Flexible board, liquid jet head, and liquid jet recording apparatus

Abstract

To provide a flexible board etc. capable of easily improving reliability.SOLUTION: A flexible board according to an embodiment of the present disclosure is a flexible board configured to output a drive signal to be applied to a liquid jet head having a plurality of nozzles, and includes: a plurality of wiring layers including a first wiring layer and a second wiring layer opposed to each other along a direction orthogonal to a surface of the board; one or a plurality of drive devices which are arranged in a first region of the first wiring layer, and which are configured to generate the drive signal for jetting a liquid from the nozzles; and a deformation inhibition part which is provided in a second region of the second wiring layer and configured to inhibit deformation of the flexible board.SELECTED DRAWING: Figure 7

Description

Technical Field

[0001] The present disclosure relates to a flexible substrate, an inkjet head, and an inkjet recording apparatus.

Background Art

[0002] Inkjet recording apparatuses equipped with inkjet heads are used in various fields, and various types of inkjet heads have been developed (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In such an inkjet head, generally, it is required to easily improve reliability. It is desirable to provide a flexible substrate, an inkjet head, and an inkjet recording apparatus that can easily improve reliability.

Means for Solving the Problems

[0005] A flexible substrate according to an embodiment of the present disclosure is a flexible substrate that outputs a drive signal applied to an inkjet head having a plurality of nozzles, and includes a plurality of wiring layers including a first wiring layer and a second wiring layer that face each other along a direction orthogonal to the substrate surface, one or more drive devices that are disposed within a first region of the first wiring layer and generate a drive signal for ejecting liquid from the nozzles, and a deformation suppression portion that is provided in a second region of the second wiring layer and suppresses deformation of this flexible substrate.

[0006] A liquid ejection head according to an embodiment of the present disclosure includes a flexible substrate according to an embodiment of the present disclosure, and an ejection unit having a plurality of nozzles that ejects liquid based on a drive signal output from the flexible substrate.

[0007] A liquid ejection recording apparatus according to an embodiment of the present disclosure includes the liquid ejection head according to an embodiment of the present disclosure.

Advantages of the Invention

[0008] According to the flexible substrate, the liquid ejection head, and the liquid ejection recording apparatus according to an embodiment of the present disclosure, it is possible to easily improve reliability.

Brief Description of the Drawings

[0009]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

Figure 14

Figure 15

Figure 16

Modes for Carrying Out the Invention

[0010] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. The description will be made in the following order. 1. Embodiments (Examples of flexible substrates provided with deformation suppression parts of various configurations) 2. Modification examples

[0011] <1. Embodiments> [Schematic Configuration of Printer 5] FIG. 1 shows a schematic configuration example of a printer 5 as a liquid ejection recording apparatus according to an embodiment of the present disclosure in a block diagram. FIG. 2 schematically shows a schematic configuration example of an inkjet head 1 as the liquid ejection head shown in FIG. 1 in a perspective view. FIG. 3 schematically shows a configuration example of the inkjet head 1 shown in FIG. 2 in a cross-sectional view (Y-Z cross-sectional view). In each drawing used in the description of this specification, the scale of each member is appropriately changed in order to make each member recognizable in size.

[0012] The printer 5 is an inkjet printer that uses the ink 9 described later to record (print) images, characters, etc. on a recording medium (for example, the recording paper P shown in FIG. 1). As shown in FIG. 1, this printer 5 includes an inkjet head 1, a print control unit 2, and an ink tank 3.

[0013] Note that the inkjet head 1 corresponds to a specific example of the "liquid ejection head" in the present disclosure, and the printer 5 corresponds to a specific example of the "liquid ejection recording apparatus" in the present disclosure. Further, the ink 9 corresponds to a specific example of the "liquid" in the present disclosure.

[0014] (A. Print Control Unit 2) The print control unit 2 supplies various types of information (data) to the inkjet head 1. Specifically, as shown in FIG. 1, the print control unit 2 supplies a print control signal Sc to the inside of the inkjet head 1 (such as the drive device 41 described later).

[0015] Note that this print control signal Sc includes, for example, image data, a discharge timing signal, and a power supply voltage for operating the inkjet head 1.

[0016] (B. Ink Tank 3) The ink tank 3 is a tank that houses the ink 9 inside. The ink 9 in this ink tank 3 is supplied to the inside of the inkjet head 1 (the ejection unit 11 described later) via the ink supply pipe 30 as shown in FIG. 1. Note that such an ink supply pipe 30 is composed of, for example, a flexible hose having flexibility.

[0017] (C. Inkjet Head 1) As shown by the dashed arrows in Fig. 1, the inkjet head 1 is a head that ejects (discharges) droplet-shaped ink 9 onto the recording paper P from a plurality of nozzle holes Hn described later to perform recording such as images and characters. As shown in Figs. 2 and 3, for example, this inkjet head 1 includes one ejection unit 11, one I / F (interface) substrate 12, four flexible substrates 13a, 13b, 13c, 13d, and two cooling units 141, 142.

[0018] (C-1. I / F Substrate 12) As shown in Figs. 2 and 3, the I / F substrate 12 includes two connectors 10, four connectors 120a, 120b, 120c, 120d, and a circuit arrangement region 121.

[0019] As shown in Fig. 2, the connector 10 is a part (connector part) that inputs the aforementioned printing control signal Sc supplied from the printing control unit 2 toward the inkjet head 1 (each of the flexible substrates 13a, 13b, 13c, 13d described later).

[0020] The connectors 120a, 120b, 120c, 120d are each a part (connector part) that electrically connects between the I / F substrate 12 and the flexible substrates 13a, 13b, 13c, 13d.

[0021] The circuit arrangement region 121 is a region on the I / F substrate 12 where various circuits are arranged. Note that such a circuit arrangement region may also be provided in other regions on the I / F substrate 12.

[0022] (C-2. Ejection Unit 11) As shown in Fig. 1, the ejection unit 11 has a plurality of nozzle holes Hn and is a part that ejects ink 9 from these nozzle holes Hn. Such ejection of the ink 9 is performed according to a drive signal Sd (drive voltage Vd) supplied from a drive device 41 described later on each of the flexible substrates 13a, 13b, 13c, 13d (see Fig. 1).

[0023] As shown in FIG. 1, such an injection unit 11 is configured to include an actuator plate 111 and a nozzle plate 112.

[0024] (Nozzle plate 112) The nozzle plate 112 is a plate made of a film material such as polyimide or a metal material, and has the plurality of nozzle holes Hn as described above, as shown in FIG. 1. These nozzle holes Hn are formed side by side at a predetermined interval and are, for example, circular in shape. Note that each of these nozzle holes Hn corresponds to a specific example of the "nozzle" in the present disclosure.

[0025] Specifically, in the example of the injection unit 11 shown in FIG. 2, the plurality of nozzle holes Hn in the nozzle plate 112 are constituted by a plurality of nozzle rows (four nozzle rows) arranged along the column direction (X-axis direction). Further, these four nozzle rows are arranged side by side along the direction (Y-axis direction) orthogonal to the column direction.

[0026] (Actuator plate 111) The actuator plate 111 is a plate made of a piezoelectric material such as PZT (lead zirconate titanate), for example. A plurality of channels (pressure chambers) are provided in the actuator plate 111. These channels are portions for applying pressure to the ink 9 and are arranged side by side at a predetermined interval so as to be parallel to each other. Each channel is defined by a driving wall (not shown) made of a piezoelectric body and has a concave groove portion in a cross-sectional view.

[0027] Such channels include a discharge channel for discharging the ink 9 and a dummy channel (non-discharge channel) that does not discharge the ink 9. In other words, while the discharge channel is filled with the ink 9, the dummy channel is not filled with the ink 9. Note that the filling of the ink 9 into each discharge channel is performed, for example, via a flow path (common flow path) that communicates in common with such each discharge channel. Also, each discharge channel individually communicates with the nozzle hole Hn in the nozzle plate 112, while each dummy channel is not in communication with the nozzle hole Hn. These discharge channels and dummy channels are alternately arranged side by side along the column direction (X-axis direction) described above.

[0028] Further, drive electrodes are provided on the opposing inner surfaces of the drive walls described above. On this drive electrode, there exist a common electrode (common electrode) provided on the inner surface facing the discharge channel and an active electrode (individual electrode) provided on the inner surface facing the dummy channel. Between these drive electrodes and a drive device 41 described later, they are electrically connected via the respective flexible substrates 13a, 13b, 13c, 13d. Thereby, the drive voltage Vd (drive signal Sd) described above is applied from the drive device 41 to each drive electrode via the respective flexible substrates 13a, 13b, 13c, 13d (see FIG. 1).

[0029] (C-3. Flexible substrates 13a, 13b, 13c, 13d) Flexible substrates 13a, 13b, 13c, and 13d are substrates that electrically connect between the I / F substrate 12 and the ejection unit 11, as shown in FIGS. 2 and 3. Each of these flexible substrates 13a, 13b, 13c, and 13d is configured to individually control the ejection operation of the ink 9 for each of the four nozzle rows in the nozzle plate 112 described above. Also, as shown by reference numerals P1a, P1b, P1c, and P1d in FIG. 3, for example, near the connection points of the respective flexible substrates 13a, 13b, 13c, and 13d to the ejection unit 11 (near the pressure-bonding electrodes 433), the respective flexible substrates 13a, 13b, 13c, and 13d are configured to be bent. Note that the pressure-bonding electrodes 433 and the ejection unit 11 are electrically connected to each other by thermocompression bonding using, for example, an ACF (Anisotropic Conductive Film).

[0030] On each of such flexible substrates 13a, 13b, 13c, and 13d, drive devices 41 are individually mounted (see FIG. 3). Each of these drive devices 41 is a device that outputs a drive signal Sd (drive voltage Vd) for ejecting the ink 9 from the nozzle holes Hn in the corresponding nozzle row in the ejection unit 11. Therefore, such drive signals Sd are output from each of the flexible substrates 13a, 13b, 13c, and 13d to the ejection unit 11. Note that each of such drive devices 41 is configured by, for example, an ASIC (Application Specific Integrated Circuit) or the like.

[0031] In addition, each of these drive devices 41 is configured to be cooled by the aforementioned cooling units 141 and 142. Specifically, as shown in FIG. 3, a cooling unit 141 is fixedly arranged between the drive devices 41 on the flexible substrates 13a and 13b. By pressing this cooling unit 141 against each of these drive devices 41, each drive device 41 is cooled. Similarly, a cooling unit 142 is fixedly arranged between the drive devices 41 on the flexible substrates 13c and 13d. By pressing this cooling unit 142 against each of these drive devices 41, each drive device 41 is cooled. Note that such cooling units 141 and 142 can each be configured using various types of cooling mechanisms.

[0032] [Detailed Configuration of Flexible Substrates 13a, 13b, 13c, and 13d] Subsequently, with reference to FIGS. 4 to 9 in addition to FIGS. 1 to 3, a detailed configuration example of the aforementioned flexible substrates 13a, 13b, 13c, and 13d will be described while comparing it with the configuration of a comparative example.

[0033] FIGS. 4 and 5 schematically show, in plan views (Z-X plane views), detailed configuration examples of the flexible substrates 13a to 13d (hereinafter generically referred to as the flexible substrate 13 as appropriate) shown in FIGS. 2 and 3, respectively. Specifically, FIG. 4 shows a plan configuration example of the surface S1 side of the flexible substrate 13 to be described later, and FIG. 5 shows a plan configuration example of the back surface S2 side of the flexible substrate 13 to be described later. FIG. 6 schematically shows, in a plan view (Z-X plane view), an arrangement configuration example of wiring patterns 43 and the like in the vicinity of the device interval region Ag in a conventional flexible substrate (flexible substrate 103) according to the comparative example. FIGS. 7 and 8 schematically show, in perspective views, arrangement configuration examples of deformation suppression portions 42 and the like to be described later in the present embodiment. FIG. 9 schematically shows, in a cross-sectional view, the arrangement configuration example of the deformation suppression portion 42 and the like shown in FIG. 8.

[0034] First, this flexible substrate 13 is a double-sided substrate with a multi-layer structure including a front surface S1 and a back surface S2. Specifically, this flexible substrate 13 has, as wiring layers of such a multi-layer structure (two-layer structure), a first wiring layer W1 on the front surface S1 side and a second wiring layer W2 on the back surface S2 side that face each other along the direction (Y-axis direction) orthogonal to the substrate surface (Z-X plane) (see FIG. 9). Note that the wiring layer in the flexible substrate 13 may have a structure of three or more layers, for example, including the above-described first wiring layer W1 and second wiring layer W2.

[0035] Also, as shown in FIGS. 4, 5, 7 to 9, this flexible substrate 13 has the aforementioned one or more drive devices 41 (five drive devices 41 in this example), a mold portion 40, a wiring pattern 43, a terminal portion 130, and a deformation suppression portion 42.

[0036] As described above, the drive device 41 is disposed on the substrate of the flexible substrate 13 (on the first wiring layer W1 on the front surface S1 side). Specifically, for example, as shown in FIGS. 7 to 9, the drive device 41 is disposed within a first region A1 of the first wiring layer W1. Note that, for example, as shown in FIG. 9, within this first region A1 of the first wiring layer W1, a mold portion 40 is disposed around the drive device 41. Also, in the examples of FIGS. 4, 5, 7, and 8, on the substrate of the flexible substrate 13, a plurality of drive devices 41 (five drive devices 41 in this example) are arranged side by side along the X-axis direction (the longitudinal direction of the flexible substrate 13).

[0037] The wiring pattern 43 is a pattern of various wirings electrically connected to the drive device 41. Examples of this wiring pattern 43 include a signal wiring pattern corresponding to the wiring of various signals, a power supply wiring pattern corresponding to the wiring of various power supplies, and a ground wiring pattern corresponding to the wiring of the ground.

[0038] The terminal portion 130 is disposed in the end region on the I / F substrate 12 side of the flexible substrate 13 (see FIGS. 4 and 5), and includes a plurality of terminals for electrically connecting between the flexible substrate 13 and the I / F substrate 12. In other words, this terminal portion 130 is the portion to be inserted into the connectors 120a to 120d on the I / F substrate 12 as another substrate.

[0039] The deformation suppression portion 42 is provided in the second region A2 of the second wiring layer W2 (see FIGS. 7 to 9), and is a portion that suppresses deformation of the flexible substrate 13. The reason for suppressing the deformation of the flexible substrate 13 in this way will be described below with reference to the comparative example shown in FIG. 6.

[0040] First, in the flexible substrate 103 of the comparative example shown in FIG. 6, by arranging the wiring pattern 43 in the region (device-intermediate region Ag) between the drive devices 41, the rigidity of this device-intermediate region Ag is increased to suppress bending between the drive devices 41. However, in such a configuration, a portion with low rigidity is formed at the boundary between the wiring pattern 43 and the end portion (end portion e1) of the drive device 41. When the flexible substrate 103 is bent, stress is applied to the boundary, which may cause the mounting of the drive device 41 to peel off. Also, when the flexible substrate 103 is bent at the end portion (end portion e2) not sandwiched by the drive device 41, direct stress is applied to the end portion, which may similarly cause the mounting of the drive device 41 to peel off.

[0041] Therefore, in the flexible substrate 13 of the present embodiment, a deformation suppression portion 42 that suppresses deformation of the flexible substrate 13 is provided on the second wiring layer W2 (second region A2) different from the first wiring layer W1 on which the drive device 41 is disposed. Specifically, in the examples of FIGS. 7 to 9, the second region A2 in which the deformation suppression portion 42 is disposed overlaps with the entire region of the first region A1 including the arrangement region of the drive device 41. Also, for example, as shown in FIGS. 7 and 8, on the flexible substrate 13, a plurality of second regions A2 are arranged separately from each other for each of the plurality of drive devices 41.

[0042] Further, in the examples of FIGS. 8 and 9, the deformation suppression portion 42 is configured using the wiring pattern 43 on the second wiring layer W2. Note that the wiring pattern 43 constituting such a deformation suppression portion 42 is set to a predetermined power supply potential or a ground potential, for example. Examples of such a ground potential include a ground potential for a predetermined signal line.

[0043] [Embodiment Regarding Configuration of Deformation Suppression Portion 42] Here, with reference to FIGS. 10 to 16 in addition to FIGS. 1 to 9, embodiments (Embodiments 1 to 7) regarding the configuration of such a deformation suppression portion 42 will be described in detail.

[0044] FIGS. 10 to 15 schematically show, in a plan view (Z-X plan view), the arrangement configurations of the deformation suppression portion 42 and the like in flexible substrates (flexible substrates 13A to 13G) according to Embodiments 1 to 7, respectively. Specifically, in FIGS. 10 to 16, the correspondence relationships among the arrangement regions (mounting regions) of the drive devices 41, the above-described first region A1 and second region A2, and the arrangement region of the deformation suppression portion 42 on the flexible substrates 13A to 13G are schematically shown.

[0045] First, in the flexible substrate 13A of Embodiment 1 shown in FIG. 10, the second region A2 in which the deformation suppression portion 42 is arranged overlaps at least a part (in the example of FIG. 10, a part of the first region A1) of the first region A1 including the arrangement region of the drive device 41. In contrast, in the examples of FIGS. 7 to 9 described above, the second region A2 in which the deformation suppression portion 42 is arranged overlaps the entire region of the first region A1 including the arrangement region of the drive device 41.

[0046] Further, in the flexible substrate 13B of Embodiment 2 shown in FIG. 11, the second region A2 in which the deformation suppression portion 42 is arranged overlaps at least a part (in the example of FIG. 11, a part of the end portion of the drive device 41) of the end portion of the drive device 41 within the first region A1.

[0047] In the flexible substrate 13C of Embodiment 3 shown in FIG. 12, the second region A2 in which the deformation suppression portion 42 is disposed is disposed along the outer periphery of the drive device 41 within the first region A1. Note that connection electrodes (not shown) to the flexible substrate 13C are arranged side by side in the vicinity of the outer periphery of the drive device 41. Therefore, when the deformation suppression portion 42 is arranged so as to include this connection electrode, it is necessary to provide a width of, for example, about ±0.2 mm from the outer periphery (outer frame) of the drive device 41.

[0048] In the flexible substrate 13D of Embodiment 4 shown in FIG. 13, the second region A2 in which the deformation suppression portion 42 is disposed overlaps with the entire region of the arrangement region of the drive device 41 within the first region A1.

[0049] In the flexible substrate 13E of Embodiment 5 shown in FIG. 14, the second region A2 in which the deformation suppression portion 42 is disposed is disposed along the outer periphery of the first region A1 including the arrangement region of the drive device 41 and is spaced apart from the arrangement region of the drive device 41. Note that when the deformation suppression portion 42 is arranged while protecting the above-described mold portion 40, it is necessary to provide a width of, for example, about ±1.0 mm from the outer periphery (outer frame) of the first region A1. On the other hand, in the flexible substrate 13F of Embodiment 6 shown in FIG. 15, the second region A2 in which the deformation suppression portion 42 is disposed overlaps with the entire region of the first region A1 including the arrangement region of the drive device 41.

[0050] Also, in the flexible substrate 13G of Example 7 shown in FIG. 16, similar to the flexible substrate 13E described above, the second region A2 in which the deformation suppressing portion 42 is disposed is arranged along the outer periphery of the first region A1 including the arrangement region of the drive device 41 and separated from the arrangement region of the drive device 41. However, in this flexible substrate 13G, unlike the flexible substrate 13E, the second region A2 has an external region including the missing portion A0 outside the first region A1. That is, with the missing portion A0 where the deformation suppressing portion 42 is not provided interposed therebetween, the second region A2 on the inner peripheral side and the second region A2 on the outer peripheral side are provided. Note that the deformation suppressing portion 42 (second region A2) on the inner peripheral side of the missing portion A0 may not be separated from the arrangement region of the drive device 41, unlike the case of Example 7 shown in FIG. 16. Further, regarding the shape of the missing portion A0, any shape may be used as long as the pattern of the deformation suppressing portion 42 is missing on the outer peripheral side of the first region A1. For example, it does not have to be a shape that surrounds the periphery of the first region A1.

[0051] [Operation, Action, and Effect] (A. Basic Operation of Printer 5) In this printer 5, a recording operation (printing operation) such as an image or characters on a recording medium (recording paper P or the like) is performed using an ink ejection operation of the ink 9 by the following inkjet head 1. Specifically, in the inkjet head 1 of the present embodiment, an ink ejection operation using a shear mode is performed as follows.

[0052] First, each drive device 41 on each flexible substrate 13 (13a, 13b, 13c, 13d) applies a drive voltage Vd (drive signal Sd) to the above-described drive electrodes (common electrode and active electrode) in the actuator plate 111 in the ejection portion 11. Specifically, each drive device 41 applies a drive voltage Vd to each drive electrode disposed on a pair of drive walls defining the above-described discharge channel. As a result, each of these pair of drive walls deforms so as to protrude toward the dummy channel side adjacent to its discharge channel.

[0053] At this time, the drive wall will be bent and deformed in a V shape with the intermediate position in the depth direction of the drive wall as the center. Then, due to such bending and deformation of the drive wall, the discharge channel deforms as if it swells. In this way, the volume of the discharge channel increases due to the bending deformation caused by the piezoelectric thickness-shear effect in the pair of drive walls. And as the volume of the discharge channel increases, the ink 9 will be induced into the discharge channel.

[0054] Next, the ink 9 induced into the discharge channel in this way propagates inside the discharge channel as a pressure wave. And at the timing when this pressure wave reaches the nozzle hole Hn of the nozzle plate 112 (or the timing in the vicinity thereof), the drive voltage Vd applied to the drive electrode becomes 0 (zero) V. As a result, the drive wall is restored from the above-described bent and deformed state, and the volume of the discharge channel that once increased returns to its original state again.

[0055] In this way, in the process of the volume of the discharge channel returning to its original state, the pressure inside the discharge channel increases, and the ink 9 in the discharge channel is pressurized. As a result, the ink 9 in droplet form is discharged to the outside (toward the recording paper P) through the nozzle hole Hn (see FIG. 1). In this way, the ejection operation (discharge operation) of the ink 9 in the inkjet head 1 is performed, and as a result, the recording operation of images, characters, etc. on the recording paper P is performed.

[0056] (B. Action and Effect of Inkjet Head 1) Subsequently, the actions and effects of the inkjet head 1 of the present embodiment will be described in detail.

[0057] (B-1. About Conventional Inkjet Heads) First, in a conventional inkjet head, as a driving substrate for driving the inkjet head, a method using a flexible substrate is known. Since this flexible substrate has flexibility, it becomes easier to arrange the substrate in the inkjet head and connect it to an actuator. However, because it has flexibility, handling during assembly and the like becomes difficult, which is a factor in reducing the yield. In particular, at the end of a driving device, which is a particularly large component among the components mounted on the flexible substrate, the flexible substrate may bend.

[0058] Therefore, for example, in the flexible substrate 103 (see FIG. 6) of the above-described comparative example, by arranging the wiring pattern 43 in the inter-device region Ag, the rigidity of this inter-device region Ag is increased to suppress bending between the driving devices 41. However, when such a configuration is adopted, when the flexible substrate 103 bends, stress is applied in the vicinity of the ends e1 and e2 as described above, which may cause the mounted driving device 41 to peel off.

[0059] Thus, it can be said that it is difficult to easily improve the reliability of the flexible substrate in a conventional inkjet head (including the flexible substrate 103 of the comparative example).

[0060] (B-2. Function and Effect) On the other hand, in the inkjet head 1 of the present embodiment, since the flexible substrate 13 (13A to 13F) has the following configuration, for example, the following functions and effects can be obtained.

[0061] That is, first, in the flexible substrate 13 of the present embodiment, a deformation suppressing portion 42 for suppressing deformation of the flexible substrate 13 is provided on a second wiring layer W2 (second region A2) different from the first wiring layer W1 on which the drive device 41 is disposed. Thereby, while maintaining the wiring freedom degree with respect to the drive device 41 on the first wiring layer W1, the deformation of the flexible substrate 13 is suppressed, so that the mounting peeling of the drive device 41 is less likely to occur. As a result, in the present embodiment, it is possible to easily improve the reliability of the flexible substrate 13 as compared with the above-described comparative example and the like.

[0062] Further, in the present embodiment, when the above-described second region A2 overlaps at least a part of the first region A1 including the arrangement region of the drive device 41, the following occurs. That is, when the mounting pad (electrode connected to the substrate) of the drive device 41 is located inside the outer shape of the drive device 41, it is possible to protect the connection between the mounting pad and the substrate.

[0063] Furthermore, in the present embodiment, when the above-described second region A2 overlaps at least a part of the end portion of the drive device 41 in the first region A1, it is possible to prevent the mounting peeling of the drive device 41 in the vicinity of the end portion of the drive device 41.

[0064] In addition, in the present embodiment, when the above-described second region A2 is arranged along the outer periphery of the drive device 41 in the first region A1, the following occurs. That is, it is possible to protect all end portions of the drive device 41 (prevent the mounting peeling of the drive device 41 in the vicinity of all end portions).

[0065] Also, in the present embodiment, when the above-described second region A2 overlaps the entire region of the drive device 41 in the first region A1, it is possible to protect not only the vicinity of the end portion of the drive device 41 but also the entire arrangement region of the drive device 41.

[0066] Furthermore, in the present embodiment, when the above-described second region A2 is arranged so as to be separated from the arrangement region of the drive device 41 along the outer periphery of the first region A1, the following occurs. That is, it becomes possible to prevent peeling between the end portion of the mold portion 40 and the substrate.

[0067] In addition, in the present embodiment, when the above-described second region A2 is made to overlap with the entire region of the first region A1, it becomes possible to further increase the strength of the flexible substrate 13 and further suppress bending.

[0068] Also, in the present embodiment, when the above-described second region A2 has an external region including the missing portion A0 outside the first region A1, the following occurs. That is, by removing a pattern at a location different from the first region A1, it becomes possible to disperse the bending stress on the flexible substrate 13 to a location different from the periphery of the drive device 41.

[0069] Furthermore, in the present embodiment, since the plurality of drive devices 41 are arranged side by side along the longitudinal direction (X-axis direction) of the flexible substrate 13, the following occurs. That is, the path of the wiring pattern 43 on the flexible substrate 13 becomes short and simple. Therefore, it becomes possible to reduce the size of the flexible substrate 13.

[0070] In addition, in the present embodiment, since the plurality of second regions A2 are arranged so as to be separated from each other for each of the plurality of drive devices 41, it becomes possible to arrange another wiring pattern 43 in the region between the drive devices 41 (the above-described inter-device region Ag).

[0071] Also, in the present embodiment, since the deformation suppression portion 42 is configured using the wiring pattern 43 on the second wiring layer W2, the following occurs. That is, by performing reinforcement using such a wiring pattern 43, the flexible substrate 13 can be partially reinforced, and by using the same material as the other wiring patterns 43, it becomes possible to achieve commonality in the manufacturing process.

[0072] Furthermore, in the present embodiment, when the wiring pattern 43 constituting the deformation suppression unit 42 is set to the ground potential, it becomes possible to prevent noise and obtain a heat dissipation effect.

[0073] In addition, in the present embodiment, when the ground potential set for the wiring pattern 43 described above is the ground potential for a predetermined signal line, it becomes possible to suppress heat generation compared to the case of the power supply potential due to the influence of the voltage.

[0074] <2. Modification example> As described above, the present disclosure has been described by giving some embodiments and examples, but the present disclosure is not limited to these embodiments and the like, and various modifications are possible. [[ID=!4]]

[0075] For example, in the above-described embodiments and the like, configuration examples (shape, arrangement, number, etc.) of each member in the printer and the inkjet head have been specifically described, but the present disclosure is not limited to those described in the above-described embodiments and the like, and other shapes, arrangements, numbers, etc. may be used.

[0076] Specifically, for example, in the above-described embodiments and the like, configuration examples (shape, arrangement, number, etc.) of a flexible substrate, a drive device, various wiring patterns, etc. have been specifically described, but these configuration examples are not limited to those described in the above-described embodiments and the like. For example, in the above-described embodiments and the like, an example in which a plurality of drive substrates are provided in the inkjet head has been described, but this example is not limited thereto, and for example, only one drive substrate may be provided in the inkjet head. Further, in the above-described embodiments and the like, an example in which a plurality of drive devices are provided on the drive substrate has been described, but this example is not limited thereto, and for example, only one drive device may be provided on the drive substrate. Furthermore, in the above-described embodiments and the like, the shape of the drive device is rectangular, but this example is not limited thereto, and for example, it may be square.

[0077] In addition, as the structure of the inkjet head, each type can be applied. That is, for example, a so-called side shoot type inkjet head that ejects ink 9 from the central portion in the extending direction of each ejection channel in the actuator plate 111 may be used. Alternatively, for example, a so-called edge shoot type inkjet head that ejects ink 9 along the extending direction of each ejection channel may be used. Furthermore, as the printer method, it is not limited to the method described in the above embodiments and the like. For example, various methods such as the MEMS (Micro Electro Mechanical Systems) method can be applied.

[0078] Furthermore, for example, either a circulating type inkjet head that circulates and uses ink 9 between the ink tank and the inkjet head or a non-circulating type inkjet head that uses ink 9 without circulation can apply the present disclosure.

[0079] Also, the series of processes described in the above embodiments and the like may be performed by hardware (circuit) or may be performed by software (program). When performed by software, the software is composed of a group of programs for causing a computer to execute each function. Each program may be, for example, pre-installed in the above computer and used, or may be installed from a network or a recording medium into the above computer and used.

[0080] Furthermore, in the above embodiments and the like, as a specific example of the "liquid jet recording apparatus" in the present disclosure, the printer 5 (inkjet printer) has been described. However, this example is not limited thereto, and the present disclosure can also be applied to other apparatuses other than inkjet printers. In other words, the "liquid jet head" (inkjet head) of the present disclosure may be applied to apparatuses other than inkjet printers. Specifically, for example, the "liquid jet head" of the present disclosure may be applied to apparatuses such as facsimiles and on-demand printers.

[0081] In addition, the various examples described so far may be applied in any combination.

[0082] Note that the effects described in this specification are merely illustrative and not limiting, and there may be other effects.

[0083] Also, the present disclosure can also take the following configurations. (1) A flexible substrate that outputs a drive signal applied to a liquid ejection head having a plurality of nozzles, including a plurality of wiring layers including a first wiring layer and a second wiring layer that face each other along a direction orthogonal to the substrate surface, one or more drive devices disposed in a first region of the first wiring layer and generating the drive signal for ejecting liquid from the nozzle, and a deformation suppressing portion provided in a second region of the second wiring layer for suppressing deformation of the flexible substrate A flexible substrate provided with. (2) The second region overlaps at least a part of the first region The flexible substrate according to (1) above. (3) The second region overlaps at least a part of an end portion of the drive device in the first region The flexible substrate according to (r) above. (4) The second region is disposed along the outer periphery of the drive device in the first region The flexible substrate according to (2) above. (5) The second region overlaps the entire region of the drive device in the first region The flexible substrate according to (2) above. (6) The second region is arranged along the outer periphery of the first region and is spaced apart from the arrangement region of the drive device. The flexible substrate according to (1) above. (7) The second region overlaps with the entire region of the first region. The flexible substrate according to (1) above. (8) The second region has an external region including a missing portion outside the first region. The flexible substrate according to (1) above. (9) A plurality of the drive devices are arranged side by side along the longitudinal direction of the flexible substrate. The flexible substrate according to any one of (1) to (8) above. (10) A plurality of the second regions are arranged separately from each other for each of the plurality of drive devices. The flexible substrate according to (9) above. (11) The deformation suppression portion is configured using a wiring pattern on the second wiring layer. The flexible substrate according to any one of (1) to (10) above. (12) The wiring pattern is set to a ground potential. The flexible substrate according to (11) above. (13) The ground potential is a ground potential for a predetermined signal line. The flexible substrate according to (12) above. (14) The flexible substrate according to any one of (1) to (13) above, and An ejection unit having a plurality of nozzles that ejects the liquid based on the drive signal output from the flexible substrate. A liquid ejection head provided with the above. (15) A liquid ejection recording apparatus provided with the liquid ejection head according to (14) above. A liquid ejection recording apparatus.

Description of Symbols

[0084] 1... Inkjet head, 10... Connector, 11... Injection part, 111... Actuator plate, 112... Nozzle plate, 12... I / F substrate, 120a, 120b, 120c, 120d... Connectors, 121... Circuit arrangement area, 13, 13a, 13b, 13c, 13d, 13A to 13G... Flexible substrates, 130... Connection electrodes, 141, 142... Cooling units, 2... Printing control unit, 3... Ink tank, 30... Ink supply pipe, 40... Mold part, 41... Driving device, 42... Deformation suppression part, 43... Wiring pattern, 433... Crimping electrode, 5... Printer, 9... Ink, P... Recording paper, Hn... Nozzle hole, Sc... Printing control signal, Sd... Driving signal, Vd... Driving voltage, S1... Front surface, S2... Back surface, W1... First wiring layer, W2... Second wiring layer, A0... Missing part, A1... First region, A2... Second region, Ag... Area between devices, e1, e2... Ends.

Claims

1. A flexible printed circuit board that outputs a drive signal applied to a liquid ejection head having a plurality of nozzles, including a plurality of wiring layers including a first wiring layer and a second wiring layer that face each other along a direction orthogonal to the board surface; one or a plurality of drive devices disposed in a first region of the first wiring layer, the drive devices generating the drive signal for ejecting liquid from the nozzles; and a deformation suppressing portion provided in a second region of the second wiring layer, the deformation suppressing portion suppressing deformation of the flexible printed circuit board. A flexible printed circuit board provided with the above.

2. The flexible printed circuit board according to claim 1, wherein the second region overlaps at least a part of the first region. The flexible printed circuit board according to claim 1.

3. The flexible printed circuit board according to claim 2, wherein the second region overlaps at least a part of an end portion of the drive device in the first region. The flexible printed circuit board according to claim 2.

4. The flexible printed circuit board according to claim 2, wherein the second region is disposed along an outer periphery of the drive device in the first region. The flexible printed circuit board according to claim 2.

5. The flexible printed circuit board according to claim 2, wherein the second region overlaps the entire region of the drive device in the first region. The flexible printed circuit board according to claim 2.

6. The flexible printed circuit board according to claim 1, wherein the second region is disposed along an outer periphery of the first region, separated from the arrangement region of the drive device. The flexible printed circuit board according to claim 1.

7. The flexible printed circuit board according to claim 1, wherein the second region overlaps the entire region of the first region. The flexible printed circuit board according to claim 1.

8. [[ID= ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ The flexible substrate according to any one of claims 1 to 8, and an ejection unit having the plurality of nozzles that ejects the liquid based on the drive signal output from the flexible substrate A liquid ejection head comprising:

15. A liquid ejection recording apparatus comprising the liquid ejection head according to claim 14 ​

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