Measuring apparatus

Abstract

To enable measurement of a quantity to be measured with high accuracy in a short time, even when use of a signal for measurement of a low voltage value is required.SOLUTION: A measuring apparatus comprises: a head amplifier part HA1 that amplifies a measurement signal inputted via a probe P2 brought into contact with a substrate PCB to be measured, the substrate PCB to be measured, and a probe P1 brought into contact with the substrate PCB to be measured; a measurement part that measures a predetermined quantity to be measured of the substrate to be measured on the basis of the measurement signal amplified by the head amplifier part HA1; and a probe holder amplifier part PHA1 that amplifies the measurement signal inputted via the probe P1 and outputs it to the head amplifier part HA1. The head amplifier part HA1 is disposed on a base part 23a in a Z-axis directional moving mechanism 23-1, while the probe holder amplifier part PHA1 is disposed on a moving part 23b of the Z-axis directional moving mechanism 23-1.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a measuring device configured to be able to measure a predetermined measurement quantity of a substrate to be measured based on a measurement signal input via a probe. [Background technology]

[0002] The applicant has disclosed in the following patent document a circuit board inspection device (hereinafter simply referred to as "inspection device") that measures quantities to be measured, such as capacitance and resistance, of a circuit board to be inspected based on measurement signals input via probes, and is capable of inspecting the quality of the circuit board based on the measurement results. The inspection device disclosed by the applicant includes a board holder having an insulator (dielectric) that is brought into close contact with the underside of the circuit board and a conductive plate that is brought into close contact with the underside of the insulator, multiple movable probes, a fixed probe, a first moving mechanism that moves each movable probe, a second moving mechanism that moves the fixed probe, and a control device that moves the probes using both moving mechanisms, performs measurement processing (described below), and judges the quality of the circuit board based on the measurement results.

[0003] In this case, the first movement mechanism includes an X-axis guide and a Y-axis guide that move each of the movable probes along the surface of the circuit board. The X-axis guide of the first movement mechanism includes a movable body that supports the movable probes and a motor attached to the movable body for moving each of the movable probes in the Z-axis direction that intersects with the surface of the circuit board, and the Y-axis guide includes a motor for moving the X-axis guide in the Y-axis direction. The second movement mechanism includes an X-axis guide and a Y-axis guide that move the fixed probes along the surface of the circuit board. The X-axis guide of the second movement mechanism includes a movable body that supports the fixed probes 5, a motor attached to the movable body for moving the fixed probes in the Z-axis direction, and a motor for moving the movable body in the X-axis direction, and the Y-axis guide includes a motor for moving the X-axis guide in the Y-axis direction.

[0004] The control device also includes a CPU that controls the inspection device overall, an electrical characteristic measuring means (hereinafter simply referred to as "measuring means"), a probe movement control means (hereinafter simply referred to as "movement control means"), and a switching circuit that selectively connects one of the moving probes to the measuring means, and is arranged alongside the first and second movement mechanisms outside the movement range of each probe, as shown in Figure 1 of the same patent document.

[0005] This inspection device is configured to be able to inspect circuit boards using either of two inspection methods: a first inspection method or a second inspection method. In the first inspection method, the electrostatic capacitance between each circuit pattern on the circuit board and the conductive plate is measured, and the circuit board is inspected based on the measurement results. Specifically, the movement control means controls each movement mechanism to bring the fixed probe into contact with the conductive plate and the movable probe into contact with each circuit pattern on the circuit board in sequence, the measurement means measures the electrostatic capacitance between the conductive plate (fixed probe) and the circuit pattern (movable probe), and the CPU inspects the quality of the circuit board (circuit pattern) based on whether the measurement results by the measurement means are within an allowable range of reference data.

[0006] In addition, in a second inspection method, the resistance (or voltage) between both ends of a circuit pattern is measured, and the circuit board is inspected based on the measurement results. Specifically, for example, when inspecting a circuit pattern in which a common terminal of an integrated resistor is connected to a common pattern such as a power supply or ground, and each independent terminal of the integrated resistor is connected to a plurality of circuit patterns that are independent of each other, the movement control means brings the fixed probe into contact with the common pattern and brings the moving probe into contact with each circuit pattern in sequence, the measurement means measures the resistance (or voltage) between the patterns (between both probes), and the CPU inspects the quality of the circuit board (circuit pattern) based on whether the measurement result by the measurement means is within an allowable range of the reference data.

[0007] In this way, the inspection device disclosed by the applicant employs a configuration in which measured quantities such as capacitance and resistance values are measured based on measurement signals input via a probe, and the quality of each circuit pattern is inspected based on the measurement results, thereby making it possible to suitably inspect various circuit boards with circuit patterns of different sizes, shapes, and arrangements. [Prior art documents] [Patent documents]

[0008] [Patent Document 1] Japanese Patent Application Laid-Open No. 9-230005 (pages 4-8, figures 1-7) Summary of the Invention [Problem to be solved by the invention]

[0009] However, the inspection device disclosed by the applicant has the following problems that need to be improved.

[0010] Specifically, as described above, the inspection device disclosed by the applicant employs a configuration in which the quality of each circuit pattern is inspected based on a measured quantity measured based on a measurement signal input via a pair of independently movable probes and reference data. In this case, in the inspection device disclosed by the applicant, a measurement means (controller) for measuring capacitance, resistance, etc. is fixedly installed alongside a moving mechanism that moves each probe to input the measurement signal, outside the movable range of each probe. Therefore, in the inspection device disclosed by the applicant, the movable probe attached to the moving body of the first moving mechanism is connected to the switching circuit via a signal cable, and the fixed probe attached to the moving body of the second moving mechanism is connected to the electrical characteristic measurement circuit of the measurement means via another signal cable. This allows each probe to be moved in any X, Y, or Z direction relative to the measurement means to contact the circuit pattern of the measurement target (test target).

[0011] On the other hand, one of the objects to be inspected by this type of inspection device is a probe card used to inspect the quality of integrated circuits formed on silicon wafers at semiconductor manufacturing sites, etc. In this case, the probe card is provided with a large number of probes that can be brought into contact with each inspection point on the silicon wafer. As the integrated circuits to be inspected become finer-pitched, the probes and the connecting conductor patterns become very small and are closely arranged within a narrow range. Therefore, short circuits are easily formed between adjacent probes or adjacent conductor patterns. Therefore, to accurately inspect integrated circuits using a probe card, it is necessary to inspect the probe card itself, i.e., to inspect whether each probe and each conductor pattern is properly insulated.

[0012] Here, the applicant attempted to test a probe card using the testing device disclosed in the above-mentioned patent document. However, it was found that it was difficult to shorten the time required to measure the insulation resistance between each probe (between each conductor pattern) in the probe card using the above-mentioned testing device, and that it took a long time to test the insulation state between a large number of probes. Specifically, as mentioned above, in the probe card to be tested, each probe and connecting conductor pattern are very small and arranged closely within a narrow range. Therefore, when testing this probe card, it is necessary to input a test signal with an extremely low voltage value so as not to cause insulation breakdown of each probe or conductor pattern due to the input test signal.

[0013] On the other hand, as mentioned above, in the inspection device disclosed in the above-mentioned patent document, each probe is connected to the control device via a signal cable. In this case, in this inspection device, each probe is connected to the control device by a signal cable of sufficient length so that each probe can be moved and contacted to any position within its movable range. Therefore, the stray capacitance present in the signal cable connecting each movable probe to the switching circuit of the control device is somewhat large. For this reason, in the inspection device disclosed in the above-mentioned patent document, when a measurement signal of a low voltage value as described above is input, the resistance value of the insulation resistance is large, and the current value flowing between each probe is small. As a result, it takes a long time to charge this stray capacitance, and it is necessary to wait from the start of input of the measurement signal until a state in which an accurate measurement value (voltage value) can be measured becomes possible, making it difficult to shorten the time required to measure the resistance value between each probe (between each conductor pattern). This increases the time required to inspect all the probes and conductor patterns arranged on the probe card, and it is desirable to improve this point.

[0014] Furthermore, the testing device disclosed by the applicant may result in reduced accuracy in testing probe cards and other devices. Specifically, as described above, this testing device uses a long signal cable through which a measurement signal is conducted during testing. This means that noise components may be mixed into the measurement signal (affected by external disturbances). As described above, a low-voltage measurement signal must be used during testing of probe cards and other devices. This tends to increase the ratio of the signal level of the noise components to the signal level of the measurement signal conducted through the signal cable. Therefore, resistance and voltage values measured based on measurement signals containing such noise components may be affected by external disturbances, resulting in reduced accuracy. Therefore, testing the insulation state of a conductor pattern based on such measurements may result in reduced testing accuracy. Therefore, it is desirable to improve this aspect.

[0015] The present invention has been made in consideration of the above-mentioned problems that need to be improved, and its main object is to provide a measuring device that can measure a quantity to be measured with high accuracy in a short time, even when it is necessary to use a measurement signal with a low voltage value. [Means for solving the problem]

[0016] The measuring device according to the present invention includes a first moving mechanism configured to move a first moving body to which a first probe is attached in a direction intersecting with the surface of a substrate to be measured, thereby enabling the first probe to approach and separate from the substrate to be measured; a second moving mechanism configured to move a second moving body to which a second probe is attached in a direction intersecting with the surface of the substrate to be measured, thereby enabling the second probe to approach and separate from the substrate to be measured; a third moving mechanism configured to move a third moving body to which the first moving mechanism is attached along the surface of the substrate to be measured; and a fourth moving body to which the second moving mechanism is attached, thereby enabling the fourth moving body to approach and separate from the substrate to be measured. The measuring device is provided with a fourth moving mechanism that moves along the plate surface, a first main amplifier that is disposed on the third moving body and that amplifies the measurement signal input via the second probe that is brought into contact with the measurement target substrate, the measurement target substrate, and the first probe that is brought into contact with the measurement target substrate, a measurement unit that measures a predetermined measured quantity for the measurement target substrate based on the measurement signal amplified by the first main amplifier, and a first pre-amplifier that is disposed on the first moving body and that amplifies the measurement signal input via the first probe and outputs it to the first main amplifier.

[0017] Therefore, according to the measuring device of the present invention, the measurement signal input via the first probe is amplified by the first pre-amplifier arranged near the first probe, and the measurement signal amplified by the first pre-amplifier is amplified in the first main amplifier arranged near the first pre-amplifier, so that stray capacitance caused by the existence of a path for the measurement signal from the first pre-amplifier to the measurement unit can be charged in a short time. This significantly reduces the time required for the measurement value measured by the measurement unit to stabilize, and as a result, the quantity to be measured on the target substrate can be measured in a short time.

[0018] Furthermore, because the measurement signal is amplified near the first probe by the first pre-amplifier and the first main amplifier, even if noise components are introduced into the path after the first pre-amplifier, the ratio of the signal level of the measurement signal input to the measurement unit to the noise components is sufficiently high, thereby sufficiently reducing the influence of the noise components and enabling highly accurate measurement of the measurand. Furthermore, by arranging only the first pre-amplifier, which is part of the elements that amplify the measurement signal, on the first movable body, the total weight of the components that the first moving mechanism uses to move the first probe toward and away from the measurement target substrate can be significantly reduced compared to a configuration in which all of the elements that amplify the measurement signal are arranged on the first movable body, allowing the first probe to be moved toward and away from the measurement target substrate at high speed. This further reduces the time required to measure the measurement quantity.

[0019] In addition, the measuring device of the present invention includes a second main amplifier that is disposed on the fourth movable body and amplifies the measurement signal input via the first probe that is brought into contact with the substrate to be measured, the substrate to be measured, and the second probe that is brought into contact with the substrate to be measured; a second pre-stage amplifier that is disposed on the second movable body and amplifies the measurement signal input via the second probe and outputs it to the second main amplifier; a first passage forming circuit that forms a passage through which the measurement signal passes from the output of the first main amplifier to the input of the first pre-stage amplifier in accordance with a control signal; and a second passage forming circuit that forms a passage through which the measurement signal passes from the output of the second main amplifier to the input of the second pre-stage amplifier in accordance with the control signal.

[0020] Therefore, according to the measuring device of the present invention, the measurement signal input via the second probe is amplified by the second pre-amplifier arranged near the second probe, and the measurement signal amplified by the second pre-amplifier is amplified in the second main amplifier arranged near the second pre-amplifier, so that stray capacitance caused by the existence of a path for the measurement signal from the second pre-amplifier to the measurement unit can be charged in a short time. This significantly reduces the time required for the measurement value measured by the measurement unit to stabilize, and as a result, the quantity to be measured on the target substrate can be measured in a short time.

[0021] Furthermore, because the measurement signal is amplified near the second probe by the second pre-amplifier and the second main amplifier, even if noise components are introduced into the path after the second pre-amplifier, the ratio of the signal level of the measurement signal input to the measurement unit to the noise components is sufficiently high. As a result, the influence of the noise components is sufficiently reduced, allowing for highly accurate measurement of the measurand. Furthermore, by arranging only the second pre-amplifier, which is part of the elements that amplify the measurement signal, on the second movable body, the total weight of the components that the second moving mechanism uses to move the second probe toward and away from the measurement target substrate can be significantly reduced compared to a configuration in which all of the elements that amplify the measurement signal are arranged on the second movable body. This allows the second probe to be moved toward and away from the measurement target substrate at high speed. This further reduces the time required to measure the measurement quantity.

[0022] Furthermore, in the measuring device according to the present invention, when the control signal is output to the first passage path forming circuit, the measuring unit measures the quantity to be measured based on the measurement signal that is input from the passage path formed by the first passage path forming circuit and output via the first probe, the measurement target substrate, the second probe, the second pre-stage amplifier, and the second main amplifier, and when the control signal is output to the second passage path forming circuit, the measuring unit measures the quantity to be measured based on the measurement signal that is input from the passage path formed by the second passage path forming circuit and output via the second probe, the measurement target substrate, the first probe, the first pre-stage amplifier, and the first main amplifier.

[0023] In addition, the measuring device according to the present invention includes a processing unit that outputs the control signal to one of the first passage path forming circuit and the second passage path forming circuit, thereby passing the measurement signal through the passage formed by that one of the passage path forming circuits.

[0024] Therefore, according to the measuring device of the present invention, the quantity to be measured can be measured using either a usage mode in which the measurement signal passes through the second passage forming circuit and is input from the first probe, or a usage mode in which the measurement signal passes through the first passage forming circuit and is input from the second probe.This increases the freedom to select the contact mode of the first probe and the second probe with the substrate to be measured, and as a result, the quantity to be measured on the substrate to be measured can be measured in a short time without unnecessary movement of the first probe and the second probe by each movement mechanism.

[0025] The measuring device according to the present invention also includes a first shield body attached to the third movable body to shield the first pre-amplifier. The measuring device according to the present invention also includes a second shield body attached to the fourth movable body to shield the second pre-amplifier.

[0026] Therefore, according to the measuring device of the present invention, it is possible to effectively prevent noise components from entering the first pre-amplifier and the second pre-amplifier, thereby enabling the quantity to be measured with higher accuracy.In addition, compared to a configuration in which the first shield is arranged on the first movable body together with the first pre-amplifier, or the second shield is arranged on the second movable body together with the second pre-amplifier, the total weight of the components that the first moving mechanism and the second moving mechanism move in the direction of moving the first probe and the second probe and the first pre-amplifier and the second pre-amplifier toward and away from the substrate to be measured can be reduced by the weight of both shields.As a result, the first probe and the second probe can be moved toward and away from the substrate to be measured at high speed, thereby further reducing the time required to measure the quantity to be measured. [Effects of the Invention]

[0027] According to the measuring device of the present invention, by arranging the first main amplifier and the second main amplifier on the third moving section and the fourth moving section, respectively, and by arranging the first pre-amplifier and the second pre-amplifier on the first moving body and the second moving body, respectively, stray capacitance caused by the presence of a passage through which the measurement signal passes can be charged in a short time, and as a result, the measured value measured by the measuring section stabilizes in a short time, allowing the measurand to be measured in a short time. Furthermore, since the measurement signal is sufficiently amplified near the first probe and the second probe and the signal level is high, the influence of noise components can be sufficiently reduced, allowing the measurand to be measured with high accuracy. [Brief explanation of the drawings]

[0028] [Figure 1] FIG. 1 is a configuration diagram showing the configuration of a substrate inspection system 100. [Figure 2] FIG. 2 is a diagram showing the configuration of an XYZ movement mechanism 12. [Figure 3]10 is an explanatory diagram for explaining the positional relationship between the Y-axis direction moving mechanisms 22-1, 22-2 and the Z-axis direction moving mechanisms 23-1, 23-2 in the XYZ moving mechanism 12, and the probes P1, P2, head amplifier units HA1, HA2, probe holder amplifier units PHA1, PHA2, and the shield 33. [Figure 4] 1 is an equivalent circuit diagram in a state where probes P1 and P2 are brought into contact with patterns PT1 and PT2, respectively, of a substrate PCB to be inspected. [Figure 5] FIG. 10 is an equivalent circuit diagram in a state where probes P1 and P2 are in contact with patterns PT1 and PT3, respectively, of a substrate PCB to be inspected. DETAILED DESCRIPTION OF THE INVENTION

[0029] Hereinafter, an embodiment of the measuring device will be described with reference to the accompanying drawings.

[0030] The board inspection system 100 shown in FIG. 1 is a system configured to be able to inspect a target board PCB as an inspection object and inspect whether it is good or bad, and includes a measuring device 1 and a processing device 2.

[0031] In this case, the test target substrate PCB is a probe card, which is an example of a "measurement target substrate," and is provided with a number of probes (not shown) that can be brought into contact with a number of test points defined on a silicon wafer when testing the silicon wafer (integrated circuits on the silicon wafer) using this test target substrate PCB, and a number of patterns PT1, PT2, etc. (see Figures 4 and 5; hereinafter, they will also be referred to as "patterns PT" when not being distinguished) for connecting each probe to a silicon wafer testing device.

[0032] On the other hand, the measuring device 1 is an example of a "measuring device" and includes a substrate holding unit 11, an XYZ movement mechanism 12, a measurement unit 13, and a control unit 14. Under the control of the control unit 14, the substrate holding unit 11 holds and positions the substrate PCB to be inspected at an inspection position (measurement position) defined within the movement area of the probes P1 and P2 by the XYZ movement mechanism 12. As shown in FIGS. 2 and 3, the XYZ movement mechanism 12 includes X-axis movement mechanisms 21-1 and 21-2, Y-axis movement mechanisms 22-1 and 22-2, and Z-axis movement mechanisms 23-1 and 23-2. Note that the X-axis movement mechanisms 21-1 and 21-2 are not shown in FIG. 3.

[0033] Each of the X-axis direction moving mechanisms 21-1 and 21-2 includes a base 21a and a moving unit 21b. The X-axis direction moving mechanism 21-1 is configured to be able to move the Y-axis direction moving mechanism 22-1 attached to the moving unit 21b in the direction of the arrow X along the surface of the inspection target substrate PCB held by the substrate holding unit 11, and the X-axis direction moving mechanism 21-2 is configured to be able to move the Y-axis direction moving mechanism 22-2 attached to the moving unit 21b in the direction of the arrow X along the surface of the inspection target substrate PCB.

[0034] The Y-axis direction moving mechanisms 22-1 and 22-2 each include a base 22a and a moving section 22b. The Y-axis direction moving mechanism 22-1 is configured to be able to move the Z-axis direction moving mechanism 23-1 attached to the moving section 22b in the direction of arrow Y along the surface of the inspection target substrate PCB, and the Y-axis direction moving mechanism 22-2 is configured to be able to move the Z-axis direction moving mechanism 23-2 attached to the moving section 22b in the direction of arrow Y along the surface of the inspection target substrate PCB.

[0035] The Z-axis direction moving mechanisms 23-1 and 23-2 each include a base 23a and a moving section 23b. The Z-axis direction moving mechanism 23-1 is configured to be able to move a probe P1 attached to the moving section 23b via a probe holder PH1 (see FIG. 3) in the direction of arrow Z that intersects with the surface of the test target substrate PCB (the probe P1 can be moved toward and away from the test target substrate PCB), and the Z-axis direction moving mechanism 23-2 is configured to be able to move a probe P2 attached to the moving section 23b via a probe holder PH2 (see FIG. 3) in the direction of arrow Z that intersects with the surface of the test target substrate PCB (the probe P2 can be moved toward and away from the test target substrate PCB).

[0036] In this case, in the measuring device 1 (substrate inspection system 100) of this example, the probe P1 constitutes the "first probe," the Z-axis direction moving mechanism 23-1 constitutes the "first moving mechanism," and the moving part 23b of the Z-axis direction moving mechanism 23-1 and the probe holder PH1 together constitute the "first moving body." Also, in the measuring device 1 (substrate inspection system 100) of this example, the probe P2 constitutes the "second probe," the Z-axis direction moving mechanism 23-2 constitutes the "second moving mechanism," and the moving part 23b of the Z-axis direction moving mechanism 23-2 and the probe holder PH2 together constitute the "second moving body."

[0037] Furthermore, in the measuring device 1 (substrate inspection system 100) of this example, the X-axis direction moving mechanism 21-1 and the Y-axis direction moving mechanism 22-1 together constitute a “third moving mechanism,” and the moving section 22b of the Y-axis direction moving mechanism 22-1 and the base section 23a of the Z-axis direction moving mechanism 23-1 together constitute a “third moving body.” Furthermore, in the measuring device 1 (substrate inspection system 100) of this example, the X-axis direction moving mechanism 21-2 and the Y-axis direction moving mechanism 22-2 together constitute a “fourth moving mechanism,” and the moving section 22b of the Y-axis direction moving mechanism 22-2 and the base section 23a of the Z-axis direction moving mechanism 23-2 together constitute a “fourth moving body.”

[0038] The measurement unit 13 is an example of a "measurement unit" and includes head amplifier units HA1 and HA2, probe holder amplifier units PHA1 and PHA2, a measurement board 31, and a scanner board 32, as shown in FIGS.

[0039] The head amplifier section HA1 is an example of a "first main amplifier" and includes relays R1-1 to R1-4 (hereinafter also referred to as "relay R1" when not distinguishing between them) and a head amplifier A2-1, as shown in Figures 4 and 5. This head amplifier section HA1 is covered by a shielding case (not shown), and as shown in Figures 2 and 3, is disposed on the base 23a of the Z-axis direction moving mechanism 23-1 fixed to the moving part 22b of the Y-axis direction moving mechanism 22-1, and is configured so that the head amplifier A2-1 can amplify the voltage or current of a "measurement signal" input via the probe P2 in contact with the test target board PCB, the test target board PCB, and the probe P1 in contact with the test target board PCB, as shown in Figure 4.

[0040] The head amplifier section HA2 is an example of a "second main amplifier" and includes relays R2-1 to R2-4 (hereinafter also referred to as "relay R2" when not distinguishing between them) and a head amplifier A2-2, as shown in Figures 4 and 5. This head amplifier section HA2 is covered by a shielding case (not shown), and as shown in Figures 2 and 3, is disposed on base 23a of Z-axis direction movement mechanism 23-2 fixed to moving section 22b of Y-axis direction movement mechanism 22-2, and is configured so that, as shown in Figure 5, the head amplifier A2-2 can amplify the voltage or current of a "measurement signal" input via probe P1 in contact with the test target board PCB, the test target board PCB, and probe P2 in contact with the test target board PCB.

[0041] The probe holder amplifier section PHA1 is an example of a "first pre-stage amplifier" and includes a probe holder amplifier A1-1 as shown in Figures 4 and 5. As shown in Figures 2 and 3, this probe holder amplifier section PHA1 is disposed on the moving section 23b of the Z-axis direction moving mechanism 23-1, and is configured to be able to voltage-amplify or current-amplify a "measurement signal" input via the probe P1 by the probe holder amplifier A1-1 and output the amplified signal to the head amplifier section HA1 as shown in Figure 4.

[0042] The probe holder amplifier section PHA2 is an example of a "second pre-stage amplifier" and includes a probe holder amplifier A1-2 as shown in Figures 4 and 5. As shown in Figures 2 and 3, this probe holder amplifier section PHA2 is disposed in the moving section 23b of the Z-axis direction moving mechanism 23-2, and is configured to be able to voltage-amplify or current-amplify a "measurement signal" input via probe P2 by the probe holder amplifier A1-2 and output the amplified signal to the head amplifier section HA2 as shown in Figure 5.

[0043] 3, in the measuring device 1 (substrate inspection system 100) of this example, a shield 33, which is an example of a "first shield body" that shields the probe holder amplifier unit PHA1, is attached to the base 23a of the Z-axis direction moving mechanism 23-1, and a shield 33, which is an example of a "second shield body" that shields the probe holder amplifier unit PHA2, is attached to the base 23a of the Z-axis direction moving mechanism 23-2. In the measuring device 1 (substrate inspection system 100) of this example, probes P1 and P2 are attached via probe holders PH1 and PH2 below the probe holder amplifier units PHA1 and PHA2 attached to the moving units 23b of the Z-axis direction moving mechanisms 23-1 and 23-2, respectively.

[0044] In this case, in the measuring device 1 (substrate inspection system 100) of this example, the probe holder amplifier units PHA1 and PHA2 are moved together with the probes P1 and P2 by the Z-axis direction movement mechanisms 23-1 and 23-2 in the direction of the arrow Z. For this reason, the shield 33 attached to the base 23a to shield these is formed to be sufficiently long in the direction of the arrow Z so that the probe holder amplifier units PHA1 and PHA2 can be kept in an appropriately shielded state when the probes P1 and P2 are moved by the Z-axis direction movement mechanisms 23-1 and 23-2.

[0045] 4 and 5, the measurement board 31 includes a voltage output circuit 31a and a current measurement circuit 31b. In this measurement board 31, the voltage output circuit 31a outputs a measurement voltage V of a voltage value (for example, about 10 V) that will not cause dielectric breakdown of the pattern PT or probes on the test target substrate PCB, and the current measurement circuit 31b measures the current values (one example of a "predetermined measurement quantity for the test target substrate") of currents I1 and I2 flowing through current paths IR1 and IR2, which will be described later, and outputs current value data Di indicating the measurement results to the control unit 14.

[0046] As shown in Figures 4 and 5, the scanner board 32 has relays R3-1 to R3-4 (hereinafter, also referred to as "relay R3" when not distinguishing between them), and each relay R3 switches the connection state between the head amplifier units HA1, HA2 and the measurement board 31 (voltage output circuit 31a and current measurement circuit 31b) in accordance with a control signal Sc from the control unit 14.

[0047] In this case, in the measuring device 1 (substrate inspection system 100) of this example, the circuit configured with relays R3-1, R1-1, and R1-4 that forms a "passage path PW1 (see Figure 5)" that passes the "measurement signal" from the output part of the head amplifier part HA1 (head amplifier A2-1) to the input part of the probe holder amplifier part PHA1 (probe holder amplifier A1-1) without amplifying the "measurement signal" by the head amplifier part HA1 (head amplifier A2-1) and the probe holder amplifier part PHA1 (probe holder amplifier A1-1) corresponds to the "first passage path forming circuit." Furthermore, in the measuring device 1 (substrate inspection system 100) of this example, the "second passage path forming circuit" corresponds to a circuit configured with relays R3-3, R2-1, and R2-4 that forms a "passage path PW2 (see Figure 4)" that passes the "measurement signal" from the output part of the head amplifier part HA2 (head amplifier A2-2) to the input part of the probe holder amplifier part PHA2 (probe holder amplifier A1-2) without amplifying the "measurement signal" by the head amplifier part HA2 (head amplifier A2-2) and the probe holder amplifier part PHA2 (probe holder amplifier A1-2).

[0048] The control unit 14 is an example of a "processing unit" and controls the operation of each unit of the measurement device 1. Specifically, the control unit 14 controls the movement of the probes P1 and P2 by the XYZ movement mechanism 12, the switching of the relays R1 to R3 between the ON state and the OFF state, and the output of the measurement voltage V (measurement signal) from the voltage output circuit 31a. The control unit 14 also calculates the resistance value R between the patterns PT and PT with which the probes P1 and P2 are in contact (another example of a "predetermined measurement quantity for the measurement target substrate") based on the voltage value of the measurement voltage V output from the voltage output circuit 31a and the current value determined based on the current value data Di output from the current measurement circuit 31b, thereby generating resistance value data Dr and outputting the generated resistance value data Dr to the processing device 2.

[0049] In the measuring device 1 (substrate inspection system 100) of this example, the measurement board 31 and scanner board 32 in the measuring unit 13 and the control unit 14 are fixedly installed outside the range in which the probes P1 and P2 can be moved by the XYZ movement mechanism 12.

[0050] The processing device 2 controls the measuring device 1 to measure the resistance value (value of the resistance value data Dr). The processing device 2 also inspects whether the insulation state between the patterns PT, PT·· on the inspection target substrate PCB, whose resistance value has been measured by the measuring device 1, is good or not, based on the value of the comparison data acquired from the inspection target substrate PCB, which is a good product, and the resistance value of the insulation resistance R specified based on the resistance value data Dr output from the measuring device 1.

[0051] Next, a method for inspecting the inspection target substrate PCB using the substrate inspection system 100 will be described with reference to the accompanying drawings.

[0052] First, the inspection target substrate PCB is held at a predetermined inspection position by the substrate holder 11. Next, the control unit 14 controls the XYZ movement mechanism 12 to bring the probes P1 and P2 into contact with the patterns PT and PT whose insulation state is to be inspected, respectively.

[0053] 4, when inspecting the insulation state between patterns PT1 and PT2 (probes, not shown, connected to patterns PT1 and PT2) on the inspection target substrate PCB, as an example, X-axis direction movement mechanism 21-1, Y-axis direction movement mechanism 22-1, and Z-axis direction movement mechanism 23-1 move probe P1 to contact pattern PT1, and X-axis direction movement mechanism 21-2, Y-axis direction movement mechanism 22-2, and Z-axis direction movement mechanism 23-2 move probe P2 to contact pattern PT2. Note that the process of moving probes P1 and P2 (contacting pattern PT) by XYZ movement mechanism 12 is well known, so a detailed description thereof will be omitted.

[0054] Next, the control unit 14 outputs a control signal Sc to the measurement unit 13, thereby transitioning the state in which the current I1 passes through the aforementioned current passage IR1 as the "passage path" when the measurement voltage V is output from the voltage output circuit 31a. Specifically, the control unit 14 transitions the relays R3-4, R2-3, R2-2, R1-4, R1-1, and R3-1 to the OFF state, and transitions the relays R3-3, R2-1, R2-4, R1-2, R1-3, and R3-2 to the ON state. This forms a current path IR1 consisting of the output section of voltage output circuit 31a, relays R3-3, R2-1, R2-4, probe P2, pattern PT2, insulation resistance R, pattern PT1, probe P1, probe holder amplifier section PHA1 (probe holder amplifier A1-1), head amplifier section HA1 (relay R1-2, head amplifier A2-1 and relay R1-3) and relay R3-2, and when measurement voltage V is output from voltage output circuit 31a, head amplifier section HA2 (head amplifier A2-2) and probe holder amplifier section PHA2 (probe holder amplifier A1-2) do not function as an "amplifier" (i.e., current I1 does not pass through head amplifier A2-2 and probe holder amplifier A1-2), and current I1 is amplified by probe holder amplifier section PHA1 (probe holder amplifier A1-1) and head amplifier section HA1 (head amplifier A2-1).

[0055] Next, the control unit 14 causes the voltage output circuit 31a to output the measurement voltage V. At this time, the current I1 output from the voltage output circuit 31a passes through the passage PW2 and the insulation resistance R (the resistance component between the patterns PT1 and PT2) between the patterns PT2 and PT1 on the test target substrate PCB, and is input from the test target substrate PCB (pattern PT1) to the probe P1. The current I1 input to the probe P1 is amplified by the probe holder amplifier A1-1 in the probe holder amplifier unit PHA1, and then input to the head amplifier A2-1 in the head amplifier unit HA1 via the relay R1-2 and amplified therein, and then passes through relays R1-3 and R3-2 to be input to the current measurement circuit 31b of the measurement board 31.

[0056] As a result, the current measurement circuit 31b measures the voltage value of the measurement voltage V output from the voltage output circuit 31a and the current value corresponding to the resistance value of the insulation resistance R between the patterns PT1 and PT2, and current value data Di indicating the measurement result is output from the current measurement circuit 31b to the control unit 14 (an example of a process in which "when a control signal is output to the second passage path forming circuit, the quantity to be measured is measured based on the measurement signal that is input from the passage path formed by the second passage path forming circuit and output via the second probe, the measurement target substrate, the first probe, the first pre-amplifier, and the first main amplifier"). Furthermore, the control unit 14 measures (calculates) the resistance value of the insulation resistance R between the patterns PT1 and PT2 with which the probes P1 and P2 are in contact, based on the current value determined based on the current value data Di output from the current measurement circuit 31b and the voltage value of the measurement voltage V output from the voltage output circuit 31a, and generates resistance value data Dr indicating the measurement result and outputs it to the processing device 2.

[0057] Furthermore, based on the resistance value data Dr output from the measuring device 1 (controller 14) and the comparison data, the processing device 2 inspects that the insulation state between the patterns PT1 and PT2 is good when the resistance value determined based on the resistance value data Dr is equal to or greater than the allowable resistance value between the patterns PT1 and PT2 determined based on the comparison data, and inspects that the insulation state between the patterns PT1 and PT2 is poor when the resistance value determined based on the resistance value data Dr is below the allowable resistance value. This completes the inspection of the insulation state between the patterns PT1 and PT2.

[0058] On the other hand, as shown in FIG. 5, when inspecting the insulation state between patterns PT1 and PT3 (probes, not shown, connected to patterns PT1 and PT3) on the inspection target substrate PCB, as an example, while maintaining probe P1 in contact with pattern PT1, probe P2 is moved to contact pattern PT3 by X-axis direction moving mechanism 21-2, Y-axis direction moving mechanism 22-2, and Z-axis direction moving mechanism 23-2.

[0059] Next, control unit 14 outputs a control signal Sc to measurement unit 13, thereby transitioning the state in which current I2 passes through current path IR2 as the "passage path" when measurement voltage V is output from voltage output circuit 31a. Specifically, control unit 14 transitions relays R3-2, R1-3, R1-2, R2-4, R2-1, and R3-3 to the OFF state, and transitions relays R3-1, R1-1, R1-4, R2-2, R2-3, and R3-4 to the ON state. This forms a current path IR2 consisting of the output section of voltage output circuit 31a, relays R3-1, R1-1, R1-4, probe P1, pattern PT1, insulation resistance R, pattern PT3, probe P2, probe holder amplifier section PHA2 (probe holder amplifier A1-2), head amplifier section HA2 (relay R2-2, head amplifier A2-2 and relay R2-3) and relay R3-4, and when measurement voltage V is output from voltage output circuit 31a, head amplifier section HA1 (head amplifier A2-1) and probe holder amplifier section PHA1 (probe holder amplifier A1-1) do not function as an "amplifier" (i.e., current I2 does not pass through head amplifier A2-1 and probe holder amplifier A1-1), and current I2 is amplified by probe holder amplifier section PHA2 (probe holder amplifier A1-2) and head amplifier section HA2 (head amplifier A2-2).

[0060] Next, the control unit 14 causes the voltage output circuit 31a to output the measurement voltage V. At this time, the current I1 output from the voltage output circuit 31a passes through the passage PW2 and the insulation resistance R (the resistance component between the patterns PT1 and PT3) between the patterns PT1 and PT3 on the test target substrate PCB, and is input from the test target substrate PCB (pattern PT3) to the probe P2. The current I2 input to the probe P2 is amplified by the probe holder amplifier A1-2 in the probe holder amplifier unit PHA2, input to the head amplifier A2-2 in the head amplifier unit HA2 via the relay R2-2 and amplified there, and then passes through relays R2-3 and R3-4 to be input to the current measurement circuit 31b of the measurement board 31.

[0061] As a result, the current measurement circuit 31b measures the voltage value of the measurement voltage V output from the voltage output circuit 31a and the current value corresponding to the resistance value of the insulation resistance R between the patterns PT1 and PT3, and current value data Di indicating the measurement result is output from the current measurement circuit 31b to the control unit 14 (an example of a process in which "when a control signal is output to the first passage path forming circuit, the quantity to be measured is measured based on the measurement signal that is input from the passage path formed by the first passage path forming circuit and output via the first probe, the measurement target substrate, the second probe, the second pre-amplifier, and the second main amplifier"). Furthermore, the control unit 14 measures (calculates) the resistance value of the insulation resistance R between the patterns PT1 and PT3 with which the probes P1 and P2 are in contact, based on the current value determined based on the current value data Di output from the current measurement circuit 31b and the voltage value of the measurement voltage V output from the voltage output circuit 31a, and generates resistance value data Dr indicating the measurement result and outputs it to the processing device 2.

[0062] Furthermore, based on the resistance value data Dr output from the measuring device 1 (controller 14) and the comparison data, the processing device 2 inspects that the insulation state between the patterns PT1 and PT3 is good when the resistance value determined based on the resistance value data Dr is equal to or greater than the allowable resistance value between the patterns PT1 and PT3 determined based on the comparison data, and inspects that the insulation state between the patterns PT1 and PT3 is poor when the resistance value determined based on the resistance value data Dr is below the allowable resistance value. This completes the inspection of the insulation state between the patterns PT1 and PT3.

[0063] Thereafter, the control unit 14 performs a process of measuring the resistance values of the insulation resistance R between other patterns PT, PT in the same manner as the process of measuring the resistance value of the insulation resistance R between the patterns PT1, PT2 and between the patterns PT1, PT3, and outputs the generated resistance value data Dr to the processing device 2 each time. Furthermore, each time resistance value data Dr is output from the measuring device 1 (control unit 14), the processing device 2 inspects the insulation state between the patterns PT, PT based on the output resistance value data Dr and comparison data. Note that the inspection of the insulation state between each of the patterns PT, PT... in the processing device 2 is not limited to the configuration in which the inspection is performed each time resistance value data Dr for any of the patterns PT, PT is output from the measuring device 1, as in the above example. Alternatively, a configuration in which the inspection is performed collectively between all of the patterns PT, PT to be inspected on the inspection target substrate PCB when resistance value data Dr for all of the patterns PT, PT to be inspected is output from the measuring device 1 may be adopted.

[0064] In this case, the measuring device 1 (substrate inspection system 100) of this example employs a configuration in which, with the current passage IR2 formed as described above (see FIG. 4), a measurement voltage V is output from the voltage output circuit 31a, and the current value of the current I1 amplified by the probe holder amplifier unit PHA1 and the head amplifier unit HA1 is measured by the current measurement circuit 31b. Also, in the measuring device 1 (substrate inspection system 100) of this example, the probe holder amplifier unit PHA1, which amplifies the current I1 input from the inspection target substrate PCB via the probe P1, is disposed together with the probe P1 on the moving unit 23b of the Z-axis direction moving mechanism 23-1, and the distance between the probe P1 and the probe holder amplifier A1-1 of the probe holder amplifier unit PHA1 is very short.

[0065] Therefore, the path through which the current I1, which has a low signal level and is input from the test target substrate PCB (pattern PT1) to the measuring device 1 (probe P1), passes is very short, and the stray capacitance caused by the existence of this path is sufficiently small, so that even the current I1, which has a low signal level (a small current value), can be charged in a short time. Furthermore, because this path is very short, the influence of noise on the current I1 input to the probe holder amplifier A1-1 is sufficiently kept low. Furthermore, the current I1 input from the probe P1 is immediately amplified in the probe holder amplifier section PHA1, and the current I1, which has a high signal level (a large current value), is input to the head amplifier section HA1. Therefore, the stray capacitance caused by the existence of the path through which the current I1 passes from the probe holder amplifier section PHA1 (probe holder amplifier A1-1) to the head amplifier section HA1 (head amplifier A2-1), can be charged in a short time.

[0066] Furthermore, in the measuring device 1 (substrate inspection system 100) of this example, even if noise components are mixed into the passage between the probe holder amplifier section PHA1 (probe holder amplifier A1-1) and the head amplifier section HA1 (head amplifier A2-1), the current I1 passing through this passage is sufficiently amplified by the probe holder amplifier section PHA1, and therefore the ratio of the signal level of the current I1 passing through this passage to the noise components (S / N) is sufficiently increased.

[0067] Furthermore, in the measuring device 1 (substrate inspection system 100) of this example, a head amplifier unit HA1 that further amplifies the current I1 amplified by the probe holder amplifier unit PHA1 is disposed on the base 23a of the Z-axis direction moving mechanism 23-1. In this case, the amount of movement of the probe P1 in the Z-axis direction (the direction in which the probe P1 is moved toward or away from the test target substrate PCB: the direction of arrow Z shown in FIG. 3) by the Z-axis direction moving mechanism 23-1 is very small, and therefore the amount of displacement of the moving unit 23b in the Z-axis direction moving mechanism 23-1 relative to the base 23a is also small. For this reason, the signal cable connecting the head amplifier unit HA1 disposed on the base 23a and the probe holder amplifier unit PHA1 disposed on the moving unit 23b is also very short.

[0068] Therefore, the path (between the probe holder amplifier A1-1 and the head amplifier A2-1) through which the current I1, which has been amplified by the probe holder amplifier unit PHA1 (the probe holder amplifier A1-1) and whose signal level has been increased to a certain extent, passes is very short, and the stray capacitance resulting from the existence of this path is also sufficiently small, so that even the current I1, which has a somewhat low signal level, can be charged in a short time. Furthermore, the current I1, which has been amplified by the probe holder amplifier unit PHA1 and whose signal level has been increased to a certain extent, is amplified by the head amplifier unit HA1 and input to the measurement board 31 (current measurement circuit 31b) with its signal level being sufficiently high, so that the stray capacitance resulting from the existence of the path through which the current I1 passes, from the head amplifier unit HA1 (the head amplifier A2-1) to the current measurement circuit 31b, can be charged in a short time.

[0069] Furthermore, in the measuring device 1 (substrate inspection system 100) of this example, even if noise components are mixed into the passage between the head amplifier unit HA1 (head amplifier A2-1) and the measurement board 31 (current measurement circuit 31b), the current I1 passing through this passage is sufficiently amplified by the head amplifier unit HA1, and therefore the ratio of the signal level of the current I1 passing through this passage to the noise components (S / N) is sufficiently increased.

[0070] Furthermore, the measuring device 1 (substrate inspection system 100) of this example employs a configuration in which, with the current passage IR1 formed as described above (see FIG. 5), a measurement voltage V is output from the voltage output circuit 31a, and the current value of the current I2 amplified by the probe holder amplifier unit PHA2 and the head amplifier unit HA2 is measured by the current measurement circuit 31b. Furthermore, in the measuring device 1 (substrate inspection system 100) of this example, the probe holder amplifier unit PHA2, which amplifies the current I2 input from the inspection target substrate PCB via the probe P2, is disposed together with the probe P2 on the moving unit 23b of the Z-axis direction moving mechanism 23-2, and the distance between the probe P2 and the probe holder amplifier A1-2 of the probe holder amplifier unit PHA2 is very short.

[0071] Therefore, the path through which the current I2 with a low signal level input from the test target substrate PCB (pattern PT1) to the measurement device 1 (probe P2) passes is very short, and the stray capacitance caused by the existence of this path is sufficiently small, so that even the current I2 with a low signal level (small current value) can be charged in a short time. Furthermore, because this path is very short, the influence of noise on the current I2 input to the probe holder amplifier A1-2 is sufficiently kept low. Furthermore, the current I2 input from the probe P2 is immediately amplified in the probe holder amplifier unit PHA2, and the current I2 with a high signal level (large current value) is input to the head amplifier unit HA2. Therefore, the stray capacitance caused by the existence of the path through which the current I2 passes from the probe holder amplifier unit PHA2 (probe holder amplifier A1-2) to the head amplifier unit HA2 (head amplifier A2-2) can be charged in a short time.

[0072] Furthermore, in the measuring device 1 (substrate inspection system 100) of this example, even if noise components are mixed into the passage between the probe holder amplifier section PHA2 (probe holder amplifier A1-2) and the head amplifier section HA2 (head amplifier A2-2), the current I2 passing through this passage is sufficiently amplified by the probe holder amplifier section PHA2, and therefore the ratio of the signal level (S / N) of the current I1 passing through this passage to the noise components is sufficiently increased.

[0073] Furthermore, in the measuring device 1 (substrate inspection system 100) of this example, a head amplifier unit HA2 that further amplifies the current I2 amplified by the probe holder amplifier unit PHA2 is disposed on the base 23a of the Z-axis direction moving mechanism 23-2. In this case, the amount of movement of the probe P2 in the Z-axis direction (the direction in which the probe P2 is moved toward or away from the test target substrate PCB: the direction of arrow Z shown in FIG. 3) by the Z-axis direction moving mechanism 23-2 is very small, and therefore the amount of displacement of the moving unit 23b of the Z-axis direction moving mechanism 23-2 relative to the base 23a is also small. For this reason, the signal cable connecting the head amplifier unit HA2 disposed on the base 23a and the probe holder amplifier unit PHA2 disposed on the moving unit 23b is also very short.

[0074] Therefore, the path (between probe holder amplifier A1-2 and head amplifier A2-2) through which current I2, which has been amplified by probe holder amplifier section PHA2 (probe holder amplifier A1-2) and has a somewhat high signal level, passes is very short, and the stray capacitance caused by the existence of this path is also sufficiently small, so that even current I2, which has a somewhat low signal level, can be charged in a short time. Furthermore, current I2, which has been amplified by probe holder amplifier section PHA2 and has a somewhat high signal level, is amplified by head amplifier section HA2 and input to measurement board 31 (current measurement circuit 31b) with its signal level being sufficiently high, so that the stray capacitance caused by the existence of the path through which current I2 passes from head amplifier section HA2 (head amplifier A2-2) to current measurement circuit 31b can be charged in a short time.

[0075] Furthermore, in the measuring device 1 (substrate inspection system 100) of this example, even if noise components are mixed into the passage between the head amplifier unit HA2 (head amplifier A2-2) and the measurement board 31 (current measurement circuit 31b), the current I2 passing through this passage is sufficiently amplified by the head amplifier unit HA2, and therefore the ratio of the signal level of the current I2 passing through this passage to the noise components (S / N) is sufficiently increased.

[0076] Therefore, in the measuring device 1 (board inspection system 100) of this example, even when a measurement voltage V of a very low voltage value is used so as not to cause insulation breakdown of the board PCB to be inspected, the stray capacitance caused by the presence of each wiring is charged in a short time, and the time required for the measurement value (current values of currents I1 and I2) measured by the current measurement circuit 31b to reach a stable state is sufficiently shortened, and the influence of the inclusion of noise components is sufficiently reduced by the amount that the path through which the currents I1 and I2 of very low signal levels pass is shortened.

[0077] As described above, this measurement device 1 (substrate inspection system 100) includes an XYZ movement mechanism 12 that brings the probes P1 and P2 into contact with the patterns PT, PT, etc. of the inspection target substrate PCB, a head amplifier unit HA1 that amplifies a "measurement signal (current I1)" input via the probe P2 that has been brought into contact with the inspection target substrate PCB, the inspection target substrate PCB, and the probe P1 that has been brought into contact with the inspection target substrate PCB, and a measurement unit 13 that measures a predetermined "measurement quantity (current value of current I1)" for the inspection target substrate PCB based on the "measurement signal" amplified by the head amplifier unit HA1. (voltage output circuit 31a and current measurement circuit 31b of measurement board 31, or voltage output circuit 31a, current measurement circuit 31b and control unit 14), and a probe holder amplifier unit PHA1 that amplifies the "measurement signal" input via probe P1 and outputs it to the head amplifier unit HA1, and the head amplifier unit HA1 is arranged on the "third moving body (base 23a of Z-axis direction moving mechanism 23-1 in XYZ moving mechanism 12)" and the probe holder amplifier unit PHA1 is arranged on the "first moving body (moving part 23b of Z-axis direction moving mechanism 23-1 in XYZ moving mechanism 12)".

[0078] Therefore, according to this measuring device 1 (substrate inspection system 100), the current I1 input via the probe P1 is amplified by the probe holder amplifier unit PHA1 arranged near the probe P1, and the current I1 amplified by the probe holder amplifier unit PHA1 is amplified in the head amplifier unit HA1 arranged near the probe holder amplifier unit PHA1, so that the stray capacitance resulting from the existence of a path (e.g., a coaxial cable) through which the current I1 passes from the probe holder amplifier unit PHA1 to the current measurement circuit 31b can be charged in a short time. This sufficiently reduces the time required for the measurement value (current value) measured by the current measurement circuit 31b to stabilize, and as a result, the resistance value of the insulation resistance R between the patterns PT and PT can be measured in a short time.

[0079] Furthermore, since the current I1 is amplified in the vicinity of the probe P1 by the probe holder amplifier section PHA1 and the head amplifier section HA1, even if noise components are mixed into the path after the probe holder amplifier section PHA1, the ratio of the signal level of the current I1 to the noise components input to the current measurement circuit 31b (S / N) becomes sufficiently high, and as a result, the influence of the mixed-in noise components is sufficiently reduced, allowing the resistance value of the insulation resistance R between the patterns PT, PT to be measured with high accuracy. Furthermore, by arranging only the probe holder amplifier section PHA1, which is part of the elements that amplify the current I1, on the "first moving body (in this example, the moving section 23b of the Z-axis direction moving mechanism 23-1)," the total weight of the components that the Z-axis direction moving mechanism 23-1 moves the probe P1 in the direction in which it moves toward or away from the test target substrate PCB can be significantly reduced compared to a configuration in which all of the elements that amplify the current I1 (the amplifiers corresponding to the probe holder amplifier A1-1 and the head amplifier A2-1) are arranged on the "first moving body." This allows the probe P1 to move toward or away from the test target substrate PCB (pattern PT) at high speed. This further reduces the time required to measure the resistance value data Dr.

[0080] Furthermore, in this measuring device 1 (substrate inspection system 100), there are provided a head amplifier section HA2 that amplifies a "measurement signal (current I2)" input via a probe P1 that is brought into contact with a substrate PCB to be inspected, the substrate PCB to be inspected, and a probe P2 that is brought into contact with the substrate PCB to be inspected, a probe holder amplifier section PHA2 that amplifies the "measurement signal" input via the probe P2 and outputs it to the head amplifier section HA2, and a "first passage path forming circuit (relay)" that forms a passage PW1 that passes the "measurement signal" from the output section of the head amplifier section HA1 (head amplifier A2-1) to the input section of the probe holder amplifier section PHA1 (probe holder amplifier A1-1) in accordance with a control signal Sc from the control section 14. and a "second passage forming circuit (circuit comprising relays R3-3, R2-1, R2-4)" which forms a passage PW2 for passing the "measurement signal" from the output part of the head amplifier part HA2 (head amplifier A2-1) to the input part of the probe holder amplifier part PHA2 (probe holder amplifier A1-2) in accordance with a control signal Sc, and the head amplifier part HA2 is disposed on the "fourth moving body (base 23a of the Z-axis direction moving mechanism 23-2 in the XYZ moving mechanism 12)", and the probe holder amplifier part PHA2 is disposed on the "second moving body (moving part 23b of the Z-axis direction moving mechanism 23-2 in the XYZ moving mechanism 12)".

[0081] Therefore, according to this measuring device 1 (substrate inspection system 100), the current I2 input via the probe P2 is amplified by the probe holder amplifier unit PHA2 arranged near the probe P2, and the current I2 amplified by the probe holder amplifier unit PHA2 is amplified in the head amplifier unit HA2 arranged near the probe holder amplifier unit PHA2, so that the stray capacitance resulting from the existence of a path (e.g., a coaxial cable) through which the current I2 passes from the probe holder amplifier unit PHA2 to the current measurement circuit 31b can be charged in a short time. This sufficiently reduces the time required for the measurement value (current value) measured by the current measurement circuit 31b to stabilize, and as a result, the resistance value of the insulation resistance R between the patterns PT and PT can be measured in a short time.

[0082] Furthermore, since the current I2 is amplified in the vicinity of the probe P2 by the probe holder amplifier section PHA2 and the head amplifier section HA2, even if noise components are mixed into the path after the probe holder amplifier section PHA2, the ratio of the signal level of the current I2 input to the current measurement circuit 31b to the noise components (S / N) becomes sufficiently high, and as a result, the influence of the mixed-in noise components is sufficiently reduced, allowing the resistance value of the insulation resistance R between the patterns PT, PT to be measured with high accuracy. Furthermore, by arranging only the probe holder amplifier section PHA2, which is part of the elements that amplify the current I2, on the "second moving body (in this example, the moving section 23b of the Z-axis direction moving mechanism 23-2)," the total weight of the components that move the probe P2 in the direction in which the Z-axis direction moving mechanism 23-2 moves it toward or away from the test target substrate PCB can be significantly reduced compared to a configuration in which all of the elements that amplify the current I2 (the amplifiers corresponding to the probe holder amplifier A1-2 and the head amplifier A2-2) are arranged on the "second moving body." This allows the probe P2 to be moved toward or away from the test target substrate PCB (pattern PT) at high speed. This further reduces the time required to measure the resistance value data Dr.

[0083] Furthermore, in this measuring device 1 (substrate inspection system 100), when a control signal Sc is output to the "first passage path forming circuit", the measuring unit 13 measures the "quantity to be measured" based on a "measurement signal" that is input from the passage path (passage path PW1) formed by the "first passage path forming circuit" and output via the probe P1, the test target substrate PCB, the probe P2, the probe holder amplifier unit PHA2, and the head amplifier unit HA2, and when a control signal Sc is output to the "second passage path forming circuit", the measuring unit 13 measures the "quantity to be measured" based on a "measurement signal" that is input from the passage path (passage path PW2) formed by the "second passage path forming circuit" and output via the probe P2, the test target substrate PCB, the probe P1, the probe holder amplifier unit PHA1, and the head amplifier unit HA1.

[0084] In addition, this measuring device 1 (substrate inspection system 100) is equipped with a control unit 14 that outputs a control signal Sc to either the "first passage forming circuit" or the "second passage forming circuit" to pass the "measurement signal (current I1)" through the passage (passage PW1 or passage PW2) formed by one of the passage forming circuits.

[0085] Therefore, according to this measuring device 1 (substrate inspection system 100), the resistance value of the insulation resistance R can be measured using either a usage mode in which the current I1 passes through the "passage path (passage path PW2)" formed by the "second passage path forming circuit" and is input from the probe P1, or a usage mode in which the current I2 passes through the "passage path (passage path PW1)" formed by the "first passage path forming circuit" and is input from the probe P2.This increases the freedom to select the contact mode of the probes P1 and P2 with each pattern PT, PT·· on the substrate PCB to be inspected, and as a result, the resistance value of the insulation resistance R between each pattern PT, PT can be measured in a short time without unnecessary movement of the probes P1 and P2 by the XYZ movement mechanism 12.

[0086] In addition, this measuring device 1 (substrate inspection system 100) is provided with a shield 33 attached to the "third movable body" to shield the probe holder amplifier unit PHA1, and a shield 33 attached to the "fourth movable body" to shield the probe holder amplifier unit PHA2.

[0087] Therefore, this measuring device 1 (substrate inspection system 100) can effectively prevent noise components from entering the probe holder amplifier units PHA1, PHA2, thereby making it possible to measure the resistance value of the insulation resistance R between the patterns PT, PT with even higher accuracy.In addition, compared to a configuration in which the shield 33 is arranged on the moving unit 23b together with the probe holder amplifier units PHA1, PHA2, the total weight of the components that the Z-axis moving mechanisms 23-1, 23-2 move in the direction of moving the probes P1, P2 and the probe holder amplifier units PHA1, PHA2 toward and away from the substrate PCB to be inspected can be reduced by the weight of the shield 33.As a result, the probes P1, P2 can be moved toward and away from the substrate PCB (pattern PT) to be inspected at high speed, thereby further shortening the time required to measure the resistance value data Dr.

[0088] The configuration of the "measuring device" is not limited to the example of the configuration of the measuring device 1 in the substrate inspection system 100 described above.

[0089] For example, the configuration has been described as an example in which the XYZ moving mechanism 12 includes X-axis moving mechanisms 21-1 and 21-2, Y-axis moving mechanisms 22-1 and 22-2, and Z-axis moving mechanisms 23-1 and 23-2, and moves the probes P1 and P2 in any X, Y, or Z directions. However, instead of the X-axis moving mechanism 21-1 and the Y-axis moving mechanism 22-1, a configuration in which a robot arm mechanism that moves the Z-axis moving mechanism 23-1 in any X, Y, or Z direction (or any X and Y direction) is provided as a "second moving mechanism," or instead of the X-axis moving mechanism 21-2 and the Y-axis moving mechanism 22-2, a configuration in which a robot arm mechanism that moves the Z-axis moving mechanism 23-2 in any X, Y, or Z direction (or any X and Y direction) is provided as a "fourth moving mechanism" (not shown).

[0090] In addition, the configuration has been described as an example in which a probe card, which is an example of a test target substrate PCB, is used as a "measurement target substrate (test target substrate)" to measure the measured quantity and inspect whether it is good or bad, but various test target substrates PCBs other than a probe card can also be used as a "measurement target substrate (test target substrate)" to measure the measured quantity and inspect whether it is good or bad.

[0091] In the above configuration, head amplifier A2-1 is provided in head amplifier section HA1, probe holder amplifier A1-1 is provided in probe holder amplifier section PHA1, head amplifier A2-2 is provided in head amplifier section HA2, and probe holder amplifier A1-2 is provided in probe holder amplifier section PHA2, but it is also possible to adopt a configuration in which the gain of probe holder amplifier A1-1 is increased and head amplifier A2-1 is omitted, or a configuration in which the gain of probe holder amplifier A1-2 is increased and head amplifier A2-2 is omitted. Furthermore, the gains of head amplifiers A2-1 and A2-2 and probe holder amplifiers A1-1 and A1-2 can be defined arbitrarily.

[0092] Furthermore, in the above configuration, the current values of the currents I1 and I2 and the resistance value of the insulation resistance R are measured as the "quantity to be measured," but the "quantity to be measured" is not limited to these, and any electrical parameter such as voltage value or capacitance value can be measured as the "quantity to be measured." Furthermore, in the above configuration, the "quantity to be measured" is measured by the two-terminal method using two probes P1 and P2, but it is also possible to adopt a configuration in which the "quantity to be measured" is measured by the four-terminal method using two pairs of probes P1 and P2 (i.e., four probes). [Industrial Applicability]

[0093] According to the present invention, by disposing the first main amplifier on the first moving mechanism and the first pre-amplifier on the first moving body, stray capacitance due to the presence of a passage through which the measurement signal passes can be charged in a short time, and the measurement value measured by the measurement unit stabilizes in a short time, so that a predetermined measurement quantity of the measurement target substrate can be measured in a short time based on the measured measurement value. Furthermore, the measurement signal is sufficiently amplified near the first probe and the second probe, resulting in a high signal level, which sufficiently reduces the influence of noise components and enables the measurement quantity to be measured with high accuracy. As a result, the present invention can be widely applied to measurement devices that measure a predetermined measurement quantity of the measurement target substrate based on the measurement signal input via the first probe or the second probe. [Explanation of symbols]

[0094] 100 PCB Inspection System 1. Measuring equipment 2 Processing equipment 11 Board holding part 12 XYZ movement mechanism 13 Measuring part 14 Control Unit 21-1,21-2 X-axis direction movement mechanism 22-1,22-2 Y-axis direction movement mechanism 23-1,23-2 Z-axis direction movement mechanism 21a~23a base 21b~23b Moving part 31a Voltage output circuit 31b Current measurement circuit 33 Shield A1-1, A1-2 Probe holder amplifier A2-1, A2-2 head amplifier Di Current value data HA1, HA2 head amplifier section PHA1, PHA2 probe holder amplifier I1,I2 current IR1,IR2 current path P1,P2 probe PCB Inspection target board PT1,PT2... Pattern R insulation resistance R1-1~R1-4, R2-1~R2-4, R3-1~R3-4 relays Sc control signal V Measurement voltage

Claims

1. a first moving mechanism configured to move a first moving body to which a first probe is attached in a direction intersecting a surface of the measurement target substrate, thereby enabling the first probe to approach and separate from the measurement target substrate; a second moving mechanism configured to move a second moving body to which a second probe is attached in a direction intersecting the surface of the measurement target substrate, thereby enabling the second probe to approach and separate from the measurement target substrate; a third moving mechanism that moves a third moving body to which the first moving mechanism is attached along the surface of the measurement target substrate; a fourth moving mechanism that moves a fourth moving body to which the second moving mechanism is attached along the surface of the measurement target substrate; a first main amplifier that is disposed on the third movable body and that amplifies a measurement signal input via the second probe that is brought into contact with the measurement target substrate, the measurement target substrate, and the first probe that is brought into contact with the measurement target substrate; a measurement unit that measures a predetermined measurement quantity of the measurement target substrate based on the measurement signal amplified by the first main amplifier; a first pre-amplifier that is disposed on the first moving body and that amplifies the measurement signal input via the first probe and outputs the amplified signal to the first main amplifier;

2. 2. The measuring device according to claim 1, further comprising a first shield body attached to said third movable body for shielding said first pre-amplifier.

3. a second main amplifier that is disposed on the fourth movable body and that amplifies the measurement signal input via the first probe that is brought into contact with the measurement target substrate, the measurement target substrate, and the second probe that is brought into contact with the measurement target substrate; a second pre-amplifier that is disposed in the second moving body and that amplifies the measurement signal input via the second probe and outputs the amplified signal to the second main amplifier; a first path forming circuit that forms a path through which the measurement signal passes from the output of the first main amplifier to the input of the first pre-stage amplifier in accordance with a control signal; 2. The measuring device according to claim 1, further comprising a second path forming circuit that forms a path through which the measurement signal passes from the output of the second main amplifier to the input of the second pre-stage amplifier in accordance with the control signal.

4. 4. The measuring device according to claim 3, wherein, when the control signal is output to the first passage path forming circuit, the measuring unit measures the quantity to be measured based on the measurement signal that is input from the passage path formed by the first passage path forming circuit and output via the first probe, the measurement target substrate, the second probe, the second pre-stage amplifier, and the second main amplifier, and when the control signal is output to the second passage path forming circuit, the measuring unit measures the quantity to be measured based on the measurement signal that is input from the passage path formed by the second passage path forming circuit and output via the second probe, the measurement target substrate, the first probe, the first pre-stage amplifier, and the first main amplifier.

5. 5. The measuring device according to claim 4, further comprising a processing unit that outputs the control signal to one of the first passage forming circuit and the second passage forming circuit, thereby passing the measurement signal through the passage formed by that one of the passage forming circuits.

6. 6. The measuring device according to claim 3, further comprising a second shield body attached to the fourth movable body for shielding the second pre-amplifier.

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