Imaging device

JP2025118108APending Publication Date: 2025-08-13CANON KK
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Patent Information

Application Number
JP2024013232
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-01-31
Publication Date
2025-08-13

AI Technical Summary

Technical Problem

Existing pan-tilt cameras with interchangeable lenses face challenges in achieving sufficient heat dissipation and ease of center of gravity adjustment due to limited contact surface for heat conduction and fixed tripod mounts.

Method used

An imaging device with a switchable fixed arm mechanism that allows the imaging unit to be positioned and fixed to a support rail for heat dissipation during shooting, and movable for center of gravity adjustment during preparation, using a heat sink and support rail with enhanced thermal conductivity.

Benefits of technology

Ensures effective heat dissipation and easy center of gravity adjustment in pan-tilt cameras with interchangeable lenses, maintaining operational stability and reducing image blur.

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Abstract

To easily adjust the center of gravity of a lens interchangeable pan / tilt camera while securing sufficient heat dissipation capability.SOLUTION: An imaging device is characterized in that a fixation state in which an imaging unit and a camera support rail come into contact with each other and a non-fixation state in which they do not come into contact are alternated with a fixed arm that the image unit comprises, wherein the imaging device is placed in the fixation state for photography to dissipate the heat of an image sensor through natural air cooling as the heat is transferred from the imaging unit to the camera support rail, or placed in the non-fixation state for gravity center adjustment to make the imaging unit movable along the optical axis relative to the camera support rail.SELECTED DRAWING: Figure 1
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Description

[Technical Field]

[0001] The present invention relates to an imaging device. [Background technology]

[0002] Pan-tilt cameras (PT cameras) are imaging devices that can rotate the imaging unit in both pan and tilt directions. In recent years, the rise in pixel count and frame rate has led to increased heat generation, particularly from imaging elements, and there is a possibility that natural cooling via the exterior alone may not be sufficient to dissipate the heat.

[0003] However, incorporating a heat dissipation fan into the imaging unit of a PT camera to improve heat dissipation capacity increases the weight of the imaging unit, and a higher performance motor is required to ensure the torque required for pan / tilt drive. This also increases the volume of the imaging unit, resulting in a larger overall imaging device. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 5925053 Summary of the Invention [Problem to be solved by the invention]

[0005] A known heat dissipation method for an imaging device other than forced air cooling or natural air cooling is a structure in which heat generated inside the imaging device is dissipated by thermal conduction from a tripod mount on the bottom of the device to a tripod, as described in Patent Document 1. In other words, heat generated by the imaging element and image processing IC built into the imaging device can be dissipated by being transferred to a tripod that is fixed with screws into holes in the camera's tripod mount.

[0006] However, with the above-mentioned tripod mount heat dissipation structure, the actual contact surface is limited to the periphery of the screw seat, resulting in high contact thermal resistance and limited effectiveness in heat conduction from the tripod mount to the outside. Therefore, it is not practical to apply this to a PT camera with interchangeable lenses. Another issue is that because the camera is fixed to a tripod or similar device, it is not possible to adjust the center of gravity in the optical axis direction, which is necessary for a PT camera with interchangeable lenses.

[0007] An object of the present invention is to provide a PT camera with interchangeable lenses that can achieve both sufficient heat dissipation capacity during shooting and ease of center of gravity adjustment. [Means for solving the problem]

[0008] The imaging device of the present invention comprises an imaging unit equipped with a lens mount to which an interchangeable lens unit can be attached, a support rail that supports the imaging unit so that it can move back and forth in the forward and backward directions and that is equipped with a heat sink, a fixed arm for positioning and fixing the imaging unit to the support rail, the support arm to which the support rail is fixed, an arm unit that supports the support arm so that it can rotate in the tilt direction, and a base unit that supports the arm unit so that it can rotate in the pan direction, wherein the fixed arm is switchable between a fixed state in which the imaging unit is positioned and fixed relative to the support rail and an unfixed state in which the imaging unit is not positioned and fixed relative to the support rail, and in the fixed state, the exterior of the imaging unit is in surface contact with the support rail, so that heat generated inside the imaging device is dissipated from the heat sink of the support rail. [Effects of the Invention]

[0009] According to the present invention, it is possible to provide an interchangeable lens type pan-tilt imaging device that can easily adjust the center of gravity while ensuring sufficient heat dissipation capability during imaging. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 1 is a front view of an imaging device according to a first embodiment. [Figure 2] FIG. 1 is a top view of an imaging device according to a first embodiment. [Figure 3] FIG. 2 is a front view of the imaging unit according to the first embodiment. [Figure 4] FIG. 2 is a cross-sectional view of the imaging unit according to the first embodiment. [Figure 5] FIG. 2 is a perspective view of a camera support rail according to the first embodiment. [Figure 6] FIG. 2 is a front view of the imaging unit and the camera support rail according to the first embodiment. [Figure 7] FIG. 10 is a front view of an imaging unit and a camera support rail according to a second embodiment. [Figure 8] FIG. 11 is a front view of an imaging unit and a camera support rail according to a third embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0011] Preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0012] Example 1 1 is a front view of an imaging device according to a first embodiment of the present invention, and Fig. 2 is a top view of the imaging device according to the first embodiment of the present invention. Here, the imaging device viewed from the imaged side in the normal pan-tilt position is taken as the front.

[0013] The imaging device 100 is made up of an imaging unit 110, an arm unit 200, and a base unit 300.

[0014] An interchangeable lens unit 120 is fixed to the imaging unit 110 via a lens mount. The lens mount has a function of mechanically fixing the imaging unit 110 and the lens unit 120 using a bayonet structure, and a function of electrically connecting them using electrical contacts.

[0015] Furthermore, imaging unit 110 includes therein imaging element 110S, which is disposed on the optical axis OA of lens unit 120 and perpendicular to the optical axis OA, and outputs an imaging signal based on the image light of a subject formed by lens unit 120. The imaging signal output from imaging element 110S is transmitted to an image processing board built into base unit 300 via an electrical cable that transmits signals, passing through the inside of arm unit 200, and image data is generated.

[0016] The imaging unit 110 is connected at its bottom surface to the camera support unit 130, and the camera support unit 130 is supported by the arm unit 200 so as to be rotatable in the tilt direction around a tilt rotation axis TA. The camera support unit 130 is composed of a camera support arm 131 connected to the arm unit 200, and a camera support rail 132 that supports the imaging unit 110.

[0017] The camera support arm 131 extends from the tilt rotation axis TA of the arm unit 200 toward the bottom of the imaging unit 110. The camera support arm 131 is driven to rotate about the tilt rotation axis TA by a bearing, a gear train, and a tilt drive motor (none of which are shown) provided inside the arm unit 200. The bearing rotatably supports the camera support arm 131, and the gear train transmits the driving force of the tilt drive motor to the camera support arm 131. The gear train is a speed reduction mechanism, and may be a belt-based speed reduction mechanism, or the tilt drive motor and camera support arm 131 may be directly connected via a coupling or the like.

[0018] The camera support rail 132 supports the imaging unit 110 from its bottom surface, is fixed to the imaging unit 110 during shooting, and allows the imaging unit 110 to move linearly in a direction parallel to the optical axis OA (the front-to-rear direction of the imaging device 100) during center of gravity adjustment. That is, since the lens units 120 attached via lens mounts have different weights and centers of gravity, the imaging unit 110 is moved in a direction parallel to the optical axis OA relative to the camera support rail 132 to adjust the center of gravity.

[0019] The arm unit 200 is made up of an arm section 210 that stands upright to support the camera support unit 130 from both sides, and an arm base section 220 that connects the arm section 210 at the bottom and connects to the base unit 300.

[0020] The base unit 300 is a pedestal that supports the entire imaging device 100 on the bottom surface thereof and also supports the arm unit 200 so that it can rotate in the pan direction around the pan rotation axis PA, and is provided with terminals 310 on the rear side. The terminals 310 include, for example, a power terminal, a video terminal, and a network terminal. Note that the location of the terminals 310 is not limited to the rear side, but it is desirable to provide them on the base unit 300, which is a pedestal, so that cables and the like connected to the terminals 310 do not move due to pan / tilt driving.

[0021] Furthermore, the base unit 300 is provided with a bearing, a gear train, and a tilt drive motor (none of which are shown) inside, similar to the arm unit 200, and is driven to rotate the arm unit 200 around the pan rotation axis PA.

[0022] These mechanisms allow the imaging device 100 to be rotated in the pan direction and tilt direction.

[0023] Next, the structure of the imaging unit 110 will be described with reference to Figures 3 and 4. Figure 3 is a front view of the imaging unit 110, and Figure 4 is a cross-sectional view of the imaging unit 110 taken along the line AA in Figure 3.

[0024] The imaging unit 110 is covered by an imaging unit exterior 111, and an imaging element 110S is disposed inside the opening of the lens mount 114. A thermally conductive member 113 is disposed so as to be in contact with the rear side of the imaging element 110S and the backside of an imaging unit contact surface 111A that forms part of the bottom surface of the imaging unit exterior 111. This thermally conductive member 113 conducts heat generated by the imaging element 110S from the backside of the imaging unit contact surface 111A to the imaging unit contact surface 111A. Note that the position of the imaging unit contact surface 111A that is connected to the thermally conductive member 113 may be the bottom surface of the imaging unit 110, as well as a side surface or top surface, or a combination of these.

[0025] The heat conducting member 113 is configured, for example, by a sheet metal part made of a copper alloy, a heat pipe, a graphite sheet, etc. The imaging unit contact surface 111A is a metal exterior made of a material such as aluminum or magnesium, and it is desirable that the thermal resistance be small.

[0026] An image processing board 116 is disposed on the rear side of the image sensor 110S, and the image sensor 110S and the image processing board 116 are electrically connected via a flexible printed circuit board 115. The image processing board 116 receives the image signal output from the image sensor 110S, performs predetermined image processing on the image signal, and generates image data. The generated image data is output from terminals 310 to the outside of the image sensor 100 via electrical cables and circuit boards built into the arm unit 200 and the base unit 300.

[0027] The imaging unit 110 has fixed arms 112 on both ends of an imaging unit contact surface 111A on the bottom surface. The fixed arm 112 is composed of a fixed arm connection part 112A that extends from the bottom surface of the imaging unit 110, and a fixed arm engagement part 112B that extends from the fixed arm connection part 112A and engages with the camera support rail 132. The fixed arm engagement part 112B has a convex shape that protrudes inward from each of the left and right sides, for example.

[0028] Next, the structure of the camera support rail will be described with reference to Fig. 5. Fig. 5 is a perspective view of the camera support rail.

[0029] The camera support rail 132 is, for example, a rail part formed by extrusion molding or a sheet metal part formed by press molding, and is preferably made of a material with high thermal conductivity such as an aluminum alloy. Also, in order to support the imaging unit 110 so that it can move linearly in a direction parallel to the optical axis OA, the cross-sectional shape is the same in the direction parallel to the optical axis OA.

[0030] The camera support rail 132 has a camera support rail contact surface 132A on the imaging unit 110 side. At both ends of the camera support rail contact surface 132A in the direction parallel to the tilt drive axis TA, there are provided camera support rail engagement portions 132B. The camera support rail engagement portions 132B are, for example, recessed inward. The surface opposite the camera support rail contact surface 132A is provided with a heat sink surface 132H. The heat sink surface 132H is an enlarged heat transfer surface for increasing the surface area of the camera support rail 132, and may be, for example, a plurality of fins formed by extrusion molding or corrugated fins formed by bending a metal plate.

[0031] 6(a) is a front view showing a fixed state in which the imaging unit 110 is positioned and fixed to the camera support rail 132 during imaging. Also, FIG. 6(b) is a front view showing an unfixed state in which the imaging unit 110 is movable in a straight line relative to the camera support rail 132 during adjustment of the center of gravity of the imaging device 100.

[0032] The fixed arm engagement portion 112B of the imaging unit 110 and the camera support rail engagement portion 132B of the camera support rail 132 engage with each other, and the camera support rail contact surface 132A and the imaging unit contact surface 111A face each other. The fixed arm 112 of the imaging unit 110 is moved in the vertical direction (the up and down direction of the imaging device 100). The imaging unit 110 can be switched between a fixed state in which it is fixed to the camera support rail 132 and an unfixed state in which it is movable in a straight line relative to the camera support rail 132.

[0033] First, the state in which the imaging unit 110 is positioned and fixed to the camera support rail 132 will be described with reference to FIG. 6(a).

[0034] The fixed arm engaging portion 112B engages with the camera support rail engaging portion 132B to pull the camera support rail 132 toward the imaging unit 110, and the imaging unit contact surface 111A and the camera support rail contact surface 132A come into surface contact. Then, the imaging unit 110 is positioned and fixed to the camera support rail 132 by the frictional force between the engaging portions and the frictional force between the contact surfaces. At this time, the fixed arm 112 protrudes from the imaging unit contact surface 111A by a protrusion amount L1.

[0035] Furthermore, contact between the imaging unit contact surface 111A and the camera support rail contact surface 132A allows heat generated by the imaging element 110S in the imaging unit 110 to be conducted to the camera support rail 132. This allows the heat generated by the imaging element 110S to be dissipated to the outside air via the camera support rail 132. Furthermore, by providing the camera support rail 132 with a heat sink surface 132H on the surface opposite the camera support rail contact surface 132A, the heat dissipation effect from the camera support rail 132 to the outside air can be improved. Furthermore, by increasing the contact pressure between the contact surfaces, the frictional force is increased, firmly positioning and fixing the imaging unit 110 to the camera support rail 132, preventing image blur due to rattle of the imaging unit 110 even when pan / tilt driving is performed. Furthermore, the heat dissipation effect can be improved by reducing the contact thermal resistance of the contact surfaces.

[0036] Next, a state in which the imaging unit 110 is movable in a straight line relative to the camera support rail 132 will be described with reference to FIG. 6(b).

[0037] The fixed arm engaging portion 112B engages with the camera support rail engaging portion 132B to pull the camera support rail 132 away from the imaging unit 110, and the imaging unit contact surface 111A and the camera support rail contact surface 132A are separated by a clearance CL. At this time, there is no friction between the imaging unit contact surface 111A and the camera support rail contact surface 132A, and the imaging unit 110 can move linearly in a direction parallel to the optical axis OA relative to the camera support rail 132. At this time, the fixed arm 112 protrudes from the imaging unit contact surface 111A by a protrusion amount L2 (L2>L1).

[0038] Generally, when adjusting the center of gravity of the imaging device 100, it is during the preparation stage when no image is being captured, so the imaging element 110S does not generate heat and there is no need to dissipate that heat. Therefore, there is no problem if the imaging unit contact surface 111A and the camera support rail contact surface 132A are spaced apart during center of gravity adjustment. It is also acceptable for the clearance CL to be zero, meaning that the imaging unit contact surface 111A and the camera support rail contact surface 132A are in contact. In this case, the contact pressure must be sufficiently low so that the imaging unit 110 can move linearly in a direction parallel to the optical axis OA by sliding on the contact surface.

[0039] In this way, the contact state between the imaging unit contact surface 111A and the camera support rail contact surface 132A is switched. Then, during photography, the imaging unit 110 is positioned and fixed relative to the camera support rail 132, and heat generated in the imaging element 110S can be dissipated by natural air cooling through heat conduction from the imaging unit 110 to the camera support rail 132. Furthermore, during adjustment of the center of gravity of the imaging device 100, the imaging unit 110 can be easily moved in the optical axis direction relative to the camera support rail 132.

[0040] The shapes and engagement relationship of fixed arm engagement portion 112B and camera support rail engagement portion 132B are not limited to the above configuration, and for example, the concave and convex shapes of fixed arm engagement portion 112B and camera support rail engagement portion 132B may be reversed.

[0041] It is also desirable that the imaging unit contact surface 111A and the camera support rail contact surface 132A are both flat, which reduces the contact thermal resistance when the imaging unit contact surface 111A and the camera support rail contact surface 132A are in contact with each other, and improves the effect of dissipating heat generated by the imaging element 110S from the heat sink surface 132H.

[0042] Example 2 7 is a front view of an imaging device according to a second embodiment of the present invention. The imaging device of the second embodiment has a function of positioning in a direction parallel to the tilt rotation axis by having an inclined engaging portion between the fixed arm of the imaging unit and the camera support rail. The following mainly describes the differences from the first embodiment with reference to FIG. 7.

[0043] The imaging unit 2110 has fixed arms 2112 on both ends of an imaging unit contact surface 2111A on the bottom surface. The fixed arm 2112 is composed of a fixed arm connection part 2112A extending from the bottom surface of the imaging unit 2110, and a fixed arm engagement part 2112B extending from the fixed arm connection part 2112A and engaging with the camera support rail 2132.

[0044] The camera support rail 2132 has a camera support rail contact surface 2132A on the imaging unit 2110 side. In addition, camera support rail engagement portions 2132B are provided on both ends of the camera support rail contact surface 2132A in a direction parallel to the tilt drive axis TA. The camera support rail engagement portions 2132B engage with the fixed arm engagement portion 2112B. In addition, the camera support rail 2132 has a heat sink surface 2132H on the surface opposite to the camera support rail contact surface 2132A.

[0045] Here, the fixed arm engaging portion 2112B and the camera support rail engaging portion 2132B each have a sloped surface, and when the imaging unit 2110 is fixed to the camera support rail 2132, the sloped surfaces come into contact with each other and engage with each other.

[0046] The arm-side sloped surface shape 2112C of the fixed arm engagement portion 2112B is located on the imaging unit contact surface 2111A side of the fixed arm engagement portion 2112B. In addition, the rail-side sloped surface shape 2132C of the camera support rail engagement portion 2132B is located on the camera support rail contact surface 2132A side of the camera support rail engagement portion 2132B. The arm-side sloped surface shape 2112C and the rail-side sloped surface shape 2132C are parallel, and the angle that each slope forms with the imaging unit contact surface 2112A is, for example, 45 degrees.

[0047] The fixed arm 2112 of the imaging unit 2110 is moved in the vertical direction (up and down direction of the imaging device 100). The imaging unit 2110 can be switched between a fixed state in which it is positioned and fixed relative to the camera support rail 2132, and an unfixed state in which it is movable in a straight line relative to the camera support rail 2132.

[0048] When positioning and fixing the imaging unit 2110 relative to the camera support rail 2132, the fixing arm 2112 is moved toward the imaging unit 2110, and the arm-side inclined surface shape 2112C and the rail-side inclined surface shape 2132C engage with each other. At this time, as the inclined surfaces engage with each other, a component force is generated in a direction parallel to the imaging unit contact surface 2111A. This component force determines the position of the imaging unit 2110 in a direction parallel to the imaging unit contact surface 2111A. Also, as in the first embodiment, the imaging unit contact surface 2111A and the camera support rail contact surface 2132A come into contact with each other.

[0049] In this way, the imaging unit 2110 can be positioned and fixed to the camera support rail 2132 in a direction parallel to the imaging unit contact surface 2111A, and heat generated by the imaging element 2110S can be dissipated from the camera support rail 2132.

[0050] When adjusting the center of gravity of the imaging device, the fixed arm engaging portion 2112B engages with the camera support rail engaging portion 2132B to push the camera support rail 2132 away from the imaging unit 2110. This provides the same effect as in the first embodiment, that is, the imaging unit 2110 can be easily moved in the optical axis direction relative to the camera support rail 2132.

[0051] Example 3 8 is a front view of an imaging device according to a third embodiment of the present invention. In the imaging device of the third embodiment, a plurality of fixed arms and camera support rails of the imaging unit are arranged on a surface other than the bottom surface of the imaging unit. The following mainly describes the differences from the first embodiment with reference to FIG. 8.

[0052] In the imaging unit 3110, a thermally conductive member 3113 is provided on the back side of the imaging element 3110S, thermally connecting the imaging element 3110S and the back surface of the imaging unit contact surface 3111AL, and the imaging element 3110S and the back surface of the imaging unit contact surface 3111AR. The imaging unit contact surfaces 3111AL and 3111AR form part of the side surfaces of the imaging unit exterior 3111, and are located on the left and right sides of the imaging unit 3110, respectively. As in the first embodiment, it is desirable that the imaging unit contact surfaces 3111AL and 3111AR have low thermal resistance between them and their back surfaces. This allows the thermally conductive member 3113 to conduct heat generated by the imaging element 3110S to the imaging unit contact surfaces 3111AL and 3111AR.

[0053] The imaging unit 3110 has fixed arms 3112L on both ends of the imaging unit contact surface 3111AL, and fixed arms 3112R on both ends of the imaging unit contact surface 3111AR. Also, camera support rails 3132L and 3132R are arranged on the left and right sides of the imaging unit 3110, respectively.

[0054] When the imaging unit 3110 is positioned and fixed to the camera support rails 3132L and 3132R, the fixing arm 3112L is moved toward the imaging unit 3110. Then, the camera support rail contact surface 3132AL of the camera support rail 3132L is brought into contact with the imaging unit contact surface 3111AL. The fixing arm 3112R is also moved toward the imaging unit 3110, and the camera support rail contact surface 3132AR of the camera support rail 3132R is brought into contact with the imaging unit contact surface 3111AR. This allows heat generated in the imaging element 3110S to be conducted from the imaging unit contact surfaces 3111AL and 3111AR to the camera support rails 3132AL and 3132AR.

[0055] When the imaging unit 3110 is not to be positioned and fixed relative to the camera support rails 3132L and 3132R, the fixing arms 3112L and 3112R are moved away from the imaging unit 3110. Then, the imaging unit contact surfaces 3111AL and 3111AR are moved away from the camera support rail contact surfaces 3132AL and 3132AR, respectively, or are brought into contact with them with a sufficiently low contact pressure. This results in no friction or a sufficiently low friction between the imaging unit contact surfaces 3111AL and 3111AR and the camera support rail contact surfaces 3132AL and 3132AR. This allows the imaging unit 3110 to move linearly relative to the camera support rails 3132L and 3132R in a direction parallel to the optical axis OA.

[0056] The camera support rails 3132L, 3132R are supported by the camera support arm 131 as described in the first embodiment so as to be rotatable about the tilt rotation axis TA of the arm unit 200. It is also desirable that the camera support rails 3132L, 3132R be able to move linearly in a direction parallel to the tilt rotation axis TA relative to the arm section 210. This prevents a load from being applied to the arm section 210 in a direction parallel to the tilt rotation axis TA when switching the contact state between the camera support rail contact surfaces 3132AL, 3132AR and the imaging unit contact surfaces 3111AL, 3111AR.

[0057] In this way, in the third embodiment, heat generated by the image sensor 3110S is conducted to and dissipated by the camera support rails 3132L and 3132R provided on the left and right sides of the imaging unit 3110. In this configuration, multiple camera support rails are required compared to the first embodiment, resulting in increased costs, but the surface area of the camera support rails is increased, making it possible to improve the effect of dissipating heat from the image sensor 3110S.

[0058] Although the present invention has been described in detail above based on preferred embodiments thereof, the present invention is not limited to these specific embodiments, and various forms within the scope of the gist of the present invention are also included in the present invention. Parts of the above-described embodiments may be combined as appropriate. [Explanation of symbols]

[0059] 110 Imaging unit 112 Fixed Arm 114 Lens Mount 120 Lens Unit 130 Camera support unit 131 Camera support arm 132 Camera support rail 132H Heatsink surface 200 Arm Unit 210 Arm 220 Arm base 300 base unit

Claims

1. an imaging unit having a lens mount to which an interchangeable lens unit can be attached; a support rail that supports the imaging unit so as to be movable in the front-rear direction and is equipped with a heat sink; a fixing arm for positioning and fixing the imaging unit to the support rail; a support arm to which the support rail is fixed; an arm unit that supports the support arm so that the support arm can rotate in a tilt direction; a base unit that supports the arm unit so that the arm unit can rotate in a pan direction; and the fixed arm is switchable between a fixed state in which the imaging unit is positioned and fixed to the support rail and an unfixed state in which the imaging unit is not positioned and fixed to the support rail, In the fixed state, the exterior of the imaging unit is in surface contact with the support rail, so that heat generated inside the imaging device is dissipated from the heat sink of the support rail.

2. 2. The imaging device according to claim 1, wherein the fixed arm positions and fixes the imaging unit relative to the support rail by bringing the imaging unit into surface contact with the support rail in the fixed state, and separates the imaging unit from the support rail in the unlocked state, allowing the imaging unit to move in the forward and backward directions relative to the support rail.

3. 2. The imaging device according to claim 1, wherein the fixed arm positions and fixes the imaging unit relative to the support rail by bringing the imaging unit into surface contact with the support rail in the fixed state, and allows the imaging unit to move in the forward and backward directions relative to the support rail by bringing the imaging unit into sliding contact with the support rail in the non-fixed state.

4. 2. The imaging device according to claim 1, wherein the fixed arm protrudes from both ends of the imaging unit and comprises a fixed arm connection portion extending from the imaging unit and a fixed arm engagement portion extending from the fixed arm connection portion and engaging with the support rail.

5. the fixed arm engaging portions have convex shapes that protrude inward from both ends of the imaging unit, 5. The imaging device according to claim 4, wherein the support rail includes a support rail engaging portion that engages with the fixed arm engaging portion.

6. 2. The imaging device according to claim 1, wherein the support rail is disposed on the bottom side of the imaging unit.

7. 2. The imaging device according to claim 1, wherein the imaging unit is positioned and fixed to the plurality of support rails by the fixing arms.

8. 8. The imaging device according to claim 7, wherein the imaging unit is positioned and fixed to the support rails by a plurality of fixing arms arranged on different sides of the imaging unit.

Citation Information

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