Imaging apparatus and method for manufacturing imaging apparatus

Abstract

To provide an imaging apparatus that can prevent a reduction in image quality due to electromagnetic induction noise propagated to an imaging sensor, while accurately holding the imaging sensor.SOLUTION: An imaging apparatus (100) has: a first substrate (13) that has an imaging sensor package (131) including an imaging sensor (131a) arranged on a first surface, and a plurality of electronic components (135) arranged on a second surface; a holding member (12) that holds the imaging sensor package in a state where an inside side face of a first opening (121) and a side face of the imaging sensor package are made opposite to each other while maintaining a predetermined interval therebetween; and a shield member (14) that is grounded on the holding member and covers a side face of the first substrate and at least part of the second surface. A connection part (132) electrically connected to a second substrate (15) is arranged on the second surface of the first substrate. A second opening (141) is formed in the shield member at a position opposite to the connection part. The second substrate is configured to cover the second opening when seen from an optical axis direction.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to an imaging device and a method for manufacturing an imaging device. [Background technology]

[0002] The image sensor, which is a heat source of the imaging device, needs to be fixed to the lens barrel with high strength and precision. Patent Document 1 discloses a holding structure for fixing the image sensor to the lens barrel, which is a so-called "air bonding" structure in which the positional relationship between the image sensor and the image sensor holder plate is determined using a jig, and then they are fixed with an adhesive or the like. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2017-169175 Summary of the Invention [Problem to be solved by the invention]

[0004] An imaging device has a coil unit such as a fan motor, which is a source of electromagnetic induction noise (noise source). When electromagnetic induction noise propagates to the imaging sensor or the signal line of the imaging sensor, image quality may be degraded. However, the configuration disclosed in Patent Document 1 cannot suppress degradation of image quality caused by noise sources inside the imaging device.

[0005] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide an imaging device that can suppress degradation of image quality due to electromagnetic induction noise propagating to the imaging sensor while maintaining the imaging sensor with high precision. [Means for solving the problem]

[0006] An imaging device according to one aspect of the present invention comprises a first substrate on whose first surface an imaging sensor package including an imaging sensor is arranged and on whose second surface opposite the first surface a plurality of electronic components are arranged; a holding member having a first opening formed therein and holding the imaging sensor package with the inner side of the first opening facing the side of the imaging sensor package while maintaining a predetermined distance between them; and a shielding member grounded to the holding member and covering at least a portion of the side and the second surface of the first substrate, wherein a connection portion electrically connected to a second substrate is arranged on the second surface of the first substrate, and a second opening is formed in the shielding member at a position opposite the connection portion, and when viewed from the optical axis direction, the second substrate is configured to cover the second opening.

[0007] Other objects and features of the present invention will be described in the following embodiments. [Effects of the Invention]

[0008] According to the present invention, it is possible to provide an imaging device that can suppress degradation of image quality due to electromagnetic induction noise propagating to the imaging sensor while maintaining the imaging sensor with high precision. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 2 is an exploded perspective view of the imaging device according to the first embodiment. [Figure 2] FIG. 2 is an exploded perspective view of the lens barrel according to the first embodiment. [Figure 3] 5A and 5B are diagrams showing how the image sensor package is fixed and held in the first embodiment. [Figure 4] FIG. 2 is a diagram illustrating the configuration of a lens barrel and an image sensor package according to the first embodiment. [Figure 5] FIG. 2 is a wiring pattern diagram of an FPC in the first embodiment. [Figure 6] 1A and 1B are a perspective view and a cross-sectional view of an image sensor package according to a first embodiment. [Figure 7] FIG. 10 is an exploded perspective view of an imaging device according to a second embodiment. [Figure 8] FIG. 10 is an exploded perspective view of a lens barrel according to a second embodiment. [Figure 9] 10A and 10B are a perspective view and a cross-sectional view showing a heat dissipation structure of an imaging board in a second embodiment. [Figure 10] FIG. 11 is a perspective view showing a modified example of the heat dissipation structure of the imaging board in the second embodiment. [Figure 11] FIG. 10 is a rear view showing a part of the configuration of the imaging device according to the second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that the embodiments described below are examples of means for realizing the present invention, and may be appropriately modified or changed depending on the configuration of the device to which the present invention is applied and various conditions. Furthermore, each embodiment can also be appropriately combined.

[0011] (First embodiment) First, a first embodiment of the present invention will be described. Fig. 1 is an exploded perspective view of an imaging device 100 according to this embodiment. Note that a detailed description of the structure of the imaging device 100 will be omitted, and only the parts required for the description of this embodiment will be discussed.

[0012] Imaging device 100 in this embodiment has a configuration in which lens barrel (lens device) 10 and battery box 20 are assembled by sandwiching them mainly between front cover 21, chassis 22, and side cover 23. Lens barrel 10 is configured to include lens drive unit 17 and sensor holder unit 18. Lens drive unit 17 is configured to include multiple lenses, lens holders that hold each lens, a cam barrel that forms cam grooves, a focus lens unit, a shutter unit, and the like.

[0013] Sensor holder unit 18 is configured to include an imaging board (first board) 13 on which an imaging sensor package 131 including an imaging sensor (imaging element) 131a is mounted, and a holder that holds imaging board 13. Lens barrel 10 also has an FPC (flexible printed circuit board, wiring board, second board) 15 attached thereto, which electrically connects control board (third board) 24 and imaging board 13. Control board 24 is attached to battery box 20 in advance. Battery box 20 is configured to be able to house a removable battery (not shown).

[0014] Next, the internal structure of the lens barrel 10 will be described with reference to Figures 2(a) to (c) through 4(a) to (c). Figures 2(a) to (c) are exploded perspective views of the lens barrel 10. Figures 3(a) to (c) are diagrams (perspective view, cross-sectional view) showing how the image sensor package 131 is fixed and held. Figures 4(a) to (c) are structural diagrams of the lens barrel 10 and the image sensor package 131 (rear view of the lens barrel 10, cross-sectional view of the image sensor package 131).

[0015] 2(a) to 2(c) show the retracted position in which the lens group is housed while waiting to take a picture, and show the parts around the image sensor 131a disassembled from the lens barrel 10. The lens barrel 10 has a sensor holder 11. A sensor plate (holding member) 12 is fixed to the sensor holder 11 with screws. An imaging board 13 on which an image sensor package 131 is mounted is adhesively fixed and held by the sensor plate 12. The adhesive fixing method will be described in detail later.

[0016] The imaging board 13 has a first surface (first main surface) and a second surface (second main surface) opposite the first surface. An imaging sensor package 131 including an imaging sensor 131a is arranged on the first surface, and a plurality of electronic components 135 are arranged on the second surface. A connector (connecting portion) 132 that can be electrically connected to the FPC 15 is arranged on at least a portion of the second surface of the imaging board 13. The sensor plate 12 is arranged to face four sides of the rectangular imaging sensor package 131 and to face closely to a portion of the first surface of the imaging board 13.

[0017] The shielding plate (shielding member) 14 has a box-like shape formed by bending the four sides of a substantially rectangular pressed metal sheet, and is arranged so as to cover the imaging board 13 from the rear side of the imaging device 100, and is fixed (fixed with screws) in a grounded state to the sensor plate 12. The sensor plate 12 and the shielding plate 14 are each formed by pressing a plate made of a metal material such as copper or aluminum. However, this embodiment is not limited to this, and at least one of the sensor plate 12 and the shielding plate 14 may be made of a member that has been coated with a shielding property.

[0018] The bent portions 145 on the four sides of the shielding plate 14 are formed to stand upright so as to face the side surfaces of the imaging board 13. In this way, the shielding plate 14 is grounded to the sensor plate 12 and covers at least a portion of the side surfaces and the second surface of the imaging board 13. The shielding plate 14 is configured to have an opening (second opening) 141 formed in the center of the plane facing the imaging board 13, and a board-to-board type connector (board-to-board connector) 132 mounted on the imaging board 13 is exposed from the opening 141. In this way, the opening 141 is formed in the shielding plate 14 at a position facing the connector 132. The FPC 15 accesses the connector 132 through the opening 141, and the imaging board 13 and the FPC 15 are electrically connected. The shielding plate 14 may have an opening (third opening) 142 different from the opening 141. The lens barrel 10 is configured to be separable into a lens drive unit 17 and a sensor holder unit 18.

[0019] 3(a) to 3(c) are perspective views illustrating a method for adhesively fixing the image sensor package 131 and the imaging board 13 on which the image sensor package 131 is mounted to the sensor plate 12. FIG. 3(a) is a perspective view showing the components unfolded. FIG. 3(b) is a perspective view showing the state in which the image sensor package 131 and the imaging board 13 are adhesively fixed to the sensor plate 12. FIG. 3(c) is an enlarged view of part B in the AA cross section in FIG. 3(b).

[0020] In this embodiment, a bonding structure known as "air bonding" is employed, in which the imaging sensor package 131 and the sensor plate 12 are positioned with high precision using a jig, and then fixed with an adhesive or the like. The imaging sensor package 131 has an imaging sensor 131a and a package base (base member) 131b. The imaging sensor 131 is a photoelectric conversion element such as a CCD (Charge Coupled Device) sensor or a CMOS (Complementary Metal-Oxide-Semiconductor) sensor. The package base 131b is made of ceramic or the like.

[0021] The package base 131b houses the image sensor 131a, enabling it to be mounted on the imaging board 13, and dissipates heat generated by the image sensor 131a to the imaging board 13 via the package base 131b. The electrodes of the image sensor 131a and the electrodes of the package base 131b are electrically connected by wire bonding or the like, and the package is sealed with a lid 131c. Wire bonding is a technique for electrically connecting electrodes of a semiconductor package, or connections between circuit patterns on a board and other electronic components, using wires of gold, copper, aluminum, or the like with a diameter of several tens to several hundred micrometers.

[0022] The sensor plate 12 is formed by pressing a highly rigid metal sheet made of a material such as SUS (stainless steel). An opening (first opening) 121 is formed in the center of the sensor plate 12. An imaging sensor package 131 is pre-mounted on the imaging substrate 13 by reflow soldering. The imaging substrate 13 and the sensor plate 12 are aligned parallel to each other with the side surface of the imaging sensor package 131 facing the inner side surface of the opening 121 at a fixed distance. In this way, the sensor plate 12 holds (fixedly holds) the imaging sensor package 131 with the inner side surface of the opening 121 facing the side surface of the imaging sensor package 131 at a fixed distance (constant gap).

[0023] Additionally, an ultraviolet-curing adhesive 16 is injected between the side surface of the image sensor package 131 and the edge of the opening 121. The ultraviolet irradiation firmly fixes the image sensor package 131 and the imaging board 13 to the sensor plate 12. The injection range of the adhesive 16 may be over all four sides of the image sensor package 131 and the opening 121, but depending on the adhesive strength, this can be changed as needed, such as only on two parallel sides or only on a specific part of each side. Minimizing the injection range of the adhesive 16 reduces the ultraviolet irradiation time, contributing to a shorter takt time in the bonding process.

[0024] As described above, the sensor plate 12, imaging board 13, and imaging sensor package 131 are integrated by so-called "air bonding," and then the shielding plate 14 is attached from the rear side of the lens barrel 10, allowing these components to be handled as a single unit. In this way, the imaging board 13, sensor plate 12, and shielding plate 14 are configured as a single unit that can be attached and detached from the lens barrel 10. That is, as shown in FIG. 2(c), in the sensor holder unit 18, the so-called "air bonded" components, including the imaging sensor package 131, can be handled as a single unit.

[0025] The image sensor package 131 requires highly accurate positioning and fixing to ensure the optical performance of the lens barrel 10. Due to individual differences in the components of each lens and lens barrel, the optimal fixing position of the integrated unit of the image sensor package 131 in the lens barrel 10 may differ slightly from the nominal design position. Therefore, when assembling the integrated unit of the image sensor package 131, various adjustment tools are used to first identify the optimal fixing position for each lens barrel 10. Then, an assembly and adjustment method is employed in which the integrated unit of the image sensor package 131 is temporarily fixed in the optimal position and then adhesively fixed. In the lens barrel 10 of this embodiment, the lens drive unit 17 and the sensor holder unit 18 (excluding the integrated unit of the image sensor package 131) are first assembled in advance, and then the integrated unit of the image sensor package 131 is precisely positioned. The lens barrel 10 is then completed through an adhesive fixing process.

[0026] 4(a) and 4(b) are rear views of the lens barrel 10. FIG. 4(c) is a cross-sectional view taken along the line CC in FIG. 4(b). As described above, the shielding plate 14 has an opening 141 formed in the center of the plane facing the imaging board 13, and the board-to-board type connector 132 mounted on the imaging board 13 is exposed from the opening 141. The FPC 15 has access to the connector 132 from the opening 141, and the imaging board 13 and the FPC 15 are electrically connected. When the FPC 15 is attached to the imaging board 13, the FPC 15 is configured to cover the opening 141 in a projected view (when viewed from the optical axis direction) in the optical axis direction (the direction from the FPC 15 toward the imaging sensor 131a).

[0027] The lens barrel 10 uses the shielding plate 14 and FPC 15 to form a shielding structure that shields the side and rear portions of the imaging board 13, thereby providing shielding performance against electromagnetic noise that may be incident on the imaging board 13 from inside and outside the imaging device 100. Here, the integrated unit including the imaging sensor package 131 is configured so that the opening end face of the sensor plate 12 faces closely to and is opposite the outer side face of the package of the imaging sensor package 131. The outer shape of the imaging board 13 is larger than the outline of the opening 121 of the sensor plate 12. In addition, a part of the surface of the imaging board 13 on which the imaging sensor package 131 is mounted, particularly the outer periphery of the board's outer shape, is configured so that it faces closely to and is opposite the sensor plate 12.

[0028] In this embodiment, the opening 121 of the sensor plate 12 is larger than the outline of the image sensor package 131, the outline of the imaging board 13 is larger than the opening 121, and the shielding plate 14 encompasses and shields the outline of the imaging board 13. In this way, the shielding plate 14 is configured to cover the four side surfaces of the imaging board 13 and the entire surface on which the connector 132 is mounted. The FPC 15, which includes a conductor layer, is configured to cover the opening 141 of the shielding plate 14. This allows the sensor plate 12, shielding plate 14, and FPC 15 to form an integrated shielding unit structure that covers most of the area of the image sensor package 131 except for the light receiving surface.

[0029] A connector 151 is mounted on the FPC 15. The connector 151 and the connector 132 are a pair of board-to-board connectors (BtoB connectors), and the imaging board 13 and the FPC 15 are electrically connected by mating the connector 151 and the connector 132. The distance (facing distance) between the FPC 15 and the imaging board 13 when the connector 132 and the connector 151 are mated, that is, the stacking height of the connector, is longer (greater) than the distance (facing distance) between the imaging board 13 and the shielding plate 14. For this reason, when the outer shape of the opening 141 is made smaller than the outer shape of the FPC 15 and the FPC 15 is assembled to the imaging board 13, a structure can be formed in which the opening 141 is blocked by the FPC 15 when viewed from the optical axis direction.

[0030] An opening 142 may be formed in the shielding plate 14. At least some of the multiple electronic components 135 (components having a certain height or more) are mounted on the imaging board 13 facing the opening 142. This allows the height of the surface facing the imaging board 13 via the bent portion 145 from the contact surface with the sensor plate 12 to be lowered while avoiding collision with tall components. This allows for a shielding structure to be formed while reducing an increase in the housing thickness in the optical axis direction of the imaging device 100. When the FPC 15 is attached to the imaging board 13, the opening 142 is configured to be covered by the FPC 15 when viewed from the optical axis direction. This configuration allows for a reduction in an increase in the housing thickness of the imaging device 100 while maintaining a shielding function.

[0031] Next, the configuration of the FPC 15 in this embodiment will be described with reference to Figures 5(a) and (b). Figures 5(a) and (b) are wiring pattern diagrams of the FPC 15. The FPC 15 in this embodiment is composed of a CCL (Copper Clad Laminate) in which copper foil material is bonded to both sides of a polyimide base material, a coverlay film that covers the conductor surface, and a reinforcing plate material that supplements local strength. CCLs are classified as three-layer CCLs or two-layer CCLs depending on whether or not an adhesive layer is used to bond the laminated materials together, but either may be applied in this embodiment.

[0032] FIG. 5(a) is a wiring pattern diagram of the component side (surface) of FPC 15. FIG. 5(b) is a wiring pattern diagram of the backside of FIG. 5(a). FPC 15 is configured as a double-sided FPC with two conductor layers (multiple laminated conductor layers). However, this embodiment is not limited to this, and an FPC with four conductor layers, for example, may be used. In this case, for example, the surface conductor layer of the wiring portion that is wired to control board 24 can be etched away to form a two-layer wiring, thereby making the wiring portion flexible.

[0033] The FPC 15 has a connector mounting section 152 on which a connector 151 is mounted. Conductor lands are formed at positions where the electrode terminals of the connector 151 are grounded, and the coverlay film is opened to expose the conductor portions of the FPC 15 so that they can be electrically connected to the electrode terminals of the connector 151. The FPC 15 also has wiring patterns formed on both the front and back surfaces thereof that electrically connect the connector mounting section 152 to the control board 24. More specifically, the FPC 15 has signal lines 153 containing imaging signals and power supplies, and a GND plane (ground wiring) 154 that serves as a return path for the signal lines 153. For the return path, in addition to solid wiring of a conductor layer such as the GND plane 154, a GND mesh 155 in which conductor layers and etched layers are regularly arranged may also be used. The GND mesh 155 is formed on the back surface of the signal line 153, and the density of the conductor layers and etched layers can be arbitrarily set, thereby adjusting the impedance of the transmission line using the signal line 153 to a desired value.

[0034] In this embodiment, the GND plane 154 is disposed so as to cover the opening 141 (at a position facing the opening 141). The GND plane 154 and the shielding plane 14 are electrically connected directly or indirectly. The imaging board 13 is shielded by the sensor plate 12, the shielding plate 14, and the FPC 15.

[0035] In this embodiment, the FPC 15 has multiple laminated conductor layers. A GND plane 154 is formed on the conductor layer (first conductor layer) farthest from the imaging board 13 among the laminated conductor layers. A signal line 153 electrically connecting the imaging board 13 and the control board 24 is formed on a second conductor layer different from the first conductor layer. As described above, in the FPC 15 of this embodiment, all signal lines 153 are wired on the component mounting surface side. The entire back surface of the FPC 15 is composed of a GND plane 154 and a GND mesh 155. The component mounting surface side faces the imaging board 13 and the shielding plate 14. By configuring the wiring surface in this manner, the GND plane 154 (ground wiring) can block electromagnetic noise propagation from various internal noise sources within the imaging device 100 to the imaging board 13 and the signal line 153. This allows a holding structure for the imaging sensor 131a to be configured while suppressing degradation in image quality of the imaging device 100.

[0036] By electrically connecting the GND pattern of the FPC 15 to metal components such as the shielding plate 14, the mechanical GND of the housing of the imaging device 100 can be strengthened, contributing to electrical stability. For example, a coverlay opening 156 is formed on the component mounting surface side of the FPC 15. Then, the GND conductor of the laminated conductor is exposed, and a protrusion 143 that protrudes toward the FPC 15 is formed on the shielding plate 14 at a position facing the coverlay opening 156 by drawing or half-blanking. When the FPC 15 is electrically connected to the imaging board 13 by mating the connector 132 with the connector 151, the exposed GND conductor and the protrusion 143 come into physical contact with a given pressure. This configuration allows the GND pattern of the FPC 15 to be electrically connected to metal components such as the shielding plate 14.

[0037] In this case, both connector fitting and strengthening of the GND can be achieved by removing the reinforcing plate on the back surface in the area where the GND conductor contacts the protrusion 143 and configuring the FPC 15 to be deformable under pressure. It is also effective to add a cushioning material that elastically presses the connector fitting portion from the back side of the housing of the image pickup device 100 to prevent the connector from coming loose.

[0038] In this embodiment, the shielding plate 14 and the opening 141 are configured to minimize the opening area in consideration of shielding performance. Therefore, when assembling the FPC 15 into the imaging board 13, the mating operation between the connector 132 and the connector 151 is difficult to visually observe, and a smooth assembling operation is desired. Therefore, for example, it is preferable to adopt a configuration in which an index 144 is formed on the shielding plate 14 along a portion of the outline of the FPC's external shape after the FPC 15 is assembled into the imaging board 13. The index 144 is provided for aligning the FPC 15 with the connector 132, and can be realized, for example, by marking. By providing such an index for assembly in advance, both a shielding structure and ease of assembly can be achieved. The index for alignment may also be provided on the FPC 15.

[0039] 6(a) and 6(b) are a perspective view and a cross-sectional view showing the configuration of the image sensor package 131 of this embodiment. As described above, the image sensor package 131 houses the image sensor 131a inside the package base 131b, and the electrodes of the image sensor 131a and the electrodes of the package base 131b are electrically connected by wire bonding or the like.

[0040] A wiring pattern electrically connected to the imaging sensor 131a is formed inside the package base 131b. This wiring pattern connects the wire bonding electrodes to external electrodes 131d that are soldered to the imaging substrate 13. The surfaces of the wires and electrodes are bonded using heat, ultrasonic waves, and load. At this time, gold plating the electrode surfaces in advance improves the bondability with the wires, so it is preferable to perform electrolytic plating on the electrode surfaces during the manufacturing process of the package base 131b.

[0041] Electrolytic plating involves a reduction reaction at the cathode of an electrolyte, which causes the deposition of a plating metal and grows a plating film. During plating, a voltage is applied from outside the package base 131b, requiring plating leads 131e that extend from the wiring patterns connected to the electrodes to the outside of the package base 131b. The plating leads 131e generally extend from the inner wiring pattern of the package base 131b to the side of the package, and are cut from the outside when the exterior of the image sensor package 131 is processed. Therefore, the cut surfaces of the plating leads 131e are exposed on the side of the package base 131b.

[0042] In recent years, the imaging sensor package 131 has become more sophisticated, and the number of electrodes electrically connected to the imaging substrate 13 has also tended to increase. Consequently, a large number of plated leads 131e are exposed on the side surface of the package base 131b, and the plated leads 131e are arranged adjacent to each other at a relatively narrow pitch. For example, if the imaging sensor package 131 is directly fixed and held with a high-strength metal material for the purpose of highly accurate positioning, the fixing metal and the plated leads 131e may come into contact. In this example, there is a possibility of an electrical short circuit between adjacent plated leads 131e via the fixing metal. Therefore, in this embodiment, the sensor plate 12 that adhesively fixes the imaging sensor package 131 and the imaging sensor package 131 are integrated in a non-contact state using an insulating adhesive 16. That is, the sensor plate 12 and the plated leads 131e face each other at a predetermined distance. This reduces the possibility of an electrical short circuit between the plated leads 131e, as described above, and enables highly accurate positioning.

[0043] In this embodiment, in order to achieve highly accurate positional fixation of the image sensor package 131, a highly rigid metal material such as SUS (stainless steel) is used as the material for the sensor plate 12. However, modified materials may be used as long as they are environmentally and shock resistant and can achieve highly accurate positional fixation. For example, the desired positional fixation and shielding structure can be achieved using a member based on a highly rigid molded resin material, the surface of which is coated with a highly conductive magnetic shield coating that provides high resistance to electromagnetic noise.

[0044] (Second embodiment) Next, a second embodiment of the present invention will be described.

[0045] In conventional configurations, to reduce the temperature rise of electronic components due to heat generation, a thermally conductive rubber is sandwiched between the heat-generating electronic components and a heat dissipation member, and the heat generated by the electronic components is dissipated to the heat dissipation member via the thermally conductive rubber. When considering applying this conventional configuration to a heat dissipation structure for an image sensor, for example, a possible configuration would be to place a heat sink opposite the imaging board, which heats up along with the image sensor, and dissipate the heat by placing a thermally conductive rubber between them. When the image sensor and imaging board are fixed in position by aerial bonding, the fixation is primarily achieved by filling the side surfaces of the image sensor's sensor package with adhesive, which tends to be less resistant to pressure forces from the optical axis than to external forces acting on the adhesive toward the light-receiving surface. Therefore, when dissipating heat from an image sensor fixed by aerial bonding, the pressure from the thermally conductive rubber may cause the adhesive that secures the image sensor to peel off. Therefore, in this embodiment, a heat dissipation structure for the image sensor is proposed in relation to fixing the position of the image sensor and reducing the incidence of electromagnetic noise, and a configuration for suppressing degradation of image quality due to dark current noise and the like caused by a rise in temperature of the image sensor is described in detail.

[0046] 7 is an exploded perspective view of the imaging device 200 according to this embodiment. Note that detailed structural explanation of the imaging device 200 will be omitted, and only the parts required for explaining this embodiment will be discussed. Furthermore, parts having the same configuration as those in the first embodiment will be assigned the same numbers as those used in the first embodiment, and detailed explanations thereof will be omitted.

[0047] In the imaging device 200 of this embodiment, a heat dissipation structure is configured in the lens barrel 50 to reduce the temperature rise of heat sources, particularly the imaging sensor 131a. The imaging device 200 is configured such that the lens barrel 50 and battery box 20 are sandwiched mainly between a front cover 21, a chassis 22, and a side cover 23. An FPC (flexible printed circuit) 15 is attached to the lens barrel 50, electrically connecting the control board 24 and the imaging board 13. The control board 24 is attached to the battery box 20 in advance. The battery box 20 is configured to be able to accommodate a removable battery (not shown).

[0048] 8(a) and (b) show the retracted position in which the lens group is stored when ready to shoot, with the components around the image sensor disassembled from lens barrel 50. Lens barrel 50 has sensor holder 11. Sensor plate 12 is fixed to sensor holder 11 with screws. Sensor plate 12 adhesively holds imaging board 13, on which imaging sensor package 131 is mounted.

[0049] The heat dissipation plate (heat dissipation member) 54 has a box-like shape formed by folding the four sides of a roughly rectangular pressed metal sheet. The heat dissipation plate 54 is grounded to the sensor plate 12, and is disposed so as to cover the imaging board 13 (at least part of the side surface and second surface of the imaging board) from the rear side of the imaging device 200, and is fixed (fixed with screws) to the sensor plate 12. The heat dissipation plate 54 is formed by pressing a plate material with high thermal conductivity made of a metal material such as copper or aluminum. The folded portions (side wall portions 542) of the four sides are formed upright so as to face the side surfaces of the imaging board 13.

[0050] Before the heat dissipation plate 54 is fixed to the sensor plate 12 with screws, a certain amount of paste-like heat dissipation material (heat dissipating paste member) 65 is applied between the imaging board 13 and the heat dissipation plate 54. The paste-like heat dissipation material 65 is made of, for example, a one-component or two-component paste-like thermally conductive resin material called gap filler. The paste-like heat dissipation material 65 may be of a type that hardens from a paste state over time, or may be of a type that maintains a paste state regardless of the passage of time. It has pump-out resistance against grease, and is made of a urethane-based material, silicone-based material, or the like.

[0051] An opening 541 is formed in the heat dissipation plate 54 in the center of the plane facing the imaging board 13. A board-to-board type connector (connection portion) 132 mounted on the imaging board 13 is exposed from the opening 541. The FPC 15 accesses the connector 132 from the opening 541, and the imaging board 13 and FPC 15 are electrically connected. In this embodiment, paste-like heat dissipation material 65 is filled in one place each on the left and right sides of the connector 132. That is, the paste-like heat dissipation material 65 is arranged in each of the first and second areas so as to sandwich the connector 132.

[0052] As mentioned above, a rise in temperature of the image sensor 131a can cause dark current noise, potentially resulting in a degradation of image quality. Dark current noise is physical thermal noise of the element, and as the element temperature rises, the dark current noise also increases, regardless of the amount of incident light. To reduce the degradation of image quality, it is effective to incorporate a configuration that dissipates heat accumulated in the image sensor 131a and image sensor package 131 to the outside. However, if the heat dissipation path is locally biased, the heat from the image sensor 131a will not be dissipated uniformly, resulting in a biased temperature distribution. For this reason, when forming a heat dissipation path, a configuration that can dissipate the heat from the image sensor 131a uniformly is required.

[0053] Therefore, in this embodiment, a connector 132 that electrically connects to the FPC 15 is located approximately in the center of the heat dissipation plate 54, and paste-like heat dissipation material 65 is filled in one location on each side of the connector 132. This configuration allows heat accumulated in the image sensor 131a and imaging board 13 to be transferred approximately uniformly to the heat dissipation plate 54. As a result, temperature rise and uneven temperature distribution in the image sensor 131a and imaging board 13 are reduced, and degradation of image quality can be suppressed. The lens barrel 50 is configured to be separable into the lens drive unit 17 and the sensor holder unit 58.

[0054] 9(a) and 9(b) are diagrams illustrating a method for adhesively fixing the image sensor package 131 and the imaging board 13 on which the image sensor package 131 is mounted to the sensor plate 12, and show the heat dissipation structure of the imaging board 13. FIG. 9(a) is an oblique view of the components unfolded. FIG. 9(b) is a cross-sectional view taken along the line DD in FIG. 9(a), showing the state in which the FPC 15 has been further incorporated.

[0055] Like the first embodiment, the lens barrel 50 employs an aerial bonding structure. The package base 131b houses the image sensor 131a, enabling it to be mounted on the imaging board 13, and dissipates heat generated in the image sensor 131a to the package base 131b and the imaging board 13. The image sensor package 131 is configured by accommodating the image sensor 131a inside the package base 131b, electrically connecting the electrodes of the image sensor 131a to the electrodes of the package base 131b by wire bonding or the like, and sealing with the lid 131c.

[0056] An opening 121 is formed in the center of the sensor plate 12. The imaging substrate 13, on which the image sensor package 131 has been reflow-mounted in advance, and the sensor plate 12 are aligned parallel to each other, with the side of the image sensor package 131 facing the opening 121 at a certain distance. An ultraviolet-curing adhesive 16 is then injected between the side of the image sensor package 131 and the edge of the opening 121, and the image sensor package 131 and the imaging substrate 13 are firmly fixed to the sensor plate 12 by ultraviolet light irradiation.

[0057] As described above, the sensor plate 12, imaging board 13, and imaging sensor package 131 are integrated using an aerial bonding structure, and the heat dissipation plate 54 is attached from the rear of the lens barrel 50, allowing these components to be handled as a single unit. In this way, the imaging board 13, sensor plate 12, and heat dissipation plate 54 are configured to be detachable from the lens barrel 50 as a single unit. In this way, the imaging board 13, sensor plate 12, and heat dissipation plate 54 are configured to be detachable from the lens barrel 50 as a single unit. That is, as shown in FIG. 8( b), the components of the aerial bonding structure, including the imaging sensor package 131, can be detachably handled as an integrated unit in the lens barrel 50. Therefore, when assembling the integrated unit, a manufacturing method (assembly method and adjustment method) is adopted in which the lens barrel 50 is adjusted to an optimal fixing position using various adjustment tools, and the integrated unit is temporarily fixed in that optimal position and then adhesively fixed.

[0058] The paste-like heat dissipation material 65 is disposed in at least a portion of the area between the heat dissipation plate 54 and the imaging board 13. As a result, heat from the plurality of electronic components 135 is dissipated to the heat dissipation plate 54 via the paste-like heat dissipation material 65.

[0059] In this embodiment, the paste-like heat dissipation material 65 penetrates and fills the gaps between the electronic components 135 so as to cover and surround the surfaces of the electronic components 135 mounted on the imaging board 13. That is, the paste-like heat dissipation material 65 is filled at least between the electronic components 135. This allows it to adhere closely to the surface of the imaging board 13 and the surfaces of the electronic components. This allows it to efficiently absorb heat generated by the imaging board 13 and the electronic components and transfer it to the heat dissipation plate 54. Furthermore, compared to a heat dissipation sheet preformed into an arbitrary shape, the paste-like heat dissipation material 65 or a preformed heat dissipation sheet generates a different repulsive force when the heat dissipation plate 54 is assembled to the sensor plate 12. A heat dissipation sheet preformed into an arbitrary shape is assembled by charging a certain amount relative to the thickness of the sheet to ensure reliable contact. In this case, a certain repulsive force is generated, and a certain amount of shear force is applied in the direction of peeling of the adhesive portion. On the other hand, when the heat dissipation plate 54 comes into contact with the paste-like heat dissipation material 65, the paste material penetrates more widely, and a state of contact with the heat dissipation plate 54 can be formed without generating a large repulsive force.

[0060] The heat dissipation plate 54 also has side walls 542 formed by bending a metal plate. The side walls 542 are formed along the four sides of the imaging board 13 and are configured to cover at least a portion of the multiple electronic components 135 arranged on the imaging board 13 from the side. The side walls 542 maintain the paste-like heat dissipation material 65 filled between the imaging board 13 and the heat dissipation plate 54, and act favorably to prevent the paste-like heat dissipation material 65 from scattering to other areas of the imaging device 200 even when, for example, a large impact is applied to the imaging device 200.

[0061] The heat dissipation plate 54 also has a drawn portion 543. The drawn portion 543 is drawn by a certain amount in a direction away from the imaging board 13 facing it. A mounted component (at least a portion of the multiple electronic components 135) having a certain component height or more is mounted at a position on the imaging board 13 facing the drawn portion 543. This allows the height of the surface facing the imaging board 13 via the bent portion (side wall portion 542) from the contact surface with the sensor plate 12 to be lowered while avoiding collision with tall mounted components. This allows for a heat dissipation structure to be formed while reducing the increase in the housing thickness in the optical axis direction of the imaging device 200. In this case, it is preferable to fill the paste-like heat dissipation material 65 within a range a certain distance from the opening 541. For example, by filling the paste-like heat dissipation material 65 within a range a certain distance from the opening 541, scattering of the paste-like heat dissipation material 65 outside the heat dissipation plate 54 can be reduced when a large impact is applied to the imaging device 200.

[0062] Furthermore, as described above, the sensor plate 12, imaging board 13, and imaging sensor package 131 can be handled as a single unit. That is, even when adjusting the lens barrel 50 to an optimal fixed position, the imaging sensor package 131 unit can be handled with the paste-like heat dissipation material 65 still filled in the enclosed area. This reduces the possibility of the paste-like heat dissipation material 65 scattering during the adjustment work, making it possible to carry out the adjustment work more efficiently.

[0063] Next, modified examples of the heat dissipation plate 54 and imaging board 13 will be described with reference to Figures 10(a) and (b). Figures 10(a) and (b) are perspective views showing modified examples of the heat dissipation structure of the imaging board 13. In the lens barrel 50, in order to reduce the increase in the housing thickness in the optical axis direction of the imaging device 200, the bent height of the heat dissipation plate 54 facing the imaging board 13 is configured to be as low as possible. A drawn portion 543 is formed in the area facing tall mounted components to avoid collision with the electronic components 135.

[0064] As shown in FIG. 10(a), the heat dissipation plate (heat dissipation member) 54A has an opening (fourth opening) 542A formed in a region facing a tall mounted component (at least some of the electronic components 135). This prevents collisions between the heat dissipation plate 54A and the mounted component. The paste-like heat dissipation material 65 is preferably filled in a region a certain distance away from the openings 541A and 542A. Filling the region away from the openings 541A and 542A with the paste-like heat dissipation material 65 reduces the possibility of the paste-like heat dissipation material 65 scattering outside the heat dissipation plate 54A. Furthermore, since the paste-like heat dissipation material 65 can be filled so as to sandwich the connector 132 from both sides, heat accumulated in the image sensor 131a and the imaging board 13A can be transferred to the heat dissipation plate 54A in a substantially uniform manner. This reduces temperature rise and uneven temperature distribution in the image sensor 131a and the imaging board 13, thereby suppressing degradation of image quality.

[0065] As shown in FIG. 10(b), the imaging board 13B, which is patterned with the central connector 132 rotated 90 degrees relative to the imaging board 13, is fixed to the sensor plate 12 with the imaging sensor package 131 and aerial adhesive. In this case, an opening 541B extending in the left-right direction is formed in the heat dissipation plate (heat dissipation member) 54B facing the imaging board 13B, ensuring space for access by the FPC 15. Furthermore, paste-like heat dissipation material 65 is filled between the imaging board 13B and the heat dissipation plate 54B so as to sandwich the connector 132 from above and below. That is, the paste-like heat dissipation material 65 is disposed in each of the first and second regions so as to sandwich the connector 132. Heat accumulated in the imaging sensor 131a and imaging board 13B is transferred substantially uniformly to the heat dissipation plate 54B. This reduces temperature rise and uneven temperature distribution in the imaging sensor 131a and imaging board 13B, thereby suppressing degradation of image quality.

[0066] Next, the configuration of an imaging device 200 incorporating a lens barrel 50 will be described with reference to FIG. 11. FIG. 11 is a rear view showing a portion of the configuration of the imaging device 200. The imaging device 200 has the lens barrel 50 disposed approximately in the center of the housing, and the control board 24 disposed to the right of the lens barrel 50 when viewed from the rear. An area for accommodating a heat sink is formed on the left side of the lens barrel 50. Specifically, a heat sink 70 is mounted on it. The heat sink 70 has multiple heat dissipation fins and is formed by die casting using an alloy material such as aluminum, magnesium, or zinc. Instead of a die-cast product, a pressed product formed by bending a thin metal plate multiple times to form fins may also be used.

[0067] The imaging device 200 may also have a fan motor (heat radiator) 80. The fan motor 80 is disposed close to the heat sink 70, and has the function of storing heat transferred from multiple heat sources in the imaging device 200 in the heat sink 70 and cooling the heat by driving the fan motor 80. The fan motor 80 may be, for example, an axial fan in which multiple blades are rotatably held in the center of the housing frame and the coil is driven to draw air in from the front of the housing and expel it to the rear. Alternatively, the fan motor 80 may be a centrifugal fan in which a motor holds cylindrical blades in the center and draws air in from the front of the housing and expels it to the side.

[0068] The imaging device 200 is equipped with an accessory shoe (not shown) to which a camera accessory such as an external flash can be attached to the top of the housing. Therefore, when laying out functional components such as the heat sink 70, the vertical and horizontal dimensions of the housing can be balanced by laying out the functional components on the left and right sides of the housing. Here, by joining the heat dissipation plate 54 and the heat sink 70 using a heat transfer member 60, the heat dissipation plate 54 and the heat sink 70 can be thermally coupled.

[0069] Specifically, the heat transfer member 60 is formed, for example, from a graphite sheet laminated with a thin PET (polyethylene terephthalate) base sheet. One end of this laminated heat dissipation sheet material is attached to the surface of the heat dissipation plate 54, and the other end is attached to the heat sink 70. The heat transfer member 60 is not limited to the laminated graphite sheet described above; for example, aluminum foil tape or copper foil tape may also be used. When functional components that require heat transfer are laid out in the left-right direction of the housing, as in the image capture device 200 of this embodiment, the attachment of the heat transfer member 60 must be considered. For this reason, it is preferable that the opening 541 formed in the heat dissipation plate 54 be elongated in the vertical direction of the image capture device 200, as shown in FIGS. 8( a) and 9(a). Forming the opening 541 elongated in the vertical direction ensures a wide attachment area for the heat transfer member 60 in the left-right direction of the opening 541, and also ensures a wider width of the sheet material in the heat transfer direction of the heat transfer member 60.

[0070] In this embodiment, the housing style of the imaging device 200 is configured to resemble a so-called rangefinder camera. To layout the various functional components in this housing style, the heat dissipation direction from the heat transfer member 60 is configured to be in the left-right direction of the housing. However, the housing style of imaging devices can be configured in a variety of ways, and appropriate heat dissipation structures are considered and formed for each case, such as action cameras, omnidirectional cameras, and new genre cameras specialized for specific functions. Therefore, the heat dissipation direction of the imaging sensor is considered depending on the housing style of the imaging device and other constraints, and it is fully expected that forming a heat dissipation path in the up-down direction of the housing, as shown in FIG. 10(b), for example, will be effective.

[0071] This embodiment can also employ an imaging sensor package 131 similar to that of the first embodiment. As described in the first embodiment, the electrode surfaces of the imaging sensor package 131 are electrolytically gold plated. For the purpose of electrolytic plating, plating leads 131e extend from the wiring patterns connected to each electrode to the outside of the package base 131b. The plating leads 131e generally extend from the inner wiring pattern of the package base 131b to the side of the package and are cut from the outside when the exterior of the imaging sensor package 131 is processed. Therefore, the cut surfaces of the plating leads 131e are exposed on the side surfaces of the package base 131b. In this embodiment, the sensor plate 12 that adhesively fixes the imaging sensor package 131 and the imaging sensor package 131 are integrated in a non-contact state via the adhesive 16. This eliminates concerns about electrical shorts between the plating leads 131e, allowing for highly accurate positioning.

[0072] 7, lens barrel 50 in this embodiment is configured so that lens barrel 50 can be handled as a unit with image pickup device 200. Furthermore, by filling paste-like heat dissipation material 65 between heat dissipation plate 54 and imaging board 13, the filling range is configured to remain within the range of the unit configuration of lens barrel 50. In other words, lens barrel 50 including paste-like heat dissipation material 65 is completed once. This makes it possible to reduce the scattering of paste-like heat dissipation material 65 from the filling range to the outside, even if it becomes necessary to partially disassemble image pickup device 200 during the manufacturing process of image pickup device 200, for example.

[0073] As described above, lens barrel 50, like lens barrel 10, is configured to be separable into lens drive unit 17 and sensor holder unit 58. Therefore, sensor holder unit 58 can be handled while paste-like heat dissipation material 65 remains inside the integrated unit of image sensor package 131. This reduces problems such as scattering of paste-like heat dissipation material 65 during inspection of lens drive unit 17, making it possible to carry out the inspection more favorably.

[0074] According to each embodiment, it is possible to provide an imaging device and a method for manufacturing an imaging device that can suppress degradation of image quality due to electromagnetic induction noise propagating to the imaging sensor while maintaining the imaging sensor with high precision.

[0075] The disclosure of each embodiment includes the following configurations and methods. (Configuration 1) a first substrate having an image sensor package including an image sensor disposed on a first surface thereof and a plurality of electronic components disposed on a second surface opposite to the first surface thereof; a holding member having a first opening, the holding member holding the image sensor package in a state where an inner side surface of the first opening faces a side surface of the image sensor package with a predetermined distance maintained between them; a shielding member that is grounded to the holding member and covers at least a part of the side surface and the second surface of the first substrate, a connection portion electrically connected to a second substrate is disposed on the second surface of the first substrate; a second opening is formed in the shielding member at a position opposite to the connection portion; The imaging device is characterized in that, when viewed from the optical axis direction, the second substrate is configured to cover the second opening. (Configuration 2) further comprising a third substrate that controls the imaging device; The imaging device according to configuration 1, wherein the second substrate is a flexible printed circuit board and electrically connects the third substrate and the first substrate. (Configuration 3) the shielding member is fixed to the holding member, 3. The imaging device according to configuration 1 or 2, wherein the first substrate, the holding member, and the shielding member are integrally configured to be detachable from the lens barrel. (Configuration 4) the connecting portion is a board-to-board connector, 4. The imaging device according to any one of configurations 1 to 3, wherein the stacking height of the connection portion is greater than the opposing distance between the first substrate and the shielding member. (Configuration 5) the first opening of the holding member is larger than an outer shape of the image sensor package; The outer shape of the first substrate is larger than the first opening, 5. The imaging device according to any one of configurations 1 to 4, wherein the shielding member encloses and shields the outer shape of the first substrate. (Configuration 6) the holding member and the shielding member are each made of a metal material or a member coated with a shielding coating; the holding member is disposed to face four sides of the rectangular image sensor package and to face closely to a portion of the first surface of the first substrate; the second substrate has a ground wiring that covers the second opening, 6. The imaging device according to any one of configurations 1 to 5, wherein the first substrate is shielded by the holding member, the shielding member, and the second substrate. (Configuration 7) the second substrate has a plurality of laminated conductor layers; the ground wiring is formed on a first conductor layer of the laminated conductor layers that is farthest from the first substrate; The imaging device according to configuration 6, wherein a signal line electrically connecting the first substrate and the third substrate is formed on a second conductor layer different from the first conductor layer. (Configuration 8) 8. The imaging device according to configuration 6 or 7, wherein the ground wiring and the shielding member are electrically connected directly or indirectly. (Configuration 9) The shielding member has a third opening formed therein, At least some of the electronic components are arranged at positions exposed through the third opening, 9. The imaging device according to any one of configurations 1 to 8, wherein the second substrate is configured to cover the third opening when viewed from the optical axis direction. (Configuration 10) 10. The imaging device according to any one of configurations 1 to 9, wherein at least one of the shielding member and the second substrate is provided with an index used for aligning the second substrate. (Configuration 11) a first substrate having an image sensor package including an image sensor disposed on a first surface thereof and a plurality of electronic components disposed on a second surface opposite to the first surface thereof; a holding member having a first opening, the holding member holding the image sensor package in a state where an inner side surface of the first opening faces a side surface of the image sensor package with a predetermined distance maintained between them; a heat dissipation member that is grounded to the holding member and covers at least a part of the side surface and the second surface of the first substrate, a connection portion electrically connected to a second substrate is disposed on the second surface of the first substrate; the heat dissipation member faces the second surface of the first substrate in a region away from the connection portion, An imaging device, characterized in that a heat dissipating paste member is disposed in at least a part of the region between the heat dissipating member and the first substrate. (Configuration 12) 12. The imaging device according to configuration 11, wherein heat from the plurality of electronic components is dissipated to the heat dissipation member via the heat dissipation paste member. (Configuration 13) 13. The imaging device according to claim 11, wherein the heat dissipating paste member is filled between the plurality of electronic components. (Configuration 14) 14. The imaging device according to any one of configurations 11 to 13, wherein the heat dissipating paste members are disposed in the first region and the second region so as to sandwich the connecting portion. (Configuration 15) the heat dissipation member has a drawn portion, 15. The imaging device according to any one of configurations 11 to 14, wherein at least some of the electronic components are disposed in positions facing the drawn portion. (Configuration 16) a fourth opening is formed in the heat dissipation member, 16. The imaging device according to any one of configurations 11 to 15, wherein at least some of the electronic components are exposed through the fourth opening. (Configuration 17) 17. The imaging device according to claim 16, wherein the heat dissipating paste member is disposed at a position away from the fourth opening. (Configuration 18) 18. The imaging device according to any one of configurations 11 to 17, wherein the heat dissipation member has a side wall portion that covers at least a part of the plurality of electronic components from the side. (Configuration 19) 19. The imaging device according to any one of configurations 11 to 18, further comprising a heat sink that receives heat from the heat sink member. (Configuration 20) 20. The imaging device according to claim 19, wherein the heat dissipator includes at least one of a heat sink and a fan motor. (Configuration 21) the heat dissipation member is fixed to the holding member, 21. The imaging device according to any one of configurations 11 to 20, wherein the first substrate, the holding member, and the heat dissipation member are integrally configured to be detachable from the lens barrel. (Configuration 22) The image sensor package includes: a base member that houses the image sensor; and plated leads exposed from the side surfaces of the base member, 22. The imaging device according to any one of configurations 1 to 21, wherein the holding member and the plated leads face each other at the predetermined interval. (Configuration 23) 23. The imaging device according to any one of configurations 1 to 22, wherein the lens barrel is configured to be detachable. (Configuration 24) a lens driving unit including at least one lens, and a sensor holder unit including the imaging sensor; 24. The imaging device according to any one of configurations 1 to 23, wherein the lens driving unit and the sensor holder unit are separable. (Method 1) disposing an image sensor package including an image sensor on a first surface of a first substrate; arranging a plurality of electronic components on a second surface of the first substrate opposite to the first surface; forming a first opening in a holding member, and holding the image sensor package in a state where an inner side surface of the first opening faces a side surface of the image sensor package with a predetermined distance maintained between them; grounding a heat dissipation member to the holding member and arranging the heat dissipation member so as to cover at least a portion of a side surface of the first substrate and the second surface; arranging a connection portion on the second surface of the first substrate, the connection portion being electrically connected to a second substrate; and placing a heat-dissipating paste member in at least a portion of the region between the heat-dissipating member and the first substrate.

[0076] Although the preferred embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and various modifications and changes are possible within the scope of the gist of the present invention. [Explanation of symbols]

[0077] 12 Sensor plate (holding member) 13 Imaging board (first board) 14 Shielding plate (shielding member) 15 FPC (second board) 100 Imaging device 121 Opening (First Opening) 131 Image sensor package 131a Image sensor 132 Connector (Connection) 135 Electronic Components 141 Opening (Second Opening)

Claims

1. a first substrate having an image sensor package including an image sensor disposed on a first surface thereof and a plurality of electronic components disposed on a second surface thereof opposite to the first surface; a holding member having a first opening, the holding member holding the image sensor package in a state where an inner side surface of the first opening faces a side surface of the image sensor package with a predetermined distance maintained between them; a shielding member that is grounded to the holding member and covers at least a part of the side surface and the second surface of the first substrate, a connection portion electrically connected to a second substrate is disposed on the second surface of the first substrate; a second opening is formed in the shielding member at a position facing the connection portion; The imaging device, characterized in that the second substrate is configured to cover the second opening when viewed from the optical axis direction.

2. a third substrate that controls the imaging device; 2. The imaging device according to claim 1, wherein the second substrate is a flexible printed circuit board, and electrically connects the third substrate and the first substrate.

3. the shielding member is fixed to the holding member, 2. The imaging device according to claim 1, wherein the first substrate, the holding member, and the shielding member are integrally configured to be detachable from the lens barrel.

4. the connecting portion is a board-to-board connector, The imaging device according to claim 1 , wherein a stacking height of the connection portion is greater than a distance between the first substrate and the shielding member.

5. the first opening of the holding member is larger than an outer shape of the image sensor package; The outer shape of the first substrate is larger than the first opening, The imaging device according to claim 1 , wherein the shielding member encloses and shields the outer shape of the first substrate.

6. the holding member and the shielding member are each made of a metal material or a member coated with a shielding coating; the holding member is disposed to face four sides of the rectangular image sensor package and to face closely to a portion of the first surface of the first substrate; the second substrate has a ground wiring covering the second opening, 2. The imaging device according to claim 1, wherein the first substrate is shielded by the holding member, the shielding member, and the second substrate.

7. the second substrate has a plurality of laminated conductor layers; the ground wiring is formed on a first conductor layer of the laminated conductor layers that is farthest from the first substrate; 7. The imaging device according to claim 6, wherein a signal line electrically connecting the first substrate and the third substrate is formed on a second conductor layer different from the first conductor layer.

8. 7. The imaging device according to claim 6, wherein the ground wiring and the shielding member are electrically connected directly or indirectly.

9. The shielding member has a third opening formed therein, At least some of the electronic components are arranged at positions exposed through the third opening, The imaging device according to claim 1 , wherein the second substrate is configured to cover the third opening when viewed from the optical axis direction.

10. 2. The imaging device according to claim 1, wherein at least one of the shielding member and the second substrate is provided with an index used for aligning the second substrate.

11. a first substrate having an image sensor package including an image sensor disposed on a first surface thereof and a plurality of electronic components disposed on a second surface thereof opposite to the first surface; a holding member having a first opening, the holding member holding the image sensor package in a state where an inner side surface of the first opening faces a side surface of the image sensor package with a predetermined distance maintained between them; a heat dissipation member that is grounded to the holding member and covers at least a portion of the side surface and the second surface of the first substrate, a connection portion electrically connected to a second substrate is disposed on the second surface of the first substrate; the heat dissipation member faces the second surface of the first substrate in a region away from the connection portion, An imaging device, characterized in that a heat dissipating paste member is disposed in at least a portion of the area between the heat dissipating member and the first substrate.

12. 12. The imaging device according to claim 11, wherein heat from the plurality of electronic components is dissipated to the heat dissipation member via the heat dissipation paste member.

13. 12. The imaging device according to claim 11, wherein the heat dissipating paste material is filled between the plurality of electronic components.

14. 12. The imaging device according to claim 11, wherein the heat dissipating paste member is disposed in each of the first and second regions so as to sandwich the connecting portion.

15. the heat dissipation member has a drawn portion, 12. The imaging device according to claim 11, wherein at least some of the electronic components are disposed in positions facing the drawn portion.

16. a fourth opening is formed in the heat dissipation member, The imaging device according to claim 11 , wherein at least some of the electronic components are exposed from the fourth opening.

17. 17. The imaging device according to claim 16, wherein the heat dissipating paste member is disposed at a position away from the fourth opening.

18. 12. The imaging device according to claim 11, wherein the heat dissipation member has a side wall portion that covers at least a part of the plurality of electronic components from a side surface direction.

19. 12. The imaging device according to claim 11, further comprising a heat sink that receives heat from the heat sink member.

20. 20. The imaging device according to claim 19, wherein the heat dissipator includes at least one of a heat sink and a fan motor.

21. the heat dissipation member is fixed to the holding member, 12. The imaging device according to claim 11, wherein the first substrate, the holding member, and the heat dissipation member are configured to be detachable from the lens barrel as a single unit.

22. The image sensor package includes: a base member that houses the image sensor; and plated leads exposed from the side surfaces of the base member, 22. The imaging device according to claim 1, wherein the holding member and the plated leads face each other at the predetermined interval.

23. 22. The imaging device according to claim 1, wherein the lens barrel is detachably mounted.

24. a lens driving unit including at least one lens, and a sensor holder unit including the imaging sensor; 22. The imaging device according to claim 1, wherein the lens driving unit and the sensor holder unit are separable.

25. disposing an image sensor package including an image sensor on a first surface of a first substrate; disposing a plurality of electronic components on a second surface of the first substrate opposite to the first surface; forming a first opening in a holding member, and holding the image sensor package in a state where an inner side surface of the first opening faces a side surface of the image sensor package with a predetermined distance maintained between them; grounding a heat dissipation member to the holding member and arranging the heat dissipation member so as to cover at least a portion of a side surface of the first substrate and the second surface; disposing a connection portion on the second surface of the first substrate, the connection portion being electrically connected to a second substrate; and placing a heat-dissipating paste member in at least a portion of the region between the heat-dissipating member and the first substrate.

Images