Semiconductor manufacturing device

Abstract

To provide a semiconductor manufacturing device capable of more appropriately picking up electronic components.SOLUTION: A semiconductor manufacturing device comprises a pickup device 10 including a push-up mechanism 11, a transfer head 13 as a transfer unit, and a wafer holding unit 12, and a mounting unit 30. The push-up mechanism pushes up a plurality of adjacent electronic components among semiconductor chips C, which are a plurality of electronic components which have been singulated from a wafer. The transfer unit transfers the plurality of electronic components pushed up by the push-up mechanism. A presizer 20, which serves as an electronic component holding unit, holds the plurality of electronic components transferred by the transfer unit. The mounting unit (mounting head 31) mounts the electronic components held by the electronic component holding unit on a mounting target. At least a part of the push-up mechanism pushes up a plurality of adjacent electronic components such that it spans the same surface of the plurality of adjacent electronic components. The electronic component holding unit can switch between a holding state and a non-holding state for each electronic component.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present embodiment relates to a semiconductor manufacturing apparatus. [Background technology]

[0002] When picking up thin chips (thin electronic components), it is effective to use a multi-stage push-up method. However, as the aspect ratio of the chip increases and the chip becomes thinner, it becomes difficult to create a jig for the multi-stage push-up method. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2003-109979 Summary of the Invention [Problem to be solved by the invention]

[0004] A semiconductor manufacturing device capable of more appropriately picking up electronic components is provided. [Means for solving the problem]

[0005] The semiconductor manufacturing apparatus according to this embodiment includes a push-up unit, a transfer unit, an electronic component holding unit, and a mounting unit. The push-up unit is capable of pushing up adjacent electronic components among the electronic components singulated from the wafer. The transfer unit is capable of transferring the electronic components pushed up by the push-up unit. The electronic component holding unit is capable of holding the electronic components transferred and mounted by the transfer unit. The mounting unit mounts the electronic components held by the electronic component holding unit onto the mounting object. At least a portion of the push-up unit is capable of pushing up adjacent electronic components so as to straddle the adjacent electronic components on the same plane. The electronic component holding unit is capable of switching between an electronic component holding state and an electronic component non-holding state for each electronic component. [Brief explanation of the drawings]

[0006] [Figure 1] 1 is a block diagram showing an example of the configuration of a semiconductor manufacturing apparatus according to a first embodiment. [Figure 2] FIG. 2 is a top view showing an example of the configuration of a push-up mechanism according to the first embodiment. [Figure 3A] 3A to 3C are diagrams illustrating an example of a method for manufacturing the semiconductor device according to the first embodiment. [Figure 3B] 3B is a diagram showing an example of a method for manufacturing a semiconductor device, following FIG. 3A. FIG. [Figure 3C] 3B is a diagram showing an example of a method for manufacturing a semiconductor device. FIG. [Figure 3D] 3D is a diagram showing an example of a method for manufacturing a semiconductor device, following FIG. 3C. [Figure 3E] 3D, which is a diagram showing an example of a method for manufacturing a semiconductor device. [Figure 3F] 3E is a diagram illustrating an example of a method for manufacturing a semiconductor device. FIG. [Figure 4] 5A to 5C are cross-sectional views showing an example of the operation of the push-up mechanism according to the first embodiment. [Figure 5A] 3A to 3C are diagrams illustrating an example of a method for manufacturing the semiconductor device according to the first embodiment. [Figure 5B] 4B is a diagram showing an example of a method for manufacturing a semiconductor device, following FIG. 4A. FIG. [Figure 5C] 4B is a diagram showing an example of a method for manufacturing a semiconductor device, following FIG. 4B. [Figure 5D] 4D is a diagram showing an example of a method for manufacturing a semiconductor device, following FIG. 4C. [Figure 6A] 10A to 10C are diagrams illustrating an example of a method for manufacturing a semiconductor device according to a comparative example. [Figure 6B] 6B is a diagram showing an example of a method for manufacturing a semiconductor device, following FIG. 6A. FIG. [Figure 7] 10A and 10B are cross-sectional views showing an example of the operation of the push-up mechanism according to the second embodiment. [Figure 8] 10A and 10B are cross-sectional views showing an example of the operation of the push-up mechanism according to the third embodiment. [Figure 9]10A and 10B are cross-sectional views showing an example of the operation of the push-up mechanism according to the fourth embodiment. [Figure 10] FIG. 13 is a top view showing an example of the configuration of a push-up mechanism according to a fifth embodiment. [Figure 11] FIG. 13 is a top view showing an example of the configuration of a push-up mechanism according to a sixth embodiment. [Figure 12] FIG. 13 is a top view showing an example of the configuration of a push-up mechanism according to a seventh embodiment. [Figure 13] FIG. 19 is a top view showing an example of the configuration of a push-up mechanism according to an eighth embodiment. [Figure 14] FIG. 13 is a block diagram showing an example of the configuration of a semiconductor manufacturing apparatus according to a ninth embodiment. [Figure 15] FIG. 13 is a cross-sectional view showing an example of the operation of the thrust-up mechanism according to a third operation example of the ninth embodiment. [Figure 16] FIG. 13 is a cross-sectional view showing an example of the operation of the thrust-up mechanism according to a fourth operation example of the ninth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0007] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. The present invention is not limited to the embodiment. The drawings are schematic or conceptual, and the proportions of the various parts are not necessarily the same as those in reality. In the specification and drawings, elements similar to those described above with reference to the previous drawings are designated by the same reference numerals, and detailed descriptions thereof will be omitted as appropriate.

[0008] (First embodiment) 1 is a block diagram showing an example of the configuration of a semiconductor manufacturing apparatus according to the first embodiment. The semiconductor manufacturing apparatus includes a pickup device 10, a preciser 20, and a mount device 30.

[0009] The pick-up device 10 picks up the individual electronic components from the dicing tape DT. In the following description, the electronic components are assumed to be semiconductor chips C. However, the electronic components are not limited to semiconductor chips C.

[0010] The pickup device 10 includes a push-up mechanism 11 , a wafer holder 12 , and a transfer head 13 .

[0011] The push-up mechanism 11 (push-up unit) is capable of pushing up adjacent semiconductor chips C among a plurality of semiconductor chips C separated from the semiconductor wafer W. The push-up mechanism 11 is moved below the semiconductor chip C to be picked up (push-up target), and pushes up the semiconductor chip C and the dicing tape from below.

[0012] The push-up mechanism 11 has a plurality of push-up members 111, 112, and 113. This allows for a multi-stage push-up system to be adopted. Details of the push-up members 111, 112, and 113 will be described later with reference to FIG.

[0013] The wafer holding unit 12 is arranged around the push-up mechanism 11 and holds the semiconductor chips C around the semiconductor chip C that is pushed up by the push-up mechanism 11. The wafer holding unit 12 has suction holes for suctioning the back surface of the dicing tape DT and is connected to a vacuum pump (not shown). The wafer holding unit 12 holds the semiconductor chips C around the semiconductor chip C that is the push-up target by suction.

[0014] The transfer head 13 (transfer unit) picks up and transfers the semiconductor chips C pushed up by the push-up mechanism 11. The transfer head 13 has, for example, a suction collet that sucks the semiconductor chips C.

[0015] The precisor 20 (electronic component holder) is capable of holding a plurality of semiconductor chips C on which the semiconductor chips C are placed and transferred by the transfer head 13. The precisor 20 holds the semiconductor chips C by, for example, suction. By providing the precisor 20, the pick-up operation and the mounting operation of the semiconductor chips C can be performed independently. This allows the process time required for picking up and mounting to be shortened.

[0016] The precisor 20 can switch between a state in which the semiconductor chip C is held and a state in which the semiconductor chip C is not held for each semiconductor chip C. The precisor 20 has a plurality of suction parts (not shown) that can independently suction each semiconductor chip C. This allows separate suction (holding) for each semiconductor chip C. The suction parts (for example, suction holes) are connected to a vacuum pump (not shown).

[0017] The mounting device 30 mounts the semiconductor chip C on the mounting object. In the following description, the mounting object is assumed to be a wiring board S. However, the mounting object is not limited to the wiring board S.

[0018] The mounting device 30 has a mounting head 31 .

[0019] The mounting head 31 (mounting unit) mounts the semiconductor chip C held by the precisor 20 onto the wiring substrate S. More specifically, the mounting head 31 mounts the semiconductor chip C one by one from at least one semiconductor chip C held by the precisor 20 onto the wiring substrate S. The mounting head 31 has, for example, a suction collet that suctions the semiconductor chip C.

[0020] Next, the configuration of the push-up mechanism 11 will be described in detail.

[0021] Fig. 2 is a top view showing an example of the configuration of the push-up mechanism 11 according to the first embodiment. Fig. 2 also shows a semiconductor chip C. Note that line AA in Fig. 2 indicates a cross section corresponding to the cross section of the push-up mechanism 11 in Fig. 1.

[0022] At least a part of the push-up mechanism 11 can push up the adjacent semiconductor chips C so as to straddle the adjacent semiconductor chips C on the same plane. This makes it possible to pick up the multiple semiconductor chips C (two semiconductor chips C) at the same time.

[0023] The push-up mechanism 11 has a plurality of push-up members 111, 112, and 113. The push-up members 111, 112, and 113 correspond to the push-up members "1," "2," and "3" shown in Fig. 2, respectively. Note that the number of push-up members is not limited to three.

[0024] The push-up members 111, 112, and 113 can be raised and lowered individually (independently).

[0025] The push-up member 113 is, for example, rectangular when viewed from a direction approximately perpendicular to the semiconductor wafer W, and is disposed in the center. The push-up member 112 is, for example, disposed so as to surround the push-up member 113. The push-up member 111 is, for example, disposed so as to surround the push-up member 112.

[0026] The semiconductor chip C has, for example, a rectangular shape when viewed from a direction substantially perpendicular to the semiconductor wafer W.

[0027] Next, a method for manufacturing a semiconductor device will be described.

[0028] 3A to 3F are diagrams showing an example of a method for manufacturing the semiconductor device according to the first embodiment.

[0029] 3A, the semiconductor wafer W is diced into a plurality of semiconductor chips C. The semiconductor wafer W is diced while being adhered to a dicing tape DT via an adhesive layer A.

[0030] 3B, the wafer holder 12 holds the semiconductor chips C surrounding the semiconductor chip C to be pushed up. The semiconductor chips C are held by the wafer holder 12 using suction.

[0031] Next, as shown in Fig. 3C, the push-up mechanism 11 pushes up the semiconductor chip C to be pushed up, and the transfer head 13 picks up the semiconductor chip C by suction. In the example shown in Fig. 3C, there are two semiconductor chips C to be pushed up. Details of the operation of the push-up mechanism 11 will be explained later with reference to Fig. 4.

[0032] 3D, the transfer head 13 transfers and places the two semiconductor chips C onto the precisor 20. The transfer and placement of the semiconductor chips C is performed by the transfer head 13, two at a time.

[0033] 3E, the mounting head 31 picks up one semiconductor chip C. The precisor 20 then stops picking up (holding) the semiconductor chip C picked up by the mounting head 31.

[0034] Next, one semiconductor chip C is mounted on the wiring substrate S, as shown in FIG. 3F.

[0035] 3E and 3F are then performed on another semiconductor chip C. That is, the mounting head 31 mounts the semiconductor chips C one by one.

[0036] Next, the operation of the push-up mechanism 11 in the step of FIG. 3C will be described in detail.

[0037] Fig. 4 is a cross-sectional view showing an example of the operation of the push-up mechanism 11 according to the first embodiment. Push-up members 111, 112, and 113 correspond to push-up members "1," "2," and "3" shown in Fig. 4, respectively. Note that Fig. 4 shows a collet of the transfer head 13 as the transfer head 13.

[0038] The left and right push-up members 111 push up the two semiconductor chips C on the same surface (see FIG. 2). The left and right push-up members 112 push up the two semiconductor chips C on the same surface (see FIG. 2).

[0039] 4(a), the transfer head 13 picks up two semiconductor chips C. The push-up members 111, 112, and 113 are in the state before being pushed up, and are all at the same height.

[0040] 4(b), all of the push-up members 111, 112, and 113 rise to push up the semiconductor chips C. Note that the push-up members 111, 112, and 113 are all at the same height.

[0041] 4(c), the push-up members 112 and 113 rise and push up the semiconductor chip C. As a result, the dicing tape DT around the push-up member 112 is peeled off from the semiconductor chip C.

[0042] 4(d), the push-up member 113 rises and pushes up the semiconductor chip C. As a result, the dicing tape DT around the push-up member 113 is peeled off from the semiconductor chip C. Therefore, the dicing tape DT is gradually peeled off from the semiconductor chip C from the outside of the push-up mechanism 11.

[0043] Next, as shown in FIG. 4(e), the transfer head 13 rises and picks up the two semiconductor chips C.

[0044] Next, a method for manufacturing a semiconductor device after mounting the semiconductor chip C on the wiring substrate S will be described.

[0045] 5A to 5D are diagrams showing an example of a method for manufacturing the semiconductor device according to the first embodiment.

[0046] First, as shown in Fig. 5A, the individual semiconductor chips C are picked up and mounted on the wiring substrate S. The picking up and mounting of the semiconductor chips C are performed by the steps shown in Figs. 3A to 3F. In the example shown in Fig. 5A, an adhesive layer A is shown below the semiconductor chips C. Also shown is a plurality of semiconductor chips C stacked in a direction approximately perpendicular to the wiring substrate S.

[0047] Next, as shown in FIG. 5B, bonding wires BW that electrically connect the wiring board S and the semiconductor chip C are formed.

[0048] 5C, a molding resin M that covers the semiconductor chip C and the bonding wires BW is formed on the wiring substrate S. Also, metal bumps B are formed on the lower surface of the wiring substrate S. The metal bumps B are, for example, solder balls.

[0049] Next, as shown in Fig. 5D, the semiconductor device is divided into individual pieces, thereby completing the semiconductor device as a single semiconductor package.

[0050] As described above, according to the first embodiment, at least a part of the push-up mechanism 11 can push up a plurality of adjacent semiconductor chips C so as to straddle the adjacent semiconductor chips C on the same plane. Furthermore, the precisor 20 can switch between a holding state of the semiconductor chip C and a non-holding state of the semiconductor chip C for each semiconductor chip C. This allows thin semiconductor chips C with a high aspect ratio to be picked up more appropriately. Furthermore, the time required for picking up is shortened, thereby improving throughput.

[0051] The thickness of the semiconductor chip C along the direction approximately perpendicular to the semiconductor wafer W is, for example, 60 μm or less. The short side of the semiconductor chip C is, for example, 3.0 mm or less.

[0052] (Comparative Example) 6A and 6B are diagrams showing an example of a method for manufacturing a semiconductor device according to a comparative example. The comparative example differs from the first embodiment in that one semiconductor chip is picked up.

[0053] After the semiconductor chips C are held by the wafer holder 12 (see FIG. 3B), the push-up mechanism 11 pushes up the semiconductor chips C one by one, and the transfer head 13 picks up the semiconductor chips C one by one, as shown in FIG. 6A.

[0054] 6B, the transfer head 13 transfers and places the semiconductor chips C one by one onto the precisor 20. The precisor 20 picks up only one semiconductor chip C. The mounting head 31 recognizes only one semiconductor chip C on the precisor 20.

[0055] When picking up a thin chip (for example, 60 μm or less), it is effective to adopt a multi-stage push-up method. However, when the aspect ratio of the semiconductor chip C becomes large (for example, length / width = 4 or more) and the semiconductor chip C becomes thin, it becomes difficult to fabricate the push-up members 111, 112, 113 (jigs) for the multi-stage push-up method.

[0056] Furthermore, even if the aspect ratio is large, if the semiconductor chip C is thin, there is a possibility that the chip may crack when picked up by the pin push-up method.

[0057] In contrast, in the first embodiment, the push-up mechanism 11 pushes up multiple semiconductor chips C simultaneously. Multiple semiconductor chips C arranged in the short side direction are picked up simultaneously as a single semiconductor chip C. This makes it possible to reduce the apparent aspect ratio of the semiconductor chip C. Therefore, it is possible to pick up thin semiconductor chips C with a high aspect ratio without fabricating push-up members 111, 112, 113 (jigs) to change the aspect ratio of the semiconductor chip C. Furthermore, since multiple semiconductor chips C can be picked up simultaneously, throughput can be improved.

[0058] (Second embodiment) 7 is a cross-sectional view showing an example of the operation of the push-up mechanism 11 according to the second embodiment. In the second embodiment, the operation of the push-up mechanism 11 is different from that in the first embodiment.

[0059] 7(a), the transfer head 13 picks up two semiconductor chips C. The push-up members 111, 112, and 113 are in the state before being pushed up, and are all at the same height.

[0060] 7(b), all of the push-up members 111, 112, and 113 rise to push up the semiconductor chips C. Note that the push-up members 111, 112, and 113 are all at the same height.

[0061] 7(c), the push-up member 112 rises and pushes up the semiconductor chip C. As a result, the dicing tape DT around the push-up member 112 is peeled off from the semiconductor chip C.

[0062] Next, as shown in FIG. 7(d), the transfer head 13 rises and picks up the two semiconductor chips C.

[0063] As in the second embodiment, the operation of the push-up mechanism 11 may be changed. In this case, the same effects as in the first embodiment can be obtained.

[0064] (Third embodiment) 8 is a cross-sectional view showing an example of the operation of the push-up mechanism 11 according to the third embodiment. In the third embodiment, the operation of the push-up mechanism 11 is different from that in the first embodiment.

[0065] 8(a), the transfer head 13 picks up two semiconductor chips C. The push-up members 111, 112, and 113 are in the state before being pushed up, and are all at the same height.

[0066] 8(b), all of the push-up members 111, 112, and 113 rise to push up the semiconductor chips C. Note that the push-up members 111, 112, and 113 are all at the same height.

[0067] 8(c), the push-up member 111 descends, causing the dicing tape DT around the push-up member 112 to peel off from the semiconductor chip C.

[0068] 8(d), the push-up member 112 descends, causing the dicing tape DT around the push-up member 113 to peel off from the semiconductor chip C. Therefore, the dicing tape DT is gradually peeled off from the semiconductor chip C from the outside of the push-up mechanism 11.

[0069] Next, as shown in FIG. 8(e), the transfer head 13 rises and picks up the two semiconductor chips C.

[0070] Compared to the stepwise raising method, the stepwise lowering method applies less stress to the semiconductor chip C. Therefore, when a thin semiconductor chip C is used, the stepwise lowering method is preferable.

[0071] As in the third embodiment, the operation of the push-up mechanism 11 may be changed. In this case, the same effects as in the first embodiment can be obtained.

[0072] (Fourth embodiment) 9 is a cross-sectional view showing an example of the operation of the push-up mechanism 11 according to the fourth embodiment. In the fourth embodiment, the operation of the push-up mechanism 11 is different from that in the first embodiment.

[0073] 9(a), the transfer head 13 picks up two semiconductor chips C. The push-up members 111, 112, and 113 are in the state before being pushed up, and are all at the same height.

[0074] 9(b), all of the push-up members 111, 112, and 113 rise to push up the semiconductor chips C. Note that the push-up members 111, 112, and 113 are all the same height.

[0075] 9(c), the push-up members 111 and 113 are lowered, whereby the dicing tape DT around the push-up member 112 is peeled off from the semiconductor chip C.

[0076] Next, as shown in FIG. 9(d), the push-up member 112 rises and pushes up the semiconductor chip C.

[0077] Next, as shown in FIG. 9(e), the transfer head 13 moves up and picks up the two semiconductor chips C.

[0078] As in the fourth embodiment, the operation of the push-up mechanism 11 may be changed. In this case, the same effects as in the first embodiment can be obtained.

[0079] (Fifth embodiment) 10 is a top view showing an example of the configuration of the push-up mechanism 11 according to the fifth embodiment. In the fifth embodiment, the configuration of the push-up mechanism 11 is different from that in the first embodiment.

[0080] The push-up member 113 is, for example, rectangular when viewed from a direction approximately perpendicular to the semiconductor wafer W, and is arranged in the center. The two push-up members 112 are arranged to sandwich the push-up member 113 in the long side direction of the semiconductor chip C. The two push-up members 111 are arranged to sandwich the two push-up members 112 in the long side direction of the semiconductor chip C.

[0081] As in the fifth embodiment, the configuration of the push-up mechanism 11 may be changed. In this case, the same effects as in the first embodiment can be obtained.

[0082] (Sixth embodiment) 11 is a top view showing an example of the configuration of a push-up mechanism 11 according to the sixth embodiment. In the sixth embodiment, the number of semiconductor chips C pushed up by the push-up mechanism 11 is different from that in the fifth embodiment.

[0083] In the example shown in FIG. 11, the push-up mechanism 11 simultaneously pushes up 1×3 semiconductor chips C in a vertical×horizontal arrangement.

[0084] As in the sixth embodiment, the number of semiconductor chips C pushed up by the push-up mechanism 11 may be changed. In this case, the same effects as those of the fifth embodiment can be obtained.

[0085] (Seventh embodiment) 12 is a top view showing an example of the configuration of the push-up mechanism 11 according to the seventh embodiment. In the seventh embodiment, the number of semiconductor chips C pushed up by the push-up mechanism 11 is different from that in the fifth embodiment.

[0086] In the example shown in FIG. 12, the push-up mechanism 11 simultaneously pushes up 1×4 semiconductor chips C in length×width.

[0087] As in the seventh embodiment, the number of semiconductor chips C pushed up by the push-up mechanism 11 may be changed. In this case, the same effects as those of the fifth embodiment can be obtained.

[0088] (Eighth embodiment) 13 is a top view showing an example of the configuration of a push-up mechanism 11 according to the eighth embodiment. In the eighth embodiment, the number of semiconductor chips C pushed up by the push-up mechanism 11 is different from that in the first embodiment.

[0089] In the example shown in FIG. 13, the push-up mechanism 11 simultaneously pushes up 2×2 semiconductor chips C in a vertical×horizontal arrangement.

[0090] As in the eighth embodiment, the number of semiconductor chips C pushed up by the push-up mechanism 11 may be changed. In this case, the same effects as those of the fifth embodiment can be obtained.

[0091] (Ninth embodiment) 14 is a block diagram showing an example of the configuration of a semiconductor manufacturing apparatus according to the ninth embodiment. The ninth embodiment differs from the first embodiment in that a pass / fail judgment is performed on the semiconductor chips C.

[0092] The pickup device 10 further includes an imaging unit 14 .

[0093] The imaging unit 14 captures an image of the individual semiconductor chip C. The imaging unit 14 is, for example, a camera.

[0094] The semiconductor manufacturing apparatus further includes a control device 40.

[0095] The control device 40 controls the pickup device 10 and the mounting device 30 .

[0096] The control device 40 includes a determination unit 41 and a control unit 42. The determination unit 41 and the control unit 42 may be provided within the imaging unit 14.

[0097] The determination unit 41 determines whether the semiconductor chip C is good or bad, and whether it is present or not, based on the imaging result of the imaging unit 14. Therefore, the determination unit 41 recognizes whether the semiconductor chip C is a good chip or a defective chip. The determination unit 41 also recognizes whether the semiconductor chip C is present or not.

[0098] The control unit 42 transmits control signals to the pickup device and the mount device 30 in accordance with the determination result of the determination unit 41. This allows the pickup device 10 and the mount device 30 to perform different operations depending on the quality and presence or absence of the two semiconductor chips C to be picked up.

[0099] If the determination unit 41 recognizes that the two semiconductor chips C are non-defective chips, the pickup device 10 picks up and transports the two semiconductor chips C. The operation in this case is the same as the operation described in the first embodiment.

[0100] An example of operation when the determining unit 41 recognizes that one semiconductor chip C is a good chip and the other semiconductor chip C is a bad chip will be described.

[0101] As a first operation example, the transfer head 13 picks up two semiconductor chips C, transports the good chips to the precisor 20, and discards the bad chips immediately after picking them up (before transporting them to the precisor 20). The bad chips are discarded, for example, in a disposal container. That is, the transfer head 13 discards the semiconductor chips C that have been pushed up by the push-up mechanism 11 and determined to be defective by the determination unit 41.

[0102] As a second operation example, the transfer head 13 picks up two semiconductor chips C and transports them to the precisor 20. Thereafter, the mounting head 31 discards the defective chips. The defective chips are discarded, for example, in a waste container. That is, the mounting head 31 discards the semiconductor chips C that are held by the precisor 20 and that have been determined to be defective by the determination unit 41.

[0103] FIG. 15 is a cross-sectional view showing an example of the operation of the push-up mechanism 11 according to the third operation example of the ninth embodiment.

[0104] The suction collet of the transfer head 13 has a plurality of independent suction holes.

[0105] The transfer head 13 transfers the semiconductor chips C judged as non-defective by the judgment unit 41 among the semiconductor chips C pushed up by the push-up mechanism 11, and does not transfer the semiconductor chips C judged as defective by the judgment unit 41.

[0106] As a third operation example, the transfer head 13 turns off the suction corresponding to the defective chip, and picks up the good chip and transports it to the precisor 20. That is, the transfer head 13 leaves the bad chip on the dicing tape DT. Note that while the transfer head 13 still picks up the good chip, the push-up mechanism 11 pushes up the two semiconductor chips.

[0107] 15, the transfer head 13 turns on suction on the left side and turns off suction on the right side. The push-up mechanism 11 pushes up the two semiconductor chips C while the transfer head 13 still holds the non-defective chip by suction. This allows the left-side semiconductor chip C to be transferred and the right-side semiconductor chip C to remain on the dicing tape DT.

[0108] FIG. 16 is a cross-sectional view showing an example of the operation of the push-up mechanism 11 according to the fourth operation example of the ninth embodiment.

[0109] The push-up mechanism 11 pushes up the semiconductor chips C that are determined to be good by the determination unit 41 among the semiconductor chips C to be pushed up, and does not push up the semiconductor chips C that are determined to be defective by the determination unit 41. The right-side push-up member 111 and the left-side push-up member 111 can be pushed up independently of each other. The right-side push-up member 112 and the left-side push-up member 112 can be pushed up independently of each other.

[0110] In a fourth operation example, the push-up mechanism 11 pushes up the semiconductor chips C asymmetrically. More specifically, the transfer head 13 picks up two semiconductor chips C, and the push-up mechanism 11 pushes up the two semiconductor chips. After that, the push-up mechanism 11 sequentially lowers only the push-up members directly below the good chips from the outer periphery. In other words, the bad chips are left on the dicing tape DT. After that, the transfer head 13 transports the good chips to the precisor 20. Note that the transfer head 13 may turn off suction on the right side when the push-up members are lowered.

[0111] 16, the push-up members 111 and 112 on the left side do not rise, and the push-up members 111 and 112 on the right side rise. This allows the semiconductor chip C on the left side to be transferred, and the semiconductor chip C on the right side to remain on the dicing tape DT.

[0112] An example of operation when the determining unit 41 recognizes that one semiconductor chip C is a non-defective chip and the other has no semiconductor chip C, that is, when the semiconductor chip C at the end of the semiconductor wafer W is picked up will be described.

[0113] As a fifth operation example, the transfer head 13 turns off suction on the side where there is no semiconductor chip C, and transfers a non-defective chip.

[0114] In the sixth operation example, the push-up mechanism 11 performs push-up asymmetrically. After that, the transfer head 13 picks up the non-defective chip and transports it to the preciser 20.

[0115] If the determination unit 41 recognizes that the two semiconductor chips C are defective, the two defective chips are not picked up. That is, the push-up mechanism 11, the wafer holding unit 12, and the transfer head 13 move to the next two semiconductor chips C.

[0116] As in the ninth embodiment, the quality of the semiconductor chip C may be determined. In this case, the same effects as in the first embodiment can be obtained.

[0117] Although several embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These embodiments can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their modifications are included within the scope and spirit of the invention, as well as within the scope of the invention described in the claims and their equivalents. [Explanation of symbols]

[0118] 10 pickup device, 11 push-up mechanism, 111 to 113 push-up members, C semiconductor chip, 20 precision device, 30 mounting device, 40 control device, 41 determination unit, S wiring board, W semiconductor wafer

Claims

1. a push-up unit capable of pushing up adjacent electronic components among the electronic components singulated from the wafer; a transfer unit capable of transferring the plurality of electronic components pushed up by the push-up unit; an electronic component holding unit capable of holding the plurality of electronic components transferred by the transfer unit; a mounting unit that mounts the electronic component held by the electronic component holding unit onto a mounting target; Equipped with at least a part of the push-up portion is capable of pushing up the adjacent plurality of electronic components so as to straddle the adjacent plurality of electronic components on the same surface, The semiconductor manufacturing apparatus, wherein the electronic component holding unit is capable of switching between a holding state of the electronic component and a non-holding state of the electronic component for each electronic component.

2. 2. The semiconductor manufacturing apparatus according to claim 1, wherein the mounting section mounts the electronic components one by one from at least one of the electronic components held by the electronic component holding section onto the mounting object.

3. The semiconductor manufacturing apparatus according to claim 1 , further comprising a determining unit for determining whether the electronic component is good or bad.

4. 4. The semiconductor manufacturing apparatus according to claim 3, wherein the transfer unit transfers, among the electronic components pushed up by the push-up unit, those determined to be non-defective by the determination unit, and does not transfer those electronic components determined to be defective by the determination unit.

5. 4. The semiconductor manufacturing apparatus according to claim 3, wherein the push-up unit pushes up the electronic components that are determined to be good by the determination unit among the electronic components to be pushed up, and does not push up the electronic components that are determined to be defective by the determination unit.

6. The semiconductor manufacturing apparatus according to claim 5 , wherein the push-up portion pushes up the electronic component asymmetrically.

7. 4. The semiconductor manufacturing apparatus according to claim 3, wherein the transfer unit discards the electronic component that has been pushed up by the push-up unit and determined to be a defective product by the determination unit.

8. 4. The semiconductor manufacturing apparatus according to claim 3, wherein said mounting section discards said electronic component held by said electronic component holding section and determined to be defective by said determining section.

9. a thickness of the electronic component along a first direction substantially perpendicular to the wafer is 60 μm or less; the electronic component has a rectangular shape when viewed from the first direction, 2. The semiconductor manufacturing apparatus according to claim 1, wherein the short side of the electronic component is 3.0 mm or less.

10. 2. The semiconductor manufacturing apparatus according to claim 1, further comprising a wafer holder that holds the electronic components around the electronic component pushed up by the push-up portion.

11. the electronic component is a semiconductor chip, 2. The semiconductor manufacturing apparatus according to claim 1, wherein the object is a wiring board.

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