Method for manufacturing thermal conductive member, thermal conductive member, and electronic device

Abstract

To provide a thermal conductive member with a better thermal conduction which can be selectively provided to sites which generate much heat.SOLUTION: A method for manufacturing a thermal conductive member 20 containing a pattern-like resin film 2 containing an anisotropic filler 5 includes the step of arranging a laminate A between two electrodes 3 connected to a voltage generation device 4, applying a voltage, and electrostatically aligning the anisotropic filler 5.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a method for manufacturing a heat conductive member, a heat conductive member, and an electronic device.

Background Art

[0002] With the improvement of the processing capacity of electronic devices, the amount of heat generated from electronic devices tends to increase. Therefore, measures for effectively transferring heat to the outside of the device have become important. As such measures, heat conductive members made of materials such as metals, ceramics, and resin compositions are applied. Among these heat conductive members, heat conductive members formed of resin compositions are widely used because they have good electrical insulation, mechanical properties, heat resistance, chemical resistance, adhesiveness, etc.

[0003] In addition, in order to improve the heat conductivity of heat conductive members, attempts have been made to arrange heat conductive fibers in the heat conduction direction to perform heat conduction efficiently.

[0004] Patent Document 1 discloses an insulating heat conductive sheet containing insulating high heat conductive fibers penetrating in the thickness direction and a binder resin, having a surface roughness of 15 μm or less on at least one surface of the sheet, and having a penetration density of the insulating high heat conductive fibers penetrating in the thickness direction of 6% or more. Further, Patent Document 1 describes that the object is to provide a heat conductive sheet excellent in insulation and heat conductivity.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] The present invention provides a thermally conductive member that can be selectively applied to a site with a large calorific value and has improved thermal conductivity.

Means for Solving the Problems

[0007] According to the present invention, there are provided a method for manufacturing a thermally conductive member, a thermally conductive member, and an electronic device as described below.

[0008] 1. A method for manufacturing a thermally conductive member including a patterned resin film containing an anisotropic filler, The method for manufacturing a thermally conductive member including a step (X) of electrostatically orienting the anisotropic filler. 2. A step (A1) of preparing a sheet having a resin film made of a resin composition on a substrate, A step (X1) of electrostatically orienting the anisotropic filler inside the resin film, A step (B1) of patterning the resin film, The method for manufacturing a thermally conductive member according to 1., including the above steps. 3. The method for manufacturing a thermally conductive member according to 2., where the step (B1) is performed after the step (X1). 4. The method for manufacturing a thermally conductive member according to 2. or 3., further including a step (C1) of laminating a resin film different from the resin film on the resin film after the step (X1). 5. The method for manufacturing a thermally conductive member according to any one of 2. to 4., where the step (X1) is performed after the step (B1). 6. The method for manufacturing a thermally conductive member according to 5., further including a step (D1) of softening the patterned resin film between the step (B1) and the step (X1). 7. The method for manufacturing a thermally conductive member according to any one of 2. to 6., where the resin film contains the anisotropic filler before performing the step (X1). 8. A step (X2) of electrostatically orienting the anisotropic filler on a sheet having an adhesive resin layer, A step (A2) of preparing a sheet having a resin film made of a resin composition on a substrate, A step (E2) of laminating the sheet in which the anisotropic filler is electrostatically oriented on the resin film; A step (B2) of patterning the resin film; A step (F2) of peeling the sheet having the adhesive resin layer; The method for manufacturing a thermally conductive member according to 1., which includes the above steps. 9. The method for manufacturing a thermally conductive member according to any one of 2. to 8., wherein the resin composition includes a photosensitive resin composition. 10. A step (A3) of preparing a sheet having a patterned resin film made of a resin composition on a substrate; A step (X3) of electrostatically orienting the anisotropic filler inside the patterned resin film; The method for manufacturing a thermally conductive member according to 1., which includes the above steps. 11. The method for manufacturing a thermally conductive member according to 10., wherein the resin composition includes a photosensitive resin composition. 12. The method for manufacturing a thermally conductive member according to 10., wherein the resin composition includes a thermosetting resin composition. 13. The method for manufacturing a thermally conductive member according to any one of 1. to 12., wherein the shape of the anisotropic filler is flaky. 14. The method for manufacturing a thermally conductive member according to any one of 1. to 13., wherein the anisotropic filler includes one or more selected from the group consisting of boron nitride, aluminum nitride, alumina, and graphite. 15. The median diameter D of the anisotropic filler on a volume basis 50 is 20 μm or more and 100 μm or less. The method for manufacturing a thermally conductive member according to any one of 1. to 14. 16. The content of the anisotropic filler with respect to 100 parts by mass of the thermally conductive member is 10 parts by mass or more and 90 parts by mass or less. The method for manufacturing a thermally conductive member according to any one of 1. to 15. 17. The ratio (D of the median diameter D of the anisotropic filler to the thickness T of the resin film c 50 / T 50 c ) is 0.5 or more and 1.1 or less. The method for manufacturing a thermally conductive member according to any one of 1. to 16. 18. The method for manufacturing a thermally conductive member according to any one of 1. to 17., including the step of treating the surface of the anisotropic filler with a coupling agent. 19. The method for manufacturing a thermally conductive member according to any one of 2. to 18., wherein the resin composition contains a (meth)acrylic resin. 20. The method for manufacturing a thermally conductive member according to any one of 2. to 19., wherein the resin composition contains an epoxy resin. 21. The method for manufacturing a thermally conductive member according to any one of 2. to 20., wherein the resin composition contains a solvent. 22. The method for manufacturing a thermally conductive member according to any one of 2. to 21., wherein the resin composition contains a thermal curing initiator. 23. The method for manufacturing a thermally conductive member according to any one of 2. to 22., wherein the resin composition contains a photo-curing initiator. 24. The method for manufacturing a thermally conductive member according to any one of 2. to 23., wherein the substrate contains a metal foil. 25. The method for manufacturing a thermally conductive member according to 24., wherein the metal foil contains a copper foil. 26. The anisotropic filler contains one or more selected from the group consisting of boron nitride and graphite, The method for manufacturing a thermally conductive member according to any one of 1. to 25., wherein the thermally conductive member satisfies the following formula (1). C F ×I 100 / I 002 ≧2.4 (1) (In the formula (1), I 002 is the diffraction peak intensity of the 002 plane of the X-ray diffraction chart obtained by the following [X-ray diffraction method], and I 100 is the diffraction peak intensity of the 100 plane of the X-ray diffraction chart obtained by the following [X-ray diffraction method], and C F is the filling rate of the anisotropic filler, which is represented by the following formula (2), C F =V F / (V F +V R ) (2) In the formula (2), V F is the volume of the anisotropic filler in the resin film, and VR is the volume of the resin component in the resin film) [X-ray Diffraction Method] Using CuKα rays as the radiation source, perform X-ray diffraction by irradiating X-rays in the thickness direction of the heat conductive member under the conditions of a scanning axis of 2θ / θ, a sampling width of 0.02°, a scanning speed of 2° / min, an incident angle of 5°, and a reflection angle of 5° 27. The anisotropic filler contains aluminum nitride, The method for manufacturing a heat conductive member according to any one of 1. to 26., wherein the heat conductive member satisfies the following formula (4). C F ×I 100 / I 002 ≧1.0 (4) (In the formula (4), I 002 is the diffraction peak intensity of the 002 plane of the X-ray diffraction chart obtained by the following [X-ray Diffraction Method], and I 100 is the diffraction peak intensity of the 100 plane of the X-ray diffraction chart obtained by the following [X-ray Diffraction Method], and C F is the filling rate of the anisotropic filler, which is represented by the following formula (5), C F =V F / (V F +V R ) (5) In the formula (5), V F is the volume of the anisotropic filler in the resin film, and V R is the volume of the resin component in the resin film) [X-ray Diffraction Method] Using CuKα rays as the radiation source, perform X-ray diffraction by irradiating X-rays in the thickness direction of the heat conductive member under the conditions of a scanning axis of 2θ / θ, a sampling width of 0.02°, a scanning speed of 2° / min, an incident angle of 5°, and a reflection angle of 5° 28. The anisotropic filler contains alumina, The method for manufacturing a heat conductive member according to any one of 1. to 27., wherein the heat conductive member satisfies the following formula (7). C F ×I 113 / I 006 ≧5.0 (7) (In the formula (7), I006 is the diffraction peak intensity of the 006 plane of the X-ray diffraction chart obtained by the following [X-ray diffraction method], and I 113 is the diffraction peak intensity of the 113 plane of the X-ray diffraction chart obtained by the following [X-ray diffraction method], and C F is the filling rate of the anisotropic filler, which is represented by the following formula (8), C F =V F / (V F +V R ) (8) In the above formula (8), V F is the volume of the anisotropic filler in the resin film, and V R is the volume of the resin component in the resin film) [X-ray diffraction method] Using CuKα rays as the radiation source, with the scanning axis 2θ / θ, sampling width 0.02°, scan speed 2° / min, incident angle 5°, and reflection angle 5°, irradiate the X-rays in the thickness direction of the heat conductive member to perform X-ray diffraction 29. The method for manufacturing a heat conductive member according to any one of 1. to 28., wherein the heat conductive member is in the B-stage state. 30. The method for manufacturing a heat conductive member according to any one of 1. to 28., wherein the heat conductive member is in the C-stage state. 31. A heat conductive member obtained by the method for manufacturing a heat conductive member according to any one of 1. to 30. 32. An electronic device comprising the heat conductive member according to 31., and an electronic component on the heat conductive member.

Advantages of the Invention

[0009] According to the present invention, it is possible to provide a heat conductive member that can be selectively applied to a portion with a large amount of heat generation and has improved thermal conductivity.

Brief Description of the Drawings

[0010]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Mode for Carrying Out the Invention

[0011] Hereinafter, the present invention will be described based on embodiments.

[0012] [Method for Manufacturing a Heat Conductive Member] Hereinafter, the method for manufacturing the heat conductive member of the present embodiment will be described.

[0013] The method for manufacturing the heat conductive member of the present embodiment is a method for manufacturing a heat conductive member including a patterned resin film containing an anisotropic filler, and includes a step (X) of electrostatically orienting the anisotropic filler.

[0014] When the present inventors analyzed the heat generated from the electronic device, they obtained the finding that there are parts with a large amount of heat generation and parts with a small amount of heat generation in the electronic device. On the other hand, the conventional heat conductive member covers the entire surface of the electronic device, and cools the entire surface of the electronic device without distinguishing between the parts with a large amount of heat generation and the parts with a small amount of heat generation. That is, the parts with a small amount of heat generation and low cooling necessity are also covered with the heat conductive member, resulting in waste. Based on the above findings, the inventors have found a means of selectively applying a heat conductive member in a pattern to a site where the amount of heat generation is large and the need for cooling is high. As a result, efficient cooling can be achieved with a small amount of heat conductive member.

[0015] Furthermore, the heat conductive member of the present embodiment has improved heat conductivity by including an oriented anisotropic filler.

[0016] From the above, the heat conductive member of the present embodiment can be selectively applied to a site with a large amount of heat generation and has improved heat conductivity.

[0017] <First Embodiment> Hereinafter, a method for manufacturing a heat conductive member according to the first embodiment will be described with reference to FIGS. 1 to 3.

[0018] The method for manufacturing the heat conductive member 20 according to the first embodiment includes a step (A1) of preparing a sheet having a resin film 2 made of a resin composition on a substrate 1, a step (X1) of electrostatically orienting the anisotropic filler 5 inside the resin film 2, and a step (B1) of patterning the resin film 2.

[0019] In the method for manufacturing the heat conductive member according to the first embodiment, the order of each step is not limited. For example, step (B1) may be performed after step (X1), or step (X1) may be performed after step (B1).

[0020] An embodiment in which step (B1) is performed after step (X1) will be described with reference to FIGS. 1 and 2.

[0021] An example of an embodiment in which step (B1) is performed after step (X1) will be described with reference to FIG. 1. First, a sheet having a resin film 2 made of a resin composition containing a photosensitive resin and an anisotropic filler 5 is prepared on the substrate 1 to obtain a laminate A. In the aspect shown in FIG. 1, the resin film 2 contains the anisotropic filler 5 at the time before electrostatic orientation is performed. (FIG. 1(1)) Next, the laminate A is placed between two electrodes 3 connected to the voltage generator 4, and a voltage is applied. As a result, the anisotropic filler 5 is electrostatically oriented. (Fig. 1(2)) Next, a mask 8 is placed on the laminate A, and light 9 is irradiated. (Fig. 1(3)) Next, the uncured portion is removed (developed) to pattern the resin film 2. In this way, the heat conductive member 20 is obtained. (Fig. 1(4))

[0022] Another example of an embodiment in which step (B1) is performed after step (X1) will be described with reference to Fig. 2. First, a sheet having a resin film 2 made of a resin composition containing a photosensitive resin is prepared on the base material 1 to obtain the laminate A. In the embodiment shown in Fig. 2, the resin film 2 does not contain the anisotropic filler 5 before the electrostatic orientation. (Fig. 2(1)) Next, the laminate A is placed between two electrodes 3 connected to the voltage generator 4. Then, the anisotropic filler 5 is scattered between the resin film 2 and the electrode 3, and a voltage is applied. As a result, the anisotropic filler 5 is electrostatically oriented so as to be embedded in the resin film 2. (Fig. 2(2)) Next, a mask 8 is placed on the laminate A, and light 9 is irradiated. (Fig. 2(3)) Next, the uncured portion is removed (developed) to pattern the resin film 2. In this way, the heat conductive member 20 is obtained. (Fig. 2(4))

[0023] In the method for manufacturing the heat conductive member according to the first embodiment, it is preferable to further include a step (C1) of laminating a resin film 6 different from the resin film 2 on the resin film 2 after the step (X1). By laminating the resin film 6, the anisotropic filler 5 exposed from the surface of the resin film 2 can be covered with the resin film 6, and thus, a heat conductive member in which the anisotropic filler 5 is not exposed from the surface can be obtained.

[0024] An embodiment in which step (X1) is performed after step (B1) will be described with reference to Fig. 3. First, prepare a sheet having a resin film 2 made of a resin composition containing a photosensitive resin and an anisotropic filler 5 on a substrate 1 to obtain a laminate A. In the embodiment shown in FIG. 3, the resin film 2 contains the anisotropic filler 5 at the time before the electrostatic alignment is performed. (FIG. 3(1)) Next, place a mask 8 on the resin film 2 and irradiate it with light 9. (FIG. 3(2)) Next, remove (develop) the uncured portion to pattern the resin film 2. (FIG. 3(3)) Next, place the laminate A between two electrodes 3 connected to a voltage generator 4 and apply a voltage. As a result, the anisotropic filler 5 is electrostatically aligned to obtain a heat conductive member 20. (FIG. 3(4), (5))

[0025] When performing step (X1) after step (B1), it is preferable to further include a step (D1) of softening the patterned resin film between step (B1) and step (X1). Thereby, the anisotropic filler 5 becomes more likely to be aligned. The means for softening the resin film is not particularly limited. For example, the resin film can be softened by heating the resin film.

[0026] When performing step (X1) after step (B1), at the time of forming the resin film, the hardness of the resin film may be adjusted in advance to an appropriate range for the alignment of the anisotropic filler 5. The means for adjusting the hardness of the resin film is not particularly limited. For example, the hardness of the resin film can be adjusted by adjusting the components of the resin film or the crosslink density of the resin film.

[0027] Whether performing step (B1) after step (X1) or performing step (X1) after step (B1), it is preferable that the resin film contains an anisotropic filler at the time before performing step (X1). Thereby, it becomes easy to adjust the content of the anisotropic filler (filler content, hereinafter referred to as FC) in the resin film. Regarding this point, when explaining while comparing with the case where the resin film does not contain the anisotropic filler before performing the step (X1), in this case, as described above, between the two electrodes 3 connected to the voltage generator 4, the base material 1 having the resin film 2 is arranged, the anisotropic filler 5 is scattered between the resin film 2 and the electrode 3, a voltage is applied, and the anisotropic filler 5 is embedded in the resin film 2. When orienting the anisotropic filler in this way, it is difficult to control how much of the anisotropic filler 5 scattered between the resin film 2 and the electrode 3 is embedded in the resin film 2. On the other hand, when the resin film contains the anisotropic filler before performing the step (X1), since the resin film is formed of the resin composition containing the anisotropic filler 5, by controlling the amount of the anisotropic filler 5 blended in the resin composition, the content of the anisotropic filler in the resin film can be easily controlled.

[0028] If the FC can be adjusted, thereby the easiness of orientation of the anisotropic filler can be adjusted. Specifically, if the FC in the resin film is too much, the resin film becomes hard, and the viscosity of the varnish as the raw material of the resin film increases, etc., making it difficult for the anisotropic filler to be oriented. However, by reducing the FC, such a situation can be prevented. On the other hand, if the FC is too little, the thermal conductivity becomes small. Therefore, the FC should be set to a certain amount or more according to the required thermal conductivity. Thus, the amount of FC should be adjusted according to the case. Therefore, the ease of preparation of FC is advantageous for the manufacture of the thermal conductive member.

[0029] <Second Embodiment> Hereinafter, the manufacturing method of the thermal conductive member according to the second embodiment will be described with reference to FIG. 4.

[0030] The manufacturing method of the heat conductive member according to the second embodiment includes a step (X2) of electrostatically orienting the anisotropic filler 5 on the sheet 12 having the adhesive resin layer (preferably an alkali-soluble adhesive resin layer) 10, a step (A2) of preparing a sheet having the resin film 2 made of a resin composition on the base material 1, a step (E2) of laminating the sheet 12 on which the anisotropic filler 5 is electrostatically oriented on the resin film 2, a step (B2) of patterning the resin film 2, and a step (F2) of peeling the sheet 12 having the adhesive resin layer 10.

[0031] An example of the manufacturing method of the heat conductive member according to the second embodiment will be described with reference to FIG. 4. First, a sheet 12 having an adhesive resin layer 10 is prepared on a light-transmissive base material 11 formed of a light-transmissive material such as PET. (FIG. 4(1)) Next, the sheet 12 is disposed between two electrodes 3 connected to a voltage generator 4, the anisotropic filler 5 is scattered between the adhesive resin film 10 and the electrode 3, and a voltage is applied. Thereby, the anisotropic filler 5 is electrostatically oriented at least on one of the inside and the surface of the adhesive resin layer 10. (FIG. 4(2)) Next, the sheet 12 on which the anisotropic filler 5 is electrostatically oriented is laminated on the laminate A provided with the resin film 2 made of a resin composition containing a photosensitive resin so that the resin film 2 and the adhesive resin layer 10 face each other. (FIG. 4(3)) Next, a mask 8 is placed on the light-transmissive base material 11 of the sheet 12, and light 9 is irradiated. (FIG. 4(4)) Next, the sheet 12 is peeled off, the uncured portion and the adhesive resin layer 10 are removed (preferably removed by an alkaline solution), the resin film 2 is patterned, and the heat conductive member 20 is obtained. (FIG. 4(5))

[0032] In the manufacturing methods of the heat conductive members according to the first and second embodiments, it is preferable that the resin composition for forming the resin film contains a photosensitive resin composition. Thereby, curing by light irradiation becomes possible.

[0033] <Third Embodiment> Hereinafter, the manufacturing method of the heat conductive member according to the third embodiment will be described with reference to FIGS. 5 and 6.

[0034] The manufacturing method of the heat conductive member according to the third embodiment includes a step (A3) of preparing a sheet having a patterned resin film 13 made of a resin composition on a base material, and a step (X3) of electrostatically orienting the anisotropic filler 5 inside the patterned resin film 13.

[0035] An example of the manufacturing method of the heat conductive member according to the third embodiment will be described with reference to FIG. 5. First, a sheet having a resin film 2 made of a resin composition containing a photosensitive resin is prepared on a base material 1 to obtain a laminate A. (FIG. 5(1)) Next, a mask 8 is placed on the resin film 2, and light 9 is irradiated. (FIG. 5(2)) Next, the uncured portion is removed (developed) to form the resin film 2 into a pattern, and a patterned resin film 13 is obtained. (FIG. 5(3)) Next, the laminate A is disposed between two electrodes 3 connected to a voltage generator 4. Then, the anisotropic filler 5 is scattered between the patterned resin film 13 and the electrode 3, and a voltage is applied. Thereby, the anisotropic filler 5 is electrostatically oriented to obtain a heat conductive member 20. (FIGS. 5(4) and (5))

[0036] Another example of the manufacturing method of the heat conductive member according to the third embodiment will be described with reference to FIG. 6. First, a sheet having a patterned resin film 13 is prepared on a base material 1 by an arbitrary method such as inkjet printing to obtain a laminate A. (FIG. 6(1)) Next, the laminate A is disposed between two electrodes 3 connected to a voltage generator 4. Then, the anisotropic filler 5 is scattered between the patterned resin film 13 and the electrode 3, and a voltage is applied. Thereby, the anisotropic filler 5 is electrostatically oriented. Then, the patterned resin film 13 is cured by an arbitrary method such as heating or light irradiation to obtain a heat conductive member 20. (FIGS. 6(2) and (3))

[0037] In the manufacturing method of the heat conductive member according to the third embodiment, it is preferable that the resin composition for forming the resin film contains a photosensitive resin composition. Thereby, curing by light irradiation becomes possible.

[0038] In the method for manufacturing a thermally conductive member according to the third embodiment, it is preferable that the resin composition for forming the resin film contains a thermosetting resin composition. Thereby, curing by heating becomes possible.

[0039] <Each component> Hereinafter, each component included in the thermally conductive member according to the present embodiment will be described.

[0040] The thermally conductive member according to the present embodiment includes an anisotropic filler. In the present embodiment, the anisotropic filler refers to a filler that imparts anisotropy to the thermally conductive member when blended therewith. Anisotropy generally refers to the fact that physical properties are different depending on the direction, but in the present embodiment, it refers to the fact that thermal conductivity is different depending on the direction. That is, when the anisotropic filler in the present embodiment is blended, a thermally conductive member having different thermal conductivities depending on the direction can be obtained.

[0041] The shape of the anisotropic filler is preferably scaly from the viewpoint of further improving the thermal conductivity of the thermally conductive member. The scaly anisotropic filler may be monodisperse particles or aggregated particles, but is preferably aggregated particles from the viewpoint of further improving the thermal conductivity of the thermally conductive member. The aggregated particles of the scaly anisotropic filler may be sintered particles or non-sintered particles.

[0042] The anisotropic filler preferably contains one or more selected from the group consisting of boron nitride, aluminum nitride, alumina, and graphite from the viewpoint of further improving the thermal conductivity of the thermally conductive member, more preferably contains one or more selected from the group consisting of boron nitride, aluminum nitride, and alumina, and still more preferably contains boron nitride.

[0043] The median diameter D of the anisotropic filler on a volume basis 50From the perspective of further improving the thermal conductivity of the thermally conductive member, it is preferably 20 μm or more, more preferably 30 μm or more, still more preferably 50 μm or more, and from the perspective of further improving the performance balance such as the moldability, appearance, and flexibility of the thermally conductive member, it is preferably 100 μm or less, still more preferably 80 μm or less. Here, the median diameter D of the anisotropic filler based on volume 50 is the median diameter (D 50 ) when the particle size distribution is measured based on volume by a laser diffraction particle size distribution measuring device.

[0044] The content of the anisotropic filler with respect to 100 parts by mass of the thermally conductive member is preferably 10 parts by mass or more, more preferably 20 parts by mass or more, still more preferably 30 parts by mass or more, still more preferably 40 parts by mass or more, still more preferably 50 parts by mass or more from the perspective of further improving the thermal conductivity of the thermally conductive member, and from the perspectives of improving the moldability of the thermally conductive member and facilitating the orientation of the anisotropic filler, etc., it is preferably 90 parts by mass or less, more preferably 80 parts by mass or less, still more preferably 70 parts by mass or less, still more preferably 60 parts by mass or less.

[0045] The thickness T of the resin film c to the median diameter D of the anisotropic filler 50 ratio (D 50 / T c ) is preferably 1.1 or more from the perspective of further improving the thermal conductivity of the thermally conductive member, and preferably 5.0 or less from the perspectives of further improving the moldability, appearance, flexibility, etc. of the thermally conductive member.

[0046] In the method for manufacturing the thermally conductive member according to the present embodiment, it is preferable to include a step of treating the surface of the anisotropic filler with a coupling agent. Thereby, the compatibility between the anisotropic filler and the organic component is improved, and the dispersibility of the anisotropic filler is improved. The type of the coupling agent is not particularly limited, and known ones can be used. For example, silane coupling agents can be mentioned. Examples of the silane coupling agent include vinyl group-containing silane coupling agents such as vinyltrimethoxysilane and vinyltriethoxysilane; epoxy group-containing silane coupling agents such as 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, and 3-glycidoxypropyltriethoxysilane; (meth)acrylic group-containing silane coupling agents such as 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropyltriethoxysilane, and 3-acryloxypropyltrimethoxysilane, etc.

[0047] The resin composition according to this embodiment preferably contains a (meth)acrylic resin. In addition, the notation "(meth)acrylic" in this specification represents a concept that includes both acrylic and methacrylic. The same applies to similar notations such as "(meth)acrylate" and "(meth)acryloyl".

[0048] The type of the (meth)acrylic resin is not particularly limited. For example, a resin obtained by polymerizing a monomer containing (meth)acrylic acid ester as a main component (50% by mass or more, preferably 70% by mass or more, more preferably 90% by mass or more) can be used. (Meth)acrylic acid esters include, for example, one or more selected from the group consisting of methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, lauryl (meth)acrylate, stearyl (meth)acrylate, cyclohexyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-propyl (meth)acrylate, chloro-2-hydroxyethyl (meth)acrylate, diethylene glycol mono(meth)acrylate, methoxyethyl (meth)acrylate, glycidyl (meth)acrylate, dicyclopentanyl (meth)acrylate, dicyclopentenyl (meth)acrylate, and isobornyl (meth)acrylate.

[0049] When the resin composition according to this embodiment contains a (meth)acrylic resin, the content of the (meth)acrylic resin with respect to 100 parts by mass of the resin composition is preferably 1 part by mass or more, more preferably 5 parts by mass or more, still more preferably 10 parts by mass or more, still more preferably 15 parts by mass or more, still more preferably 20 parts by mass or more from the viewpoint of further improving the moldability, appearance, flexibility, etc. of the heat conductive member, and preferably 90 parts by mass or less, more preferably 80 parts by mass or less, still more preferably 70 parts by mass or less, still more preferably 60 parts by mass or less, still more preferably 50 parts by mass or less from the viewpoint of further improving the thermal conductivity of the heat conductive member.

[0050] The resin composition according to this embodiment preferably contains an epoxy resin.

[0051] The type of the epoxy resin is not particularly limited. For example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol E type epoxy resin, bisphenol S type epoxy resin, bisphenol M type epoxy resin (4,4'-(1,3-phenylene diisoprene) bisphenol type epoxy resin), bisphenol P type epoxy resin (4,4'-(1,4-phenylene diisoprene) bisphenol type epoxy resin), bisphenol Z type epoxy resin (4,4'-cyclohexadiene bisphenol type epoxy resin) and other bisphenol type epoxy resins; phenol novolac type epoxy resin, cresol novolac type epoxy resin, tetraphenol group ethane type novolac type epoxy resin, novolac type epoxy resin having a condensed ring aromatic hydrocarbon structure and other novolac type epoxy resins; epoxy resin having a biphenyl skeleton; aryl alkylene type epoxy resins such as xylylene type epoxy resin, epoxy resin having a biphenyl aralkyl skeleton; naphthylene ether type epoxy resin; naphthol type epoxy resin; naphthalene diol type epoxy resin; bifunctional to tetrafunctional epoxy type naphthalene resins such as 1,6-dihydroxynaphthalene type epoxy resin, 2,7-dihydroxynaphthalene type epoxy resin, 1,5-dihydroxynaphthalene type epoxy resin, 1,4-dihydroxynaphthalene type epoxy resin, 2,6-dihydroxynaphthalene type epoxy resin; binaphthyl type epoxy resin; naphthalene type epoxy resins such as epoxy resin having a naphthalene aralkyl skeleton; anthracene type epoxy resin; epoxy resin having a dicyclopentadiene skeleton; norbornene type epoxy resin; epoxy resin having an adamantane skeleton; fluorene type epoxy resin;It contains one or more selected from the group consisting of epoxy resins having a phenol aralkyl skeleton, preferably one or more selected from the group consisting of bisphenol A type epoxy resin, bisphenol F type epoxy resin, epoxy resin having a dicyclopentadiene skeleton, epoxy resin having a biphenyl skeleton, epoxy resin having an adamantane skeleton, naphthalenediol type epoxy resin, epoxy resin having a phenol aralkyl skeleton, epoxy resin having a biphenyl aralkyl skeleton, and epoxy resin having a naphthalene aralkyl skeleton.;

[0052] When the resin composition according to this embodiment contains an epoxy resin, the content of the epoxy resin with respect to 100 parts by mass of the resin composition is preferably 1 part by mass or more, more preferably 5 parts by mass or more, still more preferably 10 parts by mass or more, still more preferably 15 parts by mass or more, still more preferably 20 parts by mass or more from the viewpoint of further improving the performance balance such as the moldability, appearance and flexibility of the heat conductive member, and preferably 90 parts by mass or less, more preferably 80 parts by mass or less, still more preferably 70 parts by mass or less, still more preferably 60 parts by mass or less, still more preferably 50 parts by mass or less from the viewpoint of further improving the thermal conductivity of the heat conductive member.

[0053] The resin composition according to this embodiment preferably contains a solvent. By blending a solvent into the resin composition, the viscosity of the resin composition can be lowered, and thereby the anisotropic filler 5 becomes more easily orientable.

[0054] The type of the solvent is not particularly limited. For example, alcohols such as ethyl alcohol, propyl alcohol, butyl alcohol, pentyl alcohol, hexyl alcohol, heptyl alcohol, octyl alcohol, nonyl alcohol, decyl alcohol, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, propylene glycol monobutyl ether, methyl methoxybutanol, α-terpineol, β-terpineol, hexylene glycol, benzyl alcohol, 2-phenylethyl alcohol, isopalmitic alcohol, isostearyl alcohol, lauryl alcohol, ethylene glycol, propylene glycol or glycerin; ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, diacetone alcohol (4-hydroxy-4-methyl-2-pentanone), 2-octanone, isophorone (3,5,5-trimethyl-2-cyclohexen-1-one) or diisobutyl ketone (2,6-dimethyl-4-heptanone); esters such as ethyl acetate, butyl acetate, diethyl phthalate, dibutyl phthalate, acetoxyethane, methyl butyrate, methyl hexanoate, methyl octanoate, methyl decanoate, methyl cellosolve acetate, ethylene glycol monobutyl ether acetate, propylene glycol monomethyl ether acetate, 1,2-diacetoxyethane, tributyl phosphate, tricresyl phosphate or tripentyl phosphate; ethers such as tetrahydrofuran, dipropyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene glycol dibutyl ether, propylene glycol dimethyl ether, ethoxyethyl ether, 1,2-bis(2-diethoxy)ethane or 1,2-bis(2-methoxyethoxy)ethane, ethylene glycol-mono-2-ethylhexyl ether, tripropylene glycol mono n-butyl ether; ester ethers such as 2-(2-butoxyethoxy)ethyl acetate;One or more selected from the group consisting of ether alcohols such as 2-(2-methoxyethoxy)ethanol; hydrocarbons such as toluene, xylene, n-paraffin, isoparaffin, dodecylbenzene, turpentine oil, kerosene or light oil; nitriles such as acetonitrile or propionitrile; amides such as acetamide or N,N-dimethylformamide; silicone oils such as low molecular weight volatile silicone oil and volatile organomodified silicone oil, more preferably one or more selected from the group consisting of ethers such as tetrahydrofuran, dipropyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene glycol dibutyl ether, propylene glycol dimethyl ether, ethoxyethyl ether, 1,2-bis(2-diethoxy)ethane or 1,2-bis(2-methoxyethoxy)ethane, ethylene glycol-mono-2-ethylhexyl ether, tripropylene glycol mono n-butyl ether, and even more preferably one or two selected from the group consisting of ethylene glycol-mono-2-ethylhexyl ether and tripropylene glycol mono n-butyl ether.;

[0055] When the resin composition according to this embodiment contains a solvent, the content of the solvent with respect to 100 parts by mass of the resin composition is preferably 1 part by mass or more, more preferably 5 parts by mass or more, even more preferably 10 parts by mass or more, from the viewpoints of improving the moldability of the heat conductive member and facilitating the orientation of the anisotropic filler, and is preferably 80 parts by mass or less, more preferably 60 parts by mass or less, even more preferably 40 parts by mass or less, from the viewpoint of reducing the labor of volatilizing the solvent.;

[0056] The resin composition according to this embodiment preferably contains a thermosetting initiator.;

[0057] Examples of the thermosetting initiator include a thermal radical generator that generates radicals by heating and a thermal cation generator that generates cations by heating.; Examples of the thermal radical initiator include azo compounds such as 2,2’-azobisbutyronitrile (AIBN) and peroxides such as benzoyl peroxide (BPO). Examples of the thermal cation initiator include iodonium salts and sulfonium salts. Commercially available products include the Sun-Aid series manufactured by Sanshin Chemical Industry Co., Ltd. and the Adeka Optomer series manufactured by ADEKA Corporation.

[0058] When the resin composition according to this embodiment contains a thermosetting initiator, the content of the thermosetting initiator is not particularly limited and can be arbitrarily set as needed.

[0059] The resin composition according to this embodiment preferably contains a photoinitiator.

[0060] Examples of the photoinitiator include a photo radical initiator that generates radicals by light irradiation and a photo cation initiator that generates cations by light irradiation. Examples of the photo radical initiator include benzoin derivatives, benzyl ketals, acetophenones, acylphosphine oxides, benzophenones, Michler's ketones, or thioxanthones. Commercially available products include the Irgacure series of IGM resins. Examples of the photo cation initiator include iodonium salts and sulfonium salts. Commercially available products include the CPI series and the IK series of Sun-Apro Co., Ltd.

[0061] When the resin composition according to this embodiment contains a photoinitiator, the content of the photoinitiator is not particularly limited and can be arbitrarily set as needed.

[0062] The resin composition according to this embodiment may contain components other than those described above, and may contain known components such as polymerization inhibitors, defoamers, surfactants, and colorants. The content of these other components can be arbitrarily set as needed.

[0063] The base material constituting the heat conductive member according to this embodiment preferably includes a metal foil.

[0064] The type of the metal foil is not particularly limited, but from the viewpoint of good workability, it preferably includes one or more selected from the group consisting of copper foil, silver foil, gold foil, and aluminum foil, more preferably includes one or more selected from the group consisting of copper foil and aluminum foil, and still more preferably includes copper foil.

[0065] <Physical properties of the heat conductive member, etc.> Hereinafter, the physical properties of the heat conductive member according to this embodiment will be described.

[0066] The heat conductive member according to the first embodiment includes one or more selected from the group consisting of anisotropic fillers selected from the group consisting of boron nitride and graphite, and it is preferable that the heat conductive member satisfies the following formula (1). C F ×I 100 / I 002 ≧2.4 (1) (In formula (1), I 002 is the diffraction peak intensity of the 002 plane of the X-ray diffraction chart obtained by the following [X-ray diffraction method], and I 100 is the diffraction peak intensity of the 100 plane of the X-ray diffraction chart obtained by the following [X-ray diffraction method], and C F is the filling rate of the anisotropic filler, which is represented by the following formula (2), C F =V F / (V F +V R ) (2) In formula (2), V F is the volume of the anisotropic filler in the resin film, and V R is the volume of the resin component in the resin film) [X-ray diffraction method] Using CuKα rays as the radiation source, perform X-ray diffraction by irradiating X-rays in the thickness direction of the heat conductive member under the conditions of a scanning axis of 2θ / θ, a sampling width of 0.02°, a scanning speed of 2° / min, an incident angle of 5°, and a reflection angle of 5°.

[0067] The volume V of the anisotropic filler in the resin film F can be calculated from the content of the anisotropic filler and the specific gravity of the anisotropic filler. Also, when the resin film does not contain fillers other than the anisotropic filler, the volume obtained by subtracting the volume V F of the anisotropic filler in the resin film from the volume of the resin film is defined as the volume V R of the resin component in the resin film. Also, when the resin film contains fillers other than the anisotropic filler, the volume obtained by subtracting the volume V F of the anisotropic filler and the volume of the fillers other than the anisotropic filler from the volume of the resin film is defined as the volume V R of the resin component in the resin film.

[0068] In Equation (1), I 002 is the diffraction peak intensity of the 002 plane (2θ is approximately 27°) perpendicular to the plane direction of the anisotropic filler, and I 100 is the diffraction peak intensity of the 100 plane (2θ is approximately 42°) parallel to the plane direction of the anisotropic filler. Therefore, the fact that the value of I 100 / I 002 is equal to or greater than a certain value means that the plane direction of the anisotropic filler is parallel to the thickness direction of the heat conductive member, that is, the orientation degree of the anisotropic filler is equal to or greater than a certain value. Also, C F is the filling rate of the anisotropic filler. Therefore, Equation (1) is an equation indicating that the filling rate of the anisotropic filler is equal to or greater than a certain value and the orientation degree of the anisotropic filler is equal to or greater than a certain value.

[0069] In the heat conductive member of the first embodiment, the value of D 50 / T c is preferably 1.1 or more, more preferably 1.2 or more, still more preferably 1.3 or more, still more preferably 1.4 or more, still more preferably 1.5 or more, and preferably 5.0 or less, more preferably 4.0 or less, still more preferably 3.5 or less, still more preferably 3.0 or less, still more preferably 2.8 or less, still more preferably 2.6 or less, still more preferably 2.4 or less, still more preferably 2.3 or less. D50 / T c Since the value of is within the above range, the thermal conductivity of the heat conductive member can be further improved.

[0070] In the heat conductive member of the first embodiment, C F ×I 100 / I 002 From the viewpoint of further improving the thermal conductivity, the value of is preferably 3.0 or more, more preferably 5.0 or more, still more preferably 7.0 or more, still more preferably 7.5 or more, still more preferably 8.0 or more, still more preferably 9.0 or more, still more preferably 10.0 or more, and still more preferably 11.0 or more.

[0071] In the heat conductive member of the first embodiment, C F From the viewpoint of further improving the thermal conductivity, the value of is preferably 10% by volume or more, more preferably 30% by volume or more, still more preferably 50% by volume or more, still more preferably 55% by volume or more, still more preferably 60% by volume or more, and still more preferably 65% by volume or more. From the viewpoint of the balance between thermal conductivity and production efficiency, it is preferably 90% by volume or less, more preferably 85% by volume or less, still more preferably 80% by volume or less, and still more preferably 75% by volume or less.

[0072] The heat conductive member of the first embodiment preferably satisfies the following formula (3) from the viewpoint of improving the performance balance between thermal conductivity and production efficiency. C F ×I 100 / I 002 ≦20.0 (3) In formula (3), C F , I 100 and I 002 are defined in the same way as in formula (1).

[0073] In the heat conductive member of the first embodiment, C F ×I 100 / I 002The value is preferably 18.0 or less, more preferably 16.0 or less, still more preferably 15.0 or less, still more preferably 14.5 or less, still more preferably 14.0 or less, still more preferably 13.5 or less, and still more preferably 13.0 or less from the viewpoint of improving the performance balance between thermal conductivity and production efficiency.

[0074] The thermally conductive member according to the second embodiment preferably contains an anisotropic filler of aluminum nitride and satisfies the following formula (4). C F ×I 100 / I 002 ≧1.0 (4) (In formula (4), I 002 is the diffraction peak intensity of the 002 plane of the X-ray diffraction chart obtained by the following [X-ray diffraction method], and I 100 is the diffraction peak intensity of the 100 plane of the X-ray diffraction chart obtained by the following [X-ray diffraction method], and C F is the filling rate of the anisotropic filler, which is represented by the following formula (5), C F =V F / (V F +V R ) (5) In formula (5), V F is the volume of the anisotropic filler in the resin film, and V R is the volume of the resin component in the resin film) [X-ray diffraction method] Using CuKα rays as the radiation source, perform X-ray diffraction by irradiating X-rays in the thickness direction of the thermally conductive member under the conditions of a scanning axis of 2θ / θ, a sampling width of 0.02°, a scanning speed of 2° / min, an incident angle of 5°, and a reflection angle of 5°.

[0075] The calculation method of the volume V F of the anisotropic filler in the resin film and the volume V R of the resin component in the resin film is as described above.

[0076] In formula (4), I 002 is the diffraction peak intensity of the 002 plane (2θ is about 36.5°) perpendicular to the plane direction of the anisotropic filler, and I100 is the diffraction peak intensity of the 100 plane (2θ is about 33.2°) parallel to the planar direction of the anisotropic filler. Therefore, when the value of I 100 / I 002 is equal to or greater than a certain value, it means that the planar direction of the anisotropic filler is parallel to the thickness direction of the heat conductive member, that is, the orientation degree of the anisotropic filler is equal to or greater than a certain value. Also, C F is the filling rate of the anisotropic filler. Therefore, Equation (4) is an equation indicating that the filling rate of the anisotropic filler is equal to or greater than a certain value and the orientation degree of the anisotropic filler is equal to or greater than a certain value.

[0077] In the heat conductive member of the second embodiment, the value of D 50 / T c is preferably 1.1 or more, more preferably 1.2 or more, still more preferably 1.3 or more, still more preferably 1.4 or more, still more preferably 1.5 or more, and preferably 5.0 or less, more preferably 4.0 or less, still more preferably 3.5 or less, still more preferably 3.0 or less, still more preferably 2.8 or less, still more preferably 2.6 or less, still more preferably 2.4 or less, still more preferably 2.3 or less. When the value of D 50 / T c is within the above range, the thermal conductivity of the heat conductive member can be further improved.

[0078] In the heat conductive member of the second embodiment, the value of C F ×I 100 / I 002 is preferably 1.5 or more, more preferably 2.0 or more, still more preferably 2.5 or more, still more preferably 3.0 or more, still more preferably 3.4 or more from the viewpoint of further improving the thermal conductivity.

[0079] In the heat conductive member of the second embodiment, C FThe value of is preferably 10% by volume or more, more preferably 30% by volume or more, still more preferably 50% by volume or more, still more preferably 55% by volume or more, still more preferably 60% by volume or more, still more preferably 65% by volume or more, from the viewpoint of further improving thermal conductivity, and preferably 90% by volume or less, more preferably 85% by volume or less, still more preferably 80% by volume or less, still more preferably 75% by volume or less, from the viewpoint of improving the performance balance between thermal conductivity and production efficiency.

[0080] From the viewpoint of improving the performance balance between thermal conductivity and production efficiency, the thermal conductivity member of the second embodiment preferably satisfies the following formula (6). C F ×I 100 / I 002 ≦10.0 (6) In formula (6), C F , I 100 and I 002 are defined in the same way as in formula (4).

[0081] In the thermal conductivity member of the second embodiment, the value of C F ×I 100 / I 002 is preferably 9.0 or less, more preferably 8.0 or less, still more preferably 7.0 or less, still more preferably 6.5 or less, still more preferably 6.0 or less, from the viewpoint of improving the performance balance between thermal conductivity and production efficiency.

[0082] The thermal conductivity member according to the third embodiment preferably satisfies the following formula (7), where the anisotropic filler contains alumina. C F ×I 113 / I 006 ≧5.0 (7) (In formula (7), I 006 is the diffraction peak intensity of the 006 plane of the X-ray diffraction chart obtained by the following [X-ray diffraction method], I 113 is the diffraction peak intensity of the 113 plane of the X-ray diffraction chart obtained by the following [X-ray diffraction method], and C Fis the filling rate of the anisotropic filler and is represented by the following formula (8): C F =V F / (V F +V R ) (8) In formula (8), V F is the volume of the anisotropic filler in the resin film, and V R is the volume of the resin component in the resin film.) [X-ray Diffraction Method] Using CuKα rays as the radiation source, perform X-ray diffraction by irradiating X-rays in the thickness direction of the heat conductive member under the conditions of a scanning axis of 2θ / θ, a sampling width of 0.02°, a scanning speed of 2° / min, an incident angle of 5°, and a reflection angle of 5°.

[0083] The method for calculating the volume V F of the anisotropic filler in the resin film and the volume V R of the resin component in the resin film is as described above.

[0084] In formula (7), I 006 is the diffraction peak intensity of the 006 plane (2θ is approximately 41.6°) perpendicular to the plane direction of the anisotropic filler, and I 113 is the diffraction peak intensity of the 113 plane (2θ is approximately 43.3°) parallel to the plane direction of the anisotropic filler. Therefore, the fact that the value of I 113 / I 006 is equal to or greater than a certain value means that the plane direction of the anisotropic filler is parallel to the thickness direction of the heat conductive member, that is, the degree of orientation of the anisotropic filler is equal to or greater than a certain value. Also, C F is the filling rate of the anisotropic filler. Therefore, formula (7) is an expression indicating that the filling rate of the anisotropic filler is equal to or greater than a certain value and the degree of orientation of the anisotropic filler is equal to or greater than a certain value.

[0085] In the heat conductive member of the third embodiment, D 50 / T cThe value of is preferably 1.1 or more, more preferably 1.2 or more, still more preferably 1.3 or more, still more preferably 1.4 or more, still more preferably 1.5 or more, and is preferably 5.0 or less, more preferably 4.0 or less, still more preferably 3.5 or less, still more preferably 3.0 or less, still more preferably 2.8 or less, still more preferably 2.6 or less, still more preferably 2.4 or less, still more preferably 2.3 or less. D 50 / T c When the value of is within the above range, the thermal conductivity of the heat conductive member can be further improved.

[0086] In the heat conductive member of the third embodiment, C F ×I 113 / I 006 The value of is preferably 6.0 or more, more preferably 7.0 or more, still more preferably 10.0 or more from the viewpoint of further improving the thermal conductivity.

[0087] In the heat conductive member of the third embodiment, C F The value of is preferably 10% by volume or more, more preferably 30% by volume or more, still more preferably 50% by volume or more, still more preferably 55% by volume or more, still more preferably 60% by volume or more, still more preferably 65% by volume or more from the viewpoint of further improving the thermal conductivity, and is preferably 90% by volume or less, more preferably 85% by volume or less, still more preferably 80% by volume or less, still more preferably 75% by volume or less from the viewpoint of the balance between thermal conductivity and production efficiency.

[0088] In the heat conductive member of the third embodiment, from the viewpoint of improving the performance balance between thermal conductivity and production efficiency, preferably, the heat conductive member satisfies the following formula (9). C F ×I 113 / I 006 ≦50.0 (9) In formula (9), C F , I 006 and I 113 are defined in the same way as in formula (7).

[0089] In the heat conductive member of the third embodiment, C F ×I 113 / I 006 The value of is preferably 48.0 or less, more preferably 45.0 or less, still more preferably 43.0 or less, still more preferably 41.0 or less, and still more preferably 40.0 or less from the viewpoint of improving the performance balance between heat conductivity and production efficiency.

[0090] The heat conductive member according to this embodiment may be in a B-stage state or a C-stage state.

[0091] [Heat Conductive Member] The heat conductive member of this embodiment is obtained by the method for manufacturing the heat conductive member described above.

[0092] The above heat conductive member includes a patterned resin film. Further, the above heat conductive member includes an oriented anisotropic filler. Thereby, the above heat conductive member can be selectively applied to a portion with a large amount of heat generation, and the heat conductivity is improved.

[0093] The heat conductive member of this embodiment can be used in various applications where heat conductivity is required, for example, in electronic devices such as semiconductor devices.

[0094] [Electronic Device] The electronic device of this embodiment will be described with reference to FIG. 7. The electronic device 40 of this embodiment includes the above heat conductive member 20 and an electronic component 30 on the above heat conductive member.

[0095] The above heat conductive member 20 includes a patterned resin film 13. Further, the above heat conductive member 20 includes an oriented anisotropic filler 5. Thereby, the above heat conductive member 20 can be selectively applied to a portion with a large amount of heat generation, and the heat conductivity is improved. Therefore, the electronic device 40 of this embodiment including the above heat conductive member 20 has improved heat conductivity.

[0096] The type of electronic component is not particularly limited. For example, a power semiconductor device may be used as the electronic component, and the electronic device may be a power module. The power semiconductor device uses a wide bandgap material such as SiC, GaN, Ga2O3, or diamond, and is designed to be used at high voltage and high current. Therefore, it generates more heat than a normal silicon chip (semiconductor device), and thus operates in a high-temperature environment. For example, the power semiconductor device is required to be used for a long time in a high-temperature operating environment of 200 °C or higher, 250 °C or higher, etc. Since the heat conductive member of the present embodiment has improved heat conductivity, it can be suitably used for the power semiconductor device. Examples of the power semiconductor device include a rectifier diode, a power transistor, a power MOSFET, an insulated gate bipolar transistor (IGBT), a thyristor, a gate turn-off thyristor (GTO), a triac, and the like.

[0097] The embodiments of the present invention have been described above, but these are examples of the present invention, and various configurations other than the above can also be adopted. Further, the present invention is not limited to the foregoing embodiments, and modifications, improvements, etc. within the scope that can achieve the object of the present invention are included in the present invention.

Description of Reference Numerals

[0098] 1 Substrate 2 Resin film 3 Electrode 4 Voltage generator 5 Anisotropic filler 8 Mask 9 Light 10 Adhesive resin layer 11 Light-transmissive substrate 12 Sheet 13 Patterned resin film 20 Heat conductive member 30 Electronic component 40 Electronic device A Laminate A B Laminate B

Claims

1. A method for manufacturing a thermally conductive member including a patterned resin film containing an anisotropic filler, the method for manufacturing a thermally conductive member including a step (X) of electrostatically orienting the anisotropic filler.

2. A step (A1) of preparing a sheet having a resin film made of a resin composition on a substrate, a step (X1) of electrostatically orienting the anisotropic filler inside the resin film, a step (B1) of patterning the resin film, The method for manufacturing a thermally conductive member according to claim 1, including these steps.

3. The method for manufacturing a thermally conductive member according to claim 2, wherein the step (B1) is performed after the step (X1).

4. The method for manufacturing a thermally conductive member according to claim 2 or 3, further including a step (C1) of laminating a resin film different from the resin film on the resin film after the step (X1).

5. The method for manufacturing a thermally conductive member according to claim 2, wherein the step (X1) is performed after the step (B1).

6. The method for manufacturing a thermally conductive member according to claim 5, further including a step (D1) of softening the patterned resin film between the step (B1) and the step (X1).

7. The method for manufacturing a thermally conductive member according to claim 2, wherein the resin film contains the anisotropic filler at a point in time before performing the step (X1).

8. A step (X2) of electrostatically orienting the anisotropic filler on a sheet having an adhesive resin layer, a step (A2) of preparing a sheet having a resin film made of a resin composition on a substrate, a step (E2) of laminating the sheet on which the anisotropic filler is electrostatically oriented on the resin film, a step (B2) of patterning the resin film, a step (F2) of peeling off the sheet having the adhesive resin layer, The method for manufacturing a thermally conductive member according to claim 1, including these steps.

9. The method for manufacturing a thermally conductive member according to claim 2 or 8, wherein the resin composition includes a photosensitive resin composition.

10. A step (A3) of preparing a sheet having a patterned resin film made of a resin composition on a substrate, a step (X3) of electrostatically orienting the anisotropic filler inside the patterned resin film, The method for manufacturing a thermally conductive member according to claim 1, including these steps.

11. The method for manufacturing a thermally conductive member according to claim 10, wherein the resin composition includes a photosensitive resin composition.

12. The method for manufacturing a thermally conductive member according to claim 10, wherein the resin composition includes a thermosetting resin composition.

13. The method for manufacturing a thermally conductive member according to claim 2, 8, or 10, wherein the shape of the anisotropic filler is flaky.

14. The method for manufacturing a thermally conductive member according to claim 2, 8, or 10, wherein the anisotropic filler contains one or more selected from the group consisting of boron nitride, aluminum nitride, alumina, and graphite.

15. The median diameter D on a volume basis of the anisotropic filler ５０ is 20 μm or more and 100 μm or less, and the method for manufacturing a thermally conductive member according to claim 2, 8 or 10.

16. The method for manufacturing a thermally conductive member according to claim 2, 8, or 10, wherein the content of the anisotropic filler with respect to 100 parts by mass of the thermally conductive member is 10 parts by mass or more and 90 parts by mass or less.

17. The thickness T of the resin film ｃ The median diameter D of the anisotropic filler with respect to ５０ The ratio (D ５０ / T ｃ ) is 1.1 or more and 5.0 or less. The method for manufacturing a thermally conductive member according to claim 2, 8, or 10

18. The method for manufacturing a thermally conductive member according to claim 2, 8, or 10, comprising a step of treating the surface of the anisotropic filler with a coupling agent.

19. The method for manufacturing a thermally conductive member according to claim 2, 8, or 10, wherein the resin composition contains a (meth)acrylic resin.

20. The method for manufacturing a thermally conductive member according to claim 2, 8, or 10, wherein the resin composition contains an epoxy resin.

21. The method for manufacturing a thermally conductive member according to claim 2, 8, or 10, wherein the resin composition contains a solvent.

22. The method for manufacturing a thermally conductive member according to claim 2, 8, or 10, wherein the resin composition contains a thermal curing initiator.

23. The method for manufacturing a thermally conductive member according to claim 2, 8, or 10, wherein the resin composition contains a photo-curing initiator.

24. The method for manufacturing a thermally conductive member according to claim 2, 8, or 10, wherein the substrate contains a metal foil.

25. The method for manufacturing a thermally conductive member according to claim 24, wherein the metal foil contains a copper foil.

26. The anisotropic filler contains one or more selected from the group consisting of boron nitride and graphite, The method for manufacturing a thermally conductive member according to claim 2, 8, or 10, wherein the thermally conductive member satisfies the following formula (1). C Ｆ × I １００ / I ００２ ≥ 2.4 (1) (In the above formula (1), I ００２ is the diffraction peak intensity of the 002 plane of the X-ray diffraction chart obtained by the following [X-ray diffraction method], and I １００ is the diffraction peak intensity of the 100 plane of the X-ray diffraction chart obtained by the following [X-ray diffraction method], and C Ｆ is the filling rate of the anisotropic filler, which is represented by the following formula (2), C Ｆ = V Ｆ / (V Ｆ + V Ｒ ) (2) In the formula (2), V Ｆ is the volume of the anisotropic filler in the resin film, and V Ｒ is the volume of the resin component in the resin film) [X-ray diffraction method] Using CuKα ray as the radiation source, perform X-ray diffraction by irradiating X-ray in the thickness direction of the thermally conductive member under the conditions of scanning axis 2θ / θ, sampling width 0.02°, scan speed 2° / min, incident angle 5°, and reflection angle 5°.

27. The anisotropic filler contains aluminum nitride, The method for manufacturing a thermally conductive member according to claim 2, 8, or 10, wherein the thermally conductive member satisfies the following formula (4). C Ｆ × I １００ / I ００２ ≥ 1.0 (4) (In the formula (4), I ００２ is the diffraction peak intensity of the 002 plane of the X-ray diffraction chart obtained by the following [X-ray diffraction method], and I １００ is the diffraction peak intensity of the 100 plane of the X-ray diffraction chart obtained by the following [X-ray diffraction method], and C Ｆ is the filling rate of the anisotropic filler, which is represented by the following formula (5), C Ｆ = V Ｆ / (V Ｆ + V Ｒ ) (5) In the formula (5), V Ｆ is the volume of the anisotropic filler in the resin film, and V Ｒ is the volume of the resin component in the resin film) [X-ray diffraction method] Using CuKα rays as the X-ray source, irradiate the X-rays in the thickness direction of the heat conductive member under the conditions of a scanning axis of 2θ / θ, a sampling width of 0.02°, a scanning speed of 2° / min, an incident angle of 5°, and a reflection angle of 5° to perform X-ray diffraction.

28. The anisotropic filler contains alumina, The method for manufacturing a heat conductive member according to claim 2, 8, or 10, wherein the heat conductive member satisfies the following formula (7). C Ｆ × I １１３ / I ００６ ≥ 5.0 (7) (In the above formula (7), I ００６ is the diffraction peak intensity of the 006 plane of the X-ray diffraction chart obtained by the following [X-ray diffraction method], and I １１３ is the diffraction peak intensity of the 113 plane of the X-ray diffraction chart obtained by the following [X-ray diffraction method], and C Ｆ is the filling rate of the anisotropic filler, which is represented by the following formula (8), C Ｆ = V Ｆ / (V Ｆ + V Ｒ ) (8) In the formula (8), V Ｆ is the volume of the anisotropic filler in the resin film, and V Ｒ is the volume of the resin component in the resin film) [X-ray diffraction method] Using CuKα rays as the X-ray source, irradiate the X-rays in the thickness direction of the heat conductive member under the conditions of a scanning axis of 2θ / θ, a sampling width of 0.02°, a scanning speed of 2° / min, an incident angle of 5°, and a reflection angle of 5° to perform X-ray diffraction.

29. The method for manufacturing a heat conductive member according to claim 2, 8, or 10, wherein the heat conductive member is in a B-stage state.

30. The method for manufacturing a heat conductive member according to claim 2, 8, or 10, wherein the heat conductive member is in a C-stage state.

31. A heat conductive member obtained by the method for manufacturing a heat conductive member according to claim 2, 8, or 10.

32. The heat conductive member according to claim 31, An electronic component on the heat conductive member, An electronic device comprising the same.

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