Display device

Abstract

To provide a novel functional panel which is superior in convenience or reliability, and to provide a method of manufacturing the novel functional panel that is superior in convenience or reliability.SOLUTION: A novel functional panel includes a first base material, a second base material having a region overlapping with the first base material, a bonding layer bonding the first base material and second base material to each other, and an insulating layer in contact with the first base material and second base material. Consequently, a gap which is apt to be formed in a region where the bonding layer is in contact with the first base material or a region where the bonding layer is in contact with the second base material can be filled with the insulating layer, and a phenomenon can be suppressed in which impurities are diffused in a functional layer in a region encircled with the first base material, the second base material, and the bonding layer bonding the first base material and second base material to each other.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] One embodiment of the present invention is a functional panel, a manufacturing method of a functional panel, a module, or an information processing device. Regarding.

[0002] Note that one embodiment of the present invention is not limited to the above technical fields. The technical field of one aspect relates to an article, a method, or a manufacturing method. One aspect of the present invention is a process, machine, manufacture, or composition. Therefore, the invention disclosed herein more specifically relates to The technical field of one embodiment of the present invention is a semiconductor device, a display device, a light-emitting device, a power storage device, a memory device, Examples of information processing devices, their driving methods, or their manufacturing methods are given below. can be done. [Background technology]

[0003] There are functional elements whose functions are impaired by the diffusion of impurities. In order to maintain the function of the functional element, the functional element is attached to the substrate on which it is provided, the sealing substrate, and the front There is known an invention in which the substrate and the sealing substrate are sealed in a space surrounded by a sealing material that bonds the substrate and the sealing substrate. (Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] US Patent Application Publication No. 2007 / 0170854 Summary of the Invention [Problem to be solved by the invention]

[0005] An object of one aspect of the present invention is to provide a novel functional panel that is highly convenient and reliable. Alternatively, a method for producing a novel functional panel that is highly convenient and reliable is provided. Alternatively, a novel functional panel, a method for manufacturing the novel functional panel, or An object of the present invention is to provide a novel semiconductor device.

[0006] The description of these problems does not preclude the existence of other problems. It is not necessary for the present invention to solve all of these problems. The above will be made clear from the description, drawings, claims, etc. It is possible to extract other issues from the descriptions in the patent, claims, etc. [Means for solving the problem]

[0007] One aspect of the present invention is a method for manufacturing a semiconductor device, comprising: a first substrate; a second substrate having an area overlapping the first substrate; a bonding layer having a function of bonding a second substrate to one surface of the first substrate; The insulating layer in contact with the first substrate and the bonding layer, and the area surrounded by the first substrate, the second substrate, and the bonding layer. and a functional layer.

[0008] The functional layer includes a plurality of functional elements.

[0009] Another embodiment of the present invention is the functional panel, wherein the functional element includes a light-emitting element.

[0010] Another aspect of the present invention is the functional panel, wherein the functional element includes a display element.

[0011] Another aspect of the present invention is the functional panel, in which the functional element includes a transistor.

[0012] The functional panel according to one aspect of the present invention includes a first substrate and a second substrate having an area overlapping the first substrate. a bonding layer that bonds the first and second substrates together; and an insulating layer in contact with the bonding layer. This allows the bonding layer to be bonded to the first base material. The insulating layer fills gaps that tend to occur in the area where the bonding layer contacts the second substrate or the area where the bonding layer contacts the second substrate. and a bonding method for bonding a first substrate and a second substrate, and a bonding method for bonding the first substrate and the second substrate. This can prevent impurities from diffusing into the functional layer in the area surrounded by the layer. As a result, a novel functional panel with excellent convenience and reliability can be provided.

[0013] Another aspect of the present invention is a method for producing a functional panel, which includes the following six steps:

[0014] In a first step, a first substrate and a second substrate having an area overlapping the first substrate are provided. a bonding layer having a function of bonding a second substrate to one surface of the first substrate; and a functional layer in an area surrounded by the substrate and the bonding layer, the functional layer including a plurality of functional elements. A workpiece to be processed is prepared and fed to the workpiece support portion.

[0015] In the second step, the temperature of the processed member is controlled to a predetermined value, and the processed member support is internally The chamber prepared for the test is evacuated.

[0016] In the third step, a source gas containing a precursor compound is supplied to the chamber. The source gas is then purged from the chamber.

[0017] In the fourth step, a source gas containing an oxidizing agent is supplied to the chamber, and after the supply, the source gas is The source gas is purged from the chamber.

[0018] In the fifth step, the cycle including the third and fourth steps is repeated. If the number is less than the predetermined number, return to the third step. If the number is greater than or equal to the predetermined number, proceed to step 6.

[0019] In the sixth step, the processed member is removed from the chamber. Finish.

[0020] Another aspect of the present invention is a method for producing a functional panel, which includes the following eight steps:

[0021] In a first step, a first substrate and a second substrate having an area overlapping the first substrate are provided. a first bonding layer having a function of bonding a second substrate to one surface of the first substrate, and a second bonding layer a bonding layer, a first functional layer in an area surrounded by the first substrate, the second substrate, and the first bonding layer; a second functional layer in an area surrounded by the first substrate, the second substrate, and the second bonding layer; A first functional layer and a second functional layer each include a plurality of functional elements. Then, an opening is formed in a region of the second substrate that overlaps the region between the first bonding layer and the second bonding layer. Form a part.

[0022] In a second step, the workpiece is fed onto a workpiece support.

[0023] In the third step, the temperature of the processed member is controlled to a predetermined value, and the processed member support is internally The chamber prepared for the test is evacuated.

[0024] In the fourth step, a source gas containing a precursor compound is supplied to the chamber. The source gas is then purged from the chamber.

[0025] In the fifth step, a source gas containing an oxidizing agent is supplied to the chamber, and after the supply, the source gas is The source gas is purged from the chamber.

[0026] In the sixth step, the cycle including the third and fourth steps is repeated. If the number is less than the predetermined number, return to the fourth step. If the number is equal to or greater than the predetermined number, proceed to the seventh step.

[0027] In the seventh step, the workpiece is removed from the chamber. Exit.

[0028] In an eighth step, a workpiece is placed in the area between the first bonding layer and the second bonding layer. The area is divided along the

[0029] The method for manufacturing a functional panel according to one aspect of the present invention includes supplying a raw material gas containing a precursor compound; a step of purging the source gas from the chamber after supplying the source gas; and a step of supplying the source gas containing the oxidizer. and purging the source gas from the chamber after the supply. This allows an insulating layer containing an oxide of the precursor compound to be formed on the surface of the processed member. As a result, a novel method for producing a functional panel can be provided.

[0030] A module having any one of the functional panels described above and an FPC or a touch sensor. It's Joules.

[0031] Any one of the above-described functional panels or modules, and a microphone, an antenna, a The information processing device has a battery, an operation switch, or a housing.

[0032] In this specification, the EL layer refers to a layer provided between a pair of electrodes of a light-emitting element. Therefore, the light-emitting layer containing an organic compound, which is a light-emitting material sandwiched between the electrodes, is one of the EL layers. This is an aspect.

[0033] In this specification, the term "light emitting device" refers to an image display device or a light source (including a lighting device). ) and also refers to the use of connectors, such as FPC (Flexible Printed Circuit) ed circuit) or TCP (Tape Carrier Package) modules with a TCP attached, modules with a printed wiring board at the end of the TCP, or or a substrate on which a light emitting element is formed, using the COG (Chip On Glass) method to mount an IC The module directly mounted with the (integrated circuit) may include a light emitting device. [Effects of the Invention]

[0034] According to one aspect of the present invention, a novel functional panel that is highly convenient or reliable can be provided. Alternatively, a novel method for producing a functional panel that is highly convenient and reliable can be provided. A novel functional panel, a novel method for manufacturing a functional panel, or a novel semiconductor device can be provided. Cut.

[0035] The description of these effects does not preclude the existence of other effects. The embodiment does not necessarily have to have all of these effects. , the specification, drawings, claims, etc., and It is possible to extract other effects from the claims and other descriptions. [Brief explanation of the drawings]

[0036] [Figure 1] 3A and 3B are diagrams illustrating a configuration of a function panel according to an embodiment. [Figure 2] 3A and 3B are diagrams illustrating a configuration of a function panel according to an embodiment. [Figure 3] 3A and 3B are diagrams illustrating a configuration of a function panel according to an embodiment. [Figure 4] 3A and 3B are diagrams illustrating a configuration of a function panel according to an embodiment. [Figure 5] 1 is a flowchart illustrating a manufacturing method of a functional panel according to an embodiment. [Figure 6] 1A to 1C are schematic diagrams illustrating a method for manufacturing a functional panel according to an embodiment. [Figure 7] 1 is a flowchart illustrating a manufacturing method of a functional panel according to an embodiment. [Figure 8] 1A to 1C are schematic diagrams illustrating a method for manufacturing a functional panel according to an embodiment. [Figure 9] 1A and 1B are schematic diagrams illustrating a configuration of a film formation system that can be used to manufacture a functional panel according to an embodiment. [Figure 10] 1A and 1B are schematic diagrams illustrating a structure of a film formation apparatus that can be used to manufacture a functional panel according to an embodiment. [Figure 11] 3A and 3B are diagrams illustrating a configuration of a function panel according to an embodiment. [Figure 12] 3A and 3B are diagrams illustrating a configuration of a function panel according to an embodiment. [Figure 13] 3A and 3B are diagrams illustrating a configuration of a function panel according to an embodiment. [Figure 14] FIG. 1 is a diagram illustrating a configuration of an information processing device according to an embodiment. [Figure 15] FIG. 1 is a diagram illustrating a configuration of an information processing device according to an embodiment. [Figure 16] FIG. 1 is a diagram illustrating a configuration of an information processing device according to an embodiment. [Figure 17] 3A and 3B are diagrams illustrating a configuration of a function panel according to an embodiment. [Figure 18] 3A and 3B are diagrams illustrating a configuration of a function panel according to an embodiment. [Figure 19] 3A and 3B are diagrams illustrating a configuration of a function panel according to an embodiment. [Figure 20]3A and 3B are diagrams illustrating a configuration of a function panel according to an embodiment. [Figure 21] 3A and 3B are diagrams illustrating a configuration of a function panel according to an embodiment. [Figure 22] 3A and 3B are diagrams illustrating a configuration of a function panel according to an embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0037] The functional panel according to one embodiment of the present invention includes a first substrate and a second substrate having an area overlapping the first substrate. a substrate, a bonding layer for bonding the first substrate and the second substrate, and a bonding layer for bonding the first substrate, the second substrate, and the and an insulating layer in contact with the bonding layer.

[0038] As a result, the bonding layer is bonded to the first substrate or the second substrate. The insulating layer can fill gaps that tend to occur, and the first base material, the second base material, and the first Impurities diffuse into the functional layer in the area surrounded by the bonding layer that bonds the base material and the second base material. As a result, a novel functional panel with excellent convenience and reliability can be produced. We can provide you with the following:

[0039] The embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description. The present invention is not limited to the above embodiments, and various changes and modifications may be made in the form and details thereof without departing from the spirit and scope of the present invention. It will be readily understood by those skilled in the art that the present invention can be achieved by the following embodiments. It should not be construed as being limited to the contents of the description. The same reference numerals are used in different drawings to denote the same parts or parts having similar functions. A repeated explanation will be omitted.

[0040] (Embodiment 1) In this embodiment, a structure of a functional panel according to one embodiment of the present invention will be described with reference to FIGS. While explaining.

[0041] FIG. 1 is a diagram illustrating the configuration of a functional panel according to one embodiment of the present invention. 1(B) is a top view of the functional panel 200 of the embodiment, and FIG. 1(B) is a top view of the functional panel 200 of the embodiment, taken along the cutting lines AB and AB in FIG. 1(A). 1(C) and 1(D) are cross-sectional views taken along the cutting line CD. 10 is a cross-sectional view illustrating a configuration that can replace a portion of the configuration shown in FIG.

[0042] <Example 1 of the function panel configuration> The functional panel 200 described in this embodiment includes a first base material 210 and a second base material 210. A second substrate 270 having an overlapping area and a second substrate 27 on one side of the first substrate 210. 0, a first substrate 210, a second substrate 270, and The insulating layer 290 in contact with the bonding layer 205, the first base material 210, the second base material 270, and the bonding The region surrounded by the layer 205 includes a functional layer (see FIG. 1(A)).

[0043] The functional layer includes a plurality of functional elements.

[0044] The functional panel 200 described in this embodiment includes a first base material 210, a second base material 270, and , a bonding layer 205 that bonds the first substrate 210 and the second substrate 270, and a bonding layer 205 that bonds the first substrate 210 and the second substrate 270 together. 0, the second base material 270, the bonding layer 205, and the insulating layer 290 in contact therewith. In addition, flexible materials may be used for the first substrate 210 and the second substrate 270. can.

[0045] As a result, the bonding layer is bonded to the first substrate or the second substrate. The insulating layer can fill gaps that tend to occur, and the first base material, the second base material, and the first Impurities diffuse into the functional layer in the area surrounded by the bonding layer that bonds the base material and the second base material. In addition, the first substrate 210 and the second substrate 220 are made of a flexible material. When used with the substrate 270, it can be bent or folded. A novel functional panel with excellent convenience and reliability can be provided.

[0046] The light emitting element 250R can be used as a functional element. The functional panel 200 can be called a light-emitting module.

[0047] In addition, a display element can be used as a functional element. 00 can be said to be a display module.

[0048] Moreover, the driving transistor M0 can be used as a functional element.

[0049] In addition, the functional panel 200 according to one embodiment of the present invention includes a pixel 202, a control signal supplied to the pixel 202, and a a driver circuit GD for supplying a display signal to the pixel 202; a driver circuit SD for supplying a display signal to the pixel 202; The area 201 has a region where the ion beam is provided (see FIGS. 1(A) and 1(B)).

[0050] The pixel 202 is supplied with a display signal (see FIG. 1A). The subpixel 202R has a function of displaying red. The pixel includes a sub-pixel for displaying blue and a sub-pixel for displaying blue.

[0051] The subpixel 202R includes a pixel circuit and a display module 280R (see FIG. 1(B)). .

[0052] The pixel circuit includes a drive transistor M0 and a capacitance element C.

[0053] The display module 280R includes a light emitting element 250R, a light emitting element 250R, and a light emitting element 250R. The colored layer 267R has an area overlapping with the light-emitting element 250R. It can be said that this is one aspect of a display element.

[0054] The light emitting element 250R includes a lower electrode, an upper electrode, and a layer containing a light emitting organic compound.

[0055] The circuit includes a driving transistor M0 and is connected between the first substrate 210 and the light-emitting element 250R. The circuit is sandwiched between the light emitting element 250R and the insulating film 221.

[0056] The driving transistor M0 has a second electrode. The second electrode is provided on the insulating film 221. It is electrically connected to the lower electrode of the light emitting element 250R through the opening.

[0057] The capacitance element C has a first electrode and a second electrode. The first electrode is connected to the driving transistor M0 and a second electrode electrically connected to the second electrode of the driving transistor M0. are connected to the network.

[0058] The drive circuit SD includes a transistor MD and a capacitor CD.

[0059] The functional panel 200 according to one embodiment of the present invention includes wiring 211 electrically connected to the driving circuit SD. A terminal 219 electrically connected to the wiring 211 and a frame electrically connected to the terminal 219 are provided. and a flexible printed circuit board 209.

[0060] In addition, a light-shielding layer 267BM having an opening in a region overlapping with the sub-pixel 202R is provided.

[0061] In addition, a partition wall 228 is provided with an opening in the area overlapping the light emitting element 250R and covers the end of the lower electrode. Equipped with.

[0062] It also has a functional film 267p that has an area that overlaps with the area 201 (see FIG. 1(B)).

[0063] The functional panel 200 can display information on the side where the second base material 270 is provided. This can be done.

[0064] The individual elements that make up the functional panel 200 according to one embodiment of the present invention will be described below. These configurations cannot be clearly separated, and one configuration may also serve as another configuration. Some may be included.

[0065] Overall composition The functional panel 200 includes a first substrate 210, a second substrate 270, a bonding layer 205, an insulating layer 29, and a bonding layer 205. 0 or functional layer.

[0066] The functional panel 200 includes a pixel 202, a driving circuit GD, a driving circuit SD, and a region 201. Pixel 202R, drive transistor M0, capacitance element C, display module 280R, light-emitting element 250R, colored layer 267R, pixel circuit, insulating film 221, wiring 211, terminal 219, flexible A flexible printed circuit board 209, a light-shielding layer 267BM, a partition wall 228 or a functional film 267p do.

[0067] <<First substrate 210>> The first base material 210 has a heat resistance sufficient to withstand the manufacturing process and a thickness that is applicable to the manufacturing equipment. There are no particular limitations as long as it has the required thickness and size.

[0068] The first substrate 210 is made of an organic material, an inorganic material, or a composite material of an organic material and an inorganic material. For example, inorganic materials such as glass, ceramics, and metal can be used for the first substrate 210. It can be used for.

[0069] Specifically, alkali-free glass, soda-lime glass, potash glass, or crystal glass The first substrate 210 may be made of an inorganic oxide film, an inorganic nitride film, or the like. A film or an inorganic oxynitride film can be used for the first substrate 210. For example, a silicon oxide film The first base material 210 can be made of silicon, silicon nitride, silicon oxynitride, alumina film, or the like. The first base material 210 can be made of SUS, aluminum, or the like.

[0070] For example, the first substrate 210 may be made of an organic material such as a resin, a resin film, or a plastic. Specifically, polyester, polyolefin, polyamide, polyimide A resin film or a resin plate such as polycarbonate or acrylic resin is placed on the first substrate 2. It can be used for 10.

[0071] For example, a metal plate, a thin glass plate, or a film of an inorganic material is laminated to a resin film or the like. A composite material such as fibrous or particulate gold can be used for the first substrate 210. A composite material in which metal, glass, or inorganic material is dispersed in a resin film is applied to the first substrate 210. For example, fibrous or particulate resin or organic material can be used as an inorganic material. The first substrate 210 may be a composite material dispersed in a material.

[0072] In addition, a single layer material or a multi-layer laminated material may be used for the first substrate 210. For example, a material that is laminated with a base material and an insulating film that prevents the diffusion of impurities contained in the base material can be used. , can be used for the first substrate 210. Specifically, glass and impurities contained in glass can be used for the first substrate 210. A silicon oxide layer, a silicon nitride layer, a silicon oxynitride layer, or the like that prevents diffusion of substances A material having one or more films laminated thereon can be applied to the first substrate 210. Alternatively, a resin and silicon oxide film, silicon nitride film or silicon oxynitride film that prevents the diffusion of impurities that penetrate the resin. A material having a silicon film or the like laminated thereon can be applied to the first substrate 210.

[0073] Furthermore, a flexible material can be used for the first base material 210. For example, Use a material that is flexible enough to be able to be folded or folded. Specifically, it is 5 mm or more, preferably 4 mm or more, more preferably 3 mm or more, It is particularly preferable to use a material that can be bent with a curvature radius of 1 mm or more. The thickness is 2.5 μm or more and 3 mm or less, preferably 5 μm or more and 1.5 mm or less, more preferably 10 A material having a thickness of 500 μm or more can be used for the first substrate 210 (see FIG. 2).

[0074] Specifically, the substrate 210b has flexibility, the barrier film 210a prevents the diffusion of impurities, and The laminate in which the base material 210b and the resin layer 210c that bonds the barrier film 210a are laminated is 1 can be used for the substrate 210.

[0075] Second substrate 270 A material that can be used for the first base material 210 and has light-transmitting properties in the area that overlaps with the display element is used. , can be used for the second base material 270. In addition, a flexible material can be used for the second base material 270. Specifically, the flexible substrate 270b can be used to prevent the diffusion of impurities. The barrier film 270a and the resin layer 270b are bonded to the substrate 270b. A laminate in which c is laminated can be used as the second base material 270.

[0076] 《Joining layer 205》 A material capable of bonding the first base material 210 and the second base material 270 is used as the bonding layer 2. Can be used for 05.

[0077] The bonding layer 205 may be made of an inorganic material, an organic material, or a composite material of an inorganic material and an organic material. can be done.

[0078] For example, a glass layer or adhesive having a melting point of 400°C or less, preferably 300°C or less, is used. It is possible.

[0079] For example, light-curing adhesives, reaction-curing adhesives, heat-curing adhesives, and / or anaerobic adhesives. The bonding layer 205 can be made of an organic material such as an adhesive.

[0080] Specifically, epoxy resin, acrylic resin, silicone resin, phenolic resin, polyimide resin, imide resin, PVC (polyvinyl chloride) resin, PVB (polyvinyl butyrate) Adhesives containing Ethylene Vinyl Acetate (EVA) resin, etc. can be used. do.

[0081] Insulating layer 290 The insulating layer 2 is made of a material having electrical insulating properties or a material having a function of suppressing the diffusion of impurities. 90. For example, oxides, nitrides, fluorides, sulfides, ternary compounds, Metals or polymers can be used for the insulating layer 290 .

[0082] For example, aluminum oxide, hafnium oxide, hafnium silicate, lanthanum oxide, acid silicon dioxide, strontium titanate, tantalum oxide, titanium oxide, zinc oxide, niobium oxide, Zirconium oxide, tin oxide, yttrium oxide, cerium oxide, scandium oxide, acid Materials including erbium oxide, vanadium oxide, or indium oxide can be used. .

[0083] For example, aluminum nitride, hafnium nitride, silicon nitride, tantalum nitride, titanium nitride, Materials including niobium nitride, molybdenum nitride, zirconium nitride, or gallium nitride are used. It is possible.

[0084] For example, copper, platinum, ruthenium, tungsten, iridium, palladium, iron, cobalt Alternatively, a material containing nickel or the like can be used.

[0085] For example, zinc sulfide, strontium sulfide, calcium sulfide, lead sulfide, calcium fluoride, Materials containing strontium fluoride or zinc fluoride can be used.

[0086] For example, nitrides containing titanium and aluminum, oxides containing titanium and aluminum, oxides containing aluminum and zinc, sulfides containing manganese and zinc, cerium and sulfides containing strontium, oxides containing erbium and aluminum, Materials including oxides containing thorium and zirconium can be used.

[0087] For example, atomic layer deposition (ALD) Any material that can be formed using a dense, crystalline silicon can be used for the insulating layer 290. The insulating layer 290 has reduced defects such as gaps and pinholes or has a uniform thickness. The insulating layer 290 can be formed by atomic layer deposition. This reduces damage to the material.

[0088] Functional Layer Functional circuits, functional elements, optical elements, functional films, etc., or layers containing a plurality of these can be used for the functional layer.

[0089] For example, an electric element or a biochip can be used as the functional layer. A transistor, a capacitance element, a resistance element, a memory element, a light-emitting element, a display element, or the like can be used. can.

[0090] For example, a display element and a pixel circuit for driving the display element can be used as the functional layer.

[0091] For example, a touch sensor, a color filter, a moisture-proof film, or the like can be used as the functional layer.

[0092] 《Area 201》 The region 201 includes a plurality of functional elements. For example, the functional elements are arranged in a matrix. Specifically, it comprises a plurality of pixels 202 arranged in a matrix. The function panel 200 can display image information in an area 201 .

[0093] 《Pixel 202》 Multiple sub-pixels can be used in pixel 202. For example, sub-pixel 202 that displays red A sub-pixel that displays R, a sub-pixel that displays green, and a sub-pixel that displays blue can be used. , a sub-pixel that displays yellow, a sub-pixel that displays white, a sub-pixel that displays cyan, and a sub-pixel that displays magenta. Sub-pixels for display can be used.

[0094] Subpixel A display element and a pixel circuit for driving the display element can be used for the sub-pixel.

[0095] In addition, the insulating film 221 is used between the functional layer including the display element and the functional layer including the pixel circuit. can be done.

[0096] For example, an inorganic material, an organic material, or a composite material of an inorganic material and an organic material is used for the insulating film 221. Specifically, a film containing silicon and nitrogen, a film containing silicon and oxygen, a poly A film containing imide, a film containing acrylic resin, a film containing silicone resin, or a film made from these films The insulating film 221 can be a film in which a plurality of selected films are stacked.

[0097] The functional panel 200 includes a light-shielding layer 267 having an opening in the area overlapping the subpixel 202R. The light-shielding layer 267BM has a light-shielding property.

[0098] For example, a resin containing a pigment dispersed therein, a resin containing a dye, or an inorganic film such as a black chrome film can be used as the light-shielding layer 2. 67BM. Specifically, carbon black, inorganic oxides, and multiple inorganic A composite oxide containing a solid solution of an inorganic oxide can be used for the light-shielding layer 267BM.

[0099] In addition, the partition wall 228 having an opening in the area overlapping with the display element is used in the functional panel 200. For example, when the conductive film overlaps the partition wall 228, the conductive film overlaps the opening of the partition wall 228. This region can be used for the lower electrode of the light emitting element 250R. This can prevent the occurrence of a defect at the end of the electrode.

[0100] Display element For example, contrast, brightness, reflectance, transmittance, etc. may change due to electrical or magnetic effects. The display medium can be used as a display element.

[0101] The light emitting element 250R and the light emitting element 250R transmit at least a part of the light emitted by the light emitting element 250R. A display module 280R including the colored layer 267R can be used as a display element.

[0102] For example, a layer containing a material such as a pigment or a dye can be used for the colored layer 267R. This allows the color of light emitted by the display module 280R to be a specific color.

[0103] In addition, a microcavity structure in which the light-emitting element 250R is arranged between the reflective film and the semi-transmissive and semi-reflective film is used. Specifically, a reflective conductive film can be used as one electrode, and a semi-transmissive / semi-reflective A light emitting element 250R having the conductive film on the other electrode can be used.

[0104] For example, a microcavity that efficiently extracts red light and a colored layer that transmits red light can be formed by Used in the color display module 280R, it features a microcavity that efficiently extracts green light. A colored layer that transmits red and green light is used in a display module that displays green, or a colored layer that transmits blue light is used in a display module that displays blue. The microcavity that efficiently extracts light and the colored layer that transmits blue light are placed on the display that displays blue. It may also be used in the display module.

[0105] Furthermore, a microcavity that efficiently extracts yellow light and a colored layer that transmits yellow light It may also be used in a display module together with the above.

[0106] Specifically, EL (electroluminescence) elements (EL elements containing organic and inorganic materials) , organic EL elements, inorganic EL elements), LEDs (white LEDs, red LEDs, green LEDs, blue LEDs) LEDs, etc.), transistors (transistors that emit light according to the current), electron emitters, liquid crystal displays Crystal element, electronic ink, electrophoretic element, grating light valve (GLV), plasma Displays (PDP), MEMS (Micro-Electro-Mechanical Systems) The display element used was a digital micromirror device (DMD), a DMS (digital mirror Black shutter), MIRASOL (registered trademark), IMOD (Interference Modulation modulation element, shutter-type MEMS display element, optical interference-type MEMS display display element, electrowetting element, piezoelectric ceramic display, carbon nanotube A display element using a tube, etc. can be used.

[0107] 《Pixel circuit》 Various pixel circuits suitable for the display element can be used.

[0108] For example, a pixel circuit including a drive transistor M0 or a capacitance element C can be used. .

[0109] A variety of transistors can be used for the drive transistor M0.

[0110] For example, a transistor using a group 14 element, a compound semiconductor, or an oxide semiconductor in the semiconductor layer Specifically, semiconductors containing silicon, semiconductors containing gallium arsenide, or a transistor using an oxide semiconductor containing indium as the driving transistor M0. It can be applied to semiconductor layers.

[0111] For example, single crystal silicon, polysilicon, or amorphous silicon may be used as the driving transistor. It can be applied to semiconductor layers of STAM0.

[0112] For example, a bottom gate transistor, a top gate transistor, etc. can be applied. .

[0113] <Drive circuit> Use of various sequential circuits such as shift registers in the driver circuit GD or driver circuit SD can be done.

[0114] In addition, various transistors can be used for the transistor MD of the driver circuit SD. For example, a structure that can be formed in the same process as the drive transistor M0 can be used as the transistor. It can be used for StaMD.

[0115] Moreover, the same configuration as that of the capacitance element C can be used for the capacitance element CD.

[0116] Wiring and terminals A conductive material can be used for the wiring 211 or the terminal 219 .

[0117] For example, inorganic conductive materials, organic conductive materials, metals, conductive ceramics, etc. can be used as wiring 2. 11 or terminal 219.

[0118] Specifically, aluminum, gold, platinum, silver, chromium, tantalum, titanium, molybdenum, a metal element selected from tungsten, nickel, iron, cobalt, palladium, or manganese The wiring 2 is an alloy containing the above-mentioned metal elements or an alloy combining the above-mentioned metal elements. 11 or terminal 219.

[0119] Indium oxide, indium tin oxide, indium zinc oxide, zinc oxide, gallium-added Conductive oxides such as zinc oxide can be used for the wiring 211 or the terminals 219. .

[0120] Graphene or graphite can be used for the conductive film. For example, the graphene oxide film can be formed by reducing a film containing the graphene oxide. Examples of the method include a method of applying heat and a method of using a reducing agent.

[0121] A conductive polymer can be used.

[0122] The terminal 219 can be electrically connected to the flexible printed circuit board 209 . For example, electrical connection can be achieved using an anisotropic conductive film.

[0123] "others" The functional panel 200 has a functional film 267p.

[0124] For example, a film containing an inorganic material, an organic material, or a composite material of an inorganic material and an organic material is called a functional film. 267p. Specifically, ceramics containing alumina or silicon oxide, etc. Functional film 2 includes black coating layer, hard coating layer such as UV curing resin, anti-reflection film, circular polarizer, etc. Can be used for 67p.

[0125] Transistor A variety of transistors can be used for the drive transistor M0 or the transistor MD. can.

[0126] For example, a bottom gate type transistor may be used as the driving transistor M0 or the transistor MD It can be used for.

[0127] For example, a semiconductor layer containing an oxide semiconductor, amorphous silicon, or the like is used as the driving transistor M 0 and transistor MD.

[0128] For example, at least indium (In), zinc (Zn) and M (Al, Ga, Ge, Y, In-M-Zn oxide containing metals such as Zr, Sn, La, Ce or Hf Preferably, the film contains both In and Zn.

[0129] Stabilizers include gallium (Ga), tin (Sn), hafnium (Hf), and aluminum. Aluminum (Al) or zirconium (Zr). Also, other stabilizers The lanthanides are lanthanum (La), cerium (Ce), and praseodymium (P r), neodymium (Nd), samarium (Sm), europium (Eu), gadolinium ( Gd), terbium (Tb), dysprosium (Dy), holmium (Ho), erbium Er, Thulium, Ytterbium, Lutetium, etc. .

[0130] Examples of oxide semiconductors that form the oxide semiconductor film include In-Ga-Zn oxides, I n-Al-Zn oxide, In-Sn-Zn oxide, In-Hf-Zn oxide, In -La-Zn oxide, In-Ce-Zn oxide, In-Pr-Zn oxide, In- Nd-Zn oxide, In-Sm-Zn oxide, In-Eu-Zn oxide, In-G d-Zn oxide, In-Tb-Zn oxide, In-Dy-Zn oxide, In-Ho -Zn-based oxides, In-Er-Zn-based oxides, In-Tm-Zn-based oxides, In-Yb- Zn-based oxide, In-Lu-Zn-based oxide, In-Sn-Ga-Zn-based oxide, In-H f-Ga-Zn oxide, In-Al-Ga-Zn oxide, In-Sn-Al-Zn oxide Oxides, In-Sn-Hf-Zn oxides, In-Hf-Al-Zn oxides, In-G A-series oxides can be used.

[0131] Here, the In-Ga-Zn oxide is a material containing In, Ga, and Zn as main components. It means oxide, and the ratio of In, Ga, and Zn does not matter. Other metal elements may also be included.

[0132] For example, a semiconductor layer containing polycrystalline silicon crystallized by a process such as laser annealing. can be applied to the drive transistor M0 and the transistor MD (see FIG. 1(C)).

[0133] For example, the top gate type transistors are the driving transistor M0 and the transistor MD (See Figure 1(D)).

[0134] For example, a semiconductor layer containing polycrystalline silicon or a single crystal transferred from a single crystal silicon substrate, etc. A semiconductor layer including a crystalline silicon film is applied to the drive transistor M0 and the transistor MD. It is possible.

[0135] Another configuration of the functional panel according to one embodiment of the present invention will be described with reference to FIGS. 17 to 22. do.

[0136] 17 to 22 are diagrams illustrating the configuration of a functional panel according to one embodiment of the present invention. 22A to 22C are top views of a functional panel according to one embodiment of the present invention, and FIGS. 22(B) are cut lines AB and 22(B) in the corresponding Figures 17(A) to 22(A). 17(C) to 22(C) and 17(D) to 22(D). FIG. 22(D) shows a partial configuration of the corresponding FIG. 17(B) to FIG. 22(B). FIG. 10 is a cross-sectional view illustrating a configuration in which the switch can be made.

[0137] The functional panel 200(1) has an insulating layer 291, and a first substrate 210 is provided between the insulating layer 291 and the first substrate 210. The functional panel 200 differs from the functional panel 200 in that it includes a light-emitting element 250R (see FIG. 17(B) and FIG. 1 8(B)).

[0138] The materials that can be used for the insulating layer 290 can also be used for the insulating layer 291. The insulating layer 291 can be formed using a method similar to that used for the edge layer 290 .

[0139] The functional panel 200(2) has an insulating layer 291, and a first substrate 210 is provided between the insulating layer 291 and the first substrate 210. The functional panel 200 differs from the functional panel 200 in that it includes a driving transistor M0 (see FIGS. 19 and 20 reference).

[0140] The materials that can be used for the insulating layer 290 can also be used for the insulating layer 291. The insulating layer 291 can be formed using a method similar to that used for the edge layer 290 .

[0141] The functional panel 200(3) includes a functional film 267p between the insulating layer 290 and the second substrate 270. This is different from the function panel 200 (see FIGS. 21 and 22).

[0142] <Example 2 of the function panel configuration> Another configuration of the functional panel according to an embodiment of the present invention will be described with reference to FIG.

[0143] 3A and 3B are diagrams illustrating the configuration of a functional panel according to one embodiment of the present invention. 3(B) is a top view of the functional panel 200B of the embodiment, and FIG. 3(B) is a view taken along the cutting lines AB and AB in FIG. 3(A). 3(C) and 3(D) are cross-sectional views taken along the cutting line CD shown in FIG. 3(B). FIG. 10 is a cross-sectional view illustrating a configuration that can replace a portion of the configuration.

[0144] The functional panel 200B described in this embodiment has an opening in the region overlapping with the subpixel 202R. The light-shielding layer 267BM and the colored layer 267R are provided between the first base material 210 and the light-emitting element 250R. The functional film 267p is disposed on the first substrate 210 side. The display module 280R emits light to the side where the first base material 210 is provided. 1. The functional panel 200 is different from the functional panel 200 described with reference to FIG.

[0145] The first base material 210 has a translucent property in the area overlapping with the display element, and the second base material 270 is necessarily The other structures may be the same as those described above.

[0146] As a result, the functional panel 200B displays display information on the side where the first base material 210 is provided. It can be shown.

[0147] Furthermore, flexible materials can be used for the first substrate 210 and the second substrate 270. For example, it is necessary to have flexibility to the extent that it can be bent or folded. Specifically, a flexible substrate 210b, a material having impurities, A barrier film 210a that prevents diffusion and a resin that bonds the substrate 210b and the barrier film 210a A laminate in which the layer 210c is laminated can be used as the first base material 210. The substrate 270b has a barrier film 270a for preventing the diffusion of impurities, and the substrate 270b and the barrier film 270a are connected to each other. The laminate in which the resin layer 270c to which the rear film 270a is bonded is laminated is placed on the second substrate 270. It can be used for (see Figure 4).

[0148] Note that this embodiment mode can be appropriately combined with other embodiment modes shown in this specification. .

[0149] (Embodiment 2) In this embodiment, a manufacturing method of a functional panel according to one embodiment of the present invention will be described with reference to FIGS. Explain with reference to the above.

[0150] FIG. 5 is a flow diagram illustrating a method for manufacturing a functional panel according to one embodiment of the present invention, and FIG. 6 shows the process steps. 6(A-1) is a schematic diagram illustrating the structure of the processed member of one embodiment of the present invention. 6(B-1) is a schematic top view of a processed member according to one embodiment of the present invention and a method for manufacturing a processed member using the processed member. 6(A-2) and 6(B-2) are schematic top views of the functional panel. 1 is a schematic cross-sectional view taken along the line W1-W2 in the drawing shown in FIG.

[0151] <Example 1 of how to make a functional panel> The method for manufacturing a functional panel described in this embodiment includes the following six steps (FIG. 5 reference).

[0152] First Step In the first step, the workpiece 10 is prepared and then processed by a processing method not shown. The processed member support section supplies the processed member 10 with the temperature of the processed member 10 (see FIG. 5(S1)). It has the function of controlling the degree.

[0153] The processed member 10 includes a first base material 310 and a second base material 311 having an area overlapping the first base material 310. The second substrate 370 is attached to one surface of the first substrate 310. The bonding layer 305 is surrounded by the first base material 310, the second base material 370, and the bonding layer 305. The functional layer 330 is provided in the region. The functional layer 330 is provided with a plurality of functional elements. (See Figures 6(A-1) and 6(A-2)).

[0154] Second Step In the second step, the temperature of the processed member 10 is raised to a predetermined value, for example, by using the processed member support. The chamber (not shown) having the workpiece 10 and the workpiece support therein is controlled to rotate. The chamber is a space that can be sealed. Has.

[0155] The third step In the third step, a source gas containing a precursor compound is supplied to the chamber. After that, the source gas is purged from the chamber (see FIG. 5(S3)). The precursor compound can be an organic compound or an organometallic compound. The raw material gas is purged by evacuating the gas or by introducing an inert gas. It can be used in the method.

[0156] The Fourth Step In the fourth step, a source gas containing an oxidizing agent is supplied to the chamber, and after the supply, the source gas is The source gas is purged from the chamber (see Figure 5 (S4)). For example, water vapor, ozone, etc. After this step, the acid of the precursor compound can be used as an oxidizing agent. An insulating layer containing a compound is formed on the surface of the workpiece 10. As a result, a dense film can be formed on the surface with a rough surface, resulting in an insulating layer with few defects such as pinholes. can be formed.

[0157] The fifth step In the fifth step, the cycle including the third and fourth steps is repeated. If the number is less than the predetermined number, return to the third step. If the number is greater than or equal to the predetermined number, If the number of cycles is more than 1, the process proceeds to the sixth step (see FIG. 5 (S5)). One cycle includes the third step and the fourth step.

[0158] It should be noted that a method of alternately supplying two or more precursor compounds can be used in the third step. For example, a first third step of supplying a source gas containing a first precursor compound; and a third step of supplying a source gas containing the precursor compound of the second compound. In this case, one cycle consists of the first third step, the second third step, and Including the fourth step.

[0159] Step 6 In the sixth step, the workpiece 10 is removed from the chamber. The formation of 0 is completed (see FIG. 5(S6), FIG. 6(B-1) and FIG. 6(B-2)). At the end of this step, an insulating layer 390 containing an oxide of the precursor compound is formed to a predetermined thickness. The functional panel 300 can be provided by forming the functional panel 300 on the surface.

[0160] The method for manufacturing a functional panel described in this embodiment is a method for manufacturing a functional panel by supplying a raw material gas containing a precursor compound. and purging the source gas from the chamber after supplying the source gas. and purging the source gas from the chamber after the supply. This allows an insulating layer containing an oxide of the precursor compound to be formed on the surface of the processed member. As a result, a novel method for producing a functional panel can be provided.

[0161] The manufacturing method of the functional panel described in this embodiment mode can be the same as that described in Embodiment Mode 3, for example. The above-described method can be carried out by using a film formation system according to one embodiment of the present invention.

[0162] Specifically, in the film forming apparatus 100, a functional layer is formed on the first substrate 310, and the functional layer is sealed in the sealing chamber SU. In this step, the first base material 310 and the second base material 370 are bonded together using the bonding layer 305. The first base material 310 can be produced in this manner.

[0163] Then, an insulating layer 390 can be formed using an atomic layer deposition (ALD) system.

[0164] In addition, a lift-off method or the like is used to provide a region in which the insulating layer 390 is not formed on a part of the processed member 10. It can be used in the method.

[0165] For example, a resist mask that can be peeled off in a later step is formed on the area where the insulating layer 390 is not formed. A processed member formed in the region is used as the processed member 10.

[0166] After the above steps 1 to 6 are performed, the resist mask is stripped off. As a result, the insulating layer 390 formed on the resist mask is processed together with the resist mask. It can be separated from the construction member 10.

[0167] Specifically, photosensitive resist, soluble resin, adhesive tape, etc. are used as a resist mask. You can be there.

[0168] <Example 2 of how to make a functional panel> For another configuration of the method for manufacturing a functional panel according to one embodiment of the present invention, please refer to FIGS. 7 and 8. I will explain.

[0169] FIG. 7 is a flow diagram illustrating a method for manufacturing a functional panel according to one embodiment of the present invention, and FIG. 8 shows the process steps. 8(A-1) to 8(D-1) are schematic diagrams illustrating the structure of the processed member of the present invention. 8(A-2) to 8(D-2) are schematic top views of a processed member according to one embodiment of the present invention. FIG. 1 is a schematic cross-sectional view taken along the line W1-W2 in the diagram shown on the left side.

[0170] Another method for manufacturing a functional panel described in this embodiment has the following eight steps: (See FIG. 7.) For example, in the film forming system according to one aspect of the present invention described in the third embodiment, This can be implemented using the system.

[0171] The method for fabricating a functional panel, which will be explained with reference to Figure 5, has the following three points: different.

[0172] The first difference is that a processed member 10B is used. The processed member 10B has a first bonding layer 3 05a, second bonding layer 305b, first substrate 310, second substrate 370 and first The first functional layer 330a, the first base material 310, and the second base material 311 are disposed in the area surrounded by the bonding layer 305a. and a second functional layer 330b in an area surrounded by the material 370 and the second bonding layer 305b. (Fig. 8(A-1) and Fig. 8(A-2)).

[0173] The second difference is that the first bonding layer 305a and the second bonding layer 305b of the second base material 370 The point is that there is a step of forming an opening in the region overlapping the region between b (FIG. 7(T1 ), see Figure 8(B-1) and Figure 8(B-2)).

[0174] The third difference is that the processed member 10B is made of a first bonding layer 305a and a second bonding layer 305b. The point is that there is a step of dividing along the overlapping area between the 8(D-1) and 8(D-2)).

[0175] The different steps are described in detail here, and some parts may use similar steps. The above explanation is incorporated herein by reference.

[0176] First Step In the first step, a processed member 10B is prepared (see FIGS. 8(A-1) and 8(A-2)). )), the second bonding layer 305a overlaps the region between the first bonding layer 305a and the second bonding layer 305b. An opening is formed in the region of the base material 370 (FIG. 7(T1), FIG. 8(B-1) and FIG. 8( (See B-2).

[0177] For example, the second substrate 370 is divided into a second substrate 370a and a second substrate 370b. forming a continuous opening between the first substrate 370a and the second substrate 370b; or A method of piercing the second base material 370 using a sharp tip, a method of using a laser or the like (for example, A plurality of openings may be formed in a broken line pattern by using a laser ablation method or the like.

[0178] Second Step In a second step, the workpiece 10B is fed to a workpiece support (not shown). (Figure 7(T2)).

[0179] The third step In the third step, the temperature of the processed member 10B is set to a predetermined value using, for example, a processed member support portion. The chamber having the workpiece support part therein is evacuated (see FIG. 7 (T3)). ) The chamber has a space that can be sealed.

[0180] The Fourth Step In the fourth step, a source gas containing a precursor compound is supplied to the chamber. After that, the source gas is purged from the chamber (see FIG. 7(T4)).

[0181] The fifth step In the fifth step, a source gas containing an oxidizing agent is supplied to the chamber, and after supplying, the chamber is (See Figure 7 (T5)).

[0182] It should be noted that, when this step is completed, an insulating layer containing an oxide of the precursor compound is formed on the processed member 10. This method allows a dense film to be formed on the surface of B. As a result, an insulating layer with fewer defects such as pinholes can be formed. In the fourth and fifth steps, the original material is extracted from the opening formed in the first step. The source gas can penetrate and form an insulating layer inside the opening.

[0183] Step 6 In the sixth step, the cycle including the third and fourth steps is repeated. If the number is less than the predetermined number, return to the fourth step. If the number is equal to or greater than the predetermined number, Then, the process proceeds to the seventh step (see FIG. 7(T6)).

[0184] The Seventh Step In the seventh step, the processed member 10B is carried out from the chamber. The formation of 90 is completed (see FIG. 7(T7), FIG. 8(C-1) and FIG. 8(C-2)).

[0185] The Eighth Step In the eighth step, the processed member 10B is bonded to the first bonding layer 305a and the second bonding layer 305b. The area overlapping the area between 305b is divided (FIG. 7(T8), FIG. 8(D-1) and (See Figure 8(D-2)). After this step, the oxide of the precursor compound is The first functional panel 300(1) has an insulating layer 390a formed on its surface with a predetermined thickness. and a second functional panel 300(2) having an insulating layer 390b formed on the surface with a predetermined thickness. It can be provided.

[0186] The first functional panel 300(1) is made of a first base material 310a and a substrate 310b. The second substrate 370a may have a region, and the second substrate 370 may be disposed on one side of the first substrate 310a. a bonding layer 305a having a function of bonding the first base material 310a and the second base material 370a. and a functional layer 330a in an area surrounded by the bonding layer 305a. 30a comprises a plurality of functional elements.

[0187] The first functional panel 300(1) has a first base material 310a, and when it is cut, the first base material 3 The semiconductor device 10a has an end surface on which the insulating layer 390a is not formed.

[0188] The second functional panel 300(2) is formed on the first substrate 310b. The second substrate 370b may have a region, and the second substrate 370 may be disposed on one side of the first substrate 310b. a bonding layer 305b having a function of bonding the first base material 310b and the second base material 370b; and a functional layer 330b in an area surrounded by the bonding layer 305b. 30b comprises a plurality of functional elements.

[0189] The second functional panel 300(2) has a first base material 310b, and when it is cut, the first base material 3 10b has an end surface on which the insulating layer 390b is not formed.

[0190] The method for manufacturing a functional panel described in this embodiment is a method for manufacturing a functional panel by supplying a raw material gas containing a precursor compound. and purging the source gas from the chamber after supplying the source gas. and purging the source gas from the chamber after the supply. This allows an insulating layer containing an oxide of the precursor compound to be formed on the surface of the processed member. As a result, a novel method for producing a functional panel can be provided.

[0191] Note that this embodiment mode can be appropriately combined with other embodiment modes shown in this specification. .

[0192] (Embodiment 3) In this embodiment, a film formation system that can be used to manufacture a functional panel according to one embodiment of the present invention will be described. The configuration of the system will be described with reference to FIGS.

[0193] FIG. 9 shows the configuration of a film formation system that can be used to manufacture a functional panel according to one embodiment of the present invention. FIG. 9A is a diagram illustrating a cluster-type film formation system 1000 according to one embodiment of the present invention. 9(B) is a schematic diagram of an in-line type film forming system 1000B.

[0194] FIG. 10 illustrates the configuration of a film formation apparatus that can be used in a film formation system according to one embodiment of the present invention. FIG. 10A is a diagram showing a film formation apparatus system that can be used in one embodiment of the present invention. A state in which a film is being formed on a first substrate 310 using the film forming apparatus 100 and the shadow mask 170. 10(B) is a cross-sectional view illustrating the process of forming a processed member 10 using an atomic layer deposition (ALD) apparatus. 10 is a cross-sectional view illustrating a state in which a film is being formed on the substrate. FIG.

[0195] <Example 1 of a deposition system configuration> The film forming system 1000 includes a loading device LD, a transfer chamber DC connected to the loading device LD, and a transfer The unloading device ULD connected to the chamber DC, the film forming device 100 connected to the transfer chamber DC, and the sealing chamber S U, atomic layer deposition apparatus ALD and chemical vapor deposition apparatus CVD (see FIG. 9(A)) .

[0196] Then, the loading device LD loads the first substrate 310. The transfer chamber DC loads the first substrate 310. The unloading device ULD carries the processed member 10. do.

[0197] The film forming apparatus 100 also transports the first substrate 310 and deposits the film forming material on the first substrate 310. To film.

[0198] The sealing chamber SU is also loaded with the first base material 310, and a sealing material is formed on the first base material 310. For example, a bonding layer is formed on the first base material 310, and the processed member 10 is then transported out. The first base material 310 and the second base material 370 are bonded together to form a sealing material.

[0199] In addition, the atomic layer deposition apparatus ALD carries the processed member 10 and deposits a film-forming material on the processed member 10. do.

[0200] The chemical vapor deposition apparatus CVD transports the processed member 10 and deposits a film-forming material on the processed member 10. To film.

[0201] The film forming apparatus 100, the atomic layer deposition apparatus ALD, and the chemical vapor deposition apparatus CVD are provided with a transfer port. In addition, a shadow mask 170 is loaded into the film forming apparatus 100 .

[0202] In addition, multiple film deposition equipment, atomic layer deposition equipment ALD or chemical vapor deposition equipment CVD, are installed in the transfer chamber D It may be connected to C.

[0203] <Example 2 of a deposition system configuration> The film forming system 1000B includes a loading device LD and a film forming device 100A connected to the loading device LD. a film forming apparatus 100B connected to the film forming apparatus 100A; a film forming apparatus 100C, a film forming apparatus 100D connected to the film forming apparatus 100C, and a film forming apparatus 100D connected to the film forming apparatus 100D. a sealing chamber SU connected to the sealing chamber SU, an atomic layer deposition apparatus ALD connected to the sealing chamber SU, and an atomic layer deposition apparatus A chemical vapor deposition system CVD connected to ALD and a carrying-out device connected to the chemical vapor deposition system CVD and a position ULD (see FIG. 9(B)).

[0204] Then, the loading device LD loads the first substrate 310. The unloading device ULD loads the processed member 1 Carry out 0.

[0205] The film forming apparatuses 100A to 100D are each loaded with a first substrate 310 and a film forming material. A film is formed on the first substrate 310, and the first substrate 310 is transported.

[0206] The sealing chamber SU is also loaded with the first base material 310, and a sealing material is formed on the first base material 310. For example, a bonding layer is formed on the first base material 310, and the processed member 10 is then transported out. The first base material 310 and the second base material 370 are bonded together to form a sealing material.

[0207] In addition, the atomic layer deposition system ALD carries in the processed member 10 and deposits the film-forming material on the processed member 10. , the processed workpiece 10 is transported.

[0208] In addition, the chemical vapor deposition apparatus CVD carries the workpiece 10 and deposits a film on the workpiece 10 with a film-forming material. Then, the processed workpiece 10 is transported.

[0209] Film forming apparatuses 100A to 100D, sealing chamber SU, atomic layer deposition apparatus ALD, and chemical The vapor deposition apparatus CVD includes a loading port and a loading port. A shadow mask 170 is loaded into the film forming apparatus 100D.

[0210] Each of the devices constituting the film forming system 1000 or the film forming system 1000B is In order to prevent moisture from adhering, the container is filled with an inert gas (such as nitrogen gas) with a controlled dew point. It is preferable to keep the pressure reduced, and it is desirable to maintain the pressure reduced.

[0211] The film forming system 1000B described in this embodiment includes a plurality of film forming apparatuses 100A to 100C. The apparatus 100D is equipped with a sealing chamber SU, an atomic layer deposition apparatus ALD, and a chemical vapor deposition apparatus CVD. .

[0212] This allows a laminated film in which a plurality of films are laminated to be formed on the first base material 310. It is possible to stack a film material on a film that has just been deposited without exposing the film to the atmosphere. In addition, the incorporation of impurities can be suppressed. In addition, the throughput is high. The first substrate 310, the second substrate 370, and the first substrate 310 and the second substrate 370 are bonded together. An insulating layer with few pinholes can be formed on the processed member 10 having the bonding layer.

[0213] The individual elements constituting the film forming system 1000 or the film forming system 1000B will be described below. These components cannot be clearly separated, and one component may function as another. It may contain parts of other configurations.

[0214] 《Film deposition equipment 100》 The film forming apparatus 100 described in this embodiment is a processing apparatus having a function of supporting the first substrate 310. The film forming member support portion 110 and the film forming material ejection portion 312 have a function of depositing the film forming material on the first substrate 310. A shadow mask 17 is provided between the deposition source 120A and the first substrate 310. A shadow mask support 115 having a function of supporting the workpiece 110, a deposition a deposition chamber 190 in which the source 120A and the shadow mask support 115 are disposed; (See Figure 10(A)).

[0215] The film forming apparatus 100 may also have a power source 140. For example, the film forming apparatus 100 may have a power source 140, the processed member support 110 together with the first substrate 310 is placed relative to the evaporation source 120A. The deposition source 120A may have a function of being relatively movable. The ejected film forming material can be deposited uniformly on the surface of the first substrate 310.

[0216] The film forming apparatus 100 also uses, for example, a power source 140 to move the shadow mask support portion 115. The dopant mask 170, the workpiece support 110, and the first substrate 310 may move together. .

[0217] The film forming apparatus 100 also detects the position of the shadow mask 170 relative to the first substrate 310. For example, the workpiece support 110 and / or the system may have a detector 198. The shadow mask support 115 is used to move the first substrate relative to the shadow mask 170. Place 310 in place.

[0218] The film forming apparatus 100 also includes an exhaust device 197 for controlling the pressure in the film forming chamber 190 and a gas supply device 198 for supplying the gas to the film forming chamber 190. 90 may have a pipe 196 for introducing a predetermined gas.

[0219] The film forming apparatus 100 also includes a first substrate 310 and / or a shadow mass in the film forming chamber 190. The door valve 195 has a function to allow the storage 170 to be loaded and / or unloaded. It may be possible.

[0220] The film forming apparatus 100 may have a deposition source 120B in addition to the deposition source 120A. In addition, a shielding plate 121A may be provided to shield the film forming material ejected from the vapor deposition source 120A. In addition, a detector for detecting the amount of film forming material ejected from the deposition source 120A per unit time is also provided. The device may have a container 122A.

[0221] 《Sealing room SU》 The sealing chamber SU has a function of bonding the first base material 310 and the second base material 370 with a bonding layer, for example. As a result, the functional layer formed on the surface of the first base material 310 is attached to the second base material 370. Protect it using

[0222] It can have a function of replacing the first substrate 310. For example, the first substrate 310 A machine for separating a part of the manufactured functional panel from the first base material 310 and attaching it to another base material. Specifically, it is possible to change a substrate that does not have flexibility into a substrate that has flexibility. In this specification, the first base material 310 after being replaced can be replaced. The term "first substrate 310" is also used for the substrate.

[0223] <<Atomic Layer Deposition System ALD>> The atomic layer deposition (ALD) apparatus deposits various layers on the surface of a workpiece 10 having a complex structure on its surface. For example, it has the function of depositing a film of a variety of materials with a thickness of 20 nm to 200 nm. The processing unit 10 has a function of forming a film on the processed member 10.

[0224] For example, when small holes called pinholes are formed on the surface of the workpiece 10, The film-forming material can be deposited inside the pinhole, filling the pinhole.

[0225] In conventional film-forming equipment using the CVD method, one or more source gases for the reaction are used for film formation. Several species are supplied to the chamber simultaneously. The source gases are introduced into the chamber in sequence, and the film is formed by repeating this gas introduction sequence. For example, by switching each switching valve (also called high-speed valve), two or more types of The above source gases are supplied to the chamber in order, and the first After the source gas, an inert gas (argon, nitrogen, etc.) is introduced, and the second source gas Instead of introducing an inert gas, the first source gas is exhausted by vacuum evacuation. After the first source gas is introduced, the second source gas may be introduced. The first monoatomic layer is formed, and then reacts with the second source gas introduced later, forming the second monoatomic layer. The thin film is formed by stacking the first monoatomic layer on the second monoatomic layer. By repeating this process multiple times until the desired thickness is achieved, a thin film with excellent step coverage can be formed. The thickness of the thin film can be precisely adjusted by changing the number of times the gas introduction sequence is repeated. This allows for precise film thickness adjustment, making it suitable for fabricating fine transistors.

[0226] Furthermore, the ALD method is free from plasma damage.

[0227] FIG. 10(B) shows an example of a film formation apparatus using the ALD method (also called an atomic layer deposition apparatus ALD). The atomic layer deposition (ALD) apparatus includes a film formation chamber (chamber 180), a raw material supply unit 181a, 181b, high-speed valves 182a and 182b which are flow rate controllers, a raw material inlet 183a, 183b, a raw material outlet 184, and an exhaust device 185. The raw material inlets 183a and 183b are supplied to the raw material supply units 181a and 181b via supply pipes and valves. 81b, and the raw material discharge port 184 is connected to a discharge pipe, a valve, and a pressure regulator. It is connected to the exhaust device 185 via the exhaust port 185 .

[0228] Inside the chamber, there is a processed member support 186 equipped with a heater. A first substrate 310 on which a film is to be formed is placed on 86 .

[0229] In the raw material supply units 181a and 181b, solid raw materials and liquid raw materials are supplied by vaporizers and heating means. The raw material supply units 181a and 181b generate raw material gas from the raw material. It may be configured to supply the

[0230] In addition, although an example in which two raw material supply units 181a and 181b are provided is shown, this is not particularly limited. Three or more high-speed valves 182a and 182b may be provided. It is possible to supply either the source gas or the inert gas. The valves 182a and 182b are flow rate controllers for the source gas and also for the inert gas. It can also be said that...

[0231] In the film forming apparatus shown in FIG. 10(B), the processed member 10 is carried onto the processed member support portion 186. After the chamber 180 is sealed, the processed member is heated by the heater of the processed member support portion 186. 10 is heated to a desired temperature (for example, 80°C or higher, 100°C or higher, or 150°C or higher), and the raw material Supply of gas, exhaust by exhaust device 185, supply of inert gas, and exhaust by exhaust device 185 By repeating this process, a thin film is formed on the substrate surface.

[0232] In the film forming apparatus shown in FIG. 10(B), the raw materials (volatile By appropriately selecting the appropriate metal compound, hafnium, aluminum, tantalum, etc. oxides (including composite oxides) containing one or more elements selected from the group consisting of ammonium nitrate, ammonium nitrate, and zirconium. Specifically, an insulating layer containing hafnium oxide can be formed. an insulating layer comprising aluminum oxide; an insulating layer comprising hafnium silicate; or an insulating layer comprising aluminum silicate. In addition, the raw materials (volatile organic compounds) used in the raw material supply units 181a and 181b can be By appropriately selecting the metal compound, a metal layer such as a tungsten layer or a titanium layer, Thin films such as nitride layers, such as titanium nitride layers, can also be deposited.

[0233] For example, when forming a hafnium oxide layer by atomic layer deposition (ALD), the solvent and hafnium Liquids containing hafnium precursor compounds (e.g., hafnium alkoxides and tetrakisdimethylamide) The raw material gas is vaporized hafnium (hafnium amide such as TDMAH), and the oxidizer and In this case, two types of gases are used: ozone (O3) and ozone (O4). The first source gas supplied from the source supply unit 181b is TDMAH, and the second source gas supplied from the source supply unit 181c is TDMAH. The chemical formula for tetrakisdimethylamidohafnium is Hf[N(CH 3)2]4. Other material liquids include tetrakis(ethylmethylamide) hafnium. There are nium, etc.

[0234] When forming an aluminum oxide layer by atomic layer deposition (ALD), a solvent and aluminum The raw material gas is vaporized from a liquid containing aluminum precursor compounds (e.g., trimethylaluminum (TMA)). In this case, two types of gases are used: HCl as an oxidizing agent and H2O as an oxidizing agent. The first source gas to be supplied is TMA, and the second source gas to be supplied from the source supply unit 181b is TMA. The chemical formula for trimethylaluminum is Al(CH3)3. Other liquid materials include tris(dimethylamido)aluminum and triisobutylaluminum. Aluminum, aluminum tris(2,2,6,6-tetramethyl-3,5-heptanediol), Onato), etc.

[0235] When forming a tungsten layer using an atomic layer deposition (ALD) system, WF6 gas and B 2H6 gas is introduced repeatedly to form an initial tungsten layer, and then WF6 gas and The tungsten layer is formed using H2 gas. Note that SiH4 gas is used instead of B2H6 gas. These gases may be controlled by a mass flow controller. You may do so.

[0236] Chemical Vapor Deposition Equipment (CVD) The chemical vapor deposition apparatus CVD can form a film of a film material on a processed member by using a chemical vapor deposition method. For example, a film forming apparatus that utilizes plasma CVD can be used.

[0237] Instead of or in addition to the chemical vapor deposition (CVD) method, metal organic chemical vapor deposition (MOCVD) may be used. Metal Organic Chemical Vapor Deposition) Alternatively, a deposition apparatus using a deposition method or a deposition apparatus using a sputtering method may be used.

[0238] <<Workpiece Support Portion 110>> The processed member support 110 has a function of supporting the first base material 310. The holder 110 has a function of moving the first substrate 310 relative to the deposition source 120A. That's fine.

[0239] For example, a structure for gripping or supporting the vicinity of the end of the first base material 310 may be provided as the processed member support part 1. Specifically, it can be used for a member having a clamping mechanism or an L-shaped support. In addition, a structure for holding or supporting the first base material 310 can be used. Specifically, when the first base material 310 has a rectangular shape, The first base material 310 may be supported near its four corners.

[0240] When the processed member support part 110 is moved relative to the deposition source 120A, for example, a power 40 can be used. Specifically, a servo motor or a stepping motor can be used. Alternatively, the processed member support part 110 may be moved by using an air cylinder. The member support 110 is rotated above the deposition source 120A or moved across the deposition source 120A. It may be passed through as follows.

[0241] The processed member support 110 adjusts the position of the first base material 310 relative to the shadow mask 170. For example, the first substrate 310 may be provided with a function to keep the thickness constant. Specifically, the first electrode may be provided with a function of making the first electrode adhere to the first electrode by using an elastic body such as a spring. The substrate 310 may be pressed against the shadow mask. A magnet or the like is placed so as to sandwich the base material 310, and the shadow mask is attracted to the first base material 310. It is okay to do so.

[0242] The first base material 310 must have heat resistance sufficient to withstand the manufacturing process and be compatible with the manufacturing equipment. There are no particular limitations as long as the thickness and size are sufficient.

[0243] The first substrate 310 can also include various functional layers, such as functional circuits, Examples of the functional element include a functional element, an optical element, a functional film, or a layer containing a plurality of functional elements selected from these. Specifically, the pixel circuit, pixel driving circuit, display element, color filter, etc. of a known display device are Examples of the layer include a filter, a moisture-proof film, or a layer containing a plurality of layers selected from these.

[0244] The first substrate 3 is made of a material including an organic material, an inorganic material, or a composite material of an organic material and an inorganic material. It can be used for 10.

[0245] For example, inorganic materials such as glass, ceramics, or metals may be used for the first substrate 310. can be done.

[0246] Specifically, alkali-free glass, soda-lime glass, potash glass, or crystal glass etc. can be used for the first substrate 310.

[0247] Specifically, an inorganic oxide film, an inorganic nitride film, an inorganic oxynitride film, or the like is formed on the first substrate 31. For example, silicon oxide, silicon nitride, silicon oxynitride, alumina film, etc. It can be used for the first substrate 310.

[0248] For example, the first substrate 310 may be made of an organic material such as a resin, a resin film, or a plastic. It is possible.

[0249] Specifically, polyester, polyolefin, polyamide, polyimide, polycarbonate A resin film or a resin plate such as polyethylene terephthalate or acrylic resin may be used as the first substrate 310. This can be done.

[0250] For example, a composite material in which a thin glass plate or a film of an inorganic material is bonded to a resin film or the like. The material can be used for the first substrate 310.

[0251] For example, fibrous or particulate metal, glass, or inorganic material is dispersed in a resin film. The composite material can be used for the first substrate 310.

[0252] For example, a composite material in which fibrous or particulate resin or organic material is dispersed in an inorganic material It can be used for the first substrate 310.

[0253] In addition, a single layer material or a laminated material in which multiple layers are laminated may be used for the first base material 310. For example, a stack of materials and insulating layers that prevent the diffusion of impurities contained in the materials can be used. A layer material can be used for the first substrate 310 .

[0254] Specifically, the glass and the silicon oxide film, silicon nitride film or a laminated material in which one or more films selected from a silicon oxynitride film or the like are laminated on a first substrate; Applicable to 310.

[0255] Shadow mask support part 115 The shadow mask support portion 115 has a function of supporting the shadow mask 170. The shadow mask support 115 moves the shadow mask relative to the deposition source 120A. The device may also have a function to:

[0256] For example, a structure for holding or supporting the vicinity of the edge of the shadow mask 170 may be provided as a shadow mask. It can be used for the dome mask support part 115. Specifically, it is a member equipped with a clamping mechanism. Alternatively, an L-shaped supporting member or the like can be used. Specifically, the shadow mask 170 may have a plurality of structures for holding or supporting the shadow mask 170. If the shadow mask 170 has a rectangular shape, it may be supported near the four corners.

[0257] When the shadow mask support 115 is moved relative to the deposition source 120A, for example, Power 140 can be used. Specifically, a servo motor or a stepping motor can be used. The shadow mask support 115 may be moved using a motor or an air cylinder. Specifically, the shadow mask support 115 is rotated or positioned above the deposition source 120A. It may also be passed across above OA.

[0258] Shadow Mask 170 The shadow mask 170 has a shielding area that has a function of blocking the deposition material and a mask area surrounded by the shielding area. and an opening area.

[0259] 《Vapor deposition source》 The film forming apparatus 100 includes one or more deposition sources. It has a source 120B.

[0260] The same material may be ejected from the deposition source 120A and the deposition source 120B. The thickness of the film material deposited on the surface of the first base material 310 per unit time can be increased. Cut.

[0261] Different materials may be ejected from the deposition source 120A and the deposition source 120B. A film containing a mixture of different materials can be deposited on the surface of the first substrate 310. In other words, co-evaporation You can wear it.

[0262] The deposition source 120A has a function of ejecting a film forming material. For example, the deposition source 120A ejects the film forming material in the following direction: It is preferable that the film-forming material has a directivity to the laser beam. This can increase the efficiency of use of the film-forming material.

[0263] Specifically, a point source type evaporation source or a linear source type evaporation source is used as the evaporation source 120. It can be used for A. Or, it can be used to arrange point sources in a line or matrix. A vapor deposition source that ejects vaporized film-forming material from a slit can be used.

[0264] The deposition apparatus 100 also moves the deposition source 120A relative to the processed member support portion 110. For example, the evaporation source 120A may be moved relative to the first substrate 310 using a power source. The film may be formed while scanning the substrate.

[0265] 《Film formation chamber》 The film forming chamber 190 can reduce the pressure inside to below atmospheric pressure. - 3 Pa or less.

[0266] The exhaust device 197 can reduce the pressure inside the film forming chamber 190. For example, Pumps, turbo pumps and / or cryopumps can be used as the exhaust system 197. Cut.

[0267] The film forming chamber 190 can be filled with gas. The pipe 196 is for example filled with nitrogen gas. etc. can be supplied to the film forming chamber.

[0268] The film forming chamber 190 may be provided with a function for heating the inner wall. For example, it is possible to efficiently desorb molecules that have been absorbed by a heater or a pipe through which a heat medium is supplied. etc. may be provided on the wall surface.

[0269] Note that this embodiment mode can be appropriately combined with other embodiment modes shown in this specification. .

[0270] (Fourth embodiment) In this embodiment, a configuration of a functional panel according to one embodiment of the present invention that can be used for an input / output device will be described. This will be described with reference to FIGS. 11 to 13.

[0271] 11 to 13 are diagrams illustrating the configuration of a functional panel according to one embodiment of the present invention.

[0272] FIG. 11A is a top view of a functional panel 200TP according to one embodiment of the present invention, and FIG. 11B is a 11(A) and 11(B) are cross-sectional views taken along the cutting lines AB and CD in FIG. 11(C) is a top view illustrating a part of the configuration of the functional panel 200TP, and FIG. 11(D) is a top view illustrating a part of the configuration of the functional panel 200TP. 1(C) is a cross-sectional view taken along the line W3-W4 shown in FIG.

[0273] FIG. 13 is a projection view illustrating a functional panel 200TP according to an embodiment of the present invention. For convenience, a portion of the function panel 200TP is shown enlarged.

[0274] <Example of function panel configuration> The functional panel 200TP described in this embodiment includes a first base material 210 and a second base material 21 0 and a second substrate 270 on one side of the first substrate 210. a bonding layer 205 having a function of bonding the first substrate 210, the second substrate 270, and and an insulating layer 290 in contact with the bonding layer 205, the first base material 210, the second base material 270, and The functional layer is located in a region surrounded by the bonding layer 205 .

[0275] The functional layer includes a plurality of functional elements. Specifically, the functional elements include the pixels 202 and the sensing elements. In this way, the functional panel 200TP receives an image signal and displays an image. It has a function to display the information. It also has a function to receive a control signal and provide a detection signal. Equipped with.

[0276] The function panel 200TP can be called an input / output panel or a touch panel.

[0277] The functional panel 200TP according to one embodiment of the present invention includes pixels 202, a display panel 200B, a display panel 200C, a display panel 200D, a display panel 200E, a display panel 200F, a display panel 200H, a display panel 200I ... a driver circuit GD for supplying a display signal to the pixel 202; a driver circuit SD for supplying a display signal to the pixel 202; The ion implantation device has a region 201 (see FIGS. 11(A) and 11(B)).

[0278] The pixel 202 is supplied with a display signal (see FIG. 11(A)). The sub-pixel 202R has a function of displaying red. The pixel includes a sub-pixel that displays red and a sub-pixel that displays blue.

[0279] The subpixel 202R includes a pixel circuit and a display module 280R (see FIG. 11(B)). ).

[0280] The pixel circuit includes a drive transistor M0 and a capacitance element C.

[0281] The display module 280R includes a light emitting element 250R, a light emitting element 250R, and a light emitting element 250R. The colored layer 267R has an area overlapping with the light-emitting element 250R. It can be said that this is one aspect of a display element.

[0282] The light emitting element 250R includes a lower electrode, an upper electrode, and a layer containing a light emitting organic compound.

[0283] The circuit includes a driving transistor M0 and is connected between the first substrate 210 and the light-emitting element 250R. The circuit is sandwiched between the light emitting element 250R and the insulating film 221.

[0284] The driving transistor M0 has a second electrode. The second electrode is provided on the insulating film 221. It is electrically connected to the lower electrode of the light emitting element 250R through the opening.

[0285] The capacitance element C has a first electrode and a second electrode. The first electrode is connected to the driving transistor M0 and a second electrode electrically connected to the second electrode of the driving transistor M0. are connected to the network.

[0286] The drive circuit SD includes a transistor MD and a capacitor CD.

[0287] The functional panel 200TP according to one embodiment of the present invention includes wiring 21 electrically connected to the driving circuit SD. 1, a terminal 219 electrically connected to the wiring 211, and a and a flexible printed circuit board 209.

[0288] In addition, a light-shielding layer 267BM having an opening in a region overlapping with the sub-pixel 202R is provided.

[0289] In addition, a partition wall 228 is provided with an opening in the area overlapping the light emitting element 250R and covers the end of the lower electrode. Equipped with.

[0290] In addition, it has a functional film 267p having an area overlapping the area 201 (see FIG. 11(B)).

[0291] The functional panel 200TP displays information on the side where the second base material 270 is provided. It is possible.

[0292] The functional panel 200TP has a second substrate 270, and the second substrate 270 has a plurality of control lines. It has the function of supporting CL(i) and multiple signal lines ML(j).

[0293] The control line CL(i) extends in the row direction (the direction of the arrow indicated by R in the figure) and is supplied with a control signal. It has the function of

[0294] The signal line ML(j) extends in the column direction (the direction of the arrow indicated by C in the figure) and supplies a detection signal. It has the function of

[0295] The functional panel 200TP has a first electrode C1(i) electrically connected to the control line CL(i). and a portion that does not overlap with the first electrode C1(i) and is electrically connected to the signal line ML(j). The second electrode C2(j) is connected to the electrode (see FIG. 11(C) and FIG. 13).

[0296] The first electrode C1(i) or the second electrode C2(j) is connected to the pixel 202 or the subpixel 202R. The first electrode C1 ( The second electrode C2(i) or the second electrode C2(j) is opened in the area overlapping the pixel 202 or the sub-pixel 202R. It includes a mesh-like conductive film having openings 767 .

[0297] The functional panel 200TP according to one aspect of the present invention includes a terminal electrically connected to the control line CL(i). and a terminal electrically connected to the signal line ML(j). It is electrically connected to the flexible printed circuit board FPFC2.

[0298] The functional panel 200TP described in this embodiment is made up of a first base material 210 and a second base material 27. 0, a bonding layer 205 that bonds the first substrate 210 and the second substrate 270, and 210, the second base material 270, and the bonding layer 205, and a functional layer is included in the area surrounded by the The functional layer also includes a display element and a detection element. and provides a detection signal in response to a control signal provided. A novel functional panel with excellent convenience and reliability can be provided.

[0299] For example, the Function Panel 200TP detects nearby objects and sends information about their location. It has a function to provide detection information so that the location of the detected object can be linked. Or, it can provide detection information including a trajectory, etc. Specifically, the function panel 200T The user of the P uses a finger or the like placed close to or in contact with the function panel 200TP as a pointer. You can use various gestures (tap, drag, swipe or pinch in, etc.) do.

[0300] In addition, the user of the Function Panel 200TP can supply various operation commands to the arithmetic unit. For example, the calculation device that receives the detection information provided by the function panel 200TP can The information provided is judged based on a program or the like to determine whether it satisfies a predetermined condition, and the information is then processed in a predetermined manner. The command associated with the gesture can be executed.

[0301] Furthermore, the functional panel 200TP can display display information supplied by, for example, a computing device.

[0302] The functional panel 200TP has an insulating layer 290 .

[0303] For example, a ceramic coating layer or a hard coating layer can be used as the insulating layer. Typically, a layer containing aluminum oxide or a UV-cured resin layer can be used.

[0304] The functional panel 200TP has a functional film 267p.

[0305] For example, an anti-reflection layer that weakens the intensity of external light reflected by the functional panel can be used as the functional film. Specifically, a circular polarizing plate or the like can be used.

[0306] The individual elements that make up the function panel 200TP will be described below. The components cannot be clearly separated, and one component may serve as another component or may contain parts of another component. There is a match.

[0307] For example, the function panel 200TP is a touch panel as well as a detection panel or display panel. It's also Nell.

[0308] Overall composition The functional panel 200TP described in this embodiment includes a first base material 210 and a second base material 270. , a bonding layer 205, an insulating layer 290, or a functional layer.

[0309] The functional layer includes a pixel 202, a driving circuit GD, a driving circuit SD, a region 201, a sub-pixel 202R, a driving a driving transistor M0, a capacitance element C, a display module 280R, a light-emitting element 250R, and a coloring layer 267R, the pixel circuit, the insulating film 221, the wiring 211, the terminal 219, the light-shielding layer 267BM or It includes a partition wall 228 .

[0310] The functional layer includes a control line CL(i), a wiring BR(i,j), a signal line ML(j), and a first electrode C1 (i) or a second electrode C2(j).

[0311] The functional panel 200 also includes a flexible printed circuit board 209, a flexible printed circuit board The flexible printed circuit board FPC1 has a flexible printed circuit board FPC2 or a functional film 267p.

[0312] <<First substrate, second substrate, bonding layer, insulating layer>> The first substrate 210, the second substrate 270, the bonding layer 205, and the insulating layer 290 are provided with, for example, The same configuration as the functional panel described in the first embodiment can be used.

[0313] Furthermore, flexible materials can be used for the first substrate 210 and the second substrate 270. For example, it is necessary to have flexibility to the extent that it can be bent or folded. Specifically, a flexible substrate 210b, a material having impurities, A barrier film 210a that prevents diffusion and a resin that bonds the substrate 210b and the barrier film 210a A laminate in which the layer 210c is laminated can be used as the first base material 210. The substrate 270b has a barrier film 270a for preventing the diffusion of impurities, and the substrate 270b and the barrier film 270a are connected to each other. The laminate in which the resin layer 270c to which the rear film 270a is bonded is laminated is placed on the second substrate 270. It can be used for (see Figure 12).

[0314] Functional Layer The subpixel 202R, the display element, the pixel circuit, the driving circuit GD, the wiring 211, and the terminal 219 are For example, the same configuration as the functional panel described in the first embodiment can be used.

[0315] <Detection element, detection circuit> Detects capacitance, illuminance, magnetic force, radio waves, pressure, etc. and provides a signal based on the detected physical quantity. A sensing element that supplies the sensing element can be used in the functional layer.

[0316] For example, a conductive film, a photoelectric conversion element, a magnetic detection element, a piezoelectric element, a resonator, or the like is used as the detection element. You can be there.

[0317] For example, a detection function that provides a signal that varies based on the parasitic capacitance of the conductive film. The circuit can be used as a functional layer. This allows the fingers adjacent to the conductive film to be easily exposed to the atmosphere. These can be detected using changes in capacitance.

[0318] Specifically, a control signal is supplied to the first electrode C1(i) using the control line CL(i). The potential of the second electrode C2(j) that changes based on the input control signal and capacitance is expressed as a signal It can be obtained using line ML(j) and provided as the detection signal.

[0319] For example, a circuit including a capacitor element having one electrode connected to a conductive film can be used as a detection circuit. can.

[0320] The control line CL(i) includes a wiring BR(i,j). CL(i) intersects with the signal line ML(j) (see FIG. 11(C)). An insulating film 711 is provided between the signal lines ML(j) (see FIG. 11(D)). This can prevent a short circuit between BR(i,j) and signal line ML(j).

[0321] The function panel 200TP detects, for example, a change in capacitance between objects in close proximity or in contact with each other. and provides a detection signal.

[0322] In addition, a method of forming a film for forming a sensing element on the second base material 270 and processing the film may be used to fabricate a sensing element.

[0323] Alternatively, a portion of the functional panel 200TP is fabricated on another substrate, and the portion is then transferred to the substrate 610. The functional panel 200TP may be fabricated using the method described above.

[0324] "wiring" The function panel 200TP is equipped with wiring. The wiring includes control lines CL(i) and signal lines ML(j). Includes.

[0325] The conductive material can be used for wiring and the like.

[0326] For example, inorganic conductive materials, organic conductive materials, metals, conductive ceramics, etc. are used for wiring. It can be used for.

[0327] Specifically, aluminum, gold, platinum, silver, chromium, tantalum, titanium, molybdenum, tungsten, nickel, iron, cobalt, yttrium, zirconium, palladium or A metal element selected from manganese, an alloy containing the above-mentioned metal element, or an alloy containing the above-mentioned metal element The alloys of aluminum, chromium, and copper can be used for wiring. , containing one or more elements selected from tantalum, titanium, molybdenum, and tungsten In particular, an alloy of copper and manganese is suitable for microfabrication using wet etching. is.

[0328] Specifically, a two-layer structure in which a titanium film is laminated on an aluminum film, a titanium nitride film on a titanium nitride film, Two-layer structure with a tungsten film laminated on a titanium nitride film, two-layer structure with a tungsten film laminated on a titanium nitride film, a two-layer structure in which a tungsten film is laminated on a titanium film or a tungsten nitride film; A three-layer structure in which an aluminum film is layered on top of the titanium film, and a titanium film is then formed on top of that. etc. can be used.

[0329] Specifically, titanium, tantalum, tungsten, molybdenum, chromium, neodymium, scandium A laminated film in which a film of an element selected from aluminum and aluminum alloys is laminated on an aluminum film can be used. Or titanium, tantalum, tungsten, molybdenum, chromium, neodymium, scandium A laminated film is used in which an alloy film containing multiple elements selected from aluminum is laminated on an aluminum film. Alternatively, titanium, tantalum, tungsten, molybdenum, chromium, neodymium, A laminated film in which a nitride film of an element selected from zinc and scandium is stacked on an aluminum film. It can be used.

[0330] Alternatively, indium oxide, indium tin oxide, indium zinc oxide, zinc oxide, gallium Conductive oxides such as zinc oxide doped with ammonium can be used.

[0331] Alternatively, graphene or graphite can be used. The graphene-containing film can be For example, the graphene oxide film can be formed by reducing a film containing the graphene oxide. Examples of the method include a method of applying heat and a method of using a reducing agent.

[0332] Alternatively, a conductive polymer can be used.

[0333] "others" The functional panel 200TP has a functional film 267p.

[0334] For example, a film containing an inorganic material, an organic material, or a composite material of an inorganic material and an organic material is called a functional film. 267p. Specifically, ceramics containing alumina or silicon oxide, etc. Functional film 2 includes black coating layer, hard coating layer such as UV curing resin, anti-reflection film, circular polarizer, etc. Can be used for 67p.

[0335] Note that this embodiment mode can be appropriately combined with other embodiment modes shown in this specification. .

[0336] (Embodiment 5) In this embodiment, a configuration of a data processing device according to one embodiment of the present invention will be described with reference to FIG. We will explain.

[0337] FIG. 14 illustrates an information processing device according to one embodiment of the present invention.

[0338] FIG. 14A shows an example of a data processing device K100 of one embodiment of the present invention, in which the input / output device K20 is expanded. 14(B) is a projection view illustrating the state of FIG. 14(A) along the cutting line X1-X2. 14(C) is a cross-sectional view of the information processing device K100, in which the input / output device K20 is folded. FIG.

[0339] <Configuration example of information processing device> The information processing device K100 described in this embodiment includes an input / output device K20, a calculation device K10, and a The housing K01 has housings K01(1) to K01(3) (see FIG. 14).

[0340] Input / output devices For example, the functional panel described in Embodiment 4 can be used as an input / output device.

[0341] The input / output device K20 includes a display device K30 and an input device K40 (see FIG. 14(B)). The input / output device K20 is supplied with image information V and supplies detection information S.

[0342] The display device K30 is supplied with image information V, and the input device K40 supplies sensed information S.

[0343] The input / output device K20, in which the input device K40 and the display device K30 are stacked together, is 0 and also the input device K40.

[0344] The input device K40 is a touch sensor, and the display device K30 is an input / output device using a display panel. The force device K20 is a touch panel.

[0345] The display device K30 includes a first region K31(11), a first bendable region K31(21), The second region K31(12), the second bendable region K31(22) and the third region K3 1(13) are arranged in this order in a striped pattern in the region K31 (see FIG. 14(A)).

[0346] The display device K30 has a first fold and a second fold formed in the first bendable region K31 (21). and a state where the second bend is formed at the second fold in the second bendable region K31 (22). and deployed (see Figures 14(A) and 14(C)).

[0347] 《Arithmetic device》 The calculation device K10 includes a calculation unit and a storage unit that stores a program to be executed by the calculation unit. Also, image information V is supplied and detection information S is supplied.

[0348] 《Case》 The housing consists of housing K01(1), hinge K02(1), housing K01(2), hinge K02(2) ) or housing K01(3), and are arranged in this order.

[0349] The housing K01(3) houses the arithmetic unit K10. 1(3) holds the input / output device K20 and holds the input / output device K20 in a folded or unfolded state. The opening can be opened (see FIG. 14(B)).

[0350] In this embodiment, an information processing device having three housings connected by two hinges is For example, the input / output device K20 of this information processing device folds at two hinges. It is possible.

[0351] Note that n (n is a natural number equal to or greater than 2) housings may be connected using (n-1) hinges. The information processing device having this configuration folds the input / output device K20 at (n-1) positions. It can be folded.

[0352] The housing K01(1) overlaps the first area K31(11) and includes a button K45(1).

[0353] The housing K01(2) overlaps with the second area K31(12).

[0354] The housing K01(3) overlaps with the third area K31(13), and includes the arithmetic unit K10, the antenna K It accommodates the 10A and battery K10B.

[0355] The hinge K02(1) overlaps with the first bendable region K31(21) and the housing K01(1 ) is rotatably connected to the housing K01(2).

[0356] The hinge K02(2) overlaps with the second bendable region K31(22) and connects the housing K01(2) to the hinge K02(2). ) is rotatably connected to the housing K01(3).

[0357] The antenna K10A is electrically connected to the computing device K10 and supplies or is supplied with a signal. .

[0358] The antenna K10A is also powered wirelessly from an external device and uses the power from the battery K1 Supply to 0B.

[0359] The battery K10B is electrically connected to the computing device K10 and supplies or provides power to the computing device K10. .

[0360] Folding Sensor The folding sensor K41 detects whether the housing is in a folded or unfolded state, Provides information indicating the state of the enclosure.

[0361] The arithmetic unit K10 is supplied with information indicating the state of the housing.

[0362] When the information indicating the state of the housing K01 is information indicating the folded state, the arithmetic device K10 supplies image information V including a first image to the first region K31(11) (see FIG. 14(C)). see).

[0363] In addition, when the information indicating the state of the casing K01 is information indicating the unfolded state, the arithmetic device K 10 supplies image information V to an area K31 of a display device K30 (FIG. 14(A)).

[0364] 《Detection Unit》 The detection unit K50 detects the illuminance of the environment in which the display device K30 is used and outputs a display including information on the illuminance. Sensing information can be provided.

[0365] For example, a photoelectric conversion element and a signal provided by the photoelectric conversion element are used to obtain information about the illuminance of the environment. The detection circuit that supplies the voltage can be used in the detection unit K50.

[0366] Note that this embodiment mode can be appropriately combined with other embodiment modes shown in this specification. .

[0367] (Sixth embodiment) In this embodiment, a configuration of a data processing device of one embodiment of the present invention will be described with reference to FIG. We will explain.

[0368] FIG. 15 illustrates an information processing device according to one embodiment of the present invention.

[0369] FIG. 15A is a projection view of a data processing device 3000A of one embodiment of the present invention.

[0370] FIG. 15B is a projection view of a data processing device 3000B of one embodiment of the present invention.

[0371] 15C-1 and 15C-2 show a data processing device 3000C according to one embodiment of the present invention. 1. Top and bottom views of the device.

[0372] <<Information processing device A>> The information processing device 3000A includes an input / output unit 3120 and a housing 3 supporting the input / output unit 3120. 101 (see FIG. 15(A)).

[0373] The input / output unit 3120 includes a functional panel according to an embodiment of the present invention. The functional panel described above can be used as the input / output unit 3120.

[0374] The information processing device 3000A also includes a processor and a program for causing the processor to execute the program. The device is equipped with a power source such as a battery that supplies power to drive the memory unit and the calculation unit.

[0375] The housing 3101 houses a computing unit, a storage unit, a battery, and the like.

[0376] The information processing device 3000A can display information on the side and / or top surface. .

[0377] The user of the information processing device 3000A issues operation commands using fingers in contact with the side and / or top surface. Orders can be provided.

[0378] <<Information processing device B>> The information processing device 3000B includes a housing 3101 and a housing 3102 connected to the housing 3101 by a hinge. 101b (see FIG. 15(B)).

[0379] The housing 3101 supports the input / output unit 3120 .

[0380] The housing 3101b supports the input / output unit 3120b.

[0381] The input / output unit 3120 or the input / output unit 3120b includes a functional panel according to one aspect of the present invention. For example, the functional panel described in the fourth embodiment can be used for the input / output unit 3120.

[0382] The information processing device 3000B also includes a processor and a program for causing the processor to execute the program. The device is equipped with a power source such as a battery that supplies power to drive the memory unit and the calculation unit.

[0383] The housing 3101 houses a computing unit, a storage unit, a battery, and the like.

[0384] The information processing device 3000B displays information on the input / output unit 3120 or the input / output unit 3120b. It is possible.

[0385] The user of the information processing device 3000B connects to the input / output unit 3120 or the input / output unit 3120b. The user can use the fingers to provide the operation commands.

[0386] <<Information processing device C>> The information processing device 3000C includes an input / output unit 3120 and a housing that supports the input / output unit 3120. 3101 (see Figure 15(C-1) and Figure 15(C-2)).

[0387] The input / output unit 3120 includes a functional panel according to an embodiment of the present invention. The functional panel described above can be used as the input / output unit 3120.

[0388] The information processing device 3000C also stores a calculation unit and a program to be executed by the calculation unit. The device is equipped with a power source such as a battery that supplies power to drive the memory unit and the calculation unit.

[0389] The housing 3101 houses a computing unit, a storage unit, a battery, and the like.

[0390] Note that this embodiment mode can be appropriately combined with other embodiment modes shown in this specification. .

[0391] (Embodiment 7) In this embodiment, a configuration of a data processing device of one embodiment of the present invention will be described with reference to FIG. We will explain.

[0392] FIG. 16 illustrates an information processing device according to one embodiment of the present invention.

[0393] 16A-1 to 16A-3 are projection views of a data processing device of one embodiment of the present invention. do.

[0394] 16(B-1) and 16(B-2) are projection views of a data processing device of one embodiment of the present invention. be.

[0395] 16(C-1) and 16(C-2) are top views and diagrams of a data processing device of one embodiment of the present invention. and bottom view.

[0396] <<Information processing device A>> The information processing device 4000A includes an input / output unit 4120 and a housing 44 for supporting the input / output unit 4120. 101 (see FIGS. 16(A-1) to 16(A-3)).

[0397] The input / output unit 4120 includes a functional panel according to an embodiment of the present invention. The functional panel described above can be used as the input / output unit 4120.

[0398] The information processing device 4000A also includes a processor and a program for causing the processor to execute the program. The device is equipped with a power source such as a battery that supplies power to drive the memory unit and the calculation unit.

[0399] The housing 4101 houses a computing unit, a storage unit, a battery, and the like.

[0400] The information processing device 4000A can display information on the side and / or top surface. .

[0401] The user of the information processing device 4000A issues operation commands using fingers in contact with the side and / or top surface. Orders can be provided.

[0402] <<Information processing device B>> The information processing device 4000B includes an input / output unit 4120 and an input / output unit 4120b (see FIG. 1 6(B-1) and Fig. 16(B-2)).

[0403] The information processing device 4000B includes a housing 4101 that supports an input / output unit 4120 and a flexible The belt-shaped housing 4101b has:

[0404] The input / output unit 4120 or the input / output unit 4120b includes a functional panel according to one embodiment of the present invention. For example, the functional panel described in the fourth embodiment can be used for the input / output unit 4120.

[0405] The information processing device 4000B also has a housing 4101 that supports an input / output unit 4120b.

[0406] The information processing device 4000B also includes a processor and a program for causing the processor to execute the program. The device is equipped with a power source such as a battery that supplies power to drive the memory unit and the calculation unit.

[0407] The housing 4101 houses a computing unit, a storage unit, a battery, and the like.

[0408] The information processing device 4000B has an input / output device supported by a flexible belt-like housing 4101b. Display information can be displayed on the output unit 4120.

[0409] The user of the information processing device 4000B provides an operation command using a finger in contact with the input / output unit 4120. can be provided.

[0410] <<Information processing device C>> The information processing device 4000C includes an input / output unit 4120 and a housing that supports the input / output unit 4120. 4101 and a housing 4101b (see FIG. 16(C-1) and FIG. 16(C-2) ).

[0411] The input / output unit 4120 and the housing 4101b are flexible.

[0412] The input / output unit 4120 includes a functional panel according to an embodiment of the present invention. The functional panel described above can be used as the input / output unit 4120.

[0413] The information processing device 4000C also includes a processor and a program for causing the processor to execute the program. The device is equipped with a power source such as a battery that supplies power to drive the memory unit and the calculation unit.

[0414] The housing 4101 houses a computing unit, a storage unit, a battery, and the like.

[0415] The information processing device 4000C can be folded in two at the housing 4101b.

[0416] Note that this embodiment mode can be appropriately combined with other embodiment modes shown in this specification. .

[0417] For example, in this specification, when it is explicitly stated that X and Y are connected, In this case, X and Y are electrically connected, and X and Y are functionally connected. The case where X and Y are directly connected is also considered to be disclosed in this specification. Therefore, the present invention is not limited to the predetermined connection relationships, for example, the connection relationships shown in the drawings or text. Connections other than those shown in the drawings or text are also treated as if they were described in the drawings or text. do.

[0418] Here, X and Y are the object (for example, a device, an element, a circuit, a wiring, an electrode, a terminal, a conductive film, a layer, etc.). , etc.).

[0419] An example of a direct connection between X and Y is a circuit that allows electrical connection between X and Y. The elements to be considered (e.g., switches, transistors, capacitance elements, inductors, resistance elements, When no external device (such as a diode, display element, light-emitting element, or load) is connected between X and Y, The elements that allow electrical connection between X and Y (e.g., switches, transistors, capacitors) elements, inductors, resistors, diodes, display elements, light-emitting elements, loads, etc.) , X and Y are connected.

[0420] An example of an electrical connection between X and Y is The elements to be considered (e.g., switches, transistors, capacitance elements, inductors, resistance elements, One or more devices (such as diodes, display elements, light-emitting elements, and loads) can be connected between X and Y. It is possible. The switch has a function to control on / off. A switch can be in a conducting state (ON state) or a non-conducting state (OFF state), allowing current to flow. The switch has the function of controlling whether or not the current flows. When X and Y are electrically connected, This includes the case where Y is directly connected.

[0421] An example of a functional connection between X and Y is a function that allows the functional connection between X and Y. Circuits that perform the above functions (for example, logic circuits (inverters, NAND circuits, NOR circuits, etc.), signal conversion conversion circuits (DA conversion circuits, AD conversion circuits, gamma correction circuits, etc.), potential level conversion circuits (voltage power supply circuits (voltage boost circuits, voltage drop circuits, etc.), level shifter circuits that change the signal potential level, etc.) , voltage source, current source, switching circuit, amplifier circuit (which can increase the signal amplitude or current amount, etc.) circuits, operational amplifiers, differential amplifier circuits, source follower circuits, buffer circuits, etc.), signal generation One or more circuits (e.g., memory circuits, control circuits, etc.) can be connected between X and Y. For example, even if another circuit is inserted between X and Y, the signal output from X If X is transmitted to Y, then X and Y are considered to be functionally connected. When X and Y are functionally connected, there is a direct connection between X and Y and a direct connection between X and Y. This also includes the case where the and are electrically connected.

[0422] In addition, if it is explicitly stated that X and Y are electrically connected, are electrically connected (i.e., there is another element or circuit between X and Y) X and Y are functionally connected (i.e., X and Y are functionally connected) and (When there is a functional connection between them via another circuit) and when X and Y are directly connected (i.e., when X and Y are connected without any other element or circuit between them) is considered to be disclosed in the present specification. If it is explicitly stated that it is connected, The same content is considered to be disclosed in the present specification.

[0423] For example, if the source (or first terminal, etc.) of the transistor is connected via Z1 (or (not shown), electrically connected to X, and the drain (or second terminal, etc.) of the transistor is connected to Z 2 (or not), and is electrically connected to Y, or the source of the transistor (or the first terminal, etc.) is directly connected to a part of Z1, and another part of Z1 is directly connected to X. The drain (or second terminal, etc.) of the transistor is directly connected to a part of Z2. and another part of Z2 is directly connected to Y, It is possible to do so.

[0424] For example, "X and Y and the source (or first terminal, etc.) and drain (or second terminal, etc.) of a transistor" The terminals of the transistor (or the first terminal) are electrically connected to each other. 1 terminal, etc.), the drain of the transistor (or the second terminal, etc.), and Y. It can be expressed as "connected to the source (or the first The first terminal of the transistor is electrically connected to X, and the drain of the transistor is electrically connected to the second terminal of the transistor. The transistor source (or first terminal, etc.) is electrically connected to Y, and the transistor source (or first terminal, etc.) is electrically connected to X. The drain (or second terminal, etc.) of the transistor, Y, is electrically connected in this order. " Alternatively, "X is the source (or first terminal, etc.) of the transistor. and the drain (or second terminal, etc.) are electrically connected to Y, and X, the source (or first terminal, etc.) of a transistor, the drain (or second terminal, etc.) of a transistor ), Y is provided in this order of connection. By specifying the order of connections in the circuit configuration using a simple expression method, Distinguish between the source (or first terminal, etc.) and the drain (or second terminal, etc.) of a transistor. The technical scope can be determined by the above.

[0425] Alternatively, for example, "the source (or first terminal, etc.) of a transistor" is electrically connected to X through at least a first connection path, and the first connection path is , and the second connection path is a transistor through a transistor. The source (or first terminal, etc.) of the transistor and the drain (or second terminal, etc.) of the transistor The first connection path is a path via Z1, and the second connection path is a path between the first and second transistors. The drain (or second terminal, etc.) of the capacitor is electrically connected to Y through at least a third connection path. the third connection path does not have the second connection path, and the third connection path The connection path is the path via Z2. The source (or first terminal, etc.) of the resistor is connected to the resistor via Z1 by at least the first connection path. and electrically connected to X, and the first connection path does not have a second connection path; The second connection path has a connection path through a transistor, and (or the second terminal, etc.) is connected to Y via Z2 by at least a third connection path. The third connection path does not have the second connection path. Alternatively, the source (or first terminal, etc.) of the transistor may be at least The first electrical path is electrically connected to X through Z1. The primary path does not have a second electrical path, and the second electrical path is a From the source (or first terminal, etc.) to the drain (or second terminal, etc.) of the transistor The drain (or second terminal, etc.) of the transistor is connected to at least a third The third electrical path is electrically connected to Y through Z2. , does not have a fourth electrical path, and the fourth electrical path is (or second terminal, etc.) to the source (or first terminal, etc.) of the transistor. Using the same expression as these examples, the circuit configuration By defining the connection path in Distinguishing between the first terminal (or the second terminal, etc.) and the drain (or the second terminal, etc.) to determine the technical scope. can be done.

[0426] These representation methods are merely examples, and the present invention is not limited to these representation methods. , Y, Z1, Z2 are objects (e.g., devices, elements, circuits, wiring, electrodes, terminals, conductive films, layer, etc.).

[0427] In addition, the circuit diagram shows independent components as if they are electrically connected to each other. Even if the components are different, one component may have the functions of multiple components. For example, when a part of the wiring also functions as an electrode, one conductive film functions as both the wiring and the electrode. Therefore, the electrode in this specification has the functions of both components. The term "electromagnetic connection" refers to a case where one conductive film has the functions of multiple components. This also falls within the scope of the above. [Explanation of symbols]

[0428] BR wiring FPC2 flexible printed circuit board K01 housing K02 Hinge K10 arithmetic unit K10A Antenna K10B Battery K20 input / output device K30 display device K31 area K40 Input Device K41 Sensor K45 button K50 detection unit K100 Information Processing Device M0 drive transistor 10. Processed parts 10B Processed material 100 Film deposition equipment 100A film deposition equipment 100B film deposition equipment 100C film deposition equipment 100D film deposition equipment 110 Workpiece support 115 Shadow mask support part 120A evaporation source 120B Deposition source 121A Shielding plate 122A detector 140 Power 170 Shadow Mask 180 Chamber 181a Raw material supply section 181b Raw material supply department 182a High Speed Valve 182b High-Speed Valve 183a Raw material inlet 183b Raw material inlet 184 Raw material discharge port 185 Exhaust system 186 Workpiece support 190 Deposition chamber 195 Door Valve 196 Piping 197 Exhaust system 198 Detector 200 Function Panel 200(1) Function Panel 200(2) Function Panel 200(3) Function Panel 200B Function Panel 200TP Function Panel 201 areas 202 pixels 202R subpixel 205 Bonding layer 209 Flexible Printed Circuit Board 210 First substrate 210a Barrier film 210b Base material 210c resin layer 211 Wiring 219 terminal 221 Insulating film 228 Bulkhead 250R light emitting element 267BM light shielding layer 267p functional membrane 267R colored layer 270 Second substrate 270a Barrier film 270b Base material 270c resin layer 280R Display Module 290 Insulating Layer 291 Insulating Layer 300 Function Panel 305 Bonding layer 305a Bonding layer 305b Bonding layer 310 First substrate 310a First substrate 310b First substrate 330 Functional Layer 330a Functional Layer 330b functional layer 370 Second substrate 370a Second substrate 370b Second substrate 390 Insulating Layer 390a Insulating layer 390b insulating layer 610 Base material 711 Insulating film 767 Opening 1000 Film Deposition System 1000B Film Deposition System 3000A Information Processing Device 3000B Information Processing Equipment 3000C Information Processing Device 3101 Housing 3101b housing 3120 Input / output section 3120b input / output section 4000A Information Processing Device 4000B Information Processing Equipment 4000C Information Processing Device 4101 Housing 4101b housing 4120 Input / output section 4120b Input / output section

Claims

1. a pixel; and a driver circuit having a function of supplying a signal to the pixel; the pixel includes a first transistor and a light-emitting element; the drive circuit includes a second transistor; the first transistor has a first gate above a channel forming region; a display device, wherein the second transistor has a second gate above a channel formation region, a first substrate; a terminal having an area disposed above the first substrate; a flexible printed circuit board electrically connected to the terminal; an insulating film having a region disposed above the first gate of the first transistor and a region disposed above the second gate of the second transistor; a partition wall having a region disposed above the insulating film and a region covering an end portion of a lower electrode of the light emitting element; an aluminum oxide layer having a region disposed above the partition wall and a region disposed above an upper electrode of the light-emitting element; an adhesive disposed so as to have an area in contact with the upper surface of the aluminum oxide layer; a second substrate having an area disposed above the adhesive; In a cross-sectional view taken along a direction perpendicular to the first base, a side surface of the partition wall has a region where an angle formed between a bottom surface and the side surface is smaller than 90 degrees, the aluminum oxide layer has a first region overlapping with the first gate of the first transistor, a second region overlapping with the second gate of the second transistor, a third region in contact with a side surface of the partition wall, and a fourth region continuous with the third region and in contact with the insulating film; A display device, wherein, in a plan view, the third region and the fourth region are disposed between the terminal and the drive circuit.

2. a pixel; and a driver circuit having a function of supplying a signal to the pixel; the pixel includes a first transistor and a light-emitting element; the drive circuit includes a second transistor; the first transistor has a first gate above a channel forming region; a display device, wherein the second transistor has a second gate above a channel formation region, a first substrate; a terminal having an area disposed above the first substrate; a flexible printed circuit board electrically connected to the terminal; an insulating film having a region disposed above the first gate of the first transistor and a region disposed above the second gate of the second transistor; a partition wall having a region disposed above the insulating film and a region covering an end portion of a lower electrode of the light emitting element; an aluminum oxide layer having a region disposed above the partition wall and a region disposed above an upper electrode of the light-emitting element; an adhesive disposed so as to have an area in contact with the upper surface of the aluminum oxide layer; a second substrate having an area disposed above the adhesive; In a cross-sectional view taken along a direction perpendicular to the first base, a side surface of the partition wall has a region where an angle formed between a bottom surface and the side surface is smaller than 90 degrees, the aluminum oxide layer has a first region overlapping with the first gate of the first transistor, a second region overlapping with the second gate of the second transistor, a third region in contact with a side surface of the partition wall, and a fourth region continuous with the third region and in contact with the insulating film; an end portion of the aluminum oxide layer has a region that does not overlap with the second substrate; A display device, wherein, in a plan view, the third region and the fourth region are disposed between the terminal and the drive circuit.

3. In claim 1 or claim 2, the first transistor and the second transistor include an oxide semiconductor; The display device, wherein the oxide semiconductor contains indium.

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