Pickup unit, horn unit, and bonding device

Abstract

To provide a pickup unit capable of efficiently holding a component in a non-contact manner.SOLUTION: A pickup unit 14 is a unit for picking up a chip 6a in a non-contact manner, and includes: a vibration part 152 that vibrates to generate a sound wave; a pickup nozzle 14a that picks up the chip 6a in the non-contact manner using the generated sound wave; and a plurality of support parts 50 connected to the vibration part 152. Each of the plurality of support parts 50 includes: a first elastic member 51 that is elastically deformed in a direction orthogonal to an axial direction of the pickup unit 14, which is an arrangement direction of the vibrating part 152 and a pickup nozzle 14a; and one or more fixing parts 52 that is / are respectively connected to the vibrating part 152 via the first elastic member 51.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present disclosure relates to a unit for picking up parts, etc. [Background technology]

[0002] To improve the functionality of semiconductor packages, hybrid bonding that does not use bumps or bonding materials is required. In hybrid bonding, the semiconductor chip is bonded to a substrate or other device using hydrogen bonding or other methods while the surface of the semiconductor chip is kept clean. Therefore, in hybrid bonding, the surface of the semiconductor chip must be kept highly clean from the time it is picked up from the adhesive sheet dicing tape until it is bonded.

[0003] Therefore, conventionally, a chip holding device that uses a chip holder to hold a semiconductor chip pushed up from below the dicing tape in a non-contact manner, and a manufacturing apparatus having such a chip holding device have been proposed (see, for example, Patent Document 1). Such a chip holder is also called a nozzle or a pickup nozzle, and the chip holding device is also called a pickup unit. Furthermore, the manufacturing apparatus is also called a bonding apparatus because it bonds the semiconductor chip to a substrate as a component. The chip holding device of Patent Document 1 uses ultrasonic waves and suction force to hold a semiconductor chip pushed up from below the dicing tape in a non-contact manner.

[0004] Patent Document 1 does not disclose how the tip holding device is supported on the manufacturing equipment. Patent Document 2, on the other hand, discloses a method for supporting an ultrasonic vibrator that generates ultrasonic waves. In Patent Document 2, a support cylinder for supporting the ultrasonic vibrator is fastened to a support nut. As a result, the support for the ultrasonic vibrator inserted into the support cylinder and the tapered inner surface of the support cylinder are engaged. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Publication No. 2023-45216 [Patent Document 2] Japanese Patent Application Publication No. 2018-176136 Summary of the Invention [Problem to be solved by the invention]

[0006] However, even if the supporting method of Patent Document 2 is incorporated into the chip holding device (ie, pickup unit) of Patent Document 1, there is a problem in that it is difficult to efficiently hold the semiconductor chips that are components.

[0007] Therefore, the present disclosure provides a pickup unit and the like that can hold components efficiently and without contact. [Means for solving the problem]

[0008] A pickup unit according to one embodiment of the present disclosure is a pickup unit for picking up components non-contact, and includes a vibration unit that vibrates to generate sound waves, a nozzle that uses the generated sound waves to pick up the components non-contact, and a plurality of support units connected to the vibration unit, each of which includes a first elastic member that elastically deforms in a direction perpendicular to the axial direction of the pickup unit, which is the arrangement direction of the vibration unit and the nozzle, and one or more fixed units each connected to the vibration unit via the first elastic member.

[0009] These general or specific aspects may be realized as a system, an apparatus, or a method, or may be realized as any combination of a system, an apparatus, and a method. [Effects of the Invention]

[0010] The pickup unit of the present disclosure can hold components in a suitable non-contact manner.

[0011] Further advantages and effects of one aspect of the present disclosure will become apparent from the specification and drawings. Such advantages and / or effects are provided by some of the embodiments and configurations described in the specification and drawings, but not all of the configurations are necessarily required. [Brief explanation of the drawings]

[0012] [Figure 1] FIG. 1 is a perspective view of a component mounting apparatus according to an embodiment. [Figure 2] FIG. 2 is a diagram for explaining the operation of the component mounting device according to the embodiment when mounting a chip on a substrate. [Figure 3] FIG. 3 is a diagram illustrating an example of the configuration of a pickup system according to the embodiment. [Figure 4A] FIG. 4A is a diagram exemplarily showing part of the operation of the pickup system according to the embodiment, in which the pickup system picks up a chip using a pickup nozzle and transfers the chip to a component mounting nozzle. [Figure 4B] FIG. 4B is a diagram illustrating the remaining part of the operation of the pickup system according to the embodiment, in which the pickup system uses the pickup nozzle to pick up a chip and transfer it to the component mounting nozzle. [Figure 5] FIG. 5 is a diagram showing an example of the pickup unit according to the embodiment as viewed from the X-axis direction. [Figure 6] FIG. 6 is a diagram showing an example of a horn according to the embodiment. [Figure 7] FIG. 7 is a diagram illustrating an example of elastic deformation of the first elastic member in the embodiment. [Figure 8] FIG. 8 is a diagram illustrating an example of a cross section of a pickup unit according to the embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0013] The present inventors have found that the following problems arise with the chip holding device of Patent Document 1 and the supporting method of Patent Document 2 described in the "Background Art" section.

[0014] The chip holding device of Patent Document 1 uses a chip holder with suction holes to pick up a semiconductor chip from above. That is, the semiconductor chip is attracted to the chip holder by suction of air through the suction holes of the chip holder. Meanwhile, ultrasonic waves generated in response to the vibration of the ultrasonic vibrator, i.e., the ultrasonic squeeze effect, exerts a force on the semiconductor chip that pulls the semiconductor chip away from the chip holder. As a result, the semiconductor chip is held by the chip holder without contact.

[0015] In the tip holding device of Patent Document 1, the ultrasonic vibrator generates ultrasonic waves by vibrating in the direction of the central axis (i.e., the vertical direction). However, the tip holding device also vibrates slightly in the direction normal to the central axis (i.e., the horizontal direction).

[0016] In the supporting method of Patent Document 2, the support for the ultrasonic transducer is sandwiched between a supporting cylinder and a supporting nut, which results in suppressing movement of the support in the direction normal to the central axis of the ultrasonic transducer.

[0017] Therefore, if the support method of Patent Document 2 is applied to the chip holding device of Patent Document 1, vibrations in the normal direction of the chip holding device are suppressed, and as a result, vibrations in the central axis direction are also suppressed. This reduces the efficiency of vibrations of the chip holding device, i.e., the pickup unit, making it difficult to efficiently hold the semiconductor chips that are components.

[0018] Therefore, in order to solve such problems, the pickup unit according to the first aspect of the present disclosure is a pickup unit for picking up components non-contact, and comprises a vibration part that vibrates to generate sound waves, a nozzle that uses the generated sound waves to pick up the components non-contact, and a plurality of support parts connected to the vibration part, each of the plurality of support parts including a first elastic member that elastically deforms in a direction perpendicular to the axial direction of the pickup unit, which is the arrangement direction of the vibration part and the nozzle, and one or more fixing parts each connected to the vibration part via the first elastic member.

[0019] For example, the one or more fixing portions are fixed to a device having the pickup unit. The nozzle is also called a pickup nozzle. The sound wave is a sound wave used in a broad sense and may be an ultrasonic wave.

[0020] This allows the vibration of the vibrating part to be tolerated by the elastic deformation of the first elastic member, even if the vibrating part vibrates in a direction perpendicular to the axial direction of the pickup unit, i.e., in a direction normal to the central axis of the pickup unit. In other words, the reduction in the vibration can be suppressed. As a result, the efficiency of the axial vibration of the pickup unit can be improved, and the component can be held efficiently without contact.

[0021] In addition, in the pickup unit according to the second aspect, the vibration unit may include a vibrator that vibrates in the axial direction and a horn connected to the nozzle for transmitting the vibration of the vibrator to the nozzle, and each of the plurality of support parts may be connected to the horn of the vibration unit. Note that the pickup unit according to the second aspect may be subordinate to the pickup unit according to the first aspect. Furthermore, if the sound waves generated by the vibration of the vibration unit are ultrasonic waves, the vibrator can be said to be an ultrasonic vibrator.

[0022] As a result, even if the horn vibrates in the normal direction, the vibration can be tolerated by the elastic deformation of the first elastic member, and the component can be held efficiently without contact.

[0023] In the pickup unit according to the third aspect, each of the plurality of supports may be connected to a vibration node of the horn. The pickup unit according to the third aspect may be subordinate to the pickup unit according to the first aspect.

[0024] At the vibration nodes of the horn, axial vibration is smaller than at other parts of the horn. Therefore, by connecting each of the multiple supports to the nodes, as in the third embodiment, it is possible to further suppress the decrease in vibration of the pickup unit and efficiently hold the component without contact.

[0025] In the pickup unit according to the fourth aspect, the vibration unit may include a vibrator connected to the nozzle and vibrating in the axial direction to transmit vibrations to the nozzle, and each of the plurality of supports may be connected to the vibrator of the vibration unit. Note that the pickup unit according to the fourth aspect may be subordinate to the pickup unit according to the first aspect.

[0026] This allows the pickup unit to efficiently hold the component without contact, even if it does not have a horn. In other words, even if the vibrator vibrates in the normal direction, the vibration can be tolerated by the elastic deformation of the first elastic member, allowing the component to be efficiently held without contact.

[0027] In a pickup unit according to a fifth aspect, each of the plurality of supports may be connected to a node of vibration of the vibrator. The pickup unit according to the fifth aspect may be subordinate to the pickup unit according to the fourth aspect.

[0028] At the vibration nodes of the vibrator, the axial vibration is smaller than at other parts of the vibrator. Therefore, by connecting each of the multiple supports to the nodes, as in the fifth aspect, it is possible to further suppress the decrease in vibration of the pickup unit and to efficiently hold the component without contact.

[0029] In addition, in the pickup unit according to a sixth aspect, the plurality of support parts may be arranged rotationally symmetrically with respect to a central axis of the pickup unit when the pickup unit is viewed from the axial direction. The pickup unit according to the sixth aspect may be subordinate to the pickup unit according to any one of the first to fifth aspects.

[0030] This allows the pickup unit to be supported in a well-balanced manner.

[0031] In a pickup unit according to a seventh aspect, the plurality of support parts may include three or more support parts, and the three or more support parts may be arranged rotationally symmetrically with respect to a central axis of the pickup unit when viewed from the axial direction. The pickup unit according to the seventh aspect may be subordinate to the pickup unit according to any one of the first to fifth aspects.

[0032] This allows the pickup unit to be supported in a well-balanced manner.

[0033] In the pickup unit according to an eighth aspect, the one or more fixing portions may include two fixing portions, and the first elastic member may be disposed between the two fixing portions when the pickup unit is viewed from the axial direction. Note that the pickup unit according to the eighth aspect may be subordinate to the pickup unit according to any one of the first to seventh aspects.

[0034] As a result, since the first elastic member is disposed between the two fixed parts, the central part of the first elastic member in the arrangement direction of the two fixed parts is connected to the vibrating part, which makes it easier to elastically deform the first elastic member. As a result, the efficiency of the axial vibration of the pickup unit can be improved, and the component can be efficiently held without contact.

[0035] In a pickup unit according to a ninth aspect, the first elastic member may extend along the outer circumferential direction of the vibrating part when the pickup unit is viewed from the axial direction. The pickup unit according to the ninth aspect may be subordinate to the pickup unit according to any one of the first to eighth aspects.

[0036] This allows the central portion of the first elastic member in the outer circumferential direction to be connected to the vibrating portion, making it easier to elastically deform the first elastic member, thereby improving the efficiency of the axial vibration of the pickup unit and enabling efficient contactless holding of components.

[0037] In a pickup unit according to a tenth aspect, when the pickup unit is viewed from the axial direction, a thickness of the first elastic member in a radial direction of the pickup unit may be thinner than a thickness of each of the two fixed portions. Note that the pickup unit according to the tenth aspect may be subordinate to the pickup unit according to any one of the first to ninth aspects.

[0038] This allows the first elastic member to be easily elastically deformed because it is thin, which improves the efficiency of the axial vibration of the pickup unit and allows components to be held efficiently without contact.

[0039] In the pickup unit according to an eleventh aspect, each of the two fixing portions may have a hole along the axial direction for fixing the pickup unit. The pickup unit according to the eleventh aspect may be subordinate to the pickup unit according to any one of the eighth to tenth aspects.

[0040] This allows the fixing portion to be firmly fixed to the device having the pickup unit by passing a bolt through the hole. In other words, the fixing portion can be bolted.

[0041] In a pickup unit according to a twelfth aspect, the horn may have a through-hole that penetrates the horn in a direction perpendicular to the axial direction of the pickup unit and is connected to the hole in the nozzle, the through-hole being located between the vibrator and a vibration node of the horn. Note that the pickup unit according to the twelfth aspect may be subordinate to the pickup unit according to any one of the second to eleventh aspects.

[0042] This allows components to be sucked through the through-hole of the horn and the nozzle hole, thereby achieving non-contact component holding using suction. Furthermore, because the through-hole penetrates the horn in a direction perpendicular to the axial direction, i.e., the through-hole is aligned horizontally, a negative pressure generator can be easily connected to the through-hole. As a result, a component suction configuration can be easily realized. Furthermore, because the through-hole is located between the vibrator and the vibration node of the horn, the connection mechanism for connecting the through-hole and the negative pressure generator can be positioned closer to the vibrator in the axial direction than the multiple support members. As a result, the connection mechanism can be easily positioned, and the configuration of the device having the pickup unit can be prevented from becoming complicated.

[0043] In the pickup unit according to the thirteenth aspect, the through hole may be closer to a vibration node of the horn than the vibrator. The pickup unit according to the thirteenth aspect may be subordinate to the pickup unit according to the twelfth aspect.

[0044] This allows the through hole to be located close to the vibration node of the horn, so the connection mechanism and the multiple support parts can be placed close to each other, which makes it possible to make the device having the pickup unit more compact.

[0045] In the pickup unit according to the fourteenth aspect, the through hole may be closer to the vibrator than a node of the vibration of the horn. The pickup unit according to the fourteenth aspect may be subordinate to the pickup unit according to the twelfth aspect.

[0046] This makes it possible to suppress the disadvantage of having a through hole. The disadvantage is that vibration from the vibrator is less likely to be transmitted to the nozzle. In other words, in the fourteenth aspect, because the through hole is close to the vibrator, this disadvantage can be suppressed compared to when the through hole is far from the vibrator.

[0047] In a pickup unit according to a fifteenth aspect, the one or more fixed portions may be fixed to a moving mechanism that moves the pickup unit. The pickup unit according to the fifteenth aspect may be subordinate to the pickup unit according to any one of the first to fourteenth aspects.

[0048] This allows the pickup unit to be fixed to the moving mechanism, making it possible to move the pickup unit.

[0049] In a pickup unit according to a sixteenth aspect, the through hole of the pickup unit may be connected via a second elastic member to a negative pressure generator that generates negative pressure to suck the component. The pickup unit according to the sixteenth aspect may be subordinate to the pickup unit according to any one of the twelfth to fifteenth aspects.

[0050] This allows the through hole to be connected to the negative pressure generating section via a second elastic member such as a rubber pad, making it difficult to suppress vibration of the horn, which improves the efficiency of axial vibration of the pickup unit and allows components to be held efficiently without contact.

[0051] In a pickup unit according to a seventeenth aspect, the first elastic member may be a leaf spring. The pickup unit according to the seventeenth aspect may be subordinate to the pickup unit according to any one of the first to sixteenth aspects.

[0052] This makes it possible to improve the efficiency of the axial vibration of the pickup unit with a simple configuration, and to hold the component efficiently without contact.

[0053] Furthermore, the horn unit according to the first aspect is a horn unit used in a pickup unit for picking up components non-contact, and comprises a horn for transmitting vibrations of a vibrator included in the pickup unit to a nozzle included in the pickup unit, and a plurality of support parts directly connected to the horn, each of which includes an elastic member that elastically deforms in a direction perpendicular to the axial direction of the horn unit, which is the arrangement direction of the vibrator and the nozzle, and one or more fixed parts each connected to the horn via the elastic member.

[0054] This allows the elastic deformation of the elastic member to tolerate vibrations of the horn in a direction perpendicular to the axial direction of the pickup unit, i.e., in a direction normal to the central axis of the pickup unit. In other words, the reduction in vibration can be suppressed. As a result, the efficiency of the axial vibration of the pickup unit can be improved, allowing components to be held efficiently without contact.

[0055] A pickup unit according to an eighteenth aspect may include the horn unit according to the first aspect, the vibrator, and the nozzle.

[0056] This makes it possible to achieve the same effects as the horn unit according to the first aspect.

[0057] In addition, the joining device according to the first aspect includes a pickup unit according to any one of the first to eighteenth aspects, and a joining unit that receives the component from the pickup unit and joins the received component to another component.

[0058] This makes it possible to achieve the same effects as the pickup unit according to any one of the first to seventeenth and nineteenth aspects.

[0059] Hereinafter, the embodiments will be specifically described with reference to the drawings.

[0060] The embodiments described below are all comprehensive or specific examples. The numerical values, shapes, materials, components, component placement and connection configurations, steps, and step sequences shown in the following embodiments are merely examples and are not intended to limit the present disclosure. Furthermore, among the components in the following embodiments, components that are not recited in the independent claims that represent the highest concepts are described as optional components. Furthermore, each figure is a schematic diagram and is not necessarily an exact illustration. Furthermore, the same components are designated by the same reference numerals in each figure. Furthermore, expressions such as "approximately 0" are used in the following embodiments. For example, "approximately 0" does not only mean that the value is completely 0, but also that the value is substantially 0, including an error of, for example, a few percent. Furthermore, "approximately 0" means that the value is 0 within the range in which the effects of the present disclosure can be achieved. The same applies to other expressions using "approximately."

[0061] (Embodiment) FIG. 1 is a perspective view of a component mounting apparatus according to the present embodiment.

[0062] The component mounting apparatus 1 in this embodiment picks up components and mounts the picked-up components on the substrate 7. Therefore, the component mounting apparatus 1 in this embodiment is equipped with a pickup system that picks up components. Mounting components on the substrate 7 is also referred to as bonding the components to the substrate 7. Therefore, the component mounting apparatus 1 is also referred to as a bonding apparatus. The substrate 7 in this embodiment is not limited to a specific type of substrate and may be a silicon substrate, a component, a silicon chip, or the like. In this disclosure, the vertical direction is referred to as the Z-axis direction or up-down direction, a direction in a plane perpendicular to the vertical direction is referred to as the Y-axis direction, left-right direction, or lateral direction, and a direction perpendicular to the Y-axis direction in that perpendicular plane is referred to as the X-axis direction or depth direction. In this disclosure, the positive side of the Z-axis direction is upward or up, and the negative side of the Z-axis direction is downward or down. In this disclosure, the positive side of the Y-axis direction is the right side or right, and the negative side of the Y-axis direction is the left side or left. In this disclosure, the positive side in the X-axis direction is the rear side or back, and the negative side in the X-axis direction is the front side or front. An example of a component is a semiconductor chip or chips. In this disclosure, picking up refers to the action of holding a component, or, among the actions of holding a component, particularly the action of picking up a component from an adhesive sheet such as dicing tape.

[0063] Component mounting apparatus 1 includes a base 2, a component supply unit 3, a board holding unit 5, a component holding unit 15, a frame 11, a Y-axis drive mechanism 12, a component mounting unit 13, and a pickup camera 21. Base 2 is the base of component mounting apparatus 1 and supports each of the components included in component mounting apparatus 1.

[0064] The component supply unit 3 is placed on the base 2 and supplies components to the component holder 15. The component supply unit 3 includes a holding table 3a, an XY table mechanism 31, a movable plate 32, and multiple support members 33. The holding table 3a holds the semiconductor wafer unit 6 aligned horizontally. The semiconductor wafer unit 6 includes an adhesive sheet 6b and multiple chips 6a. The multiple chips 6a are individual pieces or semiconductor chips obtained by dicing a semiconductor wafer, and are components supplied by the component supply unit 3 and mounted on the substrate 7. The adhesive sheet 6b is an adhesive sheet also known as dicing tape. The multiple chips 6a are affixed to the upper surface of the adhesive sheet 6b. Each of the multiple support members 33 is a columnar member placed on the movable plate 32 so as to stand upright from the movable plate 32. The multiple support members 33 support the holding table 3a while separating the semiconductor wafer unit 6 held by the holding table 3a above the movable plate 32. The movable plate 32 is a plate placed on the XY table mechanism 31. The XY table mechanism 31 moves the movable plate 32 in the X-axis direction and the Y-axis direction. As the movable plate 32 moves, the semiconductor wafer unit 6 moves in the X-axis direction and the Y-axis direction. In other words, the multiple chips 6a move along the XY plane.

[0065] The pickup camera 21 is disposed above the component supply unit 3 and captures an image of the chip 6a of the semiconductor wafer unit 6 that is to be picked up.

[0066] The substrate holder 5 holds the substrate 7 in a horizontally aligned state. Such a substrate holder 5 is provided with a transport rail 5a. The substrate holder 5 positions and holds the substrate 7 transported by the transport rail 5a at a mounting position. The mounting position is a position where the chip 6a is mounted.

[0067] The component holder 15 includes an arm 15a, a rotational movement mechanism 15b, and a pickup unit 14. The arm 15a is a columnar member and is attached to the rotational movement mechanism 15b along the X-axis direction. That is, one longitudinal end (i.e., the base end) of the arm 15a is attached to the rotational movement mechanism 15b. The pickup unit 14 is attached to the other end (i.e., the tip end) of the arm 15a.

[0068] The rotational movement mechanism 15b is suspended from the Y-axis frame 11b of the frame 11 and moves the arm 15a in the X-axis, Y-axis, and Z-axis directions. Furthermore, the rotational movement mechanism 15b rotates the arm 15a around a central axis along the longitudinal direction of the arm 15a. That is, the rotational movement mechanism 15b rotates the arm 15a around the X-axis. The pickup unit 14 is attached to the tip of the arm 15a as described above. The pickup unit 14 also includes a pickup nozzle 14a, made of, for example, metal, that holds the chip 6a non-contact by vacuum suction and ultrasonic waves. Note that vacuum suction is an action of sucking air and is also simply referred to as suction. Therefore, the pickup nozzle 14a is driven by the rotational movement mechanism 15b to move in the X-axis, Y-axis, and Z-axis directions and rotate around the X-axis. The rotational movement mechanism 15b also moves the pickup nozzle 14a based on the image capture results of the pickup camera 21. This allows rotational movement mechanism 15b to lower pickup nozzle 14a and accurately bring it close to the top surface of chip 6a to be picked up. Note that pickup nozzle 14a in this embodiment is also referred to simply as a nozzle, and has an opening for holding chip 6a in a non-contact manner using vacuum suction and ultrasonic waves.

[0069] Frame 11 is disposed on the positive side of the X-axis direction on base 2, and includes two support posts 11a and a long Y-axis frame 11b. The two support posts 11a support Y-axis frame 11b while Y-axis frame 11b is aligned along the Y-axis direction and spaced above the top surface of base 2. In other words, Y-axis frame 11b is suspended by the two support posts 11a. As described above, rotational movement mechanism 15b is suspended from Y-axis frame 11b.

[0070] Y-axis drive mechanism 12 is attached to the surface of Y-axis frame 11b on the negative side in the X-axis direction, and moves component mounting section 13 in the Y-axis direction. Component mounting section 13 is equipped with a mounting unit 20. Component mounting section 13 receives chip 6a held by pickup nozzle 14a from pickup nozzle 14a using mounting unit 20, and mounts chip 6a on board 7 positioned at the mounting position.

[0071] FIG. 2 is a diagram for explaining the operation of component mounting apparatus 1 to mount chip 6a on substrate 7. As shown in FIG.

[0072] The component mounting device 1 picks up the chip 6a that is placed at a predetermined pick-up work position P in the XY plane from among the multiple chips 6a attached to the adhesive sheet 6b, and mounts the chip 6a on the substrate 7.

[0073] Specifically, the XY table mechanism 31 moves the moving plate 32 in the X-axis direction and the Y-axis direction to place the chip 6a to be picked up at the pick-up work position P. The chip 6a to be picked up that has been placed at the pick-up work position P is pushed up by the push-up section 34.

[0074] 2, the component mounting apparatus 1 in this embodiment is provided with a push-up unit 34 arranged at the pick-up work position P. The push-up unit 34 may also be provided in the component supply unit 3. The push-up unit 34 pushes up the chip 6a attached to the adhesive sheet 6b from below to above via the adhesive sheet 6b. Specifically, the push-up unit 34 pushes up the chip 6a to be picked up that is arranged at the pick-up work position P.

[0075] The pickup camera 21 is disposed above the component supply unit 3 at the pickup operation position P. The pickup camera 21 captures an image of the pickup operation position P and its surroundings among the multiple chips 6a attached to the adhesive sheet 6b from above the component supply unit 3. This captures an image of the chip 6a to be picked up, and the position of the chip 6a to be picked up is recognized based on the image capture result. In other words, the position of the chip 6a is recognized.

[0076] Pickup nozzle 14a of pickup unit 14 is lowered by the drive of rotational movement mechanism 15b, approaches chip 6a from above, the position of which has been recognized based on the image capture results of pickup camera 21, and holds that chip 6a. Then, pickup nozzle 14a rises while holding chip 6a, and further moves, for example, to the negative side in the Y-axis direction. Here, pickup nozzle 14a faces the lower surface (i.e., the bottom surface) of the held chip 6a upward as arm 15a is rotated by rotational movement mechanism 15b. As a result, chip 6a is held by pickup nozzle 14a in an upside-down state.

[0077] 2, component mounting section 13 includes not only mounting unit 20 described above, but also movable plate 13a, lifting mechanism 13b, and lifting plate 13c. Movable plate 13a is a plate attached to Y-axis drive mechanism 12 so as to be movable in the Y-axis direction. In other words, movable plate 13a moves in the Y-axis direction by being driven by Y-axis drive mechanism 12.

[0078] The lifting mechanism 13b is attached to the front of the moving plate 13a and raises and lowers the lifting plate 13c. A mounting unit 20 is attached to the lower part of the lifting plate 13c. The mounting unit 20 has a component mounting nozzle 20a. The component mounting nozzle 20a receives the chip 6a from the pickup nozzle 14a, which holds the chip 6a, for example, upside down. For example, the component mounting nozzle 20a is driven by the Y-axis drive mechanism 12 and the lifting mechanism 13b to move above the chip 6a and hold the chip 6a by, for example, vacuum suction. Then, while holding the chip 6a, the component mounting nozzle 20a moves toward the substrate 7 along the Y-axis direction and mounts the chip 6a on the substrate 7.

[0079] Component mounting section 13 in this embodiment is an example of a joining unit that joins chip 6a held by pickup unit 14 of component holding section 15 to another component such as substrate 7. Therefore, the joining device that is component mounting apparatus 1 in this embodiment includes pickup unit 14 and a joining unit that receives chip 6a from pickup unit 14 and joins the received chip 6a to another component. Note that when receiving chip 6a, the joining unit in this embodiment receives chip 6a from pickup unit 14 after rotational movement mechanism 15b rotates pickup unit 14.

[0080] FIG. 3 is a diagram showing an example of the configuration of a pickup system according to the present embodiment.

[0081] Pickup system 100 in this embodiment is a system provided in component mounting apparatus 1, and includes component holder 15, push-up unit 34, and control unit 101, for example.

[0082] The component holder 15 includes a pickup unit 14, a negative pressure generator 153, and a rotational movement mechanism 15b. The pickup unit 14 is a mechanism for picking up chips 6a in a non-contact manner, and includes a pickup nozzle 14a and a vibrating unit 152. In this embodiment, the vibrating unit 152 includes a vibrator 152a and a horn 152b.

[0083] Oscillator 152a vibrates to generate ultrasonic waves. Oscillator 152a is, for example, a Langevin-type ultrasonic oscillator, and vibrates (i.e., generates ultrasonic vibrations) in response to a voltage applied to the oscillator. Horn 152b is connected to oscillator 152a and pickup nozzle 14a, amplifying the vibrations of oscillator 152a and transmitting them to pickup nozzle 14a. As a result, ultrasonic waves are generated around opening 14b of pickup nozzle 14a. When pickup nozzle 14a vibrates ultrasonically in the vertical direction, the vibrations are transmitted to the air in contact with the underside of pickup nozzle 14a. For example, oscillator 152a ultrasonically vibrates pickup nozzle 14a with a maximum amplitude of approximately 10 to 20 μm. Pickup nozzle 14a uses the ultrasonic waves generated by the vibrations to pick up tip 6a in a non-contact manner.

[0084] In this embodiment, the vibrator 152a generates ultrasonic waves having a frequency of, for example, 20 kHz or higher, but may also generate sound waves in the broad sense. That is, the sound waves generated by the vibrator 152a may be sound waves in the narrow sense, i.e., elastic waves that propagate through the air at a frequency audible to humans (e.g., 10 kHz or higher and lower than 20 kHz), or may be ultrasonic waves. In other words, the vibrator 152a in this embodiment may generate elastic waves of any frequency in the air as long as they can apply a repulsive force to the tip 6a.

[0085] Negative pressure generator 153 generates negative pressure around opening 14b of pickup nozzle 14a. In this embodiment, negative pressure generator 153 is configured as, for example, a vacuum pump. Specifically, horn 152b has suction path 152c, which is a hole for sucking tip 6a, and pickup nozzle 14a has suction hole 14c connected to suction path 152c and communicating with opening 14b. Negative pressure generator 153 generates negative pressure around opening 14b of pickup nozzle 14a by creating negative pressure within suction path 152c and suction hole 14c. In other words, negative pressure generator 153 generates negative pressure around opening 14b by sucking air around opening 14b through suction path 152c and suction hole 14c. Negative pressure generator 153 also has an adjustment valve for adjusting the negative pressure and generates negative pressure of a magnitude corresponding to the opening of the adjustment valve.

[0086] Pick-up nozzle 14a holds tip 6a in a non-contact manner around opening 14b based on a repulsive force that pulls tip 6a away from pickup nozzle 14a, which is generated by the ultrasonic waves of vibrator 152a, and a suction force that attracts tip 6a to pickup nozzle 14a, which is generated by the negative pressure of negative pressure generator 153. The repulsive force is a force generated by the formation of a squeeze film by the ultrasonic waves.

[0087] Rotational movement mechanism 15b includes, for example, a motor and moves pickup unit 14 in the X-axis, Y-axis, and Z-axis directions. Rotational movement mechanism 15b also rotates arm 15a, thereby rotating pickup nozzle 14a of pickup unit 14 attached to the tip of arm 15a. The time required for pickup nozzle 14a to rotate 180 degrees, i.e., the time required for pickup nozzle 14a to reverse, is, for example, less than 0.5 seconds.

[0088] The push-up unit 34 has a plurality of push-up pins 34a, and raises and lowers the plurality of push-up pins 34a. The plurality of push-up pins 34a rise and push up the adhesive sheet 6b, thereby pushing up the chip 6a attached to the adhesive sheet 6b.

[0089] The control unit 101 controls the push-up unit 34 and the component holder 15. That is, the control unit 101 controls the push-up unit 34, the vibrator 152a, the negative pressure generator 153, and the rotational movement mechanism 15b. For example, the control unit 101 adjusts the repulsive force on the chip 6a by controlling the voltage applied to the vibrator 152a. The control unit 101 also adjusts the suction force on the chip 6a by controlling the adjustment valve of the negative pressure generator 153. This makes it possible to effectively adjust the repulsive force and suction force on the chip 6a.

[0090] In this embodiment, component holder 15 includes vibrator 152a and negative pressure generator 153, but vibrator 152a and negative pressure generator 153 do not have to be included in component holder 15. In this embodiment, horn 152b and pick-up nozzle 14a are separate bodies, but they may be configured as an integrated unit.

[0091] 4A and 4B are diagrams showing an example of the operation of the pickup system 100 in this embodiment, in which the pickup nozzle 14a is used to pick up the chip 6a and deliver it to the component mounting nozzle 20a.

[0092] For example, when the XY table mechanism 31 moves the moving plate 32, the adhesive sheet 6b held on the holding table 3a moves in the X-axis direction and the Y-axis direction. This movement of the adhesive sheet 6b causes the chip 6a to be picked up to be positioned at the pick-up operation position P, as shown in (a) of FIG. 4A. That is, the chip 6a to be picked up is positioned on the multiple push-up pins 34a of the push-up unit 34.

[0093] Next, as shown in FIG. 4A (b), the push-up unit 34 raises the multiple push-up pins 34a to push up the chip 6a through the adhesive sheet 6b. Then, as shown in FIG. 4A (c), the pickup nozzle 14a descends, the vibrator 152a generates ultrasonic waves, and the negative pressure generator 153 generates negative pressure. Specifically, under the control of the control unit 101, the vibrator 152a vibrates the pickup nozzle 14a via the horn 152b, generating ultrasonic waves from around the opening 14b of the pickup nozzle 14a. The ultrasonic waves generated by the vibrator 152a are generated by the vibration of the pickup nozzle 14a at a vibration speed of, for example, 10 mm / s or more and 5000 mm / s or less. Furthermore, the negative pressure generator 153 suctions air under the control of the control unit 101. This generates negative pressure around the opening 14b of the pickup nozzle 14a. As a result, control unit 101 causes pickup nozzle 14a to hold tip 6a in a non-contact manner, using the suction force caused by the negative pressure around opening 14b and the repulsive force caused by the ultrasonic waves around opening 14b. That is, pickup nozzle 14a holds tip 6a in a non-contact manner, using the suction force that draws tip 6a toward opening 14b of pickup nozzle 14a and the repulsive force that moves tip 6a away from opening 14b. In this non-contact holding, a gap of, for example, about 20 to 60 μm in width is generated between pickup nozzle 14a and tip 6a.

[0094] Then, as shown in FIG. 4B (a), the control unit 101 controls the rotational movement mechanism 15b to raise the pickup nozzle 14a. That is, the chip 6a is peeled off from the adhesive sheet 6b and rises. Furthermore, as shown in FIG. 4B (b), the control unit 101 controls the rotational movement mechanism 15b to rotate the pickup nozzle 14a. That is, as shown in FIGS. 4B (b) and (c), the rotational movement mechanism 15b rotates the arm 15a, thereby rotating the pickup nozzle 14a by 180 degrees so that the opening 14b of the pickup nozzle 14a faces upward. That is, as the arm 15a rotates, the pickup unit 14 attached to the tip of the arm 15a is inverted. As a result, the pickup nozzle 14a included in the pickup unit 14 is inverted. This also inverts the chip 6a held in contact with the pickup nozzle 14a, and the lower surface of the chip 6a, which was attached to the adhesive sheet 6b, faces upward. Before inverting the pickup nozzle 14a, the rotational movement mechanism 15b may move the pickup nozzle 14a in the X-axis direction and the Y-axis direction to a chip transfer position where the chip 6a is transferred to the component mounting nozzle 20a.

[0095] 4B(c), the component mounting nozzle 20a picks up the inverted chip 6a from above, and as a result, the chip 6a is transferred from the pickup nozzle 14a to the component mounting nozzle 20a.

[0096] Fig. 5 is a diagram showing an example of pickup unit 14 as viewed from the X-axis direction. Fig. 6 is a diagram showing an example of horn 152b. Note that Fig. 6(a) is a diagram showing an example of horn 152b as viewed from the Z-axis direction positive side, and Fig. 6(b) is a cross-sectional view taken along line BB in Fig. 6(a).

[0097] As shown in FIG. 5, the pickup unit 14 in this embodiment is a unit for picking up chips 6a in a non-contact manner and is formed in a substantially cylindrical shape with a central axis along the Z-axis direction. In the example of FIG. 5, the pickup unit 14 is formed in a substantially cylindrical shape, but it may be formed in another shape, such as a substantially rectangular pillar shape, instead of this shape. As shown in FIG. 5, the pickup unit 14 also includes a vibration unit 152 that vibrates to generate sound waves and a pickup nozzle 14a that uses the generated sound waves to pick up chips 6a in a non-contact manner. In this embodiment, the pickup unit 14 also includes a plurality of support units 50 connected to the vibration unit 152. Specifically, the pickup unit 14 includes three support units 50 as shown in FIG. 6(a). The number of support units 50 included in the pickup unit 14 may be two or four or more.

[0098] The vibrating section 152 is formed in a generally cylindrical shape with a central axis along the Z-axis direction. The vibrating section 152 includes a vibrator 152a that vibrates in the axial direction of the pickup unit 14 (i.e., the central axis direction or the Z-axis direction), and a horn 152b that is connected to the pickup nozzle 14a and transmits the vibration of the vibrator 152a to the pickup nozzle 14a. In this embodiment, each of the three supports 50 is connected to a vibration node of the horn 152b of the vibrating section 152. More specifically, each of the three supports 50 is connected to a vibration node of the horn 152b. The vibration of the vibrator 152a also vibrates the horn 152b. As a result, a standing wave is generated in the vibrator 152a and the horn 152b due to the vibration. The above-mentioned nodes are nodes of the standing wave.

[0099] Horn 152b has a through-hole that passes through horn 152b and has opening 152d, which is connected to opening 14b of pickup nozzle 14a.

[0100] As shown in FIG. 6A, each of the three support units 50 includes a first elastic member 51 and two fixed units 52. The first elastic member 51 elastically deforms in a direction perpendicular to the Z-axis direction. The Z-axis direction is the arrangement direction of the vibration unit 152 and the pickup nozzle 14a, i.e., the axial direction of the pickup unit 14. Each of the two fixed units 52 included in the support unit 50 is connected to the vibration unit 152 via the first elastic member 51. Specifically, each of the two fixed units 52 is connected to the horn 152b via the first elastic member 51. In this embodiment, the number of fixed units 52 included in the support unit 50 is two, but it may be one, or three or more. In this embodiment, the first elastic member 51 is a leaf spring.

[0101] As shown in (a) of Figure 6, the three support parts 50 are arranged rotationally symmetrically with respect to the central axis of horn 152b when horn 152b is viewed from the Z-axis direction. In other words, when horn 152b is rotated 120 degrees, the three support parts 50 overlap with their original state before the rotation. Note that the number of support parts 50 is not limited to three as described above, and may be two or more. Furthermore, the central axis of horn 152b is the same as the central axis of pickup unit 14, and the Z-axis direction is the axial direction of pickup unit 14.

[0102] That is, in this embodiment, the multiple support parts 50 are arranged rotationally symmetrically with respect to the central axis of the pickup unit 14 when the pickup unit 14 is viewed in the axial direction. The number of support parts 50 may be three or more. In this case, the multiple support parts 50 described above include three or more support parts 50, and the three or more support parts 50 are arranged rotationally symmetrically with respect to the central axis of the pickup unit 14 when the pickup unit 14 is viewed in the axial direction.

[0103] When horn 152b is viewed from the Z-axis direction, first elastic member 51 included in support part 50 is disposed between two fixed parts 52 included in support part 50. Furthermore, first elastic member 51 is formed so as to follow the outer circumferential direction of horn 152b. The central part of first elastic member 51 in the outer circumferential direction is connected to horn 152b.

[0104] As described above, in the present embodiment, the one or more fixing portions 52 included in support portion 50 include two fixing portions 52, and when pickup unit 14 is viewed in the axial direction, first elastic member 51 is disposed between the two fixing portions 52. When pickup unit 14 is viewed in the axial direction, first elastic member 51 extends along the outer circumferential direction of vibrating portion 152. Specifically, the outer circumferential direction of vibrating portion 152 is the outer circumferential direction of horn 152b, as described above. Furthermore, if horn 152b is substantially cylindrical with a central axis along the Z-axis direction, the outer circumferential direction of horn 152b can also be said to be the circumferential direction of horn 152b.

[0105] 6(a) and 6(b), when horn 152b is viewed from the Z-axis direction, thickness d of first elastic member 51 is thinner than the thickness of fixed portion 52. That is, in this embodiment, when pickup unit 14 is viewed from the axial direction, thickness d of first elastic member 51 included in support portion 50 in the radial direction of pickup unit 14 is thinner than each of the thicknesses of two fixed portions 52 included in support portion 50. Note that thickness d is, for example, 1 mm. Note that thickness d is not limited to 1 mm and may be any thickness. For example, thickness d may be 1 / 20 to 1 / 10 of the diameter of horn 152b. This diameter is the diameter of horn 152b in the XY plane.

[0106] Each fixed portion 52 has a hole 52a formed therethrough along the Z-axis direction. Bolts are inserted into these holes 52a and are fastened to, for example, an arm 15a. The arm 15a is part of a movement mechanism that moves the pickup unit 14. As a result, the pickup unit 14 is fixed to the movement mechanism by fastening the bolts inserted into the holes 52a of each fixed portion 52.

[0107] Thus, in this embodiment, each of the two fixing portions 52 included in the support portion 50 has a hole 52a along the above-mentioned axial direction for fixing the pickup unit 14. The two fixing portions 52, i.e., one or more fixing portions 52, are fixed to a movement mechanism that moves the pickup unit 14 by fastening bolts using the holes 52a. The movement mechanism may be composed of an arm 15a and a rotational movement mechanism 15b.

[0108] FIG. 7 is a diagram showing an example of elastic deformation of the first elastic member 51. As shown in FIG.

[0109] Horn 152b transmits the vibration of vibrator 152a to pickup nozzle 14a. The vibration is a longitudinal wave or a compressional wave along the Z-axis direction, generating a standing wave in horn 152b. Three supports 50 are connected to the nodes of the standing wave, and two fixed portions 52 included in each of the three supports 50 are fixed to arm 15a. Here, at the nodes of the standing wave, the displacement in the Z-axis direction is approximately zero. However, at these nodes, horn 152b vibrates slightly in the X-axis and Y-axis directions.

[0110] For example, when the node of horn 152b is viewed from the Z-axis direction, as shown in FIG. 7(a), vibration of horn 152b causes connection portion 51a between first elastic member 51 and horn 152b to contract, and then, as shown in FIG. 7(b), connection portion 51a expands. Thereafter, connection portion 51a contracts again, as shown in FIG. 7(a). Such expansion and contraction of connection portion 51a occur repeatedly. Note that the expansion lengthens connection portion 51a, and the contraction shortens connection portion 51a. On the other hand, as described above, the two fixed portions 52 included in each of the three support portions 50 are fixed and therefore do not displace.

[0111] If the first elastic members 51 included in each of the three support parts 50 do not elastically deform, the expansion and contraction of the first elastic members 51 are suppressed by the three support parts 50. As a result, the horn 152b has difficulty transmitting the vibration of the vibrator 152a in the Z-axis direction to the pickup nozzle 14a.

[0112] However, in this embodiment, the first elastic member 51 is elastically deformed. That is, as shown in Fig. 7(b), when the connection portion 51a expands, the first elastic member 51 is elastically deformed in directions perpendicular to the Z-axis direction, i.e., in the X-axis and Y-axis directions. In other words, the first elastic member 51 is elastically deformed such that the central portion of the first elastic member 51 is alternately displaced in a direction away from and a direction toward the horn 152b.

[0113] This allows the connection portion 51a to expand and contract while fixing the pickup unit 14, and allows the vibration of the vibrator 152a in the Z-axis direction to be transmitted effectively to the pickup nozzle 14a.

[0114] 8 is a diagram showing an example of a cross section of the pickup unit 14. The cross section is a plane passing through the central axis of the pickup unit 14 along the Z-axis direction.

[0115] Vibrator 152a and horn 152b are connected as shown in Fig. 8. Pickup nozzle 14a is connected to the lower end of horn 152b, so that suction path 152c of horn 152b and suction hole 14c of pickup nozzle 14a are connected in series along the Z-axis direction.

[0116] Here, horn 152b is formed with through-hole 152e that penetrates horn 152b in a direction perpendicular to the Z-axis direction. This through-hole 152e leads to opening 152d shown in FIG. 5 and is further connected to the upper end of suction path 152c. Such through-hole 152e is located between vibrator 152a and the three supports 50 in the Z-axis direction. Each support 50 is connected to a vibration node of horn 152b.

[0117] Two pipes 61, each connected to negative pressure generator 153, are attached to horn 152b so as to sandwich horn 152b. Specifically, one end of one of the two pipes 61 is connected to one end of through hole 152e of horn 152b, i.e., one of two openings 152d, via a second elastic member 63 such as a rubber pad. One end of the other pipe 61 is connected to the other end of through hole 152e, i.e., the other of two openings 152d, via the second elastic member 63. The other ends of the two pipes 61 are connected to negative pressure generator 153.

[0118] Through hole 152e of horn 152b is located above support part 50 and close to support part 50. Negative pressure generating part 153 sucks air around opening 14b of pickup nozzle 14a via two pipes 61, two second elastic members 63, through hole 152e of horn 152b, suction path 152c of horn 152b, and suction hole 14c of pickup nozzle 14a.

[0119] Thus, in this embodiment, horn 152b has through-hole 152e that penetrates horn 152b in a direction perpendicular to the axial direction of pickup unit 14 and is connected to suction hole 14c of pickup nozzle 14a. Through-hole 152e is located between vibrator 152a and the vibration node of horn 152b. In this embodiment, through-hole 152e is closer to the vibration node of horn 152b than vibrator 152a. Through-hole 152e of pickup unit 14 is connected, via second elastic member 63, to negative pressure generator 153 that generates negative pressure to suck chip 6a.

[0120] As described above, in this embodiment, the vibrating section 152 of the pickup unit 14 is connected to one or more fixed sections via each of the multiple first elastic members 51. The one or more fixed sections are then fixed to a device having the pickup unit 14, such as a moving mechanism including the arm 15a. This allows the vibration of the vibrating section 152 to be tolerated by the elastic deformation of the first elastic members 51, even if the vibrating section 152 vibrates in a direction perpendicular to the axial direction of the pickup unit 14, i.e., in a direction normal to the central axis of the pickup unit 14. In other words, the reduction in the vibration can be suppressed. As a result, the efficiency of the axial vibration of the pickup unit 14 can be improved, and the chip 6a can be efficiently held without contact.

[0121] In this embodiment, vibrating section 152 includes vibrator 152a and horn 152b, and multiple support sections 50 are connected to horn 152b. Therefore, even if horn 152b vibrates in the normal direction, the vibration can be tolerated by the elastic deformation of first elastic member 51, and chip 6a can be efficiently held in a non-contact manner.

[0122] In this embodiment, the multiple supports 50 are connected to vibration nodes of the horn 152b. At the vibration nodes of the horn 152b, the axial vibration is smaller than at other parts of the horn 152b. Therefore, by connecting each of the multiple supports 50 to the nodes, it is possible to further suppress the decrease in vibration of the pickup unit 14, and it is possible to efficiently hold the chip 6a in a non-contact manner.

[0123] Furthermore, in this embodiment, the multiple support parts 50 are arranged in rotational symmetry. More specifically, three or more support parts 50 are arranged in rotational symmetry. This allows the pickup unit 14 to be supported in a balanced manner. It is possible to prevent uneven vibration of the pickup unit 14.

[0124] In this embodiment, the first elastic member 51 is disposed between the two fixed portions 52. Therefore, the central portion of the first elastic member 51 in the arrangement direction of the two fixed portions 52 is connected to the vibrating portion 152, which makes it easier to elastically deform the first elastic member 51. As a result, the efficiency of the axial vibration of the pickup unit 14 can be improved, and the chip 6a can be efficiently held in a non-contact manner. Furthermore, the pickup unit 14 can be made smaller.

[0125] Furthermore, in this embodiment, the first elastic member 51 extends along the outer circumferential direction of the vibrating part 152. This allows the central part of the first elastic member 51 in the outer circumferential direction to be connected to the vibrating part 152, making it easier to elastically deform the first elastic member 51. As a result, the efficiency of the axial vibration of the pickup unit 14 can be improved, and the chip 6a can be efficiently held in a non-contact manner.

[0126] Furthermore, in this embodiment, the thickness d of the first elastic member 51 is thinner than the thickness of each of the two fixing portions 52. This makes it easier to elastically deform the first elastic member 51 because the first elastic member 51 is thin. As a result, the efficiency of the axial vibration of the pickup unit 14 can be improved, and the chip 6a can be efficiently held in a non-contact manner.

[0127] Furthermore, in this embodiment, each of the two fixing portions 52 has a hole 52a, which allows a bolt to be passed through the hole 52a to firmly fix the fixing portion 52 to a device having the pickup unit 14. In other words, the fixing portion 52 can be bolted.

[0128] In this embodiment, horn 152b has through-hole 152e, which is located between the vibration node of vibrator 152a and horn 152b. This allows suction of chip 6a through through-hole 152e of horn 152b and suction hole 14c of pickup nozzle 14a, achieving non-contact holding of chip 6a. Furthermore, because through-hole 152e penetrates horn 152b in a direction perpendicular to the axial direction, i.e., because through-hole 152e is aligned horizontally, negative pressure generator 153 can be easily connected to through-hole 152e. As a result, a configuration for suction of chip 6a can be easily achieved. Furthermore, because through-hole 152e is located between the vibration node of vibrator 152a and horn 152b, a connection mechanism, i.e., piping 61, connecting through-hole 152e to negative pressure generator 153 can be positioned closer to vibrator 152a in the axial direction than the multiple supports 50. As a result, the connection mechanism can be easily arranged, and the configuration of the device having the pickup unit 14, that is, the pickup system 100, can be prevented from becoming complicated.

[0129] Furthermore, in this embodiment, through-hole 152e is close to the vibration node of horn 152b. This allows the connection mechanism for connecting through-hole 152e and negative pressure generating unit 153 to be positioned close to the multiple supports 50. As a result, the device having pickup unit 14 can be made more compact.

[0130] In this embodiment, one or more fixing portions 52 are fixed to a moving mechanism, and as a result, the pickup unit 14 is fixed to the moving mechanism, so that the pickup unit 14 can be moved.

[0131] Furthermore, in this embodiment, through-hole 152e is connected to negative pressure generating section 153 via second elastic member 63, such as a rubber pad. This makes it difficult for vibration of horn 152b to be suppressed. As a result, the efficiency of axial vibration of pickup unit 14 can be improved, and chip 6a can be held efficiently in a non-contact manner.

[0132] In this embodiment, the first elastic member 51 is a leaf spring. This allows for a simple configuration to improve the efficiency of axial vibration of the pickup unit 14, and allows for efficient non-contact holding of the chip 6a. The leaf spring, which is the first elastic member 51, may be made of a metal such as stainless steel, just like the horn 152b.

[0133] The horn unit in this embodiment is a unit used in the pickup unit 14 for contactlessly picking up the chip 6a, and includes a horn 152b and a plurality of support members 50. The horn 152b is a member for transmitting the vibration of the vibrator 152a included in the pickup unit 14 to the pickup nozzle 14a also included in the pickup unit 14. The plurality of support members 50 are directly connected to the horn 152b.

[0134] As a result, even if the horn 152b vibrates in a direction perpendicular to the axial direction of the pickup unit 14, i.e., in the direction normal to the central axis of the pickup unit 14, the vibration can be tolerated by the elastic deformation of the first elastic member 51. In other words, the reduction in the vibration can be suppressed. As a result, the efficiency of the axial vibration of the pickup unit 14 can be improved, and the chip 6a can be held efficiently without contact.

[0135] In the above embodiment, vibrating unit 152 includes horn 152b, but it does not have to include horn 152b. In this case, vibrating unit 152 includes vibrator 152a that is connected to pickup nozzle 14a and vibrates in the axial direction to transmit vibrations to pickup nozzle 14a. Each of the multiple supports 50 is connected to vibrator 152a of vibrating unit 152 instead of horn 152b.

[0136] This allows the chip 6a to be held efficiently in a non-contact manner even when the pickup unit 14 does not have the horn 152b. In other words, even if the vibrator 152a vibrates in the normal direction, the vibration can be tolerated by the elastic deformation of the first elastic member 51, and the chip 6a can be held efficiently in a non-contact manner.

[0137] In the above case, each of the multiple supports 50 may be connected to a vibration node of the vibrator 152a. At the vibration node of the vibrator 152a, the axial vibration is smaller than at other parts of the vibrator 152a. Therefore, by connecting each of the multiple supports 50 to the node, it is possible to further suppress a decrease in the vibration of the pickup unit 14, and it is possible to efficiently hold the chip 6a in a non-contact manner.

[0138] Furthermore, in the above embodiment, through-hole 152e is closer to the vibration node of horn 152b than vibrator 152a, but conversely, it may be closer to vibrator 152a than the vibration node of horn 152b. This can mitigate the disadvantage of having through-hole 152e. The disadvantage is that vibrations from vibrator 152a are less likely to be transmitted to pickup nozzle 14a. In other words, when through-hole 152e is closer to vibrator 152a, this disadvantage can be reduced compared to when through-hole 152e is farther from vibrator 152a.

[0139] While the pickup unit 14, horn unit, and joining device according to one or more embodiments have been described above based on the embodiments, the present disclosure is not limited to those embodiments. Various modifications conceivable by those skilled in the art may also be included in the present disclosure as long as they do not deviate from the spirit of the present disclosure.

[0140] For example, in the above embodiment, the pickup nozzle 14a holds the chip 6a in a non-contact manner, but the component mounting nozzle 20a may also hold the chip 6a in a non-contact manner, similar to the pickup nozzle 14a.

[0141] In the above embodiment, the control unit 101 and the like may be configured with dedicated hardware, or may be realized by executing a software program suitable for the control unit 101. The control unit 101 may be realized by a program execution unit such as a CPU (Central Processing Unit) or a processor reading and executing a software program recorded on a recording medium such as a hard disk or semiconductor memory.

[0142] The following cases are also included in this disclosure:

[0143] (1) Specifically, the control unit 101 may be a computer system configured with a microprocessor, a ROM (Read Only Memory), a RAM (Random Access Memory), a hard disk unit, a display unit, a keyboard, a mouse, etc. A computer program is stored in the RAM or hard disk unit. The control unit 101 achieves its functions by the microprocessor operating in accordance with the computer program. Here, the computer program is configured by combining multiple instruction codes that indicate commands to the computer to achieve a predetermined function.

[0144] (2) The control unit 101 may be configured as one system LSI (Large Scale Integration). The system LSI is an ultra-multifunctional LSI manufactured by integrating multiple components on a single chip, and specifically, is a computer system configured to include a microprocessor, ROM, RAM, etc. A computer program is stored in the RAM. The system LSI achieves its functions by the microprocessor operating in accordance with the computer program.

[0145] (3) The control unit 101 may be configured as a removable IC card or a standalone module. The IC card or module is a computer system configured with a microprocessor, ROM, RAM, etc. The IC card or module may include the ultra-multifunctional LSI described above. The IC card or module achieves its functions when the microprocessor operates according to a computer program. This IC card or module may be tamper-resistant. [Industrial Applicability]

[0146] The present disclosure is applicable to, for example, devices, units, systems, and the like that pick up parts and perform work using those parts. [Explanation of symbols]

[0147] 1. Component mounting equipment (bonding equipment) 2 bases 3. Parts Supply Department 3a Holding table 5 Board holding part 5a Transport rail 6 Semiconductor Wafer Unit 6a Chip (component) 6b Adhesive sheet 7. Circuit Board 11 frames 11a Support Post 11b Y-axis frame 12 Y-axis drive mechanism 13 Component mounting section 13a Moving plate 13b Lifting mechanism 13c Lifting Plate 14 Pickup unit 14a Pick-up nozzle (nozzle) 14b opening 14c Suction hole 15 Parts holder 15a Arm 15b Rotational movement mechanism 20 Mounting Unit 20a Component Mounting Nozzle 21 Pickup Camera 31 XY table mechanism 32 Moving Plate 33 Support member 34 Push-up part 34a Push-up pin 50 Support part 51 first elastic member 51a Connection part 52 Fixed part 52a hole 61 Piping 63 Second elastic member 100 Pickup System 101 Control section 152 Vibration unit 152a Oscillator 152b Horn 152c Suction path 152d aperture 152e Through hole 153 Negative pressure generating section d Thickness

Claims

1. A pickup unit for picking up components without contact, a vibration part that vibrates to generate sound waves; a nozzle that picks up the component without contact using the generated acoustic waves; a plurality of support parts connected to the vibration part, Each of the plurality of support portions is a first elastic member that elastically deforms in a direction perpendicular to an axial direction of the pickup unit, which is an arrangement direction of the vibration section and the nozzles; one or more fixed portions each connected to the vibrating portion via the first elastic member, Pickup unit.

2. the vibration unit includes a vibrator that vibrates in the axial direction and a horn that is connected to the nozzle and transmits vibration of the vibrator to the nozzle, Each of the plurality of support parts is connected to the horn of the vibration part. The pickup unit according to claim 1 .

3. Each of the plurality of support parts is connected to a vibration node of the horn. The pickup unit according to claim 2 .

4. the vibration unit includes a vibrator connected to the nozzle and vibrating in the axial direction to transmit vibrations to the nozzle, Each of the plurality of support parts is connected to the vibrator of the vibration part. The pickup unit according to claim 1 .

5. Each of the plurality of support parts is connected to a node of vibration of the vibrator. The pickup unit according to claim 4 .

6. the plurality of support parts are arranged rotationally symmetrically with respect to a central axis of the pickup unit when the pickup unit is viewed from the axial direction; The pickup unit according to claim 1 .

7. the plurality of support portions includes three or more support portions, the three or more support parts are arranged rotationally symmetrically with respect to a central axis of the pickup unit when the pickup unit is viewed from the axial direction. The pickup unit according to claim 1 .

8. the one or more fixing portions include two fixing portions, When the pickup unit is viewed from the axial direction, the first elastic member is disposed between the two fixing portions. The pickup unit according to claim 1 .

9. the first elastic member extends along the outer circumferential direction of the vibration section when the pickup unit is viewed from the axial direction; The pickup unit according to claim 8.

10. When the pickup unit is viewed from the axial direction, a thickness of the first elastic member in a radial direction of the pickup unit is thinner than each of the thicknesses of the two fixing portions. The pickup unit according to claim 9.

11. Each of the two fixing portions has a hole along the axial direction for fixing the pickup unit. The pickup unit according to claim 9.

12. the horn has a through hole that penetrates the horn in a direction perpendicular to the axial direction of the pickup unit and is connected to a hole of the nozzle; The through hole is located between the vibrator and a vibration node of the horn. The pickup unit according to claim 2 .

13. The through-hole is closer to a vibration node of the horn than the vibrator. The pickup unit according to claim 12.

14. The through hole is closer to the vibrator than the vibration node of the horn. The pickup unit according to claim 12.

15. the one or more fixed portions are fixed to a moving mechanism that moves the pickup unit; The pickup unit according to claim 1 .

16. the through hole of the pickup unit is connected via a second elastic member to a negative pressure generating unit that generates negative pressure to suck the component; The pickup unit according to claim 12.

17. The first elastic member is a leaf spring. The pickup unit according to claim 1 .

18. A horn unit used in a pickup unit for picking up components in a non-contact manner, a horn for transmitting vibration of a vibrator included in the pickup unit to a nozzle included in the pickup unit; a plurality of supports directly connected to the horn; Each of the plurality of support portions is an elastic member that elastically deforms in a direction perpendicular to the axial direction of the horn unit, which is the arrangement direction of the vibrators and the nozzles; and one or more fixing portions each connected to the horn via the elastic member. Horn unit.

19. The horn unit according to claim 18; The vibrator; The nozzle; A pickup unit comprising:

20. A pickup unit according to any one of claims 1 to 17 and 19; a joining unit that receives the component from the pickup unit and joins the received component to another component; A joining device comprising:

Images