Coating stripping method and coating stripping device

Abstract

To provide an efficient coating stripping method.SOLUTION: A coating stripping method uses laser light L to strip a coating of a wire material 100 while moving a wire material 100 relative to a laser irradiation device 10 in a feed direction D, and includes a first irradiation step of moving a spot area S of the laser light L in a first direction F across the wire material 100 and irradiating a first irradiation area 103 on the wire material 100 with the laser light L, a first feeding step of moving the spot area S in the feed direction of the wire material 100 after the first irradiation step, and a second irradiation step of moving the spot area S of the laser light L in a second direction F' opposite to the first direction F across the wire material 100 and irradiating a second irradiation area 104 that overlaps with at least a portion of the first irradiation area 103 with the laser light L.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present invention relates to a coating stripping method and a coating stripping device. [Background technology]

[0002] The coating stripping method described in Patent Document 1 discloses a method of removing an insulating coating of an electric wire by irradiating the insulating coating with a laser beam. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2021-158819 Summary of the Invention [Problem to be solved by the invention]

[0004] As a method for stripping the insulating coating of an electric wire, a method of irradiating the wire with laser light, as described in Patent Document 1, is known.

[0005] In order to increase the insulating coating removal rate, conventional coating stripping methods using laser light require multiple laser irradiation by sending the insulated electric wire back and forth through the laser light multiple times, or multiple laser irradiation devices to apply the laser multiple times. However, multiple laser irradiation may reduce productivity, and the use of multiple laser irradiation devices may increase the size of the device.

[0006] Therefore, an object of the present disclosure is to provide an efficient coating stripping method and coating stripping device. [Means for solving the problem]

[0007] A coating stripping method according to one aspect of the present invention includes: A coating stripping method for stripping a coating of a wire rod by using a laser beam while moving the wire rod in a feed direction relative to a laser irradiation device, a first irradiation step of irradiating a first irradiation region on the wire with the laser light by moving a spot region of the laser light in a first direction across the wire; a first feeding step of moving the spot area in the feeding direction of the wire rod after the first irradiation step; and a second irradiation step of moving the spot area of the laser light in a second direction opposite to the first direction so as to cross the wire, and irradiating the laser light onto a second irradiation area that overlaps with at least a portion of the first irradiation area.

[0008] Furthermore, a coating stripping device according to one aspect of the present invention includes: A coating stripping device that strips a coating from a wire rod by laser light while moving the wire rod relatively in a feed direction with respect to a laser irradiation device, The laser irradiation device a laser light source unit that outputs laser light; a scanning unit that scans the wire with a spot area of the laser light; a control unit that controls the scanning unit, the control unit moves the spot area of the laser light in a first direction across the wire and irradiates a first irradiation area with the laser light, moving the spot area in the feed direction; The scanning unit is controlled to move the spot area of the laser light in a second direction opposite to the first direction so as to cross the wire, and to irradiate the laser light onto a second irradiation area that overlaps with at least a portion of the first irradiation area. [Effects of the Invention]

[0009] According to the present invention, it is possible to provide an efficient coating stripping method and coating stripping device. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 1 is a schematic diagram of a coating stripping device for carrying out a coating stripping method according to this embodiment. [Figure 2] FIG. 2 is a block diagram of a laser irradiation device according to the present disclosure. [Figure 3] FIG. 3 is a schematic diagram of a galvano-optical system according to the embodiment. [Figure 4] FIG. 4 is a diagram showing a process of stripping a wire using the stripping device according to the embodiment. [Figure 5] FIG. 5 is a diagram showing a process of stripping a coating from a wire by the coating stripping device according to the embodiment. [Figure 6] FIG. 6 is a diagram showing a process of stripping a coating from a wire by the coating stripping device according to the embodiment. [Figure 7] FIG. 7 is a graph showing the relationship between the time from the end of the first irradiation step to the start of the second irradiation step and the degree of exposure of the central conductor of the wire. [Figure 8] FIG. 8 is a diagram showing the internal structure of a laser irradiation device according to another embodiment. [Figure 9] FIG. 9 is a diagram showing the internal structure of a laser irradiation device according to another embodiment. [Figure 10] FIG. 10 is a diagram showing the internal structure of a laser irradiation device according to another embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that, for the sake of convenience of explanation, the dimensions of each component shown in the drawings may differ from the actual dimensions of each component.

[0012] FIG. 1 is a schematic diagram of a coating stripping apparatus that performs a coating stripping method according to this embodiment. As shown in FIG. 1, the coating stripping apparatus 1 includes laser irradiation devices 10 and 10' and a conveying device 200. The conveying device 200 has a pair of rollers around which a wire 100 having an insulating coating is wound. In this embodiment, the wire 100 is a coated wire having a central conductor and an insulating coating. The insulating coating may be, for example, polyimide. The conveying device 200 can feed the wire 100 from one roller to the other along a feed direction D.

[0013] The laser irradiation devices 10 and 10' irradiate the wire 100 with laser light L, thereby removing the insulating coating of the wire 100. The laser irradiation devices 10 and 10' irradiate the laser light L in a direction intersecting the feeding direction of the wire 100. The laser irradiation devices 10 and 10' are disposed facing each other with the wire 100 in between. The laser irradiation device 10 irradiates a region of half the circumference of the wire 100 with laser light L, and the laser irradiation device 10' irradiates a region of the remaining half circumference of the wire 100 with laser light L. The laser irradiation device 10 and the laser irradiation device 10' shown in FIG. 1 have the same configuration. Therefore, in the following description, "laser irradiation device 10" can be read as "laser irradiation device 10'" as appropriate.

[0014] Next, the laser irradiation device 10 according to the present disclosure will be described in detail with reference to Figures 2 and 3. Figure 2 is a block diagram of the laser irradiation device 10 according to the present disclosure. Figure 3 is a schematic diagram of a galvano optical system 30 according to an embodiment. As shown in Figure 2, the laser irradiation device 10 includes a laser light source 20, a scanning unit 30, a control unit 40, a feed speed acquisition unit 41, a wire width input unit 42, and a peeling length input unit 43.

[0015] The laser light source 20 is an oscillator capable of emitting laser light L (see FIG. 1). In this embodiment, the laser light source 20 is capable of emitting laser light having a wavelength of, for example, 400 to 470 nm. Depending on the material of the object to be removed, for example, an irradiation laser light source 20 capable of irradiating laser light L with a wavelength ranging from 354 nm, which is the wavelength of a UV laser, to 1064 nm, which is the wavelength of an IR laser, may be used. In this embodiment, the scanning unit 30 is a galvano optical system 30. The galvano optical system 30 can displace the laser light L emitted from the laser light source 20 in any two-dimensional direction. As shown in FIG. 3 , the galvano optical system 30 has an X-axis galvano scanner 31, a Y-axis galvano scanner 32, and a mirror 33. The X-axis galvanometer scanner 31 has an X-axis galvanometer mirror 31a and an X-axis galvanometer motor 31b. The X-axis galvanometer mirror 31a is fixed to the output shaft of the X-axis galvanometer motor 31b. By driving the X-axis galvanometer motor 31b, the orientation of the X-axis galvanometer mirror 31a changes. The Y-axis galvanometer scanner 32 also has a Y-axis galvanometer mirror 32a and a Y-axis galvanometer motor 32b. The Y-axis galvanometer mirror 32a is fixed to the output shaft of the Y-axis galvanometer motor 32b. By driving the Y-axis galvanometer motor 32b, the orientation of the Y-axis galvanometer mirror 32a changes. The laser light L emitted from the laser light source 20 is reflected by the X-axis galvanometer mirror 31 a and the Y-axis galvanometer mirror 32 a, and then guided to the wire 100 by the mirror 33 .

[0016] The control unit 40 can control the laser light source 20 and the galvanometer optical system 30. More specifically, the control unit 40 can control the on / off of the emission of the laser light L emitted from the laser light source 20. Furthermore, the control unit 40 controls the X-axis galvanometer motor 31b and the Y-axis galvanometer motor 32b to change the angles of the X-axis galvanometer mirror 31a and the Y-axis galvanometer mirror 32a, thereby changing the irradiation position of the laser light L and the moving speed of the irradiation position.

[0017] The feed speed acquisition unit 41 can acquire the feed speed of the wire rod 100. The feed speed acquisition unit 41 can be configured to acquire the output of a feed speed sensor (not shown) that detects the feed speed of the wire rod 100, or to acquire the rotation speed of the rollers. The wire width input unit 42 allows an operator to arbitrarily input the widthwise length of the wire 100 to be irradiated with the laser light L. The stripping length input unit 43 allows an operator to arbitrarily input the length of the coating to be stripped from the wire 100. The wire width input unit 42 and the stripping length input unit 43 can be configured to acquire signals output from an input device such as a keyboard or touch panel operated by the operator. The feed speed acquisition unit 41, wire width input unit 42, and peeling length input unit 43 are connected to the control unit 40, and the control unit 40 controls the laser light source 20 and the galvano optical system 30 based on the information obtained from the feed speed acquisition unit 41, wire width input unit 42, and peeling length input unit 43.

[0018] Next, the coating stripping method of the coating stripping device 1 according to this embodiment will be described in detail with reference to Figures 4 to 6. Figures 4 to 6 are diagrams showing the process of stripping the coating from the wire 100 by the coating stripping device 1 according to this embodiment.

[0019] The coating stripping device 1 according to this embodiment can perform a first irradiation step, a first feeding step, a second irradiation step, and a second feeding step, and by repeating these steps, strips the coating from the wire 100. That is, the coating stripping device 1 performs the second feeding step and then performs the first irradiation step again. The laser irradiation device 10 irradiates the wire 100 with laser light L within a spot area S from the start of the first irradiation step to the end of the second feeding step. In this embodiment, the spot area S of the laser light L irradiated by the laser irradiation device 10 moves so as to trace an elliptical locus E on the surface of the wire 100. The shape of the locus E can be arbitrarily set by the control unit 40.

[0020] 4 to 6 show the process of stripping the coating of wire 100. Wire 100 has a coated region 101 where the coating has not been removed and a stripped region 102 where the coating has been removed. In the coating stripping method according to this embodiment, laser irradiation device 10 irradiates laser light L onto coated region 101 to strip the coating, thereby exposing the conductor portion of wire 100 to form stripped region 102. In this embodiment, stripped region 102 refers to, for example, a region of wire 100 where the coating removal rate calculated as a mass ratio is 90% or more. Note that the value of the coating removal rate is not uniquely determined but may vary depending on laser irradiation conditions such as the wavelength and intensity of the laser light, the type of coating material, etc.

[0021] The first irradiation step and the first feeding step performed by the coating peeling device will be described with reference to FIGS. In the first irradiation step, the laser irradiation device 10 irradiates the wire 100 with laser light L in a first direction F across the wire 100. The first direction F is the width direction of the wire 100 and is also a direction perpendicular to the feeding direction D. The area irradiated with the laser light L in the first irradiation step is referred to as a first irradiation area 103. When the laser light L is irradiated onto a coating made of a resin such as polyimide, the coating is heated to a high temperature by the laser light, evaporating and removing the coating. As shown in FIG. 5, when the first irradiation step is completed, the first irradiation area 103 is in a state where the coating has been peeled off. The coating removal rate in the first irradiation area 103 shown in FIG. 5 may be less than 90%.

[0022] After the first irradiation step is completed, the laser irradiation device 10 proceeds to a first feeding step (see FIG. 5). In the first feeding step, the laser irradiation device 10 moves the spot area S in the feeding direction D. In this embodiment, the laser irradiation device 10 moves the spot area S in the feeding direction D by moving the spot area S along an elliptical trajectory E. While the laser irradiation device 10 is performing the first feeding step, the conveying device 200 continues to feed the wire 100 in the feeding direction D. Here, the speed of the spot area S in the feeding direction D in the first feeding step is set to be smaller than the feed speed of the wire 100.

[0023] Next, the second irradiation step will be described with reference to Fig. 6. In the second irradiation step, the laser irradiation device 10 irradiates the spot area S with laser light L so as to cross the wire 100 along a second direction F' opposite to the first direction F. The area irradiated with the laser light L in the second irradiation step is referred to as a second irradiation area 104. This second irradiation area 104 overlaps with at least a part of the first irradiation area 103 on the wire 100. In the overlapping area where the first irradiation area 103 and the second irradiation area 104 overlap, the coating removal rate of the wire 100 is 90% or more.

[0024] According to the coating stripping method of the present disclosure, a first irradiation step irradiates a first irradiation region of a wire with laser light, a first feeding step is interposed therebetween, and a second irradiation step irradiates a second irradiation region overlapping at least a portion of the first irradiation region with laser light. In addition, the first feeding step is provided between the first irradiation step and the second irradiation step. According to the coating removal method of the present disclosure, the first irradiation region 103 in the first irradiation step and the second irradiation region 104 in the second irradiation step at least partially overlap. Since the same region can be irradiated with laser light L twice, the coating can be easily and reliably removed, resulting in high coating removal efficiency. Furthermore, since the same light source is used to irradiate the same region with laser light L twice, the coating removal device is less complicated than when two light sources are used for two irradiations.

[0025] Furthermore, the coating stripping method according to the present disclosure can efficiently achieve a high coating removal rate with a single wire feeding operation, and is therefore particularly effective in stripping the insulating coating from, for example, motor terminals used in electric vehicles or wires for welding.

[0026] According to the coating stripping method of the present disclosure, the first irradiation region 103 irradiated with the laser light L in the first irradiation step and the second irradiation region 104 irradiated with the laser light L in the second irradiation step at least partially overlap. If the same region is irradiated with the laser light L twice within a short period of time, there is a concern that the temperature of this region may become high. However, according to the present disclosure, the first feeding step is provided between the first irradiation step and the second irradiation step, which prevents the wire 100 from becoming too hot. This makes it possible to provide a coating removal method that can efficiently remove the coating while maintaining the quality of the wire 100. Considering the cooling rate of the wire 100, it is desirable that the time from the end of the first irradiation step to the start of the second irradiation step (i.e., the time required for the first feeding step) be at least 0.5 ms.

[0027] According to the coating stripping method of the present disclosure, the spot area S traces an elliptical trajectory. That is, the coating stripping method of the present disclosure includes a second feeding step of moving the spot area in the opposite direction to the feeding direction D after the second irradiation step, and the movement amount in the first feeding step is equal to the movement amount in the second feeding step. According to this configuration, since the movement amount in the first feeding step is equal to the movement amount in the second feeding step, the first irradiation area 103 can be set at the same position as seen from the laser irradiation device 10.

[0028] In the present disclosure, the elliptical locus E of the spot area S has a major axis perpendicular to the feed direction D and a minor axis aligned with the feed direction D. That is, in the coating stripping method according to the present disclosure, the amount of movement in the feed direction D in the first irradiation step may be smaller than the amount of movement in the feed direction D in the first feeding step. With this configuration, since the amount of movement in the feed direction D in the first irradiation step is small, it is easy to form the stripped area 102 parallel to the width direction of the wire 100.

[0029] Furthermore, in the coating stripping method according to the present disclosure, the amount of movement in the first direction F in the first irradiation step is preferably greater than the amount of movement in the first direction F in the first feeding step. If the amount of movement in the first direction F in the first feeding step is small, the first feeding step can be completed in a short time, and it is easy to increase the overlapping area between the first irradiation region 103 and the second irradiation region 104. If the amount of movement in the first direction F in the first irradiation step is large, the spot region S is moved in the first direction F at a speed that is sufficiently greater than the feed speed of the wire 100, making it easier to form the stripping region 102 parallel to the width direction of the wire 100.

[0030] In the coating stripping method according to the present disclosure, where n is a natural number and i is a natural number smaller than n, the process from the start of the first irradiation step to the end of the second feeding step may be repeated n times, so that the first irradiation area in the i-th irradiation step and the second irradiation area in the (i-1)th irradiation step at least partially overlap with each other. According to the above configuration, the series of stripping steps from the first irradiation step to the second irradiation step are performed multiple times, so that the coating can be efficiently removed from multiple locations on the wire.

[0031] In the coating stripping method according to the present disclosure, the laser beam may be continuously irradiated from the start of the first irradiation step to the end of the second feeding step. According to the above configuration, the frequency of switching on and off the laser light source of the laser irradiation device can be reduced, and the burden on the laser light source can be reduced.

[0032] Although the coating stripping method according to the present embodiment has been described above, the present disclosure is not limited to the above-described embodiment. For example, the trajectory E of the spot area S of the laser light L irradiated by the laser irradiation device 10 may be a rectangular shape such as a rectangle, or may be a figure-eight shape, etc. Furthermore, it is preferable that the trajectory E of the spot area S has a shape that can be drawn in one stroke so that the spot area S can be returned to the starting position of the first irradiation step after the second feeding step. Furthermore, the trajectory E of the spot area does not have to be a closed figure.

[0033] 1, in the present embodiment, an example has been described in which two laser irradiation devices 10 are provided at specific positions in the feed direction of the wire 100, but the present disclosure is not limited to this. For example, one laser irradiation device 10 may be provided at a specific position in the feed direction of the wire 100, or three or more laser irradiation devices 10 may be provided. Furthermore, laser irradiation devices 10 may be provided at multiple positions in the feed direction of the wire 100. Coating stripping can be performed at multiple locations simultaneously, further improving the efficiency of wire coating removal.

[0034] The laser irradiation device 10 according to the present disclosure may further include other optical systems and the like in addition to the components described in the embodiment.

[0035] It should be noted that in the present disclosure, the configuration of the control unit 40 is not limited to the above-described embodiment. For example, the control unit 40 may control the conveying device 200. In this case, the feed speed acquisition unit 41 may be configured so that an operator can arbitrarily input a feed speed of the wire rod 100, and the control unit 40 controls the conveying device 200 in accordance with the input information. Furthermore, the wire rod width input unit 42 may be configured so that the width of the wire rod 100 can be automatically detected by a sensor or the like.

[0036] In the above-described embodiment, the laser irradiation device is fixed and the wire rod 100 is transported. However, the present disclosure is not limited to this. The wire rod 100 may be placed on a work table, the laser irradiation device may be mounted on a stage that is movable relative to the work table, and the laser irradiation device 10 may be movable in the length direction of the wire rod 100 relative to the work table (wire rod 100). In this case, the feed speed acquisition unit 41 may be configured to acquire the feed speed of the stage in the length direction of the wire rod 100.

[0037] In order to improve the efficiency of stripping the coating from the wire, it is possible to shorten the time required for the coating stripping step. For example, the time required for the coating stripping step can be shortened by shortening the time interval between the end of the first irradiation step and the start of the second irradiation step. However, if the interval between the first and second irradiation steps is too short, the temperature of the coating may become too high, causing the coating to burn. Wires with burnt coatings have a low coating removal rate.

[0038] In order to solve the above problem, a coating stripping method according to one aspect of the present disclosure includes: A coating stripping method in which a coating of a wire rod 100 is stripped off by laser light L while the wire rod 100 is moved in a feed direction D relative to a laser irradiation device 10, a first irradiation step of irradiating a first irradiation region 103 on the wire 100 with laser light L; a second irradiation step of irradiating a second irradiation region 104 overlapping at least a part of the first irradiation region 103 with the laser light L; The time interval between the end of the first irradiation step and the start of the second irradiation step may be at least 0.5 ms or more.

[0039] According to the above configuration, the time interval between the end of the first irradiation step and the start of the second irradiation step is at least 0.5 ms, so that a coating stripping method can be provided that can efficiently strip the coating while maintaining a high degree of exposure of the central conductor of the wire after the coating is stripped.

[0040] The inventors conducted a coating removal experiment to clarify the relationship between the time interval between irradiation steps and the degree of exposure of the center conductor. The coating removal experiment was conducted by setting multiple times from the end of the first irradiation step to the start of the second irradiation step and measuring the coating removal rate of the wire 100 at each time. Figure 7 is a graph showing the relationship between the time from the end of the first irradiation step to the start of the second irradiation step and the coating removal rate of the wire 100.

[0041] As shown in FIG. 7, when the time interval between the end of the first irradiation step and the start of the second irradiation step is 0.5 ms or more, the coating removal rate of the wire after coating stripping can be made higher than 80%.

[0042] In the above configuration, the laser irradiation device 10 can generate spot areas S at at least two positions along the feed direction D on the wire 100, and the separation distance between each spot area S in the feed direction may be equal to or greater than the feed speed × 0.5 [ms]. Here, assume that the separation distance L in the feed direction between the upstream spot area S1 and the downstream spot area S2 is L [mm], and the feed speed of the wire 100 is X [mm / ms]. Then, the time required for this portion to be fed the separation distance L is calculated as t = L / X. If this time t is 0.5 [ms] or more, the coating removal rate will be higher than 80%. In other words, from the relational expression L / X≧0.5, it is possible to derive the relationship that the separation distance L in the feed direction D between each of the spot areas S1, S2 is preferably equal to or greater than the feed speed X × 0.5 [ms]. According to this configuration, the coating is stripped simultaneously from a plurality of regions on the wire 100, and the time interval between the first irradiation step performed in the upstream spot region S1 and the second irradiation step performed in the downstream spot region S2 is 0.5 ms or more. Therefore, it is possible to provide a coating stripping method that can efficiently and reliably strip the coating.

[0043] In addition, as another aspect of the coating stripping device 1 according to the present disclosure, A coating stripping device that strips a coating of a wire rod 100 by laser light L while moving the wire rod 100 in a feed direction relative to a laser irradiation device 10, The laser irradiation device 10 includes: a laser light source unit that outputs laser light L; a scanning unit 30 that scans a spot area S of laser light L over the wire 100; a control unit (40) that controls the scanning unit (30), The control unit 40 moves the spot area S of the laser light L to irradiate the first irradiation area 103 with the laser light, and then irradiates the second irradiation area 104 with the laser light so as to overlap at least a part of the first irradiation area 103; The scanning unit 30 may be controlled so that the time interval between the end of irradiation of the first irradiation region 103 with the laser light L and the start of irradiation of the second irradiation region 104 with the laser light is at least 0.5 ms or more.

[0044] According to the above configuration, it is possible to provide a coating stripping method that can efficiently strip the coating while maintaining a high degree of exposure of the central conductor of the wire after the coating is stripped.

[0045] Furthermore, in the above configuration, the spot areas S may be generated at at least two positions along the feed direction D on the wire 100, and the separation distance between the spot areas S in the feed direction D may be equal to or greater than the feed speed × 0.5 [ms]. According to the above configuration, the coating can be stripped simultaneously from a plurality of areas on the wire 100, and therefore, a coating stripping device capable of efficiently stripping the coating can be provided.

[0046] In the above-described embodiment, the laser irradiation device may have a configuration including a multifocal lens, for example, in order to generate at least two spot regions S on the wire 100. FIG. 8 is a diagram showing the internal structure of a laser irradiation device 11 according to another embodiment of the present disclosure. In the example shown in FIG. 8, the laser irradiation device 11 includes a light source 300, a collimating lens 301 capable of collimating the laser light L emitted from the light source 300, and a multifocal lens 302. With this configuration, the laser light L can be focused at multiple locations on the wire 100 by the multifocal lens 302. This allows multiple spot regions S to be generated without increasing the number of laser light sources, thereby preventing the laser irradiation device 10 from becoming large.

[0047] In the above-described embodiment, the laser irradiation device may have, for example, a diffractive optical element to generate at least two spot regions S on the wire 100. FIG. 9 is a diagram showing the internal structure of a laser irradiation device 12 according to another embodiment of the present disclosure. In the example shown in FIG. 9, the laser irradiation device 12 has a light source 400, a collimating lens 401 capable of collimating the laser light L emitted from the light source 400, and a diffractive optical element 402. This configuration makes it possible to split a single laser light beam and generate multiple spot regions S on the wire 100. This makes it possible to generate multiple spot regions S without increasing the number of laser light sources, thereby preventing the laser irradiation device 10 from becoming large.

[0048] In the above-described embodiment, in order to generate at least two spot regions S on the wire 100, the laser irradiation device 10 may be configured to include, as a laser light source unit, a first laser light source capable of generating a first spot region and a second laser light source capable of generating a second spot region. FIG. 10 is a diagram showing the internal structure of a laser irradiation device 13 according to another embodiment of the present disclosure. In the example shown in FIG. 10, the laser irradiation device 13 includes a plurality of light sources 500 and a condenser lens 501 corresponding to each light source 500. With this configuration, the first spot region and the second spot region can be generated by separate laser light sources, thereby increasing the laser beam output per spot region S compared to when a single laser light source is used. This provides a coating stripping device capable of efficiently stripping a coating. [Explanation of symbols]

[0049] 1 Coating stripping device 10, 10', 11, 12, 13 Laser irradiation device 20 Laser light source 30 Galvano Optical System 31 X-axis galvanometer scanner 31a X-axis galvanometer mirror 31b X-axis galvanometer motor 32 Y-axis galvanometer scanner 32a Y-axis galvanometer mirror 32b Y-axis galvanometer motor 33 Mirror 40 Control Unit 41 Feed rate acquisition unit 42 Wire rod width input section 43 Input section 100 wire rod 101 Covered Area 102 Peeling area 103 First irradiation area 104 Second irradiation area 200 Conveyor 300, 400, 500 light sources 301, 401 Collimating Lens 302 Multifocal Lenses 402 Diffractive Optical Element 501 Condenser Lens D Feed direction E locus F first direction F' Second direction S Spot area

Claims

1. A coating stripping method for stripping a coating of a wire rod by using a laser beam while moving the wire rod in a feed direction relative to a laser irradiation device, a first irradiation step of irradiating a first irradiation region on the wire with the laser light by moving a spot region of the laser light in a first direction across the wire; a first feeding step of moving the spot area in the feeding direction of the wire rod after the first irradiation step; a second irradiation step of moving the spot area of the laser light in a second direction opposite to the first direction so as to cross the wire, and irradiating the laser light onto a second irradiation area that overlaps with at least a part of the first irradiation area; A coating stripping method comprising the steps of:

2. a second feeding step of moving the spot area in a direction opposite to the feeding direction after the second irradiation step, The coating stripping method according to claim 1 , wherein the movement amount in the first feeding step is equal to the movement amount in the second feeding step.

3. The coating stripping method according to claim 1 , wherein a movement amount of the spot area in the feed direction in the first irradiating step is smaller than a movement amount in the feed direction in the first feeding step.

4. The coating stripping method according to claim 1 , wherein a movement amount of the spot area in the first direction in the first irradiation step is greater than a movement amount in the first direction in the first feeding step.

5. When n is a natural number and i is a natural number smaller than n, The process from the start of the first irradiation step to the end of the second feeding step is repeated n times, The coating stripping method according to claim 2, wherein the first irradiation region of the i-th time and the second irradiation region of the (i-1)th time at least partially overlap with each other.

6. The coating stripping method according to claim 2 , wherein the laser light is continuously emitted from the start of the first irradiation step to the end of the second feeding step.

7. The coating stripping method according to claim 2 , wherein the spot area of the laser light traces an elliptical locus from the start of the first irradiation step to the end of the second feeding step.

8. The coating stripping method according to claim 1 , wherein the time interval between the end of the first irradiation step and the start of the second irradiation step is at least 0.5 ms or more.

9. A coating stripping device that strips a coating from a wire rod by laser light while moving the wire rod relatively in a feed direction with respect to a laser irradiation device, The laser irradiation device a laser light source unit that outputs laser light; a scanning unit that scans the wire with a spot area of the laser light; a control unit that controls the scanning unit, the control unit moves the spot area of the laser light in a first direction across the wire and irradiates a first irradiation area with the laser light, moving the spot area in the feed direction; A coating stripping device that controls the scanning unit to move the spot area of the laser light in a second direction opposite to the first direction so as to cross the wire, and irradiate the laser light onto a second irradiation area that overlaps with at least a portion of the first irradiation area.

10. The coating stripping device according to claim 9 , wherein the control unit controls the scanning unit based on a relative speed between the coating stripping device and the wire in a feeding direction.

11. The coating stripping device according to claim 9 or 10, further comprising a conveying device that conveys the wire in the feed direction.

12. A coating stripping method for stripping a coating of a wire rod by using a laser beam while moving the wire rod in a feed direction relative to a laser irradiation device, a first irradiation step of irradiating a first irradiation region on the wire with laser light; a second irradiation step of irradiating a second irradiation region overlapping with at least a portion of the first irradiation region with laser light, A coating stripping method, wherein the time interval from the end of the first irradiation step to the start of the second irradiation step is at least 0.5 ms.

13. generating at least two laser beam spot regions on the wire at positions along the feeding direction; The coating stripping method according to claim 12, wherein the distance between the spot areas in the feed direction is equal to or greater than the feed speed × 0.5 ms.

14. A coating stripping device that strips a coating from a wire rod by laser light while moving the wire rod relatively in a feed direction with respect to a laser irradiation device, The laser irradiation device a laser light source unit that outputs laser light; a scanning unit that scans a spot area of a laser beam over the wire; a control unit that controls the scanning unit, the control unit moves the spot area of the laser light to irradiate a first irradiation area with the laser light, and then irradiates a second irradiation area with the laser light so as to overlap at least a part of the first irradiation area; a coating stripping device that controls the scanning unit so that a time interval between the end of irradiation of the first irradiation region with laser light and the start of irradiation of the second irradiation region with laser light is at least 0.5 ms or more;

15. The spot areas can be generated at at least two positions on the wire along the feeding direction, 15. The coating stripping device according to claim 14, wherein the distance between the spot areas in the feed direction is equal to or greater than the feed speed × 0.5 ms.

16. The coating stripping device according to claim 15 , wherein the laser irradiation device has a multifocal lens.

17. The coating stripping apparatus according to claim 15 , wherein the laser irradiation device includes a diffractive optical element.

18. The laser light source unit a first laser light source capable of generating a first spot area; a second laser light source capable of generating a second spot area; The coating stripping device according to claim 15.

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