Electrostatic capacitive sensor

Abstract

To provide an electrostatic capacitive sensor that can be manufactured without changing the layout of conductive wires even when the number and position of detection electrodes and the number of conductive wires to be electrically connected to the detection electrodes are different.SOLUTION: An electrostatic capacitive sensor 1 includes a plurality of first conductive parts 14 each disposed on a substrate 10 and including a first conductive part 14a and a first conductive part 14b extending from the first conductive part 14a, a detection electrode 22 that electrically connects to the first conductive part 14a included in one first conductive part 14 selected from the plurality of first conductive parts 14, a plurality of second conductive parts 15 each disposed on the substrate 10 and including a second conductive part 15a electrically connected to a terminal T connected to a driving circuit and a second conductive part 15b extending from the second conductive part 15a, and a first connection member 50 that electrically connects the first conductive part 14b included in one first conductive part 14 and the second conductive part 15b included in one second conductive part 15 selected from the plurality of second conductive parts 15.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present disclosure relates to a capacitance sensor.

Background Art

[0002] Patent Document 1 discloses a detection device including a sensor substrate on which a plurality of detection electrodes are arranged as an example of a capacitance sensor. The plurality of detection electrodes are arranged in a matrix on the first surface of the sensor substrate. Sensor wirings are electrically connected to the plurality of detection electrodes respectively. That is, the number of sensor wirings is equal to the number of detection electrodes. The sensor wirings are arranged on the first surface of the sensor substrate in a state of being electrically isolated from each other.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The capacitance sensor described in Patent Document 1 can be combined not only with a display device but also, for example, disposed inside a product such as furniture formed of wood or the like. In this case, for example, the capacitance sensor reacts when a user touches a symbol indicating a switch disposed on the outer surface of the product. Also in this case, the number of detection electrodes and the number of sensor wirings (conductive wires) may be equal to the number of the symbols. Further, the positions of the detection electrodes vary depending on the positions of the symbols.

[0005] However, the differences in the number and positions of the detection electrodes and the number of conductive wires mean that it is necessary to change the layout of the conductive wires for each product, and it is necessary to manufacture a capacitance sensor in which the positions of the detection electrodes and the layout of the conductive wires are different for each product. Manufacturing a dedicated capacitance sensor for each product is difficult in terms of cost and management.

[0006] The present disclosure aims to provide a capacitance sensor that can be manufactured without changing the layout of conductive wires even when the number and positions of detection electrodes and the number of conductive wires electrically connected to the detection electrodes are different.

Means for Solving the Problems

[0007] The capacitance sensor of the present disclosure includes a substrate, a plurality of first conductive parts disposed on the substrate and having a first conductor part and a first wire part extending from the first conductor part, a detection electrode electrically connected to the first conductor part included in one first conductive part selected from the plurality of first conductive parts, a plurality of second conductive parts disposed on the substrate and having a second conductor part electrically connected to a terminal connected to a drive circuit and a second wire part extending from the second conductor part, and a first connection member that electrically connects the first wire part and the second wire part, wherein the first connection member electrically connects the first wire part included in the one first conductive part and the second wire part of one second conductive part among the plurality of second conductive parts.

Brief Description of the Drawings

[0008]

Figure 1

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BEST MODE FOR CARRYING OUT THE INVENTION

[0009] Hereinafter, each embodiment of the present disclosure will be described with reference to the drawings. The present disclosure is not limited by the contents described in the following embodiments. Further, the constituent elements described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the constituent elements described below can be combined as appropriate.

[0010] Note that the disclosure is merely an example, and those that can be easily conceived by those skilled in the art with appropriate modifications while maintaining the gist of the invention are naturally included in the scope of the present disclosure. In addition, for the purpose of making the description clearer, the drawings may schematically show the width, thickness, shape, etc. of each part compared to the actual aspect, but this is merely an example and does not limit the interpretation of the present disclosure. Also, in this specification and each drawing, elements that are the same as those described above with respect to the already shown drawings may be denoted by the same reference numerals, and detailed description may be omitted as appropriate.

[0011] The X, Y, and Z directions shown in the figures are mutually orthogonal. The Z direction corresponds to the thickness direction of the capacitance sensor 1. The +Z side in the Z direction (the side pointed by the arrow) corresponds to the front side of the capacitance sensor 1, and the opposite -Z side corresponds to the back side of the capacitance sensor 1. Also, in this specification, "plan view" means looking at the capacitance sensor 1 along the Z direction. Note that the X, Y, and Z directions are examples, and the present disclosure is not limited to these directions.

[0012] FIG. 1 is a plan view of the capacitance sensor 1 according to an embodiment of the present disclosure as viewed from the front side. FIG. 2 is a cross-sectional view of the capacitance sensor 1 taken along line II-II shown in FIG. 1.

[0013] The capacitance sensor 1 is a self-capacitance type sensor. The capacitance sensor 1 is plate-shaped and detects a detection target located on the front side. The detection target is, for example, a user's finger. Note that the detection target may be a part of the user other than the finger, or a stylus pen or the like.

[0014] Also, the capacitance sensor 1 is disposed, for example, inside a product such as furniture. The capacitance sensor 1 is disposed at a position corresponding to a symbol such as a figure indicating a switch disposed on the outer surface of the product. The capacitance sensor 1 detects the detection target, for example, when the detection target touches the symbol. In a state where the detection target touches the symbol, the detection target does not touch the capacitance sensor 1. That is, the capacitance sensor 1 performs hover detection for detecting the detection target in a state where the detection target is close even when the detection target is not in contact.

[0015] The capacitance sensor 1 includes a first substrate 10 (corresponding to a "substrate"), a plurality of second substrates 20, a plurality of first connecting members 30, and a plurality of second connecting members 40.

[0016] The first substrate 10 is a multilayer substrate. The first substrate 10 includes a first insulating layer 11a, a second insulating layer 11b, and a third insulating layer 11c. The first insulating layer 11a, the second insulating layer 11b, and the third insulating layer 11c are arranged in this order from the +Z side to the -Z side. The first insulating layer 11a, the second insulating layer 11b, and the third insulating layer 11c are formed of a resin material having electrical insulation properties.

[0017] A first circuit layer 12a is disposed on a first surface 11a1 on the front side of the first insulating layer 11a. A second circuit layer 12b (corresponding to the "second conductor layer") is disposed between the first insulating layer 11a and the second insulating layer 11b. A third circuit layer 12c (corresponding to the "first conductor layer") is disposed between the second insulating layer 11b and the third insulating layer 11c. A fourth circuit layer 12d is disposed on a second surface 11c1 on the back side of the third insulating layer 11c.

[0018] The first substrate 10 has a plurality of first pairs of holes 13. The plurality of first pairs of holes 13 are arranged in a matrix along the X direction and the Y direction respectively. The first pair of holes 13 penetrate the first substrate 10 along the Z direction.

[0019] The first pair of holes 13 has a first hole 13a and a second hole 13b. The first hole 13a and the second hole 13b are arranged along a direction inclined with respect to the X direction and the Y direction.

[0020] In addition, a plurality of first conductive portions 14, a plurality of second conductive portions 15, and a shield electrode 16 are disposed on the first substrate 10. The number of the plurality of second conductive portions 15 is less than the number of the plurality of first conductive portions 14.

[0021] FIG. 3 is a diagram showing the circuit configuration of the first substrate 10, and is a diagram showing the range H1 indicated by the two-dot chain line in FIG. 1. FIG. 4 is a partially enlarged plan view of the first substrate 10 in the range H2 indicated by the two-dot chain line shown in FIG. 3. FIG. 5 is a cross-sectional view of the first substrate 10 taken along the line V-V shown in FIG. 4. FIG. 6 is a cross-sectional view of the first substrate 10 taken along the line VI-VI shown in FIG. 4. FIG. 7 is a cross-sectional view of the first substrate 10 taken along the line VII-VII shown in FIG. 4.

[0022] As shown in FIGS. 1, 2, 3, 4, and 5, each of the plurality of first conductive portions 14 has a first conductor portion 14a and a first lead portion 14b. The first conductor portion 14a shown in FIGS. 1 and 2 is a through-hole that penetrates the first substrate 10. Hereinafter, the first conductor portion 14a is referred to as the first through-hole 14a. The first through-hole 14a electrically connects the first circuit layer 12a, the second circuit layer 12b, the third circuit layer 12c, and the fourth circuit layer 12d. The hole of the first through-hole 14a corresponds to the first hole 13a.

[0023] The first lead portion 14b shown in FIGS. 1, 2, 3, 4, and 5 is linear and extends from the first through-hole 14a. The first lead portion 14b is disposed in the third circuit layer 12c, and the first end is electrically connected to the first through-hole 14a.

[0024] The plurality of first conductive portions 14 are electrically isolated from each other. Also, the first lead portion 14b extends along the X direction on the -Y side of the plurality of first pairs of holes 13. The second end of the first lead portion 14b is located on the -Y side of the plurality of first pairs of holes 13.

[0025] As shown in FIGS. 3, 4, and 5, a plurality of second through-holes 14b1 that penetrate the first substrate 10 are disposed in a portion of the first lead portion 14b on the -Y side of the plurality of first pairs of holes 13. The second through-holes 14b1 electrically connect the first circuit layer 12a, the second circuit layer 12b, the third circuit layer 12c, and the fourth circuit layer 12d. Note that the second through-holes 14b1 only need to electrically connect at least the first circuit layer 12a and the third circuit layer 12c. The number of the second through-holes 14b1 disposed in one first lead portion 14b is equal to the number of the second portions 15b2 (described later) of the second lead portions 15b that intersect the first lead portion 14b, as described later.

[0026] As shown in FIGS. 1, 3, 4, and 6, each of the plurality of second conductive portions 15 has a second conductor portion 15a and a second lead portion 15b.

[0027] The second conductor part 15a is disposed on the first circuit layer 12a and is electrically connected to a terminal T (see FIG. 1) connected to the drive circuit. The second conductor part 15a corresponds to a so-called pad. The drive circuit and the terminal T are electrically connected via the flexible substrate 2.

[0028] The second conductor line part 15b is linear and extends from the second conductor part 15a. The second conductor line part 15b has a first part 15b1 and a second part 15b2.

[0029] The first part 15b1 is disposed on the first circuit layer 12a and extends along the Y direction from the second conductor part 15a. The first part 15b1 has a third conductor part 15c at the +Y side end. The third conductor part 15c is a so-called pad.

[0030] The second part 15b2 is disposed on the second circuit layer 12b and extends along the Y direction on the +Y side of the first part 15b1. The second part 15b2 is electrically isolated from the first part 15b1. The second part 15b2 intersects a plurality of first conductor line parts 14b in plan view.

[0031] The second part 15b2 has a third through hole 15d that penetrates the first substrate 10 at the -Y side end. The third through hole 15d electrically connects the first circuit layer 12a, the second circuit layer 12b, the third circuit layer 12c, and the fourth circuit layer 12d. Note that the third through hole 15d only needs to connect at least the first circuit layer 12a and the second circuit layer 12b. One third through hole 15d and one third conductor part 15c are adjacent to each other in an electrically isolated state.

[0032] Also, as shown in FIGS. 3, 4, and 5, a plurality of fourth through-holes 15e penetrating the first substrate 10 are arranged in the second part 15b2. The fourth through-holes 15e electrically connect the first circuit layer 12a, the second circuit layer 12b, the third circuit layer 12c, and the fourth circuit layer 12d. Note that the fourth through-holes 15e only need to electrically connect at least the first circuit layer 12a and the second circuit layer 12b. The number of fourth through-holes 15e arranged in one second part 15b2 is equal to the number of first conductor parts 14b intersecting the first second part 15b2. One fourth through-hole 15e and one second through-hole 14b1 are adjacent to each other in a state of being electrically isolated from each other.

[0033] The shield electrodes 16 shown in FIGS. 4, 5, and 6 are arranged in the first circuit layer 12a and the fourth circuit layer 12d. The shield electrodes 16 are electrically isolated from the second conductor part 15a, the first part 15b1, the third conductor part 15c, the first through-hole 14a, the second through-hole 14b1, the third through-hole 15d, and the fourth through-hole 15e.

[0034] As shown in FIG. 4, the shield electrode 16 in the first circuit layer 12a has a plurality of first openings 16a in which one fourth through-hole 15e and one second through-hole 14b1 adjacent to each other are located inside, and a plurality of second openings 16b in which one third through-hole 15d and one third conductor part 15c adjacent to each other, and one second conductor part 15a electrically connected to the one third conductor part 15c via the first part 15b1 are located inside.

[0035] The shield electrode 16 overlaps a detection electrode 22 described later in a plan view. The shield electrode 16 functions as an active shield that suppresses the influence on the potential of the detection electrode 22 by changing its potential according to a drive signal Sg described later.

[0036] The second substrate 20 shown in FIGS. 1 and 2 is smaller than the first substrate 10 in plan view. The second substrate 20 is disposed on the first substrate 10. The size of the second substrate 20 is such that when the second substrate 20 is disposed on the first substrate 10, in plan view, one of the plurality of first pairs of holes 13, i.e., the first pair of holes 13, overlaps with the second substrate 20, and the other first pairs of holes 13 do not overlap with the second substrate 20.

[0037] The second substrate 20 includes a base material 21 and a detection electrode 22.

[0038] The base material 21 is formed of a resin material having electrical insulation properties. The base material 21 is plate-shaped and has a third surface 21a on the front side of the capacitance sensor 1. Further, the base material 21 has one second pair of holes 21b. The second pair of holes 21b penetrate the base material 21 along the Z direction.

[0039] The second pair of holes 21b has a third hole 21b1 and a fourth hole 21b2. When the second substrate 20 is disposed on the first substrate 10 as described later, the third hole 21b1 corresponds to the first hole 13a, and the fourth hole 21b2 corresponds to the second hole 13b.

[0040] Further, the second substrate 20 further includes a fifth through hole 23 that penetrates the base material 21. The hole of the fifth through hole 23 corresponds to the third hole 21b1.

[0041] The detection electrode 22 is disposed on the third surface 21a. The detection electrode 22 is electrically connected to the fifth through hole 23. The detection electrode 22 and the fifth through hole 23 are integrated. Further, the detection electrode 22 is electrically isolated from the fourth hole 21b2.

[0042] Also, the number of the second substrates 20 is smaller than the number of the first conductive parts 14. That is, the number of the second substrates 20 is smaller than the number of the first through holes 14a. The second substrate 20 is selectively disposed at a position corresponding to one of the plurality of first through holes 14a in the first substrate 10.

[0043] The position of the second substrate 20 is determined based on the position of a symbol on the outer surface of the product to which the capacitance sensor 1 is applied. Specifically, the position of the second substrate 20 is first determined by selecting one first conductive portion 14 from the plurality of first conductive portions 14 based on the position of the symbol.

[0044] Further, the second substrate 20 is disposed on the first substrate 10 in a state where the opposite surface 21c of the base material 21 opposite to the third surface 21a faces the first surface 11a1 of the first substrate 10, and the first through hole 14a of the one first conductive portion 14 is electrically connected to the detection electrode 22. At this time, in plan view, the third hole 21b1 and the first hole 13a overlap, and the fourth hole 21b2 and the second hole 13b overlap. Also, the first through hole 14a of the one first conductive portion 14 is electrically connected by contacting the fifth through hole 23, and is electrically connected to the detection electrode 22 through the fifth through hole 23.

[0045] Note that the second substrate 20 indicated by the dashed-dotted line in FIG. 2 shows a state where the second substrate 20 is not disposed at the position where the second substrate 20 is selectively disposed.

[0046] Also, the capacitance sensor 1 includes a first connecting member 30 and a second connecting member 40. The first connecting member 30 and the second connecting member 40 connect the first substrate 10 and the second substrate 20, respectively. The first connecting member 30 and the second connecting member 40 each include, for example, bolts 31, 41 and nuts 32, 42.

[0047] The first connecting member 30 has conductivity. The first connecting member 30 penetrates through the first through hole 14a and the fifth through hole 23 (that is, penetrates through the first hole 13a and the third hole 21b1) in a state where the second substrate 20 is disposed on the first substrate 10, and fastens the first substrate 10 and the second substrate 20. By connecting the first substrate 10 and the second substrate 20 with the first connecting member 30, the first through hole 14a of the one first conductive portion 14 selected from the plurality of first conductive portions 14 and the fifth through hole 23 are electrically connected.

[0048] The second connecting member 40 has electrical insulation properties. The first connecting member 30 penetrates through the second hole 13b and the fourth hole 21b2 in a state where the second substrate 20 is disposed on the first substrate 10, and fastens the first substrate 10 and the second substrate 20. The second connecting member 40 is electrically isolated from the detection electrode 22 in a state where the second substrate 20 is disposed on the first substrate 10.

[0049] Also, as shown in FIGS. 3 and 4, the capacitance sensor 1 further includes a first connection member 50, a second connection member 60, and a third connection member 70.

[0050] The first connection member 50 shown in FIGS. 3, 4, and 5 is a conductor that electrically connects the first lead portion 14b and the second lead portion 15b. The first connection member 50 electrically connects the first lead portion 14b included in one first conductive portion 14 selected from the plurality of first conductive portions 14 and the second lead portion 15b of one second conductive portion 15 among the plurality of second conductive portions 15. The first lead portion 14b included in one first conductive portion 14 selected from the plurality of first conductive portions 14 corresponds to the first lead portion 14b extending from the first through hole 14a that is electrically connected to the detection electrode 22. That is, the position of the first connection member 50 is determined based on the position of the second substrate 20 having the detection electrode 22.

[0051] More specifically, the first connection member 50 electrically connects one of the plurality of second through holes 14b1 disposed in the first lead portion 14b that is electrically connected to the detection electrode 22 and one of the plurality of fourth through holes 15e disposed in the second portion 15b2 of the second lead portion 15b in one second conductive portion 15.

[0052] For example, when one first conductor part 14ba among a plurality of first conductor parts 14b shown in FIGS. 3 and 4, to which "a" is attached at the end of the reference sign, is electrically connected to the detection electrode 22, one second through-hole 14b1a among a plurality of second through-holes 14b1, to which "a" is attached at the end of the reference sign, and one fourth through-hole 15ea, which is adjacent to the second through-hole 14b1a in the first opening 16a and to which "a" is attached at the end of the reference sign, are electrically connected by the first connection member 50.

[0053] That is, the first conductor part 14b of one first conductive part 14 selected from the plurality of first conductive parts 14 and electrically connected to the detection electrode 22 is electrically connected to the second part 15b2 of the second conductor part 15b of one second conductive part 15 among the plurality of second conductive parts 15 via the first connection member 50. That is, one second conductive part 15 is electrically connected to the detection electrode 22 via the first connection member 50. The number of the first connection members 50 is equal to the number of the second substrates 20.

[0054] The second connection member 60 shown in FIGS. 3, 4, and 6 electrically connects the first part 15b1 and the second part 15b2 in the second conductor part 15b of one second conductive part 15 that is electrically connected to the first connection member 50 among the plurality of second conductive parts 15. Specifically, the second connection member 60 electrically connects the third through-hole 15d of the second part 15b2 and the third conductor part 15c of the first part 15b1 to each other in the second conductor part 15b that is electrically connected to the first connection member 50. That is, the position of the second connection member 60 is determined based on the position of the second substrate 20 having the detection electrode 22.

[0055] For example, among the plurality of second conductor portions 15b shown in FIGS. 3 and 4, in the second conductor portion 15bb with "b" appended to the end of the symbol including one fourth through hole 15ea that is electrically connected to the first connection member 50, the third through hole 15d of the second portion 15b2 located within the second opening 16b and the third conductor portion 15c of the first portion 15b1 are electrically connected to each other via the second connection member 60. Thereby, the first portion 15b1 of the second conductor portion 15bb is electrically connected to the detection electrode 22 via the second connection member 60, the second portion 15b2 of the second conductor portion 15bb, the first connection member 50, and the first conductive portion 14 including the first conductor portion 14ba. The number of the second connection members 60 is equal to the number of the second substrates 20 having the detection electrodes 22.

[0056] The third connection member 70 shown in FIGS. 3, 4, and 7 is a conductor that electrically connects another one of the plurality of first conductive portions 14 that is electrically isolated from the detection electrode 22 and the shield electrode 16. Specifically, the third connection member 70 electrically connects the first conductor portion 14b extending from the first through hole 14a where the detection electrode 22 is not disposed (that is, the first conductor portion 14b not electrically connected to the first connection member 50) and the shield electrode 16. That is, the position of the third connection member 70 is determined based on the position of the second substrate 20 having the detection electrode 22.

[0057] More specifically, the third connection member 70 electrically connects one of the plurality of second through holes 14b1 disposed in the first conductor portion 14b extending from the first through hole 14a where the detection electrode 22 is not disposed and the shield electrode 16 on the first surface 11a1 of the first substrate 10.

[0058] For example, when another first conductor portion 14bc with a "c" appended to the end of the symbol among the plurality of first conductor portions 14b shown in FIGS. 3 and 4 is electrically isolated from the detection electrode 22, one second through hole 14b1c with a "c" appended to the end of the symbol among the plurality of second through holes 14b1 is electrically connected to the shield electrode 16 on the first surface 11a1 of the first substrate 10 via a third connection member 70. The number of the third connection members 70 is equal to the value obtained by subtracting the number of the second substrates 20 from the number of the first conductor portions 14a.

[0059] The materials of the first conductive portion 14, the first through hole 14a, the second through hole 14b1, the third through hole 15d, the fourth through hole 15e, the fifth through hole 23, the second conductive portion 15, the detection electrode 22, the shield electrode 16, the first connection member 30, the first connection member 50, the second connection member 60, and the third connection member 70 are one or more metals selected from aluminum (Al), copper (Cu), silver (Ag), molybdenum (Mo), chromium (Cr), and tungsten (W), or alloys containing one or more selected from these metal materials.

[0060] Also, in the manufacturing process of the capacitance sensor 1, the position of the second substrate 20 disposed on the first substrate 10 is determined based on the position of a symbol on the outer surface of the product to which the capacitance sensor 1 is applied. Needless to say, the position of the second substrate 20 is not limited to the position shown in FIG. 1, and it is arranged to correspond to the product to which the capacitance sensor 1 is applied. For example, the plurality of second substrates 20 may be arranged in a scattered manner, arranged linearly, or arranged circularly. That is, the position of the second substrate 20 can be recombined according to the product to which the capacitance sensor 1 is applied. The position of the second substrate 20 (detection electrode 22) can be selected during the manufacture of the capacitance sensor 1.

[0061] Furthermore, in the manufacturing process of the capacitance sensor 1, the first connection member 50 and the second connection member 60 are selectively arranged based on the first conductive portion 14 to which the detection electrode 22 is electrically connected as described above. By arranging the first connection member 50 and the second connection member 60 in this way, the detection electrode 22 is electrically connected to one terminal T connected to the drive circuit via one first conductive portion 14 and one second conductive portion 15.

[0062] Therefore, even when the number and position of the detection electrodes 22 are different, by changing the number and position of the first connection member 50 and the second connection member 60 based on the number and position of the detection electrodes 22, the capacitance sensor 1 can be manufactured without changing the layout of the plurality of first conductor portions 14b and the plurality of second conductor portions 15b.

[0063] Also, as described above, the number of the plurality of second conductive portions 15 is less than the number of the plurality of first conductive portions 14. Therefore, the size of the first substrate 10 can be reduced as compared with the case where the number of the plurality of second conductive portions 15 is equal to the number of the plurality of first conductive portions 14.

[0064] Next, the operation of the capacitance sensor 1 will be described.

[0065] FIG. 8 is a diagram showing an equivalent circuit of the capacitance sensor 1 and the drive circuit. In FIG. 8, one of the plurality of detection electrodes 22 is shown. A drive signal source G and a voltage detector D are electrically connected to the detection electrode 22. The drive signal source G and the voltage detector D are included in the drive circuit. The voltage detector D includes an integration circuit. The detection electrode 22 is electrically connected to the drive circuit via one first conductive portion 14, the first connection member 50, one second conductive portion 15, and the second connection member 60 as described above.

[0066] The drive signal source G outputs a drive signal Sg to the detection electrode 22. The drive signal Sg is an alternating current rectangular wave. Based on the drive signal Sg, the charging and discharging of the detection electrode 22 are repeated. When the detection target is not close to the detection electrode 22, a current corresponding to the capacitance of the detection electrode 22 is generated by the charging and discharging of the detection electrode 22. In the voltage detector D, a detection signal Sd appears due to the current.

[0067] On the other hand, when the detection target is close to the detection electrode 22, due to the capacitance of the detection target, the current generated by the charging and discharging of the detection electrode 22 and the detection signal Sd appearing in the voltage detector D change. The drive circuit detects that the detection target is close to the detection electrode 22 based on the change in the detection signal Sd.

[0068] As described above, the third connection member 70 electrically connects another one of the plurality of first conductive portions 14 that is electrically isolated from the detection electrode 22 and the shield electrode 16. Therefore, it is possible to suppress the other one of the first conductive portions 14 from affecting the capacitance of the detection electrode 22 and the detection signal Sd. Therefore, the detection accuracy of the capacitance sensor 1 can be improved.

[0069] As described above, the preferred embodiments of the present invention have been described, but the present invention is not limited to such embodiments. The content disclosed in the embodiments is merely an example, and various modifications are possible without departing from the spirit of the present invention. Appropriate modifications made without departing from the spirit of the present invention also naturally belong to the technical scope of the present invention.

[0070] For example, the capacitance sensor 1 may be a mutual capacitance type sensor.

[0071] Further, the first conductor portion 14b may be disposed in the second circuit layer 12b, and the second conductor portion 15b may be disposed in the third circuit layer 12c.

[0072] Further, a second part 15b2 of the second conductor parts 15b among the plurality of second conductor parts 15b shown in FIGS. 3 and 4, where the first connection member 50 and the second connection member 60 are not electrically connected, may be electrically connected to the shield electrode 16 via a connection member. In this case, it is possible to suppress the occurrence of electrical noise in the second conductor part 15b where the first connection member 50 and the second connection member 60 are not electrically connected.

[0073] FIG. 9 is a diagram showing a circuit configuration of a first substrate 110 in a capacitance sensor 1 according to a modified example of an embodiment of the present disclosure.

[0074] In this modified example, the first connection member 150 is a switch element that switches between a connection state in which the first conductor part 14b and the second conductor part 15b are electrically connected and a cutoff state in which the first conductor part 14b and the second conductor part 15b are electrically disconnected. In this case, the first connection member 150 is disposed between one fourth through hole 15e and one second through hole 14b1 adjacent to each other, and the connection state and the cutoff state are switched. Further, the first connection member 150 is disposed between each of all the one fourth through hole 15e and one second through hole 14b1 adjacent to each other.

[0075] The connection state and the cutoff state of the first connection member 150 are determined based on the position of the second substrate 20. Specifically, the first connection member 150 disposed between one second through hole 14b1 among the plurality of second through holes 14b1 disposed in the first conductor part 14b electrically connected to the detection electrode 22 and one fourth through hole 15e adjacent to the one second through hole 14b1 is determined to be in the connection state.

[0076] For example, when one first conductor part 14ba with "a" attached to the end of the reference numeral among a plurality of first conductor parts 14b shown in FIG. 9 is electrically connected to the detection electrode 22, one second through hole 14b1a with "a" attached to the end of the reference numeral among a plurality of second through holes 14b1 and one fourth through hole 15ea with "a" attached to the end of the reference numeral adjacent to the second through hole 14b1a, the first connection member 150a with "a" attached to the end of the reference numeral therebetween is in a connected state.

[0077] On the other hand, among a plurality of first connection members 150, other first connection members 150 without "a" attached to the end of the reference numeral are defined to be in an open state.

[0078] Also, in this modified example, the second connection member 160 is a switching element that switches between a connected state of electrically connecting the second part 15b2 and the first part 15b1 and an open state of electrically disconnecting the second part 15b2 and the first part 15b1 in the second conductor part 15b. In this case, the second connection member 160 is disposed between the third through hole 15d of the second part 15b2 and the third conductor part 15c of the first part 15b1 that are adjacent to each other, and the connected state and the open state are switched. Further, the second connection member 160 is disposed between the third through hole 15d of the second part 15b2 and the third conductor part 15c of the first part 15b1 that are adjacent to each other, respectively.

[0079] The connected state and the open state of the second connection member 160 are determined based on the state of the first connection member 150 that is electrically connected to the second conductor part 15b. Specifically, the second connection member 160 between the third through hole 15d of the second part 15b2 and the third conductor part 15c of the first part 15b1 in the second conductor part 15b that is electrically connected to the connected first connection member 150 is defined to be in a connected state.

[0080] For example, when one of the plurality of second conductor portions 15b shown in FIG. 9, i.e., a second conductor portion 15bb with "b" appended to the end of the reference numeral, is electrically connected to the first connection member 150 in a connected state, the second connection member 160b with "b" appended to the end of the reference numeral, which is between the third through-hole 15d of the second portion 15b2 and the third conductor portion 15c of the first portion 15b1 in the one second conductor portion 15bb, is in a connected state.

[0081] On the other hand, among the plurality of second connection members 160, other second connection members 160 without "b" appended to the end of the reference numeral are defined to be in an open state.

[0082] Furthermore, in this modification, the third connection member 170 is a switching element that switches between a connected state in which the first conductive portion 14 and the shield electrode 16 are electrically connected and an open state in which the first conductive portion 14 and the shield electrode 16 are electrically disconnected. In this case, the third connection member 170 is disposed between one of the plurality of second through-holes 14b1 of one first conductor portion 14b and the shield electrode 16, and the connected state and the open state are switched. Also, the third connection member 170 is disposed between one second through-hole 14b1 and the shield electrode 16 in each of the plurality of first conductor portions 14b.

[0083] The connected state and the open state of the third connection member 170 are defined based on the position of the second substrate 20. Specifically, the third connection member 170 between one through-hole among the plurality of second through-holes 14b1 disposed in the first conductor portion 14b that is not electrically connected to the detection electrode 22 and the shield electrode 16 is defined to be in a connected state.

[0084] For example, when one of the plurality of first conductor portions 14b shown in FIG. 9, i.e., a first conductor portion 14bc with "c" appended to the end of the reference numeral, is not electrically connected to the detection electrode 22, the third connection member 170c with "c" appended to the end of the reference numeral, which is between one second through-hole 14b1c with "c" appended to the end of the reference numeral among the plurality of second through-holes 14b1 and the shield electrode 16, is defined to be in a connected state.

[0085] On the other hand, among the plurality of third connection members 170, the other third connection members 170 that do not have a "c" added to the end of their reference numerals are set to the disconnected state.

[0086] In the manufacturing process of the capacitance sensor 1, the states of the first connecting member 150, the second connecting member 160, and the third connecting member 170 are switched based on the position of the second substrate 20. Therefore, the connection state between the first conductor portion 14b and the second conductor portion 15b can be easily switched based on the position of the second substrate 20.

[0087] Fig. 10 is a partially enlarged plan view of the first substrate 210 in the capacitance sensor 1 according to another modified example of the embodiment of the present disclosure. Fig. 11 is a cross-sectional view of the first substrate 210 taken along line XI-XI shown in Fig. 10. Fig. 12 is a cross-sectional view of the first substrate 210 taken along line XII-XII shown in Fig. 10. Fig. 13 is a cross-sectional view of the first substrate 210 taken along line XIII-XIII shown in Fig. 10. Fig. 14 is a cross-sectional view of the first substrate 210 taken along line XIV-XIV shown in Fig. 10.

[0088] In this other modified example, the first substrate 210 is a flexible substrate. The first substrate 210 shown in FIGS. 10, 11, 12, 13, and 14 does not include the third insulating layer 11c of the above embodiment, but includes a first insulating layer 211a and a second insulating layer 211b. Furthermore, the first substrate 210 does not include the fourth circuit layer 12d of the above embodiment, but includes a first circuit layer 212a (corresponding to the "first conductor layer"), a second circuit layer 212b (corresponding to the "second conductor layer"), and a third circuit layer 212c. The first through-hole 214a of the first conductive portion 214 (corresponding to the first through-hole 14a of the first conductive portion 14 of the above embodiment; not shown in this modified example) electrically connects the first circuit layer 212a, the second circuit layer 212b, and the third circuit layer 212c.

[0089] 10 and 11 is disposed on the first circuit layer 212a. Furthermore, the first conductive wire portion 214b has a plurality of fourth conductor portions 214c disposed on the first circuit layer 212a, instead of the plurality of second through holes 14b1 of the above embodiment. The plurality of fourth conductor portions 214c are so-called pads.

[0090] 10, 11, and 12, a second portion 215b2 of a second conductor portion 215b included in the second conductive portion 215 is disposed on the second circuit layer 212b. A third through-hole 215d and a plurality of fourth through-holes 215e disposed on the second portion 215b2 electrically connect the first circuit layer 212a and the second circuit layer 212b.

[0091] 10, 13, and 14, the first substrate 210 further includes a plurality of sixth through holes 217a and seventh through holes 217b. In addition, the first substrate 210 has a shield electrode 216 arranged on the third circuit layer 212c, and a conductive sheet 218 (e.g., copper foil, silver foil, or the like) arranged on the first circuit layer 212a, which functions as a shield electrode.

[0092] The sixth through hole 217a is adjacent to one of the multiple fourth conductor portions 214c arranged on the first conductor portion 14b. The sixth through hole 217a electrically connects the first circuit layer 212a, the second circuit layer 212b, and the third circuit layer 212c. The sixth through hole 217a is integrated with the shield electrode 216 of the third circuit layer 212c. The number of sixth through holes 217a is equal to the number of first conductor portions 214b.

[0093] At least one seventh through-hole 217b is disposed at any position on the first substrate 210. The seventh through-hole 217b electrically connects the first circuit layer 212a, the second circuit layer 212b, and the third circuit layer 212c. The seventh through-hole 217b is integral with the shield electrode 216 of the third circuit layer 212c.

[0094] Further, the conductive sheet 218 has a third opening 218a corresponding to the first opening 16a of the above-described embodiment and a fourth opening 218b corresponding to the second opening 16b. The conductive sheet 18 further has a fifth opening 218c. The fifth opening 218c has one fourth through-hole 215e, one fourth conductor portion 214c, and one sixth through-hole 217a located inside.

[0095] Also, as shown in FIG. 14, the conductive sheet 218 is electrically connected to the seventh through-hole 217b. Thereby, the conductive sheet 218 and the shield electrode 216 are electrically connected. Further, as shown in FIGS. 11 and 12, the first conductor portion 214b and the first part 215b1 are electrically isolated from the conductive sheet 218 by the insulating sheet 219.

[0096] Also, as shown in FIGS. 10, 11, 12, and 13, the first connection member 250 electrically connects one fourth conductor portion 214c and one fourth through-hole 215e adjacent to each other. The second connection member 260 electrically connects one third through-hole 215d and one third conductor portion 215c adjacent to each other. The third connection member 270 electrically connects the shield electrode 216 via one fourth conductor portion 214c and one sixth through-hole 217a. The arrangement of the first connection member 250, the second connection member 260, and the third connection member 270 is determined by the position of the second substrate 20 as in the above-described embodiment.

[0097] The first substrate 210 of this other modification does not include the third insulating layer 11c and the fourth circuit layer 12d as compared with the first substrate 210 of the above-described embodiment. Therefore, even when the first substrate 210 is a flexible substrate, the cost of the first substrate 210 can be reduced.

[0098] In this other modification, the first substrate 210 may include a second insulating sheet instead of the second insulating layer 211b.

[0099] In addition, for other operational effects brought about by the aspects described in the present embodiment that are obvious from the description in this specification or can be appropriately conceived by those skilled in the art, they are naturally understood to be brought about by the present disclosure.

Description of Reference Numerals

[0100] 1 Capacitance sensor 10 First substrate (substrate) 11a First insulating layer 12a First circuit layer (first conductor layer) 12b Second circuit layer (second conductor layer) 12c Third circuit layer (first conductor layer) 12d Fourth circuit layer 14 First conductive part 14a First conductor part 14b First lead part 15 Second conductive part 15a Second conductor part 15b Second lead part 15c Third conductor part 16 Shield electrode 20 Second substrate 22 Detection electrode 50 First connection member 60 Second connection member 70 Third connection member

Claims

1. A substrate, a plurality of first conductive parts disposed on the substrate, each having a first conductor part and a first lead part extending from the first conductor part, a detection electrode electrically connected to the first conductor part of one first conductive part selected from the plurality of first conductive parts, a plurality of second conductive parts disposed on the substrate, each having a second conductor part electrically connected to a terminal connected to a drive circuit and a second lead part extending from the second conductor part, and a first connection member electrically connecting the first lead part and the second lead part, wherein the first connection member electrically connects the first lead part of the one first conductive part and the second lead part of one second conductive part among the plurality of second conductive parts, a capacitance sensor.

2. The number of the plurality of second conductive parts is less than the number of the plurality of first conductive parts, The capacitance sensor according to Claim 1.

3. The second lead part includes a first part extending from the second conductor part, and a second part electrically isolated from the first part and to which the first connection member is electrically connected, and further includes a second connection member electrically connecting the second part and the first part at the second lead part of the one second conductive part where the first connection member is electrically connected, The capacitance sensor according to Claim 1.

4. The substrate is a multilayer substrate having a first conductor layer on which the first lead part is disposed and a second conductor layer on which the second lead part is disposed, The capacitance sensor according to Claim 1.

5. a shield electrode disposed on the substrate, and a third connection member electrically connecting another one of the plurality of first conductive parts, which is electrically isolated from the detection electrode, and the shield electrode, The capacitance sensor according to Claim 1.

6. The first connection member is a switch element that switches between a connection state of electrically connecting the first lead part and the second lead part and a cutoff state of electrically disconnecting the first lead part and the second lead part, The capacitance sensor according to Claim 1.

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