the deterioration of the noise figure of the low-noise amplifiers 31 and 32, and it is possible to suppress the deterioration of the amplification characteristics on the output side of the composite filter component 13.

[0188] Next, as a specific configuration example of the composite filter component 13 included in the high-frequency module 1C according to the third modified example, the composite filter component 13A according to the eighth embodiment is shown. FIG. 8B is a plan view of the composite filter component 13A according to the eighth embodiment.

[0189] As shown in the figure, the composite filter component 13A has a rectangular shape when viewed in plan on the main surface 261, and has outer sides 331 and 333 facing each other, and outer sides 332 and 334 facing each other. Note that the composite filter component 13A may be polygonal when viewed in plan on the main surface 261.

[0190] The output bumps 111 to 114 are arranged on the main surface 261 in the order of output bumps 111, 112, 113, and 114 in the first direction (negative x-axis direction) along the outer side 331. On the other hand, the input bumps 101 and 102 are arranged on the main surface 261 in the order of input bumps 101 and 102 in the first direction (negative x-axis direction) in the region between the output bumps 111 to 114 and the outer side 333. Further, the input bumps 161 to 164 are arranged on the main surface 261 in the order of input bumps 164, 163, 162, and 161 in the first direction (negative x-axis direction) in the region between the input bumps 101 and 102 and the outer side 333.

[0191] According to this, since no wiring crossing occurs in the region between the output bumps 111 to 114 and the low-noise amplifiers 31 and 32 arranged on the output side of the composite filter component 13A, deterioration of the noise figure of the low-noise amplifiers 31 and 32 can be suppressed, and deterioration of the amplification characteristics on the output side of the composite filter component 13A can be suppressed.

[0192] Also, since the input bumps 161 to 164 through which the transmission signal passes are arranged away from the output bumps 111 to 114 through which only the reception signal passes, isolation between transmission and reception can be ensured.

[0193] Note that the output bumps 111 to 114 do not have to be linearly arranged in the first direction as shown in FIG. 8B. The output bumps 111 to 114 may be arranged such that the output bumps 111 and 112 are adjacently arranged and the output bumps 113 and 114 are adjacently arranged in the region between the outer side 331 and the input bumps 101 and 102.

[0194] In Modification 3 and Example 8, the band AL is, for example, Band 3 for LTE or n3 for 5G NR. The band AM is, for example, Band 1 for LTE or n1 for 5G NR. The band BL is, for example, Band 25 for LTE or n25 for 5G NR. The band BM is, for example, Band 66 for LTE or n66 for 5G NR.

[0195] In this case, the frequencies of ALT (B3T) and BMT (B66T) partially overlap. In contrast, as shown in FIG. 8B, between the input bump 161 through which the signal of ALT passes and the input bump 164 through which the signal of BMT passes, input bumps 162 and 163 through which the signals of AMT and BLT whose frequencies do not overlap with those of ALT and BMT pass are arranged.

[0196] According to this, isolation between the wirings connecting the input bumps 161 to 164 and the power amplifier 36 can be ensured.

[0197] [Configuration of the high-frequency module 1D according to Modification 4] FIG. 9A is a circuit configuration diagram of the high-frequency module 1D according to Modification 4 of Embodiment 1. As shown in the figure, the high-frequency module 1D according to this modification includes a composite filter component 14, low-noise amplifiers 31 and 32, a power amplifier 36, switches 20A, 21A, 22A, and 25, an antenna connection terminal 200, signal output terminals 110 and 120, and a signal input terminal 140. The high-frequency module 1D according to this modification is different from the high-frequency module 1C according to Modification 3 in that the composite filter component 14 includes a filter for TDD. Hereinafter, regarding the high-frequency module 1D according to this modification, the description of the same configuration as that of the high-frequency module 1C according to Modification 3 will be omitted, and the description will focus on the different configuration.

[0198] The composite filter component 14 includes filters 100a, 100b, 100c, 100d, 100e, 100f, 100j, 100k, 100l, and 100m, input bumps 101, 102, 103, 161, 162, 163, and 164, output bumps 111, 112, 113, and 114, and input / output bumps 165 and 166.

[0199] Since the filters 100a to 100d and 100j to 100m have the same configuration as the filters 100a to 100d and 100j to 100m included in the composite filter component 13 according to Modification 3, the description thereof will be omitted.

[0200] Filter 100f has a fifth passband that includes the transmission band and the reception band (CLTR) of band CL (the fifth band). Filter 100e has a sixth passband that includes the transmission band and the reception band (CMTR) of band CM (the sixth band). Filters 100f and 100e are filters for TDD that allow transmission signals and reception signals to pass through in a time-division manner.

[0201] The signals of band AL (the first band) and the signals of band AM (the third band) can be transmitted and received simultaneously. The signals of band BL (the second band) and the signals of band BM (the fourth band) can be transmitted and received simultaneously. The signals of band CL (the fifth band) and the signals of band CM (the sixth band) can be transmitted simultaneously and can also be received simultaneously.

[0202] Input bump 102 is an example of a first input bump and is connected to the input end of filter 100d, the input end of filter 100b, the output end of filter 100j, and the output end of filter 100l. Input bump 101 is an example of a second input bump and is connected to the input end of filter 100c, the input end of filter 100a, the output end of filter 100k, and the output end of filter 100m. Input bump 103 is an example of a third input bump and is connected to one end of filter 100e and one end of filter 100f.

[0203] Among output bumps 111 to 114, output bump 111 and output bump 112 are arranged adjacent to each other, and output bump 113 and output bump 114 are arranged adjacent to each other.

[0204] Input bump 161 is connected to the input end of filter 100j. Input bump 162 is connected to the input end of filter 100l. Input bump 163 is connected to the input end of filter 100k. Input bump 164 is connected to the input end of filter 100m.

[0205] The input / output bump 165 is an example of the sixth output bump and is connected to the other end of the filter 100e. The input / output bump 166 is an example of the fifth output bump and is connected to the other end of the filter 100f.

[0206] The power amplifier 36 is capable of amplifying the signals of ALT, AMT, BLT, BMT, CLTR, and CMTR.

[0207] The switch 20A is connected between the antenna connection terminal 200 and the composite filter component 14. The switch 21A is connected between the low-noise amplifier 31 and the composite filter component 14. The switch 22A is connected between the low-noise amplifier 32 and the composite filter component 14. The switch 25 is connected between the power amplifier 36 and the composite filter component 14.

[0208] Note that the high-frequency module 1D of this modification example may not include at least one of the switches 20A to 22A and 25.

[0209] According to the above configuration, when connecting the filters 100d (output bump 114 connected thereto) and 100c (output bump 113 connected thereto) that do not perform simultaneous reception to the low-noise amplifier 32, and connecting the filters 100b (output bump 112 connected thereto) and 100a (output bump 111 connected thereto) that do not perform simultaneous reception to the low-noise amplifier 31, the filters 100a to 100d can be connected to the low-noise amplifiers 31 and 32 without crossing the wiring connecting the output bumps 111 to 114 and the low-noise amplifiers 31 and 32. Thereby, it is possible to suppress the occurrence of parasitic capacitance caused by the crossing of the wiring in the vicinity of the input ends of the low-noise amplifiers 31 and 32. Therefore, it is possible to suppress the deterioration of the noise figure of the low-noise amplifiers 31 and 32 and suppress the deterioration of the amplification characteristics on the output side of the composite filter component 14.

[0210] Next, as a specific configuration example of the composite filter component 14 included in the high-frequency module 1D according to Modification Example 4, the composite filter component 14A according to Embodiment 9 is shown. FIG. 9B is a plan view of the composite filter component 14A according to Embodiment 9.

[0211] As shown in the figure, the composite filter component 14A has a rectangular shape when the main surface 171 is viewed in plan view, and has outer sides 341 and 343 facing each other, and outer sides 342 and 344 facing each other. Note that the composite filter component 14A may be polygonal when the main surface 171 is viewed in plan view.

[0212] The output bumps 111 to 114 and the input / output bumps 165 to 166 are arranged on the main surface 171 in the order of the output bumps 111, 112, 113, 114, the input / output bumps 165 and 166 in the first direction (negative x-axis direction) along the outer side 341. On the other hand, the input bumps 101 to 103 are arranged on the main surface 171 in the order of the input bumps 101, 102, and 103 in the first direction (negative x-axis direction) in the region between the output bumps 111 to 114 and the input / output bumps 165 to 166 and the outer side 343. Further, the input bumps 161 to 164 are arranged on the main surface 171 in the order of the input bumps 164, 163, 162, and 161 in the first direction (negative x-axis direction) in the region between the input bumps 101 to 103 and the outer side 343.

[0213] According to this, in the region between the output bumps 111 to 114 and the low-noise amplifiers 31 and 32 arranged on the output side of the composite filter component 14A, no intersection of the wiring connecting the output bumps 111 to 114 and the low-noise amplifiers 31 and 32 occurs. Therefore, when simultaneously receiving the received signal of band AL and the received signal of band AM, and when simultaneously receiving the received signal of band BL and the received signal of band BM, the deterioration of the noise figure of the low-noise amplifiers 31 and 32 can be suppressed, and the deterioration of the amplification characteristics on the output side of the composite filter component 14A can be suppressed.

[0214] In addition, since the input bumps 161 to 164 and the input / output bumps 165 to 166 through which the transmission signal passes are arranged away from the output bumps 111 to 114 through which only the received signal passes, isolation between transmission and reception can be ensured.

[0215] Note that the output bumps 111 to 114 do not have to be linearly arranged in the first direction as shown in FIG. 9B. The output bumps 111 to 114 may be in the region between the outer side 341 and the input bumps 101 to 103, as long as the output bumps 111 and 112 are adjacently arranged and the output bumps 113 and 114 are adjacently arranged.

[0216] Also, in the composite filter component 14A according to this embodiment, the filters 100j to 100m do not have to be provided. In this case, in the arrangement configuration of the input bumps and output bumps shown in FIG. 9B, the input bumps 161 to 164 may be deleted, and the arrangement configurations of the input bumps 101 to 103, the output bumps 111 to 114, and the input / output bumps 165 to 166 do not change.

[0217] Note that in Modification 4 and Embodiment 9, the band AL is, for example, Band 3 for LTE or n3 for 5G NR. The band AM is, for example, Band 1 for LTE or n1 for 5G NR. The band BL is, for example, Band 25 for LTE or n25 for 5G NR. The band BM is, for example, Band 66 for LTE or n66 for 5G NR. The band CL is, for example, Band 39 for LTE or n39 for 5G NR. The band CM is, for example, Band 34 for LTE or n34 for 5G NR.

[0218] In this case, the frequencies of ALT (B3T) and BMT (B66T) partially overlap. On the other hand, as shown in FIG. 9B, between the input bump 161 through which the signal of ALT passes and the input bump 164 through which the signal of BMT passes, input bumps 162 and 163 through which the signals of AMT and BLT that do not overlap in frequency with ALT and BMT pass are arranged.

[0219] Accordingly, isolation between the wirings connecting the input bumps 161 to 164 and the power amplifier 36 can be ensured.

[0220] [1.14 Configuration of the high-frequency module 1E according to Modification 5] FIG. 10A is a circuit configuration diagram of the high-frequency module 1E according to Modification 5 of Embodiment 1. As shown in the figure, the high-frequency module 1E according to this modification includes a composite filter component 15, low-noise amplifiers 31 and 32, a power amplifier 36, switches 20, 21, 22, and 26, an antenna connection terminal 200, signal output terminals 110 and 120, and a signal input terminal 140. The high-frequency module 1E according to this modification is different from the high-frequency module 1C according to Modification 3 in that the number of input bumps connected to the transmission filter included in the composite filter component 15 is larger. Hereinafter, for the high-frequency module 1E according to this modification, the description of the same configuration as that of the high-frequency module 1C according to Modification 3 will be omitted, and the description will focus on the different configuration.

[0221] The composite filter component 15 includes filters 100a, 100b, 100c, 100d, 100j, 100k, 100l, 100m, 100n, and 100p (not shown), input bumps 101, 102, 161, 162, 163, 164, 167, and 168, and output bumps 111, 112, 113, and 114.

[0222] The filter 100d (ALR) is connected to the input bump 102 and the output bump 114. The filter 100c (BLR) is connected to the input bump 101 and the output bump 113. The filter 100b (AMR) is connected to the input bump 102 and the output bump 112. The filter 100a (BMR) is connected to the input bump 101 and the output bump 111.

[0223] The filter 100j (A1T) is connected to the input bumps 102 and 168. The filter 100k (A2T) is connected to the input bumps 102 and 167. The filter 100l (A3T) is connected to the input bumps 102 and 164. The filter 100m (A4T) is connected to the input bump 101 and 163. The filter 100n (A5T) is connected to the input bumps 101 and 162. The filter 100p (A6T) is connected to the input bumps 101 and 161.

[0224] In the composite filter component 15A according to this modified example and Example 10 described later, for example, ALR is a co-band including the reception bands of Band12, 13, and 14 for LTE or a co-band including the reception bands of n12, 13, and 14 for 5GNR. AMR is, for example, the reception band of Band5 for LTE or the reception band of n5 for 5GNR. BLR is, for example, a co-band including the reception bands of Band20 and 28 for LTE or a co-band including the reception bands of n20 and 28 for 5GNR. BMR is, for example, the reception band of Band8 for LTE or the reception band of n8 for 5GNR.

[0225] A1T is, for example, a co-band including the transmission bands of Band13 and 14 for LTE or a co-band including the transmission bands of n13 and 14 for 5GNR. A2T is, for example, the transmission band of Band12 for LTE or the transmission band of n12 for 5GNR. A3T is, for example, the transmission band of Band5 for LTE or the transmission band of n5 for 5GNR. A4T is, for example, the transmission band of Band28 for LTE or the transmission band of n28 for 5GNR. A5T is, for example, the transmission band of Band20 for LTE or the transmission band of n20 for 5GNR. A6T is, for example, the transmission band of Band8 for LTE or the transmission band of n8 for 5GNR.

[0226] The signals of ALR and AMR can be received simultaneously, and the signals of BLR and BMR can be received simultaneously.

[0227] The input bump 102 is an example of a first input bump and is connected to the input end of the filter 100d, the input end of the filter 100b, the output end of the filter 100j, the output end of the filter 100k, and the output end of the filter 100l. The input bump 101 is an example of a second input bump and is connected to the input end of the filter 100c, the input end of the filter 100a, the output end of the filter 100m, the output end of the filter 100n, and the output end of the filter 100p.

[0228] Among the output bumps 111 to 114, the output bump 111 and the output bump 112 are adjacently arranged, and the output bump 113 and the output bump 114 are adjacently arranged.

[0229] The power amplifier 36 can amplify the signals of A1T to A6T.

[0230] The switch 26 is connected between the power amplifier 36 and the composite filter component 15. Note that the high-frequency module 1E of this modification example does not necessarily include at least one of the switches 20 to 22 and 26.

[0231] According to the above configuration, when the filter 100d (output bump 114 connected thereto) and the filter 100c (output bump 113 connected thereto) that do not receive signals simultaneously are connected to the low-noise amplifier 32, and the filter 100b (output bump 112 connected thereto) and the filter 100a (output bump 111 connected thereto) that do not receive signals simultaneously are connected to the low-noise amplifier 31, the filters 100a to 100d can be connected to the low-noise amplifiers 31 and 32 without crossing the wiring connecting the output bumps 111 to 114 and the low-noise amplifiers 31 and 32. As a result, it is possible to suppress the occurrence of parasitic capacitance caused by the crossing of the wiring in the vicinity of the input ends of the low-noise amplifiers 31 and 32. Therefore, it is possible to suppress the deterioration of the noise figure of the low-noise amplifiers 31 and 32, and it is possible to suppress the deterioration of the amplification characteristics on the output side of the composite filter component 15.

[0232] Next, as a specific configuration example of the composite filter component 15 included in the high-frequency module 1E according to Modification Example 5, the composite filter component 15A according to Embodiment 10 is shown. FIG. 10B is a plan view of the composite filter component 15A according to Embodiment 10.

[0233] As shown in the figure, the composite filter component 15A has a rectangular shape when the main surface 181 is viewed in plan, and has outer sides 351 and 353 facing each other, and outer sides 352 and 354 facing each other. Note that the composite filter component 15A may be polygonal when the main surface 181 is viewed in plan.

[0234] The output bumps 111 to 114 are arranged on the main surface 181 in the order of the output bumps 111, 112, 113, and 114 in the first direction (negative x-axis direction) along the outer side 351. On the other hand, the input bumps 101 and 102 are arranged on the main surface 181 in the order of the input bumps 101 and 102 in the first direction (negative x-axis direction) in the region between the output bumps 111 to 114 and the outer side 353. Further, the input bumps 161 to 164 and 167 to 168 are arranged on the main surface 181 in the order of the input bumps 161, 162, 163, 164, 167, and 168 in the first direction (negative x-axis direction) in the region between the input bumps 101 to 102 and the outer side 353.

[0235] According to this, since no wiring crossing occurs in the region between the output bumps 111 to 114 and the low-noise amplifiers 31 and 32 arranged on the output side of the composite filter component 15A, deterioration of the noise figure of the low-noise amplifiers 31 and 32 can be suppressed, and deterioration of the amplification characteristics on the output side of the composite filter component 15A can be suppressed.

[0236] In addition, since the input bumps 161 to 164 and 167 to 168 through which the transmission signal passes are arranged away from the output bumps 111 to 114 through which only the reception signal passes, isolation between transmission and reception can be ensured.

[0237] Note that the output bumps 111 to 114 do not have to be linearly arranged in the first direction as shown in FIG. 10B. The output bumps 111 to 114 only need to be arranged such that the output bumps 111 and 112 are adjacently arranged and the output bumps 113 and 114 are adjacently arranged in the region between the outer side 341 and the input bumps 101 to 103.

[0238] Further, the filter 100d (ALR) is a filter having a passband that includes a coband including the reception bands of Bands 13 and 14 for LTE or a coband including the reception bands of n13 and 14 for 5G NR. Also, the filter 100c (BLR) is a filter having a passband that includes a coband including the reception bands of Bands 20 and 28 for LTE or a coband including the reception bands of n20 and 28 for 5G NR.

[0239] According to this, the number of output bumps on the reception side can be reduced, and the composite filter component 15A can be miniaturized. Also, since the number of wirings connecting the low-noise amplifiers 31 and 32 and the output bumps of the composite filter component 15A can be reduced, it is possible to suppress the proximity of the wirings to each other. Therefore, since the parasitic capacitance generated in the above wirings can be reduced, it is possible to suppress the deterioration of the noise figure of the low-noise amplifiers 31 and 32, and it is possible to suppress the deterioration of the amplification characteristics on the output side of the composite filter component 15A.

[0240] [Configuration of the high-frequency module 1F according to Modification Example 6] FIG. 11A is a circuit configuration diagram of the high-frequency module 1F according to Modification Example 6 of Embodiment 1. As shown in the figure, the high-frequency module 1F according to this modification includes a composite filter component 16, low-noise amplifiers 31, 32, and 33, switches 20B, 21B, 22B, and 23B, an antenna connection terminal 200, and signal output terminals 110, 120, and 130. The high-frequency module 1F according to this modification is mainly different from the high-frequency module 1B according to Modification Example 2 in that the number of input bumps provided in the composite filter component 16 is large. Hereinafter, for the high-frequency module 1F according to this modification, the description of the same configuration as that of the high-frequency module 1B according to Modification Example 2 will be omitted, and the description will focus on the different configuration.

[0241] The composite filter component 16 includes filters 100a, 100b, 100c, 100d, 100e, 100f, 100g, and 100h (not shown), input bumps 101, 102, 103, and 104, and output bumps 111, 112, 113, 114, 115, 116, 117, and 118.

[0242] Filter 100d (ALR) is connected to input bump 102 and output bump 114. Filter 100c (BLR) is connected to input bump 101 and output bump 113. Filter 100b (AMR) is connected to input bump 102 and output bump 112. Filter 100a (BMR) is connected to input bump 101 and output bump 111. Filter 100e (CMR) is connected to input bump 104 and output bump 115. Filter 100f (CLR) is connected to input bump 104 and output bump 116. Filter 100g (AHR) is connected to input bump 102 and output bump 117. Filter 100h (DLR) is connected to input bump 103 and output bump 118.

[0243] In this modified example and Example 11 described later, band AL is, for example, Band 3 for LTE or n3 for 5G NR. Band AM is, for example, Band 1 for LTE or n1 for 5G NR. Band BL is, for example, Band 25 for LTE or n25 for 5G NR. Band BM is, for example, Band 66 for LTE or n66 for 5G NR. Band CL is, for example, Band 39 for LTE or n39 for 5G NR. Band CM is, for example, Band 34 for LTE or n34 for 5G NR. Band AH is, for example, Band 32 for LTE or n32 for 5G NR. Band DL is, for example, the co-band of Band 11 and 21 for LTE or the co-band of n11 and 21 for 5G NR.

[0244] The signals of band AL, band AM, and band AH can be received simultaneously, the signals of band BL and band BM can be received simultaneously, and the signals of band CL and band CM can be received simultaneously.

[0245] The input bump 102 is connected to the input ends of the filter 100d (B3), the filter 100b (B1), and the filter 100g (B32). The input bump 101 is connected to the input ends of the filter 100c (B25) and the filter 100a (B66). The input bump 103 is connected only to the input end of the filter 100h (B11 / 21). The input bump 104 is connected to the input ends of the filter 100e (B34) and the filter 100f (B39).

[0246] The output bump 114 is connected to the output end of the filter 100d (B3). The output bump 113 is connected to the output end of the filter 100c (B25). The output bump 112 is connected to the output end of the filter 100b (B1). The output bump 111 is connected to the output end of the filter 100a (B66). The output bump 116 is connected to the output end of the filter 100f (B39). The output bump 115 is connected to the output end of the filter 100e (B34). The output bump 118 is connected to the output end of the filter 100h (B11 / 21). The output bump 117 is connected to the output end of the filter 100g (B32).

[0247] Among the output bumps 111 to 118, the output bump 114, the output bump 113, and the output bump 116 are arranged adjacent to each other, the output bump 112, the output bump 111, and the output bump 115 are arranged adjacent to each other, and the output bump 117 and the output bump 118 are arranged adjacent to each other.

[0248] The low-noise amplifier 31 can amplify the signals of AMR (B1), BMR (B66), and CMR (B34). Since the bands AM, BM, and CM are combinations of bands that do not receive signals simultaneously with each other, the low-noise amplifier 31 can be connected to the filter 100b including AMR in the passband, the filter 100a including BMR in the passband, and the filter 100e including CMR in the passband. Thus, the input end of the low-noise amplifier 31 is connected to the output bumps 111, 112, and 115 via the switch 21B.

[0249] The low-noise amplifier 32 can amplify the signals of ALR (B3), BLR (B25), and CLR (B39). Since the bands AL, BL, and CL are a combination of bands that do not receive signals simultaneously, the low-noise amplifier 32 can be connected to the filter 100d that includes ALR in its passband, the filter 100c that includes BLR in its passband, and the filter 100f that includes CLR in its passband. Thus, the input terminal of the low-noise amplifier 32 is connected to the output bumps 113, 114, and 116 via the switch 22B.

[0250] The low-noise amplifier 33 can amplify the signals of AHR (B32) and DLR (B11 / 21). Since the bands AH and DL are a combination of bands that do not receive signals simultaneously, the low-noise amplifier 33 can be connected to the filter 100g that includes AHR in its passband and the filter 100h that includes DLR in its passband. Thus, the input terminal of the low-noise amplifier 33 is connected to the output bumps 117 and 118 via the switch 23B.

[0251] The switch 20B is connected between the antenna connection terminal 200 and the composite filter component 16. The switch 21B is connected between the low-noise amplifier 31 and the composite filter component 16. The switch 22B is connected between the low-noise amplifier 32 and the composite filter component 16. The switch 23B is connected between the low-noise amplifier 33 and the composite filter component 16. Note that the high-frequency module 1F of this modification example does not necessarily include at least one of the switches 20B to 23B.

[0252] In the above configuration of the composite filter component 16 according to this modification example, on the input side of the composite filter component 16, the filters 100a (B66) and 100c (B25) that can be received simultaneously are connected to the input bump 101, the filters 100b (B1), 100d (B3) and 100g (B32) that can be received simultaneously are connected to the input bump 102, the filter 100h (B11 / 21) is connected to the input bump 103 alone, and the filters 100e (B34) and 100f (B39) that can be received simultaneously are connected to the input bump 104. On the other hand, on the output side of the composite filter component 16, the output bump 114 connected to the filter 100d (B3), the output bump 113 connected to the filter 100c (B25), and the output bump 116 connected to the filter 100f (B39) are adjacent to each other, the output bump 112 connected to the filter 100b (B1), the output bump 111 connected to the filter 100a (B66), and the output bump 115 connected to the filter 100e (B34) are adjacent to each other, and the output bump 117 connected to the filter 100g (B32) and the output bump 118 connected to the filter 100h (B11 / 21) are adjacent to each other. According to this, when connecting the filters 100d, 100c, and 100f that are not received simultaneously to the low-noise amplifier 32, connecting the filters 100b, 100a, and 100e that are not received simultaneously to the low-noise amplifier 31, and connecting the filters 100g and 100h that are not received simultaneously to the low-noise amplifier 33, the filters 100a to 100h and the low-noise amplifiers 31 to 33 can be connected without crossing the wiring connecting the output bumps 111 to 118 and the low-noise amplifiers 31 to 33. Thereby, it is possible to suppress the occurrence of parasitic capacitance caused by the crossing of the wiring in the vicinity of the input ends of the low-noise amplifiers 31 to 33. According to this, since no wiring crossing occurs in the region between the output bumps 111 to 118 and the low-noise amplifiers 31 to 33, it is possible to suppress the deterioration of the noise figure of the low-noise amplifiers 31 to 33 and suppress the deterioration of the amplification characteristics on the output side of the composite filter component 16.

[0253] Next, as a specific configuration example of the composite filter component 16 included in the high-frequency module 1F according to Modification Example 6, the composite filter component 16A according to Embodiment 11 is shown. FIG. 11B is a plan view of the composite filter component 16A according to Embodiment 11.

[0254] As shown in the figure, the composite filter component 16A has a rectangular shape when the main surface 191 is viewed in plan view, and has outer sides 361 and 363 facing each other, and outer sides 362 and 364 facing each other. Note that the composite filter component 16A may be polygonal when the main surface 191 is viewed in plan view.

[0255] The output bumps 111 to 118 are arranged in the order of output bumps 111, 112, 115, 117, 118, 113, 114, and 116 in the first direction (negative x-axis direction) along the outer side 361 on the main surface 191. On the other hand, the input bumps 101 to 104 are arranged in the order of input bumps 101, 102, 103, and 104 in the first direction (negative x-axis direction) in the region between the output bumps 111 to 118 and the outer side 363 on the main surface 191.

[0256] According to this, since no wiring crossover occurs in the region between the output bumps 111 to 118 and the low-noise amplifiers 31 to 33 arranged on the output side of the composite filter component 16A, deterioration of the noise figure of the low-noise amplifiers 31 to 33 can be suppressed, and deterioration of the amplification characteristics on the output side of the composite filter component 16A can be suppressed.

[0257] Note that the output bumps 111 to 118 do not have to be linearly arranged in the first direction as shown in FIG. 11B. The output bumps 111 to 118 may be arranged such that the output bumps 111, 112, and 115 are adjacent to each other, the output bumps 113, 114, and 116 are adjacent to each other, and the output bumps 117 and 118 are adjacent to each other in the region between the outer side 361 and the input bumps 101 to 104.

[0258] [1.16 Effects, etc.] As described above, the composite filter component 10 according to the present embodiment includes a filter 100d having a first passband including the reception band of band AL, a filter 100c having a second passband including the reception band of band BL, a filter 100b having a third passband including the reception band of band AM that can be received simultaneously with band AL, a filter 100a having a fourth passband including the reception band of band BM that can be received simultaneously with band BL, an input bump 102 connected to the input ends of the filter 100d and the filter 100b, an input bump 101 connected to the input ends of the filter 100c and the filter 100a, an output bump 114 connected to the output end of the filter 100d, an output bump 113 connected to the output end of the filter 100c, an output bump 112 connected to the output end of the filter 100b, and an output bump 111 connected to the output end of the filter 100a. Among the output bumps 111 to 114, the output bump 114 and the output bump 113 are arranged adjacent to each other, and the output bump 112 and the output bump 111 are arranged adjacent to each other.

[0259] According to this, when connecting the filters 100d and 100c that do not perform simultaneous reception to the low-noise amplifier 32 and connecting the filters 100b and 100a that do not perform simultaneous reception to the low-noise amplifier 31, the filters 100a to 100d and the low-noise amplifiers 31 and 32 can be connected without crossing the wiring connecting the output bumps 111 to 114 and the low-noise amplifiers 31 and 32. Thereby, it is possible to suppress the occurrence of parasitic capacitance caused by the crossing of the wiring in the vicinity of the input ends of the low-noise amplifiers 31 and 32. Therefore, it is possible to provide a multi-band compatible composite filter component 10 that can suppress the deterioration of the noise figure of the low-noise amplifiers 31 and 32.

[0260] For example, the composite filter components 10A to 10D have main surfaces 153 and 151 facing each other, and are polygons having outer sides 301 and 303 facing each other when the main surface 153 is viewed in plan. The output bumps 111 to 114 are arranged on the main surface 153 in the order of the output bumps 111, 112, 113, and 114 in a first direction along the outer side 301. The input bumps 101 and 102 are arranged on the main surface 153 between the output bumps 111 to 114 and the outer side 303.

[0261] According to this, since no wiring crossing occurs in the region between the output bumps 111 to 114 and the low-noise amplifiers 31 and 32 arranged on the output side of the composite filter components 10A to 10D, deterioration of the noise figure of the low-noise amplifiers 31 and 32 can be suppressed, and deterioration of the amplification characteristics on the output side of the composite filter components 10A to 10D can be suppressed.

[0262] For example, the composite filter component 10A according to the first embodiment includes filter chips 121 and 122 laminated on each other. The filter chip 121 includes the main surface 153, filters 100a and 100b. The filter chip 122 includes the main surface 151, filters 100c and 100d. The filters 100c and 100d are arranged in the order of the filter 100c and 100d in the first direction. The filters 100a and 100b are arranged in the order of the filter 100a and 100b in the first direction. When the main surfaces 151 and 153 are viewed in plan, the filter 100d and the filter 100b at least partially overlap, and the filter 100c and the filter 100a at least partially overlap.

[0263] According to this, by arranging two filters that do not receive signals simultaneously on one filter chip and arranging two filters that receive signals simultaneously on different filter chips, the isolation of two received signals received simultaneously can be improved. Further, by arranging two filters that receive signals simultaneously so as to overlap in plan view, proximity and crossing of the wiring connected to the input bump 101 and the wiring connected to the input bump 102 can be suppressed.

[0264] For example, the composite filter component 10B according to Example 2 includes filter chips 121 and 122 laminated on each other. The filter chip 121 includes a main surface 153, filters 100a and 100b. The filter chip 122 includes a main surface 151, filters 100c and 100d. The filters 100c and 100d are arranged in the order of filter 100d and 100c in the first direction. The filters 100a and 100b are arranged in the order of filter 100a and 100b in the first direction. When the main surfaces 151 and 153 are viewed in plan, the filter 100d and the filter 100a at least partially overlap, and the filter 100c and the filter 100b at least partially overlap.

[0265] According to this, by arranging two filters that do not receive signals simultaneously on one filter chip, arranging two filters that receive signals simultaneously on different filter chips, and further arranging them so as not to overlap in the above plan view, the isolation of two received signals received simultaneously can be improved.

[0266] For example, in the composite filter components 10A to 10D, the filter chip 121 includes a piezoelectric substrate 326, and the filters 100a and 100b are formed on the piezoelectric substrate 326. The filter chip 122 includes a piezoelectric substrate 327, and the filters 100c and 100d are formed on the piezoelectric substrate 327.

[0267] According to the above configuration, since the hollow space in which the IDT electrodes (functional electrodes) are formed on the piezoelectric substrates 326 and 327 is an air layer having a relative permittivity of 1, the parasitic capacitance generated when the wiring formed on the piezoelectric substrate 326 and the wiring formed on the piezoelectric substrate 327 intersect is smaller than the parasitic capacitance generated when the wiring formed on the dielectric substrate intersects. Therefore, it is possible to improve the isolation between the filters 100a and 100b and the filters 100c and 100d.

[0268] For example, the composite filter component 10C according to Example 3 includes filter chips 121 and 122 laminated on each other. The filter chip 121 includes a main surface 153, filters 100b and 100d. The filter chip 122 includes a main surface 151, filters 100a and 100c. The filters 100b and 100d are arranged in the order of filters 100b and 100d in the first direction. The filters 100a and 100c are arranged in the order of filters 100a and 100c in the first direction. When the main surfaces 151 and 153 are viewed in plan, the filter 100d and the filter 100c at least partially overlap, and the filter 100b and the filter 100a at least partially overlap.

[0269] According to this, by arranging two filters to be received simultaneously on one filter chip, it is possible to avoid the wiring connecting the two filters to be received simultaneously and the output bumps from being close to each other.

[0270] For example, in the composite filter component 10C, the filter chip 121 includes a piezoelectric substrate 326, and the filters 100b and 100d are formed on the piezoelectric substrate 326. The filter chip 122 includes a piezoelectric substrate 327, and the filters 100a and 100c are formed on the piezoelectric substrate 327.

[0271] According to the above configuration, since the hollow space in which the IDT electrodes (functional electrodes) are formed on the piezoelectric substrates 326 and 327 is an air layer having a relative permittivity of 1, the parasitic capacitance generated when the wiring formed on the piezoelectric substrate 326 and the wiring formed on the piezoelectric substrate 327 intersect is smaller than the parasitic capacitance generated when the wiring formed on the dielectric substrate intersects. Therefore, it is possible to improve the isolation between the filters 100b and 100d and the filters 100a and 100c.

[0272] For example, the composite filter component 11 according to Modification 1 further includes a filter 100f having a fifth passband including the reception band of the band CL, a filter 100e having a sixth passband including the reception band of the band CM that can be received simultaneously with the band CL and is different from the band CL, an input bump 103 connected to the input ends of the filter 100f and the filter 100e, an output bump 116 connected to the output end of the filter 100f, and an output bump 115 connected to the output end of the filter 100e. Among the output bumps 111 to 116, the output bump 116 is arranged adjacent to the output bumps 113 and 114, and the output bump 115 is arranged adjacent to the output bumps 111 and 112.

[0273] According to this, when connecting the non-simultaneously receiving filters 100d, 100c, and 100f to the low-noise amplifier 32 and connecting the non-simultaneously receiving filters 100a, 100b, and 100e to the low-noise amplifier 31, the filters 100a to 100f and the low-noise amplifiers 31 and 32 can be connected without crossing the wiring connecting the output bumps 111 to 116 and the low-noise amplifiers 31 and 32. Thereby, it is possible to suppress the occurrence of parasitic capacitance caused by the crossing of the wiring in the vicinity of the input ends of the low-noise amplifiers 31 and 32. Therefore, it is possible to provide a multi-band compatible composite filter component 11 that can suppress the deterioration of the noise figure of the low-noise amplifiers 31 and 32.

[0274] For example, the composite filter component 14A according to Example 9 further includes a filter 100f having a fifth passband including the transmission band and the reception band of the band CL, a filter 100e having a sixth passband including the transmission band and the reception band of the band CM, an input bump 103 connected to one end of the filter 100f and one end of the filter 100e, an input / output bump 166 connected to the other end of the filter 100f, and an input / output bump 165 connected to the other end of the filter 100e. Each of the filters 100f and 100e is a filter for TDD. The composite filter component 14A has a first main surface and a second main surface facing each other, and is a polygon having outer sides 341 and 343 facing each other when viewed in plan from the first main surface. The output bumps 111 to 114 and the input / output bumps 165 to 166 are arranged on the first main surface in the order of the output bumps 111, 112, 113, 114, the input / output bumps 165 and 166 in the first direction along the outer side 341. The input bumps 101 to 103 are arranged on the first main surface in the first direction in the region between the output bumps 111 to 114 and the input / output bumps 165 to 166 and the outer side 343 in the order of the input bumps 101, 102, and 103.

[0275] According to this, since no crossing of the wiring connecting the output bumps 111 to 114 and the low-noise amplifiers 31 and 32 arranged on the output side of the composite filter component 14A occurs in the region between the output bumps 111 to 114 and the low-noise amplifiers 31 and 32, when simultaneously receiving the reception signal of the band AL and the reception signal of the band AM, and when simultaneously receiving the reception signal of the band BL and the reception signal of the band BM, deterioration of the noise figure of the low-noise amplifiers 31 and 32 can be suppressed, and deterioration of the amplification characteristics on the output side of the composite filter component 14A can be suppressed. Further, since the input / output bumps 165 to 166 through which the transmission signal passes are arranged away from the output bumps 111 to 114 through which only the reception signal passes, isolation between transmission and reception can be ensured.

[0276] For example, the composite filter component 12 according to Modification 2 further includes a filter 100g having a seventh passband including a reception band of band AH that can be received simultaneously with bands AL and AM, different from bands AL and AM, and a filter 100h having an eighth passband including a reception band of band BH that can be received simultaneously with bands BL and BM, different from bands BL and BM, an output bump 118 connected to the output end of the filter 100g, and an output bump 117 connected to the output end of the filter 100h. The input bump 102 is connected to the input end of the filter 100d, the input end of the filter 100b, and the input end of the filter 100g. The input bump 101 is connected to the input end of the filter 100c, the input end of the filter 100a, and the input end of the filter 100h. Among the output bumps 111 to 114 and 117 to 118, the output bump 114 and the output bump 113 are arranged adjacent to each other, the output bump 112 and the output bump 111 are arranged adjacent to each other, and the output bump 118 and the output bump 117 are arranged adjacent to each other.

[0277] According to this, when connecting the non-simultaneously receiving filters 100d and 100c to the low-noise amplifier 32, the non-simultaneously receiving filters 100b and 100a to the low-noise amplifier 31, and the non-simultaneously receiving filters 100g and 100h to the low-noise amplifier 33, the filters 100a to 100d and 100g to 100h can be connected to the low-noise amplifiers 31 to 33 without crossing the wiring connecting the output bumps 111 to 114 and 117 to 118 and the low-noise amplifiers 31 to 33. Thereby, it is possible to suppress the occurrence of parasitic capacitance caused by the crossing of the wiring in the vicinity of the input ends of the low-noise amplifiers 31 to 33. Therefore, it is possible to provide a multi-band compatible composite filter component 12 that can suppress the deterioration of the noise figure of the low-noise amplifiers 31 to 33.

[0278] For example, the high-frequency modules 1, 1A to 1E according to Embodiment 1 include a mounting substrate 90 having main surfaces 90a and 90b facing each other, any one of the composite filter components 10 to 15 arranged on the mounting substrate 90, and low-noise amplifiers 31 and 32 arranged on the mounting substrate 90. The input end of the low-noise amplifier 32 is connected to output bumps 113 and 114, and the input end of the low-noise amplifier 31 is connected to output bumps 111 and 112.

[0279] According to this, it is possible to provide the multi-band compatible high-frequency modules 1, 1A to 1E that can suppress the deterioration of the noise figures of the low-noise amplifiers 31 and 32.

[0280] For example, in the high-frequency modules 1, 1A to 1E, the output bumps 113 and 114 are arranged closer to the low-noise amplifier 32 than to the low-noise amplifier 31, and the output bumps 111 and 112 are arranged closer to the low-noise amplifier 31 than to the low-noise amplifier 32.

[0281] According to this, the wiring connecting the output bumps 113 and 114 to the low-noise amplifier 32 and the wiring connecting the output bumps 111 and 112 to the low-noise amplifier 31 can be shortened. Therefore, the high-frequency modules 1, 1A to 1E can be made low-loss and miniaturized.

[0282] (Embodiment 2) In Embodiment 1, a configuration for suppressing the deterioration of the amplification characteristics by suppressing the wiring crosstalk of the reception circuit was exemplified. In this embodiment, a configuration for suppressing the deterioration of the amplification characteristics by suppressing the wiring crosstalk of the transmission circuit will be exemplified.

[0283] [2.1 Configuration of High-Frequency Module 5 and Communication Device 6] First, the circuit configuration and component layout configuration of the high-frequency module 5 and the communication device 6 according to the present embodiment will be described with reference to FIG. 12. FIG. 12 is a circuit configuration diagram of the high-frequency module 5 and the communication device 6 according to Embodiment 2. Note that FIG. 12 shows an exemplary circuit configuration of the high-frequency module 5 and the communication device 6, and the high-frequency module 5 and the communication device 6 can be implemented using any of a wide variety of circuit implementations and circuit technologies. Therefore, the descriptions of the high-frequency module 5 and the communication device 6 provided below should not be construed in a limiting sense.

[0284] The communication device 6 is implemented in a UE of a cellular network and is typically a mobile phone, a smartphone, a tablet computer, a wearable device, or the like. Note that the communication device 6 may be an IoT sensor device, a medical / healthcare device, a vehicle, a UAV, or an AGV. Further, the communication device 6 may be implemented in a BS of a cellular communication system.

[0285] As shown in FIG. 12, the communication device 6 includes a high-frequency module 5, an antenna 2, and an RFIC 3. The high-frequency module 5 can transmit a high-frequency signal between the antenna 2 and the RFIC 3. The internal configuration of the high-frequency module 5 will be described later.

[0286] The antenna 2 is connected to the antenna connection terminal 200 of the high-frequency module 5. The antenna 2 transmits the high-frequency signal supplied from the high-frequency module 5 to the outside of the communication device 6. Further, the antenna 2 may receive a high-frequency signal from the outside of the communication device 6 and supply it to the high-frequency module 5. Note that the antenna 2 may not be included in the communication device 6. Further, the communication device 6 may include a plurality of antennas.

[0287] RFIC3 is an example of a signal processing circuit that processes high-frequency signals. Specifically, RFIC3 processes the transmission signal input from the BBIC by up-conversion or the like, and outputs the high-frequency transmission signal generated by the signal processing to the high-frequency module 5. Further, RFIC3 may process the high-frequency reception signal input via the reception path of the high-frequency module 5 by down-conversion or the like, and output the reception signal generated by the signal processing to the BBIC.

[0288] Next, the circuit configuration of the high-frequency module 5 according to the present embodiment will be described. The high-frequency module 5 includes a composite filter component 50, power amplifiers 37 and 38, switches 20, 27, and 28, inductors 61, 62, 63, and 64, an antenna connection terminal 200, signal input terminals 310 and 320.

[0289] The composite filter component 50 includes filters 500a, 500b, 500c, and 500d, output bumps 501 and 502, and input bumps 511, 512, 513, and 514.

[0290] The filter 500d has a first passband including the transmission band (BLT) of the band BL (first band). The filter 500c has a second passband including the transmission band (ALT) of the band AL (second band). The filter 500b has a third passband including the transmission band (BMT) of the band BM (third band). The filter 500a has a fourth passband including the transmission band (AMT) of the band AM (fourth band). The filters 500d and 500c are respectively an example of one of the first filter and the second filter, and the other of the first filter and the second filter, and the filters 500b and 500a are respectively an example of one of the third filter and the fourth filter, and the other of the third filter and the fourth filter.

[0291] Note that the filters 500d and 500c may each be an example of one of the third filter and the fourth filter, and in this case, the filters 500b and 500a may each be an example of one of the first filter and the second filter, and the other of the first filter and the second filter.

[0292] The band BL (first band) and the band BM (third band) are a combination of bands that can be transmitted simultaneously, and the band AL (second band) and the band AM (fourth band) are a combination of bands that can be transmitted simultaneously. That is, the signal of the band BL (first band) and the signal of the band BM (third band) can be transmitted simultaneously, and the signal of the band AL (second band) and the signal of the band AM (fourth band) can be transmitted simultaneously.

[0293] The output bump 502 is an example of the first output bump and is connected to the output ends of the filter 500d and the filter 500b. The output bump 501 is an example of the second output bump and is connected to the output ends of the filter 500c and the filter 500a.

[0294] According to this, the output ends of the two filters 500a and 500c that can be transmitted simultaneously are commonly connected to the output bump 501, and the output ends of the two filters 500b and 500d that can be transmitted simultaneously are commonly connected to the output bump 502. Therefore, the number of output bumps of the composite filter component 50 can be reduced, and the size can be reduced. Further, since the number of output bumps of the composite filter component 50 is reduced, the number of terminals of the switch 20 can be reduced, so that the off-capacitance generated at the terminals of the switch 20 can be reduced.

[0295] The input bump 514 is an example of the first input bump and is connected to the input end of the filter 500d. The input bump 513 is an example of the second input bump and is connected to the input end of the filter 500c. The input bump 512 is an example of the third input bump and is connected to the input end of the filter 500b. The input bump 511 is an example of the fourth input bump and is connected to the input end of the filter 500a.

[0296] Among the input bumps 511 to 514, the input bump 511 and the input bump 512 are adjacently arranged, and the input bump 513 and the input bump 514 are adjacently arranged.

[0297] The power amplifier 38 is an example of a first power amplifier and can amplify the signals of ALT and BLT. Since the bands AL and BL are a combination of bands that do not transmit simultaneously with each other, the power amplifier 38 can be connected to both the filter 500d including BLT in its passband and the filter 500c including ALT in its passband. From this, the output terminal of the power amplifier 38 is connected to the input bumps 513 and 514 via the switch 28.

[0298] The power amplifier 37 is an example of a second power amplifier and can amplify the signals of AMT and BMT. Since the bands AM and BM are a combination of bands that do not transmit simultaneously with each other, the power amplifier 37 can be connected to both the filter 500b including BMT in its passband and the filter 500a including AMT in its passband. From this, the output terminal of the power amplifier 37 is connected to the input bumps 511 and 512 via the switch 27.

[0299] The switch 20 is connected between the antenna connection terminal 200 and the composite filter component 50, and switches the connection between the antenna 2 and the output terminal 501 and the connection between the antenna 2 and the output terminal 502. The switch 27 is connected between the power amplifier 37 and the composite filter component 50, and switches the connection between the power amplifier 37 and the input bump 511 and the connection between the power amplifier 37 and the input bump 512. The switch 28 is connected between the power amplifier 38 and the composite filter component 50, and switches the connection between the power amplifier 38 and the input bump 513 and the connection between the power amplifier 38 and the input bump 514.

[0300] The inductor 61 is connected between the input bump 511 and the switch 27 to achieve impedance matching between the composite filter component 50 and the power amplifier 37. The inductor 62 is connected between the input bump 512 and the switch 27 to achieve impedance matching between the composite filter component 50 and the power amplifier 37. The inductor 63 is connected between the input bump 513 and the switch 28 to achieve impedance matching between the composite filter component 50 and the power amplifier 38. The inductor 64 is connected between the input bump 514 and the switch 28 to achieve impedance matching between the composite filter component 50 and the power amplifier 38. Each of the inductors 61 to 64 may be a circuit composed of at least one of an inductor and a capacitor.

[0301] Further, the high-frequency module 5 of the present embodiment does not necessarily include at least one of the switches 20, 27, and 28 and the inductors 61 to 64.

[0302] In a conventional composite filter component including a plurality of filters 500a to 500d, filters 500b (BMT) and 500d (BLT) capable of simultaneous transmission are connected to output bump 502, and filters 500a (AMT) and 500c (ALT) capable of simultaneous transmission are connected to output bump 501. In order to avoid crossing and shorten the wiring connecting the output bumps and each filter, in the composite filter component, filters 500b and 500d are arranged adjacent to each other, and filters 500a and 500c are arranged adjacent to each other. On the other hand, in order to avoid crossing and shorten the wiring connecting the input bumps and each filter, on the input side of the composite filter component, since filters 500b and 500d are arranged adjacent to each other, input bump 514 connected to filter 500d and output bump 512 connected to filter 500b are made adjacent to each other, and since filters 500a and 500c are arranged adjacent to each other, input bump 511 connected to filter 500a and input bump 513 connected to filter 500c are made adjacent to each other. In power amplifiers 37 and 38 that output transmission signals to the composite filter component, it is difficult to output two signals for simultaneous transmission from one power amplifier, and it is desirable to distribute and output the two signals to power amplifiers 37 and 38 respectively. For this reason, input bumps 512 and 514 arranged adjacent to each other are distributed and connected to power amplifiers 37 and 38, and input bumps 511 and 513 arranged adjacent to each other are distributed and connected to power amplifiers 37 and 38. Then, in the region between input bumps 511 to 514 and power amplifiers 37 and 38, crossing of the connection wiring occurs, and parasitic capacitance due to the above crossing occurs near the output ends of power amplifiers 37 and 38. Power amplifiers 37 and 38 have a low impedance at the output end, and the closer the generated parasitic capacitance is to the output end of the power amplifier, the greater the matching loss at the output end of the power amplifier becomes, and the amplification characteristics deteriorate.

[0303] In contrast, in the above configuration of the composite filter component 50 according to the present embodiment, on the output side of the composite filter component 50, filters 500b (BMT) and 500d (BLT) that can be transmitted simultaneously are connected to the output bump 502, and filters 500a (AMT) and 500c (ALT) that can be transmitted simultaneously are connected to the output bump 501. On the other hand, on the input side of the composite filter component 50, the input bump 514 connected to the filter 500d and the input bump 513 connected to the filter 500c are adjacent to each other, and the input bump 512 connected to the filter 500b and the input bump 511 connected to the filter 500a are adjacent to each other. According to this, when connecting the filters 500d (input bump 514 connected thereto) and 500c (input bump 513 connected thereto) that do not transmit simultaneously to the power amplifier 38, and connecting the filters 500b (input bump 512 connected thereto) and 500a (input bump 511 connected thereto) that do not transmit simultaneously to the power amplifier 37, the filters 500a to 500d can be connected to the power amplifiers 37 and 38 without crossing the wiring connecting the input bumps 511 to 514 and the power amplifiers 37 and 38. Thereby, it is possible to suppress the occurrence of parasitic capacitance caused by the crossing of the wiring in the vicinity of the output ends of the power amplifiers 37 and 38.

[0304] Therefore, since no wiring crossing occurs in the region between the input bumps 511 to 514 and the power amplifiers 37 and 38, the matching loss of the transmission signal output from the power amplifiers 37 and 38 can be reduced, and the deterioration of the amplification characteristics on the input side of the composite filter component 50 can be suppressed.

[0305] In addition, since there is no wiring crossing between the input bumps 511 to 514 and the power amplifiers 37 and 38, it is possible to reduce the height of the high-frequency module 5.

[0306] Band AL is, for example, Band 3 for LTE or n3 for 5G NR. Band AM is, for example, Band 1 for LTE or n1 for 5G NR. Band BL is, for example, Band 66 for LTE or n66 for 5G NR. Band BM is, for example, Band 25 for LTE or n25 for 5G NR.

[0307] Note that the high-frequency module 5 may further include a mounting substrate. On the main surface of the mounting substrate, a composite filter component 50, switches 20, 27, and 28, inductors 61 to 64, and power amplifiers 37 and 38 are arranged.

[0308] The composite filter component 50 has, for example, a form in which (1) it is formed into an IC chip on a silicon substrate, (2) filters 500a to 500d are housed in one package, (3) a plurality of piezoelectric substrates are joined via a support layer, or (4) filters 500a to 500d are arranged on one substrate.

[0309] Each of the inductors 61 to 64 is, for example, a surface-mount chip inductor. Note that each of the inductors 61 to 64 may be composed of a coil conductor formed on the mounting substrate.

[0310] The power amplifiers 37 and 38 may be formed in one IC. Also, the switches 20, 27, and 28 may be formed in one IC.

[0311] Here, the input bumps 513 and 514 may be arranged closer to the power amplifier 38 than to the power amplifier 37, and the input bumps 511 and 512 may be arranged closer to the power amplifier 37 than to the power amplifier 38.

[0312] Accordingly, the wiring connecting the input bumps 513 and 514 to the power amplifier 38 and the wiring connecting the input bumps 511 and 512 to the power amplifier 37 can be shortened. Therefore, the high-frequency module 5 can be made to have lower loss and be smaller in size.

[0313] [Structure of Composite Filter Component 50A According to Embodiment 12] FIG. 13A is a plan view and a cross-sectional view of a composite filter component 50A according to Embodiment 12. In the figure, an example of the arrangement configuration of each filter and each bump constituting the composite filter component 50A is shown. (a) in the figure is a view of the a-a plane seen from the positive z-axis side, (b) in the figure is a view of the b-b plane seen from the positive z-axis side, (c) in the figure is a view of the c-c plane seen from the positive z-axis side, (d) in the figure is a view of the d-d cross-section seen from the negative y-axis side, and (e) in the figure is a view of the e-e cross-section seen from the negative y-axis side. Note that the a-a plane is a plane parallel to the main surface 551 and between the opposing main surfaces of the filter chip 522. Also, the b-b plane is a plane parallel to the main surface 553 and between the opposing main surfaces of the filter chip 521. Also, the c-c plane is the main surface 553. Also, the d-d cross-section is a plane perpendicular to the main surface 553 and passing through the output bumps 501 and 502. Also, the e-e cross-section is a plane perpendicular to the main surface 553 and passing through the input bumps 511 to 514.

[0314] The composite filter component 50A includes filter chips 521 and 522 laminated on each other, and includes main surfaces 553 (first main surface) and 551 (second main surface) facing each other. The filter chip 521 is an example of the first layer portion, and includes the main surface 553 (first main surface), filters 500d (BLT) and 500a (AMT). The filter chip 522 is an example of the second layer portion, and includes the main surface 551 (second main surface), filters 500b (BMT) and 500c (ALT).

[0315] In this embodiment, the filter 500d is an example of a first filter and is connected to the output bump 502 (first output bump) and the input bump 514 (first input bump). The filter 500c is an example of a second filter and is connected to the output bump 501 (second output bump) and the input bump 513 (second input bump). The filter 500b is an example of a third filter and is connected to the output bump 502 (first output bump) and the input bump 512 (third input bump). The filter 500a is an example of a fourth filter and is connected to the output bump 501 (second output bump) and the input bump 511 (fourth input bump).

[0316] Each of the filter chips 521 and 522 has a form in which, for example, (1) an IC chip is formed on a silicon substrate, (2) two filters are accommodated in one package, or (3) functional electrodes of two filters are formed on one piezoelectric substrate. Further, the composite filter component 50A has a form in which, for example, at least one of (1) joining between electrodes, (2) joining with an adhesive, and (3) resin molding is performed on the filter chips 521 and 522. In this embodiment, the filter chips 521 and 522 are joined at the interface 552.

[0317] As shown in FIG. 13A(c), the composite filter component 50A has a rectangular shape when viewed in plan on the main surface 553, and has outer sides 401 (second outer side) and 403 (first outer side) facing each other, and outer sides 402 and 404 facing each other. Note that the composite filter component 50A may be polygonal when viewed in plan on the main surface 553.

[0318] The input bumps 511 to 514 are arranged in the order of the input bumps 514, 513, 512, and 511 in the first direction (negative x-axis direction) along the outer side 403 on the main surface 553. On the other hand, the output bumps 501 and 502 are arranged in the order of the output bumps 502 and 501 in the first direction (negative x-axis direction) in the region between the input bumps 511 to 514 and the outer side 401 on the main surface 553.

[0319] According to this, since no wiring crossover occurs in the region between the input bumps 511 to 514 and the power amplifiers 37 and 38 arranged on the input side of the composite filter component 50A, the insertion loss of the transmission signals output from the power amplifiers 37 and 38 can be reduced, and the deterioration of the amplification characteristics on the input side of the composite filter component 50A can be suppressed.

[0320] Note that the input bumps 511 to 514 do not have to be linearly arranged in the first direction as shown in FIG. 13A. The input bumps 511 to 514 may be arranged such that the input bumps 511 and 512 are adjacent to each other and the input bumps 513 and 514 are adjacent to each other in the region between the outer side 403 and the output bumps 501 and 502.

[0321] The filters 500d and 500a are arranged in the order of the filters 500d and 500a in the first direction (negative x-axis direction). The filters 500c and 500b are arranged in the order of the filters 500c and 500b in the first direction (negative x-axis direction). When the main surfaces 551 and 553 are viewed in plan view, the filter 500c and the filter 500d at least partially overlap, and the filter 500a and the filter 500b at least partially overlap.

[0322] That is, in the composite filter component 50A according to the present embodiment, by arranging two filters that are not transmitted simultaneously on one filter chip, the isolation of the two transmission signals transmitted simultaneously is improved, and the heat dissipation from the filter chip is dispersed. Further, by arranging two filters that are transmitted simultaneously on different filter chips and arranging them so as not to overlap in plan view, the distance between the two filters that are transmitted simultaneously is ensured, and the isolation of the two transmission signals transmitted simultaneously is further improved.

[0323] According to the above-described arrangement configuration, the wiring connecting the output bump 501 to the filters 500a and 500c does not cross the wiring connecting the output bump 502 to the filters 500b and 500d within the filter chip 521, nor does it cross within the filter chip 522 (see (a), (b), and (d) of FIG. 13A). Also, the wiring connecting the input bump 511 to the filter 500a, the wiring connecting the input bump 512 to the filter 500b, the wiring connecting the input bump 513 to the filter 500c, and the wiring connecting the input bump 514 to the filter 500d do not cross within the filter chip 521, nor do they cross within the filter chip 522 (see (a), (b), and (e) of FIG. 13A).

[0324] That is, inside the composite filter component 50A, no crossing of the wiring connecting the input bump and the filter occurs within the filter chip, nor does crossing of the wiring connecting the output bump and the filter occur within the filter chip. As a result, it is possible to reduce the insertion loss of the transmission signals output from the power amplifiers 37 and 38 arranged on the input side of the composite filter component 50A, and to improve the isolation of the filters 500a to 500d within the composite filter component 50A. Therefore, the composite filter component 50A can transmit the simultaneously passing ALT transmission signal and AMT transmission signal with low loss, and can transmit the simultaneously passing BLT transmission signal and BMT transmission signal with low loss.

[0325] Also, as shown in FIG. 13A(c), when the main surface 553 is viewed in plan, the area of the input bump 514 is larger than the area of the input bump 512, and the area of the input bump 511 is larger than the area of the input bump 513.

[0326] The filters 500b and 500c disposed on the filter chip 522 have high heat dissipation properties toward the main surface 551 which is the top surface. On the other hand, the filters 500a and 500d disposed on the filter chip 521 sandwiched between the filter chip 522 and the mounting substrate have low heat dissipation properties to the outside. In contrast, since the area of the input bump 514 connected to the filter 500d is made larger than the area of the input bump 512 connected to the filter 500b, and the area of the input bump 511 connected to the filter 500a is made larger than the area of the input bump 513 connected to the filter 500c, it becomes possible to improve the heat dissipation property of the filter chip 521. Therefore, it becomes possible to improve the heat dissipation property of the composite filter component 50A.

[0327] Note that a shield electrode layer 590 may be formed on the main surface 551 of the composite filter component 50A. According to this, it is possible to further improve the heat dissipation property from the filter chip 522 to the main surface 551 side.

[0328] Also, the input bumps 511 to 514 may be arranged in the order of the input bumps 513, 514, 511, and 512 in the first direction. In this case, the input bumps 511 and 514 connected from the filter chip 521 will be adjacent to each other, and the dispersibility of heat dissipation from the filter chip 521 will decrease. In contrast, a shield plate may be disposed between the filter 500a and the filter 500d perpendicular to the main surface 553 and extending from the main surface 553 to the main surface 551.

[0329] According to this, since the heat conduction between the filter 500a and the filter 500d is suppressed, the heat dissipation property of the composite filter component 50A is improved.

[0330] [Structure of the composite filter component 50B according to Example 13 in 2.3] FIG. 13B is a plan view and a cross-sectional view of the composite filter component 50B according to Example 13. In the figure, an example of the arrangement configuration of each filter and each bump constituting the composite filter component 50B is shown. (a) in the figure is a view of the a-a plane seen from the positive z-axis side, (b) in the figure is a view of the b-b plane seen from the positive z-axis side, (c) in the figure is a view of the c-c plane seen from the positive z-axis side, (d) in the figure is a view of the d-d cross-section seen from the negative y-axis side, and (e) in the figure is a view of the e-e cross-section seen from the negative y-axis side. Note that the a-a plane is a plane parallel to the main surface 551 and between the opposing main surfaces of the filter chip 522. Also, the b-b plane is a plane parallel to the main surface 553 and between the opposing main surfaces of the filter chip 521. Also, the c-c plane is the main surface 553. Also, the d-d cross-section is a plane perpendicular to the main surface 553 and passing through the output bumps 501 and 502. Also, the e-e cross-section is a plane perpendicular to the main surface 553 and passing through the input bumps 511 to 514.

[0331] Compared with the composite filter component 50A according to Example 12, the composite filter component 50B according to this example has a different filter arrangement configuration in the filter chips 521 and 522. Therefore, in the following, for the composite filter component 50B according to this example, the description of the same configuration as the composite filter component 50A according to Example 12 will be omitted, and the description will focus on the configuration different from that of the composite filter component 50A.

[0332] The composite filter component 50B includes filter chips 521 and 522 laminated on each other, and includes main surfaces 553 (first main surface) and 551 (second main surface) facing each other. The filter chip 521 is an example of the first layer portion, and includes a main surface 553 (first main surface), filters 500a (AMT) and 500b (BMT). The filter chip 522 is an example of the second layer portion, and includes a main surface 551 (second main surface), filters 500c (ALT) and 500d (BLT).

[0333] In this embodiment, the filter 500d is an example of a first filter and is connected to an output bump 502 (first output bump) and an input bump 513 (first input bump). The filter 500c is an example of a second filter and is connected to an output bump 501 (second output bump) and an input bump 514 (second input bump). The filter 500b is an example of a third filter and is connected to an output bump 502 (first output bump) and an input bump 512 (third input bump). The filter 500a is an example of a fourth filter and is connected to an output bump 501 (second output bump) and an input bump 511 (fourth input bump).

[0334] As shown in FIG. 13B(c), the composite filter component 50B has a rectangular shape when viewed in plan view of the main surface 553, and has outer sides 411 (second outer side) and 413 (first outer side) facing each other, and outer sides 412 and 414 facing each other. Note that the composite filter component 50B may be a polygon when viewed in plan view of the main surface 553.

[0335] The input bumps 511 to 514 are arranged in the order of the input bumps 514, 513, 512, and 511 in the first direction (negative x-axis direction) along the outer side 413 on the main surface 553. On the other hand, the output bumps 501 and 502 are arranged in the order of the output bumps 502 and 501 in the first direction (negative x-axis direction) in the region between the input bumps 511 to 514 and the outer side 411 on the main surface 553.

[0336] According to this, since no wiring crossing occurs in the region between the input bumps 511 to 514 and the power amplifiers 37 and 38 arranged on the input side of the composite filter component 50B, the matching loss of the transmission signals output from the power amplifiers 37 and 38 can be reduced, and the deterioration of the amplification characteristics on the input side of the composite filter component 50B can be suppressed.

[0337] Note that the input bumps 511 to 514 do not have to be linearly arranged in the first direction as shown in FIG. 13B. The input bumps 511 to 514 may be in the region between the outer side 413 and the output bumps 501 and 502, as long as the input bumps 511 and 512 are adjacently arranged and the input bumps 513 and 514 are adjacently arranged.

[0338] The filters 500a and 500b are arranged in the order of the filters 500b and 500a in the first direction (negative x-axis direction). The filters 500c and 500d are arranged in the order of the filters 500c and 500d in the first direction (negative x-axis direction). When the main surfaces 551 and 553 are viewed in plan view, the filter 500b and the filter 500c at least partially overlap, and the filter 500a and the filter 500d at least partially overlap.

[0339] That is, in the composite filter component 50B according to the present embodiment, by arranging two filters that are not transmitted simultaneously on one filter chip, the isolation of two transmission signals transmitted simultaneously is improved, and the heat dissipation from the filter chip is dispersed. In addition, by arranging two filters that are transmitted simultaneously on different filter chips and arranging them so as not to overlap in plan view, the distance between the two filters that are transmitted simultaneously is ensured, and the isolation of the two transmission signals transmitted simultaneously is further improved.

[0340] In addition, since the frequencies of BLT (B66T) and ALT (B3T) partially overlap, if the filter 500c and the filter 500d overlap when the main surface 551 is viewed in plan view, the isolation deteriorates. For this reason, the filter 500c and the filter 500d are arranged in a plane on the same filter chip 522.

[0341] According to the above-described arrangement configuration, the wiring connecting the output bump 501 to the filters 500a and 500c does not cross the wiring connecting the output bump 502 to the filters 500b and 500d within the filter chip 521, nor does it cross within the filter chip 522 (see (a), (b), and (d) of FIG. 13B). Also, the wiring connecting the input bump 511 to the filter 500a, the wiring connecting the input bump 512 to the filter 500b, the wiring connecting the input bump 513 to the filter 500d, and the wiring connecting the input bump 514 to the filter 500c do not cross within the filter chip 521, nor do they cross within the filter chip 522 (see (a), (b), and (e) of FIG. 13B).

[0342] That is, inside the composite filter component 50B, no crossing of the wiring connecting the input bump and the filter occurs within the filter chip, nor does crossing of the wiring connecting the output bump and the filter occur within the filter chip. As a result, it is possible to reduce the insertion loss of the transmission signals output from the power amplifiers 37 and 38 arranged on the input side of the composite filter component 50B, and to improve the isolation of the filters 500a to 500d within the composite filter component 50B. Therefore, the composite filter component 50B can transmit the simultaneously passing ALT transmission signal and AMT transmission signal with low loss, and can transmit the simultaneously passing BLT transmission signal and BMT transmission signal with low loss.

[0343] Also, as shown in FIG. 13B(c), when the main surface 553 is viewed in plan, the area of the input bump 512 is larger than the area of the input bump 513, and the area of the input bump 511 is larger than the area of the input bump 514.

[0344] Filters 500c and 500d arranged on filter chip 522 have high heat dissipation toward main surface 551, which is the top surface. On the other hand, filters 500a and 500b arranged on filter chip 521 sandwiched between filter chip 522 and the mounting substrate have low heat dissipation toward the outside. In contrast, the area of input bump 511 connected to filter 500a is made larger than the area of input bump 514 connected to filter 500c, and the area of input bump 512 connected to filter 500b is made larger than the area of input bump 513 connected to filter 500d, thereby improving the heat dissipation of filter chip 521. This makes it possible to improve the heat dissipation of composite filter component 50B.

[0345] A shield electrode layer 590 may be formed on the main surface 551 of the composite filter component 50B. This can further improve heat dissipation from the filter chip 522 to the main surface 551 side.

[0346] [2.4 Configuration of High-Frequency Module 5A According to Modification] 14 is a circuit configuration diagram of a high-frequency module 5A according to a modification of the second embodiment. As shown in the figure, the high-frequency module 5A according to this modification includes a composite filter component 51, power amplifiers 37 and 38, switches 20A, 27A, and 28A, inductors 61, 62, 63, 64, 65, and 66, an antenna connection terminal 200, and signal input terminals 310 and 320. The high-frequency module 5A according to this modification differs from the high-frequency module 5 according to the second embodiment in that it simultaneously transmits on three sets of bands. The following description of the high-frequency module 5A according to this modification will focus on the different configuration and omit the description of the same configuration as the high-frequency module 5 according to the second embodiment.

[0347] The composite filter assembly 51 includes filters 500a, 500b, 500c, 500d, 500e and 500f, output bumps 501, 502 and 503, and input bumps 511, 512, 513, 514, 515 and 516.

[0348] Filter 500d has a first passband including the transmission band (BLT) of band BL (the first band). Filter 500c has a second passband including the transmission band (ALT) of band AL (the second band). Filter 500b has a third passband including the transmission band (BMT) of band BM (the third band). Filter 500a has a fourth passband including the transmission band (AMT) of band AM (the fourth band). Filter 500f has a passband including the transmission band (CLT) of band CL. Filter 500e has a passband including the transmission band (CMT) of band CM.

[0349] The signal of band BL (the first band) and the signal of band BM (the third band) can be transmitted simultaneously, and the signal of band AL (the second band) and the signal of band AM (the fourth band) can be transmitted simultaneously. Also, the signal of band CL and the signal of band CM are not transmitted simultaneously.

[0350] Output bump 502 is an example of a first output bump and is connected to the output ends of filter 500d and filter 500b. Output bump 501 is an example of a second output bump and is connected to the output ends of filter 500c and filter 500a. Output bump 503 is connected to the output ends of filter 500f and filter 500e.

[0351] Input bump 514 is an example of a first input bump and is connected to the input end of filter 500d. Input bump 513 is an example of a second input bump and is connected to the input end of filter 500c. Input bump 512 is an example of a third input bump and is connected to the input end of filter 500b. Input bump 511 is an example of a fourth input bump and is connected to the input end of filter 500a. Input bump 515 is connected to the input end of filter 500f. Input bump 516 is connected to the input end of filter 500e.

[0352] Among the input bumps 511 to 516, the input bump 511, the input bump 512, and the input bump 516 are arranged adjacent to each other, and the input bump 513, the input bump 514, and the input bump 515 are arranged adjacent to each other.

[0353] The power amplifier 38 is an example of a first power amplifier and can amplify the signals of ALT, BLT, and CLT. Since the bands AL, BL, and CL are combinations of bands that do not transmit simultaneously with each other, the power amplifier 38 can be connected to a filter 500d including BLT in the passband, a filter 500c including ALT in the passband, and a filter 500f including CLT in the passband. From this, the output terminal of the power amplifier 38 is connected to the input bumps 513, 514, and 515 via the switch 28A.

[0354] The power amplifier 37 is an example of a second power amplifier and can amplify the signals of AMT, BMT, and CMT. Since the bands AM, BM, and CM are combinations of bands that do not transmit simultaneously with each other, the power amplifier 37 can be connected to a filter 500b including BMT in the passband, a filter 500a including AMT in the passband, and a filter 500e including CMT in the passband. From this, the output terminal of the power amplifier 37 is connected to the input bumps 511, 512, and 516 via the switch 27A.

[0355] The switch 20A is connected between the antenna connection terminal 200 and the composite filter component 51. The switch 27A is connected between the power amplifier 37 and the composite filter component 51. The switch 28A is connected between the power amplifier 38 and the composite filter component 51.

[0356] The inductor 65 is connected between the input bump 516 and the switch 27A. The inductor 66 is connected between the input bump 515 and the switch 28A.

[0357] Also, the high-frequency module 5A according to this modification example does not have to include at least one of the switches 20A, 27A, and 28A and the inductors 61 to 66.

[0358] In the above configuration of the composite filter component 51 according to this modification example, on the output side of the composite filter component 51, filters 500b (BMT) and 500d (BLT) that can be transmitted simultaneously are connected to the output bump 502, and filters 500a (AMT) and 500c (ALT) that can be transmitted simultaneously are connected to the output bump 501. On the other hand, on the input side of the composite filter component 51, the input bump 514 connected to the filter 500d, the input bump 513 connected to the filter 500c, and the input bump 515 connected to the filter 500f are adjacent to each other, and the input bump 512 connected to the filter 500b, the input bump 511 connected to the filter 500a, and the input bump 516 connected to the filter 500e are adjacent to each other.

[0359] According to this, when connecting the filters 500d (input bump 514 connected thereto), 500c (input bump 513 connected thereto), and 500f (input bump 515 connected thereto) that are not transmitted simultaneously to the power amplifier 38, and connecting the filters 500b (input bump 512 connected thereto), 500a (input bump 511 connected thereto), and 500e (input bump 516 connected thereto) that are not transmitted simultaneously to the power amplifier 37, the filters 500a - 500f can be connected to the power amplifiers 37 and 38 without crossing the wiring connecting the input bumps 511 - 516 to the power amplifiers 37 and 38. Thereby, it is possible to suppress the occurrence of parasitic capacitance caused by the crossing of the wiring in the vicinity of the output ends of the power amplifiers 37 and 38. According to this, since no wiring crossing occurs in the region between the input bumps 511 - 516 and the power amplifiers 37 and 38, the matching loss of the transmission signal output from the power amplifiers 37 and 38 can be reduced, and the deterioration of the amplification characteristics on the input side of the composite filter component 51 can be suppressed.

[0360] Band AL is, for example, Band 3 for LTE or n3 for 5G NR. Band AM is, for example, Band 1 for LTE or n1 for 5G NR. Band BL is, for example, Band 66 for LTE or n66 for 5G NR. Band BM is, for example, Band 25 for LTE or n25 for 5G NR. Band CL is, for example, Band 39 for LTE or n39 for 5G NR. Band CM is, for example, Band 34 for LTE or n34 for 5G NR.

[0361] [Structure of the composite filter component 51A according to Example 14] As a specific configuration example of the composite filter component 51 included in the high-frequency module 5A according to the modification example, the composite filter component 51A according to Example 14 is shown. FIG. 15 is a plan view and a cross-sectional view of the composite filter component 51A according to Example 14. In the figure, an arrangement configuration example of each filter and each bump constituting the composite filter component 51A is shown. (a) of the figure is a view of the a-a plane seen from the positive side of the z-axis, (b) of the figure is a view of the b-b plane seen from the positive side of the z-axis, (c) of the figure is a view of the c-c plane seen from the positive side of the z-axis, (d) of the figure is a view of the d-d cross-section seen from the negative side of the y-axis, and (e) of the figure is a view of the e-e cross-section seen from the negative side of the y-axis. Note that the a-a plane is a plane parallel to the main surface 554 and between the opposing main surfaces of the filter chip 524. The b-b plane is a plane parallel to the main surface 556 and between the opposing main surfaces of the filter chip 523. The c-c plane is the main surface 556. The d-d cross-section is a plane perpendicular to the main surface 556 and passing through the output bumps 501 to 503. The e-e cross-section is a plane perpendicular to the main surface 556 and passing through the input bumps 511 to 516.

[0362] The composite filter component 51A includes filter chips 523 and 524 laminated on each other, and includes main surfaces 556 (first main surface) and 554 (second main surface) facing each other. The filter chip 523 is an example of a first layer portion and includes the main surface 556 (first main surface), filters 500a (AMT), 500d (BLT), and 500e (CMT). The filter chip 524 is an example of a second layer portion and includes the main surface 554 (second main surface), filters 500b (BMT), 500c (ALT), and 500f (CLT).

[0363] In this embodiment, the filter 500d is connected to the output bump 502 (first output bump) and the input bump 514 (first input bump). The filter 500c is connected to the output bump 501 (second output bump) and the input bump 513 (second input bump). The filter 500b is connected to the output bump 502 (first output bump) and the input bump 512 (third input bump). The filter 500a is connected to the output bump 501 (second output bump) and the input bump 511 (fourth input bump). The filter 500f is connected to the output bump 503 (third output bump) and the input bump 515 (sixth input bump). The filter 500e is connected to the output bump 503 (third output bump) and the input bump 516 (fifth input bump).

[0364] When the band CL is Band39 for LTE or n39 for 5GNR, the filter 500f is a filter for TDD. When the band CM is Band34 for LTE or n34 for 5GNR, the filter 500e is a filter for TDD.

[0365] Each of the filter chips 523 and 524 has a form in which, for example, (1) an IC chip is formed on a silicon substrate, (2) two filters are accommodated in one package, or (3) functional electrodes of two filters are formed on one piezoelectric substrate. Further, the composite filter component 51A has a form in which, for example, at least one of (1) bonding between electrodes, (2) bonding with an adhesive, and (3) resin molding is performed on the filter chips 523 and 524. In this embodiment, the filter chips 523 and 524 are bonded at the interface 555.

[0366] As shown in FIG. 15(c), the composite filter component 51A has a rectangular shape when viewed in plan on the main surface 556, and has outer sides 421 (second outer side) and 423 (first outer side) facing each other, and outer sides 422 and 424 facing each other. Note that the composite filter component 51A may be polygonal when viewed in plan on the main surface 556.

[0367] The input bumps 511 to 516 are arranged in this order on the main surface 556 in the first direction (negative x-axis direction) along the outer side 423 as output bumps 513, 514, 516, 515, 511, and 512. On the other hand, the output bumps 501 to 503 are arranged in this order in the first direction (negative x-axis direction) in a region between the input bumps 511 to 516 and the outer side 421 on the main surface 556.

[0368] According to this, since no wiring crossing occurs in the region between the input bumps 511 to 516 and the power amplifiers 37 and 38 arranged on the input side of the composite filter component 51A, the matching loss of the transmission signal output from the power amplifiers 37 and 38 can be reduced, and the deterioration of the amplification characteristics on the input side of the composite filter component 51A can be suppressed.

[0369] Note that the input bumps 511 to 516 do not have to be linearly arranged in the first direction as shown in FIG. 15. The input bumps 511 to 516 may be arranged adjacent to each other in the region between the outer side 423 and the output bumps 501 to 503, as long as the input bumps 511, 512, and 515 are adjacent to each other and the input bumps 513, 514, and 516 are adjacent to each other.

[0370] The filters 500a, 500d, and 500e are arranged in the order of the filters 500d, 500e, and 500a in the first direction (negative x-axis direction). The filters 500b, 500c, and 500f are arranged in the order of the filters 500c, 500f, and 500b in the first direction (negative x-axis direction). When the main surfaces 554 and 556 are viewed in plan view, the filter 500d and the filter 500c overlap at least partially, the filter 500e and the filter 500f overlap at least partially, and the filter 500a and the filter 500b overlap at least partially.

[0371] That is, in the composite filter component 51A according to this embodiment, three filters that are not transmitted simultaneously are arranged on one filter chip. In addition, two filters that are transmitted simultaneously are distributed to different filter chips and arranged so as not to overlap in plan view. Further, the filters 500e and 500f that are transmitted alone are arranged between the two filters that are transmitted simultaneously in plan view. This improves the isolation of the two transmission signals that are transmitted simultaneously.

[0372] According to the above-described arrangement configuration, the wiring connecting the output bump 501 to the filters 500a and 500c, the wiring connecting the output bump 502 to the filters 500b and 500d, and the wiring connecting the output bump 503 to the filters 500e and 500f do not cross within the filter chip 523 and do not cross within the filter chip 524 (see (a), (b), and (d) of FIG. 15). Also, the wiring connecting the input bump 511 to the filter 500a, the wiring connecting the input bump 512 to the filter 500b, the wiring connecting the input bump 513 to the filter 500c, the wiring connecting the input bump 514 to the filter 500d, the wiring connecting the input bump 515 to the filter 500f, and the wiring connecting the input bump 516 to the filter 500e do not cross within the filter chip 523 and do not cross within the filter chip 524 (see (a), (b), and (e) of FIG. 15).

[0373] That is, inside the composite filter component 51A, no crossing of the wiring connecting the input bump and the filter within the filter chip occurs, and no crossing of the wiring connecting the output bump and the filter within the filter chip occurs. As a result, it is possible to reduce the insertion loss of the transmission signals output from the power amplifiers 37 and 38 arranged on the input side of the composite filter component 51A, and it is possible to improve the isolation of the filters 500a to 500f within the composite filter component 51A. Therefore, the composite filter component 51A can transmit the transmission signals of the simultaneously passing band AL and the transmission signals of the band AM with low loss, and can transmit the transmission signals of the simultaneously passing band BL and the transmission signals of the band BM with low loss.

[0374] [2.6 Effects, etc.] As described above, the composite filter component 50 according to the present embodiment includes a filter 500d having a first passband including the transmission band of the band BL, a filter 500c having a second passband including the transmission band of the band AL, a filter 500b having a third passband including the transmission band of the band BM that can be transmitted simultaneously with the band BL, a filter 500a having a fourth passband including the transmission band of the band AM that can be transmitted simultaneously with the band AL, an output bump 502 connected to the output ends of the filter 500d and the filter 500b, an output bump 501 connected to the output ends of the filter 500c and the filter 500a, an input bump 514 connected to the input end of the filter 500d, an input bump 513 connected to the input end of the filter 500c, an input bump 512 connected to the input end of the filter 500b, and an input bump 511 connected to the input end of the filter 500a. Among the input bumps 511 to 514, the input bump 514 and the input bump 513 are arranged adjacent to each other, and the input bump 512 and the input bump 511 are arranged adjacent to each other.

[0375] According to this, when connecting the filters 500d and 500c that do not transmit simultaneously to the power amplifier 38 and connecting the filters 500b and 500a that do not transmit simultaneously to the power amplifier 37, the filters 500a to 500d and the power amplifiers 37 and 38 can be connected without crossing the wiring connecting the input bumps 511 to 514 and the power amplifiers 37 and 38. Thereby, it is possible to suppress the occurrence of parasitic capacitance caused by the crossing of the wiring in the vicinity of the output ends of the power amplifiers 37 and 38. Therefore, it is possible to provide a multi-band compatible composite filter component 50 that can reduce the insertion loss of the transmission signals output from the power amplifiers 37 and 38.

[0376] For example, the composite filter components 50A and 50B have main surfaces 553 and 551 facing each other, and when the main surface 553 is viewed in plan view, they are polygons having outer sides 401(411) and 403(413) facing each other. The input bumps 511 to 514 are arranged on the main surface 553 in the order of input bumps 514, 513, 512, and 511 in a first direction along the outer side 403(413). The output bumps 501 and 502 are arranged on the main surface 553 between the input bumps 511 to 514 and the outer side 401(411).

[0377] According to this, since no wiring intersections occur in the region between the input bumps 511 to 514 and the power amplifiers 37 and 38 arranged on the input sides of the composite filter components 50A and 50B, the matching loss of the transmission signals output from the power amplifiers 37 and 38 can be reduced, and the deterioration of the amplification characteristics on the input sides of the composite filter components 50A and 50B can be suppressed.

[0378] For example, the composite filter component 50A according to Example 12 includes filter chips 521 and 522 laminated on each other. The filter chip 521 includes the main surface 553, filters 500a and 500d. The filter chip 522 includes the main surface 551, filters 500b and 500c. The filters 500a and 500d are arranged in the order of filters 500d and 500a in the first direction. The filters 500b and 500c are arranged in the order of filters 500c and 500b in the first direction. When the main surfaces 551 and 553 are viewed in plan view, the filter 500d and the filter 500c at least partially overlap, and the filter 500b and the filter 500a at least partially overlap.

[0379] According to this, by arranging two filters that do not transmit simultaneously on one filter chip, arranging two filters that transmit simultaneously on different filter chips, and arranging them so as not to overlap in plan view, the isolation of the two transmission signals transmitted simultaneously can be improved, and the heat dissipation from the filter chips can be dispersed.

[0380] For example, in the case of the composite filter component 50A, when the main surface 553 is viewed in plan view, the area of the input bump 514 is larger than the area of the input bump 512, and the area of the input bump 511 is larger than the area of the input bump 513.

[0381] According to this, it becomes possible to improve the heat dissipation property of the filter chip 521 sandwiched between the filter chip 522 and the mounting substrate. Therefore, it becomes possible to improve the heat dissipation property of the composite filter component 50A.

[0382] For example, the composite filter component 50B according to the thirteenth embodiment includes filter chips 521 and 522 laminated on each other. The transmission band of the band BL and the transmission band of the band AL at least partially overlap. The filter chip 521 includes a main surface 553, filters 500a and 500b. The filter chip 522 includes a main surface 551, filters 500c and 500d. The filters 500a and 500b are arranged in the order of the filter 500b and the filter 500a in the first direction. The filters 500c and 500d are arranged in the order of the filter 500c and the filter 500d in the first direction. When the main surfaces 551 and 553 are viewed in plan view, the filter 500b and the filter 500c at least partially overlap, and the filter 500a and the filter 500d at least partially overlap.

[0383] According to this, by arranging two filters that do not transmit simultaneously on one filter chip, arranging two filters that transmit simultaneously on different filter chips, and arranging them so as not to overlap in plan view, the isolation of two transmission signals that transmit simultaneously can be improved, and the heat dissipation from the filter chip can be dispersed. Also, by not overlapping the filters 500c and 500d whose passband frequencies partially overlap in plan view, it becomes possible to improve the isolation between the filter 500c and the filter 500d.

[0384] For example, in the composite filter component 50B, when the main surface 553 is viewed in plan view, the area of the input bump 512 is larger than the area of the input bump 513, and the area of the input bump 511 is larger than the area of the input bump 514.

[0385] According to this, it becomes possible to improve the heat dissipation of the filter chip 521 sandwiched between the filter chip 522 and the mounting substrate. Therefore, it becomes possible to improve the heat dissipation of the composite filter component 50B.

[0386] For example, the high-frequency modules 5 and 5A according to the second embodiment include a mounting substrate having third and fourth main surfaces facing each other, either the composite filter components 50 and 51 disposed on the mounting substrate, and power amplifiers 37 and 38 disposed on the mounting substrate. The output end of the power amplifier 38 is connected to the input bumps 513 and 514, and the output end of the power amplifier 37 is connected to the input bumps 511 and 512.

[0387] According to this, it is possible to provide the multi-band compatible high-frequency modules 5 and 5A capable of reducing the insertion loss of the transmission signals output from the power amplifiers 37 and 38.

[0388] For example, in the high-frequency modules 5 and 5A, the input bumps 513 and 514 are disposed closer to the power amplifier 38 than the power amplifier 37, and the input bumps 511 and 512 are disposed closer to the power amplifier 37 than the power amplifier 38.

[0389] According to this, the wiring connecting the input bumps 513 and 514 to the power amplifier 38 and the wiring connecting the input bumps 511 and 512 to the power amplifier 37 can be shortened. Therefore, the high-frequency modules 5 and 5A can be made low-loss and miniaturized.

[0390] (Other Embodiments) As described above, the composite filter component and the high-frequency module according to the present invention have been described based on the embodiments. However, the composite filter component and the high-frequency module according to the present invention are not limited to the above embodiments. Another embodiment realized by combining any components in the above embodiments, a modification obtained by applying various modifications conceived by those skilled in the art without departing from the gist of the present invention to the above embodiments, and various devices incorporating the above composite filter component and high-frequency module are also included in the present invention.

[0391] For example, in the circuit configurations of the composite filter component and the high-frequency module according to each embodiment, another circuit element, wiring, etc. may be inserted between each circuit element and the path connecting the signal paths disclosed in the drawings.

[0392] Note that the bands applied in the above embodiments may be the bands shown below. Hereinafter, BandX for LTE and nX for 5GNR are collectively referred to as BX. Combinations of bands (not simultaneously received with each other) connected to the same low-noise amplifier are, for example, (1) at least two of B5, B8, and B26, (2) at least two of B12, B13, B14, B20, B28, B29, and n85, (3) B11 + B21 and B32, (4) B71 and n105, (5) at least two of B1, B66, and B34, (6) at least two of B3, B25, B39, and n70, (7) B7 and B41, or (8) B30 and B40.

[0393] The characteristics of the composite filter component and the high-frequency module described based on the above embodiments, modifications, and examples are shown below.

[0394] <1> A first filter having a first passband including a reception band of a first band; A second filter having a second passband including a reception band of a second band; A third filter having a third passband including a reception band of a third band that can be simultaneously received with the first band; A fourth filter having a fourth passband including a reception band of a fourth band that can be received simultaneously with the second band; A first input bump connected to an input end of the first filter and an input end of the third filter; A second input bump connected to an input end of the second filter and an input end of the fourth filter; A first output bump connected to an output end of the first filter; A second output bump connected to an output end of the second filter; A third output bump connected to an output end of the third filter; A fourth output bump connected to an output end of the fourth filter, and comprising: Among the first output bump, the second output bump, the third output bump, and the fourth output bump, the first output bump and the second output bump are arranged adjacent to each other, and the third output bump and the fourth output bump are arranged adjacent to each other, a composite filter component.

[0395] <2> The composite filter component has a first main surface and a second main surface facing each other, and is a polygon having a first outer side and a second outer side facing each other when the first main surface is viewed in plan view. The first output bump, the second output bump, the third output bump, and the fourth output bump are arranged on the first main surface in the order of the fourth output bump, the third output bump, the second output bump, and the first output bump in a first direction along the first outer side. The first input bump and the second input bump are arranged on the first main surface between the first output bump, the second output bump, the third output bump, and the fourth output bump and the second outer side, the composite filter component according to <1>.

[0396] <3> The composite filter component includes a first layer portion and a second layer portion laminated on each other; The first layer portion includes the first main surface, the third filter, and the fourth filter; The second layer portion includes the second main surface, the first filter, and the second filter. The first filter and the second filter are arranged in the order of the second filter and the first filter in the first direction. The third filter and the fourth filter are arranged in the order of the fourth filter and the third filter in the first direction. When the first main surface and the second main surface are viewed in plan view, The first filter and the third filter overlap at least partially. The composite filter component according to <2>, wherein the second filter and the fourth filter overlap at least partially.

[0397] <4> The composite filter component includes a first layer portion and a second layer portion laminated on each other. The first layer portion includes the first main surface, the third filter, and the fourth filter. The second layer portion includes the second main surface, the first filter, and the second filter. The first filter and the second filter are arranged in the order of the first filter and the second filter in the first direction. The third filter and the fourth filter are arranged in the order of the fourth filter and the third filter in the first direction. When the first main surface and the second main surface are viewed in plan view, The first filter and the fourth filter overlap at least partially. The composite filter component according to <2>, wherein the second filter and the third filter overlap at least partially.

[0398] <5> The first chip includes a first piezoelectric substrate. The third filter and the fourth filter are formed on the first piezoelectric substrate. The second chip includes a second piezoelectric substrate. The first filter and the second filter are the composite filter components described in <3> or <4> formed on the second piezoelectric substrate.

[0399] <6> The composite filter component includes a first layer portion and a second layer portion laminated on each other. The first layer portion includes the first main surface, the first filter, and the third filter. The second layer portion includes the second main surface, the second filter, and the fourth filter. The first filter and the third filter are arranged in the order of the third filter and the first filter in the first direction. The second filter and the fourth filter are arranged in the order of the fourth filter and the second filter in the first direction. When the first main surface and the second main surface are viewed in plan view, The first filter and the second filter overlap at least partially. The composite filter component according to <2>, wherein the third filter and the fourth filter overlap at least partially.

[0400] <7> The first chip includes a first piezoelectric substrate. The first filter and the third filter are formed on the first piezoelectric substrate. The second chip includes a second piezoelectric substrate. The composite filter component according to <6>, wherein the second filter and the fourth filter are formed on the second piezoelectric substrate.

[0401] <8> Furthermore, a fifth filter having a fifth passband including a reception band of a fifth band; a sixth filter having a sixth passband including a reception band of a sixth band that is different from the fifth band and can be received simultaneously with the fifth band; a third input bump connected to an input end of the fifth filter and an input end of the sixth filter; A fifth output bump connected to the output end of the fifth filter, and a sixth output bump connected to the output end of the sixth filter, Among the first output bump to the sixth output bump, the fifth output bump is arranged adjacent to the first output bump and the second output bump, and the sixth output bump is arranged adjacent to the third output bump and the fourth output bump. The composite filter component according to any one of <1> to <7>.

[0402] <9> Furthermore, A fifth filter having a fifth passband including a transmission band and a reception band of a fifth band, A sixth filter having a sixth passband including a transmission band and a reception band of a sixth band, A third input bump connected to one end of the fifth filter and one end of the sixth filter, A fifth output bump connected to the other end of the fifth filter, and a sixth output bump connected to the other end of the sixth filter, Each of the fifth filter and the sixth filter is a filter for time-division multiplexing, The composite filter component has a first main surface and a second main surface facing each other, and is a polygon having a first outer side and a second outer side facing each other when the first main surface is viewed in plan view. The first output bump to the sixth output bump are arranged on the first main surface in the first direction along the first outer side in the order of the fourth output bump, the third output bump, the second output bump, the first output bump, the sixth output bump, and the fifth output bump. The first input bump to the third input bump are arranged on the first main surface in the first direction in the region between the first output bump to the sixth output bump and the second outer side in the order of the second input bump, the first input bump, and the third input bump. The composite filter component according to any one of <1> to <7>.

[0403] <10> Furthermore, Unlike the first band and the third band, a seventh filter having a seventh passband including a reception band of a seventh band that can be received simultaneously with the first band and the third band; Unlike the second band and the fourth band, an eighth filter having an eighth passband including a reception band of an eighth band that can be received simultaneously with the second band and the fourth band; A seventh output bump connected to an output end of the seventh filter; An eighth output bump connected to an output end of the eighth filter, and comprising: The first input bump is connected to an input end of the first filter, an input end of the third filter, and an input end of the seventh filter; The second input bump is connected to an input end of the second filter, an input end of the fourth filter, and an input end of the eighth filter; Among the first output bump to the fourth output bump, the seventh output bump, and the eighth output bump, the first output bump and the second output bump are adjacently arranged, the third output bump and the fourth output bump are adjacently arranged, and the seventh output bump and the eighth output bump are adjacently arranged. The composite filter component according to any one of <1> to <7>.

[0404] <11> A first filter having a first passband including a transmission band of a first band; A second filter having a second passband including a transmission band of a second band; A third filter having a third passband including a transmission band of a third band that can be transmitted simultaneously with the first band; A fourth filter having a fourth passband including a transmission band of a fourth band that can be transmitted simultaneously with the second band; A first output bump connected to an output end of the first filter and an output end of the third filter; A second output bump connected to an output end of the second filter and an output end of the fourth filter; A first input bump connected to an input end of the first filter; A second input bump connected to the input end of the second filter, A third input bump connected to the input end of the third filter, A fourth input bump connected to the input end of the fourth filter, and Among the first input bump, the second input bump, the third input bump, and the fourth input bump, the first input bump and the second input bump are arranged adjacent to each other, and the third input bump and the fourth input bump are arranged adjacent to each other. A composite filter component.

[0405] <12> The composite filter component has a first main surface and a second main surface facing each other, and when the first main surface is viewed in plan, it is a polygon having a first outer side and a second outer side facing each other. The first input bump, the second input bump, the third input bump, and the fourth input bump are arranged on the first main surface in the first direction along the first outer side in the order of the first input bump, the second input bump, the third input bump, and the fourth input bump. The first output bump and the second output bump are arranged on the first main surface between the first input bump, the second input bump, the third input bump, the fourth input bump, and the second outer side. The composite filter component according to <11>.

[0406] <13> The composite filter component includes a first layer portion and a second layer portion laminated on each other. The first layer portion includes the first main surface, the first filter, and the fourth filter. The second layer portion includes the second main surface, the second filter, and the third filter. The first filter and the fourth filter are arranged in the first direction in the order of the first filter and the fourth filter. The second filter and the third filter are arranged in the first direction in the order of the second filter and the third filter. When the first main surface and the second main surface are viewed in plan, The first filter and the second filter overlap at least partially. The composite filter component according to <12>, wherein the third filter and the fourth filter overlap at least partially.

[0407] <14> The composite filter component according to <13>, wherein when the first main surface is viewed in plan view, the area of the first input bump is larger than the area of the third input bump, and the area of the fourth input bump is larger than the area of the second input bump.

[0408] <15> The composite filter component has a first main surface and a second main surface facing each other, and includes a first layer portion and a second layer portion laminated on each other. The transmission band of the first band and the transmission band of the second band overlap at least partially. The first layer portion includes the first main surface, the third filter, and the fourth filter. The second layer portion includes the second main surface, the first filter, and the second filter. The third filter and the fourth filter are arranged in the order of the third filter and the fourth filter in a first direction. The first filter and the second filter are arranged in the order of the second filter and the first filter in the first direction. When the first main surface and the second main surface are viewed in plan view, The first filter and the fourth filter overlap at least partially. The composite filter component according to <11>, wherein the second filter and the third filter overlap at least partially.

[0409] <16> The composite filter component according to <15>, wherein when the first main surface is viewed in plan view, the area of the third input bump is larger than the area of the first input bump, and the area of the fourth input bump is larger than the area of the second input bump.

[0410] <17> A mounting substrate having third and fourth main surfaces facing each other, the composite filter component according to any one of <1> to <10> disposed on the mounting substrate, a first low-noise amplifier and a second low-noise amplifier disposed on the mounting substrate, and an input end of the first low-noise amplifier is connected to the first output bump and the second output bump, An input end of the second low-noise amplifier is connected to the third output bump and the fourth output bump, a high-frequency module.

[0411] <18> The first output bump and the second output bump are disposed closer to the first low-noise amplifier than the second low-noise amplifier, The third output bump and the fourth output bump are disposed closer to the second low-noise amplifier than the first low-noise amplifier, the high-frequency module according to <17>.

[0412] <19> A mounting substrate having third and fourth main surfaces facing each other, the composite filter component according to any one of <11> to <16> disposed on the mounting substrate, a first power amplifier and a second power amplifier disposed on the mounting substrate, and an output end of the first power amplifier is connected to the first input bump and the second input bump, An output end of the second power amplifier is connected to the third input bump and the fourth input bump, a high-frequency module.

[0413] <20> The first input bump and the second input bump are disposed closer to the first power amplifier than the second power amplifier, The third input bump and the fourth input bump are disposed closer to the second power amplifier than the first power amplifier, the high-frequency module according to <19>.

Industrial Applicability

[0414] The present invention can be widely used in communication devices such as mobile phones as a multi-band compatible high-frequency module.

Explanation of Signs

[0415] 1, 1A, 1B, 1C, 1D, 1E, 1F, 5, 5A High-frequency module 2 Antenna 3 RFIC 4, 6 Communication device 10, 10A, 10B, 10C, 10D, 11, 11A, 12, 12A, 12B, 13, 13A, 14, 14A, 15, 15A, 16, 16A, 50, 50A, 50B, 51, 51A Composite filter component 20, 20A, 20B, 21, 21A, 21B, 22, 22A, 22B, 23B, 24, 25, 26, 27, 27A, 28, 28A Switch 31, 32, 33 Low-noise amplifier 36, 37, 38 Power amplifier 41, 42, 43, 44, 45, 46, 61, 62, 63, 64, 65, 66 Inductor 90 Mounting substrate 90a, 90b, 151, 153, 154, 156, 157, 159, 171, 181, 191, 261, 551, 553, 554, 556 Main surface 100a, 100b, 100c, 100d, 100e, 100f, 100g, 100h, 100j, 100k, 100l, 100m, 100n, 100p, 500a, 500b, 500c, 500d, 500e, 500f Filter 101, 102, 103, 104, 161, 162, 163, 164, 167, 168, 511, 512, 513, 514, 515, 516 Input bump 110, 120, 130 Signal output terminal 111, 112, 113, 114, 115, 116, 117, 118, 501, 502, 503 Output bump 121, 122, 123, 124, 125, 126, 521, 522, 523, 524 Filter chip 150 IC Interfaces 152, 155, 158, 552, 555 Input / output bumps 165, 166 Antenna connection terminal 200 Wires 211a, 211b, 212a, 212b, 213a, 213b, 214a, 214b Outer sides 301, 302, 303, 304, 311, 312, 313, 314, 321, 322, 323, 324, 331, 332, 333, 334, 341, 342, 343, 344, 351, 352, 353, 354, 361, 362, 363, 364, 401, 402, 403, 404, 411, 412, 413, 414, 421, 422, 423, 424 Signal input terminals 310, 320, 140 Support layer 325 Piezoelectric substrates 326, 327 IDT electrodes 330a, 330b, 330c, 330d Shield electrode layer 590

Claims

1. a first filter having a first passband including a reception band of a first band; a second filter having a second passband including a reception band of a second band; a third filter having a third passband including a reception band of a third band that can be received simultaneously with the first band; a fourth filter having a fourth passband including a reception band of a fourth band that can be received simultaneously with the second band; a first input bump connected to an input end of the first filter and an input end of the third filter; a second input bump connected to an input end of the second filter and an input end of the fourth filter; a first output bump connected to an output end of the first filter; a second output bump connected to an output end of the second filter; a third output bump connected to an output end of the third filter; a fourth output bump connected to an output end of the fourth filter, and among the first output bump, the second output bump, the third output bump, and the fourth output bump, the first output bump and the second output bump are arranged adjacent to each other, and the third output bump and the fourth output bump are arranged adjacent to each other; a composite filter component.

2. The composite filter component has a first main surface and a second main surface facing each other, and is a polygon having a first outer side and a second outer side facing each other when the first main surface is viewed in plan view, the first output bump, the second output bump, the third output bump, and the fourth output bump are arranged on the first main surface in the order of the fourth output bump, the third output bump, the second output bump, and the first output bump in a first direction along the first outer side, the first input bump and the second input bump are arranged on the first main surface between the first output bump, the second output bump, the third output bump, the fourth output bump, and the second outer side, The composite filter component according to claim 1.

3. The composite filter component includes a first layer portion and a second layer portion laminated on each other, the first layer portion includes the first main surface, the third filter, and the fourth filter, the second layer portion includes the second main surface, the first filter, and the second filter, the first filter and the second filter are arranged in the order of the second filter and the first filter in the first direction, The third filter and the fourth filter are arranged in the order of the fourth filter and the third filter in the first direction. When the first main surface and the second main surface are viewed in plan view, the first filter and the third filter at least partially overlap. the second filter and the fourth filter at least partially overlap. The composite filter component according to claim 2.

4. The composite filter component includes a first layer portion and a second layer portion laminated on each other. The first layer portion includes the first main surface, the third filter, and the fourth filter, The second layer portion includes the second main surface, the first filter, and the second filter. The first filter and the second filter are arranged in the order of the first filter and the second filter in the first direction. The third filter and the fourth filter are arranged in the order of the fourth filter and the third filter in the first direction. When the first main surface and the second main surface are viewed in plan view, the first filter and the fourth filter at least partially overlap. the second filter and the third filter at least partially overlap. The composite filter component according to claim 2.

5. The composite filter component includes a first chip and a second chip laminated on each other. The first chip includes a first piezoelectric substrate. The third filter and the fourth filter are formed on the first piezoelectric substrate. The second chip includes a second piezoelectric substrate. The first filter and the second filter are formed on the second piezoelectric substrate. The composite filter component according to claim 3.

6. The composite filter component includes a first layer portion and a second layer portion laminated on each other. The first layer portion includes the first main surface, the first filter, and the third filter. The second layer portion includes the second main surface, the second filter, and the fourth filter. The first filter and the third filter are arranged in the order of the third filter and the first filter in the first direction. The second filter and the fourth filter are arranged in the order of the fourth filter and the second filter in the first direction. When the first main surface and the second main surface are viewed in plan view, the first filter and the second filter at least partially overlap. the third filter and the fourth filter at least partially overlap. The composite filter component according to claim 2.

7. The composite filter component includes a first chip and a second chip stacked on each other, The first chip includes a first piezoelectric substrate, The first filter and the third filter are formed on the first piezoelectric substrate, The second chip includes a second piezoelectric substrate, The second filter and the fourth filter are formed on the second piezoelectric substrate, The composite filter component according to claim 6.

8. Furthermore, A fifth filter having a fifth passband including a reception band of a fifth band; A sixth filter having a sixth passband including a reception band of a sixth band different from the fifth band and capable of being received simultaneously with the fifth band; A third input bump connected to an input end of the fifth filter and an input end of the sixth filter; A fifth output bump connected to an output end of the fifth filter; A sixth output bump connected to an output end of the sixth filter, and Among the first output bump to the sixth output bump, the fifth output bump is disposed adjacent to the first output bump and the second output bump, and the sixth output bump is disposed adjacent to the third output bump and the fourth output bump. The composite filter component according to any one of claims 1 to 7.

9. Furthermore, A fifth filter having a fifth passband including a transmission band and a reception band of a fifth band; A sixth filter having a sixth passband including a transmission band and a reception band of a sixth band; A third input bump connected to one end of the fifth filter and one end of the sixth filter; A fifth output bump connected to the other end of the fifth filter; A sixth output bump connected to the other end of the sixth filter, and Each of the fifth filter and the sixth filter is a filter for time-division multiplexing, The composite filter component has a first main surface and a second main surface facing each other, and is a polygon having a first outer side and a second outer side facing each other when the first main surface is viewed in plan, The first output bump to the sixth output bump are arranged on the first main surface in the order of the fourth output bump, the third output bump, the second output bump, the first output bump, the sixth output bump, and the fifth output bump in a first direction along the first outer side. The first input bump to the third input bump are arranged in the order of the second input bump, the first input bump, and the third input bump in the first direction in a region on the first main surface between the first output bump to the sixth output bump and the second outer side. The composite filter component according to any one of claims 1 to 7.

10. Furthermore, Unlike the first band and the third band, a seventh filter having a seventh passband including a reception band of a seventh band that can be received simultaneously with the first band and the third band; Unlike the second band and the fourth band, an eighth filter having an eighth passband including a reception band of an eighth band that can be received simultaneously with the second band and the fourth band; A seventh output bump connected to the output end of the seventh filter; An eighth output bump connected to the output end of the eighth filter, and The first input bump is connected to the input end of the first filter, the input end of the third filter, and the input end of the seventh filter. The second input bump is connected to the input end of the second filter, the input end of the fourth filter, and the input end of the eighth filter. Among the first output bump to the fourth output bump, the seventh output bump, and the eighth output bump, the first output bump and the second output bump are arranged adjacent to each other, the third output bump and the fourth output bump are arranged adjacent to each other, and the seventh output bump and the eighth output bump are arranged adjacent to each other. The composite filter component according to any one of claims 1 to 7.

11. A first filter having a first passband including a transmission band of a first band; A second filter having a second passband including a transmission band of a second band; A third filter having a third passband including a transmission band of a third band that can be transmitted simultaneously with the first band; A fourth filter having a fourth passband including a transmission band of a fourth band that can be transmitted simultaneously with the second band; A first output bump connected to the output end of the first filter and the output end of the third filter; A second output bump connected to the output end of the second filter and the output end of the fourth filter; A first input bump connected to the input end of the first filter; A second input bump connected to the input end of the second filter; A third input bump connected to the input end of the third filter; A fourth input bump connected to the input end of the fourth filter, and Among the first input bump, the second input bump, the third input bump, and the fourth input bump, the first input bump and the second input bump are arranged adjacent to each other, and the third input bump and the fourth input bump are arranged adjacent to each other. Composite filter component.

12. The composite filter component has a first main surface and a second main surface facing each other, and is a polygon having a first outer side and a second outer side facing each other when the first main surface is viewed in plan. The first input bump, the second input bump, the third input bump, and the fourth input bump are arranged on the first main surface in the order of the first input bump, the second input bump, the third input bump, and the fourth input bump in a first direction along the first outer side. The first output bump and the second output bump are arranged on the first main surface between the first input bump, the second input bump, the third input bump, the fourth input bump and the second outer side. The composite filter component according to claim 11.

13. The composite filter component includes a first layer portion and a second layer portion laminated on each other. The first layer portion includes the first main surface, the first filter, and the fourth filter. The second layer portion includes the second main surface, the second filter, and the third filter. The first filter and the fourth filter are arranged in the order of the first filter and the fourth filter in the first direction. The second filter and the third filter are arranged in the order of the second filter and the third filter in the first direction. When the first main surface and the second main surface are viewed in plan, At least a part of the first filter and the second filter overlap each other. At least a part of the third filter and the fourth filter overlap each other. The composite filter component according to claim 12.

14. When the first main surface is viewed in plan, the area of the first input bump is larger than the area of the third input bump, and the area of the fourth input bump is larger than the area of the second input bump. The composite filter component according to claim 13.

15. The composite filter component has a first main surface and a second main surface facing each other, and includes a first layer portion and a second layer portion laminated on each other. At least a part of the transmission band of the first band and the transmission band of the second band overlap each other. The first hierarchical part includes the first main surface, the third filter, and the fourth filter. The second hierarchical part includes the second main surface, the first filter, and the second filter. The third filter and the fourth filter are arranged in the order of the third filter and the fourth filter in the first direction. The first filter and the second filter are arranged in the order of the second filter and the first filter in the first direction. When the first main surface and the second main surface are viewed in plan view, The first filter and the fourth filter overlap at least partially. The second filter and the third filter overlap at least partially. The composite filter component according to claim 11.

16. When the first main surface is viewed in plan view, the area of the third input bump is larger than the area of the first input bump, and the area of the fourth input bump is larger than the area of the second input bump. The composite filter component according to claim 15.

17. A mounting substrate having third and fourth main surfaces facing each other, The composite filter component according to any one of claims 1 to 7 disposed on the mounting substrate, A first low-noise amplifier and a second low-noise amplifier disposed on the mounting substrate, and comprising: The input end of the first low-noise amplifier is connected to the first output bump and the second output bump. The input end of the second low-noise amplifier is connected to the third output bump and the fourth output bump. High-frequency module.

18. The first output bump and the second output bump are disposed closer to the first low-noise amplifier than to the second low-noise amplifier. The third output bump and the fourth output bump are disposed closer to the second low-noise amplifier than to the first low-noise amplifier. The high-frequency module according to claim 17.

19. A mounting substrate having third and fourth main surfaces facing each other, The composite filter component according to any one of claims 11 to 16 disposed on the mounting substrate, A first power amplifier and a second power amplifier disposed on the mounting substrate, and comprising: The output end of the first power amplifier is connected to the first input bump and the second input bump. The output end of the second power amplifier is connected to the third input bump and the fourth input bump. High-frequency module.

20. The first input bump and the second input bump are arranged closer to the first power amplifier than to the second power amplifier. The third input bump and the fourth input bump are arranged closer to the second power amplifier than to the first power amplifier. The high-frequency module according to claim 19.

Images