Laser processing apparatus

Abstract

To provide a laser processing apparatus capable of setting the flow of blown gas to a desired flow across an irradiation range in which the irradiation range of a laser beam can be changed.SOLUTION: A laser processing apparatus comprises: a galvano optical system 3c which may change an irradiation position of a laser beam L on a workpiece W within a prescribed irradiation range R; a placement table 9 on which the workpiece W to be irradiated with the laser beam L is placed; a wall portion 66 which is installed between a final optical component provided at a final stage among optical components and the placement table 9, and partitions an internal space P through which the laser beam L passes and an external space Q so as to include at least the prescribed irradiation range R when viewed from the final optical component toward the placement table 9; and a gas blowing unit 6 which has a discharge port provided in the wall portion 66 to discharge gas toward the internal space P and a suction port provided in the wall portion 66 opposite to the discharge port to suck gas from the internal space P. The discharge port and the suction port open in a plane perpendicular to an irradiation surface W1 of the workpiece W that is irradiated with the laser beam L.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a laser processing apparatus that performs laser processing on an object by irradiating it with laser light. [Background technology]

[0002] Laser processing includes a variety of processes, including welding and cutting of workpieces, cleaning processes to remove the surface of an object, doping processes to add impurities to semiconductors, and laser annealing processes to restore the damaged crystalline structure of an object. In these processes, laser processing equipment must suppress the oxygen concentration near the laser irradiation position, which is the position on the object where the laser light is irradiated, to prevent oxidation of the object. For example, the laser processing head disclosed in Patent Document 1 introduces a non-oxidizing gas into a shielding box attached to the tip of the nozzle to shield the welding point and prevent oxidation of the welded area. Furthermore, the laser welding device disclosed in Patent Document 2 removes fumes and spatter generated by laser welding with gas sprayed onto the workpiece, preventing the fumes and spatter from adhering to the workpiece or optical equipment.

[0003] In conventional laser processing equipment, consideration has been given to how to spray gas onto the position where the laser light is actually irradiated, and measures have been taken to prevent oxidation of the target object and remove fumes and spatter. On the other hand, some laser processing equipment is equipped with a galvano scanner or the like, which changes the irradiation position of the laser light on the target object on the nozzle side that irradiates the laser light onto the target object. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 9-164495 [Patent Document 2] Japanese Patent Application Laid-Open No. 2012-192457 Summary of the Invention [Problem to be solved by the invention]

[0005] However, in a laser processing device in which the irradiation position of the laser light on the target object is changed on the nozzle side, spraying gas toward the changing irradiation position of the laser light requires that the spraying mechanism be moved in accordance with the change in the irradiation position of the laser light, which results in a problem of reduced throughput of laser processing.

[0006] The present invention has been made to solve the above problems, and aims to provide a laser processing device that can set the flow of gas sprayed over an irradiation range where the irradiation range of laser light can be changed to a desired flow. [Means for solving the problem]

[0007] In order to achieve this object, a first aspect of the present invention is a laser processing device that performs laser processing by irradiating a laser beam output from a laser oscillator toward a workpiece through predetermined optical components, and includes: an irradiation position change unit that can change the irradiation position of the laser beam on the workpiece within a predetermined irradiation range; a mounting table on which the workpiece to be irradiated with the laser beam is placed; a final optical component that is the final stage of the optical components, and a wall portion that is installed between the mounting table and partitions an internal space through which the laser beam passes and an external space so that the wall portion includes at least the predetermined irradiation range when viewed from the final optical component toward the mounting table; and a gas spray unit that has an outlet that is provided in the wall portion and discharges gas toward the internal space, and an inlet that is provided in the wall portion opposite the outlet and draws gas from the internal space, and the outlet and the inlet open in a plane perpendicular to the irradiation surface of the workpiece onto which the laser beam is irradiated.

[0008] A second aspect of the present invention is a laser processing apparatus according to the first aspect, wherein at least one of the discharge outlets and the suction ports is provided in plurality, and at least one of the suction ports faces any one of the discharge outlets.

[0009] A third aspect of the present invention is a laser processing apparatus according to the second aspect, wherein the discharge ports and the intake ports are arranged at equal intervals around the circumference so as to surround the predetermined irradiation range, regardless of their type.

[0010] A fourth aspect of the present invention is a laser processing apparatus according to the first aspect, which has a first step and a second step from the final optical component toward the mounting table, the first step having a first outlet for discharging a first gas and a first intake port for sucking in the first gas, and the second step having a second outlet for discharging a second gas and a second intake port for sucking in the second gas.

[0011] A fifth aspect of the present invention is a laser processing apparatus according to the fourth aspect, further comprising a partition plate between the first step portion and the second step portion, the partition plate protruding from the wall portion into the internal space.

[0012] A sixth aspect of the present invention is a laser processing apparatus according to the first aspect, which is provided with a partition plate protruding from the wall portion into the internal space on the side of the mounting table and / or the side of the final optical component from the position of the wall portion where the discharge port and the suction port are provided.

[0013] In a seventh aspect of the present invention, in the laser processing apparatus according to the first aspect, at least one of the discharge port and the suction port is provided with a flow rate adjusting unit that adjusts the flow rate of the gas.

[0014] In an eighth aspect of the present invention, in the laser processing apparatus according to the first aspect, at least one of the discharge port and the suction port is provided with a flow direction switching part that switches the flow direction of the gas.

[0015] A ninth aspect of the present invention is a laser processing apparatus according to the seventh aspect, further comprising an irradiation position determination unit that determines the irradiation position of the laser light, and the flow rate adjustment unit adjusts the flow rate of the gas based on the irradiation position determined by the irradiation position determination unit.

[0016] A tenth aspect of the present invention is a laser processing apparatus according to the eighth aspect, further comprising an irradiation position determination unit that determines an irradiation position of the laser light, and the flow direction switching unit switches the flow direction of the gas based on the irradiation position determined by the irradiation position determination unit.

[0017] An eleventh aspect of the present invention is a laser processing apparatus according to the first aspect, wherein the intake port is connected to a gas flow path that is inclined from the upstream side to the downstream side in the flow direction of the gas, in a direction away from the laser light irradiation surface of the workpiece.

[0018] A twelfth aspect of the present invention is a laser processing apparatus according to the first aspect, in which a communication passage is formed that connects the external space with the internal space, and a third outlet is provided that discharges shielding gas across the communication passage. [Effects of the Invention]

[0019] According to the laser processing apparatus of the first aspect of the present invention, gas is discharged from a discharge port provided in a wall portion and opening in a plane perpendicular to the irradiation surface of the workpiece where the laser beam is irradiated. The discharged gas flows toward intake ports provided in the wall portion at positions opposite to each other across a predetermined irradiation range where the laser beam irradiation position on the workpiece can be changed and opening in the perpendicular plane. This has the effect of spraying gas over the irradiation range where the laser beam irradiation position can be changed and setting the gas flow to a desired flow. Furthermore, compared to conventional methods in which gas is sprayed toward the actual position where the laser beam is irradiated, there is no need to move the gas spraying mechanism in accordance with changes in the laser beam irradiation position, which has the effect of improving the throughput of the laser processing apparatus.

[0020] The laser processing apparatus according to the second aspect of the present invention has the following effect in addition to the effect of the laser processing apparatus according to the first aspect: Since gas is discharged from a plurality of outlets or gas is drawn in from a plurality of inlet ports, the flow of gas over a predetermined irradiation range can be set with higher accuracy.

[0021] The laser processing apparatus according to the third aspect of the present invention has the following effect in addition to the effect of the laser processing apparatus according to the second aspect: Since the discharge ports and intake ports are arranged at equal intervals in the circumferential direction so as to surround a predetermined irradiation range regardless of the type, it has the effect of being able to set the gas flow to a desired flow without bias over a wide range including the irradiation range.

[0022] The laser processing apparatus according to the fourth aspect of the present invention has the following effect in addition to the effect achieved by the laser processing apparatus according to the first aspect: That is, the type of gas and the gas flow can be set according to the purpose at each stage, for example, by discharging a shielding gas at the second stage to prevent oxidation of the workpiece, discharging a high-velocity gas at the first stage to remove fumes and spatters generated during laser processing, or discharging an inert gas at the first stage to prevent outside air from flowing into the internal space through a communication passage between the external space and the internal space formed on the final optical component side of the first stage from flowing into the second stage.

[0023] The laser processing apparatus according to the fifth aspect of the present invention achieves the following effect in addition to the effect achieved by the laser processing apparatus according to the fourth aspect. That is, the first gas discharged from the first discharge port of the first stage flows to the first intake port without entraining the second gas flowing in the second stage due to the partition plate protruding from the wall portion toward the internal space. Also, the second gas discharged from the second discharge port of the second stage flows to the second intake port without entraining the first gas flowing in the first stage due to the partition plate. This has the effect of allowing the gas flow to be set without entraining the airflow from each stage.

[0024] The laser processing apparatus according to the sixth aspect of the present invention has the following effect in addition to the effect of the laser processing apparatus according to the first aspect. That is, a communication passage that connects the internal space partitioned by the wall to the external space may be formed between the wall and the mounting table, or between the wall and the final optical component, and the partition plate can be used to lengthen the distance of the communication passage. Therefore, gas suction by the gas blowing unit makes it difficult for gas (air) to be sucked into the internal space from the communication passage, resulting in the effect of suppressing air from the external space from being sucked into the internal space.

[0025] The laser processing apparatus according to the seventh aspect of the present invention has the following effect in addition to the effect of the laser processing apparatus according to the first aspect: Since the flow rate of the discharged gas or the flow rate of the inhaled gas can be adjusted by the flow rate adjusting unit provided in at least one of the discharge port and the inhalation port, there is an effect that the gas flow in a predetermined irradiation range can be more finely adjusted to a desired flow.

[0026] The laser processing apparatus according to the eighth aspect of the present invention has the following effect in addition to the effect of the laser processing apparatus according to the first aspect: The flow direction switching unit provided in at least one of the discharge port and the suction port can switch the gas flow direction from discharge to suction, or from suction to discharge, thereby enabling fine adjustment of the gas flow in a predetermined irradiation range to a desired flow.

[0027] The laser processing apparatus according to the ninth aspect of the present invention has the following effect in addition to the effect achieved by the laser processing apparatus according to the seventh aspect: Even if it is difficult to generate a desired gas flow over the entire predetermined irradiation range, the irradiation position of the laser beam on the workpiece is determined by the irradiation position determination unit, and the flow rate of gas discharged from the discharge port or the flow rate of gas sucked from the suction port is adjusted based on the irradiation position, thereby making it possible to control the gas flow at least near the irradiation position of the laser beam to a desired flow.

[0028] The laser processing apparatus according to the tenth aspect of the present invention has the following effect in addition to the effect achieved by the laser processing apparatus according to the eighth aspect: Even if it is difficult to generate a desired gas flow over the entire predetermined irradiation range, the irradiation position of the laser beam on the workpiece is determined by the irradiation position determination unit, and the gas flow direction is switched from discharge to suction, or from suction to discharge, based on the irradiation position, thereby making it possible to control the gas flow at least near the irradiation position of the laser beam to a desired flow.

[0029] The laser processing apparatus according to the eleventh aspect of the present invention has the following effect in addition to the effect achieved by the laser processing apparatus according to the first aspect: The gas sucked in from the intake port is sucked in from the upstream side to the downstream side in the gas flow direction through a gas flow path that is inclined in a direction away from the laser light irradiated surface of the workpiece, so that spatter and fumes generated at the laser irradiation position can be kicked up and discharged without dropping onto the workpiece.

[0030] The laser processing apparatus according to the twelfth aspect of the present invention has the following effect in addition to the effect of the laser processing apparatus according to the first aspect. That is, the shielding gas is discharged from the third discharge port so as to cross the communication passage that connects the external space and the internal space. This has the effect of preventing outside air from entering the predetermined irradiation range where the laser light can be irradiated from the external space. [Brief explanation of the drawings]

[0031] [Figure 1] 1 is a schematic diagram illustrating the configuration of a laser processing apparatus according to an embodiment of the present invention; [Figure 2] 2 is a schematic cross-sectional view of the laser processing apparatus taken along line II-II in FIG. 1. [Figure 3] 4 is a diagram showing a schematic view of the gas flow distribution in the second stage of the gas spraying unit of the laser processing apparatus. FIG. [Figure 4] FIG. 2 is a block diagram showing the electrical configuration of the laser processing apparatus. [Figure 5] FIG. 3 is a diagram showing areas A to I set by a control unit of the laser processing apparatus within the irradiation range of the laser light on the workpiece. [Figure 6] FIG. 2 is a diagram schematically showing a gas flow rate / flow direction table of the laser processing apparatus. [Figure 7] 1A and 1B are diagrams showing the gas flow distribution when the gas flow rate or gas flow direction is controlled based on the irradiation position of the laser light of the laser processing device, where (a) is a diagram showing the gas flow distribution when the galvano optical system irradiates the laser light toward the processing point T1, and (b) is a diagram showing the gas flow distribution when the galvano optical system irradiates the laser light toward the processing point T2. DETAILED DESCRIPTION OF THE INVENTION

[0032] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. Each of the embodiments described below represents a preferred specific example of the present invention. Therefore, the numerical values, shapes, materials, components, component placement positions, and connection configurations shown in the following embodiments are merely examples and are not intended to limit the present invention. Therefore, among the components in the following embodiments, components that are not recited in the independent claims that represent the highest concept of the present invention will be described as optional components. Furthermore, in each drawing, substantially identical components are designated by the same reference numerals, and redundant descriptions will be omitted or simplified.

[0033] A laser processing apparatus 1 according to one embodiment of the present invention will be described with reference to Fig. 1. Fig. 1 is a schematic diagram showing the configuration of the laser processing apparatus 1 according to this embodiment. In the description of this embodiment, the X-axis, Y-axis, and Z-axis are used. That is, the direction from left to right in the schematic diagram of Fig. 1 is the X-axis direction, the direction perpendicular to the X-axis extending from the front of the page to the back in this schematic diagram is the Y-axis direction, and the direction perpendicular to the X-axis and Y-axis extending from the bottom to the top in this schematic diagram is the Z-axis direction.

[0034] The laser processing device 1 is a device that performs laser processing such as laser welding on a workpiece W by irradiating the workpiece W with laser light L. However, the laser processing may be various processes that use laser light L, such as cutting, cleaning to remove the surface of an object, doping to add impurities to a semiconductor, and laser annealing to restore a damaged crystal structure of an object.

[0035] 1, the laser processing device 1 includes a laser oscillator 2, a head 3, a gas spraying unit 6, a gas supply and suction unit 7, a control unit 8, and a mounting table 9. The head 3 is a component that shapes the laser light L output from the laser oscillator 2 and irradiates it toward the workpiece W, and includes an optical system 3a, a mirror 3b, and a galvano optical system 3c.

[0036] The mounting table 9 is a member on which the workpiece W to be irradiated with the laser light L is placed. The control unit 8 is a device for controlling the laser oscillator 2, the gas supply and intake unit 7, and the galvano optical system 3c, and is electrically connected to these. The optical system 3a, the mirror 3b, and the galvano optical system 3c correspond to the optical components of the present invention, and the galvano optical system 3c corresponds to the final optical component provided at the final stage of the optical components.

[0037] The laser oscillator 2 is a device that oscillates and outputs laser light L. The laser oscillator 2 is mainly, for example, a fiber laser or a diode laser, but is not limited to these, and a YAG (Yttrium Aluminum Garnet) laser or an excimer laser may also be used. The laser oscillator 2 starts and stops emitting laser light L based on instructions from the control unit 8.

[0038] The optical system 3a is composed of one or more optical components (lenses such as collimating lenses, prisms, mirrors, etc.), and shapes the laser light L output from the laser oscillator 2. Shaping the laser light L includes, for example, collimating the laser light L with a collimating lens, processing the shape (profile) into a predetermined shape, and enlarging or reducing the size (diameter).

[0039] The mirror 3b is an optical component for directing the path of the laser light L shaped by the optical system 3a to the galvano optical system 3c. The galvano optical system 3c is a lens for focusing the laser light L, which is parallel light, onto the irradiation surface W1 of the workpiece W.

[0040] The galvanometer optical system 3c is an optical system for changing the irradiation position of the laser light L on the irradiation surface W1 of the workpiece W and the focusing position of the laser light L, and has a plurality of galvanometer mirrors and focusing lenses. Based on a control signal from the control unit 8, the galvanometer optical system 3c operates the rotation of each galvanometer mirror and the position of the focusing lens in conjunction with each other, thereby changing the irradiation position of the laser light L on the irradiation surface W1 of the workpiece W and focusing the laser light L at that irradiation position.

[0041] The irradiation direction of the laser light L incident on the galvano optical system 3c is changed based on a control signal from the control unit 8, and then the laser light L is irradiated toward the irradiation surface W1 of the workpiece W placed on the mounting table 9 via the gas spraying unit 6, which will be described later. This galvano optical system 3c corresponds to the irradiation position changing unit of the present invention, and can change the irradiation position of the laser light L on the workpiece W within a predetermined irradiation range R.

[0042] The gas spraying unit 6 is a member for discharging an inert gas (hereinafter also simply referred to as "gas"), such as nitrogen gas, toward an internal space P separated from an external space Q by a wall 66, thereby generating a gas flow within the internal space P. The wall 66 constitutes the gas spraying unit 6 and is formed in a cylindrical shape with both end faces in the Z-axis direction open. When installed between the galvano optical system 3c and the mounting table 9, the wall 66 separates the internal space P, through which the laser light L passes, from the external space Q. When viewed from the galvano optical system 3c toward the mounting table 9 (negative direction of the Z axis), the wall 66 separates the internal space P from the external space Q so as to include at least a predetermined irradiation range R.

[0043] The gas spraying unit 6 is divided into two stages in the vertical direction (Z-axis direction), with a first stage 62 provided on the upper stage from the galvano optical system 3c toward the mounting table 9 (Z-axis negative direction) and a second stage 61 provided on the lower stage. The upper first stage 62 has a first outlet 622 that discharges a first gas 621 toward the internal space P and a first inlet 623 that draws in the first gas 621. The first stage 62 discharges the first gas 621 at high speed from the first outlet 622 for the purpose of removing fumes and spatter generated by laser processing from the internal space P to the external space Q. The first gas 621 is, for example, nitrogen gas. As a result, in the first stage 62, even if outside air containing oxygen is taken in from the external space Q toward the internal space P through a communicating passage formed between the gas spraying section 6 and the head 3 (galvano optical system 3c), the nitrogen gas ejected at high speed can prevent the oxygen from entering the internal space P.

[0044] The second step portion 61 on the lower side has a second discharge port 612 that discharges a second gas 611 toward the internal space P and a second intake port 613 that draws in the second gas 611. The second step portion 61 discharges a shielding gas as the second gas 611 from the second discharge port 612 for the purpose of suppressing oxidation of the workpiece W due to irradiation with the laser light L.

[0045] The first discharge port 622 and the second discharge port 612 correspond to the discharge ports of the present invention, and are both provided in the wall portion 66, and open in a plane perpendicular to the irradiation surface W1 of the workpiece W that is irradiated with the laser light L. The first suction port 623 and the second suction port 613 correspond to the suction ports of the present invention, and the first suction port 623 is provided in the wall portion 66 opposite the first discharge port 622, and the second suction port 613 is provided in the wall portion 66 opposite the second discharge port 612. Like the first discharge port 622 and the second discharge port 612, the first suction port 623 and the second suction port 613 also open in a plane perpendicular to the irradiation surface W1 of the workpiece W that is irradiated with the laser light L.

[0046] In this way, in the first step 62, gas is discharged from a first discharge port 622 that is provided in the wall 66 and that opens in a plane perpendicular to the irradiation surface W1 of the workpiece W that is irradiated with the laser light L. The discharged first gas 621 flows toward a first suction port 623 that is provided in the wall 66 at a position opposite to the first gas 622 and across a predetermined irradiation range R within which the irradiation position of the laser light L on the workpiece W can be changed by the galvano optical system 3c.

[0047] In the second step 61, gas is discharged from a second discharge port 612 provided in the wall 66 and opened in a plane perpendicular to the irradiation surface W1 of the workpiece W that is irradiated with the laser light L. The discharged second gas 611 flows toward a second intake port 613 provided in the wall 66 at an opposing position across a predetermined irradiation range R within which the irradiation position of the laser light L on the workpiece W can be changed by the galvano optical system 3c.

[0048] As a result, in both the first stage 62 and the second stage 61, gas can be sprayed over a predetermined irradiation range R in which the irradiation position of the laser light L can be changed, and the gas flow can be set to a desired flow. Also, the type of gas and the gas flow can be set according to the purpose at each stage.

[0049] In this embodiment, the first discharge port 622 and the second discharge port 612 are configured to be able to change the flow rate of the gas discharged therefrom and also to change the flow direction of the gas respectively. That is, the first discharge port 622 and the second discharge port 612 can each be switched from discharging gas to suctioning gas under the control of the control unit 8. Furthermore, when the first discharge port 622 and the second discharge port 612 are switched to suctioning gas by the control unit 8, the flow rate of the suctioned gas can each be changed.

[0050] Furthermore, first suction port 623 and second suction port 613 are configured to be able to change the flow rate of gas sucked therein and also to be able to change the flow direction of the gas respectively. That is, first suction port 623 and second suction port 613 can each be switched from suctioning gas to discharging gas under the control of control unit 8. Furthermore, first suction port 623 and second suction port 613 are each configured to be able to change the flow rate of the gas to be discharged when switched to discharging gas by control unit 8.

[0051] Changes in the flow rate and flow direction of gas at first outlet 622, second outlet 612, first inlet 623, and second inlet 613 are all performed by gas supply and inlet unit 7 under the control of control unit 8. Details of gas supply and inlet unit 7 will be described later.

[0052] The gas blowing unit 6 also has a first gas flow path 624 and a second gas flow path 625 in the first step portion 62, and a third gas flow path 626 and a fourth gas flow path 627 in the second step portion 61.

[0053] The first gas flow path 624 is a communication path that communicates the first discharge port 622 and the gas supply suction unit 7. The first gas flow path 624 distributes gas supplied from the gas supply suction unit 7 to the first discharge port 622, and also distributes the inhaled gas to the gas supply suction unit 7 when gas is inhaled from the first discharge port 622. The second gas flow path 625 is a communication path that communicates the first suction port 623 and the gas supply suction unit 7. The second gas flow path 625 distributes gas inhaled from the first suction port 623 to the gas supply suction unit 7, and also distributes gas supplied from the gas supply suction unit 7 to the first suction port 623 when gas is discharged from the first suction port 623.

[0054] Here, the first step 62 blows gas for the purpose of expelling fumes and spatter from the internal space P to the external space Q, and the second gas flow path 625 connected to the first intake port 623 is inclined from the upstream side to the downstream side in the flow direction of the first gas 621, in a direction away from the irradiated surface W1 of the workpiece W. This allows the first gas 621 sucked in from the first intake port 623 to discharge spatter and fumes without dropping them onto the workpiece W, while kicking them up. Furthermore, the first gas flow path 624 connected to the first discharge port 622 may also change its flow direction to suck in the first gas 621. Therefore, by inclining the first gas flow path 624 from the upstream side to the downstream side in the flow direction of the first gas 621 when suction is performed, in a direction away from the irradiated surface W1 of the workpiece W, it is possible to discharge spatter and fumes without dropping them onto the workpiece W, while kicking them up.

[0055] The first gas flow path 624 may be provided parallel to the irradiation surface W1 of the workpiece W. This allows the first step 62 to blow out the first gas 621, which is discharged at high speed from the first discharge port 622, in a direction parallel to the irradiation surface W1 of the workpiece W. Furthermore, the second gas flow path 625 may be provided parallel to the irradiation surface W1 of the workpiece W. This allows the first gas 621, which is discharged at high speed from the first suction port 623, to be blown out in a direction parallel to the irradiation surface W1 of the workpiece W.

[0056] Furthermore, the suction of the first gas 621 at the first suction port 623 does not have to be forcibly performed by a suction pump, but may instead be performed by taking in the first gas 621 that has been blown out at high speed from the first discharge port 622 and passed through the internal space P, and discharging it to the outside from the gas blowing unit 6 via the second gas flow path 625. In this case, the flow rate at which the first gas 621 is sucked in at the first suction port 623 is naturally not controlled. Furthermore, the same configuration may be used when suctioning the first gas 621 at the first discharge port 622. Note that, when the first gas 621 blown out at high speed is taken in as is and discharged to the outside, it is preferable that the corresponding gas flow path is provided parallel to the irradiation surface W1 of the workpiece W. Furthermore, the "suction" in the present invention is a concept that includes taking in the discharged gas as is and discharging it to the outside.

[0057] Furthermore, the first stage 62 may not switch the flow direction at the first discharge port 622, and may only discharge the first gas 621 from the first discharge port 622. In this case, the first stage 62 may not switch the flow direction at the first suction port 623, and may only suck the first gas 621 from the first suction port 623.

[0058] The third gas flow path 626 is a communication path that communicates the second discharge port 612 and the gas supply suction unit 7. The third gas flow path 626 distributes gas supplied from the gas supply suction unit 7 to the second discharge port 612, and also distributes the inhaled gas to the gas supply suction unit 7 when gas is inhaled from the second discharge port 612. The fourth gas flow path 627 is a communication path that communicates the second suction port 613 and the gas supply suction unit 7. The fourth gas flow path 627 distributes gas inhaled from the second suction port 613 to the gas supply suction unit 7, and also distributes gas supplied from the gas supply suction unit 7 to the second suction port 613 when gas is discharged from the second suction port 613.

[0059] Here, the third gas flow path 626 and the fourth gas flow path 627 are provided parallel to the irradiation surface W1 of the workpiece W. As a result, the second gas 611 is ejected from the second discharge port 612 (or the second suction port 613) approximately parallel to the irradiation surface W1 of the workpiece W, flows through the internal space P approximately parallel to the irradiation surface W1, and is sucked out from the second suction port 613 (or the second discharge port 612).

[0060] The third gas flow path 626 may be inclined from the upstream side to the downstream side in the flow direction of the second gas 611 when the gas is discharged from the second discharge port 612, in a direction approaching the irradiated surface W1 of the workpiece W. This allows the second gas discharged from the second discharge port 612 to directly hit the irradiated surface W1 of the workpiece W, and ensures that the irradiated surface W1 is protected by the shielding gas. Furthermore, the fourth gas flow path 627 may be inclined from the upstream side to the downstream side in the flow direction of the second gas 611 when the gas is sucked in from the second suction port 613, in a direction away from the irradiated surface W1 of the workpiece W. This allows even if the second gas 611 sucked in from the second suction port 613 contains spatter or fumes, they can be lifted up in the fourth gas flow path 627 and discharged without dropping onto the workpiece W.

[0061] A first partition plate 64 protruding from the wall portion 66 into the internal space P is provided between the second step portion 61 and the first step portion 62 of the gas blowing section 6, and a second partition plate 65 protruding from the wall portion 66 into the internal space P is provided between the second discharge port 612 and the second intake port 613 and the mounting table 9 (for example, at the end of the wall portion 66 on the mounting table 9 side).

[0062] In this way, by providing the first partition plate 64 between the second stage 61 and the first stage 62 of the gas blowing unit 6, the second gas 611 discharged from the second discharge port 612 of the second stage 61 flows to the second intake port 613 without entraining the first gas 621 flowing through the first stage 62. Furthermore, the first gas 621 discharged from the first discharge port 622 of the first stage 62 flows to the first intake port 623 without entraining the second gas 611 flowing through the second stage 61 due to the first partition plate 64. This makes it possible to set the gas flow without entraining the airflow from each stage.

[0063] Furthermore, when discharging gas, the first gas flow path 624 connected to the first discharge port 622 is inclined from the upstream side to the downstream side in the flow direction of the first gas 621, in a direction approaching the irradiation surface W1 of the workpiece W. When discharging gas from the first suction port 623 as well, the connected second gas flow path 625 is inclined similarly to the first gas flow path 624. Therefore, the first gas 621 discharged from the first discharge port 622 or the first suction port 623 is blown out from each opening in a direction approaching the irradiation surface W1 of the workpiece W. However, the presence of the first partition plate 64 makes it possible to direct the first gas 621 to flow in a direction approximately parallel to the irradiation surface W1.

[0064] Furthermore, by providing a second partition plate 65 between the second discharge port 612 and the second suction port 613 and the mounting table 9, the second gas 611 discharged from the second discharge port 612 flows toward the second suction port 613 while heading toward the center of the predetermined irradiation range R. When gas is also discharged from the second suction port 613, the discharged second gas 611 flows toward the second discharge port 612 while heading toward the center of the predetermined irradiation range R. This makes it easier to distribute the gas throughout the predetermined irradiation range R.

[0065] Here, the gas blowing unit 6 is provided at a distance in the Z-axis direction from the head 3 and at a distance in the Z-axis direction from the mounting table 9. As a result, communication paths that connect the internal space P separated by the wall portion 66 with the external space Q are formed between the head 3 and the gas blowing unit 6, and between the mounting table 9 and the gas blowing unit 6.

[0066] In response to this, the second partition plate 65 provided between the second discharge port 612 and the second suction port 613 and the mounting table 9 can lengthen the distance of the communication passage formed between the mounting table 9 and the gas blowing unit 6, which connects the internal space P with the external space Q. As a result, an extremely high suction force is required to suck up the gas (air) in the communication passage. Therefore, even if the gas blowing unit 6 uses a strong suction force to suck in the gas in the internal space P, it is possible to suck in the gas (air) from the communication passage, and as a result, it is possible to prevent the air in the external space Q from being sucked into the internal space P.

[0067] In FIG. 1, no partition plate is provided on the wall 66 between the first outlet 622 and first intake 623 and the head 3 (galvano optical system 3c) of the gas blowing unit 6. However, a third partition plate protruding from the wall 66 into the internal space P may be provided at this location (for example, at the end of the wall 66 on the head 3 side (galvano optical system 3c)). The third partition plate can lengthen the distance of the communication passage that connects the internal space P formed between the head 3 and the gas blowing unit 6 with the external space Q. This requires an extremely high suction force to suck up the gas (air) in the communication passage. Therefore, even if the gas blowing unit 6 uses a strong suction force to suck in the gas in the internal space P, it is possible to prevent the gas (air) from being sucked in from the communication passage, resulting in the air in the external space Q being sucked into the internal space P.

[0068] The gas blowing unit 6 is also provided with third outlets 632 that discharge a shielding gas, which is a third gas 631, in a direction that crosses each of the communication passages formed between the head 3 and the gas blowing unit 6 and between the mounting table 9 and the gas blowing unit 6. That is, the third outlets 632 discharge the shielding gas in the positive direction of the Z axis into the communication passage formed between the head 3 and the gas blowing unit 6. The third outlets 632 also discharge the shielding gas in the negative direction of the Z axis into the communication passage formed between the mounting table 9 and the gas blowing unit 6. This makes it possible to prevent outside air from entering the internal space P from the external space Q.

[0069] The cross-sectional structure of the second step portion 61 of the gas blowing unit 6 will be described with reference to Figure 2. The cross-sectional structure of the first step portion 62 is the same as that of the second step portion 61, so a description thereof will be omitted here.

[0070] Fig. 2 is a schematic cross-sectional view of the laser processing apparatus 1 taken along line II-II in Fig. 1. Wall portion 66 of gas blowing unit 6 has an octagonal cross-sectional shape provided to surround a predetermined irradiation range R when viewed from the galvano optical system 3c side toward mounting table 9 (negative direction of the Z axis). Each side of the octagon is provided with one of second outlets 612a, 612b, 612c, and 612d, which are second outlets 612, and one of second inlet ports 613a, 613b, 613c, and 613d, which are second inlet ports 613. That is, regardless of type, second outlet port 612a, second outlet port 612b, second outlet port 612c, second outlet port 612d, second suction port 613a, second suction port 613b, second suction port 613c, and second suction port 613d are arranged at equal intervals in the circumferential direction so as to surround a predetermined irradiation range R. Furthermore, second outlet port 612a faces second suction port 613a, second outlet port 612b faces second suction port 613b, second outlet port 612c faces second suction port 613c, and second outlet port 612d faces second suction port 613d. Note that a second partition plate 65 separating second step portion 61 and mounting table 9 is provided around the entire inner periphery of wall portion 66.

[0071] FIG. 3 shows the gas flow rate distribution within the second stage 61 of the gas blowing unit 6 of the laser processing apparatus 1. In FIG. 3, the narrower the hatching spacing, the higher the gas flow rate. As shown in FIG. 3, the gas discharged from the second outlet 612a, second outlet 612b, second outlet 612c, and second outlet 612d merge near the predetermined irradiation range R, increasing the flow rate, and then flows to the second inlet 613a, second inlet 613b, second inlet 613c, and second inlet 613d. This allows the desired flow of gas to be blown across the irradiation range R, where the irradiation position of the laser beam L can be changed by the galvano optical system 3c. Furthermore, compared to conventional methods in which gas is blown toward the actual position irradiated by the laser beam L, this method eliminates the need to move the gas blowing mechanism in response to changes in the irradiation position of the laser beam L, thereby improving the throughput of the laser processing apparatus 1.

[0072] Furthermore, gas is discharged from a plurality of second outlets 612a, 612b, 612c, and 612d, or gas is inhaled from a plurality of second intake ports 613a, 613b, 613c, and 613d, so that the flow of gas over a specified irradiation range R can be set with greater precision.

[0073] Furthermore, the second discharge ports 612a, 612b, 612c, 612d and the second intake ports 613a, 613b, 613c, 613d are arranged at equal intervals around the circumference to surround a predetermined irradiation range R regardless of type, so that the gas flow can be set to the desired flow without bias over a wide range including the irradiation range R.

[0074] The above-mentioned effects have been explained for the second step portion 61, but the same effects are also achieved for the first step portion 62.

[0075] Although the cross section of the second step portion 61 is octagonal, it is not limited to this and may be other polygonal shapes such as a hexagon or a decagon, or may be circular. The number of second outlet ports 612 does not necessarily have to be four, as long as there is one or more. The number of second inlet ports 613 does not necessarily have to be four, as long as there is one or more. The number of second outlet ports 612 and second inlet ports 613 does not necessarily have to be the same. However, at least one of the second outlet ports 612 and at least one of the second inlet ports 613 must be provided in opposing positions on the wall portion 66. The above modifications can also be applied to the first step portion 62.

[0076] Furthermore, the cross section of the wall portion 66 of the first step portion 62 and the cross section of the wall portion 66 of the second step portion 61 do not need to have the same shape, and may have a different shape from that of the second step portion 61 across the first partition plate 64. The number of first discharge ports 622 and first suction ports 623 of the first step portion 62 may also be different from the number of second discharge ports 612 and second suction ports 613 of the second step portion 61.

[0077] The gas supply and intake unit 7 is a device for supplying gas to be discharged or for inhaling gas to each of the first discharge port 622, the first intake port 623, the second discharge port 612, and the second intake port 613. The gas supply and intake unit 7 adjusts the flow rate of gas and switches the flow direction of gas for each of the first discharge port 622, the first intake port 623, the second discharge port 612, and the second intake port 613 based on instructions from the control unit 8. When a plurality of first discharge ports 622 are provided as shown in FIG. 2, the gas supply and intake unit 7 adjusts the flow rate of gas and switches the flow direction of gas for each of the first discharge ports 622 independently. The same applies to the first intake port 623, the second discharge port 612, and the second intake port 613.

[0078] 1, first gas cylinder 71a, first gas suction pump 71b, first gas supply valve 71c, first gas suction valve 71d, and first switching valve 71e are connected to second outlet 612. Second gas cylinder 72a, second gas suction pump 72b, second gas supply valve 72c, second gas suction valve 72d, and second switching valve 72e are connected to second outlet 613. Third gas cylinder 73a, third gas suction pump 73b, third gas supply valve 73c, third gas suction valve 73d, and third switching valve 73e are connected to first outlet 622. Fourth gas cylinder 74a, fourth gas suction pump 74b, fourth gas supply valve 74c, fourth gas suction valve 74d, and fourth switching valve 74e are connected to first suction port 623. The third outlet port 632 is connected to a fifth gas cylinder 75a and a fifth gas supply valve 75c.

[0079] The first gas cylinder 71a is a container that stores the second gas 611, which is an inert gas. The first gas supply valve 71c is a valve that adjusts the flow rate of the second gas 611 to be discharged by opening and closing a passage for the second gas 611 flowing from the first gas cylinder 71a using an electrical signal. The first gas suction pump 71b is a pump that sucks the second gas 611 from the second discharge port 612. The first gas suction valve 71d is a valve that adjusts the flow rate of the second gas 611 to be sucked by opening and closing a passage for the second gas 611 sucked from the second discharge port 612 using an electrical signal.

[0080] The first switching valve 71e is a valve for switching communication with the third gas flow path 626 connected to the second discharge port 612 between the first gas supply valve 71c and the first gas suction valve 71d in response to an output signal from the control unit 8. When the second gas 611 is discharged from the second discharge port 612, the first switching valve 71e connects the first gas supply valve 71c to the third gas flow path 626. When the second gas 611 is suctioned from the second discharge port 612, the first switching valve 71e connects the first gas suction valve 71d to the third gas flow path 626.

[0081] When a plurality of second outlets 612 are provided, at least first gas supply valve 71c, first gas suction valve 71d, and first switching valve 71e are provided separately for each second outlet 612. First gas cylinder 71a and first gas suction pump 71b may be provided separately for each second outlet 612, or one for each of the plurality of second outlets 612, or one for all of the second outlets 612. This modification can also be applied to second suction port 613, first outlet port 622, and first suction port 623.

[0082] Similar to the first gas cylinder 71a, the second gas cylinder 72a is a container that stores the second gas 611, which is an inert gas. However, the second gas cylinder 72a and the first gas cylinder 71a may be a common container, or the first gas cylinder 71a may be connected to the second gas supply valve 72c, or the second gas cylinder 72a may be connected to the first gas supply valve 71c.

[0083] The third gas cylinder 73a and the fourth gas cylinder 74a are containers for storing the first gas 621, which is a high-velocity gas. The third gas cylinder 73a and the fourth gas cylinder 74a may also be a common gas cylinder, or the third gas cylinder 73a may be connected to a fourth gas supply valve 74c, or the fourth gas cylinder 74a may be connected to the third gas supply valve 73c.

[0084] The second gas suction pump 72b, the third gas suction pump 73b, and the fourth gas suction pump 74b are the same as the first gas suction pump 71b. However, the second gas suction pump 72b and the first gas suction pump 71b may be a common pump, or the first gas suction pump 71b may be connected to the second gas suction valve 72d, or the second gas suction pump 72b may be connected to the first gas suction valve 71d. Similarly, the third gas suction pump 73b and the fourth gas suction pump 74b may be a common pump, or the third gas suction pump 73b may be connected to the fourth gas suction valve 74d, or the fourth gas suction pump 74b may be connected to the third gas suction valve 73d.

[0085] The second gas supply valve 72c, the third gas supply valve 73c, and the fourth gas supply valve 74c are the same as those used in the first gas supply valve 71c. The second gas intake valve 72d, the third gas intake valve 73d, and the fourth gas intake valve 74d are the same as those used in the first gas intake valve 71d. The second switching valve 72e, the third switching valve 73e, and the fourth switching valve 74e are the same as those used in the first switching valve 71e. The first gas supply valve 71c, the second gas supply valve 72c, the third gas supply valve 73c, the fourth gas supply valve 74c, the first gas intake valve 71d, the second gas intake valve 72d, the third gas intake valve 73d, and the fourth gas intake valve 74d correspond to the flow rate adjusting unit of the present invention. The first switching valve 71e, the second switching valve 72e, the third switching valve 73e, and the fourth switching valve 74e correspond to the flow direction switching unit of the present invention.

[0086] In this way, by adjusting the flow rates of the first outlet 622, the first intake port 623, the second outlet 612, and the second intake port 613, the flow rate of the gas being discharged or the flow rate of the gas being inhaled can be adjusted, allowing for more precise adjustment so that the gas flow in a specified irradiation range becomes the desired flow.

[0087] Furthermore, by switching the flow direction of the first outlet 622, the first intake 623, the second outlet 612, and the second intake 613, the gas flow in a predetermined irradiation range can be more precisely adjusted to a desired flow.

[0088] The fifth gas cylinder 75a is a container that stores a third gas 631, which is a shielding gas. The fifth gas supply valve 75c is a valve that adjusts the flow rate of the third gas 631 by opening and closing a passage for the third gas 631 flowing from the fifth gas cylinder 75a using an electrical signal.

[0089] Next, the electrical configuration of the laser processing apparatus 1 will be described with reference to Fig. 4. Fig. 4 is a block diagram showing the electrical configuration of the laser processing apparatus 1. The control unit 8 provided in the laser processing apparatus 1 has a CPU (Central Processing Unit) 81, a ROM (Read Only Memory) 82, and a RAM (Random Access Memory) 83, which are connected via a bus line. The laser oscillator 2, the gas supply and suction unit 7, and the galvano optical system 3c are also connected to the bus line.

[0090] The CPU 81 is an arithmetic device that performs various calculations to control the irradiation of the laser light L by the laser oscillator 2, the discharge and intake of gas by the gas supply and intake unit 7, and the change of the irradiation position of the laser light L by the galvano optical system 3c, in accordance with program data 82a stored in the ROM 82.

[0091] The ROM 82 is a ROM for storing program data for executing the laser irradiation program, irradiation position determination program, and irradiation position change program in the CPU 81, as well as for storing a gas flow rate / flow direction table 82b as fixed value data.

[0092] The gas flow rate / flow direction table 82b classifies the predetermined irradiation range R, in which the laser beam L can be irradiated, into nine areas A to I. Each area corresponds to a specific gas flow rate and flow direction for each of the four discharge ports and four intake ports when the laser beam irradiation position is in the corresponding area. Figure 5 shows the areas A to I set by the control unit 8 for the irradiation range R of the laser beam L on the workpiece W, and the numbers 1 to 9 assigned to the discharge ports (or intake ports) whose gas flow rates and flow directions are controlled by the control unit 8. Figure 6 is a schematic diagram of the gas flow rate / flow direction table, showing the gas flow rates and flow directions for the discharge ports (intake ports) "1" to "9" corresponding to the areas A to I in Figure 5. In Figure 5, the gas flow rates are tentatively indicated as "large" or "small." The gas flow directions are indicated as "discharge," "intake," or "stop." The gas flow rate / flow direction table 82b is prepared for the first stage 62 and the second stage 61, and is stored in the ROM 82. The gas flow rate and flow direction of the discharge ports (suction ports) "1" to "9" of the first stage 62 are determined using the gas flow rate / flow direction table 82b for the first stage 62. The gas flow rate and flow direction of the discharge ports (suction ports) "1" to "9" of the second stage 61 are determined using the gas flow rate / flow direction table 82b for the second stage 61.

[0093] The RAM 83 is a rewritable volatile ROM, and temporarily stores various data when the CPU 81 performs arithmetic processing in accordance with the program data 82a. The RAM 83 stores irradiation position information 83a as one of the various data. The irradiation position information 83a is information that indicates, in order, the coordinates on the locus of the irradiation position of the laser light L on the workpiece W, which is set in advance by the user before laser processing is performed.

[0094] The operation of the laser processing apparatus 1 of the embodiment configured as above will be described. The CPU 81 of the laser processing apparatus 1 executes various calculations in accordance with the program data 82a, thereby executing processing by the laser processing apparatus 1 as follows.

[0095] When an operator operates the laser processing device 1 to start laser processing, the CPU 81 executes a laser irradiation program to instruct the laser oscillator 2 to output laser light L. The laser light L output from the laser oscillator 2 is collimated by the optical system 3a, its profile is adjusted, and then it is directed to the galvano optical system 3c via the mirror 3b. The irradiation position of the laser light L incident on the irradiation surface W1 of the workpiece W is changed, and the laser light L is focused at that irradiation position.

[0096] The CPU 81 executes an irradiation position changing program stored in the program data 82a and reads the coordinates of the irradiation position of the laser light L to be next irradiated onto the workpiece W from the irradiation position information 83a stored in the RAM 83. The CPU 81 controls the galvano optical system 3c so that the laser light L is irradiated onto the irradiation position indicated by the coordinates. Next, the CPU 81 executes an irradiation position determination program stored in the program data 82a and determines which of areas A to I the coordinates of the irradiation position of the laser light L used to control the galvano optical system 3c fall within. This determination corresponds to the irradiation position determination unit of the present invention. The area determined here is data for determining the flow rate and flow direction of the gas.

[0097] The CPU 81 references a gas flow rate / flow direction table 82b stored in the ROM 82 and reads out the gas flow rate and flow direction corresponding to each area for the first stage 62 and the second stage 61. The CPU 81 outputs the read-out gas flow rate and flow direction to the gas supply / suction unit 7. The gas supply / suction unit 7 discharges and draws in the gas based on the gas flow rate and flow direction output by the CPU 81. FIG. 7 is a diagram schematically illustrating a gas flow rate distribution when the gas flow rate or gas flow direction is controlled based on the irradiation position of the laser beam L of the laser processing apparatus 1. For example, as shown in FIG. 7(a), when the galvano optical system 3c irradiates the laser beam L toward the processing point T1, the CPU 81 executes the irradiation position determination program stored in the program data 82a and determines area E as the irradiation area based on the irradiation position information 83a. The CPU 81 then determines the gas flow rate and gas flow direction of the discharge ports (suction ports) 1 to 9 corresponding to area E and controls the gas supply / suction unit 7 based on the determined gas flow rate and flow direction. 7(b), when the galvano optical system 3c changes the irradiation position and irradiates the laser light L toward the processing point T2, the CPU 81 executes the irradiation position determination program stored in the program data 82a and determines the area I as the irradiation area based on the irradiation position information 83a. Then, the CPU 81 determines the flow rate and flow direction of the gas from the discharge ports (suction ports) 1 to 9 corresponding to the area I, and controls the gas supply and suction unit 7 based on this. As a result, even if the irradiation position of the laser light is changed from T1 to T2, the flow rate in the area including the changed irradiation position can be increased.

[0098] In this way, even if it is difficult to generate the desired gas flow throughout the entire specified irradiation range R, the irradiation position T of the laser light L on the workpiece W can be determined by an irradiation position determination program stored in the program data 82a, and the flow rate of gas discharged from the discharge port or the flow rate of gas inhaled from the intake port can be adjusted based on the irradiation position T, thereby controlling the gas flow at least near the irradiation position of the laser light to the desired flow.

[0099] In addition, the irradiation position T of the laser light L on the workpiece W is determined by an irradiation position determination program stored in the program data 82a, and the gas flow direction is switched from discharge to suction, or from suction to discharge based on the irradiation position T, thereby controlling the gas flow at least near the irradiation position T of the laser light to the desired flow.

[0100] Although the present invention has been described above based on the embodiments, it is readily apparent that the present invention is not limited to the above embodiments, and various improvements and modifications are possible within the scope of the present invention. For example, each embodiment may be modified by adding or replacing a part or parts of the configuration of another embodiment, including the modifications described below. Furthermore, the numerical values given in the above embodiments are merely examples, and other numerical values may of course be adopted.

[0101] In the laser processing apparatus 1 of the above embodiment, the irradiation position of the laser light L is changed using the galvanometer optical system 3c, but the galvanometer mirror may be moved horizontally to change the irradiation position of the laser light L. Also, the irradiation position of the laser light L may be changed by moving the head 3 horizontally using a robot arm or the like.

[0102] In the laser processing apparatus 1 of the above embodiment, the gas blowing unit 6 is configured with two stages, the first stage 62 and the second stage 61. However, this is not limited to this, and the gas blowing unit 6 may be configured with three stages, the first stage 62, the second stage 61, and the third stage 62, the upper stage and the lower stage 61, the lower stage 61, the second stage 62, the third stage 61, the first stage 62, the third stage 61, the third stage 61, the first stage 62, the third stage 61, the third stage 61, the first stage 62, the third stage 62, the third stage 61, the third stage 61, the third stage 61, the third stage 61, the third stage 61, the third stage 61, the third stage 61, the third stage 61, the third stage 61, the third stage 61, the third stage 61, the third stage 61, the third stage 61, the third stage 61, the third stage 61, the third stage 61, the third stage 61, the third stage 61, the third stage 61, the third stage 61, the third stage 61, the third stage 61, the fourth ...

[0103] In the laser processing apparatus 1 of the above embodiment, the gas flow rate and gas flow direction are controlled using the gas supply and intake section 7, but the gas flow rate and gas flow direction at the outlet (inlet) may be set at the design stage so that the gas flows at the desired rate over a predetermined irradiation range R where the irradiation position of the laser light L can be changed, and when actually operating, gas may be discharged or drawn in from each outlet and intake at the flow rate and flow direction set at the design stage.

[0104] In the laser processing apparatus 1 of the above embodiment, the gas flow rate / flow direction table 82b indicates the gas flow rate value in two stages, "large" and "small," but it may be possible to set more finely in multiple stages (for example, integers from "0" to "15"), or to set the flow rate value (cm3 / s).

[0105] In the laser processing apparatus 1 of the above embodiment, the case where the gas flow rate is adjusted for each of the first discharge port 622 and the first suction port 623 has been described, but the gas flow rate may be adjusted for only one of the first discharge port 622 and the first suction port 623. Also, the gas flow rate may be adjusted for only some of the multiple first discharge ports 622, or the gas flow rate may be adjusted for only some of the multiple first suction ports 623. Also, the gas flow rate may not be adjusted for each of the first discharge port 622 and the first suction port 623, and only the gas flow direction may be switched.

[0106] Similarly, in the laser processing apparatus 1 of the above embodiment, the case where the gas flow rate is adjusted for each of the second discharge port 612 and the second inlet port 613 has been described, but the gas flow rate may be adjusted for only one of the second discharge port 612 and the second inlet port 613. Furthermore, the gas flow rate may be adjusted for only some of the second discharge ports 612 among the plurality of second discharge ports 612, or the gas flow rate may be adjusted for only some of the second inlet ports 613 among the plurality of second inlet ports 613. Furthermore, the gas flow rate may not be adjusted for each of the second discharge port 612 and the second inlet port 613, and only the gas flow direction may be switched for each.

[0107] In the laser processing apparatus 1 of the above embodiment, the case where the gas flow direction is switched for each of the first outlet 622 and the first inlet 623 has been described, but the gas flow direction may be switched for only one of the first outlet 622 and the first inlet 623. Also, the gas flow direction may be switched for only some of the multiple first outlets 622, or for only some of the multiple first inlet 623. Also, the gas flow direction may not be switched for each of the first outlet 622 and the first inlet 623, and only the gas flow rate may be adjusted.

[0108] Similarly, in the laser processing apparatus 1 of the above embodiment, the case where the gas flow direction is switched for each of the second outlet 612 and the second inlet 613 has been described, but the gas flow direction may be switched for only one of the second outlet 612 and the second inlet 613. Furthermore, the gas flow direction may be switched for only some of the second outlets 612 out of the multiple second outlets 612, or the gas flow direction may be switched for only some of the multiple second inlet ports 613. Furthermore, the gas flow direction may not be switched for each of the second outlets 612 and the second inlet 613, and only the gas flow rate may be adjusted.

[0109] In the laser processing apparatus 1 of the above embodiment, the wall portion 66 of the gas blowing unit 6 is installed with a gap between it and the head 3, but it may also be installed in close contact with the head 3 with no gap. In this case, since no communication path between the internal space P and the external space Q is formed on the head 3 side, the upward third discharge port 632 for spraying the shielding gas toward the head 3 side is not necessary.

[0110] In the laser processing apparatus 1 of the above embodiment, FIG. 1 shows a case where the first partition plate 64 and the second partition plate 65 are formed so that their lengths in the Z-axis direction from the wall portion 66 toward the internal space P are equal. In contrast to this, the first partition plate 64 and the second partition plate 65 may be formed in a tapered shape so that their lengths in the Z-axis direction decrease from the wall portion 66 toward the internal space P. Furthermore, the third partition plate, which has been described as being provided on the wall portion 66 between the first outlet port 622 and the first suction port 623 and the head 3, may also be formed in a tapered shape. By forming each partition plate in a tapered shape, it is possible to prevent gas from accumulating in the corners formed between the wall portion 66 and the partition plate protruding from the wall portion 66. [Explanation of symbols]

[0111] 1. Laser processing equipment 2 Laser oscillator 3 heads 3a Optical system 3b Mirror 3c Galvano optical system (irradiation position change part) 6 Gas spraying section 62 First Stage 621 First Gas 622 1st discharge port 623 1st intake port 61 Second Stage 611 Second Gas 612 2nd outlet 613 2nd intake port 631 Third Gas 632 3rd discharge port 64 First partition 65 Second partition 66 Wall 7 Gas supply and intake 9 Mounting table L laser light double work

Claims

1. A laser processing device that performs laser processing by irradiating a workpiece with laser light output from a laser oscillator through predetermined optical components, an irradiation position changing unit that can change the irradiation position of the laser light on the workpiece within a predetermined irradiation range; a mounting table on which the workpiece to be irradiated with the laser light is placed; a wall portion that is installed between a final optical component that is provided in a final stage among the optical components and the mounting table, and that partitions an internal space through which the laser light passes and an external space so as to include at least the predetermined irradiation range when viewed from the final optical component toward the mounting table; a gas blowing unit that has: a discharge port that is provided in the wall portion and that discharges gas toward the internal space; and a suction port that is provided in the wall portion opposite to the discharge port and that sucks gas from the internal space, The outlet and the inlet are A laser processing device characterized in that the opening is in a plane perpendicular to the irradiation surface of the workpiece onto which the laser light is irradiated.

2. 2. The laser processing device according to claim 1, wherein at least one of the discharge ports and the suction ports is provided in plural, and at least one of the suction ports faces any one of the discharge ports.

3. 3. The laser processing device according to claim 2, wherein the discharge ports and the suction ports are arranged at equal intervals in the circumferential direction so as to surround the predetermined irradiation range, regardless of their types.

4. the gas spraying unit has a first step portion and a second step portion extending from the optical component toward the mounting table, the first step portion including a first outlet port for discharging a first gas and a first inlet port for sucking the first gas; 2. The laser processing device according to claim 1, wherein the second step portion comprises a second outlet port for discharging the second gas and a second inlet port for sucking the second gas.

5. 5. The laser processing device according to claim 4, further comprising a partition plate between the first step portion and the second step portion, the partition plate protruding from the wall portion into the internal space.

6. 2. The laser processing apparatus according to claim 1, further comprising a partition plate protruding from the wall portion into the internal space on the side of the mounting table and / or the side of the final optical component from the position of the wall portion where the discharge port and the suction port are provided.

7. 2. The laser processing device according to claim 1, wherein at least one of the discharge port and the suction port is provided with a flow rate adjusting unit that adjusts the flow rate of the gas.

8. 2. The laser processing device according to claim 1, wherein at least one of the discharge port and the suction port is provided with a flow direction switching part that switches the flow direction of the gas.

9. an irradiation position determination unit that determines the irradiation position of the laser light changed by the irradiation position change unit, 8. The laser processing device according to claim 7, wherein the flow rate adjusting unit adjusts the flow rate of the gas based on the irradiation position determined by the irradiation position determining unit.

10. an irradiation position determination unit that determines the irradiation position of the laser light changed by the irradiation position change unit, 9. The laser processing device according to claim 8, wherein the flow direction switching unit switches the flow direction of the gas based on the irradiation position determined by the irradiation position determining unit.

11. 2. The laser processing device according to claim 1, wherein the suction port is connected to a gas flow path that is inclined from the upstream side to the downstream side in the flow direction of the gas in a direction away from the laser light irradiation surface of the workpiece.

12. 2. The laser processing device according to claim 1, further comprising: a communication passage that connects the external space with the internal space; and a third discharge port that discharges the shielding gas across the communication passage.

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