Capacitor module

Abstract

To provide a capacitor module capable of suppressing a short circuit by securing insulation between a case and a capacitor element.SOLUTION: A capacitor module includes: a capacitor assembly having a capacitor element having a pair of end surface electrodes and a side surface connecting the pair of end surface electrodes and an external terminal electrically connected to the end surface electrode; an insulating frame having a recess for disposing the capacitor assembly; a conductive case having an opening at a position facing a bottom surface and accommodating the insulating frame and the capacitor assembly; and sealing resin filled in the case. The insulating frame is disposed so as to be fitted to the case in contact with an inner side surface and the bottom surface of the case.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present disclosure relates to a capacitor module.

Background Art

[0002] A capacitor module in which a film capacitor is housed in a case and sealed with resin is known. For example, Patent Document 1 discloses a metallized film capacitor including a case, a plurality of capacitor elements housed in the case, and a filling resin filled in the case to bury the capacitor elements. In the metallized film capacitor described in Patent Document 1, a partition plate for separating capacitor elements is disposed in the case.

[0003] In addition, for the purpose of improving the heat dissipation of the capacitor module, it has been considered to employ a metal such as aluminum as the material of the case.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In the metallized film capacitor described in Patent Document 1, when the case is formed of metal, there is still room for improvement in ensuring insulation between the case and the capacitor elements.

[0006] The present disclosure provides a capacitor module capable of ensuring insulation between a case and a capacitor element and suppressing a short circuit.

Means for Solving the Problems

[0007] The capacitor module of the present disclosure A capacitor assembly having a pair of end face electrodes and a side face connecting the pair of end face electrodes, and an external terminal electrically connected to the end face electrodes. An insulating frame having a recess for arranging the capacitor assembly. A conductive case having an opening provided at a position facing the bottom surface, and accommodating the insulating frame and the capacitor assembly. A sealing resin filled in the case. Comprising The insulating frame is arranged to abut against the inner surface and the bottom surface of the case and fit into the case.

Advantages of the Invention

[0008] According to the present disclosure, it is possible to provide a capacitor module capable of ensuring insulation between the case and the capacitor element and suppressing a short circuit.

Brief Description of the Drawings

[0009]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Modes for Carrying Out the Invention

[0010] (Background Leading to the Present Disclosure) In a capacitor module in which a capacitor element is housed in a case and encapsulated with resin, when a current flows through the capacitor, the capacitor generates heat, which may exceed the heat-resistant temperature of the capacitor module. Therefore, efficient cooling of the capacitor module has been studied. As a method of cooling the capacitor module, forming the case from a material with high thermal conductivity such as aluminum has been studied.

[0011] When the capacitor element is housed in the case and encapsulated with resin, the resin may not flow sufficiently between the capacitor element and the case, or the capacitor element may be disposed inclined with respect to the case. In this case, there is a risk that the electrode of the capacitor element contacts the case, and when the case is formed of a conductive material such as aluminum, there is a problem that the capacitor element and the case are short-circuited.

[0012] The present inventor(s) have studied a capacitor module capable of ensuring insulation between the case and the capacitor element, and arrived at the following invention.

[0013] (Embodiment 1) [Overall Configuration] FIG. 1 is a schematic plan view showing a capacitor module 1 according to Embodiment 1. FIG. 2 is a cross-sectional view taken along line A-A of FIG. 1. FIG. 3 is a cross-sectional view taken along line B-B of FIG. 1. In the drawings, the X, Y, and Z directions indicate the lateral direction, longitudinal direction, and height direction of the capacitor module 1, respectively.

[0014] As shown in FIGS. 1 to 3, the capacitor module 1 includes a capacitor assembly 10, an insulating frame 30, a case 40, and a sealing resin 50. The insulating frame 30 is disposed in the case 40 so as to fit into the bottom of the case 40. The capacitor assembly 10 is disposed in a recess of the insulating frame 30 disposed in the case 40. The capacitor assembly 10 and the insulating frame 30 in the case 40 are encapsulated with the sealing resin 50.

[0015] <Capacitor Assembly> The capacitor assembly 10 is formed by combining a capacitor element 20 and external terminals 23a and 23b that are electrically connected to a pair of end face electrodes 21a and 21b of the capacitor element 20. In the present embodiment, as shown in FIG. 3, the capacitor assembly 10 includes two capacitor elements 20.

[0016] The capacitor element 20 has a pair of end face electrodes 21a and 21b and a side surface 22 that connects the pair of end face electrodes 21a and 21b. In the present embodiment, as shown in FIG. 2, the capacitor element 20 is formed in a columnar shape having an oval cross section. In other words, the side surface 22 of the capacitor element 20 includes a pair of curved portions 22a and a pair of flat portions 22b that connect the pair of curved portions 22a. The shape of the capacitor element 20 is not limited to this, and can be any shape such as a cylinder or a prism.

[0017] The capacitor element 20 is, for example, a film capacitor formed of a laminate of dielectric films. The capacitor element 20 is formed by stacking dielectric films having a metal vapor deposition film formed on the surface and then winding them. In the present embodiment, the capacitor element 20 is formed in a columnar shape having an oval cross section by pressing a wound body of the dielectric film into a flat shape. End face electrodes 21a and 21b are provided on both end faces of the capacitor element 20. The end face electrodes 21a and 21b can be formed, for example, by spraying a conductive material such as Zn onto the end faces of the wound body of the dielectric film.

[0018] External terminals 23a and 23b are electrically connected to the end face electrodes 21a and 21b of the capacitor element 20. More specifically, the external terminal 23a is electrically connected to the end face electrode 21a, and the external terminal 23b is electrically connected to the end face electrode 21b. The external terminal 23a is a bus bar that connects the end face electrodes 21a of two capacitor elements 20 in parallel with each other, and the external terminal 23b is a bus bar that connects the end face electrodes 21b of two capacitor elements 20 in parallel with each other. The end face electrodes 21a, 21b and the external terminals 23a, 23b are connected by, for example, solder. A part of the external terminals 23a and 23b is disposed outside the case 40 and is used when connecting the capacitor module 1 to an external device or the like.

[0019] The external terminals 23a and 23b are formed, for example, by pressing a plate-shaped metal. In the present embodiment, as shown in FIG. 1, the external terminals 23a and 23b are formed by bending a plate-shaped metal, but the external terminals 23a and 23b may be members having conductivity such as lead wires. In the present embodiment, one external terminal 23a is connected to one end face electrode 21a of each of the two capacitor elements 20, and one external terminal 23b is connected to the other end face electrode 21b of each of the two capacitor elements 20.

[0020] In the present embodiment, the external terminal 23a connected to one end face electrode 21a has a first portion 26a provided along the end face electrode 21a and a bent portion 27a bent at the tip of the first portion 26a. Similarly, the external terminal 23b connected to the other end face electrode 21b has a first portion 26b provided along the end face electrode 21b and a bent portion 27b bent at the tip of the first portion 26b. Further, in the present embodiment, the external terminals 23a and 23b have external connection portions 28a and 28b extending from the bent portions 27a and 27b toward the outside of the case 40.

[0021] As shown in FIGS. 1 and 3, in the present embodiment, the capacitor assembly 10 is disposed in the case 40 with the end face electrodes 21a and 21b facing the inner surface 43 of the case 40.

[0022] Also, in the present embodiment, as shown in FIG. 2, the two external terminals 23a and 23b have an overlapping portion 24 where the external connection portions 28a and 28b are overlapped and arranged. An insulating paper 60 is disposed for insulation between the external terminal 23a and the external terminal 23b in the overlapping portion 24. Since the two external terminals 23a and 23b have the overlapping portion 24, currents flowing in opposite directions flow through the external connection portion 28a and the external connection portion 28b, respectively, canceling out the magnetic fields generated by the currents flowing through each of them, and the inductance of the capacitor module 1 can be reduced.

[0023] <Case> The case 40 is a case for housing the capacitor assembly 10. The case 40 has a bottom surface 41 and an opening 42 at a position facing the bottom surface 41. Here, the bottom surface 41 means the inner bottom surface 41 of the case 40. In the present embodiment, as shown in FIG. 1, the bottom surface 41 of the case 40 is formed in a rectangular shape, and the case 40 is formed in a box shape having the opening 42. The shape of the case 40 is not limited to this, and any shape that can house the capacitor assembly 10 and be sealed with the sealing resin 50 may be used.

[0024] The case 40 is formed of a conductive material. Examples of the conductive material include metals such as aluminum, iron, and stainless steel. Alternatively, as the material of the case 40, a resin in which a conductive filler such as a metal filler is dispersed may be used. That is, it is only necessary that the case 40 has conductivity. By forming the case 40 of a material having a high thermal conductivity such as a metal or a resin containing a metal filler, the cooling performance of the capacitor module 1 can be improved.

[0025] <Insulating Frame> The insulating frame 30 is a member disposed inside the case 40 and having a recess �1 for positioning the capacitor assembly 10 within the case 40. The recess 31 is formed in a size and shape that can position the capacitor assembly 10 inside the recess 31.

[0026] In this embodiment, as shown in FIGS. 2 and 3, the insulating frame 30 has a box shape having side walls 32 and a bottom 33. The insulating frame 30 is disposed in the case 40 such that the side walls 32 of the insulating frame 30 substantially contact the inner surface 43 of the case 40. Further, in this embodiment, legs 34 are provided on the bottom 33 of the insulating frame 30, and the legs 34 contact the bottom surface 41 of the case 40. In this embodiment, the insulating frame 30 has four legs 34 as shown in FIGS. 2 to 3. The side walls 32 and the legs 34 are in contact with the inner surface 43 and the bottom surface 41 of the case 40. In other words, the insulating frame 30 is fitted to the bottom of the case 40 by the side walls 32 abutting against the inner surface 43 and the legs 34 abutting against the bottom surface 41. That the insulating frame 30 is fitted to the case 40 means that at least a part of the side walls 32 of the insulating frame 30 is brought into contact with the inner surface 43 of the case 40, and the insulating frame 30 is accommodated in the case 40 so as not to move relative to the case 40. Since the insulating frame 30 is arranged so as to be fitted to the bottom of the case 40, the insulating frame 30 is fixed in position with respect to the case 40. Therefore, by disposing the capacitor assembly 10 in the recess 31 of the insulating frame 30, the capacitor assembly 10 can be positioned with respect to the case 40. Note that the side walls 32 abutting against the inner surface 43 includes at least a part of the side walls 32 being in contact with the inner surface 43.

[0027] The insulating frame 30 is made of an insulating material having a high dielectric breakdown voltage, such as polycarbonate, for example. Since the insulating frame 30 is formed of an insulating material, insulation between the capacitor assembly 10 and the case 40 can be ensured when the capacitor assembly 10 is disposed in the recess 31.

[0028] In this embodiment, as shown in FIG. 3, the capacitor assembly 10 is disposed such that the pair of curved portions 22a of the capacitor element 20 face the recess 31 of the insulating frame 30.

[0029] In addition, in the present embodiment, in the height direction (Z direction) from the opening 42 of the case 40 toward the bottom surface 41, the height h1 of the insulating frame 30 is formed to be half or less of the height h2 of the capacitor element 20. By making the height h1 of the insulating frame 30 lower than the height h2 of the capacitor element 20, when the sealing resin 50 is filled in the case 40, the fluidity of the sealing resin 50 can be improved.

[0030] By arranging the capacitor assembly 10 on the insulating frame 30, the capacitor assembly 10 can be positioned inside the case 40. Further, by arranging the capacitor assembly 10 on the insulating frame 30, the creepage distance between the capacitor assembly 10 and the case 40 can be ensured. By positioning the capacitor assembly 10 inside the case 40, it is possible to suppress the capacitor assembly 10 from tilting inside the case 40 and prevent contact between the capacitor assembly 10 and the case 40. Furthermore, by ensuring the creepage distance between the capacitor assembly 10 and the case 40, the capacitor assembly 10 and the case 40 can be more reliably insulated. For this reason, it is possible to suppress a short circuit between the end face electrodes 21a, 21b or the external terminals 23a, 23b of the capacitor assembly 10 and the case 40.

[0031] <Sealing resin> The sealing resin 50 is filled in the case 40 to seal the capacitor assembly 10 accommodated in the case 40. The sealing resin 50 is composed of, for example, a highly thermosetting resin such as an epoxy resin or a urethane resin.

[0032] Normally, by filling the case 40 with the sealing resin 50, the capacitor assembly 10 and the case 40 can be insulated. However, when the distance between the capacitor assembly 10 and the case 40 is short, or when the capacitor assembly 10 tilts when the case 40 is filled with the sealing resin 50, the capacitor assembly 10 may come into contact with the inner surface 43 of the case 40.

[0033] In this embodiment, by fitting the insulating frame 30 to the bottom of the case 40 and arranging the capacitor assembly 10 in the recess 31 of the insulating frame 30, the capacitor assembly 10 can be positioned with respect to the case 40. Therefore, it is possible to provide the capacitor module 1 that can ensure insulation between the capacitor assembly 10 and the case 40 and suppress a short circuit.

[0034] [Effect] According to the above-described embodiment, the following effects can be obtained.

[0035] The capacitor module 1 includes a capacitor assembly 10, an insulating frame 30, a case 40, and a sealing resin 50. The capacitor assembly 10 includes a capacitor element 20 having a pair of end face electrodes 21a and 21b and a side surface 22 connecting the pair of end face electrodes 21a and 21b, and external terminals 23a and 23b electrically connected to the end face electrodes 21a and 21b. The insulating frame 30 has a recess 31 for arranging the capacitor assembly 10. The case 40 is provided with an opening 42 at a position facing the bottom surface 41, and houses the insulating frame 30 and the capacitor assembly 10. The case 40 is made of a conductive material. The sealing resin 50 is filled in the case 40 to seal the capacitor assembly 10 and the insulating frame 30. The insulating frame 30 is arranged to abut against the inner side surface 43 and the bottom surface 41 of the case 40 and fit into the case.

[0036] With such a configuration, it is possible to provide the capacitor module 1 that can ensure insulation between the case 40 and the capacitor element 20 and suppress a short circuit. Since the insulating frame 30 is fitted to the case 40, by arranging the capacitor assembly 10 in the insulating frame 30, the capacitor assembly 10 and the case 40 can be positioned so as not to contact each other.

[0037] One end face electrode 21a of the capacitor element 20 of the capacitor assembly 10 is arranged in the insulating frame 30 facing the inner side surface 43 of the case 40.

[0038] With such a configuration, it is easy to arrange the external terminals 23a and 23b in the capacitor assembly 10, and the degree of freedom in designing the capacitor module 1 can be improved.

[0039] The side surface 22 of the capacitor element 20 includes a pair of curved portions 22a and a pair of flat portions 22b connecting the pair of curved portions 22a, and the capacitor assembly 10 is arranged such that one of the curved portions 22a faces the concave portion 31.

[0040] With such a configuration, since the curved portion 22a is arranged toward the bottom surface 41 and the opening 42 of the case 40, the fluidity of the resin when filling the sealing resin 50 can be improved.

[0041] In the height direction from the opening 42 to the bottom surface 41 of the case 40, the height h1 of the insulating frame 30 is less than or equal to half of the height h2 of the capacitor element 20.

[0042] With such a configuration, the space for filling the sealing resin 50 can be increased, and the fluidity of the resin in the case 40 can be improved.

[0043] The insulating frame 30 has legs 34 that project from the surface facing the bottom surface 41 of the case 40.

[0044] With such a configuration, the sealing resin 50 can surely flow into the space between the insulating frame 30 and the bottom surface 41 of the case 40.

[0045] [Modification Example] In the above-described embodiment, an example in which the capacitor assembly 10 has two capacitor elements 20 has been described, but the present invention is not limited to this. The capacitor assembly 10 may include only one capacitor element 20 or may include three or more capacitor elements 20.

[0046] In the above-described embodiment, an example in which the side surface of the capacitor element 20 has a pair of curved portions 22a and a pair of flat portions 22b has been described, but the present invention is not limited to this. The capacitor element 20 may be formed, for example, in a prismatic shape having four flat side surfaces, or may be formed in a columnar shape having a polygonal cross section.

[0047] In the above-described embodiment, an example in which the capacitor assembly 10 is arranged on the insulating frame 30 such that the curved portion 22a of the capacitor element 20 faces the concave portion 31 of the insulating frame 30 has been described, but the present invention is not limited to this. For example, the capacitor assembly 10 may be arranged on the insulating frame 30 such that the flat portion 22b of the capacitor element 20 faces the concave portion 31 of the insulating frame 30.

[0048] In the above-described embodiment, an example in which the height h1 of the side wall 32 of the insulating frame 30 is equal to or less than half of the height h2 of the capacitor element 20 has been described, but the present invention is not limited to this. The height h1 of the side wall 32 of the insulating frame 30 may be any height that can be accommodated within the case 40.

[0049] In the above-described embodiment, an example in which the insulating frame 30 has the leg portions 34 protruding from the surface facing the bottom surface 41 of the case 40 has been described, but the present invention is not limited to this. The insulating frame 30 may not be provided with the leg portions 34. Further, the number of the leg portions 34 is not limited to four, and may be one or more.

[0050] FIG. 4 is a schematic cross-sectional view showing a capacitor module 1A according to Modification 1 of Embodiment 1. As shown in FIG. 4, an opening 135 may be provided in the bottom portion 133 of the insulating frame 130. The opening 135 has, for example, a circular, rectangular, or polygonal shape in plan view. By providing the opening 135 in the bottom portion 133, the fluidity of the sealing resin 50 between the capacitor assembly 10 and the bottom surface 41 of the case 40 can be further improved.

[0051] (Embodiment 2) The capacitor module 2 according to Embodiment 2 of the present disclosure will be described. In Embodiment 2, mainly the differences from Embodiment 1 will be described. In Embodiment 2, the same reference numerals will be given to the same or equivalent configurations as those in Embodiment 1 and described. Further, in Embodiment 2, the description overlapping with that in Embodiment 1 will be omitted.

[0052] FIG. 5 is a schematic plan view showing the capacitor module 2 according to Embodiment 2. FIG. 6 is a cross-sectional view taken along the line C-C of FIG. 5. As shown in FIGS. 5 and 6, in Embodiment 2, it is different from Embodiment 1 in that protrusions 261a and 261b that contact the inner surface 43 of the case 40 are provided on the outer surface of the insulating frame 230.

[0053] As shown in FIG. 5, the bottom surface 41 of the case 40 has a first side 44a and a second side 44b that are located on opposite sides when viewed from the direction (Z direction) from the opening 42 toward the bottom surface 41. In the present embodiment, the protrusions provided outside the side wall 232 of the insulating frame 230 include a first protrusion 261a that contacts the first side 44a and a second protrusion 261b that contacts the second side 44b. Note that the protrusions 261a and 261b contacting the first side 44a and the second side 44b means that the protrusions 261a and 261b contact the inner surface 43 extending from the first side 44a of the bottom surface 41 and the inner surface 43 extending from the second side 44b of the bottom surface 41. In the present embodiment, the insulating frame 230 is provided with one first protrusion 261a that contacts the first side 44a and two second protrusions 261b that contact the second side 44b. Further, in the present embodiment, in the lateral direction (X direction) of the capacitor module 2, the first protrusion 261a and the second protrusion 261b are provided at different positions.

[0054] As shown in FIG. 6, the first protrusion 261a and the second protrusion 261b contact the inner surface 43 of the case 40 to fix the insulating frame 230 inside the case 40. By providing the protrusions 261a and 261b, the insulating frame 230 can be more reliably fitted inside the case 40.

[0055] By providing the first protrusion 261a and the second protrusion 261b on the insulating frame 230, even if the capacitor element 20 expands, contracts, and deforms due to heat, the insulating frame 230 can absorb the deformation. Therefore, a highly reliable capacitor module 2 can be provided. Where the protrusions 261a and 261b are not provided, a gap is formed between the insulating frame 230 and the inner surface 43 of the case 40. When filling the encapsulating resin 50, since the resin can flow into the gap between the insulating frame 230 and the case 40, the fluidity of the encapsulating resin 50 can be improved.

[0056] Since the first protrusion 261a and the second protrusion 261b are arranged at different positions in the lateral direction, the visibility of the direction in which the insulating frame 230 is inserted when the insulating frame 230 is attached into the case 40 can be improved. Therefore, misprocessing of the capacitor module 2 can be prevented.

[0057] Also, as shown in FIG. 5, the bottom surface 41 of the case 40 is formed in a rectangular shape. The first side 44a and the second side 44b of the case 40 described above correspond to the long sides of the rectangle. In the present embodiment, protrusions 262 that contact the third side 44c and the fourth side 44d corresponding to the short sides of the rectangle are provided on the side wall 232 of the insulating frame 230. Therefore, the insulating frame 230 has protrusions 261a, 261b, and 262 that respectively contact the four sides of the bottom surface 41 of the case 40. By having the protrusions 261a, 261b, and 262 on the insulating frame 230 that respectively contact the four sides of the bottom surface 41, the insulating frame 230 can be more stably fitted inside the case 40.

[0058] [Effect] According to the above-described embodiment, the following effects can be achieved.

[0059] In the capacitor module 2, protrusions 261a and 261b that contact the inner surface 43 of the case 40 are provided on the outer surface of the insulating frame 230.

[0060] With such a configuration, the insulating frame 230 can be fixed within the case 40, so that contact between the capacitor assembly 10 and the case 40 can be more reliably suppressed, preventing a short circuit.

[0061] The bottom surface 41 of the case 40 has a first side 44a and a second side 44b that are located on opposite sides when viewed from the direction from the opening 42 toward the bottom surface 41. The protrusions include a first protrusion 261a that contacts the first side 44a and a second protrusion 261b that contacts the second side 44b.

[0062] With such a configuration, the insulating frame 230 can be fixed within the case 40. Therefore, contact between the case 40 and the capacitor assembly 10 can be suppressed, and a more reliable capacitor module 2 can be provided.

[0063] The first protrusion 261a and the second protrusion 261b are provided at different positions in a direction parallel to the direction in which the first side 44a and the second side 44b extend.

[0064] With such a configuration, even if the capacitor element 20 expands, contracts, or deforms due to heat, the deformation can be absorbed by the insulating frame 230. Also, since the protrusions 261a and 261b are provided at different positions on the opposing outer surfaces of the insulating frame 230, it is easy to insert the insulating frame 230 into the case 40 in the correct orientation, and misprocessing can be suppressed.

[0065] The bottom surface 41 of the case 40 has a pair of long sides and a pair of short sides, and the first side 44a and the second side 44b constitute the pair of long sides.

[0066] With such a configuration, since the case 40 and the insulating frame 230 can be brought into contact on the long sides, the stability of the insulating frame 230 within the case 40 can be improved.

[0067] [Modification Example] FIG. 7 is a schematic cross-sectional view showing a capacitor module 2A according to Modification 1 of Embodiment 2. As shown in FIG. 7, the inner surface 343 of the case 340 may have a tapered shape that narrows from the opening 342 toward the bottom surface 341. By forming the case 340 in a tapered shape, the opening 342 can be widened, and it becomes easier to insert the insulating frame 330 and the capacitor assembly 10 into the case 340.

[0068] Further, the protrusions 361a and 361b of the insulating frame 330 may have inclined surfaces corresponding to the tapered shape of the inner surface 343 of the case 340. By forming the inclined surfaces of the protrusions 361a and 361b to match the tapered shape of the inner surface 343 of the case 340, the insulating frame 330 can be more securely fixed within the case 340.

[0069] (Embodiment 3) The capacitor module 3 according to Embodiment 3 of the present disclosure will be described. In Embodiment 3, the points that are mainly different from Embodiment 1 will be described. In Embodiment 3, the same reference numerals will be used for the same or equivalent configurations as those in Embodiment 1, and the description overlapping with Embodiment 1 will be omitted.

[0070] FIG. 8 is a schematic plan view showing the capacitor module 3 according to Embodiment 3. FIG. 9 is a cross-sectional view taken along line D-D of FIG. 8. As shown in FIGS. 8 and 9, in Embodiment 3, it is different from Embodiment 1 in that one end face electrode 421a of the capacitor element 420 is arranged facing the bottom surface 441 of the case 440.

[0071] As shown in FIGS. 8 and 9, in the capacitor module 3, one end face electrode 421a of the capacitor element 420 is arranged facing the bottom face 441 of the case 440. Therefore, the other end face electrode 421b is arranged facing the opening 442 of the case 440. For this reason, the external terminal 423a connected to the one end face electrode 421a has a second portion 426a extending along the end face electrode 421a and a third portion 427a extending along the side face 422 of the capacitor element 420 from the end of the second portion 426a. Further, the external terminal 423b connected to the other end face electrode 421b has a second portion 426b extending along the end face electrode 421b and a third portion 427b extending outward from the end of the second portion 426b of the case 440.

[0072] A protruding portion 435 protruding inward is provided at the bottom 433 of the insulating frame 430. By providing the protruding portion 435, it is possible to prevent the capacitor assembly 410 from tilting due to the thickness of the second portion 426a of the external terminal 423a disposed inside the recess 431, and to arrange the capacitor assembly 410 so as not to tilt within the insulating frame 430.

[0073] Even when the one end face electrode 421a is arranged in the capacitor assembly 410 facing the bottom face 441 of the case 440, the capacitor assembly 410 can be positioned within the case 440 using the insulating frame 430. Therefore, contact between the capacitor assembly 410 and the case 440 can be prevented, and a short circuit between the capacitor assembly 410 and the case 440 can be suppressed.

[0074] (Outline of the Embodiment) (1) The capacitor module of the present disclosure includes a capacitor assembly having a capacitor element with a pair of end face electrodes and a side surface connecting the pair of end face electrodes, and external terminals electrically connected to the end face electrodes, an insulating frame having a recess for arranging the capacitor assembly, a conductive case having an opening provided at a position facing the bottom surface and accommodating the insulating frame and the capacitor assembly, and a sealing resin filled in the case. The insulating frame is arranged to be in contact with the inner side surface and the bottom surface of the case and to fit into the case.

[0075] (2) In the capacitor module of (1), the capacitor assembly may be arranged in the insulating frame with one end face electrode of the capacitor element facing the inner side surface of the case.

[0076] (3) In the capacitor module of (1) or (2), protrusions that contact the inner side surface of the case may be provided on the outer side surface of the insulating frame.

[0077] (4) In the capacitor module of (3), the bottom surface of the case has a first side and a second side located on opposite sides when viewed from the direction from the opening toward the bottom surface, and the protrusions may include a first protrusion that contacts the first side and a second protrusion that contacts the second side.

[0078] (5) In the capacitor module of (4), the first protrusion and the second protrusion may be provided at different positions in a direction parallel to the direction in which the first side and the second side extend.

[0079] (6) In the capacitor module of (4) or (5), the bottom surface of the case has a pair of long sides and a pair of short sides, and the first side and the second side may constitute the pair of long sides.

[0080] (7) In any one of the capacitor modules of (3) to (5), the inner side surface of the case may have a tapered shape that narrows from the opening toward the bottom surface.

[0081] (8) In the capacitor module of (7), the protrusion may have an inclined surface corresponding to the tapered shape of the inner surface of the case.

[0082] (9) In any one of the capacitor modules of (1) to (8), the side surface of the capacitor element includes a pair of curved portions and a pair of flat portions connecting the pair of curved portions, and the capacitor assembly may be arranged such that one of the curved portions faces the concave portion.

[0083] (10) In any one of the capacitor modules of (1) to (9), in the height direction from the opening of the case to the bottom surface, the height of the insulating frame may be half or less of the height of the capacitor element.

[0084] (11) In any one of the capacitor modules of (1) to (10), the insulating frame may have legs protruding from the surface facing the bottom surface of the case.

[0085] (12) In any one of the capacitor modules of (1) to (11), the capacitor assembly may be arranged in the insulating frame with one of the end face electrodes facing the bottom surface of the case.

[0086] (13) In any one of the capacitor modules of (1) to (12), an opening may be provided at the bottom of the insulating frame.

[0087] (14) In any one of the capacitor modules of (1) to (13), the capacitor assembly includes a plurality of capacitor elements, and the plurality of capacitor elements may be arranged in the concave portion of the insulating frame.

[0088] (15) In any one of the capacitor modules of (1) to (14), the material of the case may include metal.

[0089] In any one of the capacitor modules (1) to (15), the material of the case may contain aluminum.

Industrial Applicability

[0090] The present disclosure is useful for capacitor modules used in various electronic devices, electrical devices, industrial devices, vehicle devices, etc.

Explanation of Symbols

[0091] 1, 1A, 2, 2A, 3 Capacitor module 10, 410 Capacitor assembly 20, 420 Capacitor element 21a, 421a End face electrode 21b, 421b End face electrode 22, 422 Side 22a Curved portion 22b Flat portion 23a External terminal 23b External terminal 30, 130, 230, 330, 430 Insulating frame 31, 131, 231, 331, 431 Recess 32, 132, 232, 332, 432 Side wall 33, 133, 233, 333, 433 Bottom 135 Opening 34 Leg 40, 340, 440 Case 41, 341, 441 Bottom surface 42, 342, 442 Opening 43, 343, 443 Inner surface 44a First side 44b Second side 44c Third side 44d Fourth side 50 Encapsulating resin 261a, 361a First protrusion (protrusion) 261b, 361b Second protrusion (protrusion) 435 Protrusion

Claims

1. A capacitor module comprising: a capacitor element having a pair of end face electrodes and a side face connecting the pair of end face electrodes; and external terminals electrically connected to the end face electrodes. An insulating frame having a recess for disposing the capacitor module. A conductive case having an opening provided at a position facing the bottom surface and accommodating the insulating frame and the capacitor module. A sealing resin filled in the case. Comprising: The insulating frame is arranged to abut against the inner surface and the bottom surface of the case and fit into the case. Capacitor module.

2. One of the end face electrodes of the capacitor element is disposed in the insulating frame with the end face electrode facing the inner surface of the case. The capacitor module according to Claim 1.

3. Protrusions that contact the inner surface of the case are provided on the outer surface of the insulating frame. The capacitor module according to Claim 1.

4. The bottom surface of the case has a first side and a second side located on opposite sides when viewed from the direction from the opening toward the bottom surface. The protrusions include a first protrusion that contacts the first side and a second protrusion that contacts the second side. The capacitor module according to Claim 3.

5. The first protrusion and the second protrusion are provided at different positions in a direction parallel to the direction in which the first side and the second side extend. The capacitor module according to Claim 4.

6. The bottom surface of the case has a pair of long sides and a pair of short sides, and the first side and the second side constitute the pair of long sides. The capacitor module according to Claim 4.

7. The inner surface of the case has a tapered shape that narrows from the opening toward the bottom surface. The capacitor module according to Claim 3.

8. The protrusions have inclined surfaces corresponding to the tapered shape of the inner surface of the case. The capacitor module according to Claim 7.

9. The side surface of the capacitor element includes a pair of curved portions and a pair of flat portions connecting the pair of curved portions, and the capacitor module is arranged such that one of the curved portions faces the recess. The capacitor module according to Claim 1.

10. In the height direction from the opening of the case toward the bottom surface, the height of the insulating frame is equal to or less than half of the height of the capacitor element. The capacitor module according to claim 1.

11. The insulating frame has legs protruding from the surface facing the bottom surface of the case. The capacitor module according to claim 1.

12. The capacitor assembly is arranged in the insulating frame with one of the end face electrodes facing the bottom surface of the case. The capacitor module according to claim 1.

13. An opening is provided at the bottom of the insulating frame. The capacitor module according to claim 1.

14. The capacitor assembly includes a plurality of capacitor elements, and the plurality of capacitor elements are arranged in the recesses of the insulating frame. The capacitor module according to claim 1.

15. The material of the case includes metal. The capacitor module according to claim 1.

16. The material of the case includes aluminum. The capacitor module according to claim 1.

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