Display panel and display device

Abstract

To provide a display panel and a display device that can improve the sealing performance of a sealing layer and further improve the overall process performance of the display panel.SOLUTION: A display panel according to the present application includes a display area AA and a non-display area NA surrounding at least a portion of the display area. The display panel includes a substrate 100, a pixel definition layer 200 including a pixel limiting portion 210 located in the display area and having a plurality of pixel openings and a defining portion 220 located in the non-display area, an emitting layer 300 including an emitting unit 310 located in a pixel opening 230, and a sealing layer 400 located on the side of the emitting layer away from the substrate, and the sealing layer includes a first sealing layer and a second sealing layer located on the side of the first sealing layer away from the emitting layer. The first sealing layer includes a sealing portion 411 located in the display area and sealing the emitting unit, and at least a portion of the second sealing layer extends to the non-display area and is connected in contact with the defining portion.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present application relates to the technical field of display devices, and more particularly to display panels and display devices. [Background technology]

[0002] Organic light-emitting diode (OLED) displays, also known as organic electroluminescence displays, have a number of advantages over traditional LCD displays, including self-luminance, wide viewing angle, ultra-lightweight, ultra-thin, high brightness, low power consumption, and fast response. The response speed can be up to 1,000 times faster than that of LCD displays, making OLED displays a very popular flat panel display product around the world and offering a wide range of potential applications.

[0003] However, there is currently a need to improve the process performance of display panels. Summary of the Invention

[0004] The embodiments of the present application aim to provide a display panel and a display device, and to improve the process performance of the display panel.

[0005] An embodiment of a first aspect of the present application provides a display panel including a display area and a non-display area surrounding at least a portion of the display area, the display panel including a substrate, a pixel definition layer located in the display area and including a pixel limiting portion in which a plurality of pixel openings are opened and a defining portion located in the non-display area, an emitting layer including light-emitting units located in the pixel openings, and a sealing layer located on a side of the emitting layer away from the substrate, the sealing layer including a first sealing layer and a second sealing layer located on a side of the first sealing layer away from the light-emitting layer, the first sealing layer including a sealing portion located in the display area and sealing the light-emitting units, and at least a portion of the second sealing layer extending to the non-display area and in contact with and connected to the defining portion.

[0006] According to an embodiment of the first aspect of the present application, the material of the pixel defining layer comprises an inorganic material.

[0007] According to any of the above embodiments of the first aspect of the present application, the material of the second encapsulation layer comprises an organic material.

[0008] According to any of the above embodiments of the first aspect of the present application, the material of the first sealing layer includes an inorganic material.

[0009] According to any of the above embodiments of the first aspect of the present application, the material of the pixel defining layer includes at least one of silicon oxide, silicon nitride, and silicon oxynitride.

[0010] According to any of the above embodiments of the first aspect of the present application, the pixel defining layer is a single film layer, or the pixel defining layer comprises a plurality of film layers arranged in a stack.

[0011] According to any of the above embodiments of the first aspect of the present application, the sealing layer further includes a third sealing layer located on the side of the second sealing layer away from the substrate, and the portion of the third sealing layer located in the non-display area extends from the second sealing layer and is in contact with and connected to the definition portion.

[0012] According to any of the above-described embodiments of the first aspect of the present application, the edge of the orthogonal projection of the second sealing layer on the substrate is located on the outer edge of the orthogonal projection of the substrate, on the side facing the display area.

[0013] According to any of the above embodiments of the first aspect of the present application, the orthogonal projection of the second encapsulation layer on the substrate lies within the orthogonal projection of the third encapsulation layer on the substrate.

[0014] According to any of the above embodiments of the first aspect of the present application, the material of the third encapsulation layer includes an inorganic material.

[0015] According to any of the above embodiments of the first aspect of the present application, the non-display area includes a dam provided on the substrate and located on a side of the pixel definition layer facing the substrate, the second sealing layer is located on a side of the dam facing the display area, and the definition portion and the third sealing layer extend on a side of the dam away from the display area.

[0016] According to any of the above embodiments of the first aspect of the present application, the defining portion and the third sealing layer are in contact with each other on the side of the dam away from the substrate.

[0017] According to any of the above embodiments of the first aspect of the present application, the dam includes an organic layer, the organic layer and the defining portion are in contact with each other, a first through hole is opened in the defining portion, and the orthogonal projection of the first through hole on the substrate is located within the orthogonal projection of the organic layer on the substrate.

[0018] According to any of the above-described embodiments of the first aspect of the present application, the plurality of first through holes are arranged at intervals along the extension direction of the dam.

[0019] According to any of the above embodiments of the first aspect of the present application, the substrate further includes signal lines, at least some of the signal lines being located on the side of the organic layer facing the substrate, second through holes being opened in the signal lines, and the orthogonal projection of the first through hole on the substrate being located within the orthogonal projection of the second through hole on the substrate.

[0020] According to any of the above embodiments of the first aspect of the present application, the signal line includes a first sublayer and a second sublayer located on a side of the first sublayer away from the substrate, the material of the first sublayer including aluminum, and the material of the second sublayer including titanium.

[0021] According to any of the above embodiments of the first aspect of the present application, the signal line further includes a third sublayer located on a side of the first sublayer away from the second sublayer, and the material of the third sublayer includes titanium.

[0022] According to any of the above embodiments of the first aspect of the present application, the substrate is further provided with an underlay layer on a side facing the signal line, and the material of the underlay layer includes an organic material.

[0023] According to any of the above embodiments of the first aspect of the present application, the light-emitting element further includes an isolation structure provided on a substrate, the isolation structure surrounding the isolation opening forming an isolation opening, the orthogonal projection of the isolation opening on the substrate at least partially overlapping with the orthogonal projection of the pixel opening on the substrate, the orthogonal projection of the isolation opening on the substrate being located within the orthogonal projection of the pixel opening on the substrate, and the first sealing layer including a plurality of sealing portions, each of which corresponds to a light-emitting unit located and sealed in each of the isolation openings.

[0024] According to any of the above embodiments of the first aspect of the present application, the display panel further includes a second electrode layer, the second electrode layer including a second electrode located on a side of each light-emitting unit away from the substrate, the second electrode being electrically connected to the isolation structure.

[0025] According to any of the above embodiments of the first aspect of the present application, an orthogonal projection of each isolation opening on the substrate is located within an orthogonal projection of each sealing portion on the substrate.

[0026] According to any of the above embodiments of the first aspect of the present application, there is a gap between adjacent sealing portions, and the gap is located on a side of the isolation structure away from the substrate.

[0027] According to any of the above embodiments of the first aspect of the present application, the isolation structure includes a first layer and a second layer located on a side of the first layer away from the substrate, and an orthogonal projection of the first layer on the substrate is located within an orthogonal projection of the second layer on the substrate.

[0028] According to any of the above embodiments of the first aspect of the present application, the material of the first layer comprises a conductive material.

[0029] According to any of the above embodiments of the first aspect of the present application, the isolation structure further includes a third layer located on a side of the first layer facing the substrate, and an orthogonal projection of the first layer on the substrate is located within an orthogonal projection of the third layer on the substrate.

[0030] According to any of the above-described embodiments of the first aspect of the present application, the non-display area is a frame area of the display panel.

[0031] An example of a first aspect of the present application further provides a display panel including a display area and a non-display area surrounding at least a portion of the display area, the display panel including a substrate, an emitting layer including a plurality of light-emitting units, and a sealing layer located on a side of the light-emitting layer away from the substrate, the sealing layer including a first sealing layer and a second sealing layer located on a side of the first sealing layer away from the light-emitting layer, the first sealing layer including a plurality of sealing portions located in the display area and covering the plurality of light-emitting units, and the second sealing layer covering the plurality of sealing portions.

[0032] According to any of the above embodiments of the first aspect of the present application, the orthogonal projections of the plurality of encapsulation layers on the substrate lie within the orthogonal projections of the second encapsulation layer on the substrate.

[0033] According to any of the above embodiments of the first aspect of the present application, the second sealing layer extends from the display area to the non-display area.

[0034] According to any of the above embodiments of the first aspect of the present application, the display panel includes a dam located in a non-display area, and the second sealing layer is located on the side of the dam facing the display area, or at least a portion of the second sealing layer extends from the display area to the side of the dam away from the display area.

[0035] According to any of the above embodiments of the first aspect of the present application, the dam includes an organic layer, the organic layer and the defining portion are in contact with each other, a first through hole is opened in the defining portion, and the orthogonal projection of the first through hole on the substrate is located within the orthogonal projection of the organic layer on the substrate.

[0036] According to any of the above embodiments of the first aspect of the present application, the display panel further includes a pixel definition layer provided on the substrate, the pixel definition layer including a pixel limiting portion located in the display area and a definition portion located in the non-display area, a plurality of pixel openings are opened in the pixel limiting portion, the light-emitting units are located in the pixel openings, and the definition portion and the second sealing layer are contact-connected on the side of the dam facing the display area.

[0037] According to any of the above embodiments of the first aspect of the present application, the defining portion extends away from the display area of the dam.

[0038] According to any of the above embodiments of the first aspect of the present application, the sealing layer further includes a third sealing layer located on the side of the second sealing layer away from the substrate, and the portion of the third sealing layer located in the non-display area extends to the second sealing layer and is in contact with and connected to the definition portion.

[0039] According to any of the above-described embodiments of the first aspect of the present application, the second sealing layer is located on the side of the dam facing the display area, and the defining portion and the third sealing layer are in contact with each other on the dam.

[0040] An embodiment of the second aspect of the present application further provides a display device including the display panel of any one of the embodiments of the first aspect.

[0041] In a display panel according to an embodiment of the present application, the display panel includes a substrate, a pixel defining layer, a light-emitting layer, and an encapsulating layer. The pixel defining layer includes a pixel defining portion located in the display area and a defining portion located in the non-display area. A pixel aperture is formed in the pixel defining portion of the display area, and a light-emitting unit is disposed within the pixel aperture to realize light emission in the display area of the display panel. The encapsulating layer includes a first encapsulating layer and a second encapsulating layer. The encapsulating portion of the first encapsulating layer is used to seal the light-emitting unit and reduce the impact of water and oxygen on the light-emitting unit's luminescence. The second encapsulating layer connects the non-display area and the defining portion of the pixel defining layer to each other. That is, the defining portion and the second encapsulating layer extend outside the first encapsulating layer to connect to each other outside the first encapsulating layer. This reduces the impact on the sealing performance due to the large contact area between the first encapsulating layer and the second encapsulating layer, which results in poor fluidity of the second encapsulating layer. Therefore, the embodiment of the present application can improve the sealing performance of the encapsulating layer and further improve the overall process performance of the display panel. [Brief explanation of the drawings]

[0042] Other features, objects, and advantages of the present application will become more apparent from the detailed description of the non-limiting embodiments with reference to the following drawings, in which the same or similar reference numerals represent the same or similar features. [Figure 1] 1 is a structural schematic diagram of a display panel according to an embodiment of the present application; [Figure 2] FIG. 2 is a cross-sectional view taken along line AA in FIG. [Figure 3] FIG. 3 is a partially enlarged structural schematic diagram of FIG. 2. [Figure 4] FIG. 2 is a cross-sectional view taken along line AA in FIG. 1 in another example. [Figure 5] FIG. 2 is a schematic structural diagram of a display panel according to another embodiment of the present application; DETAILED DESCRIPTION OF THE INVENTION

[0043] The following describes in detail the features and exemplary embodiments of each aspect of the present application. In the following detailed description, many specific details are provided to provide a thorough understanding of the present application. However, as will be apparent to those skilled in the art, the present application may be practiced without the need for some of these specific details. The following description of the embodiments is provided solely to provide an exemplary understanding of the present application. In the drawings and the following description, at least some well-known structures and techniques are not shown to avoid unnecessary ambiguity, and the dimensions of some structures may be exaggerated for clarity. Furthermore, the features, structures, or characteristics described below may be combined in any suitable manner into one or more embodiments.

[0044] In the description of this application, unless otherwise specified, the term "plurality" means two or more, and any orientation or positional relationship indicated by the terms "up," "down," "left," "right," "inside," "outside," etc. is merely for the purpose of simplifying the description and explanation of this application and does not indicate or imply that the referenced device or component must have a particular orientation or be constructed or operated in a particular orientation, and therefore should not be construed as a limitation on this application. Additionally, the terms "first," "second," etc. are merely for descriptive purposes and should not be construed as indicating or implying relative importance.

[0045] All directional terms used in the following description refer to the directions shown in the drawings and do not limit the specific structure of the embodiments of the present application. In the description of the present application, unless otherwise specified, the terms "attach" and "connect" should be understood in a broad sense, and may refer to, for example, fixed connection, detachable connection, integral connection, direct connection, or indirect connection. Those skilled in the art can understand the specific meaning of the above terms in the present application based on specific circumstances.

[0046] The display panel includes light-emitting units and a sealing layer that seals the light-emitting units. The sealing layer typically includes a first inorganic sealing layer, an organic sealing layer, and a second inorganic sealing layer. The organic sealing layer typically must be located within a region of the display panel that is surrounded by a dam. In related art, the organic sealing layer may overflow beyond the partial dam.

[0047] For reference, PCT / CN2023 / 134518, 202311499823.9, 202310707209.0, 202311346196.5, 202310692671.8, and 202311091555.7 disclose relevant contents of the isolation structure and the sealing layer.

[0048] The applicant's research has found that because the material of the first inorganic sealing layer is usually SiOx and the main component of the organic sealing layer is an organic small molecule, the O bonds in SiOx can cross-link with the valence bonds in the organic sealing layer, increasing the fluidity of the organic sealing layer. The organic sealing layer is prone to overflowing the innermost dam and overflowing between the innermost and outermost dams, reducing the sealing length and reducing the yield of the sealing layer.

[0049] In order to improve the above-mentioned problems, the present invention is presented. For a better understanding of the present invention, a display panel and a display device according to an embodiment of the present invention will be described in detail below with reference to FIGS.

[0050] 1 to 3, FIG. 1 is a structural schematic diagram of a display panel according to an embodiment of the present invention, FIG. 2 is a cross-sectional view taken along line AA in FIG. 1, and FIG. 3 is a partially enlarged structural schematic diagram of FIG.

[0051] As shown in Figures 1 to 3, an embodiment of a first aspect of the present application provides a display panel, which includes a display area AA and a non-display area NA surrounding at least a part of the display area AA, and the display panel includes a substrate 100, a pixel definition layer 200 provided on the substrate 100, an emitting layer 300, and a sealing layer 400. The pixel definition layer 200 includes a pixel limiting portion 210 located in the display area AA and a defining portion 220 located in the non-display area NA. The pixel limiting portion 210 has a plurality of pixel openings 230. The light-emitting layer 300 includes light-emitting units 310 located in the pixel openings 230. The encapsulating layer 400 is located on the side of the light-emitting layer 300 away from the substrate 100. The encapsulating layer 400 includes a first encapsulating layer 410 and a second encapsulating layer 420 located on the side of the first encapsulating layer 410 away from the light-emitting layer 300. The first encapsulating layer 410 is located in the display area AA and encapsulates the light-emitting units 310. At least a portion of the second encapsulating layer 420 extends to the non-display area NA and is in contact with the defining portion 220.

[0052] In the display panel according to the embodiment of the present application, the display panel includes a substrate 100, a pixel defining layer 200, an emitting layer 300, and an encapsulating layer 400. The pixel defining layer 200 includes a pixel defining portion 210 located in the display area AA and a defining portion 220 located in the non-display area NA. A pixel opening 230 is formed in the pixel defining portion 210 of the display area AA, and a light-emitting unit 310 is disposed within the pixel opening 230 to realize light emission in the display area AA of the display panel. The encapsulating layer 400 includes a first encapsulating layer 410 and a second encapsulating layer 420. The encapsulating portion 411 of the first encapsulating layer 410 seals the light-emitting unit 310 and prevents the intrusion of water or oxygen from affecting the light-emitting effect of the light-emitting unit 310. The second encapsulating layer 420 is in contact with the defining portion 220 of the pixel defining layer 200 in the non-display area NA, i.e., the defining portion 220 and the second encapsulating layer 420 extend outside the first encapsulating layer 410 and are in contact with each other outside the first encapsulating layer 410. This improves the sealing performance of the second encapsulating layer 420, which would be affected by a large contact area between the first encapsulating layer 410 and the second encapsulating layer 420 due to its good fluidity. Therefore, the present embodiment can improve the sealing performance of the encapsulating layer 400 and further improve the overall process performance of the display panel.

[0053] The substrate 100 may be provided in various ways. The substrate 100 may include a base and a first conductive layer, a second conductive layer, and a third conductive layer stacked on the base. An insulating layer is provided between adjacent conductive layers. Exemplarily, a pixel driving circuit is provided within the substrate 100, and the pixel driving circuit includes a transistor and a storage capacitor. The transistor includes a semiconductor, a gate, a source, and a drain. The storage capacitor includes a first electrode plate and a second electrode plate. For example, the gate and the first electrode plate may be located on the first conductive layer, the second electrode plate may be located on the second conductive layer, and the source and drain may be located on the third conductive layer.

[0054] Optionally, a first electrode layer 700 is provided on the substrate 100, and the first electrode layer 700 includes a plurality of first electrodes 710 with a spacing distribution, and the orthogonal projection of each first electrode 710 on the substrate 100 at least partially overlaps with the orthogonal projection of each pixel opening 230 on the substrate 100, thereby allowing each first electrode 710 to drive the light-emitting unit 310 located within the pixel opening 230 to emit light.

[0055] The non-display area NA may be formed in various ways, for example, as a light-transmitting hole area, which allows ambient light to pass through and transmit ambient light information to the photosensitive element. Alternatively, the non-display area NA may be a frame area of the display panel. The frame area has a large size, and the frame length of the encapsulating layer 400 in the frame area is longer. The defining portion 220 and the second encapsulating layer 420 are in contact with each other in the frame area, which can improve the encapsulating performance of the encapsulating layer 400.

[0056] The material of the pixel definition layer 200 may be applied in various ways, and may include organic materials.

[0057] Alternatively, in some other optional embodiments, the material of the pixel defining layer 200 may further include an inorganic material so that the pixel defining layer 200 has good density. That is, the material of the defining portion 220 includes an inorganic material so that the defining portion 220 has good density.

[0058] Optionally, the material of the pixel definition layer 200 includes silicon nitride (SiNx), silicon oxide (SiOx), silicon oxynitride (SiON).

[0059] Alternatively, the pixel defining layer 200 may be a single film layer, or the pixel defining layer 200 may include multiple film layers stacked on top of each other, i.e., the pixel defining layer 200 may be formed by stacking multiple film layers.

[0060] Alternatively, the pixel definition layer 200 is formed at a temperature of 150° C. or higher, which results in a denser film than the first sealing layer 410, and therefore a relatively small amount of free O bonds, which provides a certain buffering effect against overflow of the second sealing layer 420.

[0061] Alternatively, the material of the first sealing layer 410 may include an inorganic material, i.e., the material of each sealing portion 411 may include an inorganic material, so that the sealing portion 411 has good compactness and can provide better compact protection for each light-emitting unit 310.

[0062] Optionally, the material of the second encapsulation layer 420 includes an organic material, which allows the second encapsulation layer 420 to have a large thickness and adjust the flatness of the entire surface of the encapsulation layer 400 .

[0063] In some optional embodiments, the sealing layer 400 further includes a third sealing layer 430 located on the side of the second sealing layer 420 away from the substrate 100, and the portion of the third sealing layer 430 located in the non-display area NA extends from the second sealing layer 420 and is in contact with and connected to the definition portion 220.

[0064] In these optional embodiments, the sealing layer 400 further includes a third sealing layer 430, which extends from the second sealing layer 420 in the non-display area NA, i.e., the size of the third sealing layer 430 is larger than the size of the second sealing layer 420, and the third sealing layer 430 is in contact with and connected to the defining portion 220 outside the second sealing layer 420, which can improve the overall sealing performance of the sealing layer 400.

[0065] Optionally, the edge of the second sealing layer 420, as orthographically projected onto the substrate 100, is located on the outer edge of the defining portion 220, as orthographically projected onto the substrate 100, facing the display area AA. That is, the edge of the defining portion 220 extends from the second sealing layer 420 along the direction from the display area AA to the non-display area NA, and the defining portion 220 can hermetically connect the outside of the second sealing layer 420 to the third sealing layer 430. That is, a part of the defining portion 220 and the second sealing layer 420 are in contact with each other, and another part of the defining portion 220 and the third sealing layer 430 are in contact with each other, thereby increasing the contact area between the defining portion 220 and the second sealing layer 420 and the third sealing layer 430 and further improving the sealing effect of the sealing layer 400.

[0066] Optionally, the orthogonal projection of the second encapsulation layer 420 on the substrate 100 is located within the orthogonal projection of the third encapsulation layer 430 on the substrate 100. That is, the size of the third encapsulation layer 430 is larger than the size of the second encapsulation layer 420, and the third encapsulation layer 430 provides a longer sealing length, which can further improve the sealing effect of the encapsulation layer 400.

[0067] Optionally, the material of the third encapsulation layer 430 includes an inorganic material, so that the third encapsulation layer 430 has a better densification effect and can improve the sealing performance of the entire encapsulation layer 400 .

[0068] In some alternative embodiments, the non-display area NA includes a dam 110 provided on the substrate 100 and positioned on the side of the pixel definition layer 200 facing the substrate 100, a second sealing layer 420 positioned on the side of the dam 110 facing the display area AA, and the definition portion 220 and the third sealing layer 430 extending on the side of the dam 110 away from the display area AA.

[0069] In these optional embodiments, the second sealing layer 420 is located on the side of the dam 110 facing the display area AA, the second sealing layer 420 is positioned and controlled within the area surrounded by the dam 110, and the third sealing layer 430 and the definition section 220 extend to the side of the dam 110 away from the display area AA, i.e., the third sealing layer 430 and the definition section 220 extend to the outside of the dam 110, thereby increasing the sealing length and improving the sealing yield.

[0070] Optionally, the defining portion 220 and the third sealing layer 430 are contact-connected at the dam 110, i.e., the defining portion 220 and the third sealing layer 430 are contact-connected on the side of the dam 110 away from the substrate 100, and the height of the dam 110 is usually high, so that a high step can be increased by the dam 110. The defining portion 220 and the third sealing layer 430 are contact-connected at a high position of the step, which can further improve the sealing yield.

[0071] In some alternative embodiments, the dam 110 includes an organic layer 111, the organic layer 111 and the defining portion 220 are in contact with each other, a first through-hole 240 is opened in the defining portion 220, and the orthogonal projection of the first through-hole 240 on the substrate 100 is located within the orthogonal projection of the organic layer 111 on the substrate 100.

[0072] In these alternative embodiments, the organic layer 111 in the dam 110 and the defining portion 220 are in direct contact with each other, and the organic layer 111 may generate gas during the manufacturing process. The defining portion 220 has a first through-hole 240 formed therein, and the orthogonal projection of the first through-hole 240 on the substrate 100 is located within the orthogonal projection of the organic layer 111 on the substrate 100. That is, at least a portion of the organic layer 111 is exposed through the first through-hole 240. This allows gas generated in the organic layer 111 to overflow through the first through-hole 240, thereby alleviating the peeling phenomenon of the film layers caused by gas accumulation between the organic layer 111 and the defining portion 220 and further improving the sealing effect of the sealing layer 400.

[0073] Optionally, the substrate 100 is provided with a planarization layer 140. When fabricating the planarization layer 140, the material in the area of the dam 110 can be reserved to form an organic layer 111, thereby increasing the height of the dam 110. That is, the organic layer 111 can be provided in the same layer as the planarization layer 140, simplifying the manufacturing process of the display panel and increasing the height of the dam 110.

[0074] Optionally, the substrate 100 may further include multiple conductive layers, with insulating layers provided between the multiple conductive layers. When manufacturing the insulating layers, some of the material in the dam 110 may be reserved to form the organic layer 111, i.e., the insulating layer and the organic layer 111 are formed in the same layer and made of the same material.

[0075] Optionally, the material of the organic layer 111 includes an organic material. By increasing the thickness of the organic layer 111, the height of the dam 110 can be increased.

[0076] The number of first through-holes 240 may be one or more, and the multiple first through-holes 240 may be distributed at intervals along the extension direction of the dam 110. By providing multiple first through-holes 240, gas can be released from different positions in the organic layer 111, and the problem of easy peeling of the film layer between the organic layer 111 and the defining portion 220 can be improved.

[0077] Alternatively, the number of dams 110 may be one, and one dam 110 is in the form of a closed loop surrounding the display area AA.

[0078] Alternatively, the number of dams 110 may be two or more, and two or more dams 110 may be nested one inside the other. Each dam 110 is provided with a first through-hole 240, that is, the organic layer 111 of each dam 110 is provided corresponding to the first through-hole 240, thereby improving the problem of easy peeling of the film layer between the organic layer 111 and the defining portion 220.

[0079] In some alternative embodiments, as shown in FIG. 4 , the substrate 100 further includes signal lines 120, at least some of which are located on the side of the organic layer 111 facing the substrate 100, and a second through hole 121 is opened in the signal line 120, and the orthogonal projection of the first through hole 240 on the substrate 100 is located within the orthogonal projection of the second through hole 121 on the substrate 100.

[0080] In these alternative embodiments, a second through hole 121 is also opened in the signal line 120, and the orthogonal projection of the first through hole 240 on the substrate 100 is located within the orthogonal projection of the second through hole 121 on the substrate 100, i.e., the size of the first through hole 240 is smaller than the size of the second through hole 121, and the partial definition portion 220 extends into the second through hole 121 to direct the signal line 120 toward the inner wall surface of the second through hole 121 and provide protection for the signal line 120.

[0081] Alternatively, the signal line 120 may be provided so as to intersect with the dams 110 in the direction from the display area AA to the non-display area NA, or the signal line 120 may be provided in parallel with some of the dams 110 .

[0082] Alternatively, the signal line 120 may be a power supply signal line 120. For example, the signal line 120 may be used to transmit a low-level voltage signal, or the signal line 120 may be used to transmit a driving power supply voltage signal.

[0083] Alternatively, the signal line 120 may be a single film layer, or may include multiple conductive layers stacked together. For example, the signal line 120 may include a first sublayer and a second sublayer stacked together, where the second sublayer is located on the side of the first sublayer away from the substrate 100, and the material of the first sublayer may be aluminum and the material of the second sublayer may be titanium. Alternatively, the signal line 120 may further include a third sublayer located on the side of the first sublayer away from the second sublayer, and the material of the third sublayer may be titanium.

[0084] Optionally, the signal line 120 may include an underlay layer 130 facing the substrate 100, and the material of the underlay layer 130 may include an organic material. During the manufacturing process, the thickness of the organic layer 111 above the signal line 120 is reduced due to the fluidity of the organic material during application and patterning. For the defining portion 220 including an inorganic material, the etching gas may contain elemental oxygen gas during the etching process. The elemental oxygen gas may etch the thin organic layer 111, potentially causing a bare leak in the second sublayer. For the defining portion 220 including an inorganic material, the etching gas may contain elemental fluorine gas. The elemental fluorine gas may react with titanium to damage the second sublayer, potentially causing a bare leak in the first sublayer. For the first sublayer, the material may contain aluminum, which may react with elemental oxygen to form a larger volume of aluminum oxide, further degrading the sealing due to the isolation of the film layers.

[0085] In the embodiment of the present application, all areas where the signal lines 120 are present are covered by the defining portions 220, which reduces the probability that the signal lines 120 will be etched and deformed or react with oxygen elements, and further improves the yield of sealing.

[0086] 5 , the display panel further includes an isolation structure 500, which is disposed on the substrate 100 and surrounds an isolation opening 510, and the orthogonal projection of the isolation opening 510 on the substrate 100 at least partially overlaps with the orthogonal projection of the pixel opening 230 on the substrate 100. The orthogonal projection of the isolation opening 510 on the substrate 100 is located within the orthogonal projection of the pixel opening 230 on the substrate 100. The first encapsulating layer 410 includes a plurality of encapsulating portions 411, each of which is used to encapsulate a light-emitting unit 310 located in a corresponding isolation opening 510.

[0087] In these alternative embodiments, the isolation structure 500 allows the light-emitting material to be divided into multiple light-emitting units 310 located independently in each isolated opening 510, thereby eliminating the need for a precision mask plate deposition process and simplifying the display panel manufacturing process. The orthogonal projection of the isolated opening 510 on the substrate 100 and the orthogonal projection of the pixel opening 230 on the substrate 100 at least partially overlap, allowing the light-emitting units 310 to be located in both the isolated opening 510 and the pixel opening 230 at the same time. Each encapsulant 411 is used to encapsulate the light-emitting units 310 located in each isolated opening 510, improving the encapsulation performance of each light-emitting unit 310.

[0088] Optionally, the orthogonal projection of the pixel opening 230 on the substrate 100 is located within the orthogonal projection of the isolation opening 510 on the substrate 100, i.e., the size of the isolation opening 510 is larger than the size of the pixel opening 230, thereby allowing more light-emitting material to fall into the pixel opening 230.

[0089] Optionally, the display panel further includes a second electrode layer 800, which includes a second electrode 810 located on a side of each light-emitting unit 310 away from the substrate 100, and the second electrode 810 interacts with the first electrode 710 to drive the light-emitting unit 310 to emit light. Optionally, the material of the isolation structure 500 includes a conductive material, and the second electrode 810 and the isolation structure 500 are in contact with each other, so that the second electrode 810 is connected to the entire surface electrode by the isolation structure 500.

[0090] Optionally, each sealing portion 411 is located on the side of each second electrode 810 away from the substrate 100 , and the sealing portion 411 can provide protection for each second electrode 810 .

[0091] Optionally, the orthogonal projection of each second electrode 810 on the substrate 100 is located within the orthogonal projection of each sealing portion 411 on the substrate 100, i.e., the size of the sealing portion 411 is larger than the size of the second electrode 810, so that the sealing portion 411 can provide better protection for the second electrode 810.

[0092] Alternatively, the orthogonal projection of each isolation opening 510 on the substrate 100 may be located within the orthogonal projection of each sealing portion 411 on the substrate 100, i.e., the size of the sealing portion 411 may be large, and the sealing portion 411 may extend to the surface of the isolation structure 500 away from the substrate 100 to provide better sealing performance.

[0093] Optionally, there is a gap between adjacent sealing portions 411, and the gap is located on the side of the isolation structure 500 away from the substrate 100, that is, multiple sealing portions 411 are provided independently of each other.

[0094] The isolation structure 500 may be provided in various ways, for example, the isolation structure 500 may be a single-layer structure, and may include a first surface facing the substrate 100 and a second surface away from the substrate 100, with the orthogonal projection of the first surface on the substrate 100 being located within the orthogonal projection of the second surface on the substrate 100. That is, the size of the first surface is smaller than the size of the second surface, allowing a recessed structure to be formed below the second surface, and when the light-emitting units 310 are subsequently manufactured, the light-emitting material will be fractured at the edge of the second surface into a plurality of independent light-emitting units 310.

[0095] Alternatively, in another embodiment, the isolation structure 500 includes a first layer 520 and a second layer 530 stacked one on the other, with the second layer 530 located on the side of the first layer 520 away from the substrate 100, and the orthogonal projection of the first layer 520 on the substrate 100 being located within the orthogonal projection of the second layer 530 on the substrate 100. That is, the dimensions of the first layer 520 are smaller than the dimensions of the second layer 530, thereby forming a recessed structure below the second layer 530, and during subsequent manufacturing of the light-emitting units 310, the light-emitting material is broken at the edges of the second layer 530 into a plurality of independent light-emitting units 310.

[0096] Optionally, the first layer 520 includes a conductive material and is in contact with and connected to the second electrodes 810 so that the second electrodes 810 can be interconnected to the overall electrode through the first layer 520.

[0097] Optionally, the material of the second layer 530 includes a conductive material, and the material of the second layer 530 is different from the material of the first layer 520. In these optional embodiments, the material of the second layer 530 includes a conductive material, which can increase the distribution area of the conductive structure and reduce the overall electrical resistance of the second electrode 810. Because the materials of the second layer 530 and the first layer 520 are different and the different materials have different etching rates when reacted with the same etchant, it is easy to form the first layer 520 and the second layer 530 with different sizes.

[0098] Optionally, the isolation structure 500 further includes a third layer 540 located on the side of the first layer 520 facing the substrate 100, and the orthogonal projection of the first layer 520 on the substrate 100 is located within the orthogonal projection of the third layer 540 on the substrate 100. When the isolation structure 500 is formed by side-etching the first layer 520, the third layer 540 provides a protective effect and reduces the influence of etching on the film layer on the substrate 100 side of the third layer 540.

[0099] An embodiment of the first aspect of the present application further provides a display panel, the display panel having a display area AA and a non-display area NA surrounding at least a part of the display area AA, the display panel including a substrate 100, an emitting layer 300 including a plurality of light-emitting units 310, and a sealing layer 400 located on a side of the light-emitting layer 300 away from the substrate 100, the sealing layer 400 including a first sealing layer 410 and a second sealing layer 420 located on a side of the first sealing layer 410 away from the light-emitting layer 300, the first sealing layer 410 being located in the display area AA and including a plurality of sealing portions 411 corresponding to the plurality of light-emitting units 310, and the second sealing layer 420 covering the plurality of sealing portions 411.

[0100] In the display panel according to the embodiment of the present application, the display panel includes a substrate 100, a light-emitting layer 300, and an encapsulating layer 400. The encapsulating layer 400 includes a first encapsulating layer 410 and a second encapsulating layer 420. The encapsulating portions 411 of the first encapsulating layer 410 are used to encapsulate the light-emitting units 310 and prevent the intrusion of water or oxygen from affecting the light-emitting efficiency of the light-emitting units 310. The second encapsulating layer 420 is large enough to cover the multiple encapsulating portions 411, thereby improving the sealing performance of the encapsulating layer 400.

[0101] Alternatively, the arrangement of the substrate 100, the pixel defining layer 200, the light emitting layer 300, the encapsulating layer 400 and the dam 110 has been described above, and therefore will not be described again.

[0102] For example, the orthogonal projections of the plurality of sealing portions 411 on the substrate 100 are located within the orthogonal projections of the second sealing layer 420 on the substrate 100, and the size of the second sealing layer 420 is large enough to cover the plurality of sealing portions 411, thereby improving the sealing performance of the sealing layer 400. Optionally, the second sealing layer 420 can extend from the display area AA to the non-display area NA, thereby improving the coverage of the second sealing layer 420.

[0103] Optionally, the display panel 10 includes a dam 110 located in the non-display area NA, and the second sealing layer 420 is located on a side of the dam 110 facing the display area, and the position of the second sealing layer 420 can be controlled within the dam 110 via the dam 110. Optionally, at least a portion of the second sealing layer 420 extends from the display area AA to a side of the dam 110 away from the display area AA, and the second sealing layer 420 may overflow onto the side of the dam 110 away from the display area AA.

[0104] In some alternative embodiments, the display panel 10 further includes a pixel definition layer 200 disposed on the substrate 100, the pixel definition layer 200 including a pixel limiting portion 210 located in the display area AA and a definition portion 220 located in the non-display area NA, the pixel limiting portion 210 has a plurality of pixel openings 230, the light-emitting units 310 are located in the pixel openings 230, and the definition portion 220 and the second sealing layer 420 are contact-connected on the side of the dam 110 facing the display area AA.

[0105] In these embodiments, the first sealing layer 410 and the dam 110 are spaced apart, and there is a gap between the first sealing layer 410 and the dam 110, and the second sealing layer 420 and the defining portion 220 may be in contact with each other in the gap, thereby improving the sealing performance of the second sealing layer 420 due to the good fluidity of the second sealing layer 420 caused by the contact area between the first sealing layer 410 and the second sealing layer 420 being too large.

[0106] Optionally, as described above, the dam 110 includes an organic layer 111, the organic layer 111 and the defining portion 220 are in contact with each other, a first through-hole 240 is opened in the defining portion 220, and the orthogonal projection of the first through-hole 240 on the substrate 100 is located within the orthogonal projection of the organic layer 111 on the substrate 100.

[0107] In these alternative embodiments, the organic layer 111 in the dam 110 is in direct contact with the defining portion 220, and the organic layer 111 may generate gas during the manufacturing process. The defining portion 220 has the first through-hole 240, and the orthogonal projection of the first through-hole 240 on the substrate 100 is located within the orthogonal projection of the organic layer 111 on the substrate 100, i.e., at least a portion of the organic layer 111 is exposed through the first through-hole 240. This allows the gas generated in the organic layer 111 to overflow through the first through-hole 240, thereby alleviating the delamination phenomenon caused by gas accumulation between the organic layer 111 and the defining portion 220 and further improving the sealing effect of the sealing layer 400.

[0108] In some alternative embodiments, the defining portion 220 extends to the side of the dam 110 away from the display area AA. The distribution area of the defining portion 220 can be increased, and the contact area between the defining portion 220 and the second sealing layer 420 can be increased.

[0109] In some optional embodiments, the sealing layer 400 further includes a third sealing layer 430 located on the side of the second sealing layer 420 away from the substrate 100, and the portion of the third sealing layer 430 located in the non-display area NA extends from the second sealing layer 420 and is in contact with and connected to the definition portion 220.

[0110] In these optional embodiments, the sealing layer 400 further includes a third sealing layer 430, which extends from the second sealing layer 420 in the non-display area NA, i.e., the size of the third sealing layer 430 is larger than the size of the second sealing layer 420, and the third sealing layer 430 is in contact with and connected to the defining portion 220 outside the second sealing layer 420, thereby improving the overall sealing performance of the sealing layer 400.

[0111] Optionally, the second sealing layer 420 is located on the side of the dam 110 facing the display area AA, and the defining portion 220 and the third sealing layer 430 are contact-connected at the dam 110. That is, the defining portion 220 and the third sealing layer 430 are contact-connected on the side of the dam 110 away from the substrate 100, and the height of the dam 110 is usually high, so that the high step can be increased by the dam 110. The defining portion 220 and the third sealing layer 430 are contact-connected at a high position of the step, which can further improve the mounting yield.

[0112] An embodiment of the second aspect of the present application further provides a display device including the display panel according to any one of the embodiments of the first aspect. Since the display device according to the embodiment of the second aspect of the present application includes the display panel according to any one of the embodiments of the first aspect, the display device according to the embodiment of the second aspect of the present application has the beneficial effects of the display panel according to any one of the embodiments of the first aspect, and further description thereof will be omitted here.

[0113] Display devices in embodiments of the present application include, but are not limited to, devices with display capabilities such as mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, gates, smart landlines, and consoles.

[0114] While the present disclosure has been described above using preferred embodiments, various improvements and modifications are possible without departing from the spirit and scope of the present application. In particular, the technical features described in each embodiment may be arbitrarily combined as long as there is no structural contradiction. The present application is not limited to the specific embodiments disclosed above, but includes all aspects encompassed by the claims. [Explanation of symbols]

[0115] 100 boards 110 Dam 111 Organic layer 120 signal line 121 Second through hole 130 Underlayment layer 140 Planarization layer 200 pixel definition layer 210 Pixel Limited Section 220 Definition part 230 pixel aperture 240 First through hole 300 luminescent layer 310 Light Emitting Unit 400 sealing layer 410 First sealing layer 411 Sealing part 420 Second sealing layer 430 Third sealing layer 500 isolation structure 510 Isolation opening 520 1st layer 530 2nd layer 540 3rd layer 700 1st electrode layer 710 1st electrode 800 2nd electrode layer 810 2nd electrode AA display area NA Non-display area

Claims

1. A display panel including a display area and a non-display area surrounding at least a part of the display area, A substrate; a pixel definition layer including a pixel definition portion located in the display area and having a plurality of pixel openings, and a definition portion located in the non-display area; a light-emitting layer including a light-emitting unit located at the pixel opening; a sealing layer located on a side of the light-emitting layer away from the substrate, the sealing layer includes a first sealing layer and a second sealing layer located on a side of the first sealing layer away from the light-emitting layer, the first sealing layer includes a sealing portion located in the display area and sealing the light-emitting unit, and at least a portion of the second sealing layer extends to the non-display area and is in contact with and connected to the defining portion. A display panel characterized by:

2. the material of the pixel defining layer comprises an inorganic material; a material of the second sealing layer including an organic material; a material of the first sealing layer including an inorganic material; the material of the pixel defining layer includes at least one of silicon oxide, silicon nitride, and silicon oxynitride; the pixel definition layer is a single film layer, or the pixel definition layer includes a plurality of film layers stacked one on top of the other; the non-display area is a frame area of the display panel; 2. The display panel according to claim 1, wherein:

3. the sealing layer further includes a third sealing layer located on a side of the second sealing layer away from the substrate, a portion of the third sealing layer located in the non-display area extending to the second sealing layer and being in contact with the defining portion; an edge of the second sealing layer in orthogonal projection on the substrate is located on a side facing the display area at an outer edge of the definition portion in orthogonal projection on the substrate, an orthogonal projection of the second encapsulation layer on the substrate is located at an orthogonal projection of the third encapsulation layer on the substrate; a material of the third sealing layer including an inorganic material; a dam provided on the substrate and located on a side of the pixel definition layer facing the substrate is provided in the non-display area, the second sealing layer is located on a side of the dam facing the display area, and the definition portion and the third sealing layer extend on a side of the dam away from the display area; the defining portion and the third sealing layer are in contact with each other on a side of the dam away from the substrate, the dam includes an organic layer, the organic layer and the defining portion are in contact with each other, a first through-hole is formed in the defining portion, and an orthogonal projection of the first through-hole on the substrate is located at an orthogonal projection of the organic layer on the substrate; the plurality of first through holes are provided at intervals along the extension direction of the dam, signal lines are further provided on the substrate, at least a portion of the signal lines are located on a side of the organic layer facing the substrate, second through holes are formed in the signal lines, and an orthogonal projection of the first through hole on the substrate is located at an orthogonal projection of the second through hole on the substrate; the signal line includes a first sublayer and a second sublayer located on a side of the first sublayer away from the substrate, the first sublayer being made of aluminum and the second sublayer being made of titanium; the signal line further includes a third sublayer located on a side of the first sublayer away from the second sublayer, the material of the third sublayer including titanium; an underlay layer is further provided on the substrate, the underlay layer being located on a side of the signal line facing the substrate, and the material of the underlay layer includes an organic material; 2. The display panel according to claim 1, wherein:

4. the substrate further includes an isolation structure provided on the substrate, the isolation structure surrounding the isolation opening being formed, and an orthogonal projection of the isolation opening on the substrate and an orthogonal projection of the pixel opening on the substrate at least partially overlap each other; an orthogonal projection of the isolation opening on the substrate is located within an orthogonal projection of the pixel opening on the substrate; the first sealing layer includes a plurality of sealing portions, each sealing portion sealing the light emitting unit located in each of the isolation openings; the display panel further includes a second electrode layer, the second electrode layer including a second electrode located on a side of each of the light-emitting units away from the substrate, the second electrode and the isolation structure being electrically connected; an orthogonal projection of each of the isolation openings on the substrate is located at an orthogonal projection of each of the sealing portions on the substrate; a gap exists between adjacent sealing portions, the gap being located on a side of the isolation structure away from the substrate; the isolation structure includes a first layer and a second layer located on a side of the first layer away from the substrate, and an orthogonal projection of the first layer on the substrate is located at an orthogonal projection of the second layer on the substrate; the material of the first layer includes a conductive material; the isolation structure further includes a third layer located on a side of the first layer facing the substrate, and an orthogonal projection of the first layer on the substrate is located within an orthogonal projection of the third layer on the substrate.

2. The display panel according to claim 1, wherein:

5. A display panel including a display area and a non-display area surrounding at least a part of the display area, A substrate; an emitting layer including a plurality of emitting units; a sealing layer located on a side of the light-emitting layer away from the substrate, the sealing layer includes a first sealing layer and a second sealing layer located on a side of the first sealing layer away from the light-emitting layer, the first sealing layer includes a plurality of sealing portions located in the display region and covering the plurality of light-emitting units, and the second sealing layer covers the plurality of sealing portions. A display panel characterized by:

6. orthogonal projections of the plurality of sealing portions on the substrate are located at orthogonal projections of the second sealing layer on the substrate; the second sealing layer extends from the display area to the non-display area; 6. The display panel according to claim 5, wherein:

7. the display panel includes a dam located in the non-display area, and the second sealing layer is located on a side of the dam facing the display area, or at least a portion of the second sealing layer extends from the display area to a side of the dam away from the display area.

7. The display panel according to claim 6, wherein:

8. the display panel further includes a pixel definition layer disposed on the substrate, the pixel definition layer including a pixel limiting portion located in the display area and a definition portion located in the non-display area, the pixel limiting portion having a plurality of pixel openings, the light-emitting units being located in the pixel openings, the definition portion and the second sealing layer being in contact with each other on a side of the dam facing the display area, the defining portion extends the dam away from the display area; the dam includes an organic layer, the organic layer and the defining portion are in contact with each other, a first through-hole is formed in the defining portion, and an orthogonal projection of the first through-hole on the substrate is located within an orthogonal projection of the organic layer on the substrate.

8. The display panel according to claim 7, wherein:

9. the sealing layer further includes a third sealing layer located on a side of the second sealing layer away from the substrate, a portion of the third sealing layer located in the non-display area extending to the second sealing layer and being in contact with the defining portion; the second sealing layer is located on a side of the dam facing the display area, and the definition portion and the third sealing layer are in contact with each other at the dam.

9. The display panel according to claim 8, wherein the display panel comprises:

10. A display device comprising the display panel according to claim 1 .

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