Optical processing method and optical processing device

Abstract

To provide an optical processing device and an optical processing method which can follow distortion of a workpiece without depending on scanning speed, and can process a fine pattern with high accuracy and high efficiency.SOLUTION: There is provided an optical processing method performed by an optical processing device including a light source, an optical element for converging light emitted from the light source to a workpiece, a nozzle for passing therethrough a light flux converged by the optical element, and a mounting part having a mounting surface for mounting the workpiece thereon. The nozzle has a diaphragm member having an opening passing therethrough at least a part of the light flux on an end opposite to the mounting surface. The diaphragm member has an elastic part which has a convex arc shape toward the mounting surface in a state in which external force does not act thereon, and is elastically deformable in a direction crossing the mounting surface. When the workpiece is processed, the elastic part is elastically deformed by pressing the diaphragm member against the workpiece, and the light flux is emitted to the workpiece from the nozzle, while relatively moving the nozzle to the workpiece while pressing the workpiece by the elastic force of the elastic part.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an optical processing method and an optical processing apparatus. [Background technology]

[0002] Conventionally, a method for processing a workpiece into a predetermined shape by irradiating the workpiece with a laser through a mask has been known. For example, Patent Document 1 discloses a technique for forming a pattern on a thin film that covers a substrate by irradiating the thin film with an excimer laser through a mask pattern. On the other hand, Patent Document 2 discloses a technique for forming a substrate pattern while suppressing peeling of the thin film that covers the substrate, in which a laser is irradiated while a floating nozzle is pressed against the workpiece with the wind pressure of an assist gas. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 63-42128 [Patent Document 2] Japanese Patent Application Publication No. 9-192871 Summary of the Invention [Problem to be solved by the invention]

[0004] However, with both technologies, when processing with an accuracy of less than 0.1 mm, there is a possibility that processing errors will occur due to variations in the work distance caused by distortion of the substrate. In Patent Document 2, although the floating nozzle is pressed against the workpiece with a generally constant force by wind pressure, if the workpiece has a large distortion, a high processing speed (scanning speed) may not be able to follow the distortion, resulting in processing errors. As a result, there is a limit to the scanning speed. The present invention has been made in consideration of these problems, and its purpose is to provide an optical processing device and an optical processing method that can follow the distortion of the workpiece regardless of the scanning speed and process micropatterns with high precision and high efficiency. [Means for solving the problem]

[0005] The present invention provides A light source and an optical element that focuses the light emitted from the light source onto a workpiece; a nozzle through which the light beam focused by the optical element passes; a mounting portion having a mounting surface on which the workpiece is mounted, and the optical processing device performs processing on a processing surface of the workpiece by irradiating the workpiece with the light beam from the nozzle while moving the nozzle and the workpiece relatively in a first direction parallel to the mounting surface, the nozzle has a diaphragm member at an end facing the placement surface, the diaphragm member having an opening for passing at least a part of the light beam; The aperture member is an optical processing device characterized in that, in a cross section perpendicular to a second direction perpendicular to the first direction and parallel to the mounting surface, it has an arc-shaped convex shape toward the mounting surface when no external force is acting, and has an elastic portion that can elastically deform in a third direction that intersects the mounting surface. [Effects of the Invention]

[0006] According to the present invention, it is possible to provide an optical processing apparatus and an optical processing method that can follow the distortion of a workpiece regardless of the scanning speed and process a minute pattern with high precision and high efficiency. [Brief explanation of the drawings]

[0007] [Figure 1] 1 is a schematic diagram of an optical processing device according to a first embodiment. [Figure 2] FIG. 2 is a perspective view showing a nozzle unit according to the first embodiment. [Figure 3] 4 is a cross-sectional view showing a state in which the nozzle unit according to the first embodiment is deformed. FIG. [Figure 4] 4 is a cross-sectional view showing how the nozzle unit according to the first embodiment follows the distortion of the workpiece. FIG. [Figure 5] FIG. 10 is a cross-sectional view showing a nozzle unit according to a second embodiment. [Figure 6] 10 is a three-dimensional view showing an example of the surface of the aperture member according to Example 2. FIG. [Figure 7] 10 is a diagram showing fluctuations in the distance between the aperture member and the workpiece according to Comparative Example 1. FIG. [Figure 8] 10 is a diagram showing fluctuations in the focus of a light beam and the position of a workpiece according to Comparative Example 2. FIG. [Figure 9] FIG. 10 is a diagram showing a configuration example for increasing the pressing force of the drawing member against the workpiece according to the first and second embodiments. [Figure 10] 10 is a table showing evaluations of machining of workpieces when configurations according to examples and comparative examples are used. [Figure 11] 10A and 10B are diagrams showing results of machining a workpiece when the configurations according to the example and the comparative example are used. DETAILED DESCRIPTION OF THE INVENTION

[0008] The following describes an embodiment of the optical processing device of the present invention with reference to the drawings. However, the dimensions, materials, shapes, and relative positions of the components described in the following embodiments may be changed as appropriate depending on the configuration of the device to which the present invention is applied and various conditions, and the scope of the present invention is not limited to the following embodiments.

[0009] Example 1 FIG. 1 is a schematic diagram of an optical processing apparatus 1 according to a first embodiment of the present invention. As shown in FIG. 1, the optical processing apparatus 1 includes a light source 10, an optical element 12 that focuses a light beam 11 emitted from the light source 10 toward a workpiece 15, and a guide unit 13 (nozzle) that guides the light beam 11 focused by the optical element 12 to a processing surface 151 of the workpiece 15. The optical processing apparatus 1 also includes an aperture member 14 that passes at least a portion of the light beam 11, and a stage 16 that is a mounting unit having a mounting surface 161 on which the workpiece 15 is mounted. The guide unit 13 and the aperture member 14 form a nozzle unit 100 (laser processing head). The optical processing apparatus 1 irradiates the workpiece 15 with the light beam 11 from the nozzle unit 100 while moving (scanning) the nozzle unit 100 and the workpiece 15 relatively in a direction parallel to the mounting surface 161. This allows processing such as forming a fine pattern on the processing surface 151 of the workpiece 15. The optical processing device 1 of Example 1 can be used, for example, in a process for manufacturing a particle pattern on a positive electrode sheet of an all-solid-state battery, but is not limited to this and can be applied to general laser microprocessing. Hereinafter, the movement (scanning) direction of the nozzle unit 100 is referred to as the X direction (first direction), the direction parallel to the mounting surface 161 of the stage 16 and perpendicular to the X direction is referred to as the Y direction (second direction), and the direction intersecting the mounting surface 161 of the stage 16 (the perpendicular direction in Example 1) is referred to as the Z direction (third direction).

[0010] FIG. 2 is a perspective view showing the nozzle unit 100. The guide section 13 has an aperture member 14 at its end 131 in the Z direction facing the mounting surface 161, the aperture member 14 having an opening 17 that allows at least a portion of the light beam 11 to pass through. In a cross section perpendicular to the Y direction, the aperture member 14 has an arc shape that convexly faces the mounting surface 161 when no external force is applied, and is elastically deformable in the Z direction. The aperture member 14 has an elastic portion 140 at its end in the Z direction facing the stage 16. When processing the workpiece 15, the aperture member 14 is pressed in the Z direction against the workpiece 15 placed on the stage 16, thereby elastically deforming the elastic portion 140 in the Z direction. Then, the nozzle unit 100 is moved relative to the workpiece 15 while pressing the workpiece 15 with the elastic force of the elastically deformed aperture member 14. In the first embodiment, the aperture member 14 is formed by deforming a sheet-like material into an arc shape so that the arc shape is convex toward the mounting surface 161 of the stage 16 (convex in the −Z direction). The inside of the arc is hollow. An opening 17 is provided at the top (tip) 142 of the aperture member 14 that faces the stage 16.

[0011] FIG. 3 is a cross-sectional view perpendicular to the Y direction showing the deformation of the nozzle unit 100. FIG. 3(a) is a cross-sectional view of the light beam 11, the nozzle unit 100, and the workpiece 15. As described above, the light beam 11 passes through the guide portion 13, and the opening 17 of the diaphragm member 14 causes at least a portion of the light beam 11, i.e., the light beam 11', to reach the workpiece 15. When there is a gap between the opening 17 of the diaphragm member 14 and the workpiece 15 as shown in FIG. 3(a), if the opening 17 of the diaphragm member 14 is small, the effect of diffraction increases, causing the light beam 11' to diffuse and reach the workpiece 15. The state shown in FIG. 3(a) is a state in which a gap exists between the tip 142 of the diaphragm member 14 in the Z direction and the processing surface 151 of the workpiece 15 when no external force is acting on the elastic portion 140 of the diaphragm member 14 (i.e., the elastic portion 140 is not elastically deformed).

[0012] In the first embodiment, the nozzle unit 100 is pressed against the workpiece 15, or the workpiece 15 is pressed against the nozzle unit 100, thereby deforming the elastic portion 140 of the diaphragm member 14 as shown in FIG. 3(b). Here, the length of the diaphragm member 14 in the Z direction (the distance from the end 131 of the guide unit 13 to the tip 142 of the diaphragm member 14) in a state where no external force is acting on the elastic portion 140 of the diaphragm member 14 and the diaphragm member 14 is not elastically deformed (the state shown by the dashed line in FIG. 3(b)) is defined as T. Also, the distance in the Z direction between the end 131 of the guide unit 13 and the mounting surface 161 of the stage 16 is defined as D. Also, the distance in the Z direction between the end 131 of the guide unit 13 and the processing surface 151 of the workpiece 15 is defined as K. In this case, in the first embodiment, the nozzle unit 100 performs scanning at a position where T>D or T>K. By positioning the nozzle unit 100 in this position during scanning processing, the elastic portion 140 of the aperture member 14 is pressed in the Z direction by the workpiece 15 and elastically deforms, as shown by the solid line in Figure 3(b). Then, the elastic force resulting from the elastic deformation acts on the workpiece 15 as a pressing force.

[0013] As a result, as shown in FIG. 3(c), a pressing force F (elastic force) constantly acts on the workpiece 15, causing the elastically deformed shape 1412 of the elastic portion 140 of the aperture member 14 to return to its original shape 1411. The magnitude of this pressing force F corresponds to the Z-direction deformation (deflection) Δz of the elastic portion 140. This prevents a gap from forming between the aperture 17 and the workpiece 15, allowing the light beam 11' to reach the workpiece 15 before diffusing. In other words, by making the diameter of the aperture 17 smaller than the focal spot diameter of the light beam 11, processing resolution can be improved. Furthermore, by scanning the nozzle unit 100 while it is pressed against the workpiece 15, it is possible to prevent a gap from forming between the aperture member 14 and the workpiece 15 and suppress diffusing the light beam 11 due to diffraction. Therefore, a fine pattern can be formed on the workpiece 15. Although an example of forming a pattern by moving (scanning) the nozzle unit 100 relative to a stationary (fixed) workpiece 15 has been shown here, the nozzle unit 100 may be fixed and the workpiece 15 may be moved.

[0014] At this time, if the workpiece 15 is distorted in the Z direction, the distance in the Z direction between the drawing member 14 and the workpiece 15 changes as the nozzle unit 100 passes through the distortion. If the distortion is convex in the Z direction, the distance between the drawing member 14 and the workpiece 15 decreases, and the elastic portion 140 of the drawing member 14 deforms further in the Z direction than the shape 1412 before passing through the distortion, and a greater pressing force acts on the workpiece 15. On the other hand, if the distortion is concave in the Z direction, the distance between the drawing member 14 and the workpiece 15 increases, and the elastic portion 140 of the drawing member 14 returns to a shape closer to its original shape 1411, and the pressing force acting on the workpiece 15 decreases. In this way, the degree of elastic deformation of the elastic portion 140 of the drawing member 14 changes depending on the distortion of the workpiece 15, and the pressing force on the workpiece 15 is variable, allowing the drawing member 14 to more reliably follow the distortion of the workpiece 15.

[0015] FIG. 4 shows how the aperture member 14 follows distortions in the workpiece 15. The black arrow R in the figure indicates the direction of travel (scanning direction) of the nozzle unit 100. Distortions in the workpiece 15 include those caused by warping or deformation, as shown in FIGS. 4(a) and 4(b), which result in local deviations from a reference position even when the thickness is uniform, and those caused by uneven thickness, as shown in FIGS. 4(c) and 4(d). As shown in FIGS. 4(a) to 4(d), the aperture member 14 of Example 1 can follow both types of distortions. FIGS. 4(a) and 4(c) show the deformation of the aperture member 14 when the workpiece 15 is distorted toward the nozzle unit 100 (i.e., when the workpiece 15 has a convex shape in the Z direction). Conversely, FIGS. 4(b) and 4(d) show the deformation of the aperture member 14 when the workpiece 15 is distorted away from the nozzle unit 100 (i.e., when the workpiece 15 has a concave shape in the Z direction).

[0016] Using the position of the processing surface 151 of the workpiece 15 when the deformation amount of the elastic portion 140 of the diaphragm member 14 is Δz as a reference, if the processing surface 151 is distorted by Δz1 toward the nozzle unit 100 as shown in FIG. 4(a), the pressing force has a magnitude F1 corresponding to Δz + Δz1. Using the position of the processing surface 151 of the workpiece 15 when the deformation amount of the elastic portion 140 of the diaphragm member 14 is Δz as a reference, if the processing surface 151 is distorted by Δz2 away from the nozzle unit 100 as shown in FIG. 4(b), the pressing force has a magnitude F2 corresponding to Δz - Δz2. The magnitude of the pressing force is F1 > F > F2. As can be seen from FIG. 4, even if the workpiece 15 is distorted in the traveling direction R of the nozzle unit 100, the diaphragm member 14 deforms to follow the distortion, so the intensity of the light beam 11' irradiated onto the workpiece 15 remains constant regardless of the distortion of the workpiece 15. This enables uniform micromachining. Since the aperture member 14 can flexibly deform to follow the distortion of the workpiece 15, stable contact between the aperture member 14 and the workpiece 15 can be maintained even if the processing speed (scanning speed) is increased.

[0017] Example 2 Fig. 5 is a cross-sectional view of a nozzle unit 200 in a cross section perpendicular to the Y direction in Example 2 of the present invention. Fig. 6 is a perspective view showing a throttle member 141 in Example 2. Fig. 5(a) is a cross-sectional view taken along cross section P1 indicated by the dashed line in Fig. 6(a), and Fig. 5(b) is a cross-sectional view taken along cross section P2 indicated by the dashed line in Fig. 6(a). Cross section P1 is a cross section that passes through an opening 18 in a first resin layer 20 (described below) but does not pass through an opening 17 in the throttle member 141, and cross section P2 is a cross section that passes through the opening 18 in the first resin layer 20 and the opening 17 in the throttle member 141.

[0018] The aperture member 141 of Example 2 differs from Example 1 in that a first resin layer 20 is provided on the surface of a portion facing the mounting surface 161 of the stage 16. However, the elastic portion 140 of the aperture member 141 is pressed against the workpiece 15 while deforming. As shown in FIG. 5( a), when the aperture member 141 is pressed against the workpiece 15 during micromachining, the first resin layer 20 deforms along with the aperture member 141. A gap d is generated between the opening 17 of the aperture member 141 and the workpiece 15 by the thickness of the first resin layer 20. With this configuration, the gap d between the workpiece 15 and the opening 17 of the aperture member 141 can be kept constant even if the workpiece 15 is distorted during micromachining. Therefore, the intensity of the light beam 11′ irradiated onto the workpiece 15 remains constant regardless of the distortion of the workpiece 15, allowing for uniform machining.

[0019] There are no particular restrictions on the material of the first resin layer 20, but it is advisable to select a heat-resistant material or a low-friction material depending on the processing environment. The first resin layer 20 has an opening 18 at a position corresponding to the position of the opening 17 of the diaphragm member 141, the opening 18 being larger than the opening 17 and allowing the light beam 11' that has passed through the opening 17 to pass through. During processing, mist of volatile components and the like may be generated from the workpiece 15. If the opening 18 of the first resin layer 20 is small, the mist will adhere and accumulate at the opening 18 of the first resin layer, clogging the opening 17 of the diaphragm member 141. To prevent this, it is preferable that the opening 18 of the first resin layer 20 be sufficiently larger than the opening 17 of the throttle member 141.

[0020] As shown in FIG. 5(a), the throttle member 141 and the first resin layer 20 elastically deform, so that the first resin layer 20 and the workpiece 15 come into contact with each other at a contact portion S having a width in the X direction. In FIG. 6(a), the contact portion S is indicated by diagonal lines. As shown in FIG. 6(a), the opening 18 is shaped and sized to extend beyond the contact portion S in the X direction, so that the opening 18 is no longer an enclosed space, as shown in FIG. 5(b). This allows the mist to easily escape to the outside, and prevents the mist from accumulating in the opening 17.

[0021] 6(b) and 6(c) are diagrams showing other embodiments of the opening 18. When viewed in the Z direction, the opening 18 in the first resin layer 20 can be a circle with a larger diameter than the opening 17 in the diaphragm member 141 as shown in FIG. 6(a), an oval or elliptical shape as shown in FIG. 6(b), or a slit-like opening extending in the X direction as shown in FIG. 6(c). When the opening 18 is an oval or elliptical shape, it is preferable that the opening 18 be elongated in the scanning direction (X direction) as shown in FIG. 6(b). Furthermore, by arranging the centers of the openings 17 and 18 offset from each other as shown in FIG. 6(b), taking into consideration the direction of the mist flow due to the airflow, an escape route for the mist can be more reliably secured.

[0022] If the opening 18 extends beyond the contact portion S in the scanning direction (X direction), the mist can easily escape to the outside of the throttle member 141, and the accumulation of mist can be suppressed. In particular, as shown in FIG. 6(c), by extending the opening 18 further in the scanning direction (X direction), the opening 18 can extend far beyond the contact portion S, and the accumulation of mist can be more reliably suppressed. Therefore, with this configuration, uniform processing can be performed over a long period of time.

[0023] If the thickness of the first resin layer 20 is too thin, the mist will adhere to the opening 17 before it can escape, and if it is too thick, the light beam 11' will be diffused too much, making processing difficult. As a result of extensive studies by the inventors, it has been found that when the diameter of the opening 17 of the diaphragm member 141 is φ50 μm, the thickness of the first resin layer 20 is preferably 50 to 100 μm.

[0024] In each of the above embodiments, the material of the diaphragm member 14 is preferably a material that has low absorptivity for the light beam 11 in order to suppress heat generation. The surface of the diaphragm member 14 may also be coated with a material that has low absorptivity for the light beam 11. In this case, a material that does not have low absorptivity for the light beam 11 may also be used as the material of the diaphragm member 14. The portion of the diaphragm member 14 that is irradiated with the light beam 11 may be made of a material that has low absorptivity, or may be surface coated.

[0025] Increasing the thickness of the elastic portion 140 of the drawing member 14 increases the pressing force against the workpiece 15. Therefore, the thickness of the elastic portion 140 of the drawing member 14 can be determined depending on the necessary pressing force against the workpiece 15.

[0026] Furthermore, as shown in FIG. 9, the pressing force can be increased by providing a second resin layer 30 on the inner surface 1402 of the diaphragm member 14 (the surface opposite to the surface 1401 facing the mounting surface 161). The second resin layer 30 is preferably made of a flexible material. Furthermore, a reflective layer 31 that reflects the light beam 11 may be provided on the inner surface of the second resin layer 30 (the surface opposite to the diaphragm member 14). This makes it possible to prevent the second resin layer 30 from absorbing the light beam 11. The opening 19 in the second resin layer 30 and the reflective layer 31 is preferably larger than the opening 17 in the diaphragm member 14. This makes it possible to reduce the effect of the light beam 11 on the second resin layer 30. Although not shown in FIG. 9, the diaphragm member 14 may be configured to include both the first resin layer 20 and the second resin layer 30.

[0027] A comparative example for comparison with the above-described embodiment will now be described.

[0028] (Comparative Example 1) The nozzle unit in Comparative Example 1 differs from Example 1 in that the throttle member 14 is not pressed against the workpiece 15. That is, in Comparative Example 1, processing is performed in the same state as in FIG.

[0029] FIG. 7 is a diagram showing a schematic view of the positional relationship between the workpiece 15 and the aperture member 14 in the vicinity of the opening 17 of the aperture member 14. As shown in FIG.

[0030] FIG. 7(a) shows the reference positional relationship between the aperture member 14 and the workpiece 15. The aperture 17 in the aperture member 14 allows only a portion of the beam 11, beam 11', to pass through the aperture member 14 and reach the workpiece 15. If the diameter of the aperture 17 is sufficiently small, the beam 11' is diffracted at the exit of the aperture 17 and travels through the gap d between the aperture 17 and the workpiece 15 while diffusing. In Comparative Example 1, as described in FIG. 3(a), when no external force is acting on the aperture member 14, the nozzle unit is positioned so that the distance in the Z direction between the tip 142 of the aperture member 14 and the processing surface 151 of the workpiece 15 is a positive value. Therefore, the aperture member 14 does not elastically deform, and therefore the aperture member 14 does not apply a pressing force to the workpiece 15.

[0031] Here, if the workpiece 15 is distorted, the nozzle unit in Comparative Example 1 is not pressed against the workpiece 15, and therefore the nozzle unit cannot follow the distortion of the workpiece 15. In other words, the gap d between the opening 17 of the diaphragm member 14 and the workpiece 15 varies depending on the distortion of the workpiece 15.

[0032] Figure 7(b) shows a state in which the gap d is smaller than the reference gap in Figure 7(a) due to distortion of the workpiece 15. In this case, the light beam 11' reaches the workpiece 15 with less diffusion than in Figure 7(a). In other words, the energy density of the light beam 11' reaching the workpiece 15 is increased compared to the state in Figure 7(a).

[0033] On the other hand, Figure 7(c) shows a state in which the gap d is larger than the reference gap in Figure 7(a) due to distortion of the workpiece 15. In this case, the light beam 11' reaches the workpiece 15 in a state of greater diffusion than in Figure 7(a). In other words, the energy density of the light beam 11' reaching the workpiece 15 is reduced compared to the state in Figure 7(a).

[0034] In this way, in the configuration of Comparative Example 1, if the workpiece 15 is distorted, the gap d fluctuates, resulting in a decrease in processing uniformity.

[0035] (Comparative Example 2) The optical processing apparatus in Comparative Example 2 differs from Example 1 in that no diaphragm member is attached to the nozzle unit.

[0036] FIG. 8 is a diagram showing a workpiece 15 in the vicinity of a portion irradiated with the light beam 11. As shown in FIG.

[0037] FIG. 8(a) shows a state in which the workpiece 15 is placed at the focal spot position of the light beam 11. In other words, the Z-direction position of the processing surface 151 of the workpiece 15 and the position where the light beam 11 is focused are aligned. Since the optical processing device in Comparative Example 2 does not have an aperture member, it is difficult to perform processing that is smaller than the focal spot diameter of the light beam 11 (the spot diameter at the focal position of the light beam 11). Also, as in Comparative Example 1, if the Z-direction position of the processing surface 151 of the workpiece 15 deviates from the focal position of the light beam 11 due to distortion of the workpiece 15 as shown in FIG. 8(b) or 8(c), the energy density of the light beam 11 that reaches the workpiece 15 will change. This results in a decrease in processing uniformity.

[0038] (evaluation) Using the configurations of the above-described examples and comparative examples, we evaluated the workpiece resolution, processing uniformity, and nozzle unit durability. The optical processing device used was a VLS2.30 (UNIVERSAL LASER SYSTEM). The light source 10 was a CO2 laser oscillator with a wavelength of 10.6 μm and an output of 10 W. The optical element was a 2.0 lens from the same company with a focal spot diameter of 130 μm. The aperture member 14 was made of 20 μm-thick copper foil with an aperture 17. To minimize heat generation, the aperture member 14 is preferably made of a material with low CO2 laser absorption, such as gold, silver, copper, aluminum, nickel, iron, or molybdenum. If a material with high CO2 laser absorption is used for the aperture member 14, it is recommended to coat the surface of the aperture member 14 with a material with low absorption. Suitable surface coatings include, for example, vapor deposition of gold or silver. If a second resin layer 30 is provided, the material for the second resin layer 30 is not particularly limited, but examples include PET and polyimide. When the reflective layer 31 is provided, the material of the reflective layer 31 is preferably a vapor-deposited film or metal foil containing any of gold, silver, copper, aluminum, and molybdenum.

[0039] The first resin layer 20 in the second embodiment is preferably made of a material that can withstand the heat generated by the workpiece 15, and suitable examples include silicone resin, fluororesin, and polyimide resin.

[0040] The results of processing the workpiece 15 using the above-described configuration are shown in Fig. 10. The workpiece 15 was made of polyacetal resin.

[0041] In the evaluation results shown in FIG. 10, the following criteria were set. Processing resolution 〇: Processing is possible with a diameter smaller than the laser spot diameter. ×: Processing cannot be performed below the laser spot diameter. Processing uniformity ◯: The processed line width is uniform. ×: The processed line width is non-uniform. durability 〇: Scanning distance can be used for 400m or more. △: Can be used within a scanning distance range of 20 to 400 m. ×: Scanning distance is limited to less than 20 m.

[0042] FIG. 11 shows the results of processing. The upper row of each of FIGS. 11(a) to 11(d) shows a microscope observation image, and the lower row shows the shape measurement results. FIG. 11(a) shows the results of Example 1, FIG. 11(b) shows the results of Example 2, FIG. 11(c) shows the results of Comparative Example 1, and FIG. 11(d) shows the results of Comparative Example 2. Shape measurement was performed using a laser microscope VK-X1050 (manufactured by KEYENCE Corporation). As a result, Example 1 achieved uniform processing, with an example of the processed shape having a line width of 16.7 μm and a depth of 6.0 μm. Example 2 achieved uniform processing, with a line width of 17.6 μm and a depth of 1.9 μm. On the other hand, Comparative Example 1 achieved a line width of 15.2 μm and a depth of 1.6 μm, but the processing results were non-uniform. In Comparative Example 2, although the output was reduced to minimize the line width, the line width was 155.0 μm and the depth was 4.3 μm, resulting in even more non-uniform processing results.

[0043] As described above, by using the configuration of the present invention, it is possible to provide an optical processing device and an optical processing method that can follow large distortions in the workpiece even when the scanning speed is high, and can process minute patterns with high precision and high efficiency.

[0044] The disclosure of this embodiment includes the following configuration. (Configuration 1) A light source and an optical element that focuses the light emitted from the light source onto a workpiece; a nozzle through which the light beam focused by the optical element passes; a mounting portion having a mounting surface on which the workpiece is mounted, and the optical processing device performs processing on a processing surface of the workpiece by irradiating the workpiece with the light beam from the nozzle while moving the nozzle and the workpiece relatively in a first direction parallel to the mounting surface, the nozzle has a diaphragm member at an end facing the placement surface, the diaphragm member having an opening for passing at least a part of the light beam; The optical processing device is characterized in that the aperture member has an arc-shaped convex shape toward the mounting surface when no external force is applied, in a cross section perpendicular to a second direction perpendicular to the first direction and parallel to the mounting surface, and has an elastic portion that can elastically deform in a third direction that intersects with the mounting surface. (Configuration 2) The optical processing device described in configuration 1 is characterized in that, when processing the workpiece, the nozzle is positioned so that the distance in the third direction between the end of the nozzle and the mounting surface is shorter than the length in the third direction of the aperture member when the elastic portion is not elastically deformed, and moves relative to the workpiece while pressing the workpiece with the elastic force of the elastically deformed elastic portion. (Configuration 3) 3. The optical processing device according to configuration 1 or 2, wherein the elastic portion of the aperture member is a metal foil containing any of gold, silver, copper, aluminum, nickel, iron, and molybdenum. (Configuration 4) 4. The optical processing device according to any one of configurations 1 to 3, wherein gold or silver is vapor-deposited on the surface of the elastic portion of the aperture member. (Configuration 5) 5. The optical processing device according to any one of configurations 1 to 4, wherein the elastic portion of the diaphragm member has a first resin layer on a surface facing the mounting surface of the mounting portion. (Configuration 6) 6. The optical processing device according to configuration 5, wherein the first resin layer is made of any one of silicone resin, fluororesin, and polyimide resin. (Configuration 7) The optical processing device described in configuration 5 or 6, characterized in that the first resin layer has an opening at a position corresponding to the position where the opening of the diaphragm member is provided, the opening allowing the light beam that has passed through the opening of the diaphragm member to pass through, and the opening is larger than the opening of the diaphragm member. (Configuration 8) 8. The optical processing device according to any one of configurations 1 to 7, wherein the diaphragm member has a second resin layer on a surface opposite to a surface facing the mounting surface. (Configuration 9) The optical processing device according to configuration 8, wherein the second resin layer is made of a flexible material. (Configuration 10) 10. The optical processing device according to configuration 8 or 9, wherein the second resin layer has a reflective layer that reflects the light beam on a surface opposite to the diaphragm member. (Configuration 11) 11. The optical processing device according to configuration 10, wherein the reflective layer is a metal foil or a vapor-deposited film containing any of gold, silver, copper, aluminum, and molybdenum. (Method 1) A light source and an optical element that focuses the light emitted from the light source onto a workpiece; a nozzle through which the light beam focused by the optical element passes; a placement portion having a placement surface on which the workpiece is placed; an optical processing method for processing a processing surface of a workpiece by irradiating the workpiece with the light beam from the nozzle while moving the nozzle and the workpiece relatively in a first direction parallel to the placement surface, using an optical processing device comprising: the nozzle has a diaphragm member at an end facing the placement surface, the diaphragm member having an opening for passing at least a part of the light beam; the throttle member has an arc-shaped convex shape toward the placement surface when no external force is applied in a cross section perpendicular to a second direction perpendicular to the first direction and parallel to the placement surface, and has an elastic portion that is elastically deformable in a third direction intersecting the placement surface; The optical processing method includes: a step of pressing the drawing member against the workpiece to elastically deform the elastic portion; moving the nozzle relative to the workpiece in the first direction while pressing the workpiece with the elastic force of the elastically deformed elastic portion; a step of processing the processing surface of the workpiece by irradiating the light beam from the nozzle onto the workpiece; An optical processing method comprising: [Explanation of symbols]

[0045] 1: optical processing device, 10: light source, 11, 11': light beam, 12: optical element, 13: guide portion, 14: aperture member, 15: workpiece, 16: stage, 17: opening, 100: nozzle unit, 140: elastic portion

Claims

1. A light source and an optical element that focuses the light emitted from the light source onto a workpiece; a nozzle through which the light beam focused by the optical element passes; a mounting portion having a mounting surface on which the workpiece is mounted, and the optical processing device performs processing on a processing surface of the workpiece by irradiating the workpiece with the light beam from the nozzle while moving the nozzle and the workpiece relatively in a first direction parallel to the mounting surface, the nozzle has a diaphragm member at an end facing the placement surface, the diaphragm member having an opening for passing at least a part of the light beam; The optical processing device is characterized in that the aperture member has an arc-shaped convex shape toward the mounting surface when no external force is applied, in a cross section perpendicular to a second direction perpendicular to the first direction and parallel to the mounting surface, and has an elastic portion that can elastically deform in a third direction that intersects with the mounting surface.

2. The optical processing device described in claim 1, characterized in that when processing the workpiece, the nozzle is positioned so that the distance in the third direction between the end of the nozzle and the mounting surface is shorter than the length in the third direction of the diaphragm member when the elastic portion is not elastically deformed, and the nozzle moves relative to the workpiece while pressing the workpiece with the elastic force of the elastically deformed elastic portion.

3. 3. The optical processing device according to claim 1, wherein the elastic portion of the aperture member is a metal foil containing any one of gold, silver, copper, aluminum, nickel, iron, and molybdenum.

4. 3. The optical processing device according to claim 1, wherein gold or silver is vapor-deposited on the surface of the elastic portion of the aperture member.

5. 3. The optical processing device according to claim 1, wherein the elastic portion of the diaphragm member has a first resin layer on a surface facing the mounting surface of the mounting portion.

6. 6. The optical processing device according to claim 5, wherein the first resin layer is made of any one of a silicone resin, a fluororesin, and a polyimide resin.

7. 6. The optical processing apparatus according to claim 5, wherein the first resin layer has an opening at a position corresponding to the position of the opening of the diaphragm member, the opening allowing the light beam that has passed through the opening of the diaphragm member to pass therethrough, the opening being larger than the opening of the diaphragm member.

8. 3. The optical processing device according to claim 1, wherein the diaphragm member has a second resin layer on a surface opposite to a surface facing the mounting surface.

9. 9. The optical processing apparatus according to claim 8, wherein the second resin layer is made of a flexible material.

10. 9. The optical processing device according to claim 8, wherein the second resin layer has a reflective layer that reflects the light beam on a surface opposite to the diaphragm member.

11. 11. The optical processing device according to claim 10, wherein the reflective layer is a metal foil or a vapor-deposited film containing any of gold, silver, copper, aluminum, and molybdenum.

12. A light source and an optical element that focuses the light emitted from the light source onto a workpiece; a nozzle through which the light beam focused by the optical element passes; a placement portion having a placement surface on which the workpiece is placed; an optical processing method for processing a processing surface of a workpiece by irradiating the workpiece with the light beam from the nozzle while moving the nozzle and the workpiece relatively in a first direction parallel to the placement surface, using an optical processing device comprising: the nozzle has a diaphragm member at an end facing the placement surface, the diaphragm member having an opening for passing at least a part of the light beam; the diaphragm member has an arc-shaped convex shape toward the placement surface when no external force is applied in a cross section perpendicular to a second direction perpendicular to the first direction and parallel to the placement surface, and has an elastic portion that is elastically deformable in a third direction intersecting the placement surface; The optical processing method includes: a step of pressing the drawing member against the workpiece to elastically deform the elastic portion; moving the nozzle relative to the workpiece in the first direction while pressing the workpiece with the elastic force of the elastically deformed elastic portion; a step of processing the processing surface of the workpiece by irradiating the light beam from the nozzle onto the workpiece; An optical processing method comprising:

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