Light emitting display apparatus

Abstract

To provide a light emitting display apparatus in which at least one organic layer covering a metal line provided in a bending area is over-etched.SOLUTION: A light emitting display apparatus includes: a flexible substrate divided into a display area DA and a non-display area NDA surrounding the display area; a pixel driving circuit layer provided in the display area and including a pixel driving circuit; a first planarization layer covering the pixel driving circuit layer in the display area; a second planarization layer; a first non-display planarization layer provided in the non-display area; a metal line; a second non-display planarization layer; and a non-display bank, wherein the non-display area includes a bending area to be bent, a connection non-display area provided on one side of the bending area and connected to the display area, and a pad non-display area provided on the other side of the bending area, and a thickness of the non-display bank provided in the bending area is smaller than a thickness of the non-display bank provided in the connection non-display area and the pad non-display area.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present specification relates to a light-emitting display device. [Background technology]

[0002] Light emitting display devices are installed in electronic products such as televisions, monitors, notebook computers, smartphones, tablet computers, electronic pads, wearable devices, watch phones, portable information devices, navigation systems, or vehicle control display devices to display images.

[0003] A light-emitting display panel used in a light-emitting display device may be manufactured using a flexible substrate. Here, cracks may occur in metal lines provided in bending regions of the flexible substrate, which may result in degradation of light-emitting quality.

[0004] The content of the background art described above is technical information that the inventors of this specification possessed in order to derive the examples of this specification, or that they acquired in the process of deriving the examples of this specification, and is not necessarily publicly known technology that was made public to the general public prior to the filing of this specification. Summary of the Invention [Problem to be solved by the invention]

[0005] The present disclosure provides a light emitting display device in which at least one organic layer covering a metal line in a bending region is over-etched.

[0006] The problems to be solved in the various embodiments of this specification are not limited to those described above, and other problems not mentioned will be clearly understood by those having ordinary skill in the art to which the technical ideas of this specification belong from the following description. [Means for solving the problem]

[0007] An organic EL display device according to an embodiment of the present specification includes a flexible substrate divided into a display area and a non-display area surrounding the display area, a pixel driving circuit layer provided in the display area and including a pixel driving circuit, a first planar layer covering the pixel driving circuit layer in the display area, a second planar layer covering the first planar layer, a first non-display planar layer provided in the non-display area, metal lines provided on the first non-display planar layer, a second non-display planar layer covering the first non-display planar layer and the metal lines, and a non-display bank provided on the second non-display planar layer, wherein the non-display area includes a bending area that is bent, a connecting non-display area provided on one side of the bending area and connected to the display area, and a pad non-display area provided on the other side of the bending area, and a thickness of the non-display bank provided in the bending area is smaller than a thickness of the non-display bank provided in the connecting non-display area and the pad non-display area.

[0008] Specific details of various examples of the present specification other than the above-mentioned means for solving the problems are included in the following description and drawings.

[0009] In an organic light emitting display device according to an embodiment of the present specification, at least one of the insulating films provided in the bending region is over-etched, so that when the insulating film is formed, TMAH (Tetramethyl Ammonium hydroxide) or TMA+ remaining on the insulating film can be removed by over-etching.

[0010] TMAH or TMA+ remaining on the insulating film can cause cracks in the metal lines provided in the bending region.

[0011] That is, according to an embodiment of the light emitting display device of the present specification, at least one of the insulating films covering the metal lines provided in the bending region can be over-etched, thereby removing TMAH and TMA+ that cause cracks in the metal lines.

[0012] Therefore, the light emitting display device according to one embodiment of the present specification can prevent cracks from occurring in the metal lines provided in the light emitting bending region, or can reduce the amount of cracks that occur in the metal lines.

[0013] Therefore, the light emission quality can be improved.

[0014] The accompanying drawings are provided to facilitate understanding of the embodiments of the present specification and, together with the detailed description, provide examples. However, the technical features of the embodiments are not limited to the specific drawings, and the features disclosed in each drawing can be combined with each other to form a new embodiment. [Brief explanation of the drawings]

[0015] [Figure 1] 1 is an exemplary diagram illustrating a configuration of a light emitting display device according to an embodiment of the present specification; [Figure 2] 1 is an exemplary view showing a pixel structure applied to a light emitting display device according to an embodiment of the present disclosure; [Figure 3] 10 is an exemplary diagram illustrating a structure of a control driver applied to another light emitting display device according to an embodiment of the present specification; [Figure 4] 1 is an exemplary diagram illustrating a structure of a gate driver applied to a light emitting display device according to an embodiment of the present disclosure; [Figure 5] 1 is an exemplary diagram illustrating a structure of a data driver applied to a light emitting display device according to an embodiment of the present disclosure; [Figure 6] 1 is an exemplary view showing a cross section of a light emitting display panel applied to a light emitting display device according to an embodiment of the present disclosure; [Figure 7] 7 is an exemplary view showing a state in which a bending region of the light-emitting display panel shown in FIG. 6 is bent. FIG. [Figure 8] 1 is another exemplary cross-sectional view of a light emitting display panel that is applied to a light emitting display device according to an embodiment of the present disclosure; [Figure 9]1 is an exemplary view showing a bending region applied to a light emitting display device according to an embodiment of the present disclosure; [Figure 10] 10 is another exemplary view showing the bending region shown in FIG. 9. FIG. [Figure 11] 10 is another exemplary view showing a bending region applied to a light emitting display device according to an embodiment of the present disclosure; FIG. [Figure 12] 10 is a diagram illustrating yet another example of a bending region applied to a light emitting display device according to an embodiment of the present disclosure; DETAILED DESCRIPTION OF THE INVENTION

[0016] The advantages and features of the present specification, as well as methods for achieving them, will become apparent from the following detailed description of various examples with reference to the accompanying drawings. However, the present specification is not limited to the examples disclosed below, and may be configured in various different forms. The examples of the present specification are provided to complete the disclosure of the present specification and to fully convey the scope of the technical idea of the present specification to those skilled in the art to which the technical idea of the present specification pertains.

[0017] The shapes, sizes, ratios, angles, numbers, etc. disclosed in the drawings for illustrating the embodiments of the present specification are merely examples, and the present specification is not limited to the illustrated matters. The same reference numerals refer to the same components throughout the specification. Furthermore, in the description of the present specification, if it is determined that a detailed description of related known technology may unnecessarily obscure the gist of the specification, the detailed description will be omitted.

[0018] When using terms such as "comprises," "has," and "consists" as used herein, other parts may be added unless "only" is used. When an element is expressed in the singular, it also includes the plural unless expressly stated otherwise.

[0019] In interpreting elements, even if there is no separate explicit description of the error range, it is interpreted as including the error range.

[0020] When describing the positional relationship between two parts, for example, "on top of," "below," or "next to," one or more other parts may be located between the two parts, unless "directly" or "immediately" is used.

[0021] When describing a temporal relationship, for example, when describing a temporal precedence relationship such as "after", "following", "next to", or "before", it is possible to include cases where things are not consecutive, as long as "immediately" or "directly" is not used.

[0022] Although terms such as "first" and "second" are used to describe various components, these components are not limited to these terms. These terms are used only to distinguish one component from another. Therefore, a first component referred to below may also be a second component within the technical concept of this specification.

[0023] In describing components in this specification, terms such as first, second, A, B, (a), or (b) may be used. Such terms are merely used to distinguish the component from other components, and do not limit the nature, order, sequence, or number of the components. When a component is described as being "coupled," "coupled," "connected," or "attached" to another component, it should be understood that the component may be directly coupled, coupled, connected, or attached to the other component, but unless otherwise explicitly stated, it should also be understood that other components may be "intervened" between components that are indirectly coupled, coupled, connected, or attached.

[0024] "At least one" should be understood to include all combinations of one or more of the associated components. For example, "at least one of the first, second, and third components" means not only the first, second, or third component, but also all combinations of two or more of the first, second, and third components.

[0025] The features of the various embodiments of this specification may be partially or fully combined or combined with each other, and various technical interlocking and driving mechanisms may be possible, and each embodiment may be implemented independently of the others, or may be implemented together in an interdependent manner.

[0026] Hereinafter, embodiments of the present specification will be described in detail with reference to the accompanying drawings. The scales of the components shown in the drawings are different from the actual scales for the convenience of explanation, and are not limited to the scales shown in the drawings.

[0027] FIG. 1 is an exemplary diagram showing the configuration of an emissive display device according to one embodiment of the present specification, FIG. 2 is an exemplary diagram showing the structure of a pixel applied to an emissive display device according to one embodiment of the present specification, FIG. 3 is an exemplary diagram showing the structure of a control driver applied to an emissive display device other than one embodiment of the present specification, FIG. 4 is an exemplary diagram showing the structure of a gate driver applied to an emissive display device according to one embodiment of the present specification, and FIG. 5 is an exemplary diagram showing the structure of a data driver applied to an emissive display device according to one embodiment of the present specification.

[0028] The light emitting display device according to an embodiment of the present disclosure may be applied to various electronic devices, such as televisions and monitors.

[0029] As shown in FIGS. 1 and 2 , a light emitting display device according to an embodiment of the present specification may include a light emitting display panel 100 including a display area DA where an image is output and a non-display area NDA provided around the display area DA, a gate driver 200 that supplies gate signals GS to gate lines GL1 to GLg provided in the display area DA of the light emitting display panel 100, a data driver 300 that supplies data voltages Vdata to data lines DL1 to DLd provided in the light emitting display panel 100, a touch driver 600 that supplies touch drive signals to touch electrodes provided in the light emitting display panel 100, a control driver 400 that controls driving of the gate driver 200, the data driver 300, and the touch driver 600, and a power supply unit 500 that supplies power to the control driver 400, the gate driver 200, the data driver 300, the touch driver 600, and the light emitting display panel 100.

[0030] First, the light emitting display panel 100 includes a light emitting element unit 100a for displaying an image and a touch electrode unit 100b having a touch electrode for touch sensing.

[0031] The light emitting element unit 100a may include a display area DA and a non-display area NDA. The display area DA may include gate lines GL1 to GLg, data lines DL1 to DLd, and pixels P. Thus, an image may be output in the display area DA. g and d are natural numbers. The non-display area NDA may surround the outer periphery of the display area DA.

[0032] As shown in FIG. 2, the pixel P provided in the light-emitting element unit 100a may include a pixel driving circuit PDC including a switching transistor Tsw1, a storage capacitor Cst, a driving transistor Tdr, and a sensing transistor Tsw2, and a light-emitting element ED connected to the pixel driving circuit PDC.

[0033] A first terminal of the driving transistor Tdr may be connected to a first voltage supply line PLA to which a first voltage EVDD is supplied, and a second terminal of the driving transistor Tdr may be connected to the light emitting element ED.

[0034] A first terminal of the switching transistor Tsw1 may be connected to the data line DL, a second terminal of the switching transistor Tsw1 may be connected to the gate of the driving transistor Tdr, and a gate of the switching transistor Tsw1 may be connected to the gate line GL.

[0035] The data driver 300 may supply a data voltage Vdata through a data line DL. The gate driver 200 may supply a gate signal GS through a gate line GL. The gate signal GS may include a gate pulse GP for turning on the switching transistor Tsw1 and a gate-off signal for turning off the switching transistor Tsw1.

[0036] A sensing transistor Tsw2 may be provided to measure the threshold voltage or charge (e.g., electron) mobility of the driving transistor Tdr or to supply a reference voltage Vref to the pixel driving circuit PDC. A first terminal of the sensing transistor Tsw2 is connected to the second terminal of the driving transistor Tdr and the light emitting element ED, a second terminal of the sensing transistor Tsw2 is connected to a sensing line SL to which the reference voltage Vref is supplied, and a gate of the sensing transistor Tsw2 is connected to a sensing control line SCL to which a sensing control signal SCS is supplied.

[0037] The sensing lines SL are connected to the data driver 300 and may be connected to the power supply unit 500 through the data driver 300. That is, the reference voltage Vref supplied from the power supply unit 500 is supplied to the pixels P through the sensing lines SL, and the sensing signals transmitted from the pixels P may be converted into digital sensing signals by the data driver 300, and the digital sensing signals may be transmitted to the control driver 400.

[0038] The light emitting element ED may include a first electrode receiving a first voltage EVDD through the driving transistor Tdr, a second electrode connected to a second voltage supply line PLB to which a second voltage EVSS is supplied, and a light emitting layer disposed between the first electrode and the second electrode, where the first electrode may be an anode and the second electrode may be a cathode.

[0039] The structure of the pixel P applied in this specification is not limited to the structure shown in Fig. 2. Therefore, the structure of the pixel P can be changed into various forms.

[0040] The touch electrode unit 100b performs a function of sensing a touch, and for this purpose, may include a touch electrode.

[0041] For example, if the touch electrode unit 100b uses a mutual type, the touch electrode may include at least one touch driving electrode and at least one touch receiving electrode. Here, the touch driver 600 may supply a touch driving signal to the touch driving electrode and may determine whether or not a touch has occurred using a touch sensing signal received from the touch receiving electrode according to the touch driving signal.

[0042] In addition, when the touch electrode unit 100b senses a touch by a stylus, the touch driver 600 may supply an uplink signal to the touch driving electrode and may determine whether or not a touch has occurred using a downlink signal received from the stylus via the touch receiving electrode. Here, the uplink signal may be a touch driving signal.

[0043] In addition, when the touch electrode unit 100b uses a self-cap method, the touch electrode unit 100b may include at least one touch electrode. Here, the touch driver 600 may supply a touch driving signal to the touch electrode and may determine whether or not a touch has occurred using a touch sensing signal received from the touch electrode.

[0044] For convenience of explanation, a light emitting display device including a touch electrode unit 100b using a mutual method will be described as an example of a light emitting display device according to an embodiment of the present specification.

[0045] Here, as shown in FIG. 1, the touch driving electrodes provided in the touch electrode unit 100b may be connected to the touch driver 600 via touch driving electrode lines TXL, and the touch receiving electrodes provided in the touch electrode unit 100b may be connected to the touch driver 600 via touch receiving electrode lines RXL.

[0046] Next, the control driver 400 can realign the input image data Ri, Gi, Bi transmitted from the external system 700 using the timing synchronization signal TSS transmitted from the external system 700, and generate control signals GCS, DCS to be supplied to the data driver 300 and the gate driver 200.

[0047] To this end, as shown in FIG. 3, the control driver 400 may include a data aligner 430 for realigning input image data Ri, Gi, Bi to generate image data Data; a control signal generator 420 for generating gate control signals GCS and data control signals DCS using a timing synchronization signal TSS; an input unit 410 for transmitting the timing synchronization signal TSS received from an external system 700 to the control signal generator 420 and transmitting the input image data Ri, Gi, Bi received from the external system 700 to the data aligner 430; and an output unit 440 for supplying the image data Data generated by the data aligner 430 and the data control signal DCS generated by the control signal generator 420 to the data driver 300 and for supplying the gate control signal GCS generated by the control signal generator 420 to the gate driver 200.

[0048] The control signal generator 420 can also generate a power control signal to be supplied to the power supply unit 500 .

[0049] The control signal generator 420 can also generate the touch control signal TCS that is supplied to the touch driver 600.

[0050] The control driver 400 may further include a storage unit 450 for storing various information. The storage unit 450 may be included in the control driver 400 as shown in FIG. 3, or may be provided independently from the control driver 400.

[0051] The external system 700 can then function to drive the control driver 400 and the electronic device.

[0052] For example, if the electronic device is a television (TV), the external system 700 can receive various types of audio information, image information, and text information via a communication network and transmit the received image information to the control driver 400. For example, the external system can convert the image information into input image data Ri, Gi, Bi and transmit the input image data Ri, Gi, Bi to the control driver 400.

[0053] Next, the power supply unit 500 can generate various power supplies and supply the generated power supplies to the control driver 400 , the gate driver 200 , the data driver 300 and the touch driver 600 .

[0054] Next, the gate driver 200 can be directly built into the non-display area NDA in a gate-in-panel (GIP) manner, or can be provided in the display area DA having the light-emitting element ED, or can be provided on a chip-on-film attached to the non-display area NDA.

[0055] The gate driver 200 can supply gate pulses GP1 to GPg to the gate lines GL1 to GLg.

[0056] When a gate pulse GP generated by the gate driver 200 is supplied to the gate of a switching transistor Tsw1 provided in the pixel P, the switching transistor Tsw1 can be turned on. When the switching transistor Tsw1 is turned on, the data voltage Vdata supplied via the data line DL can be supplied to the pixel P.

[0057] When a gate-off signal generated by the gate driver 200 is supplied to the switching transistor Tsw1, the switching transistor Tsw1 can be turned off. When the switching transistor Tsw1 is turned off, the data voltage Vdata can no longer be supplied to the pixel P.

[0058] The gate signal GS supplied to the gate line GL may include a gate pulse GP and a gate-off signal.

[0059] To supply gate pulses GP1 to GPg to the gate lines GL1 to GLg, the gate driver 200 may include stages ST1 to STg connected to the gate lines GL1 to GLg, as shown in FIG.

[0060] Each of the stages ST1 to STg can be connected to one gate line GL, but can also be connected to at least two gate lines GL.

[0061] To generate the gate pulses GP1 to GPg, the gate start signal VST and at least one gate clock GCLK generated by the control signal generator 420 can be transmitted to the gate driver 200. That is, the gate start signal VST and at least one gate clock GCLK can be included in the gate control signal GCS.

[0062] Any one of the stages ST1 to STg is driven by a gate start signal VST and can output a gate pulse GP to a gate line GL. The gate pulse GP can be generated by a gate clock GCLK.

[0063] At least one of the signals output from the stage ST from which the gate pulse GP is output can be supplied to another stage ST to drive the other stage ST, and therefore the gate pulse GP can be output from the other stage ST as well.

[0064] That is, the stages ST are driven sequentially, and gate pulses GP can be supplied sequentially to the gate lines GL.

[0065] Next, the data driver 300 can supply a data voltage Vdata to the data lines DL1 to DLd.

[0066] To this end, as shown in FIG. 5, the data driver 300 may include a shift register unit 310 that outputs a sampling signal, a latch unit 320 that latches image data Data received from the control driver 400, a digital-to-analog converter 330 that converts the image data Data transmitted from the latch unit 320 into a data voltage Vdata and outputs the data voltage Vdata, and an output buffer 340 that outputs the data voltage Vdata transmitted from the digital-to-analog converter 330 to a data line DL in response to a source output enable signal SOE.

[0067] The shift register unit 310 may output a sampling signal using a data control signal DCS received from the control signal generator 420. For example, the data control signal DCS transmitted to the shift register unit 310 may include a source start pulse SSP and a source shift clock signal SSC.

[0068] The latch unit 320 can latch the image data (Data) sequentially received from the control driver 400, and then simultaneously output the image data (Data) to the digital-to-analog converter (DAC) 330 according to a sampling signal.

[0069] The digital-to-analog converter 330 converts the image data Data transmitted from the latch unit 320 into a data voltage Vdata and outputs the data voltage Vdata.

[0070] The output buffer 340 can simultaneously output the data voltages Vdata transmitted from the digital-to-analog converter 330 to the data lines DL1 to DLd of the display panel in response to the source output enable signal SOE transmitted from the control signal generator 420.

[0071] To this end, the output buffer 340 may include a buffer 341 that stores the data voltage Vdata transmitted from the digital-to-analog converter 330, and a switch 342 that outputs the data voltage Vdata stored in the buffer 341 to the data line DL in response to a source output enable signal SOE.

[0072] That is, when the switch 342 is turned on by the source output enable signal SOE simultaneously supplied to the switch 342, the data voltage Vdata stored in the buffer 341 can be supplied to the data lines DL1 to DLd through the switch 342.

[0073] The data voltage Vdata supplied to the data lines DL1 to DLd can be supplied to the pixels P connected to the gate line GL to which the gate pulse GP is supplied.

[0074] Finally, the touch driver 600 can supply a touch driving signal to the touch electrode unit 100b and can determine whether or not a touch has occurred using a touch sensing signal received from the touch electrode unit 100b.

[0075] Fig. 6 is an exemplary view showing a cross section of a light-emitting display panel applied to a light-emitting display device according to an embodiment of the present specification, Fig. 7 is an exemplary view showing a state in which a bending region of the light-emitting display panel shown in Fig. 6 is bent, and Fig. 8 is another exemplary view showing a cross section of a light-emitting display panel applied to a light-emitting display device according to an embodiment of the present specification. In particular, Figs. 6 to 8 show a non-display area NDA and a display area DA adjacent to the non-display area NDA of the light-emitting display panel. In the following description, content that is the same as or similar to the content described with reference to Figs. 1 to 5 will be omitted or will be briefly described.

[0076] 6 to 8, a light emitting display panel 100 applied to an light emitting display device according to an embodiment of the present specification includes a flexible substrate 101, a pixel driving circuit layer PDCL, a first flat layer 106a, a second flat layer 106b, a light emitting element ED, a sealing layer 107, a touch electrode unit 100b, a first non-display flat layer 106c, metal lines ML, a second non-display flat layer 106d, and a non-display bank NBK. In FIGS. 6 to 8, the portion excluding the touch electrode unit 100b is included in the light emitting element unit 100a shown in FIG.

[0077] Here, the pixel driving circuit layer PDCL, the first planar layer 106a, the second planar layer 106b, the light emitting element ED, the encapsulation layer 107, and the touch electrode unit 100b are provided in the display area DA where an image is displayed, and the first non-display planar layer 106c, the metal line ML, the second non-display planar layer 106d, and the non-display bank NBK are provided in the non-display area NDA.

[0078] First, as shown in FIG. 7, the flexible substrate 101 can be manufactured using various types of bendable materials, and in particular, can be manufactured using various types of materials that are applied to currently used flexible panels.

[0079] For example, the flexible substrate 101 can be formed of any one of various types of plastic substrates, or can be formed of a glass substrate.

[0080] For example, the flexible substrate 101 can be formed of an organic film such as polyimide.

[0081] As shown in FIGS. 1 and 6, the flexible substrate 101 can include a display area DA where an image is displayed, and a non-display area NDA surrounding the display area.

[0082] The non-display area NDA may include a bending area BA that is bent, a connecting non-display area CNDA that is provided on one side of the bending area BA and is connected to the display area DA, and a pad non-display area PNDA that is provided on the other side of the bending area BA.

[0083] The bending area BA means the area to be bent as shown in FIG.

[0084] The connected non-display area CNDA is an area provided between the bending area BA and the display area DA.

[0085] The pad non-display area PNDA is an area provided on the outer periphery of the bending area BA, and is provided between the pad non-display area PNDA and the connection non-display area CNDA.

[0086] The bending area BA is connected to the connecting non-display area CNDA and can be bent together with the pad non-display area PNDA toward the bottom surface BS of the substrate 101 as shown in FIG.

[0087] The pad non-display area PNDA may include pads PAD connected to at least one of the gate driver 200, the data driver 300, the control driver 400, the power supply unit 500, and the touch driver 600.

[0088] Therefore, at least one of the gate driver 200, the data driver 300, the control driver 400, the power supply unit 500, and the touch driver 600 can be connected to the pad non-display area PNDA arranged adjacent to the bottom surface BS of the flexible substrate 101 by the bending area BA.

[0089] For example, if the non-display area NDA includes a first non-display area NDA1, a second non-display area NDA2, a third non-display area NDA3, and a fourth non-display area NDA4 as shown in FIG. 1, the bending area BA may be provided in at least one of the first to fourth non-display areas NDA1 to NDA4.

[0090] The non-display area NDA may have only the connected non-display area CNDA in an area where the bending area BA is not provided.

[0091] Here, the connected non-display area CNDA may be provided with a gate driver 200.

[0092] Next, the display area DA of the flexible substrate 101 may be provided with a pixel driving circuit layer PDCL including a pixel driving circuit PDC.

[0093] The pixel driving circuit layer PDCL may include the transistors Tsw1, Tsw2, Tdr and the capacitor Cst described with reference to FIG.

[0094] That is, the flexible substrate 101 can include the transistors Tsw1, Tsw2, Tdr and the capacitor Cst described with reference to FIG.

[0095] 6 shows a light-emitting display panel 100 including only the switching transistor Tsw1 in the pixel driving circuit layer PDCL. However, the pixel driving circuit layer PDCL may further include various transistors and capacitors in addition to the switching transistor Tsw1.

[0096] The pixel driving circuit layer PDCL may include at least one electrode layer and at least one insulating layer.

[0097] For example, if the switching transistor Tsw1 includes a first electrode E1, a second electrode E2, an active ACT, a gate insulating layer 103, and a gate Gate as shown in FIG. 6, the pixel driving circuit layer PDCL may include two electrode layers and three insulating layers.

[0098] For example, the two electrode layers may include a first electrode layer having a first electrode E1 and a second electrode E2, and a second electrode layer having a gate Gate.

[0099] In addition, the three insulating layers may include a buffer 102 , a gate insulating layer 103 , and a gate protection layer 104 .

[0100] The flexible substrate 101 may include a connecting line CL.

[0101] The connection line CL may be connected to any one of the transistors and lines provided in the pixel driving circuit layer PDCL, and may be connected to any one of the gate driver 200, the data driver 300, the control driver 400, and the power supply unit 500 via a pad PAD.

[0102] For convenience of explanation, the light emitting display device according to an embodiment of the present disclosure will be described below using a connection line CL connected to the first electrode E1 of the switching transistor Tsw1.

[0103] Here, the connection line CL may be connected to the first terminal of the switching transistor Tsw1 and may be connected to the data driver 300 via the pad PAD.

[0104] For example, as described with reference to FIG. 2, the first electrode E1 of the switching transistor Tsw1 may be a first terminal connected to the data line DL, and the second electrode E2 of the switching transistor Tsw1 may be a second terminal connected to the gate of the driving transistor Tdr.

[0105] 6, the first electrode E1 of the switching transistor Tsw1 may be connected to the connection line CL through a contact hole passing through the gate protection layer 104, the gate insulating layer 103, and the buffer 102. The connection line CL may extend to the pad non-display area PNDA and be connected to a data pad, which may be connected to the data driver 300.

[0106] In addition to the connecting lines CL, a light blocking plate may be further provided on the same layer as the connecting lines CL. A portion of the light blocking plate may be connected to a transistor included in the pixel driving circuit PDC, or may be connected to any one of the gate driver 200, the data driver 300, the control driver 400, the power supply 500, and the touch driver 600. That is, a portion of the light blocking plate may be connected to any one of the transistor, the gate driver 200, the data driver 300, the control driver 400, the power supply 500, and the touch driver 600.

[0107] In addition, another part of the light blocking plate may function to block light entering the transistor active. Here, the light blocking layer may be provided independently without being connected to the transistor, the gate driver 200, the data driver 300, the control driver 400, the power supply 500, and the touch driver 600.

[0108] Here, the connecting line CL connected to the first electrode E1 of the switching transistor Tsw1 can also function as a light blocking layer. That is, the connecting line CL can transmit a voltage supplied from the data driver 300 to the switching transistor Tsw1 and can block light from entering the active ACT of the switching transistor Tsw1. Therefore, the connecting line CL can function as a data line.

[0109] The connecting line CL can be covered with a buffer 102 .

[0110] The buffer 102 may be made of an organic material or an inorganic material, and may be made of at least one organic material and at least one inorganic material.

[0111] The gate insulating layer 103 may also be formed of an organic material or an inorganic material, and may be formed of at least one organic material and at least one inorganic material.

[0112] The gate protection layer 104 may also be formed of an organic material or an inorganic material, or may be formed of at least one organic material and at least one inorganic material.

[0113] Next, the gate protection layer 104, the first electrode E1 and the second electrode E2 can be covered with a first planarization layer 106a.

[0114] The first planar layer 106a may be covered with a second planar layer 106b.

[0115] The first and second planar layers 106a and 106b serve to flatten the top surface of the pixel driving circuit layer PDCL.

[0116] The first planar layer 106a and the second planar layer 106b may be formed of various kinds of organic materials.

[0117] For example, the first planar layer 106a and the second planar layer 106b may be formed of PI (polyimide) or an acrylic polymer material, or may be formed of various organic materials used in manufacturing a light emitting display device.

[0118] Each of the first planar layer 106a and the second planar layer 106b may be formed of at least one layer.

[0119] Next, an anode constituting the light emitting element ED can be provided on the upper end surface of the second flat layer 106b.

[0120] The anode AN may be formed of a transparent metal such as ITO (Indium Tin Oxide), an opaque metal such as copper (Cu), or a combination of at least one transparent metal and at least one opaque metal.

[0121] The anode AN may be connected to the second terminal of the driving transistor Tdr.

[0122] The anode AN can be provided independently for each pixel P.

[0123] Next, a bank BK can be provided between the anodes AN.

[0124] The bank BK covers the outer periphery of the anode AN, and light can be output to the outside through the area of the anode AN that is not covered by the bank BK (hereinafter simply referred to as the opening).

[0125] The bank BK can be formed from various kinds of organic materials.

[0126] For example, the bank BK may be made of PI (polyimide) or an acrylic polymer material, or may be made of various organic materials used in manufacturing a light emitting display device.

[0127] Next, the anode AN and the bank BK are covered with the light-emitting layer EL.

[0128] The light-emitting layer EL can be provided continuously between the anodes AN, or can be provided independently like the anodes AN.

[0129] The light-emitting layer EL is then covered with a cathode CA.

[0130] Next, a sealing layer 107 may be provided on top of the cathode CA to prevent moisture penetration.

[0131] The encapsulation layer 107 can prevent external moisture and oxygen from penetrating into the light emitting element ED, which is vulnerable to external moisture and oxygen. To this end, the encapsulation layer 107 may include at least one inorganic encapsulation layer and at least one organic encapsulation layer. However, the light emitting display device according to an embodiment of the present specification is not limited thereto.

[0132] Hereinafter, a sealing layer including a first sealing layer 107a, a second sealing layer 107b, and a third sealing layer 107c will be described as an example of the sealing layer 107 applied to the light emitting display device according to an embodiment of the present specification.

[0133] The first sealing layer 107a covers the cathode CA. The first sealing layer 107a is made of silicon nitride (SiN x ), silicon oxide (SiO x ), silicon oxynitride (SiON), or aluminum oxide (Al2O3).

[0134] The second sealing layer 107b may be formed on the flexible substrate 101 on which the first sealing layer 107a is formed, using a non-photosensitive organic material such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, polyethylene or silicon oxycarbonate (SiOC), or a photosensitive organic material such as photoacrylic, but is not limited thereto.

[0135] When the second sealing layer 107b is formed by the inkjet method, at least one dam DAM may be provided in the connected non-display area CNDA to prevent the liquid second sealing layer 107b from spreading to the outer periphery of the flexible substrate 101. The dam DAM prevents the second sealing layer 107b from spreading to the bending area BA.

[0136] Here, the second sealing layer 107b may be formed from the display area DA to the dam DAM.

[0137] The dam DAM may be formed simultaneously with the first and second planar layers 106a and 106b. For example, the lower layer of the dam DAM may be formed when the first planar layer 106a is formed, and the upper layer of the dam DAM may be formed when the second planar layer 106b is formed. Thus, the dam DAM may be formed in a double structure.

[0138] Therefore, the dam DAM may be formed of the same material as the first planar layer 106a and the second planar layer 106b, but the structure of the dam DAM applied to the light emitting display device according to an embodiment of the present disclosure is not limited thereto.

[0139] The third encapsulating layer 107c is formed on the flexible substrate 101 on which the second encapsulating layer 107b is formed, and may be formed together with the first encapsulating layer 107a to surround the upper, lower and side surfaces of the second encapsulating layer 107b.

[0140] The first and third encapsulation layers 107a and 107c can minimize or prevent external moisture and oxygen from penetrating into the light emitting element ED. The first and third encapsulation layers 107a and 107c are made of silicon nitride (SiN x ), silicon oxide (SiO x ), silicon oxynitride (SiON), or aluminum oxide (Al2O3), or other inorganic materials that can be deposited at low temperatures.

[0141] The light emitting element part 100a includes a flexible substrate 101, a pixel driving circuit layer PDCL, a first flat layer 106a, a second flat layer 106b, a light emitting element ED, and a sealing layer 107.

[0142] Next, on the sealing layer 107, a touch electrode unit 100b can be provided.

[0143] The touch electrode unit 100b includes a first touch insulating layer 108a provided on the sealing layer 107, a bridge electrode BR provided on the first touch insulating layer 108a, a second touch insulating layer 108b covering the bridge electrode BR, touch electrodes TE1, TE2 provided on the second touch insulating layer, and a touch protection layer 108c covering the second touch insulating layer 108b and the touch electrodes TE1, TE2.

[0144] When the touch electrode unit 100b is configured in a mutual type, the touch electrodes TE1 and TE2 may include a touch driving electrode TE1 to which a touch driving signal is supplied and a touch receiving electrode TE2 to which a touch sensing signal is generated.

[0145] The touch driving electrode TE1 and the touch receiving electrode TE2 may be formed in the same layer, for example, on the second touch insulating layer 108b.

[0146] The touch driving electrodes TE1 and the touch receiving electrodes TE2 may extend in different directions, so that an overlapping region between the touch driving electrodes TE1 and the touch receiving electrodes TE2 may occur.

[0147] In an overlapping region of the touch driving electrode TE1 and the touch receiving electrode TE2, one of the touch driving electrode TE1 and the touch receiving electrode TE2 may be connected via a bridge electrode BR. The bridge electrode BR may be formed in a layer different from the touch driving electrode TE1 and the touch receiving electrode TE2, for example, on the first touch insulating layer 108a.

[0148] Each of the touch driving electrodes TE1 and the touch receiving electrodes TE2 may be connected to the touch driver 600 through a touch electrode line TEL. To this end, the touch electrode line TEL may extend to the pad non-display area PNDA.

[0149] The touch electrode line TEL connected to the touch driving electrode TE1 may be the touch driving electrode line TXL described with reference to FIG. 1, and the touch electrode line TEL connected to the touch receiving electrode TE2 may be the touch receiving electrode line RXL described with reference to FIG. 1.

[0150] The touch electrode line TEL can be provided on the second touch insulating layer 108b as shown in FIG. 6, but can also be provided on the first touch insulating layer 108a.

[0151] The touch driving electrodes TE1, the touch receiving electrodes TE2 and the touch electrode lines TEL may be covered with a touch protection layer 108c, as shown in FIG.

[0152] The first touch insulating layer 108a, the second touch insulating layer 108b, and the touch protective layer 108c may extend beyond the dam DAM to the connected non-display area CNDA.

[0153] The first touch insulating layer 108a and the second touch insulating layer 108b may be made of an inorganic material, and the touch protection layer 108c may be made of an organic material.

[0154] For example, the first touch insulating layer 108a and the second touch insulating layer 108b may be made of silicon oxide (SiO x ) or silicon nitride (SiN x ), metal oxide or metal nitride, or various inorganic materials used in manufacturing a light emitting display device.

[0155] The touch protection layer 108c may be made of PI (polyimide) or an acrylic polymer material, or may be made of various organic materials used in manufacturing a light emitting display device.

[0156] Next, the non-display area NDA is provided with a first non-display planar layer 106c. The first non-display planar layer 106c can be provided on the buffer 102.

[0157] The first non-display planar layer 106c may be formed of the same material as the first planar layer 106a, and may be formed together with the first planar layer 106a.

[0158] Therefore, the first non-display flat layer 106c can be made of an organic material.

[0159] The first non-display flat layer 106c may be provided in the non-display area NDA, particularly in the bending area BA, and may extend to a portion of the pad non-display area PNDA and a portion of the connection non-display area CNDA.

[0160] Next, metal lines ML may be provided on the first non-display planar layer 106c.

[0161] The metal line ML may be connected to the touch electrode TE1 or TE2 provided on the pixel driving circuit layer PDCL or may be connected to a transistor provided on the pixel driving circuit layer PDCL.

[0162] For example, in the light-emitting display panel shown in FIG. 6, the metal line ML is connected to the touch electrode TE1 or TE2 provided in the touch electrode unit 100b.

[0163] To this end, the second touch insulating layer 108b extending to the connection non-display area CNDA has a first contact hole CH1, and the touch electrode line TEL connected to the touch electrode TE1 or TE2 can be connected to the metal line ML in the connection non-display area CNDA through the first contact hole CH1.

[0164] Here, the metal lines ML extend from the connection non-display area CNDA through the bending area BA to the pad non-display area PNDA, and are connected to the pads PAD in the pad non-display area PNDA. The pads PAD may be connected to the touch driver 600.

[0165] Therefore, the touch electrode line TEL can be connected to the touch driver 600.

[0166] Therefore, a touch driving signal transmitted from the touch driver 600 can be transmitted to the touch driving electrode TE1 via the metal line ML and the touch electrode line TEL, or a touch sensing signal generated in the touch receiving electrode TE2 can be transmitted to the touch driver 600 via the touch electrode line TEL and the metal line ML.

[0167] In addition, in the light-emitting display panel shown in FIG. 8, the metal line ML is connected to the transistors provided in the pixel driving circuit layer PDCL, and in particular, is connected to the first electrode E1 of the switching transistor Tsw1.

[0168] To this end, the connecting line CL provided on the flexible substrate 101 is connected to the first electrode E1 of the switching transistor Tsw1 provided on the pixel driving circuit layer PDCL. Also, the connecting non-display area CNDA has a second contact hole CH2, and the connecting line CL extending to the connecting non-display area CNDA can be connected to the metal line ML in the connecting non-display area CNDA through the second contact hole CH2.

[0169] The metal lines ML extend from the connection non-display area CNDA through the bending area BA to the pad non-display area PNDA, and are connected to the pads PAD in the pad non-display area PNDA. The pads PAD can be connected to the data driver 300.

[0170] Therefore, the first electrode E1 of the switching transistor Tsw1 can be connected to the data driver 300.

[0171] Therefore, the data voltage Vdata output from the data driver 300 can be supplied to the first electrode E1 of the switching transistor Tsw1 through the metal line ML and the connection line CL.

[0172] Here, the connection line CL can function as a data line DL.

[0173] The first non-display planar layer 106c and the metal lines ML can then be covered with a second non-display planar layer 106d.

[0174] The second non-display planar layer 106d may be formed of the same material as the second planar layer 106b, and may be formed together with the second planar layer 106b.

[0175] Therefore, the second non-display flat layer 106d can be made of an organic material.

[0176] The second non-display flat layer 106d may be provided in the non-display area NDA, particularly in the bending area BA, and may extend to a portion of the pad non-display area PNDA and a portion of the connection non-display area CNDA.

[0177] The second non-display planar layer 106d can then be covered with non-display banks NBK.

[0178] The non-display bank NBK can be formed of the same material as the bank BK, and can be formed together with the bank BK.

[0179] Therefore, the non-display bank NBK can be formed of an organic material.

[0180] The non-display bank NBK may be provided in the bending area BA of the non-display area NDA, and may extend to a part of the pad non-display area PNDA and a part of the connection non-display area CNDA.

[0181] Here, as shown in FIG. 6, the thickness A of the non-display bank NBK provided in the bending area BA is formed to be smaller than the thickness B of the non-display bank NBK provided in the connection non-display area CNDA and the thickness C of the non-display bank NBK provided in the pad non-display area PNDA.

[0182] Therefore, TMAH (Tetramethyl Ammonium hydroxide) and TMA+ (hereinafter simply referred to as TMA ions) cannot remain on the upper end surface of the non-display bank NBK provided in the bending area BA.

[0183] Since TMAH and TMA ions do not remain in the bending area BA, defects such as cracks occurring in the metal line ML can be reduced.

[0184] TMAH is a material used to pattern the first planar layer 106a, the second planar layer 106b, the first non-display planar layer 106c, the second non-display planar layer 106d, the bank BK, the non-display bank NBK, and the touch protection layer 108c, or to pattern various electrodes and lines provided on the layers.

[0185] For example, TMAH is a material used in the development process for developing the photoresist and organic film used in the patterning of the above-mentioned structures.

[0186] That is, a solution containing TMAH is used in a development process for patterning various components provided in the light-emitting display panel 100, and after the development process is performed, a strip process is performed to wash out the solution containing TMAH.

[0187] However, even after the stripping process, TMAH may remain on the upper end surfaces of the first planar layer 106a, the second planar layer 106b, the first non-display planar layer 106c, the second non-display planar layer 106d, the banks BK, and the non-display banks NBK.

[0188] In addition, when TMAH comes into contact with water or other solutions and ionizes, TMA ions can be generated. That is, when the hydroxide group (-OH) is removed from TMAH, TMA ions (TMA+) can be generated.

[0189] That is, even after the stripping process is performed, TMAH or TMA ions may remain in the layer by chemically or physically bonding with the materials contained in the layer.

[0190] Therefore, when the development process and stripping process are performed using a solution containing TMAH, at least one of TMAH and TMA ions may remain on the top surfaces of organic layers such as the first planarizing layer 106a, the second planarizing layer 106b, the first non-display planarizing layer 106c, the second non-display planarizing layer 106d, the bank BK, and the non-display bank NBK.

[0191] That is, TMAH can chemically or physically bond with other functional groups contained in the organic layer, and thus at least one of TMAH and TMA ions can remain in the organic layer.

[0192] The TMAH and TMA ions remaining in the organic layer are the main cause of cracks in the metal lines ML provided in the bending area BA.

[0193] For example, the organic layer provided on the metal line ML may be damaged by TMAH and TMA ions, and moisture permeating from the outside through the damaged organic layer may cause cracks in the metal line ML.

[0194] In particular, in the bending area BA where the flexible substrate 101 is bent, TMAH and TMA ions may aggregate due to bending stress, and the aggregated TMAH and TMA ions may cause cracks in the metal lines ML.

[0195] That is, damage to the organic layer by TMAH and TMA ions occurs most severely in the bending region BA where bending stress is continuously applied, and thus cracks may occur in the metal line ML provided in the bending region BA.

[0196] However, in the present invention, over-etching can be performed on the non-display banks NBK, which are organic layers. In the following description, over-etching means increasing the number or time of etching processes to etch more than the original target thickness. That is, for over-etching, additional etching processes may be performed, and the etching process time may also be increased. For example, over-etching can be performed on the non-display banks NBK provided in the bending region BA using a dry etching process.

[0197] To further explain, after forming the non-display bank NBK and the bank BK, over-etching of the non-display bank NBK may be performed during the etching process for forming at least one of the light-emitting layer EL, the cathode CA, the first encapsulation layer 107a, the third encapsulation layer 107c, the first touch insulating layer 108a, the second touch insulating layer 108b, the touch electrodes TE1, TE2, and the touch electrode line TEL, which are provided on the bank BK.

[0198] The TMAH and TMA ions remaining on the upper end surface of the non-display bank NBK provided in the bending region BA can be removed together with the upper end surface of the non-display bank NBK when the upper end surface of the non-display bank NBK is removed by over-etching.

[0199] Therefore, no TMAH or TMA ions remain on the upper end surfaces of the non-display banks NBK provided in the bending areas BA.

[0200] Therefore, even if bending stress is continuously applied to the non-display bank NBK provided in the bending region BA, the non-display bank NBK provided in the bending region BA is not damaged by TMAH and TMA ions, and therefore cracks do not occur in the metal line ML provided at the lower end of the non-display bank NBK.

[0201] Therefore, even if the light emitting display device is continuously used, defects such as cracks occurring in the metal lines ML may be reduced or eliminated compared to the conventional case.

[0202] By the over-etching process as described above, the thickness A of the non-display bank NBK provided in the bending area BA can be formed smaller than the thickness B of the non-display bank NBK provided in the connection non-display area CNDA and the thickness C of the non-display bank NBK provided in the pad non-display area PNDA.

[0203] Finally, the metal line ML connected to the touch electrode TE1 or TE2 or connected to a transistor provided in the pixel driving circuit layer PDCL may extend to the pad non-display area PNDA, as shown in FIGS. 6 and 8.

[0204] The metal lines ML extending into the pad non-display area PNDA may be connected to the pads PAD.

[0205] The pad PAD may be connected to any one of the gate driver 200, the data driver 300, the control driver 400, the power supply unit 500, and the touch driver 600.

[0206] Figure 9 is an example view showing a bending region applied to a light emitting display device according to an embodiment of the present specification, and Figure 10 is another example view showing the bending region shown in Figure 9. In particular, Figure 9 shows a bending region BA that is not bent, and Figure 10 shows a bending region BA that is bent. In the following description, content that is the same as or similar to the content described with reference to Figures 1 to 8 will be omitted or will be briefly described.

[0207] As described above, the bending area BA may include a first non-display planar layer 106c provided on the flexible substrate 101 or the buffer 102, metal lines ML provided on the first non-display planar layer, a second non-display planar layer 106d covering the first non-display planar layer 106c and the metal lines ML, and non-display banks NBK provided on the second non-display planar layer 106d.

[0208] First, the non-display bank NBK can be formed of the same material as the bank BK and can be patterned together with the bank BK.

[0209] After the non-display banks NBK and BK are formed, a patterned light-emitting layer EL or a patterned cathode CA may be formed on the banks BK. In addition, after the non-display banks NBK and BK are formed, a patterned first encapsulating layer 107a, a patterned second encapsulating layer 107b, a patterned first touch insulating layer 108a, a patterned second touch insulating layer 108b, a patterned bridge electrode BR, patterned touch electrodes TE1 and TE2, and patterned touch electrode lines TEL may be formed on the banks BK.

[0210] In the following description, the patterned layer or lines provided on the bank BK will be simply referred to as the patterned layer.

[0211] The pattern layer can be formed by a developing process of developing a photoresist and an etching process of various materials.

[0212] That is, after the non-display banks NBK and BK are formed, an etching process must be performed to form various pattern layers.

[0213] When performing the etching process for forming the pattern layer, the non-display banks NBK provided in the bending area BA may also be etched.

[0214] The TMAH and TMA ions remaining on the upper surface of the non-display bank NBK provided in the bending region BA can be removed together with the upper surface of the non-display bank NBK when the upper surface of the non-display bank NBK is removed by an etching process for the non-display bank NBK.

[0215] For example, as shown in FIGS. 6 and 10, when both ends of the non-display bank NBK are covered with a non-display touch insulating layer 108d formed of the same material as the second touch insulating layer 108b, an etching process can be performed to form the non-display touch insulating layer 108d and the second touch insulating layer 108b.

[0216] That is, after the touch insulating layer material forming the second touch insulating layer 108b and the non-display touch insulating layer 108d is deposited on the entire surface of the flexible substrate 101, contact holes for connecting the bridge electrode BR and the touch electrode TE1 or TE2 can be formed, and an etching process can be performed for this purpose. The etching process can form the second touch insulating layer 108b with the contact holes formed therein, and the non-display touch insulating layer 108d exposing the non-display bank NBK can be formed. Furthermore, when the etching process is performed, the upper end surface of the non-display bank NBK can be removed by etching.

[0217] In addition, the touch insulation layer material forming the second touch insulation layer 108b and the non-display touch insulation layer 108d is formed of an inorganic material, and the inorganic material provided in the bending region BA may be damaged by bending. Therefore, an etching process may be performed to remove the touch insulation layer material provided in the bending region BA. The etching process may form the non-display touch insulation layer 108d only on both ends of the non-display bank NBK, thereby exposing the non-display bank NBK provided in the bending region BA. In addition, the etching process for removing the touch insulation layer material may also etch away the upper end surface of the non-display bank NBK provided in the bending region BA.

[0218] In addition, an etching process may be performed to form the touch electrodes TE1, TE2 and the touch electrode lines TEL provided on the second touch insulating layer 108b. When the etching process is performed, the upper end surfaces of the non-display banks NBK provided in the bending area BA may be removed by etching.

[0219] Therefore, the upper end surfaces of the non-display banks NBK provided in the bending area BA can be removed by the etching process described above.

[0220] In addition, in a state where the non-display banks NBK are exposed in the bending area BA, the process of etching the non-display banks NBK may be further performed at least once.

[0221] Therefore, the thickness A of the non-display bank NBK provided in the bending area BA can be smaller than the thickness B of the non-display bank NBK provided in the connection non-display area CNDA and the thickness C of the non-display bank NBK provided in the pad non-display area PNDA.

[0222] In addition, the TMAH and TMA ions that are used in the development process for developing the photoresist to form the pattern layer and remain on the upper surface of the non-display bank NBK even after the strip process can be removed together with the upper surface of the non-display bank NBK when the upper surface of the non-display bank NBK is removed by the etching process described above.

[0223] That is, no TMAH or TMA ions remain on the upper end surfaces of the non-display banks NBK provided in the bending areas BA.

[0224] Therefore, it is possible to prevent or reduce the damage of the metal lines ML caused by TMAH and TMA ions.

[0225] In addition, before forming the non-display touch insulating layer 108d on the upper surface of the non-display bank NBK, the entire upper surface of the non-display bank NBK can be removed by etching, so that no TMAH or TMA ions remain on the upper surface of the non-display bank NBK after etching.

[0226] Here, the thickness of the non-display bank NBK may be smaller than the thickness of the bank BK. For example, the non-display bank NBK may be formed using the same material and process as the bank BK, and after the non-display bank NBK and the bank BK are formed, an additional etching process may be performed only on the non-display bank NBK. Therefore, the thickness of the non-display bank NBK may be smaller than the thickness of the bank BK.

[0227] Next, the metal line ML may be connected to the touch electrode TE1 or TE2 provided on the pixel driving circuit layer PDCL, or may be connected to a transistor or line provided on the pixel driving circuit layer PDCL.

[0228] For example, when the touch electrode unit 100b is provided on the encapsulation layer 107, the metal line ML may be connected to the touch electrode TE1 or TE2, and in particular, may be connected to the touch electrode line TEL connected to the touch electrode TE1 or TE2.

[0229] To this end, the second touch insulating layer 108b extending to the connection non-display area CNDA may have a first contact hole CH1 as shown in FIG. 6, and the touch electrode line TEL connected to the touch electrode TE1 or TE2 may be connected to the metal line ML through the first contact hole CH1.

[0230] The metal lines ML may be connected to the touch driver 600 via pads PAD provided in the pad non-display area PNDA.

[0231] As another example, when a connection line CL connected to a transistor or line provided in the pixel driving circuit layer PDCL is provided on the flexible substrate 101, the metal line ML may be connected to the connection line CL through a second contact hole CH2 formed in the buffer 102 covering the connection line CL, as shown in FIG. 8.

[0232] Here, the transistor provided in the pixel driving circuit layer PDCL may be any one of the switching transistor Tsw1, the sensing transistor Tsw2, and the driving transistor Tdr described with reference to FIG. 2, or may be any other transistor provided in the pixel driving circuit layer PDCL.

[0233] In addition, the lines provided in the pixel driving circuit layer PDCL may be any one of the data lines DL, gate lines GL, sensing lines SL, sensing control lines SCL, first voltage supply lines PLA, and second voltage supply lines PLB described with reference to FIG. 2.

[0234] Next, as shown in FIG. 9, the non-display bank NBK provided in the bending area BA may be covered with a non-display touch protection layer 108e containing the same material as the touch protection layer 108c provided in the touch electrode unit 100b.

[0235] That is, the upper end surface of the non-display bank NBK provided in the bending area BA can be open as shown in FIGS. 6 to 8, or can be covered with the non-display touch protection layer 108e as shown in FIG.

[0236] The non-display touch protection layer 108e may be formed of an organic material. Therefore, the non-display touch protection layer 108e can block moisture from entering from the outside. Since the non-display touch protection layer 108e can block moisture from entering the non-display bank NBK, the extent of damage to the non-display bank NBK caused by moisture can be reduced. Therefore, the extent of damage to the metal line ML provided at the lower end of the non-display bank NBK can be reduced.

[0237] Next, the connection non-display area CNDA and the pad non-display area PNDA may further include a non-display touch insulating layer 108d, as shown in FIGS.

[0238] The non-display touch insulating layer 108d can be formed of at least one layer.

[0239] For example, as shown in FIGS. 6 to 8, the non-display touch insulating layer 108d may be formed of the same material as the second touch insulating layer 108b and in the same process as the second touch insulating layer 108b.

[0240] However, the non-display touch insulating layer 108d may further include a layer formed of the same material and in the same process as the first touch insulating layer 108a.

[0241] That is, the non-display touch insulating layer 108d may include at least one of the same material as the first touch insulating layer 108a and the same material as the second touch insulating layer 108b.

[0242] Here, the non-display touch insulating layer 108d does not have to be covered with the non-display touch protective layer 108e as shown in FIGS.

[0243] However, the non-display touch insulating layer 108d can also be covered with a non-display touch protective layer 108e as shown in FIG.

[0244] For example, the connection non-display area CNDA and the pad non-display area PNDA may include a non-display touch insulating layer 108d provided on the non-display bank NBK and covered by a non-display touch protective layer 108e, as shown in FIG.

[0245] That is, the non-display touch protection layer 108e can cover the upper end of the non-display bank NBK and the upper end of the non-display touch insulation layer 108d.

[0246] Here, as described above, the non-display touch insulating layer 108d may include at least one of the same material as the first touch insulating layer 108a and the same material as the second touch insulating layer 108b.

[0247] The first non-display planar layer 106c can then comprise the same material as the first planar layer 106a, and the second non-display planar layer 106d can comprise the same material as the second planar layer 106b.

[0248] That is, the first non-display flat layer 106c can be formed simultaneously with the first flat layer 106a in the same process, and the second non-display flat layer 106d can be formed simultaneously with the second flat layer 106b in the same process.

[0249] Finally, as shown in FIGS. 9 and 10, when the non-display bank NBK is covered by the non-display touch protection layer 108e, the tensile stress applied to the bending area BA can be reduced by the non-display touch protection layer 108e.

[0250] For example, the bending stress of the bending region BA can be reduced as the total thickness of the bending region BA increases, and in particular, the tensile stress applied to the layer provided under the bending region BA can be reduced.

[0251] To use this principle, the light emitting display device according to an embodiment of the present disclosure may cover the top end of the non-display bank NBK with a non-display touch protection layer 108e, as shown in FIGS.

[0252] That is, the non-display touch protection layer 108e can increase the overall thickness of the bending area BA, thereby reducing stress applied to layers provided under the bending area BA. This effect is called a neutral surface effect.

[0253] Therefore, defects in which the various layers 101, 102, 106a, 106b, 108d and metal lines ML provided in the bending area BA are damaged can be prevented or reduced, and cracks in the various layers 101, 102, 106a, 106b, 108d and metal lines ML provided in the bending area BA can be prevented or reduced.

[0254] In addition, by forming at least one of the non-display touch protection layer 108e, the first non-display planar layer 106c, and the second non-display planar layer 106d in a multi-layer structure, the stress applied to the metal line ML can be further reduced, thereby more effectively preventing or reducing cracks in the metal line ML.

[0255] 11 is a view showing another example of a bending region applied to a light emitting display device according to an embodiment of the present disclosure. In the following description, details that are the same as or similar to those described with reference to FIGS. 1 to 10 will be omitted or will be briefly described.

[0256] First, as described above, the bending area BA may include a first non-display planar layer 106c provided on the flexible substrate 101 or the buffer 102, a metal line ML provided on the first non-display planar layer, a second non-display planar layer 106d covering the first non-display planar layer 106c and the metal line ML, and a non-display bank NBK provided on the second non-display planar layer 106d.

[0257] The thickness A of the non-display bank NBK provided in the bending area BA may be smaller than the thickness B of the non-display bank NBK provided in the connection non-display area CNDA and the thickness C of the non-display bank NBK provided in the pad non-display area PNDA.

[0258] Here, the upper surface of the non-display bank NBK provided in the bending area BA is free of TMAH and TMA ions, but the upper surface of the non-display bank NBK provided in the connection non-display area CNDA and the pad non-display area PNDA may have TMAH and TMA ions.

[0259] Also, as shown in FIG. 11, the thickness D of the second non-display flat layer 106d provided in the bending area BA may be smaller than the thickness E of the second non-display flat layer 106d provided in the connection non-display area CNDA and the thickness F of the second non-display flat layer 106d provided in the pad non-display area PNDA.

[0260] For example, a development process may be performed during the process of forming the second non-display planar layer 106d and the second planar layer 106b and during the process of forming the anode AN on the second planar layer 106b, and therefore, at least one of TMAH and TMA ions may remain on the upper surface of the second non-display planar layer 106d.

[0261] The TMAH and TMA ions remaining on the upper surface of the second non-display planar layer 106d may damage the second non-display planar layer 106d, and moisture that flows in through the damaged portion may cause cracks in the metal line ML provided at the lower end of the second non-display planar layer 106d.

[0262] To prevent this, over-etching can also be performed on the top surface of the second non-display flat layer 106d.

[0263] For example, to form the anode AN on the second planar layer 106b, etching of the upper surface of the second planar layer 106b can be performed when etching the anode AN.

[0264] Therefore, the TMAH and TMA ions present on the upper surface of the second flat layer 106b can be removed.

[0265] Here, the entire upper end surface of the second non-display flat layer 106d can be etched.

[0266] For example, after forming the second non-display planar layer 106d and the second planar layer 106b, an additional etching process may be performed only on the entire upper surface of the second non-display planar layer 106d.

[0267] Therefore, the thickness of the second non-display flat layer 106d can be smaller than the thickness of the second flat layer 106b.

[0268] However, a mask may be used to etch only the portion of the second non-display flat layer 106d that is provided in the bending area BA.

[0269] Therefore, as shown in FIG. 11, the thickness D of the second non-display flat layer 106d provided in the bending area BA can be smaller than the thickness E of the second non-display flat layer 106d provided in the connection non-display area CNDA and the thickness F of the second non-display flat layer 106d provided in the pad non-display area PNDA.

[0270] Here, there is no TMAH or TMA ions on the upper surface of the second non-display planar layer 106d provided in the bending area BA, but there may be TMAH or TMA ions on the upper surface of the second non-display planar layer 106d provided in the connection non-display area CNDA and the pad non-display area PNDA.

[0271] More specifically, the thickness A of the non-display bank NBK provided in the bending region BA may be smaller than the thickness B of the non-display bank NBK provided in the connection non-display region CNDA and the thickness C of the non-display bank NBK provided in the pad non-display region PNDA. Here, the upper surface of the non-display bank NBK provided in the bending region BA may be free of TMAH and TMA ions, while the upper surfaces of the non-display bank NBK provided in the connection non-display region CNDA and the pad non-display region PNDA may contain TMAH and TMA ions.

[0272] Furthermore, the entire upper surface of the second non-display planar layer 106d is free of TMAH and TMA ions. The thickness of the second non-display planar layer 106d can be smaller than the thickness of the second planar layer 106b.

[0273] However, as shown in FIG. 11, if the thickness D of the second non-display planar layer 106d provided in the bending area BA is smaller than the thickness E of the second non-display planar layer 106d provided in the connecting non-display area CNDA and the thickness F of the second non-display planar layer 106d provided in the pad non-display area PNDA, there may be no TMAH and TMA ions on the upper surface of the second non-display planar layer 106d provided in the connecting non-display area CNDA and the pad non-display area PNDA, but there may be TMAH and TMA ions on the upper surfaces of the second non-display planar layer 106d provided in the connecting non-display area CNDA and the pad non-display area PNDA.

[0274] The non-display banks NBK can then be covered with a non-display touch protection layer 108e including an organic material.

[0275] 9 and 10, when the non-display bank NBK is covered with the non-display touch protective layer 108e, moisture penetration can be blocked by the non-display touch protective layer 108e. Furthermore, when the non-display bank NBK is covered with the non-display touch protective layer 108e, the thickness of the bending area BA increases, and therefore, stress applied to the bending area BA can be reduced.

[0276] Therefore, cracks in the metal lines ML provided in the bending area BA can be prevented or reduced, thereby improving the light emission quality.

[0277] Here, the non-display touch insulating layer 108d may not be provided between the non-display bank NBK and the non-display touch protective layer 108e, or may be provided between the non-display bank NBK and the non-display touch protective layer 108e in the connection non-display area CNDA and the pad non-display area PNDA as shown in FIG. 11 .

[0278] Finally, the non-display touch protection layer 108e may include the same material as the touch protection layer 108c covering the touch electrodes TE1 and TE2 provided in the display area DA.

[0279] Here, the non-display touch protection layer 108e can be formed together with the touch protection layer 108c.

[0280] 12 is a view showing yet another example of a bending region applied to a light emitting display device according to an embodiment of the present disclosure. In the following description, details that are the same as or similar to those described with reference to FIGS. 1 to 11 will be omitted or will be briefly described.

[0281] First, as described above, the bending area BA may include a first non-display planar layer 106c provided on the flexible substrate 101 or the buffer 102, a metal line ML provided on the first non-display planar layer, a second non-display planar layer 106d covering the first non-display planar layer 106c and the metal line ML, and a non-display bank NBK provided on the second non-display planar layer 106d.

[0282] The thickness A of the non-display bank NBK provided in the bending area BA may be smaller than the thickness B of the non-display bank NBK provided in the connection non-display area CNDA and the thickness C of the non-display bank NBK provided in the pad non-display area PNDA.

[0283] Here, the upper surface of the non-display bank NBK provided in the bending area BA is free of TMAH and TMA ions, but the upper surface of the non-display bank NBK provided in the connection non-display area CNDA and the pad non-display area PNDA may have TMAH and TMA ions.

[0284] Next, the non-display banks NBK in the connection non-display area CNDA and the pad non-display area PNDA may be covered with a non-display touch protection layer 108e including an organic material.

[0285] For example, in the light emitting display device according to an embodiment of the present specification, as described with reference to FIGS. 9 to 11, the non-display banks NBK provided in the bending area BA may be covered with the non-display touch protection layer 108e.

[0286] However, in an organic light emitting display device according to an embodiment of the present disclosure, the non-display bank NBK provided in the bending area BA may not be covered with the non-display touch protection layer 108e as shown in Fig. 12. In this case, the non-display bank NBK may be provided on the non-display bank NBK in the connection non-display area CNDA and the pad non-display area PNDA with the non-display touch protection layer 108e including an organic material.

[0287] Here, the non-display touch insulating layer 108d may not be provided between the non-display bank NBK and the non-display touch protective layer 108e, or may be provided between the non-display bank NBK and the non-display touch protective layer 108e in the connection non-display area CNDA and the pad non-display area PNDA as shown in FIG. 12.

[0288] For example, the non-display touch protection layer 108e may be formed on the non-display connection area CNDA and the non-display pad area PNDA of the upper end of the non-display bank NBK.

[0289] Thereafter, a touch protection layer material forming a non-display touch protection layer 108e may be deposited over the entire non-display connection area CNDA, the non-display pad area PNDA, and the bending area BA.

[0290] Here, the touch protection layer material provided on the non-display banks NBK in the bending region BA can be removed by a development process using a photoresist, thereby exposing the non-display banks NBK in the bending region BA. A solution containing TMAH can be used in the development process for the touch protection layer material. Therefore, TMAH and TMA ions may remain on the top surfaces of the exposed non-display banks NBK after the development process.

[0291] Therefore, an additional etching process can be performed on the exposed non-display banks NBK, thereby removing the TMAH and TMA ions remaining on the top surfaces of the exposed non-display banks NBK.

[0292] That is, there may be no TMAH and TMA ions on the upper surface of the non-display bank NBK provided in the bending area BA, but there may be TMAH and TMA ions on the upper surface of the non-display bank NBK provided in the connection non-display area CNDA and the pad non-display area PNDA.

[0293] Furthermore, by the additional etching process as described above, the thickness A of the non-display bank NBK provided in the bending area BA can be smaller than the thickness B of the non-display bank NBK provided in the connection non-display area CNDA and the thickness C of the non-display bank NBK provided in the pad non-display area PNDA.

[0294] Here, prior to performing the additional etching process as described above, an etching process may be performed at least once on the non-display banks NBK provided in the bending area BA.

[0295] That is, the TMAH and TMA ions remaining on the upper surface of the non-display bank NBK can be removed primarily through at least one etching process, and the TMAH and TMA ions remaining on the upper surface of the non-display bank NBK after the at least one etching process can be removed secondarily through the additional etching process as described above. Thus, the TMAH and TMA ions can be completely removed from the upper surface of the non-display bank NBK in the bending region BA.

[0296] Here, the second non-display planar layer 106d provided at the lower end of the non-display bank NBK can be removed during the etching process, and therefore, TMAH and TMA ions can be removed from the upper surface of the second non-display planar layer 106d provided in the bending region BA.

[0297] However, the etching process for the second non-display planar layer 106d provided at the lower end of the non-display bank NBK can be omitted. In this case, TMAH and TMA ions may be present on the upper surface of the second non-display planar layer 106d provided in the bending area BA.

[0298] Finally, as shown in FIG. 12, the non-display touch protection layer 108e provided on the non-display bank NBK in the connection non-display area CNDA and the pad non-display area PNDA may include the same material as the touch protection layer 108c covering the touch electrodes TE1 and TE2 provided in the display area DA.

[0299] Here, the non-display touch protection layer 108e can be formed together with the touch protection layer 108c.

[0300] As described above with reference to FIG. 12, after the touch protection layer material is deposited, an etching process may be performed first to expose the non-display bank NBK, thereby forming the non-display touch protection layer 108e.

[0301] After the non-display banks NBK are exposed, an additional etching process can be performed on the non-display banks NBK.

[0302] Here, the top surface of the non-display touch protection layer 108e can be etched together with the top surfaces of the non-display banks NBK.

[0303] Therefore, the thickness of the non-display touch protection layer 108e can be smaller than the thickness of the touch protection layer 108c.

[0304] For example, when a secondary additional etching process is performed on the exposed non-display bank NBK, the upper surface of the touch protection layer 108c is not etched, and the upper surface of the non-display touch protection layer 108e along with the non-display bank NBK may be etched.

[0305] Therefore, the thickness of the non-display touch protection layer 108e can be smaller than the thickness of the touch protection layer 108c.

[0306] Hereinafter, additional features of the light emitting display device according to an embodiment of the present specification and the above-mentioned features will be briefly described.

[0307] As described above, at least one organic layer, such as the second non-display planar layer 106d and the non-display bank NBK, may be formed on the metal line ML where cracks occur in the bending region BA. The photoresist process for the second non-display planar layer 106d and the non-display bank NBK, or another photoresist process performed after the second non-display planar layer 106d and the non-display bank NBK are formed, may leave TMAH and TMA ions on the top surface of the second non-display planar layer 106d and the top surface of the non-display bank NBK. The TMAH and TMA ions may cause cracks to occur in the metal line ML.

[0308] In the light emitting display device according to an embodiment of the present disclosure, the top surface of the organic material layer in which TMAH or TMA ions remain in the bending region BA may be removed by dry overetching.

[0309] Therefore, cracks in the metal lines ML provided in the bending area BA can be prevented or reduced.

[0310] 9, the upper end surfaces of the non-display banks NBK provided in the bending region BA can be removed by over-etching, so that TMAH and TMA ions cannot remain on the upper end surfaces of the non-display banks NBK provided in the bending region BA.

[0311] That is, after the non-display bank NBK in which TMAH and TMA ions remain is formed, an additional etching process using dry etching can be performed, thereby removing the TMAH and TMA ions from the upper surface of the non-display bank NBK.

[0312] More specifically, after the non-display bank NBK is formed, the non-display touch insulating layer 108d and the touch electrodes TE1 and TE2 are formed, and a dry etching process is performed in each of the processes of forming the non-display touch insulating layer 108d and the touch electrodes TE1 and TE2. When the dry etching process for forming the non-display touch insulating layer 108d and the touch electrodes TE1 and TE2 is performed, the dry etching process can also be performed on the non-display bank NBK. Therefore, the upper surface of the non-display bank NBK can be further etched, and TMAH and TMA ions remaining on the upper surface of the non-display bank NBK can be removed.

[0313] Therefore, cracks in the metal lines ML provided in the bending area BA can be prevented or reduced.

[0314] Here, the non-display bank NBK may not have the non-display touch protection layer 108e on it, or may have the non-display touch protection layer 108e on it as shown in FIG.

[0315] The non-display touch protection layer 108e can reduce bending stress and better prevent moisture penetration, thereby better preventing or reducing cracks in the metal lines ML provided in the bending area BA.

[0316] 11, not only the top surfaces of the non-display banks NBK provided in the bending region BA but also the top surface of the second non-display flat layer 106d can be removed by over-etching, so that TMAH and TMA ions cannot remain on the top surface of the second non-display flat layer 106d provided in the bending region BA.

[0317] That is, after the second non-display planar layer 106d containing the remaining TMAH and TMA ions is formed, an additional etching process using dry etching can be performed, thereby removing the TMAH and TMA ions from the upper surface of the second non-display planar layer 106d.

[0318] Since TMAH and TMA ions can be removed from the upper end surface of the non-display bank NBK and the upper end surface of the second non-display planar layer 106d, moisture penetration in the direction of the metal line ML can be prevented, and therefore cracks in the metal line ML provided in the bending area BA can be prevented or reduced.

[0319] Here, the non-display bank NBK may not have the non-display touch protection layer 108e on it, or may have the non-display touch protection layer 108e on it as shown in FIG.

[0320] The non-display touch protection layer 108e can reduce bending stress and better prevent moisture penetration, thereby better preventing or reducing cracks in the metal lines ML provided in the bending area BA.

[0321] To further explain, the amount of TMAH and TMA ions remaining on the upper surface of the second non-display planar layer 106d is smaller than the amount of TMAH and TMA ions remaining on the upper surface of the non-display bank NBK, so that moisture that has penetrated into the non-display bank NBK can be transferred to the metal line ML through the second non-display planar layer 106d.

[0322] Therefore, as described with reference to FIG. 9, only the upper surface of the non-display bank NBK can be removed by an additional etching process, and therefore, only the TMAH and TMA ions remaining on the upper surface of the non-display bank NBK can be removed.

[0323] However, in order to more completely prevent moisture penetration, not only the upper surface of the non-display bank NBK but also the upper surface of the second non-display planar layer 106d can be removed by an additional etching process, thereby removing the TMAH and TMA ions remaining on the upper surface of the non-display bank NBK and the TMAH and TMA ions remaining on the upper surface of the second non-display planar layer 106d.

[0324] Furthermore, if other organic layers other than the non-display bank NBK and the second non-display planar layer 106d are provided on the metal line ML provided in the bending region BA, the etching process can also be performed on the other organic layers, and therefore TMAH and TMA ions can also be removed from the upper surfaces of the other organic layers.

[0325] More specifically, after organic layers (e.g., the second non-display planar layer 106d and the non-display bank NBK) are formed in the bending area BA, various metal layers and inorganic layers can be formed in the display area DA. A dry etching process can be performed to form the various metal layers and inorganic layers. Therefore, when performing the dry etching process to form the various metal layers and inorganic layers, the upper surfaces of the organic layers provided in the bending area BA can be etched and removed. Therefore, TMAH and TMA ions remaining on the upper surfaces of the organic layers provided in the bending area BA can be removed together with the upper surfaces of the organic layers.

[0326] 12, the touch protection layer material deposited in the bending region BA may be removed to expose the non-display bank NBK, and the top surface of the exposed non-display bank NBK may be removed by an additional etching process, thereby removing the TMAH and TMA ions remaining on the top surface of the non-display bank NBK.

[0327] Here, the non-display touch protection layer 108e may remain only in the connection non-display area CNDA and the pad non-display area PNDA. Also, since an additional etching process is performed on the non-display touch protection layer 108e, the thickness of the non-display touch protection layer 108e may be smaller than the thickness of the touch protection layer 108e provided in the display area DA.

[0328] Finally, in the light emitting display device according to an embodiment of the present disclosure, the top surfaces of the organic material layers (e.g., the second non-display planar layer 106d and the non-display bank NBK) provided in the bending region BA may be additionally removed by a dry etching process, thereby completely removing TMAH and TMA ions from the top surfaces of the organic material layers.

[0329] Here, the upper end surface of the first non-display flat layer 106c provided at the lower end of the metal line ML in the bending region BA may also be removed by the dry etching process.

[0330] When the top surface of the organic material layer provided in the bending area BA is removed by an additional etching process, the top surfaces of the metal layer and the inorganic film layer provided in the display area DA and the non-display area NDA may also be removed. In consideration of this, the thicknesses of the metal layer and the inorganic film layer provided in the display area DA and the non-display area NDA may be set variously.

[0331] If the non-display bank NBK is not provided on the second non-display planar layer 106d but the non-display touch insulating layer 108d is provided, an additional etching process can be performed on the top surface of the second non-display planar layer 106d.

[0332] In addition, when a non-display bank NBK is provided on the second non-display planar layer 106d, another organic material layer is provided on the non-display bank NBK, and a non-display touch insulating layer 108d is provided on the other organic material layer, an additional etching process can be performed on the top surface of the other organic material layer.

[0333] The thickness of the non-display touch protection layer 108e covering the non-display banks NBK in the bending area BA can be set in various ways in consideration of the neutral plane effect.

[0334] The over-etching process for the organic layers 106a, 106b, and NBK in the bending area BA may be any one of the etching processes performed after forming the organic layers. The etching process performed after forming the organic layers may be performed to form the metal layers and inorganic film layers in the display area DA or the non-display area NDA.

[0335] If the non-display banks NBK in the bending area BA are not covered with the non-display touch protection layer 108e, the stress reduction effect in the bending area BA cannot be expected, but TMAH and TMA ions can be removed from the non-display banks NBK, which are most vulnerable to moisture permeation and stress, thereby effectively preventing cracks in the metal lines ML.

[0336] The top surface of the organic layer from which TMAH and TMA ions have been removed by over-etching may be formed in a tapered or inversely tapered shape.

[0337] In the light emitting display device according to an embodiment of the present specification, the upper surface of the organic material layer is recessed by dry etching, so that TMAH and TMA ions that cause cracks can be removed from the upper surface of the organic material layer.

[0338] An upper surface of at least one of the organic material layers provided in the bending area BA may be removed by the etching process, particularly, an upper surface of the organic material layer exposed to the outside or an upper surface of the organic material layer covered by the non-display touch protection layer 108e may be removed by the etching process.

[0339] The non-display touch protection layer 108e may not be provided in the bending area BA to prevent moisture penetration, or may be provided in the bending area BA to provide a neutral surface effect.

[0340] The characteristics of the light emitting display device according to an embodiment of the present specification can be briefly summarized as follows.

[0341] An organic EL display device according to an embodiment of the present specification includes a flexible substrate divided into a display area and a non-display area surrounding the display area, a pixel driving circuit layer provided in the display area and including a pixel driving circuit, a first planar layer covering the pixel driving circuit layer in the display area, a second planar layer covering the first planar layer, a first non-display planar layer provided in the non-display area, metal lines provided on the first non-display planar layer, a second non-display planar layer covering the first non-display planar layer and the metal lines, and a non-display bank provided on the second non-display planar layer, wherein the non-display area includes a bending area that is bent, a connecting non-display area provided on one side of the bending area and connected to the display area, and a pad non-display area provided on the other side of the bending area, and a thickness of the non-display bank provided in the bending area is smaller than a thickness of the non-display bank provided in the connecting non-display area and the pad non-display area.

[0342] The metal line is connected to a touch electrode provided on the pixel driving circuit layer, or to a transistor or line provided on the pixel driving circuit layer.

[0343] The display device further includes a light emitting element provided on the second planar layer, a sealing layer covering the light emitting element, and a touch electrode portion provided on the sealing layer, and the metal line is connected to a touch electrode provided on the touch electrode portion.

[0344] The touch electrode part includes a first touch insulating layer provided on the sealing layer, a bridge electrode provided on the first touch insulating layer, a second touch insulating layer covering the bridge electrode, a touch electrode provided on the second touch insulating layer, and a touch protection layer covering the second touch insulating layer and the touch electrode, wherein the second touch insulating layer extending to the connection non-display area has a contact hole, and a touch electrode line connected to the touch electrode is connected to the metal line through the contact hole.

[0345] The non-display banks are covered by a non-display touch protection layer that includes the same material as the touch protection layer.

[0346] The pixel driving circuit layer may further include a connection line provided on the flexible substrate, and a buffer provided between the flexible substrate and the pixel driving circuit layer to cover the connection line, the connection line being connected to a transistor or line provided on the pixel driving circuit layer, and the metal line being connected to the connection line through a contact hole provided in the buffer.

[0347] The connecting non-display area and the pad non-display area include a non-display touch insulating layer provided on the non-display bank and covered by the non-display touch protection layer, and the non-display touch insulating layer includes at least one of the same material as the first touch insulating layer and the same material as the second touch insulating layer.

[0348] No TMAH (Tetramethyl Ammounium hydroxide) or TMA ions (TMA+) remain on the top surface of the non-display bank provided in the bending region.

[0349] The non-display bank may further include an anode provided on the second planar layer, a bank covering the outer periphery of the anode, a light-emitting layer provided on the anode, a cathode covering the light-emitting layer, and a sealing layer covering the cathode, and the non-display bank may include the same material as the bank.

[0350] The first non-display planar layer includes the same material as the first planar layer, and the second non-display planar layer includes the same material as the second planar layer.

[0351] The thickness of the second non-display flat layer provided in the bending region is smaller than the thickness of the second non-display flat layer provided in the connecting non-display region and the pad non-display region.

[0352] The non-display banks are covered by a non-display touch protection layer comprising an organic material.

[0353] The non-display touch protection layer includes the same material as the touch protection layer covering the touch electrode provided in the display area.

[0354] The non-display banks in the non-display connection area and the non-display pad area are covered with a non-display touch protection layer including an organic material.

[0355] The touch panel further includes at least one non-display touch insulating layer provided between the non-display bank and the non-display touch protection layer in the non-display connection region and the non-display pad region.

[0356] The non-display touch protection layer covers the touch electrodes provided in the display area. [Industrial Applicability]

[0357] An emissive display device according to an embodiment of the present disclosure may be applied to any electronic device including an emissive display panel. For example, the emissive display device according to an embodiment of the present disclosure may be applied to a virtual reality (VR) device, an augmented reality (AR) device, a mobile device, a video phone, a smart watch, a watch phone, a wearable device, a foldable device, a rollable device, a bendable device, a flexible device, a curved device, an electronic organizer, an electronic book, a portable multimedia player (PMP), a personal digital assistant (PDA), an MP3 player, a mobile medical device, a desktop PC, a laptop PC, a netbook computer, a workstation, a navigation system, a vehicle navigation system, a vehicle display device, a television, a wallpaper display device, a signage device, a game device, a notebook PC, a monitor, a camera, a camcorder, and a home appliance.

[0358] The features, structures, effects, etc. described in the various examples of this specification are included in at least one example of this specification and are not necessarily limited to only one example. Furthermore, the features, structures, effects, etc. exemplified in at least one example of this specification can be combined or modified into other examples by a person skilled in the art to which the technical idea of this specification belongs. Therefore, content related to such combinations and modifications should be interpreted as being included in the technical scope or scope of rights of this specification.

[0359] The present invention described above is not limited to the above-described embodiments and the accompanying drawings, and it will be apparent to those skilled in the art that various substitutions, modifications, and changes can be made without departing from the scope of the present invention. Therefore, the scope of the present invention is determined by the claims set forth below, and all modifications and changes derived from the meaning, scope, and equivalents of the claims should be construed as being included in the scope of the present invention. [Explanation of symbols]

[0360] 100a Light emitting element portion 100b Touch electrode part 100 Illuminating display panel 200 Gate Driver 300 Data Driver 400 Control Driver 500 Power supply section 600 Touch Driver

Claims

1. a flexible substrate divided into a display area and a non-display area surrounding the display area; a pixel driving circuit layer provided in the display area and including pixel driving circuits; a first planar layer covering the pixel driving circuit layer in the display area; a second planar layer covering the first planar layer; a first non-display flat layer provided in the non-display area; a metal line disposed on the first non-display planar layer; a second non-display planar layer covering the first non-display planar layer and the metal line; a non-display bank provided on the second non-display planar layer; the non-display area includes a bending area to be bent, a connecting non-display area provided on one side of the bending area and connected to the display area, and a pad non-display area provided on the other side of the bending area, a thickness of the non-display bank provided in the bending region being smaller than a thickness of the non-display bank provided in the connecting non-display region and the pad non-display region;

2. The light emitting display device of claim 1 , wherein the metal line is connected to a touch electrode provided on the pixel driving circuit layer or to a transistor or line provided on the pixel driving circuit layer.

3. a light emitting element provided on the second flat layer; a sealing layer that covers the light-emitting element; a touch electrode portion provided on the sealing layer, The light emitting display device of claim 1 , wherein the metal line is connected to a touch electrode provided in the touch electrode portion.

4. The touch electrode unit is a first touch insulating layer disposed on the sealing layer; a bridge electrode disposed on the first touch insulating layer; a second touch insulating layer covering the bridge electrode; a touch electrode provided on the second touch insulating layer; a touch protection layer covering the second touch insulation layer and the touch electrode, the second touch insulating layer extending to the connecting non-display area includes a contact hole; The light emitting display device of claim 3 , wherein a touch electrode line connected to the touch electrode is connected to the metal line through the contact hole.

5. The light emitting display device of claim 4 , wherein the non-display bank is covered by a non-display touch protection layer comprising the same material as the touch protection layer.

6. a connecting line provided on the flexible substrate; a buffer disposed between the flexible substrate and the pixel driving circuit layer, the buffer covering the connecting line; The connecting line is connected to a transistor or a line provided in the pixel driving circuit layer, The light emitting display device of claim 1 , wherein the metal line is connected to the connection line through a contact hole formed in the buffer.

7. a non-display touch insulating layer provided on the non-display bank and covered by the non-display touch protection layer, the non-display touch insulating layer being provided in the non-display connection area and the non-display pad area; The light emitting display device of claim 5 , wherein the non-display touch insulating layer includes at least one of the same material as the first touch insulating layer and the same material as the second touch insulating layer.

8. 2. The light emitting display device according to claim 1, wherein no tetramethylammonium hydroxide (TMAH) or TMA ions remain on the top end surface of the non-display bank provided in the bending region.

9. an anode disposed on the second planar layer; a bank covering the outer periphery of the anode; a light-emitting layer disposed on the anode; a cathode covering the light-emitting layer; a sealing layer covering the cathode, The light emitting display device of claim 1 , wherein the non-display bank contains the same material as the bank.

10. the first non-display planar layer includes the same material as the first planar layer; The light emitting display device of claim 1 , wherein the second non-display planarizing layer includes the same material as the second planarizing layer.

11. The light emitting display device of claim 1 , wherein the thickness of the second non-display planar layer provided in the bending region is smaller than the thickness of the second non-display planar layer provided in the connecting non-display region and the pad non-display region.

12. The light emitting display device of claim 11 , wherein the non-display banks are covered by a non-display touch protection layer comprising an organic material.

13. The light emitting display device of claim 12 , wherein the non-display touch protection layer includes the same material as a touch protection layer covering the touch electrode provided in the display area.

14. The light emitting display device of claim 1 , wherein the non-display banks in the non-display connection area and the non-display pad area are covered with a non-display touch protection layer including an organic material.

15. The light emitting display device of claim 14 , further comprising at least one non-display touch insulating layer provided between the non-display bank and the non-display touch protection layer in the non-display connection region and the non-display pad region.

16. The light emitting display device of claim 14 , wherein the non-display touch protection layer includes the same material as a touch protection layer covering the touch electrode provided in the display area.

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